capacitor

Abstract

A capacitor includes: a capacitor element; a frame that has a pair of open surfaces opposing each other and surrounds the capacitor element; and a first resin portion that is disposed inside the frame and seals the capacitor element. The capacitor element is disposed between the pair of open surfaces. The first resin portion is softer than the frame.

Description

Technical Field

[0001] This disclosure generally relates to capacitors, and more specifically to capacitors having capacitor elements. Background Technology

[0002] Patent Document 1 discloses a capacitor. The capacitor includes a capacitor element having electrodes on its end face, a first electrode plate having a first external connection terminal, a second electrode plate having a second external connection terminal, a housing, and resin.

[0003] Furthermore, the first electrode plate is connected to one end face of the capacitor element, the second electrode plate is connected to the other end face and housed in the housing and filled with resin, and the first external connection terminal and the second external connection terminal are led out to the outside of the housing.

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2013-084787 Summary of the Invention The technical problem that the invention aims to solve In the capacitor of Patent Document 1, a cooler is disposed on the outer surface of the sidewall of the housing.

[0005] Regarding this point, the inventors believe that it is advantageous from the viewpoint of heat dissipation to place the cooler in close contact with the resin filling the housing rather than on the outer surface of the housing sidewall.

[0006] However, the inventors have discovered that if the above considerations are taken into account, the following technical problem exists. Specifically, in order to reduce the thermal resistance at the contact point between the cooler and the resin, the cooler must be pressed against the resin to a certain extent. However, if an attempt is made to press the cooler tightly against the resin, the pressure will be directly transmitted to the capacitor element, potentially damaging the capacitor element.

[0007] The purpose of this disclosure is to provide a capacitor that can suppress the direct application of pressure to the capacitor element even when pressure is applied to make the cooler fit tightly.

[0008] Solution to the above technical problems One aspect of this disclosure relates to a capacitor comprising: a capacitor element; a frame having a pair of opposing open surfaces and surrounding the capacitor element; and a first resin portion disposed inside the frame, sealing the capacitor element. The capacitor element is disposed between the pair of open surfaces. The first resin portion is more flexible than the frame.

[0009] One aspect of this disclosure relates to a capacitor comprising: a capacitor element; a frame having a pair of opposing openings and surrounding the capacitor element; and a first resin portion disposed inside the frame, sealing the capacitor element. The capacitor element is disposed between the pair of openings. The first resin portion is located inside at least one of the pair of openings.

[0010] One aspect of this disclosure relates to a capacitor comprising: a capacitor element; and a first resin portion that seals the capacitor element. The first resin portion has a first surface and a second surface opposite to the first surface. The capacitor element is disposed between the first surface and the second surface. At least one of the first surface and the second surface, except for its peripheral portion, is recessed toward the capacitor element.

[0011] One aspect of this disclosure relates to a capacitor comprising: a capacitor element; a housing having an opening and housing the capacitor element; a first resin portion disposed inside the housing and sealing the capacitor element; and a second resin portion covering the first resin portion. The second resin portion protrudes further outward than the opening.

[0012] One aspect of this disclosure relates to a capacitor comprising: a capacitor element; a housing having an opening and housing the capacitor element; and a first resin portion disposed inside the housing to seal the capacitor element. The first resin portion protrudes further outward than the opening.

[0013] Invention Effects According to this disclosure, even when pressure is applied to make the cooler fit tightly, the pressure can be prevented from being applied directly to the capacitor element. Attached Figure Description

[0014] Figure 1 This is a schematic cross-sectional view showing the capacitor according to the first embodiment.

[0015] Figure 2 This is a schematic top view showing the capacitor according to the first embodiment.

[0016] Figure 3 This is a schematic cross-sectional view showing the capacitor according to the second embodiment.

[0017] Figure 4 This is a schematic cross-sectional view showing the capacitor according to the third embodiment.

[0018] Figure 5 This is a schematic cross-sectional view showing the capacitor according to the fourth embodiment.

[0019] Figure 6This is a schematic cross-sectional view showing the capacitor according to the fifth embodiment.

[0020] Figure 7 This is a schematic cross-sectional view showing the capacitor according to the sixth embodiment.

[0021] Figure 8 This is a schematic cross-sectional view showing the capacitor according to the seventh embodiment.

[0022] Figure 9 This is a schematic cross-sectional view showing the capacitor according to the eighth embodiment.

[0023] Figure 10 This is a schematic cross-sectional view showing the capacitor according to the 9th embodiment.

[0024] Figure 11 This is a schematic cross-sectional view showing the capacitor according to the 10th embodiment. Detailed Implementation

[0025] 1. Summary The following is for reference Figures 1 to 11 The capacitor 1 according to this embodiment will be described. Each figure is a schematic diagram, and the ratio of the size and thickness of each component in each figure may not reflect the actual size ratio.

[0026] The arrows indicating directions in each diagram are not intended to specify the direction in which capacitor 1 is used; they are merely markings for ease of understanding and are unrelated to the actual entity.

[0027] exist Figures 1 to 11 In this context, the X, Y, and Z directions of a Cartesian coordinate system are defined.

[0028] The X direction is the direction in which the first electrode 21 and the second electrode 22 of capacitor element 2 are arranged. Sometimes the X direction is referred to as the "left-right direction". That is, sometimes the -X direction is called "left" and the +X direction is called "right".

[0029] Sometimes the Y direction is referred to as the "front-back direction". That is, sometimes the +Y direction is called "front" and the -Y direction is called "back".

[0030] The Z direction is the direction in which the first surface 41 and the second surface 42 of the first resin part 4 are arranged. Sometimes the Z direction is referred to as the "vertical direction". That is, sometimes the +Z direction is called "up" and the -Z direction is called "down". Sometimes the view of an object from above is called "view from above".

[0031] like Figure 1 and Figure 2As shown, the capacitor 1 according to this embodiment includes a capacitor element 2, a frame 3, and a first resin portion 4. The frame 3 has a pair of openings 30 facing each other and surrounds the capacitor element 2. The capacitor element 2 is disposed between the pair of openings 30. The first resin portion 4 is disposed inside the frame 3 and seals the capacitor element 2. The first resin portion 4 is more flexible than the frame 3.

[0032] like Figure 1 As shown, even when the first cooler 71 is in contact with the first opening edge 31a of the frame 3, if the pressing pressure is further increased, the pressure applied to the first resin part 4 can be reduced because the first resin part 4 is softer than the frame 3. Similarly, even when the second cooler 72 is in contact with the second opening edge 32a of the frame 3, if the pressing pressure is further increased, the pressure applied to the first resin part 4 can be reduced because the first resin part 4 is softer than the frame 3.

[0033] Therefore, according to this embodiment, even when pressure is applied to ensure the cooler 7 is in close contact, the pressure can be prevented from being directly applied to the capacitor element 2. As a result, damage to the capacitor element 2 can be suppressed.

[0034] 2. Details (1) First implementation method The following is for reference Figure 1 and Figure 2 The capacitor 1 according to the first embodiment will be described.

[0035] The capacitor 1 according to the first embodiment includes a capacitor element 2, a frame 3, and a first resin part 4.

[0036] <Capacitor Components> While there are no particular limitations on capacitor element 2, examples include thin-film capacitor elements and electrolytic capacitor elements.

[0037] The capacitor element 2 has an element body 20, a first electrode 21, and a second electrode 22.

[0038] The shape of the component body 20 is not particularly limited, but in the first embodiment, it is a generally rectangular parallelepiped that is flat on a plane perpendicular to the vertical direction. Although the figure is omitted, the first internal electrode and the second internal electrode are facing each other in the component body 20 through a dielectric.

[0039] The first electrode 21 is disposed on the left end face of the component body 20. The first electrode 21 is electrically connected to the first internal electrode.

[0040] On the other hand, the second electrode 22 is disposed on the right end face of the component body 20. The second electrode 22 is electrically connected to the second internal electrode.

[0041] <Frame> The shape of the frame 3 is not particularly limited, but in the first embodiment, it is rectangular when viewed from above (see reference). Figure 2 The frame 3 is larger than the capacitor element 2 when viewed from above.

[0042] The frame 3 has a pair of opening surfaces 30. Each of the pair of opening surfaces 30 is a planar region enclosed by the opening edge 3a of the frame 3. Specifically, the pair of opening surfaces 30 are a first opening surface 31 and a second opening surface 32. The first opening surface 31 is a planar region enclosed by the first opening edge 31a of the frame 3. On the other hand, the second opening surface 32 is a planar region enclosed by the second opening edge 32a of the frame 3.

[0043] A pair of openings 30 are positioned opposite each other. Specifically, the first opening 31 and the second opening 32 are positioned vertically opposite each other. The distance between the first opening 31 and the second opening 32 is equivalent to the height of the frame 3. The height of the frame 3 is greater than the thickness of the capacitor element 2 (vertical height) (see reference). Figure 1 ).

[0044] The frame 3 has a receiving portion 33. The receiving portion 33 is a space enclosed by the inner surface of the frame 3 and a pair of opening surfaces 30. The capacitor element 2 is received in the receiving portion 33. Thus, the frame 3 surrounds the capacitor element 2 between the pair of opening surfaces 30.

[0045] The material of frame 3 is not particularly limited; for example, polyphenylene sulfide (PPS) can be used.

[0046] The hardness of the frame 3 can be specified by Young's modulus. Specifically, the Young's modulus of the frame 3 is, for example, above 1 GPa and below 25 GPa.

[0047] <Section 1 Resin> Part 4 of the first resin section is a cured thermosetting resin. There are no particular limitations on the thermosetting resin; for example, epoxy resin (EP) can be cited.

[0048] The first resin section 4 seals the capacitor element 2. That is, the capacitor element 2 is embedded in the first resin section 4.

[0049] The first resin portion 4 is disposed inside the frame 3. In the first embodiment, the first resin portion 4 fills the interior of the frame 3 (receiving portion 33). Specifically, the first resin portion 4 fills the portion of the receiving portion 33 excluding the capacitor element 2 and the busbar 8 (described later).

[0050] The first resin part 4 has a first surface 41 and a second surface 42.

[0051] The first surface 41 is the upper surface. In the first embodiment, the first surface 41 is flush with the first opening surface 31. That is, the first surface 41, the first opening surface 31, and the first opening edge 31a exist on the same plane.

[0052] On the other hand, the second surface 42 is the surface opposite to the first surface 41. That is, the second surface 42 is the lower surface. In the first embodiment, the second surface 42 is flush with the second opening surface 32. That is, the second surface 42, the second opening surface 32, and the second opening edge 32a exist on the same plane.

[0053] The first resin portion 4 is softer than the frame 3. The hardness of the first resin portion 4 can also be defined by its Young's modulus. That is, the Young's modulus of the first resin portion 4 is less than the Young's modulus of the frame 3. Specifically, the Young's modulus of the first resin portion 4 is, for example, 1 MPa or more and 5 GPa or less.

[0054] Cooler The capacitor 1 according to the first embodiment also includes a cooler 7. The cooler 7 is not particularly limited; for example, a heat sink can be used. A heat exchanger can also be combined with the heat sink.

[0055] The shape of the cooler 7 is not particularly limited, but in the first embodiment it is plate-shaped. The cooler 7 has a flat surface 70. The cooler 7 may also have a finned structure.

[0056] The material of the cooler 7 is not particularly limited, but examples include aluminum and copper.

[0057] The cooler 7 is opposite to the opening surface 30, and while pressing the frame 3 and the first resin part 4 in the direction toward the capacitor element 2, it comes into contact with the frame 3 and the first resin part 4.

[0058] Specifically, in the first embodiment, the cooler 7 includes a first cooler 71 and a second cooler 72.

[0059] The first cooler 71 is positioned opposite the first opening surface 31, and while pressing the first opening edge 31a of the frame 3 and the first surface 41 of the first resin part 4 in the direction toward the capacitor element 2 (i.e., downward), it comes into contact with the frame 3 and the first resin part 4. The flat surface 70 of the first cooler 71 is in close contact with the first opening edge 31a of the frame 3 and the first surface 41 of the first resin part 4.

[0060] On the other hand, the second cooler 72 is opposite to the second opening surface 32, and while pressing the second opening edge 32a of the frame 3 and the second surface 42 of the first resin part 4 in the direction toward the capacitor element 2 (i.e., upward), it comes into contact with the frame 3 and the first resin part 4. The flat surface 70 of the second cooler 72 is in close contact with the second opening edge 32a of the frame 3 and the second surface 42 of the first resin part 4.

[0061] <Bus> The capacitor 1 according to the first embodiment also includes a busbar 8. The busbar 8 is a conductor. The shape of the busbar 8 is not particularly limited, for example, it can be plate-shaped or rod-shaped. The material of the busbar 8 is not particularly limited, for example, copper, aluminum, etc.

[0062] Busbar 8 includes a first busbar 81 and a second busbar 82. The first busbar 81 is connected to the first electrode 21. The first busbar 81 passes through the first resin portion 4 and the frame 3 and extends outward (to the left of the frame 3). On the other hand, the second busbar 82 is connected to the second electrode 22. The second busbar 82 also passes through the first resin portion 4 and the frame 3 and extends outward (to the right of the frame 3). Furthermore, the number, position, and direction of extension of the busbars 8 are not particularly limited.

[0063] <Effects> By pressing the first cooler 71 against the first surface 41 of the first resin portion 4, the thermal resistance at the contact point between the flat surface 70 and the first surface 41 can be reduced. Similarly, by pressing the second cooler 72 against the second surface 42 of the first resin portion 4, the thermal resistance at the contact point between the flat surface 70 and the second surface 42 can be reduced. As a result, the heat generated by the capacitor element 2 can be easily released to the outside via the first resin portion 4, the first cooler 71, and the second cooler 72. That is, the heat dissipation of the capacitor 1 can be improved.

[0064] On the other hand, even when the first cooler 71 is in contact with the first opening edge 31a of the frame 3, if the pressing pressure increases further, the pressure applied to the first resin part 4 can be reduced because the first resin part 4 is softer than the frame 3. Similarly, even when the second cooler 72 is in contact with the second opening edge 32a of the frame 3, if the pressing pressure increases further, the pressure applied to the first resin part 4 can be reduced because the first resin part 4 is softer than the frame 3.

[0065] Therefore, according to the first embodiment, even when pressure is applied to make the cooler 7 fit tightly, the pressure can be prevented from being directly applied to the capacitor element 2. As a result, damage to the capacitor element 2 can be suppressed.

[0066] (2) Second implementation method Regarding the capacitor 1 involved in the second embodiment, refer to... Figure 3 The following explanation is provided. In the second embodiment, for the same constituent elements as in the first embodiment, the same reference numerals are sometimes used as in the first embodiment, and detailed descriptions are omitted.

[0067] The second embodiment differs from the first embodiment in that the first resin part 4 is different. Hereinafter, the differences will be the main focus of the description.

[0068] <Section 1 Resin> The first resin portion 4 is located further inward than at least one of the pair of opening surfaces 30 (both of the pair of opening surfaces 30 in the second embodiment).

[0069] Specifically, the first surface 41 of the first resin portion 4 is located further inward (lower than) than the first opening surface 31. That is, the first surface 41 and the first opening surface 31 are not on the same plane. Therefore, a gap 9 can be formed between the first surface 41 and the flat surface 70 of the first cooler 71. A thermal interface material, described later, is disposed in this gap 9.

[0070] On the other hand, the second surface 42 of the first resin portion 4 is located further inward (and higher than) than the second opening surface 32. That is, the second surface 42 and the second opening surface 32 do not exist on the same plane. Therefore, a gap 9 can be formed between the second surface 42 and the flat surface 70 of the second cooler 72. The thermal interface material, which will be described later, is also disposed in this gap 9.

[0071] Thermal Interface Material (TIM) While there are no specific limitations on thermal interface materials, examples include thermal grease, thermal sheets, phase change materials (PCM), thermal gels, thermal adhesives, and thermal tapes.

[0072] Examples of thermal greases include silicone-based thermal greases. Examples of thermal pads include silicone-based thermal pads. Examples of thermal gels include silicone gels. Examples of thermal adhesives include epoxy-based thermal adhesives.

[0073] Cooler The cooler 7 is opposite to the opening surface 30 and contacts at least one of the frame 3 and the first resin part 4 while pressing at least one of them toward the capacitor element 2.

[0074] Specifically, the first cooler 71 is opposite to the first opening surface 31 and contacts the frame 3 while pressing the first opening edge 31a of the frame 3 in the direction toward the capacitor element 2 (i.e., downward). The flat surface 70 of the first cooler 71 is in close contact with the first opening edge 31a of the frame 3 and the thermal interface material (not shown) disposed in the gap 9.

[0075] On the other hand, the second cooler 72 is opposite to the second opening surface 32 and contacts the frame 3 while pressing the second opening edge 32a of the frame 3 in the direction toward the capacitor element 2 (i.e., upward). The flat surface 70 of the second cooler 72 is in close contact with the second opening edge 32a of the frame 3 and the thermal interface material (not shown) disposed in the gap 9.

[0076] <Effects> The second embodiment also achieves substantially the same effect as the first embodiment. In particular, in the second embodiment, it is possible to reduce the pressure applied by the cooler 7 to the first resin section 4 via the thermal interface material.

[0077] Therefore, according to the second embodiment, even when pressure is applied to ensure the cooler 7 is in close contact, the pressure can be prevented from being directly applied to the capacitor element 2. As a result, damage to the capacitor element 2 can be suppressed.

[0078] (3) Third implementation method Regarding the capacitor 1 involved in the third embodiment, refer to... Figure 4 The following explanation is provided. In the third embodiment, for the same constituent elements as in the first and second embodiments, the same reference numerals are sometimes used as in the first and second embodiments, and detailed descriptions are omitted.

[0079] The third embodiment differs from the first and second embodiments in that the first resin part 4 is different. Hereinafter, the differences will be the main focus of the description.

[0080] <Section 1 Resin> Both the first surface 41 and the second surface 42 are concave. That is, both the first surface 41 and the second surface 42 face the capacitor element 2 and are gently recessed in the center. Therefore, a gap 9 can be formed between the first surface 41 and the flat surface 70 of the first cooler 71. Similarly, a gap 9 can be formed between the second surface 42 and the flat surface 70 of the second cooler 72. The aforementioned thermal interface material is disposed in these gaps 9.

[0081] <Effects> The third embodiment also achieves roughly the same effect as the second embodiment.

[0082] (4) Fourth implementation method Regarding the capacitor 1 involved in the fourth embodiment, refer to... Figure 5 The following explanation is provided. In the fourth embodiment, for the same constituent elements as in the first to third embodiments, the same reference numerals are sometimes used as in the first to third embodiments, and detailed descriptions are omitted.

[0083] The fourth embodiment differs from the first to third embodiments in that the first resin part 4 is different. Hereinafter, the differences will be the main focus of the description.

[0084] <Section 1 Resin> A portion of the first resin portion 4 is located further outward than at least one of the pair of opening surfaces 30 (both of the pair of opening surfaces 30 in the fourth embodiment).

[0085] Specifically, the first surface 41 of the first resin portion 4 is located further outward than the first opening surface 31 (above the first opening surface 31). Thus, the first surface 41 and the first opening surface 31 do not exist on the same plane. That is, a portion of the first resin portion 4 protrudes upward from the first opening surface 31.

[0086] On the other hand, the second surface 42 of the first resin portion 4 is located further outward than the second opening surface 32 (below the second opening surface 32). Thus, the second surface 42 and the second opening surface 32 do not exist on the same plane. That is, a portion of the first resin portion 4 protrudes downward from the second opening surface 32.

[0087] Cooler The cooler 7 is opposite to the opening surface 30 and contacts the first resin part 4 while pressing it toward the capacitor element 2.

[0088] Specifically, the first cooler 71 is positioned opposite the first opening surface 31 and contacts the first resin portion 4 while pressing the first surface 41 of the first resin portion 4 in the direction toward (i.e., downward) towards the capacitor element 2. The flat surface 70 of the first cooler 71 is in close contact with the first surface 41. Alternatively, depending on the pressing force, the flat surface 70 of the first cooler 71 may also be in close contact with the first opening edge 31a of the frame 3.

[0089] On the other hand, the second cooler 72 is opposite to the second opening surface 32 and contacts the first resin part 4 while pressing the second surface 42 of the first resin part 4 in the direction toward the capacitor element 2 (i.e., upward). The flat surface 70 of the second cooler 72 is in close contact with the second surface 42. In addition, depending on the pressing force, the flat surface 70 of the second cooler 72 may also be in close contact with the second opening edge 32a of the frame 3.

[0090] <Effects> Compared with the first embodiment ( Figure 1 Similarly, the fourth embodiment can also improve the heat dissipation of capacitor 1.

[0091] In particular, in the fourth embodiment, if the first cooler 71 is pressed against the first surface 41 of the first resin portion 4, the first resin portion 4 deforms, thereby reducing the pressure applied to the first resin portion 4. Similarly, if the second cooler 72 is pressed against the second surface 42 of the first resin portion 4, the first resin portion 4 deforms, thereby reducing the pressure applied to the first resin portion 4.

[0092] Assuming that the pressing pressure increases further when the first cooler 71 is abutting the first opening edge 31a of the frame 3, the pressure applied to the first resin part 4 can be reduced because the first resin part 4 is softer than the frame 3. Similarly, even if the pressing pressure increases further when the second cooler 72 is abutting the second opening edge 32a of the frame 3, the pressure applied to the first resin part 4 can be reduced because the first resin part 4 is softer than the frame 3.

[0093] Therefore, according to the fourth embodiment, even when pressure is applied to make the cooler 7 fit tightly, it is possible to prevent the pressure from being directly applied to the capacitor element 2. As a result, damage to the capacitor element 2 can be suppressed.

[0094] (5) Fifth implementation method Reference Figure 6 The capacitor 1 according to the fifth embodiment will be described. In the fifth embodiment, for the same components as in the first to fourth embodiments, the same reference numerals are sometimes used as in the first to fourth embodiments, and detailed descriptions are omitted.

[0095] The fifth embodiment differs from the first to fourth embodiments in that the capacitor 1 also includes a second resin portion 5. The following description will focus on these differences.

[0096] <Second Resin Section> The second resin portion 5 is located closer to at least one of the pair of opening surfaces 30 (both of the pair of opening surfaces 30 in the fifth embodiment) than the first resin portion 4, and covers the first resin portion 4.

[0097] Specifically, in the fifth embodiment, the second resin portion 5 is disposed at 2 locations of the capacitor 1. The second resin portion 5 disposed at 2 locations is distinguished as "second resin portion 5a" and "second resin portion 5b".

[0098] The second resin portion 5a covers the surface (first surface 41) of the first resin portion 4 near the first opening surface 31. Specifically, the second resin portion 5a fills the space enclosed by the inner surface of the frame 3, the first surface 41 of the first resin portion 4, and the first opening surface 31. Furthermore, a portion of the second resin portion 5a protrudes upward from the first opening surface 31.

[0099] On the other hand, the second resin portion 5b covers the surface (second surface 42) of the first resin portion 4 near the second opening surface 32. Specifically, the second resin portion 5b fills the space enclosed by the inner surface of the frame 3, the second surface 42 of the first resin portion 4, and the second opening surface 32. Furthermore, a portion of the second resin portion 5b protrudes downward from the second opening surface 32.

[0100] Thus, a portion of the second resin portion 5 (in the fifth embodiment, a portion of the second resin portion 5a and a portion of the second resin portion 5b) protrudes outward from at least one of the pair of opening surfaces 30 (in the fifth embodiment, both of the pair of opening surfaces 30).

[0101] Specifically, the second resin portion 5a has an upward-facing flat surface 50a. "A portion of the second resin portion 5a" refers to the portion extending from the first opening surface 31 to the flat surface 50a. On the other hand, the second resin portion 5b has a downward-facing flat surface 50a. "A portion of the second resin portion 5b" refers to the portion extending from the second opening surface 32 to the flat surface 50b.

[0102] Part 5 of the second resin section is a cured thermosetting resin. While there are no particular limitations on the thermosetting resin, examples such as polyurethane (PUR) can be included.

[0103] The second resin portion 5 is softer than the first resin portion 4. Thus, among the frame 3, the first resin portion 4, and the second resin portion 5, the second resin portion 5 is the softest. The hardness of the second resin portion 5 can also be defined by Young's modulus. That is, the Young's modulus of the second resin portion 5 is less than the Young's modulus of the first resin portion 4, and is the smallest among the Young's moduli of the frame 3, the first resin portion 4, and the second resin portion 5. Specifically, the Young's modulus of the second resin portion 5 is, for example, between 0.1 MPa and 500 MPa.

[0104] Cooler The cooler 7 contacts the second resin part 5 while pressing the second resin part 5 toward the capacitor element 2.

[0105] Specifically, the first cooler 71 contacts the second resin part 5a while pressing the flat surface 50a of the second resin part 5a toward the capacitor element 2 (i.e., downwards). Thus, the flat surface 70 of the first cooler 71 is in close contact with the flat surface 50a. Alternatively, depending on the pressing force, the flat surface 70 of the first cooler 71 may also be in close contact with the first opening edge 31a of the frame 3.

[0106] On the other hand, the second cooler 72 contacts the second resin part 5b while pressing the flat surface 50b of the second resin part 5b toward the capacitor element 2 (i.e., upward). Thus, the flat surface 70 of the second cooler 72 is in close contact with the flat surface 50b. Furthermore, depending on the pressing force, the flat surface 70 of the second cooler 72 may also be in close contact with the second opening edge 32a of the frame 3.

[0107] <Effects> By pressing the first cooler 71 against the flat surface 50a of the second resin part 5a, the thermal resistance at the contact point between the flat surfaces 70 and 50a can be reduced. Similarly, by pressing the second cooler 72 against the flat surface 50b of the second resin part 5b, the thermal resistance at the contact point between the flat surfaces 70 and 50b can be reduced. As a result, the heat generated by the capacitor element 2 can be easily dissipated to the outside via the first resin part 4, the second resin part 5, the first cooler 71, and the second cooler 72. That is, the heat dissipation of the capacitor 1 can be improved.

[0108] On the other hand, in the fifth embodiment, if the first cooler 71 is pressed against the flat surface 50a of the second resin portion 5a, the pressure applied to the second resin portion 5a can be reduced by deforming the second resin portion 5a. Similarly, if the second cooler 72 is pressed against the flat surface 50b of the second resin portion 5b, the pressure applied to the first resin portion 4 can be reduced by deforming the first resin portion 4.

[0109] Even when the pressing pressure increases further when the first cooler 71 is in contact with the first opening edge 31a of the frame 3, the pressure applied to the first resin part 4 and the second resin part 5 can be reduced because the first resin part 4 and the second resin part 5 are softer than the frame 3. Similarly, even when the pressing pressure increases further when the second cooler 72 is in contact with the second opening edge 32a of the frame 3, the pressure applied to the first resin part 4 and the second resin part 5 can be reduced because the first resin part 4 and the second resin part 5 are softer than the frame 3.

[0110] Therefore, according to the fifth embodiment, the pressure applied to the capacitor element 2 can be reduced by the second resin portion 5. As a result, damage to the capacitor element 2 can be suppressed.

[0111] Furthermore, since the first resin portion 4 of the sealed capacitor element 2 is harder than the second resin portion 5, it is difficult for moisture to pass through. Therefore, the sealing effect can be improved.

[0112] (6) 6th implementation method Regarding the capacitor 1 in the sixth embodiment, refer to... Figure 7 The following explanation is provided. In the sixth embodiment, for the same constituent elements as in the first to fifth embodiments, the same reference numerals are sometimes used as in the first to fifth embodiments, and detailed descriptions are omitted.

[0113] The capacitor 1 of the sixth embodiment differs from the capacitors 1 of the first to fifth embodiments in that it does not have a component equivalent to the frame 3 of the first to fifth embodiments. Hereinafter, the differences will be the focus of the explanation.

[0114] <Section 1 Resin> The first resin part 4 seals the capacitor element 2, and the capacitor element 2 is disposed between the first surface 41 and the second surface 42.

[0115] At least one of the first surface 41 and the second surface 42 (both the first surface 41 and the second surface 42 in the sixth embodiment) is recessed toward the capacitor element 2, except for the peripheral portion 4a.

[0116] The first surface 41 and the second surface 42 each have an outer peripheral edge 4a and a main surface 4b. Hereinafter, the outer peripheral edge 4a and the main surface 4b of the first surface 41 are sometimes referred to as "first outer peripheral edge 41a" and "first main surface 41b", respectively, and the outer peripheral edge 4a and the main surface 4b of the second surface 42 are referred to as "second outer peripheral edge 42a" and "second main surface 42b", respectively.

[0117] Although not shown in the diagram, the first outer peripheral portion 41a is configured to surround the first main surface portion 41b in a top view. Furthermore, the first outer peripheral portion 41a is located further outward (above the first main surface portion 41b) than the first main surface portion 41b in a direction perpendicular to the first surface 41 (first main surface portion 41b). That is, the first main surface portion 41b is a portion recessed towards the capacitor element 2 (below). Therefore, a gap 9 can be formed between the first main surface portion 41b and the flat surface 70 of the first cooler 71. The aforementioned thermal interface material is disposed in this gap 9.

[0118] On the other hand, the second outer peripheral portion 42a is also configured to surround the second main surface portion 42b in a top view. Furthermore, the second outer peripheral portion 42a is located further outward (lower than the second main surface portion 42b) than the second main surface portion 42b in a direction perpendicular to the second surface portion 42 (second main surface portion 42b). That is, the second main surface portion 42b is a portion recessed towards the capacitor element 2 (above). Therefore, a gap 9 can be formed between the second main surface portion 42b and the flat surface 70 of the second cooler 72. The aforementioned thermal interface material is disposed in this gap 9.

[0119] Cooler The cooler 7 contacts the first resin part 4 while pressing the first resin part 4 toward the capacitor element 2.

[0120] Specifically, the first cooler 71 contacts the first resin part 4 while pressing the first outer peripheral portion 41a of the first resin part 4 toward the capacitor element 2 (i.e., downward). The flat surface 70 of the first cooler 71 is in close contact with the first outer peripheral portion 41a and the thermal interface material (not shown) disposed in the gap 9.

[0121] On the other hand, the second cooler 72 contacts the first resin part 4 while pressing the second outer peripheral portion 42a of the first resin part 4 toward the capacitor element 2 (i.e., upward). The flat surface 70 of the second cooler 72 is in close contact with the second outer peripheral portion 42a and the thermal interface material (not shown) disposed in the gap 9.

[0122] <Effects> If the pressing pressure is further increased while the first cooler 71 is abutting against the first outer peripheral edge 41a of the first resin part 4, the pressure applied to the first main surface 41b of the first resin part 4 can be reduced by deforming the first outer peripheral edge 41a. Similarly, if the pressing pressure is further increased while the second cooler 72 is abutting against the second outer peripheral edge 42a of the first resin part 4, the pressure applied to the second main surface 42b of the first resin part 4 can be reduced by deforming the second outer peripheral edge 42a.

[0123] Therefore, according to the sixth embodiment, even if pressure is applied to make the cooler 7 fit tightly, the pressure can be prevented from being applied directly to the capacitor element 2.

[0124] It can suppress damage to capacitor element 2.

[0125] (7) 7th implementation method Regarding the capacitor 1 involved in the 7th embodiment, refer to... Figure 8 The following explanation is provided. In the seventh embodiment, for the same constituent elements as in the first to sixth embodiments, the same reference numerals as in the first to sixth embodiments are sometimes used, and detailed descriptions are omitted.

[0126] Similar to the sixth embodiment, the capacitor 1 according to the seventh embodiment differs from the capacitor 1 according to the first to fifth embodiments in that it does not have a component equivalent to the frame 3 of the first to fifth embodiments. Furthermore, the seventh embodiment differs from the sixth embodiment in the main surface area 4b of the first resin portion 4. Hereinafter, the differences will be described in detail.

[0127] <Section 1 Resin> The first main surface area 41b of the first surface 41 and the second main surface area 42b of the second surface 42 are each concave. That is, the first main surface area 41b of the first surface 41 and the second main surface area 42b of the second surface 42 each face the capacitor element 2 and are gently recessed in the center. Therefore, a gap 9 can be formed between the first main surface area 41b of the first surface 41 and the flat surface 70 of the first cooler 71. Similarly, a gap 9 can be formed between the second main surface area 42b of the second surface 42 and the flat surface 70 of the second cooler 72. The aforementioned thermal interface material is disposed in these gaps 9.

[0128] <Effects> The seventh embodiment also has roughly the same effect as the sixth embodiment.

[0129] (8) Implementation Method 8 Regarding the capacitor 1 involved in the eighth embodiment, refer to... Figure 9 The following explanation is provided. In the 8th embodiment, for the same constituent elements as in the 1st to 7th embodiments, the same reference numerals as in the 1st to 7th embodiments are sometimes used and detailed descriptions are omitted.

[0130] Similar to embodiments 6 and 7, the capacitor 1 in embodiment 8 differs from the capacitors 1 in embodiments 1 to 5 in that it does not include a component equivalent to the frame 3 in embodiments 1 to 5. Furthermore, embodiment 8 differs from embodiment 6 in that the capacitor 1 further includes a second resin portion 5. Figure 7 )different.

[0131] <Second Resin Section> The second resin portion 5 covers at least one of the first surface 41 and the second surface 42 (both of the first surface 41 and the second surface 42 in the eighth embodiment).

[0132] Specifically, the second resin portion 5a covers the first main surface portion 41b of the first resin portion 4. On the other hand, the second resin portion 5b covers the second main surface portion 42b of the first resin portion 4.

[0133] Furthermore, a portion of the second resin portion 5 (referred to as "a portion of the second resin portion 5a" and "a portion of the second resin portion 5b" in the eighth embodiment) protrudes outward from the outer periphery portion 4a in a direction perpendicular to at least one of the first surface 41 and the second surface 42.

[0134] Specifically, "a portion of the second resin portion 5a" is the portion extending from the virtual plane P1 containing the first outer peripheral portion 41a to the flat surface 50a. On the other hand, "a portion of the second resin portion 5b" is the portion extending from the virtual plane P2 containing the second outer peripheral portion 42a to the flat surface 50b.

[0135] In the eighth embodiment, similarly to the fifth embodiment, the second resin portion 5 is softer than the first resin portion 4. That is, the Young's modulus of the second resin portion 5 is less than that of the first resin portion 4. The material and Young's modulus of the second resin portion 5 are as described above.

[0136] Cooler The cooler 7 contacts the second resin part 5 while pressing it toward the capacitor element 2.

[0137] Specifically, the first cooler 71 contacts the second resin portion 5a while pressing it toward the flat surface 50a of the capacitor element 2 (i.e., downwards). Thus, the flat surface 70 of the first cooler 71 is in close contact with the flat surface 50a. Furthermore, depending on the pressing force, the flat surface 70 of the first cooler 71 may also be in close contact with the first outer peripheral edge 41a of the first resin portion 4.

[0138] On the other hand, the second cooler 72 contacts the second resin portion 5b while pressing the flat surface 50b of the second resin portion 5b in the direction toward (i.e., upward) towards the capacitor element 2. Thus, the flat surface 70 of the second cooler 72 is in close contact with the flat surface 50b. Furthermore, depending on the pressing force, the flat surface 70 of the second cooler 72 may also be in close contact with the second outer peripheral edge 42a of the first resin portion 4.

[0139] <Effects> The eighth embodiment is also the same as the fifth embodiment ( Figure 6 Similarly, it can improve the heat dissipation of capacitor 1.

[0140] On the other hand, in the eighth embodiment, if the first cooler 71 is pressed against the flat surface 50a of the second resin portion 5a, the pressure applied to the second resin portion 5a can be reduced by deforming the second resin portion 5a. Similarly, if the second cooler 72 is pressed against the flat surface 50b of the second resin portion 5b, the pressure applied to the first resin portion 4 can be reduced by deforming the first resin portion 4.

[0141] Even when the pressing pressure is further increased while the first cooler 71 is in contact with the first outer peripheral edge 41a of the first resin part 4, the pressure applied to the second resin part 5 can be reduced because the second resin part 5 is softer than the first resin part 4. Similarly, even when the pressing pressure is further increased while the second cooler 72 is in contact with the second outer peripheral edge 42a of the first resin part 4, the pressure applied to the second resin part 5 can be reduced because the second resin part 5 is softer than the first resin part 4.

[0142] Therefore, according to the eighth embodiment, the pressure applied to the capacitor element 2 can be reduced by the second resin portion 5. As a result, damage to the capacitor element 2 can be suppressed.

[0143] (9) 9th implementation method Regarding the capacitor 1 involved in the 9th embodiment, refer to... Figure 10 The following explanation is provided. In the 9th embodiment, for the same constituent elements as in the 1st to 8th embodiments, the same reference numerals are sometimes used as in the 1st to 8th embodiments, and detailed descriptions are omitted.

[0144] The capacitor 1 according to the ninth embodiment differs from the capacitors 1 according to the first to fifth embodiments in that it has a housing 6 instead of a component corresponding to the frame 3 in the first to fifth embodiments. Hereinafter, the differences will be the focus of the explanation.

[0145] <Shell> The shape of the housing 6 is not particularly limited. Although the illustration is omitted, in the ninth embodiment, the housing 6 is rectangular when viewed from above. Furthermore, the housing 6 is larger than the capacitor element 2 when viewed from above.

[0146] The housing 6 has a base plate portion 62 and a peripheral wall portion 63. The peripheral wall portion 63 extends upward from the outer periphery of the base plate portion 62. The upper end of the peripheral wall portion 63 is an opening edge portion 6a. The planar area enclosed by the opening edge portion 6a is an opening surface 60. The space enclosed by the base plate portion 62, the peripheral wall portion 63, and the opening surface 60 is a receiving portion 61. A capacitor element 2 is received in the receiving portion 61. Thus, the housing 6 has an opening surface 60 and receives the capacitor element 2.

[0147] <Section 1 Resin> First resin part 4 and fifth embodiment ( Figure 6 Similarly, the capacitor element 2 is sealed. That is, the capacitor element 2 is embedded in the first resin part 4.

[0148] The first resin portion 4 is disposed inside the housing 6. In the ninth embodiment, the first resin portion 4 fills the interior of the housing 6 (receiving portion 61). Specifically, the portion of the receiving portion 61 other than the capacitor element 2 and the busbar 8 is filled with the first resin portion 4.

[0149] The first resin portion 4 is located inside the opening surface 60. Specifically, the first surface 41 of the first resin portion 4 is located inside the opening surface 60 (below the opening surface 60). That is to say, the first surface 41 and the opening surface 60 do not exist on the same plane.

[0150] The first resin portion 4 is softer than the shell 6. The hardness of the shell 6 can also be defined by Young's modulus. That is, the Young's modulus of the first resin portion 4 is less than the Young's modulus of the shell 6. Specifically, the Young's modulus of the shell 6 is, for example, 1 GPa or more and 25 GPa or less.

[0151] <Second Resin Section> The second resin portion 5 covers the first resin portion 4. Specifically, the second resin portion 5 fills the space enclosed by the inner surface of the peripheral wall portion 63 of the housing 6, the first surface 41 of the first resin portion 4, and the opening surface 60. Furthermore, a portion of the second resin portion 5 protrudes outward (upward) beyond the opening surface 60.

[0152] The second resin portion 5 is softer than the first resin portion 4. Thus, among the shell 6, the first resin portion 4, and the second resin portion 5, the second resin portion 5 is the softest. That is, the Young's modulus of the second resin portion 5 is less than that of the first resin portion 4, and is the smallest among the Young's moduli of the shell 6, the first resin portion 4, and the second resin portion 5.

[0153] Cooler The cooler 7 contacts the second resin part 5 while pressing the second resin part 5 toward the capacitor element 2.

[0154] Specifically, the cooler 7 contacts the second resin part 5 while pressing the flat surface 50 of the second resin part 5 towards the capacitor element 2 (i.e., the lower side). Thus, the flat surface 70 of the cooler 7 is in close contact with the flat surface 50. Alternatively, depending on the pressing force, the flat surface 70 of the cooler 7 may also be in close contact with the opening edge 6a of the housing 6.

[0155] <Bus> In the ninth embodiment, the first busbar 81 extends outward (to the left of the peripheral wall portion 63) of the housing 6, penetrating the first resin portion 4 and the peripheral wall portion 63. Conversely, the second busbar 82 also extends outward (to the right of the peripheral wall portion 63) of the housing 6, penetrating the first resin portion 4 and the peripheral wall portion 63. Additionally, the busbar 8 may also penetrate the base plate portion 62.

[0156] <Effects> The ninth embodiment is also the same as the fifth embodiment ( Figure 6 Similarly, it can improve the heat dissipation of capacitor 1.

[0157] On the other hand, in the ninth embodiment, when the cooler 7 is pressed against the flat surface 50 of the second resin part 5, the pressure applied to the second resin part 5 can be reduced by deforming the second resin part 5.

[0158] Even when the pressure increases further when the cooler 7 is in contact with the opening edge 6a of the housing 6, the pressure applied to the second resin part 5 can be reduced because the second resin part 5 is softer than the first resin part 4 and the housing 6.

[0159] Therefore, according to the ninth embodiment, even when pressure is applied to make the cooler 7 fit tightly, it is possible to prevent the pressure from being directly applied to the capacitor element 2. As a result, damage to the capacitor element 2 can be prevented.

[0160] (10) 10th Embodiment Regarding the capacitor 1 involved in the 10th embodiment, refer to... Figure 11The following explanation is provided. In the 10th embodiment, for the same constituent elements as in the 1st to 9th embodiments, the same reference numerals are sometimes used as in the 1st to 9th embodiments, and detailed descriptions are omitted.

[0161] The capacitor 1 according to the tenth embodiment differs from that according to the ninth embodiment in that it has a housing 6 instead of the component corresponding to the frame 3 in the first to fifth embodiments. Furthermore, the capacitor 1 according to the tenth embodiment does not have a second resin portion 5, which differs from that in the ninth embodiment. Hereinafter, the differences will be described in detail.

[0162] <Section 1 Resin> A portion of the first resin portion 4 protrudes outward (upward) beyond the opening surface 60. Specifically, the first surface 41 of the first resin portion 4 is located outside (above) the opening surface 60. In this way, the first surface 41 and the opening surface 60 do not exist on the same plane.

[0163] The first resin part 4 is also softer than the shell 6, similar to the ninth embodiment.

[0164] Cooler The cooler 7 contacts the first resin portion 4 while pressing it toward the capacitor element 2. Specifically, the flat surface 70 of the cooler 7 is in close contact with the first surface 41. Alternatively, depending on the pressing force, the flat surface 70 of the cooler 7 may also be in close contact with the opening edge 6a of the housing 6.

[0165] <Effects> The 10th embodiment is also the same as the 4th embodiment ( Figure 5 Similarly, it can improve the heat dissipation of capacitor 1.

[0166] In particular, in the 10th embodiment, when the cooler 7 is pressed against the first surface 41 of the first resin part 4, the pressure applied to the first resin part 4 can be reduced by deforming the first resin part 4.

[0167] Even when the pressure is further increased while the cooler 7 is in contact with the opening edge 6a of the housing 6, the pressure applied to the first resin part 4 can be reduced because the first resin part 4 is softer than the housing 6.

[0168] Therefore, according to the 10th embodiment, even when pressure is applied to make the cooler 7 fit tightly, it is possible to prevent the pressure from being directly applied to the capacitor element 2. As a result, damage to the capacitor element 2 can be suppressed.

[0169] Furthermore, the first resin portion 4 of the sealed capacitor element 2 is harder than the second resin portion 5, making it difficult for moisture to pass through. Therefore, the sealing effect can be improved.

[0170] 3. Variations At least two of the embodiments in embodiments 1 to 10 may also be combined appropriately.

[0171] In embodiments 1 to 8, the cooler 7 includes both a first cooler 71 and a second cooler 72, but it may also include only one of the first cooler 71 or the second cooler 72.

[0172] In embodiments 1 to 10, the busbar 8 extends in the left-right direction, but it can also extend in the front-back direction.

[0173] In the first embodiment ( Figure 1 ) and the fourth embodiment ( Figure 5 In the first surface 41 and the flat surface 70 of the cooler 7, and / or the second surface 42 and the flat surface 70 of the cooler 7, a thermal interface material may also be inserted.

[0174] In the fourth embodiment ( Figure 5 In this process, the second resin part 5 can be used instead of the first resin part 4.

[0175] In the 5th embodiment ( Figure 6 In the first opening face 41, the first opening face 31 can also be flush with the second opening face 32.

[0176] In the 5th embodiment ( Figure 6 ) and the 8th embodiment ( Figure 9 In the second resin part 5a, a thermal interface material may also be inserted between the flat surface 50a of the second resin part 5a and the flat surface 70 of the cooler 7, and / or between the flat surface 50b of the second resin part 5b and the flat surface 70 of the cooler 7.

[0177] In the 9th embodiment ( Figure 10 In the first face 41, the first face 41 can also be flush with the opening face 60.

[0178] In the 9th embodiment ( Figure 10 In the second resin part 5, a thermal interface material may also be inserted between the flat surface 50 of the second resin part 5 and the flat surface 70 of the cooler 7.

[0179] In the 10th embodiment ( Figure 11 In the first surface 41, a thermal interface material may also be introduced between the first surface 41 and the flat surface 70 of the cooler 7.

[0180] In the 10th embodiment ( Figure 11 In this process, the second resin part 5 can be used instead of the first resin part 4.

[0181] 4. Plan As is evident from the above embodiments and variations, this disclosure includes the following solutions. In the following text, reference numerals are used in brackets only to illustrate the correspondence with the embodiments.

[0182] The first embodiment is a capacitor (1) comprising: a capacitor element (2); a frame (3) having a pair of opposing openings (30) and surrounding the capacitor element (2); and a first resin portion (4) disposed inside the frame (3) and sealing the capacitor element (2). The capacitor element (2) is disposed between the pair of openings (30). The first resin portion (4) is more flexible than the frame (3).

[0183] According to this scheme, even if pressure is applied to make the cooler (7) fit tightly, the pressure can be suppressed from being applied directly to the capacitor element (2).

[0184] The second embodiment is a capacitor (1) based on the first embodiment. In the second embodiment, the capacitor (1) also includes a cooler (7) which is opposite to at least one of a pair of open surfaces (30) and contacts the at least one of the frame (3) and the first resin part (4) while pressing the frame (3) and the first resin part (4) toward the capacitor element (2).

[0185] According to this scheme, even if pressure is applied to make the cooler (7) fit tightly, the pressure can be suppressed from being applied directly to the capacitor element (2).

[0186] The third embodiment is a capacitor (1) comprising: a capacitor element (2); a frame (3) having a pair of opposing openings (30) and surrounding the capacitor element (2); and a first resin portion (4) disposed inside the frame (3) and sealing the capacitor element (2). The capacitor element (2) is disposed between the pair of openings (30). The first resin portion (4) is located further inward than at least one of the pair of openings (30).

[0187] According to this scheme, even if pressure is applied to make the cooler (7) fit tightly, the pressure can be suppressed from being applied directly to the capacitor element (2).

[0188] The fourth embodiment is a capacitor (1) based on the third embodiment. In the fourth embodiment, the capacitor (1) further includes a second resin portion (5) which is located closer to at least one of the pair of opening surfaces (30) than the first resin portion (4) and covers the first resin portion (4). The second resin portion (5) is softer than the first resin portion (4).

[0189] According to this scheme, the pressure applied to the capacitor element (2) can be reduced by using the second resin part (5).

[0190] The fifth embodiment is a capacitor (1) based on the fourth embodiment. In the fifth embodiment, a portion of the second resin portion (5) protrudes further outward than at least one of the pair of open surfaces (30).

[0191] According to this scheme, the pressure applied to the capacitor element (2) can be reduced by using the second resin part (5).

[0192] The sixth embodiment is a capacitor (1) based on the fourth or fifth embodiment. In the sixth embodiment, the capacitor (1) also includes a cooler (7) that contacts the second resin part (5) while pressing the second resin part (5) toward the capacitor element (2).

[0193] According to this scheme, the pressure applied to the capacitor element (2) can be reduced by using the second resin part (5).

[0194] The seventh embodiment is a capacitor (1) comprising: a capacitor element (2); and a first resin portion (4) sealing the capacitor element (2). The first resin portion (4) has a first surface (41) and a second surface (42) opposite to the first surface (41). The capacitor element (2) is disposed between the first surface (41) and the second surface (42). At least one of the first surface (41) and the second surface (42) is recessed into the capacitor element (2) except for the peripheral portion (4a).

[0195] According to this scheme, even if pressure is applied to make the cooler (7) fit tightly, the pressure can be suppressed from being applied directly to the capacitor element (2).

[0196] The eighth embodiment is a capacitor (1) based on the seventh embodiment. In the eighth embodiment, the capacitor (1) further includes a second resin portion (5) covering at least one of the first surface (41) and the second surface (42). The second resin portion (5) is softer than the first resin portion (4).

[0197] According to this scheme, the pressure applied to the capacitor element (2) can be reduced by utilizing the second resin part (5).

[0198] The ninth embodiment is a capacitor (1) based on the eighth embodiment. In the ninth embodiment, a portion of the second resin portion (5) protrudes further outward than the outer peripheral portion (4a) in a direction perpendicular to at least one of the first surface (41) and the second surface (42).

[0199] According to this scheme, the pressure applied to the capacitor element (2) can be reduced by utilizing the second resin part (5).

[0200] The tenth embodiment is a capacitor (1) based on the eighth or ninth embodiment. In the tenth embodiment, the capacitor (1) also includes a cooler (7) that contacts the second resin part (5) while pressing the second resin part (5) toward the capacitor element (2).

[0201] According to this scheme, the pressure applied to the capacitor element (2) can be reduced by utilizing the second resin part (5).

[0202] The 11th embodiment is a capacitor (1) comprising: a capacitor element (2); a housing (6) having an opening (60) and housing the capacitor element (2); a first resin portion (4) disposed inside the housing (6) and sealing the capacitor element (2); and a second resin portion (5) covering the first resin portion (4). The second resin portion (5) protrudes further outward than the opening (60).

[0203] According to this scheme, even if pressure is applied to make the cooler (7) fit tightly, the pressure can be suppressed from being applied directly to the capacitor element (2).

[0204] The 12th design is a capacitor (1) based on the 11th design. In the 12th design, the first resin part (4) is more flexible than the housing (6). The second resin part (5) is more flexible than the first resin part (4).

[0205] According to this scheme, since the second resin part (5) is softer than the first resin part (4) and the housing (6), the pressure applied to the capacitor element (2) can be reduced.

[0206] The 13th embodiment is a capacitor (1) based on the 11th or 12th embodiment. In the 13th embodiment, the capacitor (1) also includes a cooler (7) that contacts the second resin part (5) while pressing the second resin part (5) toward the capacitor element (2).

[0207] According to this scheme, even if pressure is applied to make the cooler (7) fit tightly, the pressure can be suppressed from being applied directly to the capacitor element (2).

[0208] The 14th embodiment is a capacitor (1) comprising: a capacitor element (2); a housing (6) having an opening (60) and housing the capacitor element (2); and a first resin portion (4) disposed inside the housing (6) and sealing the capacitor element (2). The first resin portion (4) protrudes further outward than the opening (60).

[0209] According to this scheme, even if pressure is applied to make the cooler (7) fit tightly, the pressure can be suppressed from being applied directly to the capacitor element (2).

[0210] Scheme 15 is a capacitor (1) based on Scheme 14. In Scheme 15, the first resin part (4) is more flexible than the housing (6).

[0211] According to this scheme, since the first resin part (4) is softer than the housing (6), the pressure applied to the capacitor element (2) can be reduced.

[0212] The 16th embodiment is a capacitor (1) based on the 14th or 15th embodiment. In the 16th embodiment, the capacitor (1) also includes a cooler (7) that contacts the first resin part (4) while pressing the first resin part (4) toward the capacitor element (2).

[0213] According to this scheme, even if pressure is applied to make the cooler (7) fit tightly, the pressure can be suppressed from being applied directly to the capacitor element (2).

[0214] Explanation of reference numerals in the attached figures 1. Capacitor 2. Capacitor Components 3. Frame 30 Open face 4. Resin Section 1 41 Page 1 42 Page 2 4a Peripheral edge 5. Second Resin Section 6. Shell 60 Opening face 7. Cooler.

Claims

1. A capacitor characterized by, have: Capacitor components; A frame having a pair of opposing openings and surrounding the capacitor element; and The first resin portion, disposed inside the frame and sealing the capacitor element, The capacitor element is disposed between the pair of open surfaces. The first resin part is softer than the frame.

2. The capacitor of claim 1, wherein It also includes a cooler that is opposite to at least one of the pair of open surfaces and contacts the at least one of the frame and the first resin portion while pressing the frame and the first resin portion toward the capacitor element.

3. A capacitor, characterized in that, have: Capacitor components; A frame having a pair of opposing openings and surrounding the capacitor element; and The first resin portion, disposed inside the frame and sealing the capacitor element, The capacitor element is disposed between the pair of open surfaces. The first resin portion is located further inward than at least one of the pair of opening surfaces.

4. The capacitor as claimed in claim 3, characterized in that, It also includes a second resin portion, which is located closer to at least one of the pair of opening surfaces than the first resin portion, and covers the first resin portion. The second resin portion is softer than the first resin portion.

5. The capacitor as claimed in claim 4, characterized in that, A portion of the second resin portion protrudes further outward than at least one of the pair of opening surfaces.

6. The capacitor of claim 5 wherein, It also includes a cooler that contacts the second resin portion while pressing it toward the capacitor element.

7. A capacitor characterized by have: Capacitor elements; and The first resin portion of the capacitor element is sealed. The first resin portion has a first surface and a second surface opposite to the first surface. The capacitor element is disposed between the first surface and the second surface. At least one of the first surface and the second surface, except for the peripheral portion, is recessed into the capacitor element.

8. The capacitor of claim 7 wherein, It also includes a second resin portion covering at least one of the first surface and the second surface. The second resin portion is softer than the first resin portion.

9. The capacitor of claim 8 wherein, A portion of the second resin portion protrudes further outward than the outer peripheral portion in a direction perpendicular to at least one of the first and second surfaces.

10. The capacitor of claim 9 wherein, It also includes a cooler that contacts the second resin portion while pressing it toward the capacitor element.

11. A capacitor characterized by have: Capacitor components; A housing having an opening and accommodating the capacitor element; A first resin portion disposed inside the housing and sealing the capacitor element; as well as A second resin portion covering the first resin portion. The second resin portion protrudes further outward than the opening surface.

12. The capacitor of claim 11, wherein The first resin portion is more flexible than the shell. The second resin portion is softer than the first resin portion.

13. The capacitor of claim 12, wherein It also includes a cooler that contacts the second resin portion while pressing it toward the capacitor element.

14. A capacitor, characterized by have: Capacitor components; A housing having an opening and accommodating the capacitor element; and The first resin portion, disposed inside the housing and sealing the capacitor element, The first resin portion protrudes further outward than the opening surface.

15. The capacitor of claim 14, wherein The first resin portion is softer than the shell.

16. The capacitor of claim 15, wherein It also includes a cooler that contacts the first resin portion while pressing it toward the capacitor element.

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