Substrate pairing method, substrate pairing device, electronic device, and storage medium

Abstract

This application discloses a substrate pairing method, substrate pairing apparatus, electronic device, and storage medium. The method includes: for each color filter (CF) batch in a first group, determining a thin-film transistor (TFT) batch in a second group that can be paired with that CF batch, and the corresponding pairing scheme; the first group includes multiple CF batches; the second group includes multiple TFT batches; determining an optimal CF batch based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type; the optimal CF batch is the CF batch with the lowest operational complexity in the first group; performing a pairing operation on the substrates of the optimal CF batch and the substrates of the optimal TFT batch; the optimal TFT batch is one or more TFT batches corresponding to the optimal CF batch. The method of this application can quickly and accurately find a better pairing scheme, significantly improving pairing operation efficiency, reducing pairing time, and lowering production costs.

Description

Technical Field

[0001] This application relates to the field of display device manufacturing technology, specifically to a substrate pairing method, substrate pairing device, electronic device, and storage medium. Background Technology

[0002] Due to the manufacturing requirements of LCD panels, the CELL factory (cell assembly plant) selects TFT substrates produced by the designated array engineering ARRAY plant for bonding with specific CF substrates produced by the color filter CF plant. The bonding equipment at the CELL plant requires a batch of TFT substrates and a batch of CF substrates to be processed simultaneously, ultimately producing a lot containing a set of bonded glass. In the current production process, relying on manual experience to select and pair the corresponding TFT and CF substrates results in random pairing schemes, making it difficult to find optimal ones. This leads to low pairing efficiency and long pairing times.

[0003] The above statements are for the purpose of providing background information in relation to this application only and do not necessarily constitute prior art. Summary of the Invention

[0004] The purpose of this application is to provide a substrate mating method, substrate mating apparatus, electronic device, and storage medium. To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general description, nor is it intended to identify key / important components or describe the scope of protection of these embodiments. Its sole purpose is to present some concepts in a simple form as a prelude to the detailed description that follows.

[0005] According to one aspect of the embodiments of this application, a substrate mating method is provided, comprising: For each color filter (CF) batch in the first group, determine the thin-film transistor (TFT) batch in the second group that can be paired with the CF batch and the corresponding pairing scheme; the first group includes multiple CF batches; the second group includes multiple TFT batches; the pairing scheme includes batch combination, substrate matching quantity and execution process; The optimal CF batch is determined based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type; the optimal CF batch is the CF batch with the lowest operational complexity in the first group. A pairing operation is performed on the substrates in the optimal CF batch and the substrates in the optimal TFT batch; the optimal TFT batch is one or more TFT batches corresponding to the optimal CF batch.

[0006] In some embodiments of this application, determining, for each color filter (CF) batch in the first group, the thin-film transistor (TFT) batch in the second group that can be substrate-matched with that CF batch and the corresponding matching scheme includes: The substrates in the first CF batch are paired with the substrates in each of the TFT batches in the second group to obtain the first TFT batch; the first TFT batch is the TFT batch in the second group with the largest number of substrates paired with the first CF batch; the first CF batch is any CF batch in the first group; In the second group, among the TFT batches other than the first TFT batch, a TFT substrate that can be paired with the unpaired substrate in the first CF batch is searched. The substrate pairing rules are the same as the first round of judgment criteria. The search is repeated until all substrates in the first CF batch are successfully paired, or no TFT substrate that can be paired with the unpaired substrate in the first CF batch is found. The pairing scheme corresponding to the first CF batch is then determined.

[0007] In some embodiments of this application, determining the optimal CF batch based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type includes: For each CF batch, the pairing scheme type corresponding to the pairing scheme is determined according to the preset pairing scheme type. Based on the pairing scheme type corresponding to each CF batch and the priority of each pairing scheme type, the CF batch with the highest priority is determined as the optimal CF batch.

[0008] In some embodiments of this application, the pairing operation between the substrates in the optimal CF batch and the substrates in the optimal TFT batch includes: According to the pairing scheme type corresponding to the pairing scheme of the optimal CF batch, the substrates in the optimal CF batch and the substrates in the optimal TFT batch are paired according to the corresponding pairing operation scheme.

[0009] In some embodiments of this application, the preset pairing scheme types include: Type 1: All substrates in the first CF batch can be paired one-to-one with all substrates in the first TFT batch; Second type: The number of substrates in the first CF batch is less than the number of substrates in the first TFT batch, and all substrates in the first CF batch have a corresponding matching substrate in the first TFT batch. The third type: the first CF batch corresponds to and is matched with the first number of TFT batches. Each substrate in the first CF batch corresponds to a matching substrate in the first number of TFT batches. 2 ≤ the first number ≤ the number of placement ports of the sorting machine equipment - 1; one placement port is used to place one CF batch or one TFT batch. Fourth type: The first CF batch is matched with the second number of TFT batches. Each substrate in the first CF batch has a matching substrate in the second number of TFT batches. The number of placement ports of the sorting machine equipment - 1 < the second number ≤ the number of placement ports of the sorting machine equipment × 2 - 2. Fifth type: The first CF batch is matched with a TFT batch. There are substrates in the first CF batch that cannot be matched, and all substrates in the TFT batch can be matched. Type 6: The first CF batch is matched with a TFT batch, there are substrates in the first CF batch that cannot be matched, and there are substrates in the TFT batch that are matched with the first CF batch that cannot be matched. Type 7: The first CF batch corresponds to and is matched with the third number of TFT batches. There are substrates in the first CF batch that cannot be matched, and there are substrates in the third number of TFT batches that cannot be matched, and 1 < the third number ≤ the number of placement ports of the sorting machine equipment - 3. Type 8: The first CF batch corresponds to and matches the fourth number of TFT batches. There are substrates in the first CF batch that cannot be matched and the fourth number is ≥2, or the fourth number is greater than the number of placement ports of the sorting machine equipment ×2-2.

[0010] In some embodiments of this application, the priority order of the preset pairing scheme types is as follows: from high to low priority, the first type, the second type, the third type, the fourth type, the fifth type, the sixth type, the seventh type, and the eighth type.

[0011] In some embodiments of this application, the method further includes: removing a second CF batch from the first group, wherein the second CF batch is a CF batch containing a number of mating substrates less than a preset threshold.

[0012] According to another aspect of the embodiments of this application, a substrate mating device is provided, comprising: The first determining module is used to determine, for each color filter (CF) batch in the first group, a thin-film transistor (TFT) batch in the second group that can be paired with the substrate of the CF batch and the corresponding pairing scheme; the first group includes multiple CF batches; the second group includes multiple TFT batches; the pairing scheme includes batch combination, substrate matching quantity and execution process. The second determining module is used to determine the optimal CF batch based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type; the optimal CF batch is the CF batch with the lowest operational complexity in the first group. A pairing module is used to perform a pairing operation between the substrates in the optimal CF batch and the substrates in the optimal TFT batch; the optimal TFT batch is one or more TFT batches corresponding to the optimal CF batch.

[0013] According to another aspect of the embodiments of this application, an electronic device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the substrate pairing method described in any embodiment of this application.

[0014] According to another aspect of the embodiments of this application, a computer-readable storage medium is provided having a computer program stored thereon, the computer program being executed by a processor to implement the substrate pairing method described in any embodiment of this application.

[0015] One aspect of the technical solution provided in this application embodiment may include the following beneficial effects: The substrate pairing method provided in this application provides a method for determining, for each color filter (CF) batch in the first group, a thin-film transistor (TFT) batch in the second group that can be paired with the CF batch and the corresponding pairing scheme. Based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type, an optimal CF batch is determined. Pairing operations are performed on the substrates in the optimal CF batch and the substrates in the optimal TFT batch. The optimal CF batch is the CF batch with the lowest operational complexity in the first group. This method can quickly and accurately find a better pairing scheme, which can significantly improve the efficiency of pairing operations, reduce pairing time, and lower production costs.

[0016] The above description is merely an overview of the technical solutions of the embodiments of this application. In order to better understand the technical means of the embodiments of this application and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of this application more obvious and understandable, specific implementation methods of this application are described below. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A flowchart of a substrate pairing method according to an embodiment of this application is shown.

[0019] Figure 2 A flowchart of step S10 in one embodiment of this application is shown.

[0020] Figure 3 A schematic diagram of an interface of a manufacturing execution system according to one embodiment of this application is shown.

[0021] Figure 4 A flowchart of step S20 in one embodiment of this application is shown.

[0022] Figure 5 A schematic diagram of a first type of pairing scheme is shown in one embodiment of this application.

[0023] Figure 6 A schematic diagram of a second type of pairing scheme in one embodiment of this application is shown.

[0024] Figure 7 This illustration shows a schematic diagram of the status of each placement port after the completion of Task 1 and Task 2 in one embodiment of this application.

[0025] Figure 8 This illustration shows the state of each placement port after completing tasks three and four, according to another embodiment of this application.

[0026] Figure 9 This illustration shows the state of each placement port after tasks five and six are completed, according to another embodiment of this application.

[0027] Figure 10 A block diagram of a substrate mating device according to an embodiment of this application is shown.

[0028] Figure 11 A block diagram of an electronic device structure according to an embodiment of this application is shown.

[0029] Figure 12 A schematic diagram of a computer-readable storage medium according to an embodiment of this application is shown. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0031] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have a meaning consistent with their meaning in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0032] The meanings of the English abbreviations in this article are explained below: CIM: Computer Integrated Manufacturing, a system that integrates multiple subsystems to achieve manufacturing informatization and automation.

[0033] MES: Manufacturing Execution System, whose function is to control the production process.

[0034] TFT: Thin Film Transistor, is a semiconductor device whose structure includes several film layers fabricated on a substrate, including an active layer, gate electrode, source / drain electrode, gate insulating layer, etc.

[0035] ARRAY: Array engineering, a factory that produces TFT substrates.

[0036] CF: Color filter, is a type of optical filter that expresses color. It can precisely select a small range of light waves that are desired to pass through while reflecting other unwanted wavelengths.

[0037] CELL: The cell assembly plant, where the TFT substrate and CF substrate are bonded together.

[0038] Sorter: A sorting machine whose main function is to classify and place different types of glass substrates into different carriers.

[0039] Lot: A batch, the amount of glass loaded in a vehicle is called a Lot.

[0040] TP: Total Pitch tolerance refers to the difference between the actual position of the image and the set position, which affects the color filter alignment effect.

[0041] The following description, in conjunction with the accompanying drawings, describes a substrate pairing method, substrate pairing device, electronic device, and storage medium according to embodiments of this application.

[0042] refer to Figure 1 As shown, one embodiment of this application provides a substrate pairing method, which may include steps S10-S30.

[0043] S10. For each color filter CF batch in the first group, determine the thin film transistor TFT batch in the second group that can be matched with the substrate of the CF batch and the corresponding matching scheme.

[0044] The first group includes multiple CF batches; the second group includes multiple TFT batches; the pairing scheme includes batch combination, substrate matching quantity and execution process.

[0045] Specifically, the first group (color filter CF batch Lot) and the second group (thin film transistor TFT batch Lot) can be automatically selected and specified by the computer integrated manufacturing (CIM) system, and the CIM system can automatically issue instructions to the handling equipment to place the TFT Lot and CF Lot in the corresponding two carriers.

[0046] In some implementations, reference Figure 2 As shown, for each color filter (CF) batch in the first group, determining the thin-film transistor (TFT) batch in the second group that can be paired with the CF batch as a substrate and the corresponding pairing scheme may include steps S101-S102: S101. The substrates in the first CF batch are paired with the substrates in each TFT batch in the second group to obtain the first TFT batch.

[0047] Among them, the first TFT batch is the TFT batch in the second group that has the largest number of substrates paired with the first CF batch; the first CF batch is any CF batch in the first group.

[0048] For example, a pairing attempt can be performed using a MES (Mechanical Equipment System). The MES selects the glass substrates to be paired by searching for compatible TFT batches within the first CF (Catalyst Filter) batch. Specifically, a CF batch is randomly selected to obtain the first CF batch. Glass substrates from the first CF batch are then used to attempt pairing with glass substrates from each TFT batch in the second group. The TFT batch with the largest number of compatible glass substrates is then identified as the first TFT batch.

[0049] Specifically, after receiving the glass substrates from the TFT and CF batches, the CELL factory performs tolerance (TP) value testing to obtain the X-axis and Y-axis values ​​for each glass substrate. After testing, the glass substrates enter a pairing-ready state. The pairing rules can be preset by the user. For example... Figure 3As shown, one interface on the Manufacturing Execution System (MES) allows users to set pairing rules, such as specifying a particular TFT glass substrate product model to pair with a particular CF glass substrate product model, setting which sorting machine to use, and specifying a preset number of substrates in each batch (lot) that can be paired before pairing can proceed. In response to the user clicking the "Start" button on the interface, the MES backend attempts to pair according to the user-defined rules. Another interface on the MES is used to set whether the product model is paired based on the X-axis TP value or the Y-axis TP value, and to set the standard deviation and error range of the TFT substrate TP value and the CF substrate TP value. For example, if the standard deviation is 1.2 and the error range is 0.2, then the X-axis TP value is used for pairing. If the absolute value of the difference between the X-axis TP value of the TFT substrate and the X-axis TP value of the CF substrate is between 1.2-0.2 and 1.2+0.2, then the two glass substrates are considered to be compatible for pairing.

[0050] S102. In the second group, in the TFT batches other than the first TFT batch, find TFT substrates that can be paired with unpaired substrates in the first CF batch. The substrate pairing rules are the same as the first round of judgment criteria. Search cyclically until all substrates in the first CF batch are successfully paired, or until no TFT substrates that can be paired with unpaired substrates in the first CF batch are found, and determine the pairing scheme corresponding to the first CF batch.

[0051] For example, in the second group, excluding the first TFT batch, a glass substrate that can be paired with a glass substrate that could not be paired in the first CF batch is searched for until all glass substrates in the first CF batch have found a matching glass substrate or the remaining glass substrates in the first CF batch cannot find a matching TFT glass substrate. The pairing scheme corresponding to the first CF batch is recorded, and then the pairing scheme corresponding to each of the remaining CF batches is determined in the same way.

[0052] S20. Determine the optimal CF batch based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type.

[0053] The optimal CF batch is the CF batch with the lowest operational complexity in the first group. The operational complexity of each pairing scheme type is determined through pre-evaluation. Each pairing scheme type is pre-defined, and all pairing schemes that satisfy the same constraint are classified as the same pairing scheme type. The constraint is set according to the actual application requirements.

[0054] In some implementations, reference Figure 4As shown, determining the optimal CF batch based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type can include steps S201-S202: S201. For each CF batch, determine the pairing scheme type corresponding to the pairing scheme of that CF batch according to the preset pairing scheme type.

[0055] Specifically, the pairing scheme corresponding to each CF batch is compared with the preset pairing scheme type. If the pairing scheme corresponding to the CF batch meets the conditions corresponding to a certain pairing scheme type, then the pairing scheme type is determined to be the pairing scheme type corresponding to the pairing scheme corresponding to the CF batch.

[0056] S202. Based on the pairing scheme type corresponding to each CF batch and the priority of each pairing scheme type, determine the CF batch with the highest priority as the optimal CF batch.

[0057] The priority of each pairing scheme type is negatively correlated with its operational complexity. The pairing scheme type corresponding to the highest priority CF batch has the lowest operational complexity. Specifically, according to the preset priority order of pairing scheme types, each CF batch is sorted, and the CF batch corresponding to the highest priority pairing scheme type is identified as the optimal CF batch. In this way, the optimal CF batch with the lowest operational complexity can be determined.

[0058] The higher the priority of a pairing scheme type, the lower its pairing operation complexity. The pairing operation complexity for each pairing scheme type is determined through pre-evaluation. In practical applications, the evaluation results of the pairing operation complexity for each pairing scheme type can be adjusted according to the actual application needs, or the priority of each pairing scheme type can be adjusted according to the actual application needs.

[0059] For example, the preset pairing scheme types may include a first type, a second type, a third type, a fourth type, a fifth type, a sixth type, a seventh type, and an eighth type.

[0060] Type 1: All substrates in the first CF batch can be paired one-to-one with all substrates in the first TFT batch.

[0061] Type 2: The number of substrates in the first CF batch is less than the number of substrates in the first TFT batch, and all substrates in the first CF batch have a corresponding matching substrate in the first TFT batch.

[0062] The third type: the first CF batch corresponds to and is matched with the first number of TFT batches. Each substrate in the first CF batch corresponds to a matching substrate in the first number of TFT batches. 2 ≤ the first number ≤ the number of placement ports of the sorting machine equipment - 1.

[0063] One placement port of the sorting machine is used to place one CF batch or one TFT batch. Specifically, one placement port can only hold one carrier, and one carrier can only hold one CF batch or one TFT batch, so one placement port can only hold one CF batch or one TFT batch.

[0064] Type 4: The first CF batch corresponds to and is matched with the second number of TFT batches. Each substrate in the first CF batch has a matching substrate in the second number of TFT batches. The number of placement ports of the sorting machine equipment - 1 < the second number ≤ the number of placement ports of the sorting machine equipment × 2 - 2.

[0065] Type 5: The first CF batch is matched with a TFT batch. There are substrates in the first CF batch that cannot be matched, while the substrates in the TFT batch can all be matched.

[0066] Type 6: The first CF batch is matched with a TFT batch, there are substrates in the first CF batch that cannot be matched, and there are substrates in the TFT batch that are matched with the first CF batch that cannot be matched.

[0067] Type 7: The first CF batch corresponds to and is matched with the third number of TFT batches. There are substrates in the first CF batch that cannot be matched, and there are substrates in the third number of TFT batches that cannot be matched, and 1 < the third number ≤ the number of placement ports of the sorting machine equipment - 3.

[0068] Type 8: The first CF batch corresponds to and matches the fourth number of TFT batches. There are substrates in the first CF batch that cannot be matched and the fourth number is ≥2, or the fourth number is greater than the number of placement ports of the sorting machine equipment ×2-2.

[0069] For example, the preset priority order of the pairing scheme types can be: first type, second type, third type, fourth type, fifth type, sixth type, seventh type, and eighth type, in descending order of priority.

[0070] S30. Perform a pairing operation on the substrates in the optimal CF batch and the substrates in the optimal TFT batch.

[0071] The optimal TFT batch is one or more TFT batches corresponding to the optimal CF batch. The TFT batch corresponding to the optimal CF batch is the TFT batch that can be substrate-matched with the optimal CF batch.

[0072] For example, performing a pairing operation on the substrates in the optimal CF batch and the substrates in the optimal TFT batch may include: performing a pairing operation on the substrates in the optimal CF batch and the substrates in the optimal TFT batch according to the pairing operation type corresponding to the pairing scheme corresponding to the optimal CF batch.

[0073] For example, if the pairing scheme corresponding to the optimal CF batch is of type one, that is, all glass substrates in the optimal TFT batch are exactly paired with all glass substrates in the optimal CF batch, then it is not necessary to move the optimal CF batch and the optimal TFT batch onto the sorting machine. Instead, a one-to-one pairing operation can be performed directly on all glass substrates in the optimal CF batch and all glass substrates in the optimal TFT batch. (Reference) Figure 5 As shown, Figure 5 A schematic diagram of the first type of pairing scheme is shown.

[0074] For example, if the pairing scheme corresponding to the optimal CF batch is of type two, that is, the number of substrates in the optimal CF batch is less than the number of substrates in the optimal TFT batch, and all substrates in the optimal CF batch have a corresponding matching substrate in the optimal TFT batch, then the control conveying device will transport the optimal TFT batch and a carrier to the Sorter device, and issue a SorterJob instruction to the Sorter device to control the Sorter device to place the unmatched glass substrates in the optimal TFT batch into the carrier, then perform one-to-one pairing of the glass substrates in the optimal CF batch and the glass substrates in the optimal TFT batch, and control the conveying device to remove the remaining glass substrates and carrier from the Sorter device. (Reference) Figure 6 As shown, Figure 6 A schematic diagram of the second type of pairing scheme is shown.

[0075] For example, if the pairing scheme corresponding to the optimal CF batch is of type three, that is, the optimal CF batch corresponds to and matches with the optimal number of TFT batches, and each substrate in the optimal CF batch corresponds to a matching substrate in the optimal number of TFT batches, and 2 ≤ optimal number ≤ number of placement ports of the sorting machine Sorter device - 1, then the control conveyor will transport the optimal TFT batch and a carrier to the Sorter device, and a SorterJob instruction (corresponding to task one) will be issued to the Sorter device to control the Sorter device to place the matching glass substrates in the optimal TFT batch into a new TFT Lot, and perform one-to-one pairing of the glass substrates in the optimal CF batch with the glass substrates in the new TFT Lot. Then, a SorterJob instruction (corresponding to task two) will be issued to the Sorter device to control the Sorter device to organize the remaining glass substrates in the optimal TFT batch, thereby improving the utilization efficiency of the carrier. Finally, an instruction will be issued to the conveyor to remove all batches from the Sorter device. (Reference) Figure 7 As shown, Task 1 is a sorting task to place the specified TFT products and CF products into the corresponding carriers respectively; Task 2 is a sorting task to organize the products in the carriers that are not full after Task 1, so as to improve the carrier utilization rate. Figure 7 The image shows ten vehicle placement ports, labeled P1, P2, ..., P10. Figure 7 The image shows nine vehicles: vehicle 1, vehicle 2, vehicle 3, ..., vehicle 9.

[0076] For example, if the pairing scheme corresponding to the optimal CF batch is of type four, that is, the optimal CF batch is matched with the second number of TFT batches, and each substrate in the optimal CF batch has a matching substrate in the second number of TFT batches, and the number of placement ports of the sorting machine Sorter device - 1 < the second number ≤ the number of placement ports of the sorting machine Sorter device × 2 - 2, then the control conveyor moves one carrier and the first number (the first number = the number of placement ports of the sorting machine Sorter device - 1) of TFT batches to the Sorter device, and then issues two SorterJob instructions to the Sorter device. One of the two SorterJob instructions (corresponding to task one) is used to instruct the matching glass substrates in the TFT batch to be placed in the carrier, and the other SorterJob instruction (corresponding to task two) is used to organize the glass substrates in the TFT batch. Then, a conveying instruction is issued to move the TFT batches other than those in the carrier, and then the control conveyor moves the remaining TFT batches to the Sorter device. (Refer to...) Figure 7As shown; then two SorterJob instructions are issued. One of these SorterJob instructions (corresponding to Task 3) instructs the placement of the remaining TFT batches of matchable glass substrates into the carrier as a new TFT Lot, pairing the glass substrates of the optimal CF batch one-to-one with the glass substrates in the new TFT Lot. The other SorterJob instruction (corresponding to Task 4) instructs the organization of the glass substrates in the TFT Lot, and then a transfer instruction is issued to move all TFT batches away. (Refer to...) Figure 8 As shown, Figure 8 The image shows ten placement ports: P1, P2, ..., P10. Figure 8 The image shows nine vehicles: vehicle 10, vehicle 11, vehicle 12, ..., vehicle 18.

[0077] For example, if the pairing scheme corresponding to the optimal CF batch is the fifth type, that is, the optimal CF batch is matched with a TFT batch, there are substrates in the optimal CF batch that cannot be paired, and the substrates in the TFT batch can all be paired, then the control transport device will transport the optimal CF batch and a carrier to the Sorter device, issue a SorterJob instruction to control the Sorter device to place the unpaired CF glass substrates into the carrier, pair the glass substrates in the optimal CF batch with the glass substrates in the TFT batch one by one, and then remove them all.

[0078] For example, if the pairing scheme corresponding to the optimal CF batch is the sixth type, that is, the optimal CF batch is matched with a TFT batch, there are unpairable substrates in the optimal CF batch, and there are unpairable substrates in the TFT batch that is matched with the optimal CF batch, then the TFT batch, the optimal CF batch and the two carriers are transported to the Sorter device, a SorterJob instruction is issued, the unpaired glass substrates in the TFT Lot are placed in one carrier, the unpaired glass substrates in the optimal CF batch are placed in another carrier, and then the glass substrates in the optimal CF batch are paired one-to-one with the glass substrates in the TFT batch, and then all of them are unloaded.

[0079] For example, if the pairing scheme corresponding to the optimal CF batch is the seventh type, that is, the optimal CF batch is matched with the third number of TFT batches, there are unpairable substrates in the optimal CF batch, there are unpairable substrates in the third number of TFT batches, and 1 < the third number ≤ the number of placement ports of the sorting machine Sorter device - 3, then the optimal CF batch, the third number of TFT batches, and two carriers are transported to the Sorter device, a SorterJob instruction is issued, the unpairable glass substrates in the optimal CF batch are placed in one carrier, the glass substrates that can be paired in the third number of TFT batches are placed in another carrier as a new TFT Lot, and the glass substrates in the optimal CF batch are paired one-to-one with the glass substrates in the new TFT Lot, and another SorterJob instruction is issued to sort the remaining glass substrates in the TFT Lot, and then all batches are unloaded from the device.

[0080] For example, if the pairing scheme corresponding to the optimal CF batch is type 8, that is, the optimal CF batch corresponds to and matches the fourth number of TFT batches, and there are substrates in the optimal CF batch that cannot be paired and the fourth number is ≥ 2, or the fourth number is > the number of placement ports of the sorting machine Sorter equipment × 2 - 2, then first, one carrier and the second number (the second number = the number of Sorter equipment ports - 1) of TFT batches are moved onto the Sorter equipment, and two SorterJob instructions are issued to the Sorter equipment, such as... Figure 7As shown, one SorterJob instruction (corresponding to Task 1) is used to place the glass substrates that can be paired in the TFT batch into the carrier, and another SorterJob instruction (corresponding to Task 2) is used to organize the glass substrates in the TFT batch. Then, a transfer instruction is issued to move the TFT batches other than the TFT batches in the carrier, and then the optimal CF batch, a carrier, and all or the first part of the TFT batches in the remaining TFT batches are moved onto the equipment. The first part of the TFT batches are the TFT batches whose number of glass substrates that can be paired is the third largest number (the third largest number = the number of Sorter equipment ports - 3). Specifically, all the TFT batches in the remaining TFT batches are sorted from the largest to the smallest number of glass substrates that can be paired, and then the TFT batches whose number of glass substrates that can be paired is the third largest number are taken as the first part of the TFT batches. Two more SorterJob instructions are issued. One SorterJob instruction (corresponding to Task 5) is used to place the paired glass substrates from the TFT batch into a carrier as a new TFT Lot, and to place the unpaired glass substrates from the CF batch into another carrier, pairing the glass substrates from the CF batch with the glass substrates from the TFT batch one-to-one. The other SorterJob instruction (corresponding to Task 6) is used to instruct the glass substrates in the TFT batch to be sorted, and then the entire batch is unloaded from the equipment, referencing... Figure 9 As shown, Figure 9 The image shows ten placement ports, P1, P2, ..., P10. The substrate of the CF batch is placed in the carrier at placement port P9.

[0081] For example, a computer integrated manufacturing (CIM) system can automatically select a first group and a second group, and pair each substrate in the optimal TFT batch with each substrate in the optimal CF batch one-to-one, which can greatly improve factory production efficiency.

[0082] In some embodiments, the method may further include: removing a second CF batch from the first group, wherein the second CF batch is a CF batch containing fewer than a preset threshold number of mating substrates.

[0083] Specifically, by determining the TFT batches in the second group that can be paired with the substrate for each CF batch in the first group, the number of glass substrates in each CF batch that can be paired can be obtained. If the number of glass substrates in the CF batch that can be paired is less than a preset threshold, the CF batch is removed.

[0084] The method in this embodiment can be automated, controlling the conveying equipment and the sorter equipment to perform pairing operations on the glass substrates of TFT batches and CF batches. It can quickly and accurately find the optimal pairing scheme, which can greatly improve the efficiency of pairing operations, reduce pairing time, and lower production costs.

[0085] The description of the various embodiments above tends to emphasize the differences between the various embodiments. The similarities or similarities between them can be referred to, and for the sake of brevity, they will not be repeated here.

[0086] refer to Figure 10 As shown, another embodiment of this application provides a substrate mating device, which may include: The first determining module is used to determine, for each color filter (CF) batch in the first group, a thin film transistor (TFT) batch in the second group that can be matched with the substrate of the CF batch and the corresponding matching scheme; the first group includes multiple CF batches; the second group includes multiple TFT batches; the matching scheme includes batch combination, substrate matching quantity and execution process. The second determining module is used to determine the optimal CF batch based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type; the optimal CF batch is the CF batch with the lowest operational complexity in the first group. The pairing module is used to perform pairing operations between the substrates in the optimal CF batch and the substrates in the optimal TFT batch; the optimal TFT batch is one or more TFT batches corresponding to the optimal CF batch.

[0087] For example, the first determining module may include: The acquisition unit is used to perform pairing attempts between the substrates in the first CF batch and the substrates in each TFT batch in the second group to obtain the first TFT batch; the first TFT batch is the TFT batch in the second group with the largest number of substrates paired with the first CF batch; the first CF batch is any CF batch in the first group. The pairing scheme determination unit is used to search for TFT substrates that can be paired with unpaired substrates in the first CF batch in the second group of TFT batches other than the first TFT batch. The substrate pairing rules are the same as the first round of judgment criteria. The search is repeated until all substrates in the first CF batch are successfully paired, or until no TFT substrate can be found that can be paired with unpaired substrates in the first CF batch, and the pairing scheme corresponding to the first CF batch is determined.

[0088] For example, the second determining module may include: The pairing scheme type determination unit is used to determine the pairing scheme type corresponding to the pairing scheme of each CF batch according to the preset pairing scheme type. The optimal CF batch determination unit is used to determine the highest priority CF batch as the optimal CF batch based on the pairing scheme type corresponding to each CF batch and the priority of each pairing scheme type. The priority of each pairing scheme type is negatively correlated with the operation complexity of each pairing scheme type.

[0089] For example, the pairing module is further specifically used to perform pairing operations on the substrates in the optimal CF batch and the substrates in the optimal TFT batch according to the pairing scheme type corresponding to the pairing scheme corresponding to the optimal CF batch.

[0090] For example, the preset pairing scheme type may include: Type 1: All substrates in the first CF batch can be paired one-to-one with all substrates in the first TFT batch; Type 2: The number of substrates in the first CF batch is less than the number of substrates in the first TFT batch, and all substrates in the first CF batch have a corresponding matching substrate in the first TFT batch. The third type: the first CF batch corresponds to and is matched with the first number of TFT batches. Each substrate in the first CF batch corresponds to a matching substrate in the first number of TFT batches. 2≤the first number≤the number of placement ports of the sorting machine equipment-1. Type 4: The first CF batch corresponds to and is matched with the second number of TFT batches. Each substrate in the first CF batch has a corresponding matching substrate in the second number of TFT batches. The number of placement ports of the sorting machine equipment - 1 < the second number ≤ the number of placement ports of the sorting machine equipment × 2 - 2. Fifth type: The first CF batch corresponds to a TFT batch. There are substrates in the first CF batch that cannot be paired, while the substrates in the TFT batch can all be paired. Type 6: The first CF batch is matched with a TFT batch, there are substrates in the first CF batch that cannot be matched, and there are substrates in the TFT batch that are matched with the first CF batch that cannot be matched. Type 7: The first CF batch corresponds to and is matched with the third number of TFT batches. There are substrates in the first CF batch that cannot be matched, and there are substrates in the third number of TFT batches that cannot be matched, and 1 < the third number ≤ the number of placement ports of the sorting machine equipment - 3. Type 8: The first CF batch corresponds to and matches the fourth number of TFT batches. There are substrates in the first CF batch that cannot be matched and the fourth number is ≥2, or the fourth number is greater than the number of placement ports of the sorting machine equipment ×2-2.

[0091] The preset pairing scheme type priority order is as follows: from highest to lowest priority, it is: Type 1, Type 2, Type 3, Type 4, Type 5, Type 6, Type 7, and Type 8.

[0092] For example, the device may further include a removal module for removing a second CF batch from the first group, wherein the second CF batch is a CF batch containing fewer than a preset threshold number of mating substrates.

[0093] The substrate pairing apparatus provided in this application provides a method for matching substrates of each color filter (CF) batch in the first group with a thin-film transistor (TFT) batch in the second group and the corresponding pairing scheme. Based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type, the optimal CF batch is determined. The substrates in the optimal CF batch are then paired with the substrates of the optimal TFT batch. The optimal CF batch is the CF batch with the lowest operational complexity in the first group. This method can quickly and accurately find a better pairing scheme, which can significantly improve the efficiency of the pairing operation, reduce the pairing time, and lower the production cost.

[0094] Another embodiment of this application provides an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor executing the computer program to implement the method of any of the above embodiments.

[0095] refer to Figure 11 As shown, the electronic device 20 may include: a processor 200, a memory 201, a bus 202 and a communication interface 203. The processor 200, the communication interface 203 and the memory 201 are connected through the bus 202. The memory 201 stores a computer program that can run on the processor 200. When the processor 200 runs the computer program, it executes the method provided in any of the foregoing embodiments of this application.

[0096] The memory 201 may include high-speed random access memory (RAM), and may also include non-volatile memory, such as at least one disk storage device. Communication between the device network element and at least one other network element is achieved through at least one communication interface 203 (which may be wired or wireless), such as the Internet, wide area network, local area network, metropolitan area network, etc.

[0097] Bus 202 can be an ISA bus, PCI bus, or EISA bus, etc. The bus can be divided into address bus, data bus, control bus, etc. The memory 201 is used to store programs. After receiving an execution instruction, the processor 200 executes the program. The methods disclosed in any of the foregoing embodiments of this application can be applied to the processor 200, or implemented by the processor 200.

[0098] The processor 200 may be an integrated circuit chip with signal processing capabilities. In implementation, each step of the above method can be completed by the integrated logic circuitry in the hardware of the processor 200 or by instructions in software form. The processor 200 may be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it may also be a Digital Signal Processor (DSP), an Application-Specific Integrated Circuit (ASIC), an Off-the-shelf Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the methods disclosed in the embodiments of this application can be directly embodied in the execution of a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor. The software modules may reside in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. The storage medium is located in memory 201. The processor 200 reads the information in memory 201 and, in conjunction with its hardware, completes the steps of the above method.

[0099] The electronic devices and methods provided in the embodiments of this application are based on the same inventive concept and have the same beneficial effects as the methods they employ, operate, or implement.

[0100] Another embodiment of this application provides a computer-readable storage medium having a computer program stored thereon, which is executed by a processor to implement the methods of any of the above embodiments. Reference Figure 12 As shown, the computer-readable storage medium is an optical disc 20, on which a computer program (i.e., a program product) is stored. When the computer program is run by a processor, it executes the methods provided in any of the aforementioned embodiments.

[0101] It should be noted that examples of computer-readable storage media may also include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other optical and magnetic storage media, which will not be elaborated here.

[0102] The computer-readable storage medium provided in the above embodiments of this application and the method provided in the embodiments of this application are based on the same inventive concept and have the same beneficial effects as the methods adopted, run or implemented by the applications stored therein.

[0103] It should be noted that: The term "module" is not intended to be limited to a specific physical form. Depending on the application, a module can be implemented as hardware, firmware, software, and / or a combination thereof. Furthermore, different modules may share common components or even be implemented using the same components. Clear boundaries may or may not exist between different modules.

[0104] The algorithms and displays provided herein are not inherently related to any particular computer, virtual device, or other equipment. Various general-purpose devices can also be used with the examples based on this. The required structure for constructing such devices is obvious from the above description. Furthermore, this application is not directed to any particular programming language. It should be understood that the content of this application described herein can be implemented using various programming languages, and the above description of specific languages ​​is for the purpose of disclosing the best mode of implementation of this application.

[0105] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0106] The above embodiments merely illustrate the implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A substrate pairing method, characterized by, include: For each color filter (CF) batch in the first group, determine the thin-film transistor (TFT) batch in the second group that can be paired with the CF batch and the corresponding pairing scheme; the first group includes multiple CF batches; the second group includes multiple TFT batches; the pairing scheme includes batch combination, substrate matching quantity and execution process; The optimal CF batch is determined based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type; the optimal CF batch is the CF batch with the lowest operational complexity in the first group. A pairing operation is performed on the substrates in the optimal CF batch and the substrates in the optimal TFT batch; the optimal TFT batch is one or more TFT batches corresponding to the optimal CF batch.

2. The method according to claim 1, characterized in that, For each color filter (CF) batch in the first group, the determination of the thin-film transistor (TFT) batch in the second group that can be substrate-matched with that CF batch and the corresponding matching scheme includes: The substrates in the first CF batch are paired with the substrates in each of the TFT batches in the second group to obtain the first TFT batch; the first TFT batch is the TFT batch in the second group with the largest number of substrates paired with the first CF batch; the first CF batch is any CF batch in the first group; In the second group, among the TFT batches other than the first TFT batch, a TFT substrate that can be paired with the unpaired substrate in the first CF batch is searched. The substrate pairing rules are the same as the first round of judgment criteria. The search is repeated until all substrates in the first CF batch are successfully paired, or no TFT substrate that can be paired with the unpaired substrate in the first CF batch is found. The pairing scheme corresponding to the first CF batch is then determined.

3. The method according to claim 1, characterized in that, The step of determining the optimal CF batch based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type includes: For each CF batch, the pairing scheme type corresponding to the pairing scheme is determined according to the preset pairing scheme type. Based on the pairing scheme type corresponding to each CF batch and the priority of each pairing scheme type, the CF batch with the highest priority is determined as the optimal CF batch; the priority of each pairing scheme type is negatively correlated with the operation complexity of each pairing scheme type.

4. The method according to claim 3, characterized in that, The pairing operation between the substrates in the optimal CF batch and the substrates in the optimal TFT batch includes: According to the pairing scheme type corresponding to the pairing scheme of the optimal CF batch, the substrates in the optimal CF batch and the substrates in the optimal TFT batch are paired according to the corresponding pairing operation scheme.

5. The method according to claim 3 or 4, characterized in that, The preset pairing scheme types include: Type 1: All substrates in the first CF batch can be paired one-to-one with all substrates in the first TFT batch; Second type: The number of substrates in the first CF batch is less than the number of substrates in the first TFT batch, and all substrates in the first CF batch have a corresponding matching substrate in the first TFT batch. The third type: the first CF batch corresponds to and is matched with the first number of TFT batches. Each substrate in the first CF batch corresponds to a matching substrate in the first number of TFT batches. 2 ≤ the first number ≤ the number of placement ports of the sorting machine equipment - 1; one placement port is used to place one CF batch or one TFT batch. Fourth type: The first CF batch is matched with the second number of TFT batches. Each substrate in the first CF batch has a matching substrate in the second number of TFT batches. The number of placement ports of the sorting machine equipment - 1 < the second number ≤ the number of placement ports of the sorting machine equipment × 2 - 2. Fifth type: The first CF batch is matched with a TFT batch. There are substrates in the first CF batch that cannot be matched, and all substrates in the TFT batch can be matched. Type 6: The first CF batch is matched with a TFT batch, there are substrates in the first CF batch that cannot be matched, and there are substrates in the TFT batch that are matched with the first CF batch that cannot be matched. Type 7: The first CF batch corresponds to and is matched with the third number of TFT batches. There are substrates in the first CF batch that cannot be matched, and there are substrates in the third number of TFT batches that cannot be matched, and 1 < the third number ≤ the number of placement ports of the sorting machine equipment - 3. Type 8: The first CF batch corresponds to and matches the fourth number of TFT batches. There are substrates in the first CF batch that cannot be matched and the fourth number is ≥2, or the fourth number is greater than the number of placement ports of the sorting machine equipment ×2-2.

6. The method according to claim 5, characterized in that, The preset pairing scheme type priority order is as follows: from high to low priority, the first type, the second type, the third type, the fourth type, the fifth type, the sixth type, the seventh type, and the eighth type.

7. The method according to any one of claims 1-4, characterized in that, The method further includes removing a second CF batch from the first group, wherein the second CF batch is a CF batch containing fewer than a preset threshold number of mating substrates.

8. A substrate pairing device, characterized in that, include: The first determining module is used to determine, for each color filter (CF) batch in the first group, a thin-film transistor (TFT) batch in the second group that can be paired with the substrate of the CF batch and the corresponding pairing scheme; the first group includes multiple CF batches; the second group includes multiple TFT batches; the pairing scheme includes batch combination, substrate matching quantity and execution process. The second determining module is used to determine the optimal CF batch based on the pairing scheme corresponding to each CF batch and the operational complexity of each pairing scheme type; the optimal CF batch is the CF batch with the lowest operational complexity in the first group. A pairing module is used to perform a pairing operation between the substrates in the optimal CF batch and the substrates in the optimal TFT batch; the optimal TFT batch is one or more TFT batches corresponding to the optimal CF batch.

9. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor executing the computer program to implement the substrate mating method as described in any one of claims 1-7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, The computer program is executed by a processor to implement the substrate pairing method as described in any one of claims 1-7.

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