Wafer automatic alignment and rapid transfer mechanism

Abstract

The application discloses a wafer automatic alignment and rapid conveying mechanism, which comprises a base, an adsorption fixing assembly and a wafer end face protection assembly. A sliding table is slidably connected to the upper end face of the base, and a support frame is rotatably arranged on the upper end of the sliding table. A lifting block is slidably connected to one side of the support frame. Two guide rods are slidably connected to the lifting block. The end portions of the two guide rods are fixedly connected to a transverse block. An adjusting rod is slidably connected to one side of the transverse block. A fixed rod is fixedly connected to one side of the transverse block. The end portions of the adjusting rod and the fixed rod are fixedly connected to a disc. The adsorption fixing assembly comprises a plurality of branch pipes. The branch pipes are fixedly penetrated through the lower connecting disc and are fixedly connected to a suction disc at one end. The wafer end face protection assembly comprises an elastic pad fixedly sleeved on the connecting disc. The wafer end face protection assembly is used to avoid that the wafer is pressed by a mechanical arm or contacted with other equipment in a subsequent station, so that scratches, imprints or abrasive particles are embedded on the wafer surface due to residual debris, and thus the wafer quality is ensured.

Description

Technical Field

[0001] This invention belongs to the field of wafer processing technology, specifically a wafer automatic alignment and rapid transfer mechanism. Background Technology

[0002] A wafer is a silicon chip used to make silicon semiconductor circuits. Its manufacturing process starts with a bare wafer and requires multiple precision processes such as edge trimming, surface grinding, photolithography, and etching. Automatic alignment and rapid transfer of the bare wafer between each process are necessary to ensure continuous production.

[0003] In the edge trimming process, it is necessary to remove chipped edges, burrs, and stress layers from the bare wafer to prevent breakage during subsequent processing. This process generates a large amount of silicon debris and abrasive particles. However, existing wafer transport mechanisms (such as the wafer carrier and transport device disclosed in CN210006714U) lack end-face protection structures, allowing debris to directly splash and adhere to the upper and lower surfaces of the bare wafer. The exposed surface of the bare wafer is highly sensitive to surface damage. When it is subsequently pressed by a robotic arm and comes into contact with equipment, residual debris can directly cause irreversible physical damage such as surface scratches, indentations, and abrasive particle embedding. This type of damage significantly reduces the surface flatness and cleanliness of the bare wafer, leading to subsequent photolithography alignment deviations and thin film deposition defects, ultimately rendering the bare wafer unusable and significantly increasing production costs and yield losses. Therefore, considering the processing characteristics of bare wafers, developing a mechanism with end-face protection, automatic alignment, and rapid transport to prevent debris contamination and surface damage from the source has become an urgent need for automated bare wafer processing. Summary of the Invention

[0004] The main objective of this invention is to provide an automatic wafer alignment and rapid transfer mechanism to solve at least one of the technical problems mentioned in the background art.

[0005] To achieve the above-mentioned objectives, the present invention adopts the following technical solution.

[0006] Some embodiments of the present invention provide a wafer automatic alignment and rapid transfer mechanism comprising: The base has a slide table slidably connected to its upper surface. A support frame is rotatably mounted on the upper surface of the slide table. A lifting block is slidably connected to one side of the support frame. Two guide rods are slidably connected to the lifting block. A transverse block is fixedly connected to the ends of the two guide rods. An adjusting rod is slidably connected to one side of the transverse block. A fixing rod is fixedly connected to one side of the transverse block. A connecting plate is fixedly connected to the ends of both the adjusting rod and the fixing rod. An adsorption and fixing assembly includes multiple branch tubes, which are fixedly connected through a lower connecting plate, and one end of each branch tube is fixedly connected to a suction cup. A wafer end face protection assembly includes an elastic pad fixedly sleeved on a connecting disk, and multiple traction rods evenly distributed and slidably connected along the circumference of the connecting disk, with the ends of the traction rods fixedly connected to the edges of the elastic pad.

[0007] In one embodiment, a first threaded rod is threadedly connected to one side of the bottom of the slide table, and both ends of the first threaded rod are rotatably mounted on the base. A first motor is fixedly connected to one side of the base, and the output end of the first motor is fixedly connected to one end of the first threaded rod. A second motor is fixedly connected to one side of the inner cavity of the slide table, and the output end of the second motor is fixedly connected to the bottom of the support frame.

[0008] In one embodiment, a second threaded rod is threadedly connected to one side of the lifting block, and both ends of the second threaded rod are rotatably mounted on a support frame. A third motor is fixedly connected to one side of the support frame, and the output end of the third motor is fixedly connected to one end of the second threaded rod. A first cylinder is fixedly connected to one side of the lifting block, and the piston end of the first cylinder is fixedly connected to one side of the transverse block.

[0009] In one embodiment, a second cylinder is fixedly connected to one side of the transverse block, and the piston end of the second cylinder is fixedly connected to one end of the adjusting rod.

[0010] In one embodiment, a connecting plate is fixedly connected to one side of the connecting plate, and a third threaded rod is threaded to one end of the traction rod, with both ends of the third threaded rod rotatably mounted on the connecting plate.

[0011] In one embodiment, a fifth motor is fixedly connected to one side of the connecting plate, and a first bevel gear is fixedly connected to the output end of the fifth motor. The first bevel gear is rotatably mounted on the connecting plate, and a second bevel gear is fixedly sleeved on one end of the third threaded rod. The first bevel gear and the second bevel gear mesh with each other.

[0012] In one embodiment, an air pump is fixedly connected to one side of the lower connecting plate, the air pump inlet is connected to an annular pipe, one end of the branch pipe is connected to one side of the annular pipe, and the annular pipe is fixedly connected to the connecting plate.

[0013] In one embodiment, the automatic wafer alignment and rapid transfer mechanism further includes a self-cleaning component. The self-cleaning component includes a first scraper and a second scraper slidably connected to both sides of the traction rod via a slide groove, with adjacent first and second scrapers inserted and slidably connected. A transverse plate is slidably connected to one side of the lower end face of the fixed rod, and collection boxes are slidably connected to both sides of the transverse plate. The edges of the first and second scrapers are in contact with the surface of the elastic pad.

[0014] In one embodiment, a fifth threaded rod is threadedly connected to one end of the first scraper, and both ends of the fifth threaded rod are rotatably mounted on a traction rod. A fourth motor is fixedly connected to one end of the traction rod, and the output end of the fourth motor is fixedly connected to one end of the fifth threaded rod.

[0015] In one embodiment, a fourth threaded rod is threaded to one end of the transverse plate, and both ends of the fourth threaded rod are rotatably mounted on a fixed rod. A sixth motor is fixedly connected to one side of the fixed rod, and the output end of the sixth motor is fixedly connected to one end of the fourth threaded rod. Two bidirectional threaded rods are rotatably mounted at both ends of one side of the transverse plate, and both sides of the bidirectional threaded rods are threadedly connected to the collection boxes on both sides. A seventh motor is fixedly connected to one side of the transverse plate, and the output end of the seventh motor is fixedly connected to the end of the bidirectional first threaded rod.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects: 1) This invention utilizes a wafer end-face protection component. Before grinding the wafer edges, the two sides of the wafer are covered by a connecting disk and an elastic pad. When the grinding disk grinds the wafer edges, because the upper and lower surfaces of the wafer are covered, debris will not adhere to the wafer surface. This prevents scratches, indentations, or abrasive grain embedding on the wafer surface due to debris residue when the wafer is pressed by a robotic arm or comes into contact with other equipment in subsequent processing stations, thus ensuring wafer quality. In addition, the size of the elastic pad can be adjusted according to the wafer diameter, achieving the covering effect without interfering with the operation of the grinding disk due to an excessively large covering component.

[0017] 2) This invention utilizes a self-cleaning component, which, through the coordinated action of multiple first and second scrapers, achieves self-cleaning of debris on the surface of the elastic pad. This prevents debris remaining on the elastic pad from falling onto the wafer surface and contaminating it during subsequent use. Simultaneously, it also avoids the accumulation of debris on the elastic pad surface, which could negatively impact its elasticity. Attached Figure Description

[0018] The invention will now be further described with reference to the accompanying drawings.

[0019] Figure 1 This is a three-dimensional structural schematic diagram of a wafer automatic alignment and rapid transfer mechanism according to an embodiment of the present invention; Figure 2 This is a three-dimensional structural diagram of the slide table in one embodiment of the present invention; Figure 3 This is a three-dimensional structural diagram of the lifting block in one embodiment of the present invention; Figure 4 This is a three-dimensional structural diagram of the elastic pad in one embodiment of the present invention (the wafer is fixed). Figure 5 yes Figure 4 Enlarged view of a portion of point A in the middle; Figure 6 This is a three-dimensional structural diagram of the collection box in one embodiment of the present invention; Figure 7 This is a three-dimensional structural diagram of the connecting disk in one embodiment of the present invention; Figure 8 yes Figure 7 Enlarged view of a section at point B in the middle; Figure 9 This is a three-dimensional structural diagram of the suction cup in one embodiment of the present invention; Figure 10 This is a three-dimensional structural diagram of the annular tube in one embodiment of the present invention; Figure 11 This is a three-dimensional structural diagram of the air pump in one embodiment of the present invention; Figure 12 This is a three-dimensional structural diagram of the first scraper and the second scraper in one embodiment of the present invention.

[0020] Explanation of reference numerals in the attached drawings: 1. Base; 2. First motor; 3. First threaded rod; 4. Slide table; 5. Support frame; 6. Second motor; 7. Third motor; 8. Branch pipe; 9. Fourth motor; 10. Second threaded rod; 11. Lifting block; 12. First cylinder; 13. Guide rod; 14. Transverse block; 15. Second cylinder; 16. Adjusting rod; 17. Fixing rod; 18. Connecting plate; 19. Elastic pad; 20. Collection box; 21. Traction rod; 22. Fifth motor; 23. Connecting plate; 24. First bevel gear; 25. Second bevel gear; 26. Third threaded rod; 27. Annular tube; 28. Transverse plate; 29. ​​Fourth threaded rod; 30. Sixth motor; 31. Seventh motor; 32. Bidirectional threaded rod; 33. Air pump; 34. Suction cup; 35. Fifth threaded rod; 36. First scraper; 37. Second scraper. Detailed Implementation

[0021] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please refer to Figures 1-12This invention provides an automatic wafer alignment and rapid transfer mechanism, including a base 1, a slide table 4 slidably connected to the upper surface of the base 1, a support frame 5 rotatably mounted on the upper end of the slide table 4, a lifting block 11 slidably connected to one side of the support frame 5, two guide rods 13 slidably connected to the lifting block 11, a transverse block 14 fixedly connected to the ends of the two guide rods 13, an adjusting rod 16 slidably connected to one side of the transverse block 14, a fixing rod 17 fixedly connected to one side of the transverse block 14, and a connecting plate 18 fixedly connected to the ends of both the adjusting rod 16 and the fixing rod 17.

[0023] Furthermore, the automatic wafer alignment and rapid transfer mechanism also includes an adsorption and fixing assembly. The adsorption and fixing assembly includes multiple branch tubes 8, which are fixedly connected to the lower connecting plate 18, and one end of each branch tube 8 is fixedly connected to a suction cup 34.

[0024] Furthermore, the automatic wafer alignment and rapid transfer mechanism also includes a wafer end face protection assembly. The wafer end face protection assembly includes an elastic pad 19 fixedly sleeved on a connecting disk 18, and multiple traction rods 21 are evenly distributed and slidably connected along the circumference of the connecting disk 18, with the ends of the traction rods 21 fixedly connected to the edges of the elastic pad 19.

[0025] In this embodiment, as Figures 1-5 , Figures 7-11 As shown, a first threaded rod 3 is threadedly connected to one side of the bottom of the slide table 4. Both ends of the first threaded rod 3 are rotatably mounted on the base 1. A first motor 2 is fixedly connected to one side of the base 1. The output end of the first motor 2 is fixedly connected to one end of the first threaded rod 3. A second motor 6 is fixedly connected to one side of the inner cavity of the slide table 4. The output end of the second motor 6 is fixedly connected to the bottom of the support frame 5.

[0026] A second threaded rod 10 is threadedly connected to one side of the lifting block 11. Both ends of the second threaded rod 10 are rotatably mounted on the support frame 5. A third motor 7 is fixedly connected to one side of the support frame 5. The output end of the third motor 7 is fixedly connected to one end of the second threaded rod 10. A first cylinder 12 is fixedly connected to one side of the lifting block 11. The piston end of the first cylinder 12 is fixedly connected to one side of the transverse block 14.

[0027] A second cylinder 15 is fixedly connected to one side of the transverse block 14, and the piston end of the second cylinder 15 is fixedly connected to one end of the adjusting rod 16.

[0028] A connecting plate 23 is fixedly connected to one side of the connecting plate 18, and a third threaded rod 26 is threadedly connected to one end of the traction rod 21. Both ends of the third threaded rod 26 are rotatably mounted on the connecting plate 18.

[0029] A fifth motor 22 is fixedly connected to one side of the connecting plate 23. A first bevel gear 24 is fixedly connected to the output end of the fifth motor 22. The first bevel gear 24 is rotatably mounted on the connecting plate 23. A second bevel gear 25 is fixedly sleeved on one end of the third threaded rod 26. The first bevel gear 24 and the second bevel gear 25 mesh with each other.

[0030] An air pump 33 is fixedly connected to one side of the lower connecting plate 23. The air pump 33 has an air inlet end connected to an annular pipe 27. One end of the branch pipe 8 is connected to one side of the annular pipe 27. The annular pipe 27 is fixedly connected to the connecting plate 23.

[0031] Specifically, in existing technologies, wafers are fixed to the end of a transfer arm using electrostatic adsorption, and then the transfer arm aligns and transports the wafers. However, during wafer manufacturing, the wafer edges often need to be aligned with a grinding disc, which then trims and polishes the edges. However, this polishing process generates debris that can easily splash onto the wafer's surface, leading to scratches, indentations, or embedded abrasive particles on the wafer surface during subsequent processes.

[0032] Therefore, in order to solve the above problems, the working principle of this embodiment is as follows: The base 1 is installed in a suitable position in the wafer manufacturing area. The automatic wafer alignment and rapid transfer mechanism of this embodiment works in conjunction with a wafer robot in the prior art, using the robot to remove the wafer from the wafer basket. It should be noted that the aforementioned wafer is a bare wafer. Subsequently, the first motor 2 drives the first threaded rod 3 to rotate, allowing the slide 4 to slide laterally on the base 1. The second motor 6 drives the support frame 5 to rotate, and the third motor 7 drives the second threaded rod 10 to rotate, causing the lifting block 11 to rise and fall. Through the aforementioned orientation adjustment operation, the two connecting plates 18 are aligned with the wafer picked up by the robot. Then, the first cylinder 12 drives the two connecting plates 18 to move, positioning the wafer to be fixed between the two connecting plates 18, with the wafer's axis coinciding with that of the two connecting plates 18.

[0033] Next, the upper connecting plate 18 is first brought into contact with the upper surface of the wafer, so that the suction cup 34 also comes into contact with the upper surface of the wafer. Then, the air pump 33 is started to extract the air from the suction cup 34, thus fixing the wafer in place by negative pressure adsorption. At this time, the robot can release the wafer. Then, the second cylinder 15 drives the adjusting rod 16 to move down, so that the upper surface of the lower connecting plate 18 comes into contact with the lower surface of the wafer, and the two elastic pads 19 come into contact with the upper and lower surfaces of the wafer respectively. Then, the fifth motors 22 on both the upper and lower sides start simultaneously, and the first bevel gear 24 drives multiple second bevel gears 25 to rotate simultaneously, so that multiple third threaded rods 26 rotate simultaneously, so that multiple traction rods 21 slide radially on the connecting plate 18 simultaneously. The ends of the traction rods 21 can be used to pull the edge of the elastic pad 19 to move, so that the elastic pad 19 deforms until the edge of the elastic pad 19 comes into contact with the edge of the wafer. At this time, both ends of the wafer are largely covered by the connecting plate 18 and the elastic pad 19. Among them, the elastic pad 19 should preferably be made of ultra-clean, low-friction, high-elasticity, and anti-static materials, such as anti-static silicone (Shore A 30-50), polyurethane (PU), or fluororubber (FKM).

[0034] The wafer is then transferred to the grinding process, with its edge aligned with the grinding disc of the wafer edge grinding machine for physical grinding. Subsequently, by controlling the grinding disc's rotation speed, feed rate, and pressure, precise removal of edge material is achieved. When the grinding disc grinds the wafer edge, because the upper and lower surfaces of the wafer are covered, debris does not adhere to the wafer surface. This prevents scratches, indentations, or abrasive grain embedding on the wafer surface due to debris residue during subsequent processes, thus ensuring wafer quality. Furthermore, this method allows for adjustment of the size of the elastic pad 19 according to the wafer diameter, achieving a covering effect without interfering with the grinding disc's operation due to an excessively large covering.

[0035] In this embodiment, as Figure 6 , Figure 8 , Figure 12 As shown, the automatic wafer alignment and rapid transfer mechanism also includes a self-cleaning component. The self-cleaning component includes a first scraper 36 and a second scraper 37 slidably connected to both sides of the traction rod 21 via a slide groove. Adjacent first scrapers 36 and second scrapers 37 are inserted into and slidably connected. A transverse plate 28 is slidably connected to one side of the lower end face of the fixed rod 17. Collection boxes 20 are slidably connected to both sides of the transverse plate 28. The edges of the first scraper 36 and the second scraper 37 are in contact with the surface of the elastic pad 19.

[0036] The first scraper 36 is threaded to one end with a fifth threaded rod 35. Both ends of the fifth threaded rod 35 are rotatably mounted on the traction rod 21. One end of the traction rod 21 is fixedly connected to a fourth motor 9. The output end of the fourth motor 9 is fixedly connected to one end of the fifth threaded rod 35.

[0037] One end of the transverse plate 28 is threadedly connected to a fourth threaded rod 29. Both ends of the fourth threaded rod 29 are rotatably mounted on a fixed rod 17. A sixth motor 30 is fixedly connected to one side of the fixed rod 17. The output end of the sixth motor 30 is fixedly connected to one end of the fourth threaded rod 29. Two bidirectional threaded rods 32 are rotatably mounted on both ends of one side of the transverse plate 28. Both sides of the bidirectional threaded rods 32 are threadedly connected to the collection boxes 20 on both sides. A seventh motor 31 is fixedly connected to one side of the transverse plate 28. The output end of the seventh motor 31 is fixedly connected to one end of the bidirectional threaded rod 32.

[0038] Specifically, in the above embodiments, although the wafer surface can be covered by stretching the elastic pad 19, since the elastic pad 19 is an elastomer material with a certain degree of viscoelasticity, debris easily accumulates on the surface of the elastic pad 19. During subsequent use, this debris adhering to the surface of the elastic pad 19 easily falls onto the wafer surface, still causing contamination of the wafer surface. Furthermore, as debris continuously accumulates on the surface of the elastic pad 19, it also affects its elasticity, which is not conducive to subsequent recycling.

[0039] Therefore, in order to solve the above problems, the working principle of this embodiment is as follows: After each grinding operation, the sixth motor 30 drives the fourth threaded rod 29 to rotate, causing the transverse plate 28 to slide on the lower surface of the fixed rod 17. This moves the two collection boxes 20 below the two connecting plates 18. Subsequently, the seventh motor 31 drives the bidirectional threaded rod 32 to rotate, bringing the two collection boxes 20 closer together and forming a complete circular collection trough. This collection trough coincides with the axis of the connecting plate 18. Then, the elastic pad 19 is adjusted to its maximum size. This helps to fully flatten the elastic pad 19, eliminating wrinkles and gaps on its surface and exposing debris. At this point, the edge of the elastic pad 19 is within the collection trough. Then, the fourth motor 9 drives the fifth threaded rod 35 to rotate, causing the first scraper 36 to slide from the edge of the connecting plate 18 to the outer edge of the elastic pad 19. Since the first scraper 36 and the second scraper 37 are interlocked, they move synchronously, scraping away debris adhering to the elastic pad 19. The debris on the surface is scraped off until the first scraper 36 and the second scraper 37 reach the end of the traction rod 21. Since there are multiple first scrapers 36 and second scrapers 37, the scraping area covers the entire surface of the elastic pad 19. The debris then falls from the edge of the elastic pad 19 into the collection box 20. This self-cleaning of the elastic pad 19 surface is achieved through the coordinated action of multiple first scrapers 36 and second scrapers 37, preventing debris remaining on the elastic pad 19 from falling onto the wafer surface and contaminating it during subsequent use. It also prevents the accumulation of debris on the surface of the elastic pad 19, which could affect its elasticity.

[0040] Furthermore, regardless of the size to which the elastic pad 19 is stretched by the traction rod 21, the first scraper 36 and the second scraper 37 can be positioned at the edge of the connecting disc 18 to achieve omnidirectional scraping.

[0041] Furthermore, when the collection box 20 is not collecting debris, it resets to its initial position, ensuring that the collection box 20 is not below the connecting disk 18 and will not affect the handling of wafers.

[0042] Working principle: The base 1 is installed in a suitable position in the wafer manufacturing area. This mechanism works in conjunction with existing wafer manipulators to pick up the wafer from the wafer basket. Subsequently, the first motor 2 drives the first threaded rod 3 to rotate, allowing the slide 4 to slide laterally on the base 1. The second motor 6 drives the support frame 5 to rotate, and the third motor 7 drives the second threaded rod 10 to rotate, causing the lifting block 11 to rise and fall. Through the above-mentioned orientation adjustment operation, the two connecting plates 18 are aligned with the wafer picked up by the manipulator. Then, the first cylinder 12 drives the two connecting plates 18 to move, so that the wafer to be fixed is between the two connecting plates 18, and the wafer and the axis of the two connecting plates 18 coincide.

[0043] Next, the upper connecting plate 18 is first brought into contact with the upper surface of the wafer, so that the suction cup 34 also comes into contact with the upper surface of the wafer. Then, the air pump 33 is started to extract the air from the suction cup 34, thus fixing the wafer in place by negative pressure adsorption. At this time, the robot can release the wafer. Then, the second cylinder 15 drives the adjusting rod 16 to move down, so that the upper surface of the lower connecting plate 18 comes into contact with the lower surface of the wafer, and the two elastic pads 19 come into contact with the upper and lower surfaces of the wafer respectively. Then, the fifth motors 22 on both the upper and lower sides start simultaneously, and the first bevel gear 24 drives multiple second bevel gears 25 to rotate simultaneously, so that multiple third threaded rods 26 rotate simultaneously, so that multiple traction rods 21 slide radially on the connecting plate 18 simultaneously. The ends of the traction rods 21 can be used to pull the edge of the elastic pad 19 to move, so that the elastic pad 19 deforms until the edge of the elastic pad 19 comes into contact with the edge of the wafer. At this time, both ends of the wafer are largely covered by the connecting plate 18 and the elastic pad 19.

[0044] The wafer is then transferred to the grinding process, and its edge is aligned with the grinding disc of the wafer grinding machine for physical grinding. Subsequently, by controlling the rotation speed, feed speed, and pressure of the grinding disc, the edge material is precisely removed. After each grinding operation, the sixth motor 30 drives the fourth threaded rod 29 to rotate, causing the transverse plate 28 to slide on the lower surface of the fixed rod 17. This moves the two collection boxes 20 to below the two connecting discs 18. Then, the seventh motor 31 drives the bidirectional threaded rod 32 to rotate, bringing the two collection boxes 20 closer together and fitting them into a complete circular collection trough. Furthermore, the collection groove coincides with the axis of the connecting plate 18. Then, the elastic pad 19 is adjusted to its maximum size. This helps to fully flatten the elastic pad 19, eliminate wrinkles and gaps on the surface of the elastic pad 19, and expose the debris. At this time, the edge of the elastic pad 19 is within the collection groove. Then, the fifth threaded rod 35 can be rotated by the fourth motor 9, so that the first scraper 36 slides from the edge of the connecting plate 18 to the outer edge of the elastic pad 19. Since the first scraper 36 and the second scraper 37 are inserted, they will move synchronously to scrape the debris attached to the surface of the elastic pad 19 until the first scraper 36 and the second scraper 37 reach the end of the traction rod 21. Since there are multiple first scrapers 36 and second scrapers 37, the scraping range covers the entire surface of the elastic pad 19. The debris will fall from the edge of the elastic pad 19 into the collection box 20. Thus, with the cooperation of multiple first scrapers 36 and second scrapers 37, the self-cleaning of debris on the surface of the elastic pad 19 is achieved.

[0045] Furthermore, regardless of the size to which the elastic pad 19 is stretched by the traction rod 21, the first scraper 36 and the second scraper 37 can be positioned at the edge of the connecting disk 18 to achieve omnidirectional scraping. Moreover, when the collection box 20 is not collecting debris, the collection box 20 returns to its initial position, ensuring that the collection box 20 is not located below the connecting disk 18 and does not affect the handling of the wafer.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer auto-alignment and rapid transport mechanism, comprising: include: A base (1) is slidably connected to a slide table (4) on its upper surface. A support frame (5) is rotatably mounted on the upper end of the slide table (4). A lifting block (11) is slidably connected to one side of the support frame (5). Two guide rods (13) are slidably connected to the lifting block (11). A transverse block (14) is fixedly connected to the ends of the two guide rods (13). An adjusting rod (16) is slidably connected to one side of the transverse block (14). A fixing rod (17) is fixedly connected to one side of the transverse block (14). A connecting plate (18) is fixedly connected to the ends of both the adjusting rod (16) and the fixing rod (17). The adsorption and fixing assembly includes multiple branch tubes (8), which are fixedly connected through the lower connecting plate (18), and one end of each branch tube (8) is fixedly connected to a suction cup (34). The wafer end face protection assembly includes an elastic pad (19) fixedly sleeved on a connecting disk (18). Multiple traction rods (21) are evenly distributed and slidably connected along the circumference of the connecting disk (18). The ends of the traction rods (21) are fixedly connected to the edges of the elastic pad (19).

2. The wafer auto-alignment and rapid transport mechanism of claim 1, wherein: The bottom side of the slide (4) is threaded with a first threaded rod (3), both ends of the first threaded rod (3) are rotatably mounted on the base (1), a first motor (2) is fixedly connected to one side of the base (1), the output end of the first motor (2) is fixedly connected to one end of the first threaded rod (3), a second motor (6) is fixedly connected to one side of the inner cavity of the slide (4), and the output end of the second motor (6) is fixedly connected to the bottom of the support frame (5).

3. The wafer auto-alignment and rapid transport mechanism of claim 1, wherein: The lifting block (11) is threadedly connected to a second threaded rod (10) on one side. Both ends of the second threaded rod (10) are rotatably mounted on the support frame (5). A third motor (7) is fixedly connected to one side of the support frame (5). The output end of the third motor (7) is fixedly connected to one end of the second threaded rod (10). A first cylinder (12) is fixedly connected to one side of the lifting block (11). The piston end of the first cylinder (12) is fixedly connected to one side of the transverse block (14).

4. The wafer auto-alignment and rapid transport mechanism of claim 1, wherein: A second cylinder (15) is fixedly connected to one side of the transverse block (14), and the piston end of the second cylinder (15) is fixedly connected to one end of the adjusting rod (16).

5. The wafer auto-alignment and rapid transport mechanism of claim 1, wherein: A connecting plate (23) is fixedly connected to one side of the connecting plate (18), and a third threaded rod (26) is threaded to one end of the traction rod (21). Both ends of the third threaded rod (26) are rotatably mounted on the connecting plate (18).

6. The wafer auto-alignment and rapid transport mechanism of claim 5, wherein: A fifth motor (22) is fixedly connected to one side of the connecting plate (23). A first bevel gear (24) is fixedly connected to the output end of the fifth motor (22). The first bevel gear (24) is rotatably mounted on the connecting plate (23). A second bevel gear (25) is fixedly sleeved on one end of the third threaded rod (26). The first bevel gear (24) and the second bevel gear (25) mesh with each other.

7. The wafer auto-alignment and rapid transport mechanism of claim 5, wherein: An air pump (33) is fixedly connected to one side of the lower connecting plate (23). The air pump (33) has an air inlet end connected to an annular pipe (27). One end of the branch pipe (8) is connected to one side of the annular pipe (27). The annular pipe (27) is fixedly connected to the connecting plate (23).

8. The wafer auto-alignment and rapid transport mechanism of claim 1, wherein: It also includes a self-cleaning component; the self-cleaning component includes a first scraper (36) and a second scraper (37) slidably connected to both sides of the traction rod (21) via a sliding groove, and adjacent first scrapers (36) and second scrapers (37) are inserted and slidably connected, a transverse plate (28) is slidably connected to one side of the lower end face of the fixed rod (17), and a collection box (20) is slidably connected to both sides of the transverse plate (28), and the edges of the first scraper (36) and the second scraper (37) are in contact with the surface of the elastic pad (19).

9. The wafer auto-alignment and rapid transport mechanism of claim 8, wherein: The first scraper (36) is threaded to a fifth threaded rod (35) at one end. Both ends of the fifth threaded rod (35) are rotatably mounted on the traction rod (21). A fourth motor (9) is fixedly connected to one end of the traction rod (21). The output end of the fourth motor (9) is fixedly connected to one end of the fifth threaded rod (35).

10. The wafer auto-alignment and rapid transport mechanism of claim 8, wherein: One end of the transverse plate (28) is threadedly connected to a fourth threaded rod (29). Both ends of the fourth threaded rod (29) are rotatably mounted on a fixed rod (17). A sixth motor (30) is fixedly connected to one side of the fixed rod (17). The output end of the sixth motor (30) is fixedly connected to one end of the fourth threaded rod (29). Both ends of one side of the transverse plate (28) are rotatably mounted with bidirectional threaded rods (32). Both sides of the bidirectional threaded rods (32) are threadedly connected to the collection boxes (20) on both sides respectively. A seventh motor (31) is fixedly connected to one side of the transverse plate (28). The output end of the seventh motor (31) is fixedly connected to one end of the bidirectional threaded rod (32).

Images