A heating chamber and a heating assembly thereof

Abstract

The application discloses a heating chamber and a heating assembly thereof, the heating assembly comprising a light-reflecting cover composed of a bottom plate and a peripheral wall extending along a peripheral edge of the bottom plate, a plurality of heating lamps being arranged in an inner cavity of the light-reflecting cover; the inner cavity is divided into a first reflection zone and a second reflection zone by an annular baffle, and the plurality of heating lamps are divided into an outer ring lamp array located in the first reflection zone and an inner ring lamp array located in the second reflection zone; a plurality of reflection arc surfaces are arranged in the first reflection zone and the second reflection zone, the normal lines of the concave sides of the reflection arc surfaces respectively pointing towards the corresponding outer ring lamp array or inner ring lamp array, and the reflection arc surfaces are used for reflecting and concentrating the light emitted by the corresponding lamp array on a to-be-heated piece below the heating lamps. Through the zoning arrangement of the inner cavity and the arrangement of the plurality of reflection arc surfaces, the reflection path of the light emitted by the heating lamps is optimized, the light emitted by the heating lamps is more concentratedly guided to the to-be-heated piece after one or more reflections, and the heating efficiency and the heating uniformity of the to-be-heated piece are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, and in particular to a heating chamber and its heating assembly. Background Technology

[0002] In semiconductor manufacturing, PVD (Physical Vapor Deposition) equipment is the core equipment for achieving high-precision thin film deposition. It uses physical means to vaporize the target material into atoms or ions, which are then deposited onto the wafer surface in a vacuum environment to form key structures such as metal electrodes, interconnect layers, and barrier layers. Before the wafer enters the process chamber, it typically undergoes a degassing process. Its core function is to remove adsorbed gases (such as H2O, O2, CO2) and impurities from the wafer surface through heating and a vacuum environment. This prevents the formation of pores, delamination, or contamination during deposition, thereby improving the purity, uniformity, and adhesion of the deposited thin film.

[0003] Infrared radiation heating is a common heating method used in degassing processes, and the uniformity and rate of wafer heating are the main considerations for the design of the heating device. Chinese patent document CN103839854A discloses a semiconductor processing equipment and its degassing chamber and heating assembly. The heating assembly has a centrally located planar portion and an arc-shaped edge connected to the circumferential edge of the planar portion. Multiple heated bulbs are disposed on the inner surface of the planar portion. The assembly can reflect the light from the bulbs through the planar portion and the arc-shaped edge, effectively reflecting the energy emitted by the heated bulbs into the degassing chamber. This increases the light energy reaching the substrate within the degassing chamber, allowing the substrate to reach the processing temperature more quickly, thereby improving the wafer heating rate. In the above technical solution, although the arc-shaped edge concentrates the light energy from the heated bulbs, the planar portion has limited reflective concentration effect on the heated light, resulting in some reflected light horizontally scattering and energy loss from the heated bulbs.

[0004] Chinese patent document CN107437515A discloses a heating chamber and semiconductor processing equipment. The heating lamp within the heating chamber employs an adjustable bulb height structure, with the vertical distance between the lamp and the substrate gradually decreasing from the inner layer to the outer layer. This aims to ensure that the heat radiated to different areas of the wafer is more uniform, thus improving the uniformity of the wafer's heating temperature. While this technical solution adjusts the radiation intensity of light in different areas of the wafer by controlling the radiation distance of the heating lamp, which can improve the uniformity of the wafer's heating temperature to some extent, adjusting the distance between the heating lamp and the workpiece means that the energy of the heating lamp is not fully utilized, reducing the energy efficiency of the heating lamp. Summary of the Invention

[0005] The purpose of this invention is to provide a heating chamber and its heating assembly, which improves the energy utilization rate of the heating lamp, improves the heating efficiency and heating uniformity of the heated part, and reduces the energy consumption of the heating assembly.

[0006] To solve the above-mentioned technical problems, the embodiments of the present invention provide a technical solution as follows: a heating assembly, comprising: a reflector, including a base plate and a peripheral wall extending along the circumferential edge of the base plate, the base plate and the peripheral wall forming an inner cavity; a plurality of heating lamps disposed within the inner cavity; an annular baffle disposed on the inner side of the base plate, the annular baffle dividing the inner cavity into a first reflection zone and a second reflection zone, and dividing the plurality of heating lamps into an outer ring lamp array located in the first reflection zone and an inner ring lamp array located in the second reflection zone; both the first reflection zone and the second reflection zone are provided with a plurality of reflective arc surfaces, the concave side normals of the reflective arc surfaces respectively facing the corresponding outer ring lamp array or inner ring lamp array, the reflective arc surfaces being used to reflect and concentrate the light emitted by the corresponding lamp array onto the component to be heated below the heating lamp.

[0007] Furthermore, a first reflective arc surface is provided on the inner side of the peripheral wall, and the first reflective arc surface is located above the light emission center of the outer ring lamp array; the first reflective arc surface is used to concentrate part of the light emitted by the outer ring lamp array toward the peripheral wall to the edge area of ​​the surface of the workpiece to be heated after one reflection, and the edge area is the area that is no more than 1 / 3 of the radius of the outer periphery of the workpiece to be heated.

[0008] Furthermore, the longitudinal section of the first reflective arc surface is a first circular arc, the radius of the first circular arc is (14±5)mm, and the central angle of the first circular arc is not greater than 30°.

[0009] Furthermore, the annular baffle is provided with a third reflective arc surface facing the outer ring light array. The third reflective arc surface is located above the inner side of the light emission center of the outer ring light array. The third reflective arc surface is used to concentrate part of the light emitted by the outer ring light array towards the annular baffle to the edge area of ​​the surface of the workpiece to be heated after one reflection. The edge area is the area that is no more than 1 / 3 of the radius of the outer periphery of the workpiece to be heated.

[0010] Furthermore, the longitudinal section of the third reflective arc surface is a third circular arc, the third circular arc is tangent to the inner reference plane of the base plate, the radius of the third circular arc is (45±5)mm, and the central angle of the third circular arc is (30±5)°.

[0011] Furthermore, the annular baffle is provided with a sixth reflective arc surface facing the inner ring light array. The sixth reflective arc surface is located above and outside the light emission center of the inner ring light array. The sixth reflective arc surface is used to concentrate part of the light emitted by the inner ring light array toward the annular baffle to the central area of ​​the surface of the workpiece to be heated after one reflection. The central area is the area no more than 2 / 3 of the radius of the surface of the workpiece to be heated.

[0012] Furthermore, the longitudinal section of the sixth reflective arc surface is a sixth circular arc, the sixth circular arc is tangent to the inner reference plane of the base plate, the radius of the sixth circular arc is (50±5)mm, and the central angle of the sixth circular arc is (26±5)°.

[0013] Furthermore, the second reflective area is provided with a reflective cone, which is a conical structure. The tip of the reflective cone faces the opening direction of the reflector. The conical surface of the reflective cone forms a seventh reflective arc surface facing the inner ring lamp array. The concave side normal of the seventh reflective arc surface faces the inner ring lamp array. The seventh reflective arc surface is used to reflect and concentrate the light from the inner ring lamp array and the light reflected by the annular baffle to the central area of ​​the surface of the workpiece to be heated. The central area is the area no more than 2 / 3 of the radius of the surface of the workpiece to be heated.

[0014] Furthermore, the longitudinal section of the seventh reflective arc surface yields a seventh circular arc symmetrically arranged relative to the central axis of the reflective cone, the radius of the seventh circular arc is (75±5) mm, and the central angle of the seventh circular arc is (50±5)°.

[0015] Furthermore, the annular baffle is provided with a fifth reflective arc surface facing the inner ring light array, and the fifth reflective arc surface is used to reflect part of the light rays from the inner ring light array that are directed toward the annular baffle to the seventh reflective arc surface.

[0016] To solve the above-mentioned technical problems, the present invention also provides a heating chamber, including a vacuum chamber for loading a component to be heated, wherein one end of the vacuum chamber is provided with a heating component as described in any of the above claims, the heating component is isolated from the vacuum chamber by a radiation window, and the heating component radiates heat to the component to be heated by penetrating the radiation window through radiation light.

[0017] The heating chamber and heating assembly provided by this invention, compared with the prior art, improve heating efficiency and reduce energy consumption by setting multiple reflective arc surfaces inside the reflector, allowing the light emitted by the heating lamp to be more concentratedly guided to the workpiece after one or more reflections. This reduces horizontal dispersion of the heating lamp light after reflection and increases the light energy focused on the workpiece. Simultaneously, by setting the first reflective area to correspond to the outer ring lamp array and the second reflective area to correspond to the inner ring lamp array, the light transmission path is optimized, resulting in a better arrangement of the light focused on the workpiece, which improves the uniformity of the surface temperature of the workpiece. The reflective arc surfaces, compared to planar reflection, also effectively shorten the transmission path of reflected light, reducing energy loss during transmission and further improving heating efficiency. In particular, by guiding the reflection path of the radiated light from the heating lamp using different reflective arc surfaces, customized reflective light paths are provided for the edge and center areas of the workpiece, improving heating efficiency while ensuring the uniformity of the workpiece's temperature rise. Attached Figure Description

[0018] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings represent similar elements. Unless otherwise stated, the figures in the drawings do not constitute a limitation on scale.

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the reflector from the lower viewpoint in an embodiment of the present invention; Figure 2 This is a three-dimensional structural diagram of the reflector from the perspective of an embodiment of the present invention; Figure 3 This is a bottom view of the reflector in an embodiment of the present invention; Figure 4 This is a top view of the reflector in an embodiment of the present invention; Figure 5 For the appendix Figure 4 Schematic diagram of the AA section; Figure 6 This is a schematic diagram of the distribution of the outer and inner ring light arrays in an embodiment of the present invention; Figure 7 This is a schematic diagram of the combination of the heating component and the element to be heated in an embodiment of the present invention; Figure 8 This is a schematic diagram of the reflection path of the first reflecting arc surface in an embodiment of the present invention; Figure 9 This is a schematic diagram of the reflection path of the third reflecting arc surface in an embodiment of the present invention; Figure 10 This is a schematic diagram of the reflection path of the sixth reflecting arc surface in an embodiment of the present invention; Figure 11This is a schematic diagram of the reflection path of the seventh reflecting arc surface in an embodiment of the present invention; Figure 12 This is a schematic diagram of the reflection path of the fifth reflecting arc surface in an embodiment of the present invention; Figure 13 This is a schematic cross-sectional view of the heating chamber in an embodiment of the present invention.

[0020] Explanation of reference numerals in the attached drawings: 10, reflector; 100, inner cavity; 101, first reflective zone; 102, second reflective zone; 11, base plate; 12, peripheral wall; 13, mounting hole; 14, reference plane; 20, heating lamp; 21, outer ring lamp array; 22, inner ring lamp array; 201, bulb; 31, first reflective arc surface; 311, first arc; 32, second reflective arc surface; 321, second arc; 33, third reflective arc surface; 331, third arc; 34, fourth reflective arc surface; 341, fourth arc; 35, fifth reflective arc surface; 351, fifth arc; 36, sixth reflective arc surface; 361, sixth arc; 37, seventh reflective arc surface; 371, seventh arc; 38, eighth reflective surface; 40, annular baffle; 50, reflective cone; 60, component to be heated; 70, vacuum chamber; 71, radiation window. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the various embodiments of this invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this invention to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0022] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0023] like Figure 1-7As shown, one embodiment of the present invention relates to a heating assembly, including a reflector 10 and a plurality of heating lamps 20 detachably and fixedly connected to the reflector 10. The reflector 10 includes a base plate 11 and a peripheral wall 12 extending along the circumferential edge of the base plate 11. The space formed by the peripheral wall 12 and the base plate 11 is the inner cavity 100 of the reflector 10. The plurality of heating lamps 20 are arranged in a circular array in the inner cavity 100, and the heating assembly is centrally symmetrical. The base plate 11 is provided with mounting holes 13 corresponding to the heating lamps 20. The base of the heating lamp 20 is detachably fixed to the base plate 11 through the mounting holes 13. The bulb 201 of the heating lamp 20 is housed in the inner cavity 100. The opening of the reflector 10 is a light outlet. A component 60 to be heated is provided below the heating lamp 20. That is, the light emitted by the bulb 201 of the heating lamp 20 can be focused on the component 60 to be heated through the opening of the reflector 10, thereby achieving heating. Heating of the component 60 to be heated; preferably, an annular baffle 40 is provided on the inner side of the base plate 11, the annular baffle 40 divides the inner cavity 100 into a first reflective area 101 and a second reflective area 102, and divides the multiple heating lamps 20 into an inner ring lamp array 22 and an outer ring lamp array 21; the outer ring lamp array 21 is located in the first reflective area 101, the first reflective area 101 is provided with multiple reflective arc surfaces, and the concave side normal of the reflective arc surfaces faces the outer ring lamp array 21, the reflective arc surfaces are used to reflect and focus the light emitted by the outer ring lamp array 21 onto the component 60 to be heated below the heating lamps 20; the inner ring lamp array 22 is located in the second reflective area 102, the second reflective area 102 is provided with multiple reflective arc surfaces, and the concave side normal of the reflective arc surfaces faces the inner ring lamp array 22, the reflective arc surfaces are used to reflect and focus the light emitted by the inner ring lamp array 22 onto the component 60 to be heated below the heating lamps 20. In one example, the reflector 10 has a circular cross-section, the workpiece 60 to be heated is a wafer, and the wafer below the light emitted by the heating lamp 20 is radiated and heated. The reflector 10 can reflect and concentrate the light from the heating lamp 20, reducing energy dissipation and improving the heating efficiency of the heating lamp 20 on the wafer. Preferably, the inner surface roughness Ra of the reflector 10 is ≤0.8μm, so that the reflection angle is closer to the ideal state, and at the same time, it can improve the utilization rate of the heating light and further improve the heating efficiency.

[0024] Compared to the existing technology where the reflective surface inside the reflector 10 is a flat plane, the use of a reflective arc surface increases the incident angle of the incident light relative to the surface of the element to be heated 60, reduces the horizontal dispersion of the light from the heating lamp 20 after reflection, and increases the light energy focused on the element to be heated 60, thereby improving heating efficiency. At the same time, the use of multiple reflective arc surfaces in the first reflection area 101 and the second reflection area 102 optimizes the light transmission path and optimizes the arrangement of the light focused on the element to be heated 60, which helps to improve the uniformity of the surface temperature of the element to be heated 60. Compared to planar reflection, the use of reflective arc surfaces can also effectively shorten the transmission path of reflected light, reduce the energy loss of light during transmission, and further improve heating efficiency.

[0025] like Figure 5 , 7 As shown in Figure 8, one embodiment relates to a heating assembly, including a reflector 10 and a plurality of heating lamps 20 disposed in an inner cavity 100. The inner cavity 100 of the reflector 10 is divided into a first reflective area 101 and a second reflective area 102 by an annular baffle 40. The first reflective area 101 is provided with a plurality of reflective arc surfaces, the concave side normals of which face the direction of the bulbs 201 of the outer ring lamp array 21. Specifically, the reflective arc surfaces of the first reflective area 101 include a first reflective arc surface 31, a second reflective arc surface 32, and a third reflective arc surface 33. The first reflective arc surface 31 is located above the light-emitting center of the outer ring lamp array 21. The first reflective arc surface 31 is used to concentrate a portion of the light emitted from the outer ring lamp array 21 towards the peripheral wall 12 after a single reflection onto the edge region of the surface of the workpiece to be heated 60. The edge region is the area no more than 1 / 3 of the radius of the outer periphery of the workpiece to be heated 60. Preferably, the longitudinal section of the first reflective arc surface 31 is a first circular arc 311, the radius of the first circular arc 311 is (14±5) mm, and the central angle of the first circular arc 311 is no greater than 30°. The second reflective arc surface 32 is located above the first reflective arc surface 31 on the same side. The two are connected by the cylindrical inner circumferential surface of the peripheral wall 12. The second reflective arc surface 32 is an arc surface transitioning from the peripheral wall 12 to the base plate 11. The second reflective arc surface 32 can reflect light from the outer ring lamp array 21 to the edge region of the wafer. Preferably, the longitudinal section of the second reflective arc surface 32 is a second circular arc 321, and the radius of the second circular arc 321 is 10 mm.

[0026] like Figure 9As shown, the annular baffle 40 has a third reflective arc surface 33 on the side facing the outer ring lamp array 21. The third reflective arc surface 33 is located above and inside the light-emitting center of the outer ring lamp array 21. The third reflective arc surface 33 is used to concentrate part of the light emitted by the outer ring lamp array 21 towards the annular baffle 40 after one reflection to the edge area of ​​the surface of the workpiece to be heated 60. The edge area is the area no more than 1 / 3 of the radius of the outer periphery of the workpiece to be heated 60. Preferably, the longitudinal section of the third reflective arc surface 33 is a third circular arc 331. The third circular arc 331 is tangent to the inner reference plane 14 of the base plate 11. The radius of the third circular arc 331 is (45±5) mm, and the central angle of the third circular arc 331 is (30±5)°.

[0027] like Figure 5 , 7 As shown in Figure 10, in one embodiment, a heating assembly is involved, including a reflector 10 and a plurality of heating lamps 20 disposed in an inner cavity 100. The inner cavity 100 of the reflector 10 is divided into a first reflective area 101 and a second reflective area 102 by an annular baffle 40. The second reflective area 102 is provided with a plurality of reflective arc surfaces, the concave side normals of which face the direction of the bulbs 201 of the inner ring lamp array 22. Specifically, the reflective arc surfaces of the second reflective area 102 include a fourth reflective arc surface 34, a fifth reflective arc surface 35, and a sixth reflective arc surface 36 disposed on the annular baffle 40, arranged sequentially from bottom to top. The sixth reflective arc surface 36 is located above and outside the light-emitting center of the inner ring lamp array 22. The sixth reflective arc surface 36 is used to concentrate part of the light emitted by the inner ring lamp array 22 toward the annular baffle 40 after one reflection to the central area of ​​the surface of the workpiece to be heated 60. The central area is the area no more than 2 / 3 of the radius of the surface of the workpiece to be heated 60. Preferably, the longitudinal section of the sixth reflective arc surface 36 is the sixth circular arc 361. The sixth circular arc 361 is tangent to the inner reference plane 14 of the base plate 11. The radius of the sixth circular arc 361 is (50±5) mm, and the central angle of the sixth circular arc 361 is (26±5)°.

[0028] like Figure 11As shown, in one example, the reflective arc surface of the second reflective area 102 also includes a seventh reflective arc surface 37. The second reflective area 102 is provided with a reflective cone 50, which is a conical structure that extends from the inner reference plane 14 of the base plate 11 toward the opening direction. The tip of the conical structure faces the opening direction of the reflector 10. The conical surface of the reflective cone 50 forms a seventh reflective arc surface 37 facing the inner ring light array 22. The concave side normal of the seventh reflective arc surface 37 faces the inner ring light array 22. The seventh reflective arc surface 37 is used to reflect and focus the light from the inner ring light array 22 and the light reflected by the annular baffle 40 onto the central region of the surface of the workpiece to be heated 60. The central region is a region that is no more than 2 / 3 of the radius of the surface of the workpiece to be heated 60. Preferably, the longitudinal section of the seventh reflecting arc surface 37 yields a seventh circular arc 371 symmetrically arranged relative to the central axis of the reflecting cone 50, the radius of the seventh circular arc 371 is (75±5)mm, and the central angle of the seventh circular arc 371 is (50±5)°.

[0029] like Figure 12 As shown, in one example, the annular baffle 40 has a fifth reflective arc surface 35 facing the inner ring lamp array 22. The fifth reflective arc surface 35 is adjacent to and located below the sixth reflective arc surface 36. The fifth reflective arc surface 35 is used to reflect part of the light emitted by the inner ring lamp array 22 toward the annular baffle 40 to the seventh reflective arc surface 37. The seventh reflective arc surface 37 reflects and focuses the reflected light from the fifth reflective arc surface 35 onto the central area of ​​the surface of the component to be heated 60. Preferably, the longitudinal section of the fifth reflective arc surface 35 is a fifth circular arc 351, the radius of the fifth circular arc 351 is (100±5) mm, and the central angle of the fifth circular arc 351 is (14±5)°. The fourth reflective arc surface 34 is adjacent to and located below the fifth reflective arc surface 35. The fourth reflective arc surface 34 is used to reflect and focus the light from the bulbs 201 of the inner ring lamp array 22 onto the edge area of ​​the component to be heated 60. Preferably, the longitudinal section of the fourth reflective arc surface 34 is a fourth circular arc 341, the radius of the fourth circular arc 341 is (30±5) mm, and the center of the fourth circular arc 341 is located below the light-emitting center of the inner ring lamp array 22.

[0030] In one example, the annular baffle 40 has an eighth reflective surface 38 on the side away from the fourth reflective surface 34 and the fifth reflective surface 35. The eighth reflective surface 38 is adjacent to the third reflective surface 33 and located below the third reflective surface 33. Depending on the space of the first reflective zone 101 and the position of the bulbs 201 of the outer ring lamp array 21, the longitudinal section of the eighth reflective surface 38 can be a vertical straight line or a circular arc.

[0031] like Figure 13As shown, the first embodiment of the present invention relates to a heating chamber, including a vacuum chamber 70 for loading a component 60 to be heated. The upper end of the vacuum chamber 70 is provided with any of the aforementioned heating components. The heating components are isolated from the interior of the vacuum chamber 70 by a radiation window 71. The radiant energy of the heating components radiates through the radiation window 71 to heat the component 60 inside the vacuum chamber 70. In one example, the heating chamber is used for heating a wafer, i.e., the component 60 to be heated is a wafer. By setting more than 10 reflective surfaces on the reflector of the heating component, the light scattering of the heating lamp 20 can be effectively reduced, effectively improving the heating efficiency and heating uniformity of the wafer.

[0032] Taking the heating of a 300 mm diameter wafer as an example, the application effect of the heating chamber and its heating components provided by this invention is explained. The opening diameter of the reflector is 320 mm. The light-emitting centers of multiple heating lamps are arranged horizontally and coplanarly. The distance between the light-emitting center plane and the inner reference plane of the reflector base plate is set to 44 mm. The light-emitting center of the inner ring lamp array is located on the circumference 70 mm away from the central axis of the reflector, and the light-emitting center of the outer ring lamp array is located on the circumference 140 mm away from the central axis of the reflector. The purpose of the first reflective arc surface is to reflect the radiation light emitted by the outer ring lamp array upwards and outwards onto the wafer, causing the reflected light to deflect downwards onto the wafer. Compared with the circumference where the light-emitting center of the outer ring lamp array is located, the vertical position of the center of the first arc is above the circumferential plane, with a vertical distance of (0-10) mm, preferably 4 mm; the horizontal position of the center is outside the circumference, with a distance of (0-8) mm, preferably 6 mm, from the edge of the circumference. The radius of the first arc is preferably 14 mm, and the corresponding central angle is preferably 30°. Based on the position of the wafer and the plane where the light-emitting center is located, various parameters of the first reflective arc surface can be adjusted so that more of the reflected light from the heating lamp is reflected and concentrated on the wafer surface, thereby improving the efficiency of wafer heating. Furthermore, by setting the reflection path, the uniformity of wafer heating can be taken into account.

[0033] The purpose of the third reflective arc is to reflect the radiation emitted by the outer ring lamp array upwards and inwards onto the edge area of ​​the wafer on the same side as the outer ring lamp array. The center of the third arc is located vertically within ±4mm of the height of the light-emitting center plane, and horizontally inside the circumference of the outer ring lamp array's light-emitting center, at a distance of (5-10)mm from the edge of the circumference, preferably 8mm. The radius of the first arc is preferably 45mm, and the corresponding central angle is preferably 30°. These values ​​can be adjusted according to the distance between the wafer and the heating lamp and the wafer size to improve the heating efficiency and uniformity of the heating lamp on the wafer.

[0034] The purpose of the sixth and seventh reflective arc surfaces in the second reflective zone is to reflect and concentrate the light from the inner ring lamp array to the center region of the wafer. The center of the sixth arc, corresponding to the sixth reflective arc surface, is vertically located within ±4 mm of the height of the light-emitting center plane, preferably 3.9 mm. The horizontal position of the center of the sixth arc is located inside the circumference of the inner ring lamp array's light-emitting center, at a distance of (5-10) mm from the edge of the circumference, preferably 5.6 mm. The radius of the sixth arc is preferably 50 mm, and the central angle is preferably 26°. The center of the seventh arc is located (20-35) mm below the light-emitting center plane, preferably 31 mm. The horizontal position of the center is located inside the circumference of the inner ring lamp array's light-emitting center, at a distance of (5-15) mm from the edge of the circumference, preferably 11.2 mm. The radius of the seventh arc is preferably 75 mm. Preferably, the seventh arc is tangent to the inner reference plane of the base plate.

[0035] Taking the wafer heating and degassing process in the heating chamber as an example, the heating component composed of a planar reflector is used as a comparative example to heat the wafer, and the heating component provided by this invention is used as an embodiment to heat the wafer. The initial temperature of the wafer is 20℃, and the simulation results are shown in Table 1, which is a simulation verification data table of performance indicators.

[0036] Table 1 Performance Index Simulation Verification Data Table According to the simulation data in Table 1, the heating component and heating chamber provided by the present invention have a significant improvement in heating efficiency compared with the heating component and heating chamber using planar reflection and anti-lighting in the prior art. When heating to the same temperature, the time required is shorter, and the uniformity of temperature rise on the wafer surface is also improved to a certain extent.

[0037] The heating chamber and its heating assembly provided by this invention, by setting multiple reflective arc surfaces, allows the light emitted by the heating lamp to be more concentratedly guided to the workpiece after one or more reflections, reducing light spillage. Simulations show that the radiant energy absorbed by the workpiece is significantly increased, and the heating time can be shortened by more than 20% under the same heating temperature requirement, resulting in a significant reduction in energy consumption. Through a partitioned design (the first reflective zone corresponds to the outer ring lamp array, and the second reflective zone corresponds to the inner ring lamp array), and customized reflective light paths for the edge and center regions respectively, the energy distribution of light on the surface of the workpiece is more even, effectively improving the uniformity of heating. The reflective arc surfaces shorten the reflected light path, reducing energy attenuation caused by multiple reflections compared to planar reflection. This invention, through the partitioned inner cavity of the reflector and the combination of multiple reflective arc surfaces, achieves both improved heating efficiency and enhanced heating uniformity without increasing the power of the heating lamp.

[0038] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the claims.

Claims

1. A heating assembly, characterized in that, include: A reflector includes a base plate and a peripheral wall extending along the circumferential edge of the base plate, wherein the base plate and the peripheral wall enclose an inner cavity; Multiple heating lamps are disposed within the inner cavity; An annular baffle is provided on the inner side of the base plate. The annular baffle divides the inner cavity into a first reflective area and a second reflective area, and divides the plurality of heating lamps into an outer ring lamp array located in the first reflective area and an inner ring lamp array located in the second reflective area. Both the first and second reflection areas are provided with multiple reflective arc surfaces. The concave normal of the reflective arc surface is respectively directed towards the corresponding outer ring lamp array or inner ring lamp array. The reflective arc surface is used to reflect the light emitted by the corresponding lamp array and focus it on the component to be heated below the heating lamp. The inner side of the peripheral wall is provided with a first reflective arc surface, which is located above the light emission center of the outer ring lamp array. The first reflective arc surface is used to concentrate part of the light rays from the outer ring lamp array toward the peripheral wall after one reflection to the edge area of ​​the surface of the workpiece to be heated. The edge area is the area that is no more than 1 / 3 of the radius of the outer periphery of the workpiece to be heated. The annular baffle is provided with a third reflective arc surface facing the outer ring light array. The third reflective arc surface is located above the inner side of the light emission center of the outer ring light array. The third reflective arc surface is used to concentrate part of the light rays from the outer ring light array toward the annular baffle to the edge area of ​​the surface of the workpiece to be heated after one reflection. The edge area is the area that is no more than 1 / 3 of the radius of the outer periphery of the workpiece to be heated. The annular baffle has a sixth reflective arc surface facing the inner ring light array. The sixth reflective arc surface is located above and outside the light-emitting center of the inner ring light array. The sixth reflective arc surface is used to concentrate part of the light rays from the inner ring light array toward the annular baffle to the central area of ​​the surface of the workpiece to be heated after one reflection. The central area is the area no more than 2 / 3 of the radius of the center of the surface of the workpiece to be heated. The second reflective area is provided with a reflective cone, which is a conical structure. The tip of the reflective cone faces the opening of the reflector. The conical surface of the reflective cone forms a seventh reflective arc surface facing the inner ring light array. The concave side normal of the seventh reflective arc surface faces the inner ring light array. The seventh reflective arc surface is used to reflect and concentrate the light from the inner ring light array and the light reflected by the annular baffle to the central area of ​​the surface of the workpiece to be heated. The central area is the area no more than 2 / 3 of the radius of the surface of the workpiece to be heated.

2. The heating assembly according to claim 1, characterized in that, The longitudinal section of the first reflective arc surface is a first circular arc, the radius of the first circular arc is (14±5)mm, and the central angle of the first circular arc is not greater than 30°.

3. The heating assembly according to claim 1, characterized in that, The longitudinal section of the third reflective arc surface is a third circular arc, which is tangent to the inner reference plane of the base plate. The radius of the third circular arc is (45±5)mm, and the central angle of the third circular arc is (30±5)°.

4. The heating assembly according to claim 1, characterized in that, The longitudinal section of the sixth reflective arc surface is the sixth circular arc, which is tangent to the inner reference plane of the base plate. The radius of the sixth circular arc is (50±5) mm, and the central angle of the sixth circular arc is (26±5)°.

5. The heating assembly according to claim 1, characterized in that, The longitudinal section of the seventh reflective arc surface yields a seventh circular arc symmetrically arranged relative to the central axis of the reflective cone. The radius of the seventh circular arc is (75±5) mm, and the central angle of the seventh circular arc is (50±5)°.

6. The heating assembly according to claim 1, characterized in that, The annular baffle is also provided with a fifth reflective arc surface facing the inner ring light array. The fifth reflective arc surface is used to reflect part of the light rays from the inner ring light array that are directed toward the annular baffle to the seventh reflective arc surface.

7. A heating chamber, characterized in that, The device includes a vacuum chamber for loading a component to be heated, and a heating component as described in any one of claims 1 to 6 is provided at one end of the vacuum chamber. The heating component is isolated from the vacuum chamber by a radiation window, and the heating component radiates heat to the component by penetrating the radiation window through radiant light.

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