A kind of high-density line board production processing groove cutting device and processing method

Abstract

This invention relates to the field of circuit board manufacturing and processing technology, and discloses a grooving device and processing method for high-density circuit board manufacturing and processing. The device includes: a processing base with a rectangular structure and a ventilation opening on the base; a lifting assembly fixedly connected to the top of the ventilation opening; a reinforcing bracket fixedly connected to the movable end of the lifting assembly; and a cooling device installed inside the ventilation opening; a limiting plate fixedly connected to the outer side of the reinforcing bracket via a bolt and nut assembly; and an electric slide rail fixedly connected to the outer side of the limiting plate via a bracket. This grooving device and processing method for high-density circuit board manufacturing and processing can promptly absorb the gasification products such as smoke and dust generated during laser grooving, preventing smoke and dust from affecting laser transmittance and ensuring the accuracy and stability of laser grooving.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing and processing technology, specifically to a grooving device and processing method for high-density circuit board manufacturing and processing. Background Technology

[0002] With the rapid development of the electronics and information industry towards higher integration and multi-functionality, printed circuit boards (PCBs), as the core carrier components of electronic products, are evolving towards high-density interconnection, thinning, miniaturization, and rigid-flex bonding. Against this backdrop, panelization technology has become a key means to improve surface mount efficiency and reduce manufacturing costs. This involves combining multiple unit PCBs into a large-area panel for unified production and mounting. After all processes are completed, the unit PCBs are then separated. The grooving process is a crucial pre-processing step for achieving efficient and reliable separation after panelization. The quality of grooving directly affects the edge flatness, structural integrity, and reliability of precision components after separation, and has become a key technical challenge in high-density circuit board manufacturing.

[0003] Chinese patent CN118989624B discloses a laser grooving process for circuit board processing. The process involves transporting the circuit board to be grooved to the grooving area via a loading module on a worktable, and then fixing the circuit board with a moving adsorption unit. A waste edge clamping mechanism is driven to work in the clamping area, clamping the circuit board to the sub-area to be grooved. A laser grooving system drives a laser drill bit to move to the sub-area to be grooved for grooving, until multiple sub-areas are grooved. After grooving, the moving adsorption unit pushes the grooved circuit board up to the unloading module, while the waste edge is detached from the circuit board by the waste edge clamping mechanism. This laser grooving process can both groove the circuit board and quickly and safely detach the waste edge formed by the grooving, achieving fast and safe laser cutting of irregularly shaped boards. When this device uses laser to cut grooves in circuit boards, it cannot handle the gasification products such as fumes generated by laser cutting. Laser processing of circuit boards produces a large amount of fine dust and irritating gases, which leads to a decrease in laser transmittance, causes beam scattering and focus drift, resulting in inconsistent groove width, uneven residue at the bottom of the groove, or incomplete cutting. Long-term accumulation may contaminate the optical lens, affect the stability of laser power, and adhere to the adsorption plate or sliding guide rail, affecting the motion accuracy and posing a risk to the health of operators. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention provides: a grooving device and processing method for high-density circuit board production and processing, comprising: a grooving device for high-density circuit board production and processing, comprising: A processing base having a rectangular structure and a ventilation opening on the processing base, a lifting assembly fixedly connected to the top of the ventilation opening, a reinforcing bracket fixedly connected to the movable end of the lifting assembly, and a cooling device installed inside the ventilation opening; A limiting plate is fixedly connected to the outside of a reinforcing bracket via a bolt and nut assembly. An electric slide rail is fixedly connected to the outside of the limiting plate via a bracket. A moving block is slidably connected inside the electric slide rail via an electric slider. A smoke removal device is installed on the outside of the moving block. A laser cutting assembly is fixedly connected to the bottom of the moving block at the center position. A heat-conducting plate having a rectangular plate structure and vent holes formed on the heat-conducting plate, and a vacuum suction cup assembly fixedly connected to the top of the heat-conducting plate; The smoke removal device includes: A ring plate having a ring-shaped structure and a positioning frame disposed on the ring plate, wherein multiple sets of positioning frames are provided; The gas supply pipe has an annular tubular structure and an elastic flexible tube disposed on the outside of the gas supply pipe. The end of the elastic flexible tube away from the gas supply pipe is connected to a processing cylinder, and the end of the processing cylinder away from the elastic flexible tube is connected to a suction pump. A filter screen is installed on the inner wall of the processing cylinder. The filter screen filters the incoming smoke and dust. The filtered gas is discharged through the suction pump. The absorbed smoke can be filtered to separate particulate impurities in the gas and process them centrally. The gas collecting frame has an arc-shaped structure and a limiting sleeve disposed on one side of the gas collecting frame. The end of the limiting sleeve away from the gas collecting frame is connected to a corrugated pipe, and the end of the corrugated pipe away from the limiting sleeve is connected to a suction pipe. This allows for timely absorption of gasification products such as smoke and dust generated during laser grooving, preventing smoke and dust from affecting laser transmittance and ensuring the accuracy and stability of laser grooving. The gas collecting frame is arranged in a ring around the laser cutting assembly, forming a circumferential and symmetrical negative pressure field, which can absorb smoke from different directions simultaneously. Furthermore, the gas collecting frame is close to the grooving position, allowing the smoke generated during cutting to be absorbed quickly, resulting in good smoke removal effect. An adjustment device is fixedly connected to the outside of the limiting sleeve via a bracket.

[0005] Preferably, the adjusting device includes: A fixed sleeve having a circular cylindrical structure and a first take-up roller disposed inside the fixed sleeve, both ends of the first take-up roller being rotatably connected to the bottom of an annular plate via a rotating bracket; The second take-up roller has a circular cylindrical structure and a rotary motor disposed at one end of the second take-up roller, the output end of the rotary motor being fixedly connected to one end of the second take-up roller; The traction belt has two ends fixedly connected to the outer walls of the first and second take-up rollers via clamping plates. Two sets of traction belts are provided. The rotary motor at the top of the limiting sleeve drives the second take-up roller to continuously wind the traction belt, which pulls the limiting sleeve and deforms the corrugated pipe. The limiting sleeve can then drive the air collection frame to change the suction angle. The angle of the air collection frame can be adjusted. When there is cross airflow in the workshop, adjusting the angle of the air collection frame can optimize the local flow field and restore the best dust capture efficiency.

[0006] Preferably, multiple sets of vent holes are provided, and the multiple sets of vent holes are evenly distributed on the heat-conducting plate. The top of the vent is provided with air holes corresponding to the vent holes, and the bottom of the heat-conducting plate is fixedly connected to the top of the processing base.

[0007] Preferably, the top of the positioning frame is fixedly connected to the outer wall of the moving block, the outer side of the air supply pipe is fixedly connected to the outer wall of the annular plate through a bracket, one end of the elastic hose is connected to the air supply pipe, a material inlet is provided on the outer side of the processing cylinder, and the outer side of the suction pump is fixedly connected to the outer wall of the processing cylinder through a bracket.

[0008] Preferably, the limiting sleeve is connected to the gas collecting frame, the end of the suction pipe away from the corrugated pipe is connected to the bottom of the gas supply pipe, multiple sets of the gas collecting frame are provided, and the bottom of the processing cylinder is fixedly connected to the top of the reinforcing bracket through a bracket.

[0009] Preferably, the outer side of the fixed sleeve is fixedly connected to the outer side of the limiting sleeve via a bracket, and the outer side of the first take-up roller is rotatably connected to the inner wall of the fixed sleeve via a bearing.

[0010] Preferably, the adjusting device is provided in two sets, which are symmetrically distributed at the top and bottom of the limiting sleeve. The rotary motor at the top of the limiting sleeve is fixedly connected to the bottom of the annular plate through a bracket, and the rotary motor at the bottom of the limiting sleeve is fixedly connected to the bottom of the gas supply pipe through a bracket. The end of the second winding roller at the top of the limiting sleeve is rotatably connected to the bottom of the annular plate through a rotating bracket, and the end of the second winding roller at the bottom of the limiting sleeve is rotatably connected to the bottom of the gas supply pipe through a rotating bracket.

[0011] Preferably, the cooling device includes a circulation pipe with heat-conducting fins connected through and fixed to the top of the circulation pipe. One end of the circulation pipe is connected to a water inlet pipe, and the end of the circulation pipe away from the water inlet pipe is connected to a liquid pump. The liquid pump draws external coolant into the circulation pipe through the water inlet pipe. The coolant entering the circulation pipe exchanges heat with the heat-conducting plate through the heat-conducting fins, thus removing the heat transferred to the surface of the processing base during processing in a timely manner, which can effectively prevent high temperature damage to the worktable during the grooving process.

[0012] Preferably, the top of the heat-conducting fins penetrates the processing base and is fixedly connected to the bottom of the heat-conducting plate. Multiple sets of heat-conducting fins are provided. The outer side of the liquid pump is fixedly connected to the inner wall of the vent through a bracket. The outer side of the circulation pipe is fixedly connected to the inner wall of the vent through a bracket.

[0013] A method for processing a grooving device used in the production and processing of high-density circuit boards includes the following steps: S1. The operator places the circuit board to be processed on the heat-conducting plate, and then uses a vacuum suction cup assembly to fix the circuit board on the heat-conducting plate. S2. Activate the lifting component to adjust the reinforcement bracket to a suitable height. The reinforcement bracket moves the electric slide rail through the limit plate. Activate the electric slide rail and move the moving block through the electric slider inside the electric slide rail. The moving block can then move the laser cutting component to the designated position. Then, activate the laser cutting component to cut grooves on the circuit board. S3. When cutting grooves, turn on the suction pump. The suction pump will discharge the gas in the processing cylinder and draw the smoke and dust generated during the cutting process from the gas collection frame into the corrugated pipe. The smoke and dust entering the corrugated pipe will enter the processing cylinder through the suction pipe, the gas delivery pipe, and the flexible hose in sequence. S4. The filter screen filters the incoming smoke and dust, and the filtered gas is discharged through the suction pump. S5. Turn on the two sets of rotary motors at the top and bottom of the limiting sleeve. The rotary motor at the top of the limiting sleeve drives the second winding roller to wind one end of the traction belt. The rotary motor at the bottom of the limiting sleeve drives the second winding roller to release one end of the traction belt in the opposite direction, pulling the limiting sleeve and stretching the corrugated pipe to deform it. The limiting sleeve can then drive the air collecting frame to change the air intake angle. S6. The liquid pump draws external coolant into the circulation pipe through the inlet pipe. The coolant in the circulation pipe exchanges heat with the heat-conducting plate through the heat-conducting fins.

[0014] This invention provides a grooving device and processing method for high-density circuit board manufacturing. It has the following beneficial effects: 1. The grooving device and processing method for high-density circuit board production and processing, through the installation of a smoke removal device, timely absorbs the gasification products such as smoke and dust generated by laser grooving, avoiding the impact of smoke and dust on laser transmittance, and ensuring the accuracy and stability of laser grooving. The gas collection frame is arranged in a ring around the laser cutting component to form a full-circumferential and symmetrical negative pressure field, which can absorb the smoke from different directions at the same time. Moreover, the gas collection frame is close to the grooving position, so that the smoke generated by cutting can be absorbed quickly, resulting in good smoke removal effect.

[0015] 2. The grooving device and processing method for high-density circuit board production and processing, through the installation of the adjustment device, the rotating motor at the top of the limiting sleeve drives the second winding roller to continuously wind the traction belt, which can pull the limiting sleeve and stretch the corrugated pipe to deform it. The limiting sleeve can then drive the air collecting frame to change the air intake angle. The angle of the air collecting frame can be adjusted. When there is cross airflow in the workshop, adjusting the angle of the air collecting frame can optimize the local flow field and restore the best dust capture efficiency.

[0016] 3. The grooving device and processing method for high-density circuit board production and processing, through the installation of a processing cylinder and a filter screen, the filter screen filters the incoming smoke and dust, and the filtered gas is discharged through a suction pump, which can filter the absorbed smoke and screen out particulate impurities in the gas and process them centrally.

[0017] 4. The grooving device and processing method for high-density circuit board production and processing, through the installation of a cooling device, the liquid pump draws external coolant into the circulation pipe through the water inlet pipe. The coolant in the circulation pipe exchanges heat with the heat-conducting plate through the heat-conducting fins, and the heat transferred to the surface of the processing base during processing is carried away in time, which can effectively avoid high temperature damage to the worktable during the grooving process. Attached Figure Description

[0018] Figure 1 This is a flowchart of the grooving device for high-density circuit board production and processing according to the present invention; Figure 2 This is a schematic diagram of the structure of the processing base of the present invention; Figure 3 This is a schematic diagram of the structure of the reinforcement bracket of the present invention; Figure 4 This is a schematic diagram of the structure of the processing cylinder of the present invention; Figure 5 This is a schematic diagram of the gas pipeline structure of the present invention; Figure 6 This is a schematic diagram of the structure of the suction tube of the present invention; Figure 7 This is a schematic diagram of the gas collection frame of the present invention; Figure 8 This is a schematic diagram of the structure of the fixing sleeve of the present invention; Figure 9 This is a schematic diagram of the structure of the tension belt of the present invention; Figure 10 This is a schematic diagram of the internal structure of the ventilation opening of the present invention.

[0019] In the diagram: 1. Processing base; 2. Ventilation opening; 3. Lifting assembly; 4. Reinforcing bracket; 5. Limiting plate; 6. Electric slide rail; 7. Moving block; 8. Smoke removal device; 81. Annular plate; 82. Positioning frame; 83. Gas supply pipe; 84. Flexible hose; 85. Processing cylinder; 86. Suction pump; 87. Gas collection frame; 88. Limiting sleeve; 89. Adjusting device; 891. Fixed sleeve; 892. First winding roller; 893. Second winding roller; 894. Rotary motor; 895. Pull belt; 810. Corrugated pipe; 811. Suction pipe; 9. Cooling device; 91. Circulation pipe; 92. Heat-conducting fins; 93. Water inlet pipe; 94. Liquid pump; 10. Heat-conducting plate; 11. Vent hole; 12. Vacuum suction cup assembly; 13. Laser cutting assembly. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose. Example

[0021] Please see Figures 1-9 This invention provides a technical solution: a grooving device for high-density circuit board production and processing, comprising: The processing base 1 has a rectangular structure and a ventilation opening 2 opened on the processing base 1. A lifting assembly 3 is fixedly connected to the top of the ventilation opening 2, and a reinforcing bracket 4 is fixedly connected to the movable end of the lifting assembly 3. A cooling device 9 is installed inside the ventilation opening 2. Limiting plate 5 is fixedly connected to the outside of the reinforcing bracket 4 by bolt and nut assembly. An electric slide rail 6 is fixedly connected to the outside of the limiting plate 5 by the bracket. A moving block 7 is slidably connected inside the electric slide rail 6 by an electric slider. A smoke removal device 8 is installed on the outside of the moving block 7. A laser cutting assembly 13 is fixedly connected to the bottom of the moving block 7 at the center position. The heat-conducting plate 10 has a rectangular plate structure and vent holes 11 opened on the heat-conducting plate 10. A vacuum suction cup assembly 12 is fixedly connected to the top of the heat-conducting plate 10. The smoke removal device 8 includes: An annular plate 81 has an annular plate structure and a positioning frame 82 disposed on the annular plate 81, wherein multiple sets of positioning frames 82 are provided. The gas supply pipe 83 has an annular tubular structure and an elastic hose 84 disposed on the outside of the gas supply pipe 83. The end of the elastic hose 84 away from the gas supply pipe 83 is connected to a processing cylinder 85, and the end of the processing cylinder 85 away from the elastic hose 84 is connected to an air suction pump 86. A filter screen is installed on the inner wall of the processing cylinder 85. The air collecting frame 87 has an arc-shaped structure and a limiting sleeve 88 disposed on one side of the air collecting frame 87. The end of the limiting sleeve 88 away from the air collecting frame 87 is connected to a corrugated pipe 810, and the end of the corrugated pipe 810 away from the limiting sleeve 88 is connected to an air intake pipe 811. An adjustment device 89 is fixedly connected to the outside of the limiting sleeve 88 by a bracket.

[0022] The regulating device 89 includes: The fixed sleeve 891 has a circular cylindrical structure and a first take-up roller 892 disposed inside the fixed sleeve 891. Both ends of the first take-up roller 892 are rotatably connected to the bottom of the annular plate 81 through a rotating bracket. The second take-up roller 893 has a circular cylindrical structure and a rotary motor 894 disposed at one end of the second take-up roller 893. The output end of the rotary motor 894 is fixedly connected to one end of the second take-up roller 893. The pull belt 895 has two ends that are fixedly connected to the outer walls of the first take-up roller 892 and the second take-up roller 893 respectively via clamping plates. Two sets of pull belts 895 are provided.

[0023] Multiple sets of vent holes 11 are provided, and the multiple sets of vent holes 11 are evenly distributed on the heat-conducting plate 10. The top of the vent 2 is provided with air holes corresponding to the vent holes 11. The bottom of the heat-conducting plate 10 is fixedly connected to the top of the processing base 1.

[0024] The top of the positioning frame 82 is fixedly connected to the outer wall of the moving block 7. The outer side of the air supply pipe 83 is fixedly connected to the outer wall of the annular plate 81 through a bracket. One end of the elastic hose 84 is connected to the air supply pipe 83. A material inlet is opened on the outer side of the processing cylinder 85. The outer side of the suction pump 86 is fixedly connected to the outer wall of the processing cylinder 85 through a bracket.

[0025] The limiting sleeve 88 is connected to the gas collecting frame 87, and the end of the suction pipe 811 away from the corrugated pipe 810 is connected to the bottom of the gas supply pipe 83. The gas collecting frame 87 is provided with multiple sets, and the bottom of the processing cylinder 85 is fixedly connected to the top of the reinforcing bracket 4 through the bracket.

[0026] The outer side of the fixed sleeve 891 is fixedly connected to the outer side of the limiting sleeve 88 through a bracket, and the outer side of the first take-up roller 892 is rotatably connected to the inner wall of the fixed sleeve 891 through a bearing.

[0027] Two sets of adjustment devices 89 are provided, and the two sets of adjustment devices 89 are symmetrically distributed at the top and bottom of the limiting sleeve 88. The rotary motor 894 at the top of the limiting sleeve 88 is fixedly connected to the bottom of the annular plate 81 through a bracket. The rotary motor 894 at the bottom of the limiting sleeve 88 is fixedly connected to the bottom of the air supply pipe 83 through a bracket. The end of the second winding roller 893 at the top of the limiting sleeve 88 is rotatably connected to the bottom of the annular plate 81 through a rotating bracket. The end of the second winding roller 893 at the bottom of the limiting sleeve 88 is rotatably connected to the bottom of the air supply pipe 83 through a rotating bracket.

[0028] In use, the operator places the circuit board to be processed on the heat-conducting plate 10, and then uses the vacuum suction cup assembly 12 to fix the circuit board on the heat-conducting plate 10. After fixing the circuit board, the lifting assembly 3 is activated to adjust the reinforcing bracket 4 to a suitable height. The reinforcing bracket 4 moves the electric slide rail 6 through the limit plate 5. The electric slide rail 6 is activated, and the electric slider inside the electric slide rail 6 moves the moving block 7. The moving block 7 can then move the laser cutting assembly 13 to the designated position. Then, the laser cutting assembly 13 is activated to cut grooves in the circuit board. When the laser cutting assembly 13 is cutting grooves, it will generate gaseous products such as smoke and dust. When cutting grooves, the suction pump 86 is activated to discharge the gas in the processing cylinder 85 and remove the smoke and dust generated during cutting. The gas collection frame 87 is drawn into the corrugated pipe 810. The smoke and dust entering the corrugated pipe 810 enter the processing cylinder 85 through the suction pipe 811, the gas delivery pipe 83, and the flexible hose 84. Since a filter screen is installed in the processing cylinder 85, the filter screen filters the incoming smoke and dust. The filtered gas is discharged through the suction pump 86. The gasification products such as smoke and dust generated by laser grooving are absorbed in time to avoid smoke and dust affecting the laser transmittance and ensure the accuracy and stability of laser grooving. The gas collection frame 87 is arranged in a ring around the laser cutting component 13 to form a full-circumferential and symmetrical negative pressure field, which can absorb smoke from different directions at the same time. Moreover, the gas collection frame 87 is close to the grooving position, so that the smoke generated by cutting can be absorbed quickly, resulting in good smoke removal effect.

[0029] Simultaneously, the two sets of rotary motors 894 at the top and bottom of the limiting sleeve 88 are activated. The rotary motor 894 at the top of the limiting sleeve 88 drives the second take-up roller 893 to wind one end of the traction belt 895, while the rotary motor 894 at the bottom of the limiting sleeve 88 drives the second take-up roller 893 to release one end of the traction belt 895 in the opposite direction. By continuously winding the traction belt 895 through the rotary motor 894 at the top of the limiting sleeve 88 and the second take-up roller 893, the limiting sleeve 88 can be pulled and the corrugated pipe 810 can be deformed. The limiting sleeve 88 can then drive the air collecting frame 87 to change the suction angle. The angle of the air collecting frame 87 can be adjusted. When there is cross airflow in the workshop, adjusting the angle of the air collecting frame 87 can optimize the local flow field and restore the best dust capture efficiency. Example

[0030] Please see Figures 1-10 The present invention provides a technical solution: Based on the first embodiment, the cooling device 9 includes a circulation pipe 91, a heat-conducting fin 92 is connected through and fixedly connected to the top of the circulation pipe 91, one end of the circulation pipe 91 is connected to a water inlet pipe 93, and the end of the circulation pipe 91 away from the water inlet pipe 93 is connected to a liquid pump 94.

[0031] The top of the heat-conducting fin 92 passes through the processing base 1 and is fixedly connected to the bottom of the heat-conducting plate 10. Multiple sets of heat-conducting fins 92 are provided. The outer side of the liquid pump 94 is fixedly connected to the inner wall of the vent 2 through a bracket. The outer side of the circulation pipe 91 is fixedly connected to the inner wall of the vent 2 through a bracket.

[0032] When in use, the liquid pump 94 is turned on during grooving. The liquid pump 94 draws external coolant into the circulation pipe 91 through the water inlet pipe 93. The coolant in the circulation pipe 91 exchanges heat with the heat-conducting plate 10 through the heat-conducting fins 92, and takes away the heat transferred to the surface of the processing base 1 during processing in time, which can effectively prevent the high temperature from damaging the worktable during the grooving process. Example

[0033] Please see Figure 1 This invention provides a processing method for a grooving device used in the production and processing of high-density circuit boards, comprising the following steps: S1. The operator places the circuit board to be processed on the heat-conducting plate, and then uses a vacuum suction cup assembly to fix the circuit board on the heat-conducting plate. S2. Activate the lifting component to adjust the reinforcement bracket to a suitable height. The reinforcement bracket moves the electric slide rail through the limit plate. Activate the electric slide rail and move the moving block through the electric slider inside the electric slide rail. The moving block can then move the laser cutting component to the designated position. Then, activate the laser cutting component to cut grooves on the circuit board. S3. When cutting grooves, turn on the suction pump. The suction pump will discharge the gas in the processing cylinder and draw the smoke and dust generated during the cutting process from the gas collection frame into the corrugated pipe. The smoke and dust entering the corrugated pipe will enter the processing cylinder through the suction pipe, the gas delivery pipe, and the flexible hose in sequence. S4. The filter screen filters the incoming smoke and dust, and the filtered gas is discharged through the suction pump. S5. Turn on the two sets of rotary motors at the top and bottom of the limiting sleeve. The rotary motor at the top of the limiting sleeve drives the second winding roller to wind one end of the traction belt. The rotary motor at the bottom of the limiting sleeve drives the second winding roller to release one end of the traction belt in the opposite direction, pulling the limiting sleeve and stretching the corrugated pipe to deform it. The limiting sleeve can then drive the air collecting frame to change the air intake angle. S6. The liquid pump draws external coolant into the circulation pipe through the inlet pipe. The coolant in the circulation pipe exchanges heat with the heat-conducting plate through the heat-conducting fins.

[0034] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A slot cutting device for high density interconnection board production and processing, characterized by, include: The processing base (1) has a rectangular structure and a ventilation opening (2) opened on the processing base (1). A lifting assembly (3) is fixedly connected to the top of the ventilation opening (2). A reinforcing bracket (4) is fixedly connected to the movable end of the lifting assembly (3). A cooling device (9) is installed inside the ventilation opening (2). A limiting plate (5) is fixedly connected to the outside of a reinforcing bracket (4) via a bolt and nut assembly. An electric slide rail (6) is fixedly connected to the outside of the limiting plate (5) via a bracket. A moving block (7) is slidably connected inside the electric slide rail (6) via an electric slider. A smoke removal device (8) is installed on the outside of the moving block (7). A laser cutting assembly (13) is fixedly connected to the bottom of the moving block (7) at the center position. A heat-conducting plate (10) has a rectangular plate structure and vent holes (11) opened on the heat-conducting plate (10). A vacuum suction cup assembly (12) is fixedly connected to the top of the heat-conducting plate (10). The smoke removal device (8) includes: An annular plate (81) having an annular plate-shaped structure, and a positioning frame (82) disposed on the annular plate (81), wherein multiple sets of positioning frames (82) are provided; The gas supply pipe (83) has an annular tubular structure and an elastic hose (84) disposed outside the gas supply pipe (83). One end of the elastic hose (84) away from the gas supply pipe (83) is connected to a processing cylinder (85). One end of the processing cylinder (85) away from the elastic hose (84) is connected to an air pump (86). A filter screen is installed on the inner wall of the processing cylinder (85). The gas collecting frame (87) has an arc-shaped structure and a limiting sleeve (88) disposed on one side of the gas collecting frame (87). The end of the limiting sleeve (88) away from the gas collecting frame (87) is connected to a corrugated pipe (810), and the end of the corrugated pipe (810) away from the limiting sleeve (88) is connected to an air intake pipe (811). An adjustment device (89) is fixedly connected to the outside of the limiting sleeve (88) by a bracket.

2. The grooving device for high-density circuit board production and processing according to claim 1, characterized in that: The regulating device (89) includes: A fixed sleeve (891) has a circular cylindrical structure and a first take-up roller (892) disposed inside the fixed sleeve (891). Both ends of the first take-up roller (892) are rotatably connected to the bottom of the annular plate (81) through a rotating bracket. The second take-up roller (893) has a circular cylindrical structure and a rotary motor (894) disposed at one end of the second take-up roller (893). The output end of the rotary motor (894) is fixedly connected to one end of the second take-up roller (893). The pull belt (895) has two ends that are fixedly connected to the outer walls of the first take-up roller (892) and the second take-up roller (893) respectively by means of clamps. The pull belt (895) is provided in two sets.

3. The grooving device for high-density circuit board production and processing according to claim 1, characterized in that: The ventilation holes (11) are provided in multiple sets, and the multiple sets of ventilation holes (11) are evenly distributed on the heat-conducting plate (10). The top of the vent (2) is provided with air holes corresponding to the ventilation holes (11), and the bottom of the heat-conducting plate (10) is fixedly connected to the top of the processing base (1).

4. The grooving device for high-density circuit board production and processing according to claim 1, characterized in that: The top of the positioning frame (82) is fixedly connected to the outer wall of the moving block (7), the outer side of the air supply pipe (83) is fixedly connected to the outer wall of the annular plate (81) through a bracket, one end of the elastic hose (84) is connected to the air supply pipe (83), the outer side of the processing cylinder (85) is provided with a material intake port, and the outer side of the suction pump (86) is fixedly connected to the outer wall of the processing cylinder (85) through a bracket.

5. The grooving device for high-density circuit board production and processing according to claim 1, characterized in that: The limiting sleeve (88) is connected to the gas collection frame (87), and the end of the suction pipe (811) away from the corrugated pipe (810) is connected to the bottom of the gas delivery pipe (83). The gas collection frame (87) is provided with multiple sets, and the bottom of the processing cylinder (85) is fixedly connected to the top of the reinforcing bracket (4) through the bracket.

6. The grooving device for high-density circuit board production and processing according to claim 2, characterized in that: The outer side of the fixed sleeve (891) is fixedly connected to the outer side of the limiting sleeve (88) through a bracket, and the outer side of the first take-up roller (892) is rotatably connected to the inner wall of the fixed sleeve (891) through a bearing.

7. The grooving device for high-density circuit board production and processing according to claim 2, characterized in that: The adjustment device (89) is provided in two sets, and the two sets of adjustment devices (89) are symmetrically distributed on the top and bottom of the limiting sleeve (88). The rotary motor (894) at the top of the limiting sleeve (88) is fixedly connected to the bottom of the annular plate (81) through a bracket. The rotary motor (894) at the bottom of the limiting sleeve (88) is fixedly connected to the bottom of the gas supply pipe (83) through a bracket. The end of the second winding roller (893) at the top of the limiting sleeve (88) is rotatably connected to the bottom of the annular plate (81) through a rotating bracket. The end of the second winding roller (893) at the bottom of the limiting sleeve (88) is rotatably connected to the bottom of the gas supply pipe (83) through a rotating bracket.

8. The grooving device for high-density circuit board production and processing according to claim 1, characterized in that: The cooling device (9) includes a circulation pipe (91), a heat-conducting fin (92) is connected through and fixed to the top of the circulation pipe (91), one end of the circulation pipe (91) is connected to a water inlet pipe (93), and the other end of the circulation pipe (91) away from the water inlet pipe (93) is connected to a liquid pump (94).

9. A grooving device for high-density circuit board production and processing according to claim 8, characterized in that: The top of the heat-conducting fin (92) passes through the processing base (1) and is fixedly connected to the bottom of the heat-conducting plate (10). The heat-conducting fin (92) is provided in multiple sets. The outer side of the liquid pump (94) is fixedly connected to the inner wall of the vent (2) through a bracket. The outer side of the circulation pipe (91) is fixedly connected to the inner wall of the vent (2) through a bracket.

10. A processing method for a grooving device used in the production and processing of high-density circuit boards, characterized in that, Includes the following steps: S1. The operator places the circuit board to be processed on the heat-conducting plate, and then uses a vacuum suction cup assembly to fix the circuit board on the heat-conducting plate. S2. Activate the lifting component to adjust the reinforcement bracket to a suitable height. The reinforcement bracket moves the electric slide rail through the limit plate. Activate the electric slide rail and move the moving block through the electric slider inside the electric slide rail. The moving block can then move the laser cutting component to the designated position. Then, activate the laser cutting component to cut grooves on the circuit board. S3. When cutting grooves, turn on the suction pump. The suction pump will discharge the gas in the processing cylinder and draw the smoke and dust generated during the cutting process from the gas collection frame into the corrugated pipe. The smoke and dust entering the corrugated pipe will enter the processing cylinder through the suction pipe, the gas delivery pipe, and the flexible hose in sequence. S4. The filter screen filters the incoming smoke and dust, and the filtered gas is discharged through the suction pump. S5. Turn on the two sets of rotary motors at the top and bottom of the limiting sleeve. The rotary motor at the top of the limiting sleeve drives the second winding roller to wind one end of the traction belt. The rotary motor at the bottom of the limiting sleeve drives the second winding roller to release one end of the traction belt in the opposite direction, pulling the limiting sleeve and stretching the corrugated pipe to deform it. The limiting sleeve can then drive the air collecting frame to change the air intake angle. S6. The liquid pump draws external coolant into the circulation pipe through the inlet pipe. The coolant in the circulation pipe exchanges heat with the heat-conducting plate through the heat-conducting fins.

Images