A planar tape and carrier system and temporary packaging method for ultra-thin components

Abstract

This application discloses a planar carrier tape system and a temporary packaging method for ultra-thin components. The planar carrier tape system includes: a carrier tape having a support surface for placing components and having through holes spaced apart along its length, wherein the center-to-center distance between any two adjacent through holes is configured to be less than the length dimension of the component; a capping tape for covering the component and restricting lateral movement of the component relative to the carrier tape by engaging with the carrier tape; and a vacuum source communicating with the through holes and for applying a low vacuum below the component placed on the support surface through the through holes to restrict lateral movement of the component relative to the carrier tape; the ratio of the opening area of ​​the through holes to the surface area of ​​the component is between 0.1 and 0.25; and the vacuum source is configured to apply a low vacuum between 10 kPa and 40 kPa below the component placed on the support surface. Applying this application allows for the stabilization of the component on the support surface with relatively low and uniform pressure, avoiding the problem of localized depressions and deformations of the component that are easily caused by traditional adsorption methods.

Description

Technical Field

[0001] This application relates to the field of solder pad packaging technology, specifically to a planar carrier tape system and temporary packaging method for ultra-thin components. Background Technology

[0002] Carrier tapes are commonly used for packaging and transporting electronic components. They typically have multiple equidistant pockets (or sacs) along their length to hold the components. A cover tape seals these pockets, encapsulating the electronic components within the carrier tape's pockets and protecting them from damage and contamination during transport. Existing carrier tapes are primarily designed for electronic components with structural rigidity, such as semiconductor chips, resistors, and capacitors. These components usually possess a certain degree of bending stiffness, capable of withstanding normal vibrations and impacts during transport. Existing carrier tapes can utilize the sidewalls of the pockets for support and positioning of the electronic components through pocket design, or by incorporating boss structures within the pockets for support and positioning. Some designs also include negative pressure holes at the bottom of the pockets to apply negative pressure and assist in positioning the electronic components within the pockets, preventing them from tilting due to vibration during the sealing or peeling of the cover tape.

[0003] Solder preforms are soldering materials used in semiconductor packaging and electronic assembly, and can also be packaged and transported using carrier tapes. However, for ultra-thin solder preforms (thickness less than 200 μm), their bending stiffness is low due to their relatively softer material compared to the aforementioned electronic components (such as indium-based or tin-based alloys), and they are highly sensitive to surface oxidation and mechanical scratches. When using existing carrier tapes for packaging and transporting such soldering materials, the solder preforms are prone to warping or deformation within the cells due to vibration. If existing negative pressure methods are used for auxiliary positioning, the low bending stiffness will further exacerbate the warping or deformation problem of the solder preforms. In addition, the sizes of solder preforms are more diverse to meet different application requirements, necessitating the design of various specifications of carrier tapes (with different cell sizes) to adapt to them, resulting in higher costs. Summary of the Invention

[0004] This application aims to address one of the technical problems in related technologies to a certain extent. To this end, this application provides a planar carrier tape system and a temporary packaging method for ultra-thin components.

[0005] To achieve the above objectives, this application adopts the following technical solution: a planar carrier tape system for ultra-thin components, the planar carrier tape system comprising:

[0006] A carrier tape having a bearing surface for placing components, and the carrier tape being provided with through holes spaced apart along its length, wherein the center-to-center distance between any two adjacent through holes is configured to be less than the length dimension of the component.

[0007] A cover tape is used to cover the element after it has been placed on the support surface and to restrict lateral movement of the element relative to the carrier tape by engaging with the carrier tape.

[0008] A vacuum source, which communicates with the through-hole and is used to apply a low vacuum below the element placed on the carrier surface through the through-hole to limit the lateral movement of the element relative to the carrier tape;

[0009] The opening area of ​​the through hole is configured such that the ratio of its opening area to the surface area of ​​the element covering the through hole is between 0.1 and 0.25.

[0010] The vacuum source is configured to apply a low vacuum between 10 kPa and 40 kPa below the element placed on the support surface.

[0011] The application of this application has the following beneficial effects:

[0012] Instead of the perforated carrier tape used in traditional solutions, a flat carrier tape is used, with a flat bearing surface without any grooves. For components like solder preforms, which have low bending stiffness and are prone to deformation, the flat bearing surface provides stable support, eliminating the risk of warping or deformation caused by the component being suspended within perforations. Furthermore, because there are no grooves, solder preforms of different sizes can be placed at intervals along the length of the carrier tape, allowing one type of carrier tape to accommodate multiple types of solder preforms, increasing the carrier tape's applicability. Additionally, since the carrier tape does not need perforations, its thickness can be reduced, significantly decreasing the overall size of the reel formed by winding the carrier tape and lowering transportation and transshipment costs.

[0013] By creating through-holes on the carrier tape and defining the ratio of the through-hole opening area to the surface area of ​​the component covering the through-hole, and then applying a low vacuum of 10 kPa to 40 kPa below the component using a vacuum source, air can continuously flow through the naturally existing micro-gap between the lower surface of the component and the carrier surface, creating a dynamic pressure difference between the upper and lower surfaces of the component. This allows the component to be stabilized on the carrier surface with a relatively small and uniform pressure. This avoids the problem of localized deformation and sinking of components that traditional methods rely on high vacuum and static adsorption to tightly adsorb electronic components into holes. The ratio of the through-hole opening area to the surface area of ​​the component covering the through-hole ensures sufficient opening area for airflow to establish effective dynamic adsorption force, while also ensuring sufficient contact area between the component and the carrier surface to maintain the required micro-leakage channels. The defined vacuum level ensures sufficient stabilizing force while preventing deformation and damage caused by excessive adsorption due to excessive negative pressure. A vacuum source can be used to apply a low vacuum under the component during both sealing and peeling of the capping tape to limit lateral movement of the component relative to the carrier tape and ensure the stability of the component during the sealing and peeling processes.

[0014] By sealing the capping tape onto the carrier belt, the lateral movement of the component relative to the carrier belt can be restricted during transport and transfer. Because there are no perforations, the inner surface of the capping tape fits more tightly against the upper surface of the component placed on the carrier belt, resulting in better positioning.

[0015] Optionally, the planar carrier system includes a support plate and a suction housing. The support plate is attached to a portion of the carrier and supported below the carrier. The support plate is provided with vent holes corresponding to the through holes. The carrier is configured to slide relative to the support plate under the action of an external force, so that the carrier is attached to the support plate segment by segment and the through holes on the carrier are aligned with the vent holes on the support plate one after another.

[0016] The suction housing is disposed on the side of the support plate away from the carrier belt. The suction housing forms a suction cavity. One end of the suction cavity has an opening facing the support plate and the other end has an air extraction port. The opening is configured to cover the vent on the support plate and has a gap with the support plate. The vacuum source is sealed and connected to the air extraction port.

[0017] Optionally, the vacuum source is a vortex blower.

[0018] Optionally, the through holes are distributed in a single row and the spacing between two adjacent through holes is a set spacing.

[0019] Optionally, the capping tape is an elastic, stretchable polymer film, configured to apply uniform pressure toward the carrier surface to the element after engagement with the carrier tape.

[0020] Optionally, the capping tape is bonded to the carrier tape by a heat-sealing process.

[0021] Optionally, after the capping tape is heat-sealed onto the carrier tape, it forms sealing lines distributed around the component. The sealing lines distributed around the component cooperate to form a sealing cavity corresponding to the component, and the sealing cavities formed between the capping tape and the carrier tape are interconnected.

[0022] Optionally, at least one edge of the carrier tape is provided with a plurality of side teeth arranged at equal intervals along its length direction. The side teeth are used to engage with the sprocket in the feeder of the surface mount equipment to drive the carrier tape to be conveyed.

[0023] Furthermore, this application also provides a temporary packaging method for ultra-thin components, implemented using a planar carrier tape system as described in any of the above technical solutions, the temporary packaging method comprising:

[0024] Place the component above the bearing surface of the carrier tape while maintaining a gap between them;

[0025] The vacuum source is activated and a low vacuum is applied to the lower surface of the component through the through-hole;

[0026] The component is placed on the bearing surface of the carrier tape, and at least one through hole on the carrier tape is covered by the component;

[0027] A vacuum source applies a low vacuum between 10 kPa and 40 kPa to the lower surface of the component through the through hole, so that air can continuously flow through the micro-leakage channel between the lower surface of the component and the supporting surface.

[0028] While maintaining a low vacuum between 10 kPa and 40 kPa, cover the carrier tape with the sealing tape and bond it to the carrier tape.

[0029] The vacuum source is shut off to release the low vacuum, allowing the through-hole to return to an open state to the atmosphere.

[0030] The temporary encapsulation method provided in this application is similar to the reasoning process of the beneficial effects of the aforementioned planar carrier system, and will not be repeated here.

[0031] Optionally, the temporary packaging method further includes a material handling process, which includes:

[0032] The vacuum source is activated and a low vacuum between 10 kPa and 40 kPa is applied to the lower surface of the component through the through hole, so that air continuously flows through the micro-leakage channel between the lower surface of the component and the supporting surface.

[0033] While maintaining the low vacuum, peel off the sealing tape;

[0034] While maintaining the low vacuum, the component is removed from the carrier tape using a pick-up device.

[0035] These features and advantages of this application will be disclosed in detail in the following specific embodiments and accompanying drawings. Preferred embodiments or means of this application will be illustrated in detail with reference to the accompanying drawings, but are not intended to limit the technical solutions of this application. Furthermore, each of these features, elements, and components appearing in the following text and drawings is a plurality, and different symbols or numbers are used for convenience of representation, but all represent components with the same or similar structure or function. Attached Figure Description

[0036] The following description, in conjunction with the accompanying drawings, further illustrates this application:

[0037] Figure 1 A schematic diagram of a planar carrier tape system for ultra-thin components is provided in this application embodiment;

[0038] Figure 2 This is a schematic diagram of the carrier tape in a planar carrier tape system;

[0039] Figure 3 A diagram showing the placement of components on a carrier tape and the installation of a sealing tape. Figure 1 ;

[0040] Figure 4 A diagram showing the placement of components on a carrier tape and the installation of a sealing tape. Figure 2 ;

[0041] Figure 5 The principle of applying a low vacuum below the component as a vacuum source. Figure 1 ;

[0042] Figure 6 The principle of applying a low vacuum below the component as a vacuum source. Figure 2 .

[0043] Among them, 1. carrier tape; 10. bearing surface; 11. through hole; 12. side toothed hole; 2. sealing tape; 20. sealing line; 3. vacuum source; 4. support plate; 40. vent hole; 5. suction shell; 6. component. Detailed Implementation

[0044] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described are intended to explain this application and should not be construed as limiting it.

[0045] The terms "an embodiment," "example," or "example" used in this specification refer to a particular feature, structure, or characteristic described in connection with the embodiment itself that may be included in at least one embodiment disclosed in this application. The phrase "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment.

[0046] In the description of this application, it should be understood that the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0047] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a connection through an intermediary, the internal connection of two elements, or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] This embodiment provides a planar carrier tape system for ultra-thin components, such as... Figures 1 to 6 As shown, the planar carrier tape system includes a carrier tape 1, a capping tape 2, and a vacuum source 3. The carrier tape 1 has a support surface 10 for placing components 6, and it is provided with through holes 11 spaced apart along its length. The center-to-center distance between any two adjacent through holes 11 is configured to be less than the length of the component 6. The planar carrier tape 1 replaces the carrier tape with holes used in traditional solutions, and the support surface 10 is a flat surface without any grooves. This provides stable support for components 6, such as solder preforms, which have low bending stiffness and are easily deformed, eliminating the risk of warping or deformation caused by the component 6 being suspended within the holes. Furthermore, since no grooves are present, solder preforms of different sizes can be placed spaced apart along the length of the carrier tape 1, allowing one type of carrier tape 1 to accommodate multiple types of solder preforms, thus increasing the applicability of the carrier tape 1. In addition, since carrier belt 1 does not need to have holes, the thickness of carrier belt 1 can be reduced, which will significantly reduce the overall size of the reel formed by winding carrier belt 1, thereby reducing transportation and transfer costs.

[0049] In this embodiment, the capping tape 2 is used to cover the element 6 after it is placed on the support surface 10 and to restrict the lateral movement of the element 6 relative to the carrier tape 1 by engaging with the carrier tape 1. By sealing the capping tape 2 onto the carrier tape 1, the lateral movement of the element 6 relative to the carrier tape 1 can be restricted during the transport and transfer of the element 6. Since no holes are provided, the inner surface of the capping tape 2 fits more tightly with the upper surface of the element 6 placed on the carrier tape 1, resulting in a better limiting effect.

[0050] In this embodiment, the vacuum source 3 communicates with the through-hole 11 and is used to apply a low vacuum below the element 6 placed on the support surface 10 through the through-hole 11 to limit the lateral movement of the element 6 relative to the carrier belt 1. Meanwhile, in this embodiment, the opening area of ​​the through-hole 11 is configured such that the ratio of its opening area to the surface area of ​​the element 6 covering the through-hole 11 is limited to between 0.1 and 0.25, and the vacuum source 3 is configured to apply a low vacuum below the element 6 placed on the support surface 10 between 10 kPa and 40 kPa.

[0051] By setting through holes 11 on the carrier tape 1 and defining the ratio of the opening area of ​​the through holes 11 to the surface area of ​​the component 6 covering the through holes 11, and then applying a low vacuum of 10 kPa to 40 kPa below the component 6 using a vacuum source 3, air can continuously flow through the naturally existing micro-gap between the lower surface of the component 6 and the supporting surface 10, forming a dynamic pressure difference between the upper and lower surfaces of the component 6. This allows the component 6 to be stabilized on the supporting surface 10 with a smaller and more uniform pressure. This avoids the problem of localized depressions and deformations of the component 6 that traditional methods use high vacuum and static adsorption to tightly adsorb electronic components into the holes. The ratio of the opening area of ​​the through holes 11 to the surface area of ​​the component 6 covering the through holes 11 ensures that there is sufficient opening area for airflow to establish an effective dynamic adsorption force, while also ensuring that there is sufficient contact area between the component 6 and the supporting surface 10 to maintain the required micro-leakage channel. Limiting the vacuum level ensures sufficient stabilizing force while preventing deformation and damage caused by excessive adsorption of component 6 due to excessive negative pressure. A low vacuum can be applied below component 6 using vacuum source 3 during both sealing and peeling of the sealing tape 2 to limit lateral movement of component 6 relative to carrier tape 1, ensuring the stability of component 6 during these processes.

[0052] It should be noted that in this embodiment, the center-to-center distance between any two adjacent through holes 11 is configured to be less than the length of the component 6. This ensures that when the component 6 is placed on the carrier tape 1, it will at least cover a portion of the through holes 11, preventing the component 6 from being misaligned with any one of the through holes 11. This ensures that the vacuum source 3 can apply a low vacuum to each component 6. Furthermore, with the above design, for different specifications of the component 6, when the length of the component 6 is shorter, it covers one through hole 11, and when the length of the component 6 is larger, it can cover more through holes 11. This achieves an adaptive effect where "the larger the component 6, the more through holes 11 it covers, and the greater the pressure difference generated by applying a low vacuum through the covered through holes 11."

[0053] In this embodiment, the carrier tape 1 is made of a flexible polymer film, and the material can be selected from polycarbonate (PC), polystyrene (PS) or polyethylene terephthalate (PET). The thickness of the carrier tape 1 is preferably between 0.2 mm and 0.5 mm.

[0054] In this embodiment, element 6 is an indium-based solder preform, but it can also be a solder preform made of other materials. Of course, the planar carrier system provided in this embodiment can also be applied to electronic components such as semiconductor chips, resistors, and capacitors.

[0055] Furthermore, such as Figure 1 As shown, the planar carrier tape system provided in this embodiment also includes a support plate 4 and a suction housing 5. The length of the support plate 4 is less than that of the carrier tape 1. The support plate 4 is attached to and supported below a portion of the carrier tape 1. The support plate 4 is provided with vent holes 40 corresponding to the through holes 11. When the carrier tape 1 is working, an external force can drive the carrier tape 1 to slide relative to the support plate 4 along direction F, causing the carrier tape 1 to gradually attach to the support plate 4 and align the through holes 11 on the carrier tape 1 with the vent holes 40 on the support plate 4. Referring to existing carrier tape surface mount equipment, the carrier tape 1 in this embodiment also adopts a step-by-step conveying method. Multiple side toothed holes 12 are evenly spaced along the length direction on at least one side edge of the carrier tape 1. The sprocket in the feeder of the surface mount equipment meshes with the side toothed holes 12, driving the carrier tape 1 to move a preset distance each time, ensuring that after each movement of the carrier tape 1, several consecutive through holes 11 are located at a predetermined position. The operation of placing component 6 and sealing with capping tape 2 is performed at the predetermined work station, or the operation of peeling off capping tape 2 and removing component 6 is performed.

[0056] In this embodiment, a support plate 4 is provided and a vent hole 40 is provided on the support plate 4 to support the carrier belt 1 and prevent the carrier belt 1 from bending and deforming during the process of applying a low vacuum from the vacuum source 3. At the same time, the vent hole 40 is aligned with the through hole 11 to ensure that a low vacuum can be applied smoothly.

[0057] In this embodiment, the suction housing 5 is disposed on the side of the support plate 4 away from the carrier belt 1. The suction housing 5 forms a suction cavity, one end of which has an opening facing the support plate 4 and the other end has an air extraction port. The opening is configured to cover multiple vent holes 40 and has a gap with the support plate 4. The vacuum source 3 is sealed and connected to the air extraction port. Figure 5 and Figure 6 As shown, the process of placing component 6 on carrier belt 1 and sealing capping tape 2 is illustrated as an example: The carrier belt 1 is moved by the aforementioned sprocket until part of the through-hole 11 reaches the predetermined position. A robotic arm with a suction cup picks up component 6 through the suction cup and moves component 6 above carrier belt 1. Before placing component 6 on carrier belt 1, vacuum source 3 operates and applies a low vacuum (e.g., through through-hole 11 and vent 40) to the lower surface of component 6. Figure 5 (As shown). Then, component 6 is placed on the support surface 10. It should be noted here that, in combination... Figure 2 As shown, in this embodiment, the through holes 11 are distributed in a single row, and the spacing d between two adjacent through holes 11 is 5 mm. The diameter of each through hole 11 is 1.8 mm, the thickness of the element 6 is 0.2 mm, and the length and width of the element 6 are 10 mm and 4 mm, respectively. Therefore, the element 6 placed on the carrier tape 1 can cover two through holes 11. The sum of the opening areas of the two through holes 11 is S. The surface area P of the element 6 covering the through holes 11 is the difference between the surface area T of the element 6 and the opening area S of the two through holes 11. The aforementioned "ratio of the opening area of ​​the through hole 11 to the surface area of ​​the element 6 covering the through hole 11" in this case refers to S / P, or S / (TS). Applying a low vacuum before placing the element 6 on the carrier tape 1 can improve the stability of the element 6 relative to the carrier tape 1 at the moment of placement, prevent the element 6 from shifting relative to the predetermined position at the moment of release of the suction cup, and improve the accuracy of the placement position of the element 6.

[0058] After component 6 is placed on carrier tape 1, as Figure 6 As shown, some airflow still enters from the microchannel between component 6 and carrier tape 1 and continues to flow through through hole 11 to the suction chamber. At this time, a low vacuum can restrict the lateral movement of component 6 relative to carrier tape 1, ensuring the stability of component 6 during the subsequent sealing of the capping tape 2. It is easy to understand that for ultra-thin solder preforms, due to their certain surface roughness and natural warping, a microchannel for airflow will inevitably form between them and carrier tape 1.

[0059] In this embodiment, the vacuum source 3 is a vortex blower. Vortex blowers have the characteristics of high flow rate and low vacuum. Unlike traditional vacuum pumps that pursue high vacuum, vortex blowers naturally operate in the low vacuum region and are suitable for the planar carrier system provided in this embodiment.

[0060] In this embodiment, the through holes 11 are distributed in a single row and the spacing d between two adjacent through holes 11 is between 3mm and 11mm, preferably 3mm, 5mm, 7mm and 11mm. The above spacing values ​​can be adapted to various common specifications and sizes of solder preforms.

[0061] In this embodiment, the sealing tape 2 is an elastic and stretchable polymer film, such as a multilayer composite film with polyester (PET) or polypropylene (PP) as the substrate and including at least one heat-sealing layer. The sealing tape 2 is configured to apply uniform pressure toward the bearing surface 10 to the element 6 after being joined with the carrier tape 1. After being joined with the carrier tape 1, the elastic force of the sealing tape 2 can apply a uniform pressure toward the bearing surface 10 to the element 6, which, together with the flat bearing surface 10 of the carrier tape 1, forms a double-sided constraint on the element 6. For thin solder preforms with low bending stiffness (such as pure indium solder sheets), it can effectively suppress warping deformation during transportation and maintain its surface flatness.

[0062] Furthermore, such as Figure 3 and Figure 4 As shown, in this embodiment, the capping tape 2 is joined to the carrier tape 1 by a heat-sealing process. The heat-sealing process is relatively mature, and the sealing strength is controllable and consistent, providing a stable and reliable sealing effect. At the same time, the sealing line 20 formed by heat sealing has a predetermined peeling force, which facilitates the peeling mechanism of the feeder to peel the capping tape 2 off the carrier tape 1 with a constant peeling force during the subsequent material handling process.

[0063] Furthermore, in this embodiment, the sealing tape 2, after being heat-sealed onto the carrier tape 1, forms sealing lines 20 distributed around the component 6. These sealing lines 20 cooperate to form sealing cavities corresponding to the component 6, and the sealing cavities formed between the sealing tape 2 and the carrier tape 1 are interconnected. By forming sealing lines 20 around the component 6, the component 6 is confined within a sealing cavity defined by the sealing lines 20, preventing lateral displacement of the component 6 while maintaining airflow communication between adjacent sealing cavities. Thus, during subsequent material removal, the moment the sealing tape 2 at the end of the carrier tape 1 is peeled off, the adjacent sealing cavity can be connected to the outside. Applying a low vacuum can create continuous airflow on the lower surface of the component 6, ensuring that the component 6 is stably confined to the carrier tape 1 and preventing lateral movement of the component 6 during the peeling off of the sealing tape 2.

[0064] It is easy to understand that both sealing and peeling of the capping tape 2 are carried out segment by segment following the step-by-step transmission of the carrier tape 1.

[0065] This embodiment also provides a temporary packaging method for ultra-thin components, implemented using the planar carrier tape system provided in this embodiment. The temporary packaging method includes the following steps:

[0066] S100: Place the element 6 above the bearing surface 10 of the carrier tape 1 and maintain a gap between them;

[0067] S200: Start the vacuum source 3 and apply a low vacuum to the lower surface of the component 6 through the through hole 11; applying a low vacuum before placing the component 6 can improve the stability of the component 6 relative to the carrier tape 1 at the moment of placement, prevent the component 6 from shifting relative to the predetermined position at the moment of release of the suction cup, and improve the accuracy of the placement position of the component 6.

[0068] S300: The element 6 is placed on the bearing surface 10 of the carrier tape 1, and at least one through hole 11 on the carrier tape 1 is covered by the element 6;

[0069] S400: Vacuum source 3 applies a low vacuum between 10 kPa and 40 kPa to the lower surface of element 6 through the through hole 11, so that air continuously flows through the micro-leakage channel between the lower surface of element 6 and the bearing surface 10; this stage, by applying a low vacuum to stabilize element 6, can prevent element 6 from moving laterally during the subsequent sealing of the capping tape 2.

[0070] S500: While maintaining a low vacuum between 10 kPa and 40 kPa, cover the carrier tape 2 with the capping tape 1 and join it to the carrier tape 1;

[0071] S600: The vacuum source 3 is turned off to release the low vacuum, allowing the through-hole 11 to return to an open state to the atmosphere. After sealing is completed, the vacuum is released, allowing the through-hole 11 to return to an open state to the atmosphere, so that the inside of the packaged carrier tape 1 does not maintain negative pressure, avoiding the deformation effect that may be caused to the flexible element 6 by long-term negative pressure. At the same time, the open through-hole 11 makes it easy to reapply vacuum during subsequent material handling.

[0072] The above steps S100 to S600 are used to place the element 6 relative to the carrier tape 1 and to perform the sealing operation of the sealing tape 2.

[0073] Furthermore, the temporary packaging method also includes a material handling process, which is used to peel the capping tape 2 off the carrier tape 1 and remove the component 6. The material handling process includes the following steps:

[0074] S10: Start the vacuum source 3 and apply a low vacuum between 10 kPa and 40 kPa to the lower surface of the component 6 through the through hole 11 so that air can continuously flow through the micro-leakage channel between the lower surface of the component 6 and the bearing surface 10; apply the low vacuum first and then perform the subsequent peeling operation to stabilize the component 6 on the bearing surface 10, effectively preventing the component 6 from shifting, jumping or folding due to peeling force or static electricity during the peeling of the sealing tape 2, and ensuring that the picker can accurately and reliably pick up the component 6.

[0075] S20: While maintaining a low vacuum, peel off the capping tape 2;

[0076] S30: While maintaining a low vacuum, use a pick-up device to remove component 6 from carrier tape 1.

[0077] It should be noted that since the above operations are performed segment by segment following the step-by-segment transmission of carrier tape 1, the phrase "apply vacuum first, then peel off the capping tape 2" means that a vacuum is applied before peeling off the capping tape 2 for each segment of carrier tape 1.

[0078] The above-mentioned temporary packaging method has enabled stable operation of ultra-thin components such as solder preforms throughout the entire process of "packaging-transportation-retrieval", overcoming the shortcomings of traditional cavity-type carrier tape in the packaging of such ultra-thin components.

[0079] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Those skilled in the art will understand that this application includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of this application will be included within the scope of the claims.

Claims

1. A planar carrier tape system for ultra-thin components, characterized in that, The planar carrier system includes: A carrier tape having a bearing surface for placing components, and the carrier tape being provided with through holes spaced apart along its length, wherein the center-to-center distance between any two adjacent through holes is configured to be less than the length dimension of the component. A cover tape is used to cover the element after it has been placed on the support surface and to restrict lateral movement of the element relative to the carrier tape by engaging with the carrier tape. A vacuum source, which communicates with the through-hole and is used to apply a low vacuum below the element placed on the carrier surface through the through-hole to limit the lateral movement of the element relative to the carrier tape; The opening area of ​​the through hole is configured such that the ratio of its opening area to the surface area of ​​the element covering the through hole is between 0.1 and 0.

25. The vacuum source is configured to apply a low vacuum between 10 kPa and 40 kPa below the element placed on the support surface.

2. The planar carrier system for ultra-thin components as described in claim 1, characterized in that, The planar carrier system includes a support plate and a suction housing. The support plate is attached to a portion of the carrier and supported below the carrier. The support plate is provided with vent holes corresponding to the through holes. The carrier is configured to slide and be conveyed relative to the support plate under the action of an external force, so that the carrier is attached to the support plate segment by segment and the through holes on the carrier are aligned with the vent holes on the support plate one after another. The suction housing is disposed on the side of the support plate away from the carrier belt. The suction housing forms a suction cavity. One end of the suction cavity has an opening facing the support plate and the other end has an air extraction port. The opening is configured to cover the vent on the support plate and has a gap with the support plate. The vacuum source is sealed and connected to the air extraction port.

3. The planar carrier system for ultra-thin components as described in claim 1 or 2, characterized in that, The vacuum source is a vortex blower.

4. The planar carrier system for ultra-thin components as described in claim 1, characterized in that, The through holes are distributed in a single row, and the spacing between two adjacent through holes is a set spacing.

5. The planar carrier system for ultra-thin components as described in claim 1, characterized in that, The capping tape is an elastic, stretchable polymer film, and is configured to apply uniform pressure toward the carrier surface to the element after engagement with the carrier tape.

6. The planar carrier system for ultra-thin components as described in claim 1 or 5, characterized in that, The sealing tape is bonded to the carrier tape by a heat-sealing process.

7. The planar carrier system for ultra-thin components as described in claim 6, characterized in that, After the capping tape is heat-sealed onto the carrier tape, it forms sealing lines distributed around the component. The sealing lines distributed around the component cooperate to form a sealing cavity corresponding to the component. The sealing cavities formed between the capping tape and the carrier tape are interconnected.

8. The planar carrier system for ultra-thin components as described in claim 1, characterized in that, The carrier tape has at least one edge with a plurality of equally spaced side teeth along its length direction. The side teeth are used to engage with the sprocket in the feeder of the surface mount equipment to drive the carrier tape to move.

9. A temporary packaging method for ultra-thin components, characterized in that, Implemented using the planar carrier tape system as described in any one of claims 1 to 8, the temporary packaging method includes: Place the component above the bearing surface of the carrier tape while maintaining a gap between them; The vacuum source is activated and a low vacuum is applied to the lower surface of the component through the through-hole; The component is placed on the bearing surface of the carrier tape, and at least one through hole on the carrier tape is covered by the component; A vacuum source applies a low vacuum between 10 kPa and 40 kPa to the lower surface of the component through the through hole, so that air can continuously flow through the micro-leakage channel between the lower surface of the component and the supporting surface. While maintaining a low vacuum between 10 kPa and 40 kPa, cover the carrier tape with the sealing tape and bond it to the carrier tape. The vacuum source is shut off to release the low vacuum, allowing the through-hole to return to an open state to the atmosphere.

10. The temporary packaging method for ultra-thin components as described in claim 9, characterized in that, The temporary packaging method further includes a material handling process, which includes: The vacuum source is activated and a low vacuum between 10 kPa and 40 kPa is applied to the lower surface of the component through the through hole, so that air continuously flows through the micro-leakage channel between the lower surface of the component and the supporting surface. While maintaining the low vacuum, peel off the sealing tape; While maintaining the low vacuum, the component is removed from the carrier tape using a pick-up device.

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