Method of manufacturing a cable assembly and cable assembly

Abstract

This invention discloses a method for manufacturing a cable assembly and the cable assembly itself, relating to the field of cable technology. The method for manufacturing the cable assembly includes the following steps: providing a core having a conductive groove and multiple air slots, the multiple air slots being spaced apart along the axial direction of the core and extending radially along the core; the conductive groove extending along the axial direction of the core and connecting the multiple air slots, with both ends of the conductive groove being open; providing a shielding layer and covering the outer periphery of the core; and providing an insulating layer and covering the outer periphery of the shielding layer. The technical solution provided by this invention effectively reduces the equivalent dielectric constant of the cable assembly, thereby optimizing the high-frequency transmission performance of the cable and improving the applicability of the cable assembly.

Description

Technical Field

[0001] This invention relates to the field of cable technology, and in particular to a method for manufacturing a cable assembly and the cable assembly itself. Background Technology

[0002] In applications such as high-speed signal transmission, radio frequency communication, and data center interconnection, the equivalent dielectric constant of cable assemblies is a core parameter that determines signal transmission speed, impedance stability, and high-frequency loss. The higher the equivalent dielectric constant, the greater the signal transmission delay and the more severe the high-frequency polarization loss, which can easily lead to problems such as signal phase shift, impedance mismatch, and limited transmission bandwidth, making it unsuitable for high-frequency and high-speed transmission conditions.

[0003] In existing cable assembly manufacturing methods, the core of the cable assembly typically uses a solid structure. Due to the dense dielectric filling and the high intrinsic dielectric constant of the material, the final cable assembly has a high overall equivalent dielectric constant. Even with foaming processes to improve the substrate, the dielectric reduction effect is still limited by the inherent dielectric properties of the substrate, making it difficult to meet the transmission performance requirements of high-frequency and high-speed transmission scenarios. Summary of the Invention

[0004] The main objective of this invention is to propose a method for manufacturing a cable assembly and a cable assembly, which aims to effectively reduce the equivalent dielectric constant of the cable assembly, thereby optimizing the high-frequency transmission performance of the cable and improving the applicability of the cable assembly.

[0005] To achieve the above objectives, the present invention provides a method for manufacturing a cable assembly, comprising the following steps: A core is provided, the core having a through groove and a plurality of air grooves, the plurality of air grooves being spaced apart in the axial direction of the core and extending radially along the core, the through groove extending in the axial direction of the core and communicating with the plurality of air grooves, and both ends of the through groove being open; A shielding layer is provided, and the shielding layer covers the outer periphery of the core; An insulating layer is provided, and the insulating layer is wrapped around the outer periphery of the shielding layer.

[0006] In one embodiment, the step of providing a core having a through groove and a plurality of air grooves, wherein the plurality of air grooves are spaced apart in the axial direction of the core and all extend radially along the core, and the through groove extends axially along the core and communicates with the plurality of air grooves, and both ends of the through groove are open, includes: At least one conductor and a dielectric substrate are provided, and the dielectric substrate is wrapped around the periphery of all the conductors to form the core together; The conductive groove and a plurality of air grooves are respectively formed on the two opposite outer surfaces of the medium substrate.

[0007] In one embodiment, in the axial direction of the conductor, a plurality of air grooves on two opposite outer surfaces of the dielectric substrate are arranged in an alternating pattern.

[0008] In one embodiment, the dielectric substrate comprises two dielectric layers stacked together; The step of providing at least one of the conductors and one of the dielectric substrates, and encapsulating the dielectric substrate around the periphery of all the conductors to collectively form the core, includes: Provide at least one conductor and two dielectric layers, wherein a positioning groove is formed on one side of one of the dielectric layers facing the other dielectric layer corresponding to one of the conductors; Place all the conductors in the corresponding positioning slots, and stack and connect the two dielectric layers.

[0009] In one embodiment, the depth of the positioning groove is H1, and the outer diameter of the conductor is d, satisfying the condition: 1 / 2d < H1 < d; The step of placing all the conductors in their corresponding positioning slots and connecting the two dielectric layers together includes: Place all the conductors into the corresponding positioning slots; FEP film is available; The FEP film is stacked on top of the dielectric layer on which the conductor is placed, and another dielectric layer is stacked on top of the FEP film; The stacked dielectric layer and the FEP film are hot-pressed, wherein the hot-pressing temperature is greater than the melting point of the FEP film and less than the melting point of the dielectric layer, so that the FEP film melts and fills the gap between the groove wall of the positioning groove and the outer peripheral surface of the conductor.

[0010] In one embodiment, the step of providing a core having a through groove and a plurality of air grooves, wherein the plurality of air grooves are spaced apart in the axial direction of the core and all extend radially along the core, and the through groove extends axially along the core and communicates with the plurality of air grooves, and both ends of the through groove are open, includes: The system provides at least one conductor and a dielectric substrate, wherein the conductive groove and a plurality of air grooves are formed inside the dielectric substrate, and the dielectric substrate is wrapped around the outer periphery of all the conductors to form the core.

[0011] In one embodiment, the dielectric substrate comprises two dielectric layers stacked together; The step of providing at least one of the conductors and one of the dielectric substrates, and encapsulating the dielectric substrate around the periphery of all the conductors to collectively form the core, includes: Provide at least one of the conductors and two of the dielectric layers; A positioning groove is formed on each of the two dielectric layers on one side facing each other, corresponding to a conductor, and a conductive groove and a plurality of air grooves are formed. Place all the conductors in the corresponding positioning slot of one of the dielectric layers, stack and connect the two dielectric layers, and align the air slots of the two dielectric layers one to the other.

[0012] In one embodiment, the depth of the positioning grooves in both dielectric layers is H2, and the outer diameter of the conductor is d, satisfying the condition: H2 = 1 / 2d; After providing at least one conductor and two dielectric layers, the fabrication method further includes: A low dielectric loss adhesive is applied to one side of one of the dielectric layers facing the other dielectric layer using a thin-film coating process, such that the thickness of the adhesive layer formed between the two dielectric layers is less than or equal to 10 μm.

[0013] In one embodiment, the core includes a conductor and a dielectric substrate covering the outer periphery of the conductor, wherein at least two conductors are spaced apart along their radial direction; Two opposing through slots are provided between each pair of adjacent conductors; or, along the arrangement direction of at least two conductors, two through slots are provided, with the two through slots located on opposite sides of at least two conductors.

[0014] The present invention also proposes a cable assembly manufactured by the cable assembly manufacturing method described in any of the above embodiments.

[0015] The technical solution of this invention, by opening multiple air slots spaced apart in the core, allows the air slots to be stably filled with air of extremely low dielectric constant. Simultaneously, by using axially extending, open-end conductive slots to connect all the air slots, air can be guided in and out of the slots, preventing the air in the slots from expanding due to heat during use and affecting the cable's transmission performance. Compared to existing manufacturing methods using solid core structures or foamed modified substrates, the air slots and conductive slots work together to replace part of the solid dielectric in the core with air, effectively reducing the overall equivalent dielectric constant of the manufactured cable assembly, reducing signal transmission delay and high-frequency polarization loss, thereby optimizing the cable's high-frequency transmission performance. This allows the manufactured cable assembly to better adapt to high-frequency, high-speed transmission conditions, improving the cable assembly's applicability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A schematic flowchart of an embodiment of the method for manufacturing a cable assembly provided by the present invention; Figure 2 for Figure 1 A detailed flowchart of one embodiment; Figure 3 for Figure 2 A detailed flowchart of one embodiment; Figure 4 for Figure 1 A detailed flowchart of another embodiment; Figure 5 for Figure 4 A detailed flowchart of one embodiment; Figure 6 A schematic diagram of a structure of an embodiment of the cable assembly provided by the present invention; Figure 7 for Figure 6 Exploded view of the structure shown; Figure 8 A schematic diagram of the structure of the dielectric substrate and conductor in an embodiment of the cable assembly provided by the present invention; Figure 9 A schematic diagram of another embodiment of the cable assembly provided by the present invention; Figure 10 for Figure 9 A partial exploded view of the structure shown; Figure 11 This is another structural schematic diagram of the dielectric substrate and conductor in an embodiment of the cable assembly provided by the present invention; Figure 12 for Figure 11 Exploded view of the structure shown; Figure 13 An exploded view of the dielectric substrate, conductor, and FEP film in an embodiment of the cable assembly provided by the present invention.

[0018] Explanation of icon numbers: 100. Conductor; 200. Dielectric substrate; 210. Dielectric layer; 211. Conductive groove; 212. Air groove; 213. Positioning groove; 300. Shielding layer; 400. Insulation layer; 500, FEP film.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] In applications such as high-speed signal transmission, radio frequency communication, and data center interconnection, the equivalent dielectric constant of cable assemblies is a core parameter that determines signal transmission speed, impedance stability, and high-frequency loss. The higher the equivalent dielectric constant, the greater the signal transmission delay and the more severe the high-frequency polarization loss, which can easily lead to problems such as signal phase shift, impedance mismatch, and limited transmission bandwidth, making it unsuitable for high-frequency and high-speed transmission conditions.

[0024] In existing cable assembly manufacturing methods, the core of the cable assembly typically uses a solid structure. Due to the dense dielectric filling and the high intrinsic dielectric constant of the material, the final cable assembly has a high overall equivalent dielectric constant. Even with foaming processes to improve the substrate, the dielectric reduction effect is still limited by the inherent dielectric properties of the substrate, making it difficult to meet the transmission performance requirements of high-frequency and high-speed transmission scenarios.

[0025] This invention proposes a method for manufacturing cable assemblies to effectively reduce the equivalent dielectric constant of the cable assemblies, thereby optimizing the high-frequency transmission performance of the cables and improving the applicability of the cable assemblies.

[0026] Please see Figure 1 In one embodiment, the method for manufacturing a cable assembly includes the following steps: A core is provided, the core having a through groove 211 and a plurality of air grooves 212, the plurality of air grooves 212 being spaced apart in the axial direction of the core and extending radially along the core, the through groove 211 extending in the axial direction of the core and connecting the plurality of air grooves 212, and both ends of the through groove 211 being open. A shielding layer 300 is provided, and the shielding layer 300 is wrapped around the outer periphery of the core; An insulating layer 400 is provided, and the insulating layer 400 is wrapped around the outer periphery of the shielding layer 300.

[0027] The core is the central structure that enables signal transmission in a cable assembly. The overall shape of the core determines the overall outer diameter of the cable assembly. Please refer to [link / reference needed]. Figures 6 to 12 Preferably, the core body has a rectangular cross-sectional shape, so that the final cable assembly has a flat structure with a rectangular cross-section. Compared with traditional round cables, the flat cable assembly can achieve more convenient and compact arrangement, which is more conducive to high-density integrated installation and adapts to narrow installation space.

[0028] The shielding layer 300 provides electromagnetic shielding for the core, preventing external electromagnetic interference from coupling to the core and suppressing the outward radiation of high-frequency signals from the core. The shielding layer 300 can be made of materials such as copper foil or aluminum foil, and is directly wrapped around the outer periphery of the core. Preferably, please refer to [reference needed]. Figures 6 to 10 The shielding layer 300 is wrapped around the core body in a longitudinal manner, which avoids the resonance effect caused by traditional winding wrapping and can reduce electromagnetic leakage at the joints and / or overlaps, thereby improving the shielding effect.

[0029] Insulation layer 400 provides external protection for the core and shielding layer 300, thus providing insulation protection for the entire cable assembly. (See also...) Figures 6 to 10The insulating layer 400 covers the entire outer periphery of the shielding layer 300 and is attached to the outer periphery of the shielding layer 300. The insulating layer 400 can be made of materials such as PET and PI, which does not affect the high-frequency performance and has good insulation and mechanical strength, and can effectively provide external protection.

[0030] Please refer to Figures 6 to 12 Multiple air slots 212 extend radially in the core and are spaced apart axially in the conductor 100. This increases the air content while ensuring the structural strength of the core, allowing the electromagnetic field to pass through a large amount of air during propagation, thereby significantly reducing the equivalent dielectric constant of the cable assembly. A conductive slot 211 connects all the air slots 212 along the axial direction of the core, and both ends of the conductive slot 211 are open. This allows the multiple air slots 212 to remain connected to the external space of the cable assembly even after the shielding layer 300 covers the outer periphery of the core. This prevents the air slots 212 from becoming sealed cavities, which could cause the air to expand and bulge in the core under high temperatures, ensuring the effective functioning of the air slots 212 and maintaining the structural stability of the cable assembly.

[0031] The cross-sectional shape of the air groove 212 and the guide groove 211 can be rectangular, semi-circular, trapezoidal or triangular, etc., and can be flexibly set according to the processing technology and air volume ratio requirements. There are no restrictions here.

[0032] The technical solution of this invention, by opening multiple air slots 212 spaced apart in the core, allows the air slots 212 to be stably filled with air of extremely low dielectric constant. Simultaneously, by using axially extending and open-ended conductive slots 211 to connect all the air slots 212, air can be guided in and out of the air slots 212, preventing the air in the air slots 212 from expanding due to heat during use and affecting the cable's transmission performance. Compared to existing manufacturing methods using solid core structures or foamed modified substrates, the air slots 212 and conductive slots 211 work together to replace part of the solid dielectric in the core with air, effectively reducing the overall equivalent dielectric constant of the manufactured cable assembly, reducing signal transmission delay and high-frequency polarization loss, thereby optimizing the high-frequency transmission performance of the cable. This allows the manufactured cable assembly to better adapt to high-frequency, high-speed transmission conditions, improving the applicability of the cable assembly.

[0033] Please see Figure 2 In one embodiment, a core is provided, the core having a through groove 211 and a plurality of air grooves 212, the plurality of air grooves 212 being spaced apart in the axial direction of the core and extending radially along the core, the through groove 211 extending axially along the core and communicating with the plurality of air grooves 212, and the step of having open ends at both ends of the through groove 211 includes: At least one conductor 100 and a dielectric substrate 200 are provided, and the dielectric substrate 200 is covered around the periphery of all conductors 100 to form a core together; Conductive grooves 211 and multiple air grooves 212 are respectively formed on the two opposite outer surfaces of the dielectric substrate 200.

[0034] Conductor 100 is the signal transmission carrier of the cable assembly. It can be made of silver-plated copper wire, bare copper wire, tin-plated copper wire, etc., ranging from 28AWG to 32AWG. The specific specifications can be flexibly selected according to the loss and the overall size of the cable assembly, and there are no restrictions here.

[0035] Please see Figures 6 to 13 The dielectric substrate 200 serves as the insulating support structure for the cable assembly, supporting and fixing the conductor 100. The dielectric substrate 200 covers the entire periphery of the conductor 100, and its equivalent dielectric constant affects the signal transmission speed. Therefore, the dielectric layer 210 uses a low-dielectric-constant polymer insulating material, such as polytetrafluoroethylene (PTFE), modified polyimide (PI), or liquid crystal polymer (LCP). Alternatively, in applications with relatively relaxed dielectric constant requirements, modified polyethylene terephthalate (PET) can be used as an alternative material. Preferably, the dielectric substrate 200 is made of PTFE, which has an extremely low dielectric constant and extremely low dielectric loss, significantly improving the signal transmission rate and usable frequency.

[0036] The overall equivalent dielectric constant of the cable assembly is primarily determined by the equivalent dielectric constant of the dielectric substrate 200. Satisfying the relation: ,in, Let be the dielectric constant of the fixed substrate of dielectric matrix 200. The relative permittivity of air is approximately 1. This represents the volume percentage of the fixed substrate in the dielectric substrate 200. The volume percentage of air tank 212 ( Therefore, after providing the air groove 212 on the dielectric substrate 200, This will significantly reduce [the air volume], and the more air troughs 212 there are, the larger their volume percentage will be. The lower the dielectric loss, the better. (Dielectric loss of dielectric substrate 200) Satisfying the relation: Total insertion loss of cable assembly Satisfying the relation: ,in, For the dielectric loss of conductor 100, For operating frequency, The equivalent loss tangent of the dielectric substrate 200 is therefore, at the same operating frequency ( constant), , Lowering it will make Reduce, and thus make This significantly reduces and effectively improves the transmission performance of high-frequency and high-speed signals. Thus, the arrangement of multiple air slots 212 can increase the air ratio while ensuring the structural strength of the dielectric substrate 200, thereby significantly reducing the overall equivalent dielectric constant and total insertion loss of the cable assembly, effectively meeting the requirements for low equivalent dielectric constant in high-frequency and high-speed signal transmission.

[0037] The dielectric substrate 200 has two opposing first surfaces and two opposing second surfaces on its outer surface, which are arranged alternately in the circumferential direction. Conductive grooves 211 and multiple air grooves 212 can be formed on the two first surfaces or the two second surfaces by means of pulling or mechanical cutting. This can effectively expand the setting space of the air grooves 212, ensure sufficient air volume ratio, and further reduce the risk of air loss. At the same time, it can ensure the structural strength of the dielectric substrate 200, avoid damaging the support stability of the dielectric substrate 200 for the conductor 100, and ensure the structural stability and service life of the cable assembly.

[0038] Please see Figures 6 to 10 In one embodiment, a plurality of air grooves 212 on the two opposite outer surfaces of the dielectric substrate 200 are staggered along the axial direction of the conductor 100.

[0039] The staggered arrangement of multiple air grooves 212 on the two first surfaces or two second surfaces prevents the dielectric substrate 200 from being excessively weakened by the air grooves 212 at the same cross-sectional position, which would be caused by the air grooves 212 being positioned opposite each other on the two first surfaces or two second surfaces. This avoids affecting the overall structural stability and strength of the dielectric substrate 200. At the same time, the staggered arrangement can further improve the uniformity of air distribution in the dielectric substrate 200, making the equivalent dielectric constant of each region of the dielectric substrate 200 more uniform, ensuring uniform and stable impedance, and further improving the stability of signal transmission. In addition, when the cable assembly is bent as a whole, the staggered arrangement of air grooves 212 can disperse bending stress, preventing stress concentration at the same cross-sectional position from causing cracking of the dielectric substrate 200, further improving the bending resistance and service life of the cable assembly.

[0040] Please see Figure 3 , Figures 6 to 13 In one embodiment, the dielectric substrate 200 includes two dielectric layers 210 stacked together; The step of providing at least one conductor 100 and a dielectric substrate 200, and covering the outer periphery of all conductors 100 with the dielectric substrate 200 to jointly form a core includes: At least one conductor 100 and two dielectric layers 210 are provided, and a positioning groove 213 is formed on one side of one dielectric layer 210 facing the other dielectric layer 210 corresponding to the conductor 100; Place all conductors 100 in the corresponding positioning slots 213, and stack and connect the two dielectric layers 210.

[0041] The positioning groove 213 extends along the axial direction of the conductor 100. The positioning groove 213 and the corresponding conductor 100 are in a clearance fit to confine and position the conductor 100 within the positioning groove 213, facilitating assembly. The conductor 100 is placed in the positioning groove 213, and the two dielectric layers 210 are stacked and clamped together to fix the position of the conductor 100. When the two dielectric layers 210 are connected, the conductor 100 is completely hidden between the two dielectric layers 210. That is, the dielectric substrate 200 covers the outer periphery of the conductor 100, ensuring the stability of the conductor 100's position and guaranteeing uniform and stable transmission impedance, reducing impedance fluctuations during signal transmission, and further ensuring transmission performance. The thickness of the dielectric layer 210 with the positioning groove 213 is greater than that of the dielectric layer 210 without the positioning groove 213. This ensures that after the conductor 100 is fixed by the two dielectric layers 210, the dielectric thickness on the opposite sides of the conductor 100 remains uniform or approximately uniform, making the dielectric distribution around the conductor 100 more uniform and further ensuring uniform and stable impedance.

[0042] After the two dielectric layers 210 are joined to form a complete dielectric substrate 200, slots are cut into it to easily process the conductive slots 211 and multiple air slots 212. The slotting process is easier to process and the processing accuracy is easier to control, which can effectively reduce processing costs and improve processing efficiency. After the slotting is completed, the shielding layer 300 is wrapped around the outer periphery of the two dielectric layers 210 as a whole, and then the insulating layer 400 is wrapped around the outer periphery of the shielding layer 300 to complete the cable assembly. The manufacturing process is also simpler.

[0043] Please see Figure 3 and Figure 13 In one embodiment, the groove depth of the positioning groove 213 is H1, and the outer diameter of the conductor 100 is d, satisfying the condition: 1 / 2d < H1 < d; The steps of placing all conductors 100 in the corresponding positioning slots 213 and stacking and connecting the two dielectric layers 210 include: Place all conductors 100 into the corresponding positioning slots 213; FEP film 500 is available; FEP film 500 is stacked on top of dielectric layer 210 on which conductor 100 is placed, and another dielectric layer 210 is stacked on top of FEP film 500. The stacked dielectric layer 210 and FEP film 500 are hot-pressed, wherein the hot-pressing temperature is greater than the melting point of FEP film 500 and less than the melting point of dielectric layer 210, so that FEP film 500 melts and fills the gap between the groove wall of positioning groove 213 and the outer peripheral surface of conductor 100.

[0044] A positioning groove 213 can be formed in one of the dielectric layers 210 by means of pulling or mechanical cutting. The positioning groove 213 is a U-shaped groove, and its curvature matches the outer diameter of the conductor 100. The side of the other dielectric layer 210 facing the positioning groove 213 is flat. When the conductor 100 is placed in the positioning groove 213, only a small part protrudes from the positioning groove 213. The flat surface behind the other dielectric layer 210 can press against the protruding part of the conductor 100 to stably lock and fix the conductor 100. There is no need to thicken the entire dielectric layer 210, which can effectively reduce the overall thickness of the cable assembly and is conducive to miniaturization.

[0045] The side of the two dielectric layers 210 facing away from each other is the first surface, and the sides of the two dielectric layers 210 together form the second surface. The air grooves 212 on the first or second surface can be connected to the positioning grooves 213 to further increase the volume ratio of air and effectively dissipate heat from the conductor 100.

[0046] The hot-pressing temperature is higher than the melting point of the FEP film 500 but lower than the melting point of the dielectric layer 210, causing the FEP film 500 to melt and generate rheological changes. Under pressure, the molten FEP flows downward along the surface of the conductor 100, squeezing out the air remaining between the groove wall of the positioning groove 213 and the outer peripheral surface of the conductor 100, and filling the gap between them. At the same time, the FEP film 500 can bond the two dielectric layers 210 into a complete dielectric substrate 200. The FEP film 500 itself has extremely low dielectric constant and dielectric loss, which will not negatively affect the overall transmission performance of the cable assembly. In addition, the bonding process is simple and easy to operate, the bonding strength is reliable, and it can ensure the structural stability of the dielectric substrate 200. Taking the dielectric layer 210 as an example, the hot pressing temperature can be set between 280℃ and 310℃. The FEP film in the middle (melting point of about 260℃) reaches the molten state, while the dielectric layer 210 still maintains solid rigidity (melting point of PTFE is about 327℃), which ensures the positioning stability and accuracy of the conductor 100, and at the same time ensures the regularity of the overall shape of the final cable assembly.

[0047] Please see Figure 4 In one embodiment, a core is provided, the core having a through groove 211 and a plurality of air grooves 212, the plurality of air grooves 212 being spaced apart in the axial direction of the core and extending radially along the core, the through groove 211 extending axially along the core and communicating with the plurality of air grooves 212, and the step of having both ends of the through groove 211 open includes: At least one conductor 100 and a dielectric substrate 200 are provided. Conductive grooves 211 and a plurality of air grooves 212 are formed inside the dielectric substrate 200, and the dielectric substrate 200 is wrapped around the outer periphery of all conductors 100 to form a core together.

[0048] Please see Figure 10 and Figure 11 Conductive slots 211 and multiple air slots 212 are formed inside the dielectric substrate 200, allowing both the conductive slots 211 and air slots 212 to be positioned close to the conductor 100. Since the electromagnetic field is mainly concentrated near the conductor 100 during high-frequency signal transmission, placing the air slots 212 close to the conductor 100 can more directly reduce the equivalent dielectric constant of the dielectric surrounding the conductor 100, resulting in a more significant dielectric reduction effect. This can further reduce signal transmission loss and improve transmission performance. The materials of the conductor 100 and the dielectric substrate 200, as well as the dielectric reduction principle of the air slots 212, can be referred to in the above embodiment and will not be repeated here.

[0049] Before the two dielectric layers 210 are joined to form a complete dielectric substrate 200, grooves are cut into it, thus creating conductive grooves 211 and air grooves 212 inside the dielectric substrate 200. This facilitates processing and shaping, eliminating the need for deep internal grooving on the formed complete dielectric substrate 200, effectively reducing processing difficulty and improving processing accuracy and efficiency. After the two dielectric layers 210 are joined, a shielding layer 300 is wrapped around the outer periphery of the two dielectric layers 210, and then an insulating layer 400 is wrapped around the outer periphery of the shielding layer 300, completing the cable assembly fabrication. The fabrication steps are equally simple.

[0050] Please see Figure 5 , Figure 11 and Figure 12 In one embodiment, the dielectric substrate 200 includes two dielectric layers 210 stacked together; The step of providing at least one of the conductors 100 and one of the dielectric substrates 200, and covering the outer periphery of all the conductors 100 to jointly form a core, includes: Provides at least one conductor 100 and two dielectric layers 210; A positioning groove 213 is formed on each side of the two dielectric layers 210 facing each other, corresponding to a conductor 100, and a conductive groove 211 and a plurality of air grooves 212 are formed. Place all conductors 100 in the corresponding positioning slot 213 of one of the dielectric layers 210, stack and connect the two dielectric layers 210, and make the air slots 212 of the two dielectric layers 210 face each other.

[0051] Both positioning slots 213 are clearance-fitted with the conductor 100 to jointly accommodate and position the conductor 100. Multiple air slots 212 of each dielectric layer 210 are connected to and perpendicularly connected to the positioning slots 213. The air slots 212 of the two dielectric layers 210 are connected one-to-one, forming a larger space to accommodate air and further improving the dielectric constant reduction effect. Preferably, the conductive slots 211 of the two dielectric layers 210 are opposite and connected, and the conductive slots 211 are adjacent to the corresponding positioning slots 213 to further ensure that air is concentrated around the conductor 100, thereby more fully reducing the equivalent dielectric constant around the conductor 100.

[0052] Please see Figure 5 , Figure 11 and Figure 12 In one embodiment, the groove depth of the positioning groove 213 of the two dielectric layers 210 is H2, and the outer diameter of the conductor 100 is d, satisfying the condition: H2=1 / 2d; After providing at least one conductor 100 and two dielectric layers 210, the fabrication method further includes: A low dielectric loss adhesive is applied to one side of one dielectric layer 210 facing the other dielectric layer 210 using a thin-film coating process, so that the thickness of the adhesive layer formed between the two dielectric layers 210 is less than or equal to 10 μm.

[0053] Preferably, the depth of the conductive groove 211 of each dielectric layer 210 is h, satisfying the condition: h < 1 / 4d, so as to ensure that the air groove 212 is connected to the external air, while avoiding affecting the stability of the positioning groove 213 for positioning the conductor 100, preventing the conductor 100 from shifting from the positioning groove 213 to the conductive groove 211, and ensuring that both the positioning groove 213 and the conductive groove 211 can function normally.

[0054] After applying the adhesive, positioning grooves 213, conductive grooves 211, and multiple air grooves 212 are quickly created on the opposite sides of the two dielectric layers 210 using methods such as pull cutting or mechanical cutting. The conductor 100 is then placed in the positioning groove 213, and the two dielectric layers 210 are overlapped and bonded. After the low-dielectric-loss adhesive cures, a complete dielectric substrate 200 is obtained. The steps of grooving and placing the conductor 100 can be completed within seconds, avoiding premature curing of the low-dielectric-loss adhesive which could affect the normal overlap and bonding of the two dielectric layers 210, resulting in high processing efficiency. The two dielectric layers 210 have the same thickness, ensuring that after the conductor 100 is fixed by both dielectric layers 210, the dielectric thickness on opposite sides of the conductor 100 remains uniform, resulting in a more uniform dielectric distribution around the conductor 100 and further ensuring uniform and stable impedance.

[0055] In the adhesive application step, the amount of low dielectric loss adhesive applied is controlled to ensure that the adhesive layer thickness between the two dielectric layers 210 is within 10 μm, thereby reducing the impact on the overall equivalent dielectric constant and dielectric loss of the cable assembly. The low dielectric loss adhesive can be a modified polyolefin, maleimide, or fluoropolymer adhesive, etc., with a dielectric constant close to that of the dielectric layer (such as PTFE), ensuring bonding strength while avoiding a significant increase in the overall equivalent dielectric constant of the dielectric substrate 200, thus preventing increased insertion loss during signal transmission and ensuring the transmission performance of high-frequency and high-speed signals.

[0056] In practical applications, please refer to Figures 6 to 10 The positioning grooves 213 of the two dielectric layers 210 have a depth of H2, and the outer diameter of the conductor 100 is d. When H2 = 1 / 2d, the positioning grooves 213 can be opened only on the side of the two dielectric layers 210 facing each other, and then the conductor 100 can be placed. The two dielectric layers 210 can be bonded and fixed by applying adhesive using a thin-film coating process. After the two dielectric layers 210 form a complete dielectric substrate 200, the positioning grooves 213 and the conductive grooves 211 can be opened on the first surface of the two dielectric layers 210 or the second surface they form together by means of pulling or mechanical cutting. Finally, the shielding layer 300 is wrapped around the outer periphery of the two dielectric layers 210 as a whole, and then the insulating layer 400 is wrapped around it to complete the manufacturing. In this way, the processing difficulty can be reduced while ensuring the dielectric reduction effect. No restrictions are imposed here.

[0057] Please see Figures 6 to 13 In one embodiment, the core includes a conductor 100 and a dielectric substrate 200 covering the outer periphery of the conductor, wherein at least two conductors 100 are arranged at radial intervals. Two opposing through slots 211 are provided between each pair of adjacent conductors 100; or, two through slots 211 are provided along the arrangement direction of at least two conductors 100, and the two through slots 211 are located on opposite sides of at least two conductors 100.

[0058] At least two conductors 100 are arranged at intervals along their own radial direction, that is, at intervals along the width direction of the cable assembly. The conductors 100 are arranged in pairs, and each pair of conductors 100 forms a differential signal pair to transmit high-frequency and high-speed signals. Multiple differential signal pairs are arranged side by side in sequence along the radial direction of the conductors 100, which can be used with the rectangular cross-section dielectric substrate 200 to achieve a flat arrangement, so that the finished cable assembly can be further adapted to the installation requirements of high-density integration.

[0059] Differential characteristic impedance of cable assembly (Target value 85Ω) satisfies the following relationship: , Where D is the equivalent outer diameter / width of the cable assembly, and d is the outer diameter of a single conductor 100. Therefore, when Decrease, under the same impedance ( While the current size remains unchanged, the width of the cable assembly can be significantly reduced, which is beneficial for miniaturization design. This allows the finished cable assembly to achieve lower insertion loss and more stable impedance matching in a smaller size, making it suitable for high-density, high-frequency, and high-speed transmission applications and improving the adaptability of the cable assembly.

[0060] In one embodiment, two opposing through slots 211 are provided between every two adjacent conductors 100. (See also...) Figures 6 to 8 When it is necessary to form conductive grooves 211 and multiple air grooves 212 on the opposite sides (first surfaces) of two dielectric layers 210, a conductive groove 211 is formed on each first surface corresponding to the position between two adjacent conductors 100, and the conductive grooves 211 on the two first surfaces are arranged opposite to each other; or, please refer to Figure 11 and Figure 12 When it is necessary to create conductive slots 211 and multiple air slots 212 on opposite sides of two dielectric layers 210, a conductive slot 211 is created in each dielectric layer 210 corresponding to the position between two adjacent conductors 100. The conductive slots 211 of the two dielectric layers 210 are arranged opposite each other and interconnected. Along the arrangement direction of at least two conductors 100, the conductive slots 211 of the two dielectric layers 210 are alternately arranged with the conductors 100. In this way, a larger air communication area can be formed between two adjacent conductors 100, further reducing the equivalent dielectric constant of the dielectric between adjacent conductors 100, reducing signal crosstalk between adjacent conductors 100, and improving the integrity of signal transmission; at the same time, it further ensures the uniformity of air dispersion, making the overall equivalent dielectric constant more uniform. In addition, on the same surface, all conductive slots 211 are connected to each other, which can further expand the air communication space, and while ensuring the overall structural strength of the dielectric substrate 200, maximize the air ratio, further reduce the equivalent dielectric constant, and improve transmission performance.

[0061] Please see Figure 9 and Figure 10In one embodiment, two through slots 211 are provided along the arrangement direction of at least two conductors 100, and the two through slots 211 are located on opposite sides of at least two conductors 100. That is, when it is necessary to open through slots 211 and multiple air slots 212 on the two second surfaces jointly formed by the two dielectric layers 210, one through slot 211 is opened on the same side of all conductors 100 on each second surface, and the through slot 211 is directly opposite to the conductor 100, so as to further ensure the uniformity of air dispersion and make the overall equivalent dielectric constant more uniform. The through slots 211 and multiple air slots 212 on the two second surfaces are respectively located on opposite sides of all conductors 100, which can further increase the air ratio in the regions on both sides of all conductors 100, and at the same time, cooperate with the corresponding air slots 212 to further reduce the equivalent dielectric constant of the entire dielectric substrate 200, and ensure the structural stability of the dielectric substrate 200.

[0062] Please see Figures 6 to 13 This invention also proposes a cable assembly, manufactured by a method for manufacturing a cable assembly. The specific steps of the method for manufacturing the cable assembly are described in the above embodiments. Since this cable assembly adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0063] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A method for manufacturing a cable assembly, characterized in that, Includes the following steps: A core is provided, the core having a through groove and a plurality of air grooves, the plurality of air grooves being spaced apart in the axial direction of the core and extending radially along the core, the through groove extending in the axial direction of the core and communicating with the plurality of air grooves, and both ends of the through groove being open; A shielding layer is provided, and the shielding layer covers the outer periphery of the core; An insulating layer is provided, and the insulating layer is wrapped around the outer periphery of the shielding layer.

2. The manufacturing method as described in claim 1, characterized in that, The step of providing a core having a conductive groove and a plurality of air grooves, wherein the plurality of air grooves are spaced apart along the axial direction of the core and all extend radially along the core, and the conductive groove extends along the axial direction of the core and connects to the plurality of air grooves, and both ends of the conductive groove are open, includes: At least one conductor and a dielectric substrate are provided, and the dielectric substrate is wrapped around the periphery of all the conductors to form the core together; The conductive groove and a plurality of air grooves are respectively formed on the two opposite outer surfaces of the medium substrate.

3. The manufacturing method as described in claim 2, characterized in that, Along the axial direction of the conductor, a plurality of air grooves on the two opposite outer surfaces of the dielectric substrate are arranged in an alternating pattern.

4. The manufacturing method as described in claim 2, characterized in that, The dielectric substrate comprises two dielectric layers stacked together. The step of providing at least one of the conductors and one of the dielectric substrates, and encapsulating the dielectric substrate around the periphery of all the conductors to collectively form the core, includes: Provide at least one conductor and two dielectric layers, wherein a positioning groove is formed on one side of one of the dielectric layers facing the other dielectric layer corresponding to one of the conductors; Place all the conductors in the corresponding positioning slots, and stack and connect the two dielectric layers.

5. The manufacturing method as described in claim 4, characterized in that, The depth of the positioning groove is H1, and the outer diameter of the conductor is d, satisfying the condition: 1 / 2d < H1 < d; The step of placing all the conductors in their corresponding positioning slots and connecting the two dielectric layers together includes: Place all the conductors into the corresponding positioning slots; FEP film is available; The FEP film is stacked on top of the dielectric layer on which the conductor is placed, and another dielectric layer is stacked on top of the FEP film; The stacked dielectric layer and the FEP film are hot-pressed, wherein the hot-pressing temperature is greater than the melting point of the FEP film and less than the melting point of the dielectric layer, so that the FEP film melts and fills the gap between the groove wall of the positioning groove and the outer peripheral surface of the conductor.

6. The manufacturing method as described in claim 1, characterized in that, The step of providing a core having a conductive groove and a plurality of air grooves, wherein the plurality of air grooves are spaced apart along the axial direction of the core and all extend radially along the core, and the conductive groove extends along the axial direction of the core and connects to the plurality of air grooves, and both ends of the conductive groove are open, includes: The system provides at least one conductor and a dielectric substrate, wherein the conductive groove and a plurality of air grooves are formed inside the dielectric substrate, and the dielectric substrate is wrapped around the outer periphery of all the conductors to form the core.

7. The manufacturing method as described in claim 6, characterized in that, The dielectric substrate comprises two dielectric layers stacked together. The step of providing at least one of the conductors and one of the dielectric substrates, and encapsulating the dielectric substrate around the periphery of all the conductors to collectively form the core, includes: Provide at least one of the conductors and two of the dielectric layers; A positioning groove is formed on each of the two dielectric layers on one side facing each other, corresponding to a conductor, and a conductive groove and a plurality of air grooves are formed. Place all the conductors in the corresponding positioning slot of one of the dielectric layers, stack and connect the two dielectric layers, and make the air slots of the two dielectric layers face each other.

8. The manufacturing method as described in claim 7, characterized in that, The depth of the positioning grooves in both dielectric layers is H2, and the outer diameter of the conductor is d, satisfying the condition: H2 = 1 / 2d; After providing at least one conductor and two dielectric layers, the fabrication method further includes: A low dielectric loss adhesive is applied to one side of the dielectric layer facing the other dielectric layer using a thin-film coating process, such that the thickness of the adhesive layer formed between the two dielectric layers is less than or equal to 10 μm.

9. The manufacturing method as described in claim 1, characterized in that, The core includes a conductor and a dielectric substrate covering the outer periphery of the conductor, wherein at least two conductors are arranged at intervals along their own radial direction; Two opposing through slots are provided between each pair of adjacent conductors; or, along the arrangement direction of at least two conductors, two through slots are provided, with the two through slots located on opposite sides of at least two conductors.

10. A cable assembly, characterized in that, It is manufactured by the method of manufacturing the cable assembly according to any one of claims 1 to 9.

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