A closed loop control system for a high precision circuit board etching process

Abstract

This invention relates to the field of circuit board control technology, specifically to a closed-loop control system for a high-precision circuit board etching process. In this invention, a region mapping module generates an etching region set, an execution region set, and region registration information through a control coordinate system. A load feature construction module constructs etching load state features including region etching demand components, region etching capability components, and execution action response components. A deviation prediction module generates region etching deviation prediction results. A linkage compensation control module establishes a control allocation relationship between the etching region set and the execution region set and generates linkage compensation control commands. After adjusting the etching execution parameters, the execution feedback module updates the region etching capability components and execution action response components based on the etching response information. This helps improve the specificity of deviation identification for different etching regions and the matching of execution region adjustment, and improves the continuity of subsequent linkage compensation control.

Description

Technical Field

[0001] This invention relates to the field of circuit board control technology, specifically a closed-loop control system for a high-precision circuit board etching process. Background Technology

[0002] The circuit board etching process is a regionalized material removal process under continuous conveying conditions. As the circuit board moves along the conveying path, different locations on the board surface are sequentially sprayed by multiple actuators. Due to differences in the circuit pattern distribution, copper layer load, and the spatial coverage of the actuators, the etching requirements, actual etching capabilities, and actuator responses of different etching areas within the same control cycle are not consistent. Furthermore, the effect of the actuators on the board surface is not solely determined by their installation position, but also by the entry time, central action time, exit time, effective action time position, and response delay time of the etching area passing through the actuator area. Therefore, the same etching area will be continuously affected by multiple actuators during the conveying process, and the same actuator may simultaneously affect multiple etching areas within the same time period, thus forming a cross-coupling relationship between different areas and between the actuators.

[0003] Under the aforementioned process conditions, if the regional etching demand component, regional etching capability component, and execution response component cannot be uniformly organized based on the correspondence between the etching region set and the execution region set, the regional etching deviation prediction result will be difficult to accurately characterize the deviation state of a specific etching region, and the subsequent control allocation relationship will also be difficult to accurately match the actual execution region. Furthermore, after the execution of the linkage compensation control command, if the etching response information cannot be continuously written back to the corresponding etching region and the corresponding execution region, the adjustment result in the previous control cycle will be difficult to transform into the basis for updating the regional etching capability component and execution response component in the next control cycle, thus affecting the connection between deviation prediction and compensation control in the continuous control process. Based on this, establishing a prediction, allocation, compensation, and feedback closed-loop mechanism oriented towards region-level objects for the high-precision circuit board etching process becomes a key link in constraining the stability of the etching result. Summary of the Invention

[0004] The purpose of this invention is to provide a closed-loop control system for a high-precision circuit board etching process to solve the problems mentioned in the background art. The specific technical problems include how to accurately generate regional etching deviation prediction results and establish corresponding control allocation relationships in the high-precision circuit board etching process, taking into account the differences in etching requirements of different etching regions within the same control cycle and the cross-action relationship of multiple execution regions on each etching region. This solves the problems of insufficient matching between regional deviation states and the adjustment objects of execution regions, weak targeting of linkage compensation control commands, and difficulty in continuously feeding back the adjustment results to subsequent control cycles.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a closed-loop control system for a high-precision circuit board etching process, comprising a region mapping module, a load feature construction module, a deviation prediction module, a linkage compensation control module, and an execution feedback module, wherein:

[0006] The region mapping module maps the spatial relationship between the circuit board to be etched, the transport path, and the actuator to the control coordinate system, generating an etching region set and an execution region set. Based on the control coordinate system, it obtains basic etching process information and generates region registration information corresponding to the etching region set. The specific process of generating the etching region set includes:

[0007] Based on the board size information and circuit pattern distribution information of the circuit board to be etched, the effective etching range of the circuit board to be etched is determined in the control coordinate system.

[0008] The effective etching range is divided according to the preset area division size, and continuous board segments are formed along the conveying direction of the conveying path. Each board segment is divided into grids along the width direction of the board surface to be etched, so that each grid unit is an etching area.

[0009] Assign a region number to each etched region and record the region boundary coordinates, region center coordinates, time position of entering the etched area, and time position of leaving the etched area in the control coordinate system.

[0010] All etched areas are grouped and stored according to their area numbers to form an etched area set.

[0011] The process of generating the execution region set specifically includes:

[0012] Obtain the installation location information, actuator number, spray coverage area, spray direction, response delay time, spray pressure adjustment range, and spray flow adjustment range of the actuator, and convert the installation location of the actuator to the control coordinate system;

[0013] Based on the position of the action center of each actuator in the control coordinate system and the spray coverage range, determine the effective action space of the actuator to produce an effective etching effect on the circuit board to be etched;

[0014] The execution area is determined based on the arrangement and coverage width of the spray nozzles of the actuator, or based on the effective working space corresponding to the adjustable spray unit;

[0015] Assign an execution area number to each execution area and establish a correspondence between the execution area number and the execution mechanism number. Record the execution area number, execution mechanism number, coordinates of the action center, coordinates of the action boundary, action length, action width, response delay time, spray pressure adjustment range, spray flow adjustment range, minimum pressure adjustment step, minimum flow adjustment step, minimum opening and closing time adjustment step, lower limit of spray pressure, upper limit of spray pressure, lower limit of spray flow, and upper limit of spray flow.

[0016] By combining the transmission speed information, the time range of the execution area is determined, and all execution areas are stored in a set according to the execution area number to form an execution area set.

[0017] The process of obtaining basic information during the etching process specifically includes:

[0018] Acquire initial copper thickness information, target copper thickness information, circuit pattern density information, transmission speed information, etching solution temperature information, etching solution concentration information, spray pressure information, spray flow rate information, current actuator parameter information, and target linewidth information;

[0019] The initial copper thickness information, target copper thickness information, circuit pattern density information, and target line width information are assigned to the corresponding etching regions in the etching region set according to the control coordinate system.

[0020] The transmission speed information is correlated with the real-time position of the circuit board to be etched in the control coordinate system, and the spray pressure information and spray flow information are associated with the corresponding actuator number and execution area number.

[0021] The above information is encapsulated according to the control cycle to form the basic information for the etching process.

[0022] The process of generating region registration information specifically includes:

[0023] For each etched region in the set of etched regions, based on the region boundary coordinates and region center coordinates of the etched region, the initial copper thickness information, target copper thickness information, circuit pattern density information and target line width information corresponding to the etched region are extracted from the basic information of the etching process.

[0024] Based on the transmission speed information and the coordinates of the center of the etched area, the real-time position change of the etched area on the transmission path is determined. Combined with the action boundary coordinates, action center coordinates and response delay time of each execution area in the execution area set, the entry time of the etched area into the execution area, the center action time at the action center position of the execution area, the departure time and effective action time position of the etched area leaving the execution area are determined.

[0025] Based on the correspondence between the boundary coordinates of the etched area and the action boundary coordinates of the execution area, the spatial overlap between the etched area and the execution area is determined, and the action sequence record is generated based on the execution area number, entry time, central action time, exit time and effective action time position passed by the same etched area in sequence.

[0026] The area registration information is formed by combining the area number, initial copper thickness information, target copper thickness information, line pattern density information, target line width information, spatial overlap relationship, action sequence record, and effective action time and location.

[0027] The region mapping module maps the spatial relationship between the circuit board to be etched, the transport path, and the actuator to the control coordinate system, generating a set of etched regions and a set of execution regions. It further acquires basic information about the etching process and generates region registration information corresponding to the set of etched regions. This allows for the unified association of the board surface position, time position, circuit pattern distribution information, target copper thickness information, target line width information, spatial overlap relationship with each execution region, action sequence record, and effective action time position of different etched regions within the same control cycle. This facilitates the implementation of the differences in etching requirements of etched regions and the cross-action relationship between multiple execution regions on each etched region under the same control coordinate system, providing a foundation for the subsequent accurate generation of region etching deviation prediction results and the establishment of corresponding control allocation relationships.

[0028] The load characteristic construction module constructs etching load state characteristics based on region registration information and etching process basic information. These characteristics include region etching demand components, region etching capability components, and execution response components. The specific construction process of the etching load state characteristics includes:

[0029] Based on the initial copper thickness information, target copper thickness information, and circuit pattern density information corresponding to each etched area, the copper layer load is determined and the area etching requirement component is formed.

[0030] Based on the etching solution temperature, etching solution concentration, spray pressure, spray flow rate, conveying speed, and current actuator parameters, a current etching capability evaluation value is generated, and a regional etching capability component is formed by combining the baseline capability evaluation value.

[0031] Based on the spatial overlap relationship, action sequence record, effective action time and location, center coordinates of the etched area, center coordinates of the action of the execution area and response delay time in the area registration information, the response level, response effective time and response sequence of the execution area to the etched area are determined, and the execution action response components are formed.

[0032] The regional etching demand component, regional etching capability component, and execution response component corresponding to the same etching area are combined according to the area number to form the etching load state characteristics.

[0033] The load feature construction module constructs etching load state features based on regional registration information and basic etching process information, forming regional etching demand components, regional etching capacity components, and execution response components. This allows for a unified characterization of the copper layer load in the same etching region, the actual etching capacity under the current process conditions, and the response level, response time, and response sequence of the execution region to that etching region. This enables the differences in demand and execution of different etching regions within the same control cycle to be distinguished and combined in the form of corresponding components, which helps to improve the pertinence of regional state characterization and provides a direct basis for the subsequent generation of regional etching deviation prediction results and the establishment of control allocation relationships.

[0034] The deviation prediction module generates regional etching deviation prediction results based on the regional etching demand component and the regional etching capability component; the specific process of generating the regional etching deviation prediction results includes:

[0035] Read the regional etching demand component and regional etching capability component corresponding to each etching area to obtain the demand level, demand effective time, capability level and capability effective time;

[0036] Convert the competency level and requirement level into comparable level values ​​and calculate the level difference;

[0037] The direction of deviation is determined based on the grade difference, and the grade of deviation is determined based on the absolute value of the grade difference;

[0038] The duration of the deviation is determined based on the time difference between the effective termination time and the effective start time of the etched area. The area number, deviation direction, deviation level, deviation duration, demand level, capability level, and prediction generation time are combined to form the area etching deviation prediction result.

[0039] The deviation prediction module generates regional etching deviation prediction results based on the regional etching demand component and the regional etching capability component. By comparing the demand level and capability level, it determines the deviation direction, deviation level, and deviation duration of each etching region. This transforms the demand-capacity mismatch state of different etching regions in the current control cycle into regional deviation information that can be used for control decision-making. This helps to more specifically distinguish between enhanced compensation objects, weakened compensation objects, and maintained objects, thereby reducing the generality in regional deviation state identification and providing a basis for subsequently establishing control allocation relationships corresponding to the execution regions.

[0040] The linkage compensation control module establishes a control allocation relationship between the etched region set and the execution region set based on the regional etching deviation prediction results and the execution response components. It then generates linkage compensation control commands to adjust the etching execution parameters according to this control allocation relationship. The process of establishing the control allocation relationship specifically includes:

[0041] Based on the deviation direction and deviation level in the regional etching deviation prediction results, the enhanced compensation object, the weakened compensation object, and the retained object are determined, and the corresponding actuator parameters of the retained object are kept unchanged.

[0042] Based on the response components of the execution effect, locate the execution regions that affect the enhanced compensation objects and the weakened compensation objects, and read the execution region number, response level, response delay time, effective action time location, and response order;

[0043] The control allocation weights are determined based on the response level, and the control allocation weights corresponding to the same etched area are normalized.

[0044] The control window is determined based on the response delay time and the effective action time location. For the etched regions corresponding to the same execution region within the same control window, the enhanced merging value and the weakened merging value are calculated to determine the main control direction.

[0045] Adjacent execution regions are determined based on the coordinate relationship of the action boundaries between execution regions, and the control allocation weights between adjacent execution regions are smoothed out.

[0046] The etching area number, execution area number, deviation direction, deviation level, response level, control allocation weight, control effective window, and main control direction are associated and stored to form a control allocation relationship. Based on the control allocation relationship, linkage compensation control instructions are generated.

[0047] The process of generating linkage compensation control commands specifically includes:

[0048] The parameter adjustment direction is determined based on the main control direction in the control allocation relationship, and the etching execution parameters are determined as spray pressure, spray flow rate and actuator opening and closing time.

[0049] Based on the deviation level value, control allocation weight, and preset unit adjustment amount, the adjustment range of spray pressure, spray flow rate, and actuator opening and closing time are determined respectively.

[0050] By combining the spray pressure adjustment range, spray flow adjustment range, minimum pressure adjustment step, minimum flow adjustment step, minimum opening and closing time adjustment step, lower limit of spray pressure, upper limit of spray pressure, lower limit of spray flow, and upper limit of spray flow of the actuator, the parameter adjustment range is limited and quantified.

[0051] The effective time and duration of the instruction are determined based on the control effective window, and the corresponding execution agency number is found based on the execution area number.

[0052] The actuator number, execution area number, parameter adjustment direction, parameter adjustment range, instruction effective time, and instruction hold time are combined to form a linkage compensation control instruction, which is then sorted according to the instruction effective time and deviation level and sent to the execution feedback module.

[0053] The linkage compensation control module establishes a control allocation relationship between the set of etched regions and the set of execution regions based on the regional etching deviation prediction results and the execution response components. It then generates linkage compensation control commands to adjust the etching execution parameters according to the control allocation relationship. By comprehensively considering the deviation direction, deviation level, response level, control allocation weight, control effective window, and main control direction, it assigns the regional deviation state to the execution regions that actually affect the deviation state. Within the same control effective window, it handles the cross-action relationships between multiple execution regions and multiple etched regions, thereby helping to improve the matching degree between the regional deviation state and the execution region adjustment object. This also makes the linkage compensation control commands more targeted in adjusting spray pressure, spray flow rate, and actuator opening and closing time.

[0054] The execution feedback module adjusts the etching execution parameters according to the linkage compensation control command and obtains the etching response information after executing the linkage compensation control command. Based on the control coordinate system, it associates the etching response information with the corresponding etching region in the etching region set to update the region etching capability component and execution response component used for subsequent region etching deviation prediction and linkage compensation control, until the preset etching termination condition is met. The process of updating the region etching capability component and execution response component specifically includes:

[0055] The etching response information after executing the linkage compensation control command is obtained. The etching response information includes copper thickness detection information after etching, board surface image detection information, line width detection information, etching solution temperature feedback information, etching solution concentration feedback information, spray pressure feedback information, spray flow rate feedback information, and conveying speed feedback information.

[0056] Based on the control coordinate system, the etching response information is associated with the corresponding etching region in the etching region set to obtain the actual etching result of each etching region. The actual etching result is then compared with the target copper thickness information and the target linewidth range to determine the actual etching result status. The regional etching capability component of the corresponding etching region is updated according to the actual etching change in the actual etching result.

[0057] Based on the execution area number and linkage compensation control command corresponding to the etched area, determine the actual response effect of the execution area to the etched area, and update the execution action response component of the corresponding execution area;

[0058] The updated regional etching capability component and execution response component are written into the corresponding regional number and execution regional number, and sent to the load feature construction module, deviation prediction module and linkage compensation control module for regional etching deviation prediction and linkage compensation control in the next control cycle.

[0059] The execution feedback module adjusts the etching execution parameters according to the linkage compensation control command and obtains the etching response information after executing the linkage compensation control command. Based on the control coordinate system, it associates the etching response information with the corresponding etching region in the etching region set to update the region etching capability component and execution response component used for subsequent region etching deviation prediction and linkage compensation control. This allows the actual effect of the linkage compensation control command in the current control cycle to be written back to the corresponding etching region and the corresponding execution region. Consequently, the generation of region etching deviation prediction results and the establishment of control allocation relationships in subsequent control cycles can inherit the actual adjustment results of the previous control cycle, which helps to alleviate the problem that the adjustment results are difficult to continuously feed back to subsequent control cycles.

[0060] Compared with the prior art, the beneficial effects of the present invention are:

[0061] By mapping the spatial relationship between the circuit board to be etched, the conveying path, and the actuator to the control coordinate system, an etching region set and an execution region set are generated. Combined with the basic information of the etching process, region registration information is formed. Furthermore, etching load state characteristics, including regional etching demand components, regional etching capability components, and execution action response components, are constructed. This allows for a unified characterization of the differences in etching demand among different etching regions within the same control cycle and the cross-action relationships between multiple execution regions on each etching region. Based on this, regional etching deviation prediction results are generated, and a control allocation relationship is established between the etching region set and the execution region set. This leads to the formation of linkage compensation control commands for adjusting etching execution parameters. After execution, the regional etching capability components and execution action response components are updated based on the etching response information. This helps improve the matching degree between the regional deviation state and the execution region adjustment object, enhances the pertinence of the linkage compensation control commands, and improves the effect of continuous feedback of adjustment results to subsequent control cycles. This has a positive effect on improving the control coordination, etching stability, and consistency of regional etching results in the high-precision circuit board etching process. Attached Figure Description

[0062] Figure 1 This is a schematic diagram of the core process of the overall module of the present invention;

[0063] Figure 2 This is a schematic diagram of the core process of the region mapping module of the present invention;

[0064] Figure 3 This is a schematic diagram of the core process of the load feature construction module of the present invention;

[0065] Figure 4 This is a schematic diagram of the core process of the deviation prediction module of the present invention;

[0066] Figure 5 This is a schematic diagram of the core process of the linkage compensation control module of the present invention;

[0067] Figure 6 This is a schematic diagram of the core process of the execution feedback module of the present invention.

[0068] In the diagram: 100, Region Mapping Module; 200, Load Feature Construction Module; 300, Deviation Prediction Module; 400, Linkage Compensation Control Module; 500, Execution Feedback Module. Detailed Implementation

[0069] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0070] Next, please refer to Figure 1This invention provides a closed-loop control system for a high-precision circuit board etching process, comprising a region mapping module 100, a load feature construction module 200, a deviation prediction module 300, a linkage compensation control module 400, and an execution feedback module 500. The region mapping module 100 maps the spatial relationship between the circuit board to be etched, the conveying path, and the actuator to a control coordinate system, forming an etching region set and an execution region set. Based on the control coordinate system, it acquires basic etching process information and generates region registration information corresponding to the etching region set. The load feature construction module 200 constructs etching load state features based on the region registration information and the basic etching process information. These etching load state features include a region etching demand component, a region etching capability component, and an execution response component. The deviation prediction module... 300 is used to generate regional etching deviation prediction results based on regional etching demand components and regional etching capability components; the linkage compensation control module 400 is used to establish a control allocation relationship between the etching region set and the execution region set based on the regional etching deviation prediction results and the execution response components, and generate linkage compensation control instructions for adjusting etching execution parameters according to the control allocation relationship; the execution feedback module 500 is used to adjust the etching execution parameters according to the linkage compensation control instructions, and obtain the etching response information after executing the linkage compensation control instructions, and associate the etching response information with the corresponding etching region in the etching region set based on the control coordinate system, so as to update the regional etching capability components and execution response components used for subsequent regional etching deviation prediction and linkage compensation control, until the preset etching termination condition is met.

[0071] Please see Figure 2 The region mapping module 100 first establishes a control coordinate system, wherein the control coordinate system takes the conveying direction of the conveying path as the first direction, the width direction of the board surface of the circuit board to be etched as the second direction, and the direction perpendicular to the board surface of the circuit board to be etched as the third direction.

[0072] The region mapping module 100 acquires the board size information, board positioning reference and circuit pattern distribution information of the circuit board to be etched, and determines the initial position of the circuit board to be etched in the control coordinate system based on the board positioning reference when the circuit board to be etched enters the conveying path.

[0073] The process by which the region mapping module 100 generates the etched region set specifically includes:

[0074] Based on the board size information and circuit pattern distribution information of the circuit board to be etched, the effective etching range of the circuit board to be etched is determined in the control coordinate system, where the effective etching range is the board surface area of ​​the circuit board to be etched that requires copper layer removal.

[0075] The effective etching range is divided according to the preset area division size, and continuous board segments are formed along the conveying direction of the conveying path. Each board segment is divided into grids along the width direction of the board surface to be etched, so that each grid unit is an etching area.

[0076] Assign a region number to each etched region and record the region boundary coordinates, region center coordinates, time position of entering the etched area, and time position of leaving the etched area in the control coordinate system.

[0077] All etched regions are stored in a set according to their region numbers, forming an etched region set. Thus, each etched region in the etched region set has a definite spatial and temporal location, which can be correlated with region registration information, etch load state characteristics, region etch deviation prediction results and etch response information in subsequent processing.

[0078] After forming the etched region set, the process by which the region mapping module 100 generates the execution region set specifically includes:

[0079] Obtain the installation location information, actuator number, spray coverage area, spray direction, response delay time, spray pressure adjustment range, and spray flow adjustment range of the actuator, and convert the installation location of the actuator to the control coordinate system;

[0080] Based on the position of the action center of each actuator in the control coordinate system and the spray coverage range, determine the effective action space in which the actuator can produce an effective etching effect on the circuit board to be etched;

[0081] For an actuator consisting of multiple spray nozzles, the effective working space corresponding to each spray nozzle is determined as the execution area based on the arrangement position and coverage width of the spray nozzles.

[0082] For an actuator consisting of a single adjustable spray unit, the effective working space corresponding to the adjustable spray unit is defined as the execution area;

[0083] Assign an execution area number to each execution area and establish a correspondence between the execution area number and the execution agency number;

[0084] Each execution area records the execution area number, actuator number, coordinates of the action center, coordinates of the action boundary, action length, action width, response delay time, spray pressure adjustment range, and spray flow adjustment range;

[0085] Each execution region further records the minimum pressure adjustment step, minimum flow rate adjustment step, minimum opening and closing time adjustment step, lower limit of spray pressure, upper limit of spray pressure, lower limit of spray flow rate, and upper limit of spray flow rate;

[0086] By further combining the transmission speed information, the time position of the etched area entering the corresponding execution area and the time position of leaving the corresponding execution area are determined, and the time position is written into the execution area record;

[0087] All execution regions are stored in a set according to their execution region numbers to form an execution region set. Thus, each execution region in the execution region set has a defined spatial range, temporal range, and parameter adjustment range, which can be used in subsequent processing to establish the control allocation relationship between the etching region set and the execution region set.

[0088] After forming the etching region set and the execution region set, the region mapping module 100 obtains basic information about the etching process. This basic information includes initial copper thickness information, target copper thickness information, circuit pattern density information, transmission speed information, etching solution temperature information, etching solution concentration information, spray pressure information, spray flow rate information, and current actuator parameter information, among which:

[0089] Initial copper thickness information is collected by a copper thickness detection device before entering the etching section. The copper thickness detection device detects the surface of the circuit board to be etched according to the control coordinate system and outputs the copper thickness detection value corresponding to the position of the board surface.

[0090] The target copper thickness information is read from the process parameter file. Based on the product model and board position of the circuit board to be etched, the target copper thickness information is assigned to the corresponding etching area in the etching area set.

[0091] The circuit pattern density information is generated from the circuit pattern data of the circuit board to be etched. The circuit pattern data is mapped to the control coordinate system, and the corresponding circuit pattern density information is generated according to the copper surface ratio, line width distribution and spacing distribution in each etching area.

[0092] The transmission speed information is generated by the feedback values ​​of the encoder and the conveying controller on the transmission path. The transmission speed information is correlated with the acquisition time and the real-time position of the circuit board to be etched in the control coordinate system.

[0093] The temperature information of the etching solution is collected by the temperature sensor in the etching solution circulation pipeline and the temperature sensor in the etching tank, and the concentration information of the etching solution is collected by the etching solution concentration detection device.

[0094] Spray pressure and spray flow information are collected by pressure sensors and flow sensors installed on the liquid supply line of the actuator, respectively, and are associated with the corresponding actuator number and execution area number.

[0095] The current actuator parameter information includes the actuator's open / closed status, spray pressure setting, spray flow setting, spray angle setting, and valve opening setting.

[0096] The target linewidth information is read from the process parameter file and assigned to the corresponding etching area in the etching area set according to the product model and board position of the circuit board to be etched;

[0097] The above information is encapsulated according to the control cycle to form the basic information of the etching process, so that the basic information of the etching process can be called by the region registration information generation process and the etching load state feature construction process.

[0098] The region mapping module 100 generates region registration information in the control coordinate system based on the etched region set, the execution region set, and basic information about the etching process. Specifically, this includes:

[0099] For each etched region in the set of etched regions, based on the region boundary coordinates and region center coordinates of the etched region, the initial copper thickness information, target copper thickness information, circuit pattern density information and target line width information corresponding to the etched region are extracted from the basic information of the etching process, and the extracted information is written into the region record of the etched region.

[0100] Based on the transmission speed information and the coordinates of the center of the etched area, the real-time position change of the etched area on the transmission path is determined. Combined with the action boundary coordinates, action center coordinates and response delay time of each execution area in the execution area set, the entry time of the etched area into the execution area, the center action time at the action center position of the execution area, the departure time and effective action time position of the etched area leaving the execution area are determined.

[0101] The effective action time position is the actual time position at which the change in actuator parameters actually acts on the etched area after the response delay time.

[0102] Based on the correspondence between the boundary coordinates of the etched area and the action boundary coordinates of the execution area, the spatial overlap between the etched area and the execution area is determined, and the action sequence record is generated based on the execution area number, entry time, central action time, exit time and effective action time position passed by the same etched area in sequence.

[0103] The region number, initial copper thickness information, target copper thickness information, circuit pattern density information, target line width information, spatial overlap relationship, action sequence record, and effective action time position are combined to form the region registration information corresponding to the etching region.

[0104] Store the region registration information corresponding to all etched regions according to the region number, and send the region registration information to the load feature construction module 200.

[0105] Please see Figure 3 After receiving the region registration information and the basic information of the etching process, the load feature construction module 200 constructs etching load state features for each etching region in the etching region set, specifically including:

[0106] Read the initial copper thickness information and target copper thickness information corresponding to the etched area, determine the copper layer load that needs to be removed from the etched area, and modify the copper layer load in combination with the circuit pattern density information corresponding to the etched area to form the regional etching requirement component.

[0107] The line pattern density information is the ratio of the copper surface area within the corresponding etched area to the total area of ​​the etched area;

[0108] The upper and lower limits of the preset circuit pattern density are preset by the process parameter file.

[0109] The demand levels in the regional etching demand components increase in the order of first demand level, second demand level, third demand level, fourth demand level and fifth demand level, and correspond to the demand level values ​​1, 2, 3, 4 and 5 respectively;

[0110] First, determine the initial requirement level based on the copper layer load to be removed from the etched area. Then, adjust the initial requirement level based on the circuit pattern density information. When the circuit pattern density information is greater than the preset upper limit of circuit pattern density, increase the current requirement level by one level. When the current requirement level is already the fifth requirement level, keep the fifth requirement level unchanged. When the circuit pattern density information is less than the preset lower limit of circuit pattern density, decrease the current requirement level by one level. When the current requirement level is already the first requirement level, keep the first requirement level unchanged. When the circuit pattern density information is greater than or equal to the preset lower limit of circuit pattern density and less than or equal to the preset upper limit of circuit pattern density, keep the current requirement level unchanged.

[0111] The regional etching demand component includes the region number, demand level, demand source record, and demand effective time, which is used to characterize the etching demand intensity of the corresponding etching region within the current control cycle.

[0112] The load feature construction module 200 further forms a regional etching capability component based on the etching solution temperature, etching solution concentration, spray pressure, spray flow rate, conveying speed, and current actuator parameters from the basic etching process information. This component specifically includes:

[0113] The baseline process state set in the process parameter file is used as the baseline capability level. The current etching capability evaluation value is generated based on the etching solution temperature information, etching solution concentration information, spray pressure information, spray flow rate information, conveying speed information and current actuator parameter information. The current etching capability evaluation value is then compared with the baseline capability evaluation value.

[0114] The baseline capability evaluation value is generated from the baseline etching solution temperature, baseline etching solution concentration, baseline spray pressure, baseline spray flow rate, baseline conveying speed, and baseline actuator parameters set in the process parameter file;

[0115] The capability levels in the regional etching capability component increase sequentially from the first capability level to the fifth capability level, corresponding to capability level values ​​of 1, 2, 3, 4 and 5, respectively.

[0116] When the current etching capability evaluation value is greater than the sum of the baseline capability evaluation value and the preset upper deviation threshold, the current capability level corresponding to the etching area is increased by one level unit; when the current capability level is already the fifth capability level, the fifth capability level remains unchanged; when the current etching capability evaluation value is less than the difference between the baseline capability evaluation value and the preset lower deviation threshold, the current capability level corresponding to the etching area is decreased by one level unit; when the current capability level is already the first capability level, the first capability level remains unchanged; when the current etching capability evaluation value is greater than or equal to the difference between the baseline capability evaluation value and the preset lower deviation threshold, and less than or equal to the sum of the baseline capability evaluation value and the preset upper deviation threshold, the current capability level remains unchanged.

[0117] The regional etching capability component includes the region number, capability level, capability source record, and capability effective time, which is used to characterize the actual etching capability that can be obtained for the corresponding etching region under the current process conditions.

[0118] The load feature construction module 200 also generates execution action response components based on the spatial overlap relationship, action sequence record, and effective action time location in the region registration information, specifically including:

[0119] The response level of the execution region to the etched region is determined based on the distance between the center coordinates of the etched region and the center coordinates of the execution region; the response distance is the coordinate distance between the center coordinates of the etched region and the center coordinates of the execution region; the preset center response distance threshold and the preset edge response distance threshold are determined by the width and length of the execution region.

[0120] When the response distance is less than or equal to the preset center response distance threshold, the load feature construction module 200 determines the response level as the center response level; when the response distance is greater than the preset center response distance threshold and less than or equal to the preset edge response distance threshold, the response level is determined as the intermediate response level; when the response distance is greater than the preset edge response distance threshold and there is a spatial overlap between the etched area and the execution area, the response level is determined as the edge response level; when the response distance is greater than the preset edge response distance threshold and there is no spatial overlap between the etched area and the execution area, no execution response component is established between the execution area and the etched area.

[0121] The response order of multiple execution regions to the same etched region is determined based on the action sequence record, and the effective time of the response of the corresponding execution region is determined based on the response delay time. The execution action response component includes region number, execution region number, response level, response delay time, effective action time position and response sequence, which are used to characterize the actual action response of the execution region to the etched region.

[0122] The response levels in the execution response components increase in the order of edge response level, intermediate response level, and center response level, and correspond to response level values ​​of 1, 2, and 3, respectively.

[0123] The regional etching demand component, regional etching capability component, and execution response component corresponding to the same etching area are combined according to the area number to form the etching load state characteristics corresponding to the etching area, and the etching load state characteristics are sent to the deviation prediction module 300.

[0124] Please see Figure 4 After receiving the etching load state characteristics, the deviation prediction module 300 generates a regional etching deviation prediction result based on the regional etching demand component and the regional etching capability component, specifically including:

[0125] Read the regional etching demand component corresponding to each etching area to obtain the demand level and demand effective time of the etching area, and read the regional etching capability component corresponding to the etching area to obtain the capability level and capability effective time of the etching area.

[0126] Convert the ability level and requirement level into comparable level values ​​and calculate the level difference, which is equal to the ability level value minus the requirement level value.

[0127] When the grade difference is less than the negative deviation judgment threshold, the deviation direction of the etched area is determined as the insufficient etching direction; when the grade difference is greater than the positive deviation judgment threshold, the deviation direction of the etched area is determined as the over-etching direction; when the grade difference is greater than or equal to the negative deviation judgment threshold and less than or equal to the positive deviation judgment threshold, the deviation direction of the etched area is determined as the deviation controlled direction; the deviation grade is determined according to the absolute value of the grade difference.

[0128] The preset first deviation level threshold, preset second deviation level threshold, and preset third deviation level threshold are preset by the process parameter file. When the absolute value of the level difference is greater than 0 and less than or equal to the preset first deviation level threshold, the deviation level is determined to be a first-level deviation; when the absolute value of the level difference is greater than the preset first deviation level threshold and less than or equal to the preset second deviation level threshold, the deviation level is determined to be a second-level deviation; when the absolute value of the level difference is greater than the preset second deviation level threshold and less than or equal to the preset third deviation level threshold, the deviation level is determined to be a third-level deviation; when the absolute value of the level difference is greater than the preset third deviation level threshold, the deviation level is determined to be a fourth-level deviation.

[0129] Level 1, Level 2, Level 3, and Level 4 deviations correspond to deviation level values ​​1, 2, 3, and 4, respectively. The deviation level value is a quantified value that the deviation level participates in the calculation of the enhanced and weakened combined values, and is used to characterize the weight of different deviation levels in the control combined calculation. The deviation duration is determined based on the time difference between the effective action termination time and the effective action start time of the etched area. The area number, deviation direction, deviation level, deviation duration, demand level, capability level, and prediction generation time are combined to form the regional etching deviation prediction result corresponding to the etched area.

[0130] Store the predicted etching deviation results for all etched areas according to the area number, and send the predicted etching deviation results to the linkage compensation control module 400.

[0131] Please see Figure 5 After receiving the predicted etching deviation results and the response components of the execution action, the linkage compensation control module 400 establishes a control allocation relationship between the etching region set and the execution region set in the control coordinate system, specifically including:

[0132] Read the deviation direction and deviation level from the regional etching deviation prediction results, identify the etching area with the deviation direction of insufficient etching as the enhanced compensation object, identify the etching area with the deviation direction of over-etching as the weakened compensation object, and identify the etching area with the deviation direction of the deviation control direction as the retained object; for the retained object, keep the actuator parameters corresponding to the retained object unchanged in the current control cycle, and do not include the retained object in the calculation process of enhanced merging value and weakened merging value;

[0133] Based on the execution action response components, locate the execution regions that can affect each enhanced compensation object and each weakened compensation object, and read the corresponding execution region number, response level, response delay time, effective action time location, and response order;

[0134] The control allocation weight is determined based on the response level. When the response level is the central response level, the control allocation weight is the first preset weight value; when the response level is the intermediate response level, the control allocation weight is the second preset weight value; and when the response level is the edge response level, the control allocation weight is the third preset weight value. The first preset weight value is greater than the second preset weight value, the second preset weight value is greater than the third preset weight value, and all three preset weight values ​​are preset by the process parameter file.

[0135] For all execution regions corresponding to the same etched region, the control allocation weights obtained based on the response level will be normalized so that the sum of all normalized control allocation weights is equal to 1. The normalized control allocation weights will be used as the final control allocation weights in the control allocation relationship.

[0136] The control effective window is determined based on the response delay time and the effective action time. The control effective window includes the instruction issuance time, the instruction effective time, and the instruction hold time.

[0137] For cases where the same execution region corresponds to multiple etched regions within the same control window, the enhanced merging value corresponding to the enhanced compensation direction and the weakened merging value corresponding to the weakened compensation direction are calculated separately. The enhanced merging value is the sum of the products of the deviation level values ​​of each etched region whose deviation direction is the under-etching direction and the control allocation weights. The weakened merging value is the sum of the products of the deviation level values ​​of each etched region whose deviation direction is the over-etching direction and the control allocation weights. When the enhanced merging value is greater than the sum of the weakened merging value and the preset direction judgment threshold, the main control direction is determined as the enhanced compensation direction. When the weakened merging value is greater than the sum of the enhanced merging value and the preset direction judgment threshold, the main control direction is determined as the weakened compensation direction. When the absolute value of the difference between the enhanced merging value and the weakened merging value is less than or equal to the preset direction judgment threshold, the main control direction is determined as the maintenance direction.

[0138] When the minimum distance between the boundary coordinates of two execution regions in the control coordinate system is less than or equal to a preset adjacent distance threshold, or when the boundary coordinates of the two execution regions overlap, the two execution regions are determined to be adjacent execution regions. When the difference in the final control allocation weight between adjacent execution regions is greater than a preset weight difference threshold, the final control allocation weight between the two adjacent execution regions is smoothed once or multiple times until the difference in the final control allocation weight between the two adjacent execution regions is less than or equal to the preset weight difference threshold, or the preset upper limit of the number of smoothing processes is reached. The etching region number, execution region number, deviation direction, deviation level, response level, control allocation weight, control effective window, and main control direction are associated and stored to form a control allocation relationship.

[0139] After establishing the control allocation relationship, the linkage compensation control module 400 generates linkage compensation control instructions based on the control allocation relationship and the current actuator parameter information, specifically including:

[0140] The parameter adjustment direction is determined based on the main control direction in the control allocation relationship; when the main control direction is the enhancement compensation direction, a parameter adjustment direction that increases the etching intensity is generated; when the main control direction is the weakening compensation direction, a parameter adjustment direction that decreases the etching intensity is generated; when the main control direction is the holding direction, the current etching execution parameters are kept unchanged; the etching execution parameters are determined as spray pressure, spray flow rate, and actuator opening and closing time.

[0141] The parameter adjustment range is determined based on the deviation level value, control allocation weight, and preset unit adjustment amount. The parameter adjustment range is equal to the product of the deviation level value, control allocation weight, and preset unit adjustment amount. Specifically, the spray pressure adjustment range is equal to the product of the deviation level value, control allocation weight, and preset unit spray pressure adjustment amount; the spray flow rate adjustment range is equal to the product of the deviation level value, control allocation weight, and preset unit spray flow rate adjustment amount; and the actuator opening / closing time adjustment range is equal to the product of the deviation level value, control allocation weight, and preset unit opening / closing time adjustment amount. The preset unit adjustment amounts include preset unit spray pressure adjustment amounts, preset unit spray flow rate adjustment amounts, and preset unit opening / closing time adjustment amounts, all of which are preset by the process parameter file.

[0142] Based on the spray pressure adjustment range, spray flow adjustment range, and actuator's actuable step size, the parameter adjustment range is limited and quantified.

[0143] The spray pressure after parameter adjustment is limited to between the lower limit and the upper limit of the spray pressure, and the spray flow rate after parameter adjustment is limited to between the lower limit and the upper limit of the spray flow rate. The parameter adjustment range is quantified according to the minimum pressure adjustment step, minimum flow rate adjustment step, and minimum opening and closing time adjustment step of the actuator.

[0144] The lower limit of spray pressure, the upper limit of spray pressure, the lower limit of spray flow rate, the upper limit of spray flow rate, the minimum pressure adjustment step, the minimum flow rate adjustment step, and the minimum opening and closing time adjustment step are provided by the execution region record in the execution region set;

[0145] The effective time and duration of the instruction are determined based on the control activation window, and the corresponding actuator number is found based on the execution area number. The actuator number, execution area number, parameter adjustment direction, parameter adjustment range, effective time, and duration of the instruction are combined to form a linkage compensation control instruction. When the main control direction is the enhanced compensation direction, the linkage compensation control instruction is used to increase the spray pressure, increase the spray flow rate, increase the intensity of the actuator's action, and extend the actuator's opening and closing time. When the main control direction is the weakening compensation direction, the linkage compensation control instruction is used to reduce the spray pressure, reduce the spray flow rate, reduce the intensity of the actuator's action, and shorten the actuator's opening and closing time.

[0146] The linkage compensation control instructions within the same control cycle are sorted according to their effective time; for linkage compensation control instructions with the same effective time, they are sorted in descending order of deviation level; the sorted linkage compensation control instructions are then sent to the execution feedback module 500.

[0147] Please see Figure 6 After receiving the linkage compensation control command, the execution feedback module 500 adjusts the etching execution parameters according to the linkage compensation control command. The etching execution parameters include spray pressure, spray flow rate and actuator opening and closing time.

[0148] After the linkage compensation control command takes effect, the execution feedback module 500 obtains the etching response information after executing the linkage compensation control command. The etching response information includes copper thickness detection information after etching, board surface image detection information, line width detection information, etching solution temperature feedback information, etching solution concentration feedback information, spray pressure feedback information, spray flow rate feedback information, and conveying speed feedback information.

[0149] The copper thickness detection information after etching is collected by a copper thickness detection device set at the exit of the etching section. The board surface image detection information is collected by an image acquisition device. The line width detection information is generated by an image processing unit based on the board surface image detection information. The etching solution temperature feedback information is collected by a temperature sensor. The etching solution concentration feedback information is collected by a concentration detection device. The spray pressure feedback information is collected by a pressure sensor. The spray flow rate feedback information is collected by a flow sensor. The conveying speed feedback information is collected by the encoder and conveying controller feedback values ​​on the conveying path.

[0150] The execution feedback module 500 associates the etching response information with the corresponding etching region in the etching region set based on the control coordinate system. Specifically, this includes:

[0151] Based on the installation position of the detection device in the control coordinate system, the conveying speed information of the circuit board to be etched, and the detection time, the board surface position corresponding to the detection result is determined, and the area number in the etching area set is found based on the board surface position.

[0152] The copper thickness detection information, board surface image detection information, and line width detection information are written into the feedback record of the corresponding etching area, and the etching solution temperature feedback information, etching solution concentration feedback information, spray pressure feedback information, spray flow rate feedback information, and conveying speed feedback information are written into the feedback record of the corresponding control cycle.

[0153] The actual etching results for each etching area are obtained based on the feedback records. The actual etching results include the actual copper thickness, actual line width, board surface defect status, and actual etching variation.

[0154] The actual etching result is compared with the target copper thickness information and target linewidth range corresponding to the etched area. The target copper thickness information includes the lower limit and upper limit of the target copper thickness, and the target linewidth range includes the lower limit and upper limit of the target linewidth. When the actual copper thickness is greater than the upper limit of the target copper thickness, the etched area is determined to be in an under-etched state. When the actual copper thickness is less than the lower limit of the target copper thickness, the etched area is determined to be in an over-etched state. When the actual copper thickness is greater than or equal to the lower limit of the target copper thickness and less than or equal to the upper limit of the target copper thickness, and the actual linewidth is greater than or equal to the lower limit of the target linewidth and less than or equal to the upper limit of the target linewidth, the etched area is determined to be in a controlled state.

[0155] The execution feedback module 500 updates the region etching capability component and the execution action response component based on the actual etching results. Specifically, this includes:

[0156] The execution feedback module 500 reads the regional etching capability component corresponding to the etching area in the previous control cycle and uses the capability level therein as the current capability level; in the first control cycle, the capability level determined by the load feature construction module 200 based on the current etching capability evaluation value and the benchmark capability evaluation value is used as the current capability level.

[0157] The preset variation range includes a preset lower limit and a preset upper limit. When the actual etching variation is less than the preset lower limit, it is determined that the actual etching variation is below the preset variation range. When the actual etching variation is greater than the preset upper limit, it is determined that the actual etching variation is above the preset variation range. When the actual etching variation is greater than or equal to the preset lower limit and less than or equal to the preset upper limit, it is determined that the actual etching variation is within the preset variation range.

[0158] For etching areas where the main control direction of the linkage compensation control command is the enhanced compensation direction, when the actual etching change is less than the preset lower limit, the current capability level corresponding to the etching area is reduced by one level; when the current capability level is already the first capability level, the first capability level remains unchanged; when the actual etching change is greater than or equal to the preset lower limit and less than or equal to the preset upper limit, the current capability level corresponding to the etching area remains unchanged; when the actual etching change is greater than the preset upper limit, the current capability level corresponding to the etching area is increased by one level; when the current capability level is already the fifth capability level, the fifth capability level remains unchanged.

[0159] For etching areas where the main control direction of the linkage compensation control command is the weakening compensation direction, when the actual etching change is greater than the preset upper limit of change, the current capability level corresponding to the etching area is increased by one level; when the current capability level is already the fifth capability level, the fifth capability level remains unchanged; when the actual etching change is greater than or equal to the preset lower limit of change and less than or equal to the preset upper limit of change, the current capability level corresponding to the etching area remains unchanged; when the actual etching change is less than the preset lower limit of change, the current capability level corresponding to the etching area is decreased by one level; when the current capability level is already the first capability level, the first capability level remains unchanged.

[0160] The execution feedback module 500 further reads the execution area number and linkage compensation control command corresponding to the etched area, and determines the actual response effect of the execution area to the etched area. The response level in the execution response component increases in the order of edge response level, intermediate response level, and center response level. When the parameters of the execution area are adjusted, if the actual etching change of the etched area is within the preset change range, the current response level corresponding to the execution area remains unchanged. When the parameters of the execution area are adjusted, if the actual etching change of the etched area is lower than the preset change range, the current response level corresponding to the execution area is reduced by one level unit. When the current response level is already the edge response level, the edge response level remains unchanged. When the parameters of the execution area are adjusted, if the actual etching change of the etched area is higher than the preset change range, the current response level corresponding to the execution area is increased by one level unit. When the current response level is already the center response level, the center response level remains unchanged.

[0161] The execution feedback module 500 writes the updated regional etching capability component and execution response component into the corresponding regional number and execution regional number, and sends the updated regional etching capability component and execution response component to the load feature construction module 200, the deviation prediction module 300 and the linkage compensation control module 400 for regional etching deviation prediction and linkage compensation control in the next control cycle.

[0162] Within a complete control cycle, the region mapping module 100 first establishes a control coordinate system, forming an etching region set and an execution region set, and generates region registration information; the load feature construction module 200 constructs etching load state features based on the region registration information and the basic information of the etching process; the deviation prediction module 300 generates region etching deviation prediction results based on the region etching demand component and the region etching capability component; the linkage compensation control module 400 establishes a control allocation relationship based on the region etching deviation prediction results and the execution action response component, and generates linkage compensation control instructions; the execution feedback module 500 adjusts the etching execution parameters according to the linkage compensation control instructions, obtains etching response information, and then associates the etching response information with the corresponding etching region in the etching region set to update the region etching capability component and the execution action response component; the above control cycle is executed continuously until the preset etching termination condition is met, wherein the preset etching termination condition is:

[0163] The actual copper thickness of each etched region in the etched region set is greater than or equal to the lower limit of the target copper thickness and less than or equal to the upper limit of the target copper thickness. The actual linewidth of each etched region is greater than or equal to the lower limit of the target linewidth and less than or equal to the upper limit of the target linewidth. The predicted etch deviation of the region is in the controlled deviation direction for N consecutive control cycles, and the etched circuit board to be etched completes the etch section on the transport path. Here, N is a positive integer greater than or equal to 2 and is preset by the process parameter file. After the preset etch termination condition is met, the execution feedback module 500 stops generating new linkage compensation control commands for the circuit board to be etched and outputs the etch process record of the circuit board to be etched.

[0164] In this embodiment, the preset upper limit value of the line pattern density, the preset lower limit value of the line pattern density, the preset upper deviation threshold of the capacity, the preset lower deviation threshold of the capacity, the negative deviation judgment threshold, the positive deviation judgment threshold, the preset first deviation level threshold, the preset second deviation level threshold, the preset third deviation level threshold, the preset direction judgment threshold, the preset adjacent distance threshold, the preset weight difference threshold, the preset lower limit value of the change, the preset upper limit value of the change, the first preset weight value, the second preset weight value, the third preset weight value, the preset unit spray pressure adjustment amount, the preset unit spray flow rate adjustment amount, and the preset unit opening and closing time adjustment amount are all preset by the process parameter file, wherein:

[0165] The preset upper limit and lower limit of circuit pattern density are both in the range of 0 to 1, and the lower limit of the preset circuit pattern density is less than the upper limit of the preset circuit pattern density. The values ​​are based on the statistical results of the circuit pattern distribution of the circuit board to be etched.

[0166] The preset upper deviation threshold, preset lower deviation threshold, negative deviation judgment threshold, positive deviation judgment threshold, preset first deviation level threshold, preset second deviation level threshold, preset third deviation level threshold, preset direction judgment threshold, preset lower limit of change, and preset upper limit of change are all real numbers greater than 0. The preset first deviation level threshold is less than the preset second deviation level threshold, the preset second deviation level threshold is less than the preset third deviation level threshold, and the preset lower limit of change is less than the preset upper limit of change. The values ​​are based on the statistical results of historical etching process data, target copper thickness information, target line width information, and equipment control accuracy.

[0167] The preset adjacent distance threshold is a real number that is greater than 0 and less than or equal to the width of the corresponding execution region. The value is determined based on the boundary coordinates, width, and spatial spacing between adjacent execution regions in the execution region set.

[0168] The preset weight difference threshold is a real number greater than 0 and less than 1, and the value is based on the allowable fluctuation range of control allocation weight between adjacent execution regions.

[0169] The values ​​of the first preset weight value, the second preset weight value, and the third preset weight value are all real numbers greater than 0 and less than or equal to 1. The first preset weight value is greater than the second preset weight value, and the second preset weight value is greater than the third preset weight value. The values ​​are determined based on the actual strength of the effect corresponding to the response level.

[0170] The preset unit spray pressure adjustment amount is a positive integer multiple of the minimum pressure adjustment step size and is within the spray pressure adjustment range. The preset unit spray flow rate adjustment amount is a positive integer multiple of the minimum flow rate adjustment step size and is within the spray flow rate adjustment range. The preset unit opening and closing time adjustment amount is a positive integer multiple of the minimum opening and closing time adjustment step size and is within the opening and closing time adjustment range of the corresponding actuator. The values ​​are based on the spray pressure adjustment range, spray flow rate adjustment range, minimum pressure adjustment step size, minimum flow rate adjustment step size, minimum opening and closing time adjustment step size in the execution area set and the executable adjustment accuracy of the corresponding actuator.

[0171] To further illustrate the working process of this invention, a specific operational process is given below:

[0172] In its operation, the region mapping module 100 first establishes a control coordinate system and acquires the board size information, board positioning reference, and circuit pattern distribution information of the circuit board to be etched, determining the initial position of the circuit board to be etched in the control coordinate system. Then, based on the board size information and circuit pattern distribution information of the circuit board to be etched, it forms an etching region set and acquires the installation position information, actuator number, spray coverage area, spray direction, response delay time, spray pressure adjustment range, and spray flow adjustment range of the actuator, forming an execution region set. On this basis, the region mapping module 100 further acquires basic etching process information and, based on the etching region set, the execution region set, and the basic etching process information, generates region registration information in the control coordinate system.

[0173] After receiving the region registration information and the basic information of the etching process, the load feature construction module 200 reads the initial copper thickness information, target copper thickness information, and circuit pattern density information corresponding to each etching region in the etching region set to form a region etching demand component. Then, based on the etching solution temperature information, etching solution concentration information, spray pressure information, spray flow rate information, conveying speed information, and current actuator parameter information in the basic information of the etching process, it forms a region etching capability component. Based on the spatial overlap relationship, action sequence record, and effective action time position in the region registration information, it generates an execution action response component. Finally, it combines the region etching demand component, the region etching capability component, and the execution action response component to form the etching load state feature.

[0174] After receiving the etching load state characteristics, the deviation prediction module 300 reads the regional etching demand component and regional etching capability component corresponding to each etching area to obtain the demand level and capability level. After converting the capability level and demand level into comparable level values, it calculates the level difference. Then, it determines the deviation direction based on the level difference, determines the deviation level based on the absolute value of the level difference, and determines the deviation duration based on the time difference between the effective action termination time and the effective action start time, thus forming the regional etching deviation prediction result corresponding to the etching area.

[0175] After receiving the regional etching deviation prediction results and the execution response components, the linkage compensation control module 400 establishes a control allocation relationship between the etching region set and the execution region set in the control coordinate system. Based on the main control direction in the control allocation relationship, it determines the parameter adjustment direction. Based on the deviation level value, control allocation weight, and preset unit adjustment amount, it determines the parameter adjustment amplitude. Combining the spray pressure adjustment range, spray flow adjustment range, and executable step size of the actuator, it limits and quantifies the parameter adjustment amplitude and generates linkage compensation control commands.

[0176] After receiving the linkage compensation control command, the execution feedback module 500 adjusts the etching execution parameters according to the linkage compensation control command, and obtains the etching response information after the linkage compensation control command takes effect. Subsequently, the execution feedback module 500 associates the etching response information with the corresponding etching region in the etching region set based on the control coordinate system to obtain the actual etching result, and updates the region etching capability component and the execution action response component according to the actual etching result. Finally, the updated region etching capability component and execution action response component are sent to the load feature construction module 200, the deviation prediction module 300 and the linkage compensation control module 400 for region etching deviation prediction and linkage compensation control in the next control cycle, until the preset etching termination condition is met.

[0177] As can be seen from the above description, the closed-loop control system for a high-precision circuit board etching process provided in this embodiment has the following technical effects:

[0178] The region mapping module 100 forms an etching region set, an execution region set, and region registration information in the control coordinate system. Based on this, the load feature construction module 200 constructs etching load state features including regional etching demand components, regional etching capability components, and execution action response components. The deviation prediction module 300 generates regional etching deviation prediction results. The linkage compensation control module 400 further establishes the control allocation relationship between the etching region set and the execution region set and generates linkage compensation control instructions. After executing the linkage compensation control instructions, the execution feedback module 500 obtains etching response information and updates the regional etching capability components and execution action response components. This helps to uniformly characterize and correspondingly adjust the differences in etching demand of different etching regions and the cross-action relationship of multiple execution regions on each etching region within the same control cycle. It improves the matching between the regional etching deviation prediction results and the execution region adjustment objects, enhances the pertinence of the linkage compensation control instructions, and improves the effect of continuous feedback of adjustment results to subsequent control cycles.

[0179] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A closed-loop control system for a high-precision circuit board etching process, characterized in that, It includes a region mapping module, a load characteristic construction module, a deviation prediction module, a linkage compensation control module, and an execution feedback module, among which: The region mapping module maps the spatial relationship between the circuit board to be etched, the conveying path, and the actuator to the control coordinate system, generates an etching region set and an execution region set, and obtains basic information about the etching process based on the control coordinate system to generate region registration information corresponding to the etching region set. The load feature construction module constructs etching load state features based on the region registration information and the etching process basic information. The etching load state features include a region etching demand component, a region etching capability component, and an execution response component. The deviation prediction module generates a regional etching deviation prediction result based on the regional etching demand component and the regional etching capability component. The linkage compensation control module establishes a control allocation relationship between the set of etched regions and the set of executed regions based on the regional etching deviation prediction results and the execution response components, and generates linkage compensation control instructions for adjusting etching execution parameters according to the control allocation relationship. The execution feedback module adjusts the etching execution parameters according to the linkage compensation control command, and obtains the etching response information after executing the linkage compensation control command. Based on the control coordinate system, the etching response information is associated with the corresponding etching region in the etching region set to update the region etching capability component and the execution response component used for subsequent region etching deviation prediction and linkage compensation control, until the preset etching termination condition is met.

2. The closed-loop control system for the high-precision circuit board etching process according to claim 1, characterized in that, The process of generating the set of etched regions specifically includes: Based on the board size information and circuit pattern distribution information of the circuit board to be etched, the effective etching range of the circuit board to be etched is determined in the control coordinate system. The effective etching range is divided according to the preset area division size, and continuous plate segments are formed along the conveying direction of the conveying path. Each plate segment is divided into grids along the width direction of the plate surface of the circuit board to be etched, so that each grid unit is an etching area. Assign a region number to each etched region and record the region boundary coordinates, region center coordinates, time position of entering the etched area, and time position of leaving the etched area in the control coordinate system. All etched areas are grouped and stored according to their area numbers to form the etched area set.

3. The closed-loop control system for the high-precision circuit board etching process according to claim 1, characterized in that, The process of generating the execution region set specifically includes: Obtain the installation location information, actuator number, spray coverage area, spray direction, response delay time, spray pressure adjustment range, and spray flow adjustment range of the actuator, and convert the installation location of the actuator to the control coordinate system; Based on the position of the action center of each actuator in the control coordinate system and the spray coverage range, determine the effective action space of the actuator to produce an effective etching effect on the circuit board to be etched; The execution area is determined based on the arrangement and coverage width of the spray nozzles of the actuator, or based on the effective working space corresponding to the adjustable spray unit; Assign an execution area number to each execution area and establish a correspondence between the execution area number and the execution mechanism number. Record the execution area number, execution mechanism number, coordinates of the action center, coordinates of the action boundary, action length, action width, response delay time, spray pressure adjustment range, spray flow adjustment range, minimum pressure adjustment step, minimum flow adjustment step, minimum opening and closing time adjustment step, lower limit of spray pressure, upper limit of spray pressure, lower limit of spray flow, and upper limit of spray flow. By combining the transmission speed information, the time range of the execution area is determined, and all execution areas are stored in a set according to the execution area number to form the execution area set.

4. The closed-loop control system for the high-precision circuit board etching process according to claim 1, characterized in that, The process of obtaining basic information about the etching process specifically includes: Acquire initial copper thickness information, target copper thickness information, circuit pattern density information, transmission speed information, etching solution temperature information, etching solution concentration information, spray pressure information, spray flow rate information, current actuator parameter information, and target linewidth information; The initial copper thickness information, the target copper thickness information, the circuit pattern density information, and the target line width information are allocated to the corresponding etching regions in the etching region set according to the control coordinate system; The transmission speed information is correlated with the real-time position of the circuit board to be etched in the control coordinate system, and the spray pressure information and the spray flow information are associated with the corresponding actuator number and execution area number. The above information is encapsulated according to the control cycle to form the basic information of the etching process.

5. The closed-loop control system for the high-precision circuit board etching process according to claim 1, characterized in that, The process of generating the region registration information specifically includes: For each etched region in the set of etched regions, based on the region boundary coordinates and region center coordinates of the etched region, the initial copper thickness information, target copper thickness information, circuit pattern density information and target line width information corresponding to the etched region are extracted from the basic information of the etching process. Based on the transmission speed information and the coordinates of the center of the etched area, the real-time position change of the etched area on the transmission path is determined. Combined with the action boundary coordinates, action center coordinates and response delay time of each execution area in the execution area set, the entry time of the etched area into the execution area, the center action time at the action center position of the execution area, the departure time and effective action time position of the etched area leaving the execution area are determined. Based on the correspondence between the boundary coordinates of the etched area and the action boundary coordinates of the execution area, the spatial overlap between the etched area and the execution area is determined, and the action sequence record is generated based on the execution area number, entry time, central action time, exit time and effective action time position passed by the same etched area in sequence. The area registration information is formed by combining the area number, initial copper thickness information, target copper thickness information, line pattern density information, target line width information, spatial overlap relationship, action sequence record, and effective action time and location.

6. The closed-loop control system for the high-precision circuit board etching process according to claim 5, characterized in that, The process of constructing the etch load state characteristics specifically includes: Based on the initial copper thickness information, target copper thickness information, and circuit pattern density information corresponding to each etched area, the copper layer load is determined and the area etch requirement component is formed. Based on the etching solution temperature, etching solution concentration, spray pressure, spray flow rate, conveying speed, and current actuator parameters, a current etching capability evaluation value is generated, and a regional etching capability component is formed by combining the baseline capability evaluation value. Based on the spatial overlap relationship, action sequence record, effective action time and location, center coordinates of the etched area, center coordinates of the action of the execution area and response delay time in the area registration information, the response level, response effective time and response sequence of the execution area to the etched area are determined, and the execution action response components are formed. The etching load state characteristics are formed by combining the regional etching demand component, regional etching capability component, and execution response component corresponding to the same etching region according to the region number.

7. The closed-loop control system for the high-precision circuit board etching process according to claim 6, characterized in that, The process of generating the regional etching deviation prediction results specifically includes: Read the regional etching demand component and regional etching capability component corresponding to each etching area to obtain the demand level, demand effective time, capability level and capability effective time; Convert the competency level and requirement level into comparable level values ​​and calculate the level difference; The deviation direction is determined based on the grade difference, and the deviation grade is determined based on the absolute value of the grade difference; The duration of the deviation is determined based on the time difference between the effective termination time and the effective start time of the etched area. The area number, deviation direction, deviation level, deviation duration, demand level, capability level, and prediction generation time are combined to form the etch deviation prediction result for the area.

8. The closed-loop control system for the high-precision circuit board etching process according to claim 7, characterized in that, The process of establishing the control allocation relationship specifically includes: Based on the deviation direction and deviation level in the regional etching deviation prediction results, the enhanced compensation object, the weakened compensation object, and the retained object are determined, and the corresponding actuator parameters of the retained object are kept unchanged. Based on the response components of the execution effect, locate the execution regions that affect the enhanced compensation objects and the weakened compensation objects, and read the execution region number, response level, response delay time, effective action time location, and response order; The control allocation weights are determined based on the response level, and the control allocation weights corresponding to the same etched area are normalized. The control window is determined based on the response delay time and the effective action time location. For the etched regions corresponding to the same execution region within the same control window, the enhanced merging value and the weakened merging value are calculated to determine the main control direction. Adjacent execution regions are determined based on the coordinate relationship of the action boundaries between execution regions, and the control allocation weights between adjacent execution regions are smoothed out. The etching region number, execution region number, deviation direction, deviation level, response level, control allocation weight, control effective window, and main control direction are associated and stored to form the control allocation relationship. Based on the control allocation relationship, a linkage compensation control command is generated.

9. The closed-loop control system for the high-precision circuit board etching process according to claim 8, characterized in that, The process of generating the linkage compensation control command specifically includes: The parameter adjustment direction is determined based on the main control direction in the control allocation relationship, and the etching execution parameters are determined as spray pressure, spray flow rate and actuator opening and closing time. Based on the deviation level value, control allocation weight, and preset unit adjustment amount, the spray pressure adjustment range, spray flow adjustment range, and actuator opening and closing time adjustment range are determined respectively. By combining the spray pressure adjustment range, spray flow adjustment range, minimum pressure adjustment step, minimum flow adjustment step, minimum opening and closing time adjustment step, lower limit of spray pressure, upper limit of spray pressure, lower limit of spray flow, and upper limit of spray flow of the actuator, the parameter adjustment range is limited and quantified. The effective time and duration of the instruction are determined based on the control effective window, and the corresponding execution agency number is found based on the execution area number. The actuator number, execution area number, parameter adjustment direction, parameter adjustment range, instruction effective time, and instruction hold time are combined to form the linkage compensation control instruction, which is then sorted according to the instruction effective time and deviation level and sent to the execution feedback module.

10. The closed-loop control system for the high-precision circuit board etching process according to claim 9, characterized in that, The process by which the execution feedback module updates the region etching capability component and the execution action response component specifically includes: The etching response information after executing the linkage compensation control command is obtained. The etching response information includes copper thickness detection information after etching, board surface image detection information, line width detection information, etching solution temperature feedback information, etching solution concentration feedback information, spray pressure feedback information, spray flow rate feedback information, and conveying speed feedback information. Based on the control coordinate system, the etching response information is associated with the corresponding etching region in the etching region set to obtain the actual etching result of each etching region. The actual etching result is then compared with the target copper thickness information and the target linewidth range to determine the actual etching result status. The regional etching capability component of the corresponding etching region is updated according to the actual etching change in the actual etching result. Based on the execution area number and linkage compensation control command corresponding to the etched area, determine the actual response effect of the execution area to the etched area, and update the execution action response component of the corresponding execution area; The updated regional etching capability component and execution response component are written into the corresponding regional number and execution regional number, and sent to the load feature construction module, deviation prediction module and linkage compensation control module for regional etching deviation prediction and linkage compensation control in the next control cycle.

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