A glue-filling and pressing device for production of a circuit board and a production process thereof

Abstract

This invention relates to the field of circuit board processing technology, and more particularly to a potting and pressing equipment and process for circuit board production. The equipment includes: a control console and a transmission device for transporting circuit boards. A potting device is disposed above the control console, used to pot the circuit boards on the transmission device. A pressing device is fixedly connected to the control console, comprising a telescopic column and a pressure plate. The pressure plate is fixedly connected to the bottom end of the telescopic column and is horizontally positioned for pressing the adhesive layer on the circuit board. A rolling assembly is disposed on the side of the telescopic column, comprising a fixed frame, two connecting rods, and two pressure rollers. The fixed frame is vertically fixedly connected to the fixed end side of the telescopic column, the two connecting rods are rotatably fixedly connected to the ends of the fixed frame, and the two pressure rollers are rotatably connected to the ends of the two connecting rods respectively. This invention pushes the adhesive layer from the edge to the center, forcibly expelling air bubbles and quickly leveling the surface.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to a potting and pressing equipment and production process for circuit board production. Background Technology

[0002] In the mass production of circuit boards, potting and pressing are core processes to ensure the insulation, sealing, and structural strength of the circuit boards. Potting is used to apply potting compound to the gaps between circuit lines, the gaps between component pins, and the surface of the board to achieve insulation, moisture protection, dust protection, and vibration and shock resistance. Pressing is used to evenly compact the glue layer, remove air bubbles, and make the circuit board fit tightly with the substrate and protective layer to ensure stable electrical connection and structural integrity.

[0003] Patent CN118591109A discloses a circuit board potting and pressing device, including a base frame, a cylinder at the upper end of the base frame, an auxiliary plate fixedly connected to the output end of the cylinder, a pressure plate fixedly connected to the bottom of the auxiliary plate, a worktable below the pressure plate and fixedly connected to the base frame, and also includes a drive connection mechanism, a moving scraping mechanism, a guiding collection mechanism and a synchronous cleaning mechanism. The moving scraping mechanism can move in advance to scrape off excess glue on the circuit board before the pressure plate presses it, avoiding the presence of excess glue covering or penetrating the electrical connection parts, which could lead to a decrease in electrical performance or a short circuit.

[0004] Existing glue-dispensing devices require a period of time to allow the glue to self-level and naturally expel surface micro-bubbles after dispensing in order to remove internal air bubbles. However, this process wastes a lot of time and reduces the efficiency of glue dispensing and pressing. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art by proposing a potting and pressing equipment and production process for circuit board production.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A potting and pressing device for circuit board production includes: a control console and a transmission device for transporting circuit boards. A potting device is disposed above the control console and is used to pot the circuit boards on the transmission device. A pressing device is fixedly connected to the control console. The pressing device includes a telescopic column and a pressure plate. The pressure plate is fixedly connected to the bottom end of the telescopic column and is set horizontally for squeezing the adhesive layer on the circuit board. The telescopic column is provided with a rolling assembly on its side. The rolling assembly includes a fixed frame, two connecting rods and two pressure rollers. The fixed frame is vertically fixed to the fixed end side of the telescopic column. The two connecting rods are rotatably fixed to the ends of the fixed frame. The two pressure rollers are rotatably connected to the ends of the two connecting rods respectively.

[0007] Preferably, the dispensing device includes a mounting frame, a glue container, a detection module, and a glue guide tube. The mounting frame is fixedly mounted on the control console, the glue container is fixedly connected to the mounting frame, the glue guide tube is fixedly connected to the bottom of the glue container, and the detection module is fixedly mounted below the mounting frame and above the transmission device.

[0008] Preferably, the transmission device includes a transmission frame, a transmission belt, and multiple limiting blocks. The transmission frame is fixedly connected to the control console, the transmission belt is disposed inside the transmission frame and is used to drive the circuit board to move, and the multiple limiting blocks are fixedly connected at equal intervals to the sides of the transmission frame and are used to limit the circuit board on the transmission belt.

[0009] Preferably, the pressing device further includes a side frame and a sliding frame, the side frame being fixedly connected to the side of the control console, the sliding frame being fixedly connected to the upper end of the control console, and the telescopic column being fixedly connected below the sliding end of the sliding frame.

[0010] Preferably, the connecting rod includes a rotating ring, a spring rod, and a connecting ring. The connecting ring is rotatably connected to the fixed frame and rotatably connected to the middle of the pressure roller. The spring rod is fixedly connected between the rotating ring and the connecting ring.

[0011] Preferably, a cleaning component is provided on the side of the connecting ring, and the cleaning component is used to scrape and clean the upper surface of the pressure plate.

[0012] Preferably, the cleaning component includes an elastic block and a scraper. The elastic block is fixedly connected to the side of the connecting ring near the telescopic column, and the scraper is fixedly connected to one end of the elastic block, with its end inclined toward the bottom of the telescopic column.

[0013] Preferably, two guide grooves are formed on the upper surface of the pressure plate. The guide grooves are inclined grooves, and the end near the telescopic column is lower than the other end. The two guide grooves form two inverted octagonal inclined grooves on the upper surface of the pressure plate.

[0014] Preferably, a collection groove is provided in the middle of the pressure plate, and the two sides of the collection groove are connected to the bottom of two guide grooves. The collection groove is used to collect glue.

[0015] A potting and laminating process for circuit board production includes the following steps: S1: Equipment Pre-adjustment Start the control console, set the transmission speed, dispensing volume, pressing pressure, and rolling elastic force parameters, and complete the linkage calibration of the transmission device, dispensing device, pressing device, and rolling assembly to ensure that the timing of each mechanism's actions is synchronized. S2: Circuit board loading and positioning conveyor The circuit board to be processed is placed on the transmission belt of the transmission device. The limiting block limits and positions the circuit board laterally. The transmission belt conveys the circuit board to the glue-filling station and the pressing station at a uniform speed. S3: Precision positioning and dispensing When the circuit board moves to the glue dispensing station, the detection module identifies the circuit board's arrival signal and controls the glue can to dispense a quantitative amount of glue to the designated area of ​​the circuit board through the glue guide tube. After the glue dispensing is completed, the glue dispensing stops immediately to avoid dripping and flying glue. S4: Synchronous rolling degassing and leveling After the glue is applied, the circuit board is conveyed to the lamination station. The sliding frame moves the telescopic column and the pressure plate to the processing position. When the sliding frame moves down, the pressure plate contacts the glue layer first and slightly presses against the top of the glue layer. Controlling the sliding frame to move down controls the telescopic column to retract, which causes the fixed frame fixed to the fixed part of the telescopic column to move down relative to the pressure plate. This causes the two pressure rollers to roll on the upper surface of the pressure plate, pushing the glue layer from the edge to the middle, forcibly expelling air bubbles and quickly leveling it. The two pressure rollers roll symmetrically. S5: Constant temperature and pressure pressing and curing After the rolling is completed, the pressure plate continues to descend with the telescopic column to uniformly compact the adhesive layer with the set pressure, and maintain the preset pressing time to ensure that the adhesive layer is fully bonded to the circuit board without gaps or delamination. S6: Pressure plate reset and automatic cleaning After pressing is completed, the telescopic column and sliding frame drive the pressure plate to rise and reset, and the rolling assembly is raised synchronously with the telescopic column; the scraper of the cleaning assembly is always in contact with the upper surface of the pressure plate under the action of the elastic block, and scrapes off the residual glue on the upper surface of the pressure plate as the pressure roller resets. S7: Excess Adhesive Direction Collection The excess glue and scraped-off residue on the upper surface of the pressure plate flow towards the center along the inverted octagonal guide groove, and are collected in the collection tank. The glue in the collection tank is periodically removed for recycling and reuse.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. Drive the two pressure rollers to roll on the upper surface of the pressure plate, push the adhesive layer from the edge to the middle, force out air bubbles, and quickly level it. The two pressure rollers roll symmetrically, so that the adhesive layer is evenly stressed and does not accumulate on one side, ensuring that the adhesive surface is uniform. 2. The glue dispensing device ensures stable pressure storage, stable dispensing pressure, and uniform flow rate; the detection module accurately identifies the circuit board position, realizing quantitative, positional, and timed glue dispensing, resulting in high consistency of glue layer thickness. 3. The elastic block ensures that the scraper is always in close contact with the upper surface of the pressure plate, without gaps or missed scraping. During the pressure roller reset process, the scraper moves synchronously with the pressure roller. As soon as the pressure plate is raised, it scrapes and cleans in real time without manual intervention, automatically completing the cleaning and increasing the continuous running time of the equipment. 4. The inverted octagonal guide channel guides the residual glue to flow towards the center, preventing it from spreading to the surrounding areas. At the same time, two scrapers follow the guide channel to collect the overflow glue into the collection tank. The collection tank centrally collects the overflow glue, which can be recycled and reused regularly, saving raw materials. The directional collection of overflow glue keeps the workshop environment clean and meets environmental protection production requirements. Attached Figure Description

[0017] Figure 1 This is a front structural diagram of a potting and pressing equipment for circuit board production proposed in this invention. Figure 2 This is a schematic diagram of the back structure of a potting and pressing device for circuit board production proposed in this invention. Figure 3 This is a schematic diagram of the glue-filling device structure of a glue-filling and pressing equipment for circuit board production proposed in this invention. Figure 4 This is a front view of the transmission device of a glue-filling and pressing equipment for circuit board production proposed in this invention. Figure 5 This is a front view of the pressing device of the glue-filling pressing equipment for circuit board production proposed in this invention. Figure 6 This is a schematic diagram of the pressure plate structure of a glue-filling and pressing equipment for circuit board production proposed in this invention; Figure 7 This is a cross-sectional view of the pressing device of a glue-filling pressing equipment for circuit board production proposed in this invention. Figure 8 This is a schematic diagram of the front structure of the rolling assembly of a potting and pressing equipment for circuit board production proposed in this invention. Figure 9 This is a schematic diagram of the rolled assembly structure of a potting and pressing equipment for circuit board production proposed in this invention.

[0018] In the diagram: 1. Control console; 2. Transmission device; 21. Transmission frame; 22. Transmission belt; 23. Limiting block; 3. Glue dispensing device; 31. Mounting frame; 32. Glue can; 33. Detection module; 34. Glue guide tube; 4. Pressing device; 41. Telescopic column; 42. Pressure plate; 43. Side frame; 44. Sliding frame; 5. Rolling assembly; 51. Fixed frame; 52. Connecting rod; 521. Rotating ring; 522. Spring rod; 523. Connecting ring; 53. Pressure roller; 6. Cleaning assembly; 61. Elastic block; 62. Scraper; 7. Guide groove; 8. Collection groove. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] The terms used in this invention, such as "upper," "lower," "left," "right," "middle," and "one," are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0021] Reference Figures 1-9 A potting and pressing device for circuit board production includes: a control console 1 and a transmission device 2 for transporting circuit boards. A potting device 3 is provided above the control console 1, and the potting device 3 is used to pot the circuit boards on the transmission device 2. A pressing device 4 is fixedly connected to the control console 1. The pressing device 4 includes a telescopic column 41 and a pressure plate 42. The pressure plate 42 is fixedly connected to the bottom end of the telescopic column 41 and is set horizontally for squeezing the adhesive layer on the circuit board. The telescopic column 41 is provided with a rolling assembly 5 on its side. The rolling assembly 5 includes a fixed frame 51, two connecting rods 52 and two pressure rollers 53. The fixed frame 51 is vertically fixedly connected to the fixed end side of the telescopic column 41. The two connecting rods 52 are rotatably fixedly connected to the ends of the fixed frame 51. The two pressure rollers 53 are rotatably connected to the ends of the two connecting rods 52 respectively.

[0022] In the embodiments of the above technical solutions, the existing equipment has no centralized control unit, the dispensing, transmission and pressing actions are scattered, there is no unified installation standard for each mechanism, the assembly accuracy is low and the running vibration is large, which affects the dispensing and pressing accuracy. The control console 1 serves as the integrated mounting base for the entire machine, ensuring the coaxiality, parallelism, and positional accuracy of each component. It enables precise timing and linkage control of dispensing, transmission, pressing, and rolling, avoiding action conflicts. It also optimizes the spatial layout, reduces vibration, and improves operational safety and ease of maintenance.

[0023] In traditional processes, the glue must be left to stand after potting and self-leveling to remove bubbles, which is extremely inefficient. If the bubbles are directly pressed by the pressure plate 42, they will be sealed inside and cannot be discharged. Rigid rolling will damage the circuit board and components. The fixed frame 51 is rigidly fixed to the fixed end of the telescopic column 41, and rises and falls synchronously with the sliding frame 44, but does not move up and down with the pressure plate 42, ensuring that the pressure roller 53 is always on both sides of the pressure plate 42.

[0024] Spring rod 522 provides elastic preload, ensuring that pressure roller 53 always fits against pressure plate 42 without hard pressure or impact.

[0025] When the sliding frame 44 moves down, the pressure plate 42 first contacts the adhesive layer and slightly presses against the top of the adhesive layer. Controlling the downward movement of the sliding frame 44 and controlling the retraction of the telescopic rod will cause the fixing frame 51 fixed to the fixed part of the telescopic rod to move down relative to the pressure plate 42, thereby driving the two pressure rollers 53 to roll on the upper surface of the pressure plate 42, pushing the adhesive layer from the edge to the middle, forcibly expelling air bubbles and quickly leveling it. The symmetrical rolling of the two pressure rollers 53 ensures that the adhesive layer is subjected to balanced force and does not accumulate on one side, thus ensuring a uniform adhesive surface.

[0026] The preferred technical solution in this embodiment is: Reference Figure 3 The glue dispensing device 3 includes a mounting frame 31, a glue tank 32, a detection module 33, and a glue guide tube 34. The mounting frame 31 is fixedly mounted on the control console 1, the glue tank 32 is fixedly connected to the mounting frame 31, the glue guide tube 34 is fixedly connected to the bottom of the glue tank 32, and the detection module 33 is fixedly mounted below the mounting frame 31 and above the transmission device 2. When the glue dispensing device 3 is used for manual or rough glue dispensing, the glue dispensing amount is uncontrollable. At the same time, there is no position detection. Glue is dispensed before the board arrives or after the board has passed, resulting in glue waste and pollution. Mounting bracket 31 is fixed above control console 1, keeping the height and angle of glue tank 32 and glue guide tube 34 fixed to ensure the glue dispensing position remains unchanged. Glue tank 32 is used to store potting glue, maintaining constant internal pressure to allow the glue to flow out at a stable flow rate. Detection module 33 identifies in real time whether the circuit board has reached the glue dispensing position. If a board is present, glue dispensing is triggered; if no board is present, glue dispensing stops. Glue guide tube 34 guides the glue to the designated area on the circuit board for precise dispensing, avoiding glue splashing and dripping, achieving quantitative and targeted glue dispensing.

[0027] The glue dispensing device 3 ensures stable pressure storage, stable dispensing pressure, and uniform flow rate; the detection module 33 accurately identifies the circuit board position, realizing quantitative, positional, and timed glue dispensing, and ensuring high consistency in glue layer thickness.

[0028] Reference Figure 4 The transmission device 2 includes a transmission frame 21, a transmission belt 22 and multiple limiting blocks 23. The transmission frame 21 is fixedly connected to the control console 1. The transmission belt 22 is disposed inside the transmission frame 21 and is used to drive the circuit board to move. The multiple limiting blocks 23 are fixedly connected at equal intervals to the side of the transmission frame 21 and are used to limit the circuit board on the transmission belt 22. During the circuit board transportation process, the circuit boards deviate, shift, and tilt, and the glue-filling position is misaligned with the pressing position; there is no positioning structure, the positioning of circuit boards in different batches is inconsistent, and the glue layer thickness fluctuates greatly; the transmission belt 22 slips and the speed is unstable, the glue-filling and pressing residence time is inconsistent, and the process stability is poor.

[0029] The transmission frame 21 provides rigid support and fixes the transmission belt 22 pulley set, ensuring that the transmission belt 22 runs straight and without shaking. The transmission belt 22 is driven by a motor to rotate at a constant speed, conveying the circuit board from the feeding end to the glue dispensing station, the pressing station, and the discharge end in sequence, realizing continuous assembly line operation. The limiting blocks 23, which are evenly distributed on both sides of the transmission belt 22, laterally limit the edge of the circuit board, restricting the left and right displacement of the circuit board and ensuring that the position of the circuit board entering the station is completely consistent each time.

[0030] Reference Figure 5 The pressing device 4 also includes a side frame 43 and a sliding frame 44. The side frame 43 is fixedly connected to the side of the control console 1, the sliding frame 44 is fixedly connected to the upper end of the control console 1, and the telescopic column 41 is fixedly connected to the lower end of the sliding frame 44. When the telescopic column 41 receives a control signal, it performs a vertical lifting action. When it descends, it provides stable pressure, and when it rises, it resets and provides power for pressing. The pressure plate 42 is horizontally fixed at the bottom of the telescopic column 41 and presses down synchronously with the telescopic column 41, applying pressure evenly over a large area to compact the adhesive layer and expel residual gas inside, so that the circuit board and the adhesive layer are tightly bonded. The sliding frame 44 drives the telescopic column 41 and the pressure plate 42 to adjust their vertical positions, which is used to change the position of the rolling device.

[0031] During the pressing process, the sliding frame 44 first moves the pressure plate 42 above the adhesive layer. Then, by moving the sliding frame 44 downward and the telescopic column 41 retracting, the rolling assembly 5 comes into contact with the pressure plate 42, thus achieving rolling from the center to both sides.

[0032] Reference Figure 6 The connecting rod 52 includes a rotating ring 521, a spring rod 522 and a connecting ring 523. The connecting ring 523 is rotatably connected to the fixed frame 51 and rotatably connected to the middle of the pressure roller 53. The spring rod 522 is fixedly connected between the rotating ring 521 and the connecting ring 523. Reference Figure 8 The connecting ring 523 is provided with a cleaning component 6 on its side, and the cleaning component 6 is used to scrape and clean the upper surface of the pressure plate 42; The cleaning component 6 includes an elastic block 61 and a scraper 62. The elastic block 61 is fixedly connected to the side of the connecting ring 523 near the telescopic column 41, and the scraper 62 is fixedly connected to one end of the elastic block 61, with its end inclined toward the bottom of the telescopic column 41.

[0033] When the pressure plate 42 moves down, excess glue will overflow from both sides of the pressure plate 42 and adhere to the upper surface of the pressure plate 42; if the glue is not cleaned in time, it will be difficult to clean after the glue has cured.

[0034] The elastic block 61 ensures that the scraper 62 is always in close contact with the upper surface of the pressure plate 42, without gaps or missed scraping. During the reset process of the pressure roller 53, the scraper 62 moves synchronously with the pressure roller 53. The pressure plate 42 scrapes and cleans in real time as soon as it rises, without the need for manual intervention. The cleaning is completed automatically, which increases the continuous running time of the equipment.

[0035] Reference Figure 7 The upper surface of the pressure plate 42 has two guide grooves 7. The guide grooves 7 are inclined grooves, and one end near the telescopic column 41 is lower than the other end. The two guide grooves 7 form two inverted octagonal inclined grooves on the upper surface of the pressure plate 42. The pressure plate 42 has a collection groove 8 in the middle, and the two sides of the collection groove 8 are connected to the bottom of the two guide grooves 7. The collection groove 8 is used to collect glue.

[0036] When there is too much glue, due to the squeezing action of the pressure plate 42, the overflow glue flows out disorderly and solidifies on the equipment, making it difficult to clean. The overflow glue cannot be recycled, resulting in a large waste of raw materials. Moreover, the residual glue accumulates everywhere, affecting the transmission and pressing accuracy and causing malfunctions. The residual glue is guided to flow towards the center by the inverted octagonal guide groove 7, preventing it from spreading to the surrounding areas. At the same time, two scrapers 62 follow the guide groove 7 to collect the overflow glue into the collection tank 8. The collection tank 8 collects the overflow glue in a centralized manner, which can be recycled and reused regularly, saving raw materials. The overflow glue is collected in a directional manner, and the workshop environment is clean and meets the requirements of environmentally friendly production.

[0037] A potting and laminating process for circuit board production includes the following steps: S1: Equipment Pre-adjustment Start console 1, set transmission speed, dispensing volume, pressing pressure, and rolling elastic force parameters, and complete the linkage calibration of transmission device 2, dispensing device 3, pressing device 4, and rolling assembly 5 to ensure that the timing of each mechanism's actions is synchronized. S2: Circuit board loading and positioning conveyor The circuit board to be processed is placed on the transmission belt 22 of the transmission device 2. The limiting block 23 performs lateral limiting and positioning of the circuit board. The transmission belt 22 conveys the circuit board to the glue-filling station and the pressing station at a uniform speed. S3: Precision positioning and dispensing When the circuit board moves to the glue dispensing station, the detection module 33 identifies the circuit board arrival signal and controls the glue tank 32 to dispense a quantitative amount of glue to the designated area of ​​the circuit board through the glue guide tube 34. After the glue dispensing is completed, the glue dispensing stops immediately to avoid dripping and flying glue. S4: Synchronous rolling degassing and leveling After the glue is applied, the circuit board is transported to the lamination station. The sliding frame 44 moves the telescopic column 41 and the pressure plate 42 to the processing position. When the sliding frame 44 moves down, the pressure plate 42 contacts the glue layer first and slightly presses against the top of the glue layer. Controlling the sliding frame 44 to move down and controlling the telescopic column 41 to retract will cause the fixing frame 51 fixed to the fixed part of the telescopic column 41 to move down relative to the pressure plate 42, thereby driving the two pressure rollers 53 to roll on the upper surface of the pressure plate 42, pushing the glue layer from the edge to the middle, forcibly expelling air bubbles and quickly leveling it. The two pressure rollers 53 roll symmetrically. S5: Constant temperature and pressure pressing and curing After the rolling is completed, the pressure plate 42 continues to descend with the telescopic column 41 to uniformly compact the adhesive layer with the set pressure and maintain the preset pressing time so that the adhesive layer is fully bonded to the circuit board without gaps or delamination. S6: Pressure plate 42 reset and automatic cleaning After pressing is completed, the telescopic column 41 and the sliding frame 44 drive the pressure plate 42 to rise and reset, and the rolling assembly 5 is lifted synchronously with the telescopic column 41; the scraper 62 of the cleaning assembly 6 is always in contact with the upper surface of the pressure plate 42 under the action of the elastic block 61, and scrapes and cleans the residual glue on the upper surface of the pressure plate 42 as the pressure roller 53 resets. S7: Excess Adhesive Direction Collection The excess glue and scraped-off residue on the upper surface of the pressure plate 42 flow towards the center along the inverted octagonal guide groove 7 and are collected in the collection tank 8. The glue in the collection tank 8 is periodically removed for recycling and reuse.

[0038] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A glue-filling and pressing apparatus for a production of a wiring board, comprising: A control console and a transmission device for transporting circuit boards, characterized in that a glue-pouring device is provided above the control console, the glue-pouring device being used to apply glue to the circuit boards on the transmission device; A pressing device is fixedly connected to the control console. The pressing device includes a telescopic column and a pressure plate. The pressure plate is fixedly connected to the bottom end of the telescopic column and is set horizontally for squeezing the adhesive layer on the circuit board. The telescopic column is provided with a rolling assembly on its side. The rolling assembly includes a fixed frame, two connecting rods and two pressure rollers. The fixed frame is vertically fixed to the fixed end side of the telescopic column. The two connecting rods are rotatably fixed to the ends of the fixed frame. The two pressure rollers are rotatably connected to the ends of the two connecting rods respectively.

2. The glue filling and pressing apparatus for manufacturing a circuit board according to claim 1, wherein The glue dispensing device includes a mounting frame, a glue container, a detection module, and a glue guide tube. The mounting frame is fixedly mounted on the control console, the glue container is fixedly connected to the mounting frame, the glue guide tube is fixedly connected to the bottom of the glue container, and the detection module is fixedly mounted below the mounting frame and above the transmission device.

3. The glue filling and pressing apparatus for manufacturing a circuit board according to claim 1, wherein The transmission device includes a transmission frame, a transmission belt, and multiple limiting blocks. The transmission frame is fixedly connected to the control console. The transmission belt is disposed inside the transmission frame and is used to drive the circuit board to move. The multiple limiting blocks are fixedly connected at equal intervals to the sides of the transmission frame and are used to limit the circuit board on the transmission belt.

4. The glue filling and pressing apparatus for manufacturing a circuit board according to claim 1, wherein The pressing device also includes a side frame and a sliding frame. The side frame is fixedly connected to the side of the control console, the sliding frame is fixedly connected to the upper end of the control console, and the telescopic column is fixedly connected to the lower sliding end of the sliding frame.

5. The glue filling and pressing apparatus for manufacturing a circuit board according to claim 1, wherein The connecting rod includes a rotating ring, a spring rod, and a connecting ring. The connecting ring is rotatably connected to the fixed frame and rotatably connected to the middle of the pressure roller. The spring rod is fixedly connected between the rotating ring and the connecting ring.

6. The glue filling and pressing apparatus for manufacturing a circuit board according to claim 5, wherein A cleaning component is provided on the side of the connecting ring, which is used to scrape and clean the upper surface of the pressure plate.

7. The glue filling and pressing apparatus for manufacturing a circuit board according to claim 6, wherein The cleaning assembly includes an elastic block and a scraper. The elastic block is fixedly connected to the side of the connecting ring near the telescopic column, and the scraper is fixedly connected to one end of the elastic block, with its end inclined towards the bottom of the telescopic column.

8. The glue filling and pressing apparatus for manufacturing a circuit board according to claim 7, wherein Two guide grooves are formed on the upper surface of the pressure plate. The guide grooves are inclined grooves, and the end near the telescopic column is lower than the other end. The two guide grooves form two inverted octagonal inclined grooves on the upper surface of the pressure plate.

9. The glue filling and pressing apparatus for manufacturing a circuit board according to claim 8, wherein The pressure plate has a collection groove in the middle, and the two sides of the collection groove are connected to the bottom of two guide grooves. The collection groove is used to collect glue.

10. A glue-filling and press-bonding production process for a circuit board production, characterized by, Using the potting and pressing equipment according to any one of claims 1-9, the process includes the following steps: S1: Equipment Pre-adjustment Start the control console, set the transmission speed, dispensing volume, pressing pressure, and rolling elastic force parameters, and complete the linkage calibration of the transmission device, dispensing device, pressing device, and rolling assembly to ensure that the timing of each mechanism's actions is synchronized. S2: Circuit board loading and positioning conveyor The circuit board to be processed is placed on the transmission belt of the transmission device. The limiting block limits and positions the circuit board laterally. The transmission belt conveys the circuit board to the glue-filling station and the pressing station at a uniform speed. S3: Precision positioning and dispensing When the circuit board moves to the glue dispensing station, the detection module identifies the circuit board's arrival signal and controls the glue can to dispense a quantitative amount of glue to the designated area of ​​the circuit board through the glue guide tube. After the glue dispensing is completed, the glue dispensing stops immediately to avoid dripping and flying glue. S4: Synchronous rolling degassing and leveling After the glue is applied, the circuit board is conveyed to the lamination station. The sliding frame moves the telescopic column and the pressure plate to the processing position. When the sliding frame moves down, the pressure plate contacts the glue layer first and slightly presses against the top of the glue layer. Controlling the sliding frame to move down controls the telescopic column to retract, which causes the fixed frame fixed to the fixed part of the telescopic column to move down relative to the pressure plate. This causes the two pressure rollers to roll on the upper surface of the pressure plate, pushing the glue layer from the edge to the middle, forcibly expelling air bubbles and quickly leveling it. The two pressure rollers roll symmetrically. S5: Constant temperature and pressure pressing and curing After the rolling is completed, the pressure plate continues to descend with the telescopic column to uniformly compact the adhesive layer with the set pressure, and maintain the preset pressing time to ensure that the adhesive layer is fully bonded to the circuit board without gaps or delamination. S6: Pressure plate reset and automatic cleaning After pressing is completed, the telescopic column and sliding frame drive the pressure plate to rise and reset, and the rolling assembly is raised synchronously with the telescopic column; the scraper of the cleaning assembly is always in contact with the upper surface of the pressure plate under the action of the elastic block, and scrapes off the residual glue on the upper surface of the pressure plate as the pressure roller resets. S7: Excess Adhesive Direction Collection The excess glue and scraped-off residue on the upper surface of the pressure plate flow towards the center along the inverted octagonal guide groove and are collected in the collection tank. The glue in the collection tank is periodically removed for recycling.

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