High speed active copper cable module and stress release method thereof

Abstract

This invention relates to a high-speed active copper cable module and its stress relief method. The module includes a module housing, a circuit board, a chip, and a copper cable. The circuit board is disposed within the module housing, and the chip is disposed on the circuit board. A thermally conductive area and a mechanical stress relief area are arranged within the module housing. A thermally conductive area is formed between the chip and the module housing to conduct the thermal stress generated by the chip to the module housing in a predetermined direction. The copper cable is connected to the circuit board, and the mechanical stress relief area is formed along the connection path between them. The thermally conductive area and the mechanical stress relief area are arranged horizontally adjacent to each other. This invention allows the mechanical stress generated by the copper cable to be released through the mechanical stress relief area, and the thermal stress within the module to be released through the thermally conductive area. This achieves effective decoupling of thermal and mechanical stresses, fundamentally preventing the superposition of the two types of stress at the connection point, significantly reducing the stress concentration at the circuit board connection point, and effectively reducing the risk of solder joint fatigue failure.

Description

Technical Field

[0001] This invention relates to the field of high-speed data communication interconnection technology, and in particular to a high-speed active copper cable module and its stress relief method. Background Technology

[0002] As data center switching chip speeds develop towards 800G, 1.6T and above, high-speed copper cable modules are widely used in short-distance high-speed interconnection scenarios within and between devices due to their advantages in power consumption, cost and deployment flexibility.

[0003] As high-speed copper cable modules develop towards higher speeds, the packages of link compensation chips used in circuit design are larger. To ensure the integrity of high-speed signals, priority is given to maximizing the PCB layout area required for circuit design. Due to the limited package size, the space left for cable stress relief within the package is shorter, resulting in lower reliability. Compared to previous passive copper cable DAC modules with only control chips, high-speed copper cable modules face greater stress. In actual operation, high-speed copper cable modules face two unavoidable sources of stress: thermal stress, where the re-timer or re-drive chips in active copper cable modules continuously generate heat during high-speed operation, causing thermal expansion and contraction of the chip package, circuit board, and its connection structure; and mechanical stress, where copper cables inevitably bend, twist, or shift during installation, wiring, maintenance, and operation, and this type of mechanical stress usually exhibits multi-axis coupling characteristics.

[0004] In existing technologies, thermal and mechanical stresses often overlap at circuit board solder joints or cable connections, easily leading to complex stress concentrations. This can result in solder joint fatigue, connection failure, or electrical performance degradation. Current solutions primarily address heat dissipation or mechanical reinforcement from a single perspective, lacking a module-level system design to address the synergistic effects of thermal and mechanical stresses. This makes it difficult to meet the long-term reliability requirements of high-speed copper cable modules. The following problems persist: First, existing solutions lack a systematic consideration of the synergistic effects of thermal and mechanical stresses, making it easy for these two types of stresses to overlap and form stress concentrations at connection points. Second, existing technologies are insufficient in handling multi-axis mechanical stresses, making it difficult to cope with the complex bending and torsional conditions of copper cables. Finally, existing solutions lack a module-level system design approach, failing to comprehensively plan the thermal stress transmission path and mechanical stress release path, leading to mutual interference between the two types of stresses. These problems make it difficult to effectively guarantee the long-term reliability of existing high-speed copper cable modules under high power consumption and complex bending conditions, especially in applications supporting high-speed signal transmission such as 112Gbps or 224Gbps PAM4. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a high-speed active copper cable module, comprising a module housing, a circuit board, a chip, and a copper cable. The circuit board is disposed within the module housing, and the chip is disposed on the circuit board. A heat-conducting area and a mechanical stress-relieving area are arranged within the module housing. A heat-conducting area is formed between the chip and the module housing to conduct the thermal stress generated by the chip to the module housing in a predetermined direction. The copper cable is connected to the circuit board, and the mechanical stress-relieving area is formed along the connection path between the two. The heat-conducting area and the mechanical stress-relieving area are arranged horizontally adjacent to each other.

[0006] Furthermore, the mechanical stress relief area includes, in sequence along the direction toward the circuit board, a fixing area for restricting the movement of the copper cable, a buffer zone for mechanical stress relief, and a connection area for electrically connecting the copper cable to the circuit board. The buffer zone includes at least one multi-axis mechanical stress relief unit.

[0007] Furthermore, the multiaxial stress mechanical release unit includes an axial release structure that allows the copper cable to move relative to the circuit board along its axial direction, and a radial release structure that allows the copper cable to bend relative to the circuit board in the radial direction.

[0008] Furthermore, the multi-axis mechanical stress relief unit also includes an auxiliary release structure for causing the copper cable to undergo lateral displacement or torsion relative to the circuit board.

[0009] Furthermore, the axial release structure includes a sliding sleeve and a sliding groove. The sliding sleeve is fitted onto the copper cable, and the sliding groove is disposed on the module housing. The sliding sleeve slides in the sliding groove.

[0010] Furthermore, the radial release structure includes a flexible member connected to the copper cable.

[0011] Furthermore, the thermally conductive area includes a thermally conductive component, the two ends of which are respectively attached to the chip and the module housing. The thermal stress is conducted along the thermally conductive component, and the conduction direction is perpendicular to the surface of the circuit board.

[0012] On the other hand, the present invention also provides a stress relief method for a high-speed active copper cable module, comprising the following steps:

[0013] The module is divided into adjacent thermal conduction zones and mechanical stress release zones, which decouple the thermal stress transmission path from the mechanical stress transmission path.

[0014] When thermal stress is generated within the module, the thermal stress is transferred to the module housing through the thermal conductivity zone between the chip and the module housing, thus releasing the thermal stress.

[0015] When mechanical stress is generated in the copper cable, the mechanical stress is released through the mechanical stress release area on the connection path between the copper cable and the circuit board.

[0016] Furthermore, the connection path between the copper cable and the circuit board is divided into a fixed area, a buffer area, and a connection area in sequence. The connection area is located at one end closer to the circuit board. When the copper cable generates mechanical stress, the mechanical stress gradually decreases along the fixed area, buffer area, and connection area of ​​the connection path.

[0017] Furthermore, when thermal stress is generated within the module, the thermal stress is conducted through the thermally conductive zone, and its conduction direction is perpendicular to the surface of the circuit board.

[0018] By employing the above technical solutions, this invention has the following advantages compared to existing technologies:

[0019] 1) The high-speed active copper cable module provided by this invention has a thermal conductivity zone and a mechanical stress release zone set in the module, which effectively solves the problem of difficult stress release of copper cables caused by the increase of PCB layout. In a limited space, the mechanical stress generated by the copper cable can be released through the mechanical stress release zone, and the thermal stress generated in the module can be released through the thermal conductivity zone. This achieves effective decoupling of thermal stress and mechanical stress, avoids the superposition of the two types of stress at the connection point from the root, greatly reduces the stress concentration at the connection point of the circuit board, and effectively reduces the risk of fatigue failure of the solder joint.

[0020] 2) The high-speed active copper cable module provided by the present invention has a fixed area, a buffer area and a connection area along the connection path of the copper cable. The buffer area is equipped with a multi-axis mechanical stress release unit, which can adaptively release mechanical stress for multi-axis bending, torsion and tension of the copper cable. It can achieve directional and graded release according to the direction and magnitude of mechanical stress. Under the combined working conditions of high power consumption continuous operation at 85℃ and multi-axis bending, the electrical performance of the module has no degradation and can stably support 112Gbps / 224Gbps PAM4 high-speed signal transmission, which significantly improves the adaptability of the module to complex working conditions. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 Schematic diagram of the high-speed active copper cable module provided by the present invention Figure 1 ;

[0023] Figure 2 A side view of the high-speed active copper cable module provided by the present invention;

[0024] Figure 3 Schematic diagram of the high-speed active copper cable module provided by the present invention Figure 2 ;

[0025] Figure 4 A partial structural diagram of the high-speed active copper cable module provided by the present invention. Figure 1 ;

[0026] Figure 5 A schematic diagram of the radial release structure in the high-speed active copper cable module provided by the present invention;

[0027] Figure 6 Schematic diagram of the high-speed active copper cable module provided by the present invention Figure 3 ;

[0028] Figure 7 A partial structural diagram of the high-speed active copper cable module provided by the present invention. Figure 2 .

[0029] 1-Module housing; 2-Circuit board; 3-Chip; 4-Copper cable; 5-Thermal conduction area; 51-Thermal conduction component; 6-Mechanical stress relief area; 61-Fixing area; 62-Buffer zone; 63-Connection area; 64-Axial release structure; 65-Radial release structure. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. In the accompanying drawings, the dimensions and relative dimensions of certain parts may be enlarged for clarity.

[0031] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connection" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] In the description of this invention, terms such as "upper," "lower," "left," "right," "front," and "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0033] Furthermore, in the description of this invention, the terms "first" and "second" are used merely for descriptive distinction and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Additionally, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0034] Example 1

[0035] As per the instruction manual Figure 1-2 As shown, the present invention provides a high-speed active copper cable module, including a module housing 1, a circuit board 2, a chip 3, and a copper cable 4. The circuit board 2 is disposed inside the module housing 1, and the chip 3 is disposed on the circuit board 2. A heat-conducting area and a mechanical stress-relieving area are arranged inside the module housing. A heat-conducting area 5 is formed between the chip 3 and the module housing 1 for conducting the thermal stress generated by the chip 3 to the module housing 1 in a predetermined direction. The copper cable 4 is connected to the circuit board 2, and a mechanical stress-relieving area 6 is formed on the connection path between the two. The heat-conducting area 5 and the mechanical stress-relieving area 6 are arranged horizontally adjacent to each other so that the thermal stress transmission path and the mechanical stress-relieving path are decoupled from each other inside the module housing 1.

[0036] Specifically, the chip is a heavy-duty driver chip that supports 224Gbps PAM4 signal transmission. It adopts a thermo-mechanical stress co-decoupling design and achieves adaptive response to complex stress environments through functional area division and partitioned buffer structure. The circuit board 2 and chip 3 are encapsulated within the module housing 1 and located at one end of the module housing 1. The copper cable 4 extends into the other end of the module housing 1 and connects to the circuit board 2. The end of the copper cable 4 away from the circuit board 2 is used for external devices. The heavy-duty timer or heavy-duty driver chip in the active copper cable module will continuously generate heat during high-speed operation, which needs to be conducted and released in a timely manner. The copper cable may bend, twist, or shift during installation, wiring, maintenance, and operation, resulting in mechanical stress. The module is divided into a thermal conduction zone 5 and a mechanical stress release zone 6. By arranging the thermal stress transmission path and the mechanical stress release path inside the module, and introducing a partitioned buffer and multi-axis adaptive release structure in the copper cable 4 connection path, the thermal stress and mechanical stress are decoupled in a coordinated manner, reducing the stress concentration at the connection between the copper cable and the circuit board, thereby improving the long-term reliability of the module under high power consumption and multi-axis bending conditions.

[0037] Specifically, the chip 3 is located in the middle of the circuit board 2, and the copper cable 4 is connected to the end of the circuit board 2. There is a certain gap between the connection point of the chip 3 and the copper cable 4. By setting a thermal conductivity zone 5 between the chip 3 and the module housing 1, the heat generated by the chip 3 is directly transferred to the module housing 1 for heat dissipation, allowing thermal stress to be released in a predetermined direction. This prevents heat accumulation in local areas of the circuit board and thermal stress from diffusing to the copper cable connection area, reducing the impact on the connection point. The mechanical stress relief zone is used to release or disperse the mechanical stress introduced by the bending or displacement of the copper cable 4. It is located on the connection path between the copper cable 4 and the circuit board 2. When the copper cable 4 generates mechanical stress, it can be released through the mechanical stress relief zone, preventing the mechanical stress from being transmitted to the connection point between the copper cable 4 and the circuit board 2. By dividing the module into functional areas, the thermal stress transmission path and the mechanical stress transmission path are decoupled from each other within the module, avoiding superposition in the same structural part.

[0038] Optimized implementation methods, as shown in the appendix to the instruction manual. Figure 3 As shown, the mechanical stress relief zone 6, along the direction towards the circuit board 2, sequentially includes a fixing zone 61 for restricting the movement of the copper cable 4, a buffer zone 62 for mechanical stress relief, and a connection zone 63 for electrical connection between the copper cable 4 and the circuit board 2. The buffer zone 62 includes at least one multi-axis mechanical stress relief unit. The fixing zone 61 is located at the end of the module housing 1 furthest from the circuit board 2. The copper cable 4 is fixed in the fixing zone 61 by fasteners to restrict the overall displacement and rotation of the copper cable 4, providing a stable support foundation for the connection system. The buffer zone 62 is located between the fixing zone 61 and the circuit board 2, forming the mechanical stress relief zone inside the module and serving as the core area for mechanical stress relief. The buffer zone is equipped with a multi-axis stress relief unit for stress relief. The connection zone 63 is located at the end of the buffer zone, at the connection node between the copper cable 4 and the circuit board 2, and is used to realize the electrical connection between the copper cable 4 and the circuit board 2. It is the final connection point between the copper cable 4 and the circuit board 2, and the copper cable and the circuit board can be electrically connected by welding, plugging, or crimping. By setting up the above-mentioned partitions, the mechanical stress generated by the bending or displacement of the copper cable 4 gradually decreases during the transmission along the connection path, thereby reducing stress concentration in the connection area.

[0039] As one specific implementation method, see the appendix to the instruction manual. Figure 6 The fixing area 61 is equipped with fasteners that securely fix the outer protective sleeve of the copper cable to the inlet of the module housing by clamping, restricting the overall displacement and rotation of the copper cable and providing a stable support foundation for the entire connection system. The fasteners can be wire clips to fix the copper cable to the module housing.

[0040] As one specific implementation, the connection area 63 is the final connection point between the copper cable 4 and the circuit board 2. Preferably, the two are connected by welding. The conductor wires of the copper cable 4 are connected to the solder pads on the circuit board 2 by welding, forming a stable electrical connection. Of course, the copper cable 4 and the circuit board 2 can also be electrically connected by crimping or plugging.

[0041] In an optimized implementation, the buffer zone 62 is equipped with at least one multi-axis mechanical stress release unit for adaptive release of mechanical stress. To ensure that the mechanical stress on the copper cable 4 in different directions can be released, the multi-axis mechanical stress release unit includes multiple structural parts with different degrees of freedom of deformation in space. The structural parts are configured to undergo relative displacement or deformation in the corresponding direction when the copper cable is subjected to bending, displacement or torsion in different directions, so that the multi-axis mechanical stress is dispersed and released in the buffer zone 62, and stress is prevented from being transmitted to the connection area 63.

[0042] As one specific implementation method, see the appendix to the instruction manual. Figure 4 As shown, the multiaxial stress mechanical release unit includes an axial release structure 64 that allows the copper cable 4 to move relative to the circuit board 2 along its axial direction, and a radial release structure 65 that allows the copper cable 4 to bend relative to the circuit board 2 in the radial direction. The axial release structure 64 and the radial release structure 65 can be spatially combined to release mechanical stress in different directions. Specifically, the axial release structure 64 allows the copper cable 4 to displace relative to the circuit board 2 along its axial direction, thus releasing axial mechanical stress; the radial release structure 65 allows the copper cable 4 to displace or bend relative to the circuit board 2 in the radial direction, thus releasing radial mechanical stress. The axial release structure and the radial release structure can be arranged separately, or they can be combined into a single composite release structure.

[0043] In an optimized implementation, the multi-axis mechanical stress relief unit further includes an auxiliary relief structure for causing the copper cable 4 to undergo lateral displacement or torsion relative to the circuit board 2, in order to adapt to complex mechanical stress conditions.

[0044] In this embodiment, the module is divided into a thermal conduction zone 5 and a mechanical stress release zone 6. Through the thermal-mechanical stress decoupling layout, the mechanical stress release zone buffering, and the coordinated setting of multi-axis mechanical stress release units, the thermal stress is mainly transmitted unidirectionally to the module shell along the thermal conduction zone 5, realizing the directional release of thermal stress. The mechanical stress is mainly released step by step along the fixed zone 61, the buffer zone 62, and the multi-axis mechanical stress release units, realizing the adaptive dispersion of multi-axis mechanical stress. Ultimately, the thermal stress and mechanical stress are transmitted along different paths, avoiding superposition at the electrical connection structure and significantly reducing the stress concentration in the connection area.

[0045] In an optimized implementation, the thermally conductive zone 5 includes a thermally conductive component 51 with a high thermal conductivity, enabling rapid heat conduction. The upper and lower ends of the thermally conductive component 51 are respectively attached to the chip 3 and the module housing 1. The module housing 1 is preferably a metal housing to facilitate heat conduction and dissipation. The heat generated by the chip is conducted to the module housing through the thermally conductive component. The thermal conduction direction of the thermally conductive component 51 is perpendicular to the surface of the circuit board 2, allowing heat to be conducted to the module housing in a direction perpendicular to the plane of the circuit board, thus achieving directional heat conduction.

[0046] As one specific embodiment, the heat-conducting component 51 is made of a heat-conducting sheet composed of diamond filler, with a thermal conductivity of 12 W / (m*K). One end is tightly attached to the packaging surface of the chip 3, and the other end is in direct contact with the inner wall of the module housing 1. The heat-conducting area 5 is configured to conduct heat to the module housing 1 in a direction perpendicular to the plane of the circuit board 2, as shown in the appendix to the specification. Figure 7 As shown, when the chip 3 is working, the heat generated is quickly transferred to the module housing 1 through the heat-conducting component 51, so that the thermal stress is released along the predetermined path, avoiding the accumulation of heat in local areas of the circuit board. Moreover, this vertical heat conduction design effectively prevents the thermal stress from affecting the copper cable connection area.

[0047] As one specific embodiment, the axial release structure 64 includes a sliding sleeve and a sliding groove. The sliding sleeve is sleeved on the copper cable 4, and the sliding groove is disposed on the module housing 1. The sliding sleeve slides in the sliding groove, and its movement direction is parallel to the axial direction of the copper cable 4. When the copper cable 4 is subjected to axial stress, the sliding sleeve and the sliding groove release the axial mechanical stress through relative displacement.

[0048] As one specific implementation, the axial release structure 64 includes a floating support member, which is disposed on the module housing 1. The copper cable 4 is disposed at the movable end of the floating support member. The floating support member allows the copper cable to have a certain displacement in the axial direction in order to release axial mechanical stress.

[0049] Of course, the axial release structure can also be a combination of the above-mentioned structural components. The axial release structure can also employ a corrugated pipe, with the copper cable portion configured as a corrugated pipe structure to achieve axial stress release.

[0050] As one specific embodiment, the radial release structure includes a flexible member connected to the copper cable.

[0051] In some embodiments, the flexible member is a flexible connection segment, a flexible support, or an elastic bending segment to allow the copper cable to move or bend radially.

[0052] As one specific implementation method, see the appendix to the instruction manual. Figure 5As shown, the radial release structure 65 includes a thin-walled bending beam structure that allows the copper cable to bend radially, preferably made of polyimide (PI). The axial release structure and the radial release structure are spatially staggered. The thin-walled bending beam has a bending stiffness of 3000 N / m, enabling it to undergo corresponding bending deformation when the copper cable is radially bent in the horizontal or vertical direction. The sliding sleeve-type axial release structure provides corresponding displacement compensation when the copper cable is subjected to axial tension or compression. The axial release structure partially restricts radial displacement, and the radial release structure partially restricts axial displacement.

[0053] The axial release structure is configured to restrict radial displacement, and the radial release structure is configured to restrict axial displacement. When the copper cable 4 is subjected to mechanical stress in only one direction, the release structure corresponding to that direction deforms preferentially, while the structures in other directions remain relatively stable, thus achieving directional stress release. When the copper cable is subjected to mechanical stress in multiple directions simultaneously, the axial release structure and the radial release structure respond to mechanical stress in different directions, and each structural region works independently, avoiding stress concentration in a single region and ensuring that the mechanical stress is fully dispersed and released before reaching the connection area.

[0054] Through the above structural design, the thermal stress generated by the high-speed processing chip and the multiaxial mechanical stress introduced by the copper cable are transmitted along different paths. The thermal stress is mainly transmitted to the metal module housing through the thermal conduction zone, while the mechanical stress is mainly dispersed and absorbed through the multiaxial mechanical stress release unit in the buffer zone. This avoids the superposition of the two types of stress at the connection area, significantly reduces the stress concentration at the circuit board connection, and ensures the long-term stable operation of the module under high power consumption operation and multiaxial bending test conditions.

[0055] As one specific implementation method, see the appendix to the instruction manual. Figure 6 As shown, the axial release structure 64 and the radial release structure 65 adopt a combined composite release structure, using a flexible silicone structure with snap-fit. The flexible silicone structure is sleeved on the copper cable 4, meaning the copper cable 4 passes through the flexible silicone structure. Both ends of the flexible silicone structure have snap-fits that are movably connected to the module housing 1, achieving axial displacement compensation. The flexible silicone structure releases stress from the radial bending of the copper cable. The bending stiffness of the flexible silicone structure is approximately 3000 N / m. By setting a flexible silicone structure with snap-fit ​​in the buffer zone, thermal stress and mechanical stress can be decoupled synergistically, reducing stress concentration in the connection area and improving the long-term reliability of the module.

[0056] The high-speed active copper cable module provided by this invention effectively solves the problem of difficult cable stress release caused by increased PCB layout, and can maximize the protection of electrical performance, signal integrity of high-speed signals, and electromagnetic performance design. Within limited space, a mechanical stress adaptive release structure is designed for multi-axis bending and torsion conditions of copper cables, enabling directional and graded release based on the direction and magnitude of mechanical stress, effectively reducing the risk of solder joint fatigue failure. Under combined conditions of continuous high-power operation at 70℃ and multi-axis bending, the module's electrical performance remains undiminished, stably supporting 112Gbps / 224Gbps PAM4 high-speed signal transmission, significantly improving the module's adaptability to complex operating conditions.

[0057] Through testing and verification, compared with the existing high-speed copper cable modules with single stress treatment, the stress concentration in the connection area of ​​the present invention is reduced by 70%, and the fatigue failure cycle of the solder joint is increased to more than 2,000 hours.

[0058] Example 2

[0059] This invention also provides a stress relief method for a high-speed active copper cable module, wherein the module is the high-speed active copper cable module described in Example 1, and includes the following steps:

[0060] The module is divided into adjacent thermal conduction zones 5 and mechanical stress relief zones 6, so that the thermal stress transmission path and the mechanical stress transmission path are decoupled from each other.

[0061] When thermal stress is generated within the module, the thermal stress is transferred to the module housing 1 through the thermally conductive area 5 between the chip 3 and the module housing 1, thus releasing the thermal stress.

[0062] When mechanical stress is generated in the copper cable 4, the mechanical stress is released through the mechanical stress release area on the connection path between the copper cable 4 and the circuit board 2.

[0063] Specifically, by dividing the module into a thermal conduction zone and a mechanical stress release zone, and arranging them horizontally at intervals, with a certain distance between the thermal conduction zone 5 and the connection nodes of the copper cable 4 and the circuit board 2, the thermal stress transmission path and the mechanical stress transmission path are decoupled from each other within the module through the above functional area division, avoiding superposition in the same structural part, and thermal stress and mechanical stress can be released in a directional manner through the corresponding paths.

[0064] In the optimized implementation, the connection path between the copper cable 4 and the circuit board 2 is sequentially divided into a fixed area 61, a buffer zone 62, and a connection area 63. The connection area 63 is located at the end closest to the circuit board 2. When mechanical stress is generated in the copper cable 4, the mechanical stress gradually decreases along the connection path through the fixed area 61, the buffer zone 62, and the connection area 63. The fixed area 61 firmly fixes the copper cable 4, so that the stress generated at the far end due to tension and vibration is first absorbed by the fixed area 61. The far end refers to the end of the module housing 1 that is away from the circuit board. The buffer zone, through a multi-axis mechanical stress release unit, partially consumes, transforms, or evenly distributes, or even completely consumes, the mechanical stress before it is transmitted to the connection area, ultimately resulting in a significant reduction in the stress in the connection area, thereby protecting the fragile electrical connection point. The connection area between the copper cable and the circuit board is usually highly rigid and has limited ductility. If stress is directly applied to this area, repeated bending or thermal stress caused by temperature changes will accelerate crack formation. By dispersing the mechanical stress through the buffer zone, the connection area only bears a small deformation, significantly improving fatigue life. Through multi-level attenuation of fixed zone, buffer zone and connection zone, it adapts to stress of different frequencies and amplitudes. The fixed zone mainly suppresses low frequency and large amplitude displacement, the buffer zone absorbs medium and high frequency vibration and periodic small displacement caused by thermal expansion and contraction, and the connection zone only retains the necessary electrical connection function and is almost unaffected by mechanical load. Through the above-mentioned graded treatment, the structure can cope with static stress and dynamic fatigue stress at the same time.

[0065] In the optimized implementation, when thermal stress is generated within the module, the thermal stress is conducted through the thermally conductive area, with its conduction direction perpendicular to the surface of the circuit board. The heat generated when the chip is working is preferentially conducted to the module housing 1, so that the thermal stress is released along a predetermined path.

[0066] Those skilled in the art will understand that the present invention can be implemented in many other specific forms without departing from the spirit and scope of the invention. Although embodiments of the invention have been described, it should be understood that the invention is not limited to these embodiments, and those skilled in the art can make changes and modifications within the spirit and scope of the invention as defined in the appended claims.

Claims

1. A high-speed active copper cable module, comprising a module housing, a circuit board, a chip, and a copper cable, wherein the circuit board is disposed within the module housing, and the chip is disposed on the circuit board, characterized in that, The module housing is provided with a heat-conducting area and a mechanical stress-relieving area. A heat-conducting area is formed between the chip and the module housing to conduct the thermal stress generated by the chip to the module housing in a predetermined direction. The copper cable is connected to the circuit board and the mechanical stress-relieving area is formed on the connection path between the two. The heat-conducting area and the mechanical stress-relieving area are arranged horizontally adjacent to each other.

2. The high-speed active copper cable module according to claim 1, characterized in that, The mechanical stress relief zone includes, in sequence along the direction toward the circuit board, a fixing zone for restricting the movement of the copper cable, a buffer zone for mechanical stress relief, and a connection zone for electrically connecting the copper cable to the circuit board. The buffer zone includes at least one multi-axis mechanical stress relief unit.

3. The high-speed active copper cable module according to claim 2, characterized in that, The multiaxial stress mechanical release unit includes an axial release structure that allows the copper cable to move relative to the circuit board along its axial direction, and a radial release structure that allows the copper cable to bend relative to the circuit board in the radial direction.

4. The high-speed active copper cable module according to claim 3, characterized in that, The multi-axis mechanical stress relief unit also includes an auxiliary relief structure for causing the copper cable to undergo lateral displacement or torsion relative to the circuit board.

5. The high-speed active copper cable module according to claim 3, characterized in that, The axial release structure includes a sliding sleeve and a sliding groove. The sliding sleeve is fitted onto the copper cable, and the sliding groove is disposed on the module housing. The sliding sleeve slides in the sliding groove.

6. The high-speed active copper cable module according to claim 3, characterized in that, The radial release structure includes a flexible member connected to the copper cable.

7. The high-speed active copper cable module according to claim 1, characterized in that, The thermally conductive area includes a thermally conductive component, the two ends of which are respectively attached to the chip and the module housing. The thermal stress is conducted along the thermally conductive component, and the conduction direction is perpendicular to the surface of the circuit board.

8. A stress relief method for a high-speed active copper cable module, characterized in that, Includes the following steps: The module is divided into adjacent thermal conduction zones and mechanical stress release zones, which decouple the thermal stress transmission path from the mechanical stress transmission path. When thermal stress is generated within the module, the thermal stress is transferred to the module housing through the thermal conductivity zone between the chip and the module housing, thus releasing the thermal stress. When mechanical stress is generated in the copper cable, the mechanical stress is released through the mechanical stress release area on the connection path between the copper cable and the circuit board.

9. The stress relief method for a high-speed active copper cable module according to claim 8, characterized in that, The connection path between the copper cable and the circuit board is divided into a fixed area, a buffer area, and a connection area. The connection area is located at one end closer to the circuit board. When mechanical stress is generated in the copper cable, the mechanical stress gradually decreases along the fixed area, buffer area, and connection area of ​​the connection path.

10. The stress relief method for a high-speed active copper cable module according to claim 8, characterized in that, When thermal stress is generated within the module, the thermal stress is conducted through the thermally conductive zone, and its conduction direction is perpendicular to the surface of the circuit board.

Images