Wafer transport control method and related apparatus

Abstract

A wafer transfer control method and related device, the method comprises: when a signal of a wafer processing process of a first wafer being completed is acquired, simultaneously controlling a first robot and a second robot in a transfer chamber to move to a switching position and a falling position in a process chamber respectively, the falling position being spaced from the switching position; controlling the first robot to grab the first wafer on a wafer carrier disk of the process chamber and move to a preset first safety position with the first wafer; when a signal of the first robot reaching the first safety position is acquired, controlling the second robot to move to the switching position and place a carried second wafer on the wafer carrier disk. The technical scheme can improve the efficiency of wafer transfer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer transport control method and related equipment. Background Technology

[0002] In the semiconductor industry, various types of process equipment, such as ion implantation equipment, are used to perform corresponding processing operations on wafers. Typically, during the processing of wafers, semiconductor processing equipment transports wafers along predetermined routes to ensure that wafers to be processed and wafers that have completed processing can enter and exit in an orderly manner and complete the corresponding processing.

[0003] With the development and continuous expansion of the semiconductor industry, the demand for production capacity of process equipment is constantly increasing. Therefore, how to meet the demand for increased production capacity of semiconductor processing equipment and improve the transfer efficiency of wafers within the equipment has become an urgent problem to be solved.

[0004] However, current wafer transfer control methods for semiconductor processing equipment suffer from low transfer efficiency, which reduces the wafer processing efficiency of semiconductor processing equipment. Summary of the Invention

[0005] The problem solved by the embodiments of the present invention is to provide a wafer transport control method and related equipment, which can improve the efficiency of wafer transport, thereby improving the wafer processing efficiency of semiconductor processing equipment.

[0006] To address the above problems, embodiments of the present invention provide a wafer transport control method applied to semiconductor processing equipment, the semiconductor processing equipment including a transport chamber and a process chamber, the wafer transport control method comprising:

[0007] When a signal indicating that the wafer processing of the first wafer is complete is received, the first robot and the second robot in the transmission chamber are simultaneously controlled to move to the exchange position and the falling position located in the process chamber, respectively, with the falling position being spaced apart from the exchange position.

[0008] The first robot is controlled to grab the first wafer located on the wafer carrier tray in the process chamber and move the first wafer to a preset first safe position.

[0009] Upon receiving a signal that the first robot has reached the first safe position, the second robot is controlled to move to the exchange position and place the second wafer it is carrying onto the wafer carrier tray.

[0010] Optionally, the falling position is located above the exchange position along the Z-axis of the preset coordinate system.

[0011] After controlling the second robot to move to the exchange position and place the second wafer it carries onto the wafer carrier, the wafer transfer control method further includes:

[0012] Control the second robot to move to a preset second safe position;

[0013] Upon receiving a signal that the second robot has reached the second safe position, the process chamber is controlled to perform the corresponding wafer processing process on the second wafer.

[0014] Optionally, the semiconductor processing equipment further includes a loading chamber;

[0015] The method further includes: controlling the first robot to move to a first predetermined position in the loading chamber and placing the first wafer it is carrying at the first predetermined position; controlling the first robot to move to a second predetermined position in the loading chamber and picking up a third wafer; controlling the first robot to carry the third wafer to an alignment platform in the transfer chamber and placing the third wafer on the alignment platform; and controlling the first robot to move to a preset first origin position.

[0016] After receiving a signal that the second robot has reached the second safe position, the method further includes: controlling the second robot to move to the alignment platform and grab the third wafer; and controlling the second robot to carry the third wafer to a preset second origin position.

[0017] Optionally, controlling the first robot to move to a first predetermined position in the loading chamber includes:

[0018] Control the first robot to move from the first safe position to the first predetermined position; or...

[0019] Control the first robot to move from the first safe position to a preset first origin position, and control the first robot to move from the first origin position to the first predetermined position.

[0020] Optionally, controlling the second robot to move to the alignment platform includes:

[0021] Control the second robot to move from the second safe position to the alignment platform; or...

[0022] Control the second robot to move from the second safe position to the preset second origin position, and control the second robot to move from the second origin position to the alignment platform.

[0023] Optionally, the semiconductor processing equipment further includes a temperature processing chamber;

[0024] After controlling the second robot to pick up the third wafer located on the alignment platform, and before controlling the second robot to carry the third wafer back to the second origin position, the wafer transfer control method further includes: controlling the second robot to carry the third wafer to a cooling / heating platform in a temperature processing chamber, and placing the third wafer on the cooling / heating platform; controlling the cooling / heating platform to heat or cool the third wafer; controlling the second robot to pick up the third wafer and carry the third wafer back to the second origin position.

[0025] Optionally, the speed at which the first robot carries the wafer is less than or equal to the speed at which the first robot does not carry the wafer.

[0026] The speed at which the second robot carries the wafer is less than or equal to the speed at which the second robot does not carry the wafer.

[0027] Optionally, the first robot is in an extended state when it is at the first origin position, and the second robot is in an extended state when it is at the second origin position.

[0028] Optionally, the exchange position, the falling position, the first safe position, and the second safe position are respectively located within the process chamber, and the first origin position and the second origin position are respectively located within the transmission chamber.

[0029] Optionally, the signal indicating the completion of the wafer processing of the first wafer includes one or more of the following: a signal indicating the completion of the detection of the first wafer, a signal indicating that the wafer carrier has reached the exchange position, a signal indicating that the wafer carrier releases the first wafer, and a signal indicating that the number of scans of the first wafer has reached a preset threshold.

[0030] Optionally, the wafer processing technology includes an ion implantation process.

[0031] Accordingly, embodiments of the present invention also provide a wafer transfer control device, comprising:

[0032] The first control unit is adapted to control the first robot in the transmission chamber to move to a preset exchange position when it receives a signal that the wafer processing process of the first wafer has been completed; and to control the first robot to grab the first wafer located on the wafer carrier tray in the process chamber and carry the first wafer to a preset first safe position.

[0033] The second control unit is adapted to control the first robot in the transmission chamber to move to a preset exchange position while simultaneously controlling the second robot in the transmission chamber to move to a preset falling position, the falling position being spaced apart from the exchange position; it is also adapted to control the second robot to move to the exchange position and place the second wafer it carries onto the wafer carrier tray when a signal is received that the first robot has reached the first safe position.

[0034] Optionally, the second control unit is further adapted to control the second robot to move to the exchange position, and after placing the second wafer it carries on the wafer carrier tray, control the second robot to move to a preset second safe position;

[0035] The wafer transfer control device further includes a third control unit, adapted to control the process chamber to perform corresponding wafer processing processes on the second wafer when a signal is received that the second robot has reached the second safe position.

[0036] Optionally, the semiconductor processing equipment further includes a loading chamber;

[0037] The first control unit is further adapted to control the first robot to move to a first predetermined position in the loading chamber and place the first wafer it is carrying at the first predetermined position; control the first robot to move to a second predetermined position in the loading chamber and pick up a third wafer; control the first robot to carry the third wafer to an alignment platform in the transfer chamber and place the third wafer on the alignment platform; and control the first robot to move to a preset first origin position.

[0038] The second control unit is further adapted to, after receiving a signal that the second robot has reached the second safe position, control the second robot to move to the alignment platform and pick up the third wafer; and control the second robot to carry the third wafer to a preset second origin position.

[0039] Optionally, the semiconductor processing equipment further includes a temperature processing chamber;

[0040] The second control unit is further adapted to control the second robot to move the third wafer to a cooling / heating platform in a temperature processing chamber and place the third wafer on the cooling / heating platform after the second robot picks up the third wafer on the alignment platform and before the second robot returns to the second origin position with the third wafer; it is also adapted to control the second robot to pick up the third wafer and return to the second origin position with the third wafer.

[0041] The wafer transfer control device further includes a fourth control unit, adapted to control the cooling / heating platform to heat or cool the third wafer after controlling the second robot to carry the third wafer to the cooling / heating platform in the temperature processing chamber and placing the third wafer on the cooling / heating platform.

[0042] Accordingly, embodiments of the present invention also provide a wafer processing system, including: a wafer transfer control device and a semiconductor processing equipment, wherein the wafer transfer control device is configured to perform the wafer transfer control method as described in any of the preceding claims.

[0043] Accordingly, embodiments of the present invention also provide an apparatus, comprising: at least one memory and at least one processor; the memory stores one or more computer-executable instructions, and the processor invokes the one or more computer-executable instructions to execute the wafer transfer control method as described in any of the preceding embodiments.

[0044] Accordingly, embodiments of the present invention also provide a storage medium storing one or more computer-executable instructions for executing the wafer transfer control method as described in any of the preceding claims.

[0045] Accordingly, embodiments of the present invention also provide a computer program product, including a computer program / instructions, which, when executed by a processor, are used to implement the wafer transfer control method as described in any of the preceding claims.

[0046] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages:

[0047] The wafer transfer control method provided in this embodiment of the invention includes: when a signal indicating that the wafer processing of a first wafer has been completed is received, simultaneously controlling a first robot and a second robot in the transfer chamber to move to an exchange position and a falling position respectively in the process chamber, wherein the falling position is spaced apart from the exchange position; controlling the first robot to grab the first wafer located on a wafer carrier tray in the process chamber and carry the first wafer to a preset first safe position; when a signal indicating that the first robot has reached the first safe position is received, controlling the second robot to move to the exchange position and place the second wafer it is carrying on the wafer carrier tray.

[0048] In the wafer transport control method provided by this invention, when a signal indicating the completion of the wafer processing of the first wafer is received, the first robot and the second robot in the transport chamber are simultaneously controlled to move to the exchange position and the falling position respectively within the process chamber. When the first robot picks up the first wafer from the wafer carrier and carries it to a preset first safe position, the subsequent robot is controlled to fall from the falling position to the exchange position and place the second wafer it carries onto the wafer carrier. Compared to a scheme where the first robot moves to the exchange position, then the second robot moves to the falling position, and the first robot places the first wafer in the loading chamber, then the subsequent robot falls from the falling position to the exchange position and places the second wafer it carries onto the wafer carrier, this method reduces the waiting time between the first and second robots, thereby improving wafer transport efficiency and ultimately enhancing the wafer processing efficiency of semiconductor processing equipment. Attached Figure Description

[0049] Figure 1 This diagram illustrates a flow chart of an embodiment of the wafer transfer control method provided by the present invention.

[0050] Figure 2 A schematic diagram of a semiconductor processing apparatus according to an embodiment of the wafer transfer control method of the present invention is shown.

[0051] Figure 3 This is a schematic diagram of an embodiment of the wafer transfer control device provided by the technical solution of the present invention;

[0052] Figure 4 This is a schematic diagram of an optional hardware structure of the device provided by the technical solution of the present invention. Detailed Implementation

[0053] As can be seen from the background technology, the existing wafer transfer control methods for semiconductor processing equipment suffer from low transfer efficiency, which reduces the wafer processing efficiency of semiconductor processing equipment.

[0054] To address the aforementioned technical problems, the wafer transfer control method provided in this embodiment of the invention includes: upon receiving a signal indicating that the wafer processing of a first wafer has been completed, simultaneously controlling a first robot and a second robot within the transfer chamber to move to an exchange position and a falling position respectively within the process chamber, wherein the falling position is spaced apart from the exchange position; controlling the first robot to grab the first wafer located on a wafer carrier tray within the process chamber and carry the first wafer to a preset first safe position; upon receiving a signal indicating that the first robot has reached the first safe position, controlling the second robot to move to the exchange position and place the second wafer it is carrying onto the wafer carrier tray.

[0055] In the wafer transport control method provided by this invention, when a signal indicating the completion of the wafer processing of the first wafer is received, the first robot and the second robot in the transport chamber are simultaneously controlled to move to the exchange position and the falling position respectively within the process chamber. When the first robot picks up the first wafer from the wafer carrier and carries it to a preset first safe position, the subsequent robot is controlled to fall from the falling position to the exchange position and place the second wafer it carries onto the wafer carrier. Compared to a scheme where the first robot moves to the exchange position, then the second robot moves to the falling position, and the first robot places the first wafer in the loading chamber, then the subsequent robot falls from the falling position to the exchange position and places the second wafer it carries onto the wafer carrier, this method reduces the waiting time between the first and second robots, thereby improving wafer transport efficiency and ultimately enhancing the wafer processing efficiency of semiconductor processing equipment.

[0056] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0057] Figure 1 This diagram illustrates a flow chart of an embodiment of the wafer transfer control method provided by the present invention. Figure 2 A schematic diagram of a semiconductor processing apparatus according to an embodiment of the wafer transport control method of the present invention is shown.

[0058] Reference Figure 1 and Figure 2 A wafer transfer control method may specifically include the following steps:

[0059] Step S101: When a signal indicating that the wafer processing of the first wafer has been completed is received, the first robot and the second robot in the transmission chamber are simultaneously controlled to move to the exchange position and the falling position located in the process chamber, respectively, with the falling position being spaced apart from the exchange position.

[0060] Step S102: Control the first robot to grab the first wafer on the wafer carrier tray located in the process chamber, and carry the first wafer to a preset first safe position;

[0061] Step S103: When the signal that the first robot has reached the first safe position is obtained, control the second robot to move to the exchange position and place the second wafer it is carrying on the wafer carrier tray;

[0062] In this embodiment, after controlling the second robot to move to the exchange position and placing the second wafer it carries onto the wafer carrier tray, the wafer transfer control method further includes:

[0063] Step S104: Control the second robot to move to a preset second safe position;

[0064] Step S105: When the signal that the second robot has reached the second safe position is obtained, the process chamber is controlled to perform the corresponding wafer processing process on the second wafer;

[0065] In this embodiment, after obtaining the signal that the first robot has reached the first safe position, the wafer transfer control method further includes:

[0066] Step S106: Control the first robot to move to the first predetermined position in the loading chamber, and place the first wafer it is carrying in the first predetermined position;

[0067] Step S107: Control the first robot to move to the second predetermined position in the loading chamber and pick up the third wafer;

[0068] Step S108: Control the first robot to carry the third wafer to the alignment platform in the transfer chamber, and place the third wafer on the alignment platform;

[0069] Step S109: Control the first robot to move to the preset first origin position;

[0070] In this embodiment, after obtaining the signal that the second robot has reached the second safe position, the wafer transfer control method further includes:

[0071] Step S110: Control the second robot to move to the alignment platform and pick up the third wafer;

[0072] Step S111: Control the second robot to carry the third wafer to the preset second origin position.

[0073] Please refer to the reference. Figure 1 and Figure 2 In step S101, when a signal indicating that the wafer processing of the first wafer has been completed is received, the first robot and the second robot in the transmission chamber are simultaneously controlled to move to the exchange position and the falling position located in the process chamber, respectively, with the falling position being spaced apart from the exchange position.

[0074] When a signal indicating the completion of the wafer processing of the first wafer is received, the first robot and the second robot in the transmission chamber are simultaneously controlled to move to the exchange position and the falling position respectively in the process chamber. This provides a basis for subsequently controlling the first robot to grab the first wafer located on the wafer carrier tray in the process chamber and carry the first wafer to a preset first safe position. When a signal indicating that the first robot has reached the first safe position is received, the second robot is controlled to move to the exchange position and place the second wafer it is carrying on the wafer carrier tray.

[0075] In this embodiment, the first wafer is a wafer that has undergone the corresponding wafer processing technology. Specifically, the first wafer is a wafer that has undergone the ion implantation process.

[0076] In practical applications, the signal indicating the completion of the wafer processing of the first wafer includes one or more of the following: a signal indicating the completion of the detection of the first wafer, a signal indicating that the wafer carrier has reached the exchange position, a signal indicating that the wafer carrier releases the first wafer, and a signal indicating that the number of scans of the first wafer has reached a preset threshold.

[0077] In this embodiment, the process chamber 100 is first controlled to perform an ion implantation process on the first wafer, and then the wafer carrier disk 150 (such as an electrostatic chuck) carries the first wafer to the exchange position located in the process chamber 100, and the wafer inspection device (such as a camera) (not shown) inspects the first wafer through image processing and other methods.

[0078] Accordingly, when a signal is detected that the wafer carrier 150 carrying the first wafer has arrived at the exchange position E, and a signal sent by the wafer inspection device indicating that the inspection of the first wafer is complete is obtained, the first robot and the second robot in the transmission chamber 200 are simultaneously controlled to move to the exchange position E and the falling position D located in the process chamber 100, respectively.

[0079] The exchange position E has corresponding coordinates in a preset coordinate system, and the coordinates of the wafer carrier 150 in the preset coordinate system can be obtained in real time through sensors or image recognition. Accordingly, by comparing the real-time obtained coordinates of the wafer carrier 150 in the preset coordinate system with the coordinates of the exchange position E in the preset coordinate system, it is determined whether the wafer carrier 150 carrying the first wafer has reached the exchange position E.

[0080] When a signal indicating the completion of wafer processing for the first wafer is received, the first robot and the second robot in the transmission chamber 200 are simultaneously controlled to move to the exchange position E and the drop position D respectively within the process chamber 100. Compared to the scheme where the first robot is first controlled to carry the first wafer to the first safe position S1, and then the second robot is controlled to carry the unprocessed second wafer to the drop position D, the waiting time between the first robot and the second robot can be shortened, thereby improving the efficiency of wafer transfer and thus improving the wafer processing efficiency of semiconductor processing equipment.

[0081] In this embodiment, the first robot includes a robotic arm 250. Accordingly, upon receiving a signal that the wafer carrier 150 carrying the first wafer has arrived at the exchange position E, and upon receiving a signal from the wafer inspection device indicating that the inspection of the first wafer is complete, the robotic arm 250 of the first robot is controlled to move from the first origin position O1 located in the transfer chamber 200 to the exchange position E located in the process chamber 100.

[0082] In this embodiment, the first origin position O1 is the initial position of the first robot's manipulator 250 when it is waiting to move from the transfer chamber 200 to the process chamber 100.

[0083] In this embodiment, the robotic arm 250 of the first robot is in an extended state while waiting to move from the transfer chamber 200 to the process chamber 100, which makes the distance between the robotic arm 250 of the first robot and the exchange position E closer. This means that the distance between the first origin position O1 and the exchange position E is closer, which helps to shorten the time required for the robotic arm 250 of the first robot to move from the transfer chamber 200 to the exchange position E, thereby improving the efficiency of wafer transfer.

[0084] In other embodiments, depending on actual needs, the robotic arm of the first robot may also be in a retracted state when it is at the first origin position.

[0085] In this embodiment, during the process of controlling the robotic arm 250 of the first robot to move from the first origin position O1 to the exchange position E, the robotic arm 250 of the first robot is in an unloaded state so as to subsequently pick up the first wafer from the wafer carrier 150.

[0086] Accordingly, during the process of controlling the manipulator 250 of the first robot to move from the first origin position O1 to the exchange position E located within the transfer chamber 200, the manipulator 250 of the first robot moves at a relatively high speed to shorten the time required to move from the first origin position O1 to the exchange position E, thereby further improving the efficiency of wafer transfer. As an example, the manipulator 250 of the first robot moves from the first origin position O1 to the exchange position E at the upper limit of the allowed movement speed.

[0087] In this embodiment, during the process of controlling the manipulator 250 of the first robot to move from the first origin position O1 to the exchange position E located in the transmission chamber 200, the manipulator 250 of the first robot moves in a straight line in the direction from the first origin position O1 to the exchange position E, so that the distance traveled by the manipulator 250 of the first robot from the first origin position O1 to the exchange position E is minimized, which is beneficial to further improve the efficiency of wafer transmission.

[0088] In this embodiment, the second wafer is a wafer to be processed. Specifically, the second wafer is a wafer that has not undergone ion implantation.

[0089] In this embodiment, the second robot includes a robotic arm 250'. Accordingly, controlling the second robot located in the transfer chamber 200 to move the second wafer to the falling position D located in the process chamber 100 means controlling the robotic arm 250' of the second robot to move from the second origin position O2 located in the transfer chamber 200 to the falling position D located in the process chamber 100.

[0090] In this embodiment, the second origin position O2 is the initial position of the second robot's manipulator 250' when it is waiting to move from the transfer chamber 200 to the process chamber 100.

[0091] In this embodiment, the robotic arm 250' of the second robot is in an extended state while carrying the second wafer and waiting to move from the transfer chamber 200 to the process chamber 100. This makes the second origin position O2 of the robotic arm 250' closer to the falling position D, which helps to shorten the time required for the robotic arm 250' to move from the second origin position O2 to the falling position D, thereby further improving the efficiency of wafer transfer.

[0092] In other embodiments, the robotic arm of the second robot can be in a retracted state while carrying the second wafer and waiting to move from the transfer chamber to the process chamber. This can be configured according to actual needs by those skilled in the art, and is not limited herein.

[0093] In this embodiment, during the process of controlling the manipulator 250' of the second robot to move from the second origin position O2 to the falling position D located in the transmission chamber 200, the manipulator 250' of the second robot carries the second wafer, so as to place the second wafer on the wafer carrier 150 in the future.

[0094] Accordingly, during the process of controlling the manipulator 250' of the second robot to move from the second origin position O2 to the falling position D located in the transmission chamber 200, the movement speed of the manipulator 250' of the second robot should not be too slow or too fast. If the movement speed of the manipulator 250' of the second robot is too slow, it will be detrimental to shortening the time required for the manipulator 250' of the second robot to move from the second origin position O2 to the falling position D, thereby hindering the improvement of wafer transmission efficiency; if the movement speed of the manipulator 250' of the second robot is too fast, it may cause the second wafer to fall out of the manipulator 250' of the second robot.

[0095] Therefore, considering the need to prevent the second wafer from detaching from the manipulator 250' of the second robot and to shorten the time required for the manipulator 250' of the second robot to move from the second origin position O2 to the falling position D within the transfer chamber 200, the movement speed of the manipulator 250' during its movement from the second origin position O2 to the falling position D within the transfer chamber 200 is set. As an example, the manipulator 250' of the second robot moves from the second origin position O2 to the falling position D at a movement speed of 30% to 50% of the upper limit of the allowed movement speed.

[0096] In this embodiment, during the process of controlling the manipulator 250' of the second robot to move from the second origin position O2 to the falling position D located in the transmission chamber 200, the manipulator 250' of the second robot moves in a straight line in the direction from the second origin position O2 to the falling position D, so that the distance traveled by the manipulator 250' of the second robot from the second origin position O2 to the falling position D is minimized, which is beneficial to further improve the efficiency of wafer transmission.

[0097] In this embodiment, within the transmission chamber 200, the manipulator 250' of the second robot is positioned above the manipulator 250 of the first robot. Correspondingly, along the Z-axis (not shown) direction of the preset coordinate system, the falling position D is located above the exchange position E.

[0098] The distance along the Z-axis between the falling position D and the exchange position E can be set according to actual needs. Specifically, the distance along the Z-axis between the falling position D and the exchange position E should not be too long or too short. If the distance along the Z-axis between the falling position D and the exchange position E is too long, the time required for the second robot's manipulator 250' to fall from the falling position D to the exchange position E will be longer, which is not conducive to improving wafer transfer efficiency. If the distance along the Z-axis between the falling position D and the exchange position E is too short, the second robot's manipulator 250' will hinder the first robot's manipulator 250 from grabbing the first wafer from the wafer carrier 150. Therefore, in this embodiment, the distance along the Z-axis between the falling position D and the exchange position E is 15mm to 25mm.

[0099] Please refer to the reference. Figure 1 and Figure 2 In step S102, the first robot is controlled to grab the first wafer located on the wafer carrier tray in the process chamber and move the first wafer to a preset first safe position.

[0100] The first robot is controlled to grab the first wafer located on the wafer carrier 150 and move the first wafer to a preset first safe position S1, which provides a basis for the subsequent control of the second robot to place the second wafer it is carrying on the wafer carrier 150.

[0101] In this embodiment, when the signal that the first robot has arrived at the exchange position E is obtained, the first robot is controlled to grab the first wafer located on the wafer carrier 150 and carry the first wafer from the exchange position E to the first safe position S1.

[0102] In this embodiment, the step of controlling the first robot to grasp the first wafer located on the wafer carrier 150 and move the first wafer to a preset first safe position S1 includes: controlling the robotic arm 250 of the first robot to grasp the first wafer located on the wafer carrier 150 and move the first wafer to a preset first safe position S1.

[0103] In this embodiment, the first safe position S1 is located inside the process chamber 100, making the distance between the first safe position S1 and the exchange position E relatively short. This shortens the time required for the robotic arm 250 of the first robot to move to the first safe position S1. Subsequently, when the signal of the robotic arm of the first robot moving to the first safe position S1 is obtained, the second robot is immediately controlled to place the second wafer it is carrying onto the wafer carrier 150. This shortens the interval between the second robot reaching the falling position D and performing the operation of placing the second wafer it is carrying onto the wafer carrier 150, thus further improving wafer transfer efficiency.

[0104] Furthermore, the first safe position S1 is far enough from the exchange position E that it will not obstruct the subsequent operation of the second robot placing the second wafer it is carrying from the drop position D onto the wafer carrier 150 located at the exchange position E. In addition, the first safe position S1 is close to the loading chamber 300, which also facilitates the subsequent movement of the first robot's manipulator 250 carrying the first wafer to the loading chamber 300.

[0105] Accordingly, the specific location of the first safety position S1 is set to avoid the first robot's manipulator 250 affecting the second robot's manipulator 250' from the falling position D to place the second wafer it carries onto the wafer carrier 150 located at the exchange position E, and to meet the need for improved wafer transfer efficiency, and is not limited here.

[0106] In this embodiment, during the process of controlling the robotic arm 250 of the first robot to carry the first wafer from the exchange position E to the first safe position S1, the robotic arm 250 of the first robot moves in a straight line from the exchange position E to the first safe position S1, so as to minimize the distance traveled by the robotic arm 250 of the first robot, which helps to further improve the efficiency of wafer transfer.

[0107] During the process of controlling the robotic arm 250 of the first robot to move the first wafer from the exchange position E to the first safe position S1, the movement speed of the robotic arm 250 of the first robot should not be too fast to avoid the first wafer slipping out of the robotic arm 250. At the same time, the movement speed of the robotic arm 250 of the first robot should not be too slow to avoid adversely affecting the improvement of wafer transfer efficiency. As an example, the robotic arm 250 of the first robot moves from the exchange position E to the first safe position S1 at a movement speed of 30% to 50% of the upper limit of the allowed movement speed.

[0108] Please refer to the reference. Figure 1 and Figure 2 In step S103, when a signal is received that the first robot has reached the first safe position, the second robot is controlled to move to the exchange position and place the second wafer it is carrying on the wafer carrier tray.

[0109] When the signal that the first robot has reached the first safe position S1 is received, the second robot is controlled to move to the exchange position E and place the second wafer it is carrying on the wafer carrier 150, so as to provide a basis for subsequent wafer processing technology to be performed on the second wafer.

[0110] In this embodiment, the second robot includes a robotic arm 250'. Accordingly, the step of controlling the second robot to place the second wafer onto the wafer carrier 150 from the falling position D includes: controlling the robotic arm 250' of the second robot to fall from the falling position D along the Z-axis to the exchange position E, and placing the second wafer onto the wafer carrier 150.

[0111] Please refer to the reference. Figure 1 and Figure 2 Then, execute step S104 to control the second robot to move to a preset second safe position.

[0112] After controlling the second robot to move to the exchange position E and placing the second wafer it carries on the wafer carrier 150, the second robot is then controlled to move to the preset second safe position S2. This provides a basis for controlling the process chamber 100 to perform the corresponding wafer processing process on the second wafer when the signal that the second robot has reached the second safe position S2 is received.

[0113] In this embodiment, the step of controlling the second robot to move from the exchange position E to the second safe position S2 includes: controlling the manipulator 250' of the second robot to move from the exchange position E to the second safe position S2.

[0114] In this embodiment, the second safe position S2 is located within the process chamber 100, making the distance between the second safe position S2 and the exchange position E relatively short. This shortens the time required for the second robot to move from the exchange position E to the second safe position S2. Subsequently, upon receiving a signal that the second robot has reached the second safe position S2, the process chamber 100 is immediately controlled to perform the corresponding wafer processing process on the second wafer. This shortens the interval between the operation of the second robot placing the second wafer on the wafer carrier 150 and the operation of performing the corresponding wafer processing process on the second wafer, which is beneficial to further improve wafer transfer efficiency.

[0115] Furthermore, the second safe position S2 is far enough from the exchange position E that it will not adversely affect the subsequent wafer processing operations performed by the process chamber 100 on the second wafer. In addition, the second safe position S2 is close to the transfer chamber 200, which also facilitates the subsequent return of the second robot's manipulator 250' to the transfer chamber 200.

[0116] Accordingly, in order to avoid the second robot's manipulator 250' affecting the operation of the process chamber 100 on the second wafer to perform the corresponding wafer processing process, and to improve the wafer transfer efficiency, the specific location of the second safety position S2 is set, which is not limited here.

[0117] In this embodiment, during the process of controlling the manipulator 250' of the second robot to move from the exchange position E to the second safe position S2, the manipulator 250' of the second robot moves in a straight line in the direction from the exchange position E to the second safe position S2, so that the distance traveled by the manipulator 250' of the second robot from the exchange position E to the second safe position S2 is minimized, which helps to further improve the efficiency of wafer transfer.

[0118] During the process of controlling the second robot's manipulator 250' to move from the exchange position E to the second safe position S2, the second robot's manipulator 250' is in an unloaded state in order to subsequently pick up the third wafer from the alignment platform 250" located in the transfer chamber 200.

[0119] Accordingly, during the process of controlling the manipulator 250' of the second robot to move from the exchange position E to the second safe position S2, the manipulator 250' of the second robot moves at a relatively high speed, which helps to shorten the time required to move from the exchange position E to the second safe position S2, thereby improving the efficiency of wafer transport. As an example, the manipulator 250' of the second robot moves from the exchange position E to the second safe position S2 at the upper limit of the allowed movement speed.

[0120] In this embodiment, during the process of controlling the manipulator 250' of the second robot to move from the exchange position E to the second safe position S2, the manipulator 250' of the second robot moves in a straight line in the direction from the exchange position E to the second safe position S2, so that the distance traveled by the manipulator 250' of the second robot is minimized, which is beneficial to further improve the wafer transfer efficiency.

[0121] Please refer to the reference. Figure 1 and Figure 2 In step S105, when a signal is received that the second robot has reached the second safe position, the process chamber is controlled to perform the corresponding wafer processing process on the second wafer.

[0122] When the signal that the second robot has reached the second safe position S2 is received, the process chamber 100 is controlled to perform the corresponding wafer processing process on the second wafer. Compared with the existing scheme that controls the process chamber 100 to perform the corresponding wafer processing process on the second wafer after the signal that the second robot has returned to the transmission chamber 200 is received, this is conducive to further improving the wafer process processing efficiency.

[0123] In this embodiment, when the signal that the second robot has reached the second safe position S2 is obtained, the step of controlling the process chamber 100 to perform the corresponding wafer processing process on the second wafer includes: when the signal that the manipulator 250' of the second robot has reached the second safe position S2 is obtained, controlling the process chamber 100 to perform the ion implantation process on the second wafer.

[0124] In other embodiments, the semiconductor processing equipment can also be other semiconductor processing equipment besides ion implantation. Accordingly, upon receiving a signal that the second robot has reached the second safe position, the process chamber can also be controlled to perform other wafer processing processes on the second wafer, without limitation.

[0125] Please refer to the reference. Figure 1 and Figure 2In step S106, after receiving a signal that the first robot has reached the first safe position, the robot is controlled to move to the first predetermined position in the loading chamber and the first wafer it is carrying is placed in the first predetermined position.

[0126] After receiving a signal that the first robot has reached the first safe position S1, the first robot is controlled to move to the first predetermined position P1 in the loading chamber 300 and place the first wafer it is carrying in the first predetermined position P1, so as to provide a basis for subsequently sending the first wafer out of the semiconductor processing equipment from the loading chamber 300, and controlling the first robot to move to the second predetermined position P2 in the loading chamber to pick up the third wafer located in the loading chamber 300.

[0127] In this embodiment, after receiving a signal that the first robot has reached the first safe position S1, the first robot is controlled to move to the first predetermined position P1 in the loading chamber 300 and place the first wafer it is carrying at the first predetermined position P1. This means that after receiving a signal that the robotic arm 250 of the first robot has reached the first safe position S1, the robotic arm 250 of the first robot is controlled to continue moving from the first safe position S1 to the first predetermined position P1 carrying the first wafer and placing the first wafer it is carrying at the first predetermined position P1.

[0128] As an example, the loading chamber 300 includes a first wafer cassette (not shown) located at the first predetermined position P1 and a lift pin (not shown) located within the first wafer cassette. Accordingly, the robot's manipulator 250 is first controlled to move the first wafer from the first safe position S1 to the entrance / exit of the first wafer cassette, and then the robot's manipulator 250 is controlled to carry the first wafer into the first wafer cassette; when a signal is received that the robot's manipulator 250 has carried the first wafer into the first wafer cassette and reached a preset falling position inside the cassette, the robot's manipulator 250 is controlled to fall along the Z-axis direction, placing the first wafer onto the lift pin inside the first wafer cassette.

[0129] In this embodiment, during the process of controlling the robotic arm 250 of the first robot to carry the first wafer from the first safe position S1 to the first predetermined position P1, the robotic arm 250 of the first robot moves in a straight line from the first safe position S1 to the first predetermined position P1 in the loading chamber 300, so that the distance traveled by the robotic arm 250 of the first robot carrying the first wafer from the first safe position S1 to the first predetermined position P1 in the loading chamber 300 is minimized.

[0130] In other embodiments, the robotic arm of the first robot can be controlled to first return from the first safe position to the first origin position, and then move from the first origin position to the first predetermined position located in the loading chamber, etc., without limitation.

[0131] In this embodiment, during the process of controlling the robotic arm 250 of the first robot to move the first wafer from the first safe position S1 to the first predetermined position P1 located within the loading chamber 300, the movement speed of the robotic arm 250 of the first robot should not be too fast to avoid the first wafer slipping out of the robotic arm 250. Furthermore, the movement speed of the robotic arm 250 of the first robot should not be too slow to avoid adversely affecting the wafer transfer efficiency. As an example, the robotic arm 250 of the first robot moves from the exchange position E to the first predetermined position P1 located within the loading chamber 300 at a movement speed of 30% to 50% of the upper limit of the allowed movement speed.

[0132] Please refer to the reference. Figure 1 and Figure 2 In step S107, the first robot is controlled to move to the second predetermined position in the loading chamber and pick up the third wafer.

[0133] The first robot is controlled to move to the second predetermined position P2 in the loading chamber 300 and pick up the third wafer, providing a basis for subsequently controlling the first robot to carry the third wafer to the alignment platform in the transfer chamber and place the third wafer on the alignment platform.

[0134] In this embodiment, the third wafer is a wafer to be processed using the corresponding wafer fabrication process. Specifically, the third wafer is a wafer to be subjected to ion implantation.

[0135] In this embodiment, the third wafer is stored at a second predetermined position P2 within the loading chamber 300. Correspondingly, after the robotic arm 250 of the first robot places the first wafer at a first predetermined position P1 in the loading chamber 300, the robotic arm 250 is further controlled to move from the first predetermined position P1 to the second predetermined position P2 and pick up the third wafer located at the second predetermined position P2. The second predetermined position P2 is different from the first predetermined position P1, such as a different wafer cassette.

[0136] Accordingly, the step of controlling the first robot to move to the second predetermined position P2 in the loading chamber 300 and to pick up the third wafer includes: controlling the manipulator 250 of the first robot to move to the second predetermined position P2 in the loading chamber 300 and to pick up the third wafer located at the second predetermined position P2 in the loading chamber 300.

[0137] The above description, using the example of the first predetermined position P1 and the second predetermined position P2 being in the loading chamber B, illustrates the movement path of the manipulator 250 of the first robot within the loading chamber. It is understood that the first predetermined position P1 and the second predetermined position P2 can also be located in the loading chamber A.

[0138] Please refer to the reference. Figure 1 and Figure 2 In step S108, the first robot is controlled to carry the third wafer to the alignment platform in the transfer chamber and place the third wafer on the alignment platform.

[0139] The first robot is controlled to carry the third wafer to the alignment platform 250” in the transfer chamber and the third wafer is placed on the alignment platform 250” to provide a basis for subsequently controlling the first robot to move to the preset first origin position O1.

[0140] In this embodiment, the step of controlling the first robot to carry the third wafer to the alignment platform 250” in the transfer chamber and placing the third wafer on the alignment platform 250” includes: controlling the robotic arm 250 of the first robot to carry the third wafer to the alignment platform 250” in the transfer chamber and placing the third wafer on the alignment platform 250”.

[0141] In this embodiment, controlling the manipulator 250 of the first robot to move in a straight line from the second predetermined position P2 in the loading chamber 300 to the alignment platform 250 can minimize the distance traveled by the manipulator 250 of the first robot, which is helpful to further improve the wafer transfer efficiency.

[0142] In this embodiment, during the process of controlling the first robot's manipulator 250 to move the third wafer to the alignment platform 250 in the transfer chamber, the first robot's manipulator 250 carries the third wafer.

[0143] Accordingly, the movement speed of the first robot's manipulator 250 should not be too fast to avoid the third wafer slipping out of the manipulator 250. Furthermore, the movement speed of the first robot's manipulator 250 should not be too slow to avoid adversely affecting wafer transfer efficiency. As an example, the first robot's manipulator 250 carries the third wafer from the second predetermined position P2 in the loading chamber 300 to the alignment platform 250 in the transfer chamber at a movement speed of 30% to 50% of the upper limit of the allowed movement speed.

[0144] In this embodiment, the alignment platform 250” is used to adjust the position and angle of the wafer located on it using visual or laser methods.

[0145] Please refer to the reference. Figure 1 and Figure 2 Execute step S109 to control the first robot to move to the preset first origin position.

[0146] The first robot is controlled to move to a preset first origin position O1, which provides a basis for the subsequent control of the first robot to start from the first origin position O1 and move to the exchange position E to pick up the second wafer after the wafer process has been completed, and also provides a basis for the second robot to pick up the third wafer from the alignment platform 250".

[0147] In this embodiment, the step of controlling the first robot to move to the preset first origin position O1 includes: controlling the first robot's manipulator 250 to return from the alignment platform 250” to the first origin position O1.

[0148] In this embodiment, controlling the manipulator 250 of the first robot to move in a straight line from the alignment platform 250” to the first origin position O1 can minimize the distance traveled by the manipulator 250 of the first robot, which is helpful to further improve the wafer transfer efficiency.

[0149] In this embodiment, before the robotic arm 250 of the first robot returns from the alignment platform 250” to the first origin position O1, the robotic arm 250 of the first robot places the third wafer on the alignment platform 250”. That is, during the period when the robotic arm 250 of the first robot returns from the alignment platform 250” to the first origin position O1, the robotic arm 250 of the first robot is in an unloaded state.

[0150] Accordingly, the robotic arm 250 of the first robot is controlled to move at a faster speed to shorten the time required for the robotic arm 250 to return from the alignment platform 250” to the first origin position O1, thereby improving the efficiency of wafer transfer. For example, the robotic arm 250 of the first robot returns from the alignment platform 250” to the first origin position O1 at the upper limit of the allowed movement speed.

[0151] Please refer to the reference. Figure 1 and Figure 2 In step S110, after receiving a signal that the second robot has reached the second safe position, the second robot is controlled to move to the alignment platform and grab the third wafer.

[0152] After receiving the signal that the second robot has moved to the second safe position S2, the second robot is controlled to move to the alignment platform 250” and grab the third wafer, providing a basis for the subsequent control of the second robot to carry the third wafer to the second origin position.

[0153] In this embodiment, controlling the second robot to move to the alignment platform 250” and grasp the third wafer means controlling the robotic arm 250' of the second robot to move from the second safe position S2 to the alignment platform 250” and grasp the third wafer located on the alignment platform 250”.

[0154] As an example, controlling the manipulator 250' of the second robot to move in a straight line from the second safe position S2 toward the alignment platform 250" minimizes the distance traveled by the manipulator 250 of the first robot from the alignment platform 250" to the first origin position O1, which is beneficial to further improve the efficiency of wafer transfer.

[0155] In other embodiments, the second robot can be controlled to first return to the second origin position along the direction from the second safe position to the second origin position, and then move to the alignment platform along the direction from the second origin position to the alignment platform, etc. Those skilled in the art can set it according to actual needs, and there are no restrictions here.

[0156] In this embodiment, during the movement of the second robot's manipulator 250' from the second safe position S2 to the alignment platform 250", the manipulator 250' of the second robot is in an idle state. Accordingly, the second robot is controlled to move at a faster speed to shorten the time required to move from the second safe position S2 to the alignment platform 250", thereby helping to further improve wafer transfer efficiency. For example, the manipulator 250' of the second robot can be controlled to move from the second safe position S2 to the alignment platform 250" at the upper limit of the allowed movement speed.

[0157] Please refer to the reference. Figure 1 and Figure 2 Execute step S111, controlling the second robot to carry the third wafer to a preset second origin position.

[0158] In this embodiment, controlling the second robot to move the third wafer to the second origin position O2 means controlling the manipulator 250' of the second robot to return the third wafer from the alignment platform 250" to the second origin position O2.

[0159] In this embodiment, the semiconductor processing equipment further includes a wafer processing chamber 400, and the wafer processing chamber 400 includes a cooling / heating platform 450 for heating or cooling the third wafer.

[0160] The third wafer is heated or cooled using a cooling / heating platform 450 so that its temperature reaches a preset value, so that the third wafer can be processed by the corresponding wafer processing technology.

[0161] Accordingly, after controlling the second robot to grasp the third wafer located on the alignment platform 250”, and before controlling the second robot to carry the third wafer back to the second origin position O2, the wafer transfer control method further includes: controlling the second robot to carry the third wafer to the cooling / heating platform 450 located in the temperature processing chamber 400, and placing the third wafer on the cooling / heating platform 450; controlling the cooling / heating platform 450 to heat or cool the third wafer; and after controlling the cooling / heating platform 450 to heat or cool the third wafer, controlling the second robot to grasp the third wafer and carry the third wafer back to the second origin position O2.

[0162] In this embodiment, the step of controlling the second robot to carry the third wafer to the cooling / heating platform 450 located in the temperature processing chamber 400 and placing the third wafer on the cooling / heating platform 450 includes: controlling the manipulator 250' of the second robot to carry the third wafer from the alignment platform 250" to the cooling / heating platform 450 located in the temperature processing chamber 400 and placing the third wafer on the cooling / heating platform 450.

[0163] In this embodiment, in order to shorten the time required for the manipulator 250' of the second robot to move the third wafer from the alignment platform 250" to the cooling / heating platform 450 located in the temperature processing chamber 400, the manipulator 250' of the second robot is controlled to move the third wafer in a straight line from the alignment platform 250" to the cooling / heating platform 450.

[0164] In this embodiment, during the process of controlling the manipulator 250' of the second robot to move the third wafer from the alignment platform 250" to the cooling / heating platform 450 located in the temperature processing chamber 400, the manipulator 250' of the second robot is carrying the third wafer. Therefore, the movement speed of the manipulator 250' of the second robot should not be too fast to reduce the risk of the third wafer falling off the manipulator 250' of the second robot; the movement speed of the manipulator 250' of the second robot should also not be too slow to avoid adversely affecting the wafer transfer efficiency.

[0165] As an example, the manipulator 250' of the second robot carries the third wafer from the alignment platform 250" to the cooling / heating platform 450 at a speed of 30% to 50% of the upper limit of the allowed movement speed.

[0166] In this embodiment, the step of controlling the second robot to grasp the third wafer and carry the third wafer back from the temperature processing platform 450 to the second origin position O2 includes: controlling the robotic arm 250' of the second robot to grasp the third wafer and carry the third wafer back from the temperature processing platform 450 to the second origin position O2.

[0167] In this embodiment, in order to reduce the risk of the third wafer slipping from the manipulator 250' of the second robot and to minimize the movement time of the manipulator 250' of the second robot, the manipulator 250' of the second robot is controlled to move in a straight line along the direction from the temperature processing platform 450 to the second origin position O2 at a speed of 30% to 50% of the upper limit of the allowed movement speed.

[0168] After controlling the first robot's manipulator 250 to return to the first origin position O1, and controlling the second robot's manipulator 250' to return from the alignment platform to the second origin position with the third wafer, the second wafer is used as the first wafer, and the third wafer is used as the second wafer. The process continues from step S101, and so on, until all wafers to be processed in this wafer processing process are completed.

[0169] It should also be noted that in this embodiment, when the robotic arm 250 of the first robot or the robotic arm 250' of the second robot moves from one position to another, the coordinates of the position of the robotic arm 250 of the first robot or the robotic arm 250' of the second robot in the preset coordinate system are obtained in real time and compared with the coordinates of the corresponding target position in the preset coordinate system to determine whether the robotic arm of the first robot or the robotic arm of the second robot has reached the corresponding target position. This will not be elaborated further here.

[0170] It should also be pointed out that, Figure 2 The falling position, exchange position, first origin position, second origin position, first predetermined position, and second predetermined position shown are merely examples. It is understood that those skilled in the art can flexibly set the specific positions of the falling position, exchange position, first origin position, second origin position, first predetermined position, and second predetermined position within the semiconductor processing equipment according to different needs, and the present invention does not impose any limitations.

[0171] Accordingly, embodiments of the present invention also provide a wafer transfer control device.

[0172] Figure 3 A schematic diagram of an embodiment of the wafer transfer control device provided by the present invention is shown. (Refer to reference...) Figure 3 A wafer transfer control device 30 includes: a first control unit 301, adapted to control a first robot in the transfer chamber to move to a preset exchange position when a signal indicating that the wafer processing of a first wafer has been completed is received; to control the first robot to grab a first wafer located on a wafer carrier tray in the process chamber and carry the first wafer to a preset first safe position; and a second control unit 302, adapted to control a second robot in the transfer chamber to move to a preset falling position while controlling the first robot in the transfer chamber to move to the preset exchange position, the falling position being spaced apart from the exchange position; and further adapted to control the second robot to move to the exchange position and place the second wafer it carries onto the wafer carrier tray when a signal indicating that the first robot has reached the first safe position is received.

[0173] In this embodiment, the second control unit 302 also controls the second robot to move to the exchange position, and after placing the second wafer it carries on the wafer carrier tray, controls the second robot to move to a preset second safe position.

[0174] Accordingly, the wafer transfer control device 30 further includes a third control unit 303, adapted to control the process chamber to perform corresponding wafer processing processes on the second wafer when a signal is received that the second robot has reached the second safe position.

[0175] In this embodiment, the first control unit 301 is further adapted to control the first robot to move to a first predetermined position in the loading chamber and place the first wafer it carries at the first predetermined position; control the first robot to move to a second predetermined position in the loading chamber and pick up a third wafer; control the first robot to carry the third wafer to an alignment platform in the transfer chamber and place the third wafer on the alignment platform; and control the first robot to move to a preset first origin position.

[0176] The second control unit 302 is further adapted to, after receiving a signal that the second robot has reached the second safe position, control the second robot to move to the alignment platform and pick up the third wafer; and control the second robot to carry the third wafer to a preset second origin position.

[0177] In this embodiment, the semiconductor processing equipment further includes a temperature processing chamber; correspondingly, the second control unit 302 is also adapted to control the second robot to move the third wafer to a cooling / heating platform in the temperature processing chamber after the second robot picks up the third wafer located on the alignment platform, and before controlling the second robot to carry the third wafer back to the second origin position, and to place the third wafer on the cooling / heating platform; it is also adapted to control the second robot to pick up the third wafer and carry the third wafer back to the second origin position.

[0178] Accordingly, the wafer transfer control device further includes a fourth control unit 304, adapted to control the cooling / heating platform to heat or cool the third wafer after controlling the second robot to carry the third wafer to the cooling / heating platform in the temperature processing chamber and placing the third wafer on the cooling / heating platform.

[0179] The wafer transfer control device in this embodiment of the invention can be used to execute the aforementioned wafer transfer control method, or other functional modules can be used to execute the aforementioned wafer transfer control method. For a detailed description of the wafer transfer control method, please refer to the foregoing section; it will not be repeated here.

[0180] Accordingly, embodiments of the present invention also provide an apparatus that can implement the wafer transfer control method provided in the embodiments of the present invention by loading the above-described wafer transfer control method in the form of a program.

[0181] refer to Figure 4 The diagram illustrates an optional hardware structure of a device according to an embodiment of the present invention. The device in this embodiment includes: multiple processors 01, multiple communication interfaces 02, multiple memories 03, and multiple communication buses 04.

[0182] In this embodiment, there are multiple processors 01, communication interfaces 02, memory 03 and communication buses 04, and the processors 01, communication interfaces 02 and memory 03 communicate with each other through the communication bus 04.

[0183] Communication interface 02 can be an interface for a communication module used for network communication, such as the interface for a GSM module.

[0184] The processor 01 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the wafer transfer control method of this embodiment.

[0185] Memory 03 may include high-speed RAM, and may also include non-volatile memory, such as multiple disk drives. Memory 03 stores one or more computer instructions, which are executed by processor 01 to implement the wafer transfer control method provided in the foregoing embodiments.

[0186] It should be noted that the above-described implementing electronic device may also include other devices (not shown) that may not be essential to understanding the content disclosed in the embodiments of the present invention; given that these other devices may not be essential to understanding the content disclosed in the embodiments of the present invention, the embodiments of the present invention will not describe them one by one.

[0187] Accordingly, embodiments of the present invention also provide a computer program product, including a computer program / instructions, which, when executed by a processor, are used to implement the wafer transfer control method described in the embodiments of the present invention.

[0188] This invention also provides a storage medium storing one or more computer instructions for implementing the wafer transfer control method provided in the foregoing embodiments.

[0189] The embodiments of the present invention described above are combinations of elements and features of the present invention. Unless otherwise stated, elements or features may be considered optional. Individual elements or features may be practiced without combination with other elements or features. Furthermore, embodiments of the present invention may be constructed by combining some elements and / or features. The order of operations described in the embodiments of the present invention may be rearranged. Some constructions of any embodiment may be included in another embodiment and may be replaced by corresponding constructions of another embodiment. It will be apparent to those skilled in the art that claims in the appended claims that are not expressly referenced in each other may be combined to form embodiments of the present invention, or may be included as new claims in amendments made after the filing of this application.

[0190] Embodiments of the present invention can be implemented by various means, such as hardware, firmware, software, or combinations thereof. In a hardware configuration, the method according to an exemplary embodiment of the present invention can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, etc.

[0191] In firmware or software configuration, embodiments of the present invention can be implemented in the form of modules, processes, functions, etc. Software code can be stored in a memory unit and executed by a processor. The memory unit is located inside or outside the processor and can send data to and receive data from the processor via various known means.

[0192] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is accorded the widest scope consistent with the principles and novel features disclosed herein.

[0193] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer transfer control method applied to a semiconductor processing apparatus, the semiconductor processing apparatus comprising a transfer chamber and a process chamber, characterized by, include: When a signal indicating that the wafer processing of the first wafer is complete is received, the first robot and the second robot in the transmission chamber are simultaneously controlled to move to the exchange position and the falling position located in the process chamber, respectively, with the falling position being spaced apart from the exchange position. The first robot is controlled to grab the first wafer located on the wafer carrier tray in the process chamber and move the first wafer to a preset first safe position. Upon receiving a signal that the first robot has reached the first safe position, the second robot is controlled to move to the exchange position and place the second wafer it is carrying onto the wafer carrier tray.

2. The wafer transfer control method as described in claim 1, characterized in that, Along the Z-axis of the preset coordinate system, the falling position is located above the exchange position.

3. The wafer transfer control method according to Claim 1, wherein After controlling the second robot to move to the exchange position and place the second wafer it is carrying on the wafer carrier tray, the process further includes: Control the second robot to move to a preset second safe position; Upon receiving a signal that the second robot has reached the second safe position, the process chamber is controlled to perform the corresponding wafer processing process on the second wafer.

4. The wafer transfer control method according to Claim 3, wherein The semiconductor processing equipment also includes a loading chamber; The method further includes: controlling the first robot to move to a first predetermined position in the loading chamber and placing the first wafer it is carrying at the first predetermined position; controlling the first robot to move to a second predetermined position in the loading chamber and picking up a third wafer; controlling the first robot to carry the third wafer to an alignment platform in the transfer chamber and placing the third wafer on the alignment platform; and controlling the first robot to move to a preset first origin position. After receiving a signal that the second robot has reached the second safe position, the method further includes: controlling the second robot to move to the alignment platform and grab the third wafer; and controlling the second robot to carry the third wafer to a preset second origin position.

5. The wafer transfer control method according to Claim 4, wherein Controlling the first robot to move to a first predetermined position in the loading chamber includes: Control the first robot to move from the first safe position to the first predetermined position; or... Control the first robot to move from the first safe position to a preset first origin position, and control the first robot to move from the first origin position to the first predetermined position.

6. The wafer transfer control method according to Claim 4, wherein Controlling the second robot to move to the alignment platform includes: Control the second robot to move from the second safe position to the alignment platform; or... Control the second robot to move from the second safe position to the preset second origin position, and control the second robot to move from the second origin position to the alignment platform.

7. The wafer transfer control method according to Claim 4, wherein The semiconductor processing equipment also includes a temperature processing chamber; After controlling the second robot to pick up the third wafer located on the alignment platform, and before controlling the second robot to carry the third wafer back to the second origin position, the method further includes: controlling the second robot to carry the third wafer to a cooling / heating platform in the temperature processing chamber, and placing the third wafer on the cooling / heating platform; controlling the cooling / heating platform to heat or cool the third wafer; and controlling the second robot to pick up the third wafer and carry the third wafer back to the second origin position.

8. The wafer transfer control method according to Claim 4, wherein The speed at which the first robot is carrying the wafer is less than or equal to the speed at which the first robot is not carrying the wafer. The speed at which the second robot carries the wafer is less than or equal to the speed at which the second robot does not carry the wafer.

9. The wafer transfer control method according to Claim 4, wherein The first robot is in an extended state when it is at the first origin position, and the second robot is in an extended state when it is at the second origin position.

10. The wafer transfer control method according to Claim 4, wherein The exchange position, the falling position, the first safe position, and the second safe position are respectively located within the process chamber, and the first origin position and the second origin position are respectively located within the transmission chamber.

11. The wafer transfer control method according to Claim 1, wherein The signal indicating the completion of the wafer processing of the first wafer includes one or more of the following: a signal indicating the completion of the detection of the first wafer, a signal indicating that the wafer carrier has reached the exchange position, a signal indicating that the wafer carrier releases the first wafer, and a signal indicating that the number of scans of the first wafer has reached a preset threshold.

12. The wafer transfer control method as described in claim 1, characterized in that, The wafer processing technology includes ion implantation.

13. A wafer transfer control device, applied to semiconductor processing equipment, the semiconductor processing equipment comprising a transfer chamber and a process chamber, characterized in that, include: The first control unit is adapted to control the first robot in the transmission chamber to move to a preset exchange position when it receives a signal that the wafer processing process of the first wafer has been completed; and to control the first robot to grab the first wafer located on the wafer carrier tray in the process chamber and carry the first wafer to a preset first safe position. The second control unit is adapted to control the first robot in the transmission chamber to move to a preset exchange position while simultaneously controlling the second robot in the transmission chamber to move to a preset falling position, the falling position being spaced apart from the exchange position; it is also adapted to control the second robot to move to the exchange position and place the second wafer it carries onto the wafer carrier tray when a signal is received that the first robot has reached the first safe position.

14. The wafer transfer control apparatus of Claim 13, wherein The second control unit is also adapted to control the second robot to move to the exchange position, and after placing the second wafer it carries on the wafer carrier tray, control the second robot to move to a preset second safe position; The wafer transfer control device further includes a third control unit, adapted to control the process chamber to perform corresponding wafer processing processes on the second wafer when a signal is received that the second robot has reached the second safe position.

15. The wafer transfer control apparatus of Claim 14, wherein The semiconductor processing equipment also includes a loading chamber; The first control unit is further adapted to control the first robot to move to a first predetermined position in the loading chamber and place the first wafer it is carrying at the first predetermined position; control the first robot to move to a second predetermined position in the loading chamber and pick up a third wafer; control the first robot to carry the third wafer to an alignment platform in the transfer chamber and place the third wafer on the alignment platform; and control the first robot to move to a preset first origin position. The second control unit is further adapted to, after receiving a signal that the second robot has reached the second safe position, control the second robot to move to the alignment platform and pick up the third wafer; and control the second robot to carry the third wafer to a preset second origin position.

16. The wafer transfer control apparatus of Claim 15, wherein, The semiconductor processing equipment also includes a temperature processing chamber; The second control unit is further adapted to control the second robot to move the third wafer to a cooling / heating platform in a temperature processing chamber and place the third wafer on the cooling / heating platform after the second robot picks up the third wafer on the alignment platform and before the second robot returns to the second origin position with the third wafer; it is also adapted to control the second robot to pick up the third wafer and return to the second origin position with the third wafer. The wafer transfer control device further includes a fourth control unit, adapted to control the cooling / heating platform to heat or cool the third wafer after controlling the second robot to carry the third wafer to the cooling / heating platform in the temperature processing chamber and placing the third wafer on the cooling / heating platform.

17. A wafer processing system, characterized by, include: A wafer transfer control device and a semiconductor processing equipment, wherein the wafer transfer control device is configured to perform the wafer transfer control method as described in any one of claims 1 to 12.

18. An apparatus, comprising: include: At least one memory and at least one processor; The memory stores one or more computer-executable instructions, and the processor invokes the one or more computer-executable instructions to execute the wafer transfer control method as described in any one of claims 1 to 12.

19. A storage medium, characterized by The storage medium stores one or more computer-executable instructions, which are used to execute the wafer transfer control method as described in any one of claims 1 to 12.

20. A computer program product comprising computer programs / instructions, characterized in that, When the computer program / instructions are executed by the processor, they are used to implement the wafer transfer control method as described in any one of claims 1 to 12.

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