Satellite-borne photoelectric chip anti-radiation packaging device

Abstract

The application relates to the technical field of aerospace electronic device packaging, and provides a satellite-borne photoelectric chip anti-radiation packaging device which comprises a substrate, photoelectric chips and driving chips which are arranged on the substrate, an upper optical fiber anti-radiation cover assembly which comprises an upper anti-radiation surrounding wall, an optical fiber, an optical fiber connecting piece and an optical fiber cover, the upper anti-radiation surrounding wall covers the two chips, the optical fiber connecting piece is arranged at the top of the surrounding wall, the first end of the optical fiber is arranged in the connecting piece and close to the photoelectric chip, the first end of the optical fiber cover is connected with the connecting piece, the second end of the optical fiber is arranged in the cover, and the cover penetrates through the substrate; a lower optical fiber anti-radiation cover assembly which comprises a lower anti-radiation surrounding wall and a lower cover plate, the lower anti-radiation surrounding wall is arranged on the bottom surface of the substrate, the lower cover plate is arranged at the bottom of the lower anti-radiation surrounding wall, and the optical fiber cover penetrates through the lower cover plate. The chips are fully covered by the upper and lower surrounding walls, the optical fiber is fully shielded, a closed radiation cavity is formed, the spatial high-energy particle interference is effectively reduced, the structure is compact, and the satellite-borne application is suitable.

Description

Technical Field

[0001] This invention relates to the field of aerospace electronic device packaging technology, specifically to a radiation-proof packaging device for spaceborne optoelectronic chips. Background Technology

[0002] In spacecraft such as satellites and deep space probes, optoelectronic chips are used to convert optical signals into electrical signals, and their reliability directly affects the success or failure of space missions. However, the space environment contains strong radiation such as high-energy particles and cosmic rays, which can easily cause radiation damage to optoelectronic chips and their driving chips, such as single-event effects and total dose effects, resulting in device performance degradation or even failure.

[0003] Traditional optoelectronic chip packaging structures typically employ a metal casing for overall shielding, but the optical signal input / output paths often become weak points for radiation leakage. Furthermore, the electrical connections between the driver chip and the optoelectronic chip, as well as signal extraction points beneath the substrate, also require specific protection. Existing technologies rarely offer packaging devices that simultaneously achieve optical path sealing, reliable electrical connections, and multi-layered, three-dimensional radiation protection, making it difficult to meet the high reliability requirements of spaceborne environments. Summary of the Invention

[0004] The present invention aims to provide a radiation protection packaging device for spaceborne optoelectronic chips to solve the problems of incomplete radiation protection and easy leakage of radiation at optical interface in the existing optoelectronic chip packaging structure.

[0005] To address the above problems, the present invention provides the following technical solution: A radiation-shielding packaging device for a spaceborne optoelectronic chip includes: a substrate; An optoelectronic chip, disposed on the substrate, is used to convert optical signals into electrical signals; A driver chip, disposed on the substrate, is used to drive the optoelectronic chip; An upper fiber optic radiation shielding assembly includes an upper radiation shielding wall, an optical fiber, an optical fiber connector, and an optical fiber shield. The upper radiation shielding wall is disposed outside the optoelectronic chip and the driving chip. The optical fiber connector is disposed on the top of the upper radiation shielding wall. The first end of the optical fiber is disposed in the optical fiber connector and close to the optoelectronic chip. The first end of the optical fiber shield is connected to the optical fiber connector. The second end of the optical fiber is disposed inside the optical fiber shield. The optical fiber shield passes through the substrate. The lower fiber optic radiation shielding assembly includes a lower radiation shielding wall and a lower cover plate. The lower radiation shielding wall is disposed on the bottom surface of the substrate, and the lower cover plate is disposed at the bottom of the lower radiation shielding wall. The fiber optic shield passes through the lower cover plate.

[0006] In some embodiments, the substrate is further provided with a spring pin for electrical connection, the spring pin extending downward through the lower cover plate.

[0007] In some embodiments, the upper radiation shielding wall includes a first radiation shielding wall disposed on the substrate, the first radiation shielding wall being provided with a positioning groove, a lens being disposed on the first radiation shielding wall, a positioning protrusion for embedding the positioning groove being disposed at the bottom of the lens, a second radiation shielding wall being disposed on the first radiation shielding wall, and the insertion end of the optical fiber connector being disposed on the top of the second radiation shielding wall.

[0008] In some embodiments, the bottom area of ​​the lower radiation shielding wall is larger than the bottom area of ​​the upper radiation shielding wall, the lower radiation shielding wall is provided with a first through hole for the spring pin to pass through, and the lower radiation shielding wall is also provided with a second through hole for the optical fiber connector to pass through.

[0009] In some embodiments, the optical fiber connector is used to form a sealed space with the second radiation shield and the first radiation shield, and covers the optoelectronic chip and the driving chip. The substrate is also provided with a third through hole for the optical fiber cover to pass through.

[0010] In some embodiments, the materials of the first radiation shielding wall, the second radiation shielding wall, and the lower radiation shielding wall are all one or more of tungsten, tantalum, or tungsten-copper alloy, and the thickness of the first radiation shielding wall, the second radiation shielding wall, and the lower radiation shielding wall is 1 μm to 50 μm.

[0011] In some embodiments, the driver chip includes radiation-hardened logic circuitry, which employs at least one of a DICE+TMR hybrid cell or a 16T SRAM cell.

[0012] In some embodiments, shielding gaskets are provided between the lens and the first radiation shielding wall, and between the second radiation shielding wall and the first radiation shielding wall, wherein the compression rate of the shielding gaskets is 15% to 30%.

[0013] In some embodiments, a sealing welding ring is provided between the outer wall of the optical fiber shroud and the third through hole of the substrate. The thickness of the sealing welding ring is 0.1 mm to 0.5 mm, and the material of the sealing welding ring is tungsten copper alloy.

[0014] In some embodiments, the inner surfaces of the upper radiation shielding wall and the lower radiation shielding wall are each coated with at least one layer of alternating polyimide film and copper film, wherein the thickness of the polyimide film is 5 μm to 20 μm and the thickness of the copper film is 1 μm to 10 μm.

[0015] The beneficial effects of this invention are as follows: The radiation-shielding packaging device for spaceborne optoelectronic chips provided by this invention has an upper radiation-shielding enclosure above the substrate, covering the optoelectronic chip and the driving chip together, and a lower radiation-shielding enclosure and a lower cover plate below the substrate. Optical fibers are led out from above the chip via optical fiber connectors, optical fiber sheaths, and then sequentially through the substrate and the lower cover plate. In this way, the chip is surrounded by a radiation-shielding structure on all sides and top and bottom, and the optical fiber's path is entirely within the shielding layer, preventing radiation from entering through optical path openings or substrate gaps. The entire device forms a closed radiation-shielding cavity, effectively reducing interference from high-energy particles in space on the chip and signal transmission. Its compact structure makes it suitable for spaceborne applications. Attached Figure Description

[0016] Figure 1 This is one of the perspective views of the radiation protection packaging device for spaceborne optoelectronic chips of the present invention; Figure 2 This is a second perspective view of the radiation protection packaging device for the spaceborne optoelectronic chip of the present invention (hiding the optical fiber connector, optical fiber cover and second radiation protection enclosure). Figure 3 for Figure 1 One of the exploded images; Figure 4 for Figure 3 A magnified view of a portion at point A; Figure 5 for Figure 1 Exploded view number two; Figure 6 A perspective view of the first radiation shielding enclosure of the spaceborne optoelectronic chip radiation shielding packaging device of the present invention; Figure 7 A perspective view of the lens of the radiation protection packaging device for spaceborne optoelectronic chips of the present invention.

[0017] Figure label: 1. Substrate; 2. Optoelectronic chip; 3. Driver chip; 4. Optical fiber; 5. Optical fiber connector; 6. Optical fiber cover; 7. First radiation shielding wall; 8. Second radiation shielding wall; 9. Positioning groove; 10. Lens; 11. Positioning protrusion; 14. Third through hole; 15. Lower cover plate; 16. Lower radiation shielding wall; 17. First through hole; 18. Second through hole; 19. Spring pin. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0020] For ease of description of the first, second, and third directions in the embodiments of this application, the first direction is the left-right direction in the figures, the second direction is the front-back direction in the figures, and the third direction is the up-down direction in the figures. The x-axis arrow direction is referred to as the "right" direction, the y-axis arrow direction as the "up" direction, and the z-axis arrow direction as the "back" direction, but these are not the sole limitations in the actual application of this application.

[0021] This application relates to the field of aerospace electronic device packaging technology, specifically to radiation-proof packaging of spaceborne optoelectronic chips. This application employs a fully enclosed shielding cavity composed of an upper and lower radiation-proof enclosure, coupled with an optical fiber sheath passing through the substrate and lower cover plate, to completely encapsulate the optoelectronic chip and driver chip. Simultaneously, the optical fiber's travel path is shielded throughout, forming a three-dimensional radiation protection structure to reduce interference from high-energy particles in space on the chip and signal transmission. The radiation-proof packaging device of this application can be applied to spaceborne optoelectronic modules in satellites, deep space probes, etc. Therefore, the classification number for this application can be H01L23 / 552 or H01L31 / 0203, and the keywords are spaceborne, optoelectronic chip, radiation protection, packaging, and optical fiber.

[0022] This application also relates to the field of optical communication technology, therefore the classification number of this application can be H04B10 / 00.

[0023] Example 1 like Figures 1 to 4 As shown, the satellite-borne optoelectronic chip anti-radiation packaging device of this embodiment includes: a substrate 1, an optoelectronic chip 2, a driver chip 3, an upper fiber optic anti-radiation cover assembly, and a lower fiber optic anti-radiation cover assembly.

[0024] Substrate 1 is a multilayer ceramic substrate with signal lines and power layers internally arranged. Optoelectronic chip 2 and driver chip 3 are both mounted on the upper surface of substrate 1 via flip-chip bonding or adhesive bonding. Optoelectronic chip 2 converts received optical signals into electrical signals or modulates electrical signals into optical signals, while driver chip 3 provides bias current and modulation drive. In this embodiment, driver chip 3 integrates radiation-hardened logic circuitry implemented using a DICE+TMR hybrid unit to improve tolerance to single-event upsets and single-event transient effects.

[0025] like Figures 3 to 5As shown, the upper fiber optic radiation shielding assembly includes an upper radiation shielding wall, an optical fiber 4, an optical fiber connector 5, and an optical fiber shield 6. The upper radiation shielding wall consists of a first radiation shielding wall 7 and a second radiation shielding wall 8. The first radiation shielding wall 7 is directly fixed to the substrate 1 and completely covers the optoelectronic chip 2 and the driver chip 3. The top of the first radiation shielding wall 7 is provided with a positioning groove 9, and the lens 10 is embedded in the positioning groove 9 through the positioning protrusion 11 at its bottom to achieve precise alignment. The second radiation shielding wall 8 is installed above the first radiation shielding wall 7, and the lower end of the optical fiber connector 5 is inserted into the top of the second radiation shielding wall 8.

[0026] The fiber optic connector 5, together with the second radiation shielding wall 8 and the first radiation shielding wall 7, forms a sealed shielding space that completely encloses the optoelectronic chip 2 and the driver chip 3. The first end of the fiber optic cable 4 is located inside the fiber optic connector 5 and close to the optical window of the optoelectronic chip 2; the second end of the fiber optic cable 4 passes through the fiber optic connector 5 and enters the fiber optic cover 6. The fiber optic cover 6 is a metal corrugated tube or a rigid tube, with its first end sealed to the fiber optic connector 5, and its second end passing through the third through hole 14 reserved on the substrate 1 and continuing downward through the lower cover plate 15.

[0027] like Figures 1 to 5 As shown, the lower fiber optic radiation shield assembly includes a lower radiation shield wall 16 and a lower cover plate 15. The lower radiation shield wall 16 is fixed to the bottom surface of the substrate 1, and its bottom area is larger than that of the upper radiation shield wall to provide a wider and more stable installation area. The lower radiation shield wall 16 is provided with a first through hole 17 and a second through hole 18. The substrate 1 is also provided with a plurality of spring pins 19 for elastic electrical connection with external circuit boards. The spring pins 19 extend downward and pass through the first through hole 17 of the lower radiation shield wall 16, and finally protrude through the lower cover plate 15 for crimping with other circuit boards. The fiber optic shield 6 passes through the second through hole 18 and is welded and sealed to the lower cover plate 15.

[0028] As preferred process materials, the first radiation shielding wall 7, the second radiation shielding wall 8, and the lower radiation shielding wall 16 are all made of tungsten-copper alloy with a thickness of 30 μm. The lens 10 is a radiation-resistant glass lens. To prevent radiation leakage at the interface, shielding sealing gaskets are provided between the lens 10 and the first radiation shielding wall 7, and between the second radiation shielding wall 8 and the first radiation shielding wall 7. These gaskets are made of silver-plated copper wire braided and coated with fluororubber, with a compression ratio of 20% after installation to ensure that they remain sealed under vibration and thermal cycling. In addition, a sealing welding ring is provided between the outer wall of the fiber optic outer cover 6 and the third through hole 14 of the substrate 1. The sealing welding ring is a tungsten-copper alloy ring with a thickness of 0.3 mm, and an airtight connection is achieved by laser welding.

[0029] To enhance the radiation absorption capacity of the enclosure, the inner surfaces of both the upper radiation shielding wall and the lower radiation shielding wall 16 are coated with alternating layers of polyimide and copper films. In this embodiment, a total of three layers are coated, each with a polyimide layer thickness of 10 μm and a copper film thickness of 5 μm. This composite film layer can effectively block secondary electrons and fluorescence radiation generated by high-energy particles.

[0030] Example 2 like Figures 1 to 4 As shown, Figure 1 As shown, there is a substrate 1; an optoelectronic chip 2, disposed on the substrate 1, used to convert optical signals and electrical signals; a driver chip 3, disposed on the substrate 1, used to drive the optoelectronic chip 2; an upper fiber optic radiation shield assembly, which includes a first radiation shield 7 and a second radiation shield 8, an optical fiber 4, an optical fiber connector 5, and an optical fiber shield 6. The first radiation shield 7 and the second radiation shield 8 cover the optoelectronic chip 2 and the driver chip 3. The optical fiber connector 5 is disposed on top of the first radiation shield 7 and the second radiation shield 8. The first end of the optical fiber 4 is disposed in the optical fiber connector 5 and close to the optoelectronic chip 2. The first end of the optical fiber shield 6 is connected to the optical fiber connector 5. The second end of the optical fiber 4 is disposed inside the optical fiber shield 6. The optical fiber shield 6 passes through the substrate 1; a lower fiber optic radiation shield assembly, which includes a lower radiation shield 16 and a lower cover plate 15. The lower radiation shield 16 is disposed on the bottom surface of the substrate 1. The lower cover plate 15 is disposed at the bottom of the lower radiation shield 16. The optical fiber shield 6 passes through the lower cover plate 15.

[0031] Based on the above structural analysis, the chip is surrounded by a first radiation shielding wall 7 and a second radiation shielding wall 8, with a lower radiation shielding wall 16 providing additional protection at the bottom, making it difficult for radiation to penetrate from the sides or bottom. The optical fiber 4 that carries the optical signal is also completely enclosed within the optical fiber sheath 6, extending from the chip all the way to the outside of the substrate; the entire optical path is sealed. In this way, the entire device is equivalent to a sealed shielded box, leaving only the necessary electrical interfaces on the outside.

[0032] like Figures 4 to 5 As shown, the substrate 1 is also provided with a spring pin 19 for electrical connection, and the spring pin 19 extends downward through the lower cover plate 15.

[0033] Based on the above structural analysis, the spring pin 19 on the substrate 1 passes directly through the lower cover plate 15, allowing the electrical signal to be led vertically downwards without the need for a separate connector on the side. Reducing the number of openings eliminates the potential for radiation leakage. Furthermore, the spring pin 19 itself is elastic, ensuring reliable contact when pressed against the external circuit board and facilitating assembly and disassembly.

[0034] like Figures 6 to 7As shown, the upper radiation shielding wall includes a first radiation shielding wall 7 disposed on the substrate 1. The first radiation shielding wall 7 is provided with a positioning groove 9. A lens 10 is disposed on the first radiation shielding wall 7. A positioning protrusion 11 for embedding the positioning groove 9 is disposed at the bottom of the lens 10. A second radiation shielding wall 8 is also disposed on the first radiation shielding wall 7. The insertion end of the optical fiber connector 5 is disposed on the top of the second radiation shielding wall 8.

[0035] Based on the above structural analysis, the lens 10 and the first radiation shielding wall 7 are fitted together using a positioning groove 9 and a positioning protrusion 11. During installation, the lens 10 will automatically lock into the correct position without repeated adjustments. For the optoelectronic chip 2, misalignment of the lens 10 will affect the optical coupling efficiency; this positioning structure solves the problem of assembly accuracy.

[0036] like Figures 1 to 4 As shown, the bottom area of ​​the lower radiation shielding wall 16 is larger than the bottom area of ​​the first radiation shielding wall 7 and the second radiation shielding wall 8. The lower radiation shielding wall 16 is provided with a first through hole 17 for the spring pin 19 to pass through, and the lower radiation shielding wall 16 is also provided with a second through hole 18 for the optical fiber connector 5 to pass through.

[0037] Based on the above structural analysis, the lower radiation shielding wall 16 has a larger base area than the first radiation shielding wall 7 and the second radiation shielding wall 8, making the entire device more stable and less prone to shaking when placed on the external structure. The lower wall 16 has a dedicated first through hole 17 for the spring pin 19 to pass through, and a second through hole 18 for the fiber optic outer cover 6 to pass through. These are independent of each other, ensuring no interference during installation and facilitating maintenance and replacement.

[0038] like Figure 4 As shown, the fiber optic connector 5 is used to form a sealed space with the second radiation shielding wall 8 and the first radiation shielding wall 7, and is covered on the optoelectronic chip 2 and the driver chip 3. The substrate 1 is also provided with a third through hole 14 for the fiber optic outer cover 6 to pass through.

[0039] Based on the above structural analysis, the fiber optic connector 5, the first radiation shielding wall 7, and the second radiation shielding wall 8 are interlocked, completely enclosing the optoelectronic chip 2 and the driver chip 3 in a sealed space. The optical signal enters from the fiber optic cable 4, passes through the fiber optic connector 5, and directly strikes the chip. There are no gaps in between, preventing radiation from entering and ensuring the optical path remains unaffected.

[0040] like Figures 1 to 4 As shown, the materials of the first radiation shielding wall 7, the second radiation shielding wall 8, and the lower radiation shielding wall 16 are all one or more of tungsten, tantalum, or tungsten-copper alloy, and the thickness of the first radiation shielding wall 7, the second radiation shielding wall 8, and the lower radiation shielding wall 16 is 1 μm to 50 μm.

[0041] Based on the above structural analysis, the first radiation shielding wall 7, the second radiation shielding wall 8, and the lower radiation shielding wall 16 are made of high-density materials such as tungsten, tantalum, or tungsten-copper alloys, which have a much better shielding ability against X-rays and gamma rays than ordinary metals. The thickness is controlled between 1 and 50 micrometers, which can block most high-energy particles without making the entire package too heavy, making it suitable for spaceborne requirements.

[0042] like Figures 1 to 4 As shown, the driver chip 3 includes radiation-hardened logic circuitry, which employs at least one of a DICE+TMR hybrid cell or a 16T SRAM cell.

[0043] Based on the above structural analysis, the driver chip 3 has been internally hardened against radiation using mature circuit structures such as DICE, TMR, or 16T SRAM. Even if high-energy particles hit the inside of the chip, the logic state is not easily flipped, which is equivalent to adding another layer of protection on top of the packaging shielding, making the double protection more reliable.

[0044] like Figures 1 to 4 As shown, shielding sealing gaskets 20 are provided between the lens 10 and the first radiation shielding wall 7, and between the second radiation shielding wall 8 and the first radiation shielding wall 7. The compression rate of the shielding sealing gaskets 20 is 15% to 30%.

[0045] Based on the above structural analysis, shielding sealing gaskets 20 are inserted between the lens 10 and the first radiation shielding wall 7, and between the second radiation shielding wall 8 and the first radiation shielding wall 7. After being compressed, the gaskets have a compression rate between 15% and 30%, which can not only block the micro-slits of radiation leakage, but also buffer vibration and thermal deformation, and will not age or fail even after long-term on-orbit operation.

[0046] like Figures 1 to 4 As shown, a sealing welding ring 21 is provided between the outer wall of the optical fiber outer cover 6 and the third through hole 14 of the substrate 1. The thickness of the sealing welding ring 21 is 0.1 mm to 0.5 mm, and the material of the sealing welding ring 21 is tungsten copper alloy.

[0047] Based on the above structural analysis, the location where the optical fiber sheath 6 passes through the third through-hole 14 on the substrate is sealed with a sealing welding ring 21, which is also made of tungsten copper alloy. Welding is more reliable than adhesive or gaskets, as it prevents gas release in a vacuum environment, and the welding ring itself can also shield radiation, thus preventing a weak point from forming at this through-hole location.

[0048] like Figures 1 to 4 As shown, the inner surfaces of the first radiation shielding wall 7 and the second radiation shielding wall 8, as well as the inner surface of the lower radiation shielding wall 16, are all coated with at least one layer of alternating polyimide film and copper film. The thickness of the polyimide film is 5 μm to 20 μm, and the thickness of the copper film is 1 μm to 10 μm.

[0049] Based on the above structural analysis, the inner surfaces of the first radiation shielding wall 7, the second radiation shielding wall 8, and the lower radiation shielding wall 16 are coated with multiple layers of polyimide film and copper film, stacked alternately. After high-energy particles penetrate the outer wall, they will generate secondary electrons and fluorescence. This composite film can absorb the secondary rays again, making the shielding even cleaner.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A radiation-shielding packaging device for spaceborne optoelectronic chips, characterized in that, include: substrate; An optoelectronic chip, disposed on the substrate, is used to convert optical signals into electrical signals; A driver chip, disposed on the substrate, is used to drive the optoelectronic chip; An upper fiber optic radiation shielding assembly includes an upper radiation shielding wall, an optical fiber, an optical fiber connector, and an optical fiber shield. The upper radiation shielding wall is disposed outside the optoelectronic chip and the driving chip. The optical fiber connector is disposed on the top of the upper radiation shielding wall. The first end of the optical fiber is disposed in the optical fiber connector and close to the optoelectronic chip. The first end of the optical fiber shield is connected to the optical fiber connector. The second end of the optical fiber is disposed inside the optical fiber shield. The optical fiber shield passes through the substrate. The lower fiber optic radiation shielding assembly includes a lower radiation shielding wall and a lower cover plate. The lower radiation shielding wall is disposed on the bottom surface of the substrate, and the lower cover plate is disposed at the bottom of the lower radiation shielding wall. The fiber optic shield passes through the lower cover plate.

2. The radiation-proof packaging device for spaceborne optoelectronic chips according to claim 1, characterized in that: The substrate is also provided with a spring pin for electrical connection, the spring pin extending downward through the lower cover plate.

3. The radiation-shielding packaging device for spaceborne optoelectronic chips according to claim 2, characterized in that: The upper radiation shielding wall includes a first radiation shielding wall disposed on the substrate, the first radiation shielding wall being provided with a positioning groove, a lens being disposed on the first radiation shielding wall, a positioning protrusion for embedding the positioning groove being provided at the bottom of the lens, a second radiation shielding wall being disposed on the first radiation shielding wall, and the insertion end of the optical fiber connector being disposed on the top of the second radiation shielding wall.

4. The radiation-proof packaging device for spaceborne optoelectronic chips according to claim 2, characterized in that: The bottom area of ​​the lower radiation shielding wall is larger than the bottom area of ​​the upper radiation shielding wall. The lower radiation shielding wall is provided with a first through hole for the spring pin to pass through, and the lower radiation shielding wall is also provided with a second through hole for the optical fiber connector to pass through.

5. The radiation-shielding packaging device for spaceborne optoelectronic chips according to claim 3, characterized in that: The optical fiber connector is used to form a sealed space with the second radiation shield and the first radiation shield, and covers the optoelectronic chip and the driving chip. The substrate is also provided with a third through hole for the optical fiber outer cover to pass through.

6. The radiation-shielding packaging device for spaceborne optoelectronic chips according to claim 3, characterized in that: The materials of the first radiation shielding wall, the second radiation shielding wall, and the lower radiation shielding wall are all one or more of tungsten, tantalum, or tungsten-copper alloy, and the thickness of the first radiation shielding wall, the second radiation shielding wall, and the lower radiation shielding wall is 1 μm to 50 μm.

7. The radiation-shielding packaging device for spaceborne optoelectronic chips according to claim 1, characterized in that: The driver chip includes radiation-hardened logic circuitry, which employs at least one of a DICE+TMR hybrid cell or a 16T SRAM cell.

8. The radiation-shielding packaging device for spaceborne optoelectronic chips according to claim 3, characterized in that: A shielding sealing gasket is provided between the lens and the first radiation shielding wall, and between the second radiation shielding wall and the first radiation shielding wall. The compression rate of the shielding sealing gasket is 15% to 30%.

9. The radiation-shielding packaging device for spaceborne optoelectronic chips according to claim 5, characterized in that: A sealing welding ring is provided between the outer wall of the optical fiber cover and the third through hole of the substrate. The thickness of the sealing welding ring is 0.1 mm to 0.5 mm, and the material of the sealing welding ring is tungsten copper alloy.

10. The radiation shielding package for a space-borne optoelectronic chip of claim 1 or 7, wherein: The inner surfaces of both the upper and lower radiation shielding walls are coated with at least one layer of alternating polyimide film and copper film, wherein the thickness of the polyimide film is 5 μm to 20 μm and the thickness of the copper film is 1 μm to 10 μm.

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