An integrated clamp, grounding assembly, and grounding connection method for a high-frequency data cable.

Abstract

An integrated clamp for high-frequency data cables, a grounding component, and a grounding connection method for the grounding component are disclosed, relating to the field of high-frequency data cable connector technology. The two integrated clamps, along with a grounding metal clamp encasing the grounding component, also employ a two-piece structure. These clamps are secured by limiting through holes and limiting protrusions, and fixed using snap-fit ​​and slot-fitting mechanisms. The grounding metal clamp is equipped with signal line grounding terminals, power supply grounding terminals, and circuit board grounding terminals. One end of the clamp extends to form a cable grounding overlap portion and a cable grounding grip portion. This invention eliminates the need for traditional auxiliary clamps, constructing a complete, low-impedance, and continuous grounding loop for the circuit board, completely solving the "bottleneck" problem caused by auxiliary clamps in traditional processes.

Description

Technical Field

[0001] This invention relates to the field of data cable technology, and more specifically to an integrated clamp, grounding assembly, and grounding connection method for high-frequency data cables. Background Technology

[0002] Many electronic devices nowadays have data communication interfaces, such as high-end laptops, servers, high-end cameras, high-speed external hard drives, and mobile graphics cards. In existing technologies, common data cables (such as USB, HDMI, and Ethernet cables) typically have a concentric circle layered structure from the inside out, such as... Figure 1 As shown: Existing cable manufacturing technology requires a wire stripping process to expose the ground layer for subsequent connections. During stripping, the protective layer and metal layer are removed first. However, the metal braid of the ground layer is prone to loosening and unraveling due to the loss of external restraint, damaging the metal layer. To ensure the distance between the ground layer and the solder joint is not too large, existing technology uses soldering or applying solder paste at location A to shorten the distance to the reference ground, ensuring the continuity of the reference ground. Simultaneously, auxiliary clamps 16 are used to hold and fix the cable behind the harness, ensuring connection stability. The auxiliary clamp 16, through a wire threading method, introduces additional metal material into the soldered cable end. This discontinuity in the reference ground causes a sudden change in the characteristic impedance at that location. The resulting impedance abrupt changes lead to parameters such as integrated multiple reflections (IMR), integrated return loss (IRL), and insertion loss (ILF), all of which do not meet the requirements of high-frequency data cables. Figure 2 For example, an unqualified insertion loss mutation diagram, such as Figure 2 As shown: Insertion loss (ILF) and other factors cause signal distortion and affect the stability of high-frequency data transmission.

[0003] Therefore, during the manufacturing and assembly of high-frequency data cables, the grounding loop should be considered as a complete signal return path, and its topology must strictly adhere to the principles of low impedance and high smoothness. The design should strive to avoid any sharp geometric features that could lead to electric field concentration or impedance abrupt changes, in order to effectively suppress signal distortion caused by tip discharge effects and parasitic parameters. By optimizing the geometry of the grounding loop to ensure its continuity, smoothness, and low impedance, the loop inductance can be minimized, ensuring signal integrity (SI) and electromagnetic compatibility (EMC) of the system. Existing data cable grounding methods often use traditional auxiliary clamps for connection, which is not only cumbersome to operate but also prone to impedance abrupt changes at the connection point, resulting in discontinuities in the overall characteristic impedance of the cable.

[0004] Furthermore, traditional grounding loops are often insufficient, resulting in poor electromagnetic shielding and potentially affecting the stability of critical performance test results for data cables, such as IMR, IRL, and COM, making it difficult to improve product yield. Therefore, a new grounding structure and method are needed that can simplify the process, ensure impedance continuity, and improve shielding effectiveness. Summary of the Invention

[0005] The present invention aims to provide an integrated clamp, grounding component and grounding connection method for high-frequency data lines to optimize the geometry of the grounding loop, ensure its continuity, smoothness and low impedance and solve technical problems such as complex assembly.

[0006] To achieve the above-mentioned objectives, the present invention adopts the following technical solution: an integrated clamp for high-frequency data cables, comprising a first integrated clamp and a second integrated clamp stacked on top of each other, wherein the first integrated clamp and the second integrated clamp are provided with a plurality of signal line holes for inserting signal lines; the outer surfaces of the first integrated clamp and the second integrated clamp are provided with limit protrusions and slots located on the left and right sides.

[0007] In a preferred embodiment, the left and right signal lines of the first and second integrated clamps are connected by soldering to the ground layer of the signal lines themselves to form a first grounding cylinder and a second grounding cylinder with increased contact area.

[0008] The present invention also includes a grounding component, comprising two integral wire clamps and a grounding metal clamp, wherein the grounding metal clamp is clamped outside the two integral wire clamps, and the grounding metal clamp is provided with a limiting through hole, the limiting through hole being sleeved with the limiting protrusion.

[0009] The preferred embodiment is as follows: the grounding metal clip includes two structures, an upper and a lower one, namely a first grounding metal clip and a second grounding metal clip. The first grounding metal clip and the second grounding metal clip are provided with the limiting through hole in the middle, and the sides of the first grounding metal clip and the second grounding metal clip are provided with buckles that cooperate with the slot.

[0010] In a preferred embodiment, one end of the first grounding metal clamp is provided with a signal line grounding terminal and a power grounding terminal in sequence, and the other end extends with a cable grounding connection portion; one end of the second grounding metal clamp is provided with the signal line grounding terminal and the circuit board grounding terminal, and the other end extends with a cable grounding grip portion, wherein the cable connection portion and the cable grounding grip portion are combined and fastened to the end of the cable.

[0011] The preferred embodiment is as follows: the cable has a cable grounding layer, the cable grounding layer is connected to a copper foil grounding layer, and the ground wire overlap and the cable ground wire gripping part are fastened to the copper foil grounding layer to achieve grounding connection.

[0012] The preferred embodiment is as follows: when the first grounding metal clip and the second grounding metal clip are wrapped around the two integrated wire clips, the cable ground wire gripping part presses against the cable ground wire overlapping part and fastens to the outer periphery of the copper foil grounding layer of the cable.

[0013] A grounding connection method for a grounding component of a high-frequency data line includes the following steps: S1. Insert the signal wires into the signal wire holes of the first integrated wire clamp and the second integrated wire clamp, and solder the left and right signal wires with tin to form the first grounding post and the second grounding post. S2. Wrap the first grounding metal clip and the second grounding metal clip around the two integrated wire clips, align the limiting through hole and the limiting protrusion, and fix them by snapping them into the slot. S3. Connect the signal line to the reference ground via the signal line grounding terminal, and connect the circuit board to the ground via the circuit board grounding terminal; S4. Use the cable ground wire gripping part of the second grounding metal clamp to press down on the cable ground wire overlap part, and fasten it to the outer perimeter of the copper foil grounding layer of the cable to achieve complete grounding.

[0014] The preferred embodiment is that the first and second integrated wire clamps are obtained by injection molding, and the grounding metal clamp is a hardware metal product.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. Eliminate impedance abrupt changes: By using two integrated wire clamps in conjunction with a grounding metal clamp, the traditional "auxiliary wire clamp" is completely eliminated, thus eliminating the characteristic impedance discontinuities caused by the introduction of additional metal parts and ensuring the stability of signal transmission.

[0016] 2. Improved shielding effectiveness: The grounding metal clip forms a complete ground connection, which, together with the cable ground wire grip, achieves a seamless connection between the cable shielding layer and the connector terminal, significantly improving the electromagnetic shielding effect (EMI).

[0017] 3. Simplified process and improved yield: The integrated clamping and grounding design reduces assembly steps and avoids problems such as poor soldering and short circuits caused by manual welding of auxiliary clamps, thus ensuring the consistency of product performance. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1A schematic diagram of the structure of the existing auxiliary clamp 16; Figure 2 This is a diagram showing an unqualified insertion loss mutation. Figure 3 This is a schematic diagram showing the separate structure of the two integral wire clamps 1 of the present invention; Figure 4 This is a schematic diagram of the structure of the signal line 131 of the present invention; Figure 5 This is a schematic diagram showing the connection state between the grounding component and the cable 30 of the present invention; Figure 6 This is a schematic diagram of the structure of the cable 30 of the present invention in a first embodiment; Figure 7 This is a schematic diagram of the overall data cable structure of the present invention; Figure 8 This is a schematic diagram illustrating the insertion loss variation of a qualified data line 100.

[0020] Explanation of reference numerals in the attached figures: 1. Two integrated wire clamps; 12. Second integrated wire clamp; 13. Signal wire hole; 131. Signal wire; 1311. Ground layer; 1312. Metal layer; 1313. Adhesive backing layer; 14. Limiting protrusion; 161. First grounding post; 162. Second grounding post; 17. Slot; 21. Grounding metal clip; 211. First grounding metal clip; 212. Second grounding metal clip; 214. Signal wire grounding terminal; 215. Limiting through hole; 216. Buckle; 217. Circuit board grounding terminal; 2111. Cable grounding grip; 2121. Cable grounding overlap; 41. Metal shielding upper shell; 42. Metal shielding lower shell; 51. Upper holding structure; 52. Lower holding structure; 30. Cable; 31. Cable grounding layer; 32. Copper foil grounding layer; 60. Outer shell; 100. Connector. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indication, the directional indication is only used to explain the relative positional relationship and movement of the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0023] Furthermore, if the embodiments of this invention involve descriptions such as "first," "second," etc., these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," etc., may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0024] like Figure 3 , Figure 4 As shown, this embodiment of the invention provides two integrated wire clamps 1, which are divided into a first integrated wire clamp 11 and a second integrated wire clamp 12 that are stacked on top of each other. The first integrated wire clamp 11 and the second integrated wire clamp 12 are provided with a plurality of signal wire holes 13, and signal wires 131 are inserted into the signal wire holes 13 of the first integrated wire clamp 11 and the second integrated wire clamp 12.

[0025] The first integrated wire clamp 11 and the second integrated wire clamp 12 are provided with limiting protrusions 14 on their outer surfaces, which are sleeved with the limiting through hole 215 of the grounding metal clamp 21. The grounding metal clamp 21 is clamped outside the two integrated wire clamps 1, and the matching grounding metal clamp 21 increases the grounding area and reduces signal interference.

[0026] The structure of the signal line 131 is as follows: Figure 4 As shown: the ground layer 1311 is selected as a metal braided mesh. The metal braided mesh is typically made of multiple strands of extremely fine tinned copper wire or bare copper wire woven at a specific density and angle, forming a flexible and ductile tubular layer. The metal braided mesh provides excellent electromagnetic interference resistance and mechanical protection, and its porous structure facilitates dispersion and crimping during connector assembly. When the ground layer 1311 is selected as a metal braided mesh, during manufacturing, the metal braided mesh is woven or wrapped around the wire cores already bonded with the metal layer 1312. The adhesive layer 1313 on the inner surface of the metal layer 1312 firmly bonds the inner surface of the metal braided mesh to the outer surface of the metal layer 1312. This structure ensures that even if a portion of the metal braided mesh is cut or peeled off at the end, the remaining portion remains tightly connected to the complete metal layer 1312 below through the adhesive layer 1313. The metal wires are not easily completely loosened, and the metal layer 1312, as a continuous conductive layer, provides a reliable electrical connection foundation for all the metal wires.

[0027] Among them, the left and right signal lines 131 of the first integrated clamp 11 and the second integrated clamp 12 are connected by soldering to their own ground layer 1311 to form a first grounding cylinder 161 and a second grounding cylinder 162 with a larger contact area.

[0028] The signal line 131 itself has a shielded ground layer 1311.

[0029] The first grounding cylinder 161 and the second grounding cylinder 162 are tin-coated conductive surfaces.

[0030] The two integrated wire clamps 1 are provided with slots 17 on the left and right sides, which makes it easy for the buckle 216 of the grounding metal clamp 21 to be locked in the slots 17 and not move, making the structure more stable.

[0031] To match the two integrated wire clamps 1, the grounding metal clamp 21 also includes upper and lower structures corresponding to the two integrated wire clamps 1. More specifically, the grounding metal clamp 21 includes a first grounding metal clamp 211 and a second grounding metal clamp 212. The first grounding metal clamp 211 and the second grounding metal clamp 212 are provided with a limiting through hole 215 in the middle. When the first grounding metal clamp 211 and the second grounding metal clamp 212 are wrapped around the two integrated wire clamps 1, the limiting protrusion 14 corresponding to the two integrated wire clamps 1 achieves the limiting.

[0032] The first grounding metal clip 211 has a signal line grounding terminal 214 at one end, with a short, thick power grounding terminal 215 pressing against the power supply of the circuit board. The other end extends into a cable grounding connection portion 2121. Similarly, the second grounding metal clip 212 has a signal line grounding terminal 214 at one end, with a circuit board grounding terminal 215 having multiple bends in the middle. The other end of the second grounding metal clip 212 extends into a cable grounding grip portion 2111. When the first grounding metal clip... When the grounding metal clip 211 and the second grounding metal clip 212 are wrapped around the two integrated wire clips 1, the signal line grounding terminal 214 at one end is connected to the reference ground of the signal line 131, and the cable grounding overlap 2121 at the other end overlaps on the copper foil grounding layer (32) of the cable 30. The cable grounding grip 2111 of the second grounding metal clip 212 presses the grounding overlap 2121 against the outer periphery of the copper foil grounding layer (32), making the overlapped cable 30 more stable and achieving a complete ground connection.

[0033] like Figure 5 As shown: The cable 30 has a cable grounding layer 31, and the cable grounding layer 31 is connected to a copper foil grounding layer 32. The ground wire overlap 2121 and the cable ground wire gripping part 2111 are gripped by the copper foil grounding layer 32 to achieve grounding connection. The grounding connection through the copper foil grounding layer 32 and the grounding metal clip 21 is more reliable.

[0034] The copper foil grounding layer 32 is a solder grounding layer.

[0035] The first integrated wire clamp 11 and the second integrated wire clamp 12 can be obtained by injection molding, wherein the grounding metal clamp 21 is a hardware metal product.

[0036] The process of completing a complete grounding using two integrated wire clamps 1 is briefly described as follows: First, the signal wire 131 is inserted into the signal wire hole 13 of the first integrated wire clamp 11 and the second integrated wire clamp 12. The two signal wires 131 are connected by soldering to form a first grounding cylinder 161 and a second grounding cylinder 162 with increased contact area. The first grounding metal clamp 211 and the second grounding metal clamp 21 are clamped around the integrated wire clamp 1. The limiting protrusion 14 Aligned with the limiting through hole 215, and then connected to the slots 17 on the left and right sides of the two integrated wire clamps 1 by the buckles 216 of the first grounding metal clamp 211 and the second grounding metal clamp 212. At this time, the signal line grounding terminal 214, the power grounding terminal 215 and the circuit board grounding terminal 217 are fully connected to the ground. Then, the cable ground wire gripping part 2111 at the other end of the second grounding metal clamp 212 presses against the cable ground wire overlapping part 2121 and grips the outer periphery of the copper foil grounding layer 32 of the cable 30, so as to achieve complete grounding.

[0037] like Figure 6 As shown, the process of assembling connector 100 using two integrated wire clips 1 is briefly described as follows: After the two integrated wire clips 1 are inserted into the signal line 13 and the grounding is completed by the first grounding metal clip 211 and the second grounding metal clip 212, the position of the signal line 13 is fixed by the upper holding structure 51 and the lower holding structure 52. The outer metal shielding upper shell 41 and the metal shielding lower shell 42 are sleeved on the grounding metal clip 21. Finally, the outer shell 60 is pushed in and locked to complete the assembly process of the entire data line 100.

[0038] Figure 6 This is a schematic diagram showing the change in insertion loss of a qualified data cable 100. The qualified rate of the connector 100 obtained through the structure of this invention is significantly increased.

[0039] Compared with the prior art, the present invention has the following beneficial effects: 1. By using two integrated wire clamps 1 for cable stripping and complete connection, the traditional auxiliary wire clamp method is completely eliminated, thus fundamentally eliminating the impedance change points caused by this, and making the overall characteristic impedance of the cable remain continuous and stable.

[0040] 2. Simultaneously, the grounding metal clip 21 ensures the sufficiency and continuity of the grounding loop, improves the electromagnetic shielding effect, and simplifies the subsequent manufacturing process of high-frequency data line connectors. This guarantees the stability and pass rate of key performance test results such as IMR, IRL, and COM of the data line, thereby improving product performance. In summary, the foregoing disclosure of this invention is intended to enable those skilled in the art to clearly understand the technical content of this invention and implement it accordingly, and is not intended to limit the scope of patent protection of this invention. In addition, this invention may naturally have other embodiments not listed. Without departing from the spirit and essence of this invention, those skilled in the art should be able to devise various corresponding changes and modifications based on this invention, but all such changes and modifications should fall within the scope of protection of the patent application filed for this invention.

Claims

1. An integrated clip for a high frequency data cable, comprising: It includes a first integrated wire clamp (11) and a second integrated wire clamp (12) stacked on top of each other. The first integrated wire clamp (11) and the second integrated wire clamp (12) are provided with a plurality of signal wire holes (13) for inserting signal wires (131). The outer surfaces of the first integrated wire clamp (11) and the second integrated wire clamp (12) are provided with limit protrusions (14) and slots (17) located on the left and right sides.

2. The two-piece integrated wire clamp of claim 1, wherein, The left and right signal lines (131) of the first integrated clamp (11) and the second integrated clamp (12) are connected by soldering to the ground layer (1311) of the signal lines (131) to form a first grounding cylinder (161) and a second grounding cylinder (162) with increased contact area.

3. Ground assembly comprising two one-piece wire clamps (1) according to any one of claims 1 to 3, characterized in that It also includes a grounding metal clip (21), which is clamped on the outside of the two integrated wire clips (1). The grounding metal clip (21) is provided with a limiting through hole (215), which is sleeved with the limiting protrusion (14).

4. The grounding assembly of claim 3, wherein, The grounding metal clip (21) includes two upper and lower structures, namely a first grounding metal clip (211) and a second grounding metal clip (212). The first grounding metal clip (211) and the second grounding metal clip (212) are provided with the limiting through hole (215) in the middle, and the first grounding metal clip (211) and the second grounding metal clip (212) are provided with buckles (216) that cooperate with the slot (17) on their sides.

5. The grounding assembly of claim 4, wherein, One end of the first grounding metal clip (211) is provided with a signal line grounding terminal (214) in sequence, and the other end extends with a cable grounding connection part (2121); one end of the second grounding metal clip (212) is provided with the signal line grounding terminal (214) and the circuit board grounding terminal (217), and the other end extends with a cable grounding grip part (2111). The cable connection part (2121) and the cable grounding grip part (2111) are combined and fastened to the end of the cable (30).

6. The grounding assembly of claim 5, wherein, The cable (30) has a cable grounding layer (31), the cable grounding layer (31) is connected to a copper foil grounding layer (32), and the ground wire overlap (2121) and the cable ground wire gripping part (2111) are gripped in the copper foil grounding layer (32) to achieve grounding connection.

7. The grounding assembly of claim 6, wherein, When the first grounding metal clip (211) and the second grounding metal clip (212) are wrapped around the two integrated wire clips (1), the cable ground wire gripping part (2111) presses against the cable ground wire overlapping part (2121) and fastens to the outer periphery of the copper foil grounding layer (32) of the cable (30).

8. The grounding assembly of claim 6, wherein, The copper foil grounding layer (32) is a solder grounding layer.

9. A method of grounding connection of a grounding assembly according to any one of claims 4 to 8, characterized in that, Includes the following steps: S1. Insert the signal line (131) into the signal line hole (13) of the first integrated wire clamp (11) and the second integrated wire clamp (12), and solder the left and right signal lines (131) with tin to form the first grounding cylinder (161) and the second grounding cylinder (162). S2. Wrap the first grounding metal clip (211) and the second grounding metal clip (212) around the two integrated wire clips (1), so that the limiting through hole (215) and the limiting protrusion (14) are aligned and sleeved, and then fixed by snapping the buckle (216) into the slot (17); S3. Connect the signal line (131) to the reference ground via the signal line grounding terminal (214), and connect the circuit board to the ground via the circuit board grounding terminal (217); S4. Using the cable ground wire gripping part (2111) of the second grounding metal clip (212) to press the cable ground wire lap part (2121), and using the cable ground wire gripping part of the second grounding metal clip to press the cable ground wire lap part, it is fastened to the outer periphery of the copper foil grounding layer (32) of the cable (30) to achieve complete grounding.

10. The grounding connection method according to claim 9, wherein The first integrated wire clamp (11) and the second integrated wire clamp (12) are obtained by injection molding, and the grounding metal clamp (21) is a hardware metal product.

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