A magnetic field orientation hot press forming device

Abstract

This invention discloses a magnetic field-oriented hot pressing molding apparatus. By integrating a heating mechanism precisely aligned with the orientation magnetic field region, it enables controllable heating of the raw material before applying a strong magnetic field. The main function of heating is to enhance the magnetic domain response capability of the magnetic material, especially for materials with high atomic coercivity. Heating makes it easier for the magnetic domains to achieve uniform alignment under the influence of an external magnetic field. This effectively improves the uniformity and stability of the magnetic domain orientation in the product.

Description

Technical Field

[0001] This invention relates to the field of magnetization equipment technology, and in particular to a magnetic field orientation hot pressing molding device. Background Technology

[0002] Existing magnetic field orientation molding devices generate a strong magnetic field through electromagnetic coils. Under the influence of this strong magnetic field, raw materials are oriented and compressed to obtain permanent magnets with high magnetic properties. In practical applications, it has been found that for some magnetic materials with high atomic coercivity, even with a sufficiently strong orientation magnetic field, their magnetic domains are still difficult to achieve a fully and uniformly oriented alignment at room temperature. This results in the orientation uniformity of the final product being less than expected. Summary of the Invention

[0003] Therefore, it is necessary to provide a magnetic field orientation hot pressing molding device to solve the problem that the orientation uniformity of products produced by existing magnetic field orientation molding devices is not as expected.

[0004] To achieve the above objectives, the present invention provides a magnetic field orientation hot pressing forming apparatus, characterized in that it includes: a support assembly, an electromagnet coil, a lifting mechanism, and a heating mechanism; The support assembly includes a fourth support plate, a third support plate, a second support plate, and a first support plate, which are arranged sequentially from top to bottom. The orientation mechanism includes a lower coil and an upper coil. The lower coil is located on the top of the first support plate and has a lower pole post inside. The upper coil is located on the bottom of the third support plate and above the lower coil, and has an upper pole post inside. The lifting mechanism is mounted on the fourth support plate; The heating mechanism includes an upper mold heating plate, a lower mold heating plate, and a temperature controller. The upper mold heating plate and the lower mold heating plate are electrically connected to the temperature controller. The upper mold heating plate is mounted on the lifting mechanism and rises or falls under the action of the lifting mechanism. The upper mold heating plate is located below the upper coil. The upper mold heating plate and the lower mold heating plate are directly opposite each other. The lower mold heating plate is mounted on the second support plate and is located above the lower coil. The lower mold heating plate carries magnetic raw materials.

[0005] Furthermore, the distance between the upper mold heating plate and the lower mold heating plate is 5 to 45 mm, and the distance between the upper pole post and the lower pole post is 115 to 125 mm.

[0006] Furthermore, the heating mechanism also includes a lower heat insulation pad and an upper heat insulation pad; The lower heat insulation pad is located on the bottom of the lower mold heating plate; The upper heat insulation pad is located on the top of the upper mold heating plate.

[0007] Furthermore, the upper heat insulation pad is a graphene upper heat insulation pad, and the lower heat insulation pad is a graphene lower heat insulation pad.

[0008] Furthermore, the lifting mechanism includes a servo pressure cylinder, an active lifting plate, a vertical sliding assembly, and a driven lifting plate; The fixed part of the servo pressure cylinder is located on the fourth support plate, and its telescopic part is located on the top of the active lifting plate, which is used to drive the active lifting plate to rise or fall. The vertical sliding assembly is located between the active lifting plate and the driven lifting plate and can slide relative to the third support plate. The driven lifting plate is located below the upper coil.

[0009] Furthermore, the third support plate is provided with a through hole, and the vertical sliding assembly includes an optical axis, a bearing seat and a linear bearing. The top of the optical axis is provided on the active lifting plate, and the bottom of the optical axis is provided on the driven lifting plate. The optical axis passes through the through hole of the third support plate, the bearing seat is provided in the through hole, and the linear bearing is provided in the bearing seat and sleeved on the optical axis.

[0010] Furthermore, there are multiple vertical sliding components, and the multiple vertical sliding components are evenly arranged on the outer ring of the upper coil; The driven lifting plate is provided with an upper clearance hole between the upper mold heating plate and the upper electrode head to avoid the upper coil and the upper electrode head, and the second support plate is provided with a lower clearance hole between the lower mold heating plate and the lower electrode head.

[0011] Furthermore, it also includes a feeding mechanism for feeding raw materials onto the lower mold heating plate.

[0012] Furthermore, the feeding mechanism includes a slide table, a material frame, and a moving assembly; The slide is mounted on the second support plate, with its top flush with the top of the lower mold heating plate and its end face abutting the corresponding end face of the lower mold heating plate. The material frame is placed on the slide, with its top and bottom both open. The moving component is mounted on the second support plate and connected to the material frame via a connecting plate, for pushing the material frame to slide onto the lower mold heating plate or onto the slide.

[0013] Furthermore, the moving component is a cylinder, and the feeding mechanism also includes a linear slide rail, which is located on the side of the slide table and the lower mold heating plate and supports the material frame.

[0014] The above technical solution has the following beneficial effects: By integrating a heating mechanism precisely aligned with the orientation magnetic field region, the raw material can be controlled to heat before the application of a strong magnetic field. The main function of heating is to enhance the magnetic domain response capability of the magnetic material, especially for materials with high atomic coercivity, as heating makes it easier for the magnetic domains to achieve uniform alignment under the influence of an external magnetic field. This effectively improves the uniformity and stability of the magnetic domain orientation of the product. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the magnetic field orientation hot pressing forming device in this embodiment; Figure 2 This is a three-dimensional structural diagram of the magnetic field orientation hot pressing forming device for removing the orientation mechanism in this embodiment; Figure 3 This is a three-dimensional structural diagram of the lower coil and the upper coil in this embodiment; Figure 4 This is a three-dimensional structural diagram of the lower coil, upper coil, upper mold heating plate, and lower mold heating plate in this embodiment; Figure 5 This is a three-dimensional structural diagram of the lower coil, upper mold heating plate, lower mold heating plate, lower heat insulation pad, and upper heat insulation pad in this embodiment; Figure 6 This is a three-dimensional structural diagram of the feeding mechanism in this embodiment; Figure 7 This is a three-dimensional structural diagram of the feeding mechanism and the lower mold heating plate in this embodiment; Figure 8 This is a schematic diagram of the magnetic field orientation hot pressing molding apparatus in this embodiment; Figure 9 This is a schematic diagram of the heating mechanism in this embodiment. Explanation of reference numerals in the attached figures: 1. Supporting components; 11. First support plate; 12. Second support plate; 13. Third support plate; 14. Fourth support plate. 2. Orientation mechanism; 21. Lower coil; 22. Upper coil; 23. Lower pole post; 24. Upper pole post. 3. Heating mechanism; 31. Upper mold heating plate; 32. Lower mold heating plate; 33. Upper heat insulation pad; 34. Lower heat insulation pad; 35. Temperature controller. 4. Lifting mechanism; 41. Servo pressure cylinder; 42. Active lifting plate; 43. Vertical sliding assembly; 431. Optical shaft; 432. Bearing seat; 44. Driven lifting plate; 441. Upper clearance hole. 5. Feeding mechanism; 51. Slide table; 52. Material frame; 53. Moving component; 54. Linear guide rail; 55. Connecting plate. 6. Cooling mechanism. Detailed Implementation

[0016] To explain in detail the technical content, structural features, objectives, and effects of the technical solution, the following description is provided in conjunction with specific embodiments and accompanying drawings.

[0017] Please see Figures 1 to 9 This embodiment of a magnetic field orientation hot pressing forming device includes: a support assembly 1, an electromagnet coil, a lifting mechanism 4, and a heating mechanism 3; The support assembly 1 includes a fourth support plate 14, a third support plate 13, a second support plate 12 and a first support plate 11, which are arranged from top to bottom. The orientation mechanism 2 includes a lower coil 21 and an upper coil 22. The lower coil 21 is located on the top of the first support plate 11 and has a lower pole post 23 inside. The upper coil 22 is located on the bottom of the third support plate 13 and is located above the lower coil 21. The upper coil 22 has an upper pole post 24 inside. The lifting mechanism 4 is mounted on the fourth support plate 14; The heating mechanism 3 includes an upper mold heating plate 31, a lower mold heating plate 32, and a temperature controller 35. The upper mold heating plate 31 and the lower mold heating plate 32 are electrically connected to the temperature controller 35. The upper mold heating plate 31 is mounted on the lifting mechanism 4 and rises or falls under the action of the lifting mechanism 4. The upper mold heating plate 31 is located below the upper coil 22. The upper mold heating plate 31 and the lower mold heating plate 32 are directly opposite each other. The lower mold heating plate 32 is mounted on the second support plate 12 and is located above the lower coil 21. The lower mold heating plate carries the magnetic material. The magnetic material is usually a mixture of PPS magnet material and other adhesive substances.

[0018] The working principle of the magnetic field orientation hot pressing molding device is described below: Preheating stage: Place the magnetic material on the lower mold heating plate 32. Start the temperature controller 35 to preheat the lower mold heating plate 32 and the upper mold heating plate 31 to the set process temperature, so that the material reaches a temperature state that is conducive to magnetic domain orientation.

[0019] Mold closing and pressurization: The lifting mechanism 4 drives the upper mold heating plate 31 to descend, so that the upper mold heating plate 31 and the lower mold heating plate 32 close and apply a specified pressure to the powder.

[0020] Magnetic field orientation: Under pressure, the upper coil 22 and lower coil 21 are energized, generating a strong orientation magnetic field between the upper and lower pole pieces 23. Some magnetic domains have high atomic coercivity, which can be smoothly oriented after heating, ensuring the uniformity and stability of the orientation. Orientation continues until the voltage is applied for a preset time.

[0021] Cooling and demolding: The lifting mechanism 4 rises, driving the upper mold heating plate 31 back to its original position. After cooling is completed, the molded product is removed.

[0022] The beneficial effects of the magnetic field orientation hot pressing molding apparatus are described here: By integrating a heating mechanism 3 that precisely aligns with the orientation magnetic field region, the raw material can be controlled to heat before the application of a strong magnetic field. The main function of heating is to enhance the magnetic domain response capability of the magnetic material, especially for materials with high atomic coercivity, as heating makes it easier for the magnetic domains to achieve uniform alignment under the influence of an external magnetic field. This effectively improves the uniformity and stability of the magnetic domain orientation of the product.

[0023] In some embodiments, the distance between the upper mold heating plate 31 and the lower mold heating plate 32 is 5 to 45 mm. The upper mold heating plate 31 is movable, and the target distance between the upper mold heating plate 31 and the lower mold heating plate 32 is set according to the thickness of the magnet to be formed.

[0024] In some embodiments, the distance between the upper pole post 24 and the lower pole post 23 is 115–125 mm. The target spacing between the upper mold heating plate 31 and the lower mold heating plate 32 is set according to the thickness of the magnet to be formed. The positions of the upper pole post 24 and the lower pole post 23 are calibrated and fixed during the equipment assembly stage. When the coil is energized, the magnetic field is mainly concentrated between the two pole posts, forming a highly uniform and directionally stable vertical orientation magnetic field. Because the pole post spacing is constant, the magnetic field strength distribution, gradient, and uniformity remain highly consistent throughout the entire process cycle, minimizing interference from other factors.

[0025] The upper mold heating plate 31 and the lower mold heating plate 32 are heated to the required process temperature to promote the magnetic domain orientation of the high coercivity magnetic powder. However, if the heat is conducted uncontrollably, it will diffuse upwards to the upper pole post 24 / upper coil 22 region or downwards to the lower pole post 23 / lower coil 21, which will reduce the magnetic field strength.

[0026] Please see Figure 5 In some embodiments, the heating mechanism 3 further includes a lower heat insulation pad 34 and an upper heat insulation pad 33; the lower heat insulation pad 34 is disposed on the bottom of the lower mold heating plate 32. The heat insulation pad can be fixed to the corresponding position of the heating plate by adhesive, embedding or bolts. The upper heat insulation pad 33 is disposed on the top of the upper mold heating plate 31. The lower heat insulation pad 34 is used to block some of the heat conducted downward by the lower mold heating plate 32, while the upper heat insulation pad 33 is used to suppress the upward diffusion of heat and avoid significant fluctuations in magnetic field strength caused by temperature rise.

[0027] Please see Figure 5 In some embodiments, the upper heat insulation pad 33 is a graphene upper heat insulation pad 33, and the lower heat insulation pad 34 is a graphene lower heat insulation pad 34.

[0028] Please see Figures 1 to 2In some embodiments, the lifting mechanism 4 includes a servo pressure cylinder 41, an active lifting plate 42, a vertical sliding assembly 43, and a driven lifting plate 44. The fixed part of the servo pressure cylinder 41 is located on the fourth support plate 14, and its telescopic part is located on the top of the active lifting plate 42, used to drive the active lifting plate 42 to rise or fall. The vertical sliding assembly 43 is located between the active lifting plate 42 and the driven lifting plate 44 and can slide relative to the third support plate 13. The driven lifting plate 44 is located below the upper coil 22. The fixed part of the servo pressure cylinder 41 is usually its housing, mounted on the fourth support plate 14; its telescopic part is usually the nut seat in a screw and nut mechanism, arranged vertically and extending downward, connected to the active lifting plate 42. The vertical sliding assembly 43 is located between the active lifting plate 42 and the driven lifting plate 44, and can adopt a high-precision linear guide pair, roller slider group, or self-lubricating guide column structure to ensure smooth relative movement between the two in the vertical direction. The vertical sliding component 43 rises and falls with the active lifting plate 42, which in turn drives the driven lifting plate 44 and the upper mold heating plate 31 to rise and fall synchronously. The guiding cooperation between the vertical sliding component 43 and the third support plate 13 enhances the overall rigidity, reduces vibration, and makes the lifting and pressing more stable.

[0029] In some embodiments, the servo pressure cylinder 41 may be replaced by a hydraulic cylinder or a pneumatic cylinder.

[0030] Please see Figures 1 to 2 In some embodiments, the third support plate 13 is provided with a through hole, and the vertical sliding assembly 43 includes an optical axis 431, a bearing seat 432 and a linear bearing. The top of the optical axis 431 is provided on the active lifting plate 42, and the bottom of the optical axis 431 is provided on the driven lifting plate 44. The optical axis 431 passes through the through hole of the third support plate 13, the bearing seat 432 is provided in the through hole, and the linear bearing is provided in the bearing seat 432 and sleeved on the optical axis 431.

[0031] When the servo pressure cylinder 41 drives the active lifting plate 42 to rise and fall, the optical shaft 431 moves synchronously with the active lifting plate 42, and drives the driven lifting plate 44, which is fixed to it, to move up and down. Since the optical shaft 431 passes through the through hole of the third support plate 13, and the linear bearing is firmly constrained in the through hole through the bearing seat 432, the optical shaft 431 is always constrained by the linear bearing during the movement and can only slide smoothly along the axial direction (vertical direction). The linear bearing and the optical shaft 431 cooperate to effectively suppress the sway and shaking during the lifting process, ensure that the upper mold heating plate 31 presses down vertically, and avoid uneven force on the raw material.

[0032] In some embodiments, there are multiple vertical sliding components 43, which are evenly arranged on the outer side of the upper coil 22. For example... Figure 1 and Figure 2As shown, the four vertical sliding components 43 are evenly arranged in four directions (front, back, left, and right) outside the upper coil 22. Alternatively, two, three, five, etc., of the vertical sliding components 43 can be provided.

[0033] In some embodiments, the driven lifting plate 44 is provided with an upper clearance hole 441 between the upper mold heating plate 31 and the upper electrode head to avoid the upper coil 22 and the upper electrode head, as shown in the figure. Figure 2 As shown, the second support plate 12 has a lower clearance hole between the lower mold heating plate 32 and the lower electrode head. To prevent the driven lifting plate 44 from physically interfering with the upper coil 22 or the upper electrode head during lifting, the driven lifting plate 44 has an upper clearance hole 441 in the corresponding area. The outline of this hole matches the outer contour of the upper coil 22 and the upper electrode head, ensuring sufficient clearance during movement. To prevent the second support plate 12 from obstructing the assembly of the lower coil 21 below, the second support plate 12 has a lower clearance hole in the corresponding position to allow passage for the lower coil 21 and the lower electrode head. This improves the compactness of the molding device.

[0034] Please see Figures 1 to 2 In some embodiments, the magnetic field orientation hot pressing molding apparatus further includes a feeding mechanism 5, which is used to feed the raw material onto the lower mold heating plate 32. This can reduce manual operation time and improve labor efficiency.

[0035] Please see Figures 6 to 7 In some embodiments, the feeding mechanism 5 includes a slide table 51, a material frame 52, and a moving component 53. The slide table 51 is mounted on the second support plate 12, with its top flush with the top of the lower mold heating plate 32 and its end face abutting the corresponding end face of the lower mold heating plate 32. The material frame 52 is placed on the slide table 51, with its top and bottom open. The moving component 53 is mounted on the second support plate 12 and connected to the material frame 52 via a connecting plate 55, used to push the material frame 52 to slide onto the lower mold heating plate 32 or onto the slide table 51. The design of the slide table 51 being flush with the top surface and its end face abutting the lower mold heating plate 32 allows the material frame 52 to smoothly slide between the slide table 51 and the lower mold heating plate 32 while carrying the raw material. The top (upper surface) of the slide table 51 and the heating plate has a highly smooth surface, which reduces the frictional resistance of the material frame 52 during sliding. The material frame 52 is limited on all four sides of the raw material. The moving component 53 is activated, pushing the material frame 52 along the slide table 51 via the connecting plate 55 until it moves to the preset area of ​​the lower mold heating plate 32. Since the top surface of the slide table 51 is flush with and the end faces are in contact with the lower mold heating plate 32, there are no steps or gaps during the movement of the material frame 52. The raw material is in a gel-like state. After hot pressing, the moving component 53 reverses its movement, causing the material frame 52 to retract from the lower mold heating plate 32 back to the loading position on the slide table 51.

[0036] In some embodiments, the moving component 53 is a cylinder, and the feeding mechanism 5 further includes a linear slide rail 54, which is located on the side of the slide table 51 and the lower mold heating plate 32 and supports the material frame 52.

[0037] The moving component 53 uses a cylinder as the driving element, and its piston rod is fixedly connected to the material frame 52 via a connecting plate 55. The cylinder is mounted on the second support plate 12, located on one side of the slide table 51, and its extension and retraction direction is parallel to the arrangement direction of the slide table 51 and the lower mold heating plate 32, thereby realizing the linear reciprocating push of the material frame 52. The linear slide rail 54 is arranged on the side of the slide table 51 and the lower mold heating plate 32 (usually symmetrically arranged on both sides), and its guide rail is fixed to the equipment base or support component 1, while the slider is rigidly connected to the bottom or side wall of the material frame 52. In this way, during the process of being pushed by the cylinder, the material frame 52 is provided with high rigidity lateral support and precise guidance by the linear slide rail 54.

[0038] Please see Figures 1 to 5 In some embodiments, both the upper mold heating plate 31 and the lower mold heating plate 32 can employ resistance heating, such as built-in heating elements or heating rods. The temperature controller 35 establishes bidirectional data interaction with the control system via an RS485 communication interface. The control system can employ a programmable logic controller (PLC), which sends the target set temperature to the temperature controller 35. The signal input terminal of the temperature controller 35 is connected to a thermocouple for real-time acquisition of the actual temperature signal of the equipment; its output terminal is connected to a solid-state relay (SSR), which controls the on / off state of the heating rod power supply circuit through the SSR's main circuit contacts, thereby achieving the start / stop regulation of the heating load. Optionally, the temperature controller 35 acquires the actual temperature feedback from the thermocouple in real time and compares it with the set temperature sent by the PLC; it incorporates a PID control algorithm to dynamically adjust the output signal according to the temperature deviation, precisely controlling the on / off duration of the solid-state relay; by continuously adjusting the duty cycle of the heating plate, it dynamically matches the heating power, suppressing temperature overshoot and fluctuations, thereby achieving precise constant temperature control of the equipment. Currently, the commonly used heating temperature is 200℃, and the magnet temperature control coefficient is currently -150℃.

[0039] In some embodiments, the control system is electrically connected to the lifting mechanism 4, the feeding mechanism 5, and the orientation mechanism 2 to coordinate the timing and operating status of each mechanism: the lifting mechanism 4 is used to drive the upper mold heating plate 31 to move in the vertical direction to achieve pressurization or return; the feeding mechanism 5 is used to feed the material frame 52 containing raw materials into or out of the lower mold heating plate 32; the orientation mechanism 2 is used to apply a directional magnetic field during the hot pressing process; the control system adjusts the start / stop, operating speed, and working time of the above mechanisms by outputting control signals, thereby realizing the synchronous automated operation of magnetic field orientation, feeding positioning, and hot pressing.

[0040] Please see Figures 1 to 3In some embodiments, the support assembly 1 includes a lower U-shaped frame and an upper U-shaped frame. A first support plate 11 forms the bottom edge of the lower U-shaped frame; the lower surface of the top edge of the lower U-shaped frame supports the upper coil 22 and the upper pole post 24, while a third support plate 13 is mounted on the upper surface of this top edge, allowing the lower coil 21 to be indirectly connected to the third support plate 13 through the top edge of the lower U-shaped frame. Figure 3 The image shows the lower-shaped frame with the top edge removed. The second support plate 12 has a table leg structure and passes through the hollow area in the middle of the lower-shaped frame. The third support plate 13 serves as the bottom edge of the upper-shaped frame, and the fourth support plate 14 serves as the top edge of the upper-shaped frame.

[0041] Please see Figures 1 to 2 In some embodiments, the magnetic field orientation hot pressing molding apparatus further includes a cooling mechanism 6 for cooling the product after hot pressing. Optionally, the cooling mechanism 6 accelerates heat dissipation by blowing room temperature or low temperature airflow onto the product surface through a fan or compressed air nozzle, thereby achieving rapid cooling.

[0042] Please see Figure 8 , Figure 8 This demonstrates a specific implementation method of magnetic field-oriented hot pressing. The main function of heating the upper and lower films is to improve the orientation consistency of magnetic domains in products requiring electromagnetic forming and orientation. Some magnetic domains have high atomic coercivity and require heating to achieve proper orientation, ensuring uniformity and stability of the orientation.

[0043] Please see Figure 9 , Figure 9 This diagram illustrates an implementable circuit for a heating mechanism.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Unless otherwise specified, an element defined by the phrase "comprising..." or "including..." does not exclude the presence of additional elements in the process, method, article, or terminal device that includes said element. Additionally, in this document, "greater than," "less than," "exceeding," etc., are understood to exclude the stated number; "above," "below," "within," etc., are understood to include the stated number.

[0045] Although the above embodiments have been described, those skilled in the art, once they understand the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the above descriptions are merely embodiments of the present invention and do not limit the scope of patent protection of the present invention. Any equivalent structural or procedural transformations made using the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A magnetic field orientation hot press forming apparatus characterized by, Includes: support components, electromagnet coil, lifting mechanism, and heating mechanism; The support assembly includes a fourth support plate, a third support plate, a second support plate, and a first support plate, which are arranged sequentially from top to bottom. The orientation mechanism includes a lower coil and an upper coil. The lower coil is located on the top of the first support plate and has a lower pole post inside. The upper coil is located on the bottom of the third support plate and above the lower coil, and has an upper pole post inside. The lifting mechanism is mounted on the fourth support plate; The heating mechanism includes an upper mold heating plate, a lower mold heating plate, and a temperature controller. The upper mold heating plate and the lower mold heating plate are electrically connected to the temperature controller. The upper mold heating plate is mounted on the lifting mechanism and rises or falls under the action of the lifting mechanism. The upper mold heating plate is located below the upper coil. The upper mold heating plate and the lower mold heating plate are directly opposite each other. The lower mold heating plate is mounted on the second support plate and is located above the lower coil. The lower mold heating plate carries magnetic raw materials.

2. The magnetic field orientation hot press forming apparatus according to claim 1, characterized by, The distance between the upper mold heating plate and the lower mold heating plate is 5-45mm, and the distance between the upper pole post and the lower pole post is 115-125mm.

3. The magnetic field orientation hot pressing forming apparatus according to claim 1, characterized in that, The heating mechanism also includes a lower heat insulation pad and an upper heat insulation pad; The lower heat insulation pad is located on the bottom of the lower mold heating plate; The upper heat insulation pad is located on the top of the upper mold heating plate.

4. The magnetic field orientation hot pressing forming apparatus according to claim 3, characterized in that, The upper heat insulation pad is a graphene upper heat insulation pad, and the lower heat insulation pad is a graphene lower heat insulation pad.

5. The magnetic field orientation hot pressing forming apparatus according to any one of claims 1 to 4, characterized in that, The lifting mechanism includes a servo pressure cylinder, an active lifting plate, a vertical sliding assembly, and a driven lifting plate; The fixed part of the servo pressure cylinder is located on the fourth support plate, and its telescopic part is located on the top of the active lifting plate, which is used to drive the active lifting plate to rise or fall. The vertical sliding assembly is located between the active lifting plate and the driven lifting plate and can slide relative to the third support plate. The driven lifting plate is located below the upper coil.

6. The magnetic field orientation hot pressing forming apparatus according to claim 5, characterized in that, The third support plate has a through hole. The vertical sliding assembly includes an optical axis, a bearing seat, and a linear bearing. The top of the optical axis is located on the active lifting plate, and the bottom of the optical axis is located on the driven lifting plate. The optical axis passes through the through hole of the third support plate. The bearing seat is located in the through hole, and the linear bearing is located in the bearing seat and sleeved on the optical axis.

7. The magnetic field orientation hot pressing forming apparatus according to claim 6, characterized in that, There are multiple vertical sliding components, and the multiple vertical sliding components are evenly arranged on the outer ring of the upper coil; The driven lifting plate is provided with an upper clearance hole between the upper mold heating plate and the upper electrode head to avoid the upper coil and the upper electrode head, and the second support plate is provided with a lower clearance hole between the lower mold heating plate and the lower electrode head.

8. The magnetic field orientation hot pressing forming apparatus according to claim 1, characterized in that, It also includes a feeding mechanism for feeding raw materials onto the lower mold heating plate.

9. The magnetic field orientation hot pressing forming apparatus according to claim 8, characterized in that, The feeding mechanism includes a slide table, a material frame, and a moving component; The slide is mounted on the second support plate, with its top flush with the top of the lower mold heating plate and its end face abutting the corresponding end face of the lower mold heating plate. The material frame is placed on the slide, with its top and bottom both open. The moving component is mounted on the second support plate and connected to the material frame via a connecting plate, for pushing the material frame to slide onto the lower mold heating plate or onto the slide.

10. The magnetic field orientation hot pressing forming apparatus according to claim 9, characterized in that, The moving component is a cylinder, and the feeding mechanism also includes a linear slide rail, which is located on the side of the slide table and the lower mold heating plate and supports the material frame.

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