Chip package structure and preparation method thereof, semiconductor package structure

Abstract

This disclosure relates to the field of packaging technology, and discloses a chip packaging structure and its fabrication method, as well as a semiconductor packaging structure. The chip packaging structure includes: a packaging cover assembly, a chip, and an external heat dissipation portion. The packaging cover assembly includes a board body, with the chip located on one side of the board body. The board body has a groove structure, and along the arrangement direction of the board body and the chip, the groove structure has an opening at least on the side of the board body opposite to the chip. At least a portion of the chip's orthographic projection onto the board body overlaps with the groove structure. At least a portion of the external heat dissipation portion is embedded within the groove structure, and the surface of the external heat dissipation portion opposite to the chip extends beyond the surface of the board body opposite to the chip.

Description

Technical Field

[0001] This disclosure relates to the field of packaging technology, and in particular to a chip packaging structure and its preparation method, and a semiconductor packaging structure. Background Technology

[0002] With the rapid development of integrated circuit technology, heat dissipation has become a key bottleneck restricting its performance and reliability. Current heat dissipation solutions in the chip packaging field have many limitations, making it difficult to achieve a good balance between "heat dissipation efficiency", "process reliability" and "structural compactness". Summary of the Invention

[0003] This disclosure provides a chip packaging structure and its fabrication method, as well as a semiconductor packaging structure, the specific solution of which is as follows: In a first aspect, embodiments of this disclosure provide a chip packaging structure, including: a packaging cover assembly, a chip, and an external heat dissipation portion, wherein the packaging cover assembly includes a board body, the chip is located on one side of the board body; the board body is provided with a groove structure, and along the arrangement direction of the board body and the chip, the groove structure has an opening at least on the side of the board body opposite to the chip, at least a portion of the chip's orthogonal projection onto the board body overlaps with the groove structure, at least a portion of the external heat dissipation portion is embedded in the groove structure, and the surface of the external heat dissipation portion opposite to the chip extends beyond the surface of the board body opposite to the chip.

[0004] In some embodiments of this disclosure, along the arrangement direction of the board body and the chip, the slot structure has an opening on the side of the board body opposite to the chip; the slot structure is a first blind slot; Alternatively, along the arrangement direction of the board body and the chip, the slot structure has openings on both opposite sides of the board body; the slot structure is a through slot.

[0005] In some embodiments of this disclosure, an internal heat dissipation portion is also included. Along the arrangement direction of the board body and the chip, the internal heat dissipation portion is located on the side of the chip facing the board body and is in direct contact with the chip and the board body.

[0006] In some embodiments of this disclosure, the internal heat dissipation portion is disposed on the side of the chip facing the board body and in contact with the board body; the orthographic projection of the chip on the board body coincides with the orthographic projection of the internal heat dissipation portion on the board body; Alternatively, the internal heat dissipation portion is disposed on the side surface of the board body facing the chip; the orthographic projection of the chip onto the board body is located within the orthographic projection of the internal heat dissipation portion onto the board body.

[0007] In some embodiments of this disclosure, the board body has a second blind slot on the side facing the chip; along the arrangement direction of the board body and the chip, at least a portion of the internal heat dissipation portion is embedded in the second blind slot.

[0008] In some embodiments of this disclosure, along the arrangement direction of the board body and the chip, the side surface of the inner heat dissipation portion facing the chip is flush with the side surface of the second blind slot facing the chip.

[0009] In some embodiments of this disclosure, the board body has a plurality of second blind slots on the side facing the chip; along the arrangement direction of the board body and the chip, the inner heat dissipation part is embedded in the second blind slots, and the surface of the inner heat dissipation part facing the chip is flush with the surface of the second blind slot facing the chip.

[0010] In some embodiments of this disclosure, the slot structure and the second blind slot are arranged alternately in a plane perpendicular to the board body and the chip arrangement direction; Alternatively, when the slot structure is a first blind slot, the bottom of the first blind slot and the bottom of the second blind slot are spaced apart along the arrangement direction of the board body and the chip.

[0011] In some embodiments of this disclosure, along the arrangement direction of the board body and the chip, the height H1 of the external heat dissipation portion exposed on the side away from the chip in the groove structure needs to be less than the height H2 embedded in the groove structure.

[0012] In some embodiments of this disclosure, there are multiple external heat dissipation portions, which form multiple heat dissipation rings. Each heat dissipation ring has multiple heat dissipation portions spaced apart in its circumferential direction. The cross-sectional size of the external heat dissipation portion in each heat dissipation ring gradually decreases along the direction from the heat dissipation ring in the central region of the chip to the heat dissipation ring in the peripheral region of the chip.

[0013] In some embodiments of this disclosure, the distance between adjacent heat sinks gradually increases along the direction from the heat sink in the central region of the chip to the heat sink in the peripheral region of the chip.

[0014] In some embodiments of this disclosure, the heat sink is circular and the chip is rectangular; the external heat sink is also separately arranged at a position corresponding to the corner of the chip.

[0015] In some embodiments of this disclosure, the encapsulation cover assembly further includes a protrusion along the arrangement direction of the board body and the chip. The protrusion is disposed on the side surface of the board body facing the chip and cooperates with the board body to form an encapsulation blind slot, in which the chip is placed.

[0016] In some embodiments of this disclosure, the protrusion and the plate body are an integral structure; Alternatively, the protrusion may be an encapsulation and fixing layer adhered to the surface of the plate body.

[0017] In some embodiments of this disclosure, the plate body is made of glass.

[0018] In some embodiments of this disclosure, the distance between the chip and the protrusion is greater than or equal to 5 μm.

[0019] In some embodiments of this disclosure, the chip packaging structure further includes an adapter board and a circuit board. Along the arrangement direction of the board body and the chip, the packaging cover assembly is packaged on the surface of the adapter board. The chip is located between the packaging cover assembly and the adapter board and is electrically connected to the adapter board. The circuit board is located on the side of the adapter board away from the chip and is electrically connected to the adapter board.

[0020] In a second aspect, this disclosure also provides a semiconductor packaging structure, including the chip packaging structure provided by any of the technical solutions in the first aspect above.

[0021] Thirdly, this disclosure also provides a method for fabricating a chip packaging structure, used to fabricate a chip packaging structure as provided by any of the technical solutions in the first aspect above, the fabrication method comprising: A packaging cover assembly is provided; the packaging cover assembly includes a plate body, the plate body having a groove structure, the groove structure having an opening at least on the outer surface of the plate body; an external heat dissipation part is embedded in the groove structure, and the top surface of the external heat dissipation part extends beyond the outer surface of the plate body; The chip is packaged on one side of the inner surface of the board body; at least a portion of the chip's orthographic projection onto the board body overlaps with the groove structure.

[0022] In some embodiments of this disclosure, a method for encapsulating a cover plate assembly is provided, comprising: An original blind groove is formed on the outer surface of the plate body; Metal material is filled into the original blind slot to form an external heat dissipation section; The outer surface of the plate body is thinned to form a first blind groove from the original blind groove; the groove structure is the first blind groove.

[0023] In some embodiments of this disclosure, after forming the original blind groove into a first blind groove, the method of providing an encapsulation cover assembly further includes, The inner surface of the plate body is thinned to expose the inner surface of the outer heat dissipation part, so that the first blind groove forms a through groove; the groove structure is the through groove.

[0024] In some embodiments of this disclosure, a method for providing an encapsulated cover assembly further includes: An internal heat dissipation section is formed on the inner surface of the plate body.

[0025] In some embodiments of this disclosure, the method of forming an internal heat dissipation portion on the inner surface of the plate body further includes: A second blind groove is formed on the inner surface of the plate body; The second blind slot is filled with metal material to form the internal heat dissipation section.

[0026] In some embodiments of this disclosure, a method for providing an encapsulated cover assembly further includes: An internal heat dissipation section is formed on the outer surface of the chip.

[0027] One embodiment of the present disclosure described above has at least the following advantages or beneficial effects: It should be noted that the chip packaging structure provided in this disclosure embeds a portion of the external heat dissipation section into the slot structure of the board body. This allows the heat generated by the chip to be directly transferred to the board body and dissipated through the external heat dissipation section on the board body. The heat dissipation path is shorter, resulting in better heat dissipation. This enables rapid heat dissipation "from the inside out," improving heat dissipation efficiency and thus improving the temperature uniformity of the chip surface. Furthermore, because the external heat dissipation section is partially embedded inside the board body, its individual size in the board body and chip stacking direction is smaller, reducing the volume of the packaging structure. This facilitates high-density integration and improves the compactness of the packaged structure.

[0028] In addition, the structure of the plate body is relatively complete, and there are no cavities inside for filling liquid or ventilation. The process reliability is high, which can avoid the problem of heat dissipation failure due to sealing failure. Attached Figure Description

[0029] Figure 1 This diagram shows a first cross-sectional schematic of the chip packaging structure provided in an embodiment of the present disclosure; Figure 2 A second cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown; Figure 3 A third cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown; Figure 4 A fourth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown; Figure 5 A fifth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown; Figure 6A sixth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown; Figure 7 A seventh cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown; Figure 8 An eighth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown; Figure 9 A ninth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown; Figure 10 This diagram shows a tenth cross-sectional schematic of the chip packaging structure provided in an embodiment of the present disclosure; Figure 11 A planar schematic diagram of the chip packaging structure provided in an embodiment of this disclosure is shown; Figure 12 A simulation diagram of a chip packaging structure provided in an embodiment of this disclosure is shown; Figure 13 Another simulation diagram of the chip packaging structure provided in the embodiments of this disclosure is shown; Figures 14a to 14g The diagram illustrates the film layer changes during the fabrication process of the chip packaging structure provided in this embodiment of the present disclosure. Figures 15a to 15c This diagram illustrates another film layer change during the fabrication process of the chip packaging structure provided in the embodiments of this disclosure; Figures 16a to 16e This diagram illustrates another film layer change during the fabrication process of the chip packaging structure provided in this embodiment.

[0030] Figure label: 100 - Package cover assembly; 110 - Slot structure; 120 - Package blind slot; 130 - Second blind slot; 200 - Chip; 300 - External heat dissipation part; 400 - Adapter board; 500 - Circuit board; 600 - Internal heat dissipation part; 700 - Solder bump. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0032] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "comprising" or "including," and similar terms as used in this disclosure, mean that an element or object preceding the term encompasses the elements or objects listed following the term and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Terms such as "inner," "outer," "upper," and "lower" are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0033] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0034] Semiconductor packaging structures are key components that protect, secure, and electrically connect core devices to external circuits. Their main functions are to provide mechanical support, heat dissipation channels, electrical transmission, and environmental protection, ensuring the core devices perform reliably under reliable operating conditions. Chip packaging is a crucial step in semiconductor packaging structures. The application environment of chips typically requires the package to withstand harsh conditions such as temperature cycling, humidity changes, mechanical vibration and shock, electromagnetic interference, and electrostatic discharge. Furthermore, with the widespread adoption of high-performance computing and 5G communication, the package must also possess efficient heat dissipation capabilities, low-inductance / low-resistance electrical paths, and good isolation from dust, corrosive gases, etc., to ensure the chip operates stably and reliably throughout its entire lifespan.

[0035] This disclosure provides several heat dissipation designs for chips, such as bottom-mounted heat dissipation design, top-mounted heat dissipation design, and metal patch design on the top of the package cover. However, all of these heat dissipation methods have their limitations. Specifically: In the bottom heat dissipation design of the chip, heat conduction is carried out by the chip base. The heat dissipation path is long and the thermal resistance is large, which is not efficient enough for high-power chips.

[0036] In the top heat dissipation design of the chip, cooling channels or cavities are set inside the package cover, which is complex in structure, occupies a large volume, and has the risk of fluid seal failure.

[0037] In designs where a metal heat sink is attached to the top of the package cover, although the structure is relatively simple, the heat conduction path between the heat sink and the internal heat points of the chip still requires multiple layers of material, resulting in high interfacial thermal resistance and limited improvement in heat dissipation efficiency.

[0038] In summary, the heat dissipation designs of the aforementioned chips struggle to achieve a good balance between heat dissipation efficiency, process reliability, and structural compactness.

[0039] Based on this, the embodiments of this disclosure provide a chip packaging structure that can improve heat dissipation efficiency, ensure process reliability, and achieve a compact structure. It is worth noting that the chip packaging structure provided in the embodiments of this disclosure is not only protected as part of the semiconductor packaging structure, but also separately protected by the embodiments of this disclosure.

[0040] Figure 1 A first cross-sectional schematic diagram of the chip packaging structure provided in an embodiment of this disclosure is shown. For example... Figure 1 As shown, this disclosure provides a chip packaging structure. The chip packaging structure includes: a packaging cover assembly 100, a chip 200, and an external heat dissipation portion 300, wherein the packaging cover assembly 100 includes a board body (…). Figure 1 The upper half of the encapsulation cover assembly 100 (separated by dashed lines - plate-like structure) contains the chip 200 located on one side of the plate body. The plate body has a slot structure 110. Along the arrangement direction of the plate body and the chip 200, the slot structure 110 has an opening at least on the side of the plate body opposite to the chip 200. At least a portion of the chip 200's orthogonal projection onto the plate body overlaps with the slot structure 110. At least a portion of the external heat dissipation portion 300 is embedded in the slot structure 110, and the surface of the external heat dissipation portion 300 opposite to the chip 200 extends beyond the surface of the plate body opposite to the chip 200. Figure 1 As shown, in the chip packaging structure provided in this embodiment, the number of external heat dissipation portions 300 on the surface of the board body can be one or more, forming a comb-like structure on the surface of the board body. The external heat dissipation portion 300 is made of metal, such as copper, to improve heat dissipation efficiency.

[0041] In the chip packaging structure provided in this embodiment, the packaging cover assembly 100 is used to package the chip 200, and the packaged chip 200 is located inside the packaging cover assembly 100. The plate body of the packaging cover assembly 100 is provided with a groove structure 110, wherein, along the arrangement direction of the plate body and the chip 200, the groove structure 110 has an opening at least on the side away from the chip 200, and part of the external heat dissipation part 300 is embedded in the groove structure 110, and part of it protrudes from the opening on this side of the plate body surface.

[0042] When chip 200 is applied, it generates heat. Consequently, the board body near or in contact with chip 200 will also become heated. As the temperature of the board body rises, the external heat dissipation part 300 dissipates heat from the portion embedded in the slot structure 110 to the portion protruding from the board body, thus exchanging heat with the external environment. In other words, the heat generated by chip 200 is directly transferred to the board body and dissipated through the external heat dissipation part 300 on the board body, resulting in a shorter heat dissipation path and better heat dissipation effect. Of course, during the heat dissipation process of the external heat dissipation part 300, the board body also dissipates heat to the outside, which will not be elaborated further.

[0043] It should be noted that the chip packaging structure provided in this embodiment embeds a portion of the external heat dissipation part 300 into the slot structure 110 of the board body, allowing the heat generated by the chip 200 to be directly transferred to the board body and dissipated through the external heat dissipation part 300 on the board body. This results in a shorter heat dissipation path, better heat dissipation effect, and rapid "inside-out" heat dissipation, improving heat dissipation efficiency and thus improving the temperature uniformity of the chip 200 surface. Simultaneously, since the external heat dissipation part 300 is partially embedded inside the board body, its individual size in the stacking direction of the board body and the chip 200 is small, reducing the volume of the packaging structure, facilitating high-density integration, and improving the compactness of the packaged structure.

[0044] In addition, the structure of the plate body is relatively complete, and there are no cavities inside for filling liquid or ventilation. The process reliability is high, which can avoid the problem of heat dissipation failure due to sealing failure.

[0045] like Figure 1 As shown, in some embodiments of this disclosure, the chip packaging structure provided in this embodiment further includes an adapter board 400 and a printed circuit board (PCB). Along the arrangement direction of the board body and the chip 200, a package cover assembly 100 is packaged on the surface of the adapter board 400. The chip 200 is located between the package cover assembly 100 and the adapter board 400 and is electrically connected to the adapter board 400. The circuit board 500 is located on the side of the adapter board 400 opposite to the chip 200 and is electrically connected to the adapter board 400. The adapter board 400 serves as an intermediate layer, electrically and physically connecting the chip 200 and the circuit board 500. As an example, such as... Figure 1 As shown, the chip 200 and the adapter board 400 can be electrically connected by solder bumps 700, and the adapter board 400 and the circuit board 500 can also be electrically connected by solder bumps 700.

[0046] The adapter board has an independent rewiring layer, which can be set according to the needs to improve the electrical signal transmission capability.

[0047] It should be noted that in the chip packaging structure provided in this embodiment, the adapter board 400 can effectively alleviate the thermal stress caused by the mismatch of the thermal expansion coefficients of the materials between the chip 200 and the circuit board 500, thereby improving the long-term reliability of the package. Moreover, the adapter board 400 can realize high-density, fine-pitch rewiring, fanning out or fanning in the dense pins of the chip 200 to the standard pitch of the circuit board 500, thereby simplifying the design complexity of the circuit board 500 and improving signal integrity and power integrity. At the same time, as an independent wiring layer, the adapter board 400 can integrate passive components or provide heat dissipation paths, which helps to reduce the overall package size and improve thermal management capabilities, ultimately achieving miniaturization, high-density interconnection, and high reliability of the chip 200 package.

[0048] In some embodiments of this disclosure, such as Figure 1 As shown, the encapsulation cover assembly 100 also includes a protrusion ( Figure 1 The lower half of the encapsulation cover assembly 100 (a block-shaped structure separated by dashed lines) has a protrusion on the side of the board body facing the chip 200 along the arrangement direction of the board body and the chip 200, and cooperates with the board body to form an encapsulation blind slot 120, in which the chip 200 is placed. This encapsulation blind slot 120 can provide physical protection for the chip 200 placed therein, avoiding external impact, pressure damage or dust contamination during subsequent processes or use.

[0049] When specifically configuring the encapsulation cover assembly 100 provided in the embodiments of this disclosure, the structural form of the encapsulation cover assembly 100 can be varied. As an example, for instance... Figure 1 As shown, the protrusion and the plate body are an integral structure. That is, through the manufacturing process, part of the material is removed from a plate to form an encapsulation cover assembly 100 with an encapsulation blind groove 120.

[0050] Alternatively, the protrusion may be an encapsulation fixing layer adhered to the surface of the board body. As an example, the board body is fixed to the adapter board 400 by an adhesive layer to encapsulate the chip 200; in this case, the adhesive layer forms an encapsulation fixing layer.

[0051] The material for the plate body can be selected according to requirements. In some embodiments of this disclosure, the plate body is made of glass. Glass has a high surface flatness and good chemical stability, effectively isolating moisture and corrosive gases, and providing excellent airtight protection.

[0052] In some embodiments of this disclosure, such as Figure 1As shown, the distance L between chip 200 and the protrusion is greater than or equal to 5 μm. That is, after chip 200 is placed in the package blind slot 120, the distance between its sidewall and the protrusion surrounding chip 200 must meet the above range. Of course, the distance between each side surface of chip 200 and the corresponding part of the protrusion can be the same or different, but all must be within the above range.

[0053] It should be noted that the distance between the chip 200 and the protrusion in this embodiment of the present disclosure can ensure that the performance of the chip 200 is not damaged when the chip 200 is packaged by the encapsulation cover assembly 100; and effectively avoid direct contact between the chip 200 and the protrusion, thereby preventing stress concentration, physical damage or short circuit risk caused by the difference in thermal expansion coefficients or relative displacement between the two during temperature cycling or mechanical vibration.

[0054] When fabricating the groove structure 110 on the plate body, there are several possible structural forms of the groove structure 110, as shown in the following examples: Structure Form 1: Along the arrangement direction of the board body and the chip 200, the slot structure 110 has an opening on the side of the board body opposite to the chip 200; the slot structure 110 is a first blind slot. For example... Figure 1 As shown, when the slot structure 110 is the first blind slot, along the stacking direction of the board body and the chip 200, a portion of the board body is not penetrated between the external heat dissipation part 300 and the chip 200. This can prevent water vapor from entering due to the failure of the seal at the fitting position between the external heat dissipation part 300 and the first blind slot, and can also avoid the risk of liquid leakage caused by cooling methods such as water / oil.

[0055] Structure Form 2: Along the arrangement direction of the board body and the chip 200, the slot structure 110 has openings on both sides of the board body; the slot structure 110 is a through slot. Figure 2 A second cross-sectional schematic diagram of the chip packaging structure provided in an embodiment of this disclosure is shown. For example... Figure 2 As shown, when the slot structure 110 is a through slot, the external heat dissipation portion 300 penetrates the board body along the stacking direction of the board body and the chip 200. It is worth noting that, to avoid the external heat dissipation portion 300 affecting the encapsulation effect of the package cover assembly 100 on the chip 200, the surface of the external heat dissipation portion 300 facing the chip 200 does not extend beyond the surface of the board body facing the chip 200 along the stacking direction of the board body and the chip 200. Furthermore, along the stacking direction of the board body and the chip 200, the surface of the external heat dissipation portion 300 facing the chip 200 is flush with the surface of the board body facing the chip 200.

[0056] It is worth noting that in structural form two, there is no board body gap between the external heat dissipation part 300 and the chip 200, and the external heat dissipation part 300 is closer to the chip 200. As a result, the heat dissipation is more direct, and the heat is dissipated "from the inside to the outside" more quickly, so the heat dissipation capacity is also stronger.

[0057] Based on the examples of the slot structure 110 in the above-mentioned structural forms one and two, and the detailed design of the chip packaging structure, at least the following embodiments are provided.

[0058] Example 1: As Figure 1 As shown, the slot structure 110 in this embodiment is the first blind slot in the first structure form. The external heat dissipation part is embedded in the first blind slot and partially protrudes from the side surface of the board body away from the chip 200. Figure 1 The board body and the chip 200 are in direct contact on the side away from the adapter board 400, with no other structure between them. The chip 200 is electrically connected to the adapter board 400, and the adapter board 400 is electrically connected to the circuit board 500 on the opposite side.

[0059] When chip 200 is used, it generates heat, which in turn heats the board body that is in direct contact with it. As the temperature of the board body rises, the external heat dissipation part 300 dissipates heat from the portion embedded in the slot structure 110 to the portion protruding from the board body, thus exchanging heat with the external environment. In other words, the heat generated by chip 200 is directly transferred to the board body and dissipated through the external heat dissipation part 300 on the board body, resulting in a shorter heat dissipation path and better heat dissipation effect.

[0060] It should be noted that the chip packaging structure provided in Embodiment 1 of this disclosure embeds a portion of the external heat dissipation part 300 into the slot structure 110 of the board body, allowing the heat generated by the chip 200 to be directly transferred to the board body and dissipated through the comb-shaped external heat dissipation part 300 on the board body. This results in a shorter heat dissipation path, better heat dissipation effect, and rapid "inside-out" heat dissipation, improving heat dissipation efficiency and thus improving the temperature uniformity of the chip 200 surface. Furthermore, the external heat dissipation part 300 occupies a small dimension in the stacking direction between the board body and the chip 200, and there are no other structures between the board body and the chip 200. Therefore, the thickness of the chip packaging structure provided in Embodiment 1 of this disclosure is beneficial for achieving high-density integration and improving structural compactness.

[0061] Furthermore, along the stacking direction of the board body and the chip 200, a portion of the board body is not penetrated between the external heat dissipation part 300 and the chip 200. This can prevent water vapor from entering due to the failure of the seal at the fitting position between the external heat dissipation part 300 and the first blind slot, and can also avoid the risk of liquid leakage caused by cooling methods such as water / oil.

[0062] It is worth noting that, in Embodiment 1 provided in this disclosure, as Figure 1 As shown, along the arrangement direction of the board body and the chip 200, the height H1 of the exposed groove structure 110 of the external heat dissipation part 300 on the side away from the chip 200 needs to be less than the height H2 of the embedded groove structure 110.

[0063] The smaller exposure height H1 helps reduce the overall size of the chip package structure in the thickness direction, avoids excessive protrusion of the external heat dissipation part 300, and meets the requirements of thin design.

[0064] A larger embedment height H2 means that more of the external heat dissipation part 300 is embedded in the board body, which can increase the contact area with the sidewall of the slot structure 110 and the heat diffusion path, improve the efficiency of heat conduction from the chip 200 to the external heat dissipation part 300; and enhance the mechanical anchoring effect of the external heat dissipation part 300 to prevent structural loosening caused by external forces.

[0065] Example 2: Figure 2 As shown, the difference between Embodiment 2 and Embodiment 1 is that the slot structure 110 is a through slot as in Structure Form 2. Along the stacking direction of the board body and the chip 200, the external heat dissipation part 300 penetrates the board body and is flush with the surface of the board body on the side facing the chip 200. The surface of the board body and the side of the external heat dissipation part 300 embedded in the slot structure 110 facing the chip 200 are in direct contact with the chip 200.

[0066] In Embodiment 2, there is no board body gap between the external heat dissipation part 300 and the chip 200, and it is in direct contact with the board body. Therefore, the heat dissipation is more direct, the heat is dissipated "from the inside to the outside" more quickly, and the heat dissipation capacity is also stronger.

[0067] It is worth noting that the chip packaging structure provided in this embodiment may further include an internal heat dissipation section. Along the arrangement direction of the board body and the chip 200, the internal heat dissipation section is located on the side of the chip 200 facing the board body and is in direct contact with both the chip 200 and the board body. This internal heat dissipation section can assist in the efficient heat transfer from the chip 200 to the board body, thereby improving the heat dissipation effect. When setting the internal heat dissipation section, there are various possibilities regarding its structural form and location. Specifically, the internal heat dissipation section may be located on the surface of the chip 200 facing the board body, or it may be located on the side of the board body facing the chip 200. Furthermore, there may be one or more internal heat dissipation sections. When there is only one internal heat dissipation section, its area can be set relatively large to form a flat layer structure placed between the chip 200 and the board body without affecting the packaging effect of the chip 200. This flat layer structure may be formed on the surface of the chip 200 or on the surface of the board body, or at least partially embedded in the board body after a notch. When there are multiple internal heat dissipation sections, they may be embedded in the board body.

[0068] When an internal heat dissipation unit is added to the technical solutions in Embodiments 1 and 2 above, the following embodiments can be formed by combining the location and number of internal heat dissipation units. The internal heat dissipation unit is made of metal to improve heat dissipation efficiency, such as copper.

[0069] Example 3: Figure 3 A third cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown. For example... Figure 3 As shown, the difference between Embodiment 3 and Embodiment 1 is that, along the arrangement direction of the board body and the chip 200, the board body has a second blind slot 130 on the side facing the chip 200; along the arrangement direction of the board body and the chip 200, the inner heat dissipation part 600 is embedded in the second blind slot 130, and its surface facing the chip 200 is flush with the board body and in direct contact with the chip 200. It is worth noting that, in Embodiment 3, along the arrangement direction of the chip 200 and the board body, the opening directions of the first blind slot and the second blind slot 130 are different, with the opening of the second blind slot 130 facing the chip 200.

[0070] After the chip 200 generates heat, the internal heat dissipation unit 600 can quickly conduct the heat from the chip 200 to the board body. The heat dissipation conduction is more direct, which can promote the heat exchange efficiency between the board body and the chip, as well as the heat exchange efficiency between the board body and the external heat dissipation unit 300, thereby improving the heat exchange efficiency between the external heat dissipation unit 300 and the external environment.

[0071] In summary, the chip packaging assembly provided in Embodiment 3 of this disclosure achieves rapid heat dissipation "from the inside out" through the cooperation of the external heat dissipation part 300 and the internal heat dissipation part 600, thereby improving heat dissipation efficiency. Compared with the structure in Embodiment 1 that only has an external heat dissipation part 300, the internal heat dissipation part 600 is only adjacent to the back of the chip 200, resulting in more direct heat conduction and thus stronger heat dissipation capacity.

[0072] It is worth noting that, in Embodiment 3 of this disclosure, along the arrangement direction of the board body and the chip 200, the side surface of the inner heat dissipation part 600 facing the chip 200 is flush with the side surface of the second blind groove 130 facing the chip 200, so as to facilitate the encapsulation cover assembly 100 to encapsulate the chip 200.

[0073] like Figure 3As shown in Embodiment 3 of this disclosure, there are multiple first blind slots. In a plane perpendicular to the arrangement direction of the board body and the chips 200, multiple first blind slots and second blind slots 130 are arranged alternately to prevent the board body from breaking during slotting and to ensure the structural integrity of the board body. Of course, if the structural strength requirements are met, the first blind slots and second blind slots 130 can be positioned opposite each other along the arrangement direction of the board body and the chips 200. In this case, a gap must be maintained between the bottom of the first blind slot and the bottom of the second blind slot 130. In this case, the slotting depth of the second blind slot 130 can be shallower than in the alternating arrangement of the second blind slots and first blind slots to ensure the structural integrity of the board body.

[0074] Example 4: Figure 4 A fourth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown. For example... Figure 4 As shown, the difference between Embodiment 4 and Embodiment 3 is that the number of second blind slots 130 is one, and the area of ​​the second blind slot 130 is larger. Along the arrangement direction of the board body and the chip 200, the orthographic projection of the chip 200 onto the board body coincides with the inner heat dissipation portion 600 of the second blind slot 130. Of course, it is also possible to configure the area of ​​the inner heat dissipation portion 600 to be larger than the orthographic projection of the chip 200 onto the board body; details will not be elaborated further. It is worth noting that when packaging the chip 200, the chip 200 can be directly packaged onto the surface of the inner heat dissipation portion 600.

[0075] In Embodiment 4 of this disclosure, along the arrangement direction of the board body and the chip 200, the bottom of the first blind trench and the bottom of the second blind trench 130 are spaced apart. That is, the external heat dissipation part 300 and the internal heat dissipation part 600 need to avoid interconnection, and their respective thicknesses need to be greater than or equal to 10 μm to prevent the film layer of the heat dissipation part formed during the etching process from falling off.

[0076] It should be noted that the chip packaging assembly provided in Embodiment 4 of this disclosure can transfer the heat of the chip 200 to a portion of the board body between the chip 200 and the external heat dissipation part 300 through the large-area internal heat dissipation part 600 within the second blind slot 130, and then transfer it to the external heat dissipation part 300 via this portion of the board body. The entire heat conduction process is rapid, which can achieve the effect of quickly and evenly conducting heat to the external heat dissipation part 300, and the heat dissipation capacity can be further enhanced.

[0077] Example 5: Figure 5 A fifth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown. For example... Figure 5As shown, the difference between Embodiment 5 and Embodiment 4 is that the second blind slot 130 is not provided, and the inner heat dissipation part 600 is directly fabricated on the inner surface of the board body, with the chip 200 packaged on the surface of the inner heat dissipation part 600. Specifically, the orthographic projection of the chip 200 onto the board body lies within the orthographic projection of the inner heat dissipation part 600 onto the board body; that is, the area of ​​the inner heat dissipation part 600 is larger than the area of ​​the chip 200. This design advantage effectively reduces electrostatic discharge issues during the packaging process. Furthermore, because the inner heat dissipation part 600 has a larger area, it can quickly transfer the heat from the chip 200 to the board body, and then through the board body to the outer heat dissipation part 300. The entire heat conduction process is rapid, effectively transferring heat quickly and evenly to the outer heat dissipation part 300, further enhancing heat dissipation capacity.

[0078] Moreover, compared to the board body in Embodiment 4 which does not have a second blind slot 130, the board body has better structural strength and more reliable packaging effect for chip 200.

[0079] Example 6: Figure 6 A sixth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown. (See diagram below.) Figure 6 As shown, the difference between Embodiment Six and Embodiment Five is that the inner heat dissipation part 600 is directly fabricated on the outer surface of the chip 200 and then packaged with the board body. In this case, the orthographic projection of the chip 200 on the board body coincides with the orthographic projection of the inner heat dissipation part 600 on the board body. Because there are many processing steps after the back of the chip 200 is coated, such as cutting, picking, and tape-making, which may generate ESD, forming the inner heat dissipation part 600 on the outer surface of the chip 200 can improve the ESD resistance of the chip 200 during the chip 200 manufacturing stage. At the same time, since the heat source during the operation of the chip 200 is the internal electroplating of the chip 200, the close contact between the inner heat dissipation part 600 located on the back of the chip 200 and the chip 200 helps the heat to diffuse to the inner heat dissipation part 600 in the first time, and then conducts it to the comb structure formed by the outer heat dissipation part 300 through the inner heat dissipation part 600, resulting in excellent heat dissipation effect.

[0080] Example 7: Figure 7 A seventh cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown. For example... Figure 7 As shown, the difference between Embodiment 7 and Embodiment 3 is that the groove structure 110 is a through groove, that is, the external heat dissipation part 300 penetrates through the board body and is flush with the surface of the board body on the side facing the chip 200, directly contacting the chip 200.

[0081] After the chip 200 generates heat, both the board body and the surface of the external heat dissipation part 300 embedded in the slot structure 110 facing the chip 200 are in direct contact with the chip 200. Since there is no board body gap between the external heat dissipation part 300 and the chip 200, and it is in direct contact with the board body, heat dissipation is more direct, and the heat is dissipated more quickly "from the inside to the outside," thus resulting in stronger heat dissipation capacity. Simultaneously, the internal heat dissipation part 600 can quickly conduct heat from the chip 200 to the board body. This more direct heat dissipation promotes the heat exchange efficiency between the board body and the external environment, as well as the heat exchange efficiency between the board body and the external heat dissipation part 300, thereby improving the heat exchange efficiency between the external heat dissipation part 300 and the external environment.

[0082] In summary, the chip packaging assembly provided in Embodiment 7 of this disclosure, through the cooperation of the external heat dissipation part 300 and the internal heat dissipation part 600, can achieve rapid heat dissipation "from the inside to the outside," thereby improving heat dissipation efficiency. Compared with the structure in Embodiment 2, which only has an external heat dissipation part 300, the internal heat dissipation part 600 is only adjacent to the back of the chip 200, resulting in more direct heat conduction and thus stronger heat dissipation capacity.

[0083] It is worth noting that in Embodiment 7 of this disclosure, the side surface of the internal heat dissipation portion 600 facing the chip 200 is flush with the side surface of the second blind slot 130 facing the chip 200, so as to facilitate the encapsulation cover assembly 100 to encapsulate the chip 200.

[0084] like Figure 7 As shown, there are multiple through slots, and these through slots are staggered with the second blind slot 130 to avoid the plate body from breaking during slotting and to ensure the structural integrity of the plate body.

[0085] Example 8: Figure 8 An eighth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown. For example... Figure 8 As shown, the difference between Embodiment 8 and Embodiment 7 is that the number of second blind slots 130 is one, and the area of ​​the second blind slot 130 is larger, connecting to the through slot where the external heat dissipation part 300 is located. Along the arrangement direction of the board body and the chip 200, the orthogonal projection of the chip 200 on the board body is located on the inner heat dissipation part 600 embedded in the second blind slot 130. It is worth noting that when packaging the chip 200, the chip 200 can be directly packaged on the surface formed by the cooperation of the inner heat dissipation part 600 and the outer heat dissipation part.

[0086] In Embodiment 8 of this disclosure, the thickness of the inner heat dissipation part 600 needs to be greater than or equal to 10 μm to prevent the film layer of the heat dissipation part formed during the etching process from falling off.

[0087] It should be noted that the chip packaging assembly provided in Embodiment 8 of this disclosure increases the size of the second blind slot 130, thereby increasing the size of the inner heat dissipation part 600. The large area of ​​the inner heat dissipation part 600 in the second blind slot 130 can transfer the heat of the chip 200 to the part of the board body between it and the outer heat dissipation part 300, and then transfer it to the outer heat dissipation part 300 through this part of the board body. The entire heat transfer process is rapid, so as to achieve the effect of quickly and evenly conducting heat to the outer heat dissipation part 300, and the heat dissipation capacity can be further enhanced.

[0088] Example 9: Figure 9 A ninth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown. (See diagram below.) Figure 9 As shown, the difference between Embodiment Nine and Embodiment Eight is that the second blind slot 130 is not provided, and the inner heat dissipation part 600 is directly fabricated on the inner surface of the board body, with the chip 200 packaged on the surface of the inner heat dissipation part 600. This design advantage effectively reduces electrostatic discharge issues during the packaging process. Simultaneously, because the inner heat dissipation part 600 has a larger area, it can quickly transfer the heat from the chip 200 to the board body, and then through the board body to the outer heat dissipation part 300. The entire heat transfer process is rapid, achieving the effect of quickly and evenly conducting heat to the outer heat dissipation part 300, further enhancing the heat dissipation capacity.

[0089] Moreover, compared to the board body in Embodiment 8 which does not have a second blind slot 130, the board body has better structural strength and more reliable packaging effect for chip 200.

[0090] Example 10: Figure 10 A tenth cross-sectional schematic diagram of the chip packaging structure provided in this disclosure embodiment is shown. (See diagram below.) Figure 10 As shown, the difference between Embodiment 10 and Embodiment 9 is that the internal heat dissipation part 600 is directly fabricated on the outer surface of the chip 200 and then packaged with the board body. Because there are many processing steps after the back of the chip 200 is coated, such as cutting, picking, and tape-making, which may generate ESD, forming the internal heat dissipation part 600 on the outer surface of the chip 200 can improve the ESD resistance of the chip 200 during the chip 200 manufacturing stage. Simultaneously, since the heat source during the operation of the chip 200 is the internal electroplating, the close contact between the internal heat dissipation part 600 located on the back of the chip 200 and the chip 200 facilitates the immediate dissipation of heat to the internal heat dissipation part 600, which is then conducted to the comb-like structure formed by the external heat dissipation part 300, resulting in excellent heat dissipation performance.

[0091] Based on the above embodiments, the following design can also be made for the encapsulation cover assembly 100 provided in the embodiments of this disclosure.

[0092] Figure 11A planar schematic diagram of the chip packaging structure provided in an embodiment of this disclosure is shown. (See figure) Figure 11 As shown, in some embodiments of this disclosure, there are multiple external heat dissipation parts 300, which form multiple heat dissipation rings. Each heat dissipation ring has multiple spaced heat dissipation parts arranged circumferentially. Along the direction from the heat dissipation ring in the central region of the corresponding chip 200 to the heat dissipation ring in the peripheral region of the corresponding chip 200, the cross-sectional size of the external heat dissipation part 300 within each heat dissipation ring gradually decreases. Accordingly, the structural design in the embodiments of this disclosure can achieve gradient heat dissipation for the heat generated by the chip 200: the central region of the corresponding chip 200 uses an external heat dissipation part 300 with a larger cross-section to enhance heat dissipation capability, while the peripheral region of the corresponding chip 200 uses a heat dissipation part with a smaller cross-section to avoid excessive heat dissipation. This optimizes material utilization while ensuring overall temperature control, effectively reduces thermal stress concentration, and improves the reliability of heat dissipation.

[0093] Please continue to refer to this. Figure 11 As shown in some embodiments of this disclosure, the distance between adjacent heat sinks gradually increases along the direction from the heat sink in the central region of the corresponding chip 200 to the heat sink in the peripheral region of the corresponding chip 200, in order to achieve a layout design with varying density and thickness. This gradual spacing design from dense to sparse can better match the actual heat distribution pattern of the chip 200, making the temperature field more uniform, thereby reducing thermal stress and improving the thermal stability and reliability of the chip 200.

[0094] In some embodiments of this disclosure, such as Figure 11 As shown, the heat sink is roughly circular, while the chip 200 is rectangular. The external heat sink 300 is also separately positioned corresponding to the corners of the chip 200. The corners of the chip 200 are typically far from the circular heat sink, have long heat flow paths, and relatively weak heat dissipation conditions, making them prone to localized high temperatures. By adding dedicated heat sinks for the corners, the insufficient coverage of the circular heat sink in the corner areas can be effectively compensated for, improving the heat dissipation efficiency for the corners of the chip 200. This results in a more uniform temperature distribution across the entire chip 200, preventing performance degradation or thermal stress failure due to corner overheating, thereby enhancing the adaptability of the heat dissipation system and the long-term reliability of the chip 200.

[0095] Figure 12 A simulation diagram of a chip packaging structure provided in an embodiment of this disclosure is shown; Figure 13 A simulation diagram of another chip packaging structure provided in an embodiment of this disclosure is shown. Figure 13 The chip packaging structure adopts the comb-like structure of the external heat dissipation part 300 provided in the embodiments of this disclosure, while Figure 12 The chip packaging structure in the design was not adopted.

[0096] It should be understood that Figure 12and Figure 13 The darker the color of the area closer to the center of chip 200, the higher the temperature. Figure 13 The dark area formed by high temperature in the simulated structure exists in the region near the center of chip 200, and the simulated color lightens as it moves outward from the center, indicating that the temperature gradually decreases. Figure 12 The dark area in the simulation structure is relatively large, corresponding not only to the central area of ​​chip 200, but also to the peripheral area of ​​chip 200.

[0097] When an external heat dissipation unit 300 is used to form a comb-tooth structure, finite element simulation software shows that the heat dissipation comb teeth can be compared to... Figure 12 The absence of comb teeth in the structure allows for rapid heat conduction and also ensures even heat distribution.

[0098] This disclosure also provides a method for fabricating a chip packaging structure, used to prepare the chip packaging structure provided by any of the above technical solutions. Please refer to... Figure 1 The structure shown refers to the preparation method provided in this disclosure, which includes: A cover plate assembly 100 is provided; the cover plate assembly 100 includes a plate body, the plate body is provided with a groove structure 110, the groove structure 110 has an opening at least on the outer surface of the plate body; an external heat dissipation part 300 is embedded in the groove structure 110, and the top surface of the external heat dissipation part 300 extends beyond the outer surface of the plate body. The chip 200 is packaged on one side of the inner surface of the board body; at least a portion of the chip 200 in the orthographic projection of the board body overlaps with the slot structure 110.

[0099] It should be noted that the chip packaging structure prepared using the method provided in this embodiment embeds a portion of the external heat dissipation part 300 into the slot structure 110 of the board body. This allows the heat generated by the chip 200 to be directly transferred to the board body and dissipated through the external heat dissipation part 300 on the board body. The heat dissipation path is shorter, resulting in better heat dissipation. This enables rapid heat dissipation "from the inside out," improving heat dissipation efficiency and thus improving the temperature uniformity of the chip 200 surface. Furthermore, since the external heat dissipation part 300 is partially embedded inside the board body, its individual size in the stacking direction of the board body and the chip 200 is small. This reduces the volume of the packaging structure, facilitating high-density integration and improving the compactness of the packaged structure.

[0100] In addition, the structure of the plate body is relatively complete, and there are no cavities inside for filling liquid or ventilation. The process reliability is high, which can avoid the problem of heat dissipation failure due to sealing failure.

[0101] In some embodiments of this disclosure, a method for manufacturing an encapsulation cover assembly 100 is provided, comprising: Original blind grooves are formed on the outer surface of the plate body; Metal material is filled into the original blind slot to form an external heat dissipation section 300; The outer surface of the plate body is thinned to form the first blind groove from the original blind groove; the groove structure 110 is the first blind groove.

[0102] It should be noted that the blind glass via (BGV) technology used in the preparation method provided in this disclosure is a mature process with high industrialization prospects and cost-effectiveness.

[0103] Now Figure 1 The preparation method of the structure shown in the figure provides a detailed explanation of the above preparation scheme. Figures 14a to 14g This diagram illustrates the film layer changes during the fabrication process of the chip packaging structure provided in this embodiment. Please refer to... Figure 1 refer to Figures 14a to 14g The content shown.

[0104] First, before forming the initial blind trench on the outer surface of the substrate, a substrate needs to be selected. This substrate can be a suitable base material or a wafer, and its material can be glass or other materials. Taking wafer-formed substrates as an example, firstly, based on the chip's 200 package size requirements, a hard mask is deposited on the glass-formed substrate. Materials resistant to hydrogen fluoride (HF) are suitable, such as molybdenum (Mo) or amorphous silicon (a-Si). Then, photolithography and HF etching are used to etch the desired pattern. Figure 14a The corresponding chip 200 package requires a blind slot 120, and then the hard mask is removed.

[0105] Subsequently, the above structure is laser modified to form a shape such as Figure 14b The structure shown is shown. It should be noted that the modification depth should not create a longitudinally penetrating laser sintering zone (to prevent the formation of through-grooves); Subsequently, an original blind groove is formed on the outer surface of the plate body, forming a shape like... Figure 14c The structure shown is as follows. The initial blind trench can be created using a wet etching process, with HF or sodium hydroxide (NaOH) as the etching solution. The modified area is then wet-etched to form the initial blind trench.

[0106] Subsequently, temporary bonding is performed, with one side of the encapsulated blind trench 120 serving as the bonding surface and the original blind trench side on the top layer. Further, the bonding is debonded using processes such as Physical Vapor Deposition (PVD), Electrochemical Deposition (ECD), and Chemical Mechanical Planning (CMP), filling the original blind trench with metal material to form a structure similar to... Figure 14d The external heat dissipation unit 300 is shown.

[0107] After that, as Figure 14e As shown, the outer surface of the board body is thinned to expose the external heat dissipation part 300. In this process, the exposed height H1 needs to be controlled to be less than the embedded height H2. It is worth noting that after the outer surface of the board body is thinned, the depth of the original blind slot is reduced, and the remaining part forms a slot structure - the first blind slot.

[0108] After that, as Figure 14f As shown, chip 200 is embedded in package blind slot 120.

[0109] After that, it will be like this Figure 14f The structure shown is packaged onto the adapter board 400, and the chip 200 is electrically connected to the adapter board 400 to form a structure as shown. Figure 14g The structure shown.

[0110] Finally, as Figure 14g The structure shown is packaged onto circuit board 500, and adapter board 400 is electrically connected to circuit board 500 to form a structure as shown. Figure 1 The structure shown in Example 1 is used to complete product preparation.

[0111] In some embodiments of this disclosure, such as Figure 14d The method for preparing an encapsulation cover assembly 100 after forming the original blind slot into the first blind slot further includes thinning the inner surface of the plate body to expose the inner surface of the outer heat dissipation part 300, so that the first blind slot forms a through slot; the slot structure 110 is a through slot.

[0112] Now Figure 2 The preparation method of the structure shown in the figure provides a detailed explanation of the above preparation scheme. Figures 15a to 15c This diagram illustrates another film layer change during the fabrication process of the chip packaging structure provided in this embodiment. Please refer to... Figure 2 refer to Figures 15a to 15c The content shown.

[0113] The difference between the structure in Preparation Example 2 and the structure in Preparation Example 1 lies in, for example... Figure 15aAs shown, when thinning the plate body, compared to Figure 14e The structure shown has both sides of the plate body thinned to expose the inner surface of the outer heat dissipation part 300 on the inner side of the plate body and the outer heat dissipation part 300 on the outer side of the plate body, forming a comb-like structure.

[0114] After that, as Figure 15b As shown, the chip 200 is embedded in the package blind slot 120, and the distance between the edge of the chip 200 and the periphery of the package blind slot 120 needs to be greater than or equal to 5μm.

[0115] After that, it will be like this Figure 15b The structure shown is packaged onto the adapter board 400, and the chip 200 is electrically connected to the adapter board 400 to form a structure as shown. Figure 15c The structure shown.

[0116] After that, it will be like this Figure 15c The structure shown is packaged onto circuit board 500, and adapter board 400 is electrically connected to circuit board 500 to form a structure as shown. Figure 2 The structure shown in Example 2 is used to complete product preparation.

[0117] It is worth noting that when the chip packaging structure provided in this embodiment further includes an internal heat dissipation section 600, the location and structural form of the internal heat dissipation section 600 vary, and therefore, the fabrication method also differs. The fabrication method of the internal heat dissipation section 600 will now be described with reference to specific structural examples.

[0118] Example 1: Referring to the preparation process of the structure in Example 2, such as... Figure 15a Following the structure shown, a metal layer can be deposited inside the substrate using PVD technology to form the internal heat dissipation section 600. The metal can be selected from materials such as Mo (molybdenum), aluminum (Al), or copper (Cu), with a thickness ranging from 5μm to 10μm, and potentially exceeding 10μm if conditions permit. The chip 200 is then packaged into a cover plate, then packaged with the adapter board 400, and finally packaged with the circuit board 500, forming the structure shown. Figure 10 The structure shown in Example 10 is used to complete product preparation.

[0119] It is worth noting that, in the preparation of the internal heat dissipation part 600 in Embodiment 10, the internal heat dissipation part 600 is formed on the inner surface of the plate body.

[0120] Example 2, the method of forming an internal heat dissipation portion 600 on the inner surface of the plate body further includes: A second blind groove 130 is formed on the inner surface of the plate body; Metal material is filled into the second blind slot 130 to form an internal heat dissipation section 600.

[0121] Figures 16a to 16eThis diagram illustrates another film layer change during the fabrication process of the chip packaging structure provided in this embodiment. In this embodiment, reference is made to... Figure 14a The plate shown undergoes laser modification, but as... Figure 16a When performing laser modification on the structure shown, the following points should be noted: the modification depth should not form a longitudinally penetrating laser sintering zone; the laser focal depth represents the elevation of the modified area, in order to achieve... Figure 16b The double blind groove structure requires the design of two sets of laser focal depth parameters. Due to different equipment, the parameters also vary. The BGV side of the groove needs a shallower focal depth, while the planar side needs a deeper focal depth. The two sets of focal depths also need to meet the condition that a longitudinally penetrating laser sintering zone cannot be formed.

[0122] In such Figure 16a Based on the structure shown, such as Figure 16b As shown, a second blind trench 130 is formed simultaneously with the formation of the first blind trench. A wet etching process can be used to form the first and second blind trenches 130, with HF or NaOH as the etching solution, to wet-etch the modified area and form a double-blind trench structure.

[0123] The second blind slot 130 is filled with metal material to form an internal heat dissipation section 600. As an example, in such... Figure 16b The structure shown can be filled with metal to form something like... Figure 16c The structure shown.

[0124] Subsequently, temporary bonding was performed on the structure shown in 16c above, with one side of the blind trench 120 as the bonding surface and the first blind trench side on the top layer. Through PVD, ECD, CMP, and debonding, a copper-filled structure with double BGV trenches was prepared. In terms of design, it is necessary to ensure that after the second blind slot 130 is filled with copper, the copper filling height is less than or equal to the depth of the slot; the planar side is prepared by a semi-additive method, and the copper filling thickness needs to be greater than or equal to the corresponding depth of the slot.

[0125] Furthermore, such as Figure 16d As shown, the chip 200 is embedded in the package blind slot 120, and the distance between the edge of the chip 200 and the periphery of the package blind slot 120 needs to be greater than or equal to 5μm.

[0126] After that, it will be like this Figure 16d The structure shown is packaged onto the adapter board 400, and the chip 200 is electrically connected to the adapter board 400 to form a structure as shown. Figure 16e The structure shown.

[0127] After that, it will be like this Figure 16e The structure shown is packaged onto circuit board 500, and adapter board 400 is electrically connected to circuit board 500 to form a structure as shown. Figure 3 The structure shown in Example 3 is used to complete product preparation.

[0128] Example 3, in the preparation of Figure 4 When the structure shown in Example 4 is prepared, compared to the preparation and formation Figure 3 The difference in the structure shown in Embodiment 3 is that: After the blind trench 120 is completed, a second trenching, PVD, and electroplating process is performed on the blind trench 120 to prepare the internal trench metal, forming the internal heat dissipation part 600 with a thickness of 5-10 μm. The chip 200 is packaged on top of this internal heat dissipation part 600. This design advantage can effectively reduce electrostatic issues during the packaging process. An external heat dissipation part 300 is also prepared. It is important to note that the external heat dissipation part 300 and the internal heat dissipation part 600 should not be interconnected, and their thicknesses should be ≥10 μm to prevent the metal film layer from peeling off during the etching process. With the large area of ​​metal film layer in the trench and small gaps between the film layers, heat can be quickly and evenly conducted to the comb-like structure of the BGV trench copper, thus further enhancing the heat dissipation capacity.

[0129] Example 4, please refer to the following: Figure 9 The structure shown in Embodiment 9, in some embodiments of this disclosure, provides a method for preparing an encapsulation cover assembly 100, which further includes: An internal heat dissipation section 600 is formed on the outer surface of chip 200.

[0130] Compared to the fabrication method where the internal heat dissipation part 600 is fabricated on the inner surface of the substrate, the fabrication method provided in this embodiment deposits a metal layer on the back side of the chip 200 substrate or wafer after the chip 200 is fabricated. This improves the ESD resistance of the chip 200 during the chip 200 manufacturing stage. This is because after the back side of the chip 200 is coated, there are still many processing steps, such as cutting, picking, and tape-making, which may generate ESD. At the same time, since the heat source during the operation of the chip 200 is the internal electroplating, the close contact between the back metal and the chip 200 helps the heat to dissipate to the back metal in a timely manner, and then conducts it to the comb structure of the external heat dissipation part 300 through the back metal, resulting in excellent heat dissipation.

[0131] Next, chip 200 is packaged into a cover plate, then packaged with adapter board 400, and finally packaged with circuit board 500, forming a structure as follows: Figure 9 The structure shown in Example 9 is used to complete product preparation.

[0132] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0133] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A chip package structure, characterized by, include: A package cover assembly, a chip, and an external heat sink are provided. The package cover assembly includes a board body, and the chip is located on one side of the board body. The board body has a groove structure. Along the arrangement direction of the board body and the chip, the groove structure has an opening at least on the side of the board body opposite to the chip. At least a portion of the chip's orthographic projection onto the board body overlaps with the groove structure. At least a portion of the external heat sink is embedded in the groove structure, and the surface of the external heat sink opposite to the chip extends beyond the surface of the board body opposite to the chip.

2. The chip package structure of claim 1, wherein, Along the arrangement direction of the board body and the chip, the slot structure has an opening on the side of the board body opposite to the chip; the slot structure is a first blind slot. Alternatively, along the arrangement direction of the board body and the chip, the slot structure has openings on both opposite sides of the board body; the slot structure is a through slot.

3. The chip package structure of claim 2, wherein, It also includes an internal heat dissipation section, which is located on the side of the chip facing the board body along the arrangement direction of the board body and the chip, and is in direct contact with the chip and the board body.

4. The chip package structure of claim 3, wherein, The internal heat dissipation part is located on the side of the chip facing the board body and is in contact with the board body; the orthographic projection of the chip on the board body coincides with the orthographic projection of the internal heat dissipation part on the board body. Alternatively, the internal heat dissipation portion is disposed on the side surface of the board body facing the chip; the orthographic projection of the chip onto the board body is located within the orthographic projection of the internal heat dissipation portion onto the board body.

5. The chip package structure of claim 4, wherein, The board body has a second blind slot on the side facing the chip; along the arrangement direction of the board body and the chip, at least a portion of the internal heat dissipation part is embedded in the second blind slot.

6. The chip packaging structure according to claim 5, characterized in that, Along the arrangement direction of the board body and the chip, the side surface of the inner heat dissipation part facing the chip is flush with the side surface of the second blind slot facing the chip.

7. The chip packaging structure according to claim 3, characterized in that, The board body has a plurality of second blind slots on the side facing the chip; along the arrangement direction of the board body and the chip, the inner heat dissipation part is embedded in the second blind slot, and the surface of the inner heat dissipation part facing the chip is flush with the surface of the second blind slot facing the chip.

8. The chip package structure of claim 7, wherein, In a plane perpendicular to the board body and the chip arrangement direction, the slot structure and the second blind slot are arranged alternately; Alternatively, when the slot structure is a first blind slot, the bottom of the first blind slot and the bottom of the second blind slot are spaced apart along the arrangement direction of the board body and the chip.

9. The chip package structure of any one of claims 1-8, wherein, Along the arrangement direction of the board body and the chip, the height H1 of the external heat dissipation part exposed in the groove structure on the side away from the chip needs to be less than the height H2 embedded in the groove structure.

10. The chip package structure of any one of claims 1-8, wherein, There are multiple external heat dissipation parts, which form multiple heat dissipation rings. Each heat dissipation ring has multiple heat dissipation parts spaced apart in its circumferential direction. The cross-sectional size of the external heat dissipation parts in each heat dissipation ring gradually decreases along the direction from the heat dissipation ring in the central area of ​​the chip to the heat dissipation ring in the peripheral area of ​​the chip.

11. The chip package structure of claim 10, wherein, Along the direction from the heat sink in the central region of the chip to the heat sink in the peripheral region of the chip, the distance between adjacent heat sinks gradually increases.

12. The chip package structure of claim 11, wherein, The heat dissipation ring is circular, and the chip is rectangular; the external heat dissipation part is also separately arranged at the position corresponding to the corner of the chip.

13. The chip package structure of any one of claims 1-8, wherein, The encapsulation cover assembly also includes a protrusion. Along the arrangement direction of the board body and the chip, the protrusion is disposed on the side surface of the board body facing the chip and cooperates with the board body to form an encapsulation blind slot, in which the chip is placed.

14. The chip package structure of claim 13, wherein, The protrusion and the plate body are an integral structure; Alternatively, the protrusion may be an encapsulation and fixing layer adhered to the surface of the plate body.

15. The chip packaging structure according to claim 14, characterized in that, The material of the plate body is glass.

16. The chip package structure of claim 13, wherein, The distance between the chip and the protrusion is greater than or equal to 5 μm.

17. The chip package structure of any one of claims 1-8, wherein, The chip packaging structure further includes an adapter board and a circuit board. Along the arrangement direction of the board body and the chip, the packaging cover assembly is packaged on the surface of the adapter board. The chip is located between the packaging cover assembly and the adapter board and is electrically connected to the adapter board. The circuit board is located on the side of the adapter board away from the chip and is electrically connected to the adapter board.

18. A semiconductor package structure, comprising: Includes the chip packaging structure as described in any one of claims 1-17.

19. A method of fabricating a chip package structure, the method comprising: The method for preparing the chip packaging structure as described in any one of claims 1-17 includes: A packaging cover assembly is provided; the packaging cover assembly includes a plate body, the plate body having a groove structure, the groove structure having an opening at least on the outer surface of the plate body; an external heat dissipation part is embedded in the groove structure, and the top surface of the external heat dissipation part extends beyond the outer surface of the plate body; The chip is packaged on one side of the inner surface of the board body; at least a portion of the chip's orthographic projection onto the board body overlaps with the groove structure.

20. The method of claim 19, wherein A method for providing an encapsulated cover assembly includes: An initial blind groove is formed on the outer surface of the plate body; Metal material is filled into the original blind slot to form an external heat dissipation section; The outer surface of the plate body is thinned to form a first blind groove from the original blind groove; the groove structure is the first blind groove.

21. The method of claim 20, wherein After forming the original blind groove into the first blind groove, the method of providing an encapsulation cover assembly further includes, The inner surface of the plate body is thinned to expose the inner surface of the outer heat dissipation part, so that the first blind groove forms a through groove; the groove structure is the through groove.

22. The method of claim 20 or 21, wherein A method for providing an encapsulated cover assembly further includes: An internal heat dissipation section is formed on the inner surface of the plate body.

23. The method of claim 22, wherein the method further comprises: The method of forming an internal heat dissipation portion on the inner surface of the plate body further includes: A second blind groove is formed on the inner surface of the plate body; The second blind slot is filled with metal material to form the internal heat dissipation section.

24. The method of claim 20 or 21, wherein A method for providing an encapsulated cover assembly further includes: An internal heat dissipation section is formed on the outer surface of the chip.

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