Water-cooled plate flow channel inner fin microchannel structure and preparation method thereof

Abstract

This invention discloses a microchannel structure and its preparation method, particularly relating to a finned microchannel structure within a water-cooled plate flow channel and its preparation method. The structure includes a water-cooled plate body, a water-cooled plate cover, a water-cooled plate inlet disposed on the water-cooled plate body, and a water-cooled plate outlet. This invention simultaneously incorporates an inlet distribution pipe and an outlet convergence pipe within the water-cooled plate, enabling uniform distribution of the coolant before it enters the heat exchange area and low-loss collection and stable discharge upon leaving the heat exchange area. This reduces the problem of insufficient local flow caused by flow deviation in parallel flow channels, thereby reducing the risk of local overheating, excessive temperature differences, and the resulting thermal stress concentration, and improving overall heat dissipation consistency and system reliability.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation equipment technology, and in particular to a microchannel structure with fins inside a water-cooled plate flow channel and its preparation method. Background Technology

[0002] As power electronic devices evolve towards higher density, higher power, and smaller size, the heat generated by power devices such as IGBTs and PCS during operation has increased dramatically. Heat dissipation has become a key factor limiting their performance and lifespan. Traditional single-sided cooling structures have high thermal resistance, resulting in a large temperature difference between the chip and the heat dissipation surface, which can easily lead to chip burnout after prolonged use. Although double-sided cooling technology can effectively reduce thermal resistance, problems such as uneven temperature distribution and excessively high flow resistance still exist.

[0003] In existing water-cooled plate technologies, the application of microchannels (equivalent diameter 10-1000μm) significantly improves heat dissipation efficiency. However, traditional microchannel structures are prone to problems such as a sharp increase in the temperature of the flow end wall and poor temperature uniformity under high heat flux density. Although finned heat sinks can increase the heat dissipation area, the fin structure is simple and cannot effectively solve the problem of local hot spots in high-power devices. In addition, existing water-cooled plate flow channel designs mostly use a single serpentine or parallel flow channel, which makes it difficult to balance pressure drop and temperature uniformity, resulting in limited overall heat dissipation performance.

[0004] Therefore, there is an urgent need for a new type of water-cooled plate flow channel structure that can improve heat dissipation efficiency, enhance temperature uniformity, and reduce system flow resistance, thereby meeting the heat dissipation requirements of high-power devices such as IGBTs and PCS. Summary of the Invention

[0005] In order to solve the problems existing in the prior art, the present invention provides a microchannel structure with fins inside a water-cooled plate flow channel and a method for preparing the same, so as to solve the current technical problems.

[0006] The technical solution adopted by this invention to solve its technical problem is: This invention provides a microchannel structure with fins inside a water-cooled plate flow channel and its preparation method, comprising a water-cooled plate body, a water-cooled plate cover plate, a water-cooled plate inlet disposed on the water-cooled plate body, and a water-cooled plate outlet; the water-cooled plate body and the water-cooled plate cover plate are sealed together to form a coolant flow channel; the coolant flow channel includes an inlet branch pipe communicating with the water-cooled plate inlet, an outlet manifold pipe communicating with the water-cooled plate outlet, and a microchannel sawtooth fin structure and a columnar heat exchange structure located within the heat exchange area; wherein... The microchannel serrated fin structure is used to form periodic disturbances and separation-reattachment flow within the microchannel to enhance convective heat transfer; the columnar heat exchange structure is used to generate wake vortices and lateral shear disturbances in the downstream or parallel region of the microchannel serrated fin structure to further enhance heat transfer and improve temperature uniformity; the inlet diversion pipe is used to evenly distribute the inlet coolant to multiple parallel heat exchange channels, and the outlet manifold is used to smoothly collect the coolant from each parallel heat exchange channel and discharge it to the outlet of the water-cooled plate.

[0007] Preferably, the microchannel is a rectangular, approximately rectangular, or equivalent non-circular cross-section microchannel, and the equivalent diameter of the microchannel is 50 μm to 500 μm.

[0008] Preferably, the microchannel serrated fin structure is composed of serrated units that repeat periodically along the flow direction. The serrated units include an upstream slope and a downstream steep slope to create local separation, reattachment, and redevelopment of flow between the serrated units.

[0009] Preferably, the angle of the upstream slope of the sawtooth unit is 20° to 55°, the angle of the downstream steep slope is 55° to 85°, and the sawtooth tip is provided with a rounded transition to reduce scouring sensitivity and the risk of processing burrs.

[0010] Preferably, the fin height of the microchannel serrated fin structure is 2mm to 6mm, and the fin pitch is 1.0mm to 3.0mm.

[0011] Preferably, the columnar heat exchange structure includes multiple columnar array units, the columnar cross-sections are circular, elliptical or rounded polygonal, and the columnar array is arranged in a straight line or staggered.

[0012] Preferably, the short axis or diameter of the spur teeth is 0.3 mm to 2.5 mm, and the center distance between the spur teeth is 1.2 to 4.0 times the short axis or diameter of the spur teeth.

[0013] Preferably, the inlet branch pipe and / or the outlet manifold is a manifold structure, with the cross-sectional area of ​​the manifold varying linearly, segmentally, or as a quadratic function along the main flow direction, so as to match the pressure drop along the manifold with the resistance distribution of the parallel branches, thereby improving flow uniformity.

[0014] Preferably, the heat exchange surface on the device mounting side of the water-cooled plate body is roughened or micro-textured to reduce interfacial contact thermal resistance and improve wetting stability.

[0015] Preferably, the water-cooled plate body and the water-cooled plate cover are sealed together by any one of vacuum brazing, diffusion welding or friction stir welding.

[0016] Preferably, it includes the following steps: A) Obtain the device's thermal load, allowable coolant inlet and outlet temperature rise, allowable pressure drop, installation dimensions, and coolant physical properties, and establish a flow-heat transfer coupling model that includes the inlet branch pipe, microchannel sawtooth fin structure, columnar heat exchange structure, and outlet manifold. B) Determine the equivalent diameter range of the microchannel and the geometric parameters of the serrated fins to create periodic disturbances within the microchannel; C) Determine the size and arrangement of the columnar tooth array to generate wake vortices and transverse shear disturbances in the downstream or parallel region; D) Implement a manifold cross-section gradient design for the inlet branch line and the outlet junction line to make the pressure difference at the inlet of the parallel branches more consistent and reduce the outlet junction loss; E) Process the water-cooled plate body and water-cooled plate cover and complete the sealing connection to form a flow channel, and complete the inlet and outlet interfaces; F) Conduct airtightness and water pressure tests, and measure the pressure drop-flow rate curve and temperature rise-flow rate curve to form an engineering parameter library for batch consistency verification.

[0017] Preferably, in step A, the target mass flow rate is obtained according to the mass flow rate calculation formula m_dot = Q / (cp*ΔT), where Q is the heat load, cp is the specific heat of the coolant, and ΔT is the allowable temperature rise of the coolant inlet and outlet.

[0018] Preferably, in step B, when the microchannel has a rectangular cross-section, the equivalent diameter is calculated based on Dh = 2wh / (w+h), where w is the channel width and h is the channel height.

[0019] Preferably, in step D, the flow sharing design is achieved by minimizing the branch flow deviation evaluation index of the parallel system. The evaluation index is J_flow = (1 / N)*sum((q_i - q_avg)^2), where N is the number of branches, q_i is the flow of the i-th branch, and q_avg is the average branch flow.

[0020] Preferably, in step F, the equivalent local resistance coefficient is back-calibrated based on the pressure drop data of multiple flow points, and the equivalent local resistance coefficient is used for rapid selection in subsequent model iterations.

[0021] The beneficial effects of this invention are: First, the present invention simultaneously sets up an inlet diversion pipe and an outlet manifold inside the water-cooled plate, so that the coolant is evenly distributed before entering the heat exchange area and is collected with low loss and stably discharged when leaving the heat exchange area. This reduces the problem of insufficient local flow caused by the deviation of parallel flow channels from the source, thereby reducing the risk of local overheating, excessive temperature difference and the resulting thermal stress concentration, and improving the overall heat dissipation consistency and system reliability.

[0022] Secondly, the present invention forms a coupling enhancement mechanism of "high specific surface area + periodic disturbance + separation-reattachment" in the microchannel through the sawtooth fins of the microchannel, which enables the boundary layer to be periodically destroyed and regenerated, significantly improving the local convective heat transfer coefficient and effective heat transfer area. Under the same pump power or similar pressure drop constraints, higher heat transfer capacity can be obtained, thereby improving the heat dissipation margin of IGBT or PCS devices under high heat flux density conditions and reducing the peak temperature rise on the device mounting side.

[0023] Third, the present invention further introduces a columnar heat exchange structure, which generates a tail vortex and lateral shear disturbance in the downstream or parallel region of the microchannel sawtooth fins, enhances the lateral mixing of the fluid and inhibits the downstream thermal boundary layer from thickening again, so that the heat exchange enhancement can continue in the later part of the flow direction; thereby reducing the outlet temperature rise slope and improving the overall temperature distribution uniformity, which is especially suitable for heat dissipation scenarios of IGBT or PCS modules with multiple chips and multiple heat sources unevenly distributed.

[0024] Fourth, the structural parameters and engineering implementation path of the present invention are clear: the equivalent diameter of the microchannel, the geometric range of the serrated fins, the size and arrangement range of the column teeth, the manifold gradient form, and the pressure drop segment superposition verification and parameter library back calibration method can all be directly recalculated and verified, so that those skilled in the art can complete the design, processing, assembly and consistency inspection without creative labor, and it has the engineering feasibility of being mass-produced.

[0025] Fifth, this invention is more manufacturing- and reliability-friendly: by designing a low-loss transition shape between the inlet diversion pipe and the outlet manifold, the tendency for eddy current retention and bubble retention can be reduced; at the same time, combined with feasible cleaning and unobstructedness verification, factory testing and threshold determination of pressure drop-flow rate curves and temperature rise-flow rate curves, performance dispersion caused by factors such as microstructure debris blockage, burr erosion and welding deformation can be effectively controlled in mass production, thereby improving product consistency and lifespan stability. Attached Figure Description

[0026] The above-described aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic diagram of the microchannel structure of the water-cooled plate flow channel and its preparation method according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the microchannel structure of the water-cooled plate flow channel and its preparation method according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the microchannel structure of the water-cooled plate flow channel and its preparation method according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the microchannel structure of the water-cooled plate flow channel and its preparation method according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the microchannel structure of the water-cooled plate flow channel and its preparation method according to an embodiment of the present invention. Explanation of reference numerals in the attached figures

[0027] exist Figures 1-5 In the middle section, 1 is the water-cooled plate body; 2 is the water-cooled plate cover; 3 is the water-cooled plate inlet; 4 is the water-cooled plate outlet; 5 is the microchannel serrated fins; 6 is the columnar heat exchange structure; 7 is the outlet manifold; and 8 is the inlet branch pipe. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] A microchannel structure with fins inside a water-cooled plate and its fabrication method are disclosed. The water-cooled plate consists of a water-cooled plate body 1 and a water-cooled plate cover 2, which are sealed together to form an internal coolant flow channel. The water-cooled plate body 1 is provided with a water-cooled plate inlet 3 and a water-cooled plate outlet 4. After entering through the water-cooled plate inlet 3, the coolant undergoes convective heat transfer within the internal flow channel, absorbing heat from the device, and is finally discharged through the water-cooled plate outlet 4, achieving liquid cooling for IGBT or PCS devices.

[0030] To reduce the contact thermal resistance at the device mounting interface and improve long-term stability, the heat exchange surface on the device mounting side of the water-cooled plate body 1 can be roughened or micro-textured. The feasible processes for this treatment are as follows: sandblasting: controlling the surface roughness Ra between 1.0 μm and 6.3 μm; micro-etching: using chemical micro-etching to form a uniform array of micro-pits to improve wettability; micro-grooving: forming micro-grooves by rolling or precision milling to make the thermal grease spread more evenly.

[0031] The internal flow channel includes at least: an inlet branch pipe 8, an outlet manifold pipe 7, microchannel serrated fins 5, and a columnar heat exchange structure 6.

[0032] Inlet diversion pipe 8: Achieves uniform inlet distribution and reduces flow deviation in parallel branches. Microchannel serrated fins 5: Achieves enhanced primary heat transfer through high specific surface area and periodic disturbance / reattachment. Columnar heat exchange structure 6: Achieves secondary disturbance enhancement and mixing, suppressing downstream temperature rise slope and improving temperature uniformity. Outlet manifold 7: Achieves low-loss collection and smooth discharge to the water-cooled plate outlet 4.

[0033] Inlet diversion pipe 8 is used to distribute the inlet flow of the water-cooled plate inlet 3 to multiple parallel heat exchange paths. This achieves a closed-loop method of calculation-processing-verification. Let the heat dissipation power of the device be Q, and the allowable temperature rise of the coolant inlet and outlet be... Given T_fluid, where the specific heat of the coolant is cp, the target mass flow rate is: m_dot = Q / (cp*) T_fluid).

[0034] If expressed as volumetric flow rate q_total, then: q_total = m_dot / rho, where rho is the coolant density.

[0035] Let the number of parallel branches be N, the branch flow be q_i, and the average branch flow be q_avg = q_total / N. Then the flow sharing deviation index is: J_flow = (1 / N)*sum((q_i - q_avg)^2).

[0036] Take several discrete values ​​for the manifold gradient, manifold length, and branch inlet transition fillet radius of the inlet branch pipe 8, calculate or test each group, and select the group with the smallest J_flow under the pressure drop constraint.

[0037] The manifold cross-section can be gradually changed, either linearly or in a segmented linear manner; for the branch inlet transition, a rounded transition or a gradual diffusion transition is preferred. This can be indirectly verified by checking the consistency of the temperature difference and pressure drop-flow curve at the outlets of each branch under the same pump speed / total flow rate; if a branch flow meter is available, q_i can be measured directly and J_flow can be calculated.

[0038] The purpose of the microchannel serrated fins 5 is to achieve periodic destruction and regeneration of the boundary layer within the microchannel and significantly increase the effective heat exchange area, thereby improving heat dissipation capacity under limited pump power.

[0039] When the microchannel has a rectangular cross-section, the equivalent diameter is: Dh = 2wh / (w+h); where w is the channel width and h is the channel height. Dh is preferably in the range of 50μm to 500μm.

[0040] Technicians can select w and h according to the processing capacity and ensure that Dh falls within the range. For example, if h is fixed at 0.30mm, w can be selected from 0.10mm to 0.60mm to obtain different Dh values. If it is necessary to reduce the risk of clogging, w can be appropriately increased and the filtration level can be improved.

[0041] The average flow velocity V can be calculated from the total flow area A_total_flow: V = m_dot / (rho*A_total_flow); Reynolds number: Re = rhoVDh / mu; mu is the dynamic viscosity. In engineering, it is preferable to control Re in the range of 200 to 2500 to balance heat transfer enhancement and pressure drop.

[0042] The serrated fin geometry employs a machinable profile of an oncoming slope, a back slope, and rounded tooth tips to create a separation-reattachment flow.

[0043] Fin height Hf: 2mm to 6mm, preferably 4mm; serration pitch Pf: 1.0mm to 3.0mm, preferably 1.9mm; upstream slope angle α: 20° to 55°; downstream steep slope angle β: 55° to 85°; tooth tip radius r: 0.05mm to 0.30mm; fin thickness t: 0.20mm to 1.20mm.

[0044] To ensure controllable system pump power, the total pressure drop is decomposed into: P_total = P_in + P_fin + P_pillar + P_out; where each segment can be summed by combining the loss along the path and the local loss: P_section = f(L / Dh)(rhoV^2 / 2) + K_local(rho*V^2 / 2).

[0045] The calculation method for K_local is as follows: measure the flow rate at multiple points ΔP_total; subtract from the known geometry and friction terms to back-calibrate K_local; write K_local into the engineering parameter library for direct reuse with the same structural dimensions in subsequent applications.

[0046] The columnar heat exchange structure 6 is used to continue providing disturbance and mixing downstream of or in parallel with the microchannel serrated fins 5, thereby reducing the downstream temperature rise slope and making the heat distribution more uniform. Columnar cross-section: cylindrical, elliptical, or rounded polygonal columns are all acceptable; array: in-line or staggered. Staggered array is selected if the pressure drop margin is large; in-line array is selected if the pressure drop is strictly limited.

[0047] Short axis or diameter d_s: 0.3mm to 2.5mm; center distance p: 1.2d_s to 4.0d_s. After using the default parameters, the equivalent K_local is also fixed into the parameter library through pressure drop curve calibration.

[0048] The outlet manifold 7 collects the parallel fluids and leads them to the water-cooled plate outlet 4. To reduce ineffective pressure drop and bubble retention, the flow direction avoids sudden turns as much as possible; rounded corners or gradual diffusion transitions are set at the manifold inlet of the manifold branch; the effective length of the manifold is increased within the allowable structural space to make the velocity distribution more uniform before reaching the water-cooled plate outlet 4; the pressure drop-flow curve of the sample confirms that there is no abnormal steep increase in the outlet manifold section. To ensure that the microchannel structure can be mass-produced and the consistency is controllable, the microchannel sawtooth fins 5 can be formed by CNC milling / forming tool processing / laser processing followed by fine finishing, with a focus on controlling the burrs and debris at the tooth tips; the columnar heat exchange structure 6 is formed into an array by CNC machining, with a focus on controlling the burrs at the top of the columnar teeth and the overcut at the root; the inlet branch pipe 8 and the outlet manifold 7 focus on controlling the surface quality of the manifold transition rounded corners and the gradual transition section to avoid steps that cause local vortices.

[0049] A closed-loop system is adopted, consisting of inter-process cleaning, final cleaning, and filtration circulation flushing: ultrasonic cleaning, deionized water rinsing, and hot air drying; alkaline washing for degreasing, acid washing for activation, deionized water rinsing, and drying; the internal flow channels are continuously flushed with a circulating liquid of a set filtration grade until the pressure drop stabilizes. The pressure drop is measured three times at the same flow point. If there is significant fluctuation, it is prioritized to identify residue / air bubbles / local blockage and rework the cleaning process.

[0050] The sealing connection between the water-cooled plate body 1 and the water-cooled plate cover 2 can be achieved by vacuum brazing, diffusion welding, or friction stir welding. To control the flatness and sealing reliability after welding, tooling is used for positioning to ensure consistent welding gaps; a symmetrical heat input strategy is adopted to reduce warping; and the flatness of the device mounting side is checked after welding, with reshaping correction performed if necessary.

[0051] Air tightness test: Hold pressure at the upper limit of the design pressure; if the leakage rate meets the standard, it is considered qualified. Water pressure test: Hold pressure at a multiple of the working pressure; if there is no leakage, it is considered qualified. Pressure drop-flow curve: Measure the pressure difference between the water-cooled plate inlet 3 and the water-cooled plate outlet 4 to form the flow resistance curve for this batch. Temperature rise-flow curve: Measure Tin and Tout under a standard heat source and calculate Tout-Tin to form a heat transfer curve. Consistency judgment: Compare the batch curve with the parameter library template; if it exceeds the threshold, it is judged as abnormal and the cause of cleaning / burr / welding deformation, etc., is traced.

[0052] Heat load estimation: Based on coolant: Q_est,1 = m_dotcp(Tout - Tin); Based on electrical parameter model: Q_est,2 = P_loss_model(I,V,fs,Tj); Fusion: Q_est = w1Q_est,1 + w2Q_est,2, w1+w2=1; Default w1=0.7, w2=0.3.

[0053] Target flow rate and temperature uniformity gain: Basic target: m_dot_cmd = Q_est / (cp T_target); M temperature points T_s,j are arranged on the device mounting surface, and the standard deviation is defined as follows: T = sqrt((1 / M)sum((T_s,j - T_s,avg)^2)); if T > T_target, then: m_dot_cmd = m_dot_cmd * (1 + k_u*( T / T_target -1); where k_u ranges from 0.05 to 0.30.

[0054] Voltage drop protection limit: P is the pressure difference between the inlet and outlet. If P > P_limit, then: m_dot_cmd = m_dot_cmd * ( P_limit / P)^k_p;k_p takes values ​​from 0.3 to 1.0.

[0055] Parameter library reverse calibration: For the same structure, collect multiple flow points (q_total, Create and save P_total, Tout-Tin: P_total = aq_total^2 + bq_total + c (quadratic fitting, facilitating rapid calculation by the controller); Tout-Tin = g(q_total, Q) (piecewise linear or polynomial fitting can be used); and the equivalent K_local obtained from the fitting is solidified for subsequent batch consistency judgment and rapid selection.

[0056] Fault diagnosis rules: at the same pump speed A sudden increase in P and a rise in Tout: prioritize determining debris blockage / partial blockage; When P decreases while Tout increases: prioritize identifying cavitation / liquid shortage / air intake; P is normal but Increased T abnormally: Prioritize checking the flow equalization capacity and localized air bubble retention in the inlet diversion pipeline 8. Triggering strategies: Power reduction, flow rate limiting, alarm shutdown, etc., can all be configured according to the system safety level.

[0057] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A water-cooled panel flow channel inner fin microchannel structure and its preparation method, characterized in that: It includes a water-cooled plate body, a water-cooled plate cover, a water-cooled plate inlet and a water-cooled plate outlet disposed on the water-cooled plate body.

2. The water cooled panel flow channel inner fin microchannel structure according to claim 1, characterized in that: The water-cooled plate body and the water-cooled plate cover are sealed together to form a coolant flow channel. The coolant flow channel includes an inlet branch pipe connected to the inlet of the water-cooled plate, an outlet manifold pipe connected to the outlet of the water-cooled plate, and a microchannel sawtooth fin structure and a columnar heat exchange structure located in the heat exchange area. The microchannel sawtooth fin structure is used to form periodic disturbances and separation-reattachment flow in the microchannel to enhance convective heat transfer. The columnar heat exchange structure is used to generate wake vortices and transverse shear disturbances in the downstream or parallel area of ​​the microchannel sawtooth fin structure to further improve heat transfer and improve temperature uniformity. The inlet branch pipe is used to evenly distribute the inlet coolant to multiple parallel heat exchange channels, and the outlet manifold pipe is used to smoothly collect the coolant from each parallel heat exchange channel and export it to the outlet of the water-cooled plate.

3. The water cooled panel flow channel inner fin microchannel structure and the preparation method thereof according to claim 2, characterized in that: The microchannel sawtooth fin structure is composed of sawtooth units that repeat periodically along the flow direction, and the sawtooth units include an upstream slope and a downstream steep slope.

4. The water cooled panel flow channel inner fin microchannel structure according to claim 2, characterized in that: The columnar heat exchange structure includes multiple columnar array units, the cross-section of which is circular, elliptical, or rounded polygonal, and the columnar array is arranged in a straight or staggered manner.

5. The water-cooled plate flow channel inner fin microchannel structure and its preparation method according to claim 2, characterized in that: The heat exchange surface on the device mounting side of the water-cooled plate body is roughened or micro-textured.

6. The water cooled panel flow channel inner fin microchannel structure according to claim 2, characterized in that: The water-cooled plate body and the water-cooled plate cover are sealed together by any one of vacuum brazing, diffusion welding or friction stir welding.

7. The water cooled panel flow channel inner fin microchannel structure according to claim 2, characterized in that Includes the following steps: A) Obtain the device's thermal load, allowable coolant inlet and outlet temperature rise, allowable pressure drop, installation dimensions, and coolant physical properties, and establish a flow-heat transfer coupling model that includes the inlet branch pipe, microchannel sawtooth fin structure, columnar heat exchange structure, and outlet manifold. B) Determine the equivalent diameter range of the microchannel and the geometric parameters of the serrated fins to create periodic disturbances within the microchannel; C) Determine the size and arrangement of the columnar tooth array to generate wake vortices and transverse shear disturbances in the downstream or parallel region; D) Implement a manifold cross-section gradient design for the inlet branch line and the outlet junction line to make the pressure difference at the inlet of the parallel branches more consistent and reduce the outlet junction loss; E) Process the water-cooled plate body and water-cooled plate cover and complete the sealing connection to form a flow channel, and complete the inlet and outlet interfaces; F) Conduct airtightness and water pressure tests, and measure the pressure drop-flow rate curve and temperature rise-flow rate curve to form an engineering parameter library for batch consistency verification.

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