A die bonder

Abstract

The application relates to the field of semiconductor packaging, in particular to a die bonder which comprises a workbench, the workbench is provided with a first track and a second track; a first track translationally cooperates with a glue coating mechanism to coat glue on a substrate; the second track translationally cooperates with a first pickup mechanism to be responsible for mounting a chip on the substrate and discharging a loaded substrate carrying the chip after mounting; the glue coating on the substrate is realized on the first track; the mounting of the chip on the substrate is realized on the second track; the glue coating process and the mounting process are independently carried out on the first track and the second track, so that the chip can be accurately mounted on the substrate; in addition, a chip feeding device, a transfer table and a glue tray are arranged on the workbench and at the rear side of the first track and the second track; a glue coating mechanism is arranged on the left side of the workbench; and a first pickup mechanism and a second pickup mechanism are arranged on the right side of the workbench, so that the above mechanisms are reasonably arranged, and the die bonder efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging, and in particular to a die bonder. Background Technology

[0002] As a core piece of equipment in the semiconductor packaging process, the die bonder's core function is to accurately pick up the chip and stably mount it onto the designated position on the substrate. This directly determines the precision and efficiency of semiconductor packaging and is one of the important pieces of equipment to ensure the quality of semiconductor products.

[0003] Most die bonders on the market currently use a single-track design. During operation, a carrier board moves the substrate along the same track to complete core processes such as adhesive application and chip mounting sequentially. Due to the overlapping of processes in this design, the chip mounting process is carried out simultaneously with the adhesive application on the substrate. The lack of coordination between the two processes can easily cause the carrier board to shift during track movement, resulting in chip mounting positioning deviations. This makes it impossible to accurately fit the chip to the preset position on the substrate, directly affecting the packaging accuracy.

[0004] Furthermore, the traditional die bonder's adhesive application mechanism and chip pick-up and placement mechanism have significant layout flaws, lacking a scientifically coordinated design. The adhesive application operation is performed independently from the chip orientation adjustment and placement operations, without an efficient linkage mechanism. This not only significantly increases the movement path of each mechanism and reduces overall operation efficiency, but also easily leads to mutual interference during the movement of the mechanisms, or problems such as uneven adhesive application and chip placement misalignment due to positioning deviations.

[0005] In summary, how to achieve a reasonable layout of the mechanisms on the die bonder to meet the requirement of precise chip mounting on the substrate has become an urgent problem for researchers in this field. Summary of the Invention

[0006] The technical problem to be solved by this invention is: how to achieve a reasonable layout of the mechanism on the die bonder to meet the requirement of precise chip mounting on the substrate; To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: This invention is a die bonder, comprising: a worktable, wherein a first track and a second track are arranged at intervals along the X-axis direction for driving a carrier plate to be transported along the X-axis direction; The left side of the first track is provided with a feeding mechanism for pushing the carrier plate into the first track, and the right side of the second track is provided with a discharging mechanism for pushing the carrier plate out of the second track. The workbench is provided with a first support on the left side and a second support on the right side. The first support is provided with a glue application mechanism that moves along the Y-axis in the front-back direction, and the second support is provided with a first pickup mechanism and a second pickup mechanism that move along the Y-axis in the front-back direction. A transfer platform and a chip loading device are sequentially arranged on the rear side of the second track in the Y direction. After the chip loading device lifts the chip, the second picking mechanism picks up the chip and places it on the transfer platform for posture adjustment. The first picking mechanism picks up the chip on the transfer platform after posture adjustment and places it onto the substrate on the carrier plate in the second track for mounting. An adhesive tray is provided on the rear side of the first track in the Y direction. The adhesive application mechanism picks up the adhesive on the adhesive tray and applies adhesive to the substrate on the carrier plate in the first track.

[0007] Furthermore, the transfer station includes: a base, on which a rotating component and an automatic lifting mechanism are provided; a movable platform extends outward from the end face of the rotating component; a placement surface protrudes from the top surface of the movable platform; and a chip can be adsorbed on the placement surface. The placement surface is set horizontally upward or rotated to a horizontal downward position under the drive of the rotating component; A stationary platform, controlled by an automatic lifting mechanism, is provided on one side of the moving platform. The top surface of the stationary platform has a protruding connecting surface. When the chip adsorption surface is flipped 180° downwards, the automatic lifting mechanism controls the stationary platform to rise and fall to the set position, and the contact surface can be adjusted by the automatic lifting mechanism to fit the lower surface of the chip for chip adsorption.

[0008] Furthermore, the transfer station also includes a pressure calibration sensor disposed on the left side of the base, a precision calibration block disposed in front of the pressure calibration sensor, a transfer boss disposed in front of the precision calibration block that can adsorb various chips, and a transfer module with horizontal angle adjustment disposed on the right side of the transfer boss that can adsorb various chips.

[0009] Furthermore, the chip loading device includes: an X-axis module, a rotatable turntable at the movable end of the X-axis module, and multiple blue films with chips arranged on the turntable; a top core assembly is provided on one side of the X-axis module, and the top core assembly is configured to be connected to the movable end of the Y-axis module. The top core assembly includes: a plurality of first Z-axis modules connected to the movable end of the Y-axis module, the plurality of first Z-axis modules being arranged along the Y-axis, the output end of each first Z-axis module being connected to a second Z-axis module, and the output end of the second Z-axis module being connected to a top pin; By rotating the turntable and cooperating with the X-axis and Y-axis modules, the chip to be loaded is positioned above the corresponding ejector pin. The first Z-axis module controls the ejector pin to rise once and approach the blue film. The second Z-axis module controls the corresponding ejector pin to rise a second time and act on the blue film to separate the chip from the blue film.

[0010] Furthermore, the first track and the second track have the same structure, both including a sliding seat. The sliding seat is slidably mounted on the worktable along the X-axis direction via a linear module. A support platform for supporting the carrier plate is fixed on the sliding seat. Pressure frame plates are provided on the outer sides of the support platform in the Y direction. The pressure frame plates are mounted on the sliding seat via a lifting module. A rotatable conveying component is provided on the inner side of the pressure frame plate. The two sides of the carrier plate are supported on the conveyor belt of the conveying component. The top of the pressure frame plate is provided with pressure strips spaced apart along the X direction. When the pressure frame plate is lowered to the low position by the lifting module, the pressure strips press against the upper surface of the carrier plate.

[0011] Furthermore, the conveying assembly includes: a drive shaft connecting the two pressure frame plates, a plurality of transmission wheels disposed on the inner sidewalls of the corresponding pressure frame plates, and a conveyor belt tensioned between the drive shaft and the plurality of transmission wheels, wherein the horizontal top surface of the conveyor belt constitutes the working surface for conveying the carrier plate.

[0012] Furthermore, a guide rod is fixed on the pressure frame plate, and a guide sleeve is provided on the sliding seat; the lower end of the guide rod is inserted into the guide sleeve to form a linear guide between the pressure frame plate and the sliding seat.

[0013] Furthermore, the inner side of the pressure frame plate is provided with a support bar along the X-axis direction. When the pressure frame plate is lowered to the low position, the side of the carrier plate is pressed against the support bar by the conveyor belt.

[0014] Furthermore, the pressure frame plate has multiple receiving cavities along the X-axis direction, and each receiving cavity is provided with a spring piece; one end of the spring piece is fixedly connected to the bottom of the receiving cavity, and the other end is provided with a connecting clamping block. A retaining wheel is connected to the connecting clamping block. Under the action of the spring piece, the retaining wheel tends to protrude partially from the receiving cavity. The retaining wheel abuts against the side of the carrier plate, limiting the carrier plate to be positioned between the two pressure frame plates along the Y-axis direction.

[0015] Furthermore, the lifting module includes: two support seats disposed on the sliding seat, a drive shaft rotatably disposed on the two support seats, a rotating cam disposed on the drive shaft, and the rotating cam abutting against the corresponding pressure frame plate.

[0016] The beneficial effects of this invention are as follows: This invention is a die bonding machine. A first track translation mechanism, in conjunction with a coating mechanism, applies adhesive to the substrate. A second track translation mechanism, in conjunction with a first pick-up mechanism, is responsible for mounting the chip onto the substrate and unloading the carrier board containing the chip and substrate. The first track performs adhesive application on the substrate, and the second track performs chip mounting on the substrate. The adhesive application and mounting processes are performed independently on the first and second tracks, thus enabling precise chip mounting onto the substrate. Furthermore, a chip loading device, a transfer table, and an adhesive tray are arranged on the worktable behind the first and second tracks. The coating mechanism is located on the left side of the worktable, and the first and second pick-up mechanisms are located on the right side. This rational arrangement of the above mechanisms improves the chip bonding efficiency. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a top view of this embodiment; Figure 2 This is a perspective view of this embodiment; Figure 3 This is a perspective view of this embodiment from another angle; Figure 4 This is a front view of the transfer station; Figure 5 It is a 3D view of the transfer station; Figure 6 This is a 3D view of the transfer station from another perspective; Figure 7 This is a structural diagram of the stationary platform in the transfer station; Figure 8 This is a diagram showing the initial state of the rotating components in the transfer station; Figure 9 This is a schematic diagram of the rotating component in the transfer station rotating 180° counterclockwise. Figure 10 This is a structural diagram of the stationary or moving platform in the transfer station; Figure 11 yes Figure 10 Exploded cross-section view; Figure 12 yes Figure 10 A sectional view; Figure 13 yes Figure 4 A schematic diagram of the back structure; Figure 14 This is a structural diagram of the correction module and the chip horizontal angle adjustment module in the relay station; Figure 15 This is a schematic diagram of the chip loading device; Figure 16This is a schematic diagram of the X-axis module in the chip loading device; Figure 17 This is a diagram showing the connection between the Y-axis module and the top core assembly in the chip loading device; Figure 18 This is a schematic diagram of the structure of the second Z-axis module in the top core assembly of the chip feeding device, which is omitted. Figure 19 This is a schematic diagram of the structure of the second Z-axis module in the chip loading device; Figure 20 This is a schematic diagram of the ejector cap structure in a chip loading device; Figure 21 It is a negative pressure seat with a ejector pin in the chip loading device; Figure 22 It is a negative pressure seat with three ejector pins in the chip loading device; Figure 23 It is a negative pressure seat with five ejector pins in the chip loading device; Figure 24 This is a schematic diagram of the structure of the first track; Figure 25 This is a structural schematic diagram of the first track from another perspective; Figure 26 This is a cross-sectional view of the first track; Figure 27 This is a schematic diagram of the pressure frame plate structure; Figure 28 This is a schematic diagram of a pressure frame plate with supporting wheels; Figure 29 This is a schematic diagram of a retaining wheel structure with spring clips; In the diagram: 100-worktable, 101-feeding mechanism, 102-discharging mechanism, 110-first support, 120-second support, 01-chip, 02-substrate, 03-carrier board; 1-First track, 2-Second track, 3-Glue application mechanism, 4-First pickup mechanism, 5-Second pickup mechanism, 6-Transfer station, 7-Chip loading device, 8-Glue tray; 1-1-Sliding seat, 1-2-Support platform, 1-3-Pressure frame plate, 1-31-Guide rod, 1-32-Guide sleeve, 1-33-Support bar, 1-34-Accommodation cavity, 1-35-Spring piece, 1-36-Connecting clamp block, 1-37-Holding wheel, 1-4-Lifting module, 1-41-Support seat, 1-42-Drive shaft, 1-43-Rotating cam, 1-5-Conveying assembly, 1-51-Conveyor belt, 1-52-Drive shaft, 1-53-Transmission wheel, 1-6-Pressure bar; 6-01-First motor, 6-02-Second motor, 6-1-Base, 6-2-Rotating component, 6-21-Mounting groove, 6-22-Adsorption plate, 6-23-Mounting base, 6-231-Annular groove, 6-232-Negative pressure channel, 6-24-Sealing ring, 6-3-Moving table, 6-31-Placement surface, 6-4-Stationary table, 6-41-Connecting surface, 6-42-Support lug, 6-43-Guide hole, 6-44-Elastic component 6-45-Notch, 6-5-First negative pressure hole, 6-6-Rotating shaft, 6-7-Eccentric wheel, 6-8-Rotating wheel, 6-9-Fixed frame, 6-101-First sensor plate, 6-102-First photoelectric switch, 6-103-Second sensor plate, 6-104-Second photoelectric switch, 6-105-Transfer boss, 6-106-Transfer module, 6-107-Pressure calibration sensor, 6-108-Precision calibration block; 7-1-X-direction module, 7-11-X-direction mounting plate, 7-12-rotating motor, 7-2-turntable, 7-21-waffle box, 7-3-blue film, 7-4-top core assembly, 7-41-first Z-direction module, 7-411-third motor, 7-412-lead screw, 7-413-lead nut, 7-414-mounting shell, 7-42-second Z-direction module, 7-421-fourth motor, 7-422-ejector cap, 7-423-through hole, 7-424-second negative pressure hole, 7-43-mounting bracket, 7-5-Y-direction module, 7-6-ejector, 7-7-negative pressure seat, 7-71-evacuation pipe, 7-81-photoelectric sensor, 7-82-sensor plate. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0020] See Figure 1-3This embodiment is a die bonder, including a worktable 100. A first track 1 and a second track 2 are arranged at intervals along the X-axis on the worktable for conveying a carrier plate along the X-axis. A feeding mechanism 101 for pushing the carrier plate 03 onto the first track 1 is provided on the left side of the first track 1, and a discharging mechanism 102 for pushing the carrier plate 03 off the second track 2 is provided on the right side of the second track 2. A first support 110 is provided on the left side of the worktable 100, and a second support 120 is provided on the right side. A glue-applying mechanism 3 that moves along the Y-axis is provided on the first support 110, and a glue-applying mechanism 3 that moves along the Y-axis forward and backward. The system includes a first pickup mechanism 4 and a second pickup mechanism 5 that move in the rearward direction; a transfer platform 6 and a chip loading device 7 are sequentially arranged on the rear side of the second track 2Y direction. After the chip loading device 7 lifts the chip 01, the second pickup mechanism 5 picks up the chip 01 and places it on the transfer platform 6 for posture adjustment. The first pickup mechanism 4 picks up the chip 01 on the transfer platform 6 after posture adjustment and places it on the substrate 02 on the carrier plate 03 in the second track 2 for mounting. An adhesive tray 8 is arranged on the rear side of the first track 1Y direction. The adhesive application mechanism 3 picks up the adhesive on the adhesive tray 8 and applies adhesive to the substrate 02 on the carrier plate 03 in the first track 1. In this embodiment, the first track 1 first moves to the left limit position. At this time, the carrier plate 03 with substrate 02 is pushed onto the first track 1 by the feeding mechanism 101. As the first track 1 moves from left to right, the dispensing needle in the gluing mechanism 3 picks up the glue on the glue tray 8 and applies it to the substrate 02. When the first track 1 moves to the right limit position, the second track 2 moves to the left limit position. At this time, the carrier plate 03 on the first track 1 can be transported to the second track 2. As the second track 2 moves the carrier plate 03 to the right, the chip loading device 7 lifts the chip 01 on the blue film or waffle box. The second picking mechanism 5 picks up the chip 01 and places it onto the transfer table 6. After the attitude adjustment of the chip 01 is completed, the first picking mechanism 4 picks up the chip 01 and places it onto the substrate 02. The chip 01 and the substrate 02 are then mounted. In this embodiment, the first track 1 is responsible for feeding the carrier board 03 and applying adhesive to the substrate 02, while the second track 2 is responsible for mounting the chip 01 onto the substrate 02 and unloading the carrier board 03 containing the mounted chip 01 and substrate 02. Specifically, the adhesive is applied to the substrate 02 on the first track 1, and the chip 01 is mounted onto the substrate 02 on the second track 2. The adhesive application process and the mounting process are performed independently on the first track 1 and the second track 2, which allows the chip 01 to be accurately mounted onto the substrate 02. In addition, a chip loading device 7, a transfer station 6, and an adhesive tray 8 are provided on the worktable 100 and behind the first track 1 and the second track 2. An adhesive application mechanism 3 is provided on the left side of the worktable 100, and a first pick-up mechanism 4 and a second pick-up mechanism 5 are provided on the right side. This reasonable arrangement of the above mechanisms improves the chip bonding efficiency.

[0021] It should be noted that the adhesive coating mechanism 3 is equipped with a suction nozzle plate, which is equipped with dispensing needles of different specifications. The adhesive coating mechanism 3 can be equipped with different dispensing needles. The dispensing needles pick up the adhesive from the adhesive plate 8 and then apply adhesive to the substrate 02.

[0022] It should also be noted that the second pickup mechanism 5 is equipped with a nozzle library, which can install both nozzles and dispensing needles. The nozzles are used to pick up and transfer chips, while the dispensing needles are used to apply adhesive to chips or other tooling for secondary mounting.

[0023] In some possible embodiments, see Figure 4-14 In this embodiment, the transfer station 6 includes: a base 6-1, which is fixed on the worktable 100. A rotating component 6-2 is provided on the base 6-1, and the rotating component 6-2 is controlled to rotate by a first motor 6-01. A movable platform 6-3 extends outward from the end face of the rotating component 6-2. A placement surface 6-31 protrudes from the top surface of the movable platform 6-3, and a chip 01 can be adsorbed on the placement surface 6-31. The second picking mechanism 5 picks up the chip 01 and places it on the placement surface 6-31; the placement surface 6-31 can be in a state where it is on the left side of the rotating member 6-2 and horizontally upward, or after the rotating member 6-2 rotates counterclockwise 180°, the placement surface 6-31 is in a state where it is on the right side of the rotating member 6-2 and horizontally downward. When the placement surface 6-31 adsorbs the chip 01 and is set downwards, a stationary platform 6-4, which is controlled to rise and fall by an automatic lifting mechanism, is set directly below it. The stationary platform 6-4 is connected to the base 6-1 in a lifting manner through the cooperation of a slider and a slide rail. The top surface of the stationary platform 6-4 has a protruding contact surface 6-41, which can be adjusted to fit the lower surface of the chip 01. In this embodiment, when the lower surface of chip 01 is the bonding surface, the second picking mechanism 5 picks up the upper surface of chip 01 and moves it normally or places it on the placement surface 6-31, and then the first picking mechanism 4 picks it up for subsequent mounting. See Figure 8-9When the upper surface of chip 01 is the mating surface, the automatic lifting mechanism is first adjusted to adjust the stationary stage 6-4 to the set height. The second pick-up mechanism 5 picks up the upper surface of chip 01 and places it on the placement surface 6-31. Then, the placement surface 6-31 adsorbs chip 01, and the rotating part 6-2 rotates 180° counterclockwise. At this time, the placement surface 6-31 and the mating surface 6-41 are positioned vertically opposite each other, with a gap between them equal to the thickness of one chip 01. This avoids damage to chip 01 due to insufficient spacing between the placement surface 6-31 and the mating surface 6-41, or inaccurate positioning of chip 01 when placed on the mating surface 6-41 due to excessive spacing, making it difficult for subsequent pick-up devices to pick it up. After placing chip 01 on the mating surface 6-41, the adsorption force of the placement surface 6-31 is turned off, and the rotating part 6-2 is reset clockwise. At this time, the mating surface of chip 01 is facing down. Finally, the first pick-up mechanism 4 picks up chip 01 for subsequent mounting processes. By adding a transfer station 6 to the die bonder, the orientation of the chip 01 can be selectively adjusted by flipping it over. During the orientation adjustment process, since the gap between the placement surface 6-31 and the contact surface 6-41 is the thickness of one chip 01, the chip 01 can be stably transferred from the placement surface 6-31 to the contact surface 6-41 to meet the process requirements of subsequent front or back mounting of the chip 01.

[0024] See Figure 1-3 In some possible embodiments, the placement surface 6-31 and the connecting surface 6-41 are provided with a first negative pressure hole 6-5 for adsorbing the chip 01; In this embodiment, by providing a first negative pressure hole 6-5, which is connected to a negative pressure mechanism, the chip 01 can be stably adsorbed onto the placement surface 6-31 or the contact surface 6-41.

[0025] See Figure 10 , 1112. A mounting groove 6-21 is provided on the top surface of either the stationary platform 6-4 or the moving platform 6-3, facing downwards. A mounting base 6-23 is connected to the mounting groove 6-21 via a connector. An annular groove 6-231 is provided in the center of the top surface of the mounting base 6-23. A negative pressure channel 6-232 in the center of the annular groove 6-231 communicates with the first negative pressure hole 6-5 on the adsorption sheet 6-22. The adsorption sheet 6-22 is made of ceramic, allowing it to be fitted into the annular groove 6-231. The top surface of the mounting base 6-23 protrudes beyond... The top surface of the mounting slot 6-21 and the adsorption plate 6-22 protrudes from the mounting base 6-23. The top surface of the mounting base 6-23 on the stationary stage 6-4 is the contact surface 6-41, and the top surface of the mounting base 6-23 on the moving stage 6-3 is the placement surface 6-31. The adsorption plate 6-22 can be replaced according to the diameter of the first negative pressure hole 6-5 to meet the adsorption of chips 01 of different specifications. A sealing ring 6-24 is provided between the bottom surface of the mounting base 6-23 and the bottom of the mounting slot 6-21 to avoid leakage of negative pressure.

[0026] See Figure 5-6 13. In some possible embodiments, the automatic lifting mechanism includes a second motor 6-02 and a linear reciprocating assembly connected to the output end of the second motor 6-02. The linear reciprocating assembly includes, but is not limited to, a lead screw module. The linear reciprocating assembly may also include a rotating shaft 6-6 connected to the output end of the second motor 6-02. The rotating shaft 6-6 is rotatably disposed below the stationary platform 6-4 and on the base 6-1. An eccentric wheel 6-7 is connected to the end of the rotating shaft 6-6. A rotating wheel 6-8 is disposed at the bottom end of the stationary platform 6-4. Part of the rotating wheel 6-8 protrudes from the bottom of the stationary platform 6-4 and abuts against the outer peripheral wall of the eccentric wheel 6-7. In this embodiment, the rotating shaft 6-6 is controlled to rotate by the second motor 6-02. The rotating shaft 6-6 drives the eccentric wheel 6-7 to rotate. When the minimum diameter of the eccentric wheel 6-7 abuts against the rotating wheel 6-8, the stationary stage 6-4 is at its lower limit position to meet the flipping requirements of the thicker chip 01. Conversely, when the maximum diameter of the eccentric wheel 6-7 abuts against the rotating wheel 6-8, the stationary stage 6-4 is at its upper limit position to meet the flipping requirements of the thinner chip 01. In addition, an eccentric wheel 6-7 is used to achieve stepless micro-adjustment of the lifting and lowering of the stationary stage 6-4, so as to meet the posture adjustment of chips 01 with different thicknesses. The eccentric wheel 6-7 abuts against the rotating wheel, which reduces friction between the two. Even after long-term use, the stationary stage 6-4 can still achieve high-precision lifting and lowering.

[0027] See Figure 5-6In some possible embodiments, a fixing frame 6-9 is provided on one side of the stationary platform 6-4 and on the base 6-1. A support lug 6-42 protrudes from the horizontal side of the stationary platform 6-4. The support lug 6-42 is located inside the fixing frame 6-9. A vertical guide is provided inside the fixing frame 6-9. The guide passes through a guide hole 6-43 opened on the support lug 6-42. An elastic member 6-44 is sleeved on the guide. The two ends of the elastic member 6-44 abut against the top surface of the support lug 6-42 and the inner top surface of the fixing frame 6-9, respectively. In this embodiment, the cooperation between the guide member and the guide hole 6-43 further ensures the stability of the lifting and lowering of the stationary platform 6-4; in addition, an elastic member 6-44 is sleeved on the guide member, and the elastic member 6-44 applies downward pressure to the stationary platform 6-4, so that the stationary platform 6-4 is stable after the lifting and lowering adjustment and does not shake, and the chip 01 can be stably placed on the docking surface 6-41.

[0028] See Figure 5-6 In some possible embodiments, a first sensing plate 6-101 is fixed on the other side of the stationary platform 6-4, and a first photoelectric switch 6-102 is fixed on the base 6-1. The first photoelectric switch 6-102 is used to detect the linear displacement of the first sensing plate 6-101. In this embodiment, the height of the stationary stage 6-4 can be obtained by the cooperation of the first photoelectric switch 6-102 and the first sensing chip 6-101; thus, the stationary stage 6-4 can be moved to the set height in advance before the attitude adjustment of the chip 01.

[0029] See Figure 5-6 In some possible embodiments, the end face of the rotating member 6-2 is provided with a second sensing plate 6-103, and a second photoelectric switch 6-104 is fixed on the base 6-1. The second photoelectric switch 6-104 is used to detect the amount of rotation of the second sensing plate 6-103. In this embodiment, the rotation amount of the rotating component 6-2 can be obtained through the cooperation of the second photoelectric switch 6-104 and the second sensing plate 6-103, which can ensure that the placement surface 6-31 can stably switch between the horizontal upward and horizontal downward postures.

[0030] See Figure 7 In some possible embodiments, the bottom end of the stationary platform 6-4 is provided with a notch 6-45 facing upwards, and the rotating wheel 6-8 is installed in the notch 6-45; In this embodiment, some of the rotating wheels 6-8 are placed inside the notch 6-45, so that some of the rotating wheels 6-8 are placed outside the notch 6-45 and protrude from the bottom of the stationary platform 6-4; by setting the notch 6-45, the overall height of the stationary platform 6-4 and the rotating wheels 6-8 can be shortened.

[0031] See Figure 14 In some possible embodiments, the transfer station 6 further includes a pressure calibration sensor 6-107 disposed on the left side of the base 6-1, a precision calibration block 6-108 disposed in front of the pressure calibration sensor 6-107, a transfer boss 6-105 disposed in front of the precision calibration block 6-108 capable of adsorbing various chips, and a transfer module 6-106 disposed on the right side of the transfer boss 6-105 capable of adsorbing chips and adjusting their horizontal angle.

[0032] In some possible embodiments, see Figure 15-23 The chip loading device 7 in this embodiment includes an X-axis module 7-1, the bottom of which is mounted on a workbench 100. A rotatable turntable 7-2 is provided at the movable end of the X-axis module 7-1, and multiple blue films 7-3 with chips 01 are arranged on the turntable 7-2. A core assembly 7-4 is provided on one side of the X-axis module 7-1, and the core assembly 7-4 is configured to connect to the movable end of a Y-axis module 7-5. The core assembly 7-4 includes multiple first Z-axis modules 7-41 connected to the movable end of the Y-axis module 7-5. The multiple first Z-axis modules 7-41 are arranged along the Y direction. Each first Z-axis module... The output terminals of group 7-41 are all connected to the second Z-axis module 7-42, and the output terminals of the second Z-axis module 7-42 are connected to the ejector pin 7-6. Through the rotation of the turntable 7-2 and the coordinated operation of the X-axis module 7-1 and Y-axis module 7-5, the chip to be fed is positioned above the corresponding ejector pin 7-6. The first Z-axis module 7-41 controls the ejector pin 7-6 to rise once and approach the blue film 7-3. The second Z-axis module 7-42 controls the corresponding ejector pin 7-6 to rise a second time and act on the blue film 7-3 to separate the chip 01 from the blue film 7-3. Then, the second picking mechanism 5 picks up the chip 01 separated from the blue film 7-3.

[0033] In this embodiment, chip 01 moves closer to the top core assembly 7-4 under the movement of turntable 7-2 and X-axis module 7-1; the top core assembly 7-4 moves to below the chip 01 to be picked up under the drive of the Y-axis module; the ejector pin 7-6 rises once under the drive of the first Z-axis module 7-41, bringing the ejector pin 7-6 close to the bottom surface of the blue film 7-3; the ejector pin 7-6 rises a second time under the drive of the second Z-axis module 7-42, pushing the chip 01 upward and detaching the chip 01 from the adhesion of the blue film 7-3, thus realizing the loading of chip 01; then the second picking mechanism 5 moves above the chip 01 and adsorbs and transfers the chip 01 to the next process for processing. It should be noted that the stroke accuracy of the second Z-axis module 7-42 is greater than that of the first Z-axis module 7-41; the purpose of setting multiple first Z-axis modules 7-41 in the top core assembly 7-4, and connecting multiple first Z-axis modules 7-41 to corresponding ejector pins 7-6, is to eject chips of different sizes. It should also be noted that, unlike the turntable which moves linearly along two axes under the drive of the XY axis transfer module, in this embodiment, the turntable 7-2 moves linearly only under the drive of the X-axis module 7-1. Since the top core assembly 7-4 and the mounting mechanism are both equipped with the Y-axis module 7-5, by adjusting the X-axis module 7-1 and the turntable 7-2, as well as adjusting the Y-axis of the top core assembly 7-4 and the mounting mechanism, the chip 01 on the blue film 7-3 can be located directly above the top core assembly 7-4 and directly below the second pickup mechanism 5. Therefore, this embodiment omits the Y-axis module below the turntable 7-2, optimizing the equipment structure and simplifying the device.

[0034] See Figure 16 In some possible embodiments, the movable end of the X-direction module 7-1 is provided with an X-direction mounting plate 7-11, the X-direction mounting plate 7-11 is provided with a rotary motor 7-12, and the output end of the rotary motor 7-12 is connected to a turntable 7-2. In this embodiment, the X-axis mounting plate 7-11 can move along the X-axis. The X-axis mounting plate 7-11 is equipped with a rotary motor 7-12. The output end of the rotary motor 7-12 is connected to the turntable 7-2. In this way, the chip can move linearly along the X-axis and rotate with the turntable 7-2 to adjust the position of the chip 01.

[0035] See Figure 15 In some possible embodiments, the turntable 7-2 has a placement slot around its center, and a blue film 7-3 with a chip or a waffle box 7-21 is placed in the placement slot; In this embodiment, a blue film 7-3 or a waffle box 7-21 is placed in the placement slot. The chip 01 can be directly placed in the waffle box 7-21 and picked up by the second picking mechanism 5 without the need for the top core assembly 7-4.

[0036] See Figure 17 , 18 In some possible embodiments, multiple first Z-axis modules 7-41 are fixed to the movable end of the Y-axis module 7-5 by the same mounting bracket 7-43. The first Z-axis module 7-41 includes multiple third motors 7-411 disposed on the mounting bracket 7-43. The output end of the third motor 7-411 is connected to a lead screw 7-412. The lead screw nut 7-413 on one side of the mounting housing 7-414 is connected to the lead screw 7-412. In this embodiment, the first Z-axis module 7-41 uses the cooperation of lead screw 7-412 and lead screw nut 7-413 to realize the lifting and lowering of the mounting shell 7-414 relative to the mounting frame 7-43; the number of third motors 7-411 is set to 3, and all three third motors 7-411 are fixed on the mounting frame 7-43. Each third motor 7-411 can drive the corresponding mounting shell 7-414 to rise.

[0037] See Figure 18 In some possible embodiments, the mounting housing 7-414 and the mounting bracket 7-43 are connected by a linear slide rail for lifting. In this embodiment, to ensure the accuracy of the travel of the mounting housing 7-414 during the lifting process, the mounting bracket 7-43 and the mounting housing 7-414 are connected by a slider and a slide rail.

[0038] See Figure 19 , 20 21. In some possible embodiments, the second Z-axis module 7-42 includes a fourth motor 7-421 disposed within the mounting housing 7-414, and a pin cap 7-422 disposed on the top of the mounting housing 7-414. The output end of the fourth motor 7-421 is connected to a pin 7-6. The fourth motor 7-421 drives the pin 7-6 to rise and extend from the top of the pin cap 7-422. In this embodiment, the fourth motor 7-421 is a voice coil motor. The output end of the fourth motor 7-421 is connected to the ejector pin 7-6. The ejector pin 7-6 can be raised and lowered under the drive of the fourth motor 7-421. The ejector pin 7-6 can be raised and lowered relative to the ejector cap 7-422, and the top of the ejector pin 7-6 protrudes from the top of the ejector cap 7-422. Specifically, the third motor 7-411 drives the top of the ejector cap 7-422 to approach the bottom of the blue film 7-3. Then, the fourth motor 7-421 drives the ejector pin 7-6 to extend from the top of the ejector cap 7-422 and act on the blue film 7-3 to push the chip 01 out of the blue film 7-3.

[0039] See Figure 21 , 22 23. In some possible embodiments, the number of ejector pins 7-6 configured in the plurality of second Z-axis modules 7-42 is inconsistent; In this embodiment, for the chip 01 with a larger area, the number of ejector pins 7-6 is configured as 5, and the ejector pins are arranged in a ring; for the chip 01 with a moderate area, the number of ejector pins is configured as 3, and the ejector pins 7-6 are arranged in a ring; for the chip 01 with a smaller area, the number of ejector pins 7-6 is configured as 1, and the ejector pin 7-6 can extend from the center of the ejector pin cap 7-422.

[0040] See Figure 20In some possible embodiments, the top of the ejector cap 7-422 is provided with a plurality of through holes 7-423 for the ejector pin 7-6 to pass through, and a second negative pressure hole 7-424 for adsorbing the blue film; In this embodiment, in addition to the through hole 7-423 for the ejector pin 7-6 to pass through, the top of the ejector cap 7-422 also has a second negative pressure hole 7-424. The blue film 7-3 can be adsorbed onto the top of the ejector cap 7-422 through the second negative pressure hole 7-424, generating a downward negative pressure on the blue film 7-3, which increases the separation force when the chip 01 separates from the blue film 7-3.

[0041] See Figure 20 , 21 In some possible embodiments, a negative pressure seat 7-7 is fixed to the top of the mounting shell 7-414, and a pin cap 7-422 is sleeved and fixed on the negative pressure seat 7-7. The negative pressure seat 7-7 generates negative pressure at the second negative pressure hole 7-424. In this embodiment, the negative pressure seat 7-7 is covered with a pin cap 7-422, and a suction pipe 7-71 is provided on one side of the negative pressure seat 7-7. The negative pressure seat 7-7 can generate negative pressure at the second negative pressure hole 7-424.

[0042] See Figure 18 In some possible embodiments, a photoelectric sensor 7-81 is fixed on the mounting bracket 7-43, and a sensing plate 7-82 is fixed on the mounting housing 7-414. The photoelectric sensor 7-81 is used to detect the lifting amount of the sensing plate 7-82. In this embodiment, the sensor 7-82 is fixed to the liftable mounting housing 7-414, and the photoelectric sensor 7-81 is fixed to the mounting bracket 7-43. The displacement of the mounting housing 7-414 relative to the mounting bracket 7-43 is obtained through the cooperation of the photoelectric sensor 7-81 and the sensor 7-82.

[0043] See Figure 25-29In some possible embodiments, the first track and the second track have the same structure. Taking the first track 1 as an example, the first track 1 includes a sliding seat 1-1. The sliding seat 1-1 is slidably mounted on the worktable 100 along the X-axis direction via a linear module. A support platform 1-2 supporting the carrier plate 03 is fixed on the sliding seat 1-1. Pressure frame plates 1-3 are provided on the outer sides of the support platform 1-2 in the Y direction, that is, pressure frame plates 1-3 are provided in the front and rear directions of the support platform 1-2 respectively. The pressure frame plates 1-3 are mounted on the sliding seat 1-1 via a lifting module 1-4. A rotatable conveying assembly 1-5 is provided on the inner side of the pressure frame plate 1-3. The two sides of the carrier plate 03 are supported on the conveyor belt 1-51 of the conveying assembly 1-5. Pressure strips 1-6 are spaced apart on the top of the pressure frame plate 1-3 along the X direction. When the pressure frame plate 1-3 is lowered to a low position by the lifting module 1-4, the pressure strips 1-6 press against the upper surface of the carrier plate 03. In this embodiment, when the first track 1 is at its left extreme position, the pressure frame plate 1-3, together with the pressure strip 1-6, rises to a high position under the drive of the lifting module 1-4. At this time, the carrier plate 03 can be laterally inserted into the first track 1 under the action of the feeding mechanism 101. Subsequently, the pressure frame plate 1-3, together with the pressure strip 1-6, descends to a low position under the drive of the lifting module 1-4, and the pressure strip 1-6 presses the carrier plate 03 onto the support platform 1-2. During the process of the first track 1 moving from left to right under the drive of the linear module, the adhesive is applied. Mechanism 3 applies adhesive to the upper surface of substrate 02; when the first track 1 moves to the right limit position, the pressure frame plate 1-3 and the pressure strip 1-6 rise to the high position. At this time, the carrier plate 03 is not pressed by the pressure strip 1-6. The conveyor belt 1-51 of the conveying assembly 1-5 rotates and moves the carrier plate 03 on the first track 1 to the second track 2 which is at the left limit position. Then, as the second track 2 moves to the right, the first picking mechanism 4 picks up the chip 01 and attaches it to the substrate 02, completing the mounting of the chip 01.

[0044] In other words, the linear module drives the first track 1 and the second track 2 to move laterally as a whole, which is used for applying adhesive to the substrate 02 on the carrier board 03 and mounting the chip 01 onto the substrate 02; the rotation of the conveyor belt 1-51 in the conveying assembly 1-5 on the first track 1 and the second track 2 can transport the carrier board from the first track 1 to the second track 2; in addition, the lifting pressure plate 1-3 can press the carrier board 03 onto the support platform 1-2 through the pressure strip 1-6, which can ensure that the carrier board 03 is stably supported on the first track 1 and the second track 2, and ensure the stability of the substrate 02 during the adhesive application and the mounting process of the substrate 02 and the chip 01.

[0045] See Figure 27In some possible embodiments, the conveying assembly 1-5 includes: a drive shaft 1-52 connecting the two pressure frame plates 1-3, a plurality of transmission wheels 1-53 disposed on the inner sidewall of the corresponding pressure frame plate 1-3, and a conveyor belt 1-51 tensioned between the drive shaft 1-52 and the plurality of transmission wheels 1-53, wherein the horizontal top surface of the conveyor belt 1-51 constitutes the working surface for conveying the carrier plate 03. In this embodiment, two conveyor belts 1-51 are connected to the drive shaft 1-52 in the front and rear. The corresponding conveyor belts 1-51 are tensioned on the transmission wheel 1-53 on the inner side of the corresponding pressure plate 1-3. When the drive shaft 1-52 rotates, it drives the conveyor belts 1-51 to rotate in one direction, which can move the carrier plate 03 on the feeding mechanism 101 to the two pressure plates 1-3 of the first track 1, or move it from the pressure plate 1-3 of the first track 1 to the pressure plate 1-3 of the second track 2, or move the pressure plate 1-3 of the second track 2 out of the discharging mechanism 102.

[0046] See Figure 27 In some possible embodiments, a guide rod 1-31 is fixed on the pressure frame plate 1-3, and a guide sleeve 1-32 is provided on the sliding seat 1-1; the lower end of the guide rod 1-31 is inserted into the guide sleeve 1-32, forming a linear guide between the pressure frame plate 1-3 and the sliding seat 1-1; In this embodiment, the guide rod 1-31 and the guide sleeve 1-32 are inserted and connected so that the pressure plate 1-3 can only move up and down relative to the sliding seat 1-1, thus ensuring the accuracy of the up and down movement of the pressure plate 1-3.

[0047] See Figure 27 In some possible embodiments, the inner side of the pressure frame plate 1-3 is provided with a support bar 1-33 along the X-axis direction. When the pressure frame plate 1-3 is lowered to the low position, the side of the carrier plate 03 is pressed against the support bar 1-33 by the conveyor belt 1-51. In this embodiment, when the pressure plate 1-3 descends to the low position, in addition to the support platform 1-2 supporting the carrier plate 03, the bottom of the carrier plate 03 is supported on the support bar 1-33 by the conveyor belt 1-51, thus providing more stable support for the carrier plate 03; when the pressure plate 1-3 rises to the high position, under the tension of the conveyor belt 1-51, the carrier plate 03 will detach from the support platform 1-2 and the support bar 1-33, making it easier for the subsequent conveyor belt 1-51 to drive the carrier plate 03 for linear transport.

[0048] See Figures 28-29In some possible embodiments, the pressure frame plate 1-3 has multiple receiving cavities 1-34 along the X-axis direction (along its length direction), and a spring piece 1-35 is provided in the receiving cavity 1-34; one end of the spring piece 1-35 is fixedly connected to the bottom of the receiving cavity 1-34, and the other end is provided with a connecting clamp 1-36. A retaining wheel 1-37 is connected to the connecting clamp 1-36. Under the action of the spring piece 1-35, the retaining wheel 1-37 tends to protrude partially from the receiving cavity 1-34. The retaining wheel 1-37 abuts against the side of the carrier plate 03, limiting the carrier plate 03 in the Y-axis direction between the two pressure frame plates 1-3. In this embodiment, in addition to the pressure strip 1-6 pressing the carrier plate 03 downward, the abutting wheel 1-37 can abut against the side of the carrier plate 03, so that the other side of the carrier plate 03 is tightly attached to another pressure frame plate 1-3. The carrier plate 03 is stably supported between the two pressure frame plates 1-3, which facilitates the subsequent application of glue to the substrate 02 or the mounting of the chip 01.

[0049] See Figure 24-27 In some possible embodiments, the lifting module 1-4 includes: two support seats 1-41 disposed on the sliding seat 1-1, a drive shaft 1-42 rotatably disposed on the two support seats 1-41, a rotating cam 1-43 disposed on the drive shaft 1-42, and the rotating cam 1-43 abutting against the corresponding pressure frame plate 1-3; In this embodiment, the drive shaft 1-42 drives the two rotating cams 1-43 to rotate synchronously. When the long diameter side of the rotating cam 1-43 abuts against the pressure plate 1-3, the pressure plate 1-3 is at the upper limit position. When the short diameter side of the rotating cam 1-43 abuts against the pressure plate 1-3, the pressure plate 1-3 is at the lower limit position.

[0050] Crystal bonding steps: S1: Move the first track 1 to the left limit position. At this time, the pressure bar 1-6 is in the high position. After the feeding mechanism 101 pushes the carrier plate 03 carrying the substrate 02 to the first track 1, the pressure bar 1-6 is in the low position, pressing the carrier plate 03 onto the first track 1. S2: As the first track 1 moves from left to right, the glue application mechanism 3 picks up the glue on the glue tray 8 and applies glue to the substrate 02 on the carrier plate 03 in the first track 1 in sequence. S3: The first track 1 moves to the right limit position, the second track 2 is at the left limit position, the first track 1 and the second track 2 are in the docking state, the pressure strip 1-6 is in the high position, and the carrier plate 03 is transferred from the first track 1 to the second track 2 by the rotation of the conveyor belt 1-51. S4: When the carrier plate 03 is completely moved onto the second track 2, the pressure strips 1-6 are in the low position, pressing the carrier plate 03 onto the second track 2; S5: During the movement of the second track 2 to the right, after the chip loading device 7 lifts the chip 01 onto the top, the second picking mechanism 5 picks up the chip 01 and places it on the transfer table 6 for posture adjustment. The first picking mechanism 4 picks up the chip 01 on the transfer table 6 after the posture adjustment is completed and places it on the substrate 02 on the carrier plate 03 in the second track 2 for mounting. S6: The second track 2 moves to the right to its limit position, the pressure strips 1-6 are in a high position, and the carrier plate 03 is removed from the second track 2 by the discharge mechanism 102.

[0051] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A die bonder, characterized by, include: The workbench (100) has a first track (1) and a second track (2) arranged on the workbench (100) at intervals along the X-axis direction for driving the carrier plate (03) to be transported along the X-axis direction. The left side of the first track (1) is provided with a feeding mechanism (101) for pushing the carrier plate (03) into the first track (1), and the right side of the second track (2) is provided with a discharging mechanism (102) for pushing the carrier plate (03) out of the second track (2). The workbench (100) has a first support (110) on the left side and a second support (120) on the right side. The first support (110) is equipped with a glue application mechanism (3) that moves along the Y-axis in the front-back direction. The second support (120) is equipped with a first pickup mechanism (4) and a second pickup mechanism (5) that move along the Y-axis in the front-back direction. An adhesive tray (8) is provided on the rear side of the first track (1) in the Y direction. The adhesive application mechanism (3) picks up the adhesive on the adhesive tray (8) and applies adhesive to the substrate (02) on the carrier plate (03) in the first track (1). A transfer station (6) and a chip loading device (7) are arranged sequentially on the rear side of the second track (2) in the Y direction. After the chip loading device (7) lifts the chip (01) onto the transfer station (6), the second picking mechanism (5) picks up the chip (01) and places it on the transfer station (6) for posture adjustment. The first picking mechanism (4) picks up the chip (01) after posture adjustment on the transfer station (6) and places it on the substrate (02) after adhesive is applied on the carrier board (03) in the second track (2) for mounting.

2. The die bonder of claim 1, wherein The transfer station (6) includes: a base (6-1), on which a rotating component (6-2) and an automatic lifting mechanism are provided. A movable platform (6-3) extends outward from the end face of the rotating component (6-2), and a placement surface (6-31) protrudes from the top surface of the movable platform (6-3). A chip (01) can be adsorbed on the placement surface (6-31). The placement surface (6-31) is arranged horizontally upward or rotated to be arranged horizontally downward under the drive of the rotating component (6-2); A stationary platform (6-4) controlled by an automatic lifting mechanism is provided on one side of the moving platform (6-3). The top surface of the stationary platform (6-4) has a protruding connecting surface (6-41). When the placement surface (6-31) adsorbs the chip and is rotated 180° downwards, the automatic lifting mechanism controls the stationary platform (6-4) to rise to the set position, and the contact surface (6-41) can be adjusted by the automatic lifting mechanism to fit the lower surface of the chip (01) for adsorption of the chip (01).

3. The die bonder of claim 2, wherein The transfer station (6) also includes a pressure calibration sensor (6-107) disposed on the left side of the base (6-1), a precision calibration block (6-108) disposed in front of the pressure calibration sensor (6-107), a transfer boss (6-105) disposed in front of the precision calibration block (6-108) capable of adsorbing various chips, and a transfer module (6-106) with horizontal angle adjustment disposed on the right side of the transfer boss (6-105) capable of adsorbing various chips.

4. The die bonder of claim 1, wherein The chip loading device (7) includes: an X-axis module (7-1), the movable end of which is provided with a rotatable turntable (7-2), and a plurality of blue films (7-3) with chips (01) are arranged on the turntable (7-2); a top core assembly (7-4) is provided on one side of the X-axis module (7-1), and the top core assembly (7-4) is configured to be connected to the movable end of the Y-axis module (7-5); The top core assembly (7-4) includes: a plurality of first Z-axis modules (7-41) connected to the movable end of the Y-axis module (7-5), the plurality of first Z-axis modules (7-41) being arranged along the Y-axis, the output end of each first Z-axis module (7-41) being connected to a second Z-axis module (7-42), and the output end of the second Z-axis module (7-42) being connected to a top pin (7-6); By rotating the turntable (7-2) and cooperating with the X-axis module (7-1) and Y-axis module (7-5), the chip (01) to be fed is positioned above the corresponding ejector pin (7-6). The first Z-axis module (7-41) controls the ejector pin (7-6) to rise once and approach the blue film (7-3). The second Z-axis module (7-42) controls the corresponding ejector pin (7-6) to rise a second time and act on the blue film (7-3) to separate the chip (01) from the blue film (7-3).

5. The die bonder of claim 1, wherein The first track (1) and the second track (2) have the same structure, both including a sliding seat (1-1). The sliding seat (1-1) is slidably mounted on the worktable (100) along the X-axis direction through a linear module. A support platform (1-2) supporting the carrier plate (03) is fixed on the sliding seat (1-1). A pressure frame plate (1-3) is provided on both sides of the support platform (1-2) in the Y direction. The pressure frame plate (1-3) is mounted on the sliding seat (1-1) through a lifting module (1-4). A rotatable conveying assembly (1-5) is provided on the inner side of the pressure frame plate (1-3). The two sides of the carrier plate (03) are supported on the conveyor belt (1-51) of the conveying assembly (1-5). The top of the pressure frame plate (1-3) is provided with pressure strips (1-6) spaced apart along the X direction. When the pressure frame plate (1-3) is lowered to a low position by the lifting module (1-4), the pressure strips (1-6) press against the upper surface of the carrier plate (03).

6. The die bonder of claim 5, wherein the die bonder further comprises: The conveying assembly (1-5) includes: a drive shaft (1-52) connecting the two pressure frame plates (1-3), a plurality of transmission wheels (1-53) disposed on the inner sidewall of the corresponding pressure frame plate (1-3), and a conveyor belt (1-51) tensioned between the drive shaft (1-52) and the plurality of transmission wheels (1-53). The horizontal top surface of the conveyor belt (1-51) constitutes the working surface for conveying the carrier plate (03).

7. The die bonder of claim 5, wherein the die bonder further comprises: A guide rod (1-31) is fixed on the pressure frame plate (1-3), and a guide sleeve (1-32) is provided on the sliding seat (1-1); the lower end of the guide rod (1-31) is inserted into the guide sleeve (1-32) to form a linear guide between the pressure frame plate (1-3) and the sliding seat (1-1).

8. The die bonder of claim 5, wherein the die bonder further comprises: The inner side of the pressure frame plate (1-3) is provided with a support bar (1-33) along the X-axis direction. When the pressure frame plate (1-3) is lowered to the low position, the side of the carrier plate (03) is pressed onto the support bar (1-33) by the conveyor belt (1-51).

9. The die bonder of claim 5, wherein, The pressure frame plate (1-3) has multiple accommodating cavities (1-34) along the X-axis direction. Each accommodating cavity (1-34) contains a spring piece (1-35). One end of the spring piece (1-35) is fixedly connected to the bottom of the accommodating cavity (1-34), and the other end is provided with a connecting clamp (1-36). A retaining wheel (1-37) is connected to the connecting clamp (1-36). Under the action of the spring piece (1-35), the retaining wheel (1-37) tends to protrude partially from the accommodating cavity (1-34). The retaining wheel (1-37) abuts against the side of the carrier plate (03), limiting the carrier plate (03) along the Y-axis direction between the two pressure frame plates (1-3).

10. The die bonder according to claim 5, characterized in that, The lifting module (1-4) includes: two support seats (1-41) disposed on the sliding seat (1-1), a drive shaft (1-42) rotatably disposed on the two support seats (1-41), a rotating cam (1-43) disposed on the drive shaft (1-42), and the rotating cam (1-43) abutting against the bottom edge of the corresponding pressure frame plate (1-3).

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