A mainboard simulation plug-in device

Abstract

This invention relates to the field of motherboard testing equipment, specifically to a motherboard simulation insertion device, comprising an upper frame and a lower frame rotatably connected. The upper frame houses a loading board and electrical components; the lower frame houses a loading board for placing the motherboard, a lifting assembly, and a limiting post. The lifting assembly includes a moving cylinder, a first moving frame, and a second moving frame. The first moving frame has an inclined guide wall, and the second moving frame has moving rollers that slide on the guide wall. The limiting post is arranged along the thickness direction of the lower frame, and the second moving frame slides on the limiting post. Through the inclined guide wall, during insertion, the horizontal movement of the second moving frame is converted into vertical movement by the cooperation of the inclined guide wall and the limiting post, making the lifting trend of the motherboard smoother. This reduces the possibility of damage to the motherboard and electrical components due to excessive stress during insertion, thereby improving testing efficiency.

Description

Technical Field

[0001] This invention relates to the field of motherboard testing equipment, and more specifically to a motherboard simulation connection device. Background Technology

[0002] The motherboard, installed inside the computer case, is one of the most basic and important components of a computer. Other computer components, such as the CPU, memory modules, and SSDs, are all plugged into the motherboard. During the production process, simulation plug-in equipment and testing systems are used to simulate the plug-in process of electrical components such as the CPU, memory modules, and SSDs with the motherboard, thereby testing the motherboard's electrical performance.

[0003] Existing simulated connection devices consist of a rotating upper frame and a lower frame. The motherboard is placed on the lower frame, while electrical components such as the CPU, memory modules, and SSDs are placed on the upper frame. During simulated connection, the upper frame is typically rotated so that the electrical components on it are close to the motherboard on the lower frame. Then, a lifting cylinder on the lower frame lifts the motherboard to align it with the electrical components for connection. However, this connection process can easily result in significant stress at the moment of contact between the motherboard and the electrical components, potentially damaging both the motherboard and the components during connection and affecting testing efficiency. Summary of the Invention

[0004] The technical solution adopted by this invention to solve its technical problem is: to provide a motherboard simulation plug-in device, comprising:

[0005] The upper frame is provided with an upper loading plate and electrical components mounted on the upper loading plate;

[0006] The lower frame is rotatably connected to the upper frame. The lower frame is equipped with a download plate, a lifting assembly, and a limiting post. The download plate is used to place the motherboard. The lifting assembly includes a moving cylinder, a first moving frame connected to the output end of the moving cylinder, and a second moving frame connected to the download plate. The first moving frame is equipped with a guide wall, which is inclined. The second moving frame is equipped with a moving roller, which slides along the guide wall. The limiting post is set along the thickness direction of the lower frame, and the second moving frame slides on the limiting post. When the motherboard and electrical components are plugged in, the moving cylinder drives the first moving frame to move, causing the moving roller to slide from the lowest point of the guide wall toward the upper frame, thereby driving the motherboard and electrical components to plug in.

[0007] Furthermore, the guide wall is arranged in an arc shape.

[0008] Furthermore, the lower frame is provided with a support block, and the support block is provided with a lower hook and a compression spring. The two ends of the compression spring are respectively connected to the support block and the lower hook. The lower hook is rotatably connected to the support block through the compression spring. The upper plate is provided with an upper hook, and the lower plate is provided with a limiting pulley. The limiting pulley presses on the side of the lower hook facing away from the compression spring. When the second movable frame pushes the lower plate to rise, the limiting pulley pushes the lower hook to rotate until it engages with the upper hook.

[0009] Furthermore, the upper plate is provided with a buffer post, and the buffer post is provided with a crimping post. The diameter of the buffer post is larger than the diameter of the crimping post. A limiting step is formed at the connection between the crimping post and the buffer post. A buffer spring is sleeved on the crimping post. The download plate is provided with crimping holes corresponding to the crimping posts. When the motherboard and electrical components are plugged in, the crimping post is inserted into the crimping hole, and the two ends of the buffer spring are respectively crimped to the limiting step and the download plate.

[0010] Furthermore, it also includes a CPU pressing component, which includes a mounting bracket and a drive module disposed on the mounting bracket. The output end of the drive module is provided with a pressing block, and a pushing block is slidably disposed on the mounting bracket. The drive module is used to drive the pressing block to push the pushing block and fix the CPU on the upper plate.

[0011] Furthermore, it also includes a water-cooling component, which includes a water inlet and a water-cooling heat sink, the water inlet and the water-cooling heat sink being connected, and the water-cooling heat sink being pressed onto the CPU.

[0012] Furthermore, the water-cooled heat sink is provided with a limiting bracket, and the limiting bracket is provided with an inner cavity for placing the CPU. The inner cavity is connected to the water-cooled heat sink, and the cavity wall of the inner cavity is provided with elastic buckles for limiting the CPU.

[0013] Furthermore, the water-cooled heat sink is also provided with a fixing bracket. When the push block pushes the CPU, the push block and the fixing bracket come into contact. The fixing bracket is provided with a pressure sensor, which is used to detect the pressure applied by the push block.

[0014] Furthermore, it also includes a memory module insertion assembly. The upper frame is provided with a connection structure electrically connected to the memory module. The memory module insertion assembly includes a support frame and a pressing cylinder mounted on the support frame. The support frame is provided with a detection sensor, which is electrically connected to a solenoid valve for controlling the pressing cylinder. The piston rod of the pressing cylinder is provided with a connecting frame. The connecting frame is provided with a detection rod and a placement slot for placing the memory module. The detection sensor is used to detect the detection rod. When the motherboard and the connection structure are inserted, the detection sensor detects the detection rod and drives the solenoid valve for controlling the pressing cylinder to de-energize. Under the action of gravity, the piston rod of the pressing cylinder moves the memory module to be inserted into the connection structure, thereby enabling the memory module and the motherboard to be inserted.

[0015] Furthermore, the connecting frame is provided with a connecting rod, the connecting rod is fitted with a connecting spring, the connecting rod passes through the support frame, and the two ends of the connecting spring are respectively connected to the connecting frame and the support frame.

[0016] The beneficial effects of this invention are as follows: Due to the inclined guide wall, during insertion, the moving frame one is driven by a moving cylinder to move along the length of the lower frame, causing the guide wall to move relative to the moving rollers along the length of the lower frame, thus allowing the moving rollers to slide along the guide wall. Because of the inclined guide wall, the moving rollers drive the moving frame two to move along the length of the lower frame, and simultaneously, along the thickness of the lower frame. Due to the limitation of the limiting post, the download plate ultimately only moves along the thickness of the lower frame, thereby lifting the mainboard. During this process, the inclined guide wall converts the horizontal movement of the moving frame two into vertical movement, resulting in a smoother lifting trend of the mainboard. This reduces the stress applied between the mainboard and electrical components during insertion, minimizing damage to the mainboard and electrical components due to excessive stress, and improving testing efficiency. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] In the picture: Figure 1 This invention provides an overall structural diagram of a motherboard simulation plug-in device;

[0019] Figure 2 for Figure 1 The diagram shows the 3D structure of the motherboard after the hidden part of the simulated plug-in device structure is shown.

[0020] Figure 3 for Figure 1 The diagram shows a three-dimensional structural representation of the motherboard's simulated plug-in device section.

[0021] Figure 4 for Figure 3Exploded view of the structure shown;

[0022] Figure 5 for Figure 1 The diagram shows a three-dimensional structural representation of the motherboard's simulated plug-in device section.

[0023] Figure 6 for Figure 5 A cross-sectional view of the structure shown;

[0024] Figure 7 for Figure 2 The diagram shows the three-dimensional structure of the CPU pressing assembly and the water cooling assembly.

[0025] Figure 8 for Figure 7 The cross-sectional view of the CPU pressing assembly and the water cooling assembly shown;

[0026] Figure 9 for Figure 8 Enlarged view of point A in the middle;

[0027] Figure 10 for Figure 2 The diagram shows a 3D structure of the memory module connector assembly.

[0028] Figure 11 for Figure 10 Enlarged view at point B in the middle;

[0029] Figure 12 for Figure 10 A 3D structural diagram of a transit card.

[0030] Explanation of reference numerals in the attached drawings: 10. Upper frame; 11. Upper loading plate; 111. Upper hook; 1111. Overlap; 112. Buffer column; 1121. Pressing column; 1122. Limiting step; 1123. Buffer spring; 131. Connector; 132. Rotary clip; 1321. Connecting slot; 20. Lower frame; 21. Download plate; 211. Limiting pulley; 212. Pressing hole; 221. Moving cylinder; 222. Moving frame one; 2221. Guide wall; 223. Moving frame two; 2231. Moving roller; 2232. Limiting hole; 23. Limiting column; 24. Support block; 241. Lower hook; 242. Compression spring; 25. Gas spring; 30. C PU pressing assembly; 31. Mounting bracket; 311. Push block; 321. Drive motor; 322. Drive gear; 323. Driven gear; 33. Pressing block; 41. Water inlet; 42. Water-cooled heat sink; 43. Limiting bracket; 431. Inner cavity; 432. Elastic buckle; 44. Fixing bracket; 441. Pressure sensor; 50. Memory module insertion assembly; 51. Support bracket; 511. Detection sensor; 52. Pressing cylinder; 521. Connecting bracket; 5211. Detection rod; 5212. Placement slot; 5213. Connecting rod; 5214. Connecting spring; 5215. Protrusion one; 5216. Protrusion two; 201. Memory module; 202. CPU. Detailed Implementation

[0031] To make the technical problem to be solved, the technical solution, and the beneficial effects of this invention clearer, the invention will now be described in detail with reference to the accompanying drawings. This drawing is a simplified schematic diagram, illustrating only the basic aspects of the invention, and therefore only shows the components relevant to the invention. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0032] Please refer to Figure 1 and Figure 2 The present invention provides a motherboard simulation plug-in device, including an upper frame 10 and a lower frame 20. The upper frame 10 is provided with an upper loading plate 11 and electrical components disposed on the upper loading plate 11. The lower frame 20 is rotatably connected to the upper frame 10. The lower frame 20 is provided with a download plate 21 and a lifting assembly. The download plate 21 is used to place the motherboard.

[0033] Specifically, the electrical components include CPU 202, memory module 201, SSD components, and other input / output controllers and interfaces (partial structural components of the electrical components are not shown).

[0034] To support the upper frame 10 when not connected, please refer to... Figure 1The lower frame 20 is equipped with a gas spring 25, the output end of which is connected to the upper frame 10. The gas spring 25 is used to support the upper frame 10.

[0035] Please refer to Figure 5 and Figure 6 The lower frame 20 is provided with a support block 24, and the support block 24 is provided with a lower hook 241 and a compression spring 242. The two ends of the compression spring 242 are connected to the support block 24 and the lower hook 241 respectively. The lower hook 241 is rotatably connected to the support block 24 through the compression spring 242. The upper plate 11 is provided with an upper hook 111, and the lower plate 21 is provided with a limiting pulley 211. The limiting pulley 211 presses on the side of the lower hook 241 facing away from the compression spring 242. When the second moving frame 223 pushes the lower plate 21 to rise, the limiting pulley 211 pushes the lower hook 241 to rotate until it overlaps with the upper hook 111.

[0036] With the cooperation of the lower hook 241, the limiting pulley 211, and the upper hook 111, when the download plate 21 is pushed up by the moving frame 223, the limiting pulley 211 pushes the lower hook 241 to rotate and engage with the upper hook 111 as the download plate 21 rises, thereby limiting the position of the download plate 21. The position of the download plate 21 relative to the upper plate 11 is fixed, so that when the main board and electrical components are plugged in, the download plate 21 is not easy to shake and affect the plugging process, thereby improving the stability of the plugging.

[0037] Specifically, in this embodiment, multiple support blocks 24, upper hooks 111, lower hooks 241, and compression springs 242 are provided, and they correspond one-to-one. Both the upper hooks 111 and the lower hooks 241 are provided with overlapping portions 1111, which have a hook-shaped structure. When the main board and electrical components are plugged in, the overlapping portions 1111 of the upper hooks 111 and the overlapping portions 1111 of the lower hooks 241 overlap each other.

[0038] Please refer to Figure 5 The upper plate 11 is provided with a buffer post 112, and the buffer post 112 is provided with a crimping post 1121. The diameter of the buffer post 112 is larger than the diameter of the crimping post 1121. A limiting step 1122 is formed at the connection between the crimping post 1121 and the buffer post 112. A buffer spring 1123 is sleeved on the crimping post 1121. The lower plate 21 is provided with a crimping hole 212 corresponding to the crimping post 1121. When the main board and electrical components are plugged in, the crimping post 1121 is inserted into the crimping hole 212, and the two ends of the buffer spring 1123 are respectively crimped with the limiting step 1122 and the lower plate 21. Through the cooperation of the buffer post 112 and the buffer spring 1123, the stress applied to each other when the electrical components and the main board are plugged in is buffered, reducing the possibility of damage to the main board or electrical components due to excessive force during plugging in, and improving testing efficiency.

[0039] Please refer to Figure 3 and Figure 4 The lifting assembly includes a moving cylinder 221, a first moving frame 222 connected to the output end of the moving cylinder 221, and a second moving frame 223 connected to the download plate 21. The first moving frame 222 is provided with a guide wall 2221, which is inclined. The second moving frame 223 is provided with a moving roller 2231, which slides along the guide wall 2221. When the main board and electrical components are plugged in, the moving cylinder 221 drives the first moving frame 222 to move, so that the moving roller 2231 slides from the lowest point of the guide wall 2221 toward the direction closer to the upper frame 10, thereby driving the download plate 21 to move toward the direction closer to the upper frame 10, and finally allowing the main board and electrical components to be plugged in.

[0040] Specifically, the lower frame 20 is equipped with a slide rail (not shown in the figure) for the sliding frame 222 to slide. The angle between the guide wall 2221 and the sliding frame 222 along the length direction is 18°.

[0041] To ensure that the movement trajectory of the download board 21 pushed by the second movable frame 223 corresponds to that of the upper loading plate 11, a limiting post 23 is provided on the lower frame 20, and a limiting hole 2232 adapted to the limiting post 23 is provided on the second movable frame 223. The second movable frame 223 is slidably mounted on the limiting post 23. Specifically, the first movable frame 222 moves along the length direction of the lower frame 20, and the limiting post 23 is set along the thickness direction of the lower frame 20. By setting the limiting post 23, the lifting direction of the download board 21 is limited, so that the download board 21 is lifted along the thickness direction of the lower frame 20, thereby ensuring that the insertion direction of the motherboard corresponds to that of the electrical components, and thus improving the insertion accuracy.

[0042] During insertion, the inclined guide wall 2221 drives the first moving frame 222 to move along the length of the lower frame 20 via the moving cylinder 221. This causes the guide wall 2221 to move relative to the moving roller 2231 along the length of the lower frame 20, resulting in the moving roller 2231 sliding along the guide wall 2221. Due to the inclined design of the guide wall 2221, the moving roller 2231 drives the second moving frame 223 to move along the length of the lower frame 20, and also moves along the thickness of the lower frame 20. Due to the limitation of the limiting post 23, the download plate 21 ultimately only moves along the thickness of the lower frame 20, thereby lifting the main board. In this process, the inclined guide wall 2221 converts the horizontal movement of the second moving frame 223 into vertical movement. During the conversion, the lifting trend of the main board is smoother, thereby reducing the stress applied between the main board and electrical components during insertion and reducing the possibility of damage to the main board and electrical components due to excessive stress.

[0043] Furthermore, the guide wall 2221 is arc-shaped. By setting the guide wall 2221 to an arc-shaped structure, the sliding of the download plate 21 driven by the moving roller 2231 towards the upper frame 10 is smoother, further reducing the impact of stress applied between the motherboard and electrical components during insertion, and reducing the possibility of damage to the motherboard and electrical components due to excessive stress.

[0044] Please refer to Figure 7 and Figure 8 The motherboard simulation plug-in device also includes a CPU pressing component 30. The CPU pressing component 30 includes a mounting bracket 31 and a drive module disposed on the mounting bracket 31. The mounting bracket 31 is connected to the upper frame 10. A pressing block 33 is disposed at the output end of the drive module. A pushing block 311 is slidably disposed on the mounting bracket 31. The drive module is used to drive the pressing block 33 to push the pushing block 311 and fix the CPU 202 on the upper plate 11.

[0045] Specifically, the upper plate 11 is provided with a through slot (not shown in the figure) for the CPU 202 to pass through. The drive module includes a drive motor 321, a drive gear 322 and a driven gear 323. The output end of the drive motor 321 and the drive gear 322 are fixed relative to each other. The driven gear 323 is connected to the pressing block 33. The drive gear 322 and the driven gear 323 mesh with each other.

[0046] Please refer to Figure 7 and Figure 8 The motherboard simulation connector also includes a water-cooling component, which comprises a water inlet 41 and a water-cooling heatsink 42. The water inlet 41 and the water-cooling heatsink 42 are connected, and the water-cooling heatsink 42 is pressed onto the CPU 202. Specifically, the water inlet 41 is connected to an external water source, and there are two water inlets 41, which are respectively connected to the inlet and outlet of the water-cooling heatsink 42. The water-cooling heatsink 42 is used to dissipate heat from the CPU 202.

[0047] Please refer to Figure 8 and Figure 9 The water-cooled heat sink 42 is equipped with a limiting bracket 43 and a fixing bracket 44. The limiting bracket 43 has an inner cavity 431 for placing the CPU 202. The inner cavity 431 is connected to the water-cooled heat sink 42, and the cavity wall of the inner cavity 431 is provided with elastic buckles 432 for limiting the CPU 202. When the pushing block 311 pushes the CPU 202, the pushing block 311 contacts the fixing bracket 44. The fixing bracket 44 is equipped with a pressure sensor 441, which is used to detect the pressure applied by the pushing block 311. By detecting the pressure applied by the pushing block 311 through the pressure sensor 441, it is easy to control the pressure applied to the CPU 202 and avoid damage to the CPU 202 due to excessive pressure.

[0048] Please refer to Figure 10 The motherboard simulation insertion device also includes a memory module insertion assembly 50. The upper frame 10 is provided with a connection structure electrically connected to the memory module 201. The memory module insertion assembly 50 includes a support frame 51 and a pressing cylinder 52 disposed on the support frame 51. The support frame 51 is provided with a detection sensor 511. The detection sensor 511 is electrically connected to a solenoid valve for controlling the pressing cylinder 52. The piston rod of the pressing cylinder 52 is provided with a connecting frame 521. The connecting frame 521 is provided with a detection rod 5211 and a placement slot 5212 for placing the memory module 201. The detection sensor 511 is used to detect the detection rod 5211. When the motherboard and the connection structure are inserted, the detection sensor 511 detects the detection rod 5211 and drives the solenoid valve for controlling the pressing cylinder 52 to be de-energized (the solenoid valve is not shown in the figure). Under the action of gravity, the piston rod of the pressing cylinder 52 drives the memory module 201 to move to be inserted with the connection structure, thereby enabling the memory module 201 and the motherboard to be inserted.

[0049] For details, please refer to Figure 11 The detection rod 5211 has a first protrusion 5215 and a second protrusion 5216. The first protrusion 5215 and the second protrusion 5216 correspond to the memory stick 201 and the insertion slot 1321 not being inserted, and the memory stick 201 and the insertion slot 1321 being inserted, respectively.

[0050] Because the memory module 201 is relatively expensive, it is easily damaged if excessive force is applied during insertion, resulting in high replacement costs. Therefore, an indirect connector is needed to link the memory module 201 and the motherboard. This embodiment uses a connection structure as this indirect connector. Please refer to... Figure 10 and Figure 12 The connection structure includes a connector 131 corresponding to the motherboard and an adapter card 132 mounted on the connector 131. The adapter card 132 has a slot 1321 corresponding to the memory module 201. Specifically, the connector 131 is an adapter connector in the prior art. Therefore, this invention uses an adapter card 132 and a connector 131 that are relatively inexpensive and correspond to the memory module 201. During insertion, the adapter card 132 first works with the connector 131 to insert into the motherboard. Then, the position of the insertion rod is detected by the detection sensor 511 to control the solenoid valve of the pressing cylinder 52 to be de-energized. This allows the piston rod of the pressing cylinder 52 to move freely, and under the action of gravity, the piston rod of the pressing cylinder 52 causes the memory module 201 to fall into the slot 1321 on the adapter card 132 to complete the indirect insertion with the motherboard. This reduces the risk of damage to the memory module 201 due to excessive force during insertion and lowers replacement costs.

[0051] It should be noted that when not inserted, the pressing cylinder 52 drives the connecting bracket 521 to move the memory module 201 away from the insertion slot 1321, and the protrusion 5215 of the detection rod 5211 is within the detection range of the detection sensor 511. When inserted, the pressing cylinder 52 drives the connecting bracket 521 to move the memory module 201 closer to the insertion slot 1321. At this time, the memory module 201 is located in the insertion slot 1321, but not fully inserted, and the protrusion 5216 of the detection rod 5211 is within the detection range of the detection sensor 511. After the detection sensor 511 detects the protrusion 5216, it controls the solenoid valve driving the pressing cylinder 52 to de-energize, allowing the piston rod of the pressing cylinder 52 to move freely and, under the action of gravity, fully insert the memory module 201 into the insertion slot 1321. The distance that memory module 201 moves under the influence of gravity is relatively small, and the force it may experience is much smaller than the force it may experience when it is plugged in.

[0052] Please refer to Figure 10 The connecting frame 521 is equipped with a connecting rod 5213, and a connecting spring 5214 is sleeved on the connecting rod 5213. The connecting rod 5213 passes through the support frame 51, and both ends of the connecting spring 5214 are connected to the connecting frame 521 and the support frame 51, respectively. The connecting spring 5214 provides an elastic connection between the connecting frame 521 and the support frame 51. This reduces the likelihood of the memory module 201 being damaged due to excessive movement caused by the connecting frame 521 moving under gravity, further reducing replacement costs.

Claims

1. A motherboard simulation plug-in device, characterized in that, include: The upper frame is provided with an upper loading plate and electrical components mounted on the upper loading plate; The lower frame is rotatably connected to the upper frame. The lower frame is equipped with a download plate, a lifting assembly, and a limiting post. The download plate is used to place the motherboard. The lifting assembly includes a moving cylinder, a first moving frame connected to the output end of the moving cylinder, and a second moving frame connected to the download plate. The first moving frame is equipped with a guide wall, which is inclined. The second moving frame is equipped with a moving roller, which slides along the guide wall. The limiting post is set along the thickness direction of the lower frame, and the second moving frame slides on the limiting post. When the motherboard and electrical components are plugged in, the moving cylinder drives the first moving frame to move, causing the moving roller to slide from the lowest point of the guide wall toward the upper frame, thereby driving the motherboard and electrical components to plug in.

2. The motherboard simulation plug-in device according to claim 1, characterized in that: The guide wall is arc-shaped.

3. The motherboard simulation plug-in device according to claim 1, characterized in that: The lower frame is provided with a support block, and the support block is provided with a lower hook and a compression spring. The two ends of the compression spring are respectively connected to the support block and the lower hook. The lower hook is rotatably connected to the support block through the compression spring. The upper plate is provided with an upper hook, and the lower plate is provided with a limiting pulley. The limiting pulley presses on the side of the lower hook facing away from the compression spring. When the second movable frame pushes the lower plate to rise, the limiting pulley pushes the lower hook to rotate until it engages with the upper hook.

4. The motherboard simulation plug-in device according to claim 1, characterized in that: The upper plate is provided with a buffer post, and the buffer post is provided with a crimping post. The diameter of the buffer post is larger than the diameter of the crimping post. A limiting step is formed at the connection between the crimping post and the buffer post. A buffer spring is sleeved on the crimping post. The lower plate is provided with crimping holes corresponding to the crimping posts. When the motherboard and electrical components are plugged in, the crimping post is inserted into the crimping hole, and the two ends of the buffer spring are respectively crimped to the limiting step and the lower plate.

5. The motherboard simulation plug-in device according to claim 1, characterized in that: It also includes a CPU pressing component, which includes a mounting bracket and a drive module disposed on the mounting bracket. The output end of the drive module is provided with a pressing block, and a push block is slidably disposed on the mounting bracket. The drive module is used to drive the pressing block to push the push block and fix the CPU to the upper plate.

6. The motherboard simulation plug-in device according to claim 5, characterized in that: It also includes a water-cooling component, which includes a water inlet and a water-cooling heat sink, the water inlet and the water-cooling heat sink being connected, and the water-cooling heat sink being pressed onto the CPU.

7. The motherboard simulation plug-in device according to claim 6, characterized in that: The water-cooled heat sink is provided with a limiting bracket, and the limiting bracket is provided with an inner cavity for placing the CPU. The inner cavity is connected to the water-cooled heat sink, and the cavity wall of the inner cavity is provided with elastic buckles for limiting the CPU.

8. The motherboard simulation plug-in device according to claim 6, characterized in that: The water-cooled heat sink is also provided with a mounting bracket. When the push block pushes the CPU, the push block and the mounting bracket come into contact. The mounting bracket is provided with a pressure sensor, which is used to detect the pressure applied by the push block.

9. The motherboard simulation plug-in device according to claim 1, characterized in that: It also includes a memory module insertion assembly. The upper frame has a connection structure electrically connected to the memory module. The memory module insertion assembly includes a support frame and a pressing cylinder mounted on the support frame. The support frame has a detection sensor, which is electrically connected to a solenoid valve for controlling the pressing cylinder. The piston rod of the pressing cylinder has a connecting frame. The connecting frame has a detection rod and a slot for placing the memory module. The detection sensor is used to detect the detection rod. When the motherboard and the connection structure are inserted, the detection sensor detects the detection rod and drives the solenoid valve for controlling the pressing cylinder to de-energize. Under the action of gravity, the piston rod of the pressing cylinder moves the memory module to insert into the connection structure, thereby allowing the memory module and the motherboard to be inserted.

10. The motherboard simulation plug-in device according to claim 9, characterized in that: The connecting frame is provided with a connecting rod, and a connecting spring is sleeved on the connecting rod. The connecting rod passes through the support frame, and the two ends of the connecting spring are respectively connected to the connecting frame and the support frame.

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