Satellite antenna PCB and manufacturing method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-10
- Publication Date
- 2026-08-11
AI Technical Summary
[0006]本申请提供一种卫星天线PCB及其制作方法，以解决现有技术 存在的装配复杂、可靠性差及辐射损耗高的问题
[0030]简化了装配流程，提升了生产效率：无需支柱对位、装配等复杂工序，只要高压压合即可完成整体成型，适合批量生产。
Smart Images
Figure CN122555088A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of PCB technology, and in particular to a satellite antenna PCB and its manufacturing method. Background Technology
[0002] In recent years, the rapid development of low-Earth orbit satellite internet has led to the emergence of satellite antenna PCB products that combine a vibrator, an air layer, and a parasitic radiator. Currently, the common manufacturing process for this product involves fabricating the vibrator core board and the parasitic radiator core board separately, then fixing them at the four corners using plastic supports to obtain the final satellite PCB product. Figure 1 As shown.
[0003] This process requires precise alignment of the vibrator and parasitic radiating plate, and subsequent assembly is complex. Furthermore, the satellite PCB product's pillar assembly structure makes direct surface mounting via reflow soldering difficult, resulting in poor vibration and impact resistance. Additionally, because the vibrator core board and parasitic radiating plate core board are assembled via pillars, which are open around the pillars, shielding holes / walls cannot be fabricated, leading to problems such as high edge radiation loss and beam dispersion.
[0004] Therefore, improvements to existing technologies are necessary.
[0005] The above information is provided as background information only to aid in understanding this application and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this application. Summary of the Invention
[0006] This application provides a satellite antenna PCB and its manufacturing method to solve the problems of complex assembly, poor reliability and high radiation loss in the prior art.
[0007] To achieve the above objectives, this application provides the following technical solution:
[0008] In a first aspect, embodiments of this application provide a method for manufacturing a satellite antenna PCB, comprising:
[0009] A first core board, a second core board, and an intermediate core board are provided. The surface of the first core board is formed with an oscillator circuit pattern, and the surface of the second core board is formed with a parasitic radiating sheet pattern.
[0010] A cavity is formed by slotting in a designated area of the intermediate core plate. The cavity is used to form an air dielectric layer between the oscillator circuit pattern and the parasitic radiating plate pattern.
[0011] Sacrificial filler material is filled into the cavity of the intermediate core plate;
[0012] The first core board, the first adhesive sheet, the intermediate core board filled with the sacrificial filler material, the second adhesive sheet, and the second core board are stacked in that order and then pressed together to form a pressed structure.
[0013] The sacrificial filler material within the press-fit structure is removed to form an integrated satellite antenna PCB.
[0014] Optionally, the sacrificial filler material includes a soluble material;
[0015] The removal of the sacrificial filler material within the press-fit structure includes:
[0016] At least one through hole is drilled in the pressing structure, and the through hole connects the outside of the pressing structure and the cavity.
[0017] Dissolving liquid is injected into the cavity through the through-hole to dissolve and remove the sacrificial filler material inside the cavity.
[0018] Optionally, the sacrificial filler material includes polymethacrylimide (PMI) foam material.
[0019] Optionally, the solution includes a sodium hydroxide solution.
[0020] Optionally, injecting the dissolving liquid into the cavity through the through-hole includes:
[0021] The press-fit structure is immersed in the solution, and the opening of the through hole is completely submerged below the liquid surface.
[0022] Optionally, there are multiple through holes, which are spaced apart along the periphery of the cavity.
[0023] Optionally, in the step of drilling at least one through hole in the pressed structure, the through hole extends from one side surface of the first core plate or the second core plate into the interior of the sacrificial filler material, and the end of the through hole is located in the middle region in the thickness direction of the sacrificial filler material.
[0024] Optionally, the manufacturing method further includes: sealing the opening of the through hole after removing the sacrificial filler material within the pressed structure.
[0025] Optionally, the manufacturing method further includes:
[0026] Before filling the cavity of the intermediate core plate with sacrificial filler material, a metal layer is electroplated on the inner wall of the cavity to form a shielding wall;
[0027] Multiple metallized shielding holes are fabricated on the outer periphery of the integrated satellite antenna PCB.
[0028] Secondly, embodiments of this application provide a satellite antenna PCB, manufactured according to the satellite antenna PCB manufacturing method described in any of the above claims.
[0029] Compared with the prior art, this application has the following beneficial effects:
[0030] It simplifies the assembly process and improves production efficiency: there is no need for complex processes such as pillar alignment and assembly. The whole molding can be completed by high pressure pressing, which is suitable for mass production.
[0031] Significantly improved product reliability: The final product manufactured in this embodiment has an integrated structure with no weak points in mechanical connection, and its vibration and impact resistance are significantly enhanced, meeting the stringent mechanical environment requirements for satellite launch and on-orbit operation.
[0032] Compatible with automated SMT production: The integrated PCB has a flat surface and overall structure, and can be used as a standard surface mount component in the reflow soldering production line to achieve automated surface mount soldering.
[0033] It can effectively improve antenna radiation performance: The PCB of this embodiment can be made with shielding holes or shielding walls to form an electromagnetic shielding structure, which can effectively reduce edge radiation loss, suppress beam dispersion, and improve the radiation efficiency and radiation pattern quality of the antenna.
[0034] This application has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and following detailed description, which together serve to explain the particular principles of this application. Attached Figure Description
[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0036] Figure 1 This is a structural view of a traditional satellite antenna PCB;
[0037] Figure 2 This is a flowchart illustrating the method for manufacturing a satellite antenna PCB according to an embodiment of this application;
[0038] Figures 3 to 10 This is a schematic diagram of the manufacturing process of the satellite antenna PCB provided in the embodiments of this application.
[0039] Reference numerals: 1. First core board; 2. Middle core board; 3. Second core board; 4. Sacrificial filler material. Detailed Implementation
[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0041] Traditional satellite antenna PCB product structure such as Figure 1 As shown, it is assembled from a vibrator core plate and a parasitic radiation plate core plate through plastic supports. Not only is the assembly complex, but it also has poor vibration and impact resistance, and has problems such as large edge radiation loss and beam dispersion.
[0042] For this purpose, please refer to Figure 2 This application provides a method for manufacturing a satellite antenna PCB, including:
[0043] S11. A first core board, a second core board, and an intermediate core board are provided. The surface of the first core board is formed with an oscillator circuit pattern, and the surface of the second core board is formed with a parasitic radiation sheet pattern.
[0044] The oscillator circuit pattern refers to a metal conductive pattern with a specific shape formed on the surface of the first core board through an etching process. As the active excitation unit of the antenna, it is directly connected to the feed network and actively radiates electromagnetic waves after being fed with a high-frequency signal.
[0045] The parasitic radiating pattern is a conductive metal pattern formed on the surface of the second core board through an etching process. As a passive tuning unit of the antenna, it is not directly connected to the feeding system. Instead, it induces current from the radiation field of the vibrator through electromagnetic coupling and radiates it again, which is used to expand the operating bandwidth and improve the radiation performance.
[0046] S12. A cavity is obtained by slotting in a designated area of the intermediate core board. The cavity is used to form an air dielectric layer between the oscillator circuit pattern and the parasitic radiation plate pattern.
[0047] A cavity refers to a hollow structure formed in a designated area of the core board through a grooving process. In the final product, the cavity will be filled with air, serving as an air dielectric layer between the oscillator circuit pattern and the parasitic radiating plate pattern.
[0048] This air dielectric layer will be used to reduce dielectric loss: compared to using solid dielectrics such as FR4, the loss tangent of the air dielectric layer is extremely low, which can significantly reduce the energy loss of the signal during coupling transmission between the vibrator and the parasitic radiating sheet, and improve the antenna radiation efficiency; reduce antenna weight: the air dielectric layer replaces part of the solid dielectric material, which helps to reduce the overall weight of the antenna, which is of great significance for satellite payloads.
[0049] S13. Fill the cavity of the intermediate core board with sacrificial filler material.
[0050] Sacrificial filler material refers to removable material that fills a cavity, provides temporary support during the pressing process, and is removed after pressing is completed. Its core characteristics include:
[0051] It exhibits strong structural stability in high temperature and high pressure environments: it can remain solid under high pressing temperature and pressure conditions, providing sufficient support strength and preventing the cavity from deforming during the pressing process;
[0052] Compatible with PCB processes: It does not react chemically with prepreg, copper foil, etc., or cause pollution.
[0053] Removability: After pressing, it can be completely removed by specific methods (such as chemical dissolution).
[0054] S14. The first core board, the first adhesive sheet, the intermediate core board filled with sacrificial filler material, the second adhesive sheet and the second core board are stacked in sequence and then pressed together to form a pressed structure.
[0055] During the lamination process, the intermediate core plate serves as the structural framework of the air medium layer, and its slotted area defines the planar dimensions and thickness of the air layer. The sacrificial filling material within the cavity remains solid under high temperature and pressure, supporting the cavity structure in both the vertical and horizontal directions, effectively preventing the cavity structure from collapsing and deforming under the pressure of the upper and lower core plates.
[0056] At the same time, the first and second adhesive sheets (i.e., semi-cured sheets) melt and flow at high temperature, filling the gaps between the core boards. After cooling, they solidify, firmly bonding the first core board, the middle core board, and the second core board into a whole.
[0057] S15. Remove the sacrificial filler material from the press-fit structure to form an integrated satellite antenna PCB.
[0058] In this step, after removing the sacrificial filler material, the first core board (containing the oscillator circuit pattern), the intermediate core board (containing the air dielectric layer formed by the cavity), and the second core board (containing the parasitic radiating sheet pattern) are firmly bonded together by the cured adhesive sheet to form an inseparable integral PCB board. Therefore, the embodiments of this application have the following effects:
[0059] It simplifies the assembly process and improves production efficiency: there is no need for complex processes such as pillar alignment and assembly. The whole molding can be completed by high pressure pressing, which is suitable for mass production.
[0060] Significantly improved product reliability: The final product manufactured in this embodiment has an integrated structure with no weak points in mechanical connection, and its vibration and impact resistance are significantly enhanced, meeting the stringent mechanical environment requirements for satellite launch and on-orbit operation.
[0061] Compatible with automated SMT production: The integrated PCB has a flat surface and overall structure, and can be used as a standard surface mount component in the reflow soldering production line to achieve automated surface mount soldering.
[0062] It can effectively improve antenna radiation performance: The PCB of this embodiment can be made with shielding holes or shielding walls to form an electromagnetic shielding structure, which can effectively reduce edge radiation loss, suppress beam dispersion, and improve the radiation efficiency and radiation pattern quality of the antenna.
[0063] In one alternative embodiment, the sacrificial filler material includes a soluble material;
[0064] Based on this, the method for removing the sacrificial filler material within the pressed structure in step S15 may include:
[0065] S151. Drill at least one through hole in the press-fit structure, the through hole connecting the outside of the press-fit structure to the cavity.
[0066] S152. Inject dissolving liquid into the cavity through the through hole to dissolve and remove the sacrificial filler material in the cavity.
[0067] To improve both efficiency and effectiveness, in the step of injecting the dissolving liquid into the cavity through the through hole, the press-fit structure can be immersed in the dissolving liquid, and the opening of the through hole can be completely submerged below the liquid surface.
[0068] Sacrificial filler material is removed by drilling through-holes combined with immersion in a dissolving solution. This allows the solution to directly contact the material's interior, significantly increasing the contact area and preventing central residue. The through-holes also provide a drainage channel for dissolved products, preventing accumulation and hindering the reaction. The immersion method enables simultaneous batch processing; the through-hole specifications are precisely defined by the drilling process, ensuring consistent results across batches and avoiding the inefficient operation of individual pouring, thus providing excellent mass production capabilities. Furthermore, both drilling and wet immersion are mature standard processes in PCB manufacturing, requiring no special equipment. The dissolving solution selectively dissolves only the sacrificial filler material, without damaging the core board substrate, cured adhesive sheets, or copper foil patterns, and without compromising the structural integrity and dimensional accuracy of the cavity. In summary, this solution achieves efficient, thorough, and non-destructive removal of sacrificial filler material while remaining compatible with existing PCB mass production processes, demonstrating significant industrial practical value.
[0069] For example, the sacrificial filler material can be selected from PMI (Polymethacrylimide) foam material, which has excellent temperature resistance, high specific strength, and can be dissolved and removed by sodium hydroxide solution. Accordingly, the dissolving solution can be selected as sodium hydroxide solution to achieve effective removal of PMI foam material.
[0070] In one alternative embodiment, there are multiple through holes, which are spaced apart along the periphery of the cavity.
[0071] Multiple through-holes are spaced apart along the periphery of the area containing the sacrificial filler material, allowing the dissolving solution to penetrate into the filler material simultaneously from multiple directions. This avoids the uneven dissolution problem caused by the dissolving solution only diffusing from a single location to the surroundings, resulting in faster dissolution at the edges and slower dissolution in the center, which is common in single-hole solutions. This significantly improves the dissolution rate and the uniformity of removal. At the same time, the spaced through-holes act as channels for injection and drainage during the dissolution process, creating a micro-circulation flow of the dissolving solution within the cavity. This effectively prevents the accumulation and saturation of dissolution products in local areas, which would hinder the continued reaction and ensure that the sacrificial filler material in each area is fully dissolved and smoothly discharged.
[0072] In one alternative embodiment, in step S51, which involves drilling at least one through hole in the press-fit structure, the through hole extends from one side surface of the first core plate or the second core plate into the interior of the sacrificial filler material, and the end of the through hole is located in the middle region in the thickness direction of the sacrificial filler material.
[0073] By placing the end of the through-hole in the middle region of the sacrificial filler material in the thickness direction, the dissolving liquid can penetrate evenly from the middle to the upper and lower sides, shortening the diffusion path of the dissolving liquid to the farthest end of the material, ensuring that each region can be fully dissolved, avoiding the problem of deep material residue due to excessive path length, and effectively ensuring dissolution efficiency and thoroughness.
[0074] In an optional embodiment, the above manufacturing method further includes: electroplating a metal layer on the inner wall of the cavity before filling the cavity of the intermediate core board with sacrificial filler material to form a shielding wall; and / or,
[0075] Multiple metallized shielding holes are fabricated on the outer periphery of the integrated satellite antenna PCB.
[0076] By using shielding walls and / or shielding holes, electromagnetic wave leakage from the cavity sidewalls and radiation diffusion at the PCB edges can be effectively suppressed, thereby reducing the edge radiation loss of the antenna and improving beam directivity and focusing performance. At the same time, this shielding structure is not constrained by the PCB assembly structure, fully leveraging the advantages of the integrated lamination structure's compatibility with conventional PCB processes, and boasts advantages such as compact structure, simple manufacturing, and reliable shielding effect.
[0077] Please see Figures 3 to 10 Below, a complete example is provided to illustrate the process, including the steps:
[0078] S21, such as Figure 3 As shown, the surface of the first core board facing the second core board is patterned by etching to form the oscillator circuit pattern.
[0079] S22, such as Figure 4 As shown, slots are cut into the middle core board.
[0080] S23, such as Figure 5 As shown, a parasitic radiating sheet pattern is formed by pattern etching on the surface of the second core board facing the first core board.
[0081] S24, such as Figure 6 As shown, the sacrificial filler material (such as PMI foam material) is cut to the same size as the slot size of the core board.
[0082] S25, such as Figure 7 As shown, the cut sacrificial filler material is filled into the grooved core board.
[0083] S26, such as Figure 8 As shown, the first core board + PP + middle core board (filled with PMI foam material) + PP + second core board are stacked together in the order of first core board + PP + middle core board + PP + second core board, and then high temperature and high pressure are applied to bond them together.
[0084] S27, such as Figure 9 As shown, other processes are carried out, such as drilling shielding holes, electroplating, and outer layer etching.
[0085] S28, such as Figure 10 As shown, a hole is drilled from one side of the first core board to the middle of the sacrificial filler material, and then the board is soaked in a sodium hydroxide solution to dissolve the sacrificial filler material.
[0086] Secondly, this application provides a satellite antenna PCB, which is manufactured according to the satellite antenna PCB manufacturing method described in any embodiment. This satellite antenna PCB possesses the corresponding beneficial effects of the manufacturing method, which will not be elaborated further here.
[0087] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.
Claims
1. A method of manufacturing a satellite antenna PCB, characterized by, include: A first core board, a second core board, and an intermediate core board are provided. The surface of the first core board is formed with an oscillator circuit pattern, and the surface of the second core board is formed with a parasitic radiating sheet pattern. A cavity is formed by slotting in a designated area of the intermediate core plate. The cavity is used to form an air dielectric layer between the oscillator circuit pattern and the parasitic radiating plate pattern. Sacrificial filler material is filled into the cavity of the intermediate core plate; The first core board, the first adhesive sheet, the intermediate core board filled with the sacrificial filler material, the second adhesive sheet, and the second core board are stacked in that order and then pressed together to form a pressed structure. The sacrificial filler material within the press-fit structure is removed to form an integrated satellite antenna PCB.
2. The method of claim 1, wherein, The sacrificial filler material includes soluble materials; The removal of the sacrificial filler material within the press-fit structure includes: At least one through hole is drilled in the pressing structure, and the through hole connects the outside of the pressing structure and the cavity. Dissolving liquid is injected into the cavity through the through-hole to dissolve and remove the sacrificial filler material inside the cavity.
3. The method of claim 2, wherein the satellite antenna PCB is manufactured by, The sacrificial filler material includes polymethacrylimide (PMI) foam material.
4. The method of claim 2, wherein the satellite antenna PCB is manufactured by a process comprising: The solution includes a sodium hydroxide solution.
5. The method of claim 2, wherein the satellite antenna PCB is manufactured by a process comprising: The injection of dissolving liquid into the cavity through the through hole includes: The press-fit structure is immersed in the solution, and the opening of the through hole is completely submerged below the liquid surface.
6. The method for manufacturing a satellite antenna PCB according to claim 2, characterized in that, The number of through holes is multiple, and the multiple through holes are distributed at intervals along the periphery of the cavity.
7. The method of claim 2, wherein the satellite antenna PCB is manufactured by a process comprising: In the step of drilling at least one through hole in the press-fit structure, the through hole extends from one side surface of the first core plate or the second core plate into the interior of the sacrificial filler material, and the end of the through hole is located in the middle region in the thickness direction of the sacrificial filler material.
8. The method of claim 2, wherein the satellite antenna PCB is manufactured by a process comprising: The manufacturing method further includes: sealing the opening of the through hole after removing the sacrificial filler material in the pressed structure.
9. The method of claim 1, wherein, The manufacturing method further includes: Before filling the cavity of the intermediate core plate with sacrificial filler material, a metal layer is electroplated on the inner wall of the cavity to form a shielding wall; Multiple metallized shielding holes are fabricated on the outer periphery of the integrated satellite antenna PCB.
10. A satellite antenna PCB, characterized in that, The PCB is manufactured using the method for manufacturing a satellite antenna PCB according to any one of claims 1 to 9.