A computer high-efficiency heat dissipation and cooling device

Abstract

This invention discloses a high-efficiency heat dissipation and cooling device for computers, relating to the field of computer heat dissipation technology. It includes a heat-absorbing component, a self-circulating conveying component, and a vortex cooling tower component. The heat-absorbing component is located at the heat-generating area of ​​the computer and includes a mounting base. Its surface facing the heat-generating area is the heat-absorbing surface, and the other side is the heat-dissipating surface. The self-circulating conveying component includes multiple annular circulation pipes, one end of which is embedded in the mounting base, and a circulation pump is installed on the pipes. The vortex cooling tower component includes a cooling frame, one end of which is fixedly connected to the heat-dissipating surface, and at least one cooling fan is installed on the frame. The other end of the circulation pipes is embedded in the cooling frame, and the pipes are filled with coolant. This application features a dual gas-liquid cooling method, reducing noise.

Description

Technical Field

[0001] This invention relates to the field of computer heat dissipation technology, and in particular to a high-efficiency computer heat dissipation and cooling device. Background Technology

[0002] As the power consumption of high-performance CPUs, GPUs, and AI accelerator chips continues to increase, traditional air-cooled heatsinks are gradually becoming insufficient to meet the heat dissipation requirements of chips with high heat flux densities. Especially in gaming consoles, graphics workstations, AI training devices, and edge servers, chip power consumption generally reaches 250W to 600W or more, resulting in a significant increase in local heat flux density and causing traditional heat dissipation structures to encounter heat dissipation bottlenecks.

[0003] Existing air-cooled heat dissipation solutions mainly rely on heat pipes and axial fans for heat conduction and air exchange, which have problems such as insufficient air pressure, limited heat exchange efficiency, and significant noise at high speeds. While traditional all-in-one water cooling can improve heat exchange capacity, it generally uses mechanical water pumps to drive coolant circulation. Long-term operation can easily lead to problems such as water pump aging, leakage, air bubble blockage, and complex maintenance. At the same time, water cooling systems have complex structures, are difficult to install, and have low reliability.

[0004] In addition, most existing heat dissipation systems adopt a fixed air duct structure, which has low airflow organization efficiency. The heat dissipation airflow is prone to turbulence, collision and backflow, which not only wastes energy, but also significantly increases wind noise. Summary of the Invention

[0005] In order to at least solve one of the above-mentioned technical problems, the present invention aims to provide a computer heat dissipation and cooling device with a dual gas-liquid cooling method to reduce noise.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A high-efficiency heat dissipation and cooling device for computers includes a heat absorption component, a self-circulating conveying component, and a vortex cooling tower component;

[0008] The heat-absorbing component is disposed at the heat-generating area of ​​the computer. The heat-absorbing component includes a mounting base, with the mounting base facing the heat-generating area of ​​the computer as a heat-absorbing surface and the other side of the mounting base as a heat-dissipating surface.

[0009] The self-circulating conveying assembly includes multiple annular circulation pipes, one end of which is embedded in the mounting base, and a circulation pump is installed on each of the multiple circulation pipes.

[0010] The vortex cooling tower assembly includes a cooling frame, one end of which is fixedly connected to a heat dissipation surface, and at least one cooling fan is provided on the cooling frame.

[0011] The end of the circulation pipe furthest from the mounting base is embedded in the cooling frame, and the circulation pipe is filled with coolant.

[0012] Preferably, the mounting base is made of copper, and a microchannel array layer is provided on the heat dissipation surface of the mounting base, the microchannel array layer including multiple fluid trenches.

[0013] Preferably, the cooling frame includes a heat-conducting frame, on which a plurality of heat dissipation fins are uniformly arranged.

[0014] Preferably, there are two cooling fans, which are respectively arranged on both sides of the cooling frame, and the airflow direction of the two cooling fans is the same.

[0015] Preferably, a temperature sensor is provided inside the mounting base, and the temperature sensor is electrically connected to the circulating pump and the cooling fan through a control unit.

[0016] Preferably, the multiple circulation tubes are arranged in an array, and the heat dissipation fins are staggered slit fin structures with adjacent heat dissipation fins being staggered.

[0017] Preferably, the cooling fan is a magnetic levitation fan.

[0018] Preferably, the mounting base is connected to the heat-generating part of the computer via locking bolts.

[0019] The present invention has the following beneficial effects:

[0020] I. Dual Gas-Liquid Cooling Significantly Enhances Heat Dissipation Capacity: This solution combines solid-state heat conduction from the heat-absorbing component with liquid-state circulation cooling from the self-circulating transport component, while the vortex cooling tower component provides airflow-assisted cooling. These three heat dissipation paths operate in parallel, effectively covering the entire heat transfer chain from the chip to the environment. Compared to traditional pure air-cooling solutions, the liquid-cooled circulation pipes are directly embedded in the mounting base, enabling rapid absorption of concentrated heat generated by high heat flux density chips, avoiding the bottleneck of insufficient heat pipe conduction efficiency in air-cooling solutions. Compared to traditional integrated water cooling, this solution uses multiple independent annular circulation pipes instead of a single large loop. Even if air bubbles or micro-leaks occur in one circulation pipe, the remaining pipes can still operate normally, and the overall system heat dissipation capacity will not drop drastically, resulting in significantly better reliability than traditional water cooling.

[0021] II. Self-circulating transport structure eliminates the need for external mechanical water pumps, improving system reliability; Traditional water cooling relies on mechanical water pumps to drive coolant circulation. After long-term operation, pump impeller wear and seal aging commonly lead to leaks and air bubble blockages. This solution directly mounts circulation pumps on the circulation pipes, which are arranged in an array. Each circulation pipe can be equipped with an independent small circulation pump, which is small in size, has low power consumption, and a long lifespan. The multi-pump parallel architecture ensures that a single pump failure will not paralyze the entire cooling system. Maintenance only requires replacing the corresponding circulation pipe, significantly reducing maintenance complexity and the risk of leaks.

[0022] 3. Optimized airflow organization in the vortex cooling tower assembly reduces wind noise. The heat dissipation fins on the cooling frame employ a staggered slit fin structure, with adjacent fins arranged in a staggered manner. This structure guides airflow along the fin surface to form an orderly vortex flow, reducing turbulent airflow collisions and backflow phenomena found in traditional fixed air ducts. Two cooling fans are positioned on both sides of the cooling frame with the same airflow direction, forming a unidirectional push-pull airflow channel. The airflow accelerates through the frame without generating vortex collisions at the outlet. This unidirectional airflow design, combined with the contactless operation of the magnetic levitation fan, significantly reduces overall operating noise compared to traditional high-speed axial fan solutions, making it particularly suitable for graphics workstations and edge server scenarios where quiet operation is required.

[0023] IV. Microchannel Array Layer Enhances Heat Transfer Efficiency Inside the Base: The microchannel array layer on the heat dissipation surface of the mounting base contains multiple fluid grooves. This significantly increases the contact area between the coolant and the inner wall of the base as the coolant flows within the microchannels, resulting in a heat transfer coefficient far exceeding that of smooth pipe walls. The base is made of copper, which has a thermal conductivity as high as 401 W / m Kelvin, enabling rapid and uniform diffusion of heat from the chip across the entire base surface, where it is efficiently carried away by the coolant within the microchannels. This combination of solid-state heat amplification and liquid microchannel heat transfer transforms the mounting base itself into a highly efficient liquid cooling plate, achieving a heat transfer efficiency superior to traditional heat pipe and finned pure air-cooled bases.

[0024] V. Temperature Sensor and Control Unit Enable Intelligent Adjustment to Reduce Energy Consumption: A temperature sensor installed in the mounting base monitors the chip temperature in real time and adjusts the speed of the circulation pump and cooling fan in conjunction with the control unit. When the chip is under low load, the circulation pump and fan automatically reduce their speed to minimize unnecessary power consumption and noise output. When the chip enters a high load state, the system rapidly increases the circulation flow and air volume to ensure that the heat dissipation capacity matches the heat generated. Compared with the constant high-speed operation of traditional cooling systems, this on-demand adjustment mechanism can save considerable energy in all-weather usage scenarios, while also extending the lifespan of the circulation pump and fan.

[0025] VI. Magnetic levitation fans combined with dual fans in the same direction achieve quiet and efficient heat dissipation; the cooling fans are magnetic levitation fans, whose rotors are suspended in a magnetic field without mechanical contact, fundamentally eliminating bearing friction noise and wear problems, and extending their service life far beyond traditional ball bearing fans. Simultaneously, a magnetic levitation fan is installed on each side of the cooling frame with the same airflow direction. When the two fans work together, each only needs a lower speed to achieve the required airflow, further reducing the aerodynamic noise of a single fan. The dual-fan unidirectional layout also creates a stable unidirectional airflow field inside the cooling frame, avoiding the airflow collision and turbulence noise problems common with opposing fans. This combination has significant advantages in AI training equipment and edge servers that require long-term quiet operation.

[0026] VII. The synergistic structure of the arrayed circulation tubes and staggered fins enhances overall heat transfer uniformity. Multiple circulation tubes are arranged in an array and embedded in the mounting base, allowing the coolant to absorb heat simultaneously from multiple areas of the base. This avoids the problem of heat concentration near the inlet and insufficient heat dissipation at the far end, a common issue in traditional single-loop water cooling. The heat dissipation fins on the cooling frame employ a staggered slit fin structure, echoing the arrayed circulation tubes, ensuring that the heat discharged from the end of the circulation tubes is evenly received by the fins and diffused into the airflow. This symmetrical design, with both the heat absorption and dissipation ends using an array and staggered arrangement, makes the temperature distribution of the entire heat dissipation chain more uniform, reducing the likelihood of localized hot spots. This is particularly suitable for heat dissipation scenarios involving multiple chips or large-area heat sources. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present invention.

[0029] Figure 2 This is a top view of an embodiment of the present invention.

[0030] In the diagram: 101, mounting base; 102, microchannel array layer; 201, circulation pipe; 202, circulation pump; 301, cooling frame; 311, heat conduction frame; 312, heat dissipation fins; 302, cooling fan; 401, temperature sensor; 402, control unit. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] like Figures 1 to 2 As shown, a high-efficiency heat dissipation and cooling device for computers includes a heat absorption component, a self-circulating conveying component, and a vortex cooling tower component. The heat absorption component is located at the heat-generating area of ​​the computer and includes a mounting base 101. The mounting base 101 facing the heat-generating area of ​​the computer is a heat absorption surface, and the other side of the mounting base 101 is a heat dissipation surface. The self-circulating conveying component includes multiple annular circulation pipes 201. One end of each circulation pipe 201 is embedded in the mounting base 101, and a circulation pump 202 is installed on each circulation pipe 201. The vortex cooling tower component includes a cooling frame 301. One end of the cooling frame 301 is fixedly connected to the heat dissipation surface, and at least one cooling fan 302 is installed on the cooling frame 301. The end of each circulation pipe 201 away from the mounting base 101 is embedded in the cooling frame 301, and the circulation pipe 201 is filled with coolant.

[0033] like Figures 1 to 2 As shown, the heat-absorbing component is installed at the heat-generating area of ​​the computer and consists of a mounting base 101. The side of the mounting base 101 facing the chip is the heat-absorbing surface, and the back side is the heat-dissipating surface. The heat generated by the chip is conducted to the heat-absorbing surface of the mounting base 101 through thermal grease or direct contact, and then diffused to the heat-dissipating surface through the interior of the base material. The base is made of copper, which has a thermal conductivity of up to 401 W / m Kelvin, enabling it to quickly diffuse the locally concentrated heat from the chip to the entire surface of the base, preventing heat from accumulating under the chip and forming hot spots. A microchannel array layer 102 is provided on the heat-dissipating surface of the mounting base 101, containing multiple fluid channels. When the coolant flows in these microchannels, the contact area with the inner wall of the base is much larger than that of a smooth pipe wall, significantly improving the heat transfer coefficient. After the chip's heat is conducted to the heat-dissipating surface through the copper base, it is quickly carried away by the coolant flowing in the microchannels, which is equivalent to building a high-efficiency liquid cooling plate inside the base, with a heat transfer capacity far exceeding that of a traditional heat pipe and finned pure air-cooled base.

[0034] The self-circulating transport assembly consists of multiple annular circulation pipes 201. One end of each circulation pipe 201 is embedded in the mounting base 101, and the other end is embedded in the cooling frame 301, filled with coolant. Each circulation pipe 201 is equipped with a circulation pump 202, which drives the coolant to flow continuously within the pipe. After heat is absorbed by the coolant in the microchannels within the base, it is transported along the circulation pipe 201 to one end of the cooling frame 301, completing the heat transfer from the heat absorption end to the heat dissipation end. The multiple circulation pipes 201 are arranged in an array, allowing the coolant to absorb heat from multiple areas of the base simultaneously, avoiding the problem of heat concentration near the inlet and insufficient heat dissipation at the far end, as is common in single-loop systems. The circulation pump 202 is mounted on the body of the circulation pipe 201, rather than being a separate external mechanical water pump in a traditional water-cooling system. This design makes each circulation pipe 201 an independent micro-circulation loop, with a small pump size, low power consumption, and long lifespan. Even if the pump in one of the circulation pipes 201 fails, the remaining pipes can still operate normally, and the overall heat dissipation capacity of the system will not drop drastically. At the same time, it eliminates the common problems of leakage and air bubble blockage caused by aging water pump seals in traditional water cooling, significantly improving reliability.

[0035] One end of the cooling frame 301 is fixedly connected to the heat dissipation surface of the mounting base 101. Multiple heat dissipation fins 312 are evenly arranged on the frame, employing a staggered slit fin structure with adjacent fins arranged in a staggered pattern. The end of the circulation pipe 201 is embedded within the cooling frame 301, releasing heat into the frame. A cooling fan 302 is mounted on the frame, driving external airflow over the heat dissipation fins 312 to carry away heat from the frame and exhaust it outside the machine. The staggered fin structure allows the airflow to form an orderly vortex flow along the fin surface, reducing turbulent collisions and backflow, resulting in higher airflow organization efficiency than traditional fixed air ducts. Two cooling fans 302 are positioned on either side of the cooling frame 301, with both fans pointing in the same direction. This unidirectional airflow design creates a one-way push-pull airflow channel inside the frame, accelerating the airflow without generating vortex collisions at the outlet. Each fan only needs a lower speed to achieve the required total airflow. Combined with the non-mechanical contact characteristic of magnetic levitation fans, bearing friction noise is fundamentally eliminated, resulting in significantly lower overall operating noise compared to traditional high-speed axial flow fan solutions.

[0036] A temperature sensor 401 is installed inside the mounting base 101 to monitor the chip temperature in real time and, through the control unit 402, adjust the speed of the circulation pump 202 and the cooling fan 302. When the chip is under low load, the pump and fan automatically reduce speed to reduce power consumption and noise. When the chip is under high load, the system rapidly increases the circulation flow and air volume to ensure that the heat dissipation capacity matches the heat generation. This closed-loop regulation mechanism ensures that the heat dissipation output always follows the changes in heat generation, avoiding the energy waste and noise problems caused by the constant high speed operation of traditional cooling systems.

[0037] like Figures 1 to 2As shown, the mounting base 101 is made of copper. A microchannel array layer 102 is provided on the heat dissipation surface of the mounting base 101, and the microchannel array layer 102 includes multiple fluid channels. The mounting base 101 is made of copper, which has a thermal conductivity as high as 401 W / m Kelvin, far exceeding that of aluminum alloys and ordinary copper alloys. This allows the heat generated concentrated on the chip surface to be diffused laterally to the entire base surface in a very short time, preventing heat from accumulating locally below the chip and forming hot spots. The microchannel array layer 102 on the heat dissipation surface of the base contains multiple fluid channels. When the coolant flows in these microchannels, the contact area between the coolant and the inner wall of the base is greatly increased, resulting in a significantly higher heat transfer coefficient than a smooth pipe wall. The copper base is responsible for rapidly and evenly diffusing heat from the chip to the entire heat dissipation surface, while the microchannel array layer 102 is responsible for efficiently transferring the diffused heat to the flowing coolant. Together, the mounting base 101 constitutes a high-efficiency liquid cooling plate, with a heat transfer capacity at the heat absorption end far exceeding that of a traditional heat pipe and finned pure air-cooled base.

[0038] like Figures 1 to 2 As shown, the cooling frame 301 includes a heat-conducting frame 311, on which multiple heat dissipation fins 312 are evenly arranged. The end of the circulation pipe 201 is embedded in the cooling frame 301, releasing the heat from the circulation pipe 201 into the heat-conducting frame 311. The heat-conducting frame 311 acts as an intermediate heat conductor, evenly distributing the heat to each heat dissipation fin 312. The evenly arranged heat dissipation fins 312 increase the contact area with the airflow, and the external airflow carries away the heat as it flows over the fin surface. The uniform thermal conductivity of the heat-conducting frame 311 ensures a relatively consistent temperature distribution among the fins, avoiding the uneven temperature problem in traditional heat dissipation structures where the fins near the inlet of the circulation pipe 201 are hot while the fins further away are cold, thus maximizing the heat dissipation efficiency of the air-cooled end.

[0039] like Figures 1 to 2 As shown, there are two cooling fans 302, positioned on either side of the cooling frame 301, with both fans blowing in the same direction. This unidirectional airflow design allows the airflow to enter from one side of the frame, accelerate along the surface of the heat sink fins 312, and exit from the other side, forming a stable unidirectional airflow channel within the frame. This layout avoids the airflow collision and vortex backflow phenomena common in traditional opposing fans, resulting in higher airflow organization efficiency and less energy waste. Furthermore, each fan only needs to operate at a lower speed to achieve the required total airflow. Combined with the non-mechanical contact characteristic of magnetic levitation fans, the operating noise is significantly lower than traditional single-fan high-speed or opposing dual-fan solutions, making it particularly suitable for graphics workstations and edge server scenarios where quiet operation is required.

[0040] like Figures 1 to 2As shown, a temperature sensor 401 is installed inside the mounting base 101. The sensor is electrically connected to the circulation pump 202 and the cooling fan 302 via a control unit 402. The temperature sensor 401 collects the chip surface temperature in real time and feeds the data back to the control unit 402. The control unit 402 dynamically adjusts the speed of the circulation pump 202 and the speed of the cooling fan 302 accordingly. When the chip is under low load, the pump and fan automatically reduce their speed to reduce power consumption and noise. When the chip enters a high load phase, the system rapidly increases the circulation flow and air volume to ensure that the heat dissipation capacity matches the heat generation. This closed-loop control mechanism ensures that the heat dissipation output always follows the changes in heat generation, avoiding the energy waste caused by the constant high-speed operation of traditional cooling systems.

[0041] like Figures 1 to 2 As shown, multiple circulation pipes 201 are arranged in an array and embedded within the mounting base 101, with each circulation pipe 201 covering a local area of ​​the base. Coolant flows simultaneously in each circulation pipe 201, absorbing heat synchronously from multiple areas of the base, avoiding the problem of heat concentration near the inlet and insufficient heat dissipation at distant points, common in traditional single-loop water cooling. The array arrangement makes the temperature distribution more uniform across the base, reducing the likelihood of localized hot spots, making it particularly suitable for heat dissipation scenarios involving multiple chips or large-area heat sources.

[0042] like Figures 1 to 2 As shown, the heat dissipation fins 312 adopt an interlaced slit fin structure, with adjacent fins staggered. This structure creates narrow acceleration channels between each fin as airflow passes through, guiding the airflow along the fin surface into orderly laminar and vortex flow, rather than the turbulent collisions and backflows common in traditional fixed air ducts. The interlaced layout increases the contact path length between the airflow and the fins, resulting in higher heat exchange area utilization. Simultaneously, the improved airflow organization efficiency reduces energy waste, and overall wind noise is also reduced. The cooling fan 302 is a magnetic levitation fan, whose rotor is suspended in the stator by a magnetic field, eliminating any mechanical contact during operation. This design fundamentally eliminates the mechanical noise generated by bearing friction in traditional ball bearing fans, and also eliminates the problem of shortened lifespan caused by bearing wear. The magnetic levitation fan has almost no noise output at low speeds. Combined with the co-directional dual-fan layout, each fan only needs a lower speed to achieve the required total airflow, further reducing aerodynamic noise. The overall operating noise is far lower than that of traditional high-speed axial fan solutions.

[0043] like Figures 1 to 2As shown, the mounting base 101 is connected to the heat-generating part of the computer via locking bolts. The locking bolts provide a stable mechanical clamping force, ensuring a tight fit between the heat-absorbing surface of the mounting base 101 and the chip surface, reducing contact thermal resistance. The thermal resistance between the copper base and the chip mainly originates from the microscopic gaps at the contact surface. The pressure of the locking bolts ensures a full fit between the base and the chip, and with the addition of thermal grease to fill these microscopic gaps, heat can be efficiently conducted from the chip to the heat-absorbing surface of the base. Furthermore, the locking bolt connection method facilitates installation and disassembly; the base can be quickly removed during maintenance without damaging the chip or motherboard.

[0044] The above are merely specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on the present invention to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of the present invention.

Claims

1. A high-efficiency heat dissipation and cooling device for computers, characterized in that, This includes heat absorption components, self-circulating conveying components, and vortex cooling tower components; The heat absorption component is disposed at the heat-generating part of the computer. The heat absorption component includes a mounting base (101). The mounting base (101) facing the heat-generating part of the computer is a heat-absorbing surface, and the other side of the mounting base (101) is a heat-dissipating surface. The self-circulating conveying assembly includes multiple annular circulation pipes (201), one end of which is embedded in the mounting base (101), and a circulation pump (202) is provided on each of the multiple circulation pipes (201). The vortex cooling tower assembly includes a cooling frame (301), one end of which is fixedly connected to a heat dissipation surface, and at least one cooling fan (302) is provided on the cooling frame (301). The end of the circulation pipe (201) away from the mounting base (101) is embedded in the cooling frame (301), and the circulation pipe (201) is filled with coolant.

2. A computer high-efficiency heat dissipation cooling device according to claim 1, characterized in that, The mounting base (101) is made of copper, and a microchannel array layer (102) is provided on the heat dissipation surface of the mounting base (101). The microchannel array layer (102) includes multiple fluid grooves.

3. The computer efficient heat dissipation cooling device of claim 1, wherein, The cooling frame (301) includes a heat-conducting frame (311), on which a plurality of heat dissipation fins (312) are uniformly arranged.

4. The computer efficient heat dissipation cooling device of claim 3, wherein, There are two cooling fans (302) respectively located on both sides of the cooling frame (301), and the two cooling fans (302) have the same airflow direction.

5. The computer efficient heat dissipation cooling device of claim 1, wherein, A temperature sensor (401) is provided in the mounting base (101), and the temperature sensor (401) is electrically connected to the circulating pump (202) and the cooling fan (302) through the control unit (402).

6. The computer efficient heat dissipation cooling device of claim 1, wherein, Multiple circulation tubes (201) are arranged in an array, and the heat dissipation fins (312) are staggered slit fin structures with adjacent heat dissipation fins (312) being staggered.

7. The computer efficient heat dissipation cooling device of claim 1, wherein, The cooling fan (302) is a magnetic levitation fan.

8. The computer efficient heat dissipation cooling device of claim 1, wherein, The mounting base (101) is connected to the computer's heat-generating part by locking bolts.

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