A light engine assembly and light module

Abstract

The application discloses a kind of optical engine assembly and optical module, belong to optical communication device technical field, including being set on PCB digital signal processor, transimpedance amplifier, multiple vertical cavity surface emitting lasers and multiple optical detectors;Multiple vertical cavity surface emitting lasers are adjacent to each other, and are arranged in a straight line along the second direction, and the position of each vertical cavity surface emitting laser in the first direction is same;Multiple optical detectors are adjacent to each other, and are arranged in a straight line along the second direction, and the position of each vertical cavity surface emitting laser in the first direction is same;And the spacing of multiple vertical cavity surface emitting lasers and digital signal processor in the first direction is less than the spacing of multiple optical detectors and digital signal processor in the first direction.The application adjusts the position of multiple vertical cavity surface emitting lasers, shortens the connecting line between vertical cavity surface emitting laser and digital signal processor, reduces the electrical loss caused by connecting line, and reduces the overall power consumption of optical module.

Description

Technical Field

[0001] This invention belongs to the field of optical communication device technology, specifically relating to an optical engine component and an optical module. Background Technology

[0002] Optical modules are the core components of optical fiber communication systems. They are responsible for converting between electrical signals and optical signals and are widely used in data centers, 5G base stations, smart grids and other fields.

[0003] The structure of existing optical modules is as follows Figure 1 As shown, the optical module uses gold fingers for circuit connection with external devices and optical fiber for optical path connection. It modulates electrical signals into optical signals at the transmitting end, transmits them through the fiber, and then converts the optical signals back into electrical signals at the receiving end. A typical optical module structure includes a vertical-cavity surface-emitting laser (VCSEL), a laser driver (LDD), a photo detector (PD), a transimpedance amplifier (TIA), and a digital signal processor (DSP). The VCSEL converts current signals into laser signals; the laser driver drives and controls the VCSEL; and the DSP performs electrical layer signal processing, converting analog signals into digital signals and performing algorithmic processing to compensate for transmission impairments and improve signal quality. Existing optical modules contain these components. The laser driver chip and the DSP chip are typically implemented using different chips depending on the manufacturing process requirements.

[0004] With the continuous development of optical module technology and the gradual increase in optical module speed, the optical engine components responsible for photoelectric signal conversion within the optical module are becoming increasingly complex. Specifically, the optical engine components often require multiple receivers and transmitters. This results in multiple sets of optical transmitter components (used to convert electrical signals into optical signals for output, with core components including VCSELs and laser drivers) and optical receiver components (used to convert received optical signals into electrical signals, with core components including PDs and TIAs) on a single PCB board to meet high-speed transmission requirements. Correspondingly, the increased complexity of the optical module's structural design leads to the accumulation of components inside the optical module, making the wiring and component placement on the PCB board more complex, increasing not only the overall power consumption of the optical module but also the package size. Summary of the Invention

[0005] In view of one or more of the above-mentioned defects or improvement needs of the prior art, the present invention provides an optical engine component to solve the problem that the increase in the number of internal components in existing optical modules when improving the optical transmission rate leads to complex wiring and high overall power consumption.

[0006] To achieve the above objectives, the present invention provides a light engine component, comprising: A digital signal processor, a transimpedance amplifier, multiple vertical cavity surface-emitting lasers, and multiple photodetectors are mounted on a PCB board; the PCB board has a first direction and a second direction in a plane, the first direction being perpendicular to the second direction. The plurality of vertical cavity surface-emitting lasers are adjacent to each other and arranged in a straight line along the second direction, and each vertical cavity surface-emitting laser is in the same position in the first direction; The plurality of photodetectors are adjacent to each other and arranged in a straight line along the second direction, and each photodetector is in the same position in the first direction; The distance between the plurality of vertical cavity surface-emitting lasers and the digital signal processor in the first direction is smaller than the distance between the plurality of photodetectors and the digital signal processor in the first direction; The transimpedance amplifier is positioned in the first direction between the plurality of photodetectors and the digital signal processor; The plurality of vertical cavity surface-emitting lasers are electrically connected to the digital signal processor; The plurality of photodetectors are electrically connected to the transimpedance amplifier, and the transimpedance amplifier is electrically connected to the digital signal processor.

[0007] As a further improvement of the present invention, the distance between the positions of the plurality of vertical cavity surface-emitting lasers in the first direction and the positions of the plurality of photodetectors in the first direction is 1.7~2.1mm.

[0008] As a further improvement of the present invention, it also includes a plurality of capacitors, which are adjacent to each other and arranged in a straight line along the second direction, and each capacitor is in the same position in the first direction; The transimpedance amplifier is positioned in the first direction between the plurality of photodetectors and the plurality of capacitors; The plurality of capacitors are positioned in a first direction between the transimpedance amplifier and the digital signal processor; The transimpedance amplifier is electrically connected to the digital signal processor through the plurality of capacitors.

[0009] As a further improvement of the present invention, the plurality of vertical cavity surface-emitting lasers and the plurality of photodetectors are arranged along the second direction, wherein the distance between the optical window of the vertical cavity surface-emitting laser disposed along the second direction near the two sides of the PCB board and the center of the photosensitive surface of the photodetector is 2.5~3mm.

[0010] As a further improvement of the present invention, the digital signal processor is electrically connected to and fixed on the PCB board via a flip-chip connection.

[0011] As a further improvement of the present invention, the plurality of vertical cavity surface-emitting lasers and the transimpedance amplifier are configured to be connected to the PCB board pads via gold wire bonding, and the digital signal processor is electrically interconnected with the PCB board pads.

[0012] As a further improvement of the present invention, the plurality of photodetectors are bonded to the transimpedance amplifier via gold wire bonding.

[0013] As a further improvement of the present invention, the spacing between the transimpedance amplifier and the plurality of capacitors along the first direction is 0.8~1mm; The distance between the plurality of capacitors and the digital signal processor along the first direction is 0.25~0.3mm.

[0014] As a further improvement of the present invention, it also includes a plurality of signal input pads and a plurality of signal output pads disposed on the PCB board, wherein the plurality of vertical cavity surface-emitting lasers are wire bonded to the plurality of signal output pads, and the transimpedance amplifier is wire bonded to the plurality of signal input pads.

[0015] As a further improvement of the present invention, the plurality of signal input pads are arranged in a straight line along the second direction, and each signal input pad is in the same position in the first direction; the plurality of signal output pads are arranged in a straight line along the second direction, and each signal output pad is in the same position in the first direction; the distance between the plurality of signal output pads and the digital signal processor in the first direction is less than the distance between the plurality of signal input pads and the digital signal processor in the first direction.

[0016] As a further improvement of the present invention, the plurality of signal output pads are positioned in a first direction between the plurality of vertical cavity surface-emitting lasers and the digital signal processor; The plurality of signal input pads are positioned in the first direction between the transimpedance amplifier and the plurality of capacitors.

[0017] As a further improvement of the present invention, the connection length from the plurality of vertical cavity surface-emitting lasers to the digital signal processor is less than the connection length from the transimpedance amplifier to the digital signal processor.

[0018] As a further improvement of the present invention, the lengths from the plurality of signal output pads to the plurality of vertical cavity surface-emitting lasers are the same as the lengths from the plurality of signal input pads to the transimpedance amplifier.

[0019] As a further improvement of the present invention, the projections of the plurality of vertical cavity surface-emitting lasers and the photodetector in the second direction fall within the contour range of the digital signal processor in the second direction.

[0020] As a further improvement of the present invention, a first recess and a second recess are provided on the PCB board, the plurality of vertical cavity surface-emitting lasers are disposed in the first recess, and the plurality of photodetectors and the transimpedance amplifier are disposed in the second recess.

[0021] As a further improvement of the present invention, the first sink and the second sink have the same depth, and the depth of the first sink and the second sink is the average value of the height of the vertical cavity surface-emitting laser and the transimpedance amplifier.

[0022] As a further improvement of the present invention, the depths of the first sink and the second sink are different. The depth of the first sink is the same as the height of the vertical cavity surface-emitting laser, and the depth of the second sink is the same as the height of the transimpedance amplifier.

[0023] The present invention also includes a light engine assembly comprising: A digital signal processor, a transimpedance amplifier, multiple vertical cavity surface-emitting lasers, and multiple photodetectors are mounted on a PCB board; the PCB board has a first direction and a second direction in a plane, the first direction being perpendicular to the second direction. The plurality of vertical cavity surface-emitting lasers are adjacent to each other and arranged in a straight line along the second direction, and each vertical cavity surface-emitting laser is in the same position in the first direction; The plurality of photodetectors are adjacent to each other and arranged in a straight line along the second direction, and each photodetector is in the same position in the first direction; Furthermore, the distance between the plurality of vertical cavity surface-emitting lasers and the digital signal processor in the first direction is equal to the distance between the plurality of photodetectors and the digital signal processor in the first direction; The transimpedance amplifier is positioned in the first direction between the plurality of photodetectors and the digital signal processor; The plurality of vertical cavity surface-emitting lasers are electrically connected to the digital signal processor; The plurality of photodetectors are electrically connected to the transimpedance amplifier, and the transimpedance amplifier is electrically connected to the digital signal processor through the plurality of capacitors.

[0024] The present invention also includes a light engine assembly comprising: A digital signal processor, a transimpedance amplifier, multiple vertical cavity surface-emitting lasers, and multiple photodetectors are mounted on a PCB board; the PCB board has a first direction and a second direction in a plane, the first direction being perpendicular to the second direction. The plurality of vertical cavity surface-emitting lasers are adjacent to each other and arranged in a straight line along the second direction, and each vertical cavity surface-emitting laser is in the same position in the first direction; The plurality of photodetectors are adjacent to each other and arranged in a straight line along the second direction, and each photodetector is in the same position in the first direction; Furthermore, the distance between the plurality of vertical cavity surface-emitting lasers and the digital signal processor in the first direction is equal to the distance between the plurality of photodetectors and the digital signal processor in the first direction; The transimpedance amplifier is located in the first direction on the side of the plurality of photodetectors away from the digital signal processor; The plurality of vertical cavity surface-emitting lasers are electrically connected to the digital signal processor; The plurality of photodetectors are electrically connected to the transimpedance amplifier, and the transimpedance amplifier is electrically connected to the digital signal processor through the plurality of capacitors.

[0025] The present invention also includes an optical module comprising the optical engine component.

[0026] As a further improvement of the present invention, a lens assembly is also included, wherein the optical interface of the lens assembly is used to output optical signals from the plurality of vertical cavity surface-emitting lasers and to output received optical signals to the plurality of photodetectors.

[0027] As a further improvement of the present invention, it also includes a housing and an MPO jumper, wherein the housing has an optical port of the optical module; the MPO jumper is disposed inside the housing and is configured such that one end is fixed in the optical interface of the lens assembly and the other end is disposed in the optical port of the optical module.

[0028] As a further improvement of the invention, it also includes a housing and an optical fiber patch cord, one end of which extends out of the housing and the other end is inserted into and fixed in the optical interface of the lens assembly.

[0029] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0030] In summary, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art include: (1) The optical engine component of the present invention adopts a digital signal processor with an integrated laser driver, which eliminates the need to arrange a laser driver in the form of an independent chip, thereby significantly reducing the size of a single optical engine component in the width direction. Thus, within the width range defined by the same packaging protocol, more optical engine components can be arranged in the width direction. (2) The optical engine component of the present invention adjusts the positions of multiple vertical cavity surface-emitting lasers and shortens the connection lines between the vertical cavity surface-emitting lasers and the digital signal processor. The shortening of the connection lines can reduce the electrical losses caused by the connection lines, thereby improving the circuit performance of the vertical cavity surface-emitting lasers and the digital signal processor and reducing the overall power consumption of the optical module. Furthermore, by adjusting the positions of multiple photodetectors, the channel density and data transmission rate of the optical module are improved while meeting the standard optical module package size. (3) The lens assembly of the present invention adopts an open design. The open design ensures the precise coupling of the optical path on the one hand, and ensures the heat dissipation channel of the digital signal processor on the other hand, thereby improving the overall reliability and service life of the optical module. (4) The lens assembly of the present invention ensures that the adhesive only covers the predetermined area after curing without touching the optical window of the vertical cavity surface laser by controlling the distance between the first surface and the third surface and the spacing between the side of the first surface away from the ferrule insertion slot in the first direction and the vertical surface of the lens assembly away from the ferrule insertion slot. This ensures the sealing effect while ensuring the cleanliness of the optical device. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of a light engine component in the prior art; Figure 2 This is a schematic diagram of the structure of a light engine component in an embodiment of the present invention; Figure 3 This is a schematic diagram of another light engine component in an embodiment of the present invention; Figure 4 This is a schematic diagram of another light engine component in an embodiment of the present invention; Figure 5 This is a schematic diagram of the application of the optical engine component in the optical module in an embodiment of the present invention; Figure 6 yes Figure 5 A magnified view of a section at point A in the middle; Figure 7 This is a schematic diagram of the arrangement structure of the vertical cavity surface-emitting laser and the photodetector in an embodiment of the present invention; Figure 8 This is a schematic diagram of the optical engine assembly, lens assembly, and their mating structure in an embodiment of the present invention; Figure 9This is a schematic diagram of the lens assembly in an embodiment of the present invention; Figure 10 This is a schematic diagram of the lens assembly from another angle in an embodiment of the present invention; Figure 11 This is a cross-sectional structural diagram of the lens assembly in an embodiment of the present invention; Figure 12 This is a cross-sectional structural diagram of the optical module in an embodiment of the present invention; Figure 13 yes Figure 12 A magnified view of a section at point B in the middle; Figure 14 This is a schematic diagram of the optical module in an embodiment of the present invention; Figure 15 This is a schematic diagram of the structure of another optical module in an embodiment of the present invention; Figure 16 This is a schematic diagram of the overall structure of the optical module in an embodiment of the present invention.

[0032] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. PCB board; 2. Vertical cavity surface-emitting laser; 3. Digital signal processor; 4. Photodetector; 5. Transimpedance amplifier; 6. Capacitor; 7. Lens assembly; 8. MT jumper; 9. Fiber optic jumper; 10. Housing; 11. MPO jumper interface; 101. First sink; 102. Second sink; 103. Gold finger; 104. Signal input pad; 105. Signal output pad; 701. First surface; 702. Second surface; 703. Third surface; 704. Sixth surface; 705. Bottom surface; 706. Side surface; 707. Vertical surface; 708. First reflecting cavity; 709. Second reflecting cavity; 710. Second clearance groove; 711. First clearance groove; 712. Seventh surface; 713. Eighth surface; 714. First convex lens; 715. Second convex lens; 716. Third convex lens; 717. Insertion groove; 718. Fourth surface; 719. Fifth surface; 720. Opening; 721. Lens body; 722. Fourth convex lens; 723. Fifth convex lens. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0034] In the description of this invention, it should be understood that, unless otherwise stated, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0035] Furthermore, unless otherwise stated, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] Optical module packaging is limited by the standard form factor specified by various protocols. Currently, common optical module packaging types suitable for short-distance transmission scenarios include SFP / SFP+, QSFP+ / QSFP28, QSFP-DD, and OSFP. According to protocol SFF-8432, SFP / SFP+ packaged optical modules are 13.4mm wide. According to protocols SFF-8436 and SFF-8680, QSFP+ / QSFP28 packaged optical modules are 18.35mm wide. According to the QSFP-DD MSA Hardware Specification, QSFP-DD optical modules are 18.35mm wide. According to the OSFP MSA, OSFP packaged optical modules are 22.6mm wide. CFP series packages designed for long-distance, high-capacity transmission are not considered in this solution; that is, the applicable optical module width for this solution is typically 13mm to 27mm. As the performance of optical modules gradually improves, they often require multiple vertical-cavity surface-emitting lasers (VCSELs), multiple laser drivers (LDDs), multiple photodiodes (PDs), and multiple trans-impedance amplifiers (TIAs). This leads to the accumulation of internal components and makes the wiring and component placement on the PCB board more complex, which not only increases the overall power consumption of the optical module but also increases the package size.

[0039] In this invention, a digital signal processor (DSP) chip with an integrated laser driver (LDD) is used to replace the discrete laser driver (LDD) chip and DSP chip, thereby reducing the number of components in the optical engine assembly, simplifying wiring, and avoiding an increase in package size.

[0040] When using a digital signal processor (DSP) with an integrated laser driver (LDD), the size of a single optical engine component in the width direction can be significantly reduced. This allows for the arrangement of more optical engine components along the width direction within the same package type of optical module. Furthermore, compared to optical engine components using separate laser drivers and DSPs, using a DSP with an integrated laser driver enables the DSP to directly drive the vertical-cavity surface-emitting laser (VCSEL), effectively reducing energy loss in the signal link and significantly lowering the overall power consumption of the optical mode.

[0041] The optical engine assembly of this invention refers to a combination of devices coupled to the same lens assembly within an optical module for realizing photoelectric signal conversion, suitable for short-distance transmission scenarios. Considering physical structure and functional requirements, for optical modules with multiple vertical-cavity surface-emitting lasers and photodetectors, the optical interface of the optical module adopts an integrated transceiver design, including both optical fibers that emit optical signals relative to the optical module and optical fibers that receive optical signals within the same optical module's optical interface.

[0042] In contrast, some optical modules employ two structurally different optical engine components. One component contains only an optical transmitter, while the other contains only an optical receiver. The optical module's optical interface connects to each of these two components. For optical modules with two optical module interfaces, this means that the optical fiber connected to these interfaces will inevitably experience bending, affecting its lifespan and potentially causing signal degradation. Furthermore, with this type of structure, both optical engine components need to connect to each of the two optical module ports, increasing the complexity of the optical fiber within the module and raising the cost of assembling the fiber.

[0043] The optical engine assembly of this invention includes both an optical emitting component and an optical receiving component. The optical engine assembly of this invention can correspond one-to-one with the optical interface of an optical module; that is, the optical fiber used for receiving signals and the optical fiber used for transmitting signals in the optical interface of an optical module are coupled to the same optical engine assembly. Therefore, the multiple optical fibers between the optical interface of the lens assembly and the optical interface of the optical module, regardless of whether they are used for optical transmission or reception, can have substantially the same length. Thus, by adjusting the relative positions of the optical engine assembly and the optical interface of the optical module, the optical fibers connected between the optical engine assembly and the optical interface of the optical module are ensured to be in a naturally extended state. For an optical module with two optical interface units, only one more optical engine assembly of this invention is needed to utilize the second optical interface unit. The optical fibers connecting the two optical engine assemblies do not interfere with each other and are easy to install.

[0044] Example 1: like Figure 2 As shown, as an optional embodiment of the present invention, the present invention includes an optical engine assembly comprising a digital signal processor 3, a transimpedance amplifier 5, multiple vertical-cavity surface-emitting lasers 2, and multiple photodetectors 4 disposed on a PCB board 1. The digital signal processor 3 integrates a laser driver (LDD), thereby eliminating the need for a separate laser driver. Omitting the laser driver helps to reduce the width of the optical engine assembly.

[0045] PCB board 1 has a first direction and a second direction in a plane, the first direction being perpendicular to the second direction, wherein the first direction is the length direction of the PCB board. Figure 2 The middle horizontal direction), the second direction is the PCB board width direction ( Figure 2 (in the vertical direction).

[0046] Multiple vertical-cavity surface-emitting lasers 2 are adjacent to each other and arranged in a straight line along the second direction, and each vertical-cavity surface-emitting laser 2 is positioned in the same position in the first direction. Multiple photodetectors 4 are adjacent to each other and arranged in a straight line along the second direction, and each photodetector 4 is positioned in the same position in the first direction.

[0047] Simultaneously, the distance between the multiple vertical-cavity surface-emitting lasers 2 and the digital signal processor 3 in the first direction is equal to the distance between the multiple photodetectors 4 and the digital signal processor 3 in the first direction. The transimpedance amplifier 5 is positioned between the multiple photodetectors 4 and the digital signal processor 3 in the first direction. The multiple vertical-cavity surface-emitting lasers 2 are electrically connected to the digital signal processor 3; the multiple photodetectors 4 are electrically connected to the transimpedance amplifier 5, and the transimpedance amplifier 5 is electrically connected to the digital signal processor 3.

[0048] Multiple vertical-cavity surface-emitting lasers 2 and multiple photodetectors 4 correspond to the same lens assembly ( Figure 2 (Not shown). When the optical engine assembly is used in an MPO interface optical module, this type of optical module uses an MT ferrule. The MT ferrule is coupled to the optical engine assembly via a lens assembly. The lens assembly is used to guide the light emitted from each of the multiple vertical-cavity surface-emitting lasers 2 into the multiple optical fibers in the MT ferrule used for light emission, and also to guide the light from the multiple optical fibers in the MT ferrule used for light reception to each of the multiple photodetectors 4. The fiber end faces are along the width direction of the MT ferrule ( Figure 2 The second direction) is arranged in a straight line, thus restricting the positions of multiple vertical cavity surface-emitting lasers 2 and multiple photodetectors 4. Figure 2 In this embodiment, to reduce the design cost of the lens assembly, multiple vertical-cavity surface-emitting lasers 2 and multiple photodetectors 4 are arranged flush in the first direction. Accordingly, within the lens assembly, the optical paths of the vertical-cavity surface-emitting lasers 2 and photodetectors 4 to their respective optical fibers are the same, thus enabling the coupling of the optical engine assembly and the MT ferrule to be achieved using a common lens assembly.

[0049] Typically, optical engine assemblies with multiple vertical-cavity surface-emitting lasers (VCSELs) 2 and multiple photodetectors 4 are coupled to a single MT ferrule capable of accommodating multiple optical fibers to meet the high-density requirements of optical modules. According to the IEC 61754-7 protocol, the fiber core spacing within the MT ferrule is 0.25 mm. To match the MT ferrule standard, the spacing (along the second direction) between two adjacent photodetectors 4 or two adjacent VCSELs 2 in the optical engine assembly is 0.25 mm, and the spacing (along the second direction) between adjacent photodetectors 4 and VCSELs 2 is an integer multiple of 0.25 mm.

[0050] As an optional embodiment of the present invention, by employing a digital signal processor 3 with an integrated laser driver, a corresponding mounting space for the laser driver is left on the PCB board 1, thus leaving ample space between the vertical-cavity surface-emitting laser 2 and the digital signal processor 3. The applicable optical module width for this solution is typically 13 mm to 27 mm. During the packaging process, to prevent dust, particulate matter, and other contaminants from affecting the optical path, the vertical-cavity surface-emitting laser and its driver chip, photodetector, and its transimpedance amplifier are all packaged together within a lens assembly 7. For optical modules with multiple vertical-cavity surface-emitting lasers 2 and multiple photodetectors 4, the multiple vertical-cavity surface-emitting lasers 2 and multiple photodetectors 4 are linearly distributed along the width direction (second direction) of the optical module. When using a digital signal processor with an integrated laser driver, the size of a single optical engine assembly in the width direction can be significantly reduced, thereby allowing for more sets of optical engine assemblies to be arranged along the width direction in optical modules using the same packaging type. Through the above structural layout, while meeting the standard optical module packaging size, the channel density and data transmission rate of the optical module are improved, while maintaining good optical isolation and dustproof performance.

[0051] As an optional embodiment of the present invention, the digital signal processor 3 is electrically connected to and fixed on the PCB board 1 via a flip-chip connection. The digital signal processor 3 is fixed to the PCB board 1 via a flip-chip connection. That is, the active surface of the digital signal processor 3 faces the PCB board 1 and is directly connected to the PCB board 1 via bumps. This shortens the connection path between the digital signal processor 3 and the PCB board 1, reduces the overall size of the optical engine assembly, and allows for direct perpendicular conduction between the digital signal processor 3 and the PCB board 1, significantly reducing signal delay, inductance, and crosstalk.

[0052] As an optional embodiment of the present invention, the plurality of vertical-cavity surface-emitting lasers 2 and transimpedance amplifiers 5 are respectively connected to the pads of the PCB board 1 via gold wire bonding. The digital signal processor 3 is electrically interconnected with the pads of the PCB board 1. Specifically, the digital signal processor 3 chip is electrically connected and fixed on the PCB board 1 via flip-chip technology, and the input / output terminals of the digital signal processor 3 are fanned out to the signal input / signal output pads via internal traces on the PCB board 1. The vertical-cavity surface-emitting lasers 2, photodetectors 4, and transimpedance amplifiers 5 are mounted on corresponding areas of the PCB board 1, wherein the vertical-cavity surface-emitting lasers 2 are connected to the signal output pads via gold wire bonding. Figure 2 Electrically connected (not shown), the transimpedance amplifier 5 is bonded to the signal input pad (via gold wire bonding) Figure 2Electrical connections (not shown). The photodetector 4 and the transimpedance amplifier 5 are electrically connected via gold wire bonding. The digital signal processor 3 and the signal output pad 105 are electrically connected via PCB traces, avoiding high-density gold wire bonding on the surface of the digital signal processor 3, significantly reducing packaging complexity and process difficulty.

[0053] A lens assembly is positioned above the vertical-cavity surface-emitting laser 2 and the photodetector 4 in a third direction (perpendicular to the PCB board surface). The lens assembly is positioned on the light output / input path of the vertical-cavity surface-emitting laser 2 and the photodetector 4 according to the optical path requirements.

[0054] If the digital signal processor 3 is directly wire-bonded with the vertical cavity surface-emitting laser 2 and the photodetector 4, the lens assembly must be designed to avoid the height of the gold wire arch and the bonding area, since the process usually requires the lens to be assembled after the gold wire bonding is completed. This will result in an increase in lens size and a longer optical path, which in turn will cause the optical module to expand or increase the difficulty and cost of lens design.

[0055] In this embodiment, the vertical-cavity surface-emitting laser 2 (VCSEL) and the digital signal processor 3 are not directly connected via gold wire bonding, nor is the transimpedance amplifier 5 directly connected via gold wire bonding. However, the photodetector 4 and the transimpedance amplifier 5 are directly connected via gold wire bonding. By using gold wire bonding to connect to the pad area, this scheme offers high design flexibility, is not limited by the density of gold wire bonding on the surface of the digital signal processor 3, and allows for flexible configuration of the number of VCSELs 2 or photodetectors 4 and their positions on the PCB board according to actual needs. Simultaneously, it effectively shortens the signal path between the optical chip and the driving circuit, reduces parasitic capacitance and signal crosstalk, and improves high-frequency signal integrity. This is particularly suitable for scenarios where multiple optical engine components need to be arranged on the PCB board. In the second direction, the photodetector 4 and the transimpedance amplifier 5 can be placed as close as possible to the VCSEL 2, thus reducing the area of ​​the optical engine components. Furthermore, by staggering multiple optical engine components, more optical engine components can be accommodated on a PCB board of the same width, which is beneficial for further improving the optical module speed.

[0056] As a feasible embodiment of the present invention, the light engine component of the present invention further includes multiple capacitors ( Figure 2(Not shown). Multiple capacitors are located between the transimpedance amplifier 5 and the digital signal processor 3 in the first direction, and the transimpedance amplifier 5 is electrically connected to the digital signal processor 3 through the multiple capacitors. The output signal of the transimpedance amplifier 5 may contain a DC component, while the signal processed by the digital signal processor 3 is usually an AC modulated signal. By placing capacitors between the transimpedance amplifier 5 and the digital signal processor 3, the DC component can be filtered out to prevent the DC component from being input into the digital signal processor 3, thus ensuring the stable operation of the digital signal processor 3.

[0057] Furthermore, the capacitor is located between the signal input pad and the digital signal processor 3. The signal from the transimpedance amplifier 5 passes through the signal input pad, then through the corresponding capacitor, and is subsequently transmitted to the digital signal processor 3. At this time, the digital signal processor 3 is connected to the capacitor through traces on the PCB, and the capacitor is connected to the signal input pad through traces on the PCB.

[0058] The digital signal processor 3, transimpedance amplifier 5, vertical cavity surface-emitting laser 2, and photodetector 4 in the optical engine assembly are all common components in optical modules, and their specific functions and roles will not be elaborated further.

[0059] Example 1 also has shortcomings. From Figure 2 As can be seen, due to the presence of the transimpedance amplifier TIA5, the distance between the vertical-cavity surface-emitting laser 2 and the digital signal processor 3 is greater than the distance between the photodetector 4 and the digital signal processor 3. This distance transmits high-speed electrical signals with frequencies up to GHz, and the transmission of high-speed electrical signals is affected by the traces on the PCB board. If the distance between the vertical-cavity surface-emitting laser 2 and the digital signal processor 3 is too great, it will lead to the degradation of parasitic parameters, which will have a significant impact on the path of the vertical-cavity surface-emitting laser 2 in the optical module, and may even cause the signal to fail to output effectively.

[0060] Example 2: like Figure 3 As shown, as another optional embodiment of the present invention, the optical engine component includes a digital signal processor 3, a transimpedance amplifier 5, multiple vertical cavity surface-emitting lasers 2 and multiple photodetectors 4 disposed on a PCB board 1.

[0061] The difference between this embodiment and the aforementioned Embodiment 1 lies in the positional relationship between the photodetector 4 and the transimpedance amplifier 5 relative to the digital signal processor 3. Only this difference will be described below; the remaining parts that are the same as in Embodiment 1 will not be repeated.

[0062] Multiple vertical-cavity surface-emitting lasers (VCSELs) 2 are arranged adjacent to each other in a straight line along the second direction, and each VCSEL 2 is positioned identically in the first direction. Multiple photodetectors 4 are also arranged adjacent to each other in a straight line along the second direction, and each photodetector 4 is positioned identically in the first direction. Simultaneously, the multiple VCSELs 2 and the digital signal processor 3 are arranged flush with each other in the first direction; that is, the distance between the multiple VCSELs 2 and the digital signal processor 3 in the first direction is equal to the distance between the multiple photodetectors 4 and the digital signal processor 3 in the first direction.

[0063] Furthermore, the transimpedance amplifier 5 is positioned in the first direction on the side of the plurality of photodetectors 4 opposite to the digital signal processor 3. The plurality of vertical-cavity surface-emitting lasers 2 are electrically connected to the digital signal processor 3. The plurality of photodetectors 4 are electrically connected to the transimpedance amplifier 5, and the transimpedance amplifier 5 is electrically connected to the digital signal processor 3.

[0064] When the transimpedance amplifier 5 is positioned on the side of the photodetector 4 away from the digital signal processor 3, it is equivalent to not needing to place the transimpedance amplifier 5 between the photodetector 4 and the digital signal processor 3. In this case, the photodetector 4, similar to the vertical-cavity surface-emitting laser 2, can be positioned adjacent to the digital signal processor 3, and the optical path from the fiber in the lens assembly to the corresponding vertical-cavity surface-emitting laser 2 is the same as that of the photodetector 4. This improves the electrical performance between the vertical-cavity surface-emitting laser 2 and the digital signal processor 3 without affecting the design and manufacturing of the lens assembly 7.

[0065] The drawback of Embodiment 2 is that, since the photodetector 4 needs to be electrically connected to the digital signal processor 3 through the transimpedance amplifier 5, when the transimpedance amplifier 5 is adjusted to the side where the photodetector 4 is away from the digital signal processor 3, the length of the connection line between the transimpedance amplifier 5 and the digital signal processor 3 will increase accordingly, and the circuit performance between the transimpedance amplifier 5 and the digital signal processor 3 will decrease accordingly, affecting the optical module's reception of optical signals. Furthermore, this scheme results in complex routing of the photodetector 4, increasing the complexity of the PCB design.

[0066] Example 3: Please see Figures 4-6 The optical engine component in embodiment 3 includes a digital signal processor 3, a transimpedance amplifier 5, multiple vertical cavity surface-emitting lasers 2 and multiple photodetectors 4 disposed on a PCB board 1.

[0067] The difference between this embodiment and the aforementioned Embodiment 1 lies in the change in the relative positions of the photodetector 4 and the vertical-cavity surface-emitting laser 2. Only this difference will be described below; the remaining parts that are the same as in Embodiment 1 will not be repeated.

[0068] Multiple vertical-cavity surface-emitting lasers (VCSELs) 2 are adjacent to each other and arranged in a straight line along the second direction, with each VCSEL 2 positioned identically in the first direction. Multiple photodetectors 4 are adjacent to each other and arranged in a straight line along the second direction, with each photodetector 4 positioned identically in the first direction. The VCSELs 2 and the digital signal processor 3 are positioned differently in the first direction, and the distance between the multiple VCSELs 2 and the digital signal processor 3 in the first direction is less than the distance between the multiple photodetectors 4 and the digital signal processor 3 in the first direction.

[0069] In addition, the transimpedance amplifier 5 is located between multiple photodetectors 4 and digital signal processor 3 in the first direction. Multiple vertical cavity surface-emitting lasers 2 are electrically connected to digital signal processor 3, multiple photodetectors 4 are electrically connected to transimpedance amplifier 5, and transimpedance amplifier 5 is electrically connected to digital signal processor 3.

[0070] By adjusting the distances between the vertical cavity surface-emitting laser 2 and the photodetector 4 and the digital signal processor 3, the connection length between the vertical cavity surface-emitting laser 2 and the digital signal processor 3 is shortened, and the two connection segments between the photodetector 4, the transimpedance amplifier 5 and the digital signal processor 3 are not too long, thus solving the problem of reduced signal transmission quality caused by excessively long connection segments in Examples 1 and 2.

[0071] In Example 3, compared to Example 1, the positions of the multiple vertical-cavity surface-emitting lasers (VCSELs) 2 are adjusted so that the VCSELs 2 are positioned closer to the digital signal processor (DSP) 3. This makes the distance between the VCSELs 2 and the DSP 3 in the first direction smaller than the distance between the multiple photodetectors 4 and the DSP 3 in the first direction, thereby shortening the connection lines between the VCSELs 2 and the DSP 3. Specifically, the high-speed electrical signal output by the DSP acts on the VCSELs to generate an optical signal. Since this electrical signal is a high-frequency, large-swing signal, it is extremely sensitive to parasitic parameters in the transmission path; increasing the transmission path length leads to degradation of these parasitic parameters. The photocurrent signal generated by the photodetector is typically very weak and needs to be pre-amplified by a transimpedance amplifier to convert it into a voltage signal before being transmitted to the DSP. Because the transimpedance amplifier can effectively amplify weak signals, prioritizing the placement of the VCSELs closer to the DSP optimizes the high-speed electrical signal transmission path driving the VCSELs, significantly improving the signal quality of the optical transmitting component while ensuring the performance of the optical receiving component.

[0072] In Example 3, optionally, the distance D1 between the positions of the plurality of vertical cavity surface-emitting lasers 2 in the first direction and the positions of the plurality of photodetectors 4 in the first direction is 1.7~2.1mm.

[0073] Optionally, the optical engine assembly of Embodiment 3 is used in an MPO interface optical module. This type of optical module uses an MT ferrule, meaning that the fiber end face for coupling with the vertical-cavity surface-emitting laser 2 is positioned in the same direction as the fiber end face for coupling with the photodetector 4. Due to the requirements of the photodetector 4, the optical signal incident on the fiber needs to be precisely focused by a lens system before it can be efficiently coupled to the photosensitive surface of the photodetector. However, in this embodiment, the vertical-cavity surface-emitting laser 2 and the photodetector 4 are positioned differently in the first direction, meaning that the optical signal emitted by the vertical-cavity surface-emitting laser 2 is not precisely focused on the fiber end face. In this embodiment, the fiber end face emitting the optical signal to the photodetector is located at the focal plane of the photodetector 4, and thus the fiber end face receiving the emitted light from the vertical-cavity surface-emitting laser 2 is located after the focal point of the vertical-cavity surface-emitting laser 2. Figure 4 (To the left of the location of the vertical cavity surface laser emitter 2).

[0074] The lens assembly provided in this embodiment is mainly applicable to Embodiment 3 and is not applicable to Embodiments 1 and 2. The two reflective surfaces of the lens assembly are respectively positioned directly above the vertical-cavity surface-emitting laser 2 and the photodetector 4. The optical signal emitted by the vertical-cavity surface-emitting laser 2 is converted into an optical signal parallel to the PCB board 1 via the reflective surfaces; the optical signal emitted via the optical fiber is converted into an optical signal perpendicular to the PCB board 1 via the reflective surfaces and coupled to the photodetector. That is, the optical path lengths of the optical signal emitted by the vertical-cavity surface-emitting laser 2 and the optical signal received by the photodetector 4 are different. In one embodiment, the distance between the positions of the two reflective surfaces along the first direction is the same as the distance D1 between the positions of the plurality of vertical-cavity surface-emitting lasers 2 and the plurality of photodetectors 4 along the first direction. However, the optical fiber end face used for coupling with the vertical-cavity surface-emitting laser 2 is positioned in the same first direction as the optical fiber end face used for coupling with the photodetector 4. According to the IEEE 802.3bm-2015 (100GBASE-SR4) protocol, the transmitter must have a ring flux of ≥86% within a 19μm radius and an EF of ≤30% within a 4.5μm radius. This means that within a 19μm radius circular area, at least 86% of the total optical power received at the fiber endface must be included, and within a 4.5μm radius circular area at the fiber core center, no more than 30% of the total optical power received at the fiber endface must be included. For 400G optical modules, the same EF limits (≥86% for 19μm, ≤30% for 4.5μm) are adopted according to the IEEE 802.3cm-2020 (400GBASE-SR8) protocol. Since the fiber endface is located behind the focal point of the vertical-cavity laser transmitter 2, energy may diffuse outwards towards the fiber core, causing a decrease in central power. If the energy percentage within the 19μm radius is less than 86%, the optical module will be unusable. Therefore, the value of D1 cannot be too large. Based on optical path performance, the spacing D1 between the vertical-cavity surface-emitting laser 2 and the multiple photodetectors 4 in the first direction is controlled to be less than or equal to 2.1 mm. That is, for a multimode fiber with a core diameter of 50 μm, when the defocusing amount between it and the vertical-cavity surface-emitting laser 2 is ≤2.1 mm, the ring flux can meet the protocol standard. The upper limit of D1 is also related to the avoidance of interference in subsequent dispensing processes. It should be noted that, as an extended light source, the vertical-cavity surface-emitting laser has a large emitting surface; even with a certain amount of defocusing, coupling with the fiber can be achieved through processing.

[0075] In the design of the optical engine assembly, the smaller the distance between the vertical-cavity surface-emitting laser 2 and the fiber end face, the better the optical transmission performance between the vertical-cavity surface-emitting laser 2 and the fiber end face. Correspondingly, the farther the vertical-cavity surface-emitting laser 2 is from the digital signal processor 3, the worse the circuit performance between the vertical-cavity surface-emitting laser 2 and the digital signal processor 3. Therefore, once the positions of the multiple photodetectors 4 are determined, a larger D1 will result in better circuit performance. Thus, shortening the distance between the multiple photodetectors 4 and the digital signal processor 3 will help to shorten the distance between the vertical-cavity surface-emitting laser 2 and the digital signal processor 3.

[0076] The transimpedance amplifier 5 is positioned between multiple photodetectors 4 and the digital signal processor 3 in the first direction. The photodetectors 4 are electrically connected to the transimpedance amplifier 5 via gold wire bonding, and the transimpedance amplifier 5 is also electrically connected to the digital signal processor 3 via gold wire bonding. Due to the size of the transimpedance amplifier 5 and the requirements of the gold wire bonding process, there is a limit to the distance between the photodetectors 4 and the digital signal processor 3 in the first direction (it cannot be too small). When the distance between the photodetectors 4 and the digital signal processor 3 in the first direction is minimized, this distance only meets the requirements for mounting the digital signal processor 3, transimpedance amplifier 5, and photodetectors 4 onto the PCB board 1 using a flip-chip bonding process and for the gold wire bonding process to achieve the desired shape. At this point, to ensure the quality of the electrical signal between the vertical-cavity surface-emitting laser 2 and the digital signal processor 3, the spacing D1 between the vertical-cavity surface-emitting laser 2 and the multiple photodetectors 4 in the first direction is controlled to be greater than or equal to 1.7 mm. For a single-channel 100G optical module, this distance can ensure the integrity of the high-speed electrical signal between the digital signal processor 3 and the vertical-cavity surface-emitting laser 2. Therefore, the value of D1 is between 1.7 mm and 2.1 mm.

[0077] The positional distance D1 between the vertical cavity surface-emitting laser 2 and the photodetector 4 in the first direction can also be represented by the distance between the vertical cavity surface-emitting laser 2 and the digital signal processor 3.

[0078] Furthermore, such as Figure 6 As shown, in a feasible embodiment of the present invention, the optical engine component further includes a plurality of capacitors 6, which are adjacent to each other and arranged in a straight line along a second direction, and each capacitor 6 is positioned at the same location in a first direction. The plurality of capacitors 6 are located between the transimpedance amplifier 5 and the digital signal processor 3 in the first direction, and the transimpedance amplifier 5 is electrically connected to the digital signal processor 3 through the plurality of capacitors 6. The output signal of the transimpedance amplifier 5 may contain a DC component, while the signal processed by the digital signal processor 3 is typically an AC modulated signal. By placing capacitors 6 between the transimpedance amplifier 5 and the digital signal processor 3, the DC component can be filtered out to prevent it from being input into the digital signal processor 3, thus ensuring stable operation of the digital signal processor 3.

[0079] Optional, such as Figure 7 The optical engine assembly shown includes four vertical-cavity surface-emitting lasers (VCSELs) 2 and four photodetectors 4. All four VCSELs 2 and photodetectors 4 are arranged along a second direction. The distance D2 between the center of the optical window of the VCSEL 2 located near the two sides of the PCB board 1 and the center of the photosensitive surface of the photodetector 4 is 2.5~3 mm. That is, the center distance between VCSEL 1 and PD1 is 2.5~3 mm. The parallel operation of multiple photodetectors 4 and multiple VCSELs 2 improves the transmission efficiency of the optical engine assembly. For optical modules, a single-row MT ferrule is generally used. In order to ensure the performance of the photodetector 4, the optical fibers coupled to the vertical cavity surface-emitting laser 2 and the photodetector 4 are fixed on both sides of the MT ferrule. There is a spacing of 10 to 12 fiber holes between the outermost vertical cavity surface-emitting laser 2 (VCSEL1) and the outermost photodetector 4 (PD1). It can be concluded that the center distance between the optical window of the vertical cavity surface-emitting laser 2 and the photosensitive surface of the photodetector 4, which are opposite to each other along the second direction, is 2.5 to 3 mm.

[0080] In Example 3, optionally, such as Figure 6 and Figure 7 As shown, the optical engine assembly has four vertical-cavity surface-emitting lasers (VCSELs) 2 and four photodetectors 4. The four VCSELs 2, four photodetectors 4, multiple signal input pads 104, and multiple signal output pads 105 are all arranged in a straight line along the second direction. A transimpedance amplifier 5 is located between the photodetectors 4 and the signal input pads 104. The projections of the VCSELs 2 and the transimpedance amplifier 5 along the second direction overlap. The center-to-center distance D2 between the photosensitive surfaces of VCSLE1 and PD1 is 2.75 mm. This optical engine assembly is suitable for a single-row 12-core MT ferrule. The coupling fibers to the VCSELs 2 and photodetectors 4 are fixed in fiber optic holes on both sides of the MT ferrule. The four fiber holes at the center of the MT ferrule are not filled with fiber. That is, the spacing between the adjacent vertical cavity surface emission laser 2 and photodetector 4, i.e., VCSEL4 and PD4, is 5*0.25mm. The spacing between the outermost vertical cavity surface emission laser 2 and photodetector 4, i.e., VCSEL1 and PD1, located along the second direction, is 2.75mm.

[0081] The positions of the vertical-cavity surface-emitting laser 2 or the photodetector 4 can also be adjusted to make the structure of the optical engine assembly more compact. However, in embodiment 3, the photodetector 4 and the transimpedance amplifier 5 are connected by gold wire. This means that the transimpedance amplifier 5 protrudes beyond the photodetector 4 along the second direction. To ensure that the transimpedance amplifier 5 or the vertical-cavity surface-emitting laser 2 is not affected during gold wire bonding, a sufficient safety distance needs to be reserved. Therefore, at least three fiber holes are reserved between adjacent vertical-cavity surface-emitting laser 2 and photodetector 4, that is, the distance between the outermost vertical-cavity surface-emitting laser 2 (VCSEL1) and photodetector 4 (PD1) along the second direction is greater than or equal to 2.5 mm.

[0082] Of course, the optical module can use a single-row 16-core MT ferrule. In this case, if the outermost fiber optic holes are still used to fix the fibers sequentially, it means that the distance between the photodetector 4 or transimpedance amplifier 5 and the vertical-cavity surface-emitting laser 2 increases, which will lead to an increase in the width of the optical engine assembly along the second direction. For the optical modules applicable to this solution, especially SFP / SFP+ packaged optical modules, the excessive width of the optical engine assembly makes it impossible to implement solutions that require two or more optical engine assemblies, thus limiting the improvement of the optical module speed. Therefore, a maximum of 5 fiber optic holes are reserved between adjacent vertical-cavity surface-emitting laser 2 (VCSEL4) and photodetector 4 (PD4). At this time, the distance between the outermost vertical-cavity surface-emitting laser 2 (VCSEL1) and photodetector 4 (PD1) along the second direction is 3mm.

[0083] Further optionally, the distance between the transimpedance amplifier 5 and the plurality of capacitors 6 along the first direction is 0.8~1mm, and the distance between the plurality of capacitors 6 and the digital signal processor 3 along the first direction is 0.25~0.3mm.

[0084] In one embodiment of the present invention, the digital signal processor 3 is fixed to the PCB board 1 using a flip-chip bonding process, and its functional pins are fanned out to the surrounding preset pad area through internal traces on the substrate. The capacitors are also mounted on the surface of the PCB board 1 using a flip-chip bonding process. To ensure unobstructed heat dissipation and feasibility of subsequent maintenance operations, the minimum distance between the digital signal processor 3 chip and the capacitors is controlled to be greater than 0.5mm. The vertical-cavity surface-emitting laser 2 and the photodetector 4 are mounted on preset areas of the PCB board 1. The photodetector 4 and the transimpedance amplifier 5 are connected by gold wire bonding. To achieve low-loss transmission of high-frequency signals, the length of the gold wire bonding needs to be shortened as much as possible. Due to limitations in the precision of the optoelectronic chip mounting process and the requirements for gold wire bonding, the distance between the adjacent boundaries of the photodetector 4 and the transimpedance amplifier 5 is controlled between 50μm and 100μm. Within this distance range, a low-arc, short-distance connection between the output end of the photodetector 4 and the input end of the transimpedance amplifier 5 can be achieved using standard gold wire bonding, effectively reducing parasitic inductance and signal reflection introduced by the bonding wires, and improving the bandwidth and sensitivity of the optical receiving component.

[0085] Further optionally, similar to Embodiment 1, multiple signal input pads 104 are arranged in a straight line along the second direction, and each signal input pad 104 is positioned identically in the first direction. Multiple signal input pads 104 are also arranged in a straight line along the second direction, and each signal output pad 105 is positioned identically in the first direction. The distance between the multiple signal output pads 105 and the digital signal processor 3 in the first direction is less than the distance between the multiple signal input pads 104 and the digital signal processor 3 in the first direction. It should be noted that the distance between the signal output pads 105 and the vertical-cavity surface-emitting laser 2, or between the signal input pads 104 and the transimpedance amplifier 5, only needs to meet the requirements of the gold wire bonding process.

[0086] As an optional embodiment of the present invention, the gold wire connection length from the multiple signal output pads 105 to the vertical cavity surface-emitting laser 2 is the same as the gold wire connection length from the multiple signal input pads 104 to the transimpedance amplifier 5.

[0087] Optionally, multiple signal output pads 105 are positioned in the first direction between multiple vertical-cavity surface-emitting lasers 2 and the digital signal processor 3, and multiple signal input pads 104 are positioned in the first direction between the transimpedance amplifier 5 and multiple capacitors 6. The arrangement of the signal input pads 104 and signal output pads 105 is similar to the arrangement of the vertical-cavity surface-emitting lasers 2 and the transimpedance amplifier 5. The signal input pads 104 and signal output pads 105 are respectively positioned on the side of the vertical-cavity surface-emitting lasers 2 and the transimpedance amplifier 5 facing the digital signal processor 3 and are arranged in a regular manner to reduce the gold wire connection length between the vertical-cavity surface-emitting lasers 2 and the signal output pads 105, and to reduce the gold wire connection length between the transimpedance amplifier 5 and the signal input pads 104. In this case, the transimpedance amplifier 5 is indirectly connected to the digital signal processor 3 through the signal output pads 105. Specifically, the transimpedance amplifier 5 is connected to the capacitors 6 through the signal input pads 104, and the capacitors 6 are connected to the digital signal processor 3 through PCB traces. Understandably, capacitors are placed as close as possible to the digital signal processor 3 to shorten the power supply loop path, reduce parasitic inductance, and improve power supply stability. At the same time, concentrating capacitors around the digital signal processor 3 effectively prevents accidental contact or short circuits between the gold wire and capacitors due to improper operation during gold wire bonding near the photodetector 4, thus reducing process risks.

[0088] In embodiment 3, the connection length from the multiple vertical-cavity surface-emitting lasers 2 to the digital signal processor 3 is less than the connection length from the transimpedance amplifier 5 to the digital signal processor 3. It should be noted that the connection length refers to the length of the circuit connection, specifically including the length of the gold wires used for wire bonding and the length of the PCB traces. For the vertical-cavity surface-emitting lasers 2, this connection length includes the length of the gold wire connecting the vertical-cavity surface-emitting laser 2 to the signal output pad 105 and the length of the PCB trace between the signal output pad 105 and the digital signal processor 3. For the transimpedance amplifier 5, this connection length includes the length of the gold wire connecting the transimpedance amplifier 5 to the signal input pad 104 and the length of the PCB trace between the signal input pad 104 and the digital signal processor 3. It is understood that because the drive current of the vertical-cavity surface-emitting lasers 2 completes switching within picoseconds, the current change rate is extremely high, making it extremely sensitive to parasitic inductance in the circuit. To suppress the influence of parasitic inductance on the driving waveform, the overall connection length between the vertical cavity surface-emitting laser 2 and the digital signal processor 3 should be shortened as much as possible to reduce the loop inductance and ensure the performance of high-frequency electrical signals.

[0089] Furthermore, as an optional embodiment of the present invention, the projections of the plurality of vertical-cavity surface-emitting lasers 2 and photodetectors 4 in the second direction fall within the outline range of the digital signal processor 3 in the second direction. This projection relationship arrangement ensures that the vertical-cavity surface-emitting lasers 2 and photodetectors 4 are arranged adjacent to the same side of the digital signal processor 3 along the first direction, thereby limiting the width of the optical engine assembly, which is beneficial for miniaturization of the optical engine assembly, and spatially ensuring that the connection distance between the vertical-cavity surface-emitting lasers 2 and the digital signal processor 3 is minimized, effectively reducing parasitic inductance and improving high-frequency modulation performance. For the transimpedance amplifier 5, depending on the size of the transimpedance amplifier 5, its projection in the second direction can exceed the outline range of the digital signal processor 3.

[0090] Furthermore, such as Figure 6 As shown, in an optional embodiment of the present invention, the PCB board 1 is further provided with a first recess 101 and a second recess 102, and multiple vertical-cavity surface-emitting lasers 2 are disposed in the first recess 101, while multiple photodetectors 4 and transimpedance amplifiers 5 are disposed in the second recess 102. The first recess 101 and the second recess 102 can reduce the height difference between the vertical-cavity surface-emitting lasers 2, photodetectors 4, and transimpedance amplifiers 5 and the signal input pads 104 and signal output pads 105 on the PCB board 1, thereby reducing the length of the connecting gold wires and improving circuit performance.

[0091] Optionally, the first sink 101 and the second sink 102 have the same depth, and the depths of the first sink 101 and the second sink 102 are the average of the heights of the vertical-cavity surface-emitting laser 2 and the transimpedance amplifier 5. The first sink 101 and the second sink 102 are the average of the heights of the vertical-cavity surface-emitting laser 2 and the transimpedance amplifier 5, ensuring that after the vertical-cavity surface-emitting laser 2 and the transimpedance amplifier 5 are placed in the sink, their heights from the lens are consistent, facilitating the processing and production of the lens assembly 7.

[0092] As another optional embodiment, the first sink 101 and the second sink 102 have different depths. The depth of the first sink 101 is consistent with the height of the vertical-cavity surface-emitting laser 2, and the depth of the second sink 102 is consistent with the height of the transimpedance amplifier 5. By ensuring that the depths of the first sink 101 and the second sink 102 are consistent with the heights of the vertical-cavity surface-emitting laser 2 and the transimpedance amplifier 5, respectively, the heights of the vertical-cavity surface-emitting laser 2 and the transimpedance amplifier 5 are flush with the surface of the PCB board 1. This minimizes the distance between the vertical-cavity surface-emitting laser 2 and the signal output pad 105, and also minimizes the distance between the transimpedance amplifier 5 and the signal input pad 104, thereby reducing the gold wire connection length and improving circuit performance.

[0093] Example 4 Figure 8 A lens assembly 7 according to an embodiment of this application is shown. This lens assembly 7 cooperates with the light engine assembly of embodiment 3 to form the light module of an embodiment of this application.

[0094] The optical interface of lens assembly 7 ( Figure 8 The lens assembly 7 (located on the left side) is used to connect optical fibers, thereby outputting optical signals from multiple vertical-cavity surface-emitting lasers 2 and outputting received optical signals to multiple photodetectors 4. The lens assembly 7 includes two reflecting cavities, each containing a reflecting surface, with the two reflecting surfaces positioned differently in a first direction. Specifically, the two reflecting surfaces are positioned directly above the vertical-cavity surface-emitting lasers 2 and the photodetectors 4, respectively.

[0095] Lens assembly 7 includes a collimating lens, a reflecting surface, and a converging lens. The diverging light from the vertical-cavity surface-emitting laser 2 is converted into parallel light by the collimating lens, its propagation direction is changed by the reflecting surface, and finally, the light is output to the fiber end face via the converging lens. The collimating lens, used to receive light, converts the light signal received from the fiber into parallel light, its propagation direction is changed by the reflecting surface, and finally, the light is output to the photodetector 4 via the converging lens. It is understood that both the collimating lens and the converging lens are convex lenses; for ease of description, they will be collectively referred to as convex lenses in the following description.

[0096] The structure of lens assembly 7 is adapted to the structure of the optical engine assembly. Because the vertical-cavity surface-emitting laser 2 and the photodetector 4 of the optical engine assembly are positioned differently in the first direction, the reflective surface of lens assembly 7 for light emission and the reflective surface for light reception are respectively located above the vertical-cavity surface-emitting laser 2 and the photodetector 4 in the third direction. Therefore, the positions of the reflective surface of lens assembly 7 for light emission and the reflective surface for light reception in the first direction are also different (due to…). Figure 8 The two rectangular frames of the middle lens assembly 7 are shown.

[0097] Figure 8 The digital signal processor 3 and capacitor 6 were also shown to illustrate the relative positions of the lens assembly 7 and the light engine assembly.

[0098] Figures 9-13 The detailed structure of the lens assembly is shown.

[0099] like Figures 9-13 As shown, the lens assembly 7 includes a lens body 721. The lens body 721 has a receiving groove on the side facing the PCB board 1, which is used to house the optoelectronic unit. The optoelectronic unit includes a vertical-cavity surface-emitting laser 2, a photodetector 4, and a transimpedance amplifier 5. The receiving groove is a recessed groove with three circumferential surfaces along a third direction. The opening 720 is located on the side opposite to the ferrule insertion slot 717, along the second and third directions. The receiving groove includes a first surface 701, a second surface 702, and a third surface 703 spaced apart along the third direction. The first surface 701 has multiple first convex lenses 714, the second surface 702 has multiple second convex lenses 715, and the lens assembly 7 also includes multiple third convex lenses 716. The multiple first convex lenses 714 and the multiple second convex lenses 715 are disposed on the receiving groove; the multiple third convex lenses 716 are disposed within the ferrule insertion slot 717. The focal point of the first convex lens 714 is located at the light-emitting window of the vertical-cavity surface-emitting laser 2. The beam waist of the vertical-cavity surface-emitting laser 2 is placed at the front focal point of the first convex lens 714. The first convex lens 714 is used to convert the light received from the vertical-cavity surface-emitting laser 2 into collimated light and output it to the third convex lens 716. The photodetector 4 is located at the focal point of the second convex lens 715. The optical path of the photodetector 4 is that the third convex lens 716 converts the light received from the MT ferrule 8 fiber output into collimated light, and then the collimated light is focused onto the photosensitive surface of the photodetector 4 via the second convex lens 715. The number of third convex lenses 716 is equal to the sum of the number of first convex lenses 714 and the number of second convex lenses 715. In this invention, the third direction is the thickness direction of the PCB board 1, which is the direction from the PCB board 1 towards the lens assembly 7.

[0100] like Figure 13As shown, the lens assembly 7, which is mounted on the optical engine assembly, has openings 720 along the second direction and the third negative direction. If the lens body 721 adopts a closed structure lens assembly, the lens assembly has a vertical wall along the first direction and the third direction on the side near the digital signal processor 3. Considering the positions of the components of the optical engine assembly, the position of this vertical wall has three possibilities: 1. It is located between the vertical cavity surface-emitting laser 2 and the capacitor, that is, the capacitor and the digital signal processor 3 are located outside the lens assembly; 2. It is located between the capacitor and the digital signal processor 3, that is, only the digital signal processor 3 is located outside the lens assembly; 3. It is located outside the side wall on the side of the digital signal processor 3 away from the vertical cavity surface-emitting laser 2, that is, the digital signal processor 3 is located inside the lens assembly. For cases 1 and 2, the injection molding process used for the lens assembly determines that the thickness of the vertical wall is at least 0.5 mm. During the coupling process of the lens assembly, the minimum movement range of the lens assembly needs to be about ±0.2 mm. Therefore, the horizontal distance between the vertical cavity surface-emitting laser 2 and the capacitor or the horizontal distance between the capacitor and the digital signal processor 3 needs to be more than 1 mm to provide space for the lens wall. However, the spacing between the components of the optical engine assembly is much less than 1mm, resulting in insufficient space. In scenario 3, the digital signal processor 3 generates a significant amount of heat during optical module operation. A heatsink needs to be mounted on the surface of the digital signal processor 3, and this heatsink conducts heat from the digital signal processor 3 to the optical module housing through contact with the housing. Since the digital signal processor 3 is located inside the lens assembly, the heat it generates during operation is difficult to dissipate effectively, easily leading to an increase in its temperature, which in turn affects its performance stability and lifespan. In summary, considering the coupling of the lens assembly and the structural design of the optical engine assembly, the lens assembly adopts an open design. This open design ensures precise coupling of the optical path and provides a channel for heat dissipation from the digital signal processor 3, improving the overall reliability and lifespan of the optical module.

[0101] Furthermore, the positional relationship between the first convex lens 714 and the second convex lens 715 matches the positional relationship between the vertical-cavity surface-emitting laser 2 and the photodetector 4 in the first direction, respectively. The first convex lens 714 is located directly above the vertical-cavity surface-emitting laser 2 along the third direction, and the second convex lens 715 is located directly above the photodetector 4 along the third direction. Specifically, the distance between the positions of the first convex lens 714 and the second convex lens 715 in the first direction is 1.7~2.1mm.

[0102] In one embodiment, multiple third convex lenses 716 are positioned identically in a first direction.

[0103] In an improved implementation, such as Figure 11As shown, the ferrule slot 717 is provided with a fourth surface 718 and a fifth surface 719 spaced apart along the first direction. The third convex lens 716 is divided into two parts, one part located on the fourth surface 718 and the other part located on the fifth surface 719. The part located on the fourth surface 718 is the fourth convex lens 722, and the part located on the fifth surface 719 is the fifth convex lens 723. The fourth convex lens 722 is used to receive the optical signal output from the first convex lens 714, and the fifth convex lens 723 is used to output the received optical signal to the second convex lens 715. The fourth surface 718 is closer to the digital signal processor than the fifth surface 719, which can reduce the optical path of the optical signal emitted by the vertical cavity surface-emitting laser 2 in the lens assembly 7, thereby improving the coupling efficiency and increasing the energy ratio of the annular flux at 19μm.

[0104] In one embodiment, the radii of curvature of a plurality of fourth convex lenses 722 and a plurality of fifth convex lenses 723 are the same.

[0105] In an improved embodiment, the fiber end faces of the MT ferrule are aligned on a line, and the radius of curvature of the fourth convex lens 722 is larger than that of the fifth convex lens 723. By using a convex lens with a larger radius of curvature, the optical signal from the vertical-cavity surface-emitting laser 2 can be better coupled into the fiber. The fiber end face is located behind the focal point of the fourth convex lens 722, and the spacing between adjacent fourth convex lenses 722 and the fiber core within the MT ferrule is consistent, meaning the center-to-center spacing between adjacent fourth convex lenses 722 is 0.25 mm. For optical engine assemblies with multiple vertical-cavity surface-emitting lasers 2, insufficient isolation between adjacent optical channels leads to increased crosstalk, resulting in an increased bit error rate and affecting signal transmission. Specifically, as shown below... Figure 7 As shown, the light from VCSEL1 illuminates the optical fiber coupled to VCSEL2, resulting in an increase in the signal-to-noise ratio of the optical signal from VCSEL2. By increasing the radius of curvature of the convex lens coupled to the vertical-cavity surface-emitting laser 2, the beam divergence angle can be reduced, thereby suppressing beam spread and effectively improving inter-channel crosstalk.

[0106] Furthermore, the third surface 703 is spaced apart from the first surface 701 and the second surface 702 along a third direction, and the third surface 703 is located above the first surface 701 and the second surface 702 along the third direction. The portion of the third surface 703 located on the side of the second surface 702 away from the ferrule insertion slot 717 along the first direction is used to accommodate the transimpedance amplifier 5.

[0107] Furthermore, the surface of the first surface 701 that is connected to the third surface 703 and is furthest from the ferrule slot 717 is the sixth surface 704, which is used to block adhesive. The third surface 703 is spaced apart from the bottom surface 705 of the lens assembly 7 along the third direction, with a spacing of 0.4-0.6 mm between them. The distance between the side 706 of the first surface 701 furthest from the ferrule slot 717 in the first direction and the vertical surface 707 of the lens assembly 7 furthest from the ferrule slot 717 is 11.5 mm. During the optical module packaging process, a heat dissipation pad needs to be attached to the surface of the digital signal processor 3. To prevent debris or oil stains generated by the heat dissipation pad on the surface of the digital signal processor 3 from contaminating the optical components inside the lens assembly 7, adhesive is used to seal the opening of the lens assembly 7. During the dispensing process, the fluidity of the adhesive is used to fill the space between the digital signal processor 3 and the lens assembly 7, and a sealed connection is formed after curing. To prevent the adhesive from flowing into the optical window area of ​​the vertical cavity surface-emitting laser 2 and causing contamination, the dispensing process controls the distance between the side 706 and the vertical surface 707 and the blocking method of the sixth surface 704, so that the adhesive, after curing, only covers the predetermined area and does not touch the optical window of the vertical cavity surface-emitting laser 2, ensuring the sealing effect while ensuring the cleanliness of the optical components.

[0108] It should be noted that the distance between the capacitor of the light engine component and the transimpedance amplifier 5 is relatively small, resulting in a scenario where the capacitor is located within the lens assembly 7. In other words, the projection of the lens assembly 7 along the third direction onto the PCB board 1 overlaps with the capacitor. Therefore, the distance between the third surface 703 and the bottom surface 705 is 0.4-0.6 mm to avoid obstructing the capacitor. At this time, the distance between the capacitor and the side of the lens assembly 7 is greater than 0.5 mm to prevent interference between the lens assembly 7 and the capacitor during lens coupling movement. It is understandable that the length of the side edge 706 along the second direction is greater than the width of the multiple first convex lenses 714.

[0109] In one embodiment, the distance between the first surface 701 and the third surface 703 along the third direction is 0.2 mm. By controlling the height of the sixth surface 704, the adhesive is cured so that it does not touch the optical window of the vertical cavity surface-emitting laser 2.

[0110] In another embodiment, the vertical surface 707 is approximately 0.6 mm away from the digital signal processor 3. Considering optical coupling and dispensing processes, this spacing is set so that the lens assembly 7's mounting position on the PCB board 1 needs to be determined through optical coupling, with a minimum movement range of approximately ±0.2 mm during coupling. To prevent the lens assembly 7 from colliding with the digital signal processor 3 and damaging the optical engine assembly during coupling, the spacing should be as large as possible; however, the opening 720 of the lens assembly 7 needs to be sealed subsequently using dispensing, and a smaller spacing makes sealing easier. Taking into account both the requirements of optical coupling and dispensing processes, this embodiment sets the spacing between the lens assembly 7 and the digital signal processor 3 to 0.6 mm, ensuring both coupling safety and sealing reliability.

[0111] In one embodiment, the first surface 701 is disposed above the second surface 702 along a third direction. The depths of the first recess 101 and the second recess 102 are different, and the depth of the first recess 101 is consistent with the height of the vertical cavity surface-emitting laser 2, while the depth of the second recess 102 is consistent with the height of the transimpedance amplifier 5. This ensures that the heights of the vertical cavity surface-emitting laser 2 and the transimpedance amplifier 5 are flush with the surface of the PCB board 1, thereby minimizing the distance between the vertical cavity surface-emitting laser 2 and the signal output pad 105, as well as the distance between the transimpedance amplifier 5 and the signal input pad 104. This reduces the length of the gold wire connection and improves circuit performance.

[0112] In another embodiment, the first surface 701 and the second surface 702 are set at the same height along the third direction. In this case, the photosensitive surfaces of the vertical cavity surface-emitting laser 2 and the photodetector 4 are at the same distance from the bottom surface 705 of the lens assembly 7 along the third direction.

[0113] Furthermore, the lens body 721 has a first reflecting cavity 708 and a second reflecting cavity 709 on the side opposite to the receiving groove. The first reflecting cavity 708 and the second reflecting cavity 709 are aligned with the insert insertion groove 717 along the first direction, and the distance between the first reflecting cavity 708 and the insert insertion groove 717 along the first direction is smaller than the distance between the second reflecting cavity 709 and the insert insertion groove 717 along the first direction. The reflecting surface on the first reflecting cavity 708 is located above the second convex lens 715 along the third direction, and is used to change the transmission direction of the light signal and output the received light signal to the second convex lens 715; the reflecting surface of the second reflecting cavity 709 is located above the first convex lens 714 along the third direction, and is used to change the transmission direction of the light signal of the insert by the collimated light signal output by the first convex lens 714.

[0114] Furthermore, the second surface 702 is recessed with a first clearance groove 711, which is used to avoid the gold wire connected to the transimpedance amplifier. A second clearance groove 710 is recessed on the side wall near the ferrule insertion slot 717, and the length of the second clearance groove 710 along the second direction is greater than the length of the first clearance groove 711 along the second direction. The top surface of the first clearance groove 711 is the seventh surface 712, and the top surface of the second clearance groove 710 is the eighth surface 713. The seventh surface 712 is located above the eighth surface 713 along the third direction. Figure 12 As shown, the width and depth of the corresponding two clearance slots 711 and 710 are matched with the gold wire. Specifically, the first clearance slot 711 and the second clearance slot 710 are used to avoid the gold wire connecting the transimpedance amplifier 5 and the pad of the PCB board 1. The gold wire near the transimpedance amplifier 5 is narrow and high, and the corresponding first clearance slot 711 is set to be high and narrow. The gold wire near the pad is wide and low, and the corresponding second clearance slot 710 is set to be wide and low. Optionally, the second clearance slot 710 may not be sealed, but to avoid dust and other contaminants, its height should be reduced as much as possible without pressing on the gold wire.

[0115] Example 5 Figure 14-16 An optical module according to an embodiment of this application is shown.

[0116] The optical module of Embodiment 5 includes the optical engine assembly of Embodiment 3 and the lens assembly of Embodiment 4. The optical module of Embodiment 5 also includes a housing 10 and an MT jumper 8. The housing 10 has an optical port of the optical module; the MT jumper 8 is disposed inside the housing 10 and is configured such that one end is fixed in the optical interface of the lens assembly 7, and the other end is disposed in the optical port of the optical module.

[0117] As another optional embodiment of the present invention, such as Figure 14 The optical module of the present invention also includes a housing 10 and an optical fiber patch cord 9. One end of the optical fiber patch cord 9 extends out of the housing 10, and the other end is inserted into and fixed in the optical interface of the lens assembly 7.

[0118] Optionally, the PCB board 1 in this invention includes gold fingers 103, which are connected to the digital signal processor 3 and are located at the end of the digital signal processor 3 facing away from the vertical cavity surface-emitting laser 2. The gold fingers 103 are a conventional component for electrically connecting the optical engine assembly to external devices, and will not be described in detail here.

[0119] As an optional embodiment of the present invention, such as Figure 14As shown, this invention is an 800G optical module packaged in an OSFP (Octal Small Form-factor Pluggable) package. Two optical engine assemblies are arranged along the width of the PCB board 1, each containing four high-speed channels. Specifically, each optical engine assembly includes: four vertical-cavity surface-emitting lasers (VCSELs), four photodetectors, a four-channel transimpedance amplifier, eight capacitors, a digital signal processor, and a lens assembly 7 covering the VCSELs, photodetectors, and transimpedance amplifier. The side of the lens assembly 7 furthest from the digital signal processor is connected to an MT jumper 8. The MT jumper 8 is an 8-core MT jumper, with 12-channel MT ferrules connected to both ends. The other end of the MT jumper 8 is installed in an MPO jumper interface 11. The eight optical fibers within the MT jumper 8 are symmetrically distributed on both sides of the adapter, corresponding one-to-one with the VCSELs and photodetectors, for transmitting and receiving optical signals. Furthermore, the two optical engine assemblies are arranged in a staggered pattern along the length of the PCB board 1. With the above structural layout, higher channel density and integration are achieved while meeting the OSFP package size limitations, making it suitable for high-speed optical transmission applications with speeds of 800G and above.

[0120] As an optional embodiment of the present invention, the optical engine assembly with the vertical-cavity surface-emitting laser 2 and photodetector 4 mounted is powered on. The initial position of the lens assembly 7 is determined by monitoring the magnitude of the photocurrent generated by the photodetector 4. The position of the lens assembly 7 is adjusted by further monitoring the magnitude of the optical power of the vertical-cavity surface-emitting laser 2, and the target position of the lens assembly 7 is selected when both the photocurrent of the photodetector 4 and the optical power of the vertical-cavity surface-emitting laser 2 meet the standard. Adhesive is applied to the lower surface of the lens assembly 7 to fix the lens assembly 7 to the PCB board. Adhesive is then applied to the gap between the lens assembly 7 and the digital signal processor 3 until the adhesive connects the digital signal processor 3 and the lens assembly 7, and the adhesive does not exceed the upper surface of the lens assembly 7. This is used to seal the opening 720 of the lens assembly 7 to prevent debris or oil stains from the heat sink on the digital signal processor 3 from contaminating the optical path inside the lens assembly 7. When assembling the optical module housing, a heat sink needs to be attached to the upper surface of the digital signal processor 3. The gasket is prone to generating debris and oil stains. Some of the oil stains contain volatile, condensable substances. The high temperatures generated during the operation of the digital signal processor 3 can easily cause these substances to volatilize. These volatile substances, after escaping into the inner cavity of the lens assembly, can easily condense on the laser surface, thus contaminating the optical path. Therefore, it is necessary to isolate the inner cavity of the lens assembly from the adjacent heat dissipation gasket of the digital signal processor 3. It should be noted that the uncured adhesive has low flowability, ensuring a stable coating state and preventing contamination of the internal optical path of the lens assembly. The adhesive used here is allowed to cure at room temperature, and the cured adhesive is soft, avoiding stress on the lens assembly 7 and the digital signal processor 3. The MT jumper 8 is assembled and fixed to the lens assembly 7 with adhesive to form a PCBA. Finally, the PCBA is assembled into the housing to complete the optical module assembly.

[0121] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A light engine component, characterized in that, include: A digital signal processor, a transimpedance amplifier, multiple vertical cavity surface-emitting lasers, and multiple photodetectors are mounted on a PCB board. The digital signal processor integrates a laser driver. The PCB board has a first direction and a second direction in the plane, wherein the first direction is perpendicular to the second direction; The plurality of vertical cavity surface-emitting lasers are adjacent to each other and arranged in a straight line along the second direction, and each vertical cavity surface-emitting laser is in the same position in the first direction; The plurality of photodetectors are adjacent to each other and arranged in a straight line along the second direction, and each photodetector is in the same position in the first direction; The distance between the plurality of vertical cavity surface-emitting lasers and the digital signal processor in the first direction is smaller than the distance between the plurality of photodetectors and the digital signal processor in the first direction; The transimpedance amplifier is positioned in the first direction between the plurality of photodetectors and the digital signal processor; The plurality of vertical cavity surface-emitting lasers are electrically connected to the digital signal processor; The plurality of photodetectors are electrically connected to the transimpedance amplifier, and the transimpedance amplifier is electrically connected to the digital signal processor; The distance between the positions of the plurality of vertical cavity surface-emitting lasers in the first direction and the positions of the plurality of photodetectors in the first direction is 1.7~2.1mm; The plurality of vertical cavity surface-emitting lasers, the plurality of photodetectors, and the transimpedance amplifier are encapsulated together in a lens assembly. The plurality of vertical cavity surface-emitting lasers and the plurality of photodetectors are coupled to the same MT ferrule through the optical interface of the lens assembly.

2. The light engine component according to claim 1, characterized in that, Also includes: Multiple capacitors, which are adjacent to each other and arranged in a straight line along a second direction, and each capacitor is in the same position in a first direction; The transimpedance amplifier is positioned in the first direction between the plurality of photodetectors and the plurality of capacitors; The plurality of capacitors are positioned in a first direction between the transimpedance amplifier and the digital signal processor; The transimpedance amplifier is electrically connected to the digital signal processor through the plurality of capacitors.

3. The light engine component according to claim 1, characterized in that, The digital signal processor is electrically connected to and fixed on the PCB board via a flip-chip connection.

4. The light engine component according to claim 2, characterized in that, The distance between the transimpedance amplifier and the plurality of capacitors along the first direction is 0.8~1mm; The distance between the plurality of capacitors and the digital signal processor along the first direction is 0.25~0.3mm.

5. The light engine component according to claim 3, characterized in that, It also includes multiple signal input pads and multiple signal output pads disposed on the PCB board, wherein the multiple vertical cavity surface-emitting lasers are wire bonded to the multiple signal output pads, and the transimpedance amplifier is wire bonded to the multiple signal input pads.

6. The light engine component according to claim 5, characterized in that, The plurality of signal input pads are arranged in a straight line along the second direction, and each signal input pad is in the same position in the first direction; the plurality of signal output pads are arranged in a straight line along the second direction, and each signal output pad is in the same position in the first direction; the distance between the plurality of signal output pads and the digital signal processor in the first direction is less than the distance between the plurality of signal input pads and the digital signal processor in the first direction.

7. The light engine component according to claim 1, characterized in that, The projections of the plurality of vertical cavity surface-emitting lasers and the photodetector in the second direction fall within the contour range of the digital signal processor in the second direction.

8. The light engine component according to claim 1, characterized in that, The PCB board has a first slot and a second slot. The plurality of vertical cavity surface-emitting lasers are disposed in the first slot, and the plurality of photodetectors and the transimpedance amplifier are disposed in the second slot.

9. An optical module, characterized in that, Includes at least one light engine component as described in any one of claims 1 to 8; And a lens assembly, the optical interface of which is used to output optical signals from multiple vertical cavity surface-emitting lasers and to output received optical signals to multiple photodetectors.

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