An intelligent reflectarray panel

CN122552831APending Publication Date: 2026-08-11BEIJING BOE TECH DEV CO LTD +1
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-26
Publication Date
2026-08-11

Smart Images

  • Figure CN122552831A_ABST
    Figure CN122552831A_ABST
Patent Text Reader

Abstract

A smart reflective panel. The smart reflective panel includes: a driving layer, a ground layer, and a radiating layer, wherein the driving layer, the ground layer, and the radiating layer are stacked sequentially, and a dielectric layer is disposed between any two adjacent layers; the driving layer includes a ground wire and multiple driving units, the multiple driving units being electrically connected to the same ground wire.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This disclosure pertains to the field of wireless communication technology, specifically relating to an intelligent reflective panel. Background Technology

[0002] RIS reflector arrays are reconfigurable smart surfaces based on reflector array technology and are one of the key technologies in the field of 6G wireless communication. RIS reflector arrays can effectively eliminate wireless communication signal blind spots. By deploying RIS reflector arrays between base stations and signal blind spots, wireless communication signals can be reflected and transmitted, thereby enhancing the signal quality for users in blind spots and ensuring the needs of users in coverage-deficient areas are met. Summary of the Invention

[0003] This disclosure provides an intelligent reflective panel, which includes a driving layer, a ground layer, and a radiating layer, wherein the driving layer, the ground layer, and the radiating layer are stacked sequentially, and a dielectric layer is disposed between any two adjacent layers;

[0004] The driving layer includes a grounding wire and multiple driving units, which are electrically connected to the same grounding wire.

[0005] In some embodiments, the plurality of drive units are arranged in a first array;

[0006] The grounding wire includes a first branch and multiple second branches. The first branch extends along the column direction of the first array, and the second branches extend along the row direction of the first array. The first branch and the multiple second branches are electrically connected respectively.

[0007] In the first array, a second branch is provided between adjacent odd-numbered rows and even-numbered rows of driving units, and adjacent odd-numbered rows and even-numbered rows of driving units are electrically connected to the second branch located between them.

[0008] The first branch is located between the drive units in the middle of the first array, between the odd-numbered columns and the even-numbered columns.

[0009] In some embodiments, any two adjacent rows of the driving units in the first array are located in odd columns and even columns, respectively;

[0010] The second branch line includes a main line, a plurality of first branches and a plurality of second branches, wherein the main line is electrically connected to the plurality of first branches and the plurality of second branches respectively;

[0011] The main line is a wavy broken line and extends along the row direction of the first array;

[0012] In two adjacent rows of driving units, the driving unit located in the odd-numbered column includes a first grounding terminal, and the driving unit located in the even-numbered column includes a second grounding terminal, wherein the length direction of the first grounding terminal is perpendicular to the length direction of the second grounding terminal;

[0013] The first branch is electrically connected to the first grounding terminal, and the second branch is electrically connected to the second grounding terminal;

[0014] At least a portion of the first branch extends in a direction perpendicular to the direction of extension of the second branch.

[0015] In some embodiments, the first branch is a wavy broken line.

[0016] In some embodiments, a control circuit board is also included, the control circuit board including a third ground terminal;

[0017] At least one end of the first branch extends along the column direction of the first array to the corresponding side edge of the periphery of the first array and is electrically connected to a first connection end disposed at the corresponding side edge.

[0018] The first connection terminal is electrically connected to the third grounding terminal.

[0019] In some embodiments, a control circuit board is also included, the control circuit board including a third ground terminal;

[0020] The smart reflective panel also includes a bonding connection end located on opposite sides along the direction of the first array row;

[0021] At least one end of the first branch extends to be electrically connected to the binding connection end;

[0022] The intelligent reflective panel also includes a flexible circuit board, one end of which is bonded to the binding connection end, and the other end is electrically connected to the third grounding end.

[0023] In some embodiments, a control circuit board is also included, the control circuit board including a third ground terminal;

[0024] The smart reflective panel also includes a bonding connection end located on opposite sides along the direction of the first array row;

[0025] At least one end of any of the second branches extends to be electrically connected to the binding connection end;

[0026] The intelligent reflective panel also includes a flexible circuit board, one end of which is bonded to the binding connection end, and the other end is electrically connected to the third grounding end.

[0027] In some embodiments, the width of the first branch is greater than the width of the second branch;

[0028] At the connection point between the first branch and the second branch, the line width gradually decreases from the first branch to the second branch.

[0029] In some embodiments, the linewidth of the first branch line ranges from 300 to 800 μm.

[0030] In some embodiments, the driving unit includes an integrated circuit and multiple radio frequency lines, the multiple radio frequency lines being located around the integrated circuit and electrically connected to the integrated circuit;

[0031] The line width of the radio frequency line is greater than the line width of the first branch line;

[0032] The distance between the first branch and the radio frequency line is greater than 1 mm.

[0033] In some embodiments, the system further includes multiple sets of power lines, each set including multiple power lines, and the multiple power lines in each set respectively transmit different power signals;

[0034] The power lines extend along the row direction of the first array;

[0035] The plurality of drive units and the plurality of power lines are one-to-one correspondences and electrically connected;

[0036] The multiple sets of power lines electrically connected to the drive unit in one row are located between the drive units in the 2nth row and the 2n+1th row of the first array;

[0037] The second branch is located between the driving units in the (2n-1)th row and the 2nth row of the first array;

[0038] n = 1, 2, 3, ..., and n is an integer.

[0039] In some embodiments, the line width of the power cord is in the range of 100-120 μm;

[0040] The linewidth of the second branch ranges from 100 to 120 μm;

[0041] The spacing between adjacent power lines is 70-100 μm.

[0042] The spacing between adjacent power lines and the second branch line ranges from 70 to 100 μm.

[0043] In some embodiments, the system further includes a first binding connection end and a second binding connection end, which are located at opposite sides along the first array row direction, respectively;

[0044] The first array includes N columns. In each row of the drive units, the first N / 2 drive units are electrically connected to N / 2 groups of power lines that extend to the side edge where the first bonding connection is located and are electrically connected to the first bonding connection.

[0045] The N / 2 sets of power lines that are electrically connected to the N / 2 drive units extend to the edge of the side where the second bonding connection is located and are electrically connected to the second bonding connection.

[0046] In some embodiments, the plurality of power lines electrically connected to each row of drive units are arranged in a wavy, zigzag pattern.

[0047] In some embodiments, a shielding layer and a first support layer are further included, the shielding layer being located on the side of the driving layer away from the ground layer, and the first support layer being located between the shielding layer and the driving layer;

[0048] The first support layer has a groove in at least one region corresponding to the first array. The groove is located on the side of the first support layer closer to the driving layer and / or on the side of the first support layer farther from the driving layer. The orthographic projection of the driving unit on the first support layer is located in the groove.

[0049] In some embodiments, the groove includes a first sub-groove, a second sub-groove, and a plurality of third sub-grooves, the plurality of third sub-grooves being located between the first sub-groove and the second sub-groove;

[0050] The third sub-slot extends along the row direction of the first array; and the plurality of third sub-slots correspond one-to-one with the row of drive units in the first array;

[0051] The first sub-slot and the second sub-slot are located at opposite sides of the first support layer along the first array row direction;

[0052] Both the first sub-slot and the second sub-slot are trapezoidal;

[0053] The upper and lower bottom edges of the first sub-slot extend along the column direction of the first array, and the upper and lower bottom edges of the second sub-slot extend along the column direction of the first array; the shorter bottom edge of the first sub-slot is farther away from the third sub-slot relative to its longer bottom edge; the shorter bottom edge of the second sub-slot is farther away from the third sub-slot relative to its longer bottom edge.

[0054] The longer bottom edge of the first sub-slot is connected to one end of the plurality of third sub-slots, and the longer bottom edge of the second sub-slot is connected to the other end of the plurality of third sub-slots.

[0055] In some embodiments, the width of the third sub-slot is 1.5-2 times the width of the drive unit along the direction of the first array column;

[0056] The length of the third sub-slot is N×P, where N is the number of driving units in a row of the first array, and P is the sum of the spacing between two adjacent driving units in a row of the first array and the width of the driving unit along the row direction of the first array.

[0057] The depths of the third sub-groove, the second sub-groove, and the first sub-groove are all 0.4-0.6 times the thickness of the first support layer;

[0058] The length of the longer bottom edge of the first sub-slot and the second sub-slot is the same as the length of the column of the first array, and the length of the shorter bottom edge of the first sub-slot and the second sub-slot is 0.15-0.3 times the length of the first support layer along the column direction of the first array.

[0059] In some embodiments, the groove includes a first sub-groove, a second sub-groove, two third sub-grooves, and a plurality of fourth sub-grooves, wherein the two third sub-grooves and the plurality of fourth sub-grooves are located between the first sub-groove and the second sub-groove;

[0060] The two third sub-slots extend along the row direction of the first array; and one of the third sub-slots corresponds to the first row of the drive unit in the first array, and the other third sub-slot corresponds to the last row of the drive unit in the first array.

[0061] The diagonal of the subarray formed by the driving units of the plurality of fourth sub-slots and the middle row other than the first row and the last row in the first array, as well as the plurality of diagonal lines parallel to the diagonal, correspond one-to-one.

[0062] The plurality of fourth sub-slots are divided into a first part and a second part by the diagonal of the sub-array; the first part and the second part are mirror-symmetrical about the diagonal of the sub-array.

[0063] The first sub-slot and the second sub-slot are located at opposite sides of the first support layer along the first array row direction;

[0064] Both the first sub-slot and the second sub-slot are trapezoidal;

[0065] The upper and lower bottom edges of the first sub-slot extend along the column direction of the first array, and the upper and lower bottom edges of the second sub-slot extend along the column direction of the first array; the shorter bottom edge of the first sub-slot is further away from the third and fourth sub-slots relative to its longer bottom edge; the shorter bottom edge of the second sub-slot is further away from the third and fourth sub-slots relative to its longer bottom edge.

[0066] The longer bottom edge of the first sub-slot is connected to one end of the two third sub-slots and one end of the first part of the fourth sub-slot, and the other end of the first part of the fourth sub-slot is connected to one of the third sub-slots.

[0067] The longer bottom edge of the second sub-slot is connected to the other end of the two third sub-slots and one end of the fourth sub-slot in the second part, and the other end of the fourth sub-slot in the second part is connected to the other third sub-slot.

[0068] In some embodiments, the width of the third sub-slot and the fourth sub-slot is 1.1-1.2 times the width of the drive unit along the first array column direction;

[0069] The length of the third sub-slot is N×P, where N is the number of driving units in the first array row, and P is the sum of the spacing between two adjacent driving units in the first array row and the width of the driving unit along the direction of the first array row.

[0070] The length of the fourth sub-slot is (2m-1)×3 times the length of the driving unit along the first array row direction; m=1, 2, 3…m / 2, and m is an integer; m is the arrangement order number of the diagonal lines arranged in sequence along the direction perpendicular to the diagonal and from the diagonal line furthest from the diagonal line to the diagonal line.

[0071] The depths of the third sub-groove, the fourth sub-groove, the second sub-groove, and the first sub-groove are all 0.4-0.6 times the thickness of the first support layer;

[0072] The length of the longer bottom edge of the first sub-slot and the second sub-slot is the same as the length of the column of the first array, and the length of the shorter bottom edge of the first sub-slot and the second sub-slot is 0.15-0.3 times the length of the first support layer along the column direction of the first array.

[0073] In some embodiments, the shorter bottom edge of the first sub-groove is flush with one side edge of the first support layer arranged along the first array row direction.

[0074] The shorter bottom edge of the second sub-slot is flush with the other edge of the first support layer arranged along the first array row direction.

[0075] In some embodiments, the dielectric layer includes a second support layer and a first substrate, wherein the second support layer is located between the radiating layer and the ground layer; and the first substrate is located between the ground layer and the driving layer.

[0076] The smart reflective panel further includes a second substrate, a third substrate, and a fourth substrate, wherein the second substrate is located between the driving layer and the first support layer; the third substrate is located on the side of the radiating layer away from the ground layer; and the fourth substrate is located on the side of the shielding layer away from the driving layer.

[0077] The radiation layer includes multiple sub-units, which are arranged in a second array.

[0078] In the first array, any two adjacent rows of the driving units are located in odd-numbered columns and even-numbered columns, respectively; the first array includes multiple groups of the driving units, each group of the driving units includes two driving units located in both adjacent rows and adjacent columns, and the polarization directions of the two driving units in each group of the driving units are perpendicular to each other for the radio frequency signal;

[0079] Each of the multiple sub-units corresponds one-to-one with one of the multiple groups of the driving units;

[0080] The driving units in the odd-numbered rows of the first array have a first polarization direction, and the driving units in the even-numbered rows have a second polarization direction, wherein the first polarization direction and the second polarization direction are perpendicular to each other.

[0081] The grounding layer has a plurality of first slits and a plurality of second slits; the plurality of first slits correspond one-to-one with the driving units in the odd-numbered rows of the first array, and the plurality of second slits correspond one-to-one with the driving units in the even-numbered rows of the first array;

[0082] The length direction of the first slit is perpendicular to the first polarization direction; the length direction of the second slit is perpendicular to the second polarization direction. Attached Figure Description

[0083] The accompanying drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0084] Figure 1A This is a schematic diagram of one arrangement of the driving layer in a RIS reflective array panel, a related technology.

[0085] Figure 1BThis is a partially enlarged schematic diagram of the driving layer in a RIS reflective array panel, a related technology.

[0086] Figure 1C This is an enlarged schematic diagram of the switching chip in a RIS reflective array panel, a related technology.

[0087] Figure 1D This is a schematic diagram of another arrangement of the driving layer in a RIS reflective array panel related to related technologies.

[0088] Figure 2A This is a cross-sectional schematic diagram of a smart reflective panel according to an embodiment of the present disclosure.

[0089] Figure 2B This is a schematic diagram of one arrangement of the driving layer in the intelligent reflective panel according to an embodiment of the present disclosure.

[0090] Figure 2C This is a schematic diagram of one arrangement of the grounding wire in the driving layer of the intelligent reflective panel according to an embodiment of this disclosure.

[0091] Figure 2D This is an enlarged schematic diagram of the driving unit in the driving layer of the intelligent reflective panel according to an embodiment of this disclosure.

[0092] Figure 2E This is a schematic diagram of the arrangement of the horizontal grounding wires in the driving layer of the intelligent reflective panel according to an embodiment of this disclosure.

[0093] Figure 3A This is a schematic diagram of a connection between the ground wire and the control circuit board in the driving layer of this disclosure embodiment.

[0094] Figure 3B To adopt Figure 3A A schematic diagram of the driver layer layout in the connection method.

[0095] Figure 3C This is a schematic diagram illustrating another connection between the ground wire and the control circuit board in the driving layer of this disclosure embodiment.

[0096] Figure 3D To adopt Figure 3C A schematic diagram of the driver layer layout in the connection method.

[0097] Figure 3E This is another schematic diagram showing the connection between the ground wire and the control circuit board in the driving layer of this disclosure embodiment.

[0098] Figure 3F To adopt Figure 3E A schematic diagram of the driver layer layout in the connection method.

[0099] Figure 4A This is a schematic diagram showing the width of the first and second branches of the grounding wire in the driving layer of an embodiment of this disclosure.

[0100] Figure 4B This is a schematic diagram of another arrangement of the driving layer in the intelligent reflective panel according to an embodiment of this disclosure.

[0101] Figure 4C This is a schematic diagram of another arrangement of the grounding wire in the driving layer of the intelligent reflective panel according to an embodiment of this disclosure.

[0102] Figure 5A This is a schematic diagram of the groove and the driving unit corresponding to an embodiment of this disclosure.

[0103] Figure 5B This is a schematic diagram of a groove in the first support layer of an embodiment of this disclosure.

[0104] Figure 5C This is another schematic diagram showing the groove and the driving unit corresponding in an embodiment of this disclosure.

[0105] Figure 5D This is another schematic diagram of the groove in the first support layer of the present disclosure embodiment.

[0106] Figure 6A This is a schematic diagram of the arrangement of the radiation layer in an embodiment of this disclosure.

[0107] Figure 6B This is a schematic diagram of the arrangement of slits in the grounding layer according to an embodiment of this disclosure. Detailed Implementation

[0108] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the following describes in further detail an intelligent reflective panel provided by the embodiments of this disclosure in conjunction with the accompanying drawings and specific implementation methods.

[0109] Embodiments of this disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms and should not be construed as limited to the embodiments set forth in this disclosure. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this disclosure.

[0110] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of objects. "Above," "below," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0111] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0112] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0113] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0114] With the development of wireless communication technologies, such as 5G signals, the penetration capability is weaker and the energy loss is greater compared to 4G signals. This necessitates new technological solutions to address these issues in signal propagation. To solve the problems of signal penetration and energy loss, denser deployment of base stations or access points is typically employed, but this leads to high costs, high power consumption, and network interference. Therefore, a more efficient, reliable, and low-cost signal transmission solution is needed.

[0115] RIS reflector arrays can dynamically adjust the propagation direction of wireless communication signals (electromagnetic wave signals) by precisely controlling the phase of the reflecting elements, thus optimizing the reflection and transmission of wireless communication signals and improving communication quality. Compared with traditional phased arrays, RIS reflector arrays do not require a large number of phase shifters, power amplifiers, and other devices. Instead, they achieve beamforming by controlling the bias voltage of PIN diodes or varactor diodes to change the phase response, thereby reducing hardware costs and power consumption.

[0116] Currently, the driving layer in a RIS reflective array panel can adjust the phase, amplitude, and polarization parameters of the incident signal, changing the attenuation and reflection direction of the incident electromagnetic wave to achieve directional beamforming and precisely focus the signal onto the target user. The driving layer includes multiple switching chips, each integrating a PIN diode or varactor diode. By controlling the bias voltage of the PIN diode or varactor diode, the phase response of the electromagnetic wave signal is changed, thereby achieving beamforming and focusing.

[0117] Reference Figure 1A , Figure 1B , Figure 1C and Figure 1D Multiple switch chips 15 in the driving layer are arranged in an array. Each switch chip 15 has four leads 16, namely V1 line (first bias voltage line), V2 line (second bias voltage line), GND line (ground line) and VDD line (third bias voltage line). The four leads 16 of each switch chip 15 are individually led to the bonding area at the edge of the panel. The bonding area is bonded to the flexible circuit board (FPC). The flexible circuit board then connects the leads 16 of each switch chip 15 to the control circuit board (PCB).

[0118] Currently, there are three main problems with the wiring design in the driver layer of the RIS reflective array panel:

[0119] First, the large number of switching chips in the driver layer results in a large number of control leads for these chips. Taking a 12×12 dual-polarization RIS reflective array panel as an example, the driver layer has a total of 12×12×4×2=1152 leads (i.e., each reflective unit has two switching chips with different polarization directions for the signal, used to achieve dual-polarization signals in the RIS reflective array; each switching chip has 4 leads). This large number of leads encroaches on the gaps in the delay lines (i.e., multiple signal output lines connected to the switching chips, with varying lengths; the diodes integrated in the switching chips control which signal outputs the electromagnetic wave signal, and different lengths of signal output lines achieve different phase adjustments to the input electromagnetic wave signal) in the reflective units. This necessitates finer lead widths (existing lead widths are less than 0.1mm, e.g., a lead width of 90μm), leading to a decrease in lead processing yield and a risk of breakdown. Secondly, the large number of leads requires the corresponding control circuit board (PCB) to implement an equal number of interfaces, increasing the processing difficulty of the control circuit board and reducing reliability.

[0120] Second, the large number of leads forces the delay lines in the reflective unit to detour, introducing unexpected phase shifts. In addition, the separate GND line (ground line) for each switch chip fragments the ground plane, disrupting its integrity and causing overall phase instability of the electromagnetic wave signal.

[0121] III. For a dual-polarized RIS reflector array with an N×N reflector unit array, a total of 2×N is required. 2 With multiple switching chips operating simultaneously, the heat dissipation requirements for the switching chips in the driver layer become quite demanding. Taking a dual-polarized RIS reflector array with a 12×12 reflector unit array as an example, 288 switches need to operate simultaneously during operation, which places high demands on the heat dissipation of the switching chips.

[0122] To address the aforementioned problems in the related technologies, this disclosure provides an intelligent reflective panel, referring to... Figure 2A , Figure 2B , Figure 2C , Figure 2D and Figure 2E The system includes a driving layer 1, a grounding layer 2, and a radiating layer 3, which are stacked sequentially. A dielectric layer 4 is provided between any two adjacent layers. The driving layer 1 includes a grounding wire 5 and multiple driving units 100, which are electrically connected to the same grounding wire 5.

[0123] The driving layer 1 can adjust the phase, amplitude, and polarization parameters of the incident electromagnetic wave signal, changing the attenuation and reflection direction of the incident electromagnetic wave signal to achieve directional beamforming, thereby accurately focusing the signal to the target user. The radiating layer 3 uses a rectangular microstrip patch. The function of the radiating layer 3 is to receive the incident electromagnetic wave signal and radiate the phase-adjusted reflected electromagnetic wave signal outward. A gap is formed in the grounding layer 2 to couple the incident electromagnetic wave energy to the driving layer 1 and the phase-adjusted reflected electromagnetic wave energy from the driving layer 1 to the radiating layer 3. The driving unit 100 uses a switching chip.

[0124] In this embodiment, by electrically connecting multiple driving units 100 in the driving layer 1 to the same ground line 5, the number of leads electrically connected to the driving units 100 in the driving layer 1 can be reduced. For example, for the current 12×12 reflective unit array dual-polarized RIS reflective array panel, the number of leads electrically connected to the switching chip can be reduced by 25%, that is, the number of leads can be reduced from 1152 to 865. This increases the width and spacing of the leads in the driving layer 1, thereby effectively reducing the risk of breakdown and the crosstalk intensity of the wiring, and improving the processing yield of the leads. At the same time, the reduction in the number of leads can also reduce the wiring difficulty at the control circuit board (PCB) end and improve the reliability of the control circuit board. Furthermore, the reduction in the number of leads can also increase the distance between the leads and the delay line (i.e., RF line G) connecting the switching chip, avoiding the delay line from going around, thereby reducing the unexpected phase shift of the smart reflective panel. In addition, the multiple driving units 100 in the driving layer 1 electrically connected to the same ground line 5 can achieve the integrity of the ground plane, thereby improving the overall phase stability of the electromagnetic wave signal adjusted by the smart reflective panel.

[0125] In some embodiments, a plurality of drive units 100 are arranged in a first array; the grounding wire 5 includes a first branch 51 and a plurality of second branches 52, the first branch 51 extends along the column direction Y of the first array, the second branch 52 extends along the row direction X of the first array, and the first branch 51 and the plurality of second branches 52 are electrically connected respectively; in the first array, a second branch 52 is provided between adjacent odd-numbered row and even-numbered row drive units 100, and adjacent odd-numbered row and even-numbered row drive units 100 are electrically connected to the second branch 52 located between them; the first branch 51 is located between adjacent odd-numbered column and even-numbered column drive units 100 in the middle of the first array.

[0126] The arrangement of the first branch line 51 and multiple second branch lines 52 enables all drive units 100 to be connected to the same grounding line 5, thereby ensuring the integrity of the ground plane and improving the overall phase stability of the electromagnetic wave signal adjusted by the intelligent reflective panel.

[0127] In some embodiments, refer to Figure 2D and Figure 2E In the first array, any two adjacent rows of drive units 100 are located in odd-numbered columns and even-numbered columns, respectively; the second branch 52 includes a main line 521, multiple first branches 522 and multiple second branches 523, and the main line 521 is electrically connected to the multiple first branches 522 and multiple second branches 523, respectively; the main line 521 is a wavy line and extends along the row direction X of the first array; the drive unit 100 located in the odd-numbered column of the two adjacent rows of drive units 100 includes a first ground terminal A, and the drive unit 100 located in the even-numbered column includes a second ground terminal B, and the length direction of the first ground terminal A is perpendicular to the length direction of the second ground terminal B; the first branch 522 is electrically connected to the first ground terminal A, and the second branch 523 is electrically connected to the second ground terminal B; at least a portion of the first branch 522 extends in a direction perpendicular to the extension direction of the second branch 523.

[0128] In some embodiments, refer to Figure 2B In any two adjacent rows of driving units 100 in the first array, the driving units 100 in the odd-numbered rows are all located in the odd-numbered columns, and the driving units 100 in the even-numbered rows are all located in the even-numbered columns.

[0129] In this embodiment, by setting the second branch line 52 to include the main line 521, the first branch 522 and the second branch 523, it is possible to simultaneously electrically connect two adjacent rows of drive units 100 in the first array with one second branch line 52.

[0130] In some embodiments, refer to Figure 2C The first branch line 51 is a wavy, broken line. The first branch line 51 can electrically connect all the second branches 52 extending along the first array row direction together, thereby realizing that all the drive units 100 in the first array are electrically connected to the same ground line 5.

[0131] In some embodiments, refer to Figure 3A and Figure 3B The intelligent reflective panel also includes a control circuit board 6, which includes a third grounding terminal C; at least one end of the first branch line 51 extends along the column direction Y of the first array to the corresponding side edge of the periphery of the first array and is electrically connected to a first connection terminal D disposed at the corresponding side edge; the first connection terminal D is electrically connected to the third grounding terminal C.

[0132] The first connection terminal D and the third ground terminal C are electrically connected via soldered leads. The control circuit board 6 is used to provide drive control signals (i.e., phase adjustment control signals) to the drive unit 100. This arrangement enables the drive unit 100 and the control circuit board 6 to share a common ground, thereby improving the overall phase stability of the electromagnetic wave signal adjusted by the intelligent reflective panel.

[0133] In some embodiments, refer to Figure 3C and Figure 3DThe intelligent reflective panel also includes a control circuit board 6, which includes a third grounding terminal C; the intelligent reflective panel also includes a bonding connection terminal E located at opposite sides of the first array row direction X; at least one end of the first branch line 51 extends to be electrically connected to the bonding connection terminal E; the intelligent reflective panel also includes a flexible circuit board 7, one end of which is bonded to the bonding connection terminal E, and the other end of which is electrically connected to the third grounding terminal C.

[0134] Figure 3C and Figure 3D This configuration also enables the drive unit 100 and the control circuit board 6 to share a common ground, thereby improving the overall phase stability of the electromagnetic wave signal adjusted by the intelligent reflective panel.

[0135] In some embodiments, refer to Figure 3E and Figure 3F The intelligent reflective panel also includes a control circuit board 6, which includes a third grounding terminal C; the intelligent reflective panel also includes a bonding connection terminal E, located at opposite edges along the first array row direction X; at least one end of any second branch line 52 extends to be electrically connected to the bonding connection terminal E; the intelligent reflective panel also includes a flexible circuit board 7, one end of which is bonded to the bonding connection terminal E, and the other end of which is electrically connected to the third grounding terminal C.

[0136] Figure 3E and Figure 3F This configuration also enables the drive unit 100 and the control circuit board 6 to share a common ground, thereby improving the overall phase stability of the electromagnetic wave signal adjusted by the intelligent reflective panel.

[0137] In some embodiments, refer to Figure 4A , Figure 4B and Figure 4C The width of the first branch 51 is greater than the width of the second branch 52; at the connection point of the first branch 51 and the second branch 52, the line width gradually decreases from the first branch 51 to the second branch 52.

[0138] This configuration ensures sufficient spacing between the grounding wire 5 and the delay line of the drive unit 100 (i.e., the switching chip) while maximizing the width of the grounding wire 5. Increasing the width of the grounding wire 5 reduces conductor resistance, thereby lowering the voltage drop and power consumption of the grounding wire 5 and preventing overheating. Furthermore, thickening the grounding wire 5 reduces noise coupling and significantly improves anti-interference performance.

[0139] In some embodiments, refer to Figure 4A , Figure 4B and Figure 4C The linewidth W of the first branch 51 ranges from 300 to 800 μm.

[0140] In some embodiments, refer to Figure 2D The driving unit 100 includes an integrated circuit F and multiple radio frequency lines G. The multiple radio frequency lines G are located around the integrated circuit F and are electrically connected to the integrated circuit F. The line width of the radio frequency line G is greater than the line width of the first branch line 51. The distance between the first branch line 51 and the radio frequency line G is greater than 1 mm.

[0141] The radio frequency line G includes a signal input line G1 and a signal delay line G2 (i.e., a signal output line). The signal input line G1 is responsible for inputting the incident electromagnetic wave signal received by the radiation layer 3 into a certain signal delay line G2. The integrated circuit F integrates a diode. When the diode is in the conducting state, it can select a certain signal delay line G2 to adjust the phase of the input electromagnetic wave signal. After the adjustment is completed, the signal delay line G2 transmits the electromagnetic wave signal back to the signal input line G1. The signal input line G1 then couples the electromagnetic wave signal to the radiation layer 3 through the ground layer 2. The radiation layer 3 radiates the electromagnetic wave signal outward.

[0142] In this embodiment, by making the distance between the first branch line 51 and the radio frequency line G greater than 1mm, the breakdown risk and crosstalk intensity between the first branch line 51 and the radio frequency line G can be effectively reduced. On the other hand, the detour of the signal delay line G2 can be avoided (detour will introduce an unexpected phase shift), thereby reducing the unexpected phase shift of the smart reflective panel.

[0143] In some embodiments, refer to Figure 2B The intelligent reflective panel also includes multiple sets of power lines 8, each set including multiple power lines 8, and the multiple power lines 8 in each set transmit different power signals; the power lines 8 extend along the row direction X of the first array; multiple drive units 100 and multiple sets of power lines 8 correspond one-to-one and are electrically connected; the multiple sets of power lines 8 electrically connected to a row of drive units 100 are located between the drive units 100 in the 2nth row and the 2n+1th row in the first array; the second branch line 52 is located between the drive units 100 in the 2n-1th row and the 2nth row in the first array; n=1, 2, 3..., and n is an integer.

[0144] The power lines 8 are also arranged above the first row driving unit 100 and below the last row driving unit 100 in the first array, and are used to provide power signals to the first row and last row driving units 100 respectively. In this embodiment, each group of power lines 8 includes three power lines 8, namely V1 line (first bias voltage line), V2 line (second bias voltage line) and VDD line (third bias voltage line). Different power lines 8 are used to provide different bias voltage signals to the diodes in the integrated circuit F. Different bias voltage signals determine that the diodes select different signal delay lines G2, thereby realizing different phase adjustments of the input electromagnetic wave signals.

[0145] In this embodiment, the power lines 8 are evenly arranged, and the alternating arrangement of the power lines 8 and the second branch line 52 in the first array can increase the line width and line spacing of the power lines 8 and the second branch line 52, thereby reducing the risk of breakdown and the crosstalk intensity between the power lines 8 and the second branch line 52; thus ensuring the stability of the overall phase of the electromagnetic wave signal adjusted by the intelligent reflective panel.

[0146] In some embodiments, the line width of the power line 8 is in the range of 100-120 μm; the line width of the second branch line 52 is in the range of 100-120 μm; the spacing between adjacent power lines 8 is in the range of 70-100 μm; and the spacing between adjacent power lines 8 and the second branch line 52 is in the range of 70-100 μm.

[0147] In some embodiments, the power line 8 has a line width of 110 μm; the second branch line 52 has a line width of 110 μm; the spacing between adjacent power lines 8 is 90 μm; and the spacing between adjacent power lines 8 and the second branch line 52 is 90 μm.

[0148] Compared to the lead width and lead spacing in the current driving layer 1, the width and spacing of the leads (including ground line 5 and power line 8) in this embodiment are increased, which can effectively reduce the risk of breakdown and the strength of crosstalk in the wiring, and improve the processing yield of the leads. At the same time, the width and spacing of the leads can also reduce the wiring difficulty at the control circuit board (PCB) end and improve the reliability of the control circuit board. Furthermore, the width and spacing of the leads can also increase the distance between the leads and the delay line (i.e., RF line G) connecting the switching chip, avoiding the delay line from going around, thereby reducing the unexpected phase shift of the smart reflective panel.

[0149] In some embodiments, refer to Figure 2B The intelligent reflective panel also includes a first binding connection terminal E1 and a second binding connection terminal E2, which are located on opposite sides of the first array row direction X, respectively. The first array includes N columns. In each row of driving units 100, the first N / 2 driving units 100 are electrically connected to N / 2 sets of power lines 8, which extend to the side edge where the first binding connection terminal E1 is located and are electrically connected to the first binding connection terminal E1. The last N / 2 driving units 100 are electrically connected to N / 2 sets of power lines 8, which extend to the side edge where the second binding connection terminal E2 is located and are electrically connected to the second binding connection terminal E2.

[0150] This configuration ensures that the power signal attenuation is consistent between the first N / 2 drive units 100 and the last N / 2 drive units 100 in each row of drive units 100, thereby ensuring the uniformity of the power signal in each row of drive units 100. This, in turn, ensures that the intelligent reflective panel can accurately adjust the phase of the incident electromagnetic wave signal, achieving precise directional beamforming and focusing the signal precisely on the target user. Furthermore, the wiring within the column gaps between adjacent columns formed by the first N / 2 drive units 100 and the last N / 2 drive units 100 in each row is relatively sparse. Therefore, arranging the first branch line 51 within these column gaps increases both the line width of the first branch line 51 and the power line 8, and also increases the spacing between the first branch line 51 and the power line 8.

[0151] In some embodiments, the multiple sets of power lines 8 electrically connected to each row of drive units 100 are arranged in a wavy, zigzag pattern.

[0152] In some embodiments, refer to Figure 2A , Figure 5A , Figure 5B , Figure 5C and Figure 5D The intelligent reflective panel also includes a shielding layer 9 and a first support layer 10. The shielding layer 9 is located on the side of the driving layer 1 away from the grounding layer 2, and the first support layer 10 is located between the shielding layer 9 and the driving layer 1. At least in the area corresponding to the first array, a groove 11 is formed in the first support layer 10. The groove 11 is located on the side of the first support layer 10 close to the driving layer 1 and / or on the side of the first support layer 10 away from the driving layer 1. The orthographic projection of the driving unit 100 on the first support layer 10 is located in the groove 11.

[0153] The shielding layer 9 is made of a metallic material, such as copper, and is used to prevent electromagnetic waves incident on the smart reflective panel from leaking from the side of the driving layer 1 away from the grounding layer 2. The first support layer 10 mainly serves a supporting function, and its material is a lightweight composite material such as foam core material. A groove 11 is formed in the first support layer 10 near the driving layer 1, which can help dissipate heat from the driving layer 1 and improve or avoid the problem of damage to the driving layer 1 under high heat or inaccurate phase adjustment of the electromagnetic wave signal.

[0154] In this embodiment, the groove 11 can penetrate the entire thickness of the first support layer 10. The creation of the groove 11 in the first support layer 10 requires comprehensive consideration of heat dissipation efficiency, its own mechanical strength, hot airflow distribution, and manufacturing feasibility. For example: First, the groove 11 should be evenly distributed in the first support layer 10 to ensure uniform heat dissipation and avoid localized overheating. Second, ensure that the groove 11 area covers the drive unit 100, referring to... Figure 5AThis prevents mechanical damage to the drive unit 100 caused by direct contact between the drive unit 100 and the first support layer 10. Finally, by designing the groove 11 to form a continuous airflow channel and setting a large vent at the edge of the first support layer 10, airflow is promoted, which helps to enhance the convective heat dissipation effect.

[0155] In some embodiments, refer to Figure 5B The groove 11 includes a first sub-groove 11a, a second sub-groove 11b, and a plurality of third sub-grooves 11c, the plurality of third sub-grooves 11c being located between the first sub-groove 11a and the second sub-groove 11b; the third sub-grooves 11c extending along the row direction X of the first array; and the plurality of third sub-grooves 11c corresponding one-to-one with the drive unit rows in the first array; the first sub-groove 11a and the second sub-groove 11b being located at opposite side edges of the first support layer 10 along the row direction X of the first array; both the first sub-groove 11a and the second sub-groove 11b are trapezoidal; the first The upper and lower bottom edges of sub-slot 11a extend along the column direction Y of the first array, and the upper and lower bottom edges of the second sub-slot 11b extend along the column direction Y of the first array; the shorter bottom edge of the first sub-slot 11a is further away from the third sub-slot 11c relative to its longer bottom edge; the shorter bottom edge of the second sub-slot 11b is further away from the third sub-slot 11c relative to its longer bottom edge; the longer bottom edge of the first sub-slot 11a is connected to one end of the plurality of third sub-slots 11c, and the longer bottom edge of the second sub-slot 11b is connected to the other end of the plurality of third sub-slots 11c.

[0156] In some embodiments, refer to Figure 5B The width K of the third sub-slot 11c is 1.5-2 times the width of the drive unit 100 along the column direction Y of the first array; the length L of the third sub-slot 11c is N×P, where N is the number of drive units 100 in a row of the first array, and P is the sum of the distance between two adjacent drive units 100 in a row of the first array and the width of the drive unit 100 along the row direction X of the first array; the depth of the third sub-slot 11c, the second sub-slot 11b, and the first sub-slot 11a is 0.4-0.6 times the thickness of the first support layer 10; the length of the longer bottom edge of the first sub-slot 11a and the second sub-slot 11b is the length of the column of the first array, and the length of the shorter bottom edge of the first sub-slot 11a and the second sub-slot 11b is 0.15-0.3 times the length of the first support layer 10 along the column direction Y of the first array.

[0157] In some embodiments, refer to Figure 5DThe groove 11 includes a first sub-groove 11a, a second sub-groove 11b, two third sub-grooves 11c, and multiple fourth sub-grooves 11d. The two third sub-grooves 11c and the multiple fourth sub-grooves 11d are located between the first sub-groove 11a and the second sub-groove 11b. The two third sub-grooves 11c extend along the row direction X of the first array. One third sub-groove 11c corresponds to the first row driving unit 100 in the first array, and the other third sub-groove 11c corresponds to the last row driving unit 100 in the first array. The multiple fourth sub-grooves 11d correspond one-to-one with the diagonal of the sub-array formed by the middle row driving units 100 other than the first and last rows in the first array, as well as multiple diagonal lines parallel to the diagonal. The multiple fourth sub-grooves 11d are divided into a first part M1 and a second part M2 with the diagonal of the sub-array as the dividing line J. The first part M1 and the second part M2 are mirror-symmetrical with the diagonal of the sub-array as the axis of symmetry. The first sub-groove 11a and the second sub-groove 11b are located along the first row direction X of the first support layer 10. The opposite edges of the column direction X; both the first sub-slot 11a and the second sub-slot 11b are trapezoidal; the upper and lower bottom edges of the first sub-slot 11a extend along the column direction Y of the first array, and the upper and lower bottom edges of the second sub-slot 11b extend along the column direction Y of the first array; the shorter bottom edge of the first sub-slot 11a is further away from the third sub-slot 11c and the fourth sub-slot 11d relative to its longer bottom edge; the shorter bottom edge of the second sub-slot 11b is further away from the third sub-slot 11c and the fourth sub-slot 11d relative to its longer bottom edge. Slot 11d; The longer bottom edge of the first sub-slot 11a is connected to one end of the two third sub-slots 11c and one end of the fourth sub-slot 11d of the first part M1, and the other end of the fourth sub-slot 11d of the first part M1 is connected to one of the third sub-slots 11c; The longer bottom edge of the second sub-slot 11b is connected to the other end of the two third sub-slots 11c and one end of the fourth sub-slot 11d of the second part M2, and the other end of the fourth sub-slot 11d of the second part M2 is connected to another third sub-slot 11c.

[0158] In some embodiments, refer to Figure 5C and Figure 5DThe width K of both the third sub-slot 11c and the fourth sub-slot 11d is 1.1-1.2 times the width of the drive unit 100 along the first array column direction Y; the length L of the third sub-slot 11c is N×P, where N is the number of drive units 100 in the first array row, and P is the sum of the distance between two adjacent drive units 100 in the first array row and the width of the drive unit 100 along the first array row direction X; the length S of the fourth sub-slot 11d is (2m-1)×3 times the length of the drive unit 100 along the first array row direction X; m=1, 2, 3…m / 2, and m is… Integer; m is the arrangement number of the diagonal lines arranged sequentially along the direction perpendicular to the diagonal and from the diagonal furthest from the diagonal to the diagonal; the depths of the third sub-slot 11c, the fourth sub-slot 11d, the second sub-slot 11b, and the first sub-slot 11a are all 0.4-0.6 times the thickness of the first support layer 10; the lengths of the longer bottom edges of the first sub-slot 11a and the second sub-slot 11b are all the lengths of the columns of the first array, and the lengths of the shorter bottom edges of the first sub-slot 11a and the second sub-slot 11b are all 0.15-0.3 times the length of the first support layer 10 along the column direction Y of the first array.

[0159] In some embodiments, refer to Figures 5A-5D The shorter bottom edge of the first sub-slot 11a is flush with one side edge of the first support layer 10 arranged along the first array row direction X, and the shorter bottom edge of the second sub-slot 11b is flush with the other side edge of the first support layer 10 arranged along the first array row direction X.

[0160] In some embodiments, refer to Figures 5A-5D Both the first sub-groove 11a and the second sub-groove 11b are isosceles trapezoids, and the heights of these trapezoids are the widths of the opposite two edges of the first support layer 10, which is located on the periphery of the first array and arranged along the X-direction of the first array. This arrangement avoids creating grooves in areas of the first support layer 10 where high mechanical strength is required (such as the four corners of the periphery of the first support layer 10), thereby ensuring sufficient structural and support stability of the first support layer 10.

[0161] In some embodiments, refer to Figure 2A , Figure 6A and Figure 6BThe dielectric layer 4 includes a second support layer 41 and a first substrate 42. The second support layer 41 is located between the radiating layer 3 and the ground layer 2. The first substrate 42 is located between the ground layer 2 and the driving layer 1. The smart reflective panel also includes a second substrate 12, a third substrate 13, and a fourth substrate 14. The second substrate 12 is located between the driving layer 1 and the first support layer 10. The third substrate 13 is located on the side of the radiating layer 3 away from the ground layer 2. The fourth substrate 14 is located on the side of the shielding layer 9 away from the driving layer 1. The radiating layer 3 includes multiple sub-units 30, which are arranged in a second array. Any two adjacent rows of driving units 100 in the first array are located in odd-numbered columns and even-numbered columns, respectively. The first array includes multiple groups of driving units 100, and each group of driving units 100 includes units located in both adjacent rows and adjacent columns. Two driving units 100 in two columns, with the polarization directions of the two driving units 100 in each group of driving units 100 perpendicular to each other; multiple sub-units 30 correspond one-to-one with multiple groups of driving units 100; the driving units 100 in the odd-numbered rows of the first array have a first polarization direction, and the driving units 100 in the even-numbered rows have a second polarization direction, with the first polarization direction and the second polarization direction perpendicular to each other; multiple first slits 21 and multiple second slits 22 are provided in the ground layer 2; multiple first slits 21 correspond one-to-one with the driving units 100 in the odd-numbered rows of the first array, and multiple second slits 22 correspond one-to-one with the driving units 100 in the even-numbered rows of the first array; the length direction of the first slit 21 is perpendicular to the first polarization direction; the length direction of the second slit 22 is perpendicular to the second polarization direction.

[0162] In some embodiments, the second support layer 41 serves a supporting function and is made of lightweight composite materials such as foam core material. The first substrate 42, second substrate 12, third substrate 13, and fourth substrate 14 are all made of high-temperature glass with a dielectric constant of 5.92, a loss tangent (reflecting the loss of electromagnetic wave signals after passing through the glass) of 0.0072, and a thickness of 0.5 mm. The driving layer 1, ground layer 2, radiating layer 3, and shielding layer 9 are all metal material layers, such as copper, with a thickness of 2 μm. The first support layer 10 and the second support layer 41 both have a dielectric constant of 1.07 and a loss tangent (reflecting the loss of electromagnetic wave signals after passing through the support layer) of 0.005. The first support layer 10 has a thickness of 1.2 mm, and the second support layer 41 has a thickness ranging from 5 to 10 mm.

[0163] By creating a first gap 21 and a second gap 22 in the grounding layer 2, the incident electromagnetic wave energy received by the radiation layer 3 can be coupled to the driving layer 1, and the reflected electromagnetic wave energy after phase adjustment by the driving layer 1 can be coupled to the radiation layer 3. The radiation layer 3 then radiates the phase-adjusted reflected electromagnetic wave signal outward. Therefore, the intelligent reflective panel in this embodiment is a gap-coupled RIS reflective array. The working principle of the gap-coupled RIS reflective array is as follows: an electromagnetic wave signal is incident on the radiation layer 3, and its energy is coupled to the driving layer 1 through the gapped grounding layer 2. The coupled energy is dynamically adjusted by the switching chip in the driving layer 1 using delay lines of different lengths (i.e., signal output lines of different lengths). The adjusted energy is then radiated in the reverse direction through the original coupling path, forming a controllable reflected electromagnetic wave.

[0164] The intelligent reflective panel provided in this embodiment can be any product or component with incident electromagnetic wave phase adjustment function, such as a RIS reflective array or a slot-coupled reflective array.

[0165] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. An intelligent reflecting surface panel, wherein, include: The driving layer, the ground layer, and the radiating layer are stacked sequentially, and a dielectric layer is disposed between any two adjacent layers. The driving layer includes a grounding wire and multiple driving units, which are electrically connected to the same grounding wire.

2. The smart reflective panel of claim 1, wherein, The plurality of drive units are arranged in a first array; The grounding wire includes a first branch and multiple second branches. The first branch extends along the column direction of the first array, and the second branches extend along the row direction of the first array. The first branch and the multiple second branches are electrically connected respectively. In the first array, a second branch is provided between adjacent odd-numbered rows and even-numbered rows of driving units, and adjacent odd-numbered rows and even-numbered rows of driving units are electrically connected to the second branch located between them. The first branch is located between the drive units in the middle of the first array, between the odd-numbered columns and the even-numbered columns.

3. The smart reflective panel of claim 2, wherein, In the first array, any two adjacent rows of the driving units are located in odd-numbered columns and even-numbered columns, respectively; The second branch line includes a main line, a plurality of first branches and a plurality of second branches, wherein the main line is electrically connected to the plurality of first branches and the plurality of second branches respectively; The main line is a wavy broken line and extends along the row direction of the first array; In two adjacent rows of driving units, the driving unit located in the odd-numbered column includes a first grounding terminal, and the driving unit located in the even-numbered column includes a second grounding terminal, wherein the length direction of the first grounding terminal is perpendicular to the length direction of the second grounding terminal; The first branch is electrically connected to the first grounding terminal, and the second branch is electrically connected to the second grounding terminal; At least a portion of the first branch extends in a direction perpendicular to the direction of extension of the second branch.

4. The smart reflective panel according to claim 2 or 3, wherein, The first branch is a wavy broken line.

5. The intelligent reflective panel according to claim 4, wherein, It also includes a control circuit board, which includes a third ground terminal; At least one end of the first branch extends along the column direction of the first array to the corresponding side edge of the periphery of the first array and is electrically connected to a first connection end disposed at the corresponding side edge. The first connection terminal is electrically connected to the third grounding terminal.

6. The smart reflective panel of claim 4, wherein, It also includes a control circuit board, which includes a third ground terminal; The smart reflective panel also includes a bonding connection end located on opposite sides along the direction of the first array row; At least one end of the first branch extends to be electrically connected to the binding connection end; The intelligent reflective panel also includes a flexible circuit board, one end of which is bonded to the binding connection end, and the other end is electrically connected to the third grounding end.

7. The smart reflective panel of claim 4, wherein, It also includes a control circuit board, which includes a third ground terminal; The smart reflective panel also includes a bonding connection end located on opposite sides along the direction of the first array row; At least one end of any of the second branches extends to be electrically connected to the binding connection end; The intelligent reflective panel also includes a flexible circuit board, one end of which is bonded to the binding connection end, and the other end is electrically connected to the third grounding end.

8. The smart reflective panel of claim 4, wherein, The width of the first branch is greater than the width of the second branch; At the connection point between the first branch and the second branch, the line width gradually decreases from the first branch to the second branch.

9. The intelligent reflective panel according to claim 8, wherein, The linewidth of the first branch is in the range of 300-800μm.

10. The smart reflective panel of claim 9, wherein, The driving unit includes an integrated circuit and multiple radio frequency lines, the multiple radio frequency lines being located around the integrated circuit and electrically connected to the integrated circuit; The line width of the radio frequency line is greater than the line width of the first branch line; The distance between the first branch and the radio frequency line is greater than 1 mm.

11. The smart reflective panel of claim 2, wherein, It also includes multiple sets of power lines, each set including multiple power lines, and the multiple power lines in each set transmit different power signals respectively; The power lines extend along the row direction of the first array; The plurality of drive units and the plurality of power lines are one-to-one correspondences and electrically connected; The multiple sets of power lines electrically connected to the drive unit in one row are located between the drive units in the 2nth row and the 2n+1th row of the first array; The second branch is located between the driving units in the (2n-1)th row and the 2nth row of the first array; n = 1, 2, 3, ..., and n is an integer.

12. The smart reflective panel of claim 11, wherein, The line width of the power cord is 100-120μm. The linewidth of the second branch ranges from 100 to 120 μm; The spacing between adjacent power lines is 70-100 μm. The spacing between adjacent power lines and the second branch line ranges from 70 to 100 μm.

13. The smart reflective panel of claim 11, wherein, It also includes a first binding connection end and a second binding connection end, which are located at opposite sides along the first array row direction, respectively; The first array includes N columns. In each row of the drive units, the first N / 2 drive units are electrically connected to N / 2 groups of power lines that extend to the side edge where the first bonding connection is located and are electrically connected to the first bonding connection. The N / 2 sets of power lines that are electrically connected to the N / 2 drive units extend to the edge of the side where the second bonding connection is located and are electrically connected to the second bonding connection.

14. The intelligent reflective panel according to claim 11, wherein, The multiple sets of power lines electrically connected to each row of drive units are arranged in a wavy, zigzag pattern.

15. The intelligent reflective panel according to claim 2, wherein, It also includes a shielding layer and a first support layer, wherein the shielding layer is located on the side of the driving layer away from the ground layer, and the first support layer is located between the shielding layer and the driving layer; The first support layer has a groove in at least one region corresponding to the first array. The groove is located on the side of the first support layer closer to the driving layer and / or on the side of the first support layer farther from the driving layer. The orthographic projection of the driving unit on the first support layer is located in the groove.

16. The intelligent reflective panel according to claim 15, wherein, The groove includes a first sub-groove, a second sub-groove, and a plurality of third sub-grooves, wherein the plurality of third sub-grooves are located between the first sub-groove and the second sub-groove; The third sub-slot extends along the row direction of the first array; and the plurality of third sub-slots correspond one-to-one with the row of drive units in the first array; The first sub-slot and the second sub-slot are located at opposite sides of the first support layer along the first array row direction; Both the first sub-slot and the second sub-slot are trapezoidal; The upper and lower bottom edges of the first sub-slot extend along the column direction of the first array, and the upper and lower bottom edges of the second sub-slot extend along the column direction of the first array; the shorter bottom edge of the first sub-slot is farther away from the third sub-slot relative to its longer bottom edge; the shorter bottom edge of the second sub-slot is farther away from the third sub-slot relative to its longer bottom edge. The longer bottom edge of the first sub-slot is connected to one end of the plurality of third sub-slots, and the longer bottom edge of the second sub-slot is connected to the other end of the plurality of third sub-slots.

17. The intelligent reflective panel according to claim 16, wherein, The width of the third sub-slot is 1.5-2 times the width of the drive unit along the direction of the first array column; The length of the third sub-slot is N×P, where N is the number of driving units in a row of the first array, and P is the sum of the spacing between two adjacent driving units in a row of the first array and the width of the driving unit along the row direction of the first array. The depths of the third sub-groove, the second sub-groove, and the first sub-groove are all 0.4-0.6 times the thickness of the first support layer; The length of the longer bottom edge of the first sub-slot and the second sub-slot is the same as the length of the column of the first array, and the length of the shorter bottom edge of the first sub-slot and the second sub-slot is 0.15-0.3 times the length of the first support layer along the column direction of the first array.

18. The intelligent reflective panel according to claim 15, wherein, The groove includes a first sub-groove, a second sub-groove, two third sub-grooves, and a plurality of fourth sub-grooves, wherein the two third sub-grooves and the plurality of fourth sub-grooves are located between the first sub-groove and the second sub-groove; The two third sub-slots extend along the row direction of the first array; and one of the third sub-slots corresponds to the first row of the drive unit in the first array, and the other third sub-slot corresponds to the last row of the drive unit in the first array. The diagonal of the subarray formed by the driving units of the plurality of fourth sub-slots and the middle row other than the first row and the last row in the first array, as well as the plurality of diagonal lines parallel to the diagonal, correspond one-to-one. The plurality of fourth sub-slots are divided into a first part and a second part by the diagonal of the sub-array; the first part and the second part are mirror-symmetrical about the diagonal of the sub-array. The first sub-slot and the second sub-slot are located at opposite sides of the first support layer along the first array row direction; Both the first sub-slot and the second sub-slot are trapezoidal; The upper and lower bottom edges of the first sub-slot extend along the column direction of the first array, and the upper and lower bottom edges of the second sub-slot extend along the column direction of the first array; the shorter bottom edge of the first sub-slot is further away from the third and fourth sub-slots relative to its longer bottom edge; the shorter bottom edge of the second sub-slot is further away from the third and fourth sub-slots relative to its longer bottom edge. The longer bottom edge of the first sub-slot is connected to one end of the two third sub-slots and one end of the first part of the fourth sub-slot, and the other end of the first part of the fourth sub-slot is connected to one of the third sub-slots. The longer bottom edge of the second sub-slot is connected to the other end of the two third sub-slots and one end of the fourth sub-slot in the second part, and the other end of the fourth sub-slot in the second part is connected to the other third sub-slot.

19. The intelligent reflective panel according to claim 18, wherein, The width of the third sub-slot and the fourth sub-slot is 1.1-1.2 times the width of the drive unit along the direction of the first array column; The length of the third sub-slot is N×P, where N is the number of driving units in the first array row, and P is the sum of the spacing between two adjacent driving units in the first array row and the width of the driving unit along the direction of the first array row. The length of the fourth sub-slot is (2m-1)×3 times the length of the driving unit along the first array row direction; m=1, 2, 3…m / 2, and m is an integer; m is the arrangement order number of the diagonal lines arranged in sequence along the direction perpendicular to the diagonal and from the diagonal line furthest from the diagonal line to the diagonal line. The depths of the third sub-groove, the fourth sub-groove, the second sub-groove, and the first sub-groove are all 0.4-0.6 times the thickness of the first support layer; The length of the longer bottom edge of the first sub-slot and the second sub-slot is the same as the length of the column of the first array, and the length of the shorter bottom edge of the first sub-slot and the second sub-slot is 0.15-0.3 times the length of the first support layer along the column direction of the first array.

20. The intelligent reflective panel according to any one of claims 16-19, wherein, The shorter bottom edge of the first sub-slot is flush with one edge of the first support layer that is arranged along the first array row direction. The shorter bottom edge of the second sub-slot is flush with the other edge of the first support layer arranged along the first array row direction.

21. The intelligent reflective panel according to claim 15, wherein, The dielectric layer includes a second support layer and a first substrate, wherein the second support layer is located between the radiating layer and the ground layer; and the first substrate is located between the ground layer and the driving layer. The smart reflective panel further includes a second substrate, a third substrate, and a fourth substrate, wherein the second substrate is located between the driving layer and the first support layer; The third substrate is located on the side of the radiating layer away from the ground layer; The fourth substrate is located on the side of the shielding layer away from the driving layer; The radiation layer includes multiple sub-units, which are arranged in a second array. In the first array, any two adjacent rows of the driving units are located in odd-numbered columns and even-numbered columns, respectively; the first array includes multiple groups of the driving units, each group of the driving units includes two driving units located in both adjacent rows and adjacent columns, and the polarization directions of the two driving units in each group of the driving units are perpendicular to each other for the radio frequency signal; Each of the multiple sub-units corresponds one-to-one with one of the multiple groups of the driving units; The driving units in the odd-numbered rows of the first array have a first polarization direction, and the driving units in the even-numbered rows have a second polarization direction, wherein the first polarization direction and the second polarization direction are perpendicular to each other. The grounding layer has a plurality of first slits and a plurality of second slits; the plurality of first slits correspond one-to-one with the driving units in the odd-numbered rows of the first array, and the plurality of second slits correspond one-to-one with the driving units in the even-numbered rows of the first array; The length direction of the first slit is perpendicular to the first polarization direction; the length direction of the second slit is perpendicular to the second polarization direction.