PCB board patch loading device and loading method thereof

Abstract

This invention belongs to the field of PCB board conveying technology, specifically relating to a flipping device for double-sided PCB board mounting, and more particularly to a PCB board mounting feeding device and its feeding method. The PCB board mounting feeding device, by setting up a flipping mechanism including a flipping frame and an inclined shielding component, guides one end of the PCB board during operation through the inclination of the inclined shielding component. This allows one end of the PCB board to fall onto the upper conveyor chain of the conveying mechanism first, and then the other end falls onto the upper conveyor chain after the flipping mechanism rotates to its highest point, completing the flipping process. Instead of the entire board being directly slapped and impacted onto the equipment components, the PCB board's fall during the flipping process is buffered, thereby reducing the occurrence of slapping phenomena.

Description

Technical Field

[0001] This invention belongs to the field of PCB board conveying technology, specifically relating to a flipping device for double-sided PCB board mounting, and more particularly to a PCB board mounting feeding device and its feeding method. Background Technology

[0002] In the surface mount technology (SMT) production process of double-sided PCBs, it is usually necessary to flip the PCB after the SMT is completed on one side so that the SMT can be applied to the other side.

[0003] In related technologies, when a PCB board is flipped, it is often in a free or poorly controlled flipping state. During the flipping process, the PCB board falls directly and quickly and collides rigidly with the conveyor chain or other components in the device, which is called the slapping phenomenon. This causes damage to the PCB board itself, causing the electronic components already mounted on its surface to shift or even fall off, directly affecting the product yield and reliability.

[0004] Therefore, how to prevent the PCB board from slapping when flipped is a technical problem that urgently needs to be solved.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0006] This disclosure provides at least one PCB board mounting device and its mounting method.

[0007] In a first aspect, embodiments of this disclosure provide a PCB board mounting feeding device, comprising: The shell body has a feed inlet and a discharge outlet; A flap mechanism is disposed within the shell body; The flip-plate mechanism includes: The tilting frame has conveyor mechanisms on opposite sides; An inclined shielding assembly is disposed at one end of the conveying mechanism; The inlet and outlet of the shell body are each connected to a corresponding feeding conveying component and an outlet conveying component. After the PCB board is mounted on one side, it is transported to the inlet of the housing body by the feeding conveyor assembly and then sent to the flipping mechanism. The flipping mechanism flips the PCB board and then conveys it to the discharge port; Specifically, during the flipping mechanism flipping the PCB board; The tilting shielding component first blocks the PCB board entering from the conveyor mechanism. Then, the tilting shielding component tilts to guide one end of the PCB board that is flipping, so that it falls into the upper conveyor chain of the conveyor mechanism first, thereby cushioning the PCB board's fall when it flips and preventing it from hitting the conveyor.

[0008] In one alternative implementation, the tilted shading assembly includes: The baffle body is rotatably mounted on the conveying mechanism at both ends via connecting rods; A tilting cylinder is used to drive the baffle body to rotate to a tilt position.

[0009] In one alternative embodiment, the connecting rod is rotatably connected to the lower end of the conveying mechanism via a rotating shaft; A connecting plate is provided on the connecting rod; The connecting plate has a waist-shaped hole; The piston rod of the tilting cylinder is inserted into the waist-shaped hole; When the piston rod of the tilting cylinder extends, it drives the connecting plate to move, thereby causing the connecting rod to rotate around the rotation axis, which in turn causes the baffle body to tilt.

[0010] In one alternative implementation, one end of the PCB board being flipped is guided so that it first falls into the upper conveyor chain of the conveyor mechanism, i.e.: During the process of the flipping frame rotating from a horizontal state to a vertical state, the piston rod of the tilting cylinder extends, driving the connecting plate to move, thereby causing the connecting rod to rotate around the rotating axis, which in turn causes the baffle body to tilt. One end of the flipping PCB board is stuck in the conveyor chain at the top of the conveying mechanism, thus completing the clamping of the PCB board. As the flipping frame rotates from a vertical to a horizontal position, the other end of the PCB board falls and contacts the conveyor chain at the bottom of the flipped conveyor mechanism, thus completing the flipping of the PCB board.

[0011] In one optional embodiment, the conveying mechanism has two conveying chains spaced apart from top to bottom; The spacing between the two conveyor chains is greater than the thickness of the PCB board.

[0012] In one alternative embodiment, the flipping frame includes two fixed side plates; A sliding rod is provided between the two fixed side plates; A sliding side plate, which is slidably mounted on the slide rod; The two conveying mechanisms are respectively mounted on one of the fixed side plates and the other on the sliding side plate.

[0013] In one optional embodiment, an adjusting screw is further provided between the two fixed side plates; The adjusting screw is threadedly connected to the sliding side plate; When the adjusting screw rotates, it causes the sliding side plate to slide along the slide rod to adjust the distance between the two conveying mechanisms.

[0014] In one optional embodiment, the baffle body is a telescopic mesh structure; The length of the baffle body changes as the distance between the two conveying mechanisms changes.

[0015] Secondly, this disclosure also provides a feeding method using the PCB board mounting feeding device described above, the feeding method comprising: After the PCB board is mounted on one side, it is transported to the inlet of the housing body by the feeding conveyor assembly and then sent to the flipping mechanism. The flipping mechanism flips the PCB board and then conveys it to the discharge port; The PCB board after flipping is conveyed by the material feeding and loading components.

[0016] In one optional implementation, the flipping mechanism flips the PCB board and then conveys it to the discharge port, i.e.: The tilting shielding component will block the PCB board that will enter from the conveyor mechanism; The tilting shielding component tilts to guide one end of the flipping PCB board; One end of the PCB board first falls into the upper conveyor chain of the conveyor mechanism, thus cushioning the PCB board's fall when it is flipped.

[0017] The beneficial effect of this invention is that the PCB board mounting feeding device and its feeding method, by setting up a flipping mechanism including a flipping frame and an inclined shielding component, can guide one end of the PCB board by tilting the inclined shielding component during operation, so that one end of the PCB board falls onto the upper conveyor chain in the conveying mechanism first, and then the other end falls onto the upper conveyor chain after the flipping mechanism rotates to the highest point, completing the flipping, rather than directly hitting and impacting the entire board onto the equipment components. This buffers the PCB board's fall during the flipping process, thereby reducing the occurrence of board-slapping phenomena.

[0018] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the PCB board mounting feeding device provided in an embodiment of the present disclosure; Figure 2 This is a schematic diagram of the structure of the flap mechanism provided in the embodiments of this disclosure; Figure 3 A schematic diagram of the flap mechanism provided in the embodiments of this disclosure in a horizontal state; Figure 4 A schematic diagram showing the flapping mechanism provided in this embodiment rotating from a horizontal state to a vertical state; Figure 5 A schematic diagram showing the flapping mechanism provided in this embodiment rotating from a vertical state to a horizontal state; Figure 6 A flowchart illustrating the feeding method of the PCB board mounting feeding device provided in this embodiment of the disclosure; Figure 7 for Figure 6 Flowchart of the sub-steps in step S120; Figure 8 This is a schematic diagram showing the state of the connecting plate when the tilting cylinder drives it according to an embodiment of this disclosure.

[0022] In the diagram: 100, shell body; 110, feed inlet; 120, discharge outlet; 200, flipping mechanism; 210, flipping frame; 211, fixed side plate; 212, sliding side plate; 213, slide rod; 214, adjusting screw; 220, inclined shielding assembly; 221, baffle body; 2211, connecting rod; 2212, connecting plate; 2213, oblong hole; 2214, rotating shaft; 222, inclined cylinder; 2221, piston rod; 2222, gasket; 230, conveying mechanism; 300, PCB board. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0025] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0026] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0027] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise expressly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0028] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0029] Research has found that when PCB boards are flipped, they are often in a free or poorly controlled flipping state. During the flipping process, the PCB board falls directly and quickly and collides rigidly with the conveyor chain or other components in the device, which is called the slapping phenomenon. This causes damage to the PCB board itself, causing the electronic components already mounted on its surface to shift, become poorly soldered, or even fall off, directly affecting the product yield and reliability.

[0030] Based on the above research, this disclosure provides a PCB board mounting device and its mounting method. By setting a flipping mechanism 200 including a flipping frame 210 and an inclined shielding component 220, the tilting of the inclined shielding component 220 can guide one end of the PCB board 300 during operation. Then, after the flipping mechanism rotates to the highest point, the other end falls onto the upper conveyor chain, completing the flipping, instead of the whole board being directly slapped and impacted on the equipment components. This buffers the PCB board's fall during the flipping process, thereby reducing the occurrence of slapping.

[0031] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] Please see Figure 1 and Figure 2At least one embodiment provides a PCB board mounting device, comprising: a housing 100 having an inlet 110 and an outlet 120; a flipping mechanism 200 disposed within the housing 100; wherein the flipping mechanism 200 includes: a flipping frame 210 with conveying mechanisms 230 disposed on opposite sides; and an inclined shielding component 220 disposed at one end of the conveying mechanism 230; the inlet 110 and outlet 120 of the housing 100 are each connected to corresponding inlet conveying components and outlet conveying components; after mounting on one side of the PCB board 300, the mounting is completed by the inlet conveying component... The conveying component transports the PCB board 300 to the inlet 110 of the housing body 100, and then to the flipping mechanism 200. The flipping mechanism 200 flips the PCB board 300 and then transports it to the outlet 120. When the flipping mechanism 200 flips the PCB board 300, the tilting blocking component 220 first blocks the PCB board 300 entering from the conveying mechanism 230. Then, the tilting blocking component 220 tilts to guide one end of the flipping PCB board 300, so that it falls into the upper conveying chain of the conveying mechanism 230. This buffers the PCB board when it falls and prevents it from slapping.

[0035] By setting up a flipping mechanism 200 that includes a flipping frame 210 and an inclined shielding component 220, the tilting of the inclined shielding component 220 can guide one end of the PCB board 300 during operation, so that one end of the PCB board 300 first falls onto the upper conveyor chain of the conveyor mechanism 230, and then the other end falls onto the upper conveyor chain after the flipping mechanism rotates to its highest point, thus completing the flipping, instead of the whole board directly hitting and impacting the equipment components. This buffers the PCB board's fall during the flipping process, thereby reducing the occurrence of the slapping phenomenon.

[0036] Please see Figure 2 The tilting shielding assembly 220 includes: a baffle body 221, both ends of which are rotatably mounted on the conveying mechanism 230 via connecting rods 2211; and a tilting cylinder 222, which drives the baffle body 221 to rotate to the tilt position.

[0037] The existing tilting cylinder 222 is directly improved by linking the tilting cylinder 222 with the baffle body 221, so that the baffle body 221 has the ability to tilt and flip. The tilting cylinder 222 pushes the baffle body 221 to tilt, thereby ensuring the stability of the baffle body 221's attitude switching, and thus achieving the blocking and guidance of the PCB board 300.

[0038] Specifically, the connecting rod 2211 is rotatably connected to the lower end of the conveying mechanism 230 via a rotating shaft 2214; a connecting plate 2212 is provided on the connecting rod 2211; a waist-shaped hole 2213 is provided on the connecting plate 2212; the piston rod 2221 of the tilting cylinder 222 is inserted into the waist-shaped hole 2213; when the piston rod 2221 of the tilting cylinder 222 extends, it drives the connecting plate 2212 to move, thereby driving the connecting rod 2211 to rotate around the rotating shaft 2214, thereby causing the baffle body 221 to tilt.

[0039] Please see Figure 8 It should be noted that after the piston rod 2221 is inserted into the oblong hole 2213, it is engaged with the connecting plate 2212 via a gasket 2222. In order to drive the connecting plate 2212 to rotate, the end of the piston rod 2221 opposite to the upper surface of the connecting plate 2212 is inclined, and the diameter of the piston rod 2221 is larger than the width of the oblong hole 2213, except that the diameter of the portion of the piston rod 2221 inserted into the oblong hole 2213 is smaller than the diameter of the oblong hole 2213.

[0040] Along piston rod 2221 Figure 8 When descending in the F1 direction, the drive connection plate 2212 moves along... Figure 8 The direction of F2 rotates.

[0041] The piston rod 2221 and the rotating shaft 2214 are hinged at opposite points. When the piston rod 2221 moves downward, it can drive the connecting plate 2212 to descend. At this time, the connecting plate 2212 rotates along the rotating shaft 2214, thereby causing the baffle body 221 to tilt. The tilting cylinder 222 is controlled by an external control module, so that the tilting of the tilting cylinder 222 is adapted to the tilting process of the tilting frame 210.

[0042] The flipping process is described below: One end of the PCB board 300 being flipped is guided so that it first falls into the upper conveyor chain of the conveyor mechanism 230, that is: the flipping frame 210 rotates from a horizontal state (rotation direction as follows) Figure 3 During the process of moving from the vertical position (as shown in Figure F), the piston rod 2221 of the tilting cylinder 222 extends, driving the connecting plate 2212 to move, thereby causing the connecting rod 2211 to rotate around the rotating shaft 2214, which in turn causes the baffle body 221 to tilt. One end of the flipping PCB board 300 is then caught between the baffle body 221 and the conveying chain on the upper part of the conveying mechanism 230, completing the clamping of the PCB board 300 (as shown in Figure F). Figure 4 As shown); the tilting frame 210 rotates from a vertical position (rotation direction as shown). Figure 5During the process of moving the PCB board 300 to a horizontal position (as shown in Figure F), the other end of the PCB board 300 falls and contacts the lower part of the conveyor chain in the flipped conveyor mechanism 230 (as shown in Figure F). Figure 5 As shown), the PCB board 300 is flipped.

[0043] By using a single-end clamping method to limit the PCB board when flipping, the defect of using double-end clamping to limit the board and avoid the need to ensure that the left and right ends are of the same height when pressing the board is solved in related technologies. That is, the left and right ends are actively designed to be staggered in height, so there is no need to consider the height of the left and right ends when clamping and limiting.

[0044] Please see Figure 2 The conveying mechanism 230 has two conveying chains spaced apart from top to bottom; the distance between the two conveying chains is greater than the thickness of the PCB board 300.

[0045] The distance between the two conveyor chains of the same conveyor mechanism 230 is greater than the board thickness, thereby preventing the PCB board 300 from jamming and reducing the interference of the conveyor chain with the components on the PCB board 300.

[0046] Please continue reading. Figure 2 The flipping frame 210 includes two fixed side plates 211; a slide rod 213 is provided between the two fixed side plates 211; a sliding side plate 212 is slidably disposed on the slide rod 213; and two conveying mechanisms 230 are respectively disposed on one of the fixed side plates 211 and the sliding side plate 212.

[0047] To facilitate the adjustment of the position of the sliding side plate 212, an adjusting screw 214 is provided between the two fixed side plates 211; the adjusting screw 214 is threadedly connected to the sliding side plate 212; when the adjusting screw 214 rotates, it drives the sliding side plate 212 to slide along the slide rod 213 to adjust the distance between the two conveying mechanisms 230.

[0048] The baffle body 221 is a telescopic mesh structure; the length of the baffle body 221 changes as the distance between the two conveying mechanisms 230 changes. The width of the baffle body 221 changes with the distance between the two conveying mechanisms 230, thereby adapting to the conveying requirements of PCB boards 300 of different sizes.

[0049] Please see Figure 6 This disclosure also provides a feeding method using the PCB board mounting feeding device described above. Specifically, the feeding method includes: S110: After the PCB board 300 is finished with the surface mount, the PCB board 300 is conveyed to the inlet 110 of the housing body 100 by the feeding conveyor assembly and then sent to the flipping mechanism 200. S120: The flipping mechanism 200 flips the PCB board 300 and then conveys it to the discharge port 120; S130: The PCB board 300 after flipping is conveyed through the material conveying component to complete the loading.

[0050] Please see Figure 7 The flipping mechanism 200 flips the PCB board 300 and then conveys it to the discharge port 120, that is: S121: Inclined blocking assembly 220 blocks the PCB board 300 that will enter from the conveyor mechanism 230; S122: The tilted shielding component 220 tilts to guide one end of the flipping PCB board 300; S123: One end of the PCB board 300 first falls into the upper part of the conveyor chain of the conveyor mechanism 230, so that the PCB board is buffered when it is flipped.

[0051] In summary, the present invention provides a PCB board mounting device and method. By setting up a flipping mechanism 200 including a flipping frame 210 and an inclined shielding component 220, the tilting of the inclined shielding component 220 can guide one end of the PCB board 300 during operation, so that one end of the PCB board 300 falls onto the upper conveyor chain of the conveying mechanism 230 first, and then the other end falls onto the upper conveyor chain after the flipping mechanism rotates to its highest point, thus completing the flipping, instead of the whole board being directly slapped and impacted on the equipment components. This buffers the PCB board's fall during the flipping process, thereby reducing the occurrence of slapping phenomena.

[0052] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0053] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0054] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0055] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0056] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A feeding device for PCB board patching, characterized in that, include: The shell body (100) has a feed inlet (110) and a discharge outlet (120). A flap mechanism (200) is disposed within the shell body (100); The flip-plate mechanism (200) includes: The tilting frame (210) has conveying mechanisms (230) on opposite sides. An inclined shielding assembly (220) is disposed at one end of the conveying mechanism (230); The inlet (110) and outlet (120) of the shell body (100) are each connected to a corresponding feeding conveying component and an outlet conveying component; After the PCB board (300) is mounted on one side, the PCB board (300) is conveyed to the feed port (110) of the shell body (100) by the feeding conveyor assembly and then sent to the flipping mechanism (200); The flipping mechanism (200) flips the PCB board (300) and then conveys it to the discharge port (120). Among them, when the flipping mechanism (200) flips the PCB board (300); The tilting shielding component (220) first blocks the PCB board (300) entering from the conveying mechanism (230), and then the tilting shielding component (220) tilts to guide one end of the PCB board (300) that is being flipped, so that it falls into the upper part of the conveying chain of the conveying mechanism (230), thereby buffering the PCB board when it is flipped and avoiding slamming.

2. The PCB board mounting feeding device as described in claim 1, characterized in that, The tilted shading assembly (220) includes: The baffle body (221) is rotatably mounted on the conveying mechanism (230) at both ends via connecting rods (2211); A tilting cylinder (222) is used to drive the baffle body (221) to rotate to a tilt position.

3. The PCB board mounting feeding device as described in claim 2, characterized in that, The connecting rod (2211) is rotatably connected to the lower end of the conveying mechanism (230) via a rotating shaft (2214); A connecting plate (2212) is provided on the connecting rod (2211); The connecting plate (2212) has an oblong hole (2213); The piston rod (2221) of the tilting cylinder (222) is inserted into the waist-shaped hole (2213); When the piston rod (2221) of the tilting cylinder (222) extends, it drives the connecting plate (2212) to move, thereby causing the connecting rod (2211) to rotate around the rotating shaft (2214), which in turn causes the baffle body (221) to tilt.

4. The PCB board mounting feeding device as described in claim 3, characterized in that, The process involves guiding one end of the flipping PCB board (300) so that it first falls into the upper conveyor chain of the conveyor mechanism (230), i.e.: During the process of the flipping frame (210) rotating from a horizontal state to a vertical state, the piston rod (2221) of the tilting cylinder (222) extends and drives the connecting plate (2212) to move, so as to drive the connecting rod (2211) to rotate around the rotating shaft (2214), thereby causing the baffle body (221) to tilt. One end of the PCB board (300) being flipped is stuck in the conveying chain at the top of the baffle body (221) and the conveying mechanism (230), thus completing the clamping of the PCB board (300). During the process of the flipping frame (210) rotating from a vertical state to a horizontal state, the other end of the PCB board (300) falls and contacts the conveyor chain at the lower part of the flipped conveyor mechanism (230), thus completing the flipping of the PCB board (300).

5. The PCB board mounting feeding device as described in claim 3, characterized in that, The conveying mechanism (230) has two conveying chains spaced apart from top to bottom; The spacing between the two conveyor chains is greater than the thickness of the PCB board (300).

6. The PCB board mounting feeding device as described in claim 2, characterized in that, The flipping frame (210) includes two fixed side plates (211); A slide bar (213) is provided between the two fixed side plates (211); A sliding side plate (212) is slidably mounted on the slide rod (213); The two conveying mechanisms (230) are respectively mounted on one of the fixed side plates (211) and the sliding side plate (212).

7. The PCB board mounting feeding device as described in claim 6, characterized in that, An adjusting screw (214) is also provided between the two fixed side plates (211); The adjusting screw (214) is threadedly connected to the sliding side plate (212); When the adjusting screw (214) rotates, it drives the sliding side plate (212) to slide along the slide rod (213) to adjust the distance between the two conveying mechanisms (230).

8. The PCB board mounting feeding device as described in claim 7, characterized in that, The baffle body (221) is a telescopic grid structure; When the distance between the two conveying mechanisms (230) changes, the length of the baffle body (221) also changes accordingly.

9. A feeding method using the PCB board mounting feeding device as described in claim 1, characterized in that, The feeding method includes: After the PCB board (300) is mounted on one side, the PCB board (300) is conveyed to the feed port (110) of the shell body (100) by the feeding conveyor assembly and then sent to the flipping mechanism (200); The flipping mechanism (200) flips the PCB board (300) and then conveys it to the discharge port (120). The PCB board (300) after being flipped is conveyed by the material conveying component to complete the loading.

10. The feeding method of the PCB board mounting feeding device as described in claim 9, characterized in that, The flipping mechanism (200) flips the PCB board (300) and then conveys it to the discharge port (120), that is: The tilting blocking assembly (220) blocks the PCB board (300) entering from the conveying mechanism (230); The tilting shielding assembly (220) tilts to guide one end of the flipping PCB board (300); One end of the PCB board (300) first falls into the upper part of the conveyor chain of the conveyor mechanism (230), so that the PCB board is cushioned when it is flipped.

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