A multilayer ceramic capacitor, a circuit board assembly, and a display device

Abstract

This application provides a multilayer ceramic capacitor, a circuit board assembly, and a display device, belonging to the field of capacitor technology. The multilayer ceramic capacitor includes: a ceramic body; a first external electrode and a second external electrode, respectively disposed on opposite first and second outer surfaces of the ceramic body. The ceramic body includes a first portion, a second portion, and a third portion connecting the first and second portions. The ceramic body includes multiple internal electrodes, including alternating first and second internal electrodes, respectively connected to the first and second external electrodes. In the first and second portions, the plane containing the first main body segment of the first internal electrode and the second main body segment of the second internal electrode is perpendicular to a first direction. In the third portion, the plane containing the first and second main body segments is perpendicular to a second direction, and the first direction is perpendicular to the second direction. The multilayer ceramic capacitor of this application can effectively reduce capacitor noise.

Description

Technical Field

[0001] This application relates to the field of capacitor technology, and more specifically, to a multilayer ceramic capacitor, a circuit board assembly, and a display device. Background Technology

[0002] Multilayer ceramic capacitors (multi) Multilayer ceramic capacitors (MLCCs) are one of the main components in electronic devices due to their high reliability, high precision, high frequency, voltage regulation, filtering, low power consumption, large capacity, miniaturization, and low cost. They are especially commonly used in display devices.

[0003] However, in high-frequency AC signal lines, due to the inverse piezoelectric effect, changes in the voltage applied to the MLCC cause it to deform. This can lead to the MLCC colliding with the attached printed circuit board (PCB), resulting in capacitor squealing or board oscillation. Furthermore, as the refresh rate and resolution of display devices increase, their power consumption also increases, making the squealing phenomenon more pronounced. To address this, an anti-squeaking capacitor is introduced, but this increases cost.

[0004] Therefore, how to efficiently reduce capacitor whistling is an urgent problem to be solved. Summary of the Invention

[0005] This application provides a multilayer ceramic capacitor, a circuit board assembly, and a display device. In the multilayer ceramic capacitor, the first inner electrode and the second inner electrode arranged on both sides of the ceramic body are perpendicular to the first inner electrode and the second inner electrode arranged in the middle of the ceramic body. In this way, when a voltage is applied to the first outer electrode and the second outer electrode, the electric field in the middle of the ceramic body is perpendicular to the electric field on both sides, thereby effectively reducing the howling caused by the inverse piezoelectric effect.

[0006] In a first aspect, a multilayer ceramic capacitor is provided, comprising: a ceramic body including multiple dielectric layers and a plurality of internal electrodes, the ceramic body including a first part, a second part, and a third part connected between the first part and the second part; a first external electrode and a second external electrode, respectively disposed on opposite first and second external surfaces of the ceramic body; wherein each of the plurality of internal electrodes is disposed between two adjacent dielectric layers, the plurality of internal electrodes including alternating first and second internal electrodes, the first internal electrode being connected to the first external electrode, the second internal electrode being connected to the second external electrode, the first internal electrode including a first main body segment, the second internal electrode including a second main body segment, the plane containing the first and second main body segments in the first and second parts being perpendicular to a first direction, the plane containing the first and second main body segments in the third part being perpendicular to a second direction, and the first direction being perpendicular to the second direction.

[0007] In this embodiment, the first and second inner electrodes disposed on both sides of the ceramic body in the multilayer ceramic capacitor are perpendicular to the first and second inner electrodes disposed in the middle of the ceramic body. Thus, when a voltage is applied to the first and second outer electrodes, an electric field parallel to the first direction is formed in the middle of the ceramic body, and an electric field perpendicular to the first direction is formed on both sides of the ceramic body. In this way, when the applied voltage changes continuously, the dielectric layer can maintain the expansion in the same direction, such as expanding into the ceramic body or expanding outward from the ceramic body, thereby reducing the deformation of the multilayer ceramic capacitor and effectively reducing the howling caused by the inverse piezoelectric effect.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the first inner electrode further includes a first connecting segment, and the second inner electrode further includes a second connecting segment. The first connecting segment connects two adjacent first main body segments, and the second connecting segment connects two adjacent second main body segments.

[0009] In this embodiment, two adjacent first inner electrodes and two adjacent second inner electrodes are connected in the multilayer ceramic capacitor. When a voltage is applied, an electric field parallel to the first direction is formed in the middle of the ceramic body, and an electric field perpendicular to the first direction is formed on both sides of the ceramic body. In this way, when the applied voltage changes continuously, the dielectric layer can maintain the expansion in the same direction, such as expanding into the ceramic body or expanding outward from the ceramic body. This can reduce the deformation of the multilayer ceramic capacitor and effectively reduce the howling caused by the inverse piezoelectric effect.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, the first inner electrode is an arc-shaped structure, and the second inner electrode is an arc-shaped structure.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the first main body segment and the first connecting segment form a U-shaped cross-sectional structure, and the second main body segment and the second connecting segment form a U-shaped cross-sectional structure.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, the first inner electrode and the second inner electrode located in the first part and the second part are alternately arranged along a first direction, and the first inner electrode and the second inner electrode located in the third part are alternately arranged along a second direction.

[0013] In this embodiment, the first inner electrode and the second inner electrode are alternately arranged in the multilayer ceramic capacitor. When a voltage is applied, an electric field parallel to the first direction is formed in the middle of the ceramic body, and an electric field perpendicular to the first direction is formed on both sides of the ceramic body. In this way, when the applied voltage changes continuously, the dielectric layer can maintain the expansion in the same direction, such as expanding into the ceramic body or expanding outward from the ceramic body. This can reduce the deformation of the multilayer ceramic capacitor and effectively reduce the howling caused by the inverse piezoelectric effect.

[0014] In conjunction with the first aspect, in some implementations of the first aspect, the first inner electrode includes a first lead-out portion, the second inner electrode includes a second lead-out portion, the first outer electrode is connected to the first lead-out portion, and the second outer electrode is connected to the second lead-out portion.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, both the first outer surface and the second outer surface are parallel to the first direction.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, the first inner electrode located in the first part and the second part includes a first lead-out portion, the second inner electrode located in the first part and the second part includes a second lead-out portion, the first lead-out portion is connected to the first outer electrode, and the second lead-out portion is connected to the second outer electrode; the first inner electrode located in the third part includes a first extension portion, the first extension portion is connected to the first outer electrode, and the second inner electrode located in the third part includes a second extension portion, the second extension portion is connected to the second outer electrode. In conjunction with the first aspect, in some implementations of the first aspect, both the first outer surface and the second outer surface are parallel to the second direction.

[0017] In a second aspect, a circuit board assembly is provided, comprising: a circuit board; and a multilayer ceramic capacitor as described in the first aspect and any of the aspects thereof, the multilayer ceramic capacitor being electrically connected to the circuit board.

[0018] Thirdly, a display device is provided, comprising: a display panel; and a circuit board assembly as described in the second aspect and any other aspect, the circuit board assembly being electrically connected to the display panel.

[0019] Fourthly, an electronic device is provided, which includes the display device described in the third aspect and any of the other aspects. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a multilayer ceramic capacitor.

[0021] Figure 2 This is a schematic diagram of a circuit board assembly.

[0022] Figure 3 This is a schematic diagram of the deformation of a multilayer ceramic capacitor.

[0023] Figure 4 This is a schematic diagram of a multilayer ceramic capacitor provided in an embodiment of this application.

[0024] Figure 5 This is a schematic diagram of a ceramic body provided in an embodiment of this application.

[0025] Figure 6 This is a schematic diagram of another multilayer ceramic capacitor provided in the embodiments of this application.

[0026] Figure 7 This is a schematic diagram of a circuit board assembly provided in an embodiment of this application. Detailed Implementation

[0027] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0028] This application will present various aspects, embodiments, or features relating to a system comprising multiple devices, components, modules, etc. It should be understood and appreciated that individual systems may include additional devices, components, modules, etc., and / or may not include all the devices, components, modules, etc. discussed in conjunction with the accompanying drawings. Furthermore, combinations of these approaches are also possible.

[0029] Furthermore, in the embodiments of this application, words such as "exemplarily" and "for example" are used to indicate that they are examples, illustrations, or descriptions. Any embodiment or design scheme described as an "example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the term "example" is intended to present the concept in a concrete manner. The business scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new business scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0030] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in some possible embodiments," "in other embodiments," "in yet other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0031] In this application embodiment, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0032] In the embodiments of this application, the same reference numerals are used to denote the same component or part. For the same part in the embodiments of this application, only one part or component may be labeled with reference numerals in the figures. It should be understood that the reference numerals also apply to other identical parts or components. In addition, the various parts in the figures are not drawn to scale, and the dimensions and sizes of the parts shown in the figures are only exemplary and should not be construed as limiting this application.

[0033] The following describes the technical content related to the embodiments of this application.

[0034] In the field of display circuits, MLCCs are commonly used components in voltage regulation and filtering applications. The high-frequency, low-loss characteristics of ceramic dielectrics allow MLCCs to maintain low equivalent series resistance and equivalent series inductance in mid-to-high frequency signal paths, effectively filtering noise and providing stable voltage support for display driver chips and other modules. Furthermore, MLCCs are small in size and highly integrated; their multi-layer stacked structure achieves high capacitance density per unit volume, making them suitable for the compact PCB layout requirements of mobile devices such as smartphones and tablets, and meeting the design requirements for high-density wiring in display circuits.

[0035] Based on these advantages, MLCCs are widely used in display circuits. For example, in display circuits, MLCCs perform voltage regulation and filtering functions, suppressing voltage fluctuations caused by dynamic load changes. However, in applications involving high-frequency AC signal lines, when an alternating voltage is applied across the MLCC, the ceramic dielectric will undergo periodic mechanical deformation due to the inverse piezoelectric effect. This can cause the MLCC to collide with the bonded PCB, resulting in capacitor squealing or board vibration.

[0036] Figure 1 This is a schematic diagram of a multilayer ceramic capacitor 10.

[0037] As one implementation method, refer to Figure 1 As shown, the multilayer ceramic capacitor 10 may include: a ceramic body 11, a first external electrode 12, and a second external electrode 13.

[0038] The ceramic body 11 includes alternating layers of a first inner electrode 111 and a second inner electrode 112, and a dielectric layer 113 located between the first inner electrode 111 and the second inner electrode 112. A first outer electrode 12 and a second outer electrode 13 are disposed on the ceramic body 11, with the first outer electrode 12 electrically connected to the first inner electrode 111 and the second outer electrode 13 electrically connected to the second inner electrode 112.

[0039] For example, the alternatingly stacked first inner electrode 111 and second inner electrode 112, and the dielectric layer 113 located between the first inner electrode 111 and the second inner electrode 112, can be alternatively described as follows: the ceramic body 11 includes a plurality of first inner electrodes 111, a multilayer dielectric layer 113, and a plurality of second inner electrodes 112, wherein the first inner electrode 111, the dielectric layer 113, and the second inner electrode 112 are alternately stacked. Figure 1 As shown, both the first inner electrode 111 and the second inner electrode 112 are parallel to the X direction. The dielectric layer 113 is also parallel to the X direction. The first inner electrode 111 and the second inner electrode 112 are staggered, and the edges of the staggered first inner electrode 111 and the second inner electrode 112 are exposed on the sidewalls of opposite sides of the ceramic body 11, so that the first outer electrode 12 and the second outer electrode 13 are electrically connected to the first inner electrode 111 and the second inner electrode 112, respectively.

[0040] For example, the dielectric layer 113 can be a ceramic material with a high dielectric constant, such as barium titanate or strontium titanate. During use, the dielectric layer 113 exhibits a reverse piezoelectric effect, which causes an alternating current voltage to be applied to the first external electrode 12 and the second external electrode 13, i.e., as... Figure 1 As shown, an electric field is applied along the Z direction (e.g. Figure 1 When the black double arrow (in the image) is pointed out, the multilayer ceramic capacitor 10 will move along a direction perpendicular to the electric field, for example, along... Figure 1The two black single arrows, parallel to the X-direction, contract inwards; and along a direction parallel to the electric field, for example, along... Figure 1 Two black single arrows parallel to the Z direction expand outwards.

[0041] In other words, when the voltage applied to the multilayer ceramic capacitor 10 switches back and forth, the multilayer ceramic capacitor 10 will deform in the Z direction, and thus the multilayer ceramic capacitor 10 will vibrate up and down.

[0042] Typically, the multilayer ceramic capacitor 10 is mounted on a circuit board. For example, the multilayer ceramic capacitor 10 can be soldered onto the circuit board. Figure 2 As shown, the multilayer ceramic capacitor 10 is bonded to the circuit board 21 to form the circuit board assembly 20. The up-and-down vibration of the multilayer ceramic capacitor 10 causes surface vibration of the circuit board 21, i.e., "board vibration". If the vibration frequency is within the audible range of 20Hz... Within the 20kHz range, a piercing howling sound can be heard. When electronic devices are close to the ear, the howling noise produced affects the user's experience.

[0043] As an example, see reference Figure 3 As shown, when the voltage applied across the multilayer ceramic capacitor 10 changes, the multilayer ceramic capacitor 10 vibrates up and down, repeatedly colliding with the circuit board 21. This causes the circuit board 21 to deform. Figure 3 In this process, the circuit board 21 bends away from the multilayer ceramic capacitor 10, i.e., in the opposite direction to Z; or the circuit board 21 bends toward the multilayer ceramic capacitor 10, i.e., in the same direction as Z. Over time, this may cause irreversible plastic deformation of the circuit board 21, thereby affecting the reliability and service life of the circuit board 21.

[0044] As mobile phones and tablets evolve towards higher refresh rates and higher resolutions, the current consumption fluctuations in display circuits increase significantly during dynamic screen transitions and rapid changes in local brightness or darkness. Simultaneously, capacitor feedback noise becomes increasingly pronounced. To address this, an anti-feedback capacitor has been proposed. However, this capacitor is relatively expensive.

[0045] Therefore, how to efficiently reduce capacitor whistling is an urgent problem to be solved.

[0046] In view of this, this application provides a multilayer ceramic capacitor in which the first inner electrode and the second inner electrode arranged on both sides of the ceramic body are perpendicular to the first inner electrode and the second inner electrode arranged in the middle of the ceramic body. In this way, when a voltage is applied to the first outer electrode and the second outer electrode, the electric field in the middle of the ceramic body is perpendicular to the electric field on both sides, thereby effectively reducing the howling caused by the inverse piezoelectric effect.

[0047] Figure 4 This is a schematic diagram of a multilayer ceramic capacitor 30 provided in an embodiment of this application.

[0048] As one implementation method, refer to Figure 4 As shown, the multilayer ceramic capacitor 30 may include: a ceramic body 100, a first external electrode 200, and a second external electrode 300.

[0049] The ceramic body 100 includes multiple dielectric layers 110 and multiple internal electrodes 120, and the ceramic body 100 includes a first part 130, a second part 140 and a third part 150 connected between the first part 130 and the second part 140.

[0050] In some possible implementations, each of the plurality of internal electrodes 120 is disposed between two adjacent dielectric layers 110. The plurality of internal electrodes 120 includes alternating first internal electrodes 121 and second internal electrodes 122. The first internal electrode 121 is connected to the first external electrode 200, and the second internal electrode 122 is connected to the second external electrode 300. The first internal electrode 121 includes a first main body segment 1211, and the second internal electrode 122 includes a second main body segment 1221. The plane containing the first main body segments 1211 and 1221 in the first portion 130 and the second portion 140 is perpendicular to the first direction X. The plane containing the first main body segments 1211 and 1221 in the third portion 150 is perpendicular to the second direction Z. The first direction X is perpendicular to the second direction Z. The first external electrode 200 and the second external electrode 300 are respectively disposed on the opposing first outer surface 160 and the second outer surface 170 of the ceramic body 100.

[0051] For example, the dielectric layer 110 is rectangular in shape and is typically made of ceramic material, serving as an insulator to electrically insulate the plurality of internal electrodes 120. Specifically, each of the plurality of internal electrodes 120 is disposed between two adjacent dielectric layers 110. That is, an internal electrode 120 is placed between two adjacent dielectric layers 110. In this way, an electric field can be formed between adjacent first internal electrodes 121 and second internal electrodes 122 of different polarities.

[0052] For example, in the embodiments of this application, the first inner electrode 121 can also be referred to as the first inner electrode plate, and the plane on which the first inner electrode 121 is located is denoted as the plane of the first inner electrode plate. The second inner electrode 122 can also be referred to as the second inner electrode plate, and the plane on which the second inner electrode 122 is located is denoted as the plane of the second inner electrode plate.

[0053] When a voltage is applied to the ceramic body 100, the first internal electrode 121 and the second internal electrode 122 have opposite polarities. For example, the first internal electrode 121 can be a positive electrode and the second internal electrode 122 can be a negative electrode; or, the first internal electrode 121 can be a negative electrode and the second internal electrode 122 can be a positive electrode. For ease of description, the following description will use the example of the first internal electrode 121 being a positive electrode and the second internal electrode 122 being a negative electrode.

[0054] For example, in the first portion 130 and the second portion 140, the plane containing the first main body segment 1211 and the second main body segment 1221 is a plane perpendicular to the first direction X. The fact that the plane containing the first main body segment 1211 and the second main body segment 1221 in the first portion 130 and the second portion 140 is perpendicular to the first direction X can be understood as the first main body segment 1211 and the second main body segment 1221 being disposed along the first direction X. That is, the dielectric layer 110 is perpendicular to the first direction X, and the first main body segment 1211 is disposed between two adjacent dielectric layers 110, and the second main body segment 1221 is disposed between two adjacent dielectric layers 110.

[0055] In the third part 150, the plane containing the first main body segment 1211 and the second main body segment 1221 is perpendicular to the second direction Z. The plane containing the first main body segment 1211 and the second main body segment 1221 in the third part 150 being perpendicular to the second direction Z can be described as follows: the first main body segment 1211 and the second main body segment 1221 in the third part 150 are arranged along the second direction Z. That is, the dielectric layer 110 is perpendicular to the second direction Z, and the first main body segment 1211 is disposed between two adjacent dielectric layers 110, and the second main body segment 1221 is disposed between two adjacent dielectric layers 110.

[0056] In this embodiment, the first inner electrode 121 and the second inner electrode 122 are misaligned.

[0057] As an example, the first inner electrode 121 further includes a first connecting segment 1212, and the second inner electrode 122 further includes a second connecting segment 1222. The first connecting segment 1212 connects two adjacent first main body segments 1211, and the second connecting segment 1222 connects two adjacent second main body segments 1221.

[0058] Specifically, such as Figure 4 As shown, in the first part 130 and the second part 140, along the first direction X, the first main body segment 1211 and the second main body segment 1221 are arranged perpendicular to the first direction X, and two adjacent first main body segments 1211 are connected by a first connecting segment 1212, and two adjacent second main body segments 1221 are connected by a second connecting segment 1222.

[0059] exist Figure 4 In the first part 130, the second part 140, and the third part 150, the first main body segment 1211 of the first inner electrode 121 can form an integrated structure after being connected by the first connecting segment 1212. The second main body segment 1221 of the second inner electrode 122 can form an integrated structure after being connected by the second connecting segment 1222.

[0060] In some possible implementations, the first connecting segment 1212 connects one end of the same side of two adjacent first main body segments 1211, but does not connect the other end of the two adjacent first main body segments 1211. The second connecting segment 1222 connects one end of the same side of two adjacent second main body segments 1221, but does not connect the other end of the two adjacent second main body segments 1221.

[0061] In the embodiments of this application, two adjacent first main body segments 1211 may refer to a dielectric layer 110 disposed between the two first main body segments 1211, or it may refer to a dielectric layer 110 disposed between the two first main body segments 1211, and a second main body segment 1221.

[0062] In other words, in the first part 130 and the second part 140, the two first main body segments 1211 and the first connecting segment 1212 form a U-shaped space with an opening facing upwards or downwards. In the third part 150, the two first main body segments 1211 and the first connecting segment 1212 form a U-shaped space with an opening facing right or left. This U-shaped space may include a dielectric layer 110, and / or, this U-shaped space may include multiple dielectric layers 110 and a second inner electrode 122 disposed between two adjacent dielectric layers 110. The second inner electrode 122 located in the U-shaped space is also U-shaped.

[0063] In other words, the first main body segment 1211 and the first connecting segment 1212 form a U-shaped cross-section structure, and the second main body segment 1221 and the second connecting segment 1222 form a U-shaped cross-section structure.

[0064] As an example, the first inner electrode 121 has an arc-shaped structure, and the second inner electrode 122 has an arc-shaped structure.

[0065] In other words, the first main body segment 1211 and the first connecting segment 1212 of the first inner electrode 121 form an arc-shaped structure, and the second main body segment 1221 and the second connecting segment 1222 of the second inner electrode 122 form an arc-shaped structure.

[0066] It is understood that the ceramic body may include multiple first main body segments 1211, multiple second main body segments 1221, multiple first connecting segments 1212 and multiple second connecting segments 1222. Two adjacent first main body segments 1211 are connected by the first connecting segment 1212, and two adjacent second main body segments 1221 are connected by the second connecting segment 1222.

[0067] For example, the plurality of internal electrodes 120 include a first internal electrode 121 and a second internal electrode 122 arranged alternately with each other. It can be understood that the first internal electrode 121 with a U-shaped cross-section structure and the second internal electrode 122 with a U-shaped cross-section structure are arranged alternately.

[0068] Continue to refer to Figure 4 The first inner electrode 121 includes a first lead-out portion 1213, the second inner electrode 122 includes a second lead-out portion 1223, the first outer electrode 200 is connected to the first lead-out portion 1213 of the first inner electrode 121, and the second outer electrode 300 is connected to the second lead-out portion 1223 of the second inner electrode 122.

[0069] In some possible examples, the first outer surface 160 and the second outer surface 170 of the ceramic body 100 are both perpendicular to the first direction X. Alternatively, the first outer surface 160 and the second outer surface 170 are both parallel to the second direction Z.

[0070] When a voltage is applied to the ceramic body 100, the electric field formed between the first inner electrode 121 and the second inner electrode 122 in the first part 130 and the second part 140 is parallel to the first direction X, such as Figure 4 The black double arrows in the first part 130 and the second part 140. The electric field formed between the first inner electrode 121 and the second inner electrode 122 in the third part 150 is parallel to the second direction Z, as shown... Figure 4 The black double arrows in section 3, 150. This allows the ceramic body 100 to expand inwards or outwards simultaneously (black single arrows in the figure).

[0071] In the embodiments of this application, the structure and shape of the first external electrode 200 and the second external electrode 300 are not limited.

[0072] The following is in conjunction with the appendix Figure 5 and Figure 6 An exemplary description is provided for another arrangement of the first internal electrode 121 and the second internal electrode 122 provided in the embodiments of this application.

[0073] Figure 5 This is a schematic diagram of a ceramic body 100 provided in an embodiment of this application.

[0074] As one implementation method, refer to Figure 5 As shown, the ceramic body 100 may include: a multilayer dielectric layer 110 and a plurality of internal electrodes 120, and the ceramic body 100 includes a first part 130, a second part 140 and a third part 150 connected between the first part 130 and the second part 140.

[0075] In some possible implementations, each of the plurality of internal electrodes 120 is disposed between two adjacent dielectric layers 110, and the plurality of internal electrodes 120 includes a first internal electrode 121 and a second internal electrode 122 that are disposed in an overlapping manner.

[0076] The first inner electrode 121 includes a first main body segment 1211, and the second inner electrode 122 includes a second main body segment 1221. The plane containing the first main body segment 1211 and the second main body segment 1221 in the first part 130 and the second part 140 is perpendicular to the first direction X. The plane containing the first main body segment 1211 and the second main body segment 1221 in the third part 150 is perpendicular to the second direction Z. The first direction X is perpendicular to the second direction Z.

[0077] Continue to refer to Figure 5 and Figure 4 The lead-out portion 1213 of the first inner electrode 121 and the lead-out portion 1223 of the second inner electrode 122 are respectively disposed on the first outer surface 160 and the second outer surface 170 of the ceramic body 100 for connection with the first outer electrode 200 and the second outer electrode 300.

[0078] For a description of the internal electrode 120, the first internal electrode 121, the second internal electrode 122, and the dielectric layer 110, please refer to the above. Figure 4 The relevant descriptions in the text are only discussed below. Figure 4 Different parts are illustrated by example.

[0079] For example, in Figure 5 In the first internal electrode 121, the first main body segment 1211 is included, which can be understood as: the first main body segment 1211 is the first internal electrode 121. The second internal electrode 122 includes the second main body segment 1221, which can be understood as: the second main body segment 1221 is the second internal electrode 122.

[0080] For example, the first inner electrode 121 and the second inner electrode 122 located in the first portion 130 and the second portion 140 are alternately arranged along the first direction X, and the first inner electrode 121 and the second inner electrode 122 located in the third portion 150 are alternately arranged along the second direction Z.

[0081] like Figure 5As shown, in the first portion 130 and the second portion 140, the first inner electrode 121 and the second inner electrode 122 are arranged alternately along the first direction X. In the third portion 150, the first inner electrode 121 and the second inner electrode 122 are arranged alternately along the second direction Z. Furthermore, the first inner electrode 121 and the second inner electrode 122 are staggered.

[0082] When a voltage is applied to the ceramic body 100, the electric field formed between the first inner electrode 121 and the second inner electrode 122 in the first part 130 and the second part 140 is parallel to the first direction X, such as Figure 5 The black double arrows in the first part 130 and the second part 140. The electric field formed between the first inner electrode 121 and the second inner electrode 122 in the third part 150 is parallel to the second direction Z, as shown... Figure 5 The black double arrows in section 3, 150. This allows the ceramic body 100 to expand inwards or outwards simultaneously (black single arrows in the figure).

[0083] Figure 6 This is a schematic diagram of another multilayer ceramic capacitor 30 provided in the embodiments of this application.

[0084] As one implementation method, refer to Figure 6 As shown, the multilayer ceramic capacitor 30 may include: a ceramic body 100, a first external electrode 200, and a second external electrode 300. The ceramic body 100 may include: a multilayer dielectric layer 110 and a plurality of internal electrodes 120, and the ceramic body 100 includes a first portion 130, a second portion 140, and a third portion 150 connected between the first portion 130 and the second portion 140.

[0085] In some possible implementations, each of the plurality of internal electrodes 120 is disposed between two adjacent dielectric layers 110, and the plurality of internal electrodes 120 includes a first internal electrode 121 and a second internal electrode 122 that are disposed in an overlapping manner.

[0086] The first inner electrode 121 includes a first main body segment 1211, and the second inner electrode 122 includes a second main body segment 1221. The plane containing the first main body segment 1211 and the second main body segment 1221 in the first part 130 and the second part 140 is perpendicular to the first direction X. The plane containing the first main body segment 1211 and the second main body segment 1221 in the third part 150 is perpendicular to the second direction Z. The first direction X is perpendicular to the second direction Z.

[0087] For a description of the internal electrode 120, the first internal electrode 121, the second internal electrode 122, and the dielectric layer 110, please refer to the above. Figure 4 The relevant descriptions in the text are only discussed below. Figure 4Different parts are illustrated by example.

[0088] For example, in Figure 6 In the first internal electrode 121, the first main body segment 1211 is included, which can be understood as: the first main body segment 1211 is the first internal electrode 121. The second internal electrode 122 includes the second main body segment 1221, which can be understood as: the second main body segment 1221 is the second internal electrode 122.

[0089] Continue to refer to Figure 6 In some possible implementations, the first inner electrode 121 located in the first portion 130 and the second portion 140 includes a first lead-out portion 1213, and the second inner electrode 122 located in the first portion 130 and the second portion 140 includes a second lead-out portion 1223. The first lead-out portion 1213 is connected to the first outer electrode 200, and the second lead-out portion 1223 is connected to the second outer electrode 300. The first inner electrode 121 located in the third portion 150 includes a first extension portion 1214, which is connected to the first outer electrode 200. The second inner electrode 122 located in the third portion 150 includes a second extension portion 1224, which is connected to the second outer electrode 300.

[0090] For example, the first external electrode 200 and the second external electrode 300 are respectively disposed on the opposite first external surface 160 and the second external surface 170 of the ceramic body 100. Both the first external surface 160 and the second external surface 170 are parallel to the first direction X. In other words, the first external electrode 200 and the second external electrode 300 are disposed on the long side of the ceramic body 100.

[0091] When a voltage is applied to the ceramic body 100, the electric field formed between the first inner electrode 121 and the second inner electrode 122 in the first part 130 and the second part 140 is parallel to the first direction X, such as Figure 6 The black double arrows in the first part 130 and the second part 140. The electric field formed between the first inner electrode 121 and the second inner electrode 122 in the third part 150 is parallel to the second direction Z, as shown... Figure 6 The black double arrows in section 3, 150. This allows the ceramic body 100 to expand inwards or outwards simultaneously (black single arrows in the figure).

[0092] This application also provides a circuit board assembly.

[0093] Figure 7 This is a schematic diagram of a circuit board assembly 40 provided in an embodiment of this application.

[0094] As one implementation method, refer to Figure 7As shown, the circuit board assembly 40 includes a circuit board 41 and a multilayer ceramic capacitor 30 in any of the above embodiments.

[0095] For example, the circuit board 41 is a PCB, and the circuit board assembly 40 may also include other devices that can be connected to the circuit board by means of soldering or plugging. Figure 7 The diagram shows a multilayer ceramic capacitor 30 disposed on circuit board 41. It should be understood that circuit board 41 may also be provided with... Figure 7 Other devices not shown may also be provided on the circuit board 41, such as a central processing unit (CPU), a graphics processing unit (GPU), resistors, inductors, etc.

[0096] This application also provides an electronic device. This electronic device includes the multilayer ceramic capacitor described in any of the above embodiments. For example, the multilayer ceramic capacitor 30 described above.

[0097] For example, the electronic device also includes a circuit board on which the multilayer ceramic capacitor 30 is disposed.

[0098] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0099] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0100] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0101] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0102] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0103] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0104] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A multilayer ceramic capacitor, characterized in that, include: A ceramic body, the ceramic body comprising multiple dielectric layers and multiple internal electrodes, and the ceramic body comprising a first part, a second part and a third part connected between the first part and the second part; The first external electrode and the second external electrode are respectively disposed on the opposite first and second external surfaces of the ceramic body; Each of the plurality of internal electrodes is disposed between two adjacent dielectric layers. The plurality of internal electrodes includes a first internal electrode and a second internal electrode arranged alternately. The first internal electrode is connected to the first external electrode, and the second internal electrode is connected to the second external electrode. The first internal electrode includes a first main body segment, and the second internal electrode includes a second main body segment. The plane containing the first main body segment and the second main body segment in the first part and the second part is perpendicular to a first direction. The plane containing the first main body segment and the second main body segment in the third part is perpendicular to a second direction. The first direction is perpendicular to the second direction.

2. The multilayer ceramic capacitor according to claim 1, characterized in that, The first inner electrode further includes a first connecting segment, and the second inner electrode further includes a second connecting segment. The first connecting segment connects two adjacent first main body segments, and the second connecting segment connects two adjacent second main body segments.

3. The multilayer ceramic capacitor of claim 2, wherein, The first main body segment and the first connecting segment form a U-shaped cross-sectional structure, and the second main body segment and the second connecting segment form a U-shaped cross-sectional structure.

4. The multilayer ceramic capacitor of claim 1, wherein, The first inner electrode and the second inner electrode located in the first part and the second part are alternately arranged along the first direction, and the first inner electrode and the second inner electrode located in the third part are alternately arranged along the second direction.

5. The multilayer ceramic capacitor according to any one of claims 1 to 4, wherein The first inner electrode includes a first lead-out portion, the second inner electrode includes a second lead-out portion, the first outer electrode is connected to the first lead-out portion, and the second outer electrode is connected to the second lead-out portion.

6. The multilayer ceramic capacitor of any one of claims 1 to 4, wherein Both the first outer surface and the second outer surface are parallel to the second direction.

7. The multilayer ceramic capacitor of claim 1, wherein The first inner electrode located in the first part and the second part includes a first lead-out portion, and the second inner electrode located in the first part and the second part includes a second lead-out portion. The first lead-out portion is connected to the first outer electrode, and the second lead-out portion is connected to the second outer electrode. The first inner electrode located in the third part includes a first extension portion connected to the first outer electrode, and the second inner electrode located in the third part includes a second extension portion connected to the second outer electrode.

8. The multilayer ceramic capacitor of claim 7, wherein, Both the first outer surface and the second outer surface are parallel to the first direction.

9. A circuit board assembly, characterized by include: Circuit board; as well as The multilayer ceramic capacitor as described in any one of claims 1 to 8, wherein the multilayer ceramic capacitor is electrically connected to the circuit board.

10. A display device, characterized by comprising: include: Display panel; as well as The circuit board assembly as claimed in claim 9, wherein the circuit board assembly is electrically connected to the display panel.

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