A die bonding table and a die bonder

Abstract

This invention relates to the field of die bonding machines, and discloses a die bonding station and a die bonding machine. The die bonding station has a first direction and includes a heating plate, temperature sensing elements, and a mounting base. The thickness direction of the heating plate extends along the first direction, and the heating plate has at least two heating zones, each of which can be heated independently. All heating zones are spliced ​​together to form a support area, which is used to support the substrate. There are multiple temperature sensing elements, and each heating zone is connected to at least one temperature sensing element. In the die bonding station of this application, during the chip mounting process, the substrate is placed on the support area, and each heating zone performs temperature compensation based on the temperature difference detected by the temperature sensing element, so that the heating temperature of each heating zone is consistent. As a result, the temperature of the center and edge of the substrate is balanced, and the die bonding station has good heating uniformity of the substrate, which can ensure the chip mounting quality.

Description

Technical Field

[0001] This invention belongs to the field of die bonders, and more specifically, relates to a die bonder and a die bonder. Background Technology

[0002] The die bonder is a component of a die bonder, and its function is to support the substrate for chip mounting. In related technologies, die bonders often use a whole-area heating method, that is, the die bonder has only a single heating area, and the substrate is placed in the center of this heating area for heating during the die bonding operation. This method of heating the substrate through a single heating area can easily cause uneven temperature between the center and the edge of the substrate, resulting in poor heating uniformity. Summary of the Invention

[0003] The main objective of this invention is to provide a die bonding stage with good heating uniformity.

[0004] According to a first aspect of the present invention, a die bonding stage is provided, having a first orientation, and including a heating plate, a temperature sensing element, and a mounting base;

[0005] The thickness direction of the heating plate extends along the first direction, and the heating plate has at least two heating zones, each of which can be heated independently. All the heating zones are spliced ​​together to form a bearing area, which is used to support the substrate.

[0006] The number of temperature sensing elements is multiple, and each heating zone is connected to at least one temperature sensing element;

[0007] The mounting base has a groove, an air intake channel, and an exhaust channel. The depth direction of the groove extends along the first direction, and both the air intake channel and the exhaust channel are connected to the groove.

[0008] The heating plate is fixedly connected to the mounting base along the first direction and covers the opening of the groove. The orthographic projection of the bearing area along the first direction is located on the bottom surface of the groove. The number of air intake channels is adapted to the number of heating zones. The communication opening between the air intake channel and the groove is located on the bottom surface of the groove. The air intake channel and the heating zone are arranged in a one-to-one correspondence. The air intake channel is used to input cooling gas into the groove to cool the corresponding heating zone. The exhaust channel is used to discharge gas from the groove.

[0009] In a specific embodiment of the present invention, the communication port between the exhaust channel and the groove is located on the bottom surface of the groove, and the exhaust channel is located between the plurality of intake channels.

[0010] In a specific embodiment of the present invention, the mounting base further has a protective gas channel, the outlet end of the protective gas channel is located on the side of the mounting base facing the heating plate, and the outlet end of the protective gas channel is located outside the groove.

[0011] The die bonding stage further includes a cover plate, which is fixedly connected to the mounting base along the first direction. The cover plate and the heating plate are located on the same side of the mounting base. The side of the cover plate facing the mounting base has a receiving groove. The bottom surface of the receiving groove is provided with a clearance hole that penetrates the cover plate. The side wall of the receiving groove has a first vent groove. The end of the first vent groove near the mounting base is open. The bottom surface of the receiving groove is provided with a second vent groove that communicates with the first vent groove along the first direction. The second vent groove communicates with the clearance hole.

[0012] The heating plate is located in the receiving groove. The end of the heating plate near the first vent groove is the first end. The first end is in contact with the side wall of the receiving groove, and the first end, the groove wall of the first vent groove, and the groove wall of the second vent groove form an air outlet channel. The air inlet end of the air outlet channel is connected to the air outlet end of the protective gas channel, and the air outlet end of the air outlet channel is located on the upper side of the heating plate.

[0013] In a specific embodiment of the present invention, the heating plate is provided with air outlet channels on both opposite sides, and each air outlet channel is connected to a protective gas channel.

[0014] In a specific embodiment of the present invention, the sidewall of the receiving groove further has a mounting through hole, through which the temperature measuring element passes.

[0015] In a specific embodiment of the present invention, the die bonding station further includes a spacer and mounting bolts, the spacer being annular and the number of mounting bolts being plurality of;

[0016] The cover plate is fixedly connected to the mounting base by a plurality of mounting bolts. A gasket is provided between the cover plate and the mounting base. The outlet end of the protective gas channel and the groove are located inside the gasket.

[0017] In one particular embodiment of the present invention, the heating plate has adsorption through holes extending along its thickness direction, the adsorption through holes being located between all the heating zones;

[0018] The mounting base also has an adsorption channel, and the bottom surface of the groove has a connecting protrusion. The connecting protrusion contacts the heating plate, and the adsorption channel passes through the connecting protrusion and communicates with the adsorption through hole.

[0019] In a specific embodiment of the present invention, the mounting base includes a fixed sub-base and a connecting sub-base, the fixed sub-base and the connecting sub-base are arranged along the first direction, and the mounting bolts fix the cover plate, the connecting sub-base and the fixed sub-base, wherein the fixed sub-base is located on the side of the connecting sub-base away from the cover plate, the connecting sub-base has the groove, the air inlet channel, the air outlet channel, the protective gas channel and the adsorption channel pass through the fixed sub-base and the connecting sub-base, and the air inlet end of the air inlet channel, the air outlet end of the air outlet channel, the air inlet end of the protective gas channel and the air inlet end of the adsorption channel are all provided on the fixed sub-base.

[0020] In a specific embodiment of the present invention, the die bonding stage further includes a gas pipe connector, and the gas pipe connector is connected to the gas inlet end of the gas inlet channel, the gas outlet end of the gas exhaust channel, the gas inlet end of the protective gas channel, and the gas inlet end of the adsorption channel.

[0021] The present invention also proposes a die bonder, including the die bonder stage as described above.

[0022] One of the above-described technical solutions of the present invention has at least one of the following advantages or beneficial effects:

[0023] 1. The die bonding stage of this application has a heating plate with at least two heating zones, each of which can be heated independently, and all heating zones are spliced ​​together to form a carrier area. During the chip mounting process, the substrate is placed on the carrier area, and each heating zone performs temperature compensation according to the temperature difference detected by the temperature sensing element to make the heating temperature of each heating zone consistent. As a result, the temperature of the center and edge of the substrate is balanced, the die bonding stage has good heating uniformity of the substrate, and can ensure the chip mounting quality.

[0024] The mounting base also has a groove, an air inlet channel, and an exhaust channel. The air inlet channel and the exhaust channel are connected to the groove. The heating plate covers the groove, and each heating zone is provided with an air inlet channel. Thus, after the chip mounting work of a single substrate is completed, cooling gas is input into the groove through the air inlet channel to cool down each heating zone, remove residual heat, and avoid residual heat affecting the chip mounting quality of the next substrate. The gas input through the air inlet channel carries away the heat of the heating plate and is output through the exhaust channel.

[0025] 2. The exhaust channel is located between multiple intake channels, which is conducive to the discharge of gas.

[0026] 3. The exhaust gas channel is connected to the protective gas channel. Protective gas is output from the protective gas channel to the exhaust gas channel. The protective gas is output through the exhaust gas channel. The output end of the exhaust gas channel is located on the upper side of the heating plate. Therefore, a protective gas atmosphere can be formed on the upper side of the heating plate to ensure the smooth progress of chip mounting on the substrate.

[0027] The protective gas channel is located on the outside of the groove. The protective gas channel and the air intake channel are independent of each other. The cooling gas and the protective gas do not cross-flow. The heating plate is cooled down by the cooling gas without affecting the protective gas atmosphere. The protective gas atmosphere is stable, which is beneficial for the chip mounting work on the substrate.

[0028] 4. Gas outlet channels are provided on both sides of the heating plate, so that protective gas is delivered from both sides of the heating plate towards the center, which helps to quickly form a protective gas atmosphere and improve the placement efficiency.

[0029] 5. The installation through-hole facilitates the arrangement of temperature sensing elements, and the structure is simple and reliable.

[0030] 6. The cover plate is fixedly connected to the mounting base by mounting bolts. Therefore, the gasket can prevent the mounting bolts from loosening, and the structure is reliable.

[0031] 7. The adsorption channel and the adsorption through hole are connected. By evacuating the air through the adsorption channel and the adsorption through hole, the substrate can be adsorbed and fixed on the heating plate, ensuring the smooth progress of chip mounting on the substrate.

[0032] 8. The mounting base includes a fixed sub-base and a connecting sub-base. The fixed sub-base and the connecting sub-base are fixedly connected by mounting bolts. The structure is simple and easy to install. In this type of mounting base, the air intake channel, exhaust channel, protective gas channel and adsorption channel are all composed of two sections, one of which is located on the fixed sub-base and the other of which is located on the connecting sub-base, which is convenient for processing.

[0033] 9. The air inlet end of the air inlet channel, the air outlet end of the exhaust channel, the air inlet end of the protective gas channel, and the air inlet end of the adsorption channel are all located on the fixed base. The air inlet end of the air inlet channel, the air outlet end of the exhaust channel, the air inlet end of the protective gas channel, and the air inlet end of the adsorption channel are all connected to the air pipe connector. That is, the air pipe connector is connected to the fixed base. The structure is simple and the installation is convenient. Attached Figure Description

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0035] Figure 1 This is a structural diagram of the die-bonding stage according to an embodiment of the present invention;

[0036] Figure 2 This is an exploded view of the die-bonding stage according to an embodiment of the present invention;

[0037] Figure 3 This is an embodiment of the present invention. Figure 2 Enlarged diagram of A in the middle;

[0038] Figure 4 This is a structural diagram of the fixed sub-base according to an embodiment of the present invention;

[0039] Figure 5 This is a structural diagram of the connecting sub-base according to an embodiment of the present invention;

[0040] Figure 6 This is a structural diagram of the heating plate and temperature sensing element in an embodiment of the present invention;

[0041] Figure 7 This is a top view of the die bonding stage according to an embodiment of the present invention;

[0042] Figure 8 This is an embodiment of the present invention. Figure 7 Cross-sectional view of the middle HH structure;

[0043] Figure 9 This is an embodiment of the present invention. Figure 8 Enlarged diagram of B in the diagram.

[0044] The figure labels for each figure are as follows:

[0045] 1. Heating plate; 101. Adsorption through-hole;

[0046] 2. Temperature sensing element;

[0047] 3. Mounting base; 301. Groove; 302. Air intake channel; 303. Exhaust channel; 304. Protective gas channel; 305. Adsorption channel; 3A. Connecting protrusion; 31. Fixing sub-base; 32. Connecting sub-base;

[0048] 4. Cover plate; 401. Receiving groove; 402. Clearance hole; 403. First vent groove; 404. Second vent groove; 405. Mounting through hole;

[0049] 5. Gaskets;

[0050] 6. Install bolts;

[0051] 7. Air tube connector;

[0052] 100. Heating zone; 200. Air outlet channel;

[0053] X, the first direction. Detailed Implementation

[0054] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0055] This invention proposes a die bonder, which includes a die bonder platform. The die bonder platform serves to support a substrate for chip mounting. Since the die bonder includes a die bonder platform, it also has the advantages of a die bonder platform. This application will not elaborate further on this point.

[0056] Reference Figures 1 to 9 As shown, a preferred embodiment of this application provides a die bonding stage with a first direction X, including a heating plate 1, temperature sensing elements 2, and a mounting base 3. The thickness direction of the heating plate 1 extends along the first direction X, and the heating plate 1 has at least two heating zones 100, each of which can be heated independently. All heating zones 100 are spliced ​​together to form a support area, which is used to support the substrate. The number of temperature sensing elements 2 is multiple, and at least one temperature sensing element 2 is connected to each heating zone 100. The mounting base 3 has a groove 301, an air inlet channel 302, and an exhaust channel 303. The depth direction of the groove 301 extends along the first direction X, and the air inlet channel 302 and the exhaust channel 303 are connected to each other. All exhaust channels 303 are connected to the grooves 301; wherein, the heating plate 1 is fixedly connected to the mounting base 3 along the first direction X, and the heating plate 1 covers the groove opening of the groove 301. The orthographic projection of the bearing area along the first direction X is located on the bottom surface of the groove 301. The number of air intake channels 302 is adapted to the number of heating zones 100. The connection between the air intake channel 302 and the groove 301 is located on the bottom surface of the groove 301. The air intake channels 302 and the heating zones 100 are set in a one-to-one correspondence. The air intake channel 302 is used to input cooling gas into the groove 301 to cool the corresponding heating zone 100. The exhaust channel 303 is used to discharge the gas in the groove 301. The die bonding stage of this application has a heating plate 1 with at least two heating zones 100, each of which can be heated independently. All heating zones 100 are spliced ​​together to form a carrier area. During the chip mounting process, the substrate is placed on the carrier area. Each heating zone 100 performs temperature compensation based on the temperature difference detected by the temperature sensing element 2, so that the heating temperature of each heating zone 100 is consistent. As a result, the temperature of the center and edge of the substrate is balanced, the die bonding stage has good heating uniformity of the substrate, and can ensure the chip mounting quality.

[0057] The mounting base 3 also has a groove 301, an air inlet channel 302, and an exhaust channel 303. The air inlet channel 302 and the exhaust channel 303 are both connected to the groove 301. The heating plate 1 covers the groove 301. Each heating zone 100 is provided with an air inlet channel 302. Thus, after the chip mounting work of a single substrate is completed, cooling gas is input into the groove 301 through the air inlet channel 302, which can cool down each heating zone 100 to remove residual heat and avoid residual heat affecting the chip mounting quality of the next substrate. The gas input through the air inlet channel 302 carries away the heat of the heating plate 1 and is output from the exhaust channel 303.

[0058] For example, there are four heating zones 100, which are rectangular in shape and joined together to form a rectangular load-bearing area. The temperature sensing element 2 is a thermocouple, and the number of thermocouples connected to a single heating zone 100 can be two, three, or more. The temperature sensing element 2 can also be other temperature sensing components known to those skilled in the art, and this application does not limit this. Multiple electric heating wires are provided inside the heating plate 1, and one or more electric heating wires form a heating zone 100, which depends on the actual application, and this application does not limit this. There are four air intake channels 302, which are arranged one-to-one with the heating zones 100. The four air intake channels 302 are connected in pairs, that is, every two air intake channels 302 share one air intake end.

[0059] In this embodiment, the connection between the exhaust channel 303 and the groove 301 is located on the bottom surface of the groove 301, and the exhaust channel 303 is located among multiple air intake channels 302. The arrangement of the exhaust channel 303 is conducive to gas discharge. Specifically, there is one exhaust channel 303, which has two air intakes located among four air intake channels 302.

[0060] In this embodiment, the mounting base 3 also has a protective gas channel 304, the outlet of which is located on the side of the mounting base 3 facing the heating plate 1, and the outlet of the protective gas channel 304 is located outside the groove 301; the die bonding stage also includes a cover plate 4, which is fixedly connected to the mounting base 3 along the first direction X, and the cover plate 4 and the heating plate 1 are located on the same side of the mounting base 3. The side of the cover plate 4 facing the mounting base 3 has a receiving groove 401, the bottom surface of the receiving groove 401 is provided with a clearance hole 402 penetrating the cover plate 4, and the side wall of the receiving groove 401 has a first vent groove 403, which is close to the mounting base 3. One end of the seat 3 is open. The bottom surface of the receiving groove 401 is provided with a second venting groove 404 that communicates with the first venting groove 403 along the first direction X. The second venting groove 404 is also connected to the clearance hole 402. The heating plate 1 is located inside the receiving groove 401. The end of the heating plate 1 that is close to the first venting groove 403 is the first end. The first end is in contact with the side wall of the receiving groove 401. The first end, the groove wall of the first venting groove 403, and the groove wall of the second venting groove 404 form an air outlet channel 200. The air inlet end of the air outlet channel 200 is connected to the air outlet end of the protective gas channel 304. The air outlet end of the air outlet channel 200 is located on the upper side of the heating plate 1. Specifically, during the chip mounting process, protective gas is output from the protective gas channel 304 to the exhaust channel 200. The protective gas is output through the exhaust channel 200, and the output end of the exhaust channel 200 is located on the upper side of the heating plate 1. Therefore, a protective gas atmosphere can be formed on the upper side of the heating plate 1 to ensure the smooth progress of the chip mounting process on the substrate. The protective gas channel 304 is located on the outer side of the groove 301. The protective gas channel 304 and the intake channel 302 are independent of each other. The cooling gas and the protective gas do not cross-flow. The cooling of the heating plate 1 by the cooling gas will not affect the protective gas atmosphere. The protective gas atmosphere is stable, which is beneficial to the chip mounting process on the substrate.

[0061] In this embodiment, air outlet channels 200 are provided on both opposite sides of the heating plate 1. That is, both opposite ends of the heating plate 1 are first ends. The groove wall surface of the receiving groove 401 near the first end is provided with a first venting groove 403. The bottom surface of the receiving groove 401 is provided with a second venting groove 404 corresponding to the first venting groove 403. The first venting groove 403, the second venting groove 404 and the corresponding first end are provided to form an air outlet channel 200. Thus, protective gas is transported from both sides of the heating plate 1 toward the center, which is conducive to quickly forming a protective gas atmosphere and improving mounting efficiency.

[0062] In this embodiment, the sidewall of the receiving groove 401 also has a mounting through hole 405. The temperature measuring element 2 passes through the mounting through hole 405. The mounting through hole 405 facilitates the arrangement of the temperature measuring element 2 and has a simple and reliable structure. Specifically, the cover plate 4 is rectangular. Thus, the cover plate 4 has mounting through holes 405 on opposite sides and the other two sides have the aforementioned first vent groove 403 and second vent groove 404. The temperature measuring element 2 connected to two of the heating zones 100 passes through the mounting through hole 405 on one side of the cover plate 4, and the temperature measuring element 2 connected to the other two heating zones 100 passes through the mounting through hole 405 on the other side of the cover plate 4.

[0063] In this embodiment, the die bonding stage also includes a gasket 5 and mounting bolts 6. The gasket 5 is annular, and there are multiple mounting bolts 6. The cover plate 4 is fixedly connected to the mounting base 3 by multiple mounting bolts 6. A gasket 5 is provided between the cover plate 4 and the mounting base 3, and the outlet end of the protective gas channel 304 and the groove 301 are located inside the gasket 5. Specifically, the cover plate 4 is fixedly connected to the mounting base 3 by mounting bolts 6. Thus, the gasket 5 can prevent the mounting bolts 6 from loosening, and the structure is reliable.

[0064] For example, the number of mounting bolts 6 is four, and the four mounting bolts 6 are respectively connected to the four corners of the cover plate 4. In other embodiments, the number of mounting bolts 6 may be six, eight or more, and this application does not limit this.

[0065] In this embodiment, the heating plate 1 has adsorption through holes 101 extending along its thickness direction. The adsorption through holes 101 are located between all heating zones 100, effectively adsorbing the substrate, and each heating zone 100 can contact the substrate, thereby achieving temperature uniformity between the center and edge of the substrate. The mounting base 3 also has an adsorption channel 305. The bottom surface of the groove 301 has a connecting protrusion 3A, which contacts the heating plate 1. The adsorption channel 305 passes through the connecting protrusion 3A and communicates with the adsorption through holes 101. During the chip mounting process, the substrate can be adsorbed and fixed on the heating plate 1 by evacuating air through the adsorption channel 305 and the adsorption through holes 101, ensuring the smooth progress of the chip mounting process.

[0066] In this embodiment, the mounting base 3 includes a fixed sub-base 31 and a connecting sub-base 32. The fixed sub-base 31 and the connecting sub-base 32 are arranged along the first direction X. The mounting bolts 6 fix the connecting cover plate 4, the connecting sub-base 32 and the fixed sub-base 31. The fixed sub-base 31 is located on the side of the connecting sub-base 32 away from the cover plate 4. The connecting sub-base 32 has a groove 301. An air inlet channel 302, an exhaust channel 303, a protective gas channel 304 and an adsorption channel 305 pass through the fixed sub-base 31 and the connecting sub-base 32. The air inlet end of the air inlet channel 302, the air outlet end of the exhaust channel 303, the air inlet end of the protective gas channel 304 and the air inlet end of the adsorption channel 305 are all provided on the fixed sub-base 31. Specifically, the fixed sub-base 31 and the connecting sub-base 32 are fixedly connected by mounting bolts 6, which is simple in structure and easy to install. The mounting base 3 of this structure consists of two sections for the air intake channel 302, the exhaust channel 303, the protective gas channel 304 and the adsorption channel 305. One section is located on the fixed sub-base 31 and the other section is located on the connecting sub-base 32, which is convenient for processing.

[0067] In this embodiment, the die bonding stage also includes a gas pipe connector 7. The gas pipe connector 7 is sealed to the gas inlet end of the gas inlet channel 302, the gas outlet end of the gas outlet channel 303, the gas inlet end of the protective gas channel 304, and the gas inlet end of the adsorption channel 305. In practical applications, the gas pipe is connected to the gas pipe through the gas pipe connector 7. That is, the gas pipe connector 7 is connected to the fixing base 31, which has a simple structure.

[0068] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A die-bonding stage having a first direction (X), characterized in that, It includes a heating plate (1), a temperature sensing element (2), and a mounting base (3); The thickness direction of the heating plate (1) extends along the first direction (X). The heating plate (1) has at least two heating zones (100). Each heating zone (100) can be heated independently. All the heating zones (100) are spliced ​​together to form a bearing area, which is used to support the substrate. The number of temperature measuring elements (2) is multiple, and each heating zone (100) is connected to at least one temperature measuring element (2). The mounting base (3) has a groove (301), an air intake channel (302) and an exhaust channel (303). The depth direction of the groove (301) extends along the first direction (X). The air intake channel (302) and the exhaust channel (303) are both connected to the groove (301). The heating plate (1) is fixedly connected to the mounting base (3) along the first direction (X), and the heating plate (1) covers the groove (301). The orthographic projection of the bearing area along the first direction (X) is located on the bottom surface of the groove (301). The number of air intake channels (302) is adapted to the number of heating zones (100). The communication port between the air intake channel (302) and the groove (301) is located on the bottom surface of the groove (301). The air intake channel (302) and the heating zone (100) are arranged in a one-to-one correspondence. The air intake channel (302) is used to input cooling gas into the groove (301) to cool the corresponding heating zone (100). The exhaust channel (303) is used to discharge gas from the groove (301).

2. The die bonding stage according to claim 1, characterized in that, The connection between the exhaust channel (303) and the groove (301) is located on the bottom surface of the groove (301), and the exhaust channel (303) is located between the plurality of intake channels (302).

3. The die bonding stage according to claim 1, characterized in that, The mounting base (3) also has a protective gas channel (304), the gas outlet of the protective gas channel (304) is located on the side of the mounting base (3) facing the heating plate (1), and the gas outlet of the protective gas channel (304) is located outside the groove (301). The die bonding station also includes a cover plate (4), which is fixedly connected to the mounting base (3) along the first direction (X). The cover plate (4) and the heating plate (1) are located on the same side of the mounting base (3). The side of the cover plate (4) facing the mounting base (3) has a receiving groove (401). The bottom surface of the receiving groove (401) is provided with a clearance hole (402) that penetrates the cover plate (4). The side wall of the receiving groove (401) has a first vent groove (403). The first vent groove (403) is open at one end near the mounting base (3). The bottom surface of the receiving groove (401) is provided with a second vent groove (404) that communicates with the first vent groove (403) along the first direction (X). The second vent groove (404) communicates with the clearance hole (402). The heating plate (1) is located in the receiving groove (401). The end of the heating plate (1) near the first ventilation groove (403) is the first end. The first end is in contact with the side wall of the receiving groove (401). The first end, the groove wall of the first ventilation groove (403), and the groove wall of the second ventilation groove (404) form an air outlet channel (200). The air inlet of the air outlet channel (200) is connected to the air outlet of the protective gas channel (304). The air outlet of the air outlet channel (200) is located on the upper side of the heating plate (1).

4. The die bonding stage according to claim 3, characterized in that, The heating plate (1) is provided with air outlet channels (200) on both sides, and each air outlet channel (200) is connected to a protective gas channel (304).

5. The die bonding stage according to claim 3, characterized in that, The sidewall of the receiving groove (401) also has a mounting through hole (405), through which the temperature measuring element (2) passes.

6. The die bonding stage according to claim 3, characterized in that, The die bonding station also includes a gasket (5) and mounting bolts (6), the gasket (5) being annular and the mounting bolts (6) being multiple in number; The cover plate (4) is fixedly connected to the mounting base (3) by a plurality of mounting bolts (6). The gasket (5) is provided between the cover plate (4) and the mounting base (3). The outlet end of the protective gas channel (304) and the groove (301) are located inside the gasket (5).

7. The die bonding stage according to claim 6, characterized in that, The heating plate (1) has adsorption through holes (101) extending along its thickness direction, the adsorption through holes (101) being located between all the heating zones (100); The mounting base (3) also has an adsorption channel (305), and the bottom surface of the groove (301) has a connecting protrusion (3A). The connecting protrusion (3A) contacts the heating plate (1), and the adsorption channel (305) passes through the connecting protrusion (3A) and communicates with the adsorption through hole (101).

8. The die bonding stage according to claim 7, characterized in that, The mounting base (3) includes a fixed sub-base (31) and a connecting sub-base (32). The fixed sub-base (31) and the connecting sub-base (32) are arranged along the first direction (X). The mounting bolt (6) fixes the cover plate (4), the connecting sub-base (32) and the fixed sub-base (31). The fixed sub-base (31) is located on the side of the connecting sub-base (32) away from the cover plate (4). The connecting sub-base (32) has the groove (301). The air inlet channel (302), the exhaust channel (303), the protective gas channel (304) and the adsorption channel (305) pass through the fixed sub-base (31) and the connecting sub-base (32). The air inlet end of the air inlet channel (302), the air outlet end of the exhaust channel (303), the air inlet end of the protective gas channel (304) and the air inlet end of the adsorption channel (305) are all located on the fixed sub-base (31).

9. The die bonding stage according to claim 8, characterized in that, The die bonding stage also includes a gas pipe connector (7), and the gas pipe connector (7) is connected to the gas inlet end of the gas inlet channel (302), the gas outlet end of the gas outlet channel (303), the gas inlet end of the protective gas channel (304), and the gas inlet end of the adsorption channel (305).

10. A die bonder, characterized in that, Includes the die bonding stage as described in any one of claims 1-9.

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