Sample transfer device and method for wafer level high vacuum interconnection system

Abstract

This invention relates to a sample transfer device-level method for wafer-level high-vacuum interconnect systems, belonging to the field of sample transfer technology for vacuum systems. The sample transfer method of this invention uses multiple vertically movable probes as intermediaries to lift the sample from the sample holder, achieving separation between the sample and the sample holder. A second sample transfer mechanism then holds the sample, and the first sample transfer mechanism is used to change different sample holders, achieving sample transfer across sample holders. The entire process can be performed in a high-vacuum environment, is highly automated, safe, and prevents wafer detachment. Furthermore, the entire process does not require contact with the growth surface or effective growth area, thus not affecting sample quality.

Description

Technical Field

[0001] This invention relates to the field of sample transfer technology in vacuum systems, and more particularly to a sample transfer device and method for a wafer-level high-vacuum interconnect system. Background Technology

[0002] In the fields of materials science and surface science experiments, it is often necessary to transfer samples between vacuum devices with different functions, such as to complete a series of processes such as sample growth, processing, and characterization in an ultra-high vacuum environment. To address this, researchers have developed a vacuum interconnection system that connects multiple independent devices through vacuum pipelines, allowing samples to be transferred without exposure to the atmosphere throughout the process, thereby ensuring that the atomic-level cleanliness of the sample surface and its intrinsic physicochemical properties are not compromised.

[0003] Currently, vacuum interconnection systems typically employ a collaborative operation method of "sample holder + robotic arm": each device has a sample stage, and the sample must be fixed to a sample holder with a specific structure, which is then grasped by the vacuum robotic arm and transferred between devices. However, the sample holder structures used by different device manufacturers, and even different models from the same manufacturer, vary significantly. For example, their shape, size, grasping and positioning features (such as grooves, bosses, and magnetic points), and fixing methods all differ. Therefore, a sample holder of the same specification is often not directly applicable to another device, limiting the compatibility and engineering application of vacuum interconnection systems. Direct sample transfer usually requires direct contact between the robotic arm and the sample, which can easily cause damage to the effective sample area or the risk of sample detachment.

[0004] Therefore, the incompatibility of sample holder structures in existing high-vacuum interconnected systems, leading to difficulties in sample transfer, has become a key technical bottleneck restricting the efficient, non-destructive, and automated operation of the system. Thus, there is an urgent need to develop a sample transfer method that allows for cross-sample holder transfer, enabling direct and safe transfer of samples between different devices. Summary of the Invention

[0005] Based on the above analysis, the present invention aims to provide a sample transfer device and method for a wafer-level high-vacuum interconnect system, in order to solve the technical problem that the sample transfer process of the existing vacuum interconnect system is limited by the incompatibility of sample holders, making direct transfer difficult.

[0006] On one hand, the present invention provides a sample transfer method for a wafer-level high-vacuum interconnect system, comprising the following steps: S1. Control the first sample transfer mechanism to move the first sample holder containing the sample to the top of the multi-probe lifting mechanism, and adjust the radial displacement of each probe of the multi-probe lifting mechanism so that each probe is aligned with the first clearance part of the first sample holder. S2. Control the multi-probe lifting mechanism and the first sample transfer mechanism to move closer to each other in the vertical direction until each probe passes through the first clearance part and holds the sample, so that the sample is separated from the first sample holder; S3. Control the second sample transfer mechanism to extend from above the first sample transfer mechanism into the gap between the probes, and support the sample from below; S4. Control the multi-probe lifting mechanism to move away from the first sample transfer mechanism in the vertical direction and return to the initial position; S5. Control the first sample transfer mechanism to place the empty first sample holder on the sample holder support; control the first sample transfer mechanism to move the empty second sample holder above the multi-probe lifting mechanism, and adjust the radial displacement of each probe of the multi-probe lifting mechanism so that each probe is aligned with the second clearance part of the second sample holder. S6. Control the multi-probe lifting mechanism to move closer to the first sample transfer mechanism in the vertical direction until each probe passes through the second clearance part and supports the sample; S7. Withdraw the second sample transfer mechanism; S8. Control the multi-probe lifting mechanism to move away from the first sample transfer mechanism in the vertical direction and return to the initial position; The first sample holder and the second sample holder may have the same or different structures; the first clearance portion and the second clearance portion may have the same or different structures.

[0007] Furthermore, the first sample transfer mechanism supports the first sample holder or the second sample holder through two first support arms; the first sample holder or the second sample holder includes a first extension portion, which is supported on the first support arm.

[0008] Furthermore, the probe's radial displacement is adjusted via a radially arranged slide rail; the slide rail is mounted on the multi-probe lifting mechanism, and the probe is slidably connected to the slide rail; The multi-probe lifting mechanism also includes a lifting drive device for driving the multi-probe lifting mechanism to move upward or downward.

[0009] Further, the first sample holder or the second sample holder includes a supporting portion and a first clearance portion or the second clearance portion; the supporting portion is used to support the sample, and the first clearance portion or the second clearance portion is used to allow the probe to pass through the first sample holder or the second sample holder; the top surface of the first extension portion is higher than the top surface of the supporting portion.

[0010] Furthermore, the supporting part is arranged in a ring shape, and the area enclosed by the supporting part is hollow; The bearing portion has at least three circumferentially distributed partial openings to form the first clearance portion or the second clearance portion.

[0011] Furthermore, the local opening is a groove-like structure or a hole-like structure that extends through the radial wall thickness of the bearing portion.

[0012] Furthermore, the second sample transfer mechanism supports the sample via two second support arms; the two second support arms respectively support both sides of the sample; the two second support arms are connected and fixed via a second connecting arm.

[0013] Furthermore, the second support arm is arc-shaped.

[0014] Furthermore, the sample holder includes at least one receiving groove, which is a hollow circular structure for placing the first sample holder or the second sample holder; the first sample holder or the second sample holder also includes a second extension portion, which supports the edge of the receiving groove.

[0015] On the other hand, the present invention provides a sample transfer apparatus for implementing the above-mentioned sample transfer method of wafer-level high vacuum interconnect system, comprising a multi-probe lifting mechanism, at least one first sample transfer mechanism, at least one second sample transfer mechanism, a first sample holder and a second sample holder; the first sample transfer mechanism is at least used for clamping and transporting the first sample holder or the second sample holder; the second sample transfer mechanism is at least used for holding the sample; the multi-probe lifting mechanism is at least used for transferring the sample between the first sample holder and the second sample holder.

[0016] Furthermore, the multi-probe lifting mechanism includes at least three probes capable of moving up and down; The first sample holder or the second sample holder includes a sample-carrying surface for carrying the sample. The sample-carrying surface is provided with a support portion and a first clearance portion or a second clearance portion in an annular shape. The support portion encloses a sample-carrying space for placing the sample. The first clearance portion or the second clearance portion is used to allow the probe to pass through the first sample holder or the second sample holder. The first sample holder or the second sample holder also includes a first extension portion. The top surface of the first extension portion is higher than the sample-carrying surface and extends in a direction away from the sample-carrying space. A sidewall is formed between the first extension portion and the support portion. The first sample transfer mechanism includes two parallel first support arms and a first connecting arm for connecting the two first support arms. The distance between the two first support arms is greater than the diameter of the circular space enclosed by the sidewall. The second sample transfer mechanism includes two second support arms arranged opposite each other along a first direction and at least one second connecting arm for connecting the two second support arms. Each second support arm has a support platform for supporting the sample, and the top surface of the second connecting arm is lower than the top surface of the support platform. The length of the second support arm along the second direction is... ~ mm, where R is the radius of the sample.

[0017] Furthermore, the multi-probe lifting mechanism includes a base, which is connected to a lifting drive device; at least three slide rails are arranged in a ring on the base, and the track of each slide rail is arranged radially along the base; a first drive device and a base are provided on the slide rail, the drive end of the first drive device is connected to the base, and the base is slidably connected to the slide rail; the probe is arranged vertically on the base, and the length of the probe is 30~45 mm.

[0018] Furthermore, the base has a circular structure, the first end of the slide rail is hinged to the center of the base, and the second end of the slide rail can rotate along the edge of the base.

[0019] Furthermore, a hinge seat is provided at the center of the base, and the first end of the slide rail is rotatably connected to the base through the hinge seat.

[0020] Furthermore, the edge of the base extends upward to form a limiting wall; the second end of the slide rail is provided with a first guide wheel, a second guide wheel, and a second driving device; the first guide wheel is located inside the limiting wall and is rolled and supported on the surface of the base; the second guide wheel is located outside the limiting wall and rolls along the outer side of the limiting wall; the second driving device is connected to the second guide wheel for driving the second guide wheel to rotate.

[0021] Furthermore, the limiting wall is a continuous annular wall.

[0022] Furthermore, the rolling axis of the first guide wheel is parallel to the surface of the base; the rolling axis of the second guide wheel is perpendicular to the surface of the base.

[0023] Furthermore, the first guide wheel is a driven wheel, and the second guide wheel is a driving wheel.

[0024] Furthermore, the second end of the slide rail is also provided with a mounting bracket, on which the first guide wheel, the second guide wheel and the second drive device are all mounted.

[0025] Furthermore, the second driving device is a drive motor, and the output shaft of the drive motor is fixedly connected to the second guide wheel.

[0026] Furthermore, the diameter of the probe tip gradually decreases in the direction away from the base, forming a first guide cone surface.

[0027] Furthermore, the first sample holder or the second sample holder is hollow, the supporting part is at least two flanges, the flanges are circumferentially disposed on the outer edge of the sample carrying surface, and the radial extension length of the flanges in the sample carrying space is 3~5 mm; the first clearance part or the second clearance part is a groove formed between two adjacent flanges.

[0028] Furthermore, the first sample holder or the second sample holder is hollow, and the supporting part is an inner extension continuously and annularly arranged along the outer edge of the sample carrying surface. The radial extension length of the inner extension in the sample carrying space is 3~5mm. The first clearance part or the second clearance part is at least three clearance holes spaced apart along the circumferential direction of the inner extension part. The diameter of the clearance holes is larger than the diameter of the probe.

[0029] Furthermore, the diameter of the clearance hole gradually decreases along the direction away from the probe, forming a second guide cone surface.

[0030] Furthermore, a stepped portion is provided between the supporting portion and the side wall, and the top surface of the stepped portion is higher than the sample surface.

[0031] Furthermore, the first extension portion extends 6 to 12 mm in the radial direction of the sample holder.

[0032] Furthermore, the periphery of the sidewall extends in a direction away from the sample carrying space to form a second extension, and a slot that can accommodate the first support arm is formed between the first extension and the second extension.

[0033] Furthermore, the second support arm is arc-shaped.

[0034] Furthermore, the second connecting arm is configured as a telescopic structure.

[0035] Furthermore, it also includes a sample holder support, which includes at least one receiving groove. The receiving groove is a hollow circular structure used to place the first sample holder or the second sample holder. The inner diameter of the receiving groove is smaller than the diameter of the first outer extension of the first sample holder or the second sample holder, and larger than the diameter of the circular space enclosed by the sidewalls of the first sample holder or the second sample holder.

[0036] Furthermore, the sample transfer device also includes a first sample transfer rod connected to the first sample transfer mechanism; And / or, the sample transfer device further includes a second sample transfer rod connected to the second sample transfer mechanism.

[0037] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects: 1. The sample transfer method of this invention uses multiple probes as intermediaries to lift the sample from the sample holder, thus separating the sample from the sample holder. A second sample transfer mechanism then holds the sample, and the first sample transfer mechanism is used to replace different sample holders, achieving sample transfer across sample holders. The entire process can be performed in a high vacuum environment, is highly automated, safe, and prevents sample drop. Furthermore, the entire process does not require contact with the growth surface or effective growth area, thus not affecting sample quality.

[0038] 2. The probe is radially adjustable and can cover samples of different sizes from 2 inches to 12 inches, making it widely applicable. The clearance section on the sample holder uses groove and hole structures on the bottom sample support section, requiring minimal modification, and is compatible with sample holders from different devices, making it highly adaptable.

[0039] 3. The sample transfer device of the present invention uses a multi-probe lifting mechanism as a transfer mechanism, combined with the first sample transfer mechanism and the second sample transfer mechanism, to realize the transfer and transport of the sample between the two sample holders. The effective film growth surface is not touched throughout the process, and the sample growth surface is always placed downwards. It takes into account the actual production process of each device, has a simple structure, and facilitates sample transfer.

[0040] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the content specifically pointed out in the description. Attached Figure Description

[0041] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0042] Figure 1 This is a partial flowchart of the sample transfer method of the present invention; Figure 2 This is a partial flowchart of the sample transfer method of the present invention; Figure 3 This is a partial flowchart of the sample transfer method of the present invention; Figure 4 This is a partial flowchart of the sample transfer method of the present invention; Figure 5 This is a schematic diagram of the sample transfer device of the present invention; Figure 6 This is a schematic diagram of the multi-probe lifting mechanism of the present invention; Figure 7This is a schematic diagram of the structure of the first sample transfer mechanism of the present invention; Figure 8 This is a schematic diagram of the structure of the second sample transfer mechanism of the present invention; Figure 9 This is a top view of the second sample transfer mechanism of the present invention; Figure 10 This is a schematic diagram of the sample holder in Embodiment 1 of the present invention; Figure 11 This is a schematic diagram of the sample holder in Embodiment 2 of the present invention; Figure 12 This is a schematic diagram of the sample holder in Embodiment 3 of the present invention; Figure 13 This is a schematic diagram of the sample holder in Embodiment 4 of the present invention; Figure 14 This is a schematic diagram of the sample holder adapted to smaller samples in Embodiment 1 of the present invention; Figure 15 This is a schematic diagram of the sample holder structure of the present invention; Figure 16 for Figure 6 A magnified view of a section at point A in the middle; Figure 17 This is a top view and a cross-sectional view at BB of the sample holder in Embodiment 3 of the present invention; Figure 18 for Figure 17 A magnified view of a section at point C.

[0043] In the attached diagram: 1-Multi-probe lifting mechanism, 11-Base, 111-Lifting drive device, 112-Hinge seat, 113-Limiting wall, 12-Slide rail, 121-First drive device, 122-Base, 123-Probe, 124-Mounting bracket, 125-First guide wheel, 126-Second guide wheel, 127-Second drive device, 128-First guide cone surface, 2-First sample transfer mechanism, 21-First support arm, 22-First connecting arm, 3-Second sample transfer mechanism, 31-Second support arm, 311- Support platform, 32-second connecting arm, 401-first sample holder, 402-second sample holder, 41-sample carrying surface, 42-bearing part, 421-flange, 422-inner extension, 4301-first clearance part, 4302-second clearance part, 431-groove, 432-clearance hole, 433-second guide cone surface, 44-sample carrying space, 45-first outer extension, 46-side wall, 47-second outer extension, 48-slot, 49-step part, 5-sample, 6-sample holder bracket, 61-accommodating groove. Detailed Implementation

[0044] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments, and are not intended to limit the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] It should be noted that if the embodiments of the present invention involve directional indicators, such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0046] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0047] like Figures 1 to 18 As shown, the present invention provides a sample transfer method for a wafer-level high-vacuum interconnect system, comprising the following steps: S1. The first sample transfer mechanism 2 is controlled to move the first sample holder 401 containing the sample 5 to above the multi-probe lifting mechanism 1. The radial displacement of each probe 123 of the multi-probe lifting mechanism 1 is adjusted so that each probe 123 is aligned with the first clearance portion 4301 of the first sample holder 401. Specifically, the first sample transfer mechanism 2 supports the first sample holder 401 through two first support arms 21. The first sample holder 401 includes a first extension portion 45, which is supported on the first support arms 21. The probe 123 adjusts its radial displacement through a radially arranged slide rail 12. The slide rail 12 is mounted on the multi-probe lifting mechanism 1, and the probe 123 is slidably connected to the slide rail 12.

[0048] S2. Control the multi-probe lifting mechanism 1 and the first sample transfer mechanism 2 to move closer to each other in the vertical direction. Specifically, the multi-probe lifting mechanism 1 includes a lifting drive device 111, which is used to drive the multi-probe lifting mechanism 1 to move upward or downward. At this time, control the multi-probe lifting mechanism 1 to move upward. The probe 123 first reaches below the first sample transfer mechanism 2. Continue to control the multi-probe lifting mechanism 1 to move upward until each probe 123 passes through the first clearance part 4301 and contacts the bottom of the sample 5. Continue to control the multi-probe lifting mechanism 1 to move upward. The probe 123 lifts and supports the sample 5, so that the sample 5 is separated from the first sample holder 401.

[0049] S3. The second sample transfer mechanism 3 is controlled to approach the sample 5 from the gap between the multiple probes 123 along the first direction and extend into the space between the first sample transfer mechanism 2 and the sample 5. The two second support arms 31 of the second sample transfer mechanism 3 support the sample 5 from below, with the second support arms 31 supporting the sample 5 on both sides respectively. The two second support arms 31 are connected and fixed by the second connecting arm 32, and the top surface of the second connecting arm 32 is lower than the supporting surface of the second support arm 31 supporting the sample 5.

[0050] S4. Control the multi-probe lifting mechanism 1 to move away from the first sample transfer mechanism 2 in the vertical direction, that is, control the multi-probe lifting mechanism 1 to move downward. At this time, the sample 5 moves downward with the probe 123, and the sample 5 and the second sample transfer mechanism 3 approach each other. As the multi-probe lifting mechanism 1 continues to move downward, the sample 5 contacts the second sample transfer mechanism 3 and is supported on the second sample transfer mechanism 3. Continue to control the multi-probe lifting mechanism 1 to move downward, and the top of the probe 123 leaves the lower surface of the sample 5 and gradually moves away from the sample 5. Then it passes through the first clearance part 4301 of the first sample holder 401. Continue to control the multi-probe lifting mechanism 1 to move downward until it returns to the initial position.

[0051] S5. Control the first sample transfer mechanism 2 to place the empty first sample holder 401 on the sample holder support 6. Figure 3 (Not shown); the first sample transfer mechanism 2 is controlled to move the unloaded second sample holder 402 above the multi-probe lifting mechanism 1, and the radial displacement of each probe 123 of the multi-probe lifting mechanism 1 is adjusted so that each probe 123 is aligned with the second clearance portion 4302 of the second sample holder 402. The second sample holder 402 includes a first extension portion 45, which is supported on the first support arm 21.

[0052] S6. Control the multi-probe lifting mechanism 1 to move closer to the first sample transfer mechanism 2 in the vertical direction, that is, control the multi-probe lifting mechanism 1 to move upward. At this time, the probes 123 gradually approach the first sample transfer mechanism 2 until each probe 123 passes through the second clearance part 4302 of the second sample holder 402. Continue to control the multi-probe lifting mechanism 1 to move upward. The probes 123 contact the bottom of the sample 5 and hold the sample 5, so that the sample 5 leaves the second sample transfer mechanism 3.

[0053] S7. Control the second sample transfer mechanism 3 to withdraw away from the sample 5 in the first direction from the area between the multiple probes 123. At this time, only the probes 123 are used to hold the sample 5.

[0054] S8. Control the multi-probe lifting mechanism 1 to move away from the first sample transfer mechanism 2 in the vertical direction, that is, control the multi-probe lifting mechanism 1 to move downward. The sample 5 moves downward with the probe 123 and falls back onto the second sample holder 402. Continue to control the multi-probe lifting mechanism 1 to move downward. The probe 123 leaves the lower surface of the sample 5 and passes through the second clearance part 4302 until it returns to the initial position, completing the transfer of the sample 5 from the first sample holder 401 to the second sample holder 402.

[0055] It should be noted that the first sample holder 401 and the second sample holder 402 may adopt the same structure or different structures, and the first clearance part 4301 and the second clearance part 4302 may also adopt the same structure or different structures.

[0056] In some specific embodiments, the first sample holder 401 or the second sample holder 402 further includes a support portion 42 for supporting the sample 5. The top surface of the first extension portion 45 is higher than the top surface of the support portion 42. This allows the sample 5 to be stably confined within the sample-carrying surface 41 where the support portion 42 is located, preventing the sample 5 from shifting in the horizontal direction.

[0057] In some specific embodiments, the support portion 42 is arranged in a ring shape, and the area enclosed by the support portion 42 is hollow; the support portion 42 has at least three circumferentially distributed partial openings to form a first clearance portion 4301 or a second clearance portion 4302. The partial openings are groove-like structures or hole-like structures that penetrate the radial wall thickness of the support portion 42.

[0058] It should be noted that the annular support portion 42 only contacts the area of ​​the sample 5 where no film has grown, thus avoiding contact with the effective area and affecting sample quality. The support portion 42 has a groove-like or perforated structure to form a first clearance portion 4301 or a second clearance portion 4302, resulting in minimal modification to the sample holder and strong compatibility.

[0059] To implement the above-described sample transfer method, the present invention also provides a sample transfer device, which is further described below through specific embodiments.

[0060] Example 1 like Figures 5-18 As shown, the sample transfer device of the present invention includes a multi-probe lifting mechanism 1, at least one first sample transfer mechanism 2, at least one second sample transfer mechanism 3, and a first sample holder 401 and a second sample holder 402 for placing sample 5.

[0061] It should be noted that the first sample holder 401 and the second sample holder 402 can have the same structure or different structures. The sample transfer device of this invention is configured within the vacuum transfer operation chamber of a high-vacuum interconnection system, with a working vacuum level better than 1×10⁻⁶. -8 mbar.

[0062] The multi-probe lifting mechanism 1 includes at least three probes 123 that can move up and down.

[0063] It is understood that the number of probes 123 can be 3, 4, 5, 6 or more, to achieve uniform support for the sample. Preferably, in this embodiment, the number of probes 123 is 4, balancing the balance of support and cost. The probes 123 can be made of ceramic, sapphire or molybdenum alloy, which are stable and adaptable to various working environments.

[0064] In some specific embodiments, the multi-probe lifting mechanism 1 includes a liftable base 11, which is connected to a lifting drive device 111; at least three slide rails 12 are arranged in a ring on the base 11. In this embodiment, there are four slide rails 12. The track of each slide rail 12 is arranged radially along the base 11. A first drive device 121 and a base 122 are provided on the slide rail 12. The drive end of the first drive device 121 is connected to the base 122, and the base 122 is slidably connected to the slide rail 12; a probe 123 is arranged vertically on the base 122, and the length of the probe 123 is 30~45 mm. As an example, the length of the probe 123 can be 30, 32, 34, 36, 38, 40, 42, 45 mm, or any range between two values.

[0065] It is understood that the base 11 of the multi-probe lifting mechanism 1 can be raised and lowered, thereby driving the probe 123 to rise or fall. The probe 123 is used to support the sample 5. The sample 5 is usually a wafer. In the field of semiconductor technology, the wafer is usually located on top during thin film deposition, for example, during pulsed laser deposition, the wafer is above the target material with the thin film growth surface facing down. The device of the present invention can transfer the sample while keeping the thin film growth surface facing down, avoiding multiple flipping of the sample 5, adapting to the thin film growth process, reducing the steps in the transfer process, and having stronger adaptability. The present invention uses the probe 123 to support the sample 5, which can only contact the area of ​​the sample 5 where no thin film has grown, thereby avoiding the thin film growth area and not affecting the sample quality. Furthermore, the slide rail 12 is arranged radially, and the base 122 can reciprocate along the radial direction of the base 11 on the slide rail 12, thereby allowing the probe 123 to move radially, adjusting the position of the probe 123 to adapt to samples of different sizes, such as wafers from 2 inches to 12 inches.

[0066] In some specific embodiments, the base 11 has a circular structure, the first end of the slide rail 12 is hinged to the center of the base 11, and the second end of the slide rail 12 can rotate along the edge of the base 11. Specifically, a hinge seat 112 is provided at the center of the base 11, and the first end of the slide rail 12 is rotatably connected to the base 11 through the hinge seat 112. The edge of the base 11 extends upward to form a limiting wall 113. More preferably, the limiting wall 113 is a continuous annular wall. A mounting bracket 124 is provided at the second end of the slide rail 12, and the mounting bracket 124 is provided with a first guide wheel 125, a second guide wheel 126, and a second driving device 127. The first guide wheel 125 is located inside the limiting wall 113 and is rolled on the surface of the base 11. The first guide wheel 125 is a driven wheel, and the rolling axis of the first guide wheel 125 is parallel to the surface of the base 11. The second guide wheel 126 is located outside the limiting wall 113 and rolls along the outer wall of the limiting wall 113. The second guide wheel 126 serves as the driving wheel, and its rolling axis is perpendicular to the surface of the base 11. The second drive device 127 is connected to the second guide wheel 126 for driving its rotation. Specifically, the second drive device 127 is a drive motor, and its output shaft is fixedly connected to the second guide wheel 126.

[0067] It should be noted that on the circular base 11, the first end of the slide rail 12 is rotatably connected to the center of the base 11 via a hinge seat 112, and the second end rotates along the edge of the base 11 via a first guide wheel 125, a second guide wheel 126, and a second driving device 127. This allows the slide rail 12 to move circumferentially on the surface of the base 11, thereby enabling the probe 123 to move circumferentially. The position of the probe 123 is radially and circumferentially adjustable, enhancing adaptability. Specifically, the second driving device 127 drives the second guide wheel 126 to rotate. Under the action of friction, the second guide wheel 126 rolls along the outer wall of the limiting wall 113, thereby causing the second end of the slide rail 12 to rotate along the edge of the base 11. The first guide wheel 125, as a driven wheel, has a supporting function. When the second end of the slide rail 12 moves circumferentially along the base 11, it reduces the friction between the slide rail 12 and the surface of the base 11, making the operation of the slide rail 12 smoother. At this time, since the first end of the slide rail 12 is hinged to the hinge seat 112, the movement trajectory of a single slide rail 12 forms a fan-shaped area with the center of the base 11 as the center and the length of the slide rail 12 as the radius.

[0068] The first sample holder 401 or the second sample holder 402 of the present invention includes a sample-carrying surface 41 for carrying a sample 5. A supporting portion 42 and a first clearance portion 4301 or a second clearance portion 4302 are arranged annularly on the sample-carrying surface 41. The supporting portion 42 encloses a sample-carrying space 44 for placing the sample 5. The first clearance portion 4301 or the second clearance portion 4302 allows a probe 123 to pass through the first sample holder 401 or the second sample holder 402. The first sample holder 401 or the second sample holder 402 also includes a first extension portion 45. The top surface of the first extension portion 45 is higher than the sample-carrying surface 41 and extends in a direction away from the sample-carrying space 44. A sidewall 46 is formed between the first extension portion 45 and the supporting portion 42.

[0069] In some specific embodiments, the first sample holder 401 or the second sample holder 402 is hollow, the supporting part 42 is at least two flanges 421, the flanges 421 are circumferentially disposed on the outer edge of the sample carrying surface 41, and the radial extension length of the flanges 421 in the sample carrying space 44 is 3~5 mm; the first clearance part 4301 or the second clearance part 4302 is a groove 431 formed between two adjacent flanges 421.

[0070] It is understood that in this embodiment, the first sample holder 401 or the second sample holder 402 has a flange 421 on its hollow inner edge. The flange 421 is used to support the sample 5, and the groove 431 between the flanges 421 allows the probe 123 to pass through to support the sample 5. There can be two or more flanges 421. In this embodiment, there are four flanges 421. The radial extension length of the flange 421 is 3~5 mm, which only contacts the area of ​​the sample 5 where no film grows, and makes the positional relationship of the sample 5 stable when it is placed in the first sample holder 401 or the second sample holder 402, avoiding the sample 5 from moving in the horizontal direction and damaging the film growth surface.

[0071] It is understood that multiple first sample holders 401 or second sample holders 402 can be configured according to different sample sizes to accommodate samples ranging from 2 inches to 12 inches. To ensure compatibility with the same first sample transfer mechanism 2, the diameter of the first extension 45 of different first sample holders 401 or second sample holders 402 can be kept constant, while the diameter of the sidewall 46 of the first sample holder 401 or second sample holder 402 can be adjusted accordingly to accommodate samples 5 ranging from 2 inches to 12 inches (e.g., ...). Figure 14 (As shown). By reducing the diameter of the sidewall 46, it is downward compatible to accommodate samples 5 of different sizes. This ensures that the sample 5 always maintains a tight fit on the first sample holder 401 or the second sample holder 402 without horizontal displacement. Preferably, the extension length of the first extension portion 45 can be 6 to 12 mm. As an example, the extension length of the first extension portion 45 can be 6, 7, 8, 9, 10, 11, or 12 mm, or any range defined between two values.

[0072] The first sample transfer mechanism 2 of the present invention includes two parallel first support arms 21 and a first connecting arm 22 for connecting the two first support arms 21. The distance between the two first support arms 21 is greater than the diameter of the circular space enclosed by the side wall 46.

[0073] It should be noted that the two parallel first support arms 21 of the first sample transfer mechanism 2 are used to support the first sample holder 401 or the second sample holder 402. Specifically, the two first support arms 21 and the first connecting arm 22 together form a generally "U"-shaped structure. The two first support arms 21 pass under the first sample holder 401 or the second sample holder 402, supporting the first extension 45, thereby realizing the transfer of the first sample holder 401 or the second sample holder 402. It can be understood that the distance between the two first support arms 21 is slightly larger than the diameter of the circular space enclosed by the sidewall 46.

[0074] In some specific embodiments, a first sample transfer rod (not shown in the figure) connected to the first sample transfer mechanism 2 is also included.

[0075] It should be noted that the first sample transfer rod is an ultra-high vacuum magnetically coupled sample transfer rod. Through the magnetic coupling between an external driving magnet and a driven magnet within the vacuum transfer operating chamber, external linear extension and rotational motion are synchronously and non-contactly transmitted to the vacuum transfer operating chamber. The moving end of the first sample transfer rod, which moves synchronously with the driven magnet, is fixedly connected to the first sample transfer mechanism 2. The operator manipulates the first sample transfer rod to achieve synchronous movement of the first sample transfer mechanism 2, thereby completing the picking, placing, and transferring of the first sample holder 401 or the second sample holder 402.

[0076] The second sample transfer mechanism 3 of the present invention includes two second support arms 31 arranged opposite each other along a first direction (X direction) and at least one second connecting arm 32 for connecting the two second support arms 31. Each second support arm 31 has a support platform 311 for supporting the sample, and the top surface of the second connecting arm 32 is lower than the top surface of the support platform 311. The length of the second support arm 31 along the second direction (Y direction) is... ~ mm (e.g.: mm mm mm mm mm (mm), R is the radius of sample 5.

[0077] In some specific embodiments, the maximum length of the support platform 311 along the first direction is 3 to 5 mm.

[0078] It should be noted that, referring to Figure 9The first direction is specifically the X direction, and the second direction is specifically the Y direction. The support stage 311 supports the sample 5. To avoid contact with the film growth surface, two second support arms 31 are located on either side of the sample 5, ensuring that the support stage 311 only contacts the edge of the sample 5. The shape and size of the support stage 311 match the shape and size of the edge of the sample 5, while limiting the maximum length of the support stage 311 along the first direction. This allows the support stage 311 and the sample 5 to form a relatively tight fit without contacting the film growth surface, preventing the sample 5 from moving horizontally when placed on the second sample transfer mechanism 3. The two second support arms 31 are connected by a second connecting arm 32. The top surface of the second connecting arm 32 is lower than the top surface of the support stage 311. Therefore, there is space between the second connecting arm 32 and the sample 5, preventing contact and thus not affecting the film growth surface. One or more second connecting arms 32 can be provided as needed. In this embodiment, there are two second connecting arms 32, respectively located at the ends of the two second support arms 31.

[0079] Understandably, the second sample transfer mechanism 3 needs to pass through the gaps between multiple probes 123 to enter between the first sample transfer mechanism 2 and the sample 5. Therefore, the width of the second sample transfer mechanism 3 is limited to facilitate its entry into the gaps between the probes 123. In actual operation, the second sample transfer mechanism 3 temporarily supports the sample 5 by entering the gaps between the multiple probes 123 along the first direction.

[0080] It should be noted that multiple second sample transfer mechanisms 3 can be configured as needed. The length of the second connecting arm 32 of each second sample transfer mechanism 3 can be adjusted according to the diameter of the sample 5 to accommodate different samples ranging from 2 inches to 12 inches. Alternatively, the second connecting arm 32 can be configured as a telescopic structure to accommodate at least two different sizes of samples 5.

[0081] In some specific implementations, the second support arm 31 is arc-shaped.

[0082] It should be noted that the shape and size of the second support arm 31 are adapted to the shape and size of the edge of the sample 5. Furthermore, the shape and size of the support stage 311 match the shape and size of the edge of the sample 5. The radial extension length of the support stage 311 is 3~5 mm. The support stage 311 does not affect the film growth surface of the sample, and at the same time, it forms a tight fit with the sample 5, preventing the sample 5 from shifting in the horizontal direction.

[0083] It is understandable that the second support arm 31 is an arc-shaped structure. The length of the second support arm 31 along the second direction specifically refers to the chord length of the second support arm 31.

[0084] In some specific embodiments, a second sample transfer rod (not shown in the figure) connected to the second sample transfer mechanism 3 is also included.

[0085] It should be noted that the second sample transfer rod is also an ultra-high vacuum magnetically coupled sample transfer rod. Through the magnetic coupling between an external driving magnet and the driven magnet inside the vacuum transfer operating chamber, the external linear extension and rotational motion is synchronously and non-contactly transmitted to the vacuum transfer operating chamber. The moving end of the second sample transfer rod, which moves synchronously with the driven magnet, is fixedly connected to the second sample transfer mechanism 3. The operator manipulates the second sample transfer rod to achieve the synchronous movement of the second sample transfer mechanism 3, thereby completing the temporary support of the sample.

[0086] In some preferred embodiments, the moving end of the second sample transfer rod, which moves synchronously with the driven magnet, is engaged with the second sample transfer mechanism 3 via a snap-fit ​​structure, which facilitates disassembly and assembly, and allows the specific second sample transfer mechanism 3 to be replaced according to the size of the sample 5.

[0087] The present invention also includes a sample holder 6. The sample holder 6 is used to place a first sample holder 401 or a second sample holder 402. In this embodiment, the sample holder 6 includes at least one receiving groove 61, which is a hollow circular structure used to place the first sample holder 401 or the second sample holder 402. The inner diameter of the receiving groove 61 is smaller than the diameter of the first outer extension 45 of the first sample holder 401 or the second sample holder 402, and larger than the diameter of the circular space enclosed by the sidewall 46 of the first sample holder 401 or the second sample holder 402.

[0088] In some specific embodiments, the periphery of the sidewall 46 of the first sample holder 401 or the second sample holder 402 extends away from the sample space 44 to form a second extension 47, and a slot 48 that can accommodate the first support arm 21 is formed between the first extension 45 and the second extension 47.

[0089] It should be noted that the sample holder 6 includes one or more receiving grooves 61. The receiving groove 61 is configured as a hollow circular structure, and its diameter is between the diameter of the first extension 45 of the first sample holder 401 or the second sample holder 402 and the diameter of the side wall 46. A second extension 47 is provided on the periphery of the side wall 46 of the first sample holder 401 or the second sample holder 402, and a slot 48 through which the first support arm 21 can pass is provided between the first extension 45 and the second extension 47. When the first sample holder 401 or the second sample holder 402 is placed in the receiving groove 61 of the sample holder 6, the inner ring portion of the first sample holder 401 or the second sample holder 402 enclosed by the side wall 46 is suspended in the hollow area of ​​the receiving groove 61, and the bottom of the second extension 47 is supported on the top surface of the edge of the receiving groove 61. The two first support arms 21 of the first sample transfer mechanism 2 can pass through the slot 48 and hold the first sample holder 401 or the second sample holder 402, so as to realize the picking and placing of the first sample holder 401 or the second sample holder 402.

[0090] Example 2 This embodiment is largely the same in structure as Embodiment 1, except that, as Figure 11 As shown, a stepped portion 49 is provided between the support portion 42 of the first sample holder 401 or the side wall 46, and the top surface of the stepped portion 49 is higher than the sample surface 41.

[0091] Understandably, by setting the stepped portion 49, the area of ​​the sample-carrying surface 41 is reduced, thereby adapting to a smaller sample 5.

[0092] Example 3 like Figure 12 As shown, the remaining components of this embodiment are the same as those in Embodiment 1, except that the first sample holder 401 or the second sample holder 402 also has another implementation. The first sample holder 401 or the second sample holder 402 is hollow, and the supporting part 42 is an inner extension 422 continuously and annularly arranged along the outer edge of the sample carrying surface 41. The radial extension length of the inner extension 422 in the sample carrying space 44 is 3~5 mm. The first clearance part 4301 or the second clearance part 4302 is at least three clearance holes 432 spaced apart along the circumferential direction of the inner extension 422. In this embodiment, there are four clearance holes 432. The diameter of the clearance holes 432 is larger than the diameter of the probe 123.

[0093] It should be noted that the first sample holder 401 or the second sample holder 402 can support the sample 5 by setting a continuous epitaxial portion 422 as a support portion 42. The extension length of the epitaxial portion 422 is 3~5 mm, so that the epitaxial portion 422 only contacts the area of ​​the sample 5 where no film is grown, and makes the positional relationship of the sample 5 stable when placed on the first sample holder 401 or the second sample holder 402, avoiding the sample 5 from moving in the horizontal direction and damaging the film growth surface. Moreover, the first clearance portion 4301 or the second clearance portion 4302 is realized by opening a clearance hole 432 on the epitaxial portion 422, through which the probe 123 can pass to lift the sample 5. Therefore, the diameter of the clearance hole 432 is larger than the diameter of the probe 123.

[0094] Understandably, the number of clearance holes 432 can be set according to the number of probes 123, and can be three or more.

[0095] like Figure 16 In some embodiments, the diameter of the end of the probe 123 gradually decreases in the direction away from the base 122, forming a first guide cone surface 128.

[0096] It should be noted that a guide cone is provided at the end of the probe 123 to facilitate the automatic centering of the probe 123 through the clearance hole 432.

[0097] like Figure 17 and Figure 18In some embodiments, the aperture of the clearance hole 432 gradually decreases in the direction away from the probe 123, forming a second guide cone surface 433.

[0098] It should be noted that the clearance hole 432 is also provided with a conical structure for guidance, which is beneficial for the probe 123 to pass through the clearance hole 432.

[0099] Example 4 like Figure 13 As shown, the structure of this embodiment is generally the same as that of embodiment 3. The difference is that a stepped part 49 is provided between the bearing part 42 of the first sample holder 401 or the side wall 46, and the top surface of the stepped part 49 is higher than the sample surface 41.

[0100] Understandably, by setting the stepped portion 49, the area of ​​the sample-carrying surface 41 is reduced, thereby adapting to a smaller sample 5.

[0101] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A sample transfer method of a wafer level high vacuum interlock system, characterized by, Includes the following steps: S1. Control the first sample transfer mechanism (2) to move the first sample holder (401) containing the sample (5) to the top of the multi-probe lifting mechanism (1), and adjust the radial displacement of each probe (123) of the multi-probe lifting mechanism (1) so that each probe (123) is aligned with the first clearance part (4301) of the first sample holder (401). S2. Control the multi-probe lifting mechanism (1) and the first sample transfer mechanism (2) to move closer to each other in the vertical direction until each probe (123) passes through the first clearance part (4301) and holds the sample (5), so that the sample (5) is separated from the first sample holder (401); S3. Control the second sample transfer mechanism (3) to extend from above the first sample transfer mechanism (2) into the gap between the probes (123) and support the sample (5) from below. S4. Control the multi-probe lifting mechanism (1) and the first sample transfer mechanism (2) to move away from each other in the vertical direction and return to the initial position; S5. Control the first sample transfer mechanism (2) to place the empty first sample holder (401) on the sample holder support (6); control the first sample transfer mechanism (2) to move the empty second sample holder (402) above the multi-probe lifting mechanism (1), and adjust the radial displacement of each probe (123) of the multi-probe lifting mechanism (1) so that each probe (123) is aligned with the second clearance part (4302) of the second sample holder (402); S6. Control the multi-probe lifting mechanism (1) and the first sample transfer mechanism (2) to move closer to each other in the vertical direction until each probe (123) passes through the second clearance part (4302) and supports the sample (5). S7. Withdraw the second sample transfer mechanism (3); S8. Control the multi-probe lifting mechanism (1) and the first sample transfer mechanism (2) to move away from each other in the vertical direction and return to the initial position; The first sample holder (401) and the second sample holder (402) have the same or different structures; the first clearance part (4301) and the second clearance part (4302) have the same or different structures.

2. The sample transfer method of a wafer level high vacuum interlock system according to claim 1, wherein, The first sample transfer mechanism (2) supports the first sample holder (401) or the second sample holder (402) through two first support arms (21); the first sample holder (401) or the second sample holder (402) includes a first extension (45), which is supported on the first support arm (21).

3. The sample transfer method of a wafer level high vacuum interlock system according to claim 1, wherein, The probe (123) is adjusted for radial displacement by a radially arranged slide rail (12); the slide rail (12) is mounted on the multi-probe lifting mechanism (1), and the probe (123) is slidably connected to the slide rail (12); The multi-probe lifting mechanism (1) also includes a lifting drive device (111) for driving the multi-probe lifting mechanism (1) to move upward or downward.

4. The sample transfer method of claim 2, wherein, The first sample holder (401) or the second sample holder (402) includes a support portion (42) and a first clearance portion (4301) or a second clearance portion (4302); the support portion (42) is used to support the sample (5), and the first clearance portion (4301) or the second clearance portion (4302) is used to allow the probe (123) to pass through the first sample holder (401) or the second sample holder (402); the top surface of the first extension portion (45) is higher than the top surface of the support portion (42).

5. The sample transfer method of a wafer level high vacuum interlock system according to claim 4, wherein, The supporting part (42) is arranged in a ring shape, and the area enclosed by the supporting part (42) is hollow; The bearing portion (42) has at least three circumferentially distributed partial openings to form the first clearance portion (4301) or the second clearance portion (4302).

6. The sample transfer method of a wafer level high vacuum interlock system according to claim 5, wherein, The local opening is a groove-shaped structure or a hole-shaped structure that extends through the radial wall thickness of the bearing part (42).

7. The method of claim 1, wherein the wafer level high vacuum interconnect system is a wafer level vacuum interconnect system. The second sample transfer mechanism (3) supports the sample (5) through two second support arms (31); the two second support arms (31) support the sample (5) on both sides respectively; the two second support arms (31) are connected and fixed through a second connecting arm (32).

8. The sample transfer method of a wafer level high vacuum interlock system according to claim 7, wherein, The second support arm (31) is arc-shaped.

9. The method of claim 1, wherein the wafer level high vacuum interconnect system is a wafer level vacuum interconnect system. The sample holder (6) includes at least one receiving groove (61), which is a hollow circular structure for placing the first sample holder (401) or the second sample holder (402); the first sample holder (401) or the second sample holder (402) also includes a second extension (47), which supports the edge of the receiving groove (61).

10. A sample transfer apparatus for implementing the sample transfer method of a wafer-level high-vacuum interconnect system according to any one of claims 1 to 9, characterized in that, It includes a multi-probe lifting mechanism (1), at least one first sample transfer mechanism (2), at least one second sample transfer mechanism (3), a first sample holder (401) and a second sample holder (402); the first sample transfer mechanism (2) is at least used to clamp and transfer the first sample holder (401) or the second sample holder (402); the second sample transfer mechanism (3) is at least used to hold the sample (5); the multi-probe lifting mechanism (1) is at least used to transfer the sample (5) between the first sample holder (401) and the second sample holder (402).

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