Optical communication device testing method, apparatus, device, storage medium, and program product

Abstract

This application provides a testing method, apparatus, device, storage medium, and program product for optical communication devices. The method includes: acquiring test cases; the test equipment includes at least one of an automatic mating fixture, a vibration table, and a temperature cycling chamber; controlling at least one test device to perform test operations on a target device based on test parameters; the target device includes an optical transceiver and a multi-core connector; acquiring at least one test index during the test process using a multi-channel acquisition device; the test index includes at least one of optical, mechanical, and electrical indicators; and determining an assembly index of the target device based on the at least one test index, whereby the assembly index characterizes the assembly consistency and assembly environment reliability associated with the target device. This enables unified quantification and continuous traceability of test results for the target device under multi-stress conditions, thereby improving the comprehensiveness and consistency of reliability verification for automotive-grade optical communication devices.

Description

Technical Field

[0001] This application relates to the field of data processing technology, and in particular to a testing method, apparatus, equipment, storage medium, and program product for optical communication devices. Background Technology

[0002] With the rapid development of autonomous driving, intelligent connected vehicles and in-vehicle Ethernet technology, optical communication devices are increasingly widely used in the vehicle environment. Especially in scenarios that require high bandwidth transmission and resistance to electromagnetic interference, the stability of optical transceivers and multi-core connectors has become a key indicator.

[0003] In related technologies, most focus on a single dimension, such as only detecting the continuity of optical links or assessing bit error rate.

[0004] However, the in-vehicle environment often involves significant mechanical vibration, drastic temperature fluctuations, and frequent plugging and unplugging. Therefore, the methods described above are often insufficient to fully verify the reliability of optical communication devices throughout the vehicle's lifecycle. Summary of the Invention

[0005] This application provides testing methods, apparatus, equipment, storage media, and program products for optical communication devices, in order to comprehensively verify the reliability of optical communication devices throughout the vehicle's lifecycle.

[0006] In a first aspect, embodiments of this application provide a testing method for optical communication devices, including:

[0007] Obtain test cases, wherein the test cases include test parameters associated with at least one test device, and the test device includes at least one of an automatic mating fixture, a vibration table, and a temperature cycling chamber;

[0008] Based on the test parameters, the at least one test device is controlled to perform test operations on the target device, wherein the target device includes an optical transceiver and a multi-core connector.

[0009] At least one test index is collected during the test process using a preset multi-channel acquisition device. The test index includes at least one of optical index, mechanical index, and electrical index.

[0010] The assembly index of the target equipment is determined based on the at least one test index, and the assembly index is used to characterize the assembly consistency and assembly environment reliability associated with the target equipment.

[0011] In one possible implementation, the test parameters include one or more of insertion / removal parameters, vibration parameters, and temperature cycling parameters;

[0012] The insertion and extraction parameters include at least one of the following: insertion angle, insertion speed, displacement stroke, holding force, and extraction cycle.

[0013] The vibration parameters include at least one of the vibration frequency band and acceleration spectrum;

[0014] The temperature cycling parameters include at least one of the following: temperature cycling slope, upper and lower temperature limits, holding time, and interleaving action window.

[0015] In one possible implementation, controlling the at least one test device to perform test operations on the target device based on the test parameters includes:

[0016] Based on the insertion and removal parameters, the automatic insertion tooling is controlled to perform insertion and removal operations on the associated interface of the target device;

[0017] Based on the vibration parameters, the vibration table is controlled to apply vibration stress to the target equipment;

[0018] Based on the temperature cycling parameters, the temperature cycling chamber is controlled to apply temperature cycling stress to the target equipment.

[0019] In one possible implementation, controlling the at least one test device to perform test operations on the target device based on the test parameters includes:

[0020] Based on the test parameters, the automatic fitting fixture, vibration table, and temperature circulation chamber are simultaneously controlled to perform test operations on the target equipment.

[0021] In one possible implementation, controlling the at least one test device to perform test operations on the target device based on the test parameters includes:

[0022] Based on the test parameters, the automatic mating fixture is controlled to perform mating and unmating operations on the associated interface of the target device.

[0023] In response to the automatic insertion and removal operation being completed by the automatic insertion fixture, the vibration table is controlled to apply vibration stress to the target device based on the test parameters, and the temperature cycling chamber is controlled to apply temperature cycling stress to the target device based on the test parameters.

[0024] In one possible implementation, the multi-channel acquisition unit includes at least one of an optical power monitor and a bit error rate monitor;

[0025] The acquisition of at least one test index during the test process via a preset multi-channel acquisition device includes:

[0026] The optical parameters during the test are collected by the optical power monitor, wherein the optical parameters include optical power;

[0027] The electrical indicators during the testing process are collected by the bit error rate monitor, wherein the electrical indicators include the bit error rate;

[0028] The mechanical parameters collected during the testing process by the automatic mating fixture include at least one of insertion force and springback displacement.

[0029] The number of times the temperature circulation chamber triggers compensation under temperature drift conditions is collected to obtain the number of temperature compensation actions.

[0030] In one possible implementation, determining at least one assembly index of the target equipment based on the at least one test index includes:

[0031] The assembly consistency index is calculated based on insertion force, springback displacement, first-time insertion success rate, and a preset first weight.

[0032] The assembly environment reliability index is calculated based on optical power, bit error rate, post-vibration settling time, and a preset second weight.

[0033] The assembly index is calculated based on the assembly consistency index, the assembly environment reliability index, and a preset third weight.

[0034] The first weight, the second weight, and the third weight are associated with the test vehicle model corresponding to the target device.

[0035] In one possible implementation, the method further includes:

[0036] Test logs will be generated based on the test results of this round of testing;

[0037] The test logs are stored in a preset storage path, which includes historical test logs associated with multiple rounds of testing.

[0038] In one possible implementation, the method further includes:

[0039] Based on the historical test logs in the storage path, the historical baseline data associated with the target device, and the preset trend algorithm, the change trend associated with the target device is determined, and the change trend includes at least one of the pass rate change trend and the degradation trend.

[0040] In one possible implementation, the method further includes:

[0041] Determine whether the at least one test index and the assembly index meet a preset first condition, wherein the first condition includes each test index being greater than a preset first threshold and the assembly index being greater than a second threshold.

[0042] In response to the fulfillment of the first condition, it is determined whether the trend of change meets a preset second condition, the second condition including the trend of change tending to stabilize;

[0043] If the target device meets the second condition, the target device is determined to have passed the test.

[0044] In one possible implementation, the method further includes:

[0045] If the target device passes the test, the target device is added to the admission list;

[0046] If any test index associated with the target device is less than the first threshold, but the assembly index is greater than the second threshold, a re-inspection operation is performed on the target device.

[0047] If the target device fails the test, the target device will be reworked and / or isolated.

[0048] Secondly, embodiments of this application provide an optical communication device testing system, including: a controller, at least one testing device, a target device, a multi-channel acquisition device, and a judgment device;

[0049] The controller is communicatively connected to the at least one test device, and the at least one test device is communicatively connected to the target device. The controller is used to control the at least one test device to perform test operations on the target device based on test parameters.

[0050] The multi-channel data acquisition unit is communicatively connected to the target device and is used to acquire at least one test index associated with the target device during the test.

[0051] The determination device is communicatively connected to the multi-channel data acquisition unit and is used to calculate the assembly index of the target device based on at least one test index.

[0052] In one possible implementation, the testing equipment includes at least one of an automatic fitting fixture, a vibration table, and a temperature cycling chamber;

[0053] The target device includes optical transceivers and multi-core connectors;

[0054] The multi-channel acquisition unit includes at least one of an optical power monitor, a bit error rate monitor, and an insertion / extraction force sensor.

[0055] Thirdly, embodiments of this application provide an optical communication device testing apparatus, comprising:

[0056] The acquisition module is used to acquire test cases, wherein the test cases include test parameters associated with at least one test device, and the test device includes at least one of an automatic mating fixture, a vibration table, and a temperature cycling chamber;

[0057] The control module is used to control the at least one test device to perform test operations on the target device based on the test parameters, wherein the target device includes an optical transceiver and a multi-core connector;

[0058] The acquisition module is used to acquire at least one test index during the test process through a preset multi-channel acquisition device. The test index includes at least one of optical index, mechanical index, and electrical index.

[0059] A processing module is configured to determine the assembly index of the target device based on the at least one test index, wherein the assembly index is used to characterize the assembly consistency and assembly environment reliability associated with the target device.

[0060] Thirdly, embodiments of this application provide an electronic device, including: a memory and a processor;

[0061] The memory stores computer-executed instructions;

[0062] The processor executes computer execution instructions stored in the memory, causing the processor to perform the first aspect and / or various possible implementations of the first aspect as described above.

[0063] Fourthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the first aspect and / or various possible implementations of the first aspect.

[0064] Fifthly, embodiments of this application provide a computer program product, including a computer program that, when executed by a processor, implements the first aspect and / or various possible implementations of the first aspect.

[0065] The optical communication device testing method, apparatus, equipment, storage medium, and program product provided in this application acquire test cases containing test parameters associated with at least one test device, and control at least one test device to perform test operations on a target device including optical transceivers and multi-core connectors based on the test parameters. This enables the association and coverage of assembly-related states with test conditions such as vibration, temperature cycling, and mating. By using a preset multi-channel acquisition device to collect at least one optical, mechanical, and electrical index during the testing process, and determining an assembly index to characterize assembly consistency and assembly environment reliability based on at least one test index, the test results of the target device under multi-stress conditions can be uniformly quantified and continuously traced, thereby improving the comprehensiveness and consistency of reliability verification for automotive-grade optical communication devices. Attached Figure Description

[0066] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0067] Figure 1 This is a diagram of the system architecture upon which this application is based;

[0068] Figure 2 A schematic flowchart illustrating the testing method for optical communication devices provided in this application embodiment;

[0069] Figure 3 This is another flowchart illustrating the optical communication device testing method provided in the embodiments of this application;

[0070] Figure 4 This is another flowchart illustrating the optical communication device testing method provided in the embodiments of this application;

[0071] Figure 5 This is a schematic diagram of the signaling interaction of the optical communication device testing method provided in the embodiments of this application;

[0072] Figure 6 This is another flowchart illustrating the optical communication device testing method provided in the embodiments of this application;

[0073] Figure 7 This is a schematic diagram of the structure of the optical communication device testing apparatus provided in the embodiments of this application;

[0074] Figure 8 A schematic diagram of the structure of the electronic device provided in this application.

[0075] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0076] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0077] First, let me explain the terms used in this application:

[0078] Temperature cycling chamber: also known as a temperature cycling test chamber or high and low temperature alternating test chamber. It is a special environmental equipment for industrial reliability testing. It repeatedly applies alternating high and low temperature thermal stress to the sample to simulate the product's harsh winter, summer sun exposure, day and night temperature difference, and transportation / high-altitude sudden cooling and heating scenarios.

[0079] Vibration table: A device specifically designed for vibration reliability testing. It simulates the vibration environment that a product would actually encounter through controlled vibration, applies mechanical vibration stress to the sample, and identifies potential problems in the structure, interfaces, and solder joints. It is often used in conjunction with a temperature cycling chamber for comprehensive environmental testing.

[0080] Automatic mating fixture: also known as automatic connector mating fixture, it is an automated test fixture specifically designed for products such as plugs / sockets, wire harness interfaces, and battery connectors, which automatically completes repeated mating and unmold actions.

[0081] Automotive-grade optical communication device testing is a cross-disciplinary technical field that combines automotive electronics reliability verification with optical communication link quality assessment. It mainly targets the performance verification scenarios of automotive optical transceivers and multi-core connectors in mass production introduction, batch sampling inspection, and maintenance retesting.

[0082] In related technologies, optical link testing, network bit error rate detection, and environmental testing equipment are typically used to conduct tests separately. By collecting optical power, bit error rate, or environmental tolerance results at different workstations, it is determined whether the device meets the usage requirements. The working method is usually to first complete the connector mating, and then conduct vibration tests, temperature cycling tests, or individual performance tests.

[0083] However, while individual tests can reflect local performance, they are insufficient to capture the coupling effects of various stresses on optical transceivers and multi-core connectors under actual assembly conditions. In particular, they struggle to cover the interrelationships between mating actions, mechanical forces, optical transmission, and electrical performance. Because test parameters are dispersed across different equipment and processes, test results often lack a unified and comprehensive evaluation basis, making it difficult to directly reflect assembly consistency and reliability under assembly conditions.

[0084] In the process of solving the above-mentioned technical problems, the inventors discovered through research that by acquiring test cases including test parameters associated with the test equipment, at least one of the test equipment such as automatic mating fixtures, vibration tables, and temperature cycling chambers can be controlled to perform test operations on optical transceivers and multi-core connectors based on the test parameters. At least one of the test indicators among optical indicators, mechanical indicators, and electrical indicators can be collected using a multi-channel acquisition device, and then the assembly index of the target equipment can be determined based on the collected test indicators.

[0085] This technical approach is based on a collaborative testing architecture among test cases, test equipment, and multi-channel acquisition. It transforms the dispersed testing process into a correlated testing flow. Based on multi-dimensional features such as optical, mechanical, and electrical characteristics, it jointly determines the assembly index, enabling assembly consistency and assembly environment reliability to be characterized through the assembly index, thereby providing a basis for subsequent comprehensive evaluation and quality judgment.

[0086] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0087] Figure 1 This is a system architecture diagram on which this application is based, such as Figure 1 As shown, the system architecture includes at least: a controller 11, at least one test device 12, a target device 13, a multi-channel acquisition device 14, and a judgment device 15.

[0088] The controller 11 is communicatively connected to at least one test device 12, and the at least one test device 12 is communicatively connected to the target device 13. The controller 11 is used to control the at least one test device 12 to perform test operations on the target device 13 based on test parameters.

[0089] The multi-channel acquisition unit 14 is communicatively connected to the target device 13 and is used to acquire at least one test index associated with the target device 13 during the test.

[0090] The judgment device 15 is communicatively connected to the multi-channel acquisition device 14 and is used to calculate the assembly index of the target device 13 based on at least one test index.

[0091] In this embodiment, controller 11 refers to the main control unit used for unified scheduling and parameter distribution of the test process. It receives test cases and converts test parameters into control commands executable by each test device, thereby coordinating the implementation of each test action in a preset sequence or linkage mode to ensure that the test process is in a traceable and reproducible control state. Controller 11 is typically located at the main control position of the test bench, or integrated into an industrial computer, embedded control board, or programmable logic controller (PLC) control module. It establishes a communication connection with at least one test device through a wired or wireless interface. Physically, it can be installed in the test station and works in conjunction with the power module, signal conversion module, and safety interlock module. In one possible embodiment, it can be an industrial computer with a chassis-type control unit; in another possible embodiment, it can be an embedded main control board; and in yet another possible embodiment, it can be a control architecture composed of a PLC and a host computer.

[0092] Test equipment 12 refers to a set of actuators used to apply test actions to the target device under the drive of a controller. It is used to simulate the mechanical, environmental, or connection operation conditions that the target device 13 may experience during assembly and use, and to convert preset test parameters into actual action outputs. Test equipment 12 is communicatively connected to the target device 13 and can be arranged around, below, or at the corresponding test station of the target device to perform corresponding test operations on the target device 131. The test equipment 2 can be a single device or a combination of multiple devices as a linkage station according to test requirements. In terms of size, the shape of a single test equipment 12 can be configured according to the specifications and range of motion of the target device. Its working area usually corresponds to the interface position of the target device 12 to ensure that there is an achievable connection relationship between the test interface, clamping mechanism, and signal output path.

[0093] Optionally, the test equipment 12 includes at least one of an automatic fitting fixture, a vibration table, and a temperature cycling chamber.

[0094] Optionally, the target device 13 refers to the optical communication device to be tested and its related connected objects, which is used to receive corresponding test effects under the conditions of action applied by the test equipment and provide collectable optical, electrical, and mechanical responses. The target device 13 can be installed on a docking seat, clamping seat, or adapter bracket in the test station, so that its test ports, interfaces, and possible test points correspond to the test equipment 12 and the multi-channel acquisition device. In one possible embodiment, it can be different types of optical communication devices or their related connected objects; in terms of size, the shape and interface layout of the target device 13 can be determined according to the device specifications, and its relative position with the test equipment 12 should meet the requirements of test operation and acquisition lead layout, so that it can maintain a stable state under controlled action and output comparable test results. Optionally, the target device 13 includes optical transceivers and multi-core connectors.

[0095] The multi-channel data acquisition unit 14 refers to a data acquisition unit used to synchronously sample and report the multi-dimensional responses generated by the target device 13 during the testing process. It is used to collect at least one test index associated with the target device 13 at the same time reference, thereby providing a consistent data source for subsequent assembly index calculations. The multi-channel data acquisition unit 14 is communicatively connected to the target device 13, typically accessing the corresponding port of the target device 13 through an adapter interface. Sampling channels can be configured in a 1:1 or 1:n expansion manner according to the channel configuration to ensure that various indicators are acquired synchronously within the same test window without interference.

[0096] In one possible embodiment, it can be a PCB (Printed Circuit Board) board-type acquisition module; in another possible embodiment, it can be a chassis-type acquisition host; and in yet another possible embodiment, it can be a modular box-type distributed acquisition node. Internally, it may include sampling circuitry, a clock synchronization unit, an analog-to-digital conversion unit, and a data buffer unit. Its size can be determined based on the number of channels and the site layout. The acquisition unit can be directly installed on a bracket on the side of the test station, inside the control cabinet, or near the target equipment to shorten the signal path and facilitate a corresponding connection with the target equipment 13.

[0097] Optionally, the multi-channel acquisition unit 14 includes at least one of an optical power monitor, a bit error rate monitor, and an insertion / extraction force sensor.

[0098] The judgment device 15 refers to a processing unit used to parse, calculate, and output the data output by the multi-channel data acquisition unit 14. It calculates the assembly index of the target device 13 based on at least one test index and uses this index as the basis for unified judgment of assembly consistency and test results. The judgment device 15 is communicatively connected to the multi-channel data acquisition unit 14 and can be integrated with the controller 11 into the same main control platform. It can also be deployed in the test system as an independent computing server, edge computing module, or embedded judgment chip to perform timing alignment, data cleaning, integral calculation, threshold comparison, and index generation after the acquired data arrives.

[0099] In one possible embodiment, it can be a software decision module integrated into the controller 11; in another possible embodiment, it can be an independent edge computing terminal; and in yet another possible embodiment, it can be a cloud server or a local computing host. It exchanges data with the collector through a standard communication interface to ensure the integrity and consistency of the input data required for assembly index calculation.

[0100] The optical communication device testing system provided in this application, when started, first reads the test parameters corresponding to the target device according to the pre-loaded test cases, and distributes the parameters to at least one test device, so that the corresponding test devices execute the corresponding test actions according to a unified timing sequence. During the test, the multi-channel acquisition device synchronously accesses the relevant interfaces of the target device, samples at least one related test index in real time, and completes latching and uploading according to the same time base. After receiving the sampled data, the judgment device aligns the data of each channel, and then converts the test index into an assembly index according to a preset algorithm, thereby associating the state of the target device under the test conditions with the same evaluation result. Since the test actions are uniformly scheduled by the controller, the acquisition process is synchronously completed by the multi-channel acquisition device, and the results are centrally calculated by the judgment device, the data of each station, each batch of samples, and under different test conditions can maintain the same test caliber and correspondence, so that the assembly consistency, environmental adaptability, and traceability of test results can be uniformly characterized by the assembly index.

[0101] Figure 2 This is a flowchart illustrating the testing method for optical communication devices provided in the embodiments of this application, as shown below. Figure 1 As shown, the method includes:

[0102] Step 201: Obtain test cases. The test cases include test parameters associated with at least one test device. The test device includes at least one of the following: automatic mating fixture, vibration table, and temperature cycling chamber.

[0103] In this embodiment, test cases are used to carry the configuration and control information required for this test, serving as the unified execution basis for the entire test process. Test parameters are used to convert test cases into control quantities that can be recognized and issued by the controller, and test equipment is a set of devices that perform corresponding test operations on the target device.

[0104] Optionally, test cases can be obtained by the test controller reading pre-configured test case files from local storage, a server, or the manufacturing execution system, and parsing the test case files into device type, device address, action sequence, sampling trigger conditions, decision thresholds, and associated parameter tables. These test cases can be automatically generated based on a preset template, or they can be obtained by manually fine-tuning automatically generated test cases.

[0105] In one possible design, test cases include at least one set of test parameters corresponding to the test equipment. These test parameters may include control parameters corresponding to the selected test equipment. After acquiring the test cases, the controller can perform parameter mapping according to the device communication protocol, enabling the test parameters to be converted into control information executable by the corresponding test equipment. It should be understood that the above example is merely illustrative and not limiting. Based on the above analysis, by writing the control conditions during the testing process into the test cases and completing parameter parsing before execution, a unified device control and data caliber is established at the beginning of the testing process. This allows subsequent test operations and indicator collection to revolve around the same set of test parameters, providing a prerequisite for a unified evaluation of assembly consistency and assembly environment reliability.

[0106] Step 202: Control at least one test device to perform test operations on the target device based on test parameters. The target device includes optical transceivers and multi-core connectors.

[0107] In this embodiment, the target device is the object under test, including an optical transceiver that performs optical communication functions and a multi-core connector that is connected to it. The test equipment performs test operations around the interface between the two.

[0108] Optionally, after completing the test case parsing, the controller sends control commands to at least one test device to convert the test parameters into actual test actions.

[0109] The test parameters include one or more of the following: insertion / removal parameters, vibration parameters, and temperature cycling parameters.

[0110] The insertion and extraction parameters include at least one of the following: insertion angle, insertion speed, displacement stroke, holding force, and extraction cycle.

[0111] Vibration parameters include at least one of the vibration frequency band and acceleration spectrum.

[0112] Temperature cycling parameters include at least one of the following: temperature cycling slope, upper and lower temperature limits, holding time, and interleaving action window.

[0113] The testing equipment can perform corresponding test operations on the target device according to the action requirements of the test cases. During the test, the controller can also monitor the device's operating status. When an abnormality is detected, it processes the current test process and records the corresponding status information. This enables the target device to undergo test operations corresponding to the test cases during the test, thus ensuring that the subsequently acquired optical, mechanical, and electrical performance data has operational condition correlation and reflects the state changes of the target device during the test.

[0114] Step 203: Collect at least one test index during the test process using a preset multi-channel acquisition device. The test index includes at least one of optical index, mechanical index, and electrical index.

[0115] In this embodiment, the multi-channel data acquisition unit is used to collect multi-dimensional data during the testing process and uses the data from each channel as input for subsequent assembly index calculation.

[0116] Test indicators are data items that characterize the test process status and test results. Among them, optical indicators are used to reflect the transmission status of the optical communication link, mechanical indicators are used to reflect the structural or stress status during the test process, and electrical indicators are used to reflect the electrical transmission status of the link.

[0117] Optionally, the controller can send sampling configuration to the multi-channel data acquisition unit before the test begins. When the triggering conditions are met during the test, the multi-channel data acquisition unit starts sampling and records at least one test index. To ensure comparability between different indices, the multi-channel data acquisition unit can perform unified time alignment on the data from each channel and correlate action events during the test with the sampling results. After the acquisition is completed, the multi-channel data acquisition unit outputs the corresponding data, and the controller can process the data to generate a dataset for determining the assembly index.

[0118] By collecting data from at least one test index using a multi-channel data acquisition device and then uniformly correlating the data, a correspondence can be established between action events and index responses during the test process, thereby supporting the analysis of the assembly status of the target equipment.

[0119] Step 204: Determine the assembly index of the target equipment based on at least one test index. The assembly index is used to characterize the assembly consistency associated with the target equipment and the reliability of the assembly environment.

[0120] In this embodiment, the assembly index is a comprehensive indicator that quantifies the assembly performance of the target equipment. Its input is at least one test indicator, and its output is a result value that can be used for test judgment, batch comparison, and historical traceability.

[0121] After obtaining the dataset, the controller can process it based on at least one test index to determine the corresponding assembly index. After calculation, the controller can compare the assembly index with preset judgment requirements, output the corresponding test conclusion, and save the test results.

[0122] Optionally, by converting the test results into an assembly index, the assembly consistency of the target equipment and the reliability of the assembly environment can be uniformly characterized, thereby establishing the test conclusions on a comprehensive evaluation basis.

[0123] The optical communication device testing method provided in this embodiment incorporates test operations and multi-dimensional data acquisition into the same test process through a collaborative test architecture of test cases, test equipment, and multi-channel data acquisition devices. The acquisition results are uniformly mapped to the assembly index, so that batch samples have a consistent test execution path and consistent judgment criteria under the same baseline conditions. This enables continuous recording and unified evaluation of the performance changes of the target device in the actual assembly state.

[0124] Figure 3 This is another schematic flowchart of the optical communication device testing method provided in the embodiments of this application. Based on any of the above embodiments, such as... Figure 3 As shown, step 102 includes:

[0125] Step 301: Based on the insertion and removal parameters, control the automatic insertion and removal tooling to perform insertion and removal operations on the associated interfaces of the target device.

[0126] Step 302: Apply vibration stress to the target equipment using a vibration table controlled by vibration parameters.

[0127] Step 303: Apply temperature cycling stress to the target equipment using a temperature cycling chamber controlled by temperature cycling parameters.

[0128] In this embodiment, the test parameters include one or more of the following: insertion / removal parameters, vibration parameters, and temperature cycling parameters. Insertion / removal parameters include at least one of the following: insertion angle, insertion speed, displacement stroke, holding force, and withdrawal cycle. Vibration parameters include at least one of the following: vibration frequency band and acceleration spectrum. Temperature cycling parameters include at least one of the following: temperature cycling slope, upper and lower temperature limits, holding time, and insertion action window.

[0129] Optionally, after receiving the insertion / removal parameters, vibration parameters, and temperature cycling parameters, the controller generates corresponding drive commands and sends them to the automatic insertion fixture, vibration table, and temperature cycling chamber.

[0130] Automatic mating fixtures can achieve position and force control through servo motors, linear modules and clamping mechanisms. They drive the clamping end to complete the mating and unmold actions of the associated interface according to the mating angle, mating speed, displacement stroke, holding force or pull-out rhythm.

[0131] The vibration table can be an electric vibration table or an electromagnetic vibration table, which converts the set frequency band and acceleration spectrum into vibration stress acting on the target equipment through the exciter.

[0132] The temperature circulation chamber can adopt a chamber structure with a cooling unit and a heating unit. The temperature inside the chamber is regulated in a closed loop through air circulation and temperature control sensors, so that the target equipment can withstand temperature cycle stress under the conditions corresponding to the upper and lower limits of temperature, temperature circulation slope, heat preservation time and the insertion action window.

[0133] In the same test task, at least one test device can be any one of the following: an automatic insertion fixture, a vibration table, or a temperature cycling chamber, or multiple such devices. The controller can issue control commands according to the test cases, enabling the target device to complete associated tests under insertion / removal, vibration, and temperature cycling loads, thereby outputting test results corresponding to the connection stability and environmental tolerance of the target device. The aforementioned device models can be selected based on the test station, load range, and control accuracy. In practical applications, other models of this component can also be selected, and this application does not limit this selection.

[0134] The optical communication device testing method provided in this embodiment maps insertion and removal parameters, vibration parameters, and temperature cycling parameters to corresponding testing equipment. The target device is subjected to various stresses under controlled assembly conditions. The consistency of working conditions during the testing process is uniformly managed, and the correlation between insertion and removal actions, mechanical stress, and temperature changes can be synchronously reflected. This makes the test results closer to the actual stress state under vehicle use environment and provides a direct basis for subsequent assembly consistency judgment.

[0135] Optionally, based on any of the above embodiments, step 102 includes:

[0136] Based on the test parameters, the automatic fitting fixture, vibration table, and temperature chamber are simultaneously controlled to perform test operations on the target equipment.

[0137] In this embodiment, the target device can be controlled to withstand three types of stress simultaneously: mechanical mating, dynamic vibration, and temperature cycling in the assembled and connected state. The control unit can uniformly associate the output state of each device with the same set of test parameters, so that the collected optical, mechanical, and electrical indicators have a consistent test caliber.

[0138] Therefore, the connection stability, link transmission stability and environmental adaptability of the target equipment under complex working conditions can be characterized simultaneously in the same test process, the basis for determining the assembly index is more unified, and the comparison results and traceability results between batch samples are more consistent.

[0139] Optionally, based on any of the above embodiments, step 102 includes:

[0140] Based on test parameters, the automatic mating fixture is controlled to perform plugging and unplugging operations on the associated interfaces of the target device.

[0141] In response to the automatic insertion and removal operation completed by the tooling, the vibration table is controlled to apply vibration stress to the target equipment based on the test parameters, and the temperature cycle chamber is controlled to apply temperature cycle stress to the target equipment based on the test parameters.

[0142] In this embodiment, the test parameters are output from the test cases to the controller. The controller first drives the automatic mating fixture to complete the mating or unmolding of the associated interface according to the mating parameters. After the mating is completed, the signal is fed back by the stroke detection mechanism or the status sensor, and then a start command is sent to the vibration table and a temperature cycle command is sent to the temperature cycle chamber.

[0143] Optionally, the vibration table and the temperature cycling chamber can be controlled independently, or stress can be applied continuously or in parallel within the same test cycle according to a preset sequence, so that the target equipment can undergo mechanical and thermal environment verification in sequence after the interface assembly is completed.

[0144] The optical communication device testing method provided in this embodiment, because insertion / removal operations, vibration stress, and temperature cycling stress are all constrained by the same test parameters, and the start-up timing and duration of each device can be uniformly coordinated, allows for the establishment of a correspondence between the subsequent environmental loads experienced by the target device after a change in connection status and its assembly status, thereby forming a continuous and traceable test record. Therefore, the test results of the target device in terms of insertion consistency, interface retention capability, and environmental tolerance can be simultaneously characterized, providing a stable data foundation for the subsequent determination of assembly indices.

[0145] Figure 4 This is another flowchart illustrating the optical communication device testing method provided in the embodiments of this application. Based on any of the above embodiments, the multi-channel acquisition device includes at least one of an optical power monitor and a bit error rate monitor. Figure 4 As shown, step 103 includes:

[0146] Step 401: Collect optical indicators during the test using an optical power monitor, whereby the optical indicators include optical power.

[0147] Step 402: Collect electrical indicators during the test process using a bit error rate monitor, whereby the electrical indicators include the bit error rate.

[0148] Step 403: Collect mechanical indicators during the testing process using an automatic insertion fixture, wherein the mechanical indicators include at least one of insertion force and springback displacement.

[0149] Step 404: Collect the number of times the temperature circulation chamber triggers compensation under temperature drift conditions to obtain the number of temperature compensation actions.

[0150] In this embodiment, the optical power monitor can be a coupled photoelectric probe arranged corresponding to the optical port under test, and the bit error rate monitor can be connected to the link port of the target device via an electrical connection interface. The automatic mating fixture can integrate mechanical sensors and displacement monitoring devices. Therefore, mechanical parameters during the testing process can be collected based on the automatic mating fixture.

[0151] Optionally, the sampling signals of the three components can be time-aligned and output by a unified data acquisition unit. The temperature cycling chamber can detect the compensation trigger signal when the temperature inside the chamber deviates from the preset temperature drift threshold through a temperature feedback loop, and count each trigger to form the number of temperature compensation actions, so as to perform correlation analysis with optical, electrical and mechanical indicators. The above components can be implemented using conventional models in the field. In practical applications, other models can also be selected for these components, and this application does not limit them.

[0152] This structure integrates optical power, bit error rate, insertion force, springback displacement, and the number of temperature compensation actions into a single acquisition aperture during testing. This ensures that data under different stress conditions can be output at the same test moment, providing a consistent data basis for subsequent assembly index calculations. By synchronously recording the number of temperature compensation actions, it also correlates the compensation behavior caused by environmental temperature drift with changes in device performance, thus allowing the test results to more comprehensively reflect the overall response of the target device in its assembled state.

[0153] The optical communication device testing method provided in this embodiment has a multi-channel acquisition device that can cover three types of test information: optical, electrical and mechanical. It further incorporates temperature cycle chamber compensation behavior data, enabling key indicators in the testing process to have unified acquisition and correlation traceability capabilities. The test results obtained can more directly characterize the assembly consistency of the target device and the reliability of the assembly environment.

[0154] Furthermore, based on any of the above embodiments, step 104 includes:

[0155] The assembly consistency index is calculated based on insertion force, springback displacement, first-time insertion success rate, and a preset first weight.

[0156] The assembly environment reliability index is calculated based on optical power, bit error rate, post-vibration settling time, and a preset second weight.

[0157] The assembly index is calculated based on the assembly consistency index, the assembly environment reliability index, and a preset third weight.

[0158] Among them, the first weight, the second weight, and the third weight are associated with the test vehicle model corresponding to the target equipment.

[0159] In this embodiment, a multi-channel data acquisition unit can simultaneously access the insertion / extraction force sensor, optical power monitor, and bit error rate monitor to obtain data such as insertion force, rebound displacement, optical power, and bit error rate. The first-pass yield rate can be calculated from the number of samples that successfully complete insertion in multiple insertion tests and the total number of samples. The post-vibration stabilization time can be determined by the time required for the optical power or bit error rate of the target device to recover to a preset threshold range after the vibration stress is removed. The first, second, and third weights can be pre-stored in a parameter table corresponding to the test vehicle model, and the corresponding weight combinations are loaded according to the vehicle platform, connector specifications, or optical transceiver installation location to adapt the same calculation model to different vehicle application scenarios. In practical applications, this weight table can also use other storage media or configuration methods, which are not limited in this application.

[0160] Optionally, the assembly consistency index, assembly environment reliability index, and assembly index can be obtained by the controller through weighted summation according to a preset normalization rule. Each index can first be mapped to a unified dimension, and then intermediate results are calculated based on their corresponding weights to ultimately generate a comprehensive assembly evaluation value for the target equipment. Since the assembly consistency index reflects the mechanical state of the mating mechanism, and the assembly environment reliability index reflects photoelectric stability under environmental stress, while the assembly index further integrates both, the test results can simultaneously cover the assembly process and environmental stability.

[0161] The optical communication device testing method provided in this embodiment can uniformly incorporate the insertion force, rebound displacement, first-pass insertion rate, optical power, bit error rate, and post-vibration stabilization time of the target device into the evaluation system, and combine them with the associated weights of the test vehicle models to form a consistent calculation caliber, thereby outputting a comparable and traceable assembly index, which facilitates a comprehensive judgment on the assembly quality under different batches and different vehicle models.

[0162] Figure 5 This is a schematic diagram of the signaling interaction of the optical communication device testing method provided in the embodiments of this application, as shown below. Figure 5 As shown, the method also includes:

[0163] Step 501: Determine if the equipment issues a test command and controls the automatic mating fixture to execute the mating cycle.

[0164] Step 502: Determine the vibration spectrum of the vibration table controlled by the equipment.

[0165] Step 503: Determine the loading temperature cycle curve of the equipment control temperature cycle chamber.

[0166] Step 504: After the automatic mating fixture performs cyclic mating, it outputs the mated link status to the multi-channel data collector.

[0167] Step 505: The multi-channel acquisition unit sends back drift and stability results to the judgment host.

[0168] Figure 6 This is another schematic flowchart of the optical communication device testing method provided in the embodiments of this application. Based on any of the above embodiments, such as... Figure 6 As shown, the method also includes:

[0169] Step 601: Generate test logs based on the test results of this round of testing.

[0170] Step 602: Store the test logs to a preset storage path, which includes historical test logs associated with multiple rounds of testing.

[0171] In this embodiment, when generating test logs based on the test results of this round of testing, the test results can be written to a log file and fields such as timestamp, equipment number, test vehicle model, assembly index, and judgment criteria can be generated simultaneously. The name of the log file can correspond to the test batch number or the unique identifier of the target equipment so as to be retrieved and associated with subsequent historical test logs.

[0172] Optionally, when storing test logs to a preset storage path, append-only writes, batch-based directory creation, or date-based hierarchical archiving can be used to keep the current round of logs and historical test logs within the same storage system, with each log linked by an index using batch number, timestamp, or device identifier. This storage method allows multiple rounds of test records for the same target device to be continuously retained and supports subsequent reading and comparison in chronological or batch order.

[0173] The optical communication device testing method provided in this embodiment generates test logs in real time based on the test results of the current round and writes them to a preset storage path containing historical test logs. This enables the conclusions, key indicators, and judgment criteria of each test to be uniformly archived, thereby forming a traceable multi-round test record. Based on this recording method, when performing retesting, batch comparison, or failure analysis, the historical test logs in the same storage path can be directly called and correlated with the current round's test logs, thus maintaining the consistency and continuity of test information and providing a data foundation for tracking changes in assembly consistency and reliability.

[0174] Furthermore, based on any of the above embodiments, the method further includes:

[0175] Based on historical test logs in the storage path, historical baseline data associated with the target device, and a preset trend algorithm, the changing trend associated with the target device is determined. The changing trend includes at least one of the following: pass rate changing trend and degradation trend.

[0176] In this embodiment, the historical test logs corresponding to the target device are first read from the preset storage path, and records related to pass rate, optical power, bit error rate, insertion and extraction force or number of temperature compensation actions are extracted. At the same time, the historical baseline data associated with the target device is retrieved as a reference.

[0177] The test results from each round in the historical test log are then normalized and compared with the historical baseline data, and input into a preset trend algorithm for statistical fitting or sequence analysis. The trend algorithm can identify the direction of change of the target device in continuous testing based on moving average, slope determination, threshold offset or regression fitting.

[0178] Optionally, the algorithm output can be represented as a trend of pass rate increasing, decreasing, or fluctuating with each round, or as a degradation trend corresponding to a continuous deviation of optical, mechanical, or electrical indicators from the baseline. If historical test logs show that the pass rate of the target device has been continuously decreasing in multiple rounds of testing, and the deviation of key test indicators from the baseline has been gradually increasing, then this change will be included in the result set that includes both the pass rate change trend and the degradation trend.

[0179] During the operation, the changing trends, as a follow-up tracking result of the assembly index, together with the test logs of this round, form a traceable data link, enabling the continuous recording and quantitative expression of the state evolution of the target equipment under different batches and operating conditions. Based on these trend results, the current stability status of the target equipment can be correlated and judged, providing a basis for subsequent retesting, screening, or failure warning.

[0180] The optical communication device testing method provided in this embodiment combines historical test logs, historical baseline data and trend algorithms, enabling the state changes of the target device to no longer be limited to a single test result, but to form a trend characterization that can be continuously compared. This allows for the synchronous identification of changes in pass rate and performance degradation, and provides support for batch consistency analysis and long-term reliability tracking of automotive-grade optical communication devices.

[0181] Furthermore, based on any of the above embodiments, the method further includes:

[0182] Determine whether at least one test index or assembly index meets a preset first condition. The first condition includes each test index being greater than a preset first threshold and the assembly index being greater than a second threshold.

[0183] In response to the fulfillment of the first condition, it is determined whether the trend of change meets the preset second condition, which includes the trend of change tending to stabilize.

[0184] If the target device meets the second condition, the target device is deemed to have passed the test.

[0185] In this embodiment, after receiving the test indicators and assembly index output by the multi-channel acquisition unit, the controller will compare them with the preset thresholds respectively. When any test indicator does not exceed its corresponding first threshold, or the assembly index does not exceed the second threshold, the controller will directly output a failure result.

[0186] Optionally, to improve the accuracy of the judgment, when all test indicators and assembly indices meet the threshold requirements, the controller further reads historical test logs and baseline data, and combines trend algorithms to fit and judge the pass rate change trend or deterioration trend. The stability of the change trend is determined by whether the fluctuation amplitude, slope change, or dispersion of adjacent rounds of results falls within a stable range. If the change trend meets the second condition, the judgment result that the target equipment has passed the test is output.

[0187] In this implementation, the first and second thresholds can be pre-written into the test configuration file according to the interface specifications, link budget, and environmental reliability requirements corresponding to different vehicle models, and are synchronously invoked by the test management unit when loading test cases. The stability determination of the trend can be based on continuous test data within a sliding window. A trend value is generated using least-squares fitting, mean-variance constraints, or exponential smoothing, and then compared with the stability threshold to determine whether the trend has stabilized. Therefore, the test conclusions can simultaneously reflect instantaneous performance thresholds and cross-cycle consistency.

[0188] The optical communication device testing method provided in this embodiment no longer relies solely on the results of a single indicator, but combines assembly indexes and changing trends for joint confirmation. This ensures that the target device, in addition to meeting basic performance requirements, also exhibits a stable test state, thereby matching the test conclusions with the batch consistency and continuous reliability of automotive-grade optical communication devices.

[0189] Furthermore, based on any of the above embodiments, the method further includes:

[0190] If the target device passes the test, the target device will be added to the admission list.

[0191] If any test index associated with the target device is less than the first threshold, but the assembly index is greater than the second threshold, a re-inspection operation is performed on the target device.

[0192] If the target device fails the test, rework and / or isolation operations will be performed on the target device.

[0193] In this embodiment, after the assembly index of the target equipment is calculated, each test index is compared with the threshold. When all test indexes are not lower than the first threshold and the assembly index is not lower than the second threshold, the target equipment is determined to have passed the test, and its unique identifier, batch number and test results are written into the admission list.

[0194] Optionally, if any test index is lower than the first threshold but the assembly index is lower than the second threshold, the target device is marked as pending re-inspection, and the corresponding optical power monitor, bit error rate monitor or insertion / extraction force sensor is called again for re-testing. The re-inspection result can be compared with the previous result before determining whether to release it.

[0195] If the target device fails the test, a rework instruction or isolation instruction is invoked based on the reason for failure. The rework record can be saved in conjunction with the test log, while the isolation record is updated synchronously with the inventory status and workstation occupancy status. For reworked target devices, the test chain can be re-entered for verification; for isolated target devices, isolation can only be lifted with authorization. The aforementioned access list, re-inspection, rework, and isolation can all be implemented by the same test controller through a software state machine. In practical applications, other controller models can also be selected, and this application does not impose any limitations on this.

[0196] The optical communication device testing method provided in this embodiment allows for the direct inclusion of tested components into the acceptance list, secondary confirmation of boundary samples through re-inspection, and the import of failed components into rework or isolation paths. This ensures consistency between test conclusions, handling actions, and equipment status, forming a closed-loop correlation with the aforementioned assembly index and test indicators. Consequently, it improves the traceability of test results and ensures that samples in different states receive subsequent processing matching their assessment results, guaranteeing data consistency and control consistency in subsequent processes.

[0197] Figure 7 This is a schematic diagram of the structure of the optical communication device testing apparatus provided in the embodiments of this application, as shown below. Figure 7 As shown, the device includes: an acquisition module 71, a control module 72, a data acquisition module 73, and a processing module 74. The acquisition module 71 acquires test cases, which include test parameters associated with at least one test device, including at least one of an automatic mating fixture, a vibration table, and a temperature cycling chamber. The control module 72 controls at least one test device to perform test operations on a target device based on the test parameters. The target device includes an optical transceiver and a multi-core connector. The data acquisition module 73 acquires at least one test index during the test process using a preset multi-channel data acquisition device, including at least one of optical, mechanical, and electrical indicators. The processing module 74 determines the assembly index of the target device based on at least one test index. The assembly index characterizes the assembly consistency and assembly environment reliability associated with the target device.

[0198] Furthermore, based on any of the above embodiments, the test parameters include one or more of the following: insertion / removal parameters, vibration parameters, and temperature cycling parameters. Insertion / removal parameters include at least one of the following: insertion angle, insertion speed, displacement stroke, holding force, and withdrawal cycle. Vibration parameters include at least one of the following: vibration frequency band and acceleration spectrum. Temperature cycling parameters include at least one of the following: temperature cycling slope, upper and lower temperature limits, holding time, and insertion action window.

[0199] Furthermore, based on any of the above embodiments, the control module is configured to: control the automatic mating fixture to perform mating operations on the associated interface of the target device based on mating parameters; control the vibration table to apply vibration stress to the target device based on vibration parameters; and control the temperature cycling chamber to apply temperature cycling stress to the target device based on temperature cycling parameters.

[0200] Furthermore, based on any of the above embodiments, the control module is used to simultaneously control the automatic mating fixture, vibration table, and temperature cycling chamber to perform test operations on the target equipment based on the test parameters.

[0201] Furthermore, based on any of the above embodiments, the control module is configured to: control the automatic mating fixture to perform mating and unmating operations on the associated interface of the target device based on test parameters; and, in response to the automatic mating fixture completing the mating and unmating operations, control the vibration table to apply vibration stress to the target device based on test parameters, and control the temperature cycling chamber to apply temperature cycling stress to the target device based on test parameters.

[0202] Further, based on any of the above embodiments, the multi-channel acquisition unit includes at least one of an optical power monitor and a bit error rate monitor. The acquisition module is used to: acquire optical parameters during the testing process via the optical power monitor, wherein the optical parameters include optical power; acquire electrical parameters during the testing process via the bit error rate monitor, wherein the electrical parameters include bit error rate; acquire mechanical parameters during the testing process via the automatic mating fixture, wherein the mechanical parameters include at least one of insertion force and springback displacement; and acquire the number of times the temperature cycling chamber triggers compensation under temperature drift conditions to obtain the number of temperature compensation actions.

[0203] Furthermore, based on any of the above embodiments, the processing module is configured to: calculate an assembly consistency index based on insertion force, springback displacement, first-pass yield rate, and a preset first weight; calculate an assembly environment reliability index based on optical power, bit error rate, post-vibration settling time, and a preset second weight; and calculate an assembly index based on the assembly consistency index, the assembly environment reliability index, and a preset third weight. The first, second, and third weights are associated with the test vehicle model corresponding to the target equipment.

[0204] Furthermore, based on any of the above embodiments, the apparatus further includes: a generation module, used to generate test logs based on the test results of the current round of testing; and a storage module, used to store the test logs to a preset storage path, the storage path including historical test logs associated with multiple rounds of testing.

[0205] Furthermore, based on any of the above embodiments, the apparatus further includes: a determination module, used to determine the change trend associated with the target device based on historical test logs in the storage path, historical baseline data associated with the target device, and a preset trend algorithm, wherein the change trend includes at least one of a pass rate change trend and a degradation trend.

[0206] Furthermore, based on any of the above embodiments, the apparatus further includes: a determining module, configured to determine whether at least one test index and an assembly index meet a preset first condition, the first condition including each test index being greater than a preset first threshold and the assembly index being greater than a second threshold; a processing module, configured to, in response to meeting the first condition, determine whether the trend of change meets a preset second condition, the second condition including the trend of change tending to stabilize; and a judging module, configured to, in response to the target device meeting the second condition, judge the target device to have passed the test.

[0207] Furthermore, based on any of the above embodiments, the apparatus further includes: an adding module, configured to add the target device to the admission list in response to the target device passing the test; a re-inspection module, configured to perform a re-inspection operation on the target device in response to any test index associated with the target device being less than a first threshold, but the assembly index being greater than a second threshold; and an isolation module, configured to perform a rework operation and / or an isolation operation on the target device in response to the target device failing the test.

[0208] The optical communication device testing apparatus provided in this embodiment can execute the method provided in the above method embodiment. Its implementation principle and technical effect are similar, and will not be described in detail here.

[0209] Figure 8 A schematic diagram of the structure of the electronic device provided in this application. Figure 8 As shown, the electronic device 80 provided in this embodiment includes at least one processor 801 and a memory 802. Optionally, the device 80 further includes a communication component 803. The processor 801, memory 802, and communication component 803 are connected via a bus 804.

[0210] In a specific implementation, at least one processor 801 executes computer execution instructions stored in memory 802, causing at least one processor 801 to perform the above-described method.

[0211] The specific implementation process of processor 801 can be found in the above method embodiments, and its implementation principle and technical effect are similar. It will not be repeated here.

[0212] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0213] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0214] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0215] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0216] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method.

[0217] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0218] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0219] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0220] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0221] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0222] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0223] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0224] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A testing method for optical communication devices, characterized in that, include: Obtain test cases, wherein the test cases include test parameters associated with at least one test device, and the test device includes at least one of an automatic mating fixture, a vibration table, and a temperature cycling chamber; Based on the test parameters, the at least one test device is controlled to perform test operations on the target device, wherein the target device includes an optical transceiver and a multi-core connector. At least one test index is collected during the test process using a preset multi-channel acquisition device. The test index includes at least one of optical index, mechanical index, and electrical index. The assembly index of the target equipment is determined based on the at least one test index, and the assembly index is used to characterize the assembly consistency and assembly environment reliability associated with the target equipment.

2. The method according to claim 1, characterized in that, The test parameters include one or more of the following: insertion / removal parameters, vibration parameters, and temperature cycling parameters; The insertion and extraction parameters include at least one of the following: insertion angle, insertion speed, displacement stroke, holding force, and extraction cycle. The vibration parameters include at least one of the vibration frequency band and acceleration spectrum; The temperature cycling parameters include at least one of the following: temperature cycling slope, upper and lower temperature limits, holding time, and interleaving action window.

3. The method according to claim 2, characterized in that, The step of controlling at least one test device to perform test operations on the target device based on the test parameters includes: Based on the insertion and removal parameters, the automatic insertion tooling is controlled to perform insertion and removal operations on the associated interface of the target device; Based on the vibration parameters, the vibration table is controlled to apply vibration stress to the target equipment; Based on the temperature cycling parameters, the temperature cycling chamber is controlled to apply temperature cycling stress to the target equipment.

4. The method according to claim 1, characterized in that, The step of controlling at least one test device to perform test operations on the target device based on the test parameters includes: Based on the test parameters, the automatic fitting fixture, vibration table, and temperature circulation chamber are simultaneously controlled to perform test operations on the target equipment.

5. The method according to claim 1, characterized in that, The step of controlling at least one test device to perform test operations on the target device based on the test parameters includes: Based on the test parameters, the automatic mating fixture is controlled to perform mating and unmating operations on the associated interface of the target device. In response to the automatic insertion and removal operation being completed by the automatic insertion fixture, the vibration table is controlled to apply vibration stress to the target device based on the test parameters, and the temperature cycling chamber is controlled to apply temperature cycling stress to the target device based on the test parameters.

6. The method according to claim 1, characterized in that, The multi-channel acquisition unit includes at least one of an optical power monitor and a bit error rate monitor; The acquisition of at least one test index during the test process via a preset multi-channel acquisition device includes: The optical parameters during the test are collected by the optical power monitor, wherein the optical parameters include optical power; The electrical indicators during the testing process are collected by the bit error rate monitor, wherein the electrical indicators include the bit error rate; The mechanical parameters collected during the testing process by the automatic mating fixture include at least one of insertion force and springback displacement. The number of times the temperature circulation chamber triggers compensation under temperature drift conditions is collected to obtain the number of temperature compensation actions.

7. The method according to claim 1, characterized in that, Determining the assembly index of the target equipment based on the at least one test index includes: The assembly consistency index is calculated based on insertion force, springback displacement, first-time insertion success rate, and a preset first weight. The assembly environment reliability index is calculated based on optical power, bit error rate, post-vibration settling time, and a preset second weight. The assembly index is calculated based on the assembly consistency index, the assembly environment reliability index, and a preset third weight. The first weight, the second weight, and the third weight are associated with the test vehicle model corresponding to the target device.

8. The method according to any one of claims 1-7, characterized in that, The method further includes: Test logs will be generated based on the test results of this round of testing; The test logs are stored in a preset storage path, which includes historical test logs associated with multiple rounds of testing.

9. The method according to claim 8, characterized in that, The method further includes: Based on the historical test logs in the storage path, the historical baseline data associated with the target device, and the preset trend algorithm, the change trend associated with the target device is determined, and the change trend includes at least one of the pass rate change trend and the degradation trend.

10. The method according to claim 9, characterized in that, The method further includes: Determine whether the at least one test index and the assembly index meet a preset first condition, wherein the first condition includes each test index being greater than a preset first threshold and the assembly index being greater than a second threshold. In response to the fulfillment of the first condition, it is determined whether the trend of change meets a preset second condition, the second condition including the trend of change tending to stabilize; If the target device meets the second condition, the target device is determined to have passed the test.

11. The method according to claim 10, characterized in that, The method further includes: If the target device passes the test, the target device is added to the admission list; If any test index associated with the target device is less than the first threshold, but the assembly index is greater than the second threshold, a re-inspection operation is performed on the target device. If the target device fails the test, the target device will be reworked and / or isolated.

12. A testing system for optical communication devices, characterized in that, Includes a controller, at least one testing device, a target device, a multi-channel data acquisition unit, and a judgment device; The controller is communicatively connected to the at least one test device, and the at least one test device is communicatively connected to the target device. The controller is used to control the at least one test device to perform test operations on the target device based on test parameters. The multi-channel data acquisition unit is communicatively connected to the target device and is used to acquire at least one test index associated with the target device during the test. The determination device is communicatively connected to the multi-channel data acquisition unit and is used to calculate the assembly index of the target device based on at least one test index.

13. The system according to claim 12, characterized in that, The testing equipment includes at least one of an automatic fitting fixture, a vibration table, and a temperature cycling chamber. The target device includes optical transceivers and multi-core connectors; The multi-channel acquisition unit includes at least one of an optical power monitor, a bit error rate monitor, and an insertion / extraction force sensor.

14. A testing device for optical communication devices, characterized in that, include: The acquisition module is used to acquire test cases, wherein the test cases include test parameters associated with at least one test device, and the test device includes at least one of an automatic mating fixture, a vibration table, and a temperature cycling chamber; The control module is used to control the at least one test device to perform test operations on the target device based on the test parameters, wherein the target device includes an optical transceiver and a multi-core connector; The acquisition module is used to acquire at least one test index during the test process through a preset multi-channel acquisition device. The test index includes at least one of optical index, mechanical index, and electrical index. A processing module is configured to determine the assembly index of the target device based on the at least one test index, wherein the assembly index is used to characterize the assembly consistency and assembly environment reliability associated with the target device.

15. An electronic device, characterized in that, include: Memory, processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory, causing the processor to perform the method as described in any one of claims 1-13.

16. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any one of claims 1-13.

17. A computer program product, characterized in that, Includes a computer program that, when executed by a processor, implements the method described in any one of claims 1-13.

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