Memory adaptive precision docking device

Abstract

This invention relates to the field of wafer testing technology and discloses an adaptive precision docking device for memory chips, comprising: a motherboard; a guide rail; a locking disc; a hook plate; an adapter plate; a spring pin holder; and mounting blocks. A plurality of mounting blocks in a circular array are mounted on the top of the reinforcing plate. Rollers are rotatably mounted on the mounting blocks, and the rollers, in conjunction with the hook plate, cause the other end of the double-ended spring pin to elastically contact the motherboard; and a sensor. By setting a rotational locking engagement between the hook plate and the rollers, the rotation of the locking disc causes the rollers to move along an L-shaped locking groove, synchronously compressing the double-ended spring pins. Compared to the traditional axial direct pressure method, this significantly reduces the external force required for installation, making operation more labor-saving and convenient. Simultaneously, the synchronous compression ensures uniform force distribution on the motherboard and adapter plate, effectively preventing damage to connectors or circuit boards due to excessive local pressure, and significantly improving assembly reliability and yield.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and more specifically to a memory adaptive precision docking device. Background Technology

[0002] In modern semiconductor manufacturing and packaging processes, wafer testing is a critical step in ensuring chip yield and reliability. This step typically relies on the high-precision docking of an automated probe station and a testing machine. At the interface between the testing machine and the probe station, a transition structure known as MPDD (Memory Pogo Direct Docking) or something similar is usually required. This structure acts as a physical and electrical transition layer between the testing machine channel and the probe card, playing a crucial role in bridging the gap between the two.

[0003] In practical applications, to adapt to the testing requirements of different wafer products (such as different pin definitions, power supply configurations, or signal frequencies), the industry typically uses MPDD replacement to achieve low-cost reconfiguration of test resources. To achieve this replaceability, the connection between the MPDD and the internal circuit board of the test equipment generally relies on high-density dedicated connectors, with the pogo pin connection being the most common. As the integration density of integrated circuits increases, the number of contacts on a single MPDD often reaches thousands or even tens of thousands of pins.

[0004] However, the existing technology has the following drawbacks: First, the assembly and disassembly process is difficult. Since the contact reliability of the spring-loaded ejector pins depends on their specified compression stroke (i.e., working height), to ensure a reliable electrical connection between tens of thousands of ejector pins simultaneously, an enormous overall external force (typically ranging from tens to hundreds of kilograms) is required to overcome the spring's elasticity. Under this enormous preload, if the MPDD mounted at the bottom of the testing machine is tightened and secured with screws using conventional manual methods, not only is the operation extremely difficult and alignment accuracy hard to guarantee, but uneven compression control can easily lead to inconsistent stress in certain areas, resulting in poor local contact or connector damage.

[0005] Secondly, interface stability under long-term operating conditions is difficult to guarantee. During the long-term docking between the test machine and the probe station, the interface components are not only subjected to continuous mechanical stress, but may also be affected by temperature fluctuations in the test environment. Under prolonged stress and heat conditions, the interfaces of the multi-layered structure inside the MPDD (such as the PCB board, reinforcing frame, and connectors) are prone to creep or slight deformation. Due to the lack of effective real-time monitoring methods, such deformation of the internal interface is difficult to predict, often suddenly causing contact failure during testing, leading to test interruption or data errors.

[0006] Furthermore, thermal compatibility issues are prominent in high and low temperature testing environments. With increasingly stringent testing requirements in fields such as automotive electronics and high-performance computing, wafer testing needs to be conducted in high or low temperature environments (e.g., -40°C to 150°C). It is well known that the coefficients of thermal expansion (CTE) of the various materials constituting MPDD (such as the plastic frame, metal reinforcements, and FR-4 substrate) differ significantly when temperatures change drastically. This difference not only leads to interlayer thermal stress but, more importantly, causes a misalignment between the probe contacts and the testing machine interface. In high-density, fine-pitch precision testing connections, even micrometer-level displacement can lead to contact misalignment or short circuits. Simultaneously, high-temperature environments exacerbate material deformation under stress, further deteriorating connection reliability.

[0007] Therefore, designing an MPDD connection scheme that can withstand high-pressure assembly and maintain structural stability and reliable contact over a wide temperature range, while ensuring easy replacement operation, has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0008] The purpose of this invention is to address the shortcomings of existing technologies by providing a memory adaptive precision docking device, which achieves uniform force distribution under high pressure while ensuring ease of installation, and can suppress thermal deformation and compensate for relative displacement caused by temperature drift.

[0009] The objective of this invention can be achieved through the following technical solutions: An adaptive precision docking device for memory chips includes a base plate and a reinforcing plate, the base plate being mounted on the bottom of an external testing machine, and the device further includes: Mother plate, which is embedded and mounted on the substrate; Guide rail, which is mounted on the bottom of the substrate; A locking disc, which is rotatably mounted on a guide rail, has several hollowed-out sections on it; Hook plates, and a plurality of hook plates are provided at the bottom of the locking disc; An adapter plate is installed at the bottom of a reinforcing plate and is connected to an external probe station. The reinforcing plate has a number of outer ring spring pin seats in a ring array and a central spring pin seat installed on its top. The spring pin seats are equipped with a number of double-headed spring pins, and one end of each double-headed spring pin is in elastic contact with the adapter plate. Mounting blocks, the top of the reinforcing plate is equipped with a number of mounting blocks arranged in a ring, and rollers are rotatably mounted on the mounting blocks. After the rollers cooperate with the hook plate, the other end of the double-headed spring needle makes elastic contact with the mother plate. The sensor is mounted on the top of the reinforcing plate. The number of sensors is the same as the number of mounting blocks, and the sensors correspond one-to-one with the mounting blocks.

[0010] As a further aspect of the present invention: the hook plate is provided with an L-shaped locking groove, which is composed of a vertical section, an inclined section, a horizontal section and a recessed section. The roller moves along the vertical section, the inclined section and the horizontal section and enters the recessed section.

[0011] As a further aspect of the present invention: the reinforcing plate is provided with a plurality of movable grooves, the mounting block is longitudinally slidably installed in the movable grooves, the bottom of the mounting block is wedge-shaped and has an inclined groove, a slider is slidably installed in the inclined groove, a wedge block is provided on the other side of the slider, a driving member is connected to the side of the wedge block, and the driving member penetrates the reinforcing plate and is installed on the outside of the reinforcing plate. As a further aspect of the present invention: the wedge block abuts against the bottom of the movable groove.

[0012] As a further embodiment of the present invention: a mounting groove is provided on the reinforcing plate at the position corresponding to the sensor, the output end of the sensor passes through the mounting groove, a touch ring is provided around the output end of the sensor, and a touch plate is provided on the inner wall of the mounting groove.

[0013] As a further aspect of the present invention: the touch ring initially contacts the touch plate and is located at the upper part of the touch plate; the touch ring and the touch plate are connected to form a circuit and connected to an external control unit; the external control unit is also connected to a driving component.

[0014] As a further aspect of the present invention: a flow channel is provided inside the reinforcing plate, and an inlet hole and a outlet hole are respectively provided at both ends of the flow channel.

[0015] As a further aspect of the present invention, a handle is mounted on the locking disc.

[0016] The beneficial effects of this invention are: (1) By setting a rotational locking engagement between the hook plate and the roller, the locking disc rotates to move the roller along the L-shaped locking groove, which drives the double-headed spring pin to compress synchronously. Compared with the traditional axial direct pressure method, this invention not only greatly reduces the external force required for installation and makes the operation more labor-saving and convenient, but also ensures that the mother plate and the adapter plate are subjected to uniform force through synchronous compression, effectively avoiding damage to the connector or circuit board caused by excessive local pressure, and significantly improving the reliability and yield of assembly.

[0017] (2) By setting up a sensor and an adjustable height mounting block, the present invention uses the sensor to monitor the force in each area in real time, and combines the circuit on / off feedback of the contact ring and the contact plate. When uneven force is detected, the external control unit automatically drives the wedge to move, and adjusts the longitudinal height of the corresponding mounting block through the inclined groove, thereby compensating for the difference in local compression caused by the non-parallelism between the test machine and the probe station or thermal deformation, realizing adaptive and uniform adjustment of contact pressure, and ensuring connection stability under long-term working conditions.

[0018] (3) By opening a flow channel in the reinforcing plate and cooperating with temperature control, the present invention automatically conducts the coolant for heat exchange when the temperature exceeds the limit, so that the reinforcing plate is always within a controllable temperature range, effectively suppressing the volume change and relative position shift caused by thermal expansion, avoiding contact misalignment or short circuit during high and low temperature tests, thereby ensuring the reliability of precision docking in a wide temperature range environment. Attached Figure Description

[0019] The invention will now be further described with reference to the accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a structural schematic diagram from another perspective of the present invention; Figure 3 This is a schematic diagram of the connection between the guide rail and the locking disc in this invention; Figure 4 This is a schematic diagram of the spring needle seat structure in this invention; Figure 5 This is a schematic diagram of the mounting block and sensor structure in this invention; Figure 6 This is a schematic diagram of the structure after the mounting block and wedge block are separated in this invention; Figure 7 This is a schematic diagram of the hook plate structure in this invention; Figure 8 This is a schematic diagram of the flow channel structure in this invention.

[0021] In the picture: 1. Base plate; 2. Mother plate; 3. Guide rail; 4. Locking plate; 41. Handle; 5. Hook plate; 6. Reinforcing plate; 61. Movable groove; 62. Mounting groove; 63. Flow channel; 631. Liquid inlet hole; 632. Liquid outlet hole; 7. Adapter plate; 8. Spring needle seat; 81. Double-headed spring needle; 9. Mounting block; 91. Roller; 92. Inclined groove; 93. Wedge block; 931. Slider; 94. Drive component; 10. Sensor; 101. Contact ring; 102. Contact plate. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] like Figures 1-7 As shown, a memory adaptive precision docking device includes a substrate 1 and a reinforcing plate 6. The substrate 1 is mounted on the bottom of an external testing machine. The device further includes: Motherboard 2 is embedded in the base plate 1; Guide rail 3 is mounted on the bottom of substrate 1; Locking disc 4 is rotatably mounted on guide rail 3. Several hollowed-out parts are opened on locking disc 4. A handle 41 is installed on locking disc 4. Hook plate 5, several hook plates 5 are provided at the bottom of locking disc 4; Adapter plate 7 is installed at the bottom of reinforcing plate 6 and is connected to external probe station; The spring needle seat 8 and the reinforcing plate 6 are equipped with a number of outer ring spring needle seats 8 in a ring array and a central spring needle seat 8. The spring needle seat 8 is equipped with a number of double-headed spring needles 81. One end of the double-headed spring needle 81 is in elastic contact with the adapter plate 7. Mounting block 9, the top of reinforcing plate 6 is equipped with several ring array mounting blocks 9, and rollers 91 are rotatably mounted on mounting block 9. After the rollers 91 cooperate with hook plate 5, the other end of double-headed spring needle 81 makes elastic contact with mother plate 2. Sensor 10: Several sensors 10 are mounted on the top of the reinforcing plate 6. The number of sensors 10 is the same as the number of mounting blocks 9. Several sensors 10 correspond one-to-one with several mounting blocks 9.

[0024] The hook plate 5 has an L-shaped locking groove, which consists of a vertical section, an inclined section, a horizontal section and a recessed section. The roller 91 moves along the vertical section, the inclined section and the horizontal section and enters the recessed section.

[0025] In one embodiment, sensor 10 can be a pressure sensor or a displacement sensor. The purpose of setting sensor 10 is to dynamically monitor the contact situation during the docking process between the test machine and the probe station, and to determine whether the force is uniform by the compression / displacement of the force sensors distributed at each point (which is eventually converted into voltage or current signals).

[0026] In practical application, during the docking of the testing machine and the probe station, either the substrate 1 or the reinforcing plate 6 is moved towards the other. Several spring pin seats 8 and several double-headed spring pins 81 pass through the hollowed-out portion of the locking disc 4 and contact the mother plate 2. Simultaneously, the roller 91 on the mounting block 9 enters the vertical section a of the locking groove. At this point, the double-headed spring pins 81 are not yet compressed. When the roller 91 moves to the end of the vertical section a, the locking disc 4 is rotated via the handle 41, causing the roller 91 to move along the inclined section b. During this process, the double-headed spring pins 81 begin to be compressed, and an electrical connection is established between the double-headed spring pins 81 and the mother plate 2. When the roller 91 moves to the end of the inclined section b, it enters the horizontal section c and moves along it. At this point, the double-headed spring pins 81 are no longer compressed, and the electrical connection between the double-headed spring pins 81 and the mother plate 2 is complete. When roller 91 moves to the end of horizontal section c, it enters the recessed section d. Since the position of recessed section d is slightly lower than that of horizontal section c, roller 91 will fall vertically a short distance and enter the end of locking groove. At this time, the compression state of double-headed spring pin 81 will be slightly released. Through the rebound ability of several double-headed spring pins 81, roller 91 is firmly fixed in hook plate 5, thereby achieving stable docking. By using rotation to compress several double-headed spring pins 81 synchronously, it is more labor-saving than to compress double-headed spring pins 81 by moving them axially. At the same time, during the compression of double-headed spring pins 81, it can ensure that the mother plate 2 and the adapter plate 7 are subjected to uniform force (by the elastic force of several double-headed spring pins 81), ensuring good contact while avoiding damage to the mother plate 2 or the adapter plate 7 due to uneven force. By setting up several sensors 10, the contact situation can be dynamically monitored, and the uniformity of force distribution can be determined by the compression / displacement of the force sensors at each point. For example, if the parallelism between the bottom surface of the testing machine and the upper surface of the probe station is poor or the internal structure is deformed, some force sensors will have large compression values ​​while others will have small compression values. By analyzing the inconsistency in the data, problems during the docking process can be avoided in advance. Here, the positions of the sensors 10 are calibrated on the reference plane (marble plane), and the measurement consistency of the sensors 10 themselves is also calibrated. The judgment threshold can be set by software. If the difference between the maximum and minimum values ​​exceeds a certain range, the initial docking is considered unqualified. At the same time, during the subsequent docking process, the sensors 10 can also monitor the deformation of the bottom under lifting and unloading forces, as well as the adverse effects of long-term slow material creep, providing a method for finally finding problems.

[0027] like Figures 4-6As shown, the reinforcing plate 6 has several movable slots 61. The mounting block 9 is longitudinally slidably installed in the movable slot 61. The bottom of the mounting block 9 is wedge-shaped and has an inclined groove 92. A slider 931 is slidably installed in the inclined groove 92. A wedge 93 is provided on the other side of the slider 931. The wedge 93 abuts against the bottom of the movable slot 61. A driving member 94 is connected to the side of the wedge 93. The driving member 94 passes through the reinforcing plate 6 and is installed on the outside of the reinforcing plate 6.

[0028] Furthermore, the drive unit 94 can be a combination of a miniature cylinder or a miniature motor and a lead screw, and the drive unit 94 is used to drive the wedge block 93 to move horizontally.

[0029] In practical applications, after docking, some double-headed spring pins 81 may experience uneven compression due to factors such as the tester and probe station not being parallel or the docking structure deforming due to temperature. This can lead to uneven force on the mother plate 2 or adapter plate 7, resulting in poor local contact. By setting a wedge block 93, when the force is uneven, the sensor 10 will detect it and then control the drive component 94 to move the wedge block 93. Through the cooperation of the slider 931 and the inclined groove 92, the longitudinal height of the mounting block 9 can be adjusted, thereby adjusting the longitudinal height of the roller 91. Since the roller 91 is fixed inside the hook plate 5, the height of the hook plate 5 in the corresponding area can be adjusted, causing the mother plate 2 in this area to move slightly downward or upward. This causes the double-headed spring pins 81 in this area to compress or extend, ensuring that the compression of the double-headed spring pins 81 is consistent, thus ensuring that the force on the mother plate 2 or adapter plate 7 is uniform and ensuring the stability of the docking.

[0030] Furthermore, a mounting groove 62 is provided on the reinforcing plate 6 at the position corresponding to the sensor 10. The output end of the sensor 10 passes through the mounting groove 62. A touch ring 101 is provided around the output end of the sensor 10. A touch plate 102 is provided on the inner wall of the mounting groove 62. Initially, the touch ring 101 is in contact with the touch plate 102 and is located at the upper position of the touch plate 102. The touch ring 101 and the touch plate 102 are connected to form a circuit and connected to an external control unit. The external control unit is also connected to the driving component 94.

[0031] In one embodiment, the inner ring of the contact ring 101 is made of insulating material to prevent the electrical connection between the double-ended spring pin 81 and the mother plate 2 and the adapter plate 7 from being affected, and the contact plate 102 is made of conductive material.

[0032] In practical application, initially, the touch ring 101 and the touch plate 102 are in contact. After the double-headed spring pin 81 completes the electrical connection with the mother plate 2 and the adapter plate 7, the output end of the sensor 10 is also squeezed, at which point the touch ring 101 separates from the touch plate 102. When the touch ring 101 is in contact with the touch plate 102, the circuit is connected, and the external control unit does not control the drive component 94 to start. When all the touch rings 101 are separated from the touch plate 102, the information of the circuit being disconnected is transmitted to the external control unit, at which point the external control unit also does not control the drive component 94 to start. When one or more touch rings 101 are still in contact with the touch plate 102, this is manifested as some of the double-headed spring pins 81 being in contact. If the compression is too large or too small, the information that some circuits are connected and some circuits are disconnected is transmitted to the external control unit. At this time, the external control unit controls the drive component 94 to start, thereby adjusting the height of the mounting hole 9. The sensor 10 dynamically monitors the contact status, and together with the circuit continuity status of several sets of contact rings 101 and contact plates 102, it can play a dual detection role. That is, if one fails, the other can continue to monitor, ensuring the stability of dynamic monitoring. On the other hand, during dynamic monitoring, it can automatically adjust the height of the mounting block 9 at the corresponding position, so as to automatically adjust to uniform force when the force is uneven, thereby avoiding test interruption or data error.

[0033] like Figure 2 and Figure 8 As shown, a flow channel 63 is provided inside the reinforcing plate 6, and an inlet hole 631 and a outlet hole 632 are respectively provided at both ends of the flow channel 63.

[0034] In one embodiment, the flow channel 63 is simulated to ensure the uniformity of its flow rate. At the same time, a temperature sensor is embedded inside and transmits temperature information to the external control unit in real time. The temperature is set to a threshold, and a solenoid valve is provided at the front end of the liquid inlet 631. Under normal circumstances, the solenoid valve is closed and the internal coolant does not flow.

[0035] In practical application, when the temperature of the reinforcing plate 6 exceeds the limit, the solenoid valve at the front end of the liquid inlet 631 opens, and the coolant enters the flow channel 63 to begin circulating and heat exchange. When the set temperature is reached, the operation stops, ensuring that the reinforcing plate 6 is always within a controllable temperature range. This ensures that its volume change is controllable, avoids the relative position of the double-headed spring pin 81 and the adapter plate 7 or the mother plate 2 from shifting, and avoids contact misalignment or short circuit during test docking, thereby ensuring the reliability of docking.

[0036] Working principle: When the testing machine is docked with the probe station, one of the substrate 1 or the reinforcing plate 6 is first moved towards the other. At this time, several double-headed spring pins 81 on the reinforcing plate 6 pass through the hollow part of the locking plate 4 and move closer to the mother plate 2. At the same time, the rollers 91 on the mounting block 9 enter the vertical section a of the locking groove on the hook plate 5. At this time, the double-headed spring pins 81 are in an uncompressed state. As the movement continues, the rollers 91 move to the end of the vertical section a. Then, the locking plate 4 is rotated by the handle 41, and the rollers 91 move along the inclined section b. When the roller 91 moves to the end of the inclined section b, it enters the horizontal section c. At this time, the compression of the double-headed spring needle 81 reaches its maximum and no longer increases. When the roller 91 moves to the end of the horizontal section c, it enters the sinking section d. Since the sinking section d is slightly lower, the roller 91 falls vertically a short distance, and the compression of the double-headed spring needle 81 is slightly released. At this time, the double-headed spring needle 81 slides out from the slope 112 and contacts the mother plate 2 to establish an electrical connection. The rebound force of the double-headed spring needle 81 is used to firmly fix the roller 91 in the hook plate 5, completing the stable docking.

[0037] During the docking process, sensor 10 monitors the force or displacement of each area in real time and transmits the signal to the external control unit. Simultaneously, the contact ring 101 at the output end of sensor 10 is initially in contact with the contact plate 102 in the mounting groove 62. As the double-headed spring pins 81 are compressed, the output end of sensor 10 is squeezed, and the contact ring 101 separates from the contact plate 102. When the external control unit detects that some contact rings 101 and contact plates 102 are still in contact while others have separated, it indicates uneven force distribution. At this time, the control unit activates the corresponding drive component 94, driving the wedge block 93 to move horizontally. Through the cooperation of the slider 931 and the inclined groove 92, the longitudinal height of the mounting block 9 is adjusted, thereby changing the height of the roller 91 in the corresponding area, causing a slight displacement of the mother plate 2 in that area. Ultimately, this makes the compression of all double-headed spring pins 81 more uniform, achieving adaptive adjustment for uniform force distribution.

[0038] During operation, when the temperature of the reinforcing plate 6 exceeds the set threshold, the solenoid valve at the front end of the inlet hole 631 opens, allowing coolant to enter the flow channel 63 for heat exchange, maintaining the reinforcing plate 6 within a controllable temperature range. Once the temperature returns to normal, the solenoid valve closes, thus suppressing relative positional shifts caused by thermal deformation and ensuring long-term stability of the connection. When disconnection is required, the handle 41 is rotated in the opposite direction, causing the roller 91 to disengage from the lower section d and move in the opposite direction along the horizontal section c and the inclined section b. The double-headed spring needle 81 gradually releases its compression, allowing for easy separation.

Claims

1. A memory adaptive precision docking device, comprising a base plate (1) and a reinforcing plate (6), wherein the base plate (1) is mounted on the bottom of an external testing machine, characterized in that, The device further includes: Mother plate (2), which is embedded in the base plate (1); Guide rail (3), the guide rail (3) is mounted on the bottom of the base plate (1); Locking disc (4), the locking disc (4) is rotatably mounted on guide rail (3), and the locking disc (4) has several hollowed-out parts; Hook plate (5), the bottom of the locking disc (4) is provided with several hook plates (5); Adapter plate (7), which is installed at the bottom of reinforcing plate (6) and connected to external probe station; The reinforcing plate (6) has several outer ring spring needle seats (8) in a ring array and a central spring needle seat (8) installed on its top. Several double-headed spring needles (81) are installed inside the spring needle seats (8). One end of the double-headed spring needles (81) is in elastic contact with the adapter plate (7). Mounting block (9), the top of the reinforcing plate (6) is equipped with a number of mounting blocks (9) arranged in a ring array, and a roller (91) is rotatably mounted on the mounting block (9). After the roller (91) cooperates with the hook plate (5), the other end of the double-headed spring needle (81) makes elastic contact with the mother plate (2). Sensor (10): Several sensors (10) are installed on the top of the reinforcing plate (6). The number of sensors (10) is the same as the number of mounting blocks (9). Several sensors (10) correspond one-to-one with several mounting blocks (9).

2. The memory adaptive precision docking device according to claim 1, characterized in that, The hook plate (5) has an L-shaped locking groove, which consists of a vertical section, an inclined section, a horizontal section and a sunken section. The roller (91) moves along the vertical section, the inclined section and the horizontal section and enters the sunken section.

3. The memory adaptive precision docking device according to claim 1, characterized in that, The reinforcing plate (6) has several movable grooves (61). The mounting block (9) is longitudinally slidably installed in the movable grooves (61). The bottom of the mounting block (9) is wedge-shaped and has an inclined groove (92). A slider (931) is slidably installed in the inclined groove (92). A wedge (93) is provided on the other side of the slider (931). A driving member (94) is connected to the side of the wedge (93). The driving member (94) passes through the reinforcing plate (6) and is installed on the outside of the reinforcing plate (6).

4. The memory adaptive precision docking device according to claim 3, characterized in that, The wedge (93) abuts against the bottom of the movable groove (61).

5. The memory adaptive precision docking device according to claim 3, characterized in that, The reinforcing plate (6) has a mounting groove (62) at the position corresponding to the sensor (10). The output end of the sensor (10) passes through the mounting groove (62). A touch ring (101) is provided around the output end of the sensor (10). A touch plate (102) is provided on the inner wall of the mounting groove (62).

6. The memory adaptive precision docking device according to claim 5, characterized in that, The touch ring (101) is initially in contact with the touch plate (102) and is located above the touch plate (102). The touch ring (101) and the touch plate (102) are connected to form a circuit and connected to an external control unit. The external control unit is also connected to the drive unit (94).

7. The memory adaptive precision docking device according to claim 1, characterized in that, The reinforcing plate (6) has a flow channel (63) inside, and the two ends of the flow channel (63) are respectively provided with a liquid inlet hole (631) and a liquid outlet hole (632).

8. The memory adaptive precision docking device according to claim 1, characterized in that, A handle (41) is mounted on the locking disc (4).

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