An automatic detection device and method for IC chip coplanarity

Abstract

This invention discloses an automatic IC chip coplanarity detection device and method, relating to the field of semiconductor packaging and testing technology. The device includes a housing, a control base, a workstation transfer device, a coplanar moving inspection machine, a laser contour scanner, and a dynamic feeler gauge detection module. The coplanar moving inspection machine drives the laser contour scanner and the dynamic feeler gauge detection module to move. Two sorting mechanisms are connected in series below the workstation transfer device, used to remove defective chips and replenish good chips in the tray, respectively. The detection method utilizes a large model to fuse multi-source data to calculate coplanarity, and completes the replenishment of good chips and inkjet marking of qualified chips. Automatic re-inspection is performed when data is inconsistent. This invention employs a fusion of mechanical force simulation and laser vision detection to solve the problems of low accuracy, poor matching of optical inspection conditions, and high misjudgment rate in traditional manual inspection. It achieves high-precision, non-destructive, and fully automated detection of IC chip pin coplanarity, improving inspection efficiency and consistency, and adapting to the full inspection requirements of mass production.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor packaging and testing technology, and more specifically, relates to an automatic detection device and method for IC chip coplanarity. Background Technology

[0002] In the field of semiconductor packaging and testing, the coplanarity of IC chip pins is a key indicator affecting the yield and reliability of SMT assembly. As chip pin density continues to increase and pin spacing continues to shrink, existing high-precision measurement (such as coordinate measuring machines) cannot meet the full inspection requirements of production lines due to slow detection speed. While current optical inspection methods can achieve non-contact measurement, they are prone to generating noise on highly reflective pins and are difficult to simulate the physical deformation state of pins under pressure during subsequent assembly.

[0003] Furthermore, most current equipment only uses single optical or single mechanical detection, without multimodal data fusion and cross-validation mechanisms. The detection, sorting, and marking stations are scattered, and the pallet flow is not continuous, which easily leads to chip falling, positioning deviation, low efficiency, and other problems. There is a lack of automated closed loop for the rejection of coplanar defective chips and the replenishment of good products, resulting in low pallet utilization and high production line downtime.

[0004] In summary, existing technologies have significant shortcomings in terms of detection accuracy, consistency, efficiency, non-destructive testing, working condition matching, and automated closed-loop testing. There is an urgent need for a related technology that can achieve fully automated testing of the coplanarity of IC chips. Summary of the Invention

[0005] The main objective of this invention is to provide an automatic detection device and method for IC chip coplanarity, which aims to simulate the manual feeler gauge process by standardizing mechanical force and combining AI vision and precision motion control to achieve rapid, high-precision, and non-destructive detection of IC chip pin coplanarity.

[0006] In order to achieve the above objectives;

[0007] Based on the first aspect of the present invention:

[0008] This invention discloses an automatic IC chip coplanarity detection device, comprising:

[0009] The machine casing has a control base installed at the bottom, and a workstation transfer device is arranged horizontally inside the machine casing.

[0010] Two receiving and dispensing devices are arranged at both ends of the workstation transfer device. Each receiving and dispensing device contains a stacked tray containing chips, which are then transferred between various workstations via the workstation transfer device.

[0011] The coplanar moving inspection machine has a dynamic feeler gauge detection module and a laser profile scanner arranged side by side on the front. The coplanar moving inspection frame is suitable for moving the laser profile scanner and the dynamic feeler gauge detection module above the workstation transfer device. The dynamic feeler gauge detection module achieves standard force, uniform speed and controllable stroke feeler gauge advancement through servo drive, accurately simulating the manual feeler gauge action, eliminating human error, and achieving a gap detection accuracy of ±0.01mm. Two sorting mechanisms are installed in series below the workstation transfer device.

[0012] The inkjet marking machine is installed inside the machine housing and is suitable for spraying ink dots on finished chips, while the coplanar moving inspection machine achieves rapid movement in the XY direction through a servo screw, covering the entire tray of chips in a single inspection, with a single chip inspection time of ≤0.5s;

[0013] One of the two sorting mechanisms is installed below the coplanar moving inspection machine to remove chips with obvious coplanar defects, while the other sorting mechanism is installed between the inkjet marking machine and the coplanar moving inspection machine to replenish the finished chips in the tray.

[0014] Furthermore, the workstation transfer device includes:

[0015] The connecting frame has a pair of pulleys at both ends, and the pair of pulleys are connected by a synchronous belt drive.

[0016] A stepper motor is installed at the bottom of the connecting frame, which is also equipped with a lifting base. The stepper motor is connected to the pulley drive to drive the pulley to rotate.

[0017] The tensioning pulley, located in the middle of the connecting frame, is suitable for tensioning the synchronous belt. The workstation transfer device adopts a closed-loop transmission of synchronous belt, stepper motor, and tensioning pulley, ensuring high pallet positioning accuracy and fast transfer speed, with a single pallet transfer cycle of no more than two seconds.

[0018] Furthermore, the receiving and dispensing device includes:

[0019] The storage slot is designed for stacking trays. The storage slot is vertically positioned and equipped with an electromagnetic limiter at the bottom, which is designed to abut against a single tray.

[0020] The discharge cylinder is mounted on the control base at the bottom, and the piston rod at the top of the discharge cylinder is connected to the bottom support, which is located inside the station transfer device.

[0021] When the base supports the tray, the electromagnetic limiter opens and places the trays one by one onto the timing belt through the base.

[0022] Furthermore, the coplanar moving inspection machine includes

[0023] The base frame has a longitudinal lead screw mounted on top, which is connected to a primary servo motor. The primary servo motor is mounted at the bottom of the base frame, and a pair of guide rails are provided on the top of the base frame.

[0024] The mounting bracket is horizontally equipped with a two-stage servo motor. The two-stage servo motor is coaxially connected to the horizontal lead screw. The horizontal lead screw and the horizontal support form a helical pair. The horizontal support is slidably mounted in the horizontal slide groove on the mounting bracket.

[0025] The horizontal support is equipped with a laser profile scanner and a dynamic feeler gauge detection module.

[0026] Furthermore, the dynamic feeler gauge detection module includes:

[0027] The photoelectric sensor is mounted on the side of the horizontal support via a longitudinal servo device, and a high-magnification telecentric lens is set at the end. The laser contour scanner, in conjunction with the high-magnification telecentric lens, can filter out reflective noise and acquire high-density point cloud data. The Z-axis height measurement accuracy reaches ±0.005mm.

[0028] The wedge-shaped electrical transmission connector is suitable for insertion into the pressure sensor connector. The pressure sensor connector is equipped with a custom feeler gauge. The feeler gauge is suitable for being inserted into the bottom of the pin at a uniform speed with a standard set force. The feeler gauge is a custom thin-plate type, and the standard set force pushes it in without impact or scratches, avoiding damage to the pin plating and plastic deformation.

[0029] Furthermore, the inkjet marking machine includes an ink dispenser, an XYZ three-axis linear motor platform, a support, and an ink cartridge. The ink cartridge is located at the bottom of the support, and the XYZ three-axis linear motor platform is located at the top of the support. The ink dispenser is installed on the XYZ three-axis linear motor platform.

[0030] The workstation transfer device passes through the support, and the ink dispenser is adapted to pick up ink from the ink cartridge and apply it to the qualified chip.

[0031] Furthermore, the sorting mechanism includes a buffer device and a picking mechanism: the buffer device includes a telescopic cylinder, a stand, a horizontal pneumatic gripper, and a lifting cylinder. The lifting cylinder is installed on the side of the stand, and the piston rod of the lifting cylinder is connected to the horizontal pneumatic gripper, which is suitable for gripping the tray.

[0032] The bottom of the upright is connected to the telescopic cylinder drive.

[0033] Furthermore, the picking mechanism includes a vertical linear motor, a horizontal linear motor, a mounting plate, a longitudinal linear motor, and a picking gripper. The linear motor, the horizontal linear motor, and the longitudinal linear motor are arranged perpendicularly to each other and are mounted on the mounting plate via the horizontal linear motor.

[0034] A longitudinal linear motor is connected to the pickup gripper drive, and the pickup gripper is suitable for selecting waste chips in the tray.

[0035] The beneficial effects of applying the technical solution of this invention are as follows:

[0036] This invention breaks through the limitations of traditional single detection modes, achieving complementarity between mechanical simulation and optical measurement, combination of data fusion and intelligent verification, and integration of automated flow and closed-loop sorting. It comprehensively solves the problems of low accuracy, poor efficiency, weak consistency, and easy chip damage in existing technologies. Furthermore, its overall structure is compact, highly integrated, and easy to maintain. It features high detection accuracy and strong consistency, making it suitable for mass production full inspection and enabling fast, high-precision, non-destructive, and automated detection of pin coplanarity.

[0037] The present invention also provides a detection method, which uses the above-mentioned automatic IC chip coplanarity detection device, and includes the following steps:

[0038] Step 1: The receiving and unloading device delivers the tray containing the chips to the workstation transfer device, and pushes the tray from the four sides to the center through the positioning fixture, aligning the reference faces of the chip pins in the tray with the coplanar moving inspection machine to standardize the position.

[0039] Step 2: Control the coplanar moving inspection machine to drive the dynamic feeler gauge inspection module to advance horizontally towards the chip pin gap at a constant low speed through a feeler gauge of standard thickness, and monitor the reaction force in real time. If the pushing resistance exceeds the threshold, it is considered that the gap at the pin is less than the feeler gauge thickness. If it passes easily, replace it with a feeler gauge with a larger thickness for retesting.

[0040] Step 3: Scan the chip pins with a laser contour scanner to obtain a scanned point cloud image. Then, use a large model in the industrial control computer to automatically identify the regions, edges and vertices of all pins in the point cloud image and plan the optimal measurement path. The large model integrates mechanical clearance data and optical height data to establish a three-dimensional tolerance zone model and cross-validate it. The coplanarity judgment error is no more than 0.02mm, which can greatly improve the consistency.

[0041] Step 4: Project the laser beam onto the pin, capture the deformation of the laser beam using a camera, calculate the height information of each point using trigonometric geometry principles, read the coordinates, record the Z-axis coordinate value Zi at this time, and then automatically find the highest point Z. max With the lowest point Z min The height difference is calculated using a large model, and the coplanarity ΔZ is also calculated. ;

[0042] Step 5: Fit the physical gap data and height scan data of the step. If 0 ≤ ΔZ ≤ 0.10 mm standard value, the product is judged as OK; otherwise, it is NG. At the same time, a portion of qualified products are stored in the sorting mechanism.

[0043] Step 6: Remove the NG chips from the tray and load the qualified chips from the sorting mechanism into the tray, so that the tray is full of qualified chips.

[0044] Furthermore, in step 4, when the large model is recognizing the point cloud image, it simultaneously fuses the physical gap data obtained in the previous step, establishes a three-dimensional tolerance zone model for each pin, and cross-verifies the calculated result of coplanarity ΔZ with the measured threshold of the dynamic feeler gauge detection module. If the two judgment results are inconsistent, the retest process is triggered, and the coplanar moving inspection machine controls the laser contour scanner and the dynamic feeler gauge detection module to perform a second re-inspection of the pin.

[0045] In summary, this invention breaks through the limitations of traditional single detection modes, achieving complementarity between mechanical simulation and optical measurement, combination of data fusion and intelligent verification, and integration of automated flow and closed-loop sorting. It comprehensively solves the pain points of existing technologies such as low accuracy, poor efficiency, weak consistency, and easy chip damage, significantly improving the overall performance of IC chip coplanarity detection and adapting to the needs of high-end semiconductor packaging and testing production lines. Attached Figure Description

[0046] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0047] Figure 1 A perspective view of the internal structure of the automatic IC chip coplanarity detection device provided by the present invention;

[0048] Figure 2 A perspective view of the pickup mechanism provided by the present invention;

[0049] Figure 3 A perspective view of the inkjet marking machine provided by the present invention;

[0050] Figure 4 A perspective view of the ink cartridge is provided for this invention;

[0051] Figure 5 A perspective view of the coplanar moving detection machine provided by the present invention;

[0052] Figure 6 A three-dimensional view of the laser contour scanner provided by the present invention;

[0053] Figure 7 A perspective view of the caching device provided by the present invention;

[0054] Figure 8 A perspective view of the material receiving and dispensing device provided by the present invention;

[0055] Figure 9 A perspective view of the workstation transfer device provided by the present invention;

[0056] Figure 10 A perspective view of the IC chip coplanarity automatic detection device provided by the present invention;

[0057] Figure 11 A perspective view of the dynamic feeler gauge detection module provided by the present invention;

[0058] Figure 12 Here is a flowchart of the automatic coplanarity detection method provided by the present invention;

[0059] 1. Housing; 2. Control base; 3. Material receiving and unloading device; 31. Receiving slot; 32. Electromagnetic limiter; 33. Base support; 34. Unloading cylinder; 4. Workstation transfer device; 41. Connecting frame; 42. Lifting base; 43. Stepper motor; 44. Pulley; 45. Tensioner wheel; 5. Coplanar moving inspection machine; 51. Base frame; 52. Guide rail; 53. Primary servo motor; 54. Longitudinal lead screw; 55. Mounting bracket; 56. Secondary servo motor; 57. Transverse lead screw; 58. Transverse support; 6. Laser contour scanner; 7. Inkjet marking machine; 71. Ink dispenser; 7 2XYZ three-axis linear motor platform; 73 support; 74 ink cartridge; 8 dynamic feeler gauge detection module; 81 photoelectric sensor; 82 high-magnification telecentric lens; 83 wedge-shaped electrical transmission connector; 84 pressure sensor connector; 85 feeler gauge blade; 9 sorting mechanism; 91 buffer device; 911 telescopic cylinder; 912 stand; 913 horizontal pneumatic gripper; 914 lifting cylinder; 92 pickup mechanism; 921 vertical linear motor; 922 horizontal linear motor; 923 mounting plate; 924 longitudinal linear motor; 925 pickup gripper. Detailed Implementation

[0060] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0061] It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0062] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0063] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in sequences other than those illustrated or described herein.

[0064] Furthermore, the terms “including” and “having” and any variations thereof are intended to cover non-exclusive inclusion, such as a process, method, system, product, or apparatus that includes a series of steps or units, which is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0065] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., may be used here to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figure. It should be understood that spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device as described in the figure.

[0066] For example, if a device in the accompanying drawings is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below". The device may also be positioned differently, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0067] This invention discloses an automatic IC chip coplanarity detection device. Its core design integrates dynamic feeler gauge mechanical inspection, laser contour scanning visual inspection, industrial computer large-scale model data fusion verification, and fully automated sorting and distribution. This achieves rapid, high-precision, non-destructive, and automated detection of pin coplanarity. The following description, in conjunction with the attached diagram, further details this device. Figure 1 To be continued Figure 12 The specific embodiments of the present invention will be described in detail below.

[0068] In one specific embodiment disclosed in this invention, such as Figure 1 and Figure 10As shown, the IC chip coplanarity automatic detection device of the present invention includes: a housing 1, a control base 2, a receiving and unloading device 3, a station transfer device 4, a coplanar moving detection machine 5, a laser contour scanner 6, an inkjet marking machine 7, a dynamic feeler gauge detection module 8, and a sorting mechanism 9. The housing 1 is a closed sheet metal structure with a transparent observation window on the top and an inspection door on the side, forming a clean detection chamber inside. The control base 2 is fixedly installed at the bottom of the housing 1. The control base 2 houses an industrial control computer, a servo driver, a pneumatic control unit, a power module, and a data interaction interface, providing power, control, and data processing support for the entire machine. Two receiving and unloading devices 3 are used for loading and unloading, respectively. The two receiving and unloading devices 3 are symmetrically arranged at both ends of the station transfer device 4, which is horizontally arranged inside the housing 1, penetrating the detection, sorting, and marking stations for precise pallet transport. Above the workstation transfer device 4, a coplanar moving inspection machine 5 is mounted. This machine can move along the XY directions, driving the inspection module to complete the inspection of the entire tray of chips. A laser contour scanner 6 and a dynamic feeler gauge inspection module 8 are arranged side-by-side on the coplanar moving inspection machine 5, respectively inspecting the height and width of the chip pins. During operation, a longitudinal servo device drives the dynamic feeler gauge inspection module 8 to advance horizontally to the bottom gap of the pins at a standard set force (5–10N) and a constant low speed (1–2mm / s), with a pressure sensor providing real-time feedback on the pushing resistance. The laser contour scanner 6 is fixed to one side of the transverse support 58, used for non-contact acquisition of the pin's three-dimensional contour data. It incorporates a line laser emitter, a high-definition industrial camera, and an optical lens; during operation, it projects a red line laser onto the surface of the chip pins, the camera captures the laser line deformation image, and transmits it to the industrial control computer for processing. On the other hand, an inkjet marking machine 7 is installed inside the housing 1, downstream of the sorting mechanism 9, for marking qualified chips. For NG products, two sorting mechanisms 9 are used to process them. The two sorting mechanisms 9 are installed in series below the station transfer device 4: the first is located below the coplanar moving inspection machine 5 to remove obviously defective chips; the second is located between the inkjet marking machine 7 and the inspection machine to replenish the good products on the tray.

[0069] In this embodiment, the dynamic feeler gauge detection module 8 includes a photoelectric sensor 81, a wedge-shaped electrical transmission socket 83, and a pressure sensing connector 84. The photoelectric sensor 81 is mounted on a transverse support 58 via a longitudinal servo device. A high-magnification telecentric lens 82 is located at the end of the photoelectric sensor 81 for precise positioning of the chip pins. Furthermore, a quick-connect wedge-shaped electrical transmission socket 83 is located at the bottom of the photoelectric sensor 81. The pressure sensing connector 84 can be plugged into the wedge-shaped electrical transmission socket 83 and also incorporates a high-precision pressure sensor. The pressure sensor is physically connected to a feeler gauge plate 85, which is a custom-made thin metal sheet (thicknesses of 0.05mm, 0.08mm, 0.10mm, etc.) to transmit force.

[0070] In some embodiments, a single receiving and discharging device 3 includes a receiving slot 31, an electromagnetic limiter 32, a base 33, and a discharging cylinder 34. The receiving slot 31 is a vertically arranged rectangular slot that can hold 10-20 layers of trays. The IC chips to be tested are neatly arranged in the trays. The electromagnetic limiter 32 is installed on both sides of the bottom of the receiving slot 31. Normally, it extends and abuts against the edge of the bottom tray to prevent the tray from slipping off automatically. When energized, the electromagnetic limiter 32 retracts and releases a single tray. The base 33 is horizontally arranged above the workstation transfer device 4. The base 33 supports the trays and is fixedly connected to the top of the piston rod of the discharging cylinder 34. The feeding cylinder 34 is vertically mounted on the control base 2. During operation: the feeding cylinder 34 extends, and the bottom support 33 lifts the bottom tray in the storage slot 31; the electromagnetic limiter 32 is energized and retracts, and the feeding cylinder 34 slowly retracts, placing the tray stably on the synchronous belt of the station transfer device 4; then the electromagnetic limiter 32 resets and extends, blocking the upper tray, realizing automatic feeding one by one.

[0071] In some embodiments, such as Figure 9 The workstation transfer device 4 includes a connecting frame 41, a lifting base 42, a stepper motor 43, and a tensioning wheel 45. The connecting frame 41 is a rectangular frame structure with a pair of pulleys 44 installed at both ends. A synchronous belt is sleeved between the pair of pulleys 44, and the surface of the synchronous belt is provided with anti-slip texture to support the pallet. At the same time, the stepper motor 43 is connected to one end of the pulley 44 for transmission, driving synchronous and continuous operation. The stepper motor 43 is fixed to the bottom of the connecting frame 41 and drives the pulley 44 to rotate through a coupling, gear, or transmission chain via its output shaft.

[0072] In some embodiments, such as Figure 5 and Figure 6 As shown, the coplanar moving inspection machine 5 includes a base frame 51, a primary servo motor 53, a mounting bracket 55, and a secondary servo motor 56. The base frame 51 is a gantry-type base with a pair of parallel guide rails 52 mounted on its top. The primary servo motor 53 is mounted at one end of the base frame 51, and its output shaft is connected to a longitudinal lead screw 54, which is mounted between the guide rails 52. On the other hand, a transverse lead screw 57 is mounted on the top of the mounting bracket 55 and engages with a nut on a transverse support 58, forming a transverse transmission pair. The mounting bracket 55 slides on the guide rails 52 and is driven by the longitudinal lead screw 54 to move in the Y direction. The transverse support 58 slides within a horizontal groove in the mounting bracket 55 and is driven by the transverse lead screw 57 to move in the X direction. When the laser contour scanner 6 and the dynamic feeler gauge inspection module 8 are fixed side-by-side on the transverse support 58, the primary servo motor 53 and the secondary servo motor 56 work together to move the inspection module rapidly along a preset path, covering all chip pin areas within the tray.

[0073] In one specific embodiment disclosed in this invention, such as Figure 3and Figure 4 The inkjet marking machine 7 is installed inside the housing 1, downstream of the sorting mechanism 9, and is used for marking qualified chips. It includes an ink dispenser 71, an XYZ three-axis linear motor platform 72, and an ink cartridge 74. The XYZ three-axis linear motor platform 72 is mounted on top of the support 73, enabling precise XYZ three-axis movement. The ink dispenser 71 is fixed to the end of the three-axis platform with its needle pointing downwards, accurately applying ink dots to the surface of qualified chips. It can also directly draw ink from the ink cartridge 74, which is fixed at the bottom of the support 73 for storing fast-drying black ink. The support 73 is a portal frame, through which the station transfer device 4 can pass.

[0074] In some embodiments, each sorting mechanism 9 includes a buffer device 91 and a picking mechanism 92. The buffer device 91 can be used to temporarily store good chips for replenishing the tray. Specifically, the buffer device 91 includes a telescopic cylinder 911, a support frame 912, a horizontal pneumatic gripper 913, and a lifting cylinder 914. The telescopic cylinder 911 is horizontally mounted at the bottom of the support frame 912, driving the support frame 912 to move horizontally. The support frame 912 is a vertical support for mounting the lifting cylinder 914 and the horizontal pneumatic gripper 913. The horizontal pneumatic gripper 913 is connected to the piston rod of the lifting cylinder 914 for gripping the tray, realizing the lifting and positioning of the good chip buffer tray.

[0075] Based on this structure, the pickup mechanism 92 is used to accurately pick up defective or good chips, including a vertical linear motor 921, a horizontal linear motor 922, and a longitudinal linear motor 924. The horizontal linear motor 922 is mounted on the mounting plate 923 and drives horizontal movement. The vertical linear motor 921 is connected to the slide of the horizontal linear motor 922 and drives vertical movement. The longitudinal linear motor 924 is connected to the slide of the vertical linear motor 921 and drives longitudinal movement, thereby allowing the pickup gripper 925 to move in three-dimensional space. The pickup gripper 925 is a flexible pneumatic gripper, mounted at the end of the longitudinal linear motor 924, which can accurately grip a single chip and adjust the force according to the working conditions.

[0076] Based on the same inventive concept, this invention also discloses a detection method that utilizes the improved automatic IC chip coplanarity detection device. Specific steps include: Step 1: Automatic feeding and pallet positioning are achieved. The receiving and releasing device 3 transports stacked pallets one by one to the synchronous belt of the station transfer device 4. After the pallet is transferred to the detection station, the positioning fixture pushes the pallet from four sides towards the center, aligning the chip pin reference surface with the detection module to complete precise positioning with an accuracy of no more than ±0.05mm. Step 2: Dynamic feeler gauge mechanical clearance detection. The coplanar moving detection machine 5 drives the dynamic feeler gauge detection module 8 to move above the chip pin. After the photoelectric sensor 81 positions the pin, the servo device drives the feeler gauge 85 to horizontally advance the pin gap with standard force and uniform speed. The pressure sensor monitors the reaction force in real time: if the resistance exceeds the threshold, the pin gap is determined to be defective; if the feeler gauge passes easily, a larger thickness feeler gauge is used for retesting until the resistance meets the standard, and the maximum thickness of the feeler gauge that passes is recorded. In step 3, a point cloud image is generated through laser contour scanning. The laser contour scanner 6 projects a linear laser onto the pin surface, and the camera captures the laser deformation image, generating high-density point cloud data which is then transmitted to the industrial control computer. The industrial control computer has a built-in large model that automatically identifies the pin region, edges, and vertices in the point cloud image and plans the optimal measurement path.

[0077] Step 4: 3D height calculation and coplanarity determination. For the large model, based on trigonometric geometry principles, calculate the Z-axis height coordinate Zi of each pixel in the point cloud; automatically filter all pin Z-coordinates to determine the highest point Zmax and the lowest point Zmin; calculate coplanarity. Step 5: Data fusion and quality judgment. Mechanical clearance data and optical height data are fused using a large model, and the judgment results are cross-validated: 0 ≤ ΔZ ≤ 0.10mm (standard value) → judged as OK (qualified); when ΔZ > 0.10mm, it is judged as NG (defective). Based on this, some qualified chips are stored in the buffer device 91 of the first sorting mechanism 9. In step 6, defective chips are removed and good chips are replenished. Specifically, the picking mechanism 92 of the first sorting mechanism 9 picks up NG chips from the tray and transfers them to the defective material box; the second sorting mechanism 9 picks up OK chips from the buffer device 91 and fills the empty positions on the tray, ensuring the tray is full.

[0078] In this embodiment, the full material tray is transferred to station 7 of the inkjet marking machine. The XYZ three-axis linear motor platform 72 drives the ink dispenser 71 to move, applying ink dots to the surface of each qualified chip. If the mechanical inspection and optical inspection results in step 5 are inconsistent, the large model automatically triggers a secondary re-inspection process: the inspection machine controls the laser scanner 6 and the dynamic feeler gauge module 8 to re-inspect the disputed pins until the results are consistent, thus improving the reliability of the inspection.

[0079] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An automatic detection device for the coplanarity of IC chips, characterized in that, include: The machine housing (1) has a control base (2) installed at the bottom, and a work station transfer device (4) is arranged horizontally inside the machine housing (1). Two receiving and dispensing devices (3) are arranged at both ends of the workstation transfer device (4). Each receiving and dispensing device (3) contains a stacked tray containing chips, which are transferred to various workstations via the workstation transfer device (4). The coplanar moving inspection machine (5) has a dynamic feeler gauge inspection module (8) and a laser contour scanner (6) arranged side by side on the front. The coplanar moving inspection machine frame (5) is adapted to drive the laser contour scanner (6) and the dynamic feeler gauge inspection module (8) to move above the workstation transfer device (4). Two sorting mechanisms (9) are installed in series below the workstation transfer device (4). An inkjet marking machine (7) is installed inside the housing (1) and is adapted to spray ink dots onto finished chips; One of the two sorting mechanisms (9) is installed below the coplanar moving inspection machine (5) to remove chips with obvious coplanar defects, and the other sorting mechanism (9) is installed between the inkjet marking machine (7) and the coplanar moving inspection machine (5) to replenish the finished chips in the tray.

2. The IC chip coplanarity automatic detection device as described in claim 1, characterized in that, The workstation transfer device (4) includes: The connecting frame (41) has a pair of pulleys (44) at both ends, and the pair of pulleys (44) are connected by a synchronous belt drive. A stepper motor (43) is installed at the bottom of the connecting frame (41). The connecting frame (41) is also provided with a lifting base (42). The stepper motor (43) is connected to the pulley (44) for transmission, so as to drive the pulley (44) to rotate. A tensioning pulley (45) is located in the middle of the connecting frame (41) and is adapted to tension the timing belt.

3. The IC chip coplanarity automatic detection device as described in claim 1, characterized in that, The receiving and dispensing device (3) includes: The storage slot (31) is suitable for stacking trays. The storage slot (31) is vertically arranged and has an electromagnetic limiter (32) at the bottom. The electromagnetic limiter (32) is suitable for abutting against a single tray. The bottom of the discharge cylinder (34) is mounted on the control base (2). The piston rod at the top of the discharge cylinder (34) is connected to the base support (33). The base support (33) is located inside the station transfer device (4). When the base (33) supports the tray, the electromagnetic limiter (32) opens and places the trays one by one onto the timing belt through the base (33).

4. The IC chip coplanarity automatic detection device as described in claim 1, characterized in that, The coplanar moving inspection machine (5) includes The base frame (51) has a longitudinal lead screw (54) mounted on top. The longitudinal lead screw (54) is connected to a primary servo motor (53). The primary servo motor (53) is mounted on the bottom of the base frame (51). A pair of guide rails (52) are provided on the top of the base frame (51). Mounting bracket (55) is horizontally equipped with a secondary servo motor (56). The secondary servo motor (56) is coaxially connected to a horizontal lead screw (57). The horizontal lead screw (57) and a horizontal support (58) form a helical pair. The horizontal support (58) is slidably mounted in a horizontal groove on the mounting bracket (55). The laser profile scanner (6) and the dynamic feeler gauge detection module (8) are installed on the horizontal support (58).

5. The IC chip coplanarity automatic detection device as described in claim 1, characterized in that, The dynamic feeler gauge detection module (8) includes: The photoelectric sensor (81) is mounted on the horizontal bracket (58) on the side via a longitudinal servo device, and a high-magnification telecentric lens (82) is provided at the end. A wedge-shaped electrical transmission socket (83) is adapted to insert a pressure sensing connector (84), on which a custom feeler gauge (85) is mounted, the feeler gauge (85) being adapted to be inserted into the bottom of the pin at a uniform speed with a standard set force.

6. The IC chip coplanarity automatic detection device as described in claim 1, characterized in that, The inkjet marking machine (7) includes an ink dispenser (71), an XYZ three-axis linear motor platform (72), a support (73), and an ink cartridge (74). The ink cartridge (74) is located at the bottom of the support (73), and the XYZ three-axis linear motor platform (72) is located at the top of the support (73). The ink dispenser (71) is installed on the XYZ three-axis linear motor platform (72). The workstation transfer device (4) passes through the support (73), and the ink dispenser (71) is adapted to pick up ink from the ink cartridge (74) and apply it to the qualified chip.

7. The IC chip coplanarity automatic detection device as described in claim 1, characterized in that, The sorting mechanism (9) includes a buffer device (91) and a picking mechanism (92): the buffer device (91) includes a telescopic cylinder (911), a stand (912), a horizontal pneumatic gripper (913), and a lifting cylinder (914). The lifting cylinder (914) is installed on the side of the stand (912). The piston rod of the lifting cylinder (914) is connected to the horizontal pneumatic gripper (913). The horizontal pneumatic gripper (913) is suitable for gripping the tray. The bottom of the stand (912) is connected to the telescopic cylinder (911) via a transmission.

8. The IC chip coplanarity automatic detection device as described in claim 7, characterized in that, The picking mechanism (92) includes a vertical linear motor (921), a horizontal linear motor (922), a mounting plate (923), a longitudinal linear motor (924), and a picking gripper (925). The linear motor (921), the horizontal linear motor (922), and the longitudinal linear motor (924) are arranged perpendicularly to each other and are mounted on the mounting plate (923) by the horizontal linear motor (922). The longitudinal linear motor (924) is connected to the pickup gripper (925), which is adapted to pick up waste chips in the tray.

9. A detection method, using the automatic IC chip coplanarity detection device of claim 1, characterized in that, Includes the following steps: Step 1, the receiving and feeding device (3) sends the tray containing the chip to the workstation transfer device (4), and pushes the tray from the four sides to the center through the positioning fixture, so that the chip pin reference face in the tray is aligned with the coplanar moving inspection machine (5) to standardize the position; Step 2: Control the coplanar moving detection machine (5) to drive the dynamic feeler gauge detection module (8) to push the feeler gauge piece of standard thickness horizontally towards the gap between the chip pins at a constant low speed, and monitor the reaction force in real time. If the pushing resistance exceeds the threshold, it is considered that the gap at the pin is less than the feeler gauge thickness. If it passes easily, replace it with a feeler gauge with a larger thickness for retesting. Step 3: Scan the chip pins with a laser contour scanner (6) to obtain a scanned point cloud image. Then, use the large model in the industrial control computer to automatically identify the regions, edges and vertices of all pins in the point cloud image and plan the optimal measurement path. Step 4: Project the laser beam onto the pin, capture the deformation of the laser beam using a camera, calculate the height information of each point using trigonometric geometry principles, read the coordinates, and record the Z-axis coordinate value Zi. Then, automatically find the highest point Zmax and the lowest point Zmin, calculate the height difference using a large model, and calculate the coplanarity ΔZ. ; Step 5: Fit the physical gap data from Step 2 and the height scan data from Step 4. If 0 ≤ ΔZ ≤ 0.10 mm standard value, the product is judged as OK; otherwise, it is NG. At the same time, a portion of qualified products are stored in the sorting mechanism (9). Step 6: Remove the NG chips from the tray and load the qualified chips from the sorting mechanism (9) into the tray so that the tray is full of qualified chips.

10. The detection method as described in claim 9, characterized in that, In step 4, when the large model recognizes the point cloud image, it simultaneously integrates the physical gap data obtained in step 2, establishes a three-dimensional tolerance zone model for each pin, and cross-verifies the calculation result of coplanarity ΔZ with the measured threshold of the dynamic feeler gauge detection module (8). If the two judgment results are inconsistent, the retest process is triggered, and the coplanar moving detection machine (5) controls the laser contour scanner (6) and the dynamic feeler gauge detection module (8) to perform a second re-inspection of the pin.

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