Electronic assembly comprising a connecting fork

Abstract

An electronic component (1) includes: - at least one power electronic module (2) including at least one connection pin (3), particularly angled connection pins; - a printed circuit board (4) including an electrical connection rail and at least one electrical connection port (5); - an intermediate electrical connector (7) disposed between the power electronic module (2) and the printed circuit board (4), the intermediate electrical connector including: • at least one connection fork (8) arranged to be thermally pressed onto the connection pin (3) of the power electronic module (2); • at least one intermediate pin electrically connected to the connection fork (8) and configured to be inserted into the at least one electrical connection port (5) of the printed circuit board (4).

Description

Technical Field

[0001] The present invention relates to an electronic assembly including power electronic components, which is particularly configured to be integrated in an inverter. Background Technology

[0002] Patent application EP4362083A1 discloses an electronic component that includes a power electronic module located between two cooling devices arranged to cool the power electronic module.

[0003] The power electronic module includes connection pins arranged to transmit signals to the power module. These connection pins are therefore electrically connected to intermediate connectors that are force-fitted onto the electronic board.

[0004] This connection method requires soldering the connection pins of the power electronics module to the intermediate connector. This method represents an expensive assembly step and requires precise relative positioning of the power electronics module and the intermediate connector.

[0005] The invention is specifically designed to overcome these shortcomings. Summary of the Invention

[0006] This invention relates to an electronic component, comprising:

[0007] - At least one power electronic module, which includes at least one connection pin, particularly an angled connection pin.

[0008] - A printed circuit board comprising electrical connection rails and at least one electrical connection port.

[0009] - An intermediate electrical connector, placed between the power electronics module and the printed circuit board, includes:

[0010] • At least one connecting fork, the at least one connecting fork being arranged to be heat-pressed onto the connection pins of the power electronics module.

[0011] • At least one intermediate pin, which is electrically connected to the connection fork and configured to be inserted into the at least one electrical connection port on the printed circuit board.

[0012] According to one aspect of the invention, the connecting fork is U-shaped and includes two legs of length L spaced apart by a gap E.

[0013] According to one aspect of the invention, the gap E of the connecting fork allows the fork to be heat-pressed onto the angled connecting pin, and the relative placement tolerance between the fork and the connecting pin is greater than or equal to 1 mm.

[0014] Alternatively, the connecting fork can have any other shape, such as a circle or a rectangle.

[0015] According to one aspect of the invention, the connecting fork can define an open or closed profile.

[0016] According to one aspect of the invention, the connecting fork, connecting pin, and intermediate pin are made of conductive material, particularly metal or metal alloy, and optionally coated, particularly with copper or copper alloy.

[0017] According to one aspect of the invention, the connecting fork, the intermediate pin, and the connecting pin are made of different copper alloys.

[0018] According to one aspect of the invention, the intermediate electrical connector includes a frame.

[0019] According to one aspect of the invention, the frame includes a plurality of positioning openings, particularly as many as the power electronic modules, each positioning opening being arranged to accommodate the power electronic modules.

[0020] According to one aspect of the invention, the electronic component includes a plurality of power electronic modules, such as three power electronic modules, and the intermediate electrical connector includes three positioning openings.

[0021] According to one aspect of the invention, the frame is made of an insulating material, particularly plastic.

[0022] According to one aspect of the invention, the connecting fork and the intermediate pin are permanently integrated into the frame.

[0023] According to one aspect of the invention, the frame is overmolded on the intermediate pin and the connecting fork, integrating them inseparably.

[0024] According to one aspect of the invention, the intermediate pin has a press-fit geometry.

[0025] According to one aspect of the invention, the intermediate pin is electrically connected to the electrical track of the circuit board via a connection port of the printed circuit board through form-fitting and / or friction locking and / or material locking.

[0026] It is worth noting that the intermediate pin is electrically connected to the electrical track of the printed circuit board via an interference fit, and the intermediate pin is inserted into the connection port of the printed circuit board.

[0027] According to one aspect of the invention, the power electronic module is substantially flat and includes a top surface, a bottom surface, and a side surface.

[0028] According to one aspect of the invention, the electronic component includes at least one cooling device positioned in thermal contact with at least one power electronic module.

[0029] It is worth noting that the electronic components include two cooling devices:

[0030] - A first cooling device, positioned to make thermal contact with the upper surface of the power electronics module.

[0031] - A second cooling device, which is positioned to make thermal contact with the second phase of the power electronics module.

[0032] According to one aspect of the invention, an intermediate electrical connector is located between a first cooling device and a second cooling device, and forms a stack with the first cooling device and the second cooling device.

[0033] According to one aspect of the invention, the connection pins of the power electronic module are located on the side of the power electronic module.

[0034] According to one aspect of the invention, each connection pin includes:

[0035] - The horizontal portion, which is substantially parallel to the upper surface of the power electronics module.

[0036] - A vertical portion, which is substantially perpendicular to the upper surface of the power electronics module.

[0037] - An elbow that connects the horizontal and vertical portions of the connector pin.

[0038] Advantageously, when the upper and lower surfaces of the power electronic module are positioned to contact the cooling device, the use of angled connection pins on the sides of the power electronic module enables the electronic board to be electrically connected to the power electronic module.

[0039] According to one aspect of the invention, angled connection pins are used so that the connection pins can be inserted into the connection fork, thereby enabling solderless electrical connections.

[0040] Advantageously, the use of a connecting fork can increase the connection tolerance between the intermediate electrical connector and the angled connection pins of the power electronics module.

[0041] According to one aspect of the invention, the use of larger tolerances ensures more reliable assembly of electronic components for mass production.

[0042] Advantageously, using thermoforming for electrical connections can reduce costs and improve the reliability of these connections compared to connections using brazing.

[0043] The present invention also relates to a method for electrically interconnecting a power electronic module of an electronic component with a printed circuit board of the electronic component, the method comprising the following steps:

[0044] - The step of positioning at least one connection pin of the power electronic module opposite to at least one connection fork of the intermediate electrical connector.

[0045] - The step of heat-pressing at least one connecting fork onto at least one connecting pin.

[0046] - The step of positioning the printed circuit board opposite the intermediate electrical connector, such that the electrical connection port of the printed circuit board is positioned opposite the intermediate pin of the printed circuit board.

[0047] - The step of pressing the middle pin of the intermediate electrical connector into the connection port of the printed circuit board.

[0048] According to one aspect of the invention, the hot-pressing step includes heating the connecting fork and deforming the connecting fork, particularly deforming the legs of the connecting fork, so as to position the connecting fork in contact with the connecting pin and fix the connecting fork and the connecting pin together. Attached Figure Description

[0049] Other features, details, and advantages of the invention will become clearer from the following description and from several examples of embodiments given in a non-limiting manner with reference to the accompanying diagrams, wherein:

[0050] Figure 1 This is a schematic diagram of an electronic component according to the present invention.

[0051] Figure 2 This is a close-up view of a cross-section of an electronic component according to the present invention.

[0052] Figure 3 This is a close-up top view of the electronic component according to the present invention.

[0053] The features, variations, and different embodiments of the present invention can be combined with each other in various combinations, provided that they are not mutually exclusive or incompatible. In particular, variations of the present invention may be contemplated that include only selections of the features described below, isolated from the other features described, provided that such selection is sufficient to provide a technical advantage and / or distinguish the present invention from the prior art. Detailed Implementation

[0054] Figure 1 and 2 An electronic component 1 according to the present invention is shown.

[0055] Electronic component 1 includes:

[0056] - Three power electronic modules 2, each power electronic module including at least one connection pin 3, specifically angled connection pins,

[0057] - Printed circuit board 4, only Figure 2 As shown, it includes an electrical connection rail and at least one electrical connection port 5.

[0058] - An intermediate electrical connector 7, which is placed between the power electronics module 2 and the printed circuit board 4, includes:

[0059] • At least one connecting fork 8 is arranged to be thermally pressed onto the connecting pin 3 of the power electronics module 2.

[0060] • At least one intermediate pin 10, which is electrically connected to the connecting fork 8 and configured to be inserted into at least one electrical connection port 5 of the printed circuit board 4.

[0061] In this configuration, each power electronic module 2 includes seven angled connection pins 3, and the intermediate electrical connector 7 includes seven connection forks 8 and seven intermediate pins 10.

[0062] The connecting fork 8 is U-shaped and includes two legs 11 of length L separated by a gap E.

[0063] The gap E of the connecting fork 8 allows the connecting fork 8 to be heat-pressed onto the angled connecting pin 3, and the relative placement tolerance between the fork and the connecting pin 3 is greater than or equal to 1 mm.

[0064] According to an embodiment of the invention not shown, at least one connecting fork 8 may have any other shape, such as a circular or rectangular shape, and may have an open or closed profile.

[0065] The connecting fork 8, connecting pin 3, and intermediate pin 10 are made of conductive material, particularly metal or metal alloy, and optionally coated, particularly with copper or copper alloy.

[0066] The connecting fork 8, the intermediate pin 10, and the connecting pin 3 are made of different copper alloys.

[0067] The intermediate electrical connector 7 includes a frame 30 that includes a plurality of positioning openings, particularly as many as the power electronics module 2, each positioning opening being arranged to accommodate the power electronics module 2.

[0068] The electronic component 1 includes multiple power electronic modules 2, such as three power electronic modules 2, and the intermediate electrical connector 7 includes three positioning openings.

[0069] The connecting fork 8 and the intermediate pin 10 are permanently integrated into the frame 30.

[0070] The frame 30 is made of insulating material, particularly plastic, and is overmolded onto the intermediate pin 10 and the connecting fork 8, integrating them inseparably.

[0071] The intermediate pin 10 has a press-fit geometry.

[0072] The intermediate pin 10 is electrically connected to the electrical track of the circuit board via the connection port of the printed circuit board 4 through form fit and / or friction lock and / or material lock.

[0073] It is worth noting that the intermediate pin 10 is electrically connected to the electrical rail of the printed circuit board 4 via an interference fit, and the intermediate pin 10 is inserted into the electrical connection port 5 of the printed circuit board 4.

[0074] The power electronics module 2 is basically flat and includes a top surface, a bottom surface, and side surfaces.

[0075] Electronic component 1 includes at least one cooling device positioned in thermal contact with at least one power electronic module 2.

[0076] In this case, electronic component 1 includes two cooling devices:

[0077] - A first cooling device 15 is positioned to make thermal contact with the upper surface of the power electronics module 2.

[0078] - A second cooling device 16 is positioned to make thermal contact with the second phase of the power electronics module 2.

[0079] The intermediate electrical connector 7 is located between the first cooling device 15 and the second cooling device 16, and forms a stack with the first cooling device 15 and the second cooling device 16.

[0080] The connection pin 3 of the power electronic module 2 is placed on the side of the power electronic module 2.

[0081] Each connection pin 3 includes:

[0082] - Horizontal section 20, which is substantially parallel to the upper surface of power electronics module 2.

[0083] - Vertical portion 21, which is substantially perpendicular to the upper surface of the power electronics module 2.

[0084] - Elbow 22, which connects the horizontal and vertical portions of the connecting pin 3.

[0085] By using the angled connection pin 3, the connection pin 3 can be inserted into the connection fork 8 and a solderless electrical connection can be made.

[0086] Advantageously, the use of the connecting fork 8 can increase the connection tolerance between the intermediate electrical connector 7 and the angled connecting pins 3 of the power electronics module 2.

[0087] Using larger tolerances ensures more reliable assembly of electronic component 1 for mass production.

[0088] Advantageously, using thermoforming for electrical connections can reduce costs and improve the reliability of these connections compared to connections using brazing.

Claims

1. An electronic component (1), comprising: - At least one power electronic module (2), which includes at least one connection pin (3), particularly angled connection pins, - Printed circuit board (4), which includes electrical connection rails and at least one electrical connection port (5). - An intermediate electrical connector (7) is placed between the power electronics module (2) and the printed circuit board (4), the intermediate electrical connector comprising: • At least one connecting fork (8), the at least one connecting fork (8) being arranged to be heat-pressed onto the connecting pin (3) of the power electronics module (2), • At least one intermediate pin, which is electrically connected to the connecting fork (8) and configured to be inserted into the at least one electrical connection port (5) of the printed circuit board (4).

2. The electronic assembly (1) according to claim 1, wherein The connecting fork (8) is U-shaped and includes two legs (11) of length (L) spaced apart by a gap (E), the gap (E) of the connecting fork (8) allowing the fork to be heat-pressed onto the angled connecting pin (3), wherein the relative placement tolerance of the fork and the connecting pin (3) is greater than or equal to 1 mm.

3. The electronic assembly (1) according to any one of the preceding claims, wherein The connecting fork (8), the intermediate pin, and the connecting pin (3) are made of different copper alloys.

4. The electronic assembly (1) according to any one of the preceding claims, wherein The intermediate electrical connector (7) includes a frame (30) made of insulating material, particularly a plastic frame (30), and the connecting fork (8) and the intermediate pin are permanently integrated into the frame (30).

5. The electronic assembly (1) according to any one of the preceding claims, wherein The intermediate pin has a press-fit geometry.

6. The electronic assembly (1) according to any one of the preceding claims, wherein The intermediate pin is electrically connected to the electrical track of the circuit board via the connection port of the printed circuit board (4) through a form fit and / or friction lock and / or material lock.

7. The electronic component (1) according to any one of the preceding claims includes at least one cooling device, said at least one cooling device being positioned in thermal contact with at least one power electronic module (2).

8. The electronic assembly (1) according to any one of the preceding claims, wherein The connection pin (3) of the power electronic module (2) is placed on the side of the power electronic module (2).

9. The electronic assembly (1) according to any one of the preceding claims, wherein Each connection pin (3) includes: - A horizontal portion (20), which is substantially parallel to the upper surface of the power electronics module (2). - Vertical portion (21), which is in a direction substantially perpendicular to the upper surface of the power electronics module (2), - Elbow (22), which connects the horizontal portion (20) and the vertical portion (21) of the connecting pin (3).

10. A method for electrically interconnecting a power electronic module (2) of an electronic component (1) according to any one of the preceding claims with a printed circuit board (4) of the electronic component (1), comprising the following steps: - The step of placing at least one connection pin (3) of the power electronic module (2) opposite to at least one connection fork (8) of the intermediate electrical connector (7), - The step of heat-pressing the at least one connecting fork (8) onto the at least one connecting pin (3), - The step of placing the printed circuit board (4) opposite the intermediate electrical connector (7) such that the electrical connection port of the printed circuit board (4) is positioned opposite the intermediate pin of the printed circuit board (4), - The step of pressing the intermediate pin of the intermediate electrical connector (7) into the connection port of the printed circuit board (4).

11. The method of claim 10, wherein, The hot-pressing step includes heating the connecting fork (8) and deforming the connecting fork (8), particularly deforming the legs (11) of the connecting fork (8) so as to place the connecting fork (8) in contact with the connecting pin (3) and fix the connecting fork (8) and the connecting pin (3) together.

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