Preparation method of multi-layer ceramic with special-shaped structure and ceramic package tube

Abstract

The application relates to the field of preparation of ceramic with special-shaped structure, and particularly discloses a preparation method of ceramic with special-shaped multi-layer structure and a ceramic packaging tube shell, which solves the problems that the internal special-shaped cavity of the existing ceramic packaging tube shell is difficult to prepare, the printed circuit of the ceramic flow-down sheet is prone to short circuit, the yield is low, and the pin arrangement position of the ceramic packaging tube shell cannot be flexibly adjusted. The application provides the following scheme, which comprises a ceramic packaging tube shell, a bottom ceramic flow-down sheet, a general ceramic flow-down sheet, a wiring groove, a through hole, a printed circuit, a metallized column, a positioning boss and a positioning groove. The middle part of the general ceramic flow-down sheet is provided with an installation cavity hole, the inner wall of the installation cavity hole is connected with an alumina-based transition layer, the two sides of the bottom ceramic flow-down sheet are provided with pin openings, the pin openings are further provided with grouting holes, and the pin openings are provided with pins. The ceramic packaging tube shell can be used for preparing various special-shaped cavities, the pin positions around the ceramic packaging tube shell can be flexibly adjusted and arranged, the yield of the prepared product is better, and the service performance is stable.

Description

Technical Field

[0001] This invention relates to the field of irregularly shaped ceramic preparation, and in particular to a method for preparing multi-layered irregularly shaped ceramics and a ceramic encapsulation shell. Background Technology

[0002] Ceramic packaging shells are ceramic housings made by using multi-layer ceramic cast sheets as a substrate, and molding them into a single piece through screen printing of metal lines, creating through-holes, stacking, hot pressing, and high-temperature co-firing. This results in a cavity, internal wiring, and a hermetically sealable ceramic outer shell. The interior can house semiconductor chips, MEMS devices, and radio frequency components; the exterior features lead pins and a sealed enclosure, providing a dedicated ceramic packaging shell for the precision chips, offering support, sealing, electrical interconnection, protection, and heat dissipation.

[0003] However, existing ceramic encapsulation shells are generally not suitable for forming structures with irregularly shaped cavities on the inner wall to meet the encapsulation requirements of devices of different shapes. Furthermore, during actual production, when the ceramic cast sheets are thermo-pressed together, the printed circuits on them move between the ceramic cast sheets due to heat and pressure, leading to micro-short circuits and reducing yield. Additionally, flexible pin hole arrangement is inconvenient during production; some devices have pin bonding points on the side, while others have them on the bottom. This mismatch between the pins and the bonding positions on the device increases bonding difficulty and further reduces yield. Therefore, a method for preparing multilayer ceramics with irregularly shaped structures and a ceramic encapsulation shell are proposed. Summary of the Invention

[0004] To overcome the shortcomings of existing technologies, this invention proposes a method for preparing multilayer ceramics with irregular structures and a ceramic packaging shell. This method can prepare ceramic packaging shells with irregular internal cavities, and the internal printed circuits are more stable during stacking. At the same time, the pin hole positions can be flexibly arranged according to the device requirements, making it suitable for packaging various devices.

[0005] To solve the above-mentioned technical problems, the basic technical solution proposed by this invention is as follows:

[0006] A method for preparing multilayer ceramics with irregular structures includes the following steps:

[0007] Step 1: Prepare the bottom ceramic casting sheet and the general ceramic casting sheet, and stamp the prepared bottom ceramic casting sheet and the general ceramic casting sheet to form positioning bosses and positioning grooves;

[0008] Step 2: Cut the bottom ceramic tape and the general ceramic tape to form wiring grooves and through holes, and open the mounting cavity with a size gradient in the middle of the general ceramic tape, and 3D print an alumina-based transition layer on the inner wall of the mounting cavity.

[0009] Step 3: Select the bottom ceramic casting film corresponding to the bottom layer to open pin ports on both sides, and open the injection holes on the pin ports. Print or fill the metal paste along the wiring groove and through hole pattern, and then dry to form the printed circuit and metallized pillars;

[0010] Step 4: Select several layers of the bottom ceramic casting sheet and general ceramic casting sheet, stack them together, and position them by positioning bosses and positioning grooves, and then perform hot pressing to form a ceramic encapsulation shell.

[0011] Preferably, in step three, if the pin openings are not selected on both sides of the bottom ceramic casting sheet, then the outer openings and inner openings are respectively opened on both sides of the general ceramic casting sheet and on both sides of the inner wall of the mounting cavity, and a connecting strip is formed between the outer openings and the inner openings. When the general ceramic casting sheets are stacked in multiple layers, each of the outer openings and inner openings forms a pin hole.

[0012] Preferably, in step two, a portion of the general-purpose ceramic cast sheet is selected and used as a dam layer, and a dam ring is laser-cut out on the first layer of general-purpose ceramic cast sheet on the upper end face of the dam layer. In step three, metal slurry is 3D printed into the dam ring to form a dam.

[0013] Preferably, the ceramic encapsulation shell formed in step four consists of a bottom layer formed by stacking multiple layers of bottom ceramic cast sheets, an intermediate wiring layer formed by stacking multiple layers of general-purpose ceramic cast sheets, and a dam layer.

[0014] Preferably, in step two, an annular groove is formed in the positioning groove by laser cutting, and in step three, a positioning ring is printed on the positioning boss by 3D printing. The positioning ring and the annular groove on the bottom ceramic casting sheet and the general ceramic casting sheet of different layers are fitted together.

[0015] Preferably, when the bottom ceramic casting sheets are stacked in multiple layers, each of the pin openings forms a pin hole for inserting pins, and the multiple layers of grouting holes form a grouting tube for filling the grouting tube with metal grout so as to be flush with the bottom wall of the ceramic encapsulation tube.

[0016] A ceramic encapsulation shell includes a bottom layer, an intermediate wiring layer, and a damming layer. The bottom layer is formed by stacking multiple layers of bottom ceramic cast sheets. The intermediate wiring layer and the damming layer are formed by stacking multiple layers of general-purpose ceramic cast sheets. Wiring grooves are formed on one surface of both the bottom ceramic cast sheets and the general-purpose ceramic cast sheets. Through holes penetrating the bottom ceramic cast sheets or general-purpose ceramic cast sheets are formed in the inner wall of the wiring grooves. Printed circuits are printed or 3D printed within the wiring grooves, and the printed circuits are connected to... Metallized pillars penetrate through the through hole and are flush with both sides of the bottom ceramic casting sheet or general ceramic casting sheet. The bottom ceramic casting sheet and general ceramic casting sheet are provided with positioning bosses on one side, and positioning grooves that cooperate with the positioning bosses are provided on the corresponding side. The general ceramic casting sheet is provided with a mounting cavity in the middle, and the inner wall of the mounting cavity is connected with an alumina-based transition layer. The bottom ceramic casting sheet is provided with pin openings on both sides, and injection holes are also provided on the pin openings. Pins are inserted into the pin openings.

[0017] Preferably, a positioning ring is connected to the positioning protrusion, an annular groove is formed on the inner wall of the positioning groove, the positioning ring is fitted with a sleeve in the annular groove, an irregular cavity wall is provided inside the ceramic encapsulation tube, a ramp is stamped on the inner wall of the mounting cavity, the alumina-based transition layer is filled into the inner wall of the ramp by 3D printing, multiple layers of bottom ceramic casting sheets with the pin openings are stacked to form pin holes, the pins are installed in the pin holes, multiple layers of bottom ceramic casting sheets with the grouting holes are stacked to form a grouting tube, the grouting tube is filled with metal slurry and is flush with the inner bottom wall of the ceramic encapsulation tube.

[0018] Preferably, the mounting cavity of the universal ceramic casting sheet has an inner opening on both sides of the inner wall, and the universal ceramic casting sheet has an outer opening on both sides corresponding to the inner opening. A connecting strip is formed between the inner opening and the outer opening. When multiple layers of the universal ceramic casting sheet are stacked, a pin hole is formed between the inner opening and the outer opening of each layer, and the pin is installed in the pin hole.

[0019] Preferably, the universal ceramic casting sheet has a dam ring that runs through each positioning boss. The dam ring is 3D printed with metal paste to form a dam higher than the positioning boss. The universal ceramic casting sheet has a stabilizing hole that is 3D printed with metal paste to form a stabilizing block.

[0020] The beneficial effects of this invention are:

[0021] 1. The technical solution of this invention involves creating wiring grooves on a bottom ceramic cast sheet or a general-purpose ceramic cast sheet, with through holes penetrating the bottom ceramic cast sheet or general-purpose ceramic cast sheet within the wiring grooves. Circuits are printed or 3D printed within the wiring grooves, and metal paste is injected into the through holes to connect with the printed circuits, forming a planar circuit on the bottom ceramic cast sheet or general-purpose ceramic cast sheet. During stacking, the layers of bottom ceramic cast sheets or general-purpose ceramic cast sheets are connected through metallized pillars formed by the metal paste injected into the through holes, thus forming a complete three-dimensional circuit. This ensures that during subsequent stacking, the printed circuits on each layer of bottom ceramic cast sheets or general-purpose ceramic cast sheets are not subjected to heat or pressure due to being on their surface. The flow generated during this process leads to localized short circuits, thereby further improving the yield. Simultaneously, mounting cavities are created within the general-purpose ceramic cast sheets. During stacking, these cavities form mounting chambers for the equipment. Furthermore, the dimensions of these mounting cavities can be progressively changed in steps to create irregularly shaped cavities, accommodating various structural shapes of equipment. Additionally, an alumina-based transition layer is 3D-printed within the mounting cavities. During the hot-pressing process, the heated alumina-based transition layer fills the inner walls of the steps, ensuring a smooth inner wall and stable performance for the ceramic encapsulation shell composed of the bottom ceramic cast sheets and the general-purpose ceramic cast sheets.

[0022] 2. The technical solution of the present invention opens pin holes on both sides of the bottom ceramic casting sheet and stacks them so that the pin holes of each layer can form pin holes. Inner and outer openings are opened on both sides of the general ceramic casting sheet and stacked so that the corresponding inner and outer openings can also form pin holes. This allows for easy adjustment of the opening position of the pin holes on the ceramic package shell according to the equipment situation, and corresponding pin arrangement, so as to ensure that the pins can be easily and accurately bonded to the equipment. At the same time, the connecting strip between the inner and outer openings can ensure that the general ceramic casting sheet is not cut off. When it is necessary to insert pins, it is only necessary to cut off the three-dimensional connecting strip formed by the stacking of the inner and outer openings by laser cutting.

[0023] 3. The technical solution of this invention involves creating a dam ring on a general-purpose ceramic cast sheet and communicating with a positioning boss. Then, a dam is formed by 3D printing or injecting metal paste into the dam ring. This allows the dam to be embedded in the uppermost or several uppermost layers of the general-purpose ceramic cast sheet, ensuring a stable connection between the dam and the ceramic encapsulation shell. Simultaneously, stabilizing holes are also provided on the general-purpose ceramic cast sheet. After the ceramic encapsulation shell is stacked, metal paste can be injected into it to form a stabilizing block, thereby ensuring improved structural strength of each general-purpose ceramic cast sheet after stacking and in subsequent use, thus improving its stability in use. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the present invention;

[0025] Figure 2 This is a sectional view of the side structure of the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of the universal ceramic casting sheet of the present invention;

[0027] Figure 4 This is a bottom view of the general-purpose ceramic casting sheet of the present invention;

[0028] Figure 5 This is a schematic diagram of the structure of the universal ceramic casting sheet of the present invention having an alumina-based transition layer;

[0029] Figure 6 for Figure 3 Enlarged view of point A in the middle;

[0030] Figure 7 for Figure 4 Enlarged view of point B in the middle;

[0031] Figure 8 for Figure 5 Enlarged view of point C in the middle;

[0032] Figure 9 This is a schematic diagram showing that the bottom ceramic casting sheet of the present invention has lead ports on both sides;

[0033] Figure 10 This is a schematic diagram of the structure of the universal ceramic casting sheet of the present invention, which has a dam ring and a stabilizing hole.

[0034] Figure 11 This is a schematic diagram of the structure of the universal ceramic casting sheet of the present invention, which has inner and outer openings on both sides;

[0035] Figure 12 This is a schematic diagram of the structure of the present invention where the pin port is located in the middle wiring layer;

[0036] Figure 13 This is a cross-sectional view of the pin port of the present invention located in the middle wiring layer structure.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Ceramic encapsulation shell; 2. Bottom layer; 3. Intermediate wiring layer; 4. Dam layer; 5. Bottom ceramic cast sheet; 6. General-purpose ceramic cast sheet; 7. Wiring groove; 8. Through hole; 9. Printed circuit; 10. Metallized pillar; 11. Positioning boss; 12. Positioning ring; 13. Positioning groove; 14. Ring groove; 15. Mounting cavity hole; 16. Inclined platform; 17. Alumina-based transition layer; 18. Inner opening; 19. Outer opening; 20. Connecting strip; 21. Pin opening; 22. Grouting hole; 23. Grouting pipe; 24. Pin hole; 25. Pin; 26. Dam ring; 27. Dam; 28. Stabilizing hole; 29. ​​Stabilizing block; 30. Irregular cavity wall. Detailed Implementation

[0039] The following will be combined with the appendix Figure 1 To be continued Figure 13 The technical solutions in the embodiments of the present invention have been clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0040] Example 1:

[0041] like Figures 1-13 As shown, this invention discloses a method for preparing multilayer ceramics with irregular structures, comprising the following steps:

[0042] Step 1: Prepare the bottom ceramic casting sheet 5 and the general ceramic casting sheet 6. Stamp the prepared bottom ceramic casting sheet 5 and the general ceramic casting sheet 6 to form the positioning boss 11 and the positioning groove 13.

[0043] Step 2: Cut the bottom ceramic casting sheet 5 and the general ceramic casting sheet 6 to form wiring grooves 7 and through holes 8, and open mounting cavity holes 15 with varying sizes in the middle of the general ceramic casting sheet 6, and 3D print an alumina-based transition layer 17 on the inner wall of the mounting cavity hole 15.

[0044] Step 3: Select the bottom ceramic casting film 5 corresponding to the bottom layer 2 to open the pin openings 21 on both sides, and open the injection holes 22 on the pin openings 21. Print or fill the metal paste along the wiring groove 7 and through hole 8, and then dry to form the printed circuit 9 and metallized pillar 10.

[0045] Step 4: Select several layers of bottom ceramic casting sheets 5 and general ceramic casting sheets 6, stack them together, and position them through positioning bosses 11 and positioning grooves 13, and then perform hot pressing to form ceramic encapsulation shell 1.

[0046] In step three, if the pin openings 21 are not selected on both sides of the bottom ceramic casting sheet 5, then the outer openings 19 and inner openings 18 are selected on both sides of the general ceramic casting sheet 6 and on both sides of the inner wall of the mounting cavity 15, and a connecting strip 20 is formed between the outer openings 19 and the inner openings 18. When the general ceramic casting sheets 6 are stacked in multiple layers, each outer opening 19 and inner opening 18 forms a pin hole 24.

[0047] In step two, a portion of the general-purpose ceramic cast sheet 6 is selected and used as the dam layer 4. A dam ring 26 is laser-cut out on the first layer of the general-purpose ceramic cast sheet 6 on the upper end face of the dam layer 4. In step three, metal slurry is 3D printed into the dam ring 26 to form a dam 27.

[0048] The ceramic encapsulation shell 1 formed in step four consists of a bottom layer 2 formed by stacking multiple layers of bottom ceramic casting sheets 5, an intermediate wiring layer 3 formed by stacking multiple layers of general-purpose ceramic casting sheets 6, and a dam layer 4.

[0049] In step two, an annular groove 14 is opened in the positioning groove 13 by laser cutting. In step three, a positioning ring 12 is printed on the positioning boss 11 by 3D printing. The positioning ring 12 and the annular groove 14 are fitted together on the bottom ceramic casting sheet 5 and the general ceramic casting sheet 6 of different layers.

[0050] When the bottom ceramic casting sheet 5 is stacked in multiple layers, each pin port 21 forms a pin hole 24 for inserting the pin 25, and the multiple layers of grouting holes 22 form a grouting tube 23 for filling the grouting tube 23 with metal grout so as to be flush with the inner bottom wall of the ceramic encapsulation shell 1.

[0051] This allows wiring grooves 7 and through holes 8 to be first opened on the bottom ceramic casting sheet 5 and the general ceramic casting sheet 6, and then printed circuits 9 and metallized pillars 10 to be arranged in them, thereby forming a planar circuit embedded in the bottom ceramic casting sheet 5 and the general ceramic casting sheet 6 and metallized pillars 10 that can connect each layer. This ensures that the printed circuits 9 and metallized pillars 10 will not flow due to heat and pressure during subsequent hot pressing and lamination, which would cause local short circuits and improve the yield.

[0052] By arranging pin holes 24 on both sides of the bottom ceramic casting film 5 in the bottom layer 2 or on both sides of the general ceramic casting film 6 in the middle wiring layer 3, the mounting position of the pins 25 can be changed, so as to ensure that the position of the pins 25 can be reasonably arranged according to the bonding situation when packaging different devices, thereby improving the convenience and stability of bonding.

[0053] By creating a dam ring 26 on the top layer or the top few layers of the general ceramic casting sheet 6, and embedding a dam 27 inside the dam ring 26, the stability of the dam 27 installed on it is ensured, thus ensuring the overall stability of the subsequent ceramic encapsulation shell 1 structure.

[0054] Example 2:

[0055] like Figures 1-13 As shown, this invention discloses a ceramic encapsulation shell, comprising a ceramic encapsulation shell 1 consisting of a bottom layer 2, an intermediate wiring layer 3, and a damming layer 4. The bottom layer 2 is formed by stacking multiple layers of bottom ceramic cast sheets 5. The intermediate wiring layer 3 and the damming layer 4 are formed by stacking multiple layers of general-purpose ceramic cast sheets 6. Wiring grooves 7 are formed on one side surface of both the bottom ceramic cast sheets 5 and the general-purpose ceramic cast sheets 6. Through holes 8 penetrating the bottom ceramic cast sheets 5 or the general-purpose ceramic cast sheets 6 are formed in the inner wall of the wiring grooves 7. Printed circuits 9 are printed or 3D printed in the wiring grooves 7, and the printed circuits 9 are connected to the through holes. Metallized pillars 10 penetrate and are flush with both sides of the bottom ceramic casting sheet 5 or the general ceramic casting sheet 6. A positioning boss 11 is provided on one side of both the bottom ceramic casting sheet 5 and the general ceramic casting sheet 6, and a positioning groove 13 that mates with the positioning boss 11 is provided on the corresponding side of the other side. An installation cavity 15 is provided in the middle of the general ceramic casting sheet 6, and an alumina-based transition layer 17 is connected to the inner wall of the installation cavity 15. Pin openings 21 are provided on both sides of the bottom ceramic casting sheet 5, and injection holes 22 are also provided on the pin openings 21. Pins 25 are inserted into the pin openings 21.

[0056] A positioning ring 12 is connected to the positioning boss 11. An annular groove 14 is formed on the inner wall of the positioning groove 13. The positioning ring 12 is fitted with a sleeve in the annular groove 14. An irregular cavity wall 30 is provided inside the ceramic encapsulation shell 1. An inclined platform 16 is stamped on the inner wall of the mounting cavity 15. The alumina-based transition layer 17 is filled into the inner wall of the inclined platform 16 by 3D printing. Multiple layers of bottom ceramic casting sheets 5 with pin openings 21 are stacked to form pin holes 24. Pins 25 are installed in the pin holes 24. Multiple layers of bottom ceramic casting sheets 5 with injection holes 22 are stacked to form an injection tube 23. The injection tube 23 is filled with metal slurry and is flush with the inner bottom wall of the ceramic encapsulation shell 1. The inclined platform 16 can ensure that the alumina-based transition layer 17 is stably connected to it during 3D printing.

[0057] By creating wiring grooves 7 on the bottom ceramic casting sheet 5 or general-purpose ceramic casting sheet 6, and through-holes 8 penetrating the bottom ceramic casting sheet 5 or general-purpose ceramic casting sheet 6 within the wiring grooves 7, and printing or 3D printing circuits 9 within the wiring grooves 7, while simultaneously injecting metal paste into the through-holes 8 to connect with the printed circuits 9, a planar circuit is formed on the bottom ceramic casting sheet 5 or general-purpose ceramic casting sheet 6. During stacking, the layers of bottom ceramic casting sheets 5 or general-purpose ceramic casting sheets 6 are connected through metallized pillars 10 formed by injecting metal paste into the through-holes 8, thus forming a complete three-dimensional circuit. This ensures that during subsequent stacking, the printed circuits 9 on each layer of bottom ceramic casting sheets 5 or general-purpose ceramic casting sheets 6 will not experience flow problems due to being on their surface and subjected to heat and pressure. The movement leads to local short circuits, thereby further improving the yield. At the same time, mounting cavities 15 are opened in the general ceramic cast sheets 6. During the stacking, the mounting cavities 15 of each layer of general ceramic cast sheets 6 can form mounting cavities for the equipment. The mounting cavities 15 on each layer of general ceramic cast sheets 6 can also be gradually changed in size in steps so that the stacking can form irregular cavities to meet the packaging of equipment with various structural shapes. At the same time, an alumina-based transition layer 17 is 3D printed in the mounting cavity 15. During the stacking hot pressing process, the alumina-based transition layer 17 can fill the inner wall of the steps when heated, ensuring that the inner wall of the ceramic encapsulation shell 1 composed of each bottom ceramic cast sheet 5 and the general ceramic cast sheet 6 is smooth and the performance is stable.

[0058] Furthermore, the grouting tube 23 allows the pin port 21 of the bottom layer 2 to be connected to it. After the pin 25 is installed, metal slurry is injected into the grouting tube 23 to make it flush with the inner wall of the bottom of the ceramic encapsulation shell 1, thus forming a connection between the pin 25 and the inner bottom of the ceramic encapsulation shell 1, which facilitates bonding with the bottom of the device. When the pin 25 is in the middle wiring layer 3, it is convenient to bond to both sides of the device.

[0059] Example 3:

[0060] like Figures 1-13 As shown, the present invention discloses a ceramic package shell. Compared with Embodiment 2, this embodiment discloses a configuration in which the pin hole 24 is located in a different position.

[0061] The mounting cavity 15 of the general ceramic casting sheet 6 has an inner opening 18 on both sides of the inner wall, and an outer opening 19 corresponding to the inner opening 18 is formed on both sides of the general ceramic casting sheet 6. A connecting strip 20 is formed between the inner opening 18 and the outer opening 19. When multiple layers of general ceramic casting sheets 6 are stacked, a pin hole 24 is formed between the inner opening 18 and the outer opening 19 of each layer, and the pin 25 is installed in the pin hole 24.

[0062] By opening pin openings 21 on both sides of the bottom ceramic casting sheet 5 and stacking them together, the pin openings 21 of each layer can form pin holes 24. On both sides of the general ceramic casting sheet 6, inner openings 18 and outer openings 19 are opened and stacked together, so that the corresponding inner openings 18 and outer openings 19 can also form pin holes 24. This allows for easy adjustment of the opening position of the pin holes 24 on the ceramic packaging shell 1 according to the equipment requirements, and corresponding pins 25 can be arranged to ensure that the pins 25 can be easily and accurately bonded to the equipment. At the same time, the connecting strip 20 between the inner opening 18 and the outer opening 19 can ensure that the general ceramic casting sheet 6 will not be cut off. When it is necessary to insert the pins 25, it is only necessary to cut off the three-dimensional connecting strip 20 formed by the stacking of the inner opening 18 and the outer opening 19 by laser cutting.

[0063] Example 4:

[0064] like Figures 1-13 As shown, the present invention discloses a ceramic encapsulation shell. Compared with Embodiment 3, this embodiment discloses a structure that strengthens the stacking strength of the ceramic encapsulation shell 1.

[0065] A dam ring 26 is formed on the general ceramic casting sheet 6. The dam ring 26 passes through each positioning boss 11. Metal paste is 3D printed inside the dam ring 26, forming a dam 27 that is higher than the positioning boss 11. A stabilizing hole 28 is formed on the general ceramic casting sheet 6. Metal paste is 3D printed inside the stabilizing hole 28, forming a stabilizing block 29.

[0066] By creating a dam ring 26 on the general-purpose ceramic cast sheet 6 and connecting it with the positioning boss 11, and then 3D printing or injecting metal paste into the dam ring 26 to form a dam 27, the dam 27 is embedded in the uppermost or several uppermost layers of the general-purpose ceramic cast sheet 6 in the dam layer 4, ensuring a stable connection between the dam 27 and the ceramic encapsulation shell 1. At the same time, the general-purpose ceramic cast sheet 6 is also provided with stabilizing holes 28, and after the ceramic encapsulation shell 1 is stacked, metal paste can be injected into it to form a stabilizing block 29, so as to ensure that the structural strength of each general-purpose ceramic cast sheet 6 is improved after stacking and in subsequent use, thereby improving the stability of use.

[0067] Based on the disclosure and teachings of the foregoing specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the protection scope of the claims of the present invention. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on the present invention.

Claims

1. A method for preparing multilayer ceramics with irregular structures, characterized in that, Includes the following steps: Step 1: Prepare the bottom ceramic tape (5) and the general ceramic tape (6). Stamp the prepared bottom ceramic tape (5) and the general ceramic tape (6) to form a positioning boss (11) and a positioning groove (13). Step 2: Cut the bottom ceramic casting sheet (5) and the general ceramic casting sheet (6) to form wiring grooves (7) and through holes (8), and open mounting cavity holes (15) with varying sizes in the middle of the general ceramic casting sheet (6), and 3D print an alumina-based transition layer (17) on the inner wall of the mounting cavity hole (15). Open an annular groove (14) in the positioning groove (13) by laser cutting. A ramp (16) is punched on the inner wall of the mounting cavity hole (15), and the alumina-based transition layer (17) is filled in the inner wall of the ramp (16) by 3D printing. Step 3: A positioning ring (12) is printed on the positioning boss (11) by 3D printing. The positioning ring (12) and the ring groove (14) on the bottom ceramic casting sheet (5) and the general ceramic casting sheet (6) of different layers are fitted together. The pin openings (21) are opened on both sides of the bottom ceramic casting sheet (5) corresponding to the bottom layer (2), and the injection holes (22) are opened on the pin openings (21). Metal paste is printed or filled along the texture of the wiring groove (7) and the through hole (8), and then dried to form the printed circuit (9) and metallized pillar (10). When it is not chosen to open pin openings (21) on both sides of the bottom ceramic casting sheet (5), an outer opening (19) and an inner opening (18) are opened on both sides of the general ceramic casting sheet (6) and on both sides of the inner wall of the mounting cavity (15) therein, and a connecting strip (20) is formed between the outer opening (19) and the inner opening (18). When the general ceramic casting sheet (6) is stacked in multiple layers, each of the outer openings (19) and the inner openings (18) forms a pin hole (24). When it is necessary to insert a pin (25), the three-dimensional connecting strip (20) formed by the stacking of the inner opening (18) and the outer opening (19) is cut off by laser cutting. Step 4: Select several layers of the bottom ceramic casting sheet (5) and general ceramic casting sheet (6) to stack, and position them by positioning boss (11) and positioning groove (13), and then perform hot pressing to form ceramic encapsulation shell (1).

2. The method for preparing multilayer ceramics with irregular structures according to claim 1, characterized in that, In step two, a portion of the general ceramic cast sheet (6) is selected and used as a dam layer (4). A dam ring (26) is cut out on the first layer of the general ceramic cast sheet (6) on the upper end face of the dam layer (4) by laser cutting. In step three, metal paste is 3D printed into the dam ring (26) to form a dam (27).

3. The method for preparing multilayer ceramics with irregular structures according to claim 2, characterized in that, The ceramic encapsulation shell (1) formed in step four consists of a bottom layer (2) formed by stacking multiple layers of bottom ceramic casting sheets (5), an intermediate wiring layer (3) formed by stacking multiple layers of general-purpose ceramic casting sheets (6), and a dam layer (4).

4. The method for preparing multilayer ceramics with irregular structures according to claim 3, characterized in that, When the bottom ceramic casting sheet (5) is stacked in multiple layers, each of the pin ports (21) forms a pin hole (24) for inserting the pin (25), and the multiple layers of grouting holes (22) form a grouting tube (23) for filling the grouting tube (23) with metal grout to be flush with the inner bottom wall of the ceramic encapsulation shell (1).

5. A ceramic encapsulation shell, manufactured based on the multilayer ceramic preparation method of an irregular structure as described in any one of claims 2-4, comprising a ceramic encapsulation shell (1) composed of a bottom layer (2), an intermediate wiring layer (3), and a dam layer (4), characterized in that, The bottom layer (2) is formed by stacking multiple layers of bottom ceramic cast sheets (5). The intermediate wiring layer (3) and the dam layer (4) are formed by stacking multiple layers of general-purpose ceramic cast sheets (6). Wiring grooves (7) are provided on one side surface of both the bottom ceramic cast sheets (5) and the general-purpose ceramic cast sheets (6). Through holes (8) penetrating the bottom ceramic cast sheets (5) or the general-purpose ceramic cast sheets (6) are provided on the inner wall of the wiring grooves (7). Printed circuits (9) are printed or 3D printed in the wiring grooves (7). The printed circuits (9) are also connected to the through holes (8) and are flush with the bottom ceramic cast sheets (5) or the general-purpose ceramic cast sheets (6). Metallized pillars (10) on both sides of the sheet (6), positioning bosses (11) are provided on one side of both the bottom ceramic casting sheet (5) and the general ceramic casting sheet (6), and positioning grooves (13) that cooperate with the positioning bosses (11) are provided on the corresponding side of the other side. An installation cavity (15) is provided in the middle of the general ceramic casting sheet (6), and an alumina-based transition layer (17) is connected to the inner wall of the installation cavity (15). Pin openings (21) are provided on both sides of the bottom ceramic casting sheet (5), and injection holes (22) are also provided on the pin openings (21). Pins (25) are inserted into the pin openings (21). The positioning boss (11) is connected to a positioning ring (12), the inner wall of the positioning groove (13) is provided with an annular groove (14), the positioning ring (12) is fitted with a sleeve in the annular groove (14), the ceramic encapsulation shell (1) is provided with a shaped cavity wall (30), the inner wall of the mounting cavity (15) is stamped with a ramp (16), the alumina-based transition layer (17) is filled in the inner wall of the ramp (16) by 3D printing, the bottom ceramic casting sheets (5) with the pin opening (21) are stacked to form a pin hole (24), the pin (25) is installed in the pin hole (24), the bottom ceramic casting sheets (5) with the grouting hole (22) are stacked to form a grouting tube (23), the grouting tube (23) is filled with metal slurry and is flush with the inner bottom wall of the ceramic encapsulation shell (1); The mounting cavity (15) of the general ceramic casting sheet (6) has an inner opening (18) on both sides of the inner wall. The general ceramic casting sheet (6) has an outer opening (19) on both sides corresponding to the inner opening (18). A connecting strip (20) is formed between the inner opening (18) and the outer opening (19). When multiple layers of the general ceramic casting sheet (6) are stacked, a pin hole (24) is formed between the inner opening (18) and the outer opening (19) of each layer. The pin (25) is installed in the pin hole (24).

6. A ceramic encapsulation tube shell according to claim 5, characterized in that, The universal ceramic casting sheet (6) has a dam ring (26) that passes through each positioning boss (11). The dam ring (26) is 3D printed with metal paste and forms a dam (27) higher than the positioning boss (11). The universal ceramic casting sheet (6) has a stabilizing hole (28) that is 3D printed with metal paste and forms a stabilizing block (29).

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