Smart film removing device and method for PCB thin substrate

Abstract

The present application relates to PCB film removal processing technical field, especially to a kind of intelligent film removal device and method for PCB thin substrate, the device includes knurling mechanism, peeling mechanism, acquisition module, adjustment module, calibration module, early warning module and adjustment module.The present application is distinguished by the ratio of knurling peak and valley between film and thin substrate after first knurling by increasing secondary knurling, and the wear state of knurling wheel, and is used as the basis for adjusting the parameters of secondary knurling, increasing the remedial measures for insufficient knurling caused by different reasons, and calibrating the preset peeling parameters by identifying the degree of loosening and the degree of film firmness between film and thin substrate after two knurling, so that the stress of film and thin substrate during peeling process is always in balance, effectively solving the problem of high scrap rate caused by uneven stress of thin substrate and plate rolling and carding due to the mismatch between film removal force and adhesion force caused by lack of sensing means in prior art.

Description

Technical Field

[0001] This invention relates to the field of PCB board film removal technology, and in particular to an intelligent film removal device and method for thin PCB substrates. Background Technology

[0002] Mylar film removal technology for thin PCB substrates refers to the process of completely peeling off the Mylar protective film adhered to the surface of a thin substrate during the PCB manufacturing process. It is mainly used to remove the protective Mylar film after etching or pattern transfer on the PCB. The Mylar protective film, also known as a thin film, is currently removed using two common techniques: direct adhesive roller removal and mechanical peeling after knurling. However, when dealing with thin substrates that are weak and easily deformed, such as 0.1mm-thickness substrates, the adhesion between the substrate and the film fluctuates within the same batch. Since thin substrates are extremely sensitive to mechanical stress, excessive force during removal can easily cause board rolling or jamming. This results in unstable peeling forces required for both removal methods. Existing equipment typically operates with fixed parameters, making it difficult to match the optimal peeling force in real time. This can easily lead to film residue or substrate damage, resulting in a high overall scrap rate and making it difficult to meet high-yield production requirements.

[0003] Chinese Patent Application Publication No. CN114291377A discloses a film-tearing machine and a film-tearing method, comprising: a conveyor roller, a bubbling device and a film-tearing device arranged sequentially on the conveyor roller. The bubbling device includes a front pressure roller mechanism, a bubbling mechanism and a front baffle mechanism. The front pressure roller mechanism is located above the conveyor roller and is used to press down on the upper surface of the sheet material. The bubbling mechanism includes several pairs of bubbling rollers arranged above and below to make the upper and lower films of the sheet material bubble. The front baffle mechanism includes a pair of baffles that can open and close up and down. The film-tearing device includes a film-sheet separation mechanism, a film-adhesive mechanism, a rear pressure roller mechanism and a rear baffle mechanism. The film-sheet separation mechanism includes several pairs of grippers arranged above and below to clamp the upper and lower films of the sheet material and a first linear motor module that drives the grippers to move along the length direction of the conveyor roller. The film-adhesive mechanism includes a pressing assembly arranged above and below to press the tape onto the upper and lower films of the sheet material. The rear pressure roller mechanism is located above the conveyor roller and is used to press down on the upper surface of the sheet material. The rear baffle mechanism also includes a pair of baffles that can open and close up and down.

[0004] Therefore, the existing technology has the following problems: 1. It cannot obtain the actual bonding state between the film and the substrate after knurling or bubbling, so the subsequent film removal forces such as pressure roller pressure, bubbling roller pressure, and clamping pull force are all applied according to a fixed sequence and fixed parameters, and cannot be adjusted specifically. Therefore, when processing fragile thin substrates, it is easy to damage the thin substrates. 2. It lacks the perception of the adhesive force between the film and the thin substrate. When the adhesive force between the film and the thin substrate fluctuates due to the previous process, it cannot adaptively adjust the film removal force according to the current adhesive force, which can easily cause film tearing residue or hard pulling, thus damaging the thin substrate. 3. It is an open-loop hard-resistance film removal device, which cannot perceive the degree of interface loosening, nor can it dynamically adjust the film removal force according to the fluctuation of adhesive force, nor can it make pre-adjustments for the periodic change trend of the thin substrate. This leads to the coupling of problems such as plate rolling, plate clamping, and film residue, making it difficult to meet the requirements of high-yield production of thin substrates. Summary of the Invention

[0005] To address this, the present invention provides an intelligent film removal device and method for PCB thin substrates, which overcomes the problems in the prior art where the lack of sensing means leads to mismatch between film removal force and adhesion force, uneven stress on the thin substrate causing board rolling and jamming, resulting in a high scrap rate. This is achieved by sensing the looseness state of the film and the thin substrate online and adaptively adjusting the film removal force.

[0006] To achieve the above objectives, in one aspect, the present invention provides an intelligent film removal device for thin PCB substrates, comprising: The knurling mechanism includes a first knurling assembly symmetrically distributed for performing a first knurling of a thin film on a thin substrate based on a preset knurling pressure, a second knurling assembly symmetrically distributed for performing a second knurling of the film based on a second knurling pressure, and a pre-blowing assembly for performing a test blow on the film after the first knurling. The peeling mechanism includes symmetrically distributed guide templates for peeling off the film based on preset peeling parameters; The acquisition module is used to acquire the surface roughness, surface height peak-to-valley difference, and residual indentation depth formed after knurling, the response amplitude of the film during test blowing, and the peeling resistance during peeling. The adjustment module is used to adjust the secondary knurling pressure based on the knurling peak-to-valley ratio, response amplitude, preset net film amplitude, and preset knurling pressure after the first knurling. The knurling peak-to-valley ratio is determined based on the surface roughness and surface height peak-to-valley difference after the first knurling. The calibration module is used to calibrate preset peeling parameters based on film looseness and film unit strength. Film looseness is determined based on surface roughness and response amplitude after primary and secondary knurling, and film unit strength is determined based on residual indentation depth after secondary knurling, preset knurling pressure, and secondary knurling pressure. The early warning module is used to determine the alarm type based on the resistance change rate and to trigger an alarm, wherein the resistance change rate is determined based on the stripping resistance. The adjustment module is used to adjust the preset net film amplitude based on the secondary knurling pressure, film loosening degree, alarm type and alarm frequency adjusted within the adjustment cycle.

[0007] Furthermore, the adjustment module includes: The knurling stability determination unit is used to determine the knurling peak-to-valley ratio based on the ratio of the surface height peak-to-valley difference to the surface roughness after one knurling operation. The knurling determination unit is used to determine the knurling pattern of a single knurling based on the comparison result of the knurling peak-to-valley ratio and the preset peak-to-valley threshold. The knurling pattern includes uniform and local wrinkles. The test blow adjustment unit is used to adjust the secondary knurling pressure and secondary knurling speed based on the knurling pattern, response amplitude, preset clean film amplitude, and preset knurling pressure.

[0008] Furthermore, the test-blowing adjustment unit includes: The first test blow determination subunit is used to determine whether there is a complete loosening or adhesion abnormality based on the uniform knurling pattern and the comparison result of the response amplitude and the preset amplitude window, so as to adjust the secondary knurling pressure or secondary knurling speed. The preset amplitude window is determined based on the preset net film amplitude. The second test blow determination subunit is used to determine whether there is abnormal wear of the knurling assembly based on the knurling pattern of local wrinkles and the comparison result of the response amplitude and the preset amplitude window, so as to adjust the secondary knurling pressure.

[0009] Furthermore, the calibration module includes: The looseness determination unit is used to determine the looseness of the film based on the surface roughness and response amplitude after the first knurling and the second knurling, the preset standard roughness and the preset net film amplitude; The membrane unit strength determination unit is used to determine the membrane unit strength based on the residual indentation depth after secondary knurling, the preset trough depth, the preset knurling pressure, and the secondary knurling pressure. The peel calibration unit is used to calibrate preset peel parameters based on film looseness and film unit strength. The preset peel parameters include jet pressure and substrate transport speed.

[0010] Furthermore, the looseness determination unit includes: The loosening reference determination subunit is used to determine the loosening reference value based on the ratio of the response amplitude to the preset net film amplitude; The loosening increment determination subunit is used to determine the loosening increment based on the ratio of the surface roughness increment to the preset standard roughness, wherein the surface roughness increment is determined based on the difference between the surface roughness after secondary knurling and the surface roughness after primary knurling. The loosening degree determination subunit is used to determine the loosening degree of the film based on the sum of the loosening reference value and the loosening degree increment.

[0011] Furthermore, the unit for determining the unit strength of the membrane includes: The compressibility determination subunit is used to determine the compressibility of the film based on the ratio of the residual indentation depth to the preset trough depth. The pressure increment determination subunit is used to determine the pressure increment ratio based on the ratio of the secondary knurling pressure to the preset knurling pressure. The membrane unit strength determination subunit is used to determine the membrane unit strength based on the ratio of pressure increment ratio and membrane compressibility.

[0012] Furthermore, the stripping calibration unit includes: The peeling speed calibration subunit is used to calibrate the thin substrate transfer speed based on the speed adjustment step size, wherein the speed adjustment step size is proportional to the film looseness. The jet pressure calibration subunit is used to calibrate the jet pressure based on the final pressure step, wherein the final pressure step is determined based on the product of the reference pressure step and the blowing limit ratio, the blowing limit ratio is determined based on the unit strength of the membrane, and the reference pressure step is inversely proportional to the membrane looseness. The auxiliary peeling subunit is used to determine whether to activate ultrasonic-assisted peeling of the film based on the film looseness and the unit strength of the film.

[0013] Furthermore, the early warning module includes: The film abnormality early warning unit is used to determine whether a film tearing abnormality has occurred based on the comparison result between the resistance change rate and the preset drop threshold, so as to issue a film tearing abnormality alarm. The resistance change rate is determined based on the peeling resistance during the peeling process. The thin substrate abnormality early warning unit is used to determine whether there is an abnormal stress on the thin substrate based on the comparison between the average value of the resistance change rate during the peeling process and the preset gradual rise threshold, so as to trigger an alarm for abnormal stress on the thin substrate.

[0014] Furthermore, the adjustment modules include: The alarm anomaly determination unit is used to determine whether an alarm anomaly has occurred based on the comparison result between the total number of alarms within the adjustment period and the preset alarm threshold. The alarm adjustment unit is used to calibrate the preset net film amplitude based on the judgment result of the occurrence of alarm abnormality, according to the average value of the film looseness when the judgment result of the occurrence of adhesion abnormality and the average value of the pressure increment ratio when the judgment result of the occurrence of knurling component wear abnormality within the adjustment cycle.

[0015] On the other hand, the present invention provides an intelligent film removal method for thin PCB substrates, comprising: The surface roughness, surface height peak-to-valley difference, and residual indentation depth formed after knurling, the response amplitude of the film during test blowing, and the peeling resistance during peeling were obtained. The secondary knurling pressure is adjusted based on the knurling peak-to-valley ratio, response amplitude, preset net film amplitude, and preset knurling pressure after the first knurling. The knurling peak-to-valley ratio is determined based on the surface roughness and surface height peak-to-valley difference after the first knurling. The preset peeling parameters are calibrated based on the film looseness and the unit strength of the film. The film looseness is determined based on the surface roughness and response amplitude after the first knurling and the second knurling. The unit strength of the film is determined based on the residual indentation depth after the second knurling, the preset knurling pressure and the second knurling pressure. The alarm type is determined based on the resistance change rate for alarm activation, wherein the resistance change rate is determined based on the stripping resistance. The preset net film amplitude is adjusted based on the secondary knurling pressure, film loosening degree, alarm type, and alarm frequency adjusted within the adjustment cycle.

[0016] Compared with the prior art, the beneficial effect of the present invention is that, since the response amplitude of the film after being excited by pulsed airflow can reflect the degree of interface loosening, but the low amplitude may be due to various reasons, and it is difficult to select the appropriate knurling force in advance for the fluctuating adhesive force between the film and the thin substrate during a single knurling, and it is also impossible to identify and remedy the state of incomplete knurling, so it is difficult to adapt to the fluctuating adhesive force by simply relying on the guide template, resulting in thin substrate roll-up, plate jamming, or film residue. Therefore, by adding a second knurling, the adhesive force state between the film and the thin substrate and the wear of the knurling wheel can be identified by the knurling peak-to-valley ratio after the first knurling. The system monitors the film's condition and uses this information as a basis for adjusting the parameters of the secondary knurling process. It provides remedial measures for insufficient knurling caused by various reasons. Simultaneously, by identifying the degree of loosening between the film and the substrate after the two knurling processes and the film's strength, the system calibrates the preset peeling parameters during the peeling process. This ensures that the stress on the film and substrate during peeling remains in a balanced state that matches the actual bonding state at the interface, reducing the probability of film breakage or substrate damage. This effectively solves the problems of high scrap rates in existing technologies due to a lack of sensing methods, resulting in mismatches between film removal force and adhesion force, uneven stress on the substrate leading to plate curling and jamming. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the intelligent film removal device for PCB thin substrates in this embodiment; Figure 2 This is an exploded view of the knurling mechanism in this embodiment; Figure 3 This is an example. Figure 2 Enlarged view of point A in the middle; Figure 4 This is an example. Figure 2 Enlarged view of point B in the middle; Figure 5 This is a cross-sectional view of the guide template in this embodiment; Figure 6 This is a system diagram of the intelligent film removal device for PCB thin substrates in this embodiment; Detailed Implementation

[0018] To make the objectives and advantages of the present invention clearer, the present invention will be further described below with reference to embodiments; it should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0019] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0020] This embodiment is mainly deployed on an automated Mylar protective film removal production line for PCB thin substrates. The thickness of the thin substrates produced by this production line is typically [0.05, 4] mm, with a copper width of only 0.5 mm. One side of the thin substrate is provided with a peeling area that does not contain any effective patterns and is equal to the width of the knurling wheel on the first knurling assembly. The peeling area is a non-porous area used to allow the first and second knurling assemblies to better knead the film. The length of the peeling area is [0, 5]% of the length of the thin substrate and is not greater than the distance between the first and second knurling assemblies.

[0021] Please see Figures 1-6 As shown, this embodiment provides an intelligent film removal device for thin PCB substrates, including a knurling mechanism 1, a peeling mechanism, an acquisition module, an adjustment module, a calibration module, an early warning module, and an adjustment module: The knurling mechanism 1 is mounted on a frame and includes a first knurling assembly 11, which is symmetrically distributed vertically to perform a first knurling on the film on both sides of the thin substrate based on a preset knurling pressure; a second knurling assembly 12, which is symmetrically distributed vertically to perform a second knurling on the film based on a second knurling pressure; and a pre-blowing assembly 13, which is symmetrically distributed vertically to perform a test blowing on the film after the first knurling.

[0022] The first knurling assembly 11 includes a first knurling wheel for knurling the film once by extrusion and rubbing the film at a preset rotation speed, and a first drive assembly for driving the corresponding knurling wheel to move toward the film and maintaining the extrusion pressure between the knurling wheel and the film based on a preset knurling pressure. The second knurling assembly 12 includes a second knurling wheel for knurling the film a second time by extrusion and a second rotation speed, and a second drive assembly for driving the corresponding knurling wheel to move toward the film and maintaining the extrusion pressure between the knurling wheel and the film based on the second knurling pressure.

[0023] In this embodiment, the preset knurling pressure is the normal extrusion force applied to the film by the first knurling component. This is used to ensure that the knurling wheel presses into the film to form an effective indentation and, in conjunction with rubbing, breaks the interface. Based on the pressure gradient experiment, the minimum pressure that prevents the residual indentation depth from causing the film to rupture is the lower limit, and the pressure that does not cause the film to rupture or the substrate to deform and is sufficient to separate the film from the thin substrate is the upper limit. The median of the range is used as the preset knurling pressure in this embodiment, reserving a symmetrical adjustment margin for the adaptive adjustment of the subsequent secondary knurling pressure.

[0024] The preset rotation speed is the rotation speed of the first knurling wheel, which is used to enhance the shearing and breaking effect on the film by the relative sliding between the film and the knurling wheel. Based on the speed gradient experiment, the minimum rotation speed that makes the response amplitude reach the preset net film amplitude is the lower limit of the value, and the rotation speed that does not cause film damage or equipment vibration is the upper limit of the value. The median of the value range is used as the value in this embodiment to reserve a symmetrical adjustment margin for the adaptive adjustment of the subsequent secondary knurling speed.

[0025] The peeling mechanism is mounted on the knurling mechanism 1 and includes guide templates 21 symmetrically distributed on the upper and lower sides for peeling the film based on preset peeling parameters and drive components 22 for clamping and pushing the thin substrate to move based on preset peeling parameters.

[0026] Please see Figure 6 As shown, this is a system diagram of the intelligent film removal device for PCB thin substrates in this embodiment. The acquisition module is set on the knurling mechanism 1. The acquisition module and its internal components are not shown in detail in the figure. It is used to acquire the surface roughness, surface height peak-valley difference and residual indentation depth formed after knurling, the response amplitude of the film during test blowing and the peeling resistance during peeling.

[0027] In this embodiment, the acquisition module includes a roughness acquisition unit, a peak-to-valley difference acquisition unit, a residual indentation acquisition unit, a response amplitude acquisition unit, and a peel resistance acquisition unit, wherein, The roughness acquisition unit is used to acquire the surface roughness of the knurled area based on a laser displacement meter.

[0028] The peak-valley difference acquisition unit is used to determine the surface height peak-valley difference by acquiring the sum of the highest profile peak height and the lowest profile valley depth in the knurled area based on the laser displacement meter.

[0029] The residual indentation acquisition unit is used to determine the residual indentation depth by obtaining the arithmetic mean of the depth values ​​of all contour valleys in the knurled area based on the laser displacement meter.

[0030] The response amplitude acquisition unit is used to determine the response amplitude by extracting the maximum vertical displacement of feature points on the surface of the knurled film in the knurled area using optical flow or edge tracking methods based on a high-speed vision camera during the test blowing process.

[0031] The peeling resistance acquisition unit is used to determine the peeling resistance based on the peeling force signal collected in real time by the force sensor during the continuous peeling process of the guide template.

[0032] An adjustment module, which is mounted on the frame and electrically connected to the acquisition module and the knurling mechanism 1, is used to adjust the secondary knurling pressure based on the knurling peak-to-valley ratio, response amplitude, preset net film amplitude, and preset knurling pressure, which characterize the uniformity of the film surface undulation after the first knurling. The knurling peak-to-valley ratio is determined based on the surface roughness and surface height peak-to-valley difference after the first knurling.

[0033] In this embodiment, the preset net film amplitude is the vertical displacement reference value generated by the film on a qualified thin substrate after standard knurling and excitation by test airflow. It is used to determine whether the degree of interface looseness is within the normal range. Based on the offline calibration experiment, the thin substrates with relatively uniform adhesion force that meets the production requirements and peeling resistance close to the median of the range specified for good products are selected as samples. The amplitude is determined based on the response amplitude of the thin substrate sample after one knurling under preset knurling pressure and preset rotation speed during test airflow. The minimum value of the response amplitude of these thin substrate samples, 7μm and the maximum value of 12μm, are taken as the lower limit and upper limit of the value range, and the median value of the response amplitude of these thin substrates, 10μm, is taken as the initial preset net film amplitude, which facilitates subsequent adjustment to both sides of the preset net film amplitude value range.

[0034] The calibration module, mounted on the frame and electrically connected to the acquisition module, adjustment module, and peeling mechanism, is used to calibrate preset peeling parameters based on the film loosening degree, which characterizes the degree of loosening between the film and the thin substrate after the second knurling, and the film unit strength, which characterizes the film's strength. The film loosening degree is determined based on the surface roughness and response amplitude after the first and second knurling, and the film unit strength is determined based on the residual indentation depth after the second knurling, the preset knurling pressure, and the second knurling pressure.

[0035] An early warning module, mounted on the frame and electrically connected to the acquisition module, is used to determine the alarm type and trigger an alarm based on the rate of change of resistance, which characterizes the sudden change trend of the tensile force during the peeling process of the film. The rate of change of resistance is determined based on the peeling resistance.

[0036] The adjustment module, which is mounted on the frame and electrically connected to the adjustment module, calibration module and early warning module, is used to adjust the preset net film amplitude based on the secondary knurling pressure, film loosening degree and alarm type and alarm number adjusted within the adjustment cycle.

[0037] In this embodiment, the adjustment module, calibration module, early warning module and adjustment module are all integrated into the edge computing system 3, and the early warning module includes an alarm indicator light 31 set on the rack.

[0038] In this embodiment, the adjustment cycle is a preset number of thin substrates produced continuously. The length of the adjustment cycle is determined by comprehensively considering production stability and response speed. It is based on the degree of cumulative drift of the temperature control of the hot pressing roller in the equipment maintenance record. When the 2000th piece is processed continuously, the standard deviation of the adhesion force fluctuation amplitude has exceeded ±15% of the process window. If the initial threshold is still used at this time, the judgment accuracy will decrease. In order to complete a threshold calibration when the adhesion force fluctuation reaches the critical point that affects the judgment accuracy, this embodiment takes 2000 thin substrates as the adjustment cycle.

[0039] Since the response amplitude of the thin film after being excited by pulsed airflow can reflect the degree of interfacial looseness, a low amplitude may be due to various reasons. Furthermore, it is difficult to select the appropriate knurling force in advance for the fluctuating adhesive force between the film and the thin substrate during a single knurling operation, and it is also impossible to identify and remedy incomplete knurling. This makes it difficult to adapt to fluctuating adhesive forces using only the guide template, resulting in thin substrate roll-up, jamming, or film residue. Therefore, by adding a secondary knurling step, the peak-to-valley ratio of the knurling after the first knurling step is used to identify the adhesive force state between the film and the thin substrate and the wear state of the knurling wheel, and this serves as an adjustment criterion. By adjusting the parameters of the secondary knurling process, remedial measures are provided for insufficient knurling caused by different reasons. At the same time, the preset peeling parameters during the peeling process are calibrated by identifying the degree of loosening between the film and the substrate and the film's firmness after the two knurling processes. This ensures that the stress on the film and the substrate during peeling is always in a balanced state that matches the actual bonding state at the interface, reducing the probability of film breakage or substrate damage. This effectively solves the problem of high scrap rate caused by the lack of sensing means in the existing technology, which leads to mismatch between film removal force and adhesion force, uneven stress on the substrate, and resulting in plate rolling and jamming.

[0040] Specifically, the adjustment module includes: The knurling stability determination unit is used to determine the knurling peak-to-valley ratio based on the ratio of the surface height peak-to-valley difference to the surface roughness after one knurling operation. The knurling determination unit is used to determine the knurling pattern of a knurling operation as local wrinkles based on the comparison result that the knurling peak-to-valley ratio is greater than a preset peak-to-valley threshold, so as to indicate that the knurling wheel may have wear or uneven pressure distribution based on the local abnormal deformation of the surface. It also determines the knurling pattern of a knurling operation as uniform based on the comparison result that the knurling peak-to-valley ratio is less than or equal to the preset peak-to-valley threshold, so as to indicate that the knurling wheel is in a normal state. In this embodiment, the preset peak-valley threshold is a boundary value used to distinguish whether the knurling peak-valley ratio exceeds the normal range. It can be finely adjusted according to the actual knurling wheel pattern and rubbing effect. Based on the offline calibration experiment, the lower limit is taken from the 95th percentile of the knurling peak-valley ratio of the thin substrate sample produced by the newly installed knurling wheel under uniform pressure, and the upper limit is taken from the minimum value of the knurling peak-valley ratio of the thin substrate sample produced by the knurling wheel with slight wear. Considering that a safety margin is left between normal fluctuation and slight wear, and at the same time ensuring that the abnormal film morphology can be detected in the early stage of knurling wheel wear, the arithmetic mean of the upper and lower limits is taken as the preset peak-valley threshold.

[0041] The test blow adjustment unit is used to adjust the secondary knurling pressure and secondary knurling speed based on the knurling pattern, response amplitude, preset clean film amplitude, and preset knurling pressure.

[0042] Since the working state of the knurling wheel can hinder the identification process of the adhesion between the film and the substrate, it is difficult to determine the true cause of the amplitude abnormality. The sharpness of the surface morphology after knurling can reflect the working state of the knurling wheel. Therefore, the surface morphology after knurling is identified by the knurling peak-to-valley ratio, which characterizes the sharpness of the surface morphology after knurling. The knurling morphology is divided into two categories: local wrinkles and uniformity. This adds an interference branch to the subsequent identification of whether the knurling wheel is abnormal, and increases the accuracy of the judgment of the subsequent response amplitude state and the adjustment of the secondary knurling pressure and secondary knurling speed.

[0043] Specifically, the test blow adjustment unit includes: The first test blow determination subunit is used to determine the complete loosening abnormality when the response amplitude is greater than the upper limit of the preset amplitude window based on the uniform knurling pattern. This is to identify the state where the interface has been sufficiently damaged by the first knurling, causing the film to de-adhere locally. The second knurling pressure is reduced based on the preset knurling pressure and the first pressure adjustment coefficient to reduce the probability of excessive knurling and maintain the integrity of the film structure. The first pressure adjustment coefficient is proportional to the magnitude of the response amplitude being greater than the upper limit of the preset amplitude window, and the second knurling pressure is not less than half of the preset knurling pressure. When the response amplitude is less than the lower limit of the preset amplitude window, an adhesion abnormality is determined to be present. This is to identify a state where the interface is not loose and the morphology is uniform after the first knurling, and to infer that the adhesion force is too large. Based on the preset rotation speed and the first speed adjustment coefficient, the second knurling speed is increased to enhance the rubbing shear effect, increase the shear damage force on the bonding interface between the film and the thin substrate, and reduce the probability of serious damage to the integrity of the film structure without increasing the pressure. The first speed adjustment coefficient is proportional to the amplitude of the response amplitude being less than the lower limit of the preset amplitude window.

[0044] In this embodiment, the preset amplitude window is determined based on the preset net film amplitude, which is the typical value of the response amplitude generated by a qualified thin substrate after standard knurling and excitation by standard pulsed airflow. The lower limit of the preset amplitude window is usually the minimum value of the response amplitude of all qualified boards in the calibration experiment, and the upper limit is usually the maximum value. That is, the initial preset amplitude window is [7, 12] μm. In long-term production statistics, the response amplitude distribution of qualified boards shifts as a whole with batch or equipment drift. Therefore, in order to make the preset amplitude window adaptively scale with the update of the preset net film amplitude, the lower limit of the preset amplitude window is the preset net film amplitude minus 3 μm, and the upper limit of the preset amplitude window is the preset net film amplitude plus 2 μm.

[0045] The second test blow determination subunit is used to determine the abnormal wear of the knurling component based on the knurling pattern of local wrinkles. When the response amplitude is less than the lower limit of the preset amplitude window, it identifies the state of local abnormal deformation of the surface caused by wear of the knurling wheel or uneven pressure distribution and the interface is not loose. The secondary knurling pressure is increased based on the preset knurling pressure and the second pressure adjustment coefficient to compensate for the insufficient local pressure and restore uniform knurling. The second pressure adjustment coefficient is proportional to the amplitude of the response amplitude being less than the lower limit of the preset amplitude window. When the response amplitude exceeds the upper limit of the preset amplitude window, a complete loosening abnormality is determined, and the secondary knurling pressure is reduced based on the preset knurling pressure and the first pressure adjustment coefficient.

[0046] In this embodiment, after processing the current thin substrate, the secondary knurling speed is reset to a preset rotation speed, and the secondary knurling pressure is reset to a preset knurling pressure, so as to make individual adjustments for the bonding strength between different thin substrates and films.

[0047] Since the response amplitude after a single knurling operation can reflect the degree of interface loosening, abnormal amplitude needs to be combined with the knurling pattern to distinguish between different causes of abnormality, such as excessive adhesive force or abnormal knurling wheel condition. Therefore, by using the combination of knurling pattern and response amplitude as the judgment criterion, it is possible to accurately distinguish between complete loosening abnormality, adhesion abnormality, and wear abnormality of knurling components. Furthermore, by making targeted adjustments to the abnormalities that occur during the processing of each thin substrate, the accuracy of adjusting the secondary knurling pressure and speed can be improved to adapt to the fluctuation of the adhesion force between different thin substrates and films.

[0048] Specifically, the calibration module includes: The looseness determination unit is used to determine the looseness of the film based on the surface roughness and response amplitude after the first knurling and the second knurling, the preset standard roughness and the preset net film amplitude; In this embodiment, the preset standard roughness is the standard value of the surface roughness of a qualified thin substrate after one knurling under preset knurling pressure and preset rotation speed. It is determined based on the surface roughness of qualified thin substrate samples under preset knurling pressure and preset rotation speed in offline calibration experiments, according to the previous process adhesive force, knurling wheel condition and subsequent peeling resistance all within the standard specifications. The mean value of the sample data of 1.5 μm plus or minus three times the standard deviation of 0.1 μm is taken as the normal fluctuation range, and the median of the surface roughness in the sample data of 1.5 μm is taken as the preset standard roughness. It needs to be recalibrated when there are significant changes in equipment or process.

[0049] The membrane unit strength determination unit is used to determine the membrane unit strength based on the residual indentation depth after secondary knurling, the preset trough depth, the preset knurling pressure, and the secondary knurling pressure. In this embodiment, the preset valley depth is the maximum residual indentation depth allowed for the thin film material under standard knurling pressure, used to assess the degree of pressure damage to the thin film. It is determined based on the maximum valley depth after the same thin film sample is cut into several parts and static indentation is applied under multiple different experimental knurling pressures in offline calibration tests. The 10th and 90th percentiles of the sample data are taken as the upper and lower limits of the value. To leave a safety margin, the product of the mean of the sample values ​​and 80% of the commonly used safety margin is taken as the preset valley depth.

[0050] The peel calibration unit is used to calibrate preset peel parameters based on film looseness and film unit strength. The preset peel parameters include jet pressure and substrate transport speed.

[0051] Because thin substrates are extremely sensitive to mechanical stress, the peeling force required during film peeling must be precisely matched with the actual bonding strength of the interface between the thin substrate and the film. The interfacial bonding strength needs to be reflected by the initial loosening degree after the first knurling and the loosening effect after the second knurling. Furthermore, during the peeling process, it is necessary to ensure that the demolding force on the film is less than the film's load-bearing capacity. Therefore, the relative magnitude of the actual bonding strength of the interface is characterized by the response amplitude that reflects the initial loosening degree and the roughness increment that reflects the additional loosening effect. The relative magnitude of the film's load-bearing capacity is estimated by jointly reflecting the residual indentation depth of compression damage and the additional pressure it bears. This allows for constraints on the jet pressure and transmission speed, thereby reducing the probability of film rupture or incomplete peeling or substrate damage due to insufficient jet pressure causing excessive hard extrusion pressure on the film.

[0052] Specifically, the looseness determination unit includes: The loosening reference determination sub-unit is used to determine the loosening reference value, which characterizes the initial loosening degree of the interface after one knurling, based on the ratio of the response amplitude to the preset net film amplitude. The loosening increment determination subunit is used to determine the loosening increment, which characterizes the additional loosening effect of secondary knurling on the interface, based on the ratio of the surface roughness increment that characterizes the additional destructive effect of secondary knurling on the interface to a preset standard roughness. The surface roughness increment is determined based on the difference between the surface roughness after secondary knurling and the surface roughness after primary knurling. The loosening degree determination subunit is used to determine the loosening degree of the film based on the sum of the loosening reference value and the loosening degree increment.

[0053] Since the response amplitude of the film under airflow after knurling is negatively correlated with the interface constraint stiffness, it is difficult to identify the source of the final loosening state of the interface based solely on the response amplitude. Secondary knurling involves applying pressure and rubbing the surface again after primary knurling. If additional damage occurs, the surface roughness will inevitably increase on the original basis. Therefore, the response amplitude is used to characterize the initial loosening degree after primary knurling, and the roughness increment is used to quantify the additional loosening effect of secondary knurling on the interface. The initial loosening degree and the additional loosening effect are added together to comprehensively characterize the final interface loosening level after two knurling processes. At the same time, the contribution information of primary and secondary knurling is retained, making the source of the final loosening traceable. This provides a reasonable basis for subsequent maintenance systems to judge whether the adjustment is effective and to locate the failure link.

[0054] Specifically, the unit for determining the strength of the membrane includes: The compressibility determination subunit is used to determine the film compressibility, which characterizes the degree of local compression damage of the film in the knurled region, based on the ratio of the residual indentation depth to the preset trough depth. The pressure increment determination subunit is used to determine the pressure increment ratio, which characterizes the magnitude of the actual increase in pressure experienced by the film, based on the ratio of the secondary knurling pressure to the preset knurling pressure. The membrane unit strength determination subunit is used to determine the membrane unit strength based on the ratio of pressure increment ratio and membrane compressibility, so as to quantify the overall load-bearing capacity of the membrane under unit pressure, and serve as a limiting condition to prevent membrane breakage during the peeling process.

[0055] Since the degree of local compression damage to the film in the knurled area can reflect the plastic deformation capacity of the film under pressure, but this degree of damage is measured under the adjusted secondary knurling pressure, the actual pressure will directly affect the indentation depth. Therefore, in order to eliminate the contribution of the actual knurling pressure to the indentation depth, the relative indentation depth under unit pressure represents the unit strength of the film, quantifies the film's resistance to breakage, and serves as a limiting condition to reduce the probability of film breakage during the peeling process.

[0056] Specifically, the stripping calibration unit includes: The peeling speed calibration subunit is used to calibrate the thin substrate transport speed based on the sum of the preset minimum speed and the speed adjustment step size, so that the thin substrate transport speed is adapted to the looseness of the interface between the film and the thin substrate. The speed adjustment step size is proportional to the looseness of the film, so that when the adhesion between the film and the thin substrate is stronger and the looseness is lower, the substrate transport speed is reduced, thereby reducing the probability of the plate rolling or jamming. In this embodiment, the preset minimum speed is the lower limit of the thin substrate transmission speed. It is used to forcibly limit the minimum transmission speed when the film looseness is extremely low, that is, when the interfacial adhesion between the film and the thin substrate is extremely large, so as to avoid collisions between the thin substrates on the production line. It is determined based on the safety distance and normal cycle time of the equipment conveying system. That is, the maximum value of the linear speed corresponding to the lowest speed at which the conveying motor runs stably and the minimum speed allowed for two adjacent boards to not collide after the film is peeled off under normal transmission speed is taken as the preset minimum speed.

[0057] The jet pressure calibration subunit is used to calibrate the jet pressure based on the product of a preset jet pressure and a final pressure step size, which characterizes the allowable scaling factor of the actual jet pressure relative to the preset jet pressure. This limits the jet pressure as the film strength decreases while increasing the jet pressure as the adhesion between the film and the substrate increases with the degree of interfacial looseness. The final pressure step size is determined based on the product of a reference pressure step size and a blowing restriction ratio, which characterizes the degree of jet pressure restriction required according to the fragility of the film. The blowing restriction ratio is determined based on the maximum value between the unit strength of the film and the minimum restriction ratio. The reference pressure step size is inversely proportional to the degree of film looseness, so as to increase the jet pressure when the viscosity between the film and the substrate is high to ensure smooth peeling of the film and the substrate. In this embodiment, the preset jet pressure is a reference value for jet pressure calibration, used to provide a basic jet pressure under standard process conditions. It is based on a thin substrate sample with normal adhesion, normal separation from the substrate after knurling, and qualified film strength in offline experiments. The jet pressure is gradually increased from low pressure at a preset transmission speed. The lower limit of the value is the jet pressure at which an ever-expanding air wedge begins to form between the film and the thin substrate. At the same time, the upper limit of the value is the jet pressure at which the film ruptures due to excessive air pressure or the thin substrate vibrates significantly. To ensure that the maximum jet pressure will not easily cause the film to rupture when the film strength is unqualified, and to maintain the peeling process as quickly as possible, the engineering safety factor of 0.8, which is the upper limit of the pressure window, is taken as the preset jet pressure.

[0058] The minimum limit ratio is a threshold value representing the lower limit of the membrane's unit strength. It is used to limit the jet pressure to a certain proportion of the preset jet pressure, preventing the membrane from failing to open due to excessive jet pressure restriction when the membrane strength is extremely low. It is usually determined by the ratio of the lower limit value measured during offline experiments of the preset jet pressure to the final selected preset jet pressure.

[0059] The auxiliary peeling subunit is used to determine whether to activate ultrasonic vibration to assist in peeling the film when the film looseness is less than a preset minimum looseness and the film unit strength is less than a preset minimum strength. In cases where the interface is extremely difficult to separate and the film is fragile, the high-frequency ultrasonic vibration increases shear stress at the interface between the film and the thin substrate to assist in separation, thereby reducing the probability of the film breaking due to increased jet pressure.

[0060] In this embodiment, the preset minimum loosening degree is the threshold for determining whether the interface is one that cannot be effectively expanded by high-pressure gas alone. It is determined based on the working condition of simulating high temperature during system trial operation, which increases the adhesive force. That is, for thin substrate samples processed by raising the ambient temperature of the production line to the upper limit allowed by the process, the maximum film loosening degree of the failed samples that cannot stably peel off the film while maintaining the standard knurling pressure, jet pressure and transmission speed is used as the upper limit value, and the minimum film loosening degree is used as the lower limit value. Considering that the loosening degree of the measured failed samples has equipment noise and batch fluctuations, directly using the upper limit as the threshold will cause some critical samples to be misjudged as peelable and actually fail. Therefore, the preset minimum loosening degree is based on the upper limit value multiplied by the commonly used process safety factor of 0.8.

[0061] In this embodiment, the preset minimum strength is the threshold for determining whether the film is too fragile to be further increased in terms of jet pressure. This is based on the fact that during trial operation, when the knurling wheel pressure is increased to simulate slight wear of the knurling wheel leading to local indentation deepening, a batch of thin substrates are processed according to the standard jet pressure and transmission speed. The maximum value of the unit strength of the film of the thin substrates that show microcracks or direct rupture is taken as the upper limit of the value, and the minimum value is taken as the lower limit of the value. Considering that the indentation deepening caused by slight wear of the knurling wheel is a gradual process, most of the samples that show microcracks or rupture are already in a critical failure state. Therefore, the upper limit of the value is directly taken as the preset minimum strength to increase the sensitivity of the system.

[0062] In this embodiment, ultrasonic vibration is used to assist high-pressure airflow in peeling the film. It generates high-frequency mechanical vibration through an ultrasonic transducer, which is transmitted to the film surface through a guide template, grippers, or an independent vibrating head. The direction of action is perpendicular to the film surface and includes a small tangential component, so as to generate high-frequency shear stress at the interface, which helps to break the intermolecular forces and reduce the dependence on air pressure during the peeling process.

[0063] Since stronger interfacial adhesion requires stronger airflow impact and a slower peeling process, but lower membrane unit strength necessitates limiting jet pressure, and the interface is extremely difficult to separate while the membrane is fragile, pure air pressure is insufficient to prevent membrane rupture. Therefore, it is necessary to reduce the transmission speed and increase the jet pressure by adjusting the membrane looseness, while also limiting the upper limit of the jet pressure based on the membrane unit strength, and using ultrasonic assistance under extreme conditions to ensure that the peeling force always matches the interfacial adhesion and the membrane load-bearing capacity, thereby increasing the peeling success rate while reducing the probability of membrane rupture.

[0064] Specifically, the early warning module includes: The film abnormality early warning unit is used to determine that a film tearing abnormality has occurred when the resistance change rate is less than a preset sudden drop threshold, so as to issue a film tearing abnormality alarm. The resistance change rate is the rate of change of peeling resistance over time during the peeling process. In this embodiment, the preset drop threshold is the critical resistance change rate value for determining abnormal film tearing. It is determined based on the fluctuation range of the resistance change rate during normal peeling and the resistance change rate when a tear is simulated after artificially creating a film cut. The maximum value of the resistance change rate in the simulated tear sample, i.e., the minimum absolute value of the negative sudden change, is taken as the lower limit of the value, and the minimum value of the resistance change rate in the normal operating condition fluctuation is taken as the upper limit of the value. Considering that the preset drop threshold is mainly used to capture torn films, the maximum value of the resistance change rate in the simulated tear sample is multiplied by the commonly used engineering safety factor of 0.8 as the preset drop threshold.

[0065] The thin substrate abnormality early warning unit is used to determine the occurrence of thin substrate stress abnormality based on the average value of the resistance change rate during the peeling process and when it exceeds the preset gradual rise threshold, so as to trigger a thin substrate stress abnormality alarm. In this embodiment, the preset gradual rise threshold is the average value of the critical resistance change rate for determining abnormal stress on the thin substrate. It is determined based on the fluctuation range of the resistance change rate during peeling under normal working conditions and the resistance change rate when the simulated adhesive force is too large, causing the guide template to peel the film mainly by extrusion. Usually, the minimum resistance change rate in the extrusion sample is taken as the upper limit, and the maximum resistance change rate in normal fluctuations is taken as the lower limit. In order to simultaneously avoid false alarms under normal fluctuations and have sufficient sensitivity to anomalies, the average value of the upper and lower limits is taken as the preset gradual rise threshold.

[0066] Since the peeling resistance drops sharply and instantaneously when the film tears, and the peeling resistance continues to rise when the thin substrate is subjected to abnormal stress, monitoring the rate of change of resistance can effectively distinguish between film rupture and abnormal stress on the thin substrate, and can promptly alert staff.

[0067] Specifically, the adjustment modules include: An alarm anomaly determination unit is used to determine an alarm anomaly when the total number of alarms within the adjustment period exceeds a preset alarm threshold. In this embodiment, the preset alarm threshold is a critical value for determining whether the total number of alarms within the adjustment cycle is abnormal. It is based on the number of scrapped thin substrates allowed within a single adjustment cycle required by the process yield as the upper limit, and the 80th percentile of the fluctuation range of the number of alarms under normal production conditions as the lower limit. Considering that alarms should intervene as early as possible before causing batch scrapping, but should not be interfered with by alarms under normal production conditions, the average of 50% of the upper limit and the lower limit is taken as the preset alarm threshold.

[0068] An alarm adjustment unit is used to reduce the preset net film amplitude based on the judgment result of the occurrence of an alarm abnormality. When the average value of the film loosening degree is greater than the preset loosening threshold when the judgment result of the occurrence of an adhesion abnormality within the adjustment cycle is greater than the preset loosening threshold, the preset net film amplitude is reduced based on the preset first threshold step size. This reduces the net film response threshold and thus reduces the false judgment rate of thin substrates with normal adhesion to the film. The preset threshold step size is proportional to the magnitude by which the average value of the film loosening degree is greater than the preset loosening threshold. If the frequency of the determination result of adhesion abnormality within the adjustment cycle is greater than or equal to the frequency of the determination result of wear abnormality of knurled component, and the average value of the pressure increment ratio when the determination result of wear abnormality of knurled component occurs within the adjustment cycle is greater than the preset pressure threshold, the preset net film amplitude is increased based on the preset second threshold step size to raise the net film response threshold, thereby reducing the probability of cross-misjudgment of adhesion abnormality and wear abnormality caused by the low threshold. The preset second threshold step size is directly proportional to the magnitude of the average value of the pressure increment ratio being greater than the preset pressure threshold.

[0069] In this embodiment, the preset loosening threshold is a critical value for determining whether the looseness of the film is too high. It is based on the film looseness of all uniformly shaped thin substrate samples with response amplitudes below the lower limit within the period when the statistical equipment is running stably and the adhesion anomaly determination result is normal. The 90th percentile of the looseness of these samples is taken as the upper limit and the 10th percentile as the lower limit. Considering that when the looseness exceeds the 70th percentile, after subsequent peeling verification, this type of thin substrate can be successfully separated under standard jet pressure, and there is no need to enhance the rubbing by reducing the net film amplitude, this embodiment takes the 70th percentile of the looseness as the preset loosening threshold.

[0070] In this embodiment, the preset pressure threshold is the critical value for determining whether the pressure increment ratio is too high. It is based on the pressure increment ratio of the thin substrate of the knurling assembly wear sample under normal knurling wheel conditions where local wrinkles occur and the response amplitude is lower than the lower limit. The 90th percentile of these sample pressure increment ratios is taken as the upper limit and the 10th percentile as the lower limit. Considering that when the sample pressure increment ratio exceeds the 60th percentile, the probability of the knurling wheel experiencing significant wear in the subsequent adjustment cycle, as verified by the wear acceleration experiment, will exceed 30%, which has reached a state that cannot be ignored, this embodiment takes the 60th percentile sample pressure increment ratio as the preset pressure threshold.

[0071] When bonding abnormalities occur frequently and the average film looseness is low, it usually indicates that the current clean film response threshold is too high, causing thin substrates with excessive adhesive force to be missed and not receive rubbing compensation. When the frequency of bonding abnormalities is not lower than the frequency of wear abnormalities and the pressure increment ratio corresponding to wear abnormalities is high, it usually indicates that the current clean film response threshold is too low, causing some boards with bonding abnormalities to be misjudged as wear abnormalities and the knurling pressure to be increased incorrectly. Therefore, by calibrating the preset clean film amplitude, the judgment boundary between bonding abnormalities and wear abnormalities is matched in a targeted manner to optimize the accuracy of secondary knurling parameter adjustment.

[0072] Specifically, on the other hand, the present invention provides an intelligent film removal method for thin PCB substrates, comprising: The surface roughness, surface height peak-to-valley difference, and residual indentation depth formed after knurling, the response amplitude of the film during test blowing, and the peeling resistance during peeling were obtained. The secondary knurling pressure is adjusted based on the knurling peak-to-valley ratio, response amplitude, preset net film amplitude, and preset knurling pressure after the first knurling. The knurling peak-to-valley ratio is determined based on the surface roughness and surface height peak-to-valley difference after the first knurling. The preset peeling parameters are calibrated based on the film looseness and the unit strength of the film. The film looseness is determined based on the surface roughness and response amplitude after the first knurling and the second knurling. The unit strength of the film is determined based on the residual indentation depth after the second knurling, the preset knurling pressure and the second knurling pressure. The alarm type is determined based on the resistance change rate for alarm activation, wherein the resistance change rate is determined based on the stripping resistance. The preset net film amplitude is adjusted based on the secondary knurling pressure, film loosening degree, alarm type, and alarm frequency adjusted within the adjustment cycle.

[0073] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A PCB thin substrate-oriented intelligent film removing device, characterized in that, include: The knurling mechanism includes a first knurling assembly symmetrically distributed for performing a first knurling of a thin film on a thin substrate based on a preset knurling pressure, a second knurling assembly symmetrically distributed for performing a second knurling of the film based on a second knurling pressure, and a pre-blowing assembly for performing a test blow on the film after the first knurling. The peeling mechanism includes symmetrically distributed guide templates for peeling off the film based on preset peeling parameters; The acquisition module is used to acquire the surface roughness, surface height peak-to-valley difference, and residual indentation depth formed after knurling, the response amplitude of the film during test blowing, and the peeling resistance during peeling. The adjustment module is used to adjust the secondary knurling pressure based on the knurling peak-to-valley ratio, response amplitude, preset net film amplitude, and preset knurling pressure after the first knurling. The knurling peak-to-valley ratio is determined based on the surface roughness and surface height peak-to-valley difference after the first knurling. The calibration module is used to calibrate preset peeling parameters based on film looseness and film unit strength. Film looseness is determined based on surface roughness and response amplitude after primary and secondary knurling, and film unit strength is determined based on residual indentation depth after secondary knurling, preset knurling pressure, and secondary knurling pressure. The early warning module is used to determine the alarm type based on the resistance change rate and to trigger an alarm, wherein the resistance change rate is determined based on the stripping resistance. The adjustment module is used to adjust the preset net film amplitude based on the secondary knurling pressure, film loosening degree, alarm type and alarm frequency adjusted within the adjustment cycle.

2. The smart film removing device for PCB thin substrate according to claim 1, wherein, The adjustment module includes: The knurling stability determination unit is used to determine the knurling peak-to-valley ratio based on the ratio of the surface height peak-to-valley difference to the surface roughness after one knurling operation. The knurling determination unit is used to determine the knurling pattern of a single knurling based on the comparison result of the knurling peak-to-valley ratio and the preset peak-to-valley threshold. The knurling pattern includes uniform and local wrinkles. The test blow adjustment unit is used to adjust the secondary knurling pressure and secondary knurling speed based on the knurling pattern, response amplitude, preset clean film amplitude, and preset knurling pressure.

3. The smart film removing device for PCB thin substrate according to claim 2, wherein, The test blow adjustment unit includes: The first test blow determination subunit is used to determine whether there is a complete loosening or adhesion abnormality based on the uniform knurling pattern and the comparison result of the response amplitude and the preset amplitude window, so as to adjust the secondary knurling pressure or secondary knurling speed. The preset amplitude window is determined based on the preset net film amplitude. The second test blow determination subunit is used to determine whether there is abnormal wear of the knurling assembly based on the knurling pattern of local wrinkles and the comparison result of the response amplitude and the preset amplitude window, so as to adjust the secondary knurling pressure.

4. The smart film removing device for PCB thin substrate according to claim 1, wherein, The calibration module includes: The looseness determination unit is used to determine the looseness of the film based on the surface roughness and response amplitude after the first knurling and the second knurling, the preset standard roughness and the preset net film amplitude; The membrane unit strength determination unit is used to determine the membrane unit strength based on the residual indentation depth after secondary knurling, the preset trough depth, the preset knurling pressure, and the secondary knurling pressure. The peel calibration unit is used to calibrate preset peel parameters based on film looseness and film unit strength. The preset peel parameters include jet pressure and substrate transport speed.

5. The smart film removing device for PCB facing thin substrate according to claim 4, characterized in that, The looseness determination unit includes: The loosening reference determination subunit is used to determine the loosening reference value based on the ratio of the response amplitude to the preset net film amplitude; The loosening increment determination subunit is used to determine the loosening increment based on the ratio of the surface roughness increment to the preset standard roughness, wherein the surface roughness increment is determined based on the difference between the surface roughness after secondary knurling and the surface roughness after primary knurling. The loosening degree determination subunit is used to determine the loosening degree of the film based on the sum of the loosening reference value and the loosening degree increment.

6. The smart film removing device for PCB facing thin substrate according to claim 4, wherein, The unit for determining the unit strength of the membrane includes: The compressibility determination subunit is used to determine the compressibility of the film based on the ratio of the residual indentation depth to the preset trough depth. The pressure increment determination subunit is used to determine the pressure increment ratio based on the ratio of the secondary knurling pressure to the preset knurling pressure. The membrane unit strength determination subunit is used to determine the membrane unit strength based on the ratio of pressure increment ratio and membrane compressibility.

7. The smart film removing device for PCB facing thin substrate according to claim 4, wherein, The stripping calibration unit includes: The peeling speed calibration subunit is used to calibrate the thin substrate transfer speed based on the speed adjustment step size, wherein the speed adjustment step size is proportional to the film looseness. The jet pressure calibration subunit is used to calibrate the jet pressure based on the final pressure step, wherein the final pressure step is determined based on the product of the reference pressure step and the blowing limit ratio, the blowing limit ratio is determined based on the unit strength of the membrane, and the reference pressure step is inversely proportional to the membrane looseness. The auxiliary peeling subunit is used to determine whether to activate ultrasonic-assisted peeling of the film based on the film looseness and the unit strength of the film.

8. The intelligent film removal device for PCB thin substrates according to claim 3, characterized in that, The early warning module includes: The film abnormality early warning unit is used to determine whether a film tearing abnormality has occurred based on the comparison result between the resistance change rate and the preset drop threshold, so as to issue a film tearing abnormality alarm. The resistance change rate is determined based on the peeling resistance during the peeling process. The thin substrate abnormality early warning unit is used to determine whether there is an abnormal stress on the thin substrate based on the comparison between the average value of the resistance change rate during the peeling process and the preset gradual rise threshold, so as to trigger an alarm for abnormal stress on the thin substrate.

9. The smart film removing device for PCB facing thin substrate according to claim 8, wherein, The adjustment module includes: The alarm anomaly determination unit is used to determine whether an alarm anomaly has occurred based on the comparison result between the total number of alarms within the adjustment period and the preset alarm threshold. The alarm adjustment unit is used to calibrate the preset net film amplitude based on the judgment result of the occurrence of alarm abnormality, according to the average value of the film looseness when the judgment result of the occurrence of adhesion abnormality and the average value of the pressure increment ratio when the judgment result of the occurrence of knurling component wear abnormality within the adjustment cycle.

10. A smart film removal method for thin PCB substrates, based on the smart film removal apparatus for thin PCB substrates according to any one of claims 1-9, characterized in that, include: The surface roughness, surface height peak-to-valley difference, and residual indentation depth formed after knurling, the response amplitude of the film during test blowing, and the peeling resistance during peeling were obtained. The secondary knurling pressure is adjusted based on the knurling peak-to-valley ratio, response amplitude, preset net film amplitude, and preset knurling pressure after the first knurling. The knurling peak-to-valley ratio is determined based on the surface roughness and surface height peak-to-valley difference after the first knurling. The preset peeling parameters are calibrated based on the film looseness and the unit strength of the film. The film looseness is determined based on the surface roughness and response amplitude after the first knurling and the second knurling. The unit strength of the film is determined based on the residual indentation depth after the second knurling, the preset knurling pressure and the second knurling pressure. The alarm type is determined based on the resistance change rate, wherein the resistance change rate is determined based on the peeling resistance; The preset film amplitude is adjusted based on the adjusted secondary knurling pressure, the film looseness, and the alarm type and the number of alarms in the adjustment period.

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