Support antenna and electronic device

Abstract

This invention discloses a bracket antenna and electronic device, including a metal bracket, a power supply contact, and a first ground contact. The metal bracket is disposed on one side of a motherboard and forms a cavity structure with the motherboard to form a resonant cavity. A radiation port is opened on the side of the resonant cavity. The power supply contact is disposed within the resonant cavity, with one end electrically connected to the RF feed line terminal of the motherboard and the other end electrically connected to the inner side of the metal bracket. The first ground contact is disposed around the resonant cavity, with one end electrically connected to the ground terminal of the motherboard and the other end electrically connected to the inner side of the metal bracket. This invention achieves multi-band radiation performance, high and low temperature frequency drift stability, and economical mass production of the entire device within a very small volume.

Description

Technical Field

[0001] This invention relates to the field of radio frequency antenna technology for mobile communication terminals, and more particularly to a bracket antenna and electronic device. Background Technology

[0002] As smart communication devices continue to iterate towards ultra-thin and ultra-full-screen designs, the overall thickness is constantly being reduced, leading to a continuous shrinking of the clearance area for antennas. This exacerbates the contradiction between antenna miniaturization and low-frequency communication performance. Existing communication devices with built-in FPC and LDS antennas have several inherent drawbacks: 1. Low-frequency performance limitations: Ultra-thin bodies restrict the physical size of antennas, resulting in insufficient electrical length in the 700MHz–900MHz low-frequency band, narrow resonant bandwidth, and low radiation efficiency, making it difficult to meet the requirements for multi-band coverage across all networks; 2. Poor temperature drift characteristics of traditional FPC and LDS antennas, with significant resonant frequency shifts under high and low temperature environments, resulting in insufficient RF stability; 3. Peripheral chips, shielding covers, and metal structural components on the motherboard cause significant interference to antenna radiation, further reducing antenna performance; 4. Independent antennas require separate assembly, increasing the number of components and production processes, which is detrimental to cost control. Summary of the Invention

[0003] The purpose of this invention is to provide a bracket antenna that can balance multi-band radiation performance, high and low temperature frequency drift stability, and mass production economy in a very small volume.

[0004] Another objective of this invention is to provide an electronic device that is thinner, has an antenna that can accommodate multi-band radiation, is stable in high and low temperature frequency drift, and is less expensive.

[0005] To achieve the above objectives, the present invention provides a bracket antenna, including a metal bracket, a power supply contact, and a first ground contact. The metal bracket is disposed on one side of a motherboard and forms a metal cavity structure with the motherboard to form a resonant cavity. A radiation port is provided on the side of the resonant cavity. The power supply contact is disposed in the resonant cavity and one end is electrically connected to the RF feed line terminal of the motherboard, and the other end is electrically connected to the inner side of the metal bracket. The first ground contact is disposed around the resonant cavity and one end is electrically connected to the ground terminal of the motherboard, and the other end is electrically connected to the inner side of the metal bracket.

[0006] Compared to existing technologies, this invention forms a resonant cavity by setting a metal cavity structure on the motherboard, and then setting a radiation port on the resonant cavity. A first feed contact electrically connects the motherboard's RF feed line to the inner surface of the resonant cavity, and a first ground contact electrically connects the motherboard's grounding terminal to the inner surface of the resonant cavity. This allows electromagnetic waves to be radiated outwards through electromagnetic resonance within the cavity and the radiation port. Compared to traditional FPC antennas, its size is significantly reduced, making it suitable for ultra-thin full-screen electronic devices with smaller thicknesses. Furthermore, by adjusting the position of the feed point, it can adapt to different frequency bands. The resonant cavity has the advantage of more stable resonant frequency drift under high and low temperature environments, significantly improving RF consistency. In addition, the fully enclosed metal cavity forms a natural electromagnetic shielding layer, isolating interference from the motherboard chip, shielding cover, and metal frame, improving antenna radiation efficiency. The resonant cavity is directly composed of the motherboard and metal bracket, eliminating the need for additional independent antenna components, reducing materials, simplifying assembly processes, and effectively reducing production costs.

[0007] Preferably, the feed contact is located at the radiation port. This directs the antenna beam outwards from the device, significantly reducing the intensity of electromagnetic radiation on the human side.

[0008] Preferably, a coupling slot is provided on the side of the resonant cavity, and the width of the coupling slot is less than or equal to 0.5 mm. By relying on the electromagnetic coupling of the slot to extend the high-frequency resonant bandwidth, a single antenna can be compatible with 700MHz low-frequency cellular, 5G Sub-6G, Wi-Fi 6 / 6E, and Bluetooth multi-mode communication bands.

[0009] Specifically, the coupling gap is sealed with plastic. This prevents impurities from entering the cavity, ensuring its cleanliness and minimizing electromagnetic interference within the cavity.

[0010] Preferably, the first grounding contact is a grounding foam and / or an extension of the metal bracket extending toward one side of the motherboard.

[0011] Preferably, the first ground contact is segmented, with the interval between adjacent segments being less than or equal to 0.5 mm. This prevents electromagnetic wave leakage, and the antenna resonant frequency can be finely adjusted by changing the arrangement and number of ground contacts, enabling rapid tuning of radio frequency performance.

[0012] Preferably, the metal support is a reinforcing steel sheet. By incorporating the reinforcing steel sheet, the overall structural strength and the continuity of the cavity grounding can be improved simultaneously.

[0013] Preferably, the bracket antenna further includes a second ground contact, which is disposed inside the resonant cavity and electrically connected at one end to the ground terminal of the main board, and at the other end to the inner surface of the metal bracket. By adding the second ground contact, the size of the resonant cavity can be adjusted, thereby adjusting the antenna resonant frequency and achieving rapid tuning of radio frequency performance.

[0014] Preferably, the sides of the metal bracket are also covered with plastic.

[0015] An electronic device includes a display screen, a mid-frame, a back cover, a motherboard, and a bracket antenna as described in any one of the above. The display screen is disposed on one side of the mid-frame, the back cover is disposed on the other side of the mid-frame, the motherboard is disposed within a device cavity formed between the display screen, the mid-frame, and the back cover, and the metal bracket is disposed on the side of the motherboard near the back cover. Attached Figure Description

[0016] Figure 1 This is a cross-sectional structural diagram of the support antenna of the present invention.

[0017] Figure 2 This is a structural diagram of the bracket antenna of the present invention arranged on the motherboard.

[0018] Figure 3 This is a cross-sectional structural diagram of the electronic device of the present invention. Detailed Implementation

[0019] To illustrate the technical content, structural features, objectives, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0020] Please see Figure 1 and Figure 2 The bracket antenna 100 of the present invention includes a metal bracket 1, a feed contact 2, and a first ground contact 3. The main board 200 is provided with an RF feed terminal 201 and multiple ground terminals 202. The metal bracket 1 is disposed on one side of the main board 200, and the main board 200 forms a metal cavity structure to form a resonant cavity 11. A radiation port 12 is opened on the side of the resonant cavity 11 adjacent to the main board 200. The feed contact 2 is disposed inside the resonant cavity 11, with one end electrically connected to the RF feed terminal 201 of the main board 200, and the other end electrically connected to the inner side of the metal bracket 1. The first ground contact 3 is disposed around the resonant cavity 11, with one end electrically connected to the ground terminal 202 of the main board 200, and the other end electrically connected to the inner side of the metal bracket 11.

[0021] Please see again Figure 1 and Figure 2The first grounding contact 3 is an extension of grounding foam and / or metal bracket 1 extending towards the motherboard side. The grounding foam or the extension of the metal bracket 1 allows a cavity antenna to be formed between the metal bracket 1 and the motherboard 200. The first grounding contact 3 is segmented, with a spacing 31 between adjacent segments less than or equal to 0.5 mm. To prevent electromagnetic wave leakage, the antenna resonant frequency can be fine-tuned by adjusting the arrangement and number of grounding contacts, enabling rapid RF performance tuning to adapt to different communication frequency bands. The feed contact 2 is located at the radiation port 12. By placing the radiation port 12 on the outside, the antenna beam is directed outwards, significantly reducing the electromagnetic radiation intensity on the human side. The width of the radiation port 12 is greater than 0.5 mm. Furthermore, a gradient grounding array is formed on the motherboard 200. This gradient grounding array refers to multiple reserved grounding positions used to adjust the cavity size, thereby achieving resonant tuning.

[0022] Please see again Figure 2 The resonant cavity 11 has a coupling slot 13 on its side, and the width of the coupling slot 13 is less than or equal to 0.5 mm. The coupling slot 13 can be a slot formed between the metal bracket 11 and the motherboard 200, or it can be a slot opened on the metal bracket 11. In this way, by relying on the electromagnetic coupling of the slot to extend the high-frequency resonant bandwidth, a single antenna can be compatible with 700MHz low-frequency cellular, 5G Sub-6G, Wi-Fi 6 / 6E, and Bluetooth multi-mode communication bands. Specifically, the coupling slot 13 is sealed and filled with plastic. This can prevent impurities from entering the cavity, ensure the cleanliness of the cavity, and prevent electromagnetic waves from being interfered with within the cavity.

[0023] Please see Figure 1 and Figure 2 The metal bracket 1 is a reinforcing steel sheet 14. By using the reinforcing steel sheet 14, the structural strength of the entire machine and the continuity of the cavity grounding can be improved simultaneously.

[0024] Please see again Figure 1 The bracket antenna 100 further includes a second ground contact 4, which is disposed inside the resonant cavity 11. One end of the second ground contact 4 is electrically connected to the ground terminal 202 of the main board 200, and the other end is electrically connected to the inner surface of the resonant cavity 11. By adding the second ground contact 4, the size of the resonant cavity 11 can be adjusted, thereby adjusting the antenna resonant frequency and achieving rapid tuning of radio frequency performance. The second ground contact 4 can be grounding materials such as grounding foam or spring sheets.

[0025] Please see Figure 3The present invention also discloses an electronic device comprising a display screen 300, a mid-frame 400, a back cover 500, a motherboard 200, and a bracket antenna 100. The display screen 300 is disposed on one side of the mid-frame 400, and the back cover 500 is disposed on the other side of the mid-frame 400. The motherboard 200 is disposed within the device cavity formed between the display screen 300, the mid-frame 400, and the back cover 500. The bracket antenna 100 is disposed on the side of the motherboard 200 near the back cover 500. The electronic device of the present invention utilizes the bracket antenna 100, allowing for a thinner overall electronic device, such as a thinner mobile phone or tablet, and is also suitable for communication devices such as POS machines. Furthermore, the electronic device can accommodate multi-band radiation and has a lower cost.

[0026] Compared with existing technologies, this invention forms a resonant cavity 11 by setting a metal cavity structure on the motherboard 200, and then sets a radiation port 12 on one side of the resonant cavity 11. A first feed contact 2 electrically connects the RF feed line terminal 201 of the motherboard 200 to the inner side of the resonant cavity 11, and a first ground contact 3 electrically connects the ground terminal 202 of the motherboard 200 to the inner side of the resonant cavity 11. This allows electromagnetic waves to be radiated outwards through electromagnetic resonance within the cavity and through the radiation port 12. Compared with traditional FPC antennas, its size is significantly reduced, making it suitable for ultra-thin full-screen electronic devices with smaller thicknesses. Furthermore, the antenna beam radiates outwards along the radiation port 12 towards the outside of the device, greatly reducing the electromagnetic radiation intensity on the human body side. In addition, multiple ground terminals 202 are set on the motherboard 200, allowing for adaptation to different frequency bands by adjusting the position of the feed points. Moreover, the resonant cavity 11 also has the advantage of more stable resonant frequency drift under high and low temperature environments, significantly improving RF consistency. In addition, the fully enclosed metal cavity forms a natural electromagnetic shielding layer, isolating the motherboard 200 chip, shielding cover, and metal frame 400 from interference, thus improving antenna radiation efficiency. The resonant cavity is directly composed of the motherboard 200 and the metal bracket 1, eliminating the need for additional independent antenna components, reducing materials, simplifying assembly processes, and effectively reducing production costs.

[0027] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the scope of the present invention are still within the scope of the present invention.

Claims

1. A bracket antenna, characterized in that: The device includes a metal bracket, a power supply contact, and a first ground contact. The metal bracket is disposed on one side of the motherboard and forms a cavity structure with the motherboard to form a resonant cavity. A radiation port is opened on the side of the resonant cavity. The power supply contact is disposed in the resonant cavity, with one end electrically connected to the RF feed line terminal of the motherboard and the other end electrically connected to the inner side of the metal bracket. The first ground contact is disposed around the resonant cavity, with one end electrically connected to the ground terminal of the motherboard and the other end electrically connected to the inner side of the metal bracket.

2. The bracket antenna according to claim 1, characterized in that: The power supply contact is located at the radiation port.

3. The bracket antenna according to claim 1, characterized in that: The resonant cavity has a coupling slot on its side, and the width of the coupling slot is less than or equal to 0.5 mm.

4. The bracket antenna according to claim 3, characterized in that: The coupling gap is sealed and filled with plastic.

5. The bracket antenna according to claim 1, characterized in that: The first grounding contact is a grounding foam and / or an extension of the metal bracket extending toward one side of the motherboard.

6. The bracket antenna according to claim 1, characterized in that: The first grounding contact is segmented, with the interval between two adjacent segments being less than or equal to 0.5 mm.

7. The bracket antenna according to claim 1, characterized in that: The metal support is made of reinforcing steel sheet.

8. The bracket antenna according to claim 1, characterized in that: The bracket antenna also includes a second ground contact, which is located inside the resonant cavity and is electrically connected at one end to the ground terminal of the motherboard and at the other end to the inner side of the metal bracket.

9. The bracket antenna according to claim 1, characterized in that: The sides of the metal bracket are also covered with plastic.

10. An electronic device, characterized in that: The device includes a display screen, a mid-frame, a rear cover, a motherboard, and a bracket antenna as described in any one of claims 1 to 9. The display screen is disposed on one side of the mid-frame, the rear cover is disposed on the other side of the mid-frame, the motherboard is disposed within the device cavity formed between the display screen, the mid-frame, and the rear cover, and the bracket antenna is disposed on the side of the motherboard closer to the rear cover.

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