A production method of a buried-copper-line power-supply PCB board

Abstract

This invention discloses a method for producing a high-current-carrying power PCB board with embedded copper wires, belonging to the field of printed circuit board technology. The method includes: S1: preparation of the PCB board body assembly, used to prepare for later production of the power PCB board; S2: milling grooves in the PCB board body assembly to facilitate installation with other components; S3: preparation of solid copper blocks, procuring solid copper blocks according to size requirements; S4: overall processing of the PCB board body, requiring the installation of the prepared components and the procured solid copper blocks. This method for producing a high-current-carrying power PCB board with embedded copper wires uses inner solid copper blocks as the main current-carrying channel, replacing traditional copper foil traces. It can stably carry high currents of tens to hundreds of amps, with low current voltage drop and low heat generation, making it suitable for high-power equipment such as charging piles, energy storage, and high-power inverters. Furthermore, it can doubly improve the bonding strength and tensile strength between the solid copper blocks and the resin and core board.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, specifically to a method for producing a buried copper wire power PCB board capable of handling ultra-high current. Background Technology

[0002] With the rapid development of industries such as new energy, energy storage, high-power industrial control, and vehicle power supplies, the power level of power electronic equipment continues to increase, and the operating current of the equipment can reach tens to hundreds of amps, which puts forward stringent requirements on the current carrying capacity, heat dissipation performance, and operational stability of the supporting PCB board.

[0003] In the prior art, Chinese patent CN203279352U discloses an infusion pump and an LED driver power supply PCB board that can install transformers of various specifications. A PCB board has several sets of holes drilled to install transformer components of various specifications. Using the LED driver power supply PCB board of this solution, only the corresponding transformer needs to be replaced for different driving power, eliminating the requirement of designing a PCB board for each driving power in the prior art, saving expensive PCB board manufacturing costs, making the cost of installing LED lights lower, and increasing commercial competitiveness.

[0004] For example, patent CN104320871A discloses an LED two-in-one power supply PCB board, which relates to the field of LED power supply. It includes a PCB board body with circuit components on it. The body has a recessed groove, and the circuit components are installed and embedded in the body through the recessed groove. A recessed groove is set above the PCB board body, and the electrical components are installed and embedded in the PCB board body through the recessed groove. The height of the entire power supply PCB board is reduced to less than 14cm, which greatly reduces the thickness of the entire product, making it convenient to use, easy to carry, and more aesthetically pleasing.

[0005] For example, patent CN220528283U discloses a power supply PCB board, which has a first printing area, a second printing area, a third printing area, and a fourth printing area for circuit connections from left to right. The power supply PCB board adopts a parallel rectifier bridge, an interleaved PFC inductor, a series output transformer, and a parallel power transistor. The rectifier bridge, PFC circuit components, LLC circuit components, and synchronous rectifier power components are arranged on both sides, which can effectively dissipate heat under the action of heat sink and shell, greatly reducing the temperature rise of the power supply circuit, improving the efficiency of the power supply, having a wide input voltage range and high power density, and solving the problem of excessive current causing circuit overload under high power and low voltage conditions. The power supply PCB board uses multiple X capacitors, filters, and Y capacitors, and the traces from the input to the rectifier bridge are smooth, effectively suppressing electromagnetic interference.

[0006] Traditional PCBs use surface copper foil as the current transmission channel. However, the limited thickness of the copper foil results in weak current carrying capacity, leading to problems such as severe overheating, excessive voltage drop, and circuit burnout when carrying extremely high currents. This makes them unsuitable for high-power devices. While some buried copper PCB structures have emerged, these products suffer from several technical defects in production and use: First, the gap between the core board / prepreg slots and the copper blocks is poorly designed, resulting in insufficient copper embedding or inadequate adhesive overflow. Second, the copper block thickness does not match the slot size well, making it difficult to clean residual adhesive after lamination and resulting in substandard flatness. Third, the copper blocks are prone to displacement and misalignment during lamination, leading to product failure. Fourth, the bond between the copper blocks and resin is weak, causing delamination and copper detachment after long-term use. Fifth, the low tensile strength at the copper-resin interface results in a short service life.

[0007] In summary, existing conventional PCBs and traditional buried copper PCBs are not suitable for application scenarios requiring ultra-high current, low heat generation, and high stability. Therefore, it is urgent to make technical improvements to existing power supply PCBs. Summary of the Invention

[0008] The purpose of this invention is to provide a method for producing a buried copper wire power PCB board with ultra-high current, so as to solve the problem mentioned in the background art that existing conventional PCBs and traditional buried copper PCBs cannot be adapted to the application scenarios of ultra-high current, low heat generation and high stability.

[0009] To achieve the above objectives, the present invention provides the following technical solution: a method for producing a buried copper wire power PCB board capable of handling ultra-high current, comprising the following steps:

[0010] S1: Preparation of the PCB board body assembly, used to prepare for the later production of the power supply PCB board;

[0011] S2: Milling grooves on the PCB board body assembly to facilitate installation with other components;

[0012] S3: Preparation of solid copper blocks; purchase solid copper blocks according to size requirements;

[0013] S4: The overall processing of the PCB board body requires the installation of the prepared components and the purchased solid copper blocks.

[0014] Preferably, the PCB board body assembly in S1 includes a first prepreg, a second prepreg, and a third prepreg, and the preparation method in S1 is as follows: the first prepreg, the second prepreg, and the third prepreg are respectively cut, edge-ground, and drilled, and the position of the positioning hole is matched according to the core board expansion and contraction coefficient.

[0015] Preferably, the milling process in S2 is as follows: the first semi-cured sheet, the second semi-cured sheet, and the third semi-cured sheet are milled to obtain a fixed mounting groove.

[0016] Preferably, the solid copper block purchased in S3 has an overall size 0.15mm smaller than the overall size of the fixed mounting groove. After inspecting the appearance of the solid copper block to ensure it is free of burrs, damage, and defects, the solid copper block is subjected to browning treatment to enhance the bonding force between the solid copper block and the resin. After the treatment is completed, it is ready for use.

[0017] Preferably, the PCB board body assembly in S1 further includes a GTL core board, a first core board, a second core board, and a GBL core board.

[0018] Preferably, the specific steps for the overall PCB board processing in step S4 are as follows:

[0019] S41: Core board pretreatment. First, the first core board and the second core board are cut, edge-grinding, inner layer pattern transfer, and etching to remove the film. Then, the GTL core board, the first core board, the second core board and the GBL core board are milled to obtain the fixing and mounting groove. Finally, the first core board and the second core board are browned, cleaned and roughened as a whole.

[0020] S42: Solid copper block positioning and embedding: The grooved GTL core board, first core board, second core board and GBL core board are hot-melt riveted with the first semi-cured sheet, second semi-cured sheet and third semi-cured sheet, and the positions are distributed from top to bottom as follows: GTL core board, first semi-cured sheet, first core board, second semi-cured sheet, second core board, third semi-cured sheet and GBL core board, high temperature adhesive is pasted on either side of the first core board and the second core board, and then the solid copper block prepared in S3 is embedded into the fixing and mounting groove from the other side of the first core board and the second core board;

[0021] S43: Pressing and shaping. The plate with the embedded solid copper block is placed in the press. Then, a release film is laid on the outer layer of the GTL core board and the GBL core board. Then, the overall pressing is completed by constant temperature and pressure process, so that the GTL core board, the first semi-cured sheet, the first core board, the second semi-cured sheet, the second core board, the third semi-cured sheet, the GBL core board and the solid copper block are bonded together as one.

[0022] S44: Post-processing, including drilling target holes, milling the frame, and resin polishing to remove excess adhesive, with residual adhesive being manually trimmed; followed by mechanical drilling, copper plating, electroplating, outer layer pattern transfer, and etching to remove the film.

[0023] S45: Surface treatment and inspection. Solder resist fabrication and immersion gold surface treatment are completed in sequence. Then, electrical performance tests are performed on the finished board to check open and short circuits, resistance, and inductance parameters. Finally, the shape processing and finished product appearance inspection are carried out. After passing the inspection, the board is put into storage.

[0024] Preferably, the PCB board body has connection holes, and the outer surface of the PCB board body is also provided with surface mount resistors and leads. The right side of the PCB board body is provided with connection terminals, and the connection terminals have fixing holes. There are two connection terminals, which are symmetrically distributed. A mating structure is provided between the connection terminals and the PCB board body for fixing the connection terminals.

[0025] Preferably, the docking structure includes a connecting block fixed to the left end of the connecting terminal, and the connecting block is connected to the PCB board body through a docking groove, and the docking groove is opened inside the PCB board body.

[0026] Preferably, both the connecting block and the PCB board body have positioning grooves inside, and the positioning grooves are connected to positioning blocks inside, and the positioning grooves and the mating grooves are perpendicular to each other.

[0027] Preferably, the depth of the mounting groove is consistent with the thickness of the PCB board body, and the mounting groove is 0.075mm larger on one side than the solid copper block. The thickness of the solid copper block is 0.05-0.1mm larger than the depth of the mounting groove, and the solid copper block is rectangular.

[0028] Compared with the prior art, the beneficial effects of the present invention are: by adopting a novel structural design, it is possible to remove the adhering substances on the surface of the workpiece during the optical roughness inspection process, so that the optical instrument is not affected by abnormal external factors during operation, making the imaging of the wide-angle high-definition camera more accurate, thereby improving the detection accuracy of the wide-angle high-definition camera, that is, ultimately making the roughness inspection results more accurate. The specific details are as follows:

[0029] (1) The inner solid copper block is used as the main current-carrying channel to replace the traditional copper foil wiring. It can stably carry tens to hundreds of amps of ultra-large current, with small current voltage drop and low working heat generation. It is suitable for high-power equipment such as charging piles, energy storage, and high-power inverters.

[0030] (2) The browning treatment of solid copper blocks combined with the snap-fit ​​structure formed by the side wall grooves can double improve the bonding force and tensile strength between the solid copper blocks and the resin and core board, effectively preventing problems such as delamination, copper peeling and loosening after long-term use, and extending the service life of the product.

[0031] (3) By precisely designing the gap and thickness difference between the fixed mounting groove and the solid copper block, it is possible to ensure that the solid copper block is smoothly embedded and that there is sufficient glue overflow, and it is also convenient to remove glue after grinding, ensuring the flatness of the board surface. Moreover, the use of high temperature glue to position the solid copper block can effectively prevent the solid copper block from shifting or deviating during the pressing process.

[0032] (4) The inner layer carries a large current, while the surface layer is laid with signal lines and low-voltage lines. The separation of strong and weak currents reduces electromagnetic interference and effectively improves the overall electrical performance and operational stability of the power supply PCB board. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall process of the present invention;

[0034] Figure 2 This is a schematic diagram of step four of the present invention.

[0035] Figure 3 This is a schematic diagram of the overall structure of the power supply PCB board of the present invention;

[0036] Figure 4 This is a schematic diagram showing the structural relationship between the connecting block and the positioning block of the present invention.

[0037] Figure 5 This is a schematic diagram of the structure of the connecting block and the docking groove in the separated state of the present invention;

[0038] Figure 6 This is a schematic diagram of the fixed mounting groove and the solid copper block in a separated state according to the present invention;

[0039] Figure 7 This is a schematic diagram of the PCB board body structure of the present invention.

[0040] In the diagram: 1. PCB board body; 2. Connecting hole; 3. Mounting slot; 4. Solid copper block; 5. Surface mount resistor; 6. Lead; 7. Connecting terminal; 8. Mounting hole; 9. Connecting block; 10. Docking groove; 11. Positioning groove; 12. Positioning block; 101. GTL core board; 102. First prepreg; 103. First core board; 104. Second prepreg; 105. Second core board; 106. Third prepreg; 107. GBL core board. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example 1: As Figures 1-2 As shown, this invention discloses a method for manufacturing a buried copper wire power PCB board capable of handling ultra-high current. The specific steps are as follows:

[0043] S1: Preparation of PCB board body 1 component, used to prepare for the later production of power supply PCB board;

[0044] It should be noted that the PCB board body 1 assembly includes a first prepreg 102, a second prepreg 104, and a third prepreg 106, and the preparation method in S1 is as follows: the first prepreg 102, the second prepreg 104, and the third prepreg 106 are respectively cut, edge-ground, and drilled, and the position of the positioning hole is matched according to the core board expansion and contraction coefficient. The PCB board body 1 assembly also includes a GTL core board 101, a first core board 103, a second core board 105, and a GBL core board 107.

[0045] S2: The PCB board body 1 component is milled with an electric milling groove to facilitate installation with other components. Specifically, the first semi-cured sheet 102, the second semi-cured sheet 104 and the third semi-cured sheet 106 are milled with electric milling grooves to obtain the fixing and mounting groove 3.

[0046] S3: Preparation of solid copper block 4: Purchase solid copper block 4 according to size requirements;

[0047] It should be noted that the overall size of the purchased solid copper block 4 is 0.15mm smaller than the overall size of the fixed mounting groove 3. After inspecting the appearance of the solid copper block 4 to ensure there are no burrs, damage, or defects, the solid copper block 4 is subjected to browning treatment to enhance the bonding force between the solid copper block 4 and the resin. After the treatment is completed, it is ready for use.

[0048] S4: The overall processing of the PCB board body 1 requires the installation of the prepared components and the purchased solid copper block 4. The specific steps for the overall processing of the PCB board body 1 are as follows:

[0049] S41: Core board pretreatment. First, the first core board 103 and the second core board 105 are respectively cut, ground, transferred inner layer pattern, and etched to remove film. Then, the GTL core board 101, the first core board 103, the second core board 105 and the GBL core board 107 are milled to obtain the fixed mounting groove 3. Then, the first core board 103 and the second core board 105 are subjected to browning, cleaning and roughening treatment.

[0050] S42: The solid copper block 4 is positioned and embedded. The grooved GTL core board 101, first core board 103, second core board 105 and GBL core board 107 are hot-melt riveted with the first semi-cured sheet 102, second semi-cured sheet 104 and third semi-cured sheet 106, and the positions are distributed from top to bottom as follows: GTL core board 101, first semi-cured sheet 102, first core board 103, second semi-cured sheet 104, second core board 105, third semi-cured sheet 106 and GBL core board 107. High-temperature adhesive is pasted on either side of the first core board 103 and the second core board 105. Then, the solid copper block 4 prepared in S3 is embedded into the fixing and mounting groove 3 from the other side of the first core board 103 and the second core board 105.

[0051] S43: Pressing and shaping. The plate with the embedded solid copper block 4 is placed in the press. Then, a release film is laid on the outer layer of the GTL core board 101 and the GBL core board 107. Then, the overall pressing is completed by constant temperature and constant pressure process, so that the GTL core board 101, the first semi-cured sheet 102, the first core board 103, the second semi-cured sheet 104, the second core board 105, the third semi-cured sheet 106, the GBL core board 107 and the solid copper block 4 are bonded together as one.

[0052] S44: Post-processing, including drilling target holes, milling the frame, and resin polishing to remove excess adhesive, with residual adhesive being manually trimmed; followed by mechanical drilling, copper plating, electroplating, outer layer pattern transfer, and etching to remove the film.

[0053] S45: Surface treatment and inspection. Solder resist fabrication and immersion gold surface treatment are completed in sequence. Then, electrical performance tests are performed on the finished board to check open and short circuits, resistance, and inductance parameters. Finally, the shape processing and finished product appearance inspection are carried out. After passing the inspection, the board is put into storage.

[0054] In this embodiment, the inner solid copper block 4 is used as the main current-carrying structure to improve the current-carrying capacity, heat dissipation capacity and structural stability of the PCB board body 1, and solve the problems of insufficient current carrying capacity and high heat generation of conventional copper foil traces. At the same time, it overcomes the defects of poor bonding force, easy delamination and poor flatness of traditional buried copper structure. Furthermore, by optimizing the slot size, the thickness of the solid copper block 4, the positioning method, the surface treatment and the pressing process, it solves the production problems such as the offset of the solid copper block 4, the uncontrolled pressing gap, the difficulty in cleaning residual glue and the weak bonding force, thereby improving the product yield and production efficiency.

[0055] Example 2: The designed mating structure makes the connection between the connecting terminal 7 and the PCB board body 1 more secure, effectively preventing loosening and separation during use. Figures 3-6 As shown, the PCB board body 1 includes a connection hole 2 and a solid copper block 4 fixed inside a mounting groove 3. A surface mount resistor 5 and pins 6 are also provided on the outer surface of the PCB board body 1. A connection terminal 7 is provided on the right side of the PCB board body 1. A mating structure is provided between the connection terminal 7 and the PCB board body 1 to fix the connection terminal 7. The mating structure includes a connection block 9 fixed to the left end of the connection terminal 7, and the connection block 9 is connected to the PCB board body 1 through a mating groove 10. The mating groove 10 is located inside the PCB board body 1. A fixing hole 8 is provided on the connection terminal 7, and there are two connection terminals 7, which are symmetrically distributed. Positioning grooves 11 are provided inside both the connection block 9 and the PCB board body 1. A positioning block 12 is connected inside the positioning groove 11, and the positioning groove 11 and the mating groove 10 are perpendicular. The depth of the positioning groove 11 is less than the thickness of the PCB board body 1.

[0056] In use, the PCB board body 1 can be stabilized first. Two rectangular mating slots 10 are opened inside the PCB board body 1. The connecting block 9 on the left end of the connecting terminal 7 can be inserted into the mating slot 10 to make the connecting block 9 and the mating slot 10 engage. Since both the connecting block 9 and the PCB board body 1 have positioning slots 11 inside, after the connecting block 9 and the mating slot 10 engage, the positioning block 12 can be rotated into the positioning slot 11 to lock and fix the connecting block 9 and the PCB board body 1. By connecting and fixing the connecting block 9 and the PCB board body 1, the connecting terminal 7 can be installed and fixed. Then, the other connecting terminal 7 can be installed in the same way. This completes the connection operation between the two connecting terminals 7 and the PCB board body 1, effectively preventing loosening and separation during later use and ensuring the stable use of the power supply PCB board.

[0057] Example 3: Figure 7 As shown, by setting the solid copper block 4, the power supply PCB board can be adapted to application scenarios with ultra-high current, low heat generation, and high stability. The PCB board body 1 includes a GTL core board 101, a first prepreg 102, a first core board 103, a second prepreg 104, a second core board 105, a third prepreg 106, and a GBL core board 107. The sheet 106 and the GBL core board 107 are arranged sequentially from top to bottom. A fixing groove 3 is opened in the middle of the PCB board body 1. The depth of the fixing groove 3 is consistent with the thickness of the PCB board body 1. The fixing groove 3 is 0.075mm larger than the solid copper block 4 on one side. The thickness of the solid copper block 4 is 0.05-0.1mm larger than the depth of the fixing groove 3. The solid copper block 4 is rectangular. Two sets of chip resistors 5 are arranged. The two sets of chip resistors 5 are symmetrically distributed about the transverse center line of the solid copper block 4.

[0058] Since the PCB board body 1 is composed of a GTL core board 101, a first prepreg 102, a first core board 103, a second prepreg 104, a second core board 105, a third prepreg 106, and a GBL core board 107, and these components are bonded together, the PCB board body 101, the first prepreg 102, the first core board 103, the second prepreg 104, the second core board 105, the third prepreg 106, and the GBL core board 107 can be guaranteed to be firm during use and prevent separation between the layers. A fixing groove 3 is provided in the middle of the PCB board body 1, that is, the fixing groove 3 is provided on the GTL core board 101, the first prepreg 102, the first core board 103, the second prepreg 104, the second core board 105, the third prepreg 106, and the GBL core board 107. This facilitates the embedding and installation of the solid copper block 4, making the process convenient. During operation, the solid copper block 4 can enhance the current-carrying capacity of the PCB board. The embedded installation of the solid copper block 4 can directly connect the top GTL core board 101 and the bottom GBL core board 107, achieving extremely low on-resistance and carrying large currents. At the same time, the entire solid copper block 4 is used for heat dissipation. The heat generated during operation can be quickly conducted to the surface of the power PCB board through the solid copper block 4 and then dissipated through the connection terminal 7. The temperature rise is much lower than that of traditional traces, avoiding problems such as PCB substrate aging, copper foil shedding, and decreased insulation performance caused by local high temperature. This significantly improves long-term stability. Moreover, the embedded installation saves space on the PCB board and simplifies the layout design. Large currents run directly through the embedded solid copper block 4, and the surface PCB can be dedicated to signal lines and low-voltage traces, achieving strong and weak current separation, reducing electromagnetic interference, and making the PCB board more stable during use.

[0059] The above is the entire working process, and all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0060] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for manufacturing a buried copper wire power PCB board capable of handling ultra-high current, characterized in that: Includes the following steps: S1: Preparation of PCB board body (1) components, used to prepare for the later production of power supply PCB board; S2: The PCB board body (1) component is milled with a groove to facilitate installation with other components. S3: Preparation of solid copper blocks (4), purchase solid copper blocks (4) according to size requirements; S4: The PCB board body (1) is processed as a whole, and the prepared components and the purchased solid copper blocks (4) need to be installed.

2. The method for producing a buried copper wire power PCB board with ultra-high current as described in claim 1, characterized in that: The PCB board body (1) component in S1 includes a first semi-cured sheet (102), a second semi-cured sheet (104) and a third semi-cured sheet (106). The preparation method in S1 is as follows: the first semi-cured sheet (102), the second semi-cured sheet (104) and the third semi-cured sheet (106) are respectively cut, edge-ground and drilled, and the position of the positioning hole is matched according to the core board expansion and contraction coefficient.

3. The method for producing a buried copper wire power PCB board with ultra-high current as described in claim 1, characterized in that: The method of processing the milled groove in S2 is as follows: the first semi-cured sheet (102), the second semi-cured sheet (104) and the third semi-cured sheet (106) are respectively milled to obtain the fixed installation groove (3).

4. The method for producing a buried copper wire power PCB board with ultra-high current as described in claim 1, characterized in that: The solid copper block (4) purchased in S3 has an overall size that is 0.15 mm smaller than the overall size of the fixed mounting groove (3). After inspecting the appearance of the solid copper block (4) to ensure that there are no burrs, damages, or gaps, the solid copper block (4) is subjected to browning treatment to enhance the bonding force between the solid copper block (4) and the resin. After the treatment is completed, it is ready for use.

5. The method for producing a buried copper wire power PCB board with ultra-high current as described in claim 1, characterized in that: The PCB board body (1) assembly in S1 also includes a GTL core board (101), a first core board (103), a second core board (105), and a GBL core board (107).

6. The method for producing a buried copper wire power PCB board with ultra-high current as described in claim 1, characterized in that: The specific steps for the overall PCB board processing in S4 are as follows: S41: Core board pretreatment. First, the first core board (103) and the second core board (105) are respectively cut, edge-grinding, inner layer pattern transfer, and etching to remove film. Then, the GTL core board (101), the first core board (103), the second core board (105) and the GBL core board (107) are milled to obtain the fixed mounting groove (3). Then, the first core board (103) and the second core board (105) are subjected to browning, cleaning and roughening treatment. S42: The solid copper block (4) is positioned and embedded. The grooved GTL core board (101), first core board (103), second core board (105) and GBL core board (107) are hot-melted and riveted with the first semi-cured sheet (102), second semi-cured sheet (104) and third semi-cured sheet (106). The positions are distributed from top to bottom as follows: GTL core board (101), first semi-cured sheet (102), first core board (103), second semi-cured sheet (104), second core board (105), third semi-cured sheet (106) and GBL core board (107). High-temperature adhesive is pasted on either side of the first core board (103) and the second core board (105). Then, the solid copper block (4) prepared in S3 is embedded into the fixed installation groove (3) from the other side of the first core board (103) and the second core board (105). S43: Pressing and shaping. Place the plate with the embedded solid copper block (4) in the press, and then lay a release film on the outer layer of the GTL core plate (101) and the GBL core plate (107). Then, use a constant temperature and constant pressure process to complete the overall pressing, so that the GTL core plate (101), the first semi-cured sheet (102), the first core plate (103), the second semi-cured sheet (104), the second core plate (105), the third semi-cured sheet (106), the GBL core plate (107) and the solid copper block (4) are bonded together. S44: Post-processing, including drilling target holes, milling the frame, and resin polishing to remove excess adhesive, with residual adhesive being manually trimmed; followed by mechanical drilling, copper plating, electroplating, outer layer pattern transfer, and etching to remove the film. S45: Surface treatment and inspection. Solder resist fabrication and immersion gold surface treatment are completed in sequence. Then, electrical performance tests are performed on the finished board to check open and short circuits, resistance, and inductance parameters. Finally, the shape processing and finished product appearance inspection are carried out. After passing the inspection, the board is put into storage.

7. The method for producing a buried copper wire power PCB board with ultra-high current as described in claim 1, characterized in that: The PCB board body (1) has a connection hole (2), and the outer surface of the PCB board body (1) is also provided with a chip resistor (5) and a pin (6). The right side of the PCB board body (1) is provided with a connection terminal (7), and the connection terminal (7) has a fixing hole (8). There are two connection terminals (7), and the two connection terminals (7) are symmetrically distributed. A mating structure is provided between the connection terminal (7) and the PCB board body (1) for fixing the connection terminal (7).

8. The method for producing a buried copper wire power PCB board with ultra-high current as described in claim 7, characterized in that: The docking structure includes a connecting block (9) fixed at the left end of the connecting terminal (7), and the connecting block (9) is connected to the PCB board body (1) through the docking groove (10), and the docking groove (10) is opened inside the PCB board body (1).

9. A method for producing a buried copper wire power PCB board with ultra-high current as described in claim 7, characterized in that: The connecting block (9) and the PCB board body (1) are both provided with positioning grooves (11), and the positioning grooves (11) are connected to positioning blocks (12), and the positioning grooves (11) and the docking grooves (10) are perpendicular to each other.

10. A method for producing a buried copper wire power PCB board with ultra-high current as described in claim 3, characterized in that: The depth of the fixed mounting groove (3) is consistent with the thickness of the PCB board body (1), and the fixed mounting groove (3) is 0.075mm larger on one side than the solid copper block (4). The thickness of the solid copper block (4) is 0.05-0.1mm larger than the depth of the fixed mounting groove (3), and the solid copper block (4) is rectangular.

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