Chip implant-based building component whole life cycle information tracing method and system

Abstract

This application relates to the field of information traceability technology, and discloses a method and system for tracing the entire lifecycle of building components based on chip implantation. The method includes: implanting a uniquely identified chip into the building component; automatically reading and writing the chip information and linking it to the cloud at each stage of production, transportation, installation, operation and maintenance, and dismantling and recycling via a mobile terminal or fixed reader / writer; and realizing full lifecycle information traceability of the component. This application solves the problems in existing building component traceability systems where traceability reading behavior and structural health perception behavior are independent, and structural status data during the operation and maintenance phase cannot be automatically accumulated through routine traceability operations.

Description

Technical Field

[0001] This application relates to the field of information traceability technology, and in particular to a method and system for tracing the entire life cycle of building components based on chip implantation. Background Technology

[0002] Information management of precast building components is a core aspect of building industrialization. Currently, RFID and NFC chips are used for the identification and traceability management of building components. By attaching or embedding chips on components, mobile terminals or fixed readers can read the unique chip identifier at various stages of production, transportation, and installation, uploading the operational information from each stage to a cloud database, thus achieving a chain-like record of information from the component's factory to its installation. This method has already been applied to some extent in the supply chain management of precast concrete components, forming a component information archive system with the unique chip identifier as the index key.

[0003] However, the traceability system only uses the chip as a passive identification carrier. Each reading only generates identification data and operation records, and the reading itself does not carry any physical information about the structural status of the component. Structural health monitoring during the operation and maintenance phase relies on a separately deployed dedicated sensor system, which is independent of the traceability system. This results in the inability to manage component identification files and structural health data under the same data node. Existing RFID structural health monitoring technologies all require special modifications to the chip antenna structure or the introduction of special sensing materials, which increases additional hardware costs and implantation process complexity. During the dismantling and recycling phase, there is a lack of quantitative regeneration path assessment methods based on the historical data of the entire component life cycle. The determination of the reuse value of the component relies on manual sampling inspection, which has low coverage and inconsistent standards. Summary of the Invention

[0004] This application provides a method and system for tracing the entire lifecycle information of building components based on chip implantation. It solves the problems in existing building component traceability systems where the traceability reading behavior and structural health perception behavior are independent, structural status data during the operation and maintenance phase cannot be automatically accumulated through routine traceability operations, and the lack of quantitative regeneration path decision-making means based on historical data throughout the entire lifecycle during the demolition and recycling phase. Without adding any additional sensing hardware, it realizes integrated closed-loop management of automatic reading and writing of information throughout the entire lifecycle of building components from production, transportation, installation, operation and maintenance to demolition and recycling, continuous perception of structural status, and quantitative assessment of regeneration paths.

[0005] Firstly, this application provides a method for tracing the entire lifecycle information of building components based on chip implantation, the method comprising: Step S1: During the building component production stage, a chip with a unique identifier is implanted into the building component body as a recording carrier. The unique identifier of the chip is read by a fixed reader, and the production batch, component specifications and quality inspection results are written into the cloud database to obtain the component's cloud identity file. Step S2: At each stage of transportation and installation, the unique identifier of the chip is read through a mobile terminal or a fixed reader, and the current node type, timestamp and operation information are appended to the component's cloud identity file to obtain traceability records for each stage. Step S3: During the operation and maintenance phase, chip A and chip B are implanted on both sides of the structural joint of the building component. The reader reads chip A and chip B sequentially in the same scanning cycle to obtain the current reading time interval. The difference between the current reading time interval and the initial reading time interval calibrated at the factory is used to obtain the timing deviation. The timing deviation is added to the cloud identity file of the component to obtain the timing deviation history sequence. Step S4: During the dismantling and recycling phase, the unique identifier of the chip is read through the mobile terminal, and the ratio of the maximum historical deviation in the time deviation history sequence to the final state residual deviation is mapped to the preset regeneration path rule to obtain the component regeneration path decision result, and the regeneration path decision result is written into the component cloud identity file.

[0006] Secondly, this application provides a chip-embedded building component lifecycle information traceability system, the chip-embedded building component lifecycle information traceability system comprising: The reading module is used to implant a chip with a unique identifier as a recording carrier into the building component body during the building component production stage. The unique identifier of the chip is read by a fixed reader, and the production batch, component specifications and quality inspection results are written into the cloud database to obtain the component's cloud identity file. The traceability module is used to read the unique identifier of the chip at each stage of transportation and installation through a mobile terminal or fixed reader, and append the current node type, timestamp and operation information to the component's cloud identity file to obtain traceability records for each stage. The analysis module is used to implant chip A and chip B on both sides of the structural joint of the building component during the operation and maintenance phase. The reader reads chip A and chip B sequentially in the same scanning cycle to obtain the current reading time interval. The difference between the current reading time interval and the initial reading time interval calibrated at the factory is used to obtain the timing deviation. The timing deviation is appended to the cloud identity file of the component to obtain the timing deviation history sequence. The decision module is used to read the unique identifier of the chip through a mobile terminal during the dismantling and recycling phase, map the ratio of the maximum historical deviation in the time-series deviation history sequence to the final residual deviation to a preset regeneration path rule, obtain the component regeneration path decision result, and write the regeneration path decision result into the component cloud identity file.

[0007] Thirdly, a chip-embedded building component lifecycle information traceability device is provided, comprising: a memory and at least one processor, wherein the memory stores instructions; the at least one processor invokes the instructions in the memory to cause the chip-embedded building component lifecycle information traceability device to execute the above-described chip-embedded building component lifecycle information traceability method.

[0008] Fourthly, a computer-readable storage medium is provided, wherein instructions are stored in the computer-readable storage medium, which, when executed on a computer, cause the computer to execute the above-described method for tracing the entire lifecycle information of building components based on chip implantation.

[0009] The technical solution provided in this application embeds a uniquely identified chip into the building component as a recording carrier. Using the chip's unique identifier as an index key, a cloud-based identity file for the component is constructed. This forces the production batch, component specifications, and quality inspection results to be bound to the physical chip during the production stage. Subsequent transportation and installation nodes use mobile terminals or fixed readers to read the same unique identifier, appending the node type, timestamp, and operation information to the same file node, forming an uninterrupted traceable record chain with the unique identifier as the main thread running through each stage. This design allows the component to reconstruct its complete history through a single read operation at any stage of its transfer, completely eliminating the data gap problem caused by the independent information systems at each stage in existing technologies. Simultaneously, the append-writing mechanism ensures that records at each stage only increase and never decrease, and together with the SHA-256 chain hash structure, it guarantees the integrity and immutability of the entire lifecycle file.

[0010] During the operation and maintenance phase, this invention symmetrically implants chips A and B on both sides of the structural joint. The reader sequentially reads the two chips within the same scanning cycle, using the difference between the current reading time interval and the factory-calibrated initial reading time interval as the timing deviation. This timing deviation is continuously added to the component's cloud-based identity file to form a historical sequence of timing deviations. This ensures that each routine traceability reading action synchronously outputs a state parameter with structural physical significance, achieving zero-hardware incremental reuse of traceability and structural health perception actions. Based on the historical sequence of timing deviations, the regression slope is obtained through least squares linear fitting, and the mutation amount is obtained by calculating the difference between adjacent deviations. Combined with the spatial correlation index, the spatial distribution of timing deviations across all floor joints is analyzed collaboratively, enabling the quantitative identification and precise location of three characteristics: the trend evolution of damage, sudden impact, and regional concentration. During the dismantling and recycling phase, the reversibility index is calculated by the ratio of the maximum historical deviation in the time-series deviation to the final residual deviation. The two parameters are mapped to the preset recycling path rules, and three decision results are automatically output: reassembled as is, downgraded for reuse, or crushed for recycling. These results are written into the component's cloud identity file, so that the recycling value assessment at the dismantling end is entirely driven by the historical data of the entire life cycle, without the need for additional testing. This achieves the dual connection of component information closed loop and material cycle. Attached Figure Description

[0011] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of an embodiment of the method for tracing the entire lifecycle information of building components based on chip implantation in this application. Figure 2 This is a schematic diagram illustrating the continuous deterioration state of the joint and the determination result of the sudden event node in the embodiments of this application; Figure 3 This is a schematic diagram showing the distribution of component regeneration path decision results in the embodiments of this application. Detailed Implementation

[0013] This application provides a method and system for tracing the entire lifecycle information of building components based on chip implantation. The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein. Furthermore, the terms "comprising" or "having" and any variations thereof are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0014] For ease of understanding, the specific process of the embodiments of this application is described below. Please refer to [link / reference]. Figure 1 One embodiment of the method for tracing the entire lifecycle information of building components based on chip implantation in this application includes: Step S1: During the building component production stage, a chip with a unique identifier is implanted into the building component body as a recording carrier. The unique identifier of the chip is read by a fixed reader, and the production batch, component specifications and quality inspection results are written into the cloud database to obtain the component's cloud identity file. Specifically, during the production stage, when the chip is embedded into the building component as a recording carrier, the chip must meet the geometric constraint that the antenna plane is parallel to the surface of the component. The embedment depth is set at 15mm below the thickness of the concrete protective layer. This embedment depth takes into account both the penetration attenuation characteristics of NFC signals in the concrete medium and the chip's long-term alkali corrosion protection requirements. If it is too shallow, the antenna will be affected by construction damage to the concrete surface; if it is too deep, the reading device will not be able to reliably activate the chip within the standard reading distance of 80mm. After the fixed reader reads the chip's unique identifier, it binds this unique identifier with the production batch, component specifications, and quality inspection results and writes it into the cloud database. The cloud database establishes a data node with the unique identifier as the index key value. This node remains unique and cannot be deleted throughout the entire life cycle of the component. The production batch field records the pouring date and curing age, the component specifications field records the cross-sectional dimensions and design strength grade, and the quality inspection results field records the measured value of the factory compressive strength.

[0015] Step S2: At each stage of transportation and installation, the unique identifier of the chip is read through a mobile terminal or a fixed reader, and the current node type, timestamp and operation information are appended to the component cloud identity file to obtain traceability records for each stage. Specifically, at each stage of transportation and installation, every time a mobile terminal or fixed reader reads the chip's unique identifier, it simultaneously collects the current node type, UTC timestamp, and operator's employee number. These three data points are then associated with the unique identifier and appended to the corresponding data node in the component's cloud-based identity file. The node type field takes three enumerated values: factory exit, site arrival, or in place. The UTC timestamp precision is set to 100ms. The operator's employee number corresponds one-to-one with the personnel file in the construction management system. These three types of data together constitute the traceability record for each stage. After the traceability record is written, a SHA-256 hash value is generated. The preceding hash value is used as the input for calculating the current hash value to obtain a sequential hash chain. This chain structure ensures that if any node's traceability record is tampered with, the hash verification will fail.

[0016] Step S3: During the operation and maintenance phase, chip A and chip B are implanted on both sides of the structural joint of the building component. The reader reads chip A and chip B sequentially in the same scanning cycle to obtain the current reading time interval. The difference between the current reading time interval and the initial reading time interval calibrated at the factory is used to obtain the timing deviation. The timing deviation is added to the component's cloud identity file to obtain the historical sequence of timing deviation. Specifically, during the operation and maintenance phase, chips A and B are implanted on both sides of the structural joint, respectively. The reader reads the two chips sequentially within the same scan cycle, obtaining the reading time interval for that session. The initial reading time interval calibrated at the factory refers to the reference value obtained by taking the arithmetic mean of the time differences of five consecutive reads of chips A and B at a standard reading distance of 80mm when the component leaves the factory and the joint is in its initial design state. This reference value is written to the cloud and marked as a read-only field. When the joint is displaced due to component stress, settlement, or damage, the path length difference between chips A and B relative to the reader antenna changes. The time difference between the reader reading the two chips sequentially in the anti-collision protocol time slot allocation changes accordingly. The difference between the current reading time interval and the initial reading time interval is the timing deviation. The positive or negative direction of the timing deviation reflects the trend of the joint opening or closing, and the absolute value reflects the magnitude of the displacement. The timing deviation is added sequentially with each node scan to obtain the historical sequence of timing deviations.

[0017] Timing deviation is stored in the component's cloud-based identity file as a signed numerical field named "Timing Deviation Value," with the value in microseconds and rounded to one decimal place. A positive value indicates that the joint is trending towards opening, while a negative value indicates that the joint is trending towards closing. The larger the absolute value, the greater the displacement of the joint. This numerical field is automatically calculated by the reader after completing a routine traceability scan (i.e., the same operation of reading the chip's unique identifier to confirm the component's identity). The calculation process involves the reader sequentially reading the response times of chip A and chip B within the same scan cycle and obtaining the time interval of that reading. This time interval is then subtracted from the initial reading time interval in the pre-calibrated read-only field stored in the component's cloud-based identity file. The result of the subtraction is the timing deviation value. After calculation, the reader or mobile terminal directly appends the value to the corresponding data node in the component's cloud-based identity file via the network. The entire process does not require the deployment of dedicated structural health monitoring sensors, additional signal acquisition circuits, or independent data upload channels, nor does it require any manual recording or conversion operations by operators. Since identity verification and timing deviation calculation share the same chip, the same scanning action, and the same data upload link, each routine traceability read aimed at verifying the identity of a component will synchronously and automatically generate the aforementioned timing deviation value in the component's cloud identity file, thus enabling the traceability behavior itself to have structural state perception capabilities.

[0018] Step S4: During the dismantling and recycling phase, the unique identifier of the chip is read through the mobile terminal. The ratio of the maximum historical deviation in the time-series deviation history sequence to the final residual deviation is mapped to the preset regeneration path rule to obtain the component regeneration path decision result. The regeneration path decision result is then written into the component cloud identity file.

[0019] Specifically, during the dismantling and recycling phase, a complete historical sequence of temporal deviations is retrieved from the component's cloud-based identity file. The maximum absolute value of all temporal deviations in the sequence is extracted as the maximum historical deviation, reflecting the maximum displacement magnitude experienced by the joint throughout its entire lifecycle. The absolute value of the temporal deviation corresponding to the last scan node is extracted as the final-state residual deviation, reflecting the current state of the joint before component dismantling. The reversibility index is obtained by subtracting the quotient of the final-state residual deviation and the maximum historical deviation. A reversibility index approaching 1 indicates that the joint's historical maximum displacement has been largely recovered, while an index approaching 0 indicates that the joint's residual deformation is close to its historical extreme value. Substituting the maximum historical deviation and reversibility index into the preset recycling path rules, if the maximum historical deviation does not exceed 8μs and the reversibility index is not lower than 0.85, it is determined that it can be reassembled in its original state; if the maximum historical deviation exceeds 8μs but does not exceed 20μs and the reversibility index is not lower than 0.6, it is determined that it can be downgraded and reused; if the maximum historical deviation exceeds 20μs or the reversibility index is lower than 0.6, it is determined that it is crushed and recycled. The three thresholds are determined based on the allowable displacement of precast concrete joints and the structural durability assessment specifications. The judgment results are written into the component's cloud identity file to complete the life cycle closed loop.

[0020] In one specific embodiment, step S1 includes: After the building components have been demolded and cured to reach the design strength, a chip with a unique identifier is implanted into the building component body. The antenna plane of the chip is parallel to the surface of the component, and the embedding depth is 15mm below the thickness of the concrete protective layer. Based on the unique identifier of the chip read by the fixed reader, the unique identifier is associated and bound with the production batch, component specifications and quality inspection results to obtain the component identity binding data packet; Upload the component identity binding data package to the cloud database to obtain the component cloud identity file, which uses a unique identifier as the index key value. Generate and store SHA-256 hash values ​​for the component cloud identity files. Each hash value corresponds one-to-one with the component cloud identity file. Subsequent traceability records are appended to the data nodes corresponding to the component cloud identity files using the unique identifier as the index key value.

[0021] Specifically, the geometric constraint of the chip antenna plane being parallel to the component surface is determined by the near-field inductive coupling principle of NFC signals. Electromagnetic coupling efficiency is highest when the antenna plane is parallel to the reader antenna plane; a deflection angle exceeding 30 degrees will significantly shorten the reading distance or even lead to failure. The embedment depth is set at 15mm below the concrete protective layer thickness. This value comes from the intersection of two constraints. The upper limit of the penetration depth of the NFC 13.56MHz signal in water-containing concrete is approximately 30mm to 40mm. The total depth from the component surface 15mm below the protective layer does not exceed this upper limit. Simultaneously, this depth is sufficient to completely encapsulate the chip package in concrete, preventing physical damage to the chip antenna caused by construction vibration and transportation collisions. The component identity binding data packet consists of six fields: chip unique identifier, production batch number, component cross-sectional specifications and design strength grade, measured factory compressive strength, and quality inspector employee number. These six fields are encapsulated in JSON format, and are forcibly associated with each other using the chip unique identifier as the primary key. Upload operations are rejected by the cloud if any field is missing.

[0022] The SHA-256 hash value is generated immediately after the component identity binding data packet is uploaded to the cloud database and written to the data node. The generated object is a complete JSON string of that data node. The hash value and the data node are stored in adjacent fields of the same database table, and the two are bound together by a unique identifier as a foreign key. When traceability records from various stages such as operation and maintenance, installation, etc., are appended to the same data node, the cloud recalculates the SHA-256 hash value of the appended complete data node and concatenates the new hash value with the previous hash value as the input for the next hash calculation, resulting in a chained hash structure. This structure ensures that if the traceability record of any historical node is modified, the hash value of that node and all subsequent hash values ​​become invalid. The cloud automatically performs hash chain integrity verification on each read request. If the verification fails, the data is rejected and an alarm is triggered. The unique identifier serves as an index key value throughout all data nodes, ensuring that traceability records across stages belong to the same component file and can be completely retrieved by any node's read / write device using the unique identifier as the entry point.

[0023] In one specific embodiment, step S2 includes: At the transportation and delivery points, construction site entry points, and component hoisting and placement points, the unique identifier of the chip is read by a mobile terminal or fixed reader to obtain the identity confirmation data of the current point. The current node identity verification data is associated and bound with the current node type, UTC timestamp, and operator employee number to obtain the node traceability data packet; The node traceability data packet is appended to the data node corresponding to the component cloud identity file with a unique identifier as the index key value to obtain the traceability record of each stage; SHA-256 hash values ​​are generated for each stage of the traceability record and linked with the existing hash values ​​in the component cloud identity file. The linked storage uses the previous hash value as the input for calculating the current hash value, so that the traceability record of each stage obtains an immutable sequential hash chain.

[0024] Specifically, the current node identity confirmation data refers to the complete response data packet returned by the mobile terminal or fixed reader from the chip during a single read operation. This data packet includes a unique chip identifier field and a read success status flag. Subsequent data binding operations can only be triggered when the read success status flag is 1; otherwise, the terminal prompts for a reread. The node type field is limited to three enumerated values: transported from the factory, arriving at the construction site, and component hoisting into place. These three enumerated values ​​correspond one-to-one with three key time points when a building component undergoes a physical location change. Operation nodes with values ​​other than these are not written to this field. The UTC timestamp precision is set to 100ms, which is sufficient to distinguish the operation sequence of different components under continuous operation at the same construction site. The operator's employee number corresponds one-to-one with the personnel file in the construction project management system. The employee number field is verified by the cloud before being written; employee numbers not in the project personnel list are rejected from being written. The node traceability data packet is encapsulated in JSON format. The fields include a unique identifier, a node type enumeration value, a UTC timestamp, and the operator's employee number. All four fields are required. If any field is empty, the cloud will refuse to write the operation.

[0025] After each stage of traceability record is written to the corresponding data node in the component's cloud identity profile, the cloud calculates the SHA-256 hash value of the current complete content of that data node. The input for calculation is the JSON serialized string of all fields of that data node. The specific implementation of chained storage involves concatenating the currently calculated hash value with the previously stored hash value in that data node in a fixed order into a single string. Then, the SHA-256 hash value is calculated on the concatenated string to obtain the chained hash value. This chained hash value replaces the hash field in the data node to complete the current storage. When a traceability record is written next time, the above process is repeated using the current chained hash value as the previous hash value, thus obtaining a sequential hash chain. If the content of any historical traceability record is tampered with, the recalculated chained hash value of that node will be inconsistent with the stored value. The cloud automatically performs a full-chain hash verification with each data read request. If the verification fails, the data is rejected, and a tampering alarm is pushed to the management terminal. The alarm content includes the data node number that failed the verification and its corresponding unique identifier.

[0026] In one specific embodiment, step S3 involves implanting chip A and chip B on both sides of the structural joint of the building component, respectively, including: During the building component production stage, chip A is implanted into the component body on the left side of the structural joint, and chip B is implanted into the component body on the right side of the structural joint. The horizontal distance between chip A and the center line of the joint is 50mm, and the horizontal distance between chip B and the center line of the joint is 50mm. The antenna planes of chip A and chip B are parallel to the surface of the component, and the embedment depth is 15mm below the thickness of the concrete protective layer. After the building components have been demolded and cured to reach the design strength, the fixed reader performs an initial scan at the joint area at a standard reading distance of 80mm. Within the same scanning cycle with a frame duration of 10ms, the reader sequentially reads the reading time of chip A and the reading time of chip B based on the ISO / IEC 14443-3 anti-collision protocol. The difference between the reading time of chip A and the reading time of chip B is used to obtain the initial reading time interval. By associating and binding the unique identifier of chip A, the unique identifier of chip B, the initial reading time interval, and the ambient temperature during calibration, a seam timing health fingerprint is obtained. Write the seam timing health fingerprint into the data node corresponding to the component cloud identity file, and mark the initial reading time interval as a read-only field in the component cloud identity file.

[0027] Specifically, the horizontal distance between chip A and chip B and the center line of the joint is set to 50mm. This value is based on a balance of two constraints: if the distance is too small, the signal path difference between the two chips within the coverage area of ​​the reader antenna will be too small. When the joint shifts by millimeters, the change in the reading time difference between the two chips will be lower than the reader clock resolution, resulting in timing deviations that cannot be effectively detected. If the distance is too large, the chip may exceed the effective sensing range boundary of the reader antenna at the standard reading distance, causing chip B to fail to activate. The 50mm value ensures that the path length difference between the two chips changes by approximately 0.27mm when the joint shifts by 1mm. This change provides a statistically significant time difference offset in the anti-collision protocol time slot structure. The standard reading distance is set to 80mm, which is within the upper limit of the reliable reading range of the 13.56MHz NFC chip in concrete. This ensures that the reader antenna can simultaneously cover chips A and B at 50mm positions on both sides of the joint, while also allowing the reader to operate without being in close contact with the component surface. The frame duration is set to 10ms, which is the lower limit of the standard frame duration specified by the ISO / IEC 14443-3 protocol. Within this frame duration, the number of anti-collision time slots is sufficient to accommodate the sequential response of two chips, and the clock precision corresponding to the 10ms frame duration allows the time difference between adjacent time slots to reach the microsecond level resolution.

[0028] The ISO / IEC 14443-3 anti-collision protocol works by having the reader send request commands to all chips within its sensing range during a single scan cycle. Each chip responds sequentially in its assigned time slot, and the reader records the response time of each chip. Because chip A and chip B have different path lengths from the reader's antenna, the timing of when the two chips receive sufficient activation power differs. The difference between chip A's response time t_A and chip B's response time t_B is the initial reading time interval. This difference reflects the geometric positional relationship of the two chips when the seam is in its initial design state. The seam timing health fingerprint consists of four fields: a unique identifier for chip A, a unique identifier for chip B, the initial reading time interval, and the ambient temperature during calibration. The ambient temperature field is included because the electromagnetic properties of concrete change with temperature; temperature differences cause slight changes in signal propagation speed. This field serves as a reference for temperature compensation calculations during the maintenance phase. The initial read interval is marked as a read-only field after being written to the component's cloud identity file. The cloud uses field permission control to reject any write or modification requests, ensuring that this baseline value remains unique and immutable throughout its entire lifecycle.

[0029] In one specific embodiment, in step S3, the reader sequentially reads chip A and chip B within the same scan cycle to obtain the current reading time interval, including: During the operation and maintenance phase, at each scanning node, the reader reads chip A and chip B sequentially within the same scanning cycle with a frame duration of 10ms, based on the ISO / IEC14443-3 anti-collision protocol. A single scan is performed 5 times consecutively to obtain 5 single reading time intervals. The arithmetic mean of the five single read intervals is taken to obtain the current read interval; The timing deviation is obtained by subtracting the current reading time interval from the initial reading time interval in the seam timing health fingerprint. The current node type, UTC timestamp, and timing deviation are appended to the data node corresponding to the seam timing health fingerprint in the component's cloud identity file to obtain the historical sequence of timing deviation.

[0030] Specifically, the setting of five consecutive repeated reads stems from a balance between two constraints. Low-frequency electromagnetic interference exists at the maintenance site, such as personnel movement and construction machinery operation. The time interval obtained from a single read may deviate from the true value due to interference. If the number of repetitions is too small, the arithmetic mean cannot effectively suppress occasional interference; if the number of repetitions is too large, the time consumed per scan increases, leading to a decrease in the efficiency of on-site traceability operations. Five repeated reads achieve a balance between suppressing occasional interference and controlling scan time. Before taking the arithmetic mean of the five single read time intervals, the five values ​​are arranged in ascending order. If the difference between the maximum and minimum values ​​exceeds 3μs, the maximum and minimum values ​​are discarded, and the arithmetic mean of the remaining three values ​​is taken. This discarding rule is used to eliminate extreme read deviations caused by occasional strong interference. The 3μs discarding threshold is determined based on the reader clock resolution and the time interval fluctuation range under normal scanning conditions. Timing deviation is defined as the current read time interval minus the initial read time interval recorded in the read-only field of the seam timing health fingerprint. A positive value indicates that the path difference between chip B and chip A increases, corresponding to the displacement in the seam opening direction. A negative value indicates that the path difference decreases, corresponding to the displacement in the seam closing direction. The absolute value is positively correlated with the amount of seam displacement.

[0031] The time-series deviation history sequence refers to an ordered set of all time-series deviation records appended in ascending order of UTC timestamp, using the data nodes corresponding to the seam time-series health fingerprints as storage units. Each record contains three fields: node type enumeration value, UTC timestamp, and time-series deviation. These three fields are encapsulated in JSON format and appended. The write operation is triggered by a mobile terminal or fixed reader via 4G / 5G network after the reader completes the current scan and calculates the time-series deviation. When the network is unavailable, the record is cached in the terminal's local storage. After the network is restored, it is automatically uploaded and inserted into the sequence in UTC timestamp order. After each record in the time-series deviation history sequence is written, the cloud recalculates the SHA-256 chain hash value for that data node. The input for calculating the chain hash value is the concatenation result of the JSON string of the currently appended record and the chain hash value of the previous record. This mechanism is consistent with the hash chain in the production stage, ensuring that the time-series deviation records of each scan in the operation and maintenance stage are also tamper-proof. During the operation and maintenance phase, the node type field takes three enumeration values: regular inspection, disaster trigger, or special review. Different trigger types correspond to different scanning frequency requirements. Regular inspection is performed once every 6 months, and disaster trigger is performed within 72 hours after an earthquake of level 4 or above or a strong wind event exceeding the design wind pressure by 30%.

[0032] In one specific embodiment, in step S3, the timing deviation is appended to the component's cloud identity file to obtain the timing deviation history sequence, including: Based on the historical sequence of time deviation, the regression slope is obtained by linearly fitting the time deviation corresponding to each scan node in the historical sequence of time deviation using the least squares method. The abrupt change is obtained by subtracting two consecutive time series deviations in the time series deviation history sequence; When the regression slope exceeds 0.5 μs / time and the time deviation is higher than the previous corresponding value for 3 consecutive times, the corresponding joint will be marked as continuously deteriorated in the component cloud identity file; when the absolute value of the mutation exceeds 5 μs, the corresponding scan node will be marked as a sudden event node in the component cloud identity file. Based on the current time-series deviation of each joint on the entire floor, a spatial weight matrix is ​​constructed with adjacent joints having a spatial weight of 1 and non-adjacent joints having a spatial weight of 0. The spatial correlation index is calculated between the spatial weight matrix and the time-series deviation of each joint. When the spatial correlation index exceeds 0.3, the center coordinates and influence radius of the damage concentration area are written into the component's cloud identity file to obtain a joint damage location report.

[0033] Specifically, the calculation process of the least squares linear fitting is as follows: the scan number of each record in the historical sequence of time deviation is used as the horizontal axis variable and the corresponding time deviation value is used as the vertical axis variable. Assume that there are k records in the sequence, the scan number is taken from 1 to k in sequence, and the time deviation is taken from ΔT1 to ΔT in sequence. k The regression slope is calculated as follows: the sum of the products of scan sequence number and time deviation for k records minus the product of the sum of scan sequence number and time deviation divided by k, then divided by the sum of the squares of scan sequence numbers minus the square of the sum of scan sequence numbers divided by k. The resulting quotient is the regression slope, expressed in μs / s. This value reflects the average growth rate of time deviation with the number of scans. The regression slope threshold is set at 0.5 μs / s, corresponding to an average displacement increment of approximately 0.19 mm between two consecutive periodic inspections (6 months). This is lower than the lower limit of the allowable displacement increment for precast concrete joints. Exceeding this threshold indicates a measurable and continuous expansion trend in the joint. The criterion of three consecutive time deviations exceeding the previous one is used in conjunction with the regression slope threshold. Both conditions must be met simultaneously to trigger a continuous deterioration flag; meeting either condition alone will not trigger it. This dual-judgment mechanism eliminates the possibility of short-term fluctuations caused by occasional environmental factors being misjudged as structural deterioration. The threshold for mutation is set to 5 μs, which corresponds to a sudden displacement of about 1.88 mm between two adjacent scans. This displacement magnitude is consistent with the lower limit of the typical impact displacement range of precast component joints caused by disasters such as earthquakes and strong winds. When the threshold is exceeded, the corresponding scan node is marked as a sudden event node and the event occurrence time window is recorded.

[0034] The spatial correlation index is calculated using the spatial Moran index algorithm. The calculation process involves taking the current temporal deviation of all M seams on the entire floor, calculating the mean of the M temporal deviations, subtracting the mean from the temporal deviation of each seam to obtain the deviation from the mean, constructing an M×M spatial weight matrix with adjacent seams having a spatial weight of 1 and non-adjacent seams having a spatial weight of 0, and denoting the sum of all weight values ​​in the spatial weight matrix as W. The spatial correlation index is calculated by multiplying the quotient of M and W by the sum of the products of the deviations from the mean of all adjacent seam pairs, and then dividing by the sum of the squares of the deviations from the mean of all seams. The resulting value ranges from -1 to +1, with positive values ​​indicating concentrated spatial distribution of damage and negative values ​​indicating dispersed spatial distribution of damage. The threshold is set to 0.3, which corresponds to a moderate degree of positive spatial autocorrelation; values ​​exceeding this threshold are sufficient to support area localization due to the concentration of damage. The calculation method for the center coordinates of the damage concentration area is as follows: for all joints with a time deviation exceeding 8μs, the absolute value of the time deviation of each joint is used as the weight, and the coordinates of each joint in the floor plane coordinate system are used as the weighting object. The weighted average coordinate is the center coordinate. The influence radius is the maximum value of the distance from the coordinates of all weighted joints to the center coordinate. The center coordinate and the influence radius are written together into the joint damage location report field.

[0035] Figure 2 This is a schematic diagram illustrating the continuous deterioration state of the joint and the determination result of the sudden event node in the embodiments of this application. Figure 2 The left-hand bar chart shows the regression slope calculation results for the six joints. The regression slopes of joints 1, 3, and 5 are 0.52 μs / time, 0.61 μs / time, and 0.55 μs / time, respectively, all exceeding the threshold of 0.5 μs / time. Combined with the judgment condition that the timing deviation is higher than the previous time for three consecutive times, these three joints are marked as continuously deteriorating. The regression slopes of joints 2, 4, and 6 are all below the threshold and are judged to be within the normal range. The right-hand bar chart shows the absolute value of the abrupt change in the timing deviation between two adjacent times for the six joints. The abrupt changes for joints 3 and 5 are 6.8 μs and 5.9 μs, respectively, exceeding the 5 μs threshold. The corresponding scan nodes are marked as sudden event nodes and recorded in the component cloud identity file. The abrupt changes for the remaining joints are all below the threshold and have not triggered the marking.

[0036] In one specific embodiment, step S4 includes: Before the demolition work, based on the unique identifier of the chip read by the mobile terminal, the complete historical sequence of the corresponding joint is retrieved from the cloud identity file of the component. The absolute value of all the time deviations in the historical sequence is taken and the maximum value is extracted to obtain the maximum historical deviation. The absolute value of the time deviation corresponding to the last scan node in the historical sequence is extracted to obtain the final state residual deviation. The reversibility index is obtained by dividing the final residual deviation by the maximum historical deviation and subtracting the quotient from 1. Based on the maximum historical deviation and the reversibility index, a mapping judgment is made according to the preset recycling path rules: when the maximum historical deviation does not exceed 8μs and the reversibility index is not lower than 0.85, a decision result of reassembly as is obtained; when the maximum historical deviation exceeds 8μs but does not exceed 20μs and the reversibility index is not lower than 0.6, a decision result of downgradability and reuse is obtained; when the maximum historical deviation exceeds 20μs or the reversibility index is lower than 0.6, a decision result of crushing and recycling is obtained. The three types of judgment results together constitute the component recycling path decision result. Write the component regeneration path decision result into the component cloud identity file with a unique identifier as the index key value, and update the corresponding component's life cycle status field from "removed" to "removed" in the component cloud identity file, and record the removal timestamp.

[0037] Specifically, the reversibility index reflects the degree of recovery between the maximum historical displacement and the current residual displacement of the joint throughout its entire life cycle. It is calculated by dividing the final residual deviation by the maximum historical deviation to obtain the residual ratio, and then subtracting the residual ratio from 1 to obtain the reversibility index, with a value ranging from 0 to 1. When the maximum historical deviation is 0, the reversibility index is directly set to 1, indicating that the joint has not experienced any measurable displacement throughout its entire life cycle. The maximum historical deviation threshold of 8 μs corresponds to a maximum displacement of approximately 3 mm experienced by the joint throughout its entire life cycle. This value is the typical upper limit of the allowable deformation of precast concrete component joints; not exceeding this value indicates that the joint has never exceeded the design range. 20 μs corresponds to a maximum displacement of approximately 7.5 mm; exceeding this value indicates that the joint has undergone significant deformation exceeding the structural safety margin, and there is a risk of irreversible damage to the load-bearing capacity of the component. The reversibility index threshold of 0.85 corresponds to a final residual deviation not exceeding 15% of the maximum historical deviation, indicating that the historical deformation of the joint has been basically recovered, the structural geometry is highly close to the factory condition, and it is determined that it can be reassembled as is. A threshold of 0.6 corresponds to a final residual deviation not exceeding 40% of the maximum historical deviation, indicating that the joint has a moderate degree of residual deformation but has not completely lost its reuse value, and is therefore judged as reusable after downgrading. When the threshold is below 0.6 or the maximum historical deviation exceeds 20μs, the residual deformation of the joint is too large or the historical extreme value is too high, and the structural integrity of the component cannot meet the minimum requirements for reassembly or downgrading, and is judged as broken and recycled.

[0038] When the three types of regeneration path decision results are written to the component's cloud identity file, the corresponding data node is located using a unique identifier as the index key. The decision result field takes three enumerated values: can be reassembled as is, can be downgraded and reused, and can be crushed and recycled. After being written, this field is marked as read-only and cannot be overwritten by any subsequent operations, ensuring the uniqueness and immutability of the regeneration path determination results. The complete enumerated values ​​of the life cycle status field include five categories: in production, in transportation, in installation, in operation and maintenance, and dismantled. Each stage of traceability operation triggers the sequential update of the corresponding enumerated values. Field values ​​can only be updated unidirectionally in enumeration order and cannot be rolled back to previous states. The dismantling timestamp accuracy is set to second-level UTC time, consistent with the dismantling operation record time accuracy of the construction management system. After the timestamp is written, the cloud recalculates the SHA-256 chain hash value of the data node containing the decision result and the timestamp and appends it to the hash chain, so that all operation records in the dismantling stage are included in an immutable hash chain structure consistent with the production, transportation, and operation and maintenance stages. At this point, the component's cloud identity file completes the closed-loop record of the entire life cycle from production to dismantling.

[0039] Figure 3 This is a schematic diagram showing the distribution of component regeneration path decision results in the embodiments of this application. Figure 3 Using the maximum historical deviation as the x-axis and the reversibility index as the y-axis, the classification and distribution of 80 simulated joint data points under the dual-threshold judgment rule are displayed. The vertical dashed line corresponds to the maximum historical deviation thresholds of 8μs and 20μs, and the horizontal dotted line corresponds to the reversibility index thresholds of 0.85 and 0.6. The three types of decision results are distinguished by circles, squares, and triangles, respectively. Joints with a maximum historical deviation of no more than 8μs and a reversibility index of no less than 0.85 are concentrated in the upper left area and are judged to be reassembled as is. Joints with a maximum historical deviation between 8μs and 20μs and a reversibility index of no less than 0.6 are distributed in the middle area and are judged to be downgraded and reused. Joints with a maximum historical deviation of more than 20μs or a reversibility index of less than 0.6 are distributed in the right and lower areas and are judged to be crushed and recycled. The boundaries of the three types of areas are clear and correspond one-to-one with the mapping relationship of the preset regeneration path rule.

[0040] The above describes the method for tracing the entire lifecycle information of building components based on chip implantation in the embodiments of this application. The following describes the system for tracing the entire lifecycle information of building components based on chip implantation in the embodiments of this application. One embodiment of the system for tracing the entire lifecycle information of building components based on chip implantation in the embodiments of this application includes: The reading module is used to implant a chip with a unique identifier as a recording carrier into the building component body during the building component production stage. The unique identifier of the chip is read by a fixed reader, and the production batch, component specifications and quality inspection results are written into the cloud database to obtain the component's cloud identity file. The traceability module is used to read the unique identifier of the chip at each stage of transportation and installation through a mobile terminal or fixed reader, and append the current node type, timestamp and operation information to the component's cloud identity file to obtain traceability records for each stage. The analysis module is used to implant chip A and chip B on both sides of the structural joint of the building component during the operation and maintenance phase. The reader reads chip A and chip B sequentially in the same scanning cycle to obtain the current reading time interval. The difference between the current reading time interval and the initial reading time interval calibrated at the factory is used to obtain the timing deviation. The timing deviation is appended to the cloud identity file of the component to obtain the timing deviation history sequence. The decision module is used to read the unique identifier of the chip through a mobile terminal during the dismantling and recycling phase, map the ratio of the maximum historical deviation in the time-series deviation history sequence to the final residual deviation to a preset regeneration path rule, obtain the component regeneration path decision result, and write the regeneration path decision result into the component cloud identity file.

[0041] This invention also provides a chip-embedded building component lifecycle information traceability device, which can be a server. The chip-embedded building component lifecycle information traceability device includes a processor, memory, display screen, input device, network interface, and database connected via a system bus. The processor, designed as a computer, provides computing and control capabilities. The memory of the chip-embedded building component lifecycle information traceability device includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database of the chip-embedded building component lifecycle information traceability device stores the data corresponding to this embodiment. The network interface of the chip-embedded building component lifecycle information traceability device is used to communicate with external terminals via a network connection. When the computer program is executed by the processor, it implements the above-described method.

[0042] The present invention also provides a computer-readable storage medium, which can be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium, wherein the computer-readable storage medium stores instructions that, when the instructions are executed on a computer, cause the computer to perform the steps of the chip-embedded building component full life cycle information traceability method.

[0043] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0044] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a chip-embedded building component lifecycle information traceability device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0045] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for tracing the entire lifecycle information of building components based on chip implantation, characterized in that, The method includes: Step S1: During the building component production stage, a chip with a unique identifier is implanted into the building component body as a recording carrier. The unique identifier of the chip is read by a fixed reader, and the production batch, component specifications and quality inspection results are written into the cloud database to obtain the component's cloud identity file. Step S2: At each stage of transportation and installation, the unique identifier of the chip is read through a mobile terminal or a fixed reader, and the current node type, timestamp and operation information are appended to the component's cloud identity file to obtain traceability records for each stage. Step S3: During the operation and maintenance phase, chip A and chip B are implanted on both sides of the structural joint of the building component. The reader reads chip A and chip B sequentially in the same scanning cycle to obtain the current reading time interval. The difference between the current reading time interval and the initial reading time interval calibrated at the factory is used to obtain the timing deviation. The timing deviation is added to the cloud identity file of the component to obtain the timing deviation history sequence. Step S4: During the dismantling and recycling phase, the unique identifier of the chip is read through the mobile terminal, and the ratio of the maximum historical deviation in the time deviation history sequence to the final state residual deviation is mapped to the preset regeneration path rule to obtain the component regeneration path decision result, and the regeneration path decision result is written into the component cloud identity file.

2. The method for tracing the entire lifecycle information of building components based on chip implantation according to claim 1, characterized in that, Step S1 includes: After the building component has been demolded and cured to reach the design strength, a chip with a unique identifier is implanted into the building component body. The antenna plane of the chip is parallel to the surface of the component, and the embedment depth is 15mm below the thickness of the concrete protective layer. Based on the unique identifier of the chip read by the fixed reader, the unique identifier is associated and bound with the production batch, component specifications and quality inspection results to obtain the component identity binding data packet; The component identity binding data packet is uploaded to the cloud database to obtain the component cloud identity file, which uses the unique identifier as the index key value. A SHA-256 hash value is generated and stored for the component cloud identity file. The hash value corresponds one-to-one with the component cloud identity file. Subsequent traceability records are appended to the data node corresponding to the component cloud identity file with the unique identifier as the index key value.

3. The method for tracing the entire lifecycle information of building components based on chip implantation according to claim 1, characterized in that, Step S2 includes: At the transportation and delivery points, construction site entry points, and component hoisting and positioning points, the unique identifier of the chip is read using a mobile terminal or fixed reader to obtain the current node identity confirmation data. The current node identity verification data is associated and bound with the current node type, UTC timestamp, and operator employee number to obtain the node traceability data packet; The node traceability data packet is appended to the data node corresponding to the component cloud identity file with the unique identifier as the index key value to obtain traceability records for each stage. SHA-256 hash values ​​are generated for the traceability records of each stage and linked with existing hash values ​​in the component's cloud identity file for storage. The linked storage uses the previous hash value as the calculation input for the current hash value, so that the traceability records of each stage obtain an immutable sequential hash chain.

4. The method for tracing the entire lifecycle information of building components based on chip implantation according to claim 1, characterized in that, In step S3, chip A and chip B are respectively implanted on both sides of the structural joint of the building component, including: During the building component production stage, chip A is implanted into the component body on the left side of the structural joint, and chip B is implanted into the component body on the right side of the structural joint. The horizontal distance between chip A and the center line of the joint is 50mm, and the horizontal distance between chip B and the center line of the joint is 50mm. The antenna planes of chip A and chip B are parallel to the surface of the component, and the embedment depth is 15mm below the thickness of the concrete protective layer. After the building components have been demolded and cured to reach the design strength, the fixed reader performs an initial scan of the joint area at a standard reading distance of 80mm. Within the same scanning cycle with a frame duration of 10ms, the reader sequentially reads the reading time of chip A and the reading time of chip B based on the ISO / IEC 14443-3 anti-collision protocol. The difference between the reading time of chip A and the reading time of chip B is used to obtain the initial reading time interval. The unique identifier of chip A, the unique identifier of chip B, the initial reading time interval, and the ambient temperature during calibration are associated and bound to obtain the seam timing health fingerprint. The seam timing health fingerprint is written into the data node corresponding to the component cloud identity file, and the initial reading time interval is marked as a read-only field in the component cloud identity file.

5. The method for tracing the entire lifecycle information of building components based on chip implantation according to claim 4, characterized in that, In step S3, the reader sequentially reads chip A and chip B within the same scan cycle to obtain the current reading time interval, including: During the operation and maintenance phase, at each scanning node, the reader reads chip A and chip B sequentially within the same scanning cycle with a frame duration of 10ms, based on the ISO / IEC14443-3 anti-collision protocol. A single scan is performed 5 times consecutively to obtain 5 single reading time intervals. The arithmetic mean of the five single reading time intervals is taken to obtain the current reading time interval. The timing deviation is obtained by subtracting the current reading time interval from the initial reading time interval in the seam timing health fingerprint. The current node type, UTC timestamp, and the time sequence deviation are appended to the data node corresponding to the seam time sequence health fingerprint in the component cloud identity file to obtain the time sequence deviation historical sequence.

6. The method for tracing the entire lifecycle information of building components based on chip implantation according to claim 5, characterized in that, In step S3, the timing deviation is appended to the component's cloud identity file to obtain a historical sequence of timing deviations, including: Based on the historical sequence of time deviation, the regression slope is obtained by linearly fitting the time deviation corresponding to each scan node in the historical sequence of time deviation using the least squares method. The abrupt change is obtained by subtracting two consecutive time deviations in the time deviation history sequence. When the regression slope exceeds 0.5 μs / time and the time deviation is higher than the previous corresponding value for 3 consecutive times, the corresponding joint is marked as a continuously deteriorated state in the component cloud identity file; when the absolute value of the mutation exceeds 5 μs, the corresponding scan node is marked as a sudden event node in the component cloud identity file. Based on the current time-series deviation of each joint on the entire floor, a spatial weight matrix is ​​constructed with adjacent joints having a spatial weight of 1 and non-adjacent joints having a spatial weight of 0. A spatial correlation index is calculated between the spatial weight matrix and the time-series deviation of each joint. When the spatial correlation index exceeds 0.3, the center coordinates and influence radius of the damage concentration area are written into the component's cloud identity file to obtain a joint damage location report.

7. The method for tracing the entire lifecycle information of building components based on chip implantation according to claim 1, characterized in that, Step S4 includes: Before the demolition work, the unique identifier of the chip is read by the mobile terminal, and the complete historical sequence of the corresponding joint is retrieved from the cloud identity file of the component. The absolute value of all the time deviations in the historical sequence is taken and the maximum value is extracted to obtain the maximum historical deviation. The absolute value of the time deviation corresponding to the last scan node in the historical sequence is extracted to obtain the final state residual deviation. The reversibility index is obtained by dividing the final state residual deviation by the maximum historical deviation and subtracting the quotient from 1. Based on the maximum historical deviation and the reversibility index, a mapping judgment is made according to a preset regeneration path rule: when the maximum historical deviation does not exceed 8 μs and the reversibility index is not lower than 0.85, a decision result of reassembly as is obtained; when the maximum historical deviation exceeds 8 μs but does not exceed 20 μs and the reversibility index is not lower than 0.6, a decision result of downgradability and reuse is obtained; when the maximum historical deviation exceeds 20 μs or the reversibility index is lower than 0.6, a decision result of crushing and recycling is obtained. The three types of judgment results together constitute the component regeneration path decision result. The component regeneration path decision result is written into the component cloud identity file using the unique identifier as the index key value, and the life cycle status field of the corresponding component in the component cloud identity file is updated from "in operation and maintenance" to "removed", and the removal timestamp is recorded.

8. A chip-embedded building component full lifecycle information traceability system, characterized in that, For implementing the chip-embedded building component lifecycle information traceability method as described in any one of claims 1-7, the chip-embedded building component lifecycle information traceability system comprises: The reading module is used to implant a chip with a unique identifier as a recording carrier into the building component body during the building component production stage. The unique identifier of the chip is read by a fixed reader, and the production batch, component specifications and quality inspection results are written into the cloud database to obtain the component's cloud identity file. The traceability module is used to read the unique identifier of the chip at each stage of transportation and installation through a mobile terminal or fixed reader, and append the current node type, timestamp and operation information to the component's cloud identity file to obtain traceability records for each stage. The analysis module is used to implant chip A and chip B on both sides of the structural joint of the building component during the operation and maintenance phase. The reader reads chip A and chip B sequentially in the same scanning cycle to obtain the current reading time interval. The difference between the current reading time interval and the initial reading time interval calibrated at the factory is used to obtain the timing deviation. The timing deviation is appended to the cloud identity file of the component to obtain the timing deviation history sequence. The decision module is used to read the unique identifier of the chip through a mobile terminal during the dismantling and recycling phase, map the ratio of the maximum historical deviation in the time-series deviation history sequence to the final residual deviation to a preset regeneration path rule, obtain the component regeneration path decision result, and write the regeneration path decision result into the component cloud identity file.

9. A device for tracing the entire lifecycle information of building components based on chip implantation, characterized in that, The method includes a memory and a processor, wherein the memory stores a computer program that can run on the processor, and the processor executes the computer program to implement the chip-embedded building component full life cycle information traceability method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is run by the processor, it causes the processor to execute the chip-embedded building component full life cycle information traceability method as described in any one of claims 1 to 7.

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