Display module, preparation method thereof and display device

Abstract

This invention provides a display module and its fabrication method, as well as a display device, including a display area, a display bending area surrounding the display area, and a bending and cutting area. The display bending area includes: a substrate; a composite encapsulation layer located on one side of the substrate, including a first organic encapsulation layer and a composite filler layer; the first organic encapsulation layer includes at least one hundred interconnected protrusion units; and a second organic encapsulation layer located on the side of the composite encapsulation layer opposite to the substrate. By dry etching a right-angled pyramid structure within the encapsulation layer at the bending location of the display area and fabricating a high-refractive-index composite material on the surface, the light extraction efficiency is improved, and the brightness attenuation problem caused by bending is also mitigated.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] Organic electroluminescent display (OLED) panels have gradually become the mainstream in the display field due to their excellent performance such as low power consumption, high color saturation, wide viewing angle, thinness, and flexibility. They can be widely used in terminal products such as smartphones, tablets, and televisions.

[0003] With technological advancements and rising consumer aesthetic standards, terminal displays require narrower bezels, making it crucial to further reduce these bezels. Achieving a near-zero bezel effect necessitates bends in the display area; however, brightness attenuation occurs at the bends in the display area, impacting the display quality. Summary of the Invention

[0004] In view of the above problems, the present invention provides a display module and its manufacturing method, and a display device, to solve the problem of brightness attenuation caused by bending of existing display modules.

[0005] To achieve the above objectives, the present invention provides a display module, the display module including a display area and a display bending area and a bending cut area surrounding the display area; the display bending area includes: a substrate; a composite encapsulation layer located on one side of the substrate, including a first organic encapsulation layer and a composite filler layer; the first organic encapsulation layer includes a plurality of protrusion units connected to each other; and a second organic encapsulation layer located on the side of the composite encapsulation layer opposite to the substrate.

[0006] Furthermore, each raised unit is a right-angled cone; a composite filling layer covers the surface of the raised unit.

[0007] Furthermore, the height of the protrusion unit perpendicular to the substrate ranges from 1µm to 20µm.

[0008] Furthermore, the display module also includes a first inorganic encapsulation layer, which is located on the side of the first organic encapsulation layer closer to the substrate; the distance from the protruding unit to the bottom first inorganic encapsulation layer is greater than or equal to 0.5 μm.

[0009] Furthermore, the materials of the composite filler layer include silica, polymethyl methacrylate, and butyrate.

[0010] Furthermore, the refractive index of the composite filler layer is greater than that of the first organic encapsulation layer;

[0011] The refractive index of the composite filler layer is greater than that of the second organic encapsulation layer.

[0012] Furthermore, the refractive index of the first organic encapsulation layer is between 1.0 and 1.5, and the thickness is between 1 and 20 μm; The refractive index of the second organic encapsulation layer is between 1.0 and 1.5, and the thickness is between 0.5 and 12 μm. The refractive index of the composite filler layer is between 1.5 and 2.0, and the thickness is between 50 nm and 10 μm.

[0013] The present invention also provides a method for manufacturing a display module, comprising the following steps: preparing a substrate; preparing a first organic encapsulation layer on one side of the substrate and performing dry etching on the first organic encapsulation layer in the display bending area to form a plurality of raised units; preparing a composite filler layer, the composite filler layer covering the surface of the raised units in the display bending area; and preparing a second organic encapsulation layer on the side of the first organic encapsulation layer away from the substrate.

[0014] Furthermore, the protruding unit is a right-angled cone; preferably, the right-angled cone satisfies:

[0015] Wherein, θ1 is the angle between the substrate and the horizontal baseline, and θ2 is the angle between the inclined surface of the protruding unit and the first inorganic encapsulation layer.

[0016] Further, the steps for preparing the composite filler layer include: mixing silica particles, polymethyl methacrylate, and butyrate in a first ratio to form a first solution, and subjecting it to high-speed stirring; mixing polymethyl methacrylate and butyrate in a second ratio to form a second solution; mixing the first solution and the second solution in a third ratio to form a third solution; preferably, the first ratio includes 1:2:3-5:16:30, the second ratio includes 1:2-3:20, and the third ratio includes 1:3-5:20; coating the third solution onto the surface of the raised unit and then drying it to form the composite filler layer; preferably, the coating method includes uniform spin coating.

[0017] The present invention also provides a display device, including the display module described above, or including a display module prepared by the above preparation method. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention; Figure 2 A top view of a protruding unit of a display module provided in an embodiment of the present invention; Figure 3 This is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention. Figures 4a-4f This is a schematic diagram of the structure in the display module manufacturing process provided in an embodiment of the present invention; Figure 5 This is a flowchart illustrating the preparation process of the composite filler layer in the display module provided in an embodiment of the present invention. Figure 6 This is a schematic diagram of the display module provided in an embodiment of the present invention when bent; Figure 7 This is a partial enlarged view of the protruding unit in the display module provided in an embodiment of the present invention; Figure 8 A perspective view of a protruding unit of a display module provided in an embodiment of the present invention; Marker explanation: 101-Substrate; 102-Array film layer; 103-Light-emitting structure layer; 104-First inorganic encapsulation layer; 105-Composite encapsulation layer; 1051-First organic encapsulation layer; 1052-Composite filler layer; 10511-Bump unit; 106-Second organic encapsulation layer; 107-Second inorganic encapsulation layer; 108-Polarizer; 109-Optical adhesive; 110-Cover plate Detailed Implementation The accompanying drawings illustrate preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and its scope of protection is not limited to the embodiments mentioned herein.

[0020] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0021] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0023] In related display technologies, achieving near-zero bezels in terminal display products requires display area bending, but this causes brightness attenuation at the bends, thus reducing the actual display effect of the product.

[0024] Based on the technical problems discovered in the aforementioned related display technologies, this embodiment of the invention provides a display module. The display module can be OLED (Organic Light-Emitting Diode), Micro LED (Micro Light-Emitting Diode), or Mini LED (Mini Light-Emitting Diode), and this embodiment of the invention does not specifically limit it. Figure 1The diagram shows a schematic representation of a display module according to an embodiment of the present invention. The display module includes a display area, a display bending area surrounding the display area, and a bending and cutting area. The display bending area includes: a substrate 101; a composite encapsulation layer 105 located on one side of the substrate 101, including a first organic encapsulation layer 1051 and a composite filler layer 1052; the first organic encapsulation layer 1051 includes at least one hundred interconnected protrusion units 10511; and a second organic encapsulation layer 106 located on the side of the composite encapsulation layer 105 facing away from the substrate 101. This embodiment of the present invention improves the light extraction rate and mitigates the brightness attenuation problem caused by bending by dry etching the organic encapsulation layer within the display bending area to form a right-angled pyramid structure and fabricating a high-refractive-index silicon dioxide composite material on the surface of the right-angled pyramid structure.

[0025] In this embodiment of the invention, the substrate 101 can be a rigid substrate or a flexible substrate. The rigid substrate may include alkali-free glass, soda-lime glass, quartz glass, sapphire glass, stainless steel, aluminum, nickel, etc. The flexible substrate can be a polymer material, including but not limited to one or more of polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinylphenol (PVP), polyether sulfone (PES), polyimide (PI), polyamide, polyacetal, polycarbonate (PC), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In some embodiments of the present invention, the substrate 101 is a flexible substrate, and its material may be, for example, polyimide. It is understood that the substrate 101 can also be configured as a multilayer composite structure. Exemplarily, the substrate 101 may include a base film layer, a pressure-sensitive adhesive layer, a first polyimide layer, and a second polyimide layer stacked sequentially.

[0026] refer to Figure 1 The composite encapsulation layer 105 is located on one side of the substrate 101. The composite encapsulation layer 105 includes a first organic encapsulation layer 1051 and a composite filler layer 1052. The first organic encapsulation layer 1051 includes at least one hundred protrusion units 10511 that are connected to each other.

[0027] The first organic encapsulation layer 1051 has a refractive index ranging from 1.0 to 1.5 and a thickness ranging from 1 to 20 μm, and is formed using inkjet printing. Its constituent materials may include organic polymers, inorganic / composite nanoparticles, and functional polymer materials. The organic polymers may include acrylates, epoxy resins, and high-transmittance polymethyl methacrylate, etc. The inorganic / composite nanoparticles may include low-refractive materials such as hollow silica (SiO2), alumina sol, silica, or magnesium fluoride (MgF2), etc. The functional polymer materials may include transparent conductive PEDOT:PSS (poly(3,4-ethylenedioxythiophene):polystyrene sulfonate), polyurethane acrylate (PUA) with both flexibility and low dielectric constant, and siloxane resins with excellent thermal stability. The first organic encapsulation layer 1051 mainly serves as a flexible buffer and optical matching medium. It can cover and wrap the tiny particle defects on the surface of the first inorganic encapsulation layer 104 below through the micron-thick organic layer, preventing the subsequent inorganic layer from cracking and blocking the water and oxygen channels. At the same time, it can level and fill the topographic undulations of the light-emitting structure layer 103, providing a flat substrate for the second inorganic encapsulation layer 107. It can also use its own low refractive index characteristics to block the total reflection waveguide effect between high refractive index inorganic films, thereby improving the light extraction efficiency of the device while ensuring the reliability of the encapsulation.

[0028] Continue to refer to Figure 1 The first organic encapsulation layer 1051 includes at least one hundred interconnected protrusion units 10511, each of which is a right-angled cone. It should be noted that the protrusion units 10511 are formed by dry etching of the first organic encapsulation layer 1051, and the specific number of protrusion units 10511 can be determined according to the bending radius of the display module. The protrusion unit is a right-angled cone, and its top view is shown below. Figure 2As shown, each right-angled cone is in contact with each other and is not spaced apart, which is a right-angled cone array. This design offers numerous advantages. First, the right-angled cone structure is a microscopic variant of a tensile structure. When the display screen bends, the connecting slopes between the cones undergo shear deformation and micro-rotation, dispersing the linear tensile or compressive stress concentrated in the bending area into multi-directional shear and torsional components. This prevents stress from acting directly perpendicularly on the brittle inorganic layer interface, reducing the risk of inorganic layer cracking. Second, since the bending area is extremely sensitive to thickness, etching the originally flat and continuous first organic encapsulation layer 1051 into a cone array increases the equivalent thickness modulus gradient of the region through topological structure without increasing the total material volume. The apex of the cone and the connecting base work together to guide the neutral surface to move away from the inorganic layer, ensuring that the underlying first inorganic encapsulation layer 104 is under compressive stress rather than tension during bending. Inorganic materials have higher compressive strength than tensile strength, thus improving bending life. Furthermore, the interconnected cone bottoms can form a continuous three-dimensional interlocking network. During repeated dynamic bending of the display screen, even if the shear stress at local interfaces is high, the mechanical interlocking effect between the cones can prevent cracks from propagating along the planar direction. It should be noted that the core function of the protruding unit 10511 is optical compensation. Since the curved area of ​​the display often has uneven brightness or color deviation due to the curvature change, the inclined side of the right-angled cone structure forms a micro prism array. When light passes through this structure, the inclined surface can redirect some of the large-angle light to the normal direction, compensating for the brightness attenuation caused by the change of viewing angle in the curved area.

[0029] Furthermore, the perspective view of the protrusion unit 10511 is as follows: Figure 8 As shown, the vertices of the right pyramid are named A, B, C, and D. ∠DAC equals 90 degrees, and the length of side DA equals the length of side AC, meaning triangle DAC is an isosceles right triangle; ∠BAC equals 90 degrees, and the length of side BA equals the length of side AC, meaning triangle BAC is an isosceles right triangle; ∠BAD equals 90 degrees, and the length of side BA equals the length of side AD, meaning triangle BAD is an isosceles right triangle; furthermore, triangle BDC is an equilateral triangle.

[0030] Continue to refer to Figure 1The height of the raised unit 10511 perpendicular to the substrate 101 ranges from 1µm to 20µm, and the distance from the raised unit 10511 to the first inorganic encapsulation layer 104 is greater than or equal to 0.5µm. That is, during dry etching of the first organic encapsulation layer 1051, to avoid directly etching through it, a bottom thickness of at least 0.5µm needs to be retained, and the height of the triangular pyramid formed by dry etching is between 1µm and 20µm. By limiting the height range and retaining the minimum residual thickness from the bottom to the lower first inorganic encapsulation layer 104 during dry etching of the triangular pyramid, brittle inorganic layer interface defects and microcracks can be avoided. Simultaneously, retaining the continuous organic base film maintains uniform interface adhesion and ensures that the microstructure operates in the elastic shear energy dissipation region by controlling the aspect ratio of the pyramid, allowing it to recover after repeated bending without breaking. Furthermore, retaining the endpoint tolerance of the etching process provides a wider yield window for mass production uniformity.

[0031] A composite filler layer 1052 covers the surface of the raised unit 10511. The refractive index of the composite filler layer 1052 is between 1.5 and 2.0, and its thickness is between 50 nm and 10 μm. The composite filler layer 1052 is composed of silica, polymethyl methacrylate, and butyrate. Experiments show that as the silica concentration increases, the structure of the composite material gradually changes from a single layer to a multilayer structure. At low concentrations, such as 7%-11%, silica particles are uniformly distributed to form a single-layer structure, while at higher concentrations, such as 15%-23%, silica particles gradually accumulate to form a multilayer structure. This structural change has a significant impact on the optical properties of the composite material. High-concentration silica composite materials have higher fill factors and stronger light scattering capabilities, which is beneficial for improving the light extraction efficiency of display devices. As the silica concentration increases, the surface roughness of the composite material also increases, which is also beneficial for enhancing the light scattering effect. In addition, the surface of pure polymethyl methacrylate is relatively smooth, while the addition of SiO2 particles makes the surface of the composite material rougher, and the average roughness also increases accordingly. This rough surface structure helps enhance light scattering, thereby improving the light extraction efficiency of the display device. Coating the surface of the raised unit 10511 with the composite filler layer 1052 can enhance the refraction and guidance of large-angle light in the bending area using a high-refractive-index layer to compensate for brightness attenuation; it also increases the surface hardness of the cone, which helps to suppress plastic collapse.

[0032] Continue to refer to Figure 1Because there is a significant difference in thickness between the composite filler layer 1052 and the first organic encapsulation layer, the composite filler layer 1052 cannot fill the grooves between the protruding units 10511. Therefore, it is necessary to use an organic encapsulation layer to compensate for the recessed areas. The second organic encapsulation layer 106 is located on the side of the composite encapsulation layer 105 away from the substrate 101, with a refractive index ranging from 1.0 to 1.5 and a thickness between 0.5 and 12 μm. The second organic encapsulation layer 106 fills the recessed grooves between the cones, restoring the undulating surface originally caused by the hard coating, providing an ideal high-quality film-forming substrate for the subsequent second inorganic encapsulation layer 107, and avoiding encapsulation cracks caused by poor step coverage. Secondly, the second organic encapsulation layer 106 completely encapsulates and embeds the lower protruding high-refractive-index cone, reconstructing the refractive index distribution of the encapsulation stack and forming a structure of low-refractive-index layer + high-refractive-index layer + low-refractive-index layer (the refractive index of the composite filler layer 1052 is greater than that of the first organic encapsulation layer 1051; the refractive index of the composite filler layer 1052 is greater than that of the second organic encapsulation layer 106). This can block the lateral waveguide effect caused by the high-refractive-index cone, forcing light to couple more effectively towards the display surface, while using its low-refractive-index characteristics to suppress total internal reflection of the top inorganic film. Mechanically, the second organic encapsulation layer 106 is homogeneous with the first organic encapsulation layer 1051, achieving vertical connectivity and encapsulation of the organic phase, that is, the high-modulus hard cone coating is locked inside a flexible and continuous organic matrix. This rigid-flexible interlocking structure can maintain buckling resistance using the embedded hard core, and can uniformly dissipate bending stress through the viscoelastic shear deformation of the outer organic layer, mitigating the risk of shear mismatch at the interface between the hard coating and the organic matrix.

[0033] Furthermore, in this embodiment of the invention, below the composite encapsulation layer 105, an array film layer 102, a light-emitting structure layer 103, and a first inorganic encapsulation layer 104 are sequentially stacked in a direction away from the substrate 101. The array film layer 102 is the bottommost electrical basic film layer, composed of multiple layers of finely patterned metal conductive traces, insulating dielectric layers, and multiple thin-film transistor switching units. The thin-film transistors are typically based on low-temperature polysilicon or metal-oxide-semiconductor technology. Under the timing control of the scanning driver chip, they can independently provide precisely controlled current or voltage bias signals to the corresponding pixels within the light-emitting structure layer 103, determining the lighting state and grayscale brightness of each light-emitting unit. The light-emitting structure layer 103 is a stacked functional region that realizes electro-optic conversion, including an anode array composed of highly reflective metal, a pixel definition layer for defining the pixel light-emitting area and preventing crosstalk, etc. The hole injection layer, hole transport layer, red, green and blue organic electroluminescent material layer, electron transport layer, electron injection layer, and semi-transparent or totally reflective metal cathode are prepared using vacuum thermal evaporation or fine metal mask processes. When the charge carriers injected into the array film layer recombine in the organic light-emitting layer under the action of an electric field to form excitons and undergo radiative transitions, this structure can directly convert electrical signals into visible light output, displaying color image information visible to the naked eye. The first inorganic encapsulation layer 104 covering the light-emitting structure layer 103 is the first inorganic sealing barrier in the thin film encapsulation system. It is usually grown using plasma-enhanced chemical vapor deposition (PECVD) at a relatively low temperature to form a dense silicon nitride, aluminum oxide, or silicon oxynitride nanolayer film with very low water vapor and oxygen permeability. This can block the erosion and diffusion path of trace moisture and active gases in the environment to the organic light-emitting material and the low work function metal cathode, thereby inhibiting degradation phenomena such as dark spot growth and edge shrinkage, and providing initial photoelectric performance and working life for the device.

[0034] In the display module provided in this embodiment of the invention, a second inorganic encapsulation layer 107, a polarizer 108, an optical adhesive 109, and a cover plate 110 are sequentially stacked on the second organic encapsulation layer 106 along the direction away from the substrate 101. The second inorganic encapsulation layer 107 is the second inorganic barrier of the thin-film encapsulation. It grows a dense silicon nitride or silicon oxynitride film on the flat surface provided by the second organic encapsulation layer 106 by chemical vapor deposition, blocking the penetration path of water vapor along the lateral interface. The polarizer 108 is attached to the light-emitting surface after encapsulation. Its core function is to use the circular polarizer structure to eliminate the interference of ambient light reflected by the metal cathode in the light-emitting structure layer 103 on the display contrast. The optical adhesive 109 layer can be made of a liquid optically transparent resin with high light transmittance and low haze. The fabric is cured and formed, which has excellent gap filling and stress buffering capabilities. It achieves a bubble-free and gap-free full bonding between the polarizer 108 and the outermost rigid cover plate 110, eliminating Fresnel reflection loss at the air interface to improve outdoor visibility. It can also buffer the concentrated stress transmitted to the precision film layer below when the cover plate is subjected to external impact through the flexible viscoelastic material. The cover plate 110 is usually made of chemically strengthened ultra-thin glass or high-hardness transparent polyimide, which directly withstands touch scratches, drop impacts and daily wear and tear. It has high light transmittance, which allows the light emitted below to pass through and be presented to the human eye.

[0035] This invention also provides a method for manufacturing a display module, such as... Figure 3 The flowchart shown is for this preparation method. Figures 4a-4f This is a schematic diagram of the structure in the preparation process. The preparation method includes the following steps: S1: Prepare substrate 101.

[0036] S2: A first organic encapsulation layer 1051 is prepared on one side of the substrate 101, and the first organic encapsulation layer 1051 in the display bending area is dry-etched to form a plurality of protrusion units 10511, wherein the protrusion unit 10511 is a right-angled cone, such as... Figure 4b As shown, the inclined sides of the right-angled cone form a microprism array. When light passes through this structure, the inclined surfaces can redirect some of the large-angle light back to the normal direction, compensating for the brightness attenuation in the bending area caused by changes in viewing angle. This also reduces the risk of inorganic layer cracking and improves the bending life of the device.

[0037] S3: Prepare a composite filler layer 1052, which covers the surface of the protruding unit 10511 within the display bending area, such as... Figure 4c As shown, this can improve the efficiency of light extraction, and combined with the characteristics of the cone, it can also improve the problem of brightness attenuation caused by bending.

[0038] Specifically, the steps for preparing the composite filler layer also include: S301: Mix silica particles, polymethyl methacrylate and butyrate in a first ratio to form a first solution, and then perform high-speed stirring.

[0039] S302: Mix polymethyl methacrylate and butyrate in a second ratio to form a second solution.

[0040] S303: Mix the first solution and the second solution in a third ratio to form a third solution.

[0041] Preferably, the first ratio includes 1:2:3-5:16:30, the second ratio includes 1:2-3:20, and the third ratio includes 1:3-5:20.

[0042] S304: The third solution is coated onto the surface of the raised unit and then dried to form the composite filler layer. Preferably, the coating method includes uniform spin coating. The composite material with added silica has a higher fill factor and stronger light scattering ability, which is beneficial to improving the light extraction efficiency of the display device. Furthermore, silica increases the surface roughness of the composite material, which is beneficial to enhancing the light scattering effect.

[0043] S4: A second organic encapsulation layer 106 is prepared on the side of the first organic encapsulation layer 1051 facing away from the substrate 101, such as... Figure 4d As shown. The second organic encapsulation layer 106 fills the recessed trenches between the cones, restoring the undulating surface originally caused by the hard coating, forming a structure of low refractive index layer + high refractive index layer + low refractive index layer. This blocks the lateral waveguide effect, promotes more effective forward coupling of light to the display surface, and suppresses total internal reflection of the top inorganic film. Simultaneously, the formed rigid-flexible interlocking structure has buckling resistance and can uniformly dissipate bending stress, mitigating the risk of shear mismatch at the interface between the hard coating and the organic substrate.

[0044] It is understood that before the first organic encapsulation layer 1051 is formed on one side of the substrate 101, the process further includes: sequentially forming an array film layer 102, a light-emitting structure layer 103, and a first inorganic encapsulation layer 104 along a direction away from the substrate 101, such as... Figure 4a As shown.

[0045] After fabricating the second organic encapsulation layer 106 on the side of the first organic encapsulation layer 1051 facing away from the substrate 101, the process further includes: sequentially fabricating a second inorganic encapsulation layer 107, a polarizer 108, an optical adhesive 109, and a cover plate 110 in the direction of the second organic encapsulation layer 106 facing away from the substrate 101, as follows. Figure 4e , 4f As shown.

[0046] When the display module bends the display area, the originally flat interface becomes a curved surface. For an observer (looking directly at the center of the screen), the pixel emission angle at the bend is tilted relative to the human eye. Without any treatment, the bend area will appear noticeably darker and have a color cast. However, this invention addresses this by dry etching the organic encapsulation layer within the bend area to form a right-angled pyramid structure. The dimensions of this pyramid structure are further limited, and a high-refractive-index silicon dioxide composite material is fabricated on the surface of the pyramid structure, creating a "low-high-low" refractive structure. This enhances light extraction efficiency and mitigates the brightness attenuation caused by bending. Specifically, as shown... Figure 6 As shown, when the display module bends, light emitted from the first inorganic encapsulation layer 104 and enters the bottom of the triangular pyramid of the raised unit 10511, the inclined side of the pyramid acts as a micro-refractive prism. The light is refracted as it passes through the inclined surface of the pyramid, and its propagation direction is twisted by an angle. Light that was originally directed to the side of the screen, i.e., in a direction invisible to the human eye, returns to the front of the screen. At this point, the brightness seen by the human eye is no longer determined by the peripheral light at the edge, but by the intensity of the redirected main light, thus the brightness is restored. Furthermore, the surface of the triangular pyramid is coated with the high-refractive-index SiO2 composite material layer, forming a microlens array effect with the pyramid. The pyramid not only changes the direction of light, but its inclined surface can also slightly scatter or homogenize the emitted beam, breaking the concentrated microcavity interference peaks. This not only improves brightness but also alleviates, to some extent, the local color shift caused by the change in the interference path at the bend, making the brightness recovery more natural. It is understandable that a large portion of the light emitted by organic light-emitting diodes (OLEDs) is large-angle light. In a flat encapsulation layer, this light is trapped within a high-refractive-index layer due to total internal reflection and propagates laterally, ultimately becoming heat dissipation at the screen edge and unable to participate in imaging in the bending area. However, this embodiment of the invention breaks the flatness of the interface by setting interconnected protruding units 10511 triangular pyramids. This causes the incident angle of the laterally propagated light to no longer satisfy the total internal reflection condition when it encounters the inclined surface of the pyramid. This portion of the light no longer undergoes waveguide effects and is coupled into the display direction by reflection or refraction on the back of the pyramid, converting the original waveguide light into effective display brightness in the bending area and filling the brightness gap caused by viewing angle deflection.

[0047] Further reference Figure 7 The enlarged view of the protruding unit shown indicates that θ1 is the angle between the substrate 101 and the horizontal baseline, and θ2 is the angle between the inclined surface of the right-angled cone of the protruding unit 10511 and the first inorganic encapsulation layer 104. Preferably, if θ2 satisfies the following conditions:

[0048] In this case, a better effect can be achieved in improving brightness attenuation.

[0049] This invention also provides a display device, which includes the display module described above, or a display module prepared by the method described above. It can be installed as a display device in any electronic terminal with display functionality, such as a mobile phone, laptop, tablet computer, or in-vehicle display. The display device can be used to display static images, such as pictures or photographs. It can also be used to display dynamic images, such as videos.

[0050] In addition, the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0051] The display device provided in the embodiments of this application and the display module provided in the embodiments of this application belong to the same inventive concept and have corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of the display device can be found in the embodiments of the display cover plate, and will not be repeated here.

[0052] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0053] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0054] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0055] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0056] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0057] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display module, characterized by This includes a display area, a display bending area surrounding the display area, and a bending and cutting area; the display bending area includes: Substrate; A composite encapsulation layer, located on one side of a substrate, includes a first organic encapsulation layer and a composite filler layer; The first organic encapsulation layer includes a plurality of protrusion units that are interconnected with each other; The second organic encapsulation layer is located on the side of the composite encapsulation layer that is away from the substrate.

2. The display module of claim 1, wherein, Each of the protruding units is a right-angled cone; The composite filler layer covers the surface of the protruding unit.

3. The display module of claim 2, wherein, The height of the protrusion unit perpendicular to the substrate ranges from 1µm to 20µm.

4. The display module according to claim 2, characterized in that, The display module further includes a first inorganic encapsulation layer, which is located on the side of the first organic encapsulation layer closer to the substrate. The distance from the bottom of the protruding unit to the first inorganic encapsulation layer is greater than or equal to 0.5 μm.

5. The display module according to claim 1, characterized in that, The composite filler layer is made of silica, polymethyl methacrylate, and butyrate.

6. The display module according to claim 1, characterized in that, The refractive index of the composite filler layer is greater than that of the first organic encapsulation layer; The refractive index of the composite filler layer is greater than that of the second organic encapsulation layer.

7. The display module according to claim 6, characterized in that, The refractive index of the first organic encapsulation layer is between 1.0 and 1.5, and the thickness is between 1 and 20 μm. The refractive index of the second organic encapsulation layer is between 1.0 and 1.5, and the thickness is between 0.5 and 12 μm. The refractive index of the composite filler layer is between 1.5 and 2.0, and the thickness is between 50 nm and 10 μm.

8. A method for manufacturing a display module, characterized in that, Includes the following steps: Prepare the substrate; A first organic encapsulation layer is prepared on one side of the substrate, and the first organic encapsulation layer in the display bending area is dry-etched to form multiple protrusion units. A composite filler layer is prepared, which covers the surface of the protruding unit within the display bending area; A second organic encapsulation layer is prepared on the side of the first organic encapsulation layer that is away from the substrate.

9. The display module according to claim 8, characterized in that, The protruding unit is a right-angled cone; Preferably, the right-angled pyramid satisfies: Wherein, θ1 is the angle between the substrate and the horizontal baseline, and θ2 is the angle between the inclined surface of the protruding unit and the first inorganic encapsulation layer.

10. The display module according to claim 8, characterized in that, The steps for preparing the composite filler layer include: Silica particles, polymethyl methacrylate and butyrate are mixed in a first ratio to form a first solution, and then subjected to high-speed stirring. Polymethyl methacrylate and butyrate are mixed in a second ratio to form a second solution; The first solution and the second solution are mixed in a third ratio to form a third solution; Preferably, the first ratio includes 1:2:3-5:16:30, the second ratio includes 1:2-3:20, and the third ratio includes 1:3-5:20; The third solution is coated onto the surface of the protruding unit and then dried to form the composite filler layer; Preferably, the coating method includes uniform spin coating.

11. A display device, characterized in that, It includes the display module as described in any one of claims 1-7, or the display module prepared by the preparation method as described in claims 8-10.

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