A semiconductor processing plasma etching machine

Abstract

This invention provides a semiconductor processing plasma etching machine, belonging to the technical field of plasma etching machines. It includes a tray body, a vertical scraping assembly, a horizontal scraping assembly, a first driving assembly, and a transmission assembly. The upper edge of the tray body has a receiving groove for the front of the wafer. The vertical scraping assembly is disposed inside the receiving groove, and the horizontal scraping assembly is disposed on the upper part of the tray body. The first driving assembly is mounted on the tray body. One end of the transmission assembly is connected to the first driving assembly, and the other end is connected to the vertical scraping assembly and the horizontal scraping assembly. Compared with the prior art, this invention can automatically clean the reaction byproducts inside the receiving groove on the tray body after wafer etching, thereby preventing the reaction byproducts from remaining inside the receiving groove and thus avoiding affecting subsequent wafer etching.

Description

Technical Field

[0001] This invention belongs to the field of plasma etching machine technology, specifically a semiconductor processing plasma etching machine. Background Technology

[0002] Plasma etching is the most common form of dry etching. Its principle is that the gas exposed to the electron region forms plasma, and the resulting ionized gas and the gas that releases high-energy electrons form plasma or ions. When the ionized gas atoms are accelerated by the electric field, they release enough force to tightly bond the material or etch the surface with the surface expulsion force.

[0003] Currently, when using a plasma etching machine to etch semiconductor wafers, the wafer needs to be placed inside a receiving groove on the etching machine tray to achieve wafer positioning. However, after the wafer is etched, photoresist and other reaction byproducts are easily left in the receiving groove. These reaction byproducts will stick back to the wafer during subsequent wafer etching, thus affecting the wafer etching effect. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the technical problem to be solved by the embodiments of the present invention is to provide a semiconductor processing plasma etching machine.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0006] A semiconductor processing plasma etching machine includes a tray body, a vertical scraping assembly, a horizontal scraping assembly, a first drive assembly, and a transmission assembly.

[0007] The upper edge of the tray body is provided with a receiving groove for the front of the wafer.

[0008] The vertical scraper assembly is disposed inside the receiving groove, and the horizontal scraper assembly is disposed on the upper part of the tray body.

[0009] The first drive component is mounted on the tray body.

[0010] One end of the transmission component is connected to the first drive component, and the other end is connected to the vertical scraper component and the horizontal scraper component. It is used to transmit the driving power of the first drive component to the vertical scraper component and the horizontal scraper component, thereby causing the vertical scraper component to move upwards along the inside of the receiving groove and causing the horizontal scraper component to move laterally along the upper part of the tray body.

[0011] When the vertical scraping component moves upward, it scrapes the reaction byproducts remaining inside the receiving groove to the upper part of the tray body. When the horizontal scraping component moves horizontally, it scrapes away the reaction byproducts scraped to the upper part of the tray body laterally.

[0012] As a further improvement of the present invention: the vertical scraping assembly includes a first scraper, the first scraper being a circular structure adapted to the receiving groove, and the diameter of the first scraper being the same as the diameter of the receiving groove.

[0013] As a further improvement of the present invention: a limiting groove is formed on the inner wall of the receiving groove, and a limiting block is fixedly provided on the side wall of the first scraper. The limiting block extends into the limiting groove and can slide up and down along the inside of the limiting groove. When the limiting block slides up along the inside of the limiting groove to the top of the limiting groove, the upper surface of the first scraper is flush with the upper surface of the tray body.

[0014] As a further improvement of the present invention: the horizontal scraping assembly includes a second scraper, the bottom of the second scraper is in contact with the upper surface of the tray body, and the second scraper is located on one side of the receiving groove.

[0015] As a further improvement of the present invention: the tray body is hollow inside, and a swing groove communicating with the inner cavity of the tray body is formed at the bottom of the inner side of the receiving groove.

[0016] The first drive assembly includes a lead screw, a threaded sleeve, and a motor. The motor is fixedly mounted at the center of the upper part of the tray body. One end of the lead screw is connected to the output end of the motor, and the other end extends into the inner cavity of the tray body and is threadedly engaged with the threaded sleeve.

[0017] The transmission assembly includes a sliding sleeve, a first elastic element, a first rocker arm, a guide rod, a sliding sleeve, and a second rocker arm. One end of the guide rod is fixedly connected to the inner wall of the tray body, and the other end extends into the sliding sleeve and is movably engaged with the sliding sleeve. The sliding sleeve is slidably fitted outside the guide rod. One end of the first elastic element is connected to the sliding sleeve, and the other end is connected to the sliding sleeve. One end of the first rocker arm is hinged to the sliding sleeve, and the other end extends from the rocker groove into the receiving groove and is hinged to the bottom wall of the first scraper. One end of the second rocker arm is hinged to the sliding sleeve, and the other end is hinged to the threaded sleeve.

[0018] As a further improvement of the present invention: the upper part of the pallet body is provided with a sliding groove communicating with the inner cavity of the pallet body, and the side wall of the second scraper is provided with an L-shaped connecting rod. The end of the L-shaped connecting rod away from the second scraper extends from the sliding groove to the inner cavity of the pallet body and is fixedly connected to the sliding sleeve.

[0019] As a further improvement of the present invention: the second scraper has an arc-shaped structure, and a scraping blade is provided at the bottom of the second scraper; the L-shaped connecting rod is slidably connected to the arc-shaped outer wall of the second scraper.

[0020] The upper part of the tray body is also provided with a second drive component. After the second scraper moves forward from the upper region of the first scraper, the second drive component is used to drive the second scraper to rotate, so that the opening of the arc-shaped second scraper faces upward.

[0021] As a further improvement of the present invention: the second drive assembly includes a gear, a first helical gear, a first support, a second helical gear, and a second support.

[0022] The first support and the second support are fixedly disposed on the upper part of the pallet body. The first support and the second support are located on the side of the receiving groove and are distributed at intervals. The gear is fixedly disposed at the end of the second scraper with an arc-shaped structure. The first helical tooth and the second helical tooth are each provided with several groups. Several first helical tooth pieces are hinged to the upper part of the first support, and several second helical tooth pieces are hinged to the upper part of the second support. Each group of first helical tooth pieces and the first support, as well as each group of second helical tooth pieces and the second support, are connected by a second elastic element.

[0023] As a further improvement of the present invention: the first elastic element and the second elastic element are springs or metal sheets.

[0024] As a further improvement of the present invention: an arc-shaped slide rail is fixedly provided on the arc-shaped outer wall of the second scraper, a slider is slidably provided on the arc-shaped slide rail, and one end of the L-shaped connecting rod is fixedly connected to the slider.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] In this embodiment of the invention, after the wafer etching is completed, the first driving component rotates, and the transmission component transmits the rotational power of the first driving component to the vertical scraping component and the horizontal scraping component, so as to drive the vertical scraping component to move upward along the inside of the receiving groove and drive the horizontal scraping component to move laterally along the upper part of the tray body. When the vertical scraping component moves upward, it scrapes the reaction by-products remaining in the receiving groove upward to the upper part of the tray body. When the horizontal scraping component moves laterally, it scrapes the reaction by-products scraped to the upper part of the tray body laterally, thereby completing the automatic cleaning of the reaction by-products remaining in the receiving groove, thereby preventing the reaction by-products from remaining in the receiving groove, thus avoiding re-adhesion of the subsequent wafers and improving the etching effect of the wafers. Compared with the prior art, after the wafer etching is completed, the reaction by-products in the receiving groove on the tray body can be automatically cleaned, thereby preventing the reaction by-products from remaining in the receiving groove and avoiding affecting the etching of the subsequent wafers. Attached Figure Description

[0027] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the structure of a semiconductor processing plasma etching machine Figure 1 ;

[0029] Figure 2 A schematic diagram of the structure of a semiconductor processing plasma etching machine Figure 2 ;

[0030] Figure 3 for Figure 1 Enlarged view of region A in the middle;

[0031] Figure 4 for Figure 1 Enlarged view of region B in the middle;

[0032] Figure 5 for Figure 1 Enlarged diagram of region C in the middle;

[0033] Figure 6 for Figure 1 Enlarged schematic diagram of region D in the middle;

[0034] Figure 7 for Figure 2 Enlarged schematic diagram of region E in the middle;

[0035] In the diagram: 10-Pallet body, 101-Accommodation groove, 102-Slide groove, 103-Swing groove, 104-Limiting groove, 20-Vertical scraper assembly, 201-First scraper, 202-Limiting block, 30-Horizontal scraper assembly, 301-Second scraper, 302-L-shaped connecting rod, 303-Scraping blade, 304-Arc-shaped slide rail, 305-Slider, 40-First drive assembly, 401-Lead screw, 402-Threaded sleeve, 403-Motor, 50-Transmission assembly, 501-Sliding sleeve, 502-First elastic element, 503-First swing arm, 504-Guide rod, 505-Sliding sleeve, 506-Second swing arm, 60-Second drive assembly, 601-Gear, 602-First helical gear, 603-First support, 604-Second helical gear, 605-Second elastic element, 606-Second support. Detailed Implementation

[0036] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.

[0037] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0040] Please see Figure 1 as well as Figure 2 This embodiment provides a semiconductor processing plasma etching machine, including a tray body 10, a vertical scraping assembly 20, a horizontal scraping assembly 30, a first driving assembly 40, and a transmission assembly 50. The upper edge of the tray body 10 has a receiving groove 101 for the front of a wafer. The vertical scraping assembly 20 is disposed inside the receiving groove 101. The horizontal scraping assembly 30 is disposed on the upper part of the tray body 10. The first driving assembly 40 is mounted on the tray body 10. One end of the transmission assembly 50 is connected to the first driving assembly 40, and the other end is connected to the wafer. The vertical scraping component 20 and the horizontal scraping component 30 are connected to transmit the driving power of the first driving component 40 to the vertical scraping component 20 and the horizontal scraping component 30, so as to drive the vertical scraping component 20 to move upward along the inside of the receiving groove 101 and drive the horizontal scraping component 30 to move horizontally along the upper part of the tray body 10. When the vertical scraping component 20 moves upward, it scrapes the reaction by-products remaining in the receiving groove 101 to the upper part of the tray body 10. When the horizontal scraping component 30 moves horizontally, it scrapes away the reaction by-products scraped to the upper part of the tray body 10.

[0041] After the wafer etching is completed, the first drive component 40 rotates, and the transmission component 50 transmits the rotational power of the first drive component 40 to the vertical scraping component 20 and the horizontal scraping component 30, so as to drive the vertical scraping component 20 to move upward along the inside of the receiving groove 101 and drive the horizontal scraping component 30 to move horizontally along the upper part of the tray body 10. When the vertical scraping component 20 moves upward, it scrapes the reaction by-products remaining in the receiving groove 101 upward to the upper part of the tray body 10. When the horizontal scraping component 30 moves horizontally, it scrapes the reaction by-products scraped to the upper part of the tray body 10, thereby completing the automatic cleaning of the reaction by-products remaining in the receiving groove 101, thereby preventing the reaction by-products from remaining in the receiving groove 101, thus avoiding re-adhesion of the subsequent wafers and improving the etching effect of the wafers.

[0042] Please see Figure 3 In one embodiment, the vertical scraping assembly 20 includes a first scraper 201, which is a circular structure adapted to the receiving groove 101, and the diameter of the first scraper 201 is the same as the diameter of the receiving groove 101.

[0043] When the transmission assembly 50 transmits the rotational power of the first drive assembly 40 to the first scraper 201, the first scraper 201 moves upward along the inside of the receiving groove 101. When the first scraper 201 moves upward, its edge acts on the inner wall of the receiving groove 101, thereby scraping the reaction by-products remaining on the inner wall of the receiving groove 101 upward, so that the reaction by-products are scraped to the upper part of the tray body 10.

[0044] Please see Figure 3 In one embodiment, a limiting groove 104 is formed on the inner wall of the receiving groove 101, and a limiting block 202 is fixedly provided on the side wall of the first scraper 201. The limiting block 202 extends into the limiting groove 104 and can slide up and down along the limiting groove 104. When the limiting block 202 slides up along the limiting groove 104 to the top of the limiting groove 104, the upper surface of the first scraper 201 is flush with the upper surface of the tray body 10.

[0045] When the transmission assembly 50 transmits the rotational power of the first drive assembly 40 to the first scraper 201, causing the first scraper 201 to move upward along the inside of the receiving groove 101, the first scraper 201 drives the limiting block 202 to slide upward along the inside of the limiting groove 104. When the limiting block 202 slides to the top of the limiting groove 104, the upper surface of the first scraper 201 is flush with the upper surface of the tray body 10. At this time, the first scraper 201 scrapes the reaction byproducts remaining in the receiving groove 101 to the upper part of the tray body 10. Subsequently, with the lateral movement of the horizontal scraping assembly 30, the horizontal scraping assembly 30 smoothly scrapes away the reaction byproducts on the upper part of the tray body 10 laterally.

[0046] Please see Figure 1In one embodiment, the scraping assembly 30 includes a second scraper 301, the bottom of which is attached to the upper surface of the tray body 10, and the second scraper 301 is located on one side of the receiving groove 101.

[0047] When the transmission assembly 50 transmits the rotational power of the first drive assembly 40 to the first scraper 201, causing the first scraper 201 to move upward along the inside of the receiving groove 101, the transmission assembly 50 can also transmit the rotational power of the first drive assembly 40 to the second scraper 301, causing the second scraper 301 to move laterally along the upper part of the tray body 10. When the first scraper 201 scrapes the reaction byproducts to the upper part of the tray body 10, the second scraper 301 moves laterally across the upper region of the first scraper 201, thereby simultaneously scraping away the reaction byproducts scraped from the inner wall of the receiving groove 101 to the upper part of the tray body 10 and the reaction byproducts on the upper surface of the first scraper 201 laterally.

[0048] Please see Figure 1 as well as Figure 2 In one embodiment, the tray body 10 is hollow inside, and the bottom inner side of the receiving groove 101 is provided with a swing groove 103 communicating with the inner cavity of the tray body 10. The first driving assembly 40 includes a lead screw 401, a threaded sleeve 402, and a motor 403. The motor 403 is fixedly installed at the upper center position of the tray body 10. One end of the lead screw 401 is connected to the output end of the motor 403, and the other end extends into the inner cavity of the tray body 10 and is threadedly engaged with the threaded sleeve 402. The transmission assembly 50 includes a sliding sleeve 501, a first elastic element 502, a first swing rod 503, a guide rod 504, a sliding sleeve 505, and a second swing rod 506. One end of the guide rod 504 is fixedly connected to the inner wall of the tray body 10, and the other end extends into the sliding sleeve 501 and is movably engaged with the sliding sleeve 501. The sliding sleeve 505 is slidably sleeved on the outside of the guide rod 504. One end of the first elastic element 502 is connected to the sliding sleeve 505, and the other end is connected to the sliding sleeve 501. One end of the first swing rod 503 is hinged to the sliding sleeve 505, and the other end extends from the swing groove 103 into the receiving groove 101 and is hinged to the bottom wall of the first scraper 201. One end of the second swing rod 506 is hinged to the sliding sleeve 501, and the other end is hinged to the threaded sleeve 402.

[0049] After the wafer etching is completed, the motor 403 drives the lead screw 401 to rotate. When the lead screw 401 rotates, it drives the threaded sleeve 402 to move upward along the outside of the lead screw 401 through the threaded engagement with the threaded sleeve 402. When the threaded sleeve 402 moves upward, it drives the second swing arm 506 to swing. When the second swing arm 506 swings, it pushes the sliding sleeve 501 to slide relative to the guide rod 504. When the sliding sleeve 501 slides, it pushes the sliding sleeve 505 through the first elastic element 502, causing the sliding sleeve 505 to slide along the outside of the guide rod 504. When the sliding sleeve 505 slides, it drives the first swing arm 503 to swing along the inside of the swing groove 103. When the first swing arm 503 slides, it pushes the first scraper 201, causing the first scraper 201 to move upward along the inside of the receiving groove 101, thereby scraping the reaction by-products remaining on the inner wall of the receiving groove 101 to the upper part of the tray body 10.

[0050] Please see Figure 1 as well as Figure 7 In one embodiment, the upper part of the pallet body 10 is provided with a groove 102 communicating with the inner cavity of the pallet body 10, and the side wall of the second scraper 301 is provided with an L-shaped connecting rod 302. The end of the L-shaped connecting rod 302 away from the second scraper 301 extends from the groove 102 to the inner cavity of the pallet body 10 and is fixedly connected to the sliding sleeve 501.

[0051] When the second swing rod 506 swings and pushes the sliding sleeve 501 to slide relative to the guide rod 504, the sliding sleeve 501, on the one hand, drives the sliding sleeve 505 to slide synchronously along the outside of the guide rod 504 with the help of the first elastic element 502, and then pushes the first scraper 201 to move upward along the inside of the receiving groove 101 through the first swing rod 503, so as to scrape the reaction by-products on the inner wall of the receiving groove 101 to the upper part of the tray body 10. On the other hand, the sliding sleeve 501 can also drive the L-shaped connecting rod 302 to slide along the inside of the groove 102. 02 During sliding, the second scraper 301 moves laterally along the upper part of the tray body 10. When the limiting block 202 slides up to the top of the limiting groove 104, the first scraper 201 stops moving upward. The upper surface of the first scraper 201 remains flush with the upper surface of the tray body 10. As the sliding sleeve 501 continues to slide, the first elastic element 502 is compressed, and the second scraper 301 moves forward from the upper area of ​​the first scraper 201, thereby scraping away the reaction by-products scraped to the upper part of the tray body 10 laterally. When the second scraper 301 moves from the upper area of ​​the first scraper 201, it moves laterally. After the upper region of plate 201 moves forward, motor 403 drives lead screw 401 to rotate in the opposite direction. Through the reverse thread engagement between lead screw 401 and threaded sleeve 402, threaded sleeve 402 is driven to move downward. When threaded sleeve 402 moves downward, it drives second rocker arm 506 to swing in the opposite direction. Second rocker arm 506 pulls sliding sleeve 501, causing sliding sleeve 501 to slide in the opposite direction along the outside of guide rod 504. When sliding sleeve 501 slides in the opposite direction, the compressed first elastic element 502 gradually extends and returns to its original position. At the same time, sliding sleeve 501 drives... The L-shaped connecting rod 302 and the second scraper 301 move in opposite directions. When the first elastic member 502 extends to a predetermined length, the second scraper 301 moves in the opposite direction from the upper region of the first scraper 201. Then, the first elastic member 502 pulls the sliding sleeve 505 so that the sliding sleeve 505 slides in the opposite direction along the outside of the guide rod 504, thereby driving the first swing rod 503 to swing in the opposite direction. When the first swing rod 503 swings in the opposite direction, it pulls the first scraper 201 to move down along the inside of the receiving groove 101, thereby realizing the reset of the first scraper 201 and the second scraper 301.

[0052] Please see Figure 1 as well as Figure 4In one embodiment, the second scraper 301 has an arc-shaped structure, and a scraping blade 303 is provided at the bottom of the second scraper 301. When the second scraper 301 moves forward over the area above the first scraper 201, the scraping blade 303 at the bottom of the second scraper 301 adheres to the tray body 10 and the upper surface of the first scraper 201, thereby scraping away the reaction by-products laterally. The L-shaped connecting rod 302 is slidably connected to the arc-shaped outer wall of the second scraper 301. A second driving assembly 60 is also provided on the upper part of the tray body 10. After the second scraper 301 moves forward past the upper region of the first scraper 201, the second drive assembly 60 drives the second scraper 301 to rotate, so that the opening of the arc-shaped second scraper 301 faces upward. In this way, when the second scraper 301 subsequently moves backward past the upper region of the first scraper 201, the scraping blade 303 can move away from the tray body 10 and the upper surface of the first scraper 201, thereby preventing the reaction byproducts adhering to the scraping blade 303 from acting on the upper part of the first scraper 201 again.

[0053] Please see Figure 5 as well as Figure 6 In one embodiment, the second drive assembly 60 includes a gear 601, a first helical gear 602, a first support 603, a second helical gear 604, and a second support 606. The first support 603 and the second support 606 are fixedly disposed on the upper part of the tray body 10. The first support 603 and the second support 606 are located on the side of the receiving groove 101 and are spaced apart. The gear 601 is fixedly disposed at the end of the second scraper 301 with an arc-shaped structure. The first helical gear 602 and the second helical gear 604 are each provided with a plurality of groups. A plurality of first helical gears 602 are hinged to the upper part of the first support 603, and a plurality of second helical gears 604 are hinged to the upper part of the second support 606. Each group of first helical gears 602 and the first support 603, as well as each group of second helical gears 604 and the second support 606, are connected by a second elastic member 605.

[0054] When the motor 403 drives the lead screw 401 to rotate, thereby causing the second scraper 301 to move laterally along the upper part of the tray body 10, the second scraper 301 drives the gear 601 to move synchronously. When the gear 601 moves, it first meshes with several first helical teeth 602, thereby causing the arc-shaped second scraper 301 to rotate relative to the L-shaped connecting rod 302, so that the scraping edge 303 at the bottom of the second scraper 301 is in contact with the upper surface of the tray body 10. When the second scraper 301 moves laterally, it moves forward from the upper region of the first scraper 201. The scraping edge 303 at the bottom of the second scraper 301 scrapes away the reaction byproducts laterally. After the second scraper 301 moves forward from the upper region of the first scraper 201, the gear 601 pushes several second helical teeth 604, causing the several second helical teeth 604 to rotate relative to the second support 606. Then the electric... The machine 403 drives the lead screw 401 to rotate in the opposite direction, and the second scraper 301 and gear 601 move laterally in the opposite direction. At this time, the gear 601 meshes with several second helical teeth 604, which in turn drives the second scraper 301 to rotate in the opposite direction, so that the arc-shaped second scraper 301 faces upward. At this time, the scraping edge 303 at the bottom of the second scraper 301 is away from the upper surface of the tray body 10. As the second scraper 301 continues to move laterally in the opposite direction, the second scraper 301 moves past the upper region of the first scraper 201 in the opposite direction. The reaction byproducts adhering to the scraping edge 303 will not fall back onto the upper part of the first scraper 201. After the second scraper 301 moves past the upper part of the first scraper 201 in the opposite direction, the gear 303 pushes several first helical teeth 602 to rotate towards the first support 603, thereby completing the reset.

[0055] In one embodiment, the first elastic element 502 and the second elastic element 605 can be springs or metal sheets, and there is no limitation here.

[0056] Please see Figure 6 In one embodiment, an arc-shaped slide rail 304 is fixedly provided on the arc-shaped outer wall of the second scraper 301, and a slider 305 is slidably provided on the arc-shaped slide rail 304. One end of the L-shaped connecting rod 302 is fixedly connected to the slider 305.

[0057] When gear 601 meshes with several first helical gears 602, the second scraper 301 drives the arc-shaped slide rail 304 to slide along the slider 305. When gear 601 meshes with several second helical gears 604, the second scraper 301 drives the arc-shaped slide rail 304 to slide in the opposite direction along the slider 305.

[0058] In this embodiment of the invention, after the wafer etching is completed, the first driving component 40 rotates, and the transmission component 50 transmits the rotational power of the first driving component 40 to the vertical scraping component 20 and the horizontal scraping component 30, so as to drive the vertical scraping component 20 to move upward along the inside of the receiving groove 101 and drive the horizontal scraping component 30 to move horizontally along the upper part of the tray body 10. When the vertical scraping component 20 moves upward, it scrapes the reaction by-products remaining in the receiving groove 101 upward to the upper part of the tray body 10. When the horizontal scraping component 30 moves horizontally, it scrapes the reaction by-products scraped to the upper part of the tray body 10, thereby completing the automatic cleaning of the reaction by-products remaining in the receiving groove 101, thereby preventing the reaction by-products from remaining in the receiving groove 101, thus avoiding re-adhesion of the subsequent wafers and improving the etching effect of the wafers. Compared with the prior art, after the wafer etching is completed, the reaction by-products in the receiving groove 101 on the tray body 10 can be automatically cleaned, thereby preventing the reaction by-products from remaining in the receiving groove 101 and avoiding affecting the etching of the subsequent wafers.

[0059] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0060] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity, and those skilled in the art should consider the specification as a whole.

Claims

1. A semiconductor processing plasma etching machine, characterized in that, It includes a pallet body (10), a vertical scraping assembly (20), a horizontal scraping assembly (30), a first drive assembly (40), and a transmission assembly (50). The upper edge of the tray body (10) is provided with a receiving groove (101) for the front of the wafer. The vertical scraping assembly (20) is disposed inside the receiving groove (101), and the horizontal scraping assembly (30) is disposed on the upper part of the pallet body (10). The first drive assembly (40) is mounted on the tray body (10). One end of the transmission assembly (50) is connected to the first drive assembly (40), and the other end is connected to the vertical scraping assembly (20) and the horizontal scraping assembly (30). It is used to transmit the driving power of the first drive assembly (40) to the vertical scraping assembly (20) and the horizontal scraping assembly (30), so as to drive the vertical scraping assembly (20) to move upward along the inside of the receiving groove (101) and drive the horizontal scraping assembly (30) to move laterally along the upper part of the tray body (10). When the vertical scraping component (20) moves upward, it scrapes the reaction byproducts remaining inside the receiving groove (101) to the upper part of the tray body (10). When the horizontal scraping component (30) moves horizontally, it scrapes away the reaction byproducts scraped to the upper part of the tray body (10).

2. The semiconductor processing plasma etching machine according to claim 1, characterized in that, The vertical scraping assembly (20) includes a first scraper (201), which is a circular structure adapted to the receiving groove (101), and the diameter of the first scraper (201) is the same as the diameter of the receiving groove (101).

3. The semiconductor processing plasma etching machine according to claim 2, characterized in that, A limiting groove (104) is provided on the inner wall of the receiving groove (101). A limiting block (202) is fixedly provided on the side wall of the first scraper (201). The limiting block (202) extends into the limiting groove (104) and can slide up and down along the inside of the limiting groove (104). When the limiting block (202) slides up along the inside of the limiting groove (104) to the top of the limiting groove (104), the upper surface of the first scraper (201) is flush with the upper surface of the tray body (10).

4. A semiconductor processing plasma etching machine according to claim 2, characterized in that, The horizontal scraping assembly (30) includes a second scraper (301), the bottom of which is attached to the upper surface of the tray body (10), and the second scraper (301) is located on one side of the receiving groove (101).

5. A semiconductor processing plasma etching machine according to claim 1, characterized in that, The tray body (10) is hollow inside, and the bottom of the inner side of the receiving groove (101) is provided with a swing groove (103) that communicates with the inner cavity of the tray body (10). The first drive assembly (40) includes a lead screw (401), a threaded sleeve (402), and a motor (403). The motor (403) is fixedly installed at the upper center of the pallet body (10). One end of the lead screw (401) is connected to the output end of the motor (403), and the other end extends into the inner cavity of the pallet body (10) and is threadedly engaged with the threaded sleeve (402). The transmission assembly (50) includes a sliding sleeve (501), a first elastic element (502), a first rocker arm (503), a guide rod (504), a sliding sleeve (505), and a second rocker arm (506). One end of the guide rod (504) is fixedly connected to the inner wall of the tray body (10), and the other end extends into the sliding sleeve (501) and is movably engaged with the sliding sleeve (501). The sliding sleeve (505) is slidably sleeved on the outside of the guide rod (504). One end of the first elastic element (502) is connected to the sliding sleeve (505), and the other end is connected to the sliding sleeve (501). One end of the first rocker arm (503) is hinged to the sliding sleeve (505), and the other end extends from the rocker groove (103) into the receiving groove (101) and is hinged to the bottom wall of the first scraper (201). One end of the second rocker arm (506) is hinged to the sliding sleeve (501), and the other end is hinged to the threaded sleeve (402).

6. A semiconductor processing plasma etching machine according to claim 5, characterized in that, The upper part of the pallet body (10) is provided with a groove (102) that communicates with the inner cavity of the pallet body (10). The side wall of the second scraper (301) is provided with an L-shaped connecting rod (302). The end of the L-shaped connecting rod (302) away from the second scraper (301) extends from the groove (102) to the inner cavity of the pallet body (10) and is fixedly connected to the sliding sleeve (501).

7. A semiconductor processing plasma etching machine according to claim 4, characterized in that, The second scraper (301) has an arc-shaped structure, and a scraping blade (303) is provided at the bottom of the second scraper (301). The L-shaped connecting rod (302) is slidably connected to the arc-shaped outer wall of the second scraper (301). The upper part of the tray body (10) is also provided with a second drive assembly (60). After the second scraper (301) moves forward from the upper region of the first scraper (201), the second drive assembly (60) is used to drive the second scraper (301) to rotate, so that the opening of the arc-shaped second scraper (301) faces upward.

8. A semiconductor processing plasma etching machine according to claim 7, characterized in that, The second drive assembly (60) includes a gear (601), a first helical gear (602), a first support (603), a second helical gear (604), and a second support (606). The first support (603) and the second support (606) are fixedly disposed on the upper part of the pallet body (10). The first support (603) and the second support (606) are located on the side of the receiving groove (101) and are spaced apart. The gear (601) is fixedly disposed at the end of the second scraper (301) with an arc-shaped structure. The first helical tooth (602) and the second helical tooth (604) are each provided with several groups. Several first helical tooth (602) are hinged to the upper part of the first support (603), and several second helical tooth (604) are hinged to the upper part of the second support (606). Each group of first helical tooth (602) and the first support (603) and each group of second helical tooth (604) and the second support (606) are connected by a second elastic member (605).

9. A semiconductor processing plasma etching machine according to claim 8, characterized in that, The first elastic element (502) and the second elastic element (605) are springs or metal sheets.

10. A semiconductor processing plasma etching machine according to claim 7, characterized in that, An arc-shaped slide rail (304) is fixedly installed on the arc-shaped outer wall of the second scraper (301), and a slider (305) is slidably installed on the arc-shaped slide rail (304). One end of the L-shaped connecting rod (302) is fixedly connected to the slider (305).

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