Display panel, display panel preparation method and display device

Abstract

This invention discloses a display panel, a method for manufacturing the display panel, and a display device. The display panel includes: a substrate; an isolation structure including a plurality of spaced-apart first openings, the isolation structure including a first conductive layer; a plurality of light-emitting units, which at least partially overlap with the first openings along a direction perpendicular to the plane of the substrate, and along a direction away from the substrate, each light-emitting unit includes a first electrode block, a light-emitting layer, and a second electrode block stacked together; and a color resist structure including a plurality of color resists, at least partially overlapping with the light-emitting units along a direction perpendicular to the plane of the substrate. By utilizing the isolation structure as a shield, patterned light-emitting units are formed correspondingly within the first openings, eliminating the need for additional mask preparation, effectively reducing manufacturing costs, improving production efficiency, and providing a way to filter light by setting the color resist structure, thereby improving color purity, contrast, display effect, and overall performance of the display panel.

Description

Technical Field

[0001] This invention belongs to the field of display technology, and particularly relates to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] With the advancement of technology, digital display panels such as those used in smartphones and tablets are widely used, and the display screen is an indispensable human-computer interaction interface in these panels. OLED (Organic Light Emitting Diode) display panels, for example, have advantages such as self-illumination, energy saving, flexibility, and good adaptability. Furthermore, these display panels do not require a backlight and feature fast response times and excellent display effects, attracting user attention and being widely used in smartphones, tablets, and other terminal products.

[0003] However, due to the structural limitations of existing display panels, the thickness of the display panels cannot meet the requirements.

[0004] Therefore, there is an urgent need for a new display panel, a display panel manufacturing method, and a display device. Summary of the Invention

[0005] This invention provides a display panel, a method for manufacturing the display panel, and a display device. An isolation structure is used to limit the light emission range of the light-emitting unit. During manufacturing, the isolation structure acts as a shield, and patterned light-emitting units are formed within a first opening, eliminating the need for a fine mask and reducing costs. Furthermore, along a direction perpendicular to the plane of the substrate, at least a portion of the color resist structure and the light-emitting unit overlap, meaning that at least a portion of the light emitted by the light-emitting unit needs to pass through the color resist structure, achieving light filtering, improving color purity and contrast, replacing polarizers to achieve low reflection, and reducing the thickness of the display panel.

[0006] In a first aspect, embodiments of the present invention provide a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure including a plurality of spaced-apart first openings, the isolation structure including a first conductive layer; a plurality of light-emitting units, each light-emitting unit disposed on one side of the substrate, along a direction perpendicular to the plane of the substrate, the light-emitting unit and the first openings at least partially overlapping, along a direction away from the substrate, each light-emitting unit including a first electrode block, a light-emitting layer and a second electrode block stacked together, the second electrode block and the first conductive layer being electrically connected; and a color resist structure disposed on the side of the light-emitting units away from the substrate, the color resist structure including a plurality of color resists, along a direction perpendicular to the plane of the substrate, at least partially the color resist structure and the light-emitting units overlapping.

[0007] Secondly, embodiments of the present invention provide a method for manufacturing a display panel, used to manufacture the display panel in any of the above embodiments. The method for manufacturing the display panel includes the following steps: providing a substrate; forming an isolation structure and a plurality of light-emitting units on one side of the substrate, the isolation structure including a plurality of spaced-apart first openings, the isolation structure including a first conductive layer along a direction perpendicular to the plane of the substrate, the light-emitting units and the first openings at least partially overlapping along a direction away from the substrate, the light-emitting unit including a first electrode block, a light-emitting layer and a second electrode block stacked together, the second electrode block and the first conductive layer being electrically connected; forming a color resist structure, the color resist structure being formed on the side of the light-emitting unit away from the substrate, the color resist structure including a plurality of color resists along a direction perpendicular to the plane of the substrate, at least partially the color resist structure and the light-emitting unit overlapping.

[0008] Thirdly, embodiments of the present invention provide a display device, including the display panel in any of the above embodiments.

[0009] Compared with related technologies, the display panel provided in this embodiment of the invention includes a substrate, an isolation structure, a light-emitting unit, and a color resist structure. The isolation structure includes a plurality of first openings spaced apart. The light-emitting unit can be at least partially located within the first opening. The isolation structure limits the light emission range of the light-emitting unit. At the same time, during fabrication, the isolation structure can be used as a shield to form patterned light-emitting units corresponding to the first openings, eliminating the need for a fine mask and reducing costs. Furthermore, along the direction perpendicular to the plane of the substrate, at least part of the color resist structure and the light-emitting unit are overlapped, meaning that at least part of the light emitted by the light-emitting unit needs to pass through the color resist structure to achieve light filtering, improve color purity and contrast, replace the polarizer to achieve low reflection, and reduce the thickness of the display panel. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of a display panel according to an embodiment of the present invention; Figure 2 This is provided by one embodiment of the present invention. Figure 1 A cross-sectional view at point A-A'; Figure 3 This is provided by one embodiment of the present invention. Figure 2 A partial schematic diagram at point C in the middle; Figure 4 This is provided by another embodiment of the present invention. Figure 1 A cross-sectional view at point A-A'; Figure 5 This is provided by one embodiment of the present invention. Figure 4 A partial schematic diagram at point E in the middle; Figure 6 This is a schematic diagram showing the relative positions of the light-emitting unit and the first color resist part, the second color resist part, and the third color resist part according to an embodiment of the present invention. Figure 7 This is a schematic diagram showing the relative positions of the light-emitting unit and the first color resist part, the second color resist part, and the third color resist part provided in another embodiment of the present invention; Figure 8 This is a schematic flowchart of a display panel manufacturing method provided in one embodiment of the present invention; Figure 9 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 10 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 11 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 12 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 13 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 14 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 15 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 16 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 17 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 18 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 19 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 20 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 21 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 22 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 23 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 24 This is a schematic diagram of the structure obtained during the fabrication process of a display panel fabrication method according to an embodiment of the present invention; Figure 25 This is a schematic diagram of a display device provided in one embodiment of the present invention. Attached Figure Description

[0012] 10. Display panel; 100. Substrate; 200. Isolation structure; 210. First conductive layer; 211. First conductive material layer; 220. First inorganic layer; 221. First inorganic material layer; 230. Second inorganic layer; 231. Second inorganic material layer; 300, Light-emitting unit; 301, First electrode block; 302, Light-emitting layer; 303, Second electrode block; 310, First light-emitting unit; 320, Second light-emitting unit; 330, Third light-emitting unit; 32, First light-emitting material layer; 33, Second electrode material layer; 400. Color resist structure; 410. First color resist section; 411. First part; 412. Second part; 420. Second color resist section; 421. Fifth part; 422. Sixth part; 430. Third color resist section; 431. Third part; 432. Fourth part; 510, First encapsulation layer; 511, First encapsulation portion; 501, First sub-portion; 502, Second sub-portion; 520, Second encapsulation layer; 530, Third encapsulation layer; 600, Light-shielding layer; 610, First light-shielding part; 620, Second light-shielding part; 700, Touch layer; 710, Touch substrate; 720, Touch metal line; 730, Insulating adhesive layer; 800, Covering layer; 900, First insulating layer; 901, First insulating material layer; J, Optical adhesive layer; K1, First opening; K11, First sub-opening; K2, Second opening; C1, First side surface; C2, Second side surface; C3, Third side surface; C4, Fourth side surface; P, Photoresist layer; H, Gap between adjacent first encapsulation portions; Z, along the direction perpendicular to the plane of the substrate. Detailed Implementation

[0013] The features and exemplary embodiments of various aspects of the present invention will now be described in detail. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention may be practiced without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of the invention by illustrating examples of the invention.

[0014] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0015] To better understand this invention, the following is combined with... Figures 1 to 25 The display panel, display panel manufacturing method, and display device according to embodiments of the present invention will be described in detail.

[0016] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a display panel according to an embodiment of the present invention; Figure 2 This is provided by one embodiment of the present invention. Figure 1 A cross-sectional view at point A-A'; Figure 3 This is provided by one embodiment of the present invention. Figure 2 A partial schematic diagram at point C.

[0017] This invention provides a display panel 10, comprising: a substrate 100; an isolation structure 200 disposed on one side of the substrate 100, the isolation structure 200 including a plurality of spaced first openings K1 and a first conductive layer 210; a plurality of light-emitting units 300, each light-emitting unit 300 disposed on one side of the substrate 100, along a direction Z perpendicular to the plane of the substrate, the light-emitting units 300 and the first openings K1 at least partially overlapping, along a direction away from the substrate 100, the light-emitting unit 300 including a first electrode block 301, a light-emitting layer 302 and a second electrode block 303 stacked together, the second electrode block 303 and the first conductive layer 210 electrically connected; and a color resist structure 400 disposed on the side of the light-emitting units 300 away from the substrate 100, the color resist structure 400 including a plurality of color resists, along a direction Z perpendicular to the plane of the substrate, at least a portion of the color resist structure 400 and the light-emitting units 300 overlapping.

[0018] The display panel 10 provided in this embodiment of the invention includes a substrate 100, an isolation structure 200, a light-emitting unit 300, and a color resist structure 400. The isolation structure 200 includes a plurality of first openings K1 spaced apart. The light-emitting unit 300 can be at least partially located within the first openings K1. The isolation structure 200 limits the light emission range of the light-emitting unit 300. At the same time, during fabrication, the isolation structure 200 can be used as a shield to form patterned light-emitting units 300 correspondingly within the first openings K1, eliminating the need for a fine mask and reducing costs. Furthermore, along the direction Z perpendicular to the plane of the substrate, at least part of the color resist structure 400 and the light-emitting unit 300 are overlapped, meaning that at least part of the light emitted by the light-emitting unit 300 needs to pass through the color resist structure 400 to achieve light filtering, improve color purity and contrast, replace the polarizer to achieve low reflection, and reduce the thickness of the display panel 10.

[0019] In this embodiment, the substrate 100 may include a substrate and an array layer (not shown in the figure), and the array layer may include driving circuitry. Exemplarily, the driving circuitry disposed on the array layer may include transistors and storage capacitors. The transistors include an active layer, a gate, a source, and a drain.

[0020] Optionally, the substrate can be a rigid substrate, such as a glass substrate; or it can be a flexible substrate, made of materials such as polyimide, polystyrene, polyethylene terephthalate, poly(p-xylene), polyethersulfone, or polyethylene naphthalate. The substrate is mainly used to support the devices mounted on it.

[0021] The isolation structure 200 includes a first conductive layer 210. The second electrode block 303 in each light-emitting unit 300 needs to be electrically connected to the first conductive layer 210 to form an electrically connected overall structure, which facilitates the same transmission of signals.

[0022] It should be noted that, along the direction Z perpendicular to the plane of the substrate, the light-emitting unit 300 and the first opening K1 at least partially overlap, which means that the light-emitting unit 300 is at least partially located within the first opening K1. For example, the light-emitting unit 300 may be entirely located within the first opening K1.

[0023] Optionally, the material of the first electrode block 301 is generally a material with a high work function to improve hole injection efficiency. It can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO), or a transparent conductive polymer (such as polyaniline). For example, the first electrode block 301 can be made of ITO-Ag-ITO composite material, without any special limitation.

[0024] The material of the second electrode block 303 can be one of the following metals: silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca), or indium (In). It can also be an alloy of the aforementioned metals, such as magnesium-silver alloy (Mg / Ag) or lithium-aluminum alloy (Li / Al). This embodiment does not limit the material in this regard.

[0025] The light-emitting layer 302 may include one or more of the following: an electron injection layer, an electron transport layer, a light-emitting material layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer. The specific selection depends on the type of the light-emitting layer 302 and is not particularly limited. The electron injection layer, electron transport layer, and hole blocking layer may be disposed between the second electrode layer and the light-emitting material layer. The electron blocking layer, hole transport layer, and hole injection layer may be disposed between the first electrode layer and the light-emitting material layer.

[0026] Optionally, the light-emitting layer 302 can also be a tandem architecture, i.e., a stacked structure of two-layer light-emitting devices. The light-emitting layer 302 includes a first light-emitting functional unit, a charge generation layer (CGL), and a second light-emitting functional unit stacked between the first electrode block 301 and the second electrode block 303. The charge generation layer is sandwiched between the upper and lower light-emitting units 300 and can autonomously generate and separate charges under an applied electric field, injecting holes and electrons into the light-emitting units 300 on both sides respectively. The two light-emitting units 300 synchronously emit light, achieving superposition of brightness and luminous efficiency. Compared with a single-layer structure, it can reduce the driving current density at the same light output brightness, effectively slow down the aging of organic materials, improve the device lifespan and luminous stability, and adapt to the display application requirements of high brightness and low power consumption.

[0027] Please see Figures 2 to 3Optionally, the color filter structure 400 may include multiple color filters of different colors. The color filter structure 400 is used to filter light to emit light of different colors. For example, the color filter structure 400 may include a first color filter portion 410 and a second color filter portion 420 of different colors. Specifically, the first color filter portion 410 and the second color filter portion 420 are different in color, meaning that the colors of the filtered light by the first color filter portion 410 and the second color filter portion 420 are different. For example, if the ambient light is white light, it will be filtered into blue light after passing through the first color filter portion 410 (which is blue) and into green light after passing through the second color filter portion 420 (which is green).

[0028] It should be noted that in this embodiment, the color resist structure 400 is disposed on the side of the light-emitting unit 300 away from the substrate 100, which can represent the order of film layer stacking, or the order of process. That is, the light-emitting unit 300 can be prepared first, and then the color resist structure 400 can be prepared on the side of the light-emitting unit 300 away from the substrate 100.

[0029] Please see Figures 2 to 3 In some optional embodiments, the display panel 10 further includes a first insulating layer 900 disposed between the isolation structure 200 and the substrate 100. The first insulating layer 900 includes a plurality of second openings K2. Along the direction Z perpendicular to the plane of the substrate, the first insulating layer 900 partially covers the first electrode block 301. The second openings K2 and the first openings K1 at least partially overlap, and the first electrode block 301 and the second openings K2 at least partially overlap.

[0030] It should be noted that, since the first conductive layer 210 is conductive and is used for electrical connection with the second electrode block 303, it is necessary to avoid electrical connection between the first electrode block 301 and the first conductive layer 210, which are also located in the first opening K1. Therefore, in this embodiment, the first insulating layer 900 is disposed between the isolation structure 200 and the substrate 100, and the first insulating layer 900 partially covers the first electrode block 301. By using the first insulating layer 900 to cover the edge of the first electrode block 301 near the isolation structure 200, the first electrode block 301 and the isolation structure 200 are prevented from being electrically connected, ensuring that the second electrode blocks 303 located in each of the first openings K1 are connected through the first conductive layer 210, thereby achieving overall electrical connection.

[0031] In this embodiment, the second opening K2 of the first insulating layer 900 needs to expose the side surface of the first electrode block 301 facing away from the substrate 100 to ensure contact between the first electrode block 301 and the light-emitting layer 302, that is, the first electrode block 301 and the second opening K2 mentioned above at least partially overlap.

[0032] Optionally, the first insulating layer 900 can be made of inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride.

[0033] Please see Figures 2 to 3 In some optional embodiments, the isolation structure 200 further includes a first inorganic layer 220 and a second inorganic layer 230. The first inorganic layer 220 is located on the side of the first conductive layer 210 away from the substrate 100, and the second inorganic layer 230 is located on the side of the first inorganic layer 220 away from the substrate 100. The first inorganic layer 220 includes a first side surface C1 near the first opening K1, the second inorganic layer 230 includes a second side surface C2 near the first opening K1, and the first conductive layer 210 includes a third side surface C3 near the first opening K1. Along the direction parallel to the plane where the substrate 100 is located, the minimum distance between the first side surface C1 and the third side surface C3 is D1, and the minimum distance between the second side surface C2 and the third side surface C3 is D2, where D2≥D1.

[0034] It should be noted that in this embodiment, along the direction parallel to the plane where the substrate 100 is located, the second side surface C2 can be disposed near the center of the first opening K1 relative to the first side surface C1. That is, along the direction parallel to the plane where the substrate 100 is located, the second inorganic layer 230 protrudes towards the first opening K1 relative to the first inorganic layer 220. Correspondingly, D2 > D1, which facilitates the division of the light-emitting layer 302 material or the second electrode material of the light-emitting unit 300.

[0035] When the second side C2 and the first side C1 are aligned along the direction Z perpendicular to the plane of the substrate, D2 = D1.

[0036] Please see Figures 2 to 3 The first inorganic layer 220 and the second inorganic layer 230 in the isolation structure 200 form a continuous stepped structure, which not only serves to divide the light-emitting unit 300, but also facilitates the film formation continuity of the subsequent cover layer 800 or the first encapsulation layer 510, and enhances the effectiveness of the cover layer 800 or the first encapsulation layer 510 in isolating the light-emitting unit 300 from water and oxygen erosion.

[0037] In this embodiment, along a direction parallel to the plane of the substrate 100, both the first inorganic layer 220 and the second inorganic layer 230 protrude toward the first opening K1 relative to the first conductive layer 210.

[0038] Please see Figure 3 In some optional embodiments, the first insulating layer 900 includes a fourth side surface C4 near the first opening K1. The minimum distance between the fourth side surface C4 and the third side surface C3 along a direction parallel to the plane of the substrate 100 is D3, where D3 ≥ D1.

[0039] In this embodiment, along the direction parallel to the plane of the substrate 100, the first insulating layer 900 can protrude relative to the first conductive layer 210 toward the first opening K1, with a protrusion distance of D3. Along the direction parallel to the plane of the substrate 100, the minimum distance D3 between the fourth side surface C4 and the third side surface C3 can be equal to D1, or the minimum distance between the fourth side surface C4 and the third side surface C3 can be increased so that D3 > D1, thereby increasing the coverage area of ​​the first insulating layer 900 on the first electrode block 301 and ensuring that the first electrode block 301 will not contact the second electrode block 303 or the first conductive layer 210.

[0040] Please see Figure 2 In some optional embodiments, the display panel 10 further includes a first encapsulation layer 510, which includes a plurality of spaced first encapsulation portions 511, with a gap H between adjacent first encapsulation portions 511. The first encapsulation portions 511 are at least partially disposed on the side of the light-emitting unit 300 away from the substrate 100. Along the direction Z perpendicular to the plane of the substrate, the gap H and the isolation structure 200 at least partially overlap.

[0041] It should be noted that in this embodiment, each first encapsulation part 511 is independently set and there is a gap H between them, so that they do not affect each other, thereby realizing independent encapsulation of each light-emitting unit 300 and improving the encapsulation effect.

[0042] In this embodiment, the gap H and the isolation structure 200 at least partially overlap along the direction Z perpendicular to the plane of the substrate, meaning that adjacent first packaging portions 511 can be disconnected on the side of the isolation structure 200 away from the substrate 100, i.e. above the isolation structure 200, to avoid mutual interference.

[0043] The first encapsulation portion 511 is at least partially disposed on the side of the light-emitting unit 300 away from the substrate 100, meaning that the first encapsulation portion 511 can be prepared after the light-emitting unit 300 is prepared.

[0044] Optionally, the first encapsulation layer 510 can be made of inorganic materials, specifically silicon nitride, silicon oxide, and silicon oxynitride, and can be formed using CVD (Chemical Vapor Deposition) process.

[0045] Optionally, the first encapsulation layer 510 can be made of the same or different materials as the first inorganic layer 220 and the second inorganic layer 230. For example, when the first encapsulation layer 510 and the second inorganic layer 230 are made of the same material, the first encapsulation layer 510 and the second inorganic layer 230 have better bonding and better encapsulation effect.

[0046] Please see Figure 2In some optional embodiments, the first encapsulation portion 511 includes a first sub-portion 501 and a second sub-portion 502, and a gap H is provided between the second sub-portions 502 adjacent to the first encapsulation portion 511; along the direction Z perpendicular to the plane of the substrate, the first sub-portion 501 on the side of the light-emitting unit 300 away from the substrate 100 at least partially overlaps with the light-emitting unit 300, and the second sub-portion 502 partially overlaps with the isolation structure 200; the display panel 10 also includes a light-shielding layer 600, which is located on the surface of the second sub-portion 502 on the side away from the substrate 100 and partially covers the gap H.

[0047] It should be noted that in this embodiment, along the direction Z perpendicular to the plane of the substrate, the first sub-part 501 of the light-emitting unit 300 on the side away from the substrate 100 at least partially overlaps with the light-emitting unit 300. This means that the first sub-part 501 can at least partially cover the surface of the light-emitting unit 300 on the side away from the substrate 100, or it can be located on the side of the light-emitting unit 300 on the side away from the substrate 100 and not in direct contact with the light-emitting unit 300.

[0048] Along the direction Z perpendicular to the plane of the substrate, the second sub-part 502 partially overlaps with the isolation structure 200. This means that the second sub-part 502 can directly cover the side of the isolation structure 200 away from the substrate 100, or it can be located on the side of the isolation structure 200 away from the substrate 100 and not in direct contact with the isolation structure 200. For example, a light-emitting material layer, a second electrode material layer 33, and other film layers can also be provided between the second sub-part 502 and the isolation structure 200.

[0049] In this embodiment, the light-shielding layer 600 is located on the surface of the second sub-part 502 facing away from the substrate 100 and partially covers the gap H between adjacent first encapsulation parts 511. This means that the light-shielding layer 600 is disposed on the side of the entire isolation structure 200 facing away from the substrate 100, that is, the light-shielding layer 600 can fill the gap H between adjacent first encapsulation parts 511 to ensure the blocking effect on the light emitted by the light-emitting unit 300, effectively limiting the light path of the light-emitting unit 300 and preventing light scattering. At the same time, the light-shielding layer 600 can also play a role in light shielding and anti-reflection of the isolation structure 200 as a whole, preventing light (such as external light) from being reflected on the isolation structure 200 and causing the isolation structure 200 to become visible. The light-shielding layer 600 can also encapsulate and protect the light-emitting material layer and the second electrode material layer 33 remaining on the surface of the isolation structure 200 facing away from the substrate 100.

[0050] Each first package portion 511 can be prepared, and then a light-shielding layer 600 can be prepared so that the light-shielding layer 600 partially covers the gap H between adjacent first package portions 511.

[0051] Optionally, the light-shielding layer 600 can be fabricated using BM (Black Matrix) material or a black pixel definition layer material. Optionally, the first encapsulation layer 510 is located on the side of the light-emitting unit 300 or the isolation structure 200 facing away from the substrate 100, that is, the first encapsulation layer 510 is prepared after the light-emitting unit 300 or the isolation structure 200. The core components of the BM material consist of black filler, resin matrix, photosensitive adhesive, and auxiliary additives. It has high light-blocking rate and excellent optical shielding properties.

[0052] Black pixel definition layer material is a functional material obtained by blackening and modifying conventional PDL (pixel definition layer) material. It can be doped with light-shielding components such as carbon black, black pigment or inorganic black oxide in the base resin of black pixel definition layer material, so that PDL material has efficient light-shielding ability and can replace the light-shielding function of traditional BM material.

[0053] Optionally, the orthographic projection of the light-shielding layer 600 on the substrate 100 covers the orthographic projection of the isolation structure 200 on the substrate 100. That is, the size and shape of the orthographic projection of the light-shielding layer 600 on the substrate 100 can be approximately the same as or larger than the size of the orthographic projection of the isolation structure 200 on the substrate 100, so as to ensure the light-shielding effect.

[0054] Please see Figures 2 to 3 In some optional embodiments, the display panel 10 further includes a cover layer 800 disposed between the first encapsulation layer 510 and the second electrode block 303.

[0055] In this embodiment, the capping layer 800 (CPL) is disposed on the light-emitting side of the light-emitting unit 300, and its position corresponds to the gap area between the first encapsulation layer 510 and the second electrode block 303. One side is attached to the lower surface of the first encapsulation layer 510, and the other side is attached to the upper surface of the second electrode block 303, ensuring complete coverage of the effective light-emitting area of ​​the light-emitting unit 300, while avoiding structural interference with the first encapsulation layer 510 and the second electrode block 303, thus ensuring the compactness and connection reliability of the internal structure of each layer of the display panel 10.

[0056] The cover layer 800 can serve as a protective and optical optimization layer for the light-emitting unit 300, and has the function of optimizing optical performance. By adjusting the optical interference distance inside the display panel 10, it can suppress the extinction phenomenon caused by the movement of surface plasma, reduce the light loss inside the panel, effectively improve the light extraction efficiency of the light-emitting unit 300, and thus improve the luminous efficiency of the display panel 10. In particular, it can improve the problem of low luminous efficiency of blue light pixels, while alleviating the angle dependence of the light emission of the display panel 10, optimizing the display effect under different viewing angles, and ensuring uniform brightness and consistent color across the entire viewing angle range.

[0057] Meanwhile, the cover layer 800 also has a protective function, which can assist the first encapsulation layer 510 in achieving water and oxygen barrier function, effectively preventing water and oxygen in the external environment from penetrating into the light-emitting unit 300, avoiding performance degradation or damage to the light-emitting unit 300 due to water and oxygen erosion, extending the service life of the display panel 10, and at the same time preventing the second electrode block 303 from directly contacting the light-emitting unit 300, preventing the electrode material from damaging the light-emitting unit 300, and playing an isolation and protection role.

[0058] Optionally, the cover layer 800 can be made of materials such as acrylic resin, silicon dioxide, or tantalum pentoxide.

[0059] Please see Figure 2 In some optional embodiments, the display panel 10 further includes a second encapsulation layer 520, a third encapsulation layer 530, and a touch layer 700; the second encapsulation layer 520 is disposed on the side of the first sub-part 501 away from the substrate 100 and the light-shielding layer 600 away from the substrate 100, the third encapsulation layer 530 is disposed on the side of the second encapsulation layer 520 away from the substrate 100, the touch layer 700 is disposed on the side of the third encapsulation layer 530 away from the substrate 100, and the color resist structure 400 is disposed on the side of the touch layer 700 away from the substrate 100.

[0060] It should be noted that the second encapsulation layer 520 can be set as a whole layer, covering the surface of the first sub-part 501 facing away from the substrate 100 and the surface of the light-shielding layer 600 facing away from the substrate 100 respectively, so as to ensure the encapsulation effect.

[0061] The touch layer 700 can adopt a capacitive touch structure, such as a self-capacitance touch or a mutual capacitance touch, to realize the touch function of the display panel 10.

[0062] Optionally, along the direction away from the substrate 100, the touch layer 700 includes a touch substrate 710, a touch metal line 720 and an insulating adhesive layer 730 stacked together. The insulating adhesive layer 730 may be OC adhesive (Optical Clear) to protect the touch metal line 720.

[0063] Optionally, two touch metal layers can be disposed between the touch substrate 710 and the insulating adhesive layer 730. The upper touch metal layer can be used to form a sensing electrode, a driving electrode, and a connection between one of the electrodes, while the lower touch metal layer can be used to form a connection between the other touch electrode. Both touch metal layers can include touch metal lines 720 in a mesh structure.

[0064] In this embodiment, a light-shielding layer 600 can be prepared first, and then a second encapsulation layer 520 can be prepared on the side of the light-shielding layer 600 away from the substrate 100. Then, a third encapsulation layer 530 can be prepared on the side of the second encapsulation layer 520 away from the substrate 100.

[0065] Optionally, the material of the second encapsulation layer 520 may include organic materials. The organic material may be made of resin or polymeric organic materials, and may be formed using IJP (Inkjet printing) technology.

[0066] Optionally, the material of the third encapsulation layer 530 may include inorganic materials. Adding an inorganic encapsulation layer outside the organic encapsulation layer can further improve the encapsulation effect of the encapsulation layer. In this embodiment, the material of the third encapsulation layer 530 may be the same as or different from the material of the first encapsulation layer 510, and there is no special limitation.

[0067] Optionally, the first encapsulation layer 510 and the third encapsulation layer 530 are made of the same material, so that the first encapsulation layer 510 and the third encapsulation layer 530 can be manufactured using the same equipment, which simplifies the manufacturing process of the display panel 10.

[0068] Optionally, the display panel 10 may also include an optical adhesive layer J disposed on the side of the color resist structure 400 away from the substrate 100, that is, the optical adhesive layer J can be formed after the color resist structure 400 is prepared to protect the color resist structure 400.

[0069] Please see Figure 2 In some optional embodiments, along the direction Z perpendicular to the plane where the substrate is located, the distance between the side surface of the light-shielding layer 600 away from the substrate 100 and the side surface of the second encapsulation layer 520 away from the substrate 100 is D4, and the distance between the side surface of the second encapsulation layer 520 away from the substrate 100 and the side surface of the second encapsulation layer 520 closer to the light-emitting unit 300 is D5. Where, D4≤ D5, or, D5 > D4 ≥ D5.

[0070] In this embodiment, along the direction Z perpendicular to the plane of the substrate, the smaller the distance between the side surface of the light-shielding layer 600 facing away from the substrate 100 and the side surface of the second encapsulation layer 520 facing away from the substrate 100, the higher the height of the corresponding light-shielding layer 600 relative to the corresponding light-emitting unit 300. This results in a greater restriction of the light emission range of the light-emitting unit 300 by the light-shielding layer 600, reducing the emission range of the light-emitting unit 300 and the viewing angle of the display panel 10, thus achieving a privacy protection effect.

[0071] Along the direction Z perpendicular to the plane of the substrate, the greater the distance between the side surface of the light-shielding layer 600 facing away from the substrate 100 and the side surface of the second encapsulation layer 520 facing away from the substrate 100, the lower the height of the corresponding light-shielding layer 600 relative to the corresponding light-emitting unit 300. This results in a weaker blocking effect of the corresponding light-shielding layer 600 on the light-emitting unit 300, which can increase the light emission range of the light-emitting unit 300, improve the viewing angle of the display panel 10, and enable the display panel 10 to display normally.

[0072] Optionally, when privacy protection is required, D4 can be limited to ≤ D5 ensures that D4 is small enough, and the height of the corresponding light-shielding layer 600 relative to the corresponding light-emitting unit 300 is large enough to guarantee the blocking effect. For example, D4 ​​can be equal to... D5、 D5、 Any of D5.

[0073] Optionally, if a larger viewing angle of the display panel 10 is required, D4 ≥ can be limited. D5 is used to reduce the obstruction of the light-shielding layer 600 relative to the corresponding light-emitting unit 300, thus ensuring display quality. For example, D4 ​​can be equal to... D5、 D5、 Any of D5. D4 must be smaller than D5, otherwise it will affect the setting of the second encapsulation layer 520.

[0074] Please see Figures 4 to 5 , Figure 4 This is provided by another embodiment of the present invention. Figure 1 A cross-sectional view at point A-A'; Figure 5 This is provided by one embodiment of the present invention. Figure 4 A partial schematic diagram at point E;; In some optional embodiments, the light-emitting unit 300 includes a first light-emitting unit 310 and a second light-emitting unit 320 with different light-emitting colors; the light-shielding layer 600 includes a first light-shielding part 610 and a second light-shielding part 620; The orthographic projection of the first light-shielding portion 610 on the substrate 100 is at least partially arranged around the orthographic projection of the first light-emitting unit 310 on the substrate 100, and the orthographic projection of the second light-shielding portion 620 on the substrate 100 is at least partially arranged around the orthographic projection of the second light-emitting unit 320 on the substrate 100; the thickness of the first light-shielding portion 610 and the thickness of the second light-shielding portion 620 are not equal.

[0075] It should be noted that, in this embodiment, the comparison of the thickness of the first light-shielding part 610 and the thickness of the second light-shielding part 620 can be made by referring to the direction Z perpendicular to the plane of the substrate, and the relationship between the distance D6 between the side surface of the first light-shielding part 610 away from the substrate 100 and the substrate 100 and the distance D7 between the side surface of the second light-shielding part 620 away from the substrate 100 and the substrate 100. When the distance D6 between the side surface of the first light-shielding part 610 away from the substrate 100 and the substrate 100 is greater than the distance D7 between the side surface of the second light-shielding part 620 away from the substrate 100 and the substrate 100, the corresponding thicknesses of the first light-shielding part 610 and the second light-shielding part 620 are as follows.

[0076] Optionally, the thickness of the first light-shielding part 610 may refer to the average thickness of the first light-shielding part 610 at various locations, and the thickness of the second light-shielding part 620 may refer to the average thickness of the second light-shielding part 620 at various locations.

[0077] The thickness of the first light-shielding part 610 and the thickness of the second light-shielding part 620 can be made unequal, so as to adjust the light-shielding effect of the first light-shielding part 610 and the second light-shielding part 620 on their respective light-emitting units 300, thereby achieving different requirements for wide or narrow viewing angles.

[0078] Please see Figure 2 In order not to affect the light emission effect of the light-emitting unit 300, the connection between the first light-shielding part 610 and the second light-shielding part 620 can be set to correspond to the gap H between adjacent first encapsulation parts 511. That is, along the direction Z perpendicular to the plane of the substrate, the connection between the first light-shielding part 610 and the second light-shielding part 620 overlaps with the gap H between adjacent first encapsulation parts 511. At the connection, there is a height difference between the first light-shielding part 610 and the second light-shielding part 620.

[0079] Optionally, the orthographic projection of the connection point between the first light-shielding part 610 and the second light-shielding part 620 onto the corresponding isolation structure 200 can be located at the center of the isolation structure 200.

[0080] Please see Figure 2 , Figure 4 as well as Figure 6 , Figure 6This is a schematic diagram showing the relative positions of a light-emitting unit and a first color resist portion, a second color resist portion, and a third color resist portion provided in one embodiment of the present invention. In some optional embodiments, the light-emitting unit 300 includes a first light-emitting unit 310 and a second light-emitting unit 320 with different light-emitting colors; the color resist structure 400 includes a first color resist portion 410 and a second color resist portion 420, the first color resist portion 410 including a first portion 411 and a second portion 412 spaced apart; wherein, along the direction Z perpendicular to the plane of the substrate, the first portion 411 and the first light-emitting unit 310 at least partially overlap, the gap between the second portion 412 and the adjacent light-emitting unit 300 at least partially overlap, the second color resist portion 420 and the second light-emitting unit 320 partially overlap, and the second color resist portion 420 is at least partially located on the side surface of the second portion 412 facing away from the substrate 100.

[0081] It should be noted that in this embodiment, the first portion 411 of the first color resist 410 is disposed corresponding to the first light-emitting unit 310, that is, the forward light emitted by the first light-emitting unit 310 is emitted through the first portion 411. In the direction Z perpendicular to the plane of the substrate, the gap between the second portion 412 and the adjacent light-emitting unit 300 overlaps at least partially, and a portion of the second color resist 420 is located on the side surface of the second portion 412 away from the substrate 100. That is, in the direction Z perpendicular to the plane of the substrate, the second portion 412 and the second color resist 420 are partially overlapped. The overlapping second color resist 420 and the second portion 412 can block light from the touch metal line 720 of the touch layer 700, play an anti-reflection role, and avoid the problem that the touch metal line 720 is visible due to light reflection in the touch layer 700. At the same time, it can also improve the visual effect of the display panel 10 being completely black when it is not lit.

[0082] Depending on the different colors of the first color resist 410 and the second color resist 420, the wavelength range of light that can be absorbed by the overlapping second color resist 420 and the second part 412 is also different. For example, when the first color resist 410 is a blue color resist and the second color resist 420 is a green color resist, the overlapping second color resist 420 and the second part 412 can absorb light of blue and green wavelengths, effectively reducing the reflectivity of external light. The overlapping of color resists of different colors can achieve the function of light blocking, which can replace BM and eliminate the need for an additional BM process.

[0083] In this embodiment, the orthographic projection of the second portion onto the substrate can at least partially surround the first light-emitting unit.

[0084] Please see Figure 6 or Figure 7 , Figure 7This is a schematic diagram showing the relative positions of the light-emitting unit and the first, second, and third color resist portions provided in another embodiment of the present invention. In some optional embodiments, the second color resist portion 420 includes a fifth portion 421 and a sixth portion 422 spaced apart. Along the direction Z perpendicular to the plane of the substrate, the fifth portion 421 partially overlaps with the second light-emitting unit 320, and the orthographic projection of the sixth portion 422 on the substrate 100 at least partially surrounds the orthographic projection of the first light-emitting unit 310 on the substrate 100.

[0085] It is understood that the forward light emission of the second light-emitting unit 320 is emitted through the fifth part 421 along the direction Z perpendicular to the plane of the substrate. The fifth part 421 and the second light-emitting unit 320 partially overlap. The orthogonal projection of the sixth part 422 on the substrate 100 is at least partially arranged around the orthogonal projection of the first light-emitting unit 310 on the substrate 100 to avoid affecting the forward light emission of the first light-emitting unit 310. The sixth part 422 can overlap with part of the first part 411 to achieve a light-shielding function, replacing BM.

[0086] Please see Figure 2 In some alternative embodiments, the touch layer 700 includes a touch metal line 720 along a direction Z perpendicular to the plane of the substrate, and the second portion 412 and the touch metal line 720 at least partially overlap.

[0087] It is understandable that since the touch metal line 720 is usually made of metal material, which has a certain degree of reflectivity, external light shining on the touch metal line 720 will be reflected, making the touch metal line 720 visible.

[0088] To avoid the above problems, the second part 412 is set with a gap between adjacent light-emitting units 300. By limiting the direction Z perpendicular to the plane of the substrate, the second part 412 and the touch metal line 720 overlap at least partially, which can avoid the touch metal line 720 from being visible and ensure the display effect of the display panel 10.

[0089] Optionally, the light-emitting unit 300 and the touch metal line 720 do not overlap along the direction Z perpendicular to the plane of the substrate, so as to ensure the light-emitting effect and avoid the touch metal line 720 blocking the light emitted by the light-emitting unit 300.

[0090] Please see Figure 2 In some alternative embodiments, the light-shielding layer 600 and the second portion 412 at least partially overlap in the direction Z perpendicular to the plane of the substrate.

[0091] It is understood that in this embodiment, the light-shielding layer 600 and the second part 412 are both disposed on the side of the isolation structure 200 away from the substrate 100, so that the light-shielding layer 600 and the second part 412 can work together to provide an overall light-shielding and anti-reflection effect on the isolation structure 200. At the same time, the light-shielding layer 600 can also encapsulate and protect the residual light-emitting materials between the isolation structures 200.

[0092] Optionally, the orthographic projection of the light-shielding layer 600 on the substrate 100 covers the orthographic projection of the second part 412 on the substrate 100, that is, the setting area or coverage area of ​​the light-shielding layer 600 is larger than the setting area or coverage area of ​​the second part 412, so as to ensure the light-shielding and encapsulation protection effect of the isolation structure 200.

[0093] Please see Figure 2 , Figure 7 In some optional embodiments, the light-emitting unit 300 includes a third light-emitting unit 330, the light-emitting color of the third light-emitting unit 330 being different from the light-emitting colors of the first light-emitting unit 310 and the second light-emitting unit 320; the color resist structure 400 also includes a third color resist portion 430, the third color resist portion 430 being at least partially located on the side of the light-emitting unit 300 away from the substrate 100 and the side of the second color resist portion 420 away from the substrate 100, the third color resist portion 430 including a third portion 431 and a fourth portion 432 spaced apart; Along the direction Z perpendicular to the plane of the substrate, the third part 431 and the third light-emitting unit 330 overlap at least partially, the third part 431 and the second color resist part 420 and the second part 412 both overlap partially, and the fourth part 432 and the second color resist part 420 and the first part 411 both overlap partially.

[0094] In this embodiment, on the side of the isolation structure 200 away from the substrate 100, the third part 431 and the second color resist part 420 and the second part 412 partially overlap. That is, the orthographic projection of the overlapping part of the third part 431 and the second color resist part 420 and the second part 412 falls on the isolation structure 200, and along the direction Z perpendicular to the plane of the substrate, the orthographic projection of the overlapping part of the third part 431 and the second color resist part 420 and the second part 412 on the substrate 100 covers the orthographic projection of the touch metal line 720 on the substrate 100, so as to avoid the problem of the display being visible due to reflected light at the touch metal line 720.

[0095] The overlapping of the third part 431 and the second color resist part 420 and the second part 412 can achieve the light-blocking function, which can replace the BM and eliminate the need for an additional BM process.

[0096] Similarly, the orthographic projection of the overlapping portion of the fourth part 432, the second color resist part 420, and the first part 411 on the substrate 100 can also cover the orthographic projection of the corresponding touch metal line 720 on the substrate 100.

[0097] Optionally, the orthographic projection of a portion of the second portion 412 on the substrate 100 surrounds the orthographic projection of the second light-emitting unit 320 on the substrate 100, and the orthographic projection of a portion of the second portion 412 on the substrate 100 surrounds the orthographic projection of the third light-emitting unit 330 on the substrate 100; the orthographic projection of a portion of the fourth portion 432 on the substrate 100 surrounds the orthographic projection of the first light-emitting unit 310 on the substrate 100, and the orthographic projection of a portion of the fourth portion 432 on the substrate 100 surrounds the orthographic projection of the second light-emitting unit 320 on the substrate 100; the orthographic projection of a portion of the sixth portion 422 on the substrate 100 surrounds the orthographic projection of the first light-emitting unit 310 on the substrate 100, and the orthographic projection of a portion of the sixth portion 422 on the substrate 100 surrounds the orthographic projection of the third light-emitting unit 330 on the substrate 100, to ensure a light-shielding effect.

[0098] Please see Figure 2 In some optional embodiments, the third color resist portion 430 covers the side of the second color resist portion 420. This means that the third color resist portion 430 can extend from the surface of the second color resist portion 420 away from the substrate 100 to the side of the second color resist portion 420, so as to cover the side of the second color resist portion 420. This allows external light or the light emitted by the light-emitting unit 300 to be blocked and absorbed by the second color resist portion 420 and the third color resist portion 430 at the side of the second color resist portion 420, thereby reducing reflection.

[0099] In some optional embodiments, the first color resist 410 is a blue color resist, the second color resist 420 is a green color resist, and the third color resist 430 is a red color resist. When the first color resist 410, the second color resist 420, and the third color resist 430 overlap along the direction Z perpendicular to the plane of the substrate, they can simultaneously filter the emitted light in the blue, green, and red light bands, blocking light emission and achieving anti-reflection. Of course, the colors corresponding to the first color resist 410, the second color resist 420, and the third color resist 430 are not limited to the above examples; other color combinations can also be used.

[0100] Please see Figure 8 The present invention also provides a method for manufacturing a display panel, for manufacturing the display panel 10 in any of the above embodiments, the method for manufacturing a display panel includes the following steps; S110: Provides substrate 100, such as Figure 9 As shown; S120: An isolation structure 200 and a plurality of light-emitting units 300 are formed on one side of the substrate 100. The isolation structure 200 includes a plurality of spaced-apart first openings K1 and a first conductive layer 210. Along a direction Z perpendicular to the plane of the substrate, the light-emitting units 300 and the first openings K1 at least partially overlap. Along a direction away from the substrate 100, the light-emitting unit 300 includes a first electrode block 301, a light-emitting layer 302, and a second electrode block 303 stacked together. The second electrode block 303 is electrically connected to the first conductive layer 210. Figure 10 As shown; S130: A color resist structure 400 is formed on the side of the light-emitting unit 300 facing away from the substrate 100. The color resist structure 400 includes multiple color resists. Along the direction Z perpendicular to the plane of the substrate, at least a portion of the color resist structure 400 and the light-emitting unit 300 are overlapped, such as... Figure 3 As shown.

[0101] In the method for manufacturing the display panel 10 provided in this embodiment of the invention, the formed isolation structure 200 includes a plurality of first openings K1 spaced apart. The light-emitting unit 300 can be located at least partially within the first opening K1. The isolation structure 200 limits the light emission range of the light-emitting unit 300. At the same time, during manufacturing, the isolation structure 200 can be used as a shield to form patterned light-emitting units 300 correspondingly within the first opening K1, eliminating the need for a fine mask and reducing costs. Furthermore, along the direction Z perpendicular to the plane of the substrate, at least a portion of the color resist structure 400 and the light-emitting unit 300 are overlapped, meaning that at least a portion of the light emitted by the light-emitting unit 300 needs to pass through the color resist structure 400 to achieve light filtering, improve color purity and contrast, replace the polarizer to achieve low reflection, and reduce the thickness of the display panel 10.

[0102] In step S110, the substrate 100 may include a substrate and an array layer, and the array layer may include a driving circuit. For example, the driving circuit disposed on the array layer may include a transistor and a storage capacitor. The transistor includes an active layer, a gate, a source, and a drain. The driving circuit may be electrically connected to the light-emitting unit 300 to drive the light-emitting unit 300 to emit light for display.

[0103] In step S120, a patterned first electrode block 301 can be formed on one side of the substrate 100 by magnetron sputtering or vapor deposition and then by photolithography patterning and oxygen plasma post-treatment. Then, the various film layers in the isolation structure 200 are formed through processes such as vapor deposition and coating, and the required first opening K1 is formed using patterning processes such as photolithography and dry etching. The light-emitting layer 302 can be fabricated using a vapor deposition process, with the isolation structure 200 acting as a shield, allowing the light-emitting material to fall into the first opening K1. The isolation structure 200 separates the light-emitting material within the first opening K1 from the light-emitting material located on the side of the isolation structure 200 facing away from the substrate 100, thus achieving patterning. Then, using the isolation structure 200 as a shield, the required second electrode block 303 is formed within the first opening K1. The fabrication process does not require a fine mask, reducing costs.

[0104] In step S130, the color resist structure 400 can be formed by processes such as coating, and photosensitive color resist material can be used. The color resist structure 400 is used to filter light to emit light of different colors.

[0105] In some optional embodiments, the step of forming the isolation structure 200 and the plurality of light-emitting units 300 on one side of the substrate 100 includes: Multiple spaced first electrode blocks 301 are formed on one side of the substrate 100, such as Figure 11 As shown; A first insulating material layer 901 is formed on the side of the first electrode block 301 facing away from the substrate 100, such as Figure 12 As shown; An isolation structure 200 material layer is formed on the side of the first insulating material layer 901 facing away from the substrate 100. The isolation structure 200 material layer includes a first conductive material layer 211, such as... Figure 13 As shown; The material layer of the isolation structure 200 is patterned, and the first sub-opening K11 corresponding to the first light-emitting unit 310 in the first opening K1 is etched, as shown below. Figures 15 to 16 As shown; The first insulating material layer 901 is patterned to form a second opening K2, which is connected to the first sub-opening K11, and exposes a portion of the first electrode block 301, such as... Figure 17 As shown; A first light-emitting material layer 32 and a second electrode material layer 33 are sequentially formed on the side of the first electrode block 301 facing away from the substrate 100 and the side of the material layer of the isolation structure 200 facing away from the substrate 100 within the first sub-opening K11 and the second opening K2. The first light-emitting material layer 32 and the second electrode material layer 33 formed on the side of the first electrode block 301 facing away from the substrate 100 are separated from the first light-emitting material layer 32 and the second electrode material layer 33 formed on the side of the material layer of the isolation structure 200 facing away from the substrate 100 by the isolation structure 200 material layer. The second electrode material layer 33 located in the second opening K2 is in contact with the adjacent first conductive material layer 211. At least a portion of the material layer of the isolation structure 200 is removed from the side of the substrate 100 where the first light-emitting material layer 32 and the second electrode material layer 33 are located, so that the first electrode block 301, the first light-emitting material layer 32 and the second electrode material layer 33 located in the first sub-opening K11 and the second opening K2 form the first light-emitting unit 310 in the light-emitting unit 300.

[0106] In this embodiment, after the first electrode block 301 is formed, a first insulating material layer 901 needs to be formed to insulate the first electrode block 301 and prevent short circuits between the first conductive layer 210 or the second electrode block 303 and the first electrode block 301. The second opening K2 and the first sub-opening K11 are connected and expose part of the first electrode block 301 so that the first light-emitting material layer 32 formed can contact and connect with the first electrode block 301.

[0107] It should be noted that the first light-emitting material layer 32 and the second electrode material layer 33 formed on the side of the first electrode block 301 facing away from the substrate 100 are separated from the first light-emitting material layer 32 and the second electrode material layer 33 formed on the side of the isolation structure 200 material layer facing away from the substrate 100 by the isolation structure 200 material layer. That is, there is a step difference between the first light-emitting material layer 32 and the second electrode material layer 33 formed on the side of the first electrode block 301 facing away from the substrate 100 and the first light-emitting material layer 32 and the second electrode material layer 33 formed on the side of the isolation structure 200 material layer facing away from the substrate 100, and they are mutually insulated and have no electrical connection. The first light-emitting material layer 32 and the second electrode material layer 33 formed on the side of the isolation structure 200 material layer facing away from the substrate 100 can be retained or removed by etching or other processes.

[0108] Please see Figure 21 In some optional embodiments, after the first light-emitting unit 310 is fabricated, the second light-emitting unit 320 can be fabricated. After removing at least a portion of the material layer of the isolation structure 200 on the side facing away from the substrate 100, and the first light-emitting material layer 32 and the second electrode material layer 33, so that the first electrode block 301, the first light-emitting material layer 32, and the second electrode material layer 33 located within the first sub-opening K11 and the second opening K2 form the first light-emitting unit 310 in the light-emitting unit 300, the process further includes: The material layer of the isolation structure 200 is patterned to form a second sub-opening in the first opening K1 corresponding to the second light-emitting unit 320; The first insulating material layer 901 is patterned to form a second opening K2. The second opening K2 is connected to the second sub-opening and exposes part of the first electrode block 301. A second light-emitting material layer and a second electrode material layer 33 are sequentially formed on the side of the first electrode block 301 facing away from the substrate 100 and the side of the material layer of the isolation structure 200 facing away from the substrate 100 in the second sub-opening and the second opening K2. The second light-emitting material layer and the second electrode material layer 33 formed on the side of the first electrode block 301 facing away from the substrate 100 are separated from the second light-emitting material layer and the second electrode material layer 33 formed on the side of the material layer of the isolation structure 200 facing away from the substrate 100 by the isolation structure 200 material layer. The second electrode material layer 33 located in the second opening K2 is electrically connected to the adjacent first conductive material layer 211. At least a portion of the material layer of the isolation structure 200 is removed from the side of the substrate 100 where the second light-emitting material layer and the second electrode material layer 33 are located, so that the first electrode block 301, the second light-emitting material layer and the second electrode material layer 33 located in the second sub-opening and the second opening K2 form the second light-emitting unit 320 in the light-emitting unit 300.

[0109] In this embodiment, a second sub-opening can be formed by an etching process. The second sub-opening is used to accommodate the second light-emitting unit 320 and also to limit the pattern size of the second light-emitting unit 320. When removing at least part of the material layer of the isolation structure 200 on the side away from the substrate 100, the second light-emitting material layer and the second electrode material layer 33 located in the first sub-opening K11 also need to be removed together to avoid affecting the light emission of the first light-emitting unit 310.

[0110] Please see Figures 13 to 14 In some optional embodiments, the step of forming the isolation structure 200 material layer on the side of the first insulating material layer 901 facing away from the substrate 100 includes: On the side of the first insulating material layer 901 facing away from the substrate 100, a first conductive material layer 211, a first inorganic material layer 221, and a second inorganic material layer 231 of the isolation structure 200 material layer are formed in sequence. The etching rate of the first inorganic material layer 221 is greater than the etching rate of the second inorganic material layer 231.

[0111] It should be noted that, since it is necessary to achieve the following configuration: the second inorganic layer 230 protrudes relative to the first inorganic layer 220 towards the first opening K1 along a direction parallel to the plane of the substrate 100, the minimum distance between the first side surface C1 and the third side surface C3 along the aforementioned direction parallel to the plane of the substrate 100 is D1, and the minimum distance between the second side surface C2 and the third side surface C3 is D2, where D2 ≥ D1. Therefore, in this embodiment, the etching rate of the first inorganic material layer 221 can be made greater than that of the second inorganic material layer 231 by adjusting the material composition and preparation process of the first inorganic material layer 221 and the second inorganic material layer 231, thereby increasing the etching amount of the first inorganic material layer 221 and causing the first inorganic material layer 221 to be recessed relative to the second inorganic material layer 231.

[0112] Please see Figures 15 to 17 Optionally, after forming the first conductive material layer 211, the first inorganic material layer 221, and the second inorganic material layer 231, a photoresist layer P can be formed on the second inorganic material layer 231, and the photoresist layer P can be patterned so that the photoresist layer P forms an opening pattern corresponding to the first sub-opening K11. Then, the first conductive material layer 211, the first inorganic material layer 221, and the second inorganic material layer 231 can be etched using the photoresist layer P as a mask. For example, the first inorganic material layer 221 and the second inorganic material layer 231 can be etched using a dry etching process, and then the first conductive material layer 211 can be etched using a wet etching process.

[0113] In some alternative embodiments, the film-forming rate of the first inorganic material layer 221 is greater than the film-forming rate of the second inorganic material layer 231.

[0114] It should be noted that the increase in film formation rate or deposition rate is usually accompanied by a synchronous increase in etching rate. Films prepared under low film formation rate conditions have high density and few defects, and their etching rate is significantly reduced. Films prepared under high film formation rate conditions are relatively loose and have high porosity, and their etching rate is correspondingly increased. Therefore, the etching rate of the first inorganic material layer 221 can be made greater than that of the second inorganic material layer 231 by adjusting the film formation rate of the first inorganic material layer 221.

[0115] Please see Figure 18 Optionally, between the steps of sequentially forming a first light-emitting material layer 32 and a second electrode material layer 33 on the side of the first electrode block 301 facing away from the substrate 100 and the side of the isolation structure 200 material layer facing away from the substrate 100 within the first sub-opening K11 and the second opening K2, and the step of removing at least a portion of the first light-emitting material layer 32 and the second electrode material layer 33 on the side of the isolation structure 200 material layer facing away from the substrate 100, the method further includes: A cover layer 800 is formed on the side of the second electrode material layer 33 away from the substrate 100.

[0116] Please see Figures 19 to 20 In some optional embodiments, between the steps of sequentially forming a first light-emitting material layer 32 and a second electrode material layer 33 on the side of the first electrode block 301 facing away from the substrate 100 and the side of the material layer of the isolation structure 200 facing away from the substrate 100 within the first sub-opening K11 and the second opening K2, and the step of removing at least a portion of the first light-emitting material layer 32 and the second electrode material layer 33 on the side of the material layer of the isolation structure 200 facing away from the substrate 100, the method further includes: A first encapsulation layer 510 is formed on the side of the second electrode material layer 33 facing away from the substrate 100.

[0117] It should be noted that in this embodiment, a complete first encapsulation material layer can be formed first, and then the first encapsulation material layer other than the first sub-opening K11 can be removed by etching or other processes. Considering the issue of manufacturing precision, a portion of the first encapsulation material layer located on the side of the isolation structure 200 near the first sub-opening K11 away from the substrate 100 can also be included to avoid affecting the film layer inside the first sub-opening K11 when etching the first encapsulation material layer.

[0118] Optionally, the first encapsulation portion 511 includes a first sub-portion 501 and a second sub-portion 502, with a gap between the second sub-portions 502 of adjacent first encapsulation portions 511; along the direction Z perpendicular to the plane of the substrate, the first sub-portion 501 on the side of the light-emitting unit 300 away from the substrate 100 at least partially overlaps with the light-emitting unit 300, and the second sub-portion 502 partially overlaps with the isolation structure 200. The first sub-portion 501 is formed by a first encapsulation material layer located within the first sub-opening K11, and the second sub-portion 502 is formed by a first encapsulation material layer partially located on the side of the isolation structure 200 away from the substrate 100 near the first sub-opening K11.

[0119] Please see Figure 22 Optionally, after the first encapsulation layer 510 is formed, a light-shielding layer 600 may be formed on the side of the second sub-part 502 away from the substrate 100.

[0120] Please see Figure 23 In some optional embodiments, the step of forming the color resist structure 400 includes: A color resist structure 400 is formed, which is at least partially formed on the side of the light-emitting unit 300 away from the substrate 100. The color resist structure 400 includes a first color resist portion 410 and a second color resist portion 420. The first color resist portion 410 includes a first portion 411 and a second portion 412 that are spaced apart. Along the direction Z perpendicular to the plane of the substrate, the first portion 411 and the first light-emitting unit 310 partially overlap, and the second portion 412 and the spaced portion between adjacent light-emitting units 300 overlap. The second color resist portion 420 and the second light-emitting unit 320 partially overlap, and the second color resist portion 420 is at least partially located on the surface of the second portion 412 away from the substrate 100.

[0121] In this embodiment, the first color resist portion 410 can be prepared first, and then the second color resist portion 420 can be prepared, so that the second color resist portion 420 can be formed on the side surface of the second portion 412 facing away from the substrate 100.

[0122] Please see Figure 24 After the second color resist portion 420 is fabricated, the third color resist portion 430 can be fabricated, and then an optical adhesive layer J is formed on the side of the third color resist portion 430 facing away from the substrate 100, as shown below. Figure 2 As shown.

[0123] Please see Figure 25 The present invention also provides a display device, including the display panel 10 in any of the above embodiments.

[0124] The display panel 10 provided in this embodiment of the invention has the technical effects of the touch panel in any of the above embodiments. The explanations of the same or corresponding structures and terms in the above embodiments will not be repeated here.

[0125] The display panel 10 provided in the embodiments of the present invention can be an organic light-emitting diode (OLED) display panel 10, a quantum dot light-emitting diode (QLED) display panel 10, or a micro flat panel display panel 10 (Micro-OLED or Micro-LED), etc.

[0126] The display device provided in this embodiment of the invention can be applied to mobile phones or any electronic product with display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablets, digital cameras, smart bracelets, smart glasses, in-vehicle displays, medical devices, industrial control equipment, touch interactive terminals, etc. This embodiment of the invention does not impose any special limitations on these.

[0127] The above are merely specific embodiments of the present invention. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the protection scope of the present invention.

[0128] It should also be noted that the exemplary embodiments mentioned in this invention describe methods or systems based on a series of steps or apparatus. However, this invention is not limited to the order of the steps described above; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

Claims

1. A display panel, characterized by, include; substrate; An isolation structure is disposed on one side of the substrate, the isolation structure includes a plurality of first openings spaced apart, and the isolation structure includes a first conductive layer; Multiple light-emitting units are provided on one side of the substrate, in a direction perpendicular to the plane of the substrate, the light-emitting units and the first opening at least partially overlap, in a direction away from the substrate, the light-emitting units include a first electrode block, a light-emitting layer and a second electrode block stacked together, the second electrode block and the first conductive layer are electrically connected; A color resist structure is disposed on the side of the light-emitting unit away from the substrate. The color resist structure includes multiple color resists, and at least part of the color resist structure and the light-emitting unit are overlapped along a direction perpendicular to the plane of the substrate.

2. The display panel according to claim 1, characterized in that, The display panel further includes a first insulating layer, which is disposed between the isolation structure and the substrate, and the first insulating layer includes a plurality of second openings; Along a direction perpendicular to the plane of the substrate, the first insulating layer partially covers the first electrode block, and the second opening and the first opening at least partially overlap.

3. The display panel of claim 2, wherein, The isolation structure further includes a first inorganic layer and a second inorganic layer, wherein the first inorganic layer is located on the side of the first conductive layer away from the substrate, and the second inorganic layer is located on the side of the first inorganic layer away from the substrate. The first inorganic layer includes a first side surface near the first opening, the second inorganic layer includes a second side surface near the first opening, and the first conductive layer includes a third side surface near the first opening. Along a direction parallel to the plane of the substrate, the minimum distance between the first side and the third side is D1, and the minimum distance between the second side and the third side is D2, where D2≥D1.

4. The display panel of claim 3, wherein, The first insulating layer includes a fourth side surface near the first opening, and the minimum distance between the fourth side surface and the third side surface along a direction parallel to the plane of the substrate is D3, wherein D3≥D1.

5. The display panel of claim 1, wherein, The display panel further includes a first encapsulation layer, which includes a plurality of spaced-apart first encapsulation portions, with gaps between adjacent first encapsulation portions, and the first encapsulation portions are at least partially disposed on the side of the light-emitting unit away from the substrate. Along a direction perpendicular to the plane of the substrate, the gap and the isolation structure at least partially overlap.

6. The display panel according to claim 5, characterized in that, The first encapsulation portion includes a first sub-portion and a second sub-portion, and the gap is provided between the second sub-portions adjacent to the first encapsulation portion; Along a direction perpendicular to the plane of the substrate, the first sub-part of the light-emitting unit on the side away from the substrate at least partially overlaps with the light-emitting unit, and the second sub-part partially overlaps with the isolation structure; the display panel further includes a light-shielding layer, which is located on the surface of the second sub-part on the side away from the substrate and partially covers the gap.

7. The display panel of claim 5, wherein, The display panel also includes a cover layer disposed between the first encapsulation layer and the second electrode block.

8. The display panel of claim 6, wherein, The display panel also includes a second encapsulation layer, a third encapsulation layer, and a touch layer; The second encapsulation layer is disposed on the side of the first sub-part facing away from the substrate and the light-shielding layer facing away from the substrate. The third encapsulation layer is disposed on the side of the second encapsulation layer facing away from the substrate. The touch layer is disposed on the side of the third encapsulation layer facing away from the substrate. The color resist structure is disposed on the side of the touch layer facing away from the substrate.

9. The display panel of claim 8, wherein, Along a direction perpendicular to the plane of the substrate, the distance between the side surface of the light-shielding layer facing away from the substrate and the side surface of the second encapsulation layer facing away from the substrate is D4, and the distance between the side surface of the second encapsulation layer facing away from the substrate and the side surface of the second encapsulation layer closer to the light-emitting unit is D5. Where, D4≤ D5, or, D5 > D4 ≥ D5.

10. The display panel of claim 9, wherein, The light-emitting unit includes a first light-emitting unit and a second light-emitting unit with different light-emitting colors; The light-shielding layer includes a first light-shielding part and a second light-shielding part; The first light-shielding portion is disposed with its orthogonal projection on the substrate at least partially surrounding the orthogonal projection of the first light-emitting unit on the substrate, and the second light-shielding portion is disposed with its orthogonal projection on the substrate at least partially surrounding the orthogonal projection of the second light-emitting unit on the substrate; The thickness of the first light-shielding part and the thickness of the second light-shielding part are not equal.

11. The display panel of claim 8, wherein, The light-emitting unit includes a first light-emitting unit and a second light-emitting unit with different light-emitting colors; The color resist structure includes a first color resist part and a second color resist part, wherein the first color resist part includes a first part and a second part that are spaced apart. Wherein, along a direction perpendicular to the plane of the substrate, the first portion and the first light-emitting unit at least partially overlap, the second portion and the gap between adjacent light-emitting units at least partially overlap, the second color resist portion and the second light-emitting unit partially overlap, and the second color resist portion is at least partially located on the side surface of the second portion away from the substrate.

12. The display panel of claim 11, wherein, The second color resist portion includes a fifth portion and a sixth portion spaced apart. Along a direction perpendicular to the plane of the substrate, the fifth portion and the second light-emitting unit portion overlap. The orthographic projection of the sixth portion on the substrate is at least partially arranged around the orthographic projection of the first light-emitting unit on the substrate.

13. The display panel of claim 11, wherein, Along a direction perpendicular to the plane of the substrate, the light-shielding layer and the second portion at least partially overlap.

14. The display panel of claim 11, wherein, The touch layer includes touch metal lines along a direction perpendicular to the plane of the substrate, and the second portion and the touch metal lines at least partially overlap.

15. The display panel of claim 14, wherein, The light-emitting unit includes a third light-emitting unit, and the light-emitting color of the third light-emitting unit is different from the light-emitting colors of the first light-emitting unit and the second light-emitting unit. The color resist structure further includes a third color resist portion, which is at least partially located on the side of the light-emitting unit away from the substrate and on the side of the second color resist portion away from the substrate. The third color resist portion includes a third portion and a fourth portion that are spaced apart. Along a direction perpendicular to the plane of the substrate, the third part and the third light-emitting unit at least partially overlap, the third part partially overlaps with the second color resist part and the second part, and the fourth part partially overlaps with the second color resist part and the first part.

16. The display panel of claim 15, wherein, The third color resist portion covers the side of the second color resist portion.

17. The display panel according to claim 15, characterized in that, The orthographic projection of the third part and the second color resist part, and the overlapping part of the second part on the substrate covers the orthographic projection of the touch metal line on the substrate; And / or, the orthographic projection of the overlapping portion of the fourth portion, the second color resist portion, and the first portion on the substrate covers the orthographic projection of the touch metal line on the substrate.

18. The display panel of claim 15, wherein, The first color resist part is a blue color resist, the second color resist part is a green color resist, and the third color resist part is a red color resist.

19. A method for manufacturing a display panel, characterized in that, The method for preparing the display panel according to any one of claims 1 to 17 includes the following steps; Provide substrate; An isolation structure and a plurality of light-emitting units are formed on one side of the substrate. The isolation structure includes a plurality of first openings spaced apart. The isolation structure includes a first conductive layer in a direction perpendicular to the plane of the substrate. The light-emitting units and the first openings overlap at least partially in a direction away from the substrate. The light-emitting units include a first electrode block, a light-emitting layer and a second electrode block stacked together. The second electrode block and the first conductive layer are electrically connected. A color resist structure is formed on the side of the light-emitting unit away from the substrate. The color resist structure includes multiple color resists, and at least part of the color resist structure and the light-emitting unit are overlapped along a direction perpendicular to the plane of the substrate.

20. The display panel manufacturing method of claim 19, wherein, The step of forming an isolation structure and multiple light-emitting units on one side of the substrate includes: A plurality of spaced-apart first electrode blocks are formed on one side of the substrate; A first insulating material layer is formed on the side of the first electrode block opposite to the substrate; An isolation structure material layer is formed on the side of the first insulating material layer away from the substrate, and the isolation structure material layer includes a first conductive material layer; The isolation structure material layer is patterned and etched to form a first sub-opening in the first opening corresponding to the first light-emitting unit; The first insulating material layer is patterned to form a second opening, which is connected to the first sub-opening and exposes part of the first electrode block. A first light-emitting material layer and a second electrode material layer are sequentially formed on the side of the first electrode block away from the substrate and the side of the isolation structure material layer away from the substrate within the first sub-opening and the second opening. The first light-emitting material layer and the second electrode material layer formed on the side of the first electrode block away from the substrate are separated from the first light-emitting material layer and the second electrode material layer formed on the side of the isolation structure material layer away from the substrate by the isolation structure material layer. The second electrode material layer located in the second opening is in contact with the adjacent first conductive material layer. At least a portion of the isolation structure material layer is removed from the side of the first light-emitting material layer and the second electrode material layer facing away from the substrate, so that the first electrode block, the first light-emitting material layer and the second electrode material layer located in the first sub-opening and the second opening form the first light-emitting unit in the light-emitting unit.

21. The display panel manufacturing method of claim 20, wherein, After removing at least a portion of the first light-emitting material layer and the second electrode material layer on the side of the isolation structure material layer facing away from the substrate, so that the first electrode block, the first light-emitting material layer, and the second electrode material layer located within the first sub-opening and the second opening form the first light-emitting unit in the light-emitting unit, the method further includes: The isolation structure material layer is patterned to form a second sub-opening in the first opening that corresponds to the second light-emitting unit; The first insulating material layer is patterned to form a second opening, the second opening and the second sub-opening are connected, and a portion of the first electrode block is exposed; A second light-emitting material layer and a second electrode material layer are sequentially formed on the side of the first electrode block away from the substrate and the side of the isolation structure material layer away from the substrate in the second sub-opening, the side of the first electrode block away from the substrate, and the side of the isolation structure material layer away from the substrate. The second light-emitting material layer and the second electrode material layer formed on the side of the first electrode block away from the substrate are separated by the isolation structure material layer. The second electrode material layer located in the second opening is electrically connected to the adjacent first conductive material layer. At least a portion of the isolation structure material layer is removed from the side of the substrate where the second light-emitting material layer and the second electrode material layer are facing away, so that the first electrode block, the second light-emitting material layer, and the second electrode material layer located in the second sub-opening and the second opening form the second light-emitting unit in the light-emitting unit.

22. The display panel manufacturing method of claim 20, wherein, The step of forming an isolation structure material layer on the side of the first insulating material layer away from the substrate includes: A first conductive material layer, a first inorganic material layer, and a second inorganic material layer are sequentially formed on the side of the first insulating material layer away from the substrate. The etching rate of the first inorganic material layer is greater than the etching rate of the second inorganic material layer.

23. The display panel manufacturing method of claim 22, wherein, The film-forming rate of the first inorganic material layer is greater than that of the second inorganic material layer.

24. The display panel manufacturing method of claim 20, wherein, Between the steps of sequentially forming a first light-emitting material layer and a second electrode material layer on the side of the first electrode block facing away from the substrate within the first sub-opening and the second opening, and on the side of the isolation structure material layer facing away from the substrate, and the step of removing at least a portion of the first light-emitting material layer and the second electrode layer on the side of the isolation structure material layer facing away from the substrate, the method further includes: A first encapsulation layer is formed on the side of the second electrode material layer away from the substrate.

25. The display panel manufacturing method of claim 21, wherein, The step of forming the color resist structure includes: A color resist structure is formed, wherein the color resist structure is at least partially formed on the side of the light-emitting unit away from the substrate. The color resist structure includes a first color resist portion and a second color resist portion. The first color resist portion includes a first portion and a second portion that are spaced apart. Along a direction perpendicular to the plane of the substrate, the first portion overlaps with the first light-emitting unit portion, and the second portion overlaps with the spaced portion between adjacent light-emitting units. The second color resist portion overlaps with the second light-emitting unit portion, and the second color resist portion is at least partially located on the surface of the second portion away from the substrate.

26. A display device comprising: The display panel includes the display panel according to any one of claims 1 to 18 and the display panel prepared by the display panel preparation method according to any one of claims 19 to 25.

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