power module

Abstract

Embodiments of this disclosure relate to power modules. The present invention relates to a power module for supplying and controlling various electronic devices, such as electric motors in electric vehicles. The device includes a plurality of dies on a substrate, and a molded part covering the dies and the substrate. The substrate is located on a heat sink. Connection pins are electrically coupled to the dies and extend from the dies through the molded part and into a printed circuit board. The printed circuit board is spaced apart from the upper surface of the molded part.

Description

Technical Field

[0001] This invention relates to power modules and their manufacture. Background Technology

[0002] Many applications utilize power circuits or modules to power and control various electronic devices. For example, electric vehicles include power modules that power the vehicle's electric motor and control the electronic devices.

[0003] Such power modules have a complex structure with various cooling solutions to prevent overheating. For example, a power module includes various integrated circuits (e.g., power inverters, rectifiers, etc.), die interconnect structures that provide electrical connections to the integrated circuits, and source connections that are electrically coupled to external devices (e.g., electric motors, power supplies, etc.). When the power module operates at high voltage and generates a large amount of heat, various cooling techniques are used to regulate the temperature of the power module.

[0004] The complex structure and interconnects of these power modules require expensive manufacturing materials and complex manufacturing steps to embed integrated circuits and achieve electrical isolation, and often involve multiple suppliers. Therefore, the current structure and interconnects of power modules are limiting factors for a streamlined, simple, and efficient solution for manufacturing power modules. Summary of the Invention

[0005] This invention relates to devices that combine partially embedded solutions with cooling (such as immersion cooling). For example, such devices are power modules that supply and control various electronic devices, such as electric motors in electric vehicles.

[0006] The device comprises multiple dies on a substrate, with a molding compound covering both the dies and the substrate. The substrate, along with the dies and the molding compound, is positioned on a heat sink. Connection pins are electrically coupled to the individual integrated circuits on the dies. These connection pins are press-fit pins that extend from the mold, through the molding compound, and into a printed circuit board (PCB). When inserted into the PCB, the connection pins are electrically coupled to electrical traces on the PCB. Thus, the PCB is electrically coupled to the die via the connection pins. The electrical connections on the PCB transmit signals between the die and various supporting integrated circuits (e.g., drivers, converters, and bridges) on the PCB. Space is provided between the PCB and the upper surface of the molding compound. Attached Figure Description

[0007] In the accompanying drawings, the same reference numerals denote similar features or elements. The dimensions and relative positions of features in the drawings need not be drawn to scale.

[0008] Figure 1 This is a cross-sectional view of a device according to an embodiment disclosed herein.

[0009] Figure 2A ,2B 2C, 2D, 2E and 2F are embodiments according to the disclosure herein. Figure 1 The subsequent manufacturing steps of the device.

[0010] Figure 3 It is a system comprising multiple devices according to the embodiments disclosed herein. Detailed Implementation

[0011] In the following description, certain specific details are set forth to provide a thorough understanding of the various aspects of the disclosed main figures. However, the disclosed subject matter can be practiced without these specific details. In some cases, well-known structures and methods for manufacturing electronic components, power modules, dies, and printed circuit boards (PCBs) have not been described in detail to avoid obscuring the description of other aspects of this disclosure.

[0012] Unless the context otherwise requires, throughout the specification and the following claims, the word “comprising” and its variations, such as “comprise” and “comprising”, shall be interpreted as an open-ended, inclusive meaning, that is, “including but not limited to”.

[0013] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same aspect. Furthermore, specific features, structures, or characteristics may be combined in any suitable manner in one or more aspects of this disclosure.

[0014] As described above, power modules for applications, particularly automotive applications, utilize power modules with complex structures and interconnections. Therefore, current power modules typically involve specialized manufacturing processes and high costs. This disclosure provides a power module that combines a partially embedded solution with cooling, such as immersion cooling, to simplify design and minimize the cost of the power module.

[0015] Figure 1 This is a cross-sectional view of device 10 according to an embodiment disclosed herein. The cross-section is along... Figure 2F The lines shown. Device 10 is a power module or component that supplies power to and controls various electronic devices for various applications, such as electric motors for electric vehicles.

[0016] Device 10 includes a substrate 12, multiple dies 14, connection pins 16, a molded part 18, a heat sink 20, and a printed circuit board 22.

[0017] Substrate 12 is a support layer that provides support for the plurality of dies 14. Substrate 12 is a semiconductor substrate or a multilayer substrate having multiple sublayers. Other types of substrates are also possible. In one embodiment, such as Figure 1 As shown, substrate 12 includes an insulating layer 24; a first conductive layer 26 on a first (bottom) side of insulating layer 24; and a second conductive layer 28 on a second (top) side of insulating layer 24. The first and second sides of insulating layer 24 face opposite directions. Insulating layer 24 is made of a suitable insulating material, such as ceramic. First conductive layer 26 and second conductive layer 28 are made of a suitable conductive metal, such as copper. Substrate 12 provides electrical insulation for a plurality of dies 14. Furthermore, first conductive layer 26 and second conductive layer 28 increase the thermal conductivity of substrate 12 and function as heat conductors.

[0018] Multiple dies 14 are located on the substrate 12, and more specifically on the second conductive layer 28. The dies 14 are semiconductor dies that include various integrated circuits. For example, the dies 14 include power inverters, rectifiers, converters, charging circuits, and other applicable semiconductor components.

[0019] Connection pins 16 are located on a plurality of dies 14. Connection pins 16 are conductive pins electrically coupled to various integrated circuits included in the dies 14. Connection pins 16 are press-fit pins that are pressed into and inserted into a printed circuit board 22. Each of the connection pins 16 has a first end electrically connected to one of the dies 14 and a second opposite end inserted into and electrically connected to the printed circuit board 22. When inserted, connection pins 16 provide an electrical connection between the integrated circuits of the die 14 and the printed circuit board 22. Connection pins 16 are made of a suitable conductive metal, such as copper.

[0020] A molding 18 is formed on a substrate 12, a plurality of dies 14, connection pins 16, and a heat sink 20. The molding 18 encapsulates the substrate 12 and the plurality of dies 14 and provides a protective layer thereon. The molding 18 extends along a second conductive layer 28 on a second (top) side of an insulating layer 24 and along a side surface of the substrate 12. The connection pins 16 extend from the dies 14, pass through a portion of the molding 18 on the second conductive layer 28, and extend to a printed circuit board 22. The molding 18 is made of a suitable insulating material, such as a molding compound, sealant, or epoxy resin.

[0021] The heat sink 20 supports a substrate 12, a plurality of dies 14, connection pins 16, a molded part 18, and a printed circuit board 22. The substrate 12, more specifically a first conductive layer 26, is positioned on the heat sink 20. The substrate 12 can be attached to the heat sink 20 without any insulating material (e.g., AMB SiN). The heat sink 20 absorbs and transfers heat from the plurality of dies 14. In other words, heat generated by the plurality of dies 14 is transferred from the dies 14 through the substrate 12 to the heat sink 20. In one embodiment, as... Figure 1 As shown, the dimensions of the heat sink 20 (e.g., length, width, and height) are larger than those of the substrate 12 to maximize contact between the heat sink 20 and the substrate 12 and the surrounding environment (e.g., air, water, or other immersion coolant). The heat sink 20 is made of a suitable conductive metal, such as aluminum or copper. In one embodiment, the substrate 12 is attached to the heat sink 20 with a conductive material (such as a sintered material). In one embodiment, a conductive film (e.g., a graphite film) is formed on the upper surface of the heat sink 20 (e.g., between the heat sink 20 and the substrate 12) to further increase heat dissipation.

[0022] In addition to heat sink 20, other types of heat dissipation technologies can be used. In one embodiment, heat sink 20 is replaced by a vapor chamber filled with a coolant (such as air or liquid). Substrate 12 is positioned in the vapor chamber.

[0023] The printed circuit board 22 is coupled to connection pins 16. Specifically, connection pins 16 are inserted into trenches 30 that extend into the printed circuit board 22 and have sidewalls coated with a conductive material. When inserted into the trenches 30, connection pins 16 are electrically coupled to electrical connections or traces on the printed circuit board 22. Thus, the printed circuit board 22 is electrically coupled to a plurality of dies 14 via connection pins 16. In one embodiment, the electrical connections of the printed circuit board 22 are attached to the connection pins 16 via a conductive material (e.g., solder or sinter).

[0024] Printed circuit board 22 includes electrical connections for transmitting electrical signals (e.g., power signals) between die 14 and integrated circuits, which are on or electrically coupled to printed circuit board 22 and support die 14 (e.g., drivers, converters, and bridges on or connected to printed circuit board 22). In one embodiment, printed circuit board 22 does not include any die 14. Instead, printed circuit board 22 is used solely for routing signals from integrated circuits supporting die 14 to die 14. This allows for short interconnects, low parasitics, low switching losses, low stray inductance, and high switching speeds. Furthermore, the separation of die 14 from printed circuit board 22 simplifies the design complexity of device 10 and minimizes reliability issues, while also allowing a high degree of freedom in the design to route various signals.

[0025] like Figure 1 As shown, the connection pin 16 is partially inserted into the printed circuit board 22, such that a space 32 exists between the printed circuit board 22 and the upper surface 34 of the molded part 18. Space 32 allows for various cooling techniques to be used for the die 14. For example, general non-immersion cooling can be used in conjunction with the aforementioned substrate 12 and heat sink 20. As another example, non-isolated immersion cooling of the die 14 can be used. In this case, the immersed coolant (such as air or liquid) surrounds the die 14 and heat sink 20 and fills space 32. The immersion coolant should have dielectric properties. Furthermore, the substrate 12 need not include an insulating layer 24 (e.g., the substrate 12 can instead include one or more conductive layers, such as copper). The printed circuit board 22 is also spaced from the upper surface 35 of the heat sink 20, which is not covered by the substrate 12 and the molded part 18. Thus, the heat sink 20 is also cooled by the immersed coolant. The space between the printed circuit board 22 and the upper surface 35 of the heat sink 20 is larger than space 32.

[0026] Figure 2A , 2B 2C, 2D, 2E, and 2F are embodiments disclosed herein. Figure 1 The subsequent manufacturing steps of device 10.

[0027] exist Figure 2A In the process, substrate 12 is prepared. As described above, in one embodiment, such as Figure 1 and Figure 2A As shown, the substrate 12 includes an insulating layer 24; a first conductive layer 26 on a first (bottom) side of the insulating layer 24; and a second conductive layer 28 on a second (top) side of the insulating layer 24.

[0028] exist Figure 2B In this configuration, a plurality of dies 14 are positioned on and attached to the substrate 12, and more specifically, are positioned on the second conductive layer 28. As discussed above, the dies 14 are semiconductor dies comprising various integrated circuits, such as power inverters, rectifiers, converters, charging circuits, and other applicable semiconductor components.

[0029] exist Figure 2C In this configuration, connection pin 16 is electrically coupled to various integrated circuits included in die 14 via, for example, soldering or sintering. As described above, connection pin 16 is a press-fit pin that is pressed and inserted into printed circuit board 22. When inserted, connection pin 16 provides an electrical connection between the integrated circuits of die 14 and the printed circuit board 22.

[0030] In one embodiment, connection pin 16 includes coupling pin 36. Coupling pin 36 is physically coupled to substrate 12 but not electrically coupled to the integrated circuit of die 14. Coupling pin 36 is a press-fit pin that is pressed and inserted into printed circuit board 22 to securely attach substrate 12 to printed circuit board 22. Figure 2C As shown, the coupling pin 36 includes a first set of coupling pins and a second set of coupling pins positioned on opposite sides of the substrate 12.

[0031] exist Figure 2D In this design, a molding 18 is formed on a substrate 12, a plurality of dies 14, and connection pins 16. The molding 18 extends along a second conductive layer 28 on a second (top) side of an insulating layer 24 and along a side surface of the substrate 12. The molding 18 encapsulates the substrate 12 and the plurality of dies 14, and includes a first end of the connection pins 16 electrically connected to the dies 14. The connection pins 16 extend from the dies 14, pass through a portion of the molding 18 on the second conductive layer 28, and extend out of the molding 18. A second end of the connection pins 16, inserted into and electrically connected to a printed circuit board 22, extends out of the molding 18 and is exposed from the molding 18.

[0032] exist Figure 2E In this configuration, substrate 12, a plurality of dies 14, connection pins 16, and molding compound 18 are positioned on and attached to heat sink 20 by means of, for example, soldering or sintering. More specifically, a first conductive layer 26 of substrate 12 is attached to heat sink 20. As described above, heat generated by the plurality of dies 14 is transferred from the dies 14 through substrate 12 to heat sink 20.

[0033] exist Figure 2F In this process, the printed circuit board 22 is coupled to the connection pin 16 to achieve the following: Figure 1 Device 10 is shown. As described above, the printed circuit board 22 is coupled to the connection pin 16 by inserting the connection pin 16 into the trench 30 extending into the printed circuit board 22. Thus, the connection pin 16 is electrically coupled to electrical connections or traces on the printed circuit board 22, and the printed circuit board 22 is electrically coupled to a plurality of dies 14 via the connection pin 16.

[0034] Figure 3 This is a system 41 comprising a plurality of devices 10 according to embodiments disclosed herein. Each device 10 is as follows: Figure 1 As discussed. However, multiple devices 10 share the same printed circuit board 22.

[0035] The printed circuit board 22 has a first side 38 and a second side 40 opposite to the first side 38. Each of the first side 38 and the second side 40 includes an electrical connection or trace on the printed circuit board 22.

[0036] The first group 42 of device 10 is positioned on the first side 38, and the second group 44 of device 10 is positioned on the second side 40. Although three devices 10 are shown on each side of the printed circuit board 22, any number of devices can be placed on each side of the printed circuit board 22. As described above, when the connection pin 16 of device 10 is inserted into the printed circuit board 22, the connection pin 16 provides an electrical connection between the die 14 of device 10 and the electrical connection of the printed circuit board 22.

[0037] The printed circuit board 22 is sandwiched between the first group 42 and the second group 44 of the device 10. In other words, the first group 42 of the device 10 is spaced apart from the second group 44 of the device 10 by the printed circuit board 22. In one embodiment, as... Figure 3 As shown, each device in the first group 42 of device 10 overlaps or aligns with a corresponding device in the second group 44 of device 10. In this embodiment, the connection pins 16 of the devices in the first group 42 are spaced apart from the connection pins 16 of the corresponding devices in the second group 44 by a portion of the printed circuit board 22 to avoid cross-connection.

[0038] As described above, each device 10 is coupled to a heat sink 20. In one embodiment, each device 10 is coupled to a respective heat sink 20. In another embodiment, two or more devices 10 share the same heat sink 20. For example, in Figure 3 In this configuration, two devices 10 are positioned on the same heat sink 20.

[0039] Device 10 is enclosed by housing 46. Housing 46 includes connection portions 48 positioned on opposite sides of housing 46. Printed circuit board 22 is coupled to housing via connection portions 48. Housing 46 protects device 10 and provides a closed cavity for device 10. In one embodiment, an immersion coolant (such as air or liquid) is provided in the cavity surrounding housing 46 of device 10 and fills space 32 of device 10.

[0040] The various embodiments disclosed herein provide a device that combines a partially embedded solution with cooling (e.g., immersion cooling). This device can be manufactured using relatively simple processes and does not contain high-cost components such as insulating materials.

[0041] The device is summarized to include a first heat sink; a first substrate on the first heat sink; a first plurality of dies on the first substrate; a first molding on the first plurality of dies and the first substrate; a first plurality of connection pins electrically coupled to the first plurality of dies; and a printed circuit board electrically coupled to the first plurality of connection pins, the first plurality of connection pins extending from the first plurality of dies through the surface of the first molding and extending to the printed circuit board, the printed circuit board being spaced apart from the surface of the first molding.

[0042] The first substrate includes a first conductive layer; an insulating layer on the first conductive layer; and a second conductive layer on the insulating layer, with the first plurality of dies on the second conductive layer.

[0043] The printed circuit board includes an integrated circuit and electrical connections to the integrated circuit and a plurality of connection pins.

[0044] The printed circuit board includes multiple trenches, and a plurality of connection pins are inserted into the plurality of trenches.

[0045] The device also includes an immersion coolant extending between the surfaces of the printed circuit board and the first molded part.

[0046] The first substrate is attached to the heat sink by solder or sintering.

[0047] The first plurality of connection pins are attached to the first plurality of dies by soldering or sintering.

[0048] The device also includes a second substrate; a second plurality of dies on the second substrate; a second molding on the second plurality of dies and the second substrate; and a second plurality of connection pins electrically coupled to the second plurality of dies, a printed circuit board electrically coupled to the second plurality of connection pins, the second plurality of connection pins extending from the second plurality of dies through the surface of the second molding and extending to the printed circuit board, the printed circuit board being spaced apart from the surface of the second molding.

[0049] The second substrate is on the first heat sink.

[0050] The device also includes a second heat sink, and a second substrate is placed on the second heat sink.

[0051] The first and second substrates are positioned on opposite sides of the printed circuit board.

[0052] The device also includes a housing, a first heat sink, a first substrate, a first plurality of dies, a first molded part, a first plurality of connection pins, and a printed circuit board within the housing.

[0053] The method is summarized as including positioning a plurality of dies on a substrate; electrically coupling a plurality of connection pins to the plurality of dies; forming a molded part on the plurality of dies and the substrate; positioning the substrate on a heat sink; and electrically coupling a printed circuit board to the plurality of connection pins by inserting the plurality of connection pins into a printed circuit board, the plurality of connection pins extending from the plurality of dies through the surface of the molded part and extending to the printed circuit board, the printed circuit board being spaced apart from the surface of the molded part.

[0054] The substrate includes a first conductive layer; an insulating layer on the first conductive layer; and a second conductive layer on the insulating layer, with a plurality of dies on the second conductive layer.

[0055] The method also includes providing an immersion coolant in the space between the printed circuit board and the surface of the molded part.

[0056] Positioning the substrate on the heat sink involves attaching the substrate to the heat sink using solder or sintering.

[0057] Electrically coupling multiple connection pins to multiple dies includes attaching multiple connection pins to multiple dies using solder or sintering.

[0058] The system is summarized as including: a printed circuit board; multiple heat sinks; and multiple devices positioned between the printed circuit board and the multiple heat sinks, each of the multiple devices including: a substrate; multiple dies on the substrate; a molded part on the multiple dies and the substrate; and multiple connection pins electrically coupled between the multiple dies and the printed circuit board, the multiple connection pins extending from the multiple dies through the surface of the molded part and extending to the printed circuit board, the printed circuit board being spaced apart from the surface of the molded part.

[0059] The first device of a plurality of devices is on the first heat sink of a plurality of heat sinks, the second device of a plurality of devices is on the second heat sink of a plurality of heat sinks, and the first device is spaced apart from the second device by a printed circuit board.

[0060] The first device and the second device of the plurality of devices are located on the first heat sink of the plurality of heat sinks, and the first heat sink is spaced apart from the printed circuit board through the first device and the second device.

[0061] The various embodiments described above can be combined to provide further embodiments. These and other changes can be made to the embodiments based on the detailed description above. Generally, the terminology used in the following claims should not be construed as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to include all possible embodiments and the full scope of the authorized equivalents of these claims. Therefore, the claims are not limited to this disclosure.

Claims

1. A device comprising: First radiator; The first substrate on the first heat sink; The first plurality of dies on the first substrate; A first molded part on the first plurality of dies and the first substrate; Electrically coupled to the first plurality of connection pins of the first plurality of dies; as well as Electrically coupled to the printed circuit board of the first plurality of connection pins. The first plurality of connection pins extend from the first plurality of dies through the surface of the first molded part and extend into the printed circuit board. The printed circuit board is spaced apart from the surface of the first molded part.

2. The device according to claim 1, wherein the first substrate comprises: First conductive layer; Insulating layer on the first conductive layer; as well as The second conductive layer is on the insulating layer, and the first plurality of dies are on the second conductive layer.

3. The device of claim 1, wherein the printed circuit board includes an integrated circuit and electrical connections, the electrical connections being electrically coupled to the integrated circuit and the first plurality of connection pins.

4. The device of claim 1, wherein the printed circuit board includes a plurality of trenches, and the first plurality of connection pins are inserted into the plurality of trenches.

5. The device according to claim 1, further comprising: An immersion coolant extends between the printed circuit board and the surface of the first molded part.

6. The device of claim 1, wherein the first substrate is attached to the heat sink by solder or sintering.

7. The device of claim 1, wherein the first plurality of connection pins are attached to the first plurality of dies by solder or sintering.

8. The device according to claim 1, further comprising: Second substrate; The second plurality of dies on the second substrate; The second plurality of dies and the second molded part on the second substrate; as well as Electrically coupled to the second plurality of connection pins of the second plurality of dies. The printed circuit board is electrically coupled to the second connection pin. The second plurality of connection pins extend from the second plurality of dies through the surface of the second molded part and into the printed circuit board, and The printed circuit board is spaced apart from the surface of the second molded part.

9. The device of claim 8, wherein the second substrate is on the first heat sink.

10. The device according to claim 8, further comprising: The second heat sink, the second substrate is on the second heat sink.

11. The device of claim 8, wherein the first substrate and the second substrate are positioned on opposite sides of the printed circuit board.

12. The device according to claim 8, further comprising: The housing, the first heat sink, the first substrate, the first plurality of dies, the first molded part, the first plurality of connection pins and the printed circuit board are in the housing.

13. A method comprising: Position multiple dies on the substrate; Multiple connection pins are electrically coupled to the multiple dies; A molded part is formed on the plurality of dies and the substrate; Position the substrate on the heat sink; as well as By inserting the plurality of connection pins into the printed circuit board, the printed circuit board is electrically coupled to the plurality of connection pins. The plurality of connection pins extend from the plurality of dies through the surface of the molded part and into the printed circuit board. The printed circuit board is spaced apart from the surface of the molded part.

14. The method of claim 13, wherein the substrate comprises: First conductive layer; Insulating layer on the first conductive layer; as well as A second conductive layer is located on the insulating layer, and the plurality of dies are located on the second conductive layer.

15. The method of claim 13, further comprising: An immersion coolant is provided in the space between the printed circuit board and the surface of the molded part.

16. The method of claim 13, wherein positioning the substrate on the heat sink comprises: The substrate is attached to the heat sink using solder or sintering.

17. The method of claim 13, wherein electrically coupling the plurality of connection pins to the plurality of dies comprises: The plurality of connection pins are attached to the plurality of dies by welding or sintering.

18. A system comprising: Printed circuit boards; Multiple heat sinks; as well as Multiple devices, wherein the multiple devices are positioned between the printed circuit board and the multiple heat sinks, each of the multiple devices comprising: Substrate; Multiple dies on the substrate; Molded parts on the plurality of dies and the substrate; and Multiple connection pins are electrically coupled between the plurality of dies and the printed circuit board. The plurality of connection pins extend from the plurality of dies through the surface of the molded part and into the printed circuit board. The printed circuit board is spaced apart from the surface of the molded part.

19. The system of claim 18, wherein The first of the plurality of devices is located on the first of the plurality of heat sinks. The second of the plurality of devices is located on the second of the plurality of heat sinks, and The first device is separated from the second device by the printed circuit board.

20. The system of claim 18, wherein The first and second devices of the plurality of devices are located on the first heat sink of the plurality of heat sinks, and The first heat sink is separated from the printed circuit board by the first device and the second device.

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