Flexible circuit board, display module and display device

Abstract

This invention relates to the field of display devices, specifically providing a flexible circuit board, a display module, and a display device. The aim is to solve the problem of activating the conductive adhesive between the display panel and the circuit board device area without damaging the circuit board components. To this end, the flexible circuit board of this invention provides a pressure-retaining member in the device area of ​​the circuit board body. The dimension of the pressure-retaining member in the thickness direction of the circuit board body is larger than the maximum dimension of all functional components in the thickness direction of the circuit board body. This ensures that the pressure applied by the pressure fixture acts only on the pressure-retaining member and is transmitted through it to the corresponding anisotropic conductive adhesive layer in the device area. This effectively activates the conductive adhesive in the area while protecting the functional components from pressure, thereby improving the bonding strength and electrical connection stability between the flexible circuit board and the display panel, and preventing abnormal noise.

Description

Technical Field

[0001] This invention relates to the field of display device technology, specifically to a flexible circuit board, a display module, and a display device. Background Technology

[0002] To achieve a thinner and lighter design for display devices, the clearance between the display module and the mid-frame in the thickness direction of the display device is constantly being reduced, with some gaps even less than 0.2mm. This significantly increases the risk of interference between the mid-frame and the display module. During assembly, the mid-frame is prone to deformation under stress, squeezing the display module and causing the circuit board in the display module to temporarily adhere to the display panel. When the mid-frame returns to its original shape, the temporarily adhered area will separate. At this time, the vibration generated by the operation of the components on the circuit board will be transmitted to the separated area, causing local vibration and abnormal noise, which seriously affects the user experience.

[0003] To address the aforementioned issues, this pressure fixture is currently commonly used to improve the connection strength between the circuit board and the display panel, and to activate the anisotropic conductive adhesive layer between them. However, because the components in the component area of ​​the circuit board are relatively fragile, this pressure fixture cannot directly apply pressure to this area. Consequently, the conductive adhesive between the component area of ​​the circuit board and the display panel may not be effectively activated, and the noise problem persists.

[0004] Accordingly, a new technical solution is needed in this field to solve the above problems. Summary of the Invention

[0005] This invention aims to solve the aforementioned technical problem, namely, how to activate the conductive adhesive between the display panel and the circuit board components without damaging the circuit board components. Based on this, this application provides a flexible circuit board, the flexible circuit board comprising: The circuit board body includes a device area and a non-device area surrounding the device area; the device area is provided with a plurality of first pads and at least one second pad on one side along the thickness direction of the circuit board body. Multiple functional devices corresponding one-to-one with the first pad, the functional devices being disposed on the corresponding first pad; At least one pressing member corresponding to each of the second pads, the pressing member being disposed on the corresponding second pad, and having a dimension in the thickness direction of the circuit board body that is greater than the maximum dimension of all the functional devices in the thickness direction of the circuit board body.

[0006] In the preferred embodiment of the above-mentioned flexible circuit board, the pressing member includes: A conductive block is disposed on the second pad; A damping element is disposed on the side of the conductive block opposite to the circuit board body along the thickness direction of the circuit board body.

[0007] In the preferred embodiment of the above-mentioned flexible circuit board, the damping element includes an elastomer and a spring; and The elastic body is disposed on the side of the conductive block opposite to the circuit board body along the thickness direction of the circuit board body. The elastic body has an internal cavity, or the elastic body and the conductive block together form a cavity. At least a portion of the spring is disposed in the cavity, and the deformation direction of the spring is consistent with the thickness direction of the circuit board body; or The spring element is disposed on the side of the conductive block away from the circuit board body along the thickness direction of the circuit board body, and the spring element and the conductive block are at least partially embedded in the elastic body as a whole.

[0008] In the preferred embodiment of the above flexible circuit board, the dimension of the pressing member in the thickness direction of the circuit board body is H1, and the maximum dimension of the plurality of functional devices in the thickness direction of the circuit board body is H2, where H1≥H2+x+H3; Where H3 is the first safety margin, and x is the deformation of the spring component.

[0009] In the preferred embodiment of the above-mentioned flexible circuit board, the damping element is an elastomer.

[0010] In the preferred embodiment of the above flexible circuit board, the dimension of the pressing member in the thickness direction of the circuit board body is H1, and the maximum dimension of the plurality of functional devices in the thickness direction of the circuit board body is H2, where H1≥H2+H4; H4 is the second safety margin.

[0011] In the preferred embodiment of the above-mentioned flexible circuit board, the pressing member includes: A conductive block is disposed on the second pad; A rigid body is disposed on the side of the conductive block opposite to the circuit board body along the thickness direction of the circuit board body.

[0012] In the preferred embodiment of the above flexible circuit board, the dimension of the pressing member in the thickness direction of the circuit board body is H1, and the maximum dimension of the plurality of functional devices in the thickness direction of the circuit board body is H2, where H1≥H2+H5; H5 represents the third safety margin.

[0013] In the preferred embodiment of the above-mentioned flexible circuit board, the number of the pressing members is at least four, and the at least four pressing members are symmetrically distributed relative to the device area.

[0014] In the preferred embodiment of the above-mentioned flexible circuit board, at least a portion of the at least four pressing members are spaced apart along the periphery of the device area.

[0015] In the preferred embodiment of the above-mentioned flexible circuit board, the flexible circuit board further includes: A first conductive adhesive layer is disposed on the side of the device area away from the functional device along the thickness direction of the circuit board body; A first metal layer is disposed on the side of the first conductive adhesive layer that faces away from the circuit board body.

[0016] In the preferred embodiment of the above-mentioned flexible circuit board, the first conductive adhesive layer is an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer.

[0017] This application also provides a display module, the display module comprising: The flexible circuit board described in the above preferred technical solution; A second conductive adhesive layer is disposed on the side of the circuit board body away from the functional device along its thickness direction; the second conductive adhesive layer is an anisotropic conductive adhesive layer. The display panel, wherein the backlight side of the display panel is connected to the flexible circuit board via the second conductive adhesive layer.

[0018] In the preferred embodiment of the above-mentioned display module, the display module further includes: A foam layer is disposed on the backlight side of the display panel; A second metal layer is disposed between the foam layer and the second conductive adhesive layer.

[0019] This application also provides a display device, which includes the display module described in the preferred embodiment above.

[0020] Those skilled in the art will understand that the flexible circuit board of this application, by setting a pressing member in the device area of ​​the circuit board body, and making the dimension of the pressing member in the thickness direction of the circuit board body larger than the maximum dimension of all functional devices in the thickness direction of the circuit board body, ensures that the pressure applied by the pressure fixture only acts on the pressing member and is transmitted to the anisotropic conductive adhesive layer corresponding to the device area through the pressing member. This effectively activates the conductive adhesive in the area while ensuring that the functional devices are protected from pressure, thereby improving the bonding strength and electrical connection stability between the flexible circuit board and the display panel and avoiding abnormal noise.

[0021] Furthermore, by setting the pressure component as a combination of conductive block and damping component, on the one hand, it is beneficial to form an electrostatic grounding path, improve the electrostatic protection capability of the flexible circuit board, and avoid electrostatic damage to functional devices; on the other hand, the damping component can absorb external impact energy, reduce the damage to the device area when it is hit by collision or drop impact, and effectively prevent functional devices from being damaged by impact during assembly and transportation.

[0022] Furthermore, by combining an elastomer with a spring as a damping element, not only can the anisotropic conductive adhesive layer be activated and the spring protected, but damage to functional components can also be prevented during assembly and transportation. Simultaneously, the elastomer can also act as an energy dissipation element, converting the elastic potential energy released by the helical spring into heat energy and dissipating it outwards, causing the spring's vibration amplitude to decay rapidly and effectively preventing abnormal noises caused by spring vibration.

[0023] Furthermore, when the damping component is a combination of an elastic body and a spring, the total size of the pressing component is limited to not less than the sum of the maximum size of the functional device in the thickness direction of the circuit board body, the deformation of the spring component, and the first safety margin. This ensures that the pressure applied by the pressure fixture only acts on the pressing component, avoiding pressure on the functional device, and also allows for matching and installation with the existing height space of the display device.

[0024] Furthermore, by designing the damping element as an elastomer, the elastomer can effectively activate the conductive adhesive when the functional device is free from pressure, and can also absorb external impact energy, reducing the damage to the device area when it is subjected to collision or drop impact, and effectively preventing the functional device from being damaged by impact during assembly and transportation.

[0025] Furthermore, when the damping component is an elastic body, the total size of the pressure-blocking component is limited to not less than the sum of the maximum size of the functional device in the thickness direction of the circuit board body and the second safety margin. This not only enables the effective activation of the conductive adhesive when the functional device is not subjected to pressure, and prevents the functional device from being damaged by collision, but also allows for matching and installation with the existing height space of the display device.

[0026] Furthermore, by designing the pressure-retaining component as a combination of a conductive block and a rigid body, it is possible to ensure that the functional device does not bear pressure, while also transmitting the pressure of this pressure fixture to the anisotropic conductive adhesive layer, thereby effectively activating the conductive adhesive.

[0027] Furthermore, when the pressing component is a combination of a conductive block and a rigid body, the total size of the pressing component is limited to not less than the sum of the maximum size of the functional device in the thickness direction of the circuit board body and the third safety margin. On the one hand, this ensures that the pressure applied by the pressing fixture only acts on the pressing component, avoiding the functional device from bearing pressure. On the other hand, it also enables the flexible circuit board to be matched and installed with the existing height space of the display device.

[0028] Furthermore, by setting the number of pressure-retaining components to at least four, and making these pressure-retaining components symmetrically distributed relative to the device area, and at least a portion of these pressure-retaining components arranged along the periphery of the device area, pressure can be uniformly transmitted to the anisotropic conductive adhesive layer corresponding to the device area, ensuring that the conductive adhesive corresponding to the device area can be fully activated.

[0029] Furthermore, by sequentially setting the first conductive adhesive layer and the first metal layer on the side of the device area away from the functional device along the thickness direction of the circuit board body, the electrostatic protection capability of the flexible circuit board can be further improved, and the functional device can be prevented from being damaged by electrostatic discharge.

[0030] Those skilled in the art will understand that the display module of this application, by providing an anisotropic conductive adhesive layer between the flexible circuit board and the backlight side of the display panel, and providing a pressing member in the device area of ​​the flexible circuit board, and making the dimension of the pressing member in the thickness direction of the flexible circuit board larger than the maximum dimension of all functional devices in the thickness direction of the circuit board body, ensures that the pressure applied by the pressure fixture only acts on the pressing member and is transmitted to the corresponding anisotropic conductive adhesive layer in the device area. This effectively activates the conductive adhesive in the area while ensuring that the functional devices are protected from pressure, thereby improving the bonding strength and electrical connection stability between the flexible circuit board and the display panel and avoiding abnormal noise.

[0031] Furthermore, by adding a foam layer and a second metal layer to the backlight side of the display panel, the display panel can be buffered and cooled. Attached Figure Description

[0032] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which: Figure 1 This is a schematic diagram of the display module of this application; Figure 2 This is a cross-sectional schematic diagram of the flexible circuit board, the second metal layer, and the foam layer of this application; Figure 3 This is a schematic diagram of the flexible circuit board of this application; Figure 4 This is a schematic diagram of the first embodiment of the pressing component of this application; Figure 5 This is a schematic diagram of the second embodiment of the pressing component of this application; Figure 6 This is a schematic diagram of the third embodiment of the pressing component of this application; Figure 7 This is a schematic diagram of the fourth embodiment of the pressing component of this application.

[0033] The reference numerals in the attached figures are as follows: 1. Flexible circuit board; 11. Circuit board body; 111. Component area; 1111. First pad; 1112. Second pad; 112. Non-component area; 12. Functional component; 13. Pressing component; 131. Conductive block; 132. Damping component; 1321. Elastic body; 1322. Helical spring; 133. Rigid body; 14. Anisotropic conductive adhesive layer; 15. First metal layer; 2. Display panel; 3. Second conductive adhesive layer; 4. Foam layer; 5. Second metal layer. Detailed Implementation

[0034] Preferred embodiments of this application will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application.

[0035] It should be noted that in the description of this application, the terms "upper", "lower", "inner", "top", "bottom", etc., indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0036] Furthermore, it should be noted that, in the description of this application, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] like Figure 1-7 The display module of this application is described as shown below.

[0038] like Figure 1 and 2 The display module of this application includes a flexible circuit board 1, a second conductive adhesive layer 3, a display panel 2, a foam layer 4, and a second metal layer 5. The display panel 2 includes a display area, a bending area, and a bonding area connected in sequence. The display area has a light-emitting side and a backlight side along its thickness direction. The foam layer 4 and the second metal layer 5 are sequentially stacked on the backlight side of the display area. The bonding area of ​​the display panel 2 is bent through the bending area and then stacked on the second metal layer 5 on the backlight side of the display area. The flexible circuit board 1 is bonded to the bonding area of ​​the display panel 2 and is disposed on the side of the second metal layer 5 opposite to the display area via the second conductive adhesive layer 3.

[0039] Among them, the foam layer 4 and the second metal layer 5 form the SCF layer (Super Clean Foam), which provides buffering and heat dissipation for the display area.

[0040] It should be noted that the bonding area of ​​the flexible circuit board 1 and the display panel 2 is connected by a bonding process. Because the bonding process involves high temperature and high pressure, only metal fingers are provided on the part of the flexible circuit board 1 corresponding to the bonding area to achieve electrical connection. However, the functional devices 12 on the flexible circuit board 1 cannot withstand this environment, so they are arranged in the area outside the metal finger area on the flexible circuit board 1.

[0041] For example, this application does not limit the material of the second metal layer 5, such as it can be a copper foil layer.

[0042] See next Figure 1-3 The flexible circuit board 1 includes a circuit board body 11, multiple functional devices 12, and five pressing members 13. The second conductive adhesive layer 3 is an anisotropic conductive adhesive layer 14, which bonds the circuit board body 11 to the bonding area of ​​the display panel 2 and is disposed on the side of the second metal layer 5 facing away from the display area via the anisotropic conductive adhesive layer 14. The circuit board body 11 includes a non-device area 112 and a device area 111, with the non-device area 112 surrounding the device area 111. Multiple first pads 1111 and five second pads 1112 are disposed on one side of the device area 111 along the thickness direction of the circuit board body 11. The multiple first pads 1111 correspond to multiple functional devices 12, and the functional devices 12 are disposed on the corresponding first pads 1111. The five second pads 1112 correspond one-to-one with the five pressing members 13, and the pressing members 13 are disposed on the corresponding second pads 1112. The first pads 1111 and the second pads 1112 have the same dimensions in the thickness direction of the circuit board body 11. Each pressing member 13 has the same dimension in the thickness direction of the circuit board body 11, and each is larger than the maximum dimension of all functional devices 12 in the thickness direction of the circuit board body 11. Through this arrangement, the pressure applied by the pressure fixture acts only on the pressing member 13 and is transmitted through the pressing member 13 to the anisotropic conductive adhesive layer 14 corresponding to the device area 111. This effectively activates the conductive adhesive in this area while ensuring that the functional devices 12 are protected from pressure, thereby improving the bonding strength and electrical connection stability between the flexible circuit board 1 and the display panel 2, and preventing abnormal noise.

[0043] The non-device area 112 of the circuit board body 11 includes the area bonded to the bonding area of ​​the display panel 2. The thickness direction of the circuit board body 11 is consistent with the thickness direction of the display area, both corresponding to... Figure 1 and Figure 2 The up and down directions in the middle.

[0044] For example, this application does not limit the number of device regions 111 on the circuit board body 11. The number of device regions 111 can be one, two, three, or other numbers. Furthermore, this application does not fix the number of pressing members 13 in each device region 111; those skilled in the art can adjust it according to the setup requirements. For example, the number of pressing members 13 in each device region 111 can be at least one. In a preferred embodiment, to ensure that the anisotropic conductive adhesive corresponding to the device region 111 can be fully activated, at least four pressing members 13 must be provided in each device region 111, and these at least four pressing members 13 must be arranged symmetrically with respect to the device region 111.

[0045] For example, the number of first pads 1111 and second pads 1112 in this application can also be adjusted, as long as the number of first pads 1111 is not less than the number of functional devices 12 and the number of second pads 1112 is not less than the number of pressing members 13, so that each functional device 12 has a corresponding first pad 1111 and each pressing member 13 has a corresponding second pad 1112.

[0046] For example, functional device 12 may include IC, capacitor, inductor, resistor, etc., without specific limitations.

[0047] See next Figure 3 Four of the five pressing members 13 are arranged along the periphery of the device area 111, and the other pressing member 13 is located at the center of the device area 111, so that the five pressing members 13 are arranged symmetrically with respect to the device area 111. With the above arrangement, when the pressure fixture applies force, each pressing member 13 can uniformly transmit the pressure to the anisotropic conductive adhesive layer 14 corresponding to the device area 111, ensuring that the anisotropic conductive adhesive corresponding to the device area 111 can be fully activated, thereby establishing a stable and reliable conductive connection of the anisotropic conductive adhesive layer 14 along the thickness direction of the circuit board body 11.

[0048] For example, when at least four pressing members 13 are provided in each device area 111, not only are these pressing members 13 arranged symmetrically with respect to the device area 111, but at least some of these pressing members 13 are arranged along the periphery of the device area 111, and these pressing members arranged along the periphery are also arranged symmetrically with respect to the device area 111.

[0049] See next Figure 1-2 As shown in Figures 4-7, the pressing member 13 in this application includes two structural types. One is a combination of a conductive block 131 and a damping member 132, and the other is a combination of a conductive block 131 and a rigid body 133. These two structures will be described below.

[0050] In one implementation, such as Figure 2and 4 As shown in Figure 6, the pressure-retaining component 13 includes a conductive block 131 and a damping component 132. The conductive block 131 is disposed on the second pad 1112 and is connected to the grounding line of the circuit board body 11 through the second pad 1112, thereby forming an electrostatic discharge path, improving the electrostatic protection capability of the flexible circuit board 1, and preventing the functional device 12 from being damaged by electrostatic discharge. The damping component 132 is disposed on the side of the conductive block 131 away from the circuit board body 11 along the thickness direction of the circuit board body 11. It can absorb external impact energy and prevent the functional device 12 from being damaged by impact during assembly and transportation. With the above arrangement, when the pressure fixture applies force, the damping component 132 can transmit the pressure through the conductive block 131 to the anisotropic conductive adhesive layer 14 corresponding to the device area 111, thereby activating the anisotropic conductive adhesive in that area. In addition, since the dimension of the pressure-retaining component 13 in the thickness direction of the circuit board body 11 is larger than the maximum dimension of the functional device 12 in the thickness direction of the circuit board body 11, the functional device 12 will not be subjected to the force of the pressure fixture, thereby being effectively protected.

[0051] The damping element 132 includes two structures: one is a combination of an elastic body 1321 and a spring, and the other is an elastic body 1321. For example... Figure 4 As shown, when the damping element 132 includes an elastic body 1321 and a spring element, the spring element is a helical spring 1322. The elastic body 1321 is disposed on the side of the conductive block 131 away from the circuit board body 11 along the thickness direction of the circuit board body 11, and has a receiving groove on the side of the elastic body 131 close to the conductive block 131 along the thickness direction of the circuit board body 11. The receiving groove and the conductive block 131 together form a receiving cavity. The spring element is a helical spring 1322, which is disposed in the receiving cavity, and its two ends are respectively connected to the conductive block 131 and the bottom of the receiving groove, so that the deformation direction of the helical spring 1322 is consistent with the thickness direction of the circuit board body 11. With the above arrangement, when the pressure fixture applies pressure to the pressing element 13, the helical spring 1322 is compressed along the thickness direction of the circuit board body 11 and accumulates elastic potential energy. At the same time, the pressure is transmitted through the conductive block 131 to the anisotropic conductive adhesive layer 14 corresponding to the device area 111 to activate the anisotropic conductive adhesive layer 14. When the force applied to the pressing member 13 is removed, the helical spring 1322 returns to its deformation, and the elastic body 1321 acts as an energy dissipation element, converting the elastic potential energy released by the helical spring 1322 into heat energy and dissipating it outward, so that the vibration amplitude of the spring decays rapidly and effectively avoids abnormal noise caused by spring vibration.

[0052] The spring component can be a helical spring 1322, or a wave spring, etc. In addition, the spring component is not limited to being entirely placed inside the receiving cavity; it can also be partially placed inside the receiving cavity and partially extended outside the receiving cavity.

[0053] Furthermore, when the damping element 132 includes an elastic body 1321 and a spring element, such as Figure 5 As shown, the elastic body 1321 can also be disposed on the side of the conductive block 131 away from the circuit board body 11 along the thickness direction of the circuit board body 11, and has a receiving cavity inside. The spring is disposed in the receiving cavity, and its two ends are respectively connected to the two ends of the receiving cavity along the thickness direction of the circuit board body 11, so that the deformation direction of the spring is consistent with the thickness direction of the circuit board body 11; or, as Figure 6 As shown, the spring element is disposed on the side of the conductive block 131 opposite to the circuit board body 11 along the thickness direction of the circuit board body 11, and the spring element and the conductive block 131 are at least partially embedded in the elastic body 1321 as a whole. The above two structures of the damping element 132 can realize the above-mentioned pressure transmission, conductive adhesive activation and vibration suppression functions.

[0054] To ensure proper installation within the existing height space of the display device and prevent the pressure member 13 from being too large and affecting assembly, the dimension of the pressure member 13 in the thickness direction of the circuit board body 11 is H1. This means the sum of the dimensions of the damping member 132 and the conductive block 131 in the thickness direction of the circuit board body 11 is H1. The maximum dimension of the multiple functional components 12 in the thickness direction of the circuit board body 11 is H2, and the deformation of the spring component is x. These three dimensions satisfy the relationship: H1 ≥ H2 + x + H3, where H3 is the first safety margin. By limiting these dimensions, it is ensured that the pressure applied by this pressure fixture acts only on the pressure member 13, preventing the functional components 12 from bearing pressure, while also achieving proper installation within the existing height space of the display device.

[0055] When the damping element 132 includes only the elastomer 1321, the elastomer 1321 is disposed on the side of the conductive block 131 away from the circuit board body 11 along the thickness direction of the circuit board body 11. When the pressure jig applies pressure to the elastomer 1321, the pressure is transmitted through the conductive block 131 to the anisotropic conductive adhesive layer 14 corresponding to the device area 111 to activate the anisotropic conductive adhesive.

[0056] In order to match the existing height space of the display device and avoid the pressure member 13 being too large and affecting the assembly, the dimension of the pressure member 13 in the thickness direction of the circuit board body 11 is H1, that is, the sum of the dimensions of the elastic body 1321 and the conductive block 131 in the thickness direction of the circuit board body 11 is H1, and the maximum dimension of the multiple functional devices 12 in the thickness direction of the circuit board body 11 is H2; the two satisfy the relationship: H1≥H2+H4, where H4 is the second safety margin.

[0057] It should be noted that the specific values ​​of the first and second safety margins are determined based on the pressure applied by the pressure fixture. This safety margin must ensure that the pressure applied by the pressure fixture acts only on the pressing member 13 so that the anisotropic conductive adhesive can be effectively activated, while also taking into account the matching installation with the existing height space of the display device, and avoiding the assembly being affected by the excessive size of the pressing member 13 in the thickness direction of the circuit board body 11.

[0058] For example, this application does not limit the material of the elastomer 1321. For example, the material of the elastomer 1321 can be a polymer material such as silicone, polyurethane or rubber. In addition, this application does not limit the material of the conductive block 131. For example, the material of the conductive block 131 can be a metal, such as copper. In this case, the conductive block 131 can be set on the second pad 1112 by welding.

[0059] In another implementation, such as Figure 7 As shown, the pressing member 13 includes a conductive block 131 and a rigid body 133. The conductive block 131 is disposed on the second pad 1112, and the rigid body 133 is disposed on the side of the conductive block 131 facing away from the circuit board body 11 along the thickness direction of the circuit board body 11. When pressure is applied by this pressing fixture, the pressure is transmitted through the rigid body 133 and the conductive block 131 to the anisotropic conductive adhesive layer 14 corresponding to the device area 111, thereby activating the anisotropic conductive adhesive layer 14. Since the dimension of the pressing member 13 in the thickness direction of the circuit board body 11 is larger than the maximum dimension of the functional device 12, the force of this pressing fixture only acts on the pressing member 13, and the functional device 12 is not subjected to this force, thus being effectively protected.

[0060] The rigid body 133 can be made of a metal or a rigid engineering plastic or other material with high rigidity, and this application does not impose any restrictions on this. When the rigid body 133 is made of a metal, it can be made of the same material as the conductive block 131, in which case the pressing member 13 can be integrally formed.

[0061] To ensure proper installation within the existing height space of the display device and avoid excessively large dimensions of the pressure member 13 that could affect assembly, the dimension of the pressure member 13 in the thickness direction of the circuit board body 11 is H1, which is the sum of the dimensions of the rigid body 133 and the conductive block 131 in this direction. The maximum dimension of the multiple functional devices 12 in the thickness direction of the circuit board body 11 is H2. The two satisfy the relationship: H1≥H2+H5, where H5 is the third safety margin. By limiting the dimensions as described above, it is ensured that the pressure applied by the pressure fixture acts only on the pressure member 13, effectively activating the anisotropic conductive adhesive layer 14 corresponding to the device area 111, while also achieving proper installation within the existing height space of the display device.

[0062] It should be noted that since the elastic deformation of the rigid body 133 is negligible, the third safety margin only needs to ensure that the dimension of the pressing part 13 in the thickness direction of the circuit board body 11 is slightly larger than the maximum dimension of the functional device 12 in the thickness direction of the circuit board body 11. There is no need to reserve additional deformation space. Therefore, the safety margin can be set to be slightly greater than zero to meet the assembly and conductive adhesive activation requirements.

[0063] See next Figure 1 and 2 The flexible circuit board 1 also includes a first conductive adhesive layer and a first metal layer 15, both located in the device region 111. The first conductive adhesive layer and the first metal layer 15 are stacked sequentially on the side of the device region 111 away from the functional device 12 along the thickness direction of the circuit board body 11. A second conductive adhesive layer 3 is disposed between the second metal layer 5 and the first metal layer 15. This arrangement increases the electrostatic discharge path of the flexible circuit board 1, improving its electrostatic protection performance and preventing electrostatic damage to the functional device 12.

[0064] For example, this application does not limit the materials of the first metal layer 15 and the first conductive adhesive layer, as long as they can increase the electrostatic grounding path of the flexible circuit board 1. For example, the first metal layer 15 can be stainless steel; the first conductive adhesive layer can be an isotropic conductive adhesive layer or an anisotropic conductive adhesive layer.

[0065] In addition, this application also provides a display device, which includes the display module of any of the above embodiments.

[0066] Those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, any of the claimed embodiments in the claims of this application can be used in any combination.

[0067] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A flexible circuit board, characterized in that, The flexible circuit board includes: The circuit board body (11) includes a device area (111) and a non-device area (112) surrounding the device area (111); the device area (111) is provided with a plurality of first pads (1111) and at least one second pad (1112) on one side along the thickness direction of the circuit board body (11). Multiple functional devices (12) corresponding one-to-one with the first pad (1111), the functional devices (12) being disposed on the corresponding first pad (1111); At least one pressure member (13) corresponding to the second pad (1112) is disposed on the corresponding second pad (1112) and its dimension in the thickness direction of the circuit board body (11) is greater than the maximum dimension of all the functional devices (12) in the thickness direction of the circuit board body (11).

2. The flexible circuit board according to claim 1, characterized in that, The pressing element (13) includes: A conductive block (131) is disposed on the second pad (1112); A damping element (132) is disposed on the side of the conductive block (131) away from the circuit board body (11) along the thickness direction of the circuit board body (11).

3. The flexible circuit board according to claim 2, characterized in that, The damping element (132) includes an elastic body (1321) and a spring element; and The elastic body (1321) is disposed on the side of the conductive block (131) away from the circuit board body (11) along the thickness direction of the circuit board body (11). The elastic body (1321) has an internal cavity, or the elastic body (1321) and the conductive block (131) together form a cavity. At least a portion of the spring is disposed in the cavity, and the deformation direction of the spring is consistent with the thickness direction of the circuit board body (11). The spring is disposed on the side of the conductive block (131) away from the circuit board body (11) along the thickness direction of the circuit board body (11), and the spring and the conductive block (131) are at least partially embedded in the elastic body (1321) as a whole.

4. The flexible circuit board according to claim 3, characterized in that, The pressing member (13) has a dimension of H1 in the thickness direction of the circuit board body (11), and the maximum dimension of the plurality of functional devices (12) in the thickness direction of the circuit board body (11) is H2, where H1≥H2+x+H3; Where H3 is the first safety margin, and x is the deformation of the spring component.

5. The flexible circuit board according to claim 2, characterized in that, The damping element (132) is an elastomer (1321).

6. The flexible circuit board according to claim 5, characterized in that, The pressing member (13) has a dimension of H1 in the thickness direction of the circuit board body (11), and the maximum dimension of the plurality of functional devices (12) in the thickness direction of the circuit board body (11) is H2, where H1≥H2+H4; H4 is the second safety margin.

7. The flexible circuit board according to claim 1, characterized in that, The pressing element (13) includes: A conductive block (131) is disposed on the second pad (1112); A rigid body (133) is disposed on the side of the conductive block (131) away from the circuit board body (11) along the thickness direction of the circuit board body (11).

8. The flexible circuit board according to claim 7, characterized in that, The pressing member (13) has a dimension of H1 in the thickness direction of the circuit board body (11), and the maximum dimension of the plurality of functional devices (12) in the thickness direction of the circuit board body (11) is H2, where H1≥H2+H5; H5 represents the third safety margin.

9. The flexible circuit board according to claim 1, characterized in that, The number of the pressing members (13) is at least four, and the at least four pressing members (13) are symmetrically distributed relative to the device area (111).

10. The flexible circuit board according to claim 9, characterized in that, At least a portion of the at least four pressing members (13) are spaced apart along the periphery of the device region (111).

11. The flexible circuit board according to claim 1, characterized in that, The flexible circuit board (1) also includes: A first conductive adhesive layer is disposed on the side of the device area (111) away from the functional device (12) along the thickness direction of the circuit board body (11); A first metal layer (15) is disposed on the side of the first conductive adhesive layer away from the circuit board body (11).

12. The flexible circuit board according to claim 11, characterized in that, The first conductive adhesive layer is an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer.

13. A display module, characterized in that, The display module includes: The flexible circuit board (1) according to any one of claims 1-12; The second conductive adhesive layer (3) is disposed on the side of the circuit board body (11) away from the functional device (12) along its thickness direction; the second conductive adhesive layer (3) is an anisotropic conductive adhesive layer (14). The display panel (2) is connected to the flexible circuit board (1) via the second conductive adhesive layer (3) on the backlight side of the display panel (2).

14. The display module according to claim 13, characterized in that, The display module also includes: Foam layer (4), the foam layer (4) is disposed on the backlight side of the display panel (2); The second metal layer (5) is disposed between the foam layer (4) and the second conductive adhesive layer (3).

15. A display device, characterized in that, The display device includes the display module as described in claim 13 or 14.

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