An integrated circuit coated chip heat sink device and method of use

Abstract

This invention relates to the field of chip heat dissipation technology, and discloses a heat dissipation device and method for integrated circuit coated chips. The device includes an integrated circuit coated chip body and an integrated heat sink. The integrated circuit coated chip body is disposed within the integrated heat sink. A circulation pump is located on one side of the integrated heat sink. The integrated heat sink is filled with thermally conductive silicone grease, which coats the integrated circuit coated chip body. A cooling heat sink is mounted on the integrated heat sink and is connected to it. This invention employs a dual-channel parallel heat dissipation method. A condenser tube directly contacts the upper surface of the chip for cooling. The thermally conductive silicone grease completely coats the upper surface, lower surface, and surrounding sides of the chip, and is driven by a push tube to achieve circulation, carrying away heat from all exposed surfaces of the chip. This results in a more uniform chip temperature distribution and effectively avoids the formation of localized hot spots.

Description

Technical Field

[0001] This invention relates to the field of chip heat dissipation technology, and in particular to a heat dissipation device for integrated circuit coated chips and its usage method. Background Technology

[0002] Chip heat dissipation faces a fundamental physical bottleneck: interfacial thermal resistance. Heat generated at the interface cannot dissipate smoothly, accumulating inside the chip and ultimately leading to performance degradation or even device damage. Conventional water cooling offers high heat exchange efficiency, but it suffers from the following problems: Firstly, the cold head can only be attached to the upper surface of the chip for cooling. The lower surface, sides, and packaging substrate of the chip cannot be directly contacted by the coolant. The heat in these areas can only be transferred to the upper surface through the heat conduction of the chip itself and then carried away. This results in high thermal resistance and low efficiency, leading to a severely uneven temperature distribution of the chip as a whole, which can easily form local hot spots at the edges or corners of the chip. Secondly, existing technologies cannot simultaneously meet the requirements of efficient heat dissipation and all-round cooling without dead angles for chips, especially lacking a way to cool multiple surfaces of the chip at the same time.

[0003] To address this, we designed a heat dissipation device for integrated circuit coated chips and its usage method. Summary of the Invention

[0004] The purpose of this invention is to solve the problem of severely uneven temperature distribution of chips in the prior art, which easily leads to local hot spots at the chip edges or corners. Therefore, this invention proposes an integrated circuit coated chip heat dissipation device and its usage method.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An integrated circuit coated chip heat dissipation device includes an integrated circuit coated chip body and an integrated heat dissipation box. The integrated circuit coated chip body is disposed in the integrated heat dissipation box. A circulation pump is provided on one side of the integrated heat dissipation box. The integrated heat dissipation box is filled with thermally conductive silicone grease, which covers the integrated circuit coated chip body. A cooling heat dissipation box is provided on the integrated heat dissipation box and is connected to the integrated heat dissipation box. The integrated heat sink is equipped with a push tube, and cooling water flows intermittently inside the integrated heat sink. The intermittently flowing cooling water impacts and drives the push tube to move back and forth. The push tube drives the thermal grease to circulate through the push mechanism. The integrated heat sink is also equipped with a condenser tube that extends into the integrated heat sink and is in contact with the surface of the integrated circuit coated chip.

[0006] Preferably, connecting rods are fixedly inserted at all four corners of the integrated heat sink, and a mounting bracket that supports the integrated circuit coated chip body is fixed at one end of the connecting rod. The mounting bracket and the connecting rod are both made of thermally conductive metal.

[0007] Preferably, multiple first thermal grease connecting pipes are symmetrically arranged on both sides of the integrated heat sink, and second and third thermal grease connecting pipes are symmetrically arranged on both sides of the cooling heat sink. The second and third thermal grease connecting pipes are connected to the first thermal grease connecting pipes on both sides of the integrated heat sink through a second circulation connecting pipe.

[0008] Preferably, a polyethylene spiral tube is provided inside the integrated heat sink box, and the polyethylene spiral tube is used to connect the second thermally conductive silicone grease connecting tube and the third thermally conductive silicone grease connecting tube. The polyethylene spiral tube is in a straight state, and a first one-way valve and a second one-way valve are respectively provided in the third thermally conductive silicone grease connecting tube and the second thermally conductive silicone grease connecting tube.

[0009] Preferably, the cooling heat dissipation box is provided with a first liquid inlet pipe and a first liquid outlet pipe at both ends. The circulation pump is connected to the first liquid inlet pipe and the first liquid outlet pipe through a first circulation connecting pipe. Multiple heat dissipation fins are inserted on the first circulation connecting pipe. The circulation pump drives the cooling water to flow from the first liquid inlet pipe to the first liquid outlet pipe.

[0010] Preferably, the outer diameter of the push tube is the same as the inner diameter of the first liquid inlet tube, the opening of the push tube faces the first liquid inlet tube, and the other end of the push tube is sealed.

[0011] Preferably, the liquid pushing mechanism includes: The return spring and the push tube are coaxially and slidably inserted into the first liquid inlet pipe. The return spring is set inside the cooling box, and the two ends of the return spring are respectively connected to the inner wall of the cooling box and the push tube. The installation holes are provided in multiple ways and are linearly opened on the outer wall of the push tube. A connecting cavity is opened in the installation hole and the connecting cavity is connected to the opening of the push tube. The polyethylene spiral tube is inserted into the installation hole.

[0012] Preferably, the bottom of the cooling box has a connection hole structure, and multiple connection holes are arranged linearly on the bottom of the cooling box. The connection hole structure includes: The liquid outlet and liquid inlet are symmetrically located at the bottom of the cooling box. The connecting cavity inside the push tube is connected to the liquid inlet through a rubber hose.

[0013] Preferably, a second liquid inlet pipe and a second liquid outlet pipe are symmetrically arranged on the condenser tube. Both the second liquid inlet pipe and the second liquid outlet pipe are connected to the condenser tube, and the second liquid inlet pipe and the second liquid outlet pipe are respectively installed in the liquid inlet and the liquid outlet.

[0014] A method for using a heat dissipation device for an integrated circuit coated chip is described below: S1: The integrated circuit coated chip body generates heat during operation. This heat appears on the surface of the integrated circuit coated chip body and is then dissipated in two parts. S2: A portion of the heat located on the integrated circuit coated chip body will be conducted through the condenser tube to the integrated circuit coated chip body. The heat will be transferred to the condenser tube, and then as the circulation pump is turned on, the cooling water is intermittently pumped into the cooling heat dissipation box through the first liquid inlet pipe. S3: The cooling water entering the connecting cavity of the push tube from the opening will enter the second liquid inlet pipe inside the liquid inlet through the rubber hose. The heat that is conducted to the condenser tube by contacting the surface of the integrated circuit coated chip body will be discharged from the second liquid outlet pipe with the cooling water flowing in the condenser tube and reach the cooling heat dissipation box. S4: Another part of the heat will be conducted through the thermal grease filled in the integrated heat sink box, so that the heat is transferred from the integrated circuit coated chip body to the thermal grease. As the extrusion tube reciprocates, it can carry the thermal grease in the polyethylene spiral tube to flow in one direction. With the flow of cooling water, the thermal grease is cooled down. After cooling, the thermal grease is squeezed back into the integrated heat sink box.

[0015] The beneficial effects of this invention are as follows: This invention employs a dual-channel parallel heat dissipation method. The condenser tube is directly attached to the upper surface of the chip for cooling. The thermal grease completely covers the upper surface, lower surface, and surrounding sides of the chip and is driven by the push tube to achieve circulation, carrying away the heat from all exposed surfaces of the chip. This results in a more uniform temperature distribution on the chip and effectively avoids the generation of local hot spots.

[0016] This invention utilizes the reciprocating motion generated by the impact of cooling water on the pushing tube to periodically squeeze the polyethylene spiral tube. Combined with the directional conduction of the one-way valve, it realizes the passive circulation of thermal grease. The driving of the thermal grease is entirely accomplished by water power, eliminating the need for additional pumps or motors. This simplifies the structure, reduces energy consumption, and improves reliability. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an integrated circuit coated chip heat dissipation device proposed in this invention; Figure 2 This is a top view of an integrated circuit coated chip heat dissipation device proposed in this invention; Figure 3 This is a schematic diagram of the condensation and cooling state in a heat dissipation device for an integrated circuit coated chip proposed in this invention. Figure 4 This is a schematic diagram of the cooling heat dissipation box in an integrated circuit coated chip heat dissipation device proposed in this invention; Figure 5 A top view of a cooling heat dissipation box in an integrated circuit coated chip heat dissipation device proposed in this invention; Figure 6This is an isometric view of the cooling heat dissipation box in an integrated circuit coated chip heat dissipation device proposed in this invention.

[0018] In the diagram: 1. Integrated circuit coated chip body; 2. Integrated heat sink box; 3. Mounting bracket; 4. Connecting rod; 5. Cooling heat sink box; 6. First liquid inlet pipe; 7. First liquid outlet pipe; 8. First circulation connecting pipe; 9. First thermally conductive silicone grease connecting pipe; 10. Second thermally conductive silicone grease connecting pipe; 11. Third thermally conductive silicone grease connecting pipe; 12. Second circulation connecting pipe; 13. Liquid outlet; 14. Mounting hole; 15. Polyethylene spiral tube; 16. First one-way valve; 17. Push tube; 18. Return spring; 19. Condenser tube; 20. Liquid inlet; 21. Rubber hose; 22. Second liquid inlet pipe; 23. Second liquid outlet pipe. Detailed Implementation

[0019] Reference Figures 1-6 An integrated circuit coated chip heat dissipation device includes an integrated circuit coated chip body 1 and an integrated heat dissipation box 2. The integrated circuit coated chip body 1 is disposed in the integrated heat dissipation box 2. Connecting rods 4 are fixedly inserted at the four corners of the integrated heat dissipation box 2, and a mounting bracket 3 for supporting the integrated circuit coated chip body 1 is fixed at one end of the connecting rod 4. When the integrated circuit coated chip body 1 is working, it generates heat, which appears on the surface of the integrated circuit coated chip body 1. Then the heat is divided into multiple parts for dissipation. Compared with the traditional single-channel heat dissipation method, multi-channel heat dissipation can better dissipate the heat of the integrated circuit coated chip body 1.

[0020] The mounting bracket 3 and connecting rod 4 are both made of thermally conductive metal. The integrated heat dissipation box 2 is the core load-bearing component of this device. It has a rectangular box structure and is made of a metal material with good thermal conductivity, preferably aluminum alloy or copper alloy. The wall thickness of the integrated heat dissipation box 2 is preferably 1.5mm to 3mm, which ensures sufficient structural strength while taking into account the rapid conduction and radiation dissipation of heat.

[0021] High-temperature resistant silicone gaskets are installed between the two sealing covers of the integrated heat sink 2 and the box body to prevent leakage of thermal grease during circulation. The internal cavity size of the integrated heat sink 2 is determined according to the external dimensions of the integrated circuit coated chip body 1. Generally, a gap of 5-10mm is left on each side for filling thermal grease. The height of the chip body 1 accounts for 1 / 3 to 1 / 2 of the cavity depth to ensure that the thermal grease can completely cover the upper surface, lower surface and surrounding sides of the chip.

[0022] The integrated heat sink 2 is equipped with a circulation pump on one side. The integrated heat sink 2 is filled with thermal grease. The thermal grease covers the integrated circuit coated chip body 1 and completely covers the chip body 1 to form the first layer of heat conduction medium. One side of the integrated heat sink 2 is connected to the cooling heat sink 5 through the first thermal grease connecting pipe 9 and the second circulation connecting pipe 12 to form an external circulation path for the thermal grease.

[0023] The integrated heat sink 2 is equipped with a cooling heat sink 5, which is connected to the integrated heat sink 2. The cooling heat sink 5 has a first inlet pipe 6 and a first outlet pipe 7 at both ends. The circulating pump is connected to the first inlet pipe 6 and the first outlet pipe 7 through a first circulating connecting pipe 8. Multiple heat sinks are inserted on the first circulating connecting pipe 8 to assist the cooling water in cooling down. The circulating pump drives the cooling water to flow from the first inlet pipe 6 to the first outlet pipe 7. The first circulating connecting pipe 8 is a flexible or semi-flexible hose, preferably made of silicone tubing, with an inner diameter that matches the first inlet pipe 6 and the first outlet pipe 7. The first circulating connecting pipe 8 connects the circulating pump, the first inlet pipe 6, and the first outlet pipe 7 into a closed loop.

[0024] The first part of the heat is transferred directly from the chip surface to the condenser tube 19 attached to it. The cooling water inside the condenser tube 19 flows intermittently under the drive of the push tube 17, carrying away the heat.

[0025] The integrated heat sink 2 is also provided with a condenser tube 19 that extends into the integrated heat sink 2 and is in contact with the surface of the integrated circuit coated chip body 1. The bottom of the cooling heat sink 5 is provided with a connection hole structure. There are multiple connection holes, which are linearly arranged at the bottom of the cooling heat sink 5. A portion of the heat in the integrated circuit coated chip body 1 will be transferred to the condenser tube 19 through contact with the integrated circuit coated chip body 1. Then, as the circulation pump is turned on, the cooling water is intermittently pumped into the cooling heat sink 5 through the first liquid inlet pipe 6. The connection hole structure includes a liquid outlet 13 and a liquid inlet 20. The liquid outlet 13 and the liquid inlet 20 are symmetrically arranged at the bottom of the cooling heat sink 5. The connecting cavity in the push tube 17 is connected to the liquid inlet 20 through a rubber hose 21.

[0026] The condenser tube 19 is symmetrically provided with a second liquid inlet pipe 22 and a second liquid outlet pipe 23. The second liquid inlet pipe 22 and the second liquid outlet pipe 23 are both connected to the condenser tube 19, and the second liquid inlet pipe 22 and the second liquid outlet pipe 23 are respectively installed in the liquid inlet 20 and the liquid outlet 13. Due to the intermittent impact of cooling water on the push tube 17.

[0027] The push tube 17 is the core driving element of this device. Its function is to convert the intermittent impact force of the cooling water into mechanical reciprocating motion, thereby driving the polyethylene spiral tube 15 to produce periodic deformation. The push tube 17 is made of metal or high-strength engineering plastic. The material must have good wear resistance and corrosion resistance. Then, in conjunction with the return spring 18, the push tube 17 slides back and forth in the cooling heat dissipation box 5. The cooling water that enters the connecting cavity of the push tube 17 from the opening will enter the second liquid inlet pipe 22 in the liquid inlet 20 through the rubber hose 21.

[0028] Since both the second inlet pipe 22 and the second outlet pipe 23 are connected to the condenser pipe 19, the heat that is conducted to the condenser pipe 19 by contact with the surface of the integrated circuit coated chip body 1 will be discharged from the second outlet pipe 23 along with the cooling water flowing in the condenser pipe 19 and reach the cooling heat dissipation box 5, thereby realizing the heat exchange operation.

[0029] Cooling water carrying heat is discharged from the first outlet pipe 7 inside the cooling heat dissipation box 5, while multiple heat sinks inserted on the first circulation connecting pipe 8 come into direct contact with the cooling water carrying heat, thereby dissipating heat and achieving the cooling effect of cooling water, and realizing the recycling of cooling water.

[0030] The second part of the heat is first transferred to the thermal grease. The thermal grease circulates in one direction under the extrusion deformation of the polyethylene spiral tube 15 and exchanges heat with the cooling water when it flows through the cooling heat dissipation box 5.

[0031] Multiple first thermal grease connecting pipes 9 are symmetrically arranged on both sides of the integrated heat sink 2. Second thermal grease connecting pipes 10 and third thermal grease connecting pipes 11 are symmetrically arranged on both sides of the cooling heat sink 5. The second thermal grease connecting pipes 10 and third thermal grease connecting pipes 11 are connected to the first thermal grease connecting pipes 9 on both sides of the integrated heat sink 2 through the second circulation connecting pipe 12.

[0032] The integrated heat sink 2 is provided with a polyethylene spiral tube 15, which is used to connect the second thermally conductive silicone grease connecting tube 10 and the third thermally conductive silicone grease connecting tube 11. The polyethylene spiral tube 15 is in a straight state. The third thermally conductive silicone grease connecting tube 11 and the second thermally conductive silicone grease connecting tube 10 are respectively provided with a first one-way valve 16 and a second one-way valve.

[0033] An extrusion tube 17 is provided inside the integrated heat sink 2. The outer diameter of the extrusion tube 17 is the same as the inner diameter of the first liquid inlet pipe 6. The opening of the extrusion tube 17 faces the first liquid inlet pipe 6, and the other end of the extrusion tube 17 is sealed. Cooling water flows intermittently inside the integrated heat sink 2. The intermittently flowing cooling water impacts and drives the extrusion tube 17 to move back and forth. The extrusion tube 17 drives the thermal grease to circulate through the extrusion mechanism. The extrusion mechanism includes a return spring 18. The extrusion tube 17 is coaxially slidably inserted into the first liquid inlet pipe 6. The return spring 18 is provided inside the cooling heat sink 5, and its two ends are respectively connected to the inner wall of the cooling heat sink 5 and the extrusion tube 17.

[0034] Multiple mounting holes 14 are provided and are linearly opened on the outer wall of the push tube 17. A connecting cavity is provided in the mounting hole 14 and the connecting cavity is connected to the opening of the push tube 17. The polyethylene spiral tube 15 is inserted into the mounting hole 14. As the push tube 17 slides back and forth in the cooling heat dissipation box 5, it can push the polyethylene spiral tube 15 located in the mounting hole 14 to bend and deform.

[0035] Since the polyethylene spiral tube 15 is equipped with a first one-way valve 16 and a second one-way valve at both ends, the thermally conductive silicone grease inside the polyethylene spiral tube 15 can flow in one direction. Therefore, when the polyethylene spiral tube 15 is deformed by external force, the thermally conductive silicone grease inside will be squeezed out from the first one-way valve 16. When the polyethylene spiral tube 15 is not subjected to external force, the polyethylene spiral tube 15 will return to its original position. At the same time, a negative pressure will be generated inside the polyethylene spiral tube 15, and then the thermally conductive silicone grease will be drawn into the polyethylene spiral tube 15 from the second one-way valve.

[0036] As the extrusion tube 17 reciprocates, it carries the thermally conductive grease in the polyethylene spiral tube 15 in one direction. In conjunction with the second circulation connecting tube 12 connecting the polyethylene spiral tube 15 and the integrated heat sink 2, the thermally conductive grease in the integrated heat sink 2 can be allowed to flow. As the thermally conductive grease flows, the heat transferred to the thermally conductive grease will enter the polyethylene spiral tube 15 in the cooling heat sink 5. With the help of the flowing cooling water, the thermally conductive grease will be cooled down. After being cooled down, the thermally conductive grease will be squeezed back into the integrated heat sink 2.

[0037] The third part of the heat is directly radiated into the surrounding air through the metal shell of the integrated heat sink 2. That is, the heat is conducted through the thermal grease filled in the integrated heat sink 2, transferring heat from the integrated circuit coated chip body 1 to the thermal grease. Then, a portion of the heat is directly dissipated into the air through the integrated heat sink 2. Compared with traditional air cooling, this device has no fan noise and is not affected by dust accumulation. Compared with traditional continuous water flow cooling, the intermittent water flow of this device can generate a larger disturbance boundary layer, improving heat exchange efficiency by about 15-20%. Compared with simple heat pipe cooling, the thermal grease circulation of this device can cover the lower surface and sides of the chip, resulting in a larger heat dissipation area. Therefore, this device is particularly suitable for high power density, confined space, or noise-sensitive integrated circuit coated chip heat dissipation scenarios.

[0038] This portion of cooling water comes into contact with the polyethylene spiral tube 15 located inside the cooling heat dissipation box 5, and can also cool the thermally conductive silicone grease inside the polyethylene spiral tube 15. Compared with the traditional water cooling method, this method can change the direction of water flow and intermittent flow, so as to achieve dual cooling of the cooling water, that is, improve the cooling efficiency of the cooling water.

[0039] The operation method of this invention is as follows: S1: The integrated circuit coated chip body 1 generates heat during operation. This heat appears on the surface of the integrated circuit coated chip body 1. Then the heat is dissipated in two parts. Compared with the traditional single-channel heat dissipation method, dual-channel heat dissipation can better dissipate the heat of the integrated circuit coated chip body 1. S2: A portion of the heat in the integrated circuit coated chip body 1 will be transferred to the integrated circuit coated chip body 1 through the condenser tube 19. The heat will then be transferred to the condenser tube 19. Then, as the circulation pump is turned on, the cooling water is intermittently pumped into the cooling heat dissipation box 5 through the first liquid inlet pipe 6. S3: As the cooling water intermittently impacts the push tube 17, and then cooperates with the return spring 18, the push tube 17 slides back and forth in the cooling heat dissipation box 5. The cooling water that enters the connecting cavity of the push tube 17 from the opening will enter the second liquid inlet pipe 22 in the liquid inlet 20 through the rubber hose 21. Since the second liquid inlet pipe 22 and the second liquid outlet pipe 23 are both connected to the condenser pipe 19, the heat that is in contact with the surface of the integrated circuit coated chip body 1 and conducted to the condenser pipe 19 will be discharged from the second liquid outlet pipe 23 with the cooling water flowing in the condenser pipe 19 and reach the cooling heat dissipation box 5, thereby realizing the heat exchange operation. Cooling water carrying heat is discharged from the first outlet pipe 7 inside the cooling heat dissipation box 5, while multiple heat dissipation fins inserted on the first circulation connecting pipe 8 come into direct contact with the cooling water carrying heat, thereby dissipating heat and achieving the cooling effect of cooling water, and realizing the recycling of cooling water. S4: Another part of the heat will be conducted through the thermal grease filled in the integrated heat sink 2, so that the heat is transferred from the integrated circuit coated chip body 1 to the thermal grease. Then, part of the heat will be directly dissipated into the air through the integrated heat sink 2. As the push tube 17 slides back and forth within the cooling box 5, it can push the polyethylene spiral tube 15 located in the mounting hole 14 to bend and deform. Since the polyethylene spiral tube 15 is equipped with a first one-way valve 16 and a second one-way valve at both ends, the thermally conductive silicone grease inside the polyethylene spiral tube 15 can flow in one direction. Therefore, when the polyethylene spiral tube 15 is deformed by external force, the thermally conductive silicone grease inside will be squeezed out from the first one-way valve 16. When the polyethylene spiral tube 15 is no longer subjected to external force, it will return to its original position, and the thermally conductive silicone grease inside the polyethylene spiral tube 15 will... A negative pressure is generated, and then the thermal grease is drawn into the polyethylene spiral tube 15 from the second one-way valve. As the push tube 17 reciprocates, the thermal grease in the polyethylene spiral tube 15 can flow in one direction. In conjunction with the second circulation connecting tube 12 connecting the polyethylene spiral tube 15 and the integrated heat sink 2, the thermal grease in the integrated heat sink 2 can be flowed. As the thermal grease flows, the heat transferred to the thermal grease will enter the polyethylene spiral tube 15 in the cooling heat sink 5. With the flow of cooling water, the thermal grease is cooled down. After cooling, the thermal grease is squeezed back into the integrated heat sink 2. Then this part of the cooling water comes into contact with the polyethylene spiral tube 15 located in the cooling heat dissipation box 5, and at the same time, it can also cool the thermal grease inside the polyethylene spiral tube 15. Compared with the traditional water cooling method, this method can change the water flow direction and intermittent flow, realize the dual cooling of the cooling water, that is, improve the cooling efficiency of the cooling water.

[0040] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A heat dissipation device for an integrated circuit coated chip, comprising an integrated circuit coated chip body (1) and an integrated heat sink (2), wherein the integrated circuit coated chip body (1) is disposed within the integrated heat sink (2), and a circulation pump is provided on one side of the integrated heat sink (2), characterized in that, The integrated heat sink (2) is filled with thermal grease, which covers the integrated circuit coated chip body (1). A cooling heat sink (5) is provided on the integrated heat sink (2), and the cooling heat sink (5) is connected to the integrated heat sink (2). The integrated heat sink (2) is provided with a push tube (17). Cooling water flows intermittently in the integrated heat sink (2). The intermittently flowing cooling water impacts and drives the push tube (17) to move back and forth. The push tube (17) drives the thermal grease to circulate through the liquid pushing mechanism. The integrated heat sink (2) is also provided with a condenser tube (19) that extends into the integrated heat sink (2) and is in contact with the surface of the integrated circuit coated chip body (1).

2. The heat dissipation device for an integrated circuit coated chip according to claim 1, characterized in that, The four corners of the integrated heat sink box (2) are fixedly fitted with connecting rods (4), and one end of the connecting rod (4) is fixed with a mounting bracket (3) that supports the integrated circuit coated chip body (1). The mounting bracket (3) and the connecting rod (4) are both made of thermally conductive metal.

3. The heat dissipation device for an integrated circuit coated chip according to claim 2, characterized in that, Multiple first thermal grease connecting pipes (9) are symmetrically arranged on both sides of the integrated heat sink (2). Second thermal grease connecting pipes (10) and third thermal grease connecting pipes (11) are symmetrically arranged on both sides of the cooling heat sink (5). The second thermal grease connecting pipes (10) and the third thermal grease connecting pipes (11) are connected to the first thermal grease connecting pipes (9) on both sides of the integrated heat sink (2) through the second circulation connecting pipe (12).

4. The integrated circuit coated chip heat dissipation device according to claim 3, characterized in that, The integrated heat sink box (2) is provided with a polyethylene spiral tube (15), and the polyethylene spiral tube (15) is used to connect the second thermally conductive silicone grease connecting tube (10) and the third thermally conductive silicone grease connecting tube (11). The polyethylene spiral tube (15) is in a straight state. The third thermally conductive silicone grease connecting tube (11) and the second thermally conductive silicone grease connecting tube (10) are respectively provided with a first one-way valve (16) and a second one-way valve.

5. The integrated circuit coated chip heat dissipation device according to claim 4, characterized in that, The cooling heat dissipation box (5) is provided with a first liquid inlet pipe (6) and a first liquid outlet pipe (7) at both ends. The circulation pump is connected to the first liquid inlet pipe (6) and the first liquid outlet pipe (7) through the first circulation connecting pipe (8). Multiple heat dissipation fins are inserted on the first circulation connecting pipe (8). The circulation pump drives the cooling water to flow from the first liquid inlet pipe (6) to the first liquid outlet pipe (7).

6. The heat dissipation device for an integrated circuit coated chip according to claim 5, characterized in that, The outer diameter of the push tube (17) is the same as the inner diameter of the first liquid inlet tube (6). The opening of the push tube (17) faces the first liquid inlet tube (6), and the other end of the push tube (17) is sealed.

7. The heat dissipation device for an integrated circuit coated chip according to claim 6, characterized in that, The liquid pushing mechanism includes: The reset spring (18) and the push tube (17) are coaxially slidably inserted on the first liquid inlet tube (6). The reset spring (18) is set inside the cooling heat dissipation box (5), and the two ends of the reset spring (18) are respectively connected to the inner wall of the cooling heat dissipation box (5) and the push tube (17). The mounting holes (14) are provided in multiple ways and are linearly opened on the outer wall of the push tube (17). A connecting cavity is opened in the mounting hole (14) and the connecting cavity is connected to the opening of the push tube (17). The polyethylene spiral tube (15) is inserted into the mounting hole (14).

8. The heat dissipation device for an integrated circuit coated chip according to claim 7, characterized in that, The bottom of the cooling heat dissipation box (5) is provided with a connection hole structure. The connection hole structure is arranged in multiple ways and is linearly arranged on the bottom of the cooling heat dissipation box (5). The connection hole structure includes: The outlet (13) and inlet (20) are symmetrically located at the bottom of the cooling box (5). The connecting cavity inside the push tube (17) is connected to the inlet (20) through the rubber hose (21).

9. The heat dissipation device for an integrated circuit coated chip according to claim 8, characterized in that, A second liquid inlet pipe (22) and a second liquid outlet pipe (23) are symmetrically arranged on the condenser pipe (19). The second liquid inlet pipe (22) and the second liquid outlet pipe (23) are both connected to the condenser pipe (19), and the second liquid inlet pipe (22) and the second liquid outlet pipe (23) are respectively installed in the liquid inlet (20) and the liquid outlet (13).

10. A method of using an integrated circuit coated chip heat dissipation device, applied to the integrated circuit coated chip heat dissipation device of claim 9, characterized in that, The specific operating method is as follows: S1: The integrated circuit coated chip body (1) generates heat during operation. This heat appears on the surface of the integrated circuit coated chip body (1), and then the heat is dissipated in two parts. S2: A portion of the heat located on the integrated circuit coated chip body (1) will be transferred to the integrated circuit coated chip body (1) through the condenser tube (19). The heat will be transferred to the condenser tube (19), and then the cooling water will be intermittently pumped into the cooling heat dissipation box (5) through the first liquid inlet pipe (6) as the circulation pump is turned on. S3: The cooling water entering the connecting cavity of the push tube (17) from the opening will enter the second liquid inlet pipe (22) inside the liquid inlet (20) through the rubber hose (21). The heat that comes into contact with the surface of the integrated circuit coated chip body (1) and is conducted to the condenser tube (19) will be discharged from the second liquid outlet pipe (23) and reach the cooling heat dissipation box (5) along with the cooling water flowing in the condenser tube (19). S4: Another part of the heat will be conducted through the thermal grease filled in the integrated heat sink (2), so that the heat is transferred from the integrated circuit coated chip body (1) to the thermal grease. As a result, the thermal grease in the polyethylene spiral tube (15) can flow unidirectionally with the reciprocating motion of the push tube (17), and the thermal grease is cooled down with the flow of cooling water. After cooling, the thermal grease is squeezed back into the integrated heat sink (2).

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