Electronic device

Abstract

This application discloses an electronic device, belonging to the field of electronic device technology. The electronic device includes: a first frame portion, a second frame portion, and an interdigitated structure; the second frame portion is spaced apart from the first frame portion; the interdigitated structure is disposed between the first frame portion and the second frame portion; the interdigitated structure includes interdigitated units, each interdigitated unit including at least two rows of oppositely arranged and interleaved conductive interdigitated fingers, the conductive interdigitated fingers extending along the arrangement direction of the first frame portion and the second frame portion, adjacent conductive interdigitated fingers in the same row being spaced apart, and adjacent conductive interdigitated fingers in different rows being isolated from each other.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] With the increasing performance of mobile devices, overheating has become a prominent issue, easily leading to excessively high temperatures in the grip area and posing a risk of low-temperature burns, thus affecting the user experience. To reduce the surface temperature of the bezel, a heat insulation structure is typically installed between the bezel and the frame to reduce heat transfer between them, thereby lowering the bezel surface temperature and achieving a low-temperature design. However, the antenna on the bezel requires grounding and signal return from the frame, and the heat insulation structure can interfere with the electromagnetic environment of the antenna, potentially causing problems such as resonance shift, narrowed bandwidth, and decreased radiation efficiency in the antenna's radio frequency signal. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device that can reduce the surface temperature of the frame while ensuring stable transmission of antenna radio frequency signals.

[0004] In a first aspect, embodiments of this application provide an electronic device comprising: a first frame portion, a second frame portion, and an interdigitated structure; the second frame portion and the first frame portion are spaced apart; the interdigitated structure is disposed between the first frame portion and the second frame portion; the interdigitated structure includes interdigitated units, each interdigitated unit comprising at least two rows of oppositely arranged and interleaved conductive interdigitated fingers, the conductive interdigitated fingers extending along the arrangement direction of the first frame portion and the second frame portion, adjacent conductive interdigitated fingers in the same row being spaced apart, and adjacent conductive interdigitated fingers in different rows being isolated from each other.

[0005] In this embodiment, the electronic device employs a forked-finger structure comprising at least two rows of opposing and interlaced conductive forked fingers between a first frame portion and a second frame portion spaced apart. The conductive forked fingers extend along the arrangement direction of the first and second frame portions. Adjacent conductive forked fingers within the same row are spaced apart, while adjacent conductive forked fingers in different rows are isolated from each other. On one hand, the interlaced and non-directly contacting conductive forked fingers form a continuous and stable electrical signal transmission path between the first and second frame portions, satisfying the conductivity requirements for antenna grounding and signal return, avoiding damage to the antenna's electromagnetic environment, and ensuring stable antenna radio frequency performance. On the other hand, the non-directly contacting physical interaction of the forked-finger structure forms a heat insulation path between the first and second frame portions, reducing direct heat conduction from the second frame portion to the first frame portion, decreasing the heat transfer contact area, reducing heat transfer efficiency, improving heat insulation effect, and lowering the surface temperature of the first frame portion to avoid low-temperature burns, while ensuring the electrical signal transmission performance required for normal antenna operation. This achieves a balance between heat insulation effect and stable transmission of antenna radio frequency signals. Attached Figure Description

[0006] Figure 1 This is one of the structural diagrams of a mobile terminal provided by related technologies;

[0007] Figure 2 This is the second structural diagram of a mobile terminal provided by related technologies;

[0008] Figure 3 This is one of the structural schematic diagrams of the electronic device provided in the embodiments of this application;

[0009] Figure 4 This is a simulation diagram of the filtering effect of the interdigital structure provided in the embodiments of this application;

[0010] Figure 5 This is a second schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0011] Figure 6 This is a schematic diagram of the interdigitated structure provided in the embodiments of this application;

[0012] Figure 7 This is a schematic diagram of the electronic device's workflow provided in the embodiments of this application;

[0013] Figure 8 This is the third schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0014] Figure 9 This is the fourth schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0015] Figure 10 This is the fifth schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0016] Figure 11 This is the sixth schematic diagram of the structure of the electronic device provided in the embodiments of this application.

[0017] Reference numerals: 10', frame; 20', frame; 30', metal bridge structure; 10, electronic device; 100, first frame part; 200, second frame part; 300, interdigitated structure; 310, interdigitated unit; 301, conductive interdigitated finger; 320, buffer layer; 400, carrier substrate; 401, reflector; 500, excitation unit; 600, composite heat insulation layer; 610, low thermal conductivity material layer; 620, auxiliary protective heat insulation layer; 312, first conductive interdigitated finger group; 314, second conductive interdigitated finger group; 700, heat insulation medium. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0019] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0020] In related technologies, when a user holds a mobile device and uses it continuously at high performance, the temperature of the device rises. The temperature at the edge of the device can reach approximately 44.5 to 45.5 degrees Celsius, while the temperature in the center can reach approximately 41.0 to 42.5 degrees Celsius. Prolonged holding of a mobile device at these temperatures can easily lead to low-temperature burns. To reduce the temperature of the grip area of ​​electronic devices, a so-called "low-temperature bezel" design is typically used. For example... Figure 1 and Figure 2 As shown, a common approach is to connect a metal bridge structure 30' made of a high thermal resistance material between the frame 10' and the housing 20' of the mobile terminal to achieve heat insulation. However, these high thermal resistance materials are usually located near the antenna clearance area or antenna breakpoints, which can interfere with the antenna's electromagnetic environment and lead to a degrade in antenna performance.

[0021] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0022] like Figure 3 As shown, this application provides an electronic device 10, including: a first frame portion 100, a second frame portion 200, and an interdigital structure 300; the second frame portion 200 is spaced apart from the first frame portion 100; the interdigital structure 300 is disposed between the first frame portion 100 and the second frame portion 200; the interdigital structure 300 includes interdigital units 310, each interdigital unit 310 including at least two rows of oppositely arranged and interleaved conductive interdigitals 301, the conductive interdigitals 301 extending along the arrangement direction of the first frame portion 100 and the second frame portion 200, adjacent conductive interdigitals 301 in the same row being spaced apart, and adjacent conductive interdigitals 301 in different rows being isolated from each other.

[0023] In the above embodiments, the electronic device 10 provides a finger structure 300 between the spaced-apart first frame portion 100 and second frame portion 200, comprising at least two rows of opposing and interlaced conductive interdigitated fingers 301. The conductive interdigitated fingers 301 extend along the arrangement direction of the first frame portion 100 and the second frame portion 200. Adjacent conductive interdigitated fingers 301 within the same row are spaced apart, and adjacent conductive interdigitated fingers 301 in different rows are isolated from each other. This interlaced and non-directly contacting conductive interdigitated fingers 301 allows for the formation of a continuous and stable electrical signal transmission path between the first frame portion 100 and the second frame portion 200, satisfying the requirements of antenna connection... The ground and signal return current require conductive conduction to avoid damaging the antenna's electromagnetic environment and ensure stable antenna RF performance. On the other hand, by using the interdigitated structure 300 for non-direct contact physical connection, a heat insulation path can be formed between the first frame 100 and the second frame 200, reducing the direct conduction of heat from the second frame 200 to the first frame 100, reducing the heat transfer contact area, reducing heat transfer efficiency, improving heat insulation effect, and lowering the surface temperature of the first frame 100 to avoid low-temperature burns, while ensuring the electrical signal transmission performance required for normal antenna operation, thus achieving a balance between heat insulation effect and stable transmission of antenna RF signals.

[0024] Figure 3 The direction pointed to by the middle arrow L is the arrangement direction of the first frame part 100 and the second frame part 200.

[0025] It is understandable that the mutual isolation between adjacent conductive interdigitates 301 in different rows means that adjacent conductive interdigitates 301 in different rows are arranged at intervals to maintain electrical isolation or a high-resistance state, avoiding direct electrical conduction. This arrangement can achieve the electrical isolation required for electrical signal transmission, and also helps to reduce heat conduction. It is understandable that the interdigital structure 300 can constitute an interdigital transducer, which excites surface acoustic waves through electric field coupling. The surface acoustic waves propagate along the piezoelectric substrate to the other end and are then converted into electrical signals through the reverse process, thereby realizing non-direct contact transmission of electrical signals between the first frame portion 100 and the second frame portion 200, satisfying the conduction requirements for antenna grounding and signal return.

[0026] Understandably, the interdigitated structure 300, due to its staggered, spaced, and insulated arrangement, possesses filtering characteristics. It can selectively allow useful antenna signals to pass through while filtering out other interference signals outside the frequency band, thereby achieving high signal isolation and preventing the antenna from being affected by clutter. The 2.4GHz to 2.5GHz frequency band is the typical operating frequency band for WiFi (Wireless Fidelity) and Bluetooth communication in electronic devices. For example, for useful antenna signals in the 2.4GHz to 2.5GHz range, the interdigitated structure 300 can effectively suppress unwanted interference signals outside this frequency band, achieving high isolation from unwanted signals. The above filtering effect can be verified through simulation results, such as... Figure 4 As shown, the horizontal axis represents the signal frequency, ranging from 2.10 GHz to 2.50 GHz; where freq (frequency) is the unit of frequency in GHz; the vertical axis represents the signal transmission amplitude from port 1 input and port 2 output, S(2,1) is the forward transmission coefficient in the S-parameters, and dB is the logarithmic unit representing the power / amplitude ratio in the radio frequency field; the curve maintains a high transmission characteristic close to 0 dB in the 2.40 GHz to 2.50 GHz band, corresponding to resonant transmission within the preset frequency band; the signal is significantly attenuated in the 2.10 GHz to 2.35 GHz band, achieving suppression of interference signals outside the preset frequency band.

[0027] For example, the first frame portion 100 can serve as the frame of the electronic device 10, and the second frame portion 200 can serve as the middle frame of the electronic device 10. The electronic device 10 can significantly reduce the holding temperature of the frame of the electronic device 10 while ensuring the electrical signal transmission performance required for the normal operation of the antenna, improve the user experience of the low-temperature frame, and avoid low-temperature burns caused by prolonged holding.

[0028] For example, in at least two rows of conductive interdigits 301, one row of conductive interdigits 301 can serve as the antenna ground terminal, and the other row of conductive interdigits 301 can be used to realize signal return, further ensuring the stability of the antenna's radio frequency performance.

[0029] like Figure 3 As shown, in some embodiments of this application, there are multiple interdigitated units 310, which are arranged sequentially along the direction from the first frame portion 100 to the second frame portion 200, and adjacent interdigitated units 310 are made of materials with different thermal conductivity.

[0030] In the above embodiment, there are multiple interdigitated units 310, which are arranged sequentially along the direction from the first frame portion 100 to the second frame portion 200. Adjacent interdigitated units 310 are made of materials with different thermal conductivity. The different thermal conductivity creates a difference in thermal resistance between the materials. When heat passes through multiple interdigitated units 310, it will be lost in stages due to the difference in thermal resistance. This causes the heat to be continuously attenuated as it passes through multiple interdigitated units 310, further increasing the resistance to heat transfer from the second frame portion 200 to the first frame portion 100, improving the overall heat insulation effect of the electronic device 10, and reducing the surface temperature of the first frame portion 100. Meanwhile, multiple interdigital units 310 can work with a piezoelectric substrate to form a multi-stage interdigital transducer, achieving non-contact cross-stage transmission of electrical signals through the piezoelectric / inverse piezoelectric effect: after the electrical signal enters the first-stage interdigital unit through the frame, it is excited to generate surface acoustic waves and propagate along the substrate. Subsequent interdigital units 310 sequentially complete the conversion of acoustic waves and electrical signals, and finally transmit the electrical signal to the second frame 200. While realizing signal transmission, heat is avoided from being conducted along with the signal through the contact path.

[0031] For example, Figure 3 Arrows A, B, and N in the diagram represent materials with different thermal conductivity properties.

[0032] like Figure 3 As shown, in some embodiments of this application, the interdigitated structure 300 further includes:

[0033] A buffer layer 320 is disposed between two adjacent interdigitated units 310.

[0034] In the above embodiment, the buffer layer 320 is disposed between two adjacent interdigital units 310. The buffer layer 320 occupies the space between the adjacent interdigital units 310, avoiding direct contact between the adjacent interdigital units 310 to form a rapid heat transfer channel. The buffer layer 320 itself has low thermal conductivity, which can further cut off the heat transfer path, reduce the heat transfer speed, improve the overall heat insulation performance of the electronic device 10, and at the same time maintain the relative position of the adjacent interdigital units 310 to ensure the structural stability of the interdigital structure 300.

[0035] like Figure 5 As shown, in some embodiments of this application, the electronic device 10 further includes:

[0036] The carrier substrate 400 is connected to the first frame portion 100 and the second frame portion 200, and the interdigitated structure 300 is disposed on the carrier substrate 400.

[0037] In the above embodiment, the carrier substrate 400 is connected to the first frame portion 100 and the second frame portion 200. The interdigitated structure 300 is disposed on the carrier substrate 400. The carrier substrate 400 provides a fixed mounting base for the interdigitated structure 300, so that the conductive interdigitated fingers 301 maintain a preset staggered position, spacing and extension direction, avoid displacement or deformation of the conductive interdigitated fingers 301, ensure that the electrical signal is transmitted stably according to the preset path, and at the same time maintain the integrity of the heat insulation path to ensure stable heat insulation effect.

[0038] For example, the interdigitated structure 300 is fabricated on a single heat-insulating substrate, so that heat can only be transferred from the direction of the interdigitated structure 300 on the surface.

[0039] In some embodiments of this application, the carrier substrate 400 is a piezoelectric substrate; and / or the carrier substrate 400 is a heat-insulating substrate.

[0040] In the above embodiments, the carrier substrate 400 is a piezoelectric substrate. Under the influence of an electric field, the piezoelectric substrate can generate mechanical vibration, which, in conjunction with the interdigital structure 300, enables the mutual conversion between electrical signals and surface acoustic wave signals, allowing the antenna signal to be transmitted in a low-loss manner. The carrier substrate 400 is also a heat-insulating substrate. The heat-insulating substrate itself has a low thermal conductivity, which directly prevents heat from passing through the substrate from the second frame portion 200 to the first frame portion 100, thus enhancing the overall heat insulation capability of the electronic device 10. The carrier substrate 400 can be both a piezoelectric substrate and a heat-insulating substrate.

[0041] like Figure 6 As shown, in some embodiments of this application, at least two reflective electrodes 401 are provided on the carrier substrate 400, and the reflective electrodes 401 are disposed at opposite ends in the arrangement direction of the conductive interdigitates 301.

[0042] In the above embodiment, at least two reflectors 401 are provided on the carrier substrate 400. The reflectors 401 are located at opposite ends in the direction of the arrangement of the conductive interdigitates 301. The reflectors 401 can reflect the outwardly diffused surface acoustic wave signal back to the transmission path, avoid the signal energy from being lost to the side, concentrate the signal and propagate it in a preset direction, improve the signal transmission strength and transmission efficiency, and ensure the stability of the antenna radio frequency performance.

[0043] Figure 6 In the diagram, the direction indicated by arrow W is the arrangement direction of the conductive interdigitators 301.

[0044] like Figure 6 As shown, in some embodiments of this application, the electronic device 10 further includes:

[0045] Excitation unit 500 is connected to interdigitated structure 300 and is used to apply alternating electric field excitation to interdigitated structure 300.

[0046] In the above embodiment, the excitation unit 500 is connected to the interdigital structure 300. The excitation unit 500 applies an alternating electric field to the interdigital structure 300. The alternating electric field acts on the piezoelectric substrate and the conductive interdigital fingers 301, causing the piezoelectric substrate to generate an inverse piezoelectric effect, thereby exciting surface acoustic waves propagating along the surface of the substrate. After the surface acoustic waves are transmitted to the other end, they are converted back into electrical signals through the piezoelectric effect, realizing a stable bidirectional conversion between electrical signals and acoustic signals, and ensuring smooth transmission of antenna signals.

[0047] For example, such as Figure 7 As shown, S1: The antenna operates, and the electrical signal enters the first-stage interdigital unit through the first frame; this realizes the input and guidance of the antenna signal, allowing the electrical signal to enter the starting end of the signal conversion link. S2: The excitation unit corresponding to the first-stage interdigital unit generates an alternating electric field; this provides alternating electric field excitation for the first-stage conductive interdigital unit, driving the occurrence of the inverse piezoelectric effect. S3: The first-stage conductive interdigital unit exhibits the inverse piezoelectric effect; it converts the input electrical signal into mechanical energy, exciting the supporting substrate to vibrate. S4: Surface acoustic waves are generated on the supporting substrate; these form surface acoustic waves propagating along the substrate, realizing the conversion of electrical signals to acoustic signals. S5: The excitation unit corresponding to the second-stage interdigital unit generates an alternating electric field; this provides alternating electric field excitation for the second-stage conductive interdigital unit, driving the occurrence of the piezoelectric effect. S6: The second-stage conductive interdigital unit exhibits the piezoelectric effect; it converts the propagating surface acoustic waves back into electrical signals, realizing the conversion of acoustic signals to electrical signals. S7: The acoustic wave is converted into an electrical signal and enters the third-stage interdigital unit; this completes the cross-stage transmission of the electrical signal, entering the next stage of conversion. Similarly, S8: The nth conductive interdigitates generate an electrical signal through the piezoelectric effect and enter the second frame; finally, the surface acoustic wave is converted into an electrical signal and transmitted to the second frame, realizing the non-direct contact transmission of the electrical signal between different frames, ensuring smooth transmission of the antenna signal, and at the same time avoiding heat transfer from the first frame to the second frame through contact conduction.

[0048] like Figure 8 As shown, in some embodiments of this application, the electronic device 10 further includes a composite heat insulation layer 600; the composite heat insulation layer 600 covers the interdigitated structure 300 and covers at least a portion of the carrier substrate 400.

[0049] In the above embodiments, the composite heat insulation layer 600 covers the interdigitated structure 300 and covers at least part of the carrier substrate 400. The composite heat insulation layer 600 forms a closed heat insulation layer around the interdigitated structure 300 and the carrier substrate 400, blocking the transfer of heat through air, surface radiation, etc., reducing the diffusion of internal heat to the outside and the conduction of external heat to the inside, greatly improving the overall heat insulation capability of the electronic device 10, and effectively reducing the surface temperature of the first frame portion 100.

[0050] like Figure 8 and Figure 9As shown, in some embodiments of this application, the composite thermal insulation layer 600 includes a low thermal conductivity material layer 610 and an auxiliary protective thermal insulation layer 620; the low thermal conductivity material layer 610 is disposed on the carrier substrate 400 and the interdigitated structure 300; the auxiliary protective thermal insulation layer 620 is disposed on the low thermal conductivity material layer 610.

[0051] In the above embodiment, a low thermal conductivity material layer 610 is applied to the surface of the carrier substrate 400 and the interdigitated structure 300, and an auxiliary protective heat insulation layer 620 is applied to the outside of the low thermal conductivity material layer 610. The low thermal conductivity material layer 610 preferentially blocks the main heat transfer, and the auxiliary protective heat insulation layer 620 further blocks the remaining heat transfer on the outside. The double-layer structure weakens the heat layer by layer and synergistically improves the heat insulation effect. At the same time, it forms physical protection for the internal interdigitated structure 300 and the carrier substrate 400 to avoid structural damage.

[0052] In some embodiments of this application, the low thermal conductivity material layer 610 is an aerogel layer, and the auxiliary protective heat insulation layer 620 is a ceramic fiber layer.

[0053] In the above embodiments, the low thermal conductivity material layer 610 is an aerogel layer. The porous structure inside the aerogel layer can significantly reduce the heat conduction efficiency and achieve efficient heat insulation. The auxiliary protective heat insulation layer 620 is a ceramic fiber layer. The ceramic fiber layer is heat-resistant and structurally stable, which can further help block heat and protect the internal aerogel layer and interdigitated structure 300 from external damage, thereby improving the overall stability and durability of the electronic device 10.

[0054] like Figure 10 and Figure 11 As shown, in some embodiments of this application, at least two rows of relatively arranged and interlaced conductive interdigitates 301 include a first conductive interdigitate group 312 and a second conductive interdigitate group 314. The first conductive interdigitate group 312 is disposed in the second frame portion 200; the second conductive interdigitate group 314 is disposed in the first frame portion 100.

[0055] In the above embodiment, the first conductive interdigital group 312 is disposed in the second frame portion 200, and the second conductive interdigital group 314 is disposed in the first frame portion 100. The two sets of conductive interdigital fingers 301 are directly formed by relying on the corresponding frame structure, without the need for additional setting, thereby reducing the space occupied by the electronic device 10, simplifying the assembly process, and reducing material and production costs.

[0056] For example, the first conductive interdigital group 312 is formed by extending from the metal body of the second frame portion 200, and the second conductive interdigital group 314 is formed by extending from the metal body of the first frame portion 100. Electrical signals are transmitted through electric field coupling between the conductive interdigitals 301, and heat is conducted through physical contact. The two conduction paths are independent of each other, which can simultaneously realize the functions of electrical signal transmission and heat insulation.

[0057] For example, the second conductive interdigital group 314 can serve as the antenna ground terminal, and the first conductive interdigital group 312 can realize signal return, further ensuring the stability of the antenna's radio frequency performance.

[0058] like Figure 11 As shown, in some embodiments of this application, the interdigital unit 310 further includes a heat insulation medium 700; the heat insulation medium 700 is disposed between adjacent conductive interdigitals 301 in different rows.

[0059] In the above embodiments, the heat insulation medium 700 is disposed between adjacent conductive interdigitates 301 in different rows. The heat insulation medium 700 can fill the gap between adjacent conductive interdigitates 301 in different rows, block heat from being directly transferred through the gap, improve the heat insulation effect, and at the same time keep adjacent conductive interdigitates 301 in different rows isolated to avoid short circuit of electrical signals and ensure normal transmission of electrical signals.

[0060] For example, the thermal insulation medium 700 is disposed between the first conductive interdigital group 312 and the second conductive interdigital group 314.

[0061] For example, the thermal insulation medium 700 may be a high thermal resistance and insulating medium material, such as magnesium oxide, ceramic silicone, etc.

[0062] In some embodiments of this application, the interdigitated structure 300 is configured to have resonant transmission characteristics within a preset frequency band.

[0063] In the above embodiments, by adapting the interdigital structure 300 to enable it to have resonant transmission characteristics within a preset frequency band, the transmission loss of useful signals of the antenna can be reduced, and signals within the preset operating frequency band can be transmitted efficiently, thereby ensuring antenna signal strength and transmission quality and maintaining stable antenna RF performance.

[0064] For example, the resonant transmission requirements in the 2.4 GHz to 2.5 GHz frequency band can be met by configuring the parameters of the interdigital structure 300.

[0065] In some embodiments of this application, the interdigitated structure 300 is configured to attenuate signals outside a preset frequency band.

[0066] In the above embodiments, by adapting the interdigitated structure 300, signals outside the preset frequency band are attenuated, which can suppress and effectively filter out interference signals outside the frequency band during transmission, improve the antenna signal isolation, and avoid interference from clutter signals to the normal operation of the antenna.

[0067] For example, the attenuation and filtering of interference signals in frequency bands outside 2.4 GHz to 2.5 GHz can be achieved by configuring the interdigitated structure 300 parameters.

[0068] For example, electronic device 10 is a mobile phone, tablet, laptop computer, or other device.

[0069] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0070] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: First frame section; The second frame portion is spaced apart from the first frame portion; An interdigitated structure is disposed between the first frame portion and the second frame portion; the interdigitated structure includes interdigitated units, each interdigitated unit including at least two rows of oppositely arranged and interlaced conductive interdigitated fingers, the conductive interdigitated fingers extending along the arrangement direction of the first frame portion and the second frame portion, adjacent conductive interdigitated fingers in the same row being spaced apart, and adjacent conductive interdigitated fingers in different rows being isolated from each other.

2. The electronic device according to claim 1, characterized in that, The number of interdigitated units is multiple, arranged sequentially along the direction from the first frame portion to the second frame portion, and adjacent interdigitated units are made of materials with different thermal conductivity.

3. The electronic device according to claim 1, characterized in that, The interdigitated structure further includes: A buffer layer is disposed between two adjacent interdigital units.

4. The electronic device according to claim 1, characterized in that, Also includes: A carrier substrate is connected to the first frame portion and the second frame portion, and the interdigitated structure is disposed on the carrier substrate.

5. The electronic device according to claim 4, characterized in that, The carrier substrate is a piezoelectric substrate; and / or The supporting substrate is a heat-insulating substrate.

6. The electronic device according to claim 4, characterized in that, The substrate is provided with at least two reflective electrodes, which are located at opposite ends in the direction of the conductive interdigitated fingers.

7. The electronic device according to claim 4, characterized in that, Also includes: An excitation unit, which is connected to the interdigitated structure, is used to apply an alternating electric field excitation to the interdigitated structure.

8. The electronic device according to claim 4, characterized in that, Also includes: A composite thermal insulation layer is wrapped around the interdigitated structure and covers at least a portion of the supporting substrate.

9. The electronic device according to claim 8, characterized in that, The composite thermal insulation layer includes: A low thermal conductivity material layer is applied to the carrier substrate and the interdigitated structure; An auxiliary protective heat insulation layer is applied over the low thermal conductivity material layer.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The interdigitated unit further includes: The insulating medium is placed between adjacent conductive interdigitates in different rows.

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