A four-way switch substrate and a four-way switch assembly

Abstract

This invention discloses a four-way switch substrate and a four-way switch assembly, relating to the field of electrical switch technology. It solves the technical problem of existing four-way switches having concentrated wire outlets, resulting in insufficient insulation distance in the wire harness and a tendency for short circuits. The invention includes: a substrate frame with a mounting groove on its front side; a first wire-passing hole, a second wire-passing hole, a third wire-passing hole, a fourth wire-passing hole, and a fifth wire-passing hole penetrating the substrate frame; a first wiring groove located on the back side of the substrate frame; a second wiring groove located on one side of the first wiring groove, with the fifth wire-passing hole at the end of the second wiring groove furthest from the first wiring groove; and a third wiring groove with the fourth wire-passing hole at one end. The second and third wiring grooves are located on opposite sides of the substrate frame. This invention has advantages such as large wire spacing and reduced susceptibility to short circuits.

Description

Technical Field

[0001] This invention belongs to the field of electrical switch technology, specifically relating to a four-way switch substrate and a four-way switch assembly. Background Technology

[0002] The four-way switch is a core electrical component of the handlebar control assembly in motorcycles, electric bicycles, and other two-wheeled vehicles. It is typically used to control operations such as turn signal switching, headlight high / low beam adjustment, and function mode switching. Internally, it integrates a printed circuit board (PCB) and four sets of tactile switches, which are connected to the vehicle's wiring harness via five wires to transmit electrical signals. The reliability of the switch's wiring structure directly affects the operational stability of the vehicle's electrical system and driving safety.

[0003] In practical applications, the complex operating conditions of vehicles and the long-term vibration, damp, and dusty environments place high demands on the insulation and protection capabilities of switches. Existing four-way switches often employ a five-hole, parallel-arranged design, with all wires running through the same area of ​​the substrate. This results in several problems: firstly, the narrow spacing between solder pads makes solder bridging prone to occur during the soldering process, leading to a high short-circuit failure rate; secondly, the concentrated wiring harness is susceptible to insulation wear under long-term vibration, increasing the risk of short circuits between adjacent lines and shortening the switch's lifespan. Therefore, there is an urgent need to design a four-way switch to address these issues. Summary of the Invention

[0004] This invention discloses a four-way switch substrate and a four-way switch assembly, which aims to solve the technical problem that the existing four-way switches have concentrated outgoing wires, resulting in insufficient insulation distance of the wire harness and easy short circuits.

[0005] To solve the aforementioned technical problems, the present invention adopts the following technical solution:

[0006] A four-way switch substrate, comprising:

[0007] A substrate frame, the front side of which is provided with a mounting groove for mounting a PCB board; the substrate frame is provided with a first through hole, a second through hole, a third through hole, a fourth through hole and a fifth through hole;

[0008] The first wiring groove is disposed on the back side of the substrate frame and surrounds the first through hole, the second through hole and the third through hole. The first wiring groove is used to centrally collect the wire bundles led out from the first through hole, the second through hole and the third through hole.

[0009] The second wiring channel is located on one side of the first wiring channel, and the fifth wire through hole is opened at the end of the second wiring channel away from the first wiring channel.

[0010] The third wiring groove has the fourth wiring hole at one end, and the second wiring groove and the third wiring groove are located on both sides of the substrate frame.

[0011] In this invention, the five-way through-hole is divided into three independent wiring units. The three main bundle conductors are centrally housed in the first wiring slot, while the two branch bundle conductors are independently routed in the second and third wiring slots, respectively. The three wiring units are completely separated by the physical structure of the substrate frame, achieving physical isolation between the wire bundles. Compared to existing centralized wiring structures, this invention increases the insulation distance between different groups of wire bundles, which can significantly reduce the defect rate of solder bridging between adjacent pads during the soldering stage and improve production yield. It can also prevent short circuits caused by the wear of insulation layers of different groups of wire bundles under long-term vehicle vibration conditions, thereby improving the electrical reliability and service life of the switch. At the same time, the second and third wiring slots are located on the upper and lower sides of the substrate frame, respectively, which can make full use of the corner space of the substrate to arrange the wiring slots, avoid the concentrated accumulation of wire bundles, further optimize the wiring space, and improve the utilization rate of substrate space.

[0012] Preferably, the first wire hole, the second wire hole, and the third wire hole are arranged in a triangular pattern.

[0013] After adopting this technical solution, it should be noted that the three main bundle wire holes adopt an isosceles triangular layout. In the same square layout area, the center distance between adjacent holes in the triangular arrangement is effectively increased compared with the straight arrangement. This can maximize the insulation distance between the internal wires of a single group in the limited slot space, further reducing the risk of short circuit inside the main bundle wires. At the same time, the triangular arrangement structure has more uniform stress distribution. When the external connector housing is connected in the first wiring slot, the slot wall can serve as a insertion guide surface. The stress generated by insertion and extraction can be evenly distributed to the plastic structure around the three holes, avoiding local stress concentration that could lead to slot wall cracking and hole deformation. This significantly improves the durability and contact stability of connector insertion and extraction.

[0014] Preferably, the second cable tray extends horizontally, while the third cable tray is arranged at an angle.

[0015] With this technical solution, it should be noted that the two branch wiring channels, namely the second and third wiring channels mentioned above, adopt a horizontal and diagonal design: the horizontally extending second wiring channel can make full use of the flat space on the upper part of the substrate, ensuring neat and straight wiring; the diagonally arranged third wiring channel can adapt to the structural contour of the lower part of the substrate, obtaining a longer effective wiring length within a limited space. The two extension directions are not parallel, so that the two branch wires have only a minimum spacing at a single point, and the spacing at other positions gradually increases with the wiring, shortening the length of the weak insulation section and further reducing the risk of short circuit between the two branch wires; at the same time, the staggered layout can also disperse the tensile stress of the wires, avoiding unilateral deformation and cracking of the substrate caused by unidirectional stress.

[0016] Preferably, the second wiring groove is connected to one side wall of the first wiring groove, so that the second wiring groove forms a cavity with its four sides closed, and the third wiring groove has an opening at one end of its side wall near the first wiring groove.

[0017] With this technical solution, it should be noted that the second wiring trough is connected to the sidewall of the first wiring trough, using the wall of the first wiring trough as its own end wall, together forming a closed wiring cavity. Corresponding to the core functional bundled circuit, the wires are kept in the closed trough after passing through the fifth wire hole, which can effectively prevent the wires from falling out of the trough, and at the same time block dust and moisture from entering the trough and corroding the wires and solder joints, which is conducive to improving the protection level of the core circuit. Moreover, the closed and continuous trough wall structure can also improve the overall structural strength and enhance the resistance to deformation. In addition, the third wiring trough adopts an end opening design, which corresponds to auxiliary functions or grounding circuits. After the wires are soldered, they can be directly inserted into the trough laterally from the opening end, which improves the assembly efficiency and the convenience of later maintenance and replacement of wires. Thus, a balance between protection reliability and assembly efficiency is achieved within the limited substrate space.

[0018] Preferably, the inner walls of the second and third wiring channels are provided with a plurality of limiting protrusions along the length direction.

[0019] With this technical solution, it should be noted that the limiting protrusions, spaced along the length of the inner wall of the cable tray, protrude into the tray in a semi-circular arc shape. The spacing between the protrusions is adapted to the outer diameter of the wire, which can form a multi-point interference fit and limit the wire embedded in the tray, firmly fixing the wire inside the tray. Under the continuous vibration generated by vehicle movement and the pulling force of the wiring harness, the multi-point limiting protrusions can effectively limit the axial movement and radial displacement of the wire, reduce the repeated friction and wear between the wire insulation layer and the tray wall, and extend the service life of the insulation layer; at the same time, it can offset part of the axial pulling force of the wiring harness, distribute the stress to the tray structure, release the welding stress at the end of the wire, protect the solder joints between the wire and the PCB board, and prevent the solder joints from falling off due to long-term tensile fatigue, which is beneficial to improving the reliability of the switch under strong vibration conditions.

[0020] Preferably, the fourth and fifth wire holes are located on the same side of the substrate frame, and the first, second, and third wire holes are located on the other side of the substrate frame.

[0021] With this technical solution, it should be noted that the first, second, and third wire guide holes are grouped together on one side of the substrate, while the fourth and fifth wire guide holes are grouped together on the other side. The two groups of holes span the central structure of the substrate, maximizing the physical isolation distance between the two wire harnesses within the substrate's lateral dimensions. This structurally eliminates the possibility of direct contact between wire harnesses across groups, thereby improving the switch's protection level. Simultaneously, the layout of centralized wiring on both sides facilitates the orderly arrangement of the vehicle's wiring harnesses according to their functions, reducing wire harness crossings and bends, and lowering the probability of insulation wear during long-term use.

[0022] Preferably, the mounting groove is provided with a first positioning hole and a second positioning hole diagonally, and each of the first positioning hole and the second positioning hole is provided with a positioning boss for cooperating with the corresponding hole on the PCB board to achieve assembly positioning.

[0023] After adopting this technical solution, it should be noted that the two diagonally arranged positioning holes are blind hole structures, and the positioning bosses inside the holes are cylindrical with guide chamfers at the top, which can be precisely inserted and matched with the corresponding holes on the PCB board to achieve rapid and accurate assembly of the PCB board in the mounting slot.

[0024] Furthermore, four mounting switch housings are provided in the mounting slot, and the four mounting housings are distributed in four directions in the mounting slot, with each mounting switch housing accommodating a tactile switch.

[0025] After adopting this technical solution, it should be noted that the four installation switch housings are distributed in four directions: up, down, left, and right. Each housing has an octagonal structure, and its interior forms a receiving cavity that matches the shape of the tactile switch, which can form a circumferential enclosure and limit the movement of the four tactile switches respectively.

[0026] Preferably, the outer side of the substrate frame is provided with a plurality of mounting ears, each mounting ear having a through hole for fixing the switch as a whole.

[0027] With this technical solution, it should be noted that the mounting ears on the outside of the base plate frame are integrally injection molded with the base plate frame. The ears can be thickened and reinforced, serving as the external mounting and load-bearing structure for the entire switch assembly. By passing screws through the mounting through holes, the entire switch can be securely fixed inside the handlebar switch housing.

[0028] A four-way switch assembly further includes:

[0029] A PCB board, wherein the PCB board is disposed within the mounting slot;

[0030] Four tactile switches are soldered onto the PCB board and respectively housed in their respective mounting housings.

[0031] A button, which is movably mounted in the middle of the mounting slot;

[0032] And five wires, which are respectively soldered to the four tactile switches.

[0033] Preferably, the front side of the PCB board is provided with multiple wire soldering pads, including a first soldering pad, a second soldering pad, a third soldering pad, a fourth soldering pad and a fifth soldering pad, which respectively correspond to the third through hole, the first through hole, the second through hole, the fifth through hole and the fourth through hole;

[0034] Three wires are housed in the first wiring groove and pass through the first through hole, the second through hole, and the third through hole respectively before being soldered to the second solder pad, the third solder pad, and the first solder pad. One wire is laid in the first wiring groove and passes through the fifth through hole before being soldered to the fourth solder pad. Another wire is laid in the second wiring groove and passes through the fourth through hole before being soldered to the fifth solder pad.

[0035] It should be noted that after adopting this technical solution, independent wiring of the five wire harnesses is achieved, reducing the risk of short circuit failures throughout the entire process from welding production to finished product use, while taking into account both mass production assembly efficiency and long-term reliability.

[0036] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0037] 1. The present invention provides a four-way switch substrate and a four-way switch assembly, which splits five wires into three independent wiring groups. The physical structure of the substrate frame realizes the physical isolation between each group of wires, thereby increasing the insulation distance between different groups of lines. This can reduce the solder bridging defect rate in the soldering production stage and avoid cross-group short circuits caused by wire wear during the use of the finished product.

[0038] 2. The present invention provides a four-way switch substrate and a four-way switch assembly. The first, second, and third wire through holes are arranged in a triangular pattern, which maximizes the center distance between adjacent holes within a limited layout space, further reducing the risk of short circuits inside the main harness. At the same time, the triangular layout distributes the stress more evenly, improving the structural stability of the main harness connector during insertion and removal. The design of the fourth and fifth wire through holes on both sides of the substrate maximizes the physical isolation distance between the two sets of wire harnesses, enhancing the overall insulation protection effect.

[0039] 3. The present invention provides a four-way switch substrate and a four-way switch assembly, which can stably hold the wires in the slots by setting limiting protrusions on the inner walls of the second and third wiring slots, offsetting the stress caused by vehicle vibration and wire harness pulling, protecting the welding joints and wire insulation layer, and ensuring the reliability of wire harness connection under strong vibration conditions.

[0040] In the supplementary switch assembly, the fit between the base plate and the PCB board Attached Figure Description

[0041] The present invention will be described by way of example and with reference to the accompanying drawings, wherein:

[0042] Figure 1 This is a schematic diagram of the front structure of the present invention;

[0043] Figure 2 This is a schematic diagram of the rear structure of the present invention;

[0044] Figure 3 This is a wiring diagram of the front side of the PCB board of the present invention;

[0045] Figure 4 This is a wiring diagram of the front side of a PCB board using existing technology.

[0046] Figure label:

[0047] 1-Baseboard frame, 2-Mounting slot, 3-Tact switch, 4-Button, 5-First wire guide hole, 6-Second wire guide hole, 7-Third wire guide hole, 8-Fourth wire guide hole, 9-Fifth wire guide hole, 10-First wiring groove, 11-Second wiring groove, 12-Third wiring groove, 13-Mounting switch housing, 14-First positioning hole, 15-Second positioning hole, 16-Limiting protrusion, 17-First solder pad, 18-Second solder pad, 19-Third solder pad, 20-Fourth solder pad, 21-Fifth solder pad. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments and accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and marked in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0049] In the description of the embodiments of this application, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0050] The following is combined Figures 1-4 The present invention will be described in detail below.

[0051] The specific method of using this invention is as follows:

[0052] Example 1

[0053] A four-way switch board, such as Figure 1 , Figure 2 As shown, it includes:

[0054] The substrate frame 1 has a mounting groove 2 for mounting a PCB board on its front side; the substrate frame 1 is provided with a first wire through hole 5, a second wire through hole 6, a third wire through hole 7, a fourth wire through hole 8 and a fifth wire through hole 9.

[0055] The first wiring groove 10 is disposed on the back side of the substrate frame 1 and surrounds the first wire through hole 5, the second wire through hole 6 and the third wire through hole 7. The first wiring groove 10 is used to centrally collect the wire bundles led out from the first wire through hole 5, the second wire through hole 6 and the third wire through hole 7.

[0056] The second wiring groove 11 is located on one side of the first wiring groove 10, and the fifth wire hole 9 is opened at the end of the second wiring groove 11 away from the first wiring groove 10.

[0057] The third wiring groove 12 has the fourth wiring hole 8 at one end, and the second wiring groove 11 and the third wiring groove 12 are located on both sides of the substrate frame 1.

[0058] In this embodiment, the five through holes are divided into three independent wiring units. The three main wire bundles are centrally housed in the first wiring slot 10, and the two branch wire bundles are independently routed in the second and third wiring slots 12, respectively. The three wiring units are completely separated by the physical structure of the substrate frame 1, achieving physical isolation between the wire bundles. Compared with the existing centralized outgoing wire structure, this invention increases the insulation distance between different groups of wire bundles, which can significantly reduce the defect rate of solder bridging between adjacent pads during the soldering stage and improve production yield. It can also prevent short circuits caused by the wear of the insulation layers of different groups of wire bundles under long-term vehicle vibration conditions, thereby improving the electrical reliability and service life of the switch. At the same time, the second wiring slot 11 and the third wiring slot 12 are respectively located on the upper and lower sides of the substrate frame 1, which can make full use of the corner space of the substrate to arrange the wire slots, avoid the concentrated accumulation of wire bundles, further optimize the wiring space, and improve the utilization rate of the substrate space.

[0059] The mounting groove 2 is provided with a first positioning hole 14 and a second positioning hole 15 diagonally. Both the first positioning hole 14 and the second positioning hole 15 are provided with positioning bosses, which are used to cooperate with the corresponding holes on the PCB board to achieve assembly positioning.

[0060] In this embodiment, the two positioning holes arranged diagonally are blind hole structures. The positioning bosses inside the holes are cylindrical with guide chamfers at the top, which can be precisely inserted and matched with the corresponding holes on the PCB board to achieve rapid and accurate assembly of the PCB board in the mounting slot 2.

[0061] The mounting slot 2 is provided with four mounting switch housings 13, which are distributed in four directions in the mounting slot 2, and each mounting switch housing 13 houses a tactile switch 3.

[0062] In this embodiment, the four mounting switch housings 13 are distributed in four directions: up, down, left, and right. Each housing has an octagonal structure and an internal cavity that fits the shape of the tactile switch 3, which can circumferentially wrap and limit the four tactile switches 3 respectively.

[0063] The outer side of the base plate frame 1 is also provided with multiple mounting ears, each of which has a through hole for fixing the switch as a whole.

[0064] In this embodiment, the mounting ears on the outside of the base plate frame 1 are integrally injection molded with the base plate frame 1. The ears can be thickened and reinforced, serving as the external mounting and support structure for the entire switch assembly. By passing screws through the mounting through holes, the entire switch can be securely fixed inside the handlebar switch housing.

[0065] Example 2

[0066] The difference between this embodiment and Embodiment 1 is that, as Figures 1-3As shown, the first wire hole 5, the second wire hole 6, and the third wire hole 7 are arranged in a triangular pattern.

[0067] In this embodiment, the three main bundle through holes adopt an isosceles triangular layout. Within the same square layout area, the center distance between adjacent holes arranged in a triangular pattern is effectively increased compared to a straight-line arrangement. This maximizes the insulation distance between internal wires in a single group within the limited slot space, further reducing the risk of short circuits within the main bundle. At the same time, the triangular arrangement results in more uniform stress distribution. When the first wiring slot 10 connects to the external connector housing, the slot wall can serve as a guide surface for insertion. The stress generated during insertion and removal can be evenly distributed to the plastic structure around the three holes, avoiding local stress concentration that could lead to slot wall cracking and hole deformation. This significantly improves the durability and contact stability of the connector insertion and removal.

[0068] Example 3

[0069] The difference between this embodiment and embodiment 2 is that the second wiring groove 11 extends horizontally, while the third wiring groove 12 is arranged at an angle.

[0070] In this embodiment, the two branch wiring channels, namely the second wiring channel 11 and the third wiring channel 12, adopt a horizontal and diagonal design: the horizontally extending second wiring channel 11 can make full use of the flat space on the upper part of the substrate, ensuring that the wiring is neat and straight; the diagonally arranged third wiring channel 12 can adapt to the structural contour of the lower part of the substrate, obtaining a longer effective wiring length in a limited space. The two extension directions are not parallel to each other, so that the two branch wires have only a minimum spacing at a single point, and the spacing between the wires at other positions gradually increases with the wiring, shortening the length of the weak insulation section and further reducing the risk of short circuit between the two branch wires; at the same time, the staggered layout can also disperse the tensile stress of the wires and avoid the substrate from deforming and cracking on one side due to unidirectional force.

[0071] Example 4

[0072] The difference between this embodiment and embodiment 3 is that the second wiring groove 11 is connected to one side wall of the first wiring groove 10, so that the second wiring groove 11 forms a cavity with its four sides closed, and the third wiring groove 12 has an opening at one end of the side wall near the first wiring groove 10.

[0073] In this embodiment, the second wiring groove 11 is connected to the sidewall of the first wiring groove 10, and uses the groove wall of the first wiring groove 10 as its own end groove wall to form a closed wiring cavity. Corresponding to the core function bundled circuit, the wires are kept in the closed groove after passing through the fifth wire hole 9, which can effectively prevent the wires from falling out of the groove. At the same time, it can block dust and moisture from entering the groove and corroding the wires and solder joints, which is conducive to improving the protection level of the core circuit. Moreover, the closed and continuous groove wall structure can also improve the overall structural strength and enhance the resistance to deformation. In addition, the third wiring groove 12 adopts an end opening design, which corresponds to the auxiliary function or grounding circuit. After the wires are soldered, they can be directly inserted into the groove laterally from the opening end, which improves the assembly efficiency and the convenience of later maintenance and replacement of wires. Thus, a balance between protection reliability and assembly efficiency is achieved within the limited substrate space.

[0074] The inner walls of the second wiring trough 11 and the third wiring trough 12 are respectively provided with a plurality of limiting protrusions 16 along the length direction. The limiting protrusions 16, which are spaced apart along the length direction of the inner wall of the wiring trough, protrude into the trough in a semi-circular arc shape. The spacing of the protrusions is adapted to the outer diameter of the wire, which can form a multi-point interference fit and limit the wire embedded in the trough, and firmly fix the wire inside the trough. Under the continuous vibration generated by vehicle driving and the pulling force of the wiring harness, the multi-point limiting protrusions 16 can effectively limit the axial movement and radial displacement of the wire, reduce the repeated friction and wear between the wire insulation layer and the trough wall, and extend the service life of the insulation layer; at the same time, it can offset part of the axial pulling force of the wiring harness, distribute the stress to the trough structure, release the welding stress at the end of the wire, protect the welding joint between the wire and the PCB board, and avoid the welding joint from long-term pulling fatigue and detachment, which is conducive to improving the reliability of the switch under strong vibration conditions.

[0075] Example 5

[0076] The difference between this embodiment and embodiment 4 is that the fourth wire hole 8 and the fifth wire hole 9 are located on the same side of the substrate frame 1, and the first wire hole 5, the second wire hole 6, and the third wire hole 7 are located on the other side of the substrate frame 1.

[0077] In this embodiment, the first wire through hole 5, the second wire through hole 6, and the third wire through hole 7 are grouped together on one side of the substrate, while the fourth wire through hole 8 and the fifth wire through hole 9 are grouped together on the other side of the substrate. The two groups of holes span the middle structure of the substrate, maximizing the physical isolation distance between the two groups of wire harnesses within the substrate's lateral dimension. This structurally eliminates the possibility of direct contact between the wire harnesses, thereby improving the switch's protection level. Simultaneously, the layout of centralized wiring from both sides facilitates the orderly arrangement of the vehicle's wiring harnesses according to their functions, reducing wire harness crossings and bends, and lowering the probability of insulation wear during long-term use.

[0078] Example 6

[0079] A four-way switch assembly further includes:

[0080] PCB board, wherein the PCB board is disposed in the mounting slot 2;

[0081] Four tactile switches 3 are soldered onto the PCB board and respectively disposed in the corresponding mounting switch housing 13;

[0082] Button 4 is movably mounted in the middle of the mounting slot 2;

[0083] And five wires, which are respectively welded to the four tactile switches 3.

[0084] Preferably, the front side of the PCB board is provided with multiple wire soldering pads, including a first soldering pad 17, a second soldering pad 18, a third soldering pad 19, a fourth soldering pad 20 and a fifth soldering pad 21, which correspond to the third through hole 7, the first through hole 5, the second through hole 6, the fifth through hole 9 and the fourth through hole 8, respectively.

[0085] Three wires are housed in the first wiring groove 10 and pass through the first wire through hole 5, the second wire through hole 6, and the third wire through hole 7 respectively, and are then soldered to the second solder pad 18, the third solder pad 19, and the first solder pad 17. One wire is laid in the first wiring groove 10 and passes through the fifth wire through hole 9 and is then soldered to the fourth solder pad 20. One wire is laid in the second wiring groove 11 and passes through the fourth wire through hole 8 and is then soldered to the fifth solder pad 21.

[0086] In this embodiment, independent wiring of the five wire harnesses is achieved, which reduces the risk of short circuit failure throughout the entire process from welding production to finished product use, while taking into account both mass production assembly efficiency and long-term reliability.

[0087] like Figure 3 , Figure 4 The figures shown are wiring diagrams of the present invention and the prior art, respectively, where K1, K2, K3, and K4 are four corresponding tactile switches 3. Figure 3The diagram illustrates the arrangement of wires on the PCB board after passing through the corresponding via holes. Specifically, the front of the PCB board is the component soldering layer, with four sets of solder pads distributed in four directions (top, bottom, left, and right), corresponding to tactile switches 3 (K1, K2, K3, and K4). The front of the PCB board also has five wire soldering pads: GND common terminal pad, K1 signal pad, K2 signal pad, K3 signal pad, and K4 signal pad. The GND common terminal pad corresponds to the first solder pad 17, the K1 signal pad to the second solder pad 18, the K2 signal pad to the fifth solder pad 21, the K3 signal pad to the fourth solder pad 20, and the K4 signal pad to the third solder pad 19. The GND common terminal pad, K1 signal pad, and K4 signal pad are concentrated on the same side of the PCB board, aligned vertically with the third via hole 7, the first via hole 5, and the second via hole 6 on the substrate frame 1. The signal pads and K3 signal pad are independently and separately arranged, aligned vertically with the fifth via 9 and the fourth via 8, respectively. The signal pins of the four-way tactile switch 3 are connected to their corresponding signal pads via traces on the top copper foil, such as... Figure 3 As shown by the white lines in the middle, the common pins of the four tactile switches 3 are connected to the GND common terminal pad. The five pads adopt a main bundle of three pads concentrated and a branch bundle of two pads independent, which corresponds completely to the branch bundle via layout of the substrate. This ensures the precise alignment of the pads and vias and increases the copper foil spacing between different groups of pads.

[0088] In the assembled state, the PCB board is mounted on the bottom of the mounting slot 2. Five wires pass through the corresponding wire holes from the back of the substrate and are then soldered on the corresponding pads on the front of the PCB board. After soldering, the ends of the three main wire bundles are stored in the first wiring slot 10, and the two branch wire bundles are embedded in the second wiring slot 11 and the third wiring slot 12 respectively to complete the fixation.

[0089] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A four-way switch substrate, characterized by comprising: include: The substrate frame (1) has a mounting groove (2) for mounting a PCB board on its front side; the substrate frame (1) is provided with a first wire through hole (5), a second wire through hole (6), a third wire through hole (7), a fourth wire through hole (8) and a fifth wire through hole (9). The first wiring groove (10) is provided on the back of the substrate frame (1) and surrounds the first wire hole (5), the second wire hole (6) and the third wire hole (7). The first wiring groove (10) is used to centrally store the wire bundles led out from the first wire hole (5), the second wire hole (6) and the third wire hole (7). The second wiring groove (11) is located on one side of the first wiring groove (10), and the fifth wire hole (9) is opened at the end of the second wiring groove (11) away from the first wiring groove (10). The third wiring groove (12) has the fourth wiring hole (8) at one end. The second wiring groove (11) and the third wiring groove (12) are located on both sides of the substrate frame (1).

2. The four-way switch substrate according to claim 1, wherein The first through hole (5), the second through hole (6) and the third through hole (7) are arranged in a triangle, and the second solder pad (18), the third solder pad (19) and the first solder pad (17) are arranged in a corresponding triangle.

3. The four-way switch substrate according to claim 1, wherein The second wiring groove (11) extends horizontally, and the third wiring groove (12) is arranged at an angle.

4. A four-way switch substrate according to claim 1, characterized in that, The second wiring groove (11) is connected to one side wall of the first wiring groove (10), so that the second wiring groove (11) forms a cavity with its four sides closed, and the third wiring groove (12) has an opening at one end of the side wall near the first wiring groove (10).

5. A four-way switch substrate according to claim 1, characterized in that, The inner walls of the second wiring groove (11) and the third wiring groove (12) are provided with a plurality of limiting protrusions (16) along the length direction.

6. A four-way switch substrate according to claim 1, characterized in that, The fourth wire hole (8) and the fifth wire hole (9) are located on the same side of the substrate frame (1), and the first wire hole (5), the second wire hole (6), and the third wire hole (7) are located on the other side of the substrate frame (1).

7. A four-way switch substrate according to any one of claims 1-6, characterized in that, The mounting groove (2) is provided with a first positioning hole (14) and a second positioning hole (15) diagonally. The first positioning hole (14) and the second positioning hole (15) are provided with positioning bosses, which are used to cooperate with the corresponding holes of the PCB board to achieve assembly positioning.

8. A four-way switch substrate according to any one of claims 1-6, characterized in that, The mounting slot (2) is provided with four mounting switch housings (13), which are distributed in four directions in the mounting slot (2), and each mounting switch housing (13) houses a tactile switch (3).

9. A four-way switch assembly, comprising a four-way switch substrate as described in any one of claims 1-9, characterized in that, include: PCB board, wherein the PCB board is disposed in the mounting slot (2); Four tactile switches (3) are respectively soldered onto the PCB board and respectively disposed in the corresponding mounting switch housing (13); Button (4), which is movably mounted in the middle of the mounting slot (2); And five wires, which are respectively welded to the four tactile switches (3).

10. A four-way switch assembly according to claim 9, characterized in that, The front side of the PCB board is provided with multiple wire soldering pads, including a first soldering pad (17), a second soldering pad (18), a third soldering pad (19), a fourth soldering pad (20), and a fifth soldering pad (21), which correspond to the third through hole (7), the first through hole (5), the second through hole (6), the fifth through hole (9), and the fourth through hole (8), respectively. The three wires are housed in the first wiring groove (10) and pass through the first wire hole (5), the second wire hole (6) and the third wire hole (7) respectively, and are then soldered to the second solder pad (18), the third solder pad (19) and the first solder pad (17). One wire is laid in the first wiring groove (10) and passes through the fifth wire hole (9) and is then soldered to the fourth solder pad (20). Another wire is laid in the second wiring groove (11) and passes through the fourth wire hole (8) and is then soldered to the fifth solder pad (21).

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