Transparent display screen and display module

Abstract

This application relates to a transparent display screen and a display module. The transparent display screen includes: a substrate, on which at least one driver chip and multiple LED light-emitting devices are disposed on the same side. Each LED light-emitting device includes multiple light-emitting chips. Each driver chip is electrically connected to and controls at least two LED light-emitting devices. The driver chip has a signal input pin, a positive power supply pin, a negative power supply pin, at least two common electrode control pins for light-emitting devices, and multiple non-common electrode control pins for light-emitting devices. The common electrode control pins for light-emitting devices are electrically connected to the common electrode pins of the LED light-emitting devices, and the non-common electrode control pins for light-emitting devices are electrically connected to the corresponding non-common electrode pins of the LED light-emitting devices. This application reduces the number of driver chips and the wiring on the substrate. Furthermore, multiple LED light-emitting devices can be independently controlled with just one signal input line plus a positive power supply line and a negative power supply line. The wiring is simple, and the transparency of the transparent display screen is improved.

Description

Technical Field

[0001] This application relates to the field of transparent display technology, specifically to a transparent display screen and display module. Background Technology

[0002] Currently, integrated lamp and driver products have advantages such as high integration, no scan lines, and simple substrate, and are widely used in ultra-thin displays, transparent displays, and other fields. However, they also have obvious disadvantages, such as high customization requirements, high cost, and complex manufacturing processes.

[0003] Built-in IC LEDs offer high integration of LED devices and lower requirements for the PCB module; typically, 1-2 layers of PCB are sufficient. This has led to the development of various transparent screens. Furthermore, built-in IC LEDs allow for static control of the LEDs, preventing the formation of scan lines on the screen.

[0004] In related technologies, the high cost of integrated IC LED displays is one of their drawbacks. This led to the development of multi-chip (one IC driving multiple LED groups) integrated IC LED displays, effectively reducing their cost. However, the overall package shape of multi-chip integrated IC LED displays makes it difficult to manufacture high-transparency transparent screen products.

[0005] Therefore, it is necessary to design a new transparent display screen to overcome the above problems. Summary of the Invention

[0006] This application provides a transparent display screen and display module, which can solve the technical problem of difficulty in manufacturing transparent screens with high transparency in related technologies.

[0007] In a first aspect, embodiments of this application provide a transparent display screen, comprising: a substrate, on the same side of which at least one driving chip and a plurality of LED light-emitting devices are disposed, each of the LED light-emitting devices comprising a plurality of light-emitting chips, each of the driving chips being electrically connected to and controlling at least two of the LED light-emitting devices, each of the LED light-emitting devices having a common electrode pin and a non-common electrode pin electrically connected to the light-emitting chips; the driving chip having a signal input pin, a positive power supply pin, a negative power supply pin, at least two common electrode control pins for the light-emitting devices and a plurality of non-common electrode control pins for the light-emitting devices, the common electrode control pins for the light-emitting devices being electrically connected one-to-one to the common electrode pins of the LED light-emitting devices, and the non-common electrode control pins for the light-emitting devices being electrically connected to the corresponding non-common electrode pins.

[0008] In conjunction with the first aspect, in one embodiment, the substrate is provided with a VCC pad, a DIN pad, and a GND pad, wherein the VCC pad is electrically connected to the positive power supply pin, the DIN pad is electrically connected to the signal input pin, and the GND pad is electrically connected to the negative power supply pin.

[0009] In conjunction with the first aspect, in one embodiment, the substrate is provided with a first layer of metal lines and a second layer of metal lines stacked and spaced apart. The first layer of metal lines includes the VCC pad, the DIN pad, and the GND pad, and the driver chip and the LED light-emitting device are both fixed on the first layer of metal lines. The DIN pad is electrically connected to the signal input pin through the first layer of metal lines, and the VCC pad and the GND pad are correspondingly electrically connected to the positive power supply pin and the negative power supply pin through the first layer of metal lines, the second layer of metal lines, and conductive holes provided on the substrate.

[0010] In conjunction with the first aspect, in one embodiment, the first layer of metal circuitry further includes signal input pads, power positive pads, power negative pads, common electrode control pads, and light-emitting chip control pads, which are respectively electrically connected to the signal input pin, the power positive pin, the power negative pin, the light-emitting device common electrode control pin, and the light-emitting device non-common electrode control pin. It also includes a common electrode pad and a non-common electrode pad electrically connected to the LED light-emitting device. The first layer of metal circuitry further includes a signal metal connection line electrically connecting the DIN pad and the signal input pad, and a first metal connection line electrically connecting the common electrode control pad and the common electrode pad, as well as the light-emitting chip control pad and the non-common electrode pad.

[0011] In conjunction with the first aspect, in one embodiment, the second layer of metal circuitry includes a positive metal connection line electrically connecting the VCC pad to the positive power pad, a negative metal connection line electrically connecting the GND pad to the negative power pad, and a second metal connection line. Among the multiple LED light-emitting devices electrically connected to the same driver chip, light-emitting chips with the same emitting color are electrically connected through the second metal connection line.

[0012] In conjunction with the first aspect, in one embodiment, a plurality of power positive pads in the same column are electrically connected via the positive metal connection line, the first layer of metal lines, and the conductive via; a plurality of power negative pads in the same column are electrically connected via the negative metal connection line, the first layer of metal lines, and the conductive via; and a plurality of signal input pads in the same column are electrically connected via the signal metal connection line.

[0013] In conjunction with the first aspect, in one embodiment, the substrate has a first layer of metal lines and a second layer of metal lines stacked and spaced apart. The first layer of metal lines includes the VCC pad, the DIN pad, and the GND pad, and the driver chip and the LED light-emitting device are both fixed on the first layer of metal lines. The DIN pad is electrically connected to the signal input pin through the first layer of metal lines, the second layer of metal lines, and a conductive hole provided on the substrate, and the VCC pad and the GND pad are correspondingly electrically connected to the positive power supply pin and the negative power supply pin through the first layer of metal lines, the second layer of metal lines, and a conductive hole provided on the substrate.

[0014] In conjunction with the first aspect, in one embodiment, each of the driving chips is electrically connected to and controls two LED light-emitting devices, the two LED light-emitting devices being referred to as a first LED light-emitting device and a second LED light-emitting device; the driving chip has two common electrode control pins for the light-emitting devices, one of which is electrically connected to the common electrode pin of the first LED light-emitting device, and the other is electrically connected to the common electrode pin of the second LED light-emitting device; the number of non-common electrode control pins for the light-emitting devices is the same as the number of non-common electrode pins of the first LED light-emitting device and they are electrically connected in a one-to-one correspondence, and the number of non-common electrode control pins for the light-emitting devices is the same as the number of non-common electrode pins of the second LED light-emitting device and they are electrically connected in a one-to-one correspondence.

[0015] In conjunction with the first aspect, in one embodiment, a plurality of the LED light-emitting devices are uniformly distributed around the driver chip.

[0016] Secondly, embodiments of this application provide a display module, which includes a housing and the aforementioned transparent display screen mounted on the housing.

[0017] The beneficial effects of the technical solutions provided in this application include: By setting at least one driver chip and multiple LED light-emitting devices on the same side of the substrate, and electrically connecting each driver chip to at least two LED light-emitting devices, one driver chip can control multiple LED light-emitting devices. This reduces the number of driver chips and the wiring on the substrate. Furthermore, the driver chip in this embodiment can input signals through signal input pins. Each light-emitting device's common electrode control pin, combined with its non-common electrode control pin, can independently control one LED light-emitting device. Therefore, multiple LED light-emitting devices can be independently controlled through a single signal input line plus a positive power line and a negative power line. This simplifies the wiring, improves the transparency of the transparent display screen, and solves the technical problem of difficulty in manufacturing highly transparent screens in related technologies. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of pin definitions for a driver chip provided in an embodiment of this application; Figure 2 This is a schematic diagram of a one-to-two structure in a transparent display screen provided in an embodiment of this application; Figure 3 Provided for the embodiments of this application Figure 2 A schematic diagram of the transparent display screen formed by the structure shown; Figure 4 for Figure 3 A schematic diagram of the first layer of metal circuitry in a transparent display screen. Figure 5 for Figure 3 A schematic diagram of the second layer of metal circuitry in a transparent display screen. Figure 6 A schematic diagram illustrating the pin definition of another driver chip provided in an embodiment of this application; Figure 7 This is a schematic diagram of a one-to-four structure in a transparent display screen provided in an embodiment of this application; Figure 8 Provided for the embodiments of this application Figure 7 A schematic diagram of the transparent display screen formed by the structure shown; Figure 9 for Figure 8 A schematic diagram of the first layer of metal circuitry in a transparent display screen. Figure 10 for Figure 8 A schematic diagram of the second layer of metal circuitry in a transparent display screen.

[0020] In the picture: 1. Substrate; 21. Signal input pin; 22. Positive power supply pin; 23. Negative power supply pin; 24. Common control pin for light-emitting device; 25. Non-common control pin for light-emitting device; 3. First layer of metal wiring; 301, VCC pad; 302, DIN pad; 303, GND pad; 31. Signal input pad; 32. Positive power supply pad; 33. Negative power supply pad; 34. Common control pad; 35. LED control pad; 36. Common pad; 37. Non-common pad; 38. Signal metal connection line; 39. First metal connection line; 4. Second layer metal wiring; 41. Positive electrode metal connection wire; 42. Negative electrode metal connection wire; 43. Second metal connection wire; 5. Conductive hole; 6. Through hole. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0022] This application provides a transparent display screen and a display module, which can solve the technical problem of difficulty in manufacturing transparent screens with high transparency in related technologies.

[0023] See Figure 3 As shown, this application embodiment provides a transparent display screen, which may include: a substrate 1, on the same side of which at least one driving chip and a plurality of LED light-emitting devices are provided. Each LED light-emitting device includes a plurality of light-emitting chips. Each driving chip is electrically connected to and controls at least two LED light-emitting devices. Each LED light-emitting device has a common electrode pin and a non-common electrode pin electrically connected to the light-emitting chips. The driving chip has a signal input pin 21, a power positive electrode pin 22, a power negative electrode pin 23, at least two light-emitting device common electrode control pins 24, and a plurality of light-emitting device non-common electrode control pins 25. The light-emitting device common electrode control pins 24 are electrically connected one-to-one to the common electrode pins of the LED light-emitting devices, and the light-emitting device non-common electrode control pins 25 are electrically connected to the corresponding non-common electrode pins.

[0024] In this embodiment, one driver chip can drive two LED light-emitting devices ( Figure 2 As shown), it can also drive three or four LED light-emitting devices (as shown). Figure 7 (As shown), or more LED light-emitting devices, are not limited here. Each LED light-emitting device can be equipped with three RGB light-emitting chips, or other light-emitting chips can be used as needed. This embodiment mainly uses the setting of three RGB light-emitting chips as an example for explanation.

[0025] Figure 1The driver chip shown has a signal input pin 21 (DI), a power supply positive pin 22 (VCC), a power supply negative pin 23 (GND), two common control pins 24 for the light-emitting devices (L0: control pin for the first LED light-emitting device, L1: control pin for the second LED light-emitting device), and three non-common control pins 25 for the light-emitting devices (R: control pin for the red light chip, G: control pin for the green light chip, B: control pin for the blue light chip, controlling the RGB chip). This driver chip can control two LED light-emitting devices.

[0026] Figure 6 The driver chip shown has a signal input pin 21 (DI), a power supply positive pin 22 (VCC), a power supply negative pin 23 (GND), four common control pins for light-emitting devices 24 (L0: first LED light-emitting device control pin, L1: second LED light-emitting device control pin, L2: third LED light-emitting device control pin, L3: fourth LED light-emitting device control pin), and three non-common control pins for light-emitting devices 25 (R: red light chip control pin, G: green light chip control pin, B: blue light chip control pin, controlling the RGB chip respectively). This driver chip can control four LED light-emitting devices.

[0027] In related technologies, most transparent displays are designed as a one-to-one system (i.e., one driver chip controls one LED light-emitting device). This design requires a large number of driver chips and is costly. Some one-to-many solutions are integrated lamp and driver solutions, which require a large number of driver chips and are difficult to achieve high transparency. There are also one-to-many solutions with separate lamp and driver, which use many pins such as VCC, GND, FDI, DI, and DO, making the wiring on the display substrate 1 more complex. This embodiment sets at least one driver chip and multiple LED light-emitting devices on the same side of the substrate 1. The LED light-emitting devices are designed separately from the driver chip, and each driver chip is electrically connected to at least two LED light-emitting devices, enabling one driver chip to control multiple LED light-emitting devices. Compared with a transparent screen with one LED light-emitting device, this method has a lower cost. Furthermore, the multi-LED light-emitting device in this embodiment reduces the number of driver chips and the wiring on the substrate 1. In addition, the driver chip in this embodiment can realize signal input through signal input pin 21. Each light-emitting device's common electrode control pin 24, combined with the light-emitting device's non-common electrode control pin 25, can independently control one LED light-emitting device. Multiple light-emitting device common electrode control pins 24 can realize the independent control of multiple LED light-emitting devices. Therefore, multiple LED light-emitting devices can be independently controlled by one driver chip, one signal input line, plus a positive power line and a negative power line. Through reasonable circuit optimization design, multi-LED light-emitting devices can reduce the number of driver chips used, simplify wiring, and improve the transparency of the transparent display screen. This achieves high transparency and lower cost, solving the technical problem of difficulty in manufacturing high-transparency transparent screens in related technologies.

[0028] Further, in one embodiment, the substrate 1 is provided with a VCC pad 301, a DIN pad 302, and a GND pad 303. The VCC pad 301 is electrically connected to the positive power supply pin 22, the DIN pad 302 is electrically connected to the signal input pin 21, and the GND pad 303 is electrically connected to the negative power supply pin 23. See also Figure 3 As shown, three types of pads, VCC pad 301, DIN pad 302 and GND pad 303, are provided on the surface of substrate 1. VCC pad 301, DIN pad 302 and GND pad 303 are electrically connected to the corresponding three pins of the driver chip. The driver chip can be controlled by these three signals, so that the driver chip can control each LED light-emitting device connected to it to light up independently.

[0029] Based on the above technical solution, in one embodiment, the substrate 1 is provided with a first layer of metal lines 3 and a second layer of metal lines 4 that are stacked and spaced apart. The first layer of metal lines 3 includes the VCC pad 301, the DIN pad 302 and the GND pad 303, and the driver chip and the LED light-emitting device are both fixed on the first layer of metal lines 3. The DIN pad 302 is electrically connected to the signal input pin 21 through the first layer of metal lines 3. The VCC pad 301 and the GND pad 303 are electrically connected to the positive power supply pin 22 and the negative power supply pin 23 respectively through the first layer of metal lines 3, the second layer of metal lines 4 and the conductive holes 5 provided on the substrate 1.

[0030] See Figure 3 As shown, in this embodiment, two layers of circuits are provided on the substrate 1, namely the first layer of metal circuits 3 and the second layer of metal circuits 4. Each layer of circuits can be provided with a corresponding substrate 1. That is, in this embodiment, two layers of substrate 1 can be provided (of course, one layer of substrate 1 can also be provided, and two layers of circuits distributed vertically and horizontally can be provided on the one layer of substrate 1). Each layer of substrate 1 is a PCB. In this embodiment, the first layer of metal lines 3 is located above the second layer of metal lines 4. The first layer of metal lines 3 includes a VCC pad 301, a DIN pad 302, and a GND pad 303. The VCC pad 301, DIN pad 302, and GND pad 303 are preferably disposed at the edge of the substrate 1. The DIN pad 302 can be electrically connected to the signal input pin 21 of the driver chip through a single wire in the first layer of metal lines 3. The VCC pad 301 can be electrically connected to the positive power supply pin 22 through the upper first layer of metal lines 3, the lower second layer of metal lines 4, and the conductive hole 5. The GND pad 303 can also be electrically connected to the negative power supply pin 23 through the upper first layer of metal lines 3, the lower second layer of metal lines 4, and the conductive hole 5. The second layer of metal lines 4 and the first layer of metal lines 3 are electrically connected through the conductive hole 5 penetrating the substrate 1. In this embodiment, the conductive lines of DIN pad 302 are set in the first layer of metal lines 3, and a small portion of the conductive lines of VCC pad 301 and GND pad 303 are set in the first layer of metal lines 3, while the majority are set in the second layer of metal lines 4. The conductive lines of DIN pad 302 and the conductive lines of VCC pad 301 and GND pad 303 may overlap in the vertical direction.

[0031] In other embodiments, the DIN pad 302 can also be connected to the signal input pin 21 via the first layer metal line 3 and the second layer metal line 4, just like the VCC pad 301.

[0032] In this embodiment, the transparent display driver chip and LED light-emitting devices are placed on the same layer, which facilitates production and adopts a lamp driver separation scheme. When there is a dead LED, the faulty chip can be repaired separately, which facilitates low-cost maintenance in the future (when the lamp driver is integrated, the overall driver IC chip and RGB chip need to be replaced during maintenance, which is more expensive).

[0033] Further, in one embodiment, the first layer of metal circuit 3 further includes signal input pads 31, power positive pads 32, power negative pads 33, common electrode control pads 34, and light-emitting chip control pads 35, which are respectively electrically connected to the signal input pin 21, the power positive pin 22, the power negative pin 23, the light-emitting device common electrode control pin 24, and the light-emitting device non-common electrode control pin 25. It also includes a common electrode pad 36 and a non-common electrode pad 37 electrically connected to the LED light-emitting device. The first layer of metal circuit 3 further includes a signal metal connection line 38 electrically connecting the DIN pad 302 and the signal input pad 31, and a first metal connection line 39 electrically connecting the common electrode control pad 34 and the common electrode pad 36, and the light-emitting chip control pad 35 and the non-common electrode pad 37.

[0034] See Figure 2 As shown, in this embodiment, the first layer of metal circuit 3 is provided with a signal input pad 31, a power positive pad 32, a power negative pad 33, two common electrode control pads 34, and three light-emitting chip control pads 35 corresponding to the position of a driver chip. A common electrode pad 36 and three non-common electrode pads 37 are provided corresponding to the position of an LED light-emitting device. The DIN pad 302 is connected to the signal input pad 31 through the signal metal connection line 38. One common electrode control pad 34 (L0) is connected to one common electrode pad 36 (L0) through the first metal connection line 39. Another common electrode control pad 34 (L1) is connected to another common electrode pad 36 (L1) through the first metal connection line 39. The R light-emitting chip control pad 35 is connected to one of the R non-common electrode pads 37 through the first metal connection line 39. The G light-emitting chip control pad 35 is connected to two G non-common electrode pads 37 through the first metal connection line 39. The B light-emitting chip control pad 35 is connected to one of the B non-common electrode pads 37 through the first metal connection line 39.

[0035] Further, in one embodiment, the second layer of metal circuit 4 includes a positive metal connection line 41 electrically connecting the VCC pad 301 and the power positive pad 32, a negative metal connection line 42 electrically connecting the GND pad 303 and the power negative pad 33, and a second metal connection line 43. Among the multiple LED light-emitting devices electrically connected to the same driver chip, light-emitting chips with the same light-emitting color are electrically connected through the second metal connection line 43.

[0036] See Figure 4 As shown, the VCC pad 301 located on the first layer metal line 3 is electrically connected to the positive metal connection line 41 of the second layer metal line 4 through the conductive hole 5. Figure 5 As shown, the GND pad 303 of the first layer metal line 3 is electrically connected to the negative metal connection line 42 of the second layer metal line 4 through the positive metal connection line 41 and another conductive hole 5; the GND pad 303 of the first layer metal line 3 is electrically connected to the negative metal connection line 42 of the second layer metal line 4 through the conductive hole 5, and is electrically connected to the negative power pad 33 of the first layer metal line 3 through the negative metal connection line 42 and another conductive hole 5. The two R non-common electrode pads 37 of the two LED light-emitting devices on the left and right sides of the driver chip are electrically connected to each other through the second metal connection line 43 of the second layer metal line 4, the conductive hole 5 and the first metal connection line 39 of the first layer metal line 3; the two B non-common electrode pads 37 of the two LED light-emitting devices on the left and right sides of the driver chip are electrically connected to each other through the second metal connection line 43 of the second layer metal line 4, the conductive hole 5 and the first metal connection line 39 of the first layer metal line 3.

[0037] Furthermore, in one embodiment, multiple positive power pads 32 in the same column are electrically connected via the positive metal connection line 41, the first layer metal line 3, and the conductive via 5; multiple negative power pads 33 in the same column are electrically connected via the negative metal connection line 42, the first layer metal line 3, and the conductive via 5; and multiple signal input pads 31 in the same column are electrically connected via the signal metal connection line 38. See also... Figure 3 As shown, multiple rows of driver chips and LED light-emitting devices electrically connected to each driver chip are arranged on substrate 1. Figure 3 Four rows of LED light-emitting devices are shown, with each pair of rows forming a group. On the top of the substrate 1, a VCC pad 301, a DIN pad 302, and a GND pad 303 are provided for each group, respectively connected to the VCC power supply positive terminal, the DI signal input terminal, and the GND power supply negative terminal. The signal input pads 31 in the same row are all electrically connected to the same DIN pad 302 via signal metal connection lines 38. Figure 4 (as shown), see also Figure 5As shown, the positive power pads 32 in the same column are all electrically connected to the same VCC pad 301 via positive metal connection wire 41, and the negative power pads 33 in the same column are all electrically connected to the same GND pad 303 via negative metal connection wire 42. In this way, the combination of the driver chip and the LED light-emitting device in the same column only requires a DI signal plus VCC and GND (the solution in related technologies also requires a spare FDI input pin and a DO signal output pin).

[0038] In other embodiments, multiple signal input pads 31 in the same column can also be electrically connected to the second metal line 4 via the first metal line 3.

[0039] Further, in some optional embodiments, the substrate 1 is provided with a first layer of metal lines 3 and a second layer of metal lines 4 stacked and spaced apart. The first layer of metal lines 3 includes the VCC pad 301, the DIN pad 302, and the GND pad 303, and the driver chip and the LED light-emitting device are both fixed on the first layer of metal lines 3; the DIN pad 302 is electrically connected to the signal input pin 21 through the first layer of metal lines 3, the second layer of metal lines 4, and the conductive hole 5 provided on the substrate 1. Figure 10 (As shown), and the VCC pad 301 and the GND pad 303 are electrically connected to the positive power supply pin 22 and the negative power supply pin 23 respectively through the first layer metal line 3, the second layer metal line 4 and the conductive hole 5 provided on the substrate 1. See Figure 8 As shown, this is a one-to-four configuration. In this embodiment, the main conductive lines connecting the signal input pin 21, the positive power supply pin 22, and the negative power supply pin 23 to the DIN pad 302, VCC pad 301, and GND pad 303 are located on the second layer metal line 4, while a small portion of the conductive lines are located on the first layer metal line 3. The connections between each LED light-emitting device and the driver chip are located on the first layer metal line 3. Figure 9 (As shown).

[0040] Of course, in other embodiments, the electrical connection between each LED light-emitting device and the driver chip can also be achieved through the first layer of metal lines 3 and the second layer of metal lines 4. The conductive lines connecting the signal input pin 21, the positive power supply pin 22, and the negative power supply pin 23 to the DIN pad 302, the VCC pad 301, and the GND pad 303 can also all be set in the first layer of metal lines 3.

[0041] See Figure 2 As shown, in this embodiment, each driver chip is electrically connected to and controls two LED light-emitting devices, which are referred to as the first LED light-emitting device and the second LED light-emitting device; see also Figure 1 As shown, the driver chip has two common electrode control pins 24 (L0, L1) for the light-emitting devices. One of the common electrode control pins 24 is electrically connected to the common electrode pin of the first LED light-emitting device, and the other common electrode control pin 24 is electrically connected to the common electrode pin of the second LED light-emitting device. The number of non-common electrode control pins 25 for the light-emitting devices is the same as the number of non-common electrode pins of the first LED light-emitting device and they are electrically connected in a one-to-one correspondence.

[0042] In the above embodiment, the L0 common electrode control pin 24 of the light-emitting device is connected to the L0 common electrode pin of the first LED light-emitting device, the L1 common electrode control pin 24 of the light-emitting device is connected to the L1 common electrode pin of the second LED light-emitting device, and the R, G, B non-common electrode control pins 25 of the light-emitting devices are respectively connected to the R, G, B non-common electrode pins of the first LED light-emitting device and the second LED light-emitting device.

[0043] See Figure 7 As shown, in this embodiment, each driver chip is electrically connected to and controls four LED light-emitting devices, which are designated as the first LED light-emitting device, the second LED light-emitting device, the third LED light-emitting device, and the fourth LED light-emitting device. Each of the first, second, third, and fourth LED light-emitting devices has a common electrode pin and a non-common electrode pin. (See also...) Figure 6 As shown, the driver chip has four common electrode control pins 24 (L0, L1, L2, L3) for the light-emitting devices. Each common electrode control pin 24 is electrically connected to the common electrode pin of one of the LED light-emitting devices. The number of non-common electrode control pins 25 for the light-emitting devices is the same as that of the first LED light-emitting device and they are electrically connected in a one-to-one correspondence. The number of non-common electrode control pins 25 for the light-emitting devices is the same as that of the second LED light-emitting device and they are electrically connected in a one-to-one correspondence. The number of non-common electrode control pins 25 for the light-emitting devices is the same as that of the third LED light-emitting device and they are electrically connected in a one-to-one correspondence. The number of non-common electrode control pins 25 for the light-emitting devices is the same as that of the fourth LED light-emitting device and they are electrically connected in a one-to-one correspondence.

[0044] In the above embodiment, the L0 common electrode control pin 24 of the light-emitting device is connected to the L0 common electrode pin of the first LED light-emitting device, the L1 common electrode control pin 24 of the light-emitting device is connected to the L1 common electrode pin of the second LED light-emitting device, the L2 common electrode control pin 24 of the light-emitting device is connected to the L2 common electrode pin of the third LED light-emitting device, and the L3 common electrode control pin 24 of the light-emitting device is connected to the L3 common electrode pin of the fourth LED light-emitting device; the R, G, and B non-common electrode control pins 25 of the light-emitting devices are respectively connected to the R, G, and B non-common electrode pins of the first LED light-emitting device, the second LED light-emitting device, the third LED light-emitting device, and the fourth LED light-emitting device.

[0045] Figure 8 The diagram shows four large LED light-emitting device arrays, totaling four groups. Each group on the edge of the schematic substrate 1 has a VCC pad 301, a DIN pad 302, and a GND pad 303, which are respectively connected to the positive terminal of the VCC power supply, the DI signal input, and the negative terminal of the GND power supply.

[0046] Furthermore, preferably, the plurality of said LED light-emitting devices are evenly distributed around the driver chip. See also Figure 2 As shown, when a driver chip is electrically connected to two LED light-emitting devices, the two LED light-emitting devices are symmetrically arranged on both sides of the driver chip; see also Figure 7 As shown, when a driver chip is electrically connected to four LED light-emitting devices, the four LED light-emitting devices are symmetrically and evenly distributed around the driver chip in the four directions of front, back, left, and right. The substrate 1 also has multiple through holes 6, with the driver chip and LED light-emitting devices positioned within the gaps between these through holes 6. For example, when a driver chip connects to two LED light-emitting devices, the driver chip is located between the front and back through holes 6, and each LED light-emitting device is located in the gap between the four through holes 6. By arranging the through holes 6, the transparency of the transparent display screen can be increased, and the gaps between the through holes 6 can be fully utilized for wiring.

[0047] The transparent display screen provided in this embodiment adopts a parallel addressing design for its multi-channel driver chip. Each column of driver chips and its connected LED light-emitting devices only require one DI signal, VCC signal, and GND signal. It also achieves high transparency display for multi-channel LED light-emitting devices. Taking the schematic diagram as an example, the transparent area accounts for more than 50% of the total area. If smaller LED devices are used, the transparent area will account for an even higher percentage.

[0048] In the above embodiments, in order to further improve the transparency of the transparent screen, the PCB substrate 1 can be made of a double-layer transparent FPC (Flexible Printed Circuit) board, so that the area outside the transparent area also has a certain degree of transparency.

[0049] This application also provides a display module, which includes a housing and the aforementioned transparent display screen mounted on the housing. The transparent display screen in this embodiment can be any of the transparent display screens provided in the above embodiments and achieve the corresponding functions, which will not be elaborated further here.

[0050] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0051] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0052] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A transparent display screen, characterized in that, It includes: A substrate (1) has at least one driving chip and multiple LED light-emitting devices on the same side. Each LED light-emitting device includes multiple light-emitting chips. Each driving chip is electrically connected to and controls at least two LED light-emitting devices. Each LED light-emitting device has a common electrode pin and a non-common electrode pin that are electrically connected to the light-emitting chips. The driver chip has a signal input pin (21), a power positive pin (22), a power negative pin (23), at least two light-emitting device common electrode control pins (24) and multiple light-emitting device non-common electrode control pins (25). The light-emitting device common electrode control pins (24) are electrically connected to the common electrode pins of the LED light-emitting devices, and the light-emitting device non-common electrode control pins (25) are electrically connected to the corresponding non-common electrode pins.

2. The transparent display screen as described in claim 1, characterized in that, The substrate (1) is provided with VCC pad (301), DIN pad (302) and GND pad (303). The VCC pad (301) is electrically connected to the positive power supply pin (22), the DIN pad (302) is electrically connected to the signal input pin (21), and the GND pad (303) is electrically connected to the negative power supply pin (23).

3. The transparent display screen as described in claim 2, characterized in that, The substrate (1) is provided with a first layer of metal lines (3) and a second layer of metal lines (4) stacked and spaced apart. The first layer of metal lines (3) includes the VCC pad (301), the DIN pad (302) and the GND pad (303), and the driver chip and the LED light-emitting device are both fixed on the first layer of metal lines (3). The DIN pad (302) is electrically connected to the signal input pin (21) through the first layer metal line (3). The VCC pad (301) and the GND pad (303) are electrically connected to the positive power supply pin (22) and the negative power supply pin (23) respectively through the first layer metal line (3), the second layer metal line (4) and the conductive hole (5) provided on the substrate (1).

4. The transparent display screen as described in claim 3, characterized in that, The first layer of metal circuit (3) also includes a signal input pad (31), a power positive pad (32), a power negative pad (33), a common electrode control pad (34), and a light-emitting chip control pad (35) that are electrically connected to the signal input pin (21), the power positive pin (22), the power negative pin (23), the light-emitting device common electrode control pin (24), and the light-emitting device non-common electrode control pin (25), respectively. It also includes a common electrode pad (36) and a non-common electrode pad (37) that are electrically connected to the LED light-emitting device. The first layer of metal circuit (3) also includes a signal metal connection line (38) that electrically connects the DIN pad (302) and the signal input pad (31), and a first metal connection line (39) that electrically connects the common electrode control pad (34) and the common electrode pad (36), as well as the light-emitting chip control pad (35) and the non-common electrode pad (37).

5. The transparent display screen as described in claim 4, characterized in that, The second layer of metal lines (4) includes a positive metal connection line (41) that electrically connects the VCC pad (301) and the power positive pad (32), a negative metal connection line (42) that electrically connects the GND pad (303) and the power negative pad (33), and a second metal connection line (43). Among the multiple LED light-emitting devices electrically connected to the same driver chip, the light-emitting chips with the same light-emitting color are electrically connected through the second metal connection line (43).

6. The transparent display screen as described in claim 5, characterized in that, Multiple power positive pads (32) in the same column are electrically connected through the positive metal connection line (41), the first layer metal line (3) and the conductive hole (5); Multiple power supply negative pads (33) in the same column are electrically connected through the negative metal connection line (42), the first layer metal line (3) and the conductive hole (5); Multiple signal input pads (31) in the same column are electrically connected via the signal metal connection line (38).

7. The transparent display screen as described in claim 2, characterized in that, The substrate (1) is provided with a first layer of metal lines (3) and a second layer of metal lines (4) stacked and spaced apart. The first layer of metal lines (3) includes the VCC pad (301), the DIN pad (302) and the GND pad (303), and the driver chip and the LED light-emitting device are both fixed on the first layer of metal lines (3). The DIN pad (302) is electrically connected to the signal input pin (21) through the first layer metal line (3), the second layer metal line (4) and the conductive hole (5) provided on the substrate (1), and the VCC pad (301) and the GND pad (303) are electrically connected to the positive power supply pin (22) and the negative power supply pin (23) respectively through the first layer metal line (3), the second layer metal line (4) and the conductive hole (5) provided on the substrate (1).

8. The transparent display screen as described in claim 1, characterized in that, Each of the driver chips is electrically connected to and controls two of the LED light-emitting devices, which are referred to as the first LED light-emitting device and the second LED light-emitting device; The driver chip has two common electrode control pins (24) for the light-emitting devices. One of the common electrode control pins (24) is electrically connected to the common electrode pin of the first LED light-emitting device, and the other common electrode control pin (24) is electrically connected to the common electrode pin of the second LED light-emitting device. The number of non-common electrode control pins (25) of the light-emitting device is the same as that of the non-common electrode pins of the first LED light-emitting device and they are electrically connected in a one-to-one correspondence. The number of non-common electrode control pins (25) of the light-emitting device is the same as that of the non-common electrode pins of the second LED light-emitting device and they are electrically connected in a one-to-one correspondence.

9. The transparent display screen as described in claim 1, characterized in that, Multiple LED light-emitting devices are evenly distributed around the driver chip.

10. A display module, characterized in that, It includes a housing and a transparent display screen as described in claim 1 mounted on the housing.

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