An etching fine-tuning device and method for a surface-mount filter.

Abstract

This invention discloses an etching fine-tuning device for surface-mount filters, relating to the field of surface-mount filter fine-tuning technology. It includes a vacuum chamber and an etching device, a baffle module, and a carrier disk module located within the vacuum chamber. The baffle module includes a through plate located directly above the etching device; the through plate is fixedly connected to a fixed plate. The carrier disk module is located above the baffle module and includes a sliding boat, a mask plate, and a carrier disk. The mask plate is located inside the sliding boat and has multiple mask holes arranged in an array on the mask plate. The surface-mount filter is loaded in the carrier disk station. This invention is versatile; both single-section and double-section surface-mount filters can be loaded in the carrier disk. For surface-mount filters, the mask plate and through plate can be replaced, meeting the requirements of high signal purity, high anti-interference capability, and high-precision target frequency selection for multi-section surface-mount filters. This invention also relates to a fine-tuning method for this etching fine-tuning device for surface-mount filters.

Description

Technical Field

[0001] This invention relates to the field of surface-mount filter fine-tuning technology, and more specifically to an etching fine-tuning device for surface-mount filters; the invention also relates to a fine-tuning method for such an etching fine-tuning device for surface-mount filters. Background Technology

[0002] Crystal filters are filtering devices based on the inverse piezoelectric effect of piezoelectric crystals. They are important frequency-selective electronic components in communication equipment, characterized by high stability. With their high Q value, low insertion loss, and excellent frequency selectivity, they are widely used in signal filtering in electronic equipment such as communication, navigation, and measurement and control systems. Currently, electronic devices are rapidly iterating towards thinner, smaller, and more integrated designs, placing increasingly stringent demands on the size of crystal filters. Miniaturization has become one of the core directions of their technological development. However, in the process of miniaturizing crystal filters, the actual resonant frequency is easily deviated from the design target value due to limitations in manufacturing process precision. This leads to deterioration in filtering performance (such as center frequency shift, increased passband attenuation, and decreased out-of-band rejection), failing to meet the high-precision signal filtering requirements of electronic equipment. Therefore, effective fine-tuning methods must be used to correct frequency deviations to ensure that the performance of miniaturized crystal filters meets the standards.

[0003] Existing fine-tuning techniques for monolithic crystal filters mainly focus on traditional leaded devices (such as UM-1 and UM-5 packages). A common method is vacuum deposition: depositing a thin metal film (such as gold or silver) on the electrode surface to change the electrode thickness and indirectly adjust the frequency (accuracy of about ±0.5kHz). However, due to the limitations of the fine-tuning hole processing precision, it is inadequate for surface-mount crystal filters with higher frequencies and smaller electrode and slit gaps.

[0004] Currently, there is no efficient fine-tuning method specifically for high-frequency patch crystal filters (especially miniaturized products with frequencies ≥70MHz, package sizes ≤7×5×1.5mm or even smaller, electrode sizes ≤0.25×0.18mm, and gap sizes ≤0.08mm), which makes it difficult to further improve the parameter consistency of such devices.

[0005] Therefore, it is necessary to develop an etching fine-tuning device and a fine-tuning method for surface-mount filters. Summary of the Invention

[0006] The primary objective of this invention is to overcome the shortcomings of the aforementioned background technology and to provide an etching fine-tuning device for surface-mount filters.

[0007] A second objective of the present invention is to provide a fine-tuning method for such an etching fine-tuning device for a surface-mount filter.

[0008] To achieve the aforementioned first objective, the technical solution of the present invention is as follows: an etching fine-tuning device for a surface-mount filter, characterized in that: it includes a vacuum chamber and an etching device, a baffle module, and a carrier disk module located within the vacuum chamber; the baffle module includes a through plate located directly above the etching device; the through plate has multiple through holes arranged in an array, and the through plate is fixedly connected to a fixed plate; the fixed plate is provided with multiple micro motors; the output end of the micro motor is connected to the baffle, and the micro motor controls the opening and closing of the baffle;

[0009] The carrier plate module is located above the baffle module. The carrier plate module includes a sliding boat, a mask plate, and a carrier plate. The sliding boat can slide horizontally. The mask plate is located inside the sliding boat and has multiple mask hole groups arranged in an array on the mask plate. The carrier plate is located inside the sliding boat and above the mask plate. The carrier plate has multiple carrier plate stations arranged in an array on the carrier plate, and the surface-mount filter is loaded in the carrier plate station.

[0010] In the etching fine-tuning state, the drive mechanism drives the carrier module to move horizontally to the designated position; the crystal oscillator electrodes of the through holes, baffles, mask hole groups, and surface-mount filters are located on the same vertical line.

[0011] The above technical solution also includes a test board; the test board is located above the carrier module, and the test board moves up and down by a cylinder. The test board is used to detect the crystal oscillator frequency of the surface-mount filter.

[0012] In the above technical solution, the etching device includes an anode cup, a cathode filament located inside the anode cup, a screen grid located directly above the anode cup, an accelerating grid located directly above the screen grid, and a neutralizing filament located directly above the accelerating grid; the pass plate is located directly above the neutralizing filament.

[0013] In the above technical solution, when the surface-mount filter is a dual-section filter, the surface-mount filter includes a ceramic substrate, a first coated quartz wafer, a second coated quartz wafer located inside the ceramic substrate, and a cover plate disposed on the top of the ceramic substrate; bottom pads A, B, and C are arranged sequentially from left to right on one side inside the ceramic substrate, and bottom pads F, E, and D are arranged sequentially from left to right on the other side;

[0014] The first coated quartz wafer has three corners with electrode connection terminals a, b, and f. The first front electrode of the first coated quartz wafer is connected to the bottom pad F in sequence through electrode connection terminal f and conductive adhesive. The second front electrode of the first coated quartz wafer is connected to the bottom pad B in sequence through electrode connection terminal b and conductive adhesive. The first back electrode of the first coated quartz wafer is connected to the bottom pad A in sequence through electrode connection terminal a and conductive adhesive.

[0015] The second coated quartz wafer has electrode connection terminals c, e, and d at its three corners; the third front electrode of the second coated quartz wafer is connected to the bottom pad C via electrode connection terminal c and conductive adhesive in sequence; the fourth front electrode of the second coated quartz wafer is connected to the bottom pad E via electrode connection terminal e and conductive adhesive in sequence; and the second back electrode of the second coated quartz wafer is connected to the bottom pad D via electrode connection terminal d and conductive adhesive in sequence.

[0016] In the above technical solution, the test board is arranged in an array of 8 test probe groups, each test probe group has 6 probes, and the 6 probes correspond to the electrode connection ends of the first coated quartz wafer and the second coated quartz wafer.

[0017] In the above technical solution, the mask hole group is provided with 4 mask holes.

[0018] In the above technical solution, the driving mechanism includes a stepper motor, a rotating rod, a slide rail, and a vacuum chamber; the stepper motor and the rotating rod are both located inside the vacuum chamber, one end of the rotating rod is connected to the output end of the stepper motor, and the other end is slidably connected to the carrier module; one end of the slide rail is set inside the vacuum chamber, and the other end extends out of the vacuum chamber, and a limiter is set in the middle of the slide rail;

[0019] The bottom of the carrier module is slidably connected to the slide rail, and the side of the sliding boat has an array of sliding boat positioning holes.

[0020] To achieve the second objective mentioned above, the technical solution of the present invention is: a fine-tuning method for an etching fine-tuning device for a surface-mount filter, characterized by comprising the following steps:

[0021] Step 1: Load the surface-mount filter into the carrier disk;

[0022] Step 2: Contact the probes of the test board with the bottom pads of the surface-mount filter to detect the crystal oscillator frequency of the surface-mount filter;

[0023] Step 3: The monitoring equipment is electrically connected to the test board to receive the detection signal and monitor the crystal oscillator frequency, passband width, and frequency deviation of the surface-mount filter;

[0024] Step 4: Set the target parameter value of the etching device. The etching fine-tuning machine controls the baffle to open according to the crystal oscillator frequency detected by the test board. The etching device etches the electrode on the side of the first coated quartz wafer and the second coated quartz wafer that is too low to increase the frequency. When the frequency deviation of the two electrodes on one side of the first coated quartz wafer and the second coated quartz wafer tends to be consistent, the dual electrodes are simultaneously and alternately etched and fine-tuned to make the dual electrode frequency of the first coated quartz wafer and the second coated quartz wafer meet the target setting value.

[0025] Step 5: After the etching and fine-tuning of one series of surface-mount filters is completed, the etching and fine-tuning machine controls the baffle to close, and the drive mechanism drives the carrier module to move horizontally, moving the next series of surface-mount filters directly above the baffle.

[0026] Step 6: Repeat steps 2-5 to complete the fine-tuning of the surface-mount filter throughout the entire carrier disk.

[0027] Compared with the prior art, the present invention has the following advantages.

[0028] 1) This invention is versatile. It can load both single-section and double-section surface-mount filters in the carrier disk. For surface-mount filters, the mask and pass-through plate can be replaced. It can meet the requirements of high signal purity, high anti-interference ability and high precision selection of target frequency for multi-section surface-mount filters.

[0029] 2) Compared with traditional plug-in multi-section filters, the etching fine-tuning device of the present invention reduces the matching process after micro-assembly, which can save production time, improve work efficiency and reduce investment costs.

[0030] 3) This invention can perform single-sided fine-tuning of surface-mount filters, which can reduce additional parasitic parameters, improve frequency stability, and make it easier to achieve high-precision filtering functions. At the same time, compared with traditional double-sided etching fine-tuning, it reduces the process flow, improves production efficiency, and reduces manufacturing costs.

[0031] 4) Compared with traditional plug-in filters, the fine-tuning device of this invention can fine-tune the frequency of single-section surface-mount filters and double-section surface-mount filters to a high fundamental frequency of 80MHz or even higher. The fine-tuning frequency range is wider, and the electrical performance parameters of the surface-mount filter after etching and fine-tuning are more consistent than those of traditional plug-in filters, and the pass rate is significantly improved.

[0032] 5) This invention allows for direct observation of frequency changes during the etching fine-tuning process through monitoring equipment. The etching device enables accurate adjustment of the frequency during the etching fine-tuning process. Simultaneously, it can measure the relevant electrical performance parameters of a finished two-section surface-mount filter, facilitating timely removal of defective products and improving the pass rate.

[0033] 6) This invention controls the automatic opening and closing of the baffle based on the detected crystal oscillator frequency, and can etch and fine-tune 8 products at a time. The large number of products etched and fine-tuned at one time makes it more suitable for mass production. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of the present invention.

[0035] Figure 2 This is a schematic diagram of the bottom structure of a surface-mount filter.

[0036] Figure 3This is a schematic diagram of the internal structure of a surface-mount filter with two sections.

[0037] Figure 4 for Figure 3 A sectional view.

[0038] Figure 5 This is a front view of the first coated quartz wafer.

[0039] Figure 6 This is a schematic diagram of the reverse side of the first coated quartz wafer.

[0040] Figure 7 This is a front view of the second coated quartz wafer.

[0041] Figure 8 This is a schematic diagram of the reverse side of the second-coated quartz wafer.

[0042] Figure 9 This is a schematic diagram of the test probe group, surface-mount filter, carrier disk, and baffle.

[0043] Figure 10 This is a schematic diagram of the mask plate structure.

[0044] Figure 11 This is a structural schematic diagram of the baffle module.

[0045] Figure 12 This is a schematic diagram of the drive mechanism.

[0046] Figure 13 This is a schematic diagram of the pressure plate structure.

[0047] Among them, 100-vacuum hood, 200-etching device, 210-anode cup, 220-cathode filament, 230-screen grid, 240-accelerating grid, 250-neutralizing filament, 300-baffle module, 310-through plate, 311-through hole, 320-fixing plate, 330-micro motor, 340-baffle, 400-carrier module, 410-sliding boat, 411-sliding boat positioning hole, 420-mask plate, 421-mask hole group, 4211-mask hole, 430-carrier, 431-carrier station, 440-pressure plate, 441-positioning hole, 500-surface mount filter, 510-ceramic substrate, 511-bottom pad A, 512-bottom pad B, 513-bottom pad C, 514-bottom pad F, 5 15-Bottom pad E, 516-Bottom pad D, 520-First coated quartz wafer, 521-Electrode connection terminal a, 522-Electrode connection terminal b, 523-Electrode connection terminal f, 524-First front electrode, 525-Second front electrode, 526-First reverse electrode, 530-Second coated quartz wafer, 531-Electrode connection terminal c, 532-Electrode connection terminal e, 533-Electrode connection terminal d, 534-Third front electrode, 535-Fourth front electrode, 536-Second reverse electrode, 540-Cover plate, 550-Conductive adhesive, 600-Test board, 610-Test probe group, 611-Probe, 700-Drive mechanism, 710-Stepper motor, 720-Rotating rod, 730-Slide rail, 740-Limiter. Detailed Implementation

[0048] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but these descriptions are not intended to limit the invention and are merely illustrative. The advantages of the present invention will become clearer and easier to understand through this description.

[0049] Referring to the accompanying drawings: An etching fine-tuning device for a surface-mount filter, characterized in that it includes a vacuum chamber 100 and an etching device 200, a baffle module 300, and a carrier disk module 400 located within the vacuum chamber 100; the baffle module 300 includes a through plate 310 located directly above the etching device 200; the through plate 310 has a plurality of through holes 311 arranged in an array, and the through plate 310 is fixedly connected to a fixing plate 320; the fixing plate 320 is provided with a plurality of micro motors 330; the output end of the micro motor 330 is connected to the baffle 340, and the micro motor 330 controls the opening and closing of the baffle 340;

[0050] like Figure 9As shown, the carrier module 400 is located above the baffle module 300. The carrier module 400 includes a sliding boat 410, a mask plate 420, and a carrier 430. The sliding boat 410 can slide horizontally. The mask plate 420 is located inside the sliding boat 410, and multiple mask hole groups 421 are arranged in an array on the mask plate 420. The carrier 430 is located inside the sliding boat 410 and above the mask plate 420. Multiple carrier stations 431 are arranged in an array on the carrier 430, and the surface-mount filter 500 is loaded in the carrier station 431.

[0051] In the etching fine-tuning state, the drive mechanism 700 drives the carrier module 400 to move horizontally to the designated position; the etching device 200 is used to spray an ion beam, and the crystal oscillator electrode of the through hole 311, baffle 340, mask hole group 421 and surface filter 500 is located on the same vertical line; so that the accelerated ions can pass through the through hole 311, baffle 340 and mask hole group 421 in sequence to reach the crystal oscillator electrode of the surface filter 500, thereby realizing etching fine-tuning.

[0052] It also includes a test board 600; the test board 600 is located above the carrier module 400, and the test board 600 moves up and down by a cylinder. The test board 600 is used to detect the crystal oscillator frequency of the surface-mount filter 500; the monitoring device is electrically connected to the test board 600, and the monitoring device is used to receive the detection signal and monitor the crystal oscillator frequency, passband width and frequency deviation of the surface-mount filter 500.

[0053] like Figure 1 As shown, the etching apparatus 200 includes an anode cup 210, a cathode filament 220 located inside the anode cup 210, a screen grid 230 located directly above the anode cup 210, an acceleration grid 240 located directly above the screen grid 230, and a neutralization filament 250 located directly above the acceleration grid 240; the pass plate 310 is located directly above the neutralization filament 250.

[0054] The surface-mount filter 500 can be a single-section surface-mount filter or a double-section surface-mount filter. When the surface-mount filter 500 is a double-section filter, it includes a ceramic substrate 510, a first coated quartz wafer 520 and a second coated quartz wafer 530 located within the ceramic substrate 510, and a cover plate 540 disposed on top of the ceramic substrate 510. The ceramic substrate 510 has bottom pads A511, B512, and C513 arranged sequentially from left to right on one side, and bottom pads F514, E515, and D516 arranged sequentially from left to right on the other side. The front electrodes of the first coated quartz wafer 520 and the second coated quartz wafer 530 are placed downwards.

[0055] The first coated quartz wafer 520 has electrode connection terminals a521, b522, and f523 at its three corners. The first front electrode 524 of the first coated quartz wafer 520 is connected to the bottom pad F514 in sequence through electrode connection terminal f523 and conductive adhesive 550. The second front electrode 525 of the first coated quartz wafer 520 is connected to the bottom pad B512 in sequence through electrode connection terminal b522 and conductive adhesive 550. The first back electrode 526 of the first coated quartz wafer 520 is connected to the bottom pad A511 in sequence through electrode connection terminal a521 and conductive adhesive 550.

[0056] The second coated quartz wafer 520 has electrode connection terminals c531, e532, and d533 at its three corners; the third front electrode 534 of the second coated quartz wafer 530 is connected to the bottom pad C513 in sequence through electrode connection terminal c531 and conductive adhesive 550; the fourth front electrode 535 of the second coated quartz wafer 530 is connected to the bottom pad E515 in sequence through electrode connection terminal e532 and conductive adhesive 550; and the second back electrode 536 of the second coated quartz wafer 530 is connected to the bottom pad D516 in sequence through electrode connection terminal d533 and conductive adhesive 550.

[0057] Electrode connection terminals a521 and f523 form an electrical connection to form frequency F1; electrode connection terminals c531 and d533 form an electrical connection to form frequency F1'; electrode connection terminals a521 and b522 form an electrical connection to form frequency F2; electrode connection terminals e532 and d533 form an electrical connection to form frequency F2'; electrode connection terminals b522 and f523 form an electrical connection to form frequency FA; electrode connection terminals c531 and e532 form an electrical connection to form frequency FA'; electrode connection terminals b522 and f523 are connected to electrode connection terminal a521 to form an electrical connection to form frequency FS; electrode connection terminals c531 and e532 are connected to electrode connection terminal d533 to form an electrical connection to form frequency FS'.

[0058] The test board 600 is arranged in an array of 8 test probe groups 610, each test probe group 610 having six probes 611, the six probes 611 corresponding to the electrode connection ends of the first coated quartz wafer 520 and the second coated quartz wafer 530.

[0059] The mask hole group 421 is provided with 4 mask holes 4211.

[0060] like Figure 12As shown, the drive mechanism 700 includes a stepper motor 710, a rotating rod 720, a slide rail 730, and a vacuum chamber 100. The stepper motor 710 and the rotating rod 720 are both located inside the vacuum chamber 100. One end of the rotating rod 720 is connected to the output end of the stepper motor 710, and the other end is slidably connected to the carrier module 400. One end of the slide rail 730 is disposed inside the vacuum chamber 100, and the other end extends out of the vacuum chamber 100. A limiter 740 is provided in the middle of the slide rail 730.

[0061] The bottom of the carrier module 400 is slidably connected to the slide rail 730; the side of the sliding boat 410 has an array of sliding boat positioning holes 411. When the carrier module 400 slides, the sliding displacement is identified by the signal change of the limiter 740 through the sliding boat positioning holes 411.

[0062] When the limit switch 740 detects the sliding boat positioning hole 411, the limit switch 740 outputs a signal, the stepper motor 710 stops rotating, and the etching fine adjustment begins. After the etching fine adjustment is completed, the stepper motor 710 starts rotating, and the carrier module 400 slides. When the limit switch 740 detects the next sliding boat positioning hole 411, the limit switch 740 outputs a signal, the stepper motor 710 stops rotating, and the etching fine adjustment continues.

[0063] A fine-tuning method for an etching fine-tuning device for a surface-mount filter, characterized by comprising the following steps:

[0064] Step 1: Load the surface-mount filter 500 into the carrier plate 430 and press it down with the pressure plate 440; the pressure plate 440 is a magnetic stainless steel plate with two pressure plate positioning holes 441 corresponding to the positioning posts of the sliding boat 410.

[0065] Step 2: Contact the probe 611 of the test board 600 with the bottom pad of the surface-mount filter to detect the crystal oscillator frequency of the surface-mount filter 500.

[0066] Step 3: The monitoring equipment is electrically connected to the test board 600 to receive the detection signal and monitor the crystal oscillator frequency, passband width and frequency deviation of the surface-mount filter 500;

[0067] Step 4: Set the target parameter value of the etching device 200. The etching fine-tuning machine controls the baffle 340 to open according to the crystal oscillator frequency detected by the test board 600. The etching device 200 etches the electrode on the side of the first coated quartz wafer 520 and the second coated quartz wafer 530 that is too low to increase the frequency. When the frequency deviation of the two electrodes on the first coated quartz wafer 520 and the second coated quartz wafer 530 tends to be consistent, the dual electrodes are simultaneously and alternately etched and fine-tuned so that the dual electrode frequencies of the first coated quartz wafer 520 and the second coated quartz wafer 530 meet the target setting value.

[0068] by Figure 5-8As shown, each coated quartz wafer has a pair of single-sided electrodes on both its front and back sides, located in the center of the wafer. The electrode leads extend from the electrodes to the edge of the wafer. The leads with the electrodes facing down are coated with base adhesive, and the leads with the electrodes facing up are coated with surface adhesive. After being cured by conductive adhesive 550, they are fixed on the pads of the ceramic substrate 510 to form an electrical connection. When the dual-section surface-mount filter is etched and fine-tuned, the test board 600 automatically tests the frequency of the first front electrode 524 of the first coated quartz wafer 520 to be F1, the frequency of the third front electrode 534 of the second coated quartz wafer 530 to be F1', the frequency of the second front electrode 525 to be F2, and the frequency of the fourth front electrode 535 to be F2'. At the same time, it etches and fine-tunes the electrodes of the first coated quartz wafer 520 and the second coated quartz wafer 530 with lower frequencies to make the frequency deviations of F1 and F2 more consistent, and the frequency deviations of F1' and F2' more consistent.

[0069] by Figure 5-8 As shown, the first front electrode 524, the second front electrode 525, the third front electrode 534, and the fourth front electrode 535 are etching fine-tuning areas. Different fine-tuning areas are selected for etching fine-tuning according to different frequency deviations.

[0070] Step 5: After the etching and fine-tuning of one set of surface-mount filters 500 is completed, the etching and fine-tuning machine controls the baffle 340 to close, and the drive mechanism 700 drives the carrier module 400 to move horizontally, moving the next set of surface-mount filters 500 directly above the baffle 340.

[0071] Step 6: Repeat steps 2-5 to complete the fine-tuning of the surface-mount filter 500 inside the entire carrier disk 430.

[0072] In actual use, the sliding boat 410 is equipped with positioning posts, and the mask plate 420 and the carrier plate 430 are fixed on the sliding boat 410 by the positioning posts.

[0073] The position and size of the mask hole 421 can be determined according to the position and size of the two coated wafer electrodes of the dual-section surface mount filter to ensure a good fit. The mask plate 421 can be replaced according to the filter model. The number and spacing of the carrier station 431 of the carrier 430 have been determined during the design of the fine-tuning device. The size of the carrier station 431 matches the external dimensions of the surface mount filter 500, and it is just right to place the surface mount filter 500.

[0074] The monitoring equipment includes a network analyzer and a computer display screen. The network analyzer receives, processes, and analyzes the probe signals from the test board 600. The computer display screen shows the crystal oscillator frequency, passband width, and frequency deviation of the surface-mount filter 500. The computer display screen allows for direct observation of the changes in crystal oscillator-related parameters and etching-related parameters during the etching and fine-tuning process. Simultaneously, it can measure the relevant electrical performance parameters of a finished surface-mount filter 500, facilitating the timely removal of defective products and improving the pass rate.

[0075] In practice, a two-section surface-mount filter will be used as an example to illustrate the etching fine-tuning process:

[0076] like Figure 3-8 As shown, two 80M coated quartz wafers are electrically connected by conductive adhesive 550 mounted on the internal pads of the ceramic substrate 510; the first coated quartz wafer 520 has a first front electrode 524 and a second front electrode 525 on its front side, and the second coated quartz wafer 530 has a third front electrode 534 and a fourth front electrode 535 on one side; the etching fine-tuning machine sets the FA target parameter value to 7999700Hz based on the micro-test results.

[0077] The probe 611 tests the frequency deviation F1-F2 (F1'-F2'), frequency FA (FA') and FS (FS') of the two coated quartz crystals of the surface-mount filter 500 by contacting the bottom pads A, B, C, D, E and F of the ceramic substrate 510; and the passband width.

[0078] The electrode corresponding to the lower frequency of F1 (F1') and F2 (F2') is determined by testing. When the frequency F1 (F1') is low, i.e., F1 (F1') < F2 (F2'), the electrode area is etched by controlling the opening and closing of the baffle 340. A small amount of the coating layer is removed by ion etching on the first front electrode 524 (third front electrode 534) to make the frequency F1 (F1') and F2 (F2') approach each other. When the frequency F2 (F2') is low, i.e., F1 (F1') > F2 (F2'), the electrode area is etched by controlling the opening and closing of the baffle 340. A small amount of the coating layer is removed by ion etching on the second front electrode 525 (fourth front electrode 535) to make the frequency F1 (F1') and F2 (F2') approach each other. The above testing and etching process is repeated until the frequency F1 (F1') and F2 (F2') are consistent and FA (FA') is close to the target frequency value.

[0079] All other unspecified parts belong to the prior art.

Claims

1. An etching trimming device for surface mount filters, characterized by: The system includes a vacuum chamber (100) and an etching device (200), a baffle module (300), and a carrier disk module (400) located inside the vacuum chamber (100). The baffle module (300) includes a through plate (310) located directly above the etching device (200). The through plate (310) has multiple through holes (311) arranged in an array and is fixedly connected to a fixing plate (320). The fixing plate (320) is provided with multiple micro motors (330). The output end of the micro motor (330) is connected to the baffle (340), and the micro motor (330) controls the opening and closing of the baffle (340). The carrier module (400) is located above the baffle module (300). The carrier module (400) includes a sliding boat (410), a mask plate (420), and a carrier disk (430). The sliding boat (410) can slide horizontally. The mask plate (420) is located inside the sliding boat (410), and multiple mask hole groups (421) are arranged in an array on the mask plate (420). The carrier disk (430) is located inside the sliding boat (410) and above the mask plate (420). Multiple carrier disk stations (431) are arranged in an array on the carrier disk (430), and the surface-mount filter (500) is loaded in the carrier disk station (431). In the etching fine-tuning state, the drive mechanism (700) drives the carrier plate module (400) to move horizontally to the designated position; the crystal oscillator electrodes of the through hole (311), baffle (340), mask hole group (421) and surface filter (500) are located on the same vertical line.

2. The etching trimmer device of a surface mount filter according to claim 1, wherein: It also includes a test board (600); the test board (600) is located above the carrier module (400), and the test board (600) moves up and down by a cylinder. The test board (600) is used to detect the crystal oscillator frequency of the surface-mount filter (500).

3. The etching trimmer device of a surface mount filter according to claim 2, wherein: The etching apparatus (200) includes an anode cup (210), a cathode filament (220) located inside the anode cup (210), a screen grid (230) located directly above the anode cup (210), an acceleration grid (240) located directly above the screen grid (230), and a neutralization filament (250) located directly above the acceleration grid (240); the pass plate (310) is located directly above the neutralization filament (250).

4. The etching fine-tuning device for a surface-mount filter according to claim 3, characterized in that: When the surface-mount filter (500) is a dual-section filter, the surface-mount filter (500) includes a ceramic substrate (510), a first coated quartz wafer (520) and a second coated quartz wafer (530) located inside the ceramic substrate (510), and a cover plate (540) disposed on the top of the ceramic substrate (510); the ceramic substrate (510) has bottom pads A (511), B (512) and C (513) arranged sequentially from left to right on one side, and bottom pads F (514), E (515) and D (516) arranged sequentially from left to right on the other side; The first coated quartz wafer (520) has three corners with electrode connection terminals a (521), b (522), and f (523). The first front electrode (524) of the first coated quartz wafer (520) is connected to the bottom pad F (514) in sequence through electrode connection terminal f (523) and conductive adhesive (550). The second front electrode (525) of the first coated quartz wafer (520) is connected to the bottom pad B (512) in sequence through electrode connection terminal b (522) and conductive adhesive (550). The first back electrode (526) of the first coated quartz wafer (520) is connected to the bottom pad A (511) in sequence through electrode connection terminal a (521) and conductive adhesive (550). The second coated quartz wafer (520) has electrode connection terminals c (531), e (532), and d (533) at its three corners; the third front electrode (534) of the second coated quartz wafer (530) is connected to the bottom pad C (513) in sequence through electrode connection terminal c (531) and conductive adhesive (550); the fourth front electrode (535) of the second coated quartz wafer (530) is connected to the bottom pad E (515) in sequence through electrode connection terminal e (532) and conductive adhesive (550); and the second back electrode (536) of the second coated quartz wafer (530) is connected to the bottom pad D (516) in sequence through electrode connection terminal d (533) and conductive adhesive (550).

5. The etching and fine-tuning device for a surface-mount filter according to claim 4, characterized in that: The test board (600) is arranged in an array of 8 test probe groups (610), each test probe group (610) has six probes (611), and the six probes (611) correspond to the electrode connection terminals of the first coated quartz wafer (520) and the second coated quartz wafer (530).

6. The etching fine-tuning device for a surface-mount filter according to claim 5, characterized in that: The mask hole group (421) is provided with 4 mask holes (4211).

7. The etching and fine-tuning device for a surface-mount filter according to claim 1, characterized in that: The drive mechanism (700) includes a stepper motor (710), a rotating rod (720), and a slide rail (730); the stepper motor (710) and the rotating rod (720) are both located inside the vacuum chamber (100), one end of the rotating rod (720) is connected to the output end of the stepper motor (710), and the other end is slidably connected to the carrier module (400); one end of the slide rail (730) is set inside the vacuum chamber (100), and the other end extends out of the vacuum chamber (100), and a limiter (740) is set in the middle of the slide rail (730); The bottom of the carrier module (400) is slidably connected to the slide rail (730); the side of the sliding boat (410) has an array of sliding boat positioning holes (411).

8. A fine-tuning method for an etching fine-tuning device for a surface-mount filter, characterized in that, Includes the following steps: Step 1: Load the surface-mount filter (500) into the carrier disk (430); Step 2: Contact the probes (611) of the test board (600) with the bottom pads of the surface-mount filter to detect the crystal oscillator frequency of the surface-mount filter (500). Step 3: The monitoring equipment is electrically connected to the test board (600) to receive the detection signal and monitor the crystal frequency, passband width and frequency deviation of the surface-mount filter (500); Step 4: Set the target parameter value of the etching device (200). The etching fine-tuning machine opens the baffle (340) according to the crystal oscillator frequency detected by the test board (600). The etching device (200) etches the electrode on the side of the first coated quartz wafer (520) and the second coated quartz wafer (530) that is too low to increase the frequency. When the frequency deviation of the two electrodes on the side of the first coated quartz wafer (520) and the second coated quartz wafer (530) tends to be consistent, the dual electrodes are simultaneously and alternately etched and fine-tuned so that the dual electrode frequencies of the first coated quartz wafer (520) and the second coated quartz wafer (530) meet the target setting value. Step 5: After the etching and fine-tuning of one set-top filter (500) is completed, the etching and fine-tuning machine control baffle (340) closes, and the drive mechanism (700) drives the carrier module (400) to move horizontally, moving the next set-top filter (500) directly above the baffle (340). Step 6: Repeat steps 2-5 to complete the fine-tuning of the surface-mount filter (500) within the entire carrier disk (430).

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