Package substrate manufacturing method and package substrate

Abstract

This application provides a method for manufacturing a packaging substrate, including cooling and dehumidifying the interior of a laminating equipment to achieve target temperature and humidity; pre-applying a solder resist dry film onto the packaging substrate inside the laminating equipment; and hot-pressing and leveling the solder resist dry film to adhere it to the packaging substrate. This manufacturing method allows for precise control of the pre-lamination environment of the packaging substrate within the required range, suppressing adverse factors caused by the environment during pre-lamination from the source and inhibiting undesirable material flow, achieving high-quality pre-lamination. It is applicable to the production of different types of packaging substrates, has universality, and improves the production yield of packaging substrates.

Description

Technical Field

[0001] This application relates to the field of packaging substrate technology, and in particular to a packaging substrate manufacturing method and a packaging substrate. Background Technology

[0002] During the manufacturing process of packaging substrates, the solder resist layer is typically fabricated using a vacuum laminator to attach the dry solder resist film to the substrate surface. Before this step, the dry film is usually pre-attached to the substrate surface and positioned; this process is called pre-attachment. In actual production, wrinkles easily appear on the edges or surface of the pre-attached dry film. These wrinkles directly lead to substrate scrap, becoming one of the main factors affecting production yield.

[0003] Traditional methods for improving film wrinkles mostly focus on optimizing the material formulation of the dry film itself or adjusting the parameters of the vacuum laminator, which is difficult to fundamentally suppress the formation of film wrinkles. Summary of the Invention

[0004] This application provides a method for manufacturing a packaging substrate and a packaging substrate, which can effectively suppress the phenomenon of film wrinkles during the manufacturing process of the packaging substrate and improve the production yield of the packaging substrate.

[0005] This application provides a method for manufacturing a packaging substrate, including: The interior of the film application equipment is cooled and dehumidified to achieve the target temperature and humidity. Inside the film-applying equipment, the solder resist dry film is pre-applied onto the packaging substrate; The solder resist dry film is hot-pressed and leveled to attach it to the packaging substrate.

[0006] In some embodiments, prior to cooling and dehumidifying the interior of the film application device, the method further includes: Determine the type of solder resist dry film to be applied, as different types of solder resist dry film have different rigidity and softening temperatures; The target temperature and target humidity are determined based on the type of solder resist dry film.

[0007] In some embodiments, the solder resist dry film includes a first type, a second type, and a third type, wherein the rigidity of the first type, the rigidity of the second type, and the rigidity of the third type decrease sequentially, and the softening temperature of the first type, the softening temperature of the second type, and the softening temperature of the third type decrease sequentially. The target temperature corresponding to the first model, the target temperature corresponding to the second model, and the target temperature corresponding to the third model decrease in sequence, as do the target humidity corresponding to the first model, the target humidity corresponding to the second model, and the target humidity corresponding to the third model.

[0008] In some embodiments, before determining the target temperature and the target humidity based on the type of the solder resist dry film, the method further includes: Determine the thickness of the solder mask to be applied; The step of determining the target temperature and the target humidity based on the type of the solder resist dry film includes: determining the target temperature based on the type and thickness of the solder resist dry film, and determining the target humidity based on the type of the solder resist dry film.

[0009] In some embodiments, determining the target temperature based on the type and thickness of the solder resist dry film includes: When the thickness of the solder resist dry film is less than or equal to the first thickness, the first preset temperature is reduced based on the target temperature determined according to the type of the solder resist dry film. When the thickness of the solder resist dry film is greater than or equal to the second thickness, the second preset temperature is increased based on the target temperature determined according to the type of the solder resist dry film. When the thickness of the solder resist dry film is between the first thickness and the second thickness, the target temperature is determined according to the type of the solder resist dry film; Wherein, the first thickness is less than the second thickness.

[0010] In some embodiments, when determining the target temperature based on the type and thickness of the solder resist dry film, if the size of the solder resist dry film is larger than a preset size, a third preset temperature is reduced based on the target temperature determined based on the type and thickness of the solder resist dry film.

[0011] In some embodiments, before pre-applying the solder resist dry film to the packaging substrate inside the film-applying equipment, the method further includes: The film application device is kept at the target temperature and target humidity for a preset time.

[0012] In some embodiments, if the size of the solder resist dry film is a first size, then the preset duration is a first duration; If the size of the solder resist dry film is the second size, then the preset duration is the second duration; Wherein, the second size is larger than the first size, and the second duration is greater than the first duration.

[0013] In some embodiments, before pre-applying the solder resist dry film to the packaging substrate inside the film-applying equipment, the method further includes: The static electricity inside the film application device is eliminated by an electrostatic eliminator, so that the static voltage inside the film application device is maintained within a preset static voltage range.

[0014] This application also provides a packaging substrate, which is prepared by the packaging substrate manufacturing method described in any of the above embodiments.

[0015] In the packaging substrate manufacturing method provided in this application embodiment, the interior of the laminating equipment is first cooled and dehumidified to reach the target temperature and humidity. Then, the solder resist dry film is pre-attached onto the packaging substrate inside the laminating equipment. Subsequently, the solder resist dry film is hot-pressed and flattened to adhere it to the packaging substrate. This manufacturing method allows for precise control of the pre-attachment environment of the packaging substrate within the required range, suppressing adverse factors caused by the environment during pre-attachment from the source and inhibiting poor material flow, achieving high-quality pre-attachment. It is applicable to the production of different types of packaging substrates, has universality, and improves the production yield of packaging substrates. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic flowchart of a packaging substrate manufacturing method according to an embodiment of this application.

[0018] Figure 2 This is a schematic diagram illustrating the environmental preparation for an embodiment of this application.

[0019] Figure 3 This is a schematic diagram illustrating the differences between different types of solder resist dry films according to embodiments of this application.

[0020] Figure 4 This is a schematic diagram illustrating the differences between solder resist dry films of different thicknesses in embodiments of this application.

[0021] Figure 5 This is a schematic diagram illustrating the differences between solder resist dry films of different substrate sizes in embodiments of this application.

[0022] Figure 6 This is a diagram showing the state of the solder resist dry film after pre-application according to an embodiment of this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0024] This application provides a method for manufacturing a packaging substrate, which improves the production yield of the packaging substrate by precisely controlling the pre-lamination environment during the packaging substrate manufacturing process. In practical applications, precise control of the pre-lamination environment can suppress adverse factors caused by the environment during pre-lamination from the source, achieving high-quality pre-lamination. (Reference) Figure 1 , Figure 1 This is a schematic flowchart of a packaging substrate manufacturing method according to an embodiment of this application. The manufacturing method includes the following steps: 110. Cool and dehumidify the inside of the film application equipment to bring the inside of the equipment to the target temperature and humidity. 120. Inside the film application equipment, the solder resist dry film is pre-applied onto the packaging substrate; 130. The solder resist dry film is hot-pressed and leveled to attach the solder resist dry film to the packaging substrate.

[0025] First, in step 110, the interior of the film-applying equipment (pre-applying machine) is cooled and dehumidified. In practical applications, a cooling and dehumidification device (such as a water-cooled box-type chiller unit) can be connected to the existing pre-applying machine. Figure 2 As shown, Figure 2 This is a schematic diagram illustrating the environmental preparation for an embodiment of this application. A water-cooled box-type chiller unit is connected to a constant-temperature water tank, dehumidifying and filtering the air before it is transported to the pre-applied machine via pipelines. The water tank stores cooling water, and its outlet is connected to the inlet of a cooling pump and a standby pump via pipelines. These pipelines transport dry air and cool air to form a cooling circulation loop.

[0026] In addition, the water tank is equipped with a tap water supply pipe, which can be connected to an external water source to replenish the cooling medium in the tank. The water tank, cooling pump, standby pump, and water-cooled box-type chiller unit together form a constant temperature control loop, which can keep the internal working area within the target temperature and humidity range.

[0027] Because different types of solder resist dry films have different rigidity and softening temperatures, the corresponding target temperature and target humidity ranges will also be different. Therefore, in some embodiments, before performing step 110, the type of solder resist dry film to be applied can be determined first, and then the target temperature and target humidity can be determined based on the type of solder resist dry film.

[0028] In some embodiments, it is understood that the type of solder resist dry film is determined by its characteristics, which in turn can be determined by its rigidity and softening temperature. The rigidity and softening temperature of the solder resist dry film are two core physical properties. Rigidity refers to the film's ability to resist deformation, while softening temperature refers to the limiting temperature at which the film softens and deforms at high temperatures. In practical applications, the type of solder resist dry film can be determined through information such as material parameters.

[0029] In practical applications, the glass transition initiation point of most solder resist dry film materials is approximately 2-3°C above or below 18°C. Within this temperature range, the dry film is in the critical glassy state, where molecular chain segments are frozen but side groups can vibrate locally. Macroscopically, this results in moderate rigidity, sharp edges, and good adhesion. This avoids both poor adhesion caused by excessive hardness at low temperatures and film wrinkles caused by premature adsorption due to excessively high adhesion at high temperatures.

[0030] When the humidity is between 30% and 50%, it falls at the inflection point of the water molecule adsorption isotherm, where the water molecules at the interface exhibit sub-monolayer adsorption and have not yet formed a continuous water film. This eliminates the risk of water vaporization and bubbling during high-temperature film pressing while retaining a certain degree of adsorption. Simultaneously, the surface resistivity is moderate, and static electricity is controllable. When the humidity is below 30%, the risk of static electricity increases, and above 50%, the risk of water vapor increases.

[0031] Therefore, when selecting target temperature and target humidity, you can first set the target temperature range to 18℃ and then make corresponding adjustments according to the specific situation; set the target humidity range to 30% to 50% first and then make corresponding adjustments according to the specific situation.

[0032] In some embodiments, such as Figure 3 As shown, Figure 3 This is a schematic diagram illustrating the differences between different models of solder resist dry films according to embodiments of this application. The models of the solder resist dry films include a first model, a second model, and a third model. The first model may be, for example, SR1; the second model may be, for example, SRFA; and the third model may be, for example, SRFK.

[0033] The first type, SR1, has high rigidity and a high softening temperature, making it the most suitable for temperatures ranging from 18±1℃ to 30%-50% humidity. The second type, SRFA, has moderate rigidity and a moderate softening temperature, making it suitable for temperatures ranging from 16±1℃ to 30%-45% humidity. The third type, SRFK, has good flexibility and a low softening temperature, making it the most suitable for temperatures ranging from 15±1℃ to 30%-40% humidity.

[0034] In practical applications, when the packaging substrate needs to operate stably in extremely harsh environments, or when the manufacturing process itself requires high temperatures, the first-type solder mask dry film (such as SR1) can be selected. The first-type solder mask dry film (such as SR1) exhibits higher rigidity and requires higher heat energy input to change its physical form, meaning a correspondingly higher softening temperature and a higher target temperature setting. Understandably, to avoid problems such as static electricity caused by excessively high and dry manufacturing environments, the target temperature is usually proportional to the target humidity; that is, a higher target temperature generally corresponds to a higher target humidity.

[0035] Conversely, in practical applications, when the packaging substrate needs to withstand bending, a third-type dry solder mask (such as SRFA) can be selected. Third-type dry solder mask (such as SRFK) exhibits lower rigidity, is easier to change its physical form, and softens with lower thermal input, meaning a correspondingly lower softening temperature and a lower required target temperature. Similarly, a lower target temperature also necessitates a lower target humidity.

[0036] The second type (such as SRFA) is designed as a transitional state between the first type (such as SR1) and the third type (such as SRFK). Its rigidity and softening temperature are also between the first and third types, and the target temperature and target humidity are also between the first and third types.

[0037] Therefore, the relevant material parameters for the first model (such as rigidity, softening temperature, target temperature, and target humidity), the second model (such as rigidity, softening temperature, target temperature, and target humidity), and the third model (such as rigidity, softening temperature, target temperature, and target humidity) all decrease sequentially. In actual production, this can address different situations in different production environments or practical applications.

[0038] In some embodiments, due to differences in the required thickness of the solder mask layer in practical applications, the thickness of the solder mask dry film also varies. Common thickness specifications include 15um, 20um, 25um, 30um, etc.

[0039] Because solder resist dry films of different thicknesses have different heat capacities, material properties, and applicable temperatures, it is necessary to determine the thickness of the solder resist dry film before determining the target temperature and target humidity based on the film's model.

[0040] Therefore, before performing step 110, the following sub-steps 111-112 are also included: 111. Determine the thickness of the solder mask to be applied; In some embodiments, the rate of heat transfer varies depending on the thickness of the solder resist dry film. For example, a thicker solder resist dry film has a larger heat capacity. If the target temperature of a thinner solder resist dry film is used, uneven heating will occur, leading to pre-attachment failure. Therefore, it is essential to determine the thickness of the solder resist dry film to be attached before pre-attachment.

[0041] 112. Determine the target temperature and target humidity based on the type and thickness of the solder resist dry film. For example... Figure 4 As shown, Figure 4 This is a schematic diagram illustrating the differences between solder resist dry films of different thicknesses in embodiments of this application.

[0042] Since the heat capacity of solder resist dry film is determined by its volume, it is easy to conclude that the thickness of the solder resist dry film is directly proportional to its heat capacity. That is, when the solder resist dry film thickness is a first thickness (e.g., thickness ≤ 15µm), the heat capacity is relatively small; when the solder resist dry film thickness is a second thickness (e.g., thickness ≥ 25µm), the heat capacity is relatively large; and when the solder resist dry film thickness is between the first and second thicknesses (e.g., thickness between 15-25µm), the heat capacity is moderate. Here, the first thickness is less than the second thickness; for example, the first thickness can be 15µm and the second thickness can be 25µm.

[0043] Because the material properties of solder resist dry film are closely related to its thickness, the material properties (i.e., rigidity) of the solder resist dry film also differ when the thickness changes. Similarly, when the solder resist dry film thickness is at the first thickness, the material is relatively soft; when the solder resist dry film thickness is at the second thickness, the material is relatively hard. When the solder resist dry film thickness is between the first and second thicknesses, the material is of medium rigidity.

[0044] Since different types of solder mask film have different applicable temperatures, and the applicable temperature of solder mask film can vary slightly depending on the thickness of the solder mask film, the applicable temperature of solder mask film cannot be determined solely by the type of solder mask film, but also by a comprehensive judgment based on the thickness of the solder mask film.

[0045] In practical applications, when the thickness of the solder resist dry film is less than or equal to the first thickness, the heat capacity of the solder resist dry film is relatively small, which macroscopically manifests as a decrease in the target temperature of the solder resist dry film. In this case, the temperature can be lowered based on the target temperature determined by the solder resist dry film model to ensure the smooth progress of the pre-attachment process. This lowered temperature is called the first preset temperature. The first preset temperature is typically set to 0.5-1℃ and can be adjusted according to the actual application.

[0046] When the thickness of the solder resist dry film is greater than or equal to the second thickness, the heat capacity of the solder resist dry film is relatively large, which macroscopically manifests as an increase in the target temperature of the solder resist dry film. At this time, the temperature can be increased based on the target temperature determined according to the type of solder resist dry film to ensure the smooth progress of the pre-attachment process. The increased temperature is called the second preset temperature. The second preset temperature is usually set to 0.5-1℃ and can be adjusted according to the actual application.

[0047] For example, in practical applications, when the solder resist dry film thickness is the first thickness, the first preset temperature can be reduced from the original applicable temperature (e.g., by 0.5-1℃); when the solder resist dry film thickness is the second thickness, the second preset temperature needs to be increased from the original applicable temperature (e.g., by 0.5-1℃); when the thickness of the solder resist dry film is between the first thickness and the second thickness, the target temperature can be determined according to the type of solder resist dry film, and no adjustment is required.

[0048] In some embodiments, maintaining a suitable temperature (target temperature) and humidity (target humidity) is fundamental to ensuring pre-attachment quality. Failure to maintain the target temperature and humidity, such as fluctuating temperatures or substandard ambient humidity, may lead to pre-attachment failure. Therefore, before pre-attaching the solder resist dry film onto the packaging substrate inside the film-attachment equipment, it is necessary to maintain the target temperature and humidity inside the equipment for a preset time, which is called the stabilization time.

[0049] To precisely control the physical state and chemical reactions of the solder resist dry film and achieve a tight bond, bubble-free performance, and excellent quality, a stabilization time of at least 10 minutes is typically required in practical applications. For example, a stabilization time of 10 minutes can be selected. When the solder resist dry film thickness reaches a second thickness, it is understandable that the stabilization time needs to be extended accordingly due to the increased volume; it can be extended to 15 minutes. Furthermore, since the thickness of the solder resist dry film is independent of the applicable humidity, the applicable humidity of the solder resist dry film always depends on its specific model, regardless of its thickness.

[0050] In some embodiments, the packaging substrate may have different sizes. Different packaging substrate sizes place different requirements on the size of the solder mask. For example... Figure 5 As shown, Figure 5 This diagram illustrates the differences between solder resist dry films of different substrate sizes in embodiments of this application. The dimensions of the packaging substrate may include a first size and a second size, where the second size is larger than the first size. This application uses a packaging substrate size of 515*510mm as the first size and 623*523mm as the second size as an example for illustration.

[0051] In practical applications, the size of the solder mask required for packaging substrate manufacturing varies depending on the substrate size. This affects parameters such as heat capacity, heat dissipation rate, applicable temperature, and stabilization time during the pre-application process. Therefore, when determining the target temperature based on the type and thickness of the solder mask, its size must also be considered for a comprehensive assessment.

[0052] Understandably, as the size of the solder resist film increases, its volume and other parameters also increase accordingly, leading to a corresponding increase in heat capacity. Since objects with high heat capacity experience slow temperature changes, their heat dissipation rate decreases. Therefore, when the size of the solder resist film exceeds the preset size, the temperature needs to be lowered based on the target temperature determined by the film's type and thickness to ensure smooth pre-application. This lowered temperature is called the third preset temperature. The third preset temperature is typically set between 0.5-1℃ and can be adjusted according to the specific application.

[0053] Similarly, as the size of the solder resist dry film increases, its volume and other parameters also increase accordingly, leading to a corresponding increase in heat capacity. Since objects with high heat capacity experience slow temperature changes, their heat dissipation rate decreases. Therefore, the stabilization time needs to be increased accordingly with larger dimensions to ensure sufficient time for the solder resist dry film to reach the target temperature and humidity.

[0054] For example, when the substrate size is the first size (515*510mm), the substrate size is small, resulting in a small heat capacity and a fast heat dissipation rate. The applicable temperature does not need to be changed from the originally determined applicable temperature, and the preset duration is selected as the first duration. When the substrate size is the second size (623*523mm), the heat capacity is large, resulting in a slow heat dissipation rate. In this case, the applicable temperature can be lowered by a third preset temperature (e.g., 0.5-1℃), and the preset duration can be selected as the second duration. The second duration is longer than the first duration; for example, the second duration could be 15 minutes, and the first duration could be 10 minutes.

[0055] In practical applications, the surface cleanliness and flatness of the encapsulation substrate determine the adhesion of the dry film. Therefore, after performing environmental preparation (completing step 110) and before proceeding to step 120, the encapsulation substrate to be processed can be cleaned before pre-attaching. Because the encapsulation substrate is highly susceptible to static charge generation and accumulation due to friction during manufacturing, this static charge can lead to high static voltage within the laminating equipment and on the surface of the encapsulation substrate. If the film is applied directly, static electricity will attract airborne dust particles to the substrate or dry film surface, causing bubbles or wrinkles after application. In some embodiments, a static voltage elimination device can be installed inside the pre-attach machine to prevent static electricity from attracting dust particles, eliminate tiny fibers and particles attracted by static electricity, and keep the encapsulation substrate clean. In practical applications, a static voltage elimination device, such as an ion bar or static eliminator, can be installed inside the pre-attach machine to control the static voltage within ±500V. This step can significantly reduce the probability of dust contamination caused by static electricity, improving the flatness and adhesion between the solder resist dry film and the surface of the encapsulation substrate.

[0056] Subsequently, in step 120, the solder resist dry film is pre-applied to the packaging substrate inside the film application equipment. After cleaning the packaging substrate to be processed, it is placed on the worktable of the pre-applied machine and positioned and fixed.

[0057] Subsequently, in step 130, the solder resist dry film is hot-pressed and leveled to adhere it to the packaging substrate. Under the environmental conditions of suitable temperature and humidity set in step 110, the solder resist dry film is pulled out and covers the surface of the substrate.

[0058] After application, the dry film adheres to the substrate solely by gravity and weak electrostatic attraction, and its position is unstable. At this point, a pre-fixing head (usually a row of heated, narrow strips or a movable hot-pressing point) can be activated. The head temperature can be preset according to the dry film characteristics (generally between 70℃ and 90℃). It's important to note that this temperature only allows the dry film adhesive layer to slightly soften and form temporary bonding anchors with the copper surface, not complete curing. Subsequently, the dry film position is pre-fixed using the head. The state of the solder mask dry film after pre-application is as follows. Figure 6 As shown, Figure 6 This is a diagram showing the state of the solder resist dry film after pre-application according to an embodiment of this application. The dry film is fully attached to the substrate.

[0059] After the pre-fixing of the heating head is completed, the heating head is raised. At this point, the dry film has formed a preliminary adhesion state with the substrate. The pre-attached dry film is then transferred to the vacuum laminator for final lamination under high temperature and high pressure according to standard process parameters.

[0060] The packaging substrate manufacturing method provided in this application first cools and dehumidifies the interior of the lamination equipment to achieve the target temperature and humidity. Then, solder resist dry film is pre-attached onto the packaging substrate inside the lamination equipment. Subsequently, the solder resist dry film is hot-pressed and flattened to adhere it to the packaging substrate. This manufacturing method precisely controls the pre-attachment environment of the packaging substrate within the required range, suppressing adverse factors caused by the environment during pre-attachment from the source and inhibiting poor material flow, achieving high-quality pre-attachment. It is applicable to the production of different types of packaging substrates, has universality, and improves the production yield of packaging substrates.

[0061] This application also provides a packaging substrate, which is prepared by the packaging substrate manufacturing method described in any of the above embodiments.

[0062] In the description of this application, it should be understood that terms such as “first” and “second” are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0063] The foregoing has provided a detailed description of a method for manufacturing a packaging substrate and the packaging substrate according to embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there may be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for manufacturing a packaging substrate, characterized in that, include: The interior of the film application equipment is cooled and dehumidified to achieve the target temperature and humidity. Inside the film-applying equipment, the solder resist dry film is pre-applied onto the packaging substrate; The solder resist dry film is hot-pressed and leveled to attach it to the packaging substrate.

2. The method for manufacturing a packaging substrate according to claim 1, characterized in that, Before cooling and dehumidifying the interior of the film application equipment, the following steps are also included: Determine the type of solder resist dry film to be applied, as different types of solder resist dry film have different rigidity and softening temperatures; The target temperature and target humidity are determined based on the type of solder resist dry film.

3. The method for manufacturing a packaging substrate according to claim 2, characterized in that, The solder resist dry film includes three models: a first model, a second model, and a third model. The rigidity of the first model, the second model, and the third model decreases sequentially. The softening temperature of the first model, the second model, and the third model also decreases sequentially. The target temperature corresponding to the first model, the target temperature corresponding to the second model, and the target temperature corresponding to the third model decrease in sequence, as do the target humidity corresponding to the first model, the target humidity corresponding to the second model, and the target humidity corresponding to the third model.

4. The method for manufacturing a packaging substrate according to claim 3, characterized in that, Before determining the target temperature and target humidity based on the type of the solder resist dry film, the method further includes: Determine the thickness of the solder mask to be applied; The step of determining the target temperature and the target humidity based on the type of the solder resist dry film includes: determining the target temperature based on the type and thickness of the solder resist dry film, and determining the target humidity based on the type of the solder resist dry film.

5. The method for manufacturing a packaging substrate according to claim 4, characterized in that, Determining the target temperature based on the type and thickness of the solder resist dry film includes: When the thickness of the solder resist dry film is less than or equal to the first thickness, the first preset temperature is reduced based on the target temperature determined according to the type of the solder resist dry film. When the thickness of the solder resist dry film is greater than or equal to the second thickness, the second preset temperature is increased based on the target temperature determined according to the type of the solder resist dry film. When the thickness of the solder resist dry film is between the first thickness and the second thickness, the target temperature is determined according to the type of the solder resist dry film; Wherein, the first thickness is less than the second thickness.

6. The method for manufacturing a packaging substrate according to claim 5, characterized in that, When determining the target temperature based on the type and thickness of the solder resist dry film, if the size of the solder resist dry film is larger than a preset size, then the target temperature determined based on the type and thickness of the solder resist dry film is reduced by a third preset temperature.

7. The method for manufacturing a packaging substrate according to any one of claims 1 to 6, characterized in that, Before pre-applying the solder resist dry film to the packaging substrate inside the film-applying equipment, the method further includes: The film application device is kept at the target temperature and target humidity for a preset time.

8. The method for manufacturing a packaging substrate according to claim 7, characterized in that: If the size of the solder resist dry film is a first size, then the preset duration is a first duration; If the size of the solder resist dry film is the second size, then the preset duration is the second duration; Wherein, the second size is larger than the first size, and the second duration is greater than the first duration.

9. The method for manufacturing a packaging substrate according to any one of claims 1 to 6, characterized in that, Before pre-applying the solder resist dry film to the packaging substrate inside the film-applying equipment, the method further includes: The static electricity inside the film application device is eliminated by an electrostatic eliminator, so that the static voltage inside the film application device is maintained within a preset static voltage range.

10. A packaging substrate, characterized in that, The packaging substrate is prepared by the packaging substrate manufacturing method according to any one of claims 1 to 9.

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