Display module and vehicle-mounted display

Abstract

This invention discloses a display module and an automotive display. The display module includes a glass substrate and a glass panel stacked sequentially. The glass substrate is at least partially exposed outside the glass panel, forming a first edge. A chip and a connecting plate are disposed on the upper surface of the glass substrate at the first edge, with the connecting plate extending outside the glass substrate. A graphite heat dissipation layer is disposed on the lower surface of the glass substrate at the first edge, extending outside the glass substrate and adhering to the lower surface of the connecting plate. By exposing at least part of the glass substrate outside the glass panel to form the first edge, a stepped structure with interlayer misalignment is formed, which helps to alleviate edge stress concentration caused by mismatch in thermal expansion coefficients and improves structural reliability. At the same time, placing the chip, connecting plate, and graphite heat dissipation layer at the first edge can prevent heat from being trapped in the chip and avoids forming stronger rigid constraints at the edge, thus avoiding exacerbating stress concentration, thereby improving the reliability and heat dissipation capacity of the display.

Description

Technical Field

[0001] This invention relates to the field of display structure technology, and in particular to a display module and an in-vehicle display. Background Technology

[0002] With the development of intelligent and information technology, displays are increasingly widely used in the automotive field, such as in central control displays, instrument panels, and passenger entertainment systems. Compared with consumer electronics, automotive displays, which use high-end glass substrates such as sixth-generation glass substrates, face more complex and demanding operating conditions, including a wider temperature range, continuous vibration and shock, and long-term high-load operation. Therefore, automotive displays not only need to have good display performance, but also high heat dissipation capacity and structural reliability to prevent damage to the glass substrate.

[0003] Currently, existing automotive displays still have certain limitations in structural design. On the one hand, those skilled in the art typically employ a stacked design with edges aligned for each layer, creating a relatively rigid overall structure at the edges of the multi-layered stacked structure. However, this multi-layered stacked structure is a display structure composed of multiple layers of different materials. Due to the differences in thermal expansion coefficients between these materials, significant stress concentrations can easily occur at the edges and connection areas under temperature changes or mechanical loads. This can lead to problems such as edge chipping, interface peeling, or fatigue failure of the substrate, especially the glass substrate, resulting in insufficient structural reliability. On the other hand, to improve the heat dissipation problem of chips in automotive displays, it is usually necessary to set up thermally conductive structures (such as metal sheets) in the module to enhance heat dissipation performance. However, in actual design, increasing the coverage area or thickness of the metal sheet can improve heat dissipation efficiency, but it will introduce additional metal layers in local areas, thereby changing the stiffness distribution of the original structure, further aggravating stress concentration, and affecting the reliability of the device.

[0004] Therefore, in the automotive application environment, in-vehicle displays need to improve structural reliability to adapt to temperature changes or mechanical loads, while also meeting heat dissipation requirements. It is evident that existing displays cannot simultaneously meet the structural reliability and heat dissipation requirements in the automotive environment. Summary of the Invention

[0005] The purpose of this invention is to provide a display module and an in-vehicle display, which solves the technical problem that existing displays are unable to simultaneously improve structural reliability and heat dissipation in an in-vehicle environment.

[0006] To achieve this objective, the present invention adopts the following technical solution: A display module includes a glass substrate and a glass panel stacked sequentially. The glass substrate is at least partially exposed outside the glass panel to form a first edge. The glass substrate has a chip and a connecting plate disposed on the upper surface of the glass panel at the first edge. The connecting plate extends outside the glass substrate. A graphite heat dissipation layer is provided on the lower surface of the glass substrate at the first edge. The graphite heat dissipation layer extends to the outside of the glass substrate and is attached to the lower surface of the connecting plate.

[0007] Optionally, the graphite heat dissipation layer includes a first graphite portion and a second graphite portion connected together. The forward projections of the portion of the chip and the connecting plate that does not extend beyond the glass substrate are both superimposed on the first graphite portion, and the forward projections of the second graphite portion are both superimposed on the portion of the connecting plate that extends beyond the glass substrate.

[0008] Optionally, along the extending direction of the first edge, the width of the first graphite portion is greater than the width of the second graphite portion.

[0009] Optionally, the graphite heat dissipation layer is a single-layer structure.

[0010] Optionally, the graphite heat dissipation layer has a multi-layer structure.

[0011] Optionally, the graphite heat dissipation layer includes an insulating layer and a graphite layer group stacked sequentially in a direction away from the connecting plate. The graphite layer group includes at least two single graphite layers. An embedding structure is provided on the insulating layer, and the graphite layer group forms an embedding groove for the embedding structure to be inserted.

[0012] Optionally, the embedding structure includes a first embedding portion overlapping the first graphite portion and a second embedding portion overlapping the second graphite portion; the first embedding portion is connected to the second embedding portion, and along the extending direction of the first edge, the width of the first embedding portion is greater than the width of the second graphite portion and less than the width of the first graphite portion.

[0013] Optionally, the embedding structure includes a first embedding side edge and a second embedding side edge. The first embedding side edge is fitted to one wall of the embedding groove and extends from the first embedding portion to the second embedding portion. The second embedding side edge is fitted to the other wall of the embedding groove and extends from the first embedding portion to the second embedding portion. The distance between the first embedded side edge and the second embedded side edge decreases along the extension direction of the connecting plate.

[0014] Optionally, an upper polarizer is stacked on the upper surface of the glass panel, and the glass panel is at least partially exposed outside the upper polarizer to form a third edge; a lower polarizer is stacked on the lower surface of the glass substrate at a position corresponding to the upper polarizer, and the size of the lower polarizer is the same as that of the upper polarizer.

[0015] An in-vehicle display, comprising the display module as described above.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The display module and vehicle display provided by the present invention, on the one hand, form a first edge by exposing at least part of the glass substrate outside the glass panel, thereby forming a stepped structure with interlayer misalignment. This helps to alleviate edge stress concentration caused by mismatch in thermal expansion coefficients and reduces the risk of edge chipping, crack initiation and interface peeling of the glass substrate, especially at the exposed edge. On the other hand, by placing the chip and connector plate at the first edge, and providing a graphite heat dissipation layer on the lower surface of the glass substrate at the first edge, a vertical correspondence is formed between the chip and connector plate located on the upper surface of the glass substrate. This allows the heat generated by the chip to be transferred through the thickness of the glass substrate to the graphite heat dissipation layer, and then rapidly transferred along the graphite layer by utilizing the high in-plane thermal conductivity of graphite, thus preventing heat from being trapped on the chip. Simultaneously, the graphite heat dissipation layer itself does not create stronger rigid constraints at the edge, and extends further beyond the glass substrate. This allows heat from inside the module to not only diffuse below the substrate but also continue to be dissipated outwards along the extended portion. This effectively alleviates the heat accumulation phenomenon of the chip under the high temperature and high load conditions of automotive applications, reducing the risk of material aging, interface fatigue, and connection failure due to excessive local temperature rise. In summary, this invention enables the display to possess high structural reliability and heat dissipation capabilities in automotive environments. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0019] Figure 1 This is a schematic diagram of the overall structure of the display module provided in an embodiment of the present invention; Figure 2 This is a partial structural diagram of a display module provided in an embodiment of the present invention; Figure 3 This is a partial side view of the display module provided in an embodiment of the present invention; Figure 4 for Figure 3 A magnified schematic diagram of the structure at point A; Figure 5 This is a partial front view schematic diagram of the display module provided in an embodiment of the present invention; Figure 6 This is a front view schematic diagram of the graphite heat dissipation layer in an embodiment of the present invention; Figure 7 This is a schematic diagram of the overall structure of the graphite heat dissipation layer in an embodiment of the present invention; Figure 8 This is an exploded structural diagram of the graphite heat dissipation layer in an embodiment of the present invention; Figure 9 This is a schematic cross-sectional view of the graphite heat dissipation layer in an embodiment of the present invention. Illustrations: 100, Glass substrate; 101, First edge; 102, Second edge; 200, Glass panel; 201, Third edge; 300, Chip; 400, Connecting plate; 500, Graphite heat dissipation layer; 510, First graphite portion; 520, Second graphite portion; 501, Insulating layer; 5021, First graphite layer; 5022, Second graphite layer; 503, Embedded structure; 5031, First embedded portion; 5032, Second embedded portion; 5033, First embedded side edge; 5034, Second embedded side edge; 504, Embedding groove; 610, Upper polarizer; 620, Lower polarizer; 700, Frame. Detailed Implementation

[0020] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0021] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] Example 1: The display module provided in this embodiment is suitable for scenarios with high temperature load and complex stress. By improving the structure of the display module, this embodiment enables the display module to have high structural reliability and heat dissipation performance. It is especially suitable for vehicle environments, where there are usually vibrations during vehicle operation, high temperatures in summer, and large temperature fluctuations. The display module provided in this embodiment can overcome the effects of the above phenomena and has high structural reliability and heat dissipation capabilities.

[0024] like Figures 1 to 4 As shown, the display module in this embodiment includes a glass substrate 100 and a glass panel 200 stacked sequentially. The glass structures all use glass substrates of the sixth generation or higher. The glass substrate 100 is at least partially exposed outside the glass panel 200 to form a first edge 101. The glass substrate 100 has a chip 300 and a connecting plate 400 disposed on the upper surface of the glass panel 200 at the first edge 101. The connecting plate 400 extends outside the glass substrate 100. In this embodiment, the glass substrate 100 is the largest component in terms of area. On the one hand, it provides a mounting area for the chip 300 and the connecting plate 400. On the other hand, it serves as a display area and is the key to image formation on the display. Its structure and principle are well known to those skilled in the art and will not be described in detail in this embodiment. One of the key points of this embodiment is that the glass substrate 100 is at least partially exposed outside the glass panel 200 to form the first edge 101. The implementation methods include, but are not limited to, making the size of the glass substrate 100 larger than the conventional size, so that the glass panel 200 cannot completely cover the glass substrate 100 to form the first edge 101.

[0025] A graphite heat dissipation layer 500 is disposed on the lower surface of the glass substrate 100 at a first edge 101. The graphite heat dissipation layer 500 extends outside the glass substrate 100 and is attached to the lower surface of the connecting plate 400. That is, a portion of the graphite heat dissipation layer 500 is disposed on the lower surface of the glass substrate 100 and is arranged vertically with the chip 300, thereby facilitating the transfer of heat from the chip 300 to a portion of the graphite heat dissipation layer 500 through the glass substrate 100; while another portion of the graphite heat dissipation layer 500 extends to the lower surface of the connecting plate 400, transferring heat to the outside of the glass substrate 100.

[0026] Specifically, in automotive applications, high structural stability is required to withstand vibration, impact, and thermal cycling, while rapid heat dissipation from the chip 300 is also necessary. Current technologies, which improve overall rigidity by aligning and stacking entire layers at their edges, are prone to abrupt stiffness changes at material interfaces and connection areas. This causes thermal expansion mismatch stress and mechanical loads to accumulate at the edges and connection roots. Furthermore, simply adding large-area metal heat sinks to enhance heat dissipation further alters the local stiffness distribution, exacerbating stress concentration. In contrast, existing technologies include sequentially stacked glass substrates 100 and glass panels 200, with the glass substrate 100 at least partially exposed outside the glass panel 200 to form a first edge 101, creating a stepped structure with interlayer misalignment. Since the glass panel 200 does not fully cover the edge of the glass substrate 100, the rigid edge sealing with complete alignment of traditional multilayer materials is no longer formed in the edge area. This transforms the stiffness abrupt change that was originally concentrated at the edge interface into a stiffness distribution that gradually changes along the interlayer transition area. This helps to alleviate the edge stress concentration caused by the mismatch of thermal expansion coefficients and reduces the risk of edge chipping, crack initiation and interface peeling of the glass substrate 100, especially at the exposed edge. Additionally, in this embodiment, the glass substrate 100 may also be configured such that the portion outside the first edge 101 is not covered by the glass panel 200, for example, as shown below. Figure 5 As shown, the lower edge and right edge of the glass substrate 100 are not covered by the glass panel 200. The lower edge is the first edge 101, and the right edge is the second edge 102. The second edge 102 is provided so that the glass substrate 100 can be connected to other devices, which will not be described in detail in this embodiment.

[0027] Based on this, the glass substrate 100 has a chip 300 and a connecting plate 400 disposed on the upper surface of the glass panel 200 at the first edge 101, and the connecting plate 400 extends outside the glass substrate 100, so that the heat-generating and stress-concentrated parts of the chip 300 and the connecting plate 400 are removed from the direct stacking range of the glass panel 200. The heat generated by the chip 300 when it is working is not confined to the inside of the module by the continuous stack above, but can diffuse outward along a shorter heat conduction path near the first edge 101. Meanwhile, a graphite heat dissipation layer 500 is provided on the lower surface of the glass substrate 100 at the first edge 101, and the graphite heat dissipation layer 500 extends beyond the glass substrate 100. Compared with metal heat sinks, the graphite heat dissipation layer 500 has excellent in-plane thermal conductivity and relatively low bending stiffness. It is provided on the lower surface of the glass substrate 100 and corresponding to the first edge 101. On the one hand, it can form an upper and lower corresponding relationship with the chip 300 and the connecting plate 400 located on the upper surface of the glass substrate 100. The heat generated by the chip 300 is transferred to the graphite heat dissipation layer 500 through the thickness direction of the glass substrate 100. Then, with the help of the high in-plane thermal conductivity of graphite material, it spreads quickly along the graphite layer, thereby avoiding heat retention in the vicinity of the chip 300 and the connecting plate 400. On the other hand, the graphite heat dissipation layer 500 itself does not significantly increase the local stiffness like a large area metal sheet, nor does it form a stronger rigid constraint at the edge. Therefore, while realizing the heat dissipation path, it does not significantly deteriorate the mechanical boundary conditions of the module edge and the connecting area. More importantly, the graphite heat dissipation layer 500 extends further beyond the glass substrate 100, allowing heat from inside the module to not only diffuse beneath the substrate but also continue to be conducted outwards along the extended portion. This effectively expands the heat dissipation path from the traditional "localized heat diffusion" to a "continuous heat conduction path from the heat source area to the outside of the module." This effectively alleviates heat buildup in the chip 300 and connection areas under high-temperature, high-load automotive conditions, reducing the risk of material aging, interface fatigue, and connection failure due to excessively high localized temperatures. In summary, the display module of this embodiment enables the display to possess high structural reliability and heat dissipation capabilities in automotive environments.

[0028] Furthermore, such as Figures 2 to 6As shown, the graphite heat dissipation layer 500 includes a first graphite portion 510 and a second graphite portion 520 connected together. The forward projections of the portion of the chip 300 and the connecting plate 400 that does not extend outside the glass substrate 100 are all superimposed on the first graphite portion 510, and the forward projections of the second graphite portion 520 are all superimposed on the portion of the connecting plate 400 that extends outside the glass substrate 100. "Forward" refers to the direction perpendicular to the glass substrate 100. The aforementioned arrangement positions the first graphite portion 510 directly below the chip 300 and the connecting plate 400, and the second graphite portion 520 directly below the portion of the connecting plate 400 extending beyond the glass substrate 100. This arrangement, besides facilitating rapid heat transfer, also disperses the bending and shear stresses, originally concentrated near the root section of the connecting plate 400, to a larger area by positioning the first graphite portion 510 below the root section. Specifically, since the portion of the chip 300 and the connecting plate 400 on the glass substrate 100 is both the main heat source concentration area and the area where the connecting stress transitions from the rigid glass substrate 100 to the flexible connecting plate... The key transition area of ​​board 400 (usually an FPC connector board) is projected onto the first graphite portion 510. This means that the first graphite portion 510 can form a relatively complete planar coverage in this area. On the one hand, this allows heat from the chip 300 and the inner area of ​​the connector board 400 to be directly coupled to the graphite layer and quickly diffused within the planar area, avoiding heat concentration at a single point. On the other hand, when the first graphite portion 510 is located below the root of the connector board 400, it also mechanically plays a "stress broadening" role at the root of the connector, dispersing the bending and shear stresses that might have been concentrated near the root section to a larger area, thus reducing the local peak stress. The forward projection of the second graphite portion 520 coincides with the portion of the connector board 400 extending beyond the glass substrate 100. Mechanically, this ensures that during bending, insertion, and vibration, the deformation of the extended connector board 400 is not concentrated only at the edge of the glass substrate 100, but can be gradually released along the length direction corresponding to the second graphite portion 520, thereby reducing the stress at the root of the connector. In other words, the connection between the first graphite part 510 and the second graphite part 520 ensures that the stress buffer path remains continuous in space, reducing stress concentration in the connection area.

[0029] Furthermore, such as Figure 6 and Figure 9As shown, along the extension direction of the first edge 101 (corresponding to the first extension direction in the figure), the width of the first graphite portion 510 is greater than the width of the second graphite portion 520. Setting the first graphite portion 510 to a larger width increases its coverage of the chip 300 and the root region of the connecting plate 400, enhances the lateral heat spread capability, and expands the stress dispersion range at the root. Conversely, the second graphite portion 520 corresponds to the portion of the connecting plate 400 extending beyond the glass substrate 100. Although this area still needs to bear the functions of heat conduction and buffering, if it continues to use the same large width as the first graphite portion 510, it would be necessary to increase the coverage area of ​​the extended section, which would excessively constrain the free bending of the connecting plate 400. Therefore, setting the second graphite portion 520 to a smaller width maintains continuous heat conduction and strain buffering along the direction of the connecting plate 400, while avoiding the problem of increased stiffness and limited bending radius due to excessive coverage of the extended section. As can be seen, the first graphite portion 510 being wider than the second graphite portion 520 gives the graphite heat dissipation layer 500 stronger heat diffusion and stress widening capabilities near the heat source and the connection root, while maintaining moderate flexibility in the extended section far from the root, so as to balance thermal conductivity and bending adaptability, thereby improving structural reliability and heat dissipation performance.

[0030] As an optional implementation, the graphite heat dissipation layer 500 has a single-layer structure.

[0031] As another alternative implementation, the graphite heat dissipation layer 500 has a multi-layer structure.

[0032] Based on this, such as Figures 6 to 9 As shown, the graphite heat dissipation layer 500 includes an insulating layer 501 and a graphite layer assembly stacked sequentially in a direction away from the connecting plate 400. The graphite layer assembly includes at least two single graphite layers. An embedding structure 503 is provided on the insulating layer 501, and the graphite layer assembly forms an embedding groove 504 for the embedding structure 503 to be inserted. Figure 8 For example, the graphite heat dissipation layer 500 includes an insulating layer 501, a first graphite layer 5021 and a second graphite layer 5022 stacked sequentially in a direction away from the connecting plate 400.

[0033] In this process, by inserting the embedded structure 503 into the embedding groove 504, a spatial "interlocking relationship" is formed between the insulating layer 501 and the graphite layer group. The interface force mode changes from a single shear / peeling to a shear-compression composite force. That is, when a relative displacement trend occurs, a normal support force is generated between the embedded structure 503 and the sidewall of the embedding groove 504, thereby significantly improving the interface's anti-slip and anti-peeling capabilities, making the interlayer bonding more stable, suppressing problems such as delamination and warping of the graphite layer under thermal expansion and contraction or vibration environments, and effectively improving the structural stability of the display module.

[0034] Furthermore, the embedded structure 503 includes a first embedded portion 5031 that overlaps with the first graphite portion 510 and a second embedded portion 5032 that overlaps with the second graphite portion 520; the first embedded portion 5031 and the second embedded portion 5032 are connected, and along the extending direction of the first edge 101, the width of the first embedded portion 5031 is greater than the width of the second graphite portion 520 and less than the width of the first graphite portion 510.

[0035] Understandably, when the connecting plate 400 bends or vibrates, the continuous existence of the embedded structure 503 along the entire path allows stress to be gradually transmitted and released from the root outwards along the graphite heat dissipation layer 500, without re-forming stress concentration points at a certain boundary. Therefore, it achieves a unity of "continuous heat conduction path" and "continuous stress buffering path." Specifically, when the connecting plate 400 bends, the area near the root, due to its strong interlocking, effectively suppresses interlayer misalignment and disperses stress. In the extended section far from the root, due to weakened constraints, the graphite layers can undergo a certain degree of coordinated deformation with the connecting plate 400, thereby avoiding the formation of new rigid constraint points and allowing strain to be gradually released along the length direction. This transition from a "high-constraint area" to a "low-constraint area" essentially constructs a gradual distribution of structural stiffness and interface constraint. Therefore, by dividing the embedded structure 503 into a first embedded part 5031 and a second embedded part 5032 corresponding to the first graphite part 510 and the second graphite part 520 respectively, and setting the width of the first embedded part 5031 to be between the first graphite part 510 and the second graphite part 520, the embedded structure has a large coverage area in the connection root region to enhance the interlayer bonding and stress dispersion capabilities. At the same time, the constraint is gradually weakened along the extension direction of the connecting plate 400, thereby ensuring the overall thermal conductivity continuity of the graphite heat dissipation layer 500 while realizing the gradual transition of interface constraint and structural stiffness. This allows heat to be efficiently conducted outward and bending stress to be gradually released along the path, further reducing the risk of stress concentration at the root of the connecting plate 400 and improving the structural reliability and heat dissipation performance of the display module under vehicle vibration and thermal cycling environments.

[0036] As an optional implementation method, such as Figure 9As shown, the embedded structure 503 includes a first embedded side edge 5033 and a second embedded side edge 5034. The first embedded side edge 5033 is fitted against one wall of the embedding groove 504 and extends from the first embedded portion 5031 to the second embedded portion 5032. The second embedded side edge 5034 is fitted against the other wall of the embedding groove 504 and extends from the first embedded portion 5031 to the second embedded portion 5032. The distance between the first embedded side edge 5033 and the second embedded side edge 5034 decreases along the extension direction of the connecting plate 400. At this time, the overall outline of the embedded structure 503 is an obtuse isosceles triangle, with the base corresponding to the obtuse angle completely located in the first graphite portion 510, and the position of the obtuse angle located in the second graphite portion 520. Therefore, when the embedded structure 503 is inserted into the embedding groove 504, the above-mentioned gradient structure can achieve automatic alignment, thereby ensuring a stable connection between the insulating layer 501 and the graphite layer assembly.

[0037] Based on the above embodiment, an upper polarizer 610 is stacked on the upper surface of the glass panel 200, and the glass panel 200 is at least partially exposed outside the upper polarizer 610 to form a third edge 201.

[0038] Furthermore, a lower polarizer 620 is stacked on the lower surface of the glass substrate 100 at a position corresponding to the upper polarizer 610, and the size of the lower polarizer 620 is the same as that of the upper polarizer 610. This further reduces stress concentration at the edges of the display module.

[0039] Example 2: The vehicle-mounted display provided in this embodiment includes a frame 700 and a display module as described in Embodiment 1. The display module is installed in the frame 700, which also houses components such as a light source and a power supply. The light source provides backlighting for the vehicle-mounted display, and the power supply provides power to the display module. Embodiment 1 describes the specific structure and technical effects of the display module. The vehicle-mounted display provided in this embodiment, including the display module, also possesses these technical effects, exhibiting high structural reliability and heat dissipation capabilities.

[0040] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display module, characterized in that, The device includes a glass substrate (100) and a glass panel (200) stacked sequentially. The glass substrate (100) is at least partially exposed outside the glass panel (200) to form a first edge (101). The glass substrate (100) has a chip (300) and a connecting plate (400) disposed on the upper surface of the glass panel (200) at the first edge (101). The connecting plate (400) extends outside the glass substrate (100). A graphite heat dissipation layer (500) is provided on the lower surface of the glass substrate (100) at the first edge (101). The graphite heat dissipation layer (500) extends to the outside of the glass substrate (100) and is attached to the lower surface of the connecting plate (400).

2. A display module according to claim 1, characterized in that, The graphite heat dissipation layer (500) includes a first graphite portion (510) and a second graphite portion (520) connected together. The forward projections of the chip (300) and the portion of the connecting plate (400) that does not extend outside the glass substrate (100) both coincide with the first graphite portion (510), and the forward projections of the second graphite portion (520) both coincide with the portion of the connecting plate (400) that extends outside the glass substrate (100).

3. A display module according to claim 2, characterized in that, Along the extension direction of the first edge (101), the width of the first graphite portion (510) is greater than the width of the second graphite portion (520).

4. A display module according to claim 3, characterized in that, The graphite heat dissipation layer (500) is a single-layer structure.

5. A display module according to claim 3, characterized in that, The graphite heat dissipation layer (500) has a multi-layer structure.

6. A display module according to claim 5, characterized in that, The graphite heat dissipation layer (500) includes an insulating layer (501) and a graphite layer group stacked sequentially in a direction away from the connecting plate (400). The graphite layer group includes at least two single graphite layers. An embedding structure (503) is provided on the insulating layer (501). The graphite layer group forms an embedding groove (504) for the embedding structure (503) to be inserted.

7. A display module according to claim 6, characterized in that, The embedded structure (503) includes a first embedded portion (5031) overlapping the first graphite portion (510) and a second embedded portion (5032) overlapping the second graphite portion (520); the first embedded portion (5031) is connected to the second embedded portion (5032) and along the extending direction of the first edge (101), the width of the first embedded portion (5031) is greater than the width of the second graphite portion (520) and less than the width of the first graphite portion (510).

8. A display module according to claim 7, characterized in that, The embedding structure (503) includes a first embedding side edge (5033) and a second embedding side edge (5034). The first embedding side edge (5033) is fitted to one wall of the embedding groove (504) and extends from the first embedding part (5031) to the second embedding part (5032). The second embedding side edge (5034) is fitted to the other wall of the embedding groove (504) and extends from the first embedding part (5031) to the second embedding part (5032). The spacing between the first embedded side edge (5033) and the second embedded side edge (5034) decreases along the extension direction of the connecting plate (400).

9. A display module according to claim 1, characterized in that, An upper polarizer (610) is stacked on the upper surface of the glass panel (200), and the glass panel (200) is at least partially exposed outside the upper polarizer (610) to form a third edge (201); a lower polarizer (620) is stacked on the lower surface of the glass substrate (100) at a position corresponding to the upper polarizer (610), and the size of the lower polarizer (620) is the same as the size of the upper polarizer (610).

10. A vehicle-mounted display, characterized in that, Includes the display module as described in any one of claims 1-9.

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