LED display module and display device

Abstract

This invention discloses an LED display module and display device, relating to the field of LED display technology. The LED display device includes a first connector, a second connector, a splicing display panel, and at least two carrier plates. Each carrier plate includes a display area and a splicing area. The front and back surfaces of the splicing area are respectively provided with a first solder groove and a second solder groove. When the two carrier plates are spliced, the two first solder grooves combine to form a first connecting hole, and the two second solder grooves combine to form a second connecting hole. The first connector is embedded in the first connecting hole and welded to the two carrier plates. The second connector is embedded in the second connecting hole and welded to the two carrier plates. The splicing display panel spans the splicing area of ​​the two carrier plates and is equipped with LED beads. This invention enables large-scale and effective splicing of multiple carrier plates.

Description

Technical Field

[0001] This invention relates to the field of LED display technology, and in particular to an LED display module and display device. Background Technology

[0002] LED (Light Emitting Diode) display modules mainly consist of an LED carrier board and multiple LED chips. The LED chips are the core light-emitting components. The LED carrier board serves two purposes: firstly, to fix and arrange the LED chips, and secondly, to connect the chips via circuitry. Due to limitations in current PCB manufacturing processes and equipment, the size of a single LED carrier board is limited. To achieve large-scale display devices exceeding the length of a single LED carrier board, multiple LED carrier boards must be spliced ​​together.

[0003] However, since LED carrier boards are usually designed to be large and thin, they are prone to bending or even breaking during splicing due to slight external force or their own weight. This can affect the electrical connection between LED carrier boards, leading to unstable electrical performance and even problems such as signal interruption and uneven brightness, thus affecting the LED display effect. Therefore, it is difficult to achieve large-scale and effective splicing of multiple LED carrier boards. Summary of the Invention

[0004] The main objective of this invention is to propose an LED display module and display device that aims to achieve large-scale and effective splicing of multiple carrier boards, thereby meeting the large-screen display requirements of the display device.

[0005] To achieve the above objectives, the present invention proposes an LED display module, comprising a first connector, a second connector, a splicing display panel, and at least two carrier plates. Each carrier plate includes a display area and a splicing area. The splicing area is located at the end of the display area. The front and back surfaces of the splicing area are respectively provided with a first solder groove and a second solder groove. When the two carrier plates are spliced, the two first solder grooves combine to form a first connecting hole, and the two second solder grooves combine to form a second connecting hole. The first connector is embedded in the first connecting hole and welded to the two carrier plates. The second connector is embedded in the second connecting hole and welded to the two carrier plates. The splicing display panel spans the splicing area of ​​the two carrier plates and is provided with LED beads.

[0006] In one embodiment, the bottom wall of the first welding tank is provided with a through hole, and the first connector includes a connecting part and two plug-in parts. The two plug-in parts are located on both sides of the connecting part and are respectively plugged into the through holes of the two carrier plates.

[0007] In one embodiment, solder is further filled between the plug portion and the wall of the overcurrent hole. And / or, solder is further filled between the first connector and the wall of the first connecting hole, and solder is further filled between the second connector and the wall of the second connecting hole.

[0008] In one embodiment, the carrier board includes a first circuit layer and an insulating layer. The first circuit layer includes a positive line and a negative line. The insulating layer is provided with a first welding groove. A second welding groove is provided adjacent to one of the positive line and the negative line. The first welding groove and the second welding groove are joined together to form the first welding groove.

[0009] In one embodiment, the first circuit layer consists of a plurality of spaced and alternately arranged positive and negative lines, and the other of the adjacent positive and negative lines is further provided with a third welding groove spaced apart from the second welding groove. The third welding groove and the insulating layer enclose each other to form the second welding groove.

[0010] In one embodiment, the thickness of the positive electrode line and the negative electrode line is greater than 70 micrometers.

[0011] In one embodiment, the display area is provided with LED beads.

[0012] In one embodiment, a first through hole is provided in the area of ​​the carrier plate where no LED beads are provided, and a second through hole is provided in the area of ​​the splicing display panel where no LED beads are provided. The second through hole and the first through hole of the carrier plate corresponding to the splicing display panel area are overlapped and spliced ​​together to form a light-transmitting hole.

[0013] In one embodiment, the splicing display panel is a flexible circuit board.

[0014] The present invention also proposes a display device, which includes an LED display module as described above.

[0015] In the technical solution of this invention, the splicing areas of the two carrier plates are first aligned at the splicing point, so that the first weld grooves on the front of the two carrier plates are joined to form a first connecting hole, and the second weld grooves on the back of the two carrier plates are joined to form a second connecting hole; then, the first connector is embedded into the first connecting hole and welded to the two carrier plates, and the second connector is embedded into the second connecting hole and welded to the two carrier plates, thereby achieving welding and fixing of the two carrier plates on both sides, ensuring the bending resistance of the two carrier plates on both sides of the splicing area, as well as the normal connection of the internal circuits of the carrier plates.

[0016] Meanwhile, the splicing display panel is connected across the front of the two carrier boards, ensuring normal connectivity of the circuitry on the front of the two carrier boards. Furthermore, by setting LED beads on the splicing display panel, the normal display of the LED beads in the splicing area of ​​the two carrier boards is ensured.

[0017] Therefore, the present invention enhances the structural and circuit bending resistance of the two carrier plates in the splicing area by welding and fixing the first and second connectors on the front and back sides of the two carrier plates, and by bridging the splicing area of ​​the two carrier plates with a splicing display panel. This makes it less prone to bending or breakage in terms of mechanical and circuit structures. Moreover, the operation is simple and highly reliable, which is conducive to the effective splicing of multiple carrier plates to meet the large-screen display requirements of LED display modules. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the LED display module provided by the present invention; Figure 2 A schematic diagram of an embodiment of a splicing display panel pre-installed with LED beads; Figure 3 for Figure 1 The diagram shows the front view of the LED display module after the LED beads have been removed. Figure 4 for Figure 3 Corresponding side view structural diagram; Figure 5 for Figure 3 A front view diagram showing the structure after removing the second circuit layer; Figure 6 for Figure 5 A magnified view of a section at point A in the middle; Figure 7 A schematic diagram of a partial splicing structure to conceal the first connector between two carrier plates; Figure 8 for Figure 5 Corresponding rear view structural diagram; Figure 9 for Figure 8 A magnified view of a section at point B in the middle; Figure 10 This is a schematic diagram of the structure of the first circuit layer; Figure 11 This is a schematic diagram of the insulating layer structure; Figure 12 This is a structural schematic diagram of the first connector; Figure 13This is a schematic diagram of the second connector.

[0020] Explanation of reference numerals: 100, LED display module; 10, carrier board; 101, display area; 102, splicing area; 1. First circuit layer; 11. Positive wire; 111. Second welding groove; 112. Through hole; 12. Negative wire; 121. Third welding groove; 2. Insulation layer; 21. First welding tank; 31. First weld groove; 32. Second weld groove; 33. First connecting hole; 34. Second connecting hole; 351. First through hole; 353. Light-transmitting hole; 355. Butt joint half hole; 361. Joint; 4. Second circuit layer; 41. Signal line; 42. LED chip pad; 51. First connector; 511. Connecting part; 512. Insertion part; 52. Second connector; 521. Inlet part; 61. Splicing display panel; 611. Second through hole; 71. LED lamp beads.

[0021] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0025] LED (Light Emitting Diode) display modules mainly consist of an LED carrier board and multiple LED chips. The LED chips are the core light-emitting components. The LED carrier board serves two purposes: firstly, to fix and arrange the LED chips, and secondly, to connect the chips via circuitry. Due to limitations in current PCB manufacturing processes and equipment, the size of a single LED carrier board is limited. To achieve large-scale display devices exceeding the length of a single LED carrier board, multiple LED carrier boards must be spliced ​​together.

[0026] However, since LED carrier boards are usually designed to be large and thin, they are prone to bending or even breaking during splicing due to slight external force or their own weight. This can affect the electrical connection between LED carrier boards, leading to unstable electrical performance and even problems such as signal interruption and uneven brightness, thus affecting the LED display effect. Therefore, it is difficult to achieve large-scale and effective splicing of multiple LED carrier boards.

[0027] To address the aforementioned issues, this invention proposes an LED display module 100 and a display device, aiming to achieve a large-scale and effective splicing of multiple carrier boards 10, thereby meeting the large-screen display requirements of the display device.

[0028] Reference Figures 1 to 13 In one embodiment of the present invention, the LED display module 100 includes a first connector 51, a second connector 52, a splicing display panel 61, and at least two carrier plates 10. The carrier plate 10 includes a display area 101 and a splicing area 102. The splicing area 102 is disposed at the end of the display area 101. The front and back sides of the splicing area 102 are respectively provided with a first welding groove 31 and a second welding groove 32. When the two carrier plates 10 are spliced, the two first welding grooves 31 are joined to form a first connecting hole 33, and the two second welding grooves 32 are joined to form a second connecting hole 34. The first connector 51 is embedded in the first connecting hole 33 and welded to the two carrier plates 10; the second connector 52 is embedded in the second connecting hole 34 and welded to the two carrier plates 10; the splicing display panel 61 spans the splicing area 102 of the two carrier plates 10, and the splicing display panel 61 is provided with LED beads 71.

[0029] The carrier plate 10 is a substrate used to fix and arrange the LED beads 71 ​​and provide circuit connections. The LED display module 100 of this invention includes at least two carrier plates 10 spliced ​​together. When the number of carrier plates 10 is greater than three, the remaining carrier plates 10 can be made with the same structure as the two carrier plates 10 or with different structures, both falling within the protection scope of this invention. By default, the side of the carrier plate 10 used to mount the LED beads 71 ​​is the front, and the other side is the back.

[0030] Display area 101 is the main area on the carrier board 10 used to arrange LED beads 71 ​​to achieve image display. Splicing area 102 is the end area of ​​the carrier board 10, used for docking and splicing with adjacent carrier boards 10. It has no or only a small number of LED beads 71, mainly for mechanical connection and electrical bridging. Splicing areas 102 can be provided at one or both ends of display area 101 to meet the splicing requirements of one or both ends of carrier board 10. The carrier board 10 may also include a control area, which includes power positive and negative terminals and signal interfaces for powering the carrier board 10 and providing control signals.

[0031] The first weld groove 31 is a recessed structure on the front edge of the carrier plate 10. The first weld groove 31 of a single carrier plate 10 can be semi-perforated, and two semi-perforated first weld grooves 31 can be joined together to form a strip-shaped first connecting hole 33. The second weld groove 32 is a recessed structure on the back edge of the carrier plate 10. The second weld groove 32 of a single carrier plate 10 can be semi-perforated, and two semi-perforated second weld grooves 32 can be joined together to form a strip-shaped second connecting hole 34.

[0032] It is worth noting that by embedding the first connector 51 into the first connecting hole 33 for welding and the second connector 52 into the second connecting hole 34 for welding, the surface flatness of the two LED carrier boards 10 is also ensured during welding and splicing, which facilitates the laying of the splicing display board 61 and makes the LED display module 100 more aesthetically pleasing.

[0033] The splicing display panel 61 is a plate-shaped component spanning the splicing area 102 of two carrier panels 10. Its surface is equipped with LED beads 71 ​​to fill the display gaps in the splicing area 102 and participate in imaging. Optionally, refer to... Figure 2The LED beads 71 ​​are pre-installed on the splicing display panel 61. The specific structure and circuit layout of the splicing display panel 61 can be referred to the carrier board 10, and it is electrically connected to the carrier board 10 accordingly, so as to provide power to the LED beads 71 ​​on the splicing display panel 61 and provide signal through holes.

[0034] In the technical solution of the present invention, the splicing areas 102 of the two carrier plates 10 are first aligned with the splicing point 361, so that the first welding grooves 31 on the front of the two carrier plates 10 are spliced ​​to form a first connecting hole 33, and the second welding grooves 32 on the back of the two carrier plates 10 are spliced ​​to form a second connecting hole 34; then the first connector 51 is inserted into the first connecting hole 33 and welded to the two carrier plates 10, and the second connector 52 is inserted into the second connecting hole 34 and welded to the two carrier plates 10, thereby realizing the welding and fixing of the two carrier plates 10 on both sides, ensuring the bending resistance of the two carrier plates 10 on both sides of the splicing area 102, as well as the normal connection of the internal circuits of the carrier plates 10.

[0035] Meanwhile, the splicing display panel 61 is connected across the front of the two carrier boards 10, ensuring the normal connection of the circuits on the front of the two carrier boards 10. By setting LED beads 71 ​​on the splicing display panel 61, the normal display of the LED beads 71 ​​of the two carrier boards 10 in the splicing area 102 is ensured.

[0036] Therefore, the present invention enhances the structural and circuit bending resistance of the two carrier plates 10 in the splicing area 102 by welding and fixing the first connector 51 and the second connector 52 on the front and back sides of the two carrier plates 10, and by bridging the splicing area 102 of the two carrier plates 10 with a splicing display panel 61. This makes it less prone to bending or breakage in terms of mechanical and circuit structures, and the operation is simple and reliable. It is beneficial to achieve large-scale effective splicing of multiple carrier plates 10, thereby meeting the large-screen display requirements of the LED display module 100.

[0037] Optionally, the first connector 51 is a solid metal connector embedded in the first connecting hole 33, which is firmly bonded to the hole wall of the first connecting hole 33 by welding, thereby realizing the mechanical connection and circuit connection between the front sides of the two carrier plates 10. The first connector 51 is provided with a pre-welded layer, or is welded to the hole wall of the first connecting hole 33 by filling with solder, or is welded to the two carrier plates 10 by further welding holes or other methods.

[0038] The second connector 52 is a solid metal connector embedded in the second connecting hole 34. It is firmly bonded to the hole wall of the second connecting hole 34 by welding, thereby achieving mechanical connection and reinforcement of the two carrier plates 10 on the opposite side. The second connector 52 is provided with a pre-welded layer, or it is welded to the hole wall of the second connecting hole 34 by filling with solder, or it is welded to the two carrier plates 10 by further welding holes or other methods.

[0039] Optionally, refer to Figure 9 and Figure 13 The second connector 52 is provided with an inlet portion 521 with a gradually narrowing outer diameter, so as to embed the second connector 52 into the second connecting hole 34.

[0040] Reference Figures 5 to 9 In one embodiment of the present invention, the bottom wall of the first welding groove 31 is provided with an overcurrent hole 112, and the first connector 51 includes a connecting part 511 and two plug-in parts 512. The two plug-in parts 512 are disposed on both sides of the connecting part 511 and are respectively plugged into the overcurrent holes 112 of the two carrier plates 10.

[0041] In this embodiment, the connecting portion 511 of the first connector 51 spans between the two carrier plates 10, and the plug-in portions 512 on both sides are respectively inserted into the through holes 112 of the two carrier plates 10, thereby achieving electrical connection with the circuits of the two carrier plates 10. In addition, this plug-in structure can achieve pre-positioning of the first connector 51 and the carrier plate 10 before welding, and the cooperation between the plug-in portion 512 and the through hole 112 increases the welding area, forming a more reliable mechanical anchoring and circuit connection.

[0042] Optionally, the carrier board 10 includes a first circuit layer 1 and an insulating layer 2 from bottom to top. The first circuit layers 1 of the two carrier boards 10 are soldered together to achieve electrical conductivity. The first circuit layers 1 of the two carrier boards 10 are also provided with overcurrent vias 112. A first connector 51 located on the side of the insulating layer 2 opposite to the first circuit layer 1 is inserted into and electrically connected to the first circuit layers 1 of the two carrier boards 10 via two insertion portions 512. Therefore, even if the solder joint of the first circuit layers 1 of the two carrier boards 10 breaks, the circuit connection between the two carrier boards 10 can still be achieved through the first connector 51, further enhancing the electrical stability of the LED carrier board 10. For example, see reference... Figure 9 and Figure 10 The positive line 11 or negative line 12 of the first circuit layer 1 is provided with an overcurrent via 112. Even if the positive line 11 or negative line 12 of the two carrier boards 10 breaks after welding, electrical conduction can still be achieved through the first connector 51.

[0043] Reference Figures 5 to 9 In one embodiment of the present invention, solder is further filled between the plug portion 512 and the wall of the overcurrent hole 112. And / or, solder is further filled between the wall of the first connector 51 and the wall of the first connecting hole 33, and solder is further filled between the wall of the second connector 52 and the wall of the second connecting hole 34.

[0044] In this embodiment, the solder filling eliminates the gaps between the first connector 51 and the second connector 52 and the carrier plate 10, enhancing the firmness of the mechanical connection and preventing the first connector 51 and the second connector 52 from loosening. Furthermore, the solder can be conductive, further improving the reliability of the circuit connection, reducing contact resistance, and minimizing heat generation and signal loss. Simultaneously, the solder filling also acts as a sealant, preventing moisture and dust from entering and extending the service life of the LED display module 100.

[0045] Alternatively, the solder may be a metal material such as solder bar or solder paste.

[0046] Reference Figure 7 , Figure 10 and Figure 11 In one embodiment of the present invention, the carrier board 10 includes a first circuit layer 1 and an insulating layer 2. The first circuit layer 1 includes a positive line 11 and a negative line 12. The insulating layer 2 is provided with a first welding groove 21. A second welding groove 111 is provided adjacent to one of the positive line 11 and the negative line 12. The first welding groove 21 and the second welding groove 111 are joined together to form the first welding groove 31.

[0047] The first circuit layer 1 is a metal conductive trace layer, which includes the positive electrode line 11 and the negative electrode line 12 for power supply, and has high mechanical strength and thermal conductivity.

[0048] In this embodiment, a through-hole first welding groove 21 is formed on the insulating layer 2, and a non-through-hole second welding groove 111 is formed on the upper surface of the first circuit layer 1. The two are joined together to form a complete first welding groove 31. This structure allows the bottom of the first connector 51 to contact or approach the positive line 11 or negative line 12 of the first circuit layer 1 after it is embedded, which is beneficial for achieving circuit connection and heat conduction between the first connector 51 and the first circuit layer 1. At the same time, since the second welding groove 111 of the first circuit layer 1 is a groove rather than a through hole, the first connector 51 is prevented from penetrating the back of the carrier plate 10, ensuring the flatness of the back of the carrier plate 10.

[0049] Reference Figures 9 to 11 In one embodiment of the present invention, the first circuit layer 1 consists of a plurality of positive lines 11 and negative lines 12 arranged alternately and spaced apart. The other of the adjacent positive lines 11 and negative lines 12 is further provided with a third welding groove 121 spaced apart from the second welding groove 111. The third welding groove 121 and the insulating layer 2 enclose each other to form the second welding groove 32.

[0050] In this embodiment, the first circuit layer 1 adopts a wiring pattern with alternating positive and negative lines arranged at intervals to form a uniform power supply line. The third welding groove 121 penetrates the first circuit layer 1, while the insulating layer 2 remains intact or only has shallow grooves at the corresponding positions, so that the second welding groove 32 is formed by the through groove of the first circuit layer 1 and the surface of the insulating layer 2. Through the through structure of the first circuit layer 1, the second connector 52 can make full contact with the thickness direction of the first circuit layer 1 after being embedded, providing a larger welding area and thus enhancing the connection strength on the reverse side. At the same time, since the insulating layer 2 is not completely penetrated, the front circuit of the carrier board 10 will not be affected by the reverse welding, ensuring the normal connection of the front circuit.

[0051] Reference Figure 12 In one embodiment of the present invention, the thickness of the positive electrode line 11 and the negative electrode line 12 is greater than 70 micrometers.

[0052] In this embodiment, compared to the thickness of conventional thin copper foil circuits, the thickness of the positive electrode line 11 and the negative electrode line 12 is set to be above 70 micrometers. When multiple carrier boards 10 are spliced ​​together to form an ultra-long LED display module 100, a larger current intensity can be provided to ensure that each LED bead 71 has a strong display brightness. This makes the overall display color of the LED display module 100 more uniform and vivid, and there will be no uneven display due to insufficient brightness of some LED beads 71.

[0053] Optionally, refer to Figure 4 The positive line 11 and negative line 12 of the first circuit layer 1 are made of thick copper, with a thickness ranging from 0.4mm to 0.5mm. The thickness of the insulating layer 2 ranges from 0.5mm to 0.8mm. The thickness of the second circuit layer 4, located above the insulating layer 2, namely the signal line 41 and the lamp bead pad 42, is about 0.035mm. The thickness of the splicing display board 61 is 0.1mm to 0.12mm.

[0054] Reference Figure 3 and Figure 4 In one embodiment of the present invention, the carrier board 10 further includes a second circuit layer 4 disposed on the side of the insulating layer 2 opposite to the first circuit layer 1. The second circuit layer 4 includes signal lines 41 and multiple LED chip pads 42. The signal lines 41 and LED chip pads 42 are disposed in the display area 101 of the carrier board 10. Multiple LED chips 71 in the display area 101 are respectively soldered to each LED chip pad 42 and are connected to each other through the signal lines 41.

[0055] Optionally, the LED chip pad 42 includes a positive pad, a negative pad, and a signal pad, and the LED chip 71 includes a positive pin, a negative pin, and a signal pin, which are respectively soldered to the corresponding pads. This invention does not limit the arrangement of the LED chip 71 to a single method; other arrangements of the LED chip 71 fall within the protection scope of this invention.

[0056] Optionally, refer to Figure 2 and Figure 3 The LED beads 71 ​​on the splicing display panel 61 are pre-soldered. The structure of the splicing display panel 61 can be the same as that of the carrier board 10, which also has a first circuit layer, an insulating layer and a second circuit layer, and is electrically connected to the carrier board 10, so that the LED beads 71 ​​on the splicing display panel 61 can be powered and communicated normally.

[0057] In one embodiment of the splicing display panel 61, refer to Figure 2 and Figure 3 The splicing area 102 of the carrier board 10 is provided with a positive electrode pad, a negative electrode pad, and a signal pad. The positive electrode pad is electrically connected to the positive line 11 of the first circuit layer 1 through a hole in the insulating layer 2. The negative electrode pad is electrically connected to the negative line 12 of the first circuit layer 1 through a hole in the insulating layer 2. The signal pad is electrically connected to the signal line 41 of the display area 101. The splicing display panel 61 is sequentially soldered to the positive electrode pad, the negative electrode pad, and the signal pad, thereby realizing the power supply and signal transmission of the splicing display panel 61.

[0058] Therefore, the splicing area 102 of the two carrier boards 10 is used not only to set the first solder groove 31, but also to set the solder pads for laying the splicing display panel 61. When the two carrier boards 10 are spliced, their splicing areas 102 are aligned, and the splicing display panel 61 is laid on top of the splicing areas 102 of the two carrier boards 10. The splicing display panel 61 not only plays a role in physical reinforcement, but more importantly, it is electrically connected to the positive line 11 and negative line 12 of the first circuit layer 1 of the two carrier boards 10, and also electrically connected to the signal line 41 of the second circuit layer 4, realizing the power supply to the LED beads 71 ​​on the splicing display panel 61, and realizing the signal communication between the LED beads 71 ​​of the two carrier boards 10, ensuring the normal display of the LED display module 100 as a whole.

[0059] In addition, the carrier board 10 is divided into a display area 101 and a splicing area 102. This partitioning design avoids mutual interference between welding and wiring, and clearly separates the mechanical reinforcement area from the circuit wiring area, which is convenient for production and maintenance.

[0060] It is worth noting that the present invention does not limit the structure and arrangement of the splicing display panel 61 to a single method; other structures and arrangements of the splicing display panel 61 fall within the protection scope of the present invention.

[0061] Reference Figure 1 and Figure 3 In one embodiment of the present invention, the display area 101 is provided with LED beads 71.

[0062] The display area 101 and the splicing display panel 61 may be equipped with multiple LED beads 71 ​​arranged in an array. The multiple LED beads 71 ​​are evenly spaced to meet the uniform display requirements of the image.

[0063] In this embodiment, LED beads 71 ​​are directly mounted on the display area 101 of the carrier board 10, forming the main light-emitting area. The splicing area 102 is used to connect two carrier boards 10, and no LED beads or a small number of auxiliary LED beads are set there. This partition design ensures that the splicing operation will not damage the LED beads in the display area 101, and at the same time, the splicing display board 61 can fill the display gaps in the splicing area 102 after being connected, achieving a seamless visual effect.

[0064] Reference Figure 2 , Figure 3 and Figure 5 In one embodiment of the present invention, the area of ​​the carrier plate 10 where no LED beads 71 ​​are provided is provided with a first through hole 351, and the area of ​​the splicing display panel 61 where no LED beads 71 ​​are provided is provided with a second through hole 611. The second through hole 611 and the first through hole 351 of the corresponding area of ​​the splicing display panel 61 of the carrier plate 10 are overlapped and spliced ​​together to form a light-transmitting hole 353.

[0065] In this design, both the display area 101 and the splicing area 102 of the carrier board 10 can be provided with first through holes 351. Each LED bead 71 in the display area 101 is disposed in the solid area between each first through hole 351, spaced apart from the first through holes 351. Similarly, each LED bead 71 in the splicing display panel 61 is disposed in the solid area between each second through hole 611, spaced apart from the second through holes 611. Through this arrangement, the LED display module 100, while displaying images by illuminating the LED beads 71, also maintains good transparency in both the illuminated and unilluminated areas, achieving a transparent or holographic display effect.

[0066] In this embodiment, after splicing, the through holes on the carrier plate 10 and the splicing display plate 61 overlap to form light-transmitting holes 353. These light-transmitting holes 353 allow light to pass through from the back or pass through from the front, helping to ensure the transparent or holographic display effect of the splicing area 102. At the same time, the arrangement of the light-transmitting holes 353 reduces the weight of the board and improves heat dissipation performance. When multiple carrier plates 10 are spliced, the regular arrangement of the light-transmitting holes 353 can also enhance the overall transparency and technological feel of the display.

[0067] Optionally, refer to Figure 3 The splicing edges of two adjacent carrier plates 10 form two mating half holes 355. When the two carrier plates 10 are aligned and spliced, these two mating half holes 355 are spliced ​​together to form a complete first through hole 351, thereby achieving seamless splicing of the two carrier plates 10, improving the overall aesthetics of the LED display module 100, as well as the continuity of the displayed image.

[0068] Reference Figures 1 to 3 In one embodiment of the present invention, the splicing display panel 61 is a flexible circuit board.

[0069] In this embodiment, a flexible circuit board is used as the splicing display panel 61. This can accommodate minor height differences or flatness errors that may exist during the splicing of the carrier board 10, ensuring that the LED beads 71 ​​on the splicing display panel 61 and the LED beads on the carrier board 10 are aligned, thus enhancing the overall aesthetics of the LED display module 100. Simultaneously, the flexible circuit board itself can be pre-mounted with LED beads 71, enabling continuous display in the splicing area 102 and further eliminating the visual impact of splicing gaps.

[0070] In addition, since the flexible circuit board has good bending resistance, it enhances the bending resistance of the lines in the splicing area 102 of the two carrier boards 10, ensuring that the lines between the two carrier boards 10 can be normally connected through the splicing display board 61.

[0071] In other embodiments, the splicing display panel 61 can also be a rigid thin plate, as long as it has the function of bridging and covering the splicing area of ​​the two carrier plates.

[0072] The present invention also proposes a display device, which includes the LED display module 100 as described above.

[0073] The specific structure of the LED display module 100 is as described in the above embodiments. Since this display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0074] The display device is an LED light panel, an LED display screen, or any product that uses the aforementioned LED display module 100, and can be applied to commercial displays, transparent shop windows, stage backdrops, architectural media walls, and other scenarios.

[0075] Specifically, the display device is a large display screen composed of LED display modules 100. The carrier plate 10 inside the LED display module 100 is firmly connected through the embodiment of the present invention, thereby ensuring that the entire display device is not prone to seam cracking or signal interruption during long-term use, and can meet the needs of daily use.

[0076] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An LED display module, characterized in that, include: At least two carrier boards, each carrier board including a display area and a splicing area, the splicing area being disposed at the end of the display area, the front and back of the splicing area being respectively provided with a first weld groove and a second weld groove, when the two carrier boards are spliced, the two first weld grooves are joined together to form a first connecting hole, and the two second weld grooves are joined together to form a second connecting hole; The first connector is embedded in the first connecting hole and welded to the two carrier plates; The second connector is embedded in the second connecting hole and welded to the two carrier plates; A splicing display panel is connected across the splicing area of ​​the two carrier panels, and the splicing display panel is equipped with LED beads. 2.The LED display module of claim 1, wherein, The bottom wall of the first welding tank is provided with a through hole. The first connector includes a connecting part and two plug-in parts. The two plug-in parts are located on both sides of the connecting part and are respectively plugged into the through holes of the two carrier plates. 3.The LED display module of claim 2, wherein, Solder is also filled between the plug and the wall of the overcurrent hole; And / or, solder is also filled between the first connector and the wall of the first connecting hole, and solder is also filled between the second connector and the wall of the second connecting hole. 4.The LED display module of claim 1, wherein, The carrier board includes a first circuit layer and an insulating layer. The first circuit layer includes a positive line and a negative line. The insulating layer is provided with a first welding groove. A second welding groove is provided adjacent to one of the positive line and the negative line. The first welding groove and the second welding groove are joined together to form the first welding groove.

5. The LED display module of claim 4, wherein, The first circuit layer consists of multiple positive and negative lines arranged alternately and spaced apart. Another positive and negative line is also provided with a third welding groove spaced apart from the second welding groove. The third welding groove and the insulating layer enclose each other to form the second welding groove. 6.The LED display module of claim 4, wherein, The thickness of the positive electrode line and the negative electrode line is greater than 70 micrometers.

7. The LED display module of any one of claims 1 to 6, wherein, The display area is equipped with LED beads. 8.The LED display module of claim 7, wherein, The area of ​​the carrier plate without LED beads is provided with a first through hole, and the area of ​​the splicing display panel without LED beads is provided with a second through hole. The second through hole and the first through hole of the corresponding splicing display panel area of ​​the carrier plate are overlapped and spliced ​​together to form a light-transmitting hole. 9.The LED display module of any one of claims 1 to 6, wherein, The splicing display panel is a flexible circuit board.

10. A display device, characterized by comprising: Includes the LED display module as described in any one of claims 1 to 9.

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