Optical connection member, optical connection structure, glass substrate, and method for manufacturing optical connection member and glass substrate

Abstract

The present invention provides an optical connection component that can improve productivity. The optical connection component (1) of the present invention is disposed between a first optical waveguide (5) and a second optical waveguide (6), a light-emitting element or a light-receiving element, and optically connects the first optical waveguide (5) and the second optical waveguide (6), the light-emitting element or the light-receiving element. The optical connection component has: a substrate component (2) having a first surface (2a) and a second surface (2b) opposite to the first surface (2a), and having at least one through hole (2c) extending from the first surface (2a) to the second surface (2b); and a reflective structure disposed in the through hole (2c) for reflecting light.

Description

Technical Field

[0001] The present invention relates to an optical connector, an optical connector structure using the optical connector, a glass substrate used in the optical connector, and a method for manufacturing the optical connector and the glass substrate. Background Technology

[0002] In recent years, in order to meet the demands of high-speed transmission and high capacity in optical communication, research and development have been carried out on small and high-capacity optical transceivers utilizing silicon photonics (SiPh) optical loops. There are various methods for optical coupling of SiPh with optical fiber, but the search continues to seek methods that are as simple as possible and have high reliability.

[0003] Patent Document 1 discloses an example of an optical connection structure that uses a resin core to optically connect two optical waveguides. In this optical connection structure, a resin core, a cladding, and a spacer are disposed between the two optical waveguides. More specifically, the resin core abuts against the core of one optical waveguide and the core of the other optical waveguide, respectively. The resin core is surrounded by the cladding. A spacer is disposed around a portion of the cladding.

[0004] In manufacturing the optical connection structure of Patent Document 1, after the end faces of the two optical waveguides abut against the spacer, a photocurable resin is placed between the two optical waveguides. Next, light is irradiated onto the photocurable resin from each optical waveguide, thereby curing the resin. This forms a resin core. Then, after removing the uncured photocurable resin, a cladding resin material is placed between the end faces of the two optical waveguides and cured. This forms a cladding layer.

[0005] Existing technical documents Patent documents Patent Document 1: International Publication No. 2021 / 033217 Summary of the Invention

[0006] The technical problem that the invention aims to solve However, the optical connection structure in Patent Document 1 requires the configuration of spacers, the formation of resin cores, and the formation of cladding for each optical waveguide to be connected. Therefore, it is difficult to significantly improve productivity.

[0007] The purpose of this invention is to provide an optical connection component, an optical connection structure, and a method for manufacturing the optical connection component that can improve productivity.

[0008] Technical means for solving technical problems The following describes various methods for manufacturing optical connectors, optical connector structures, glass substrates, and optical connectors and glass substrates to solve the above-mentioned technical problems.

[0009] The optical connection component according to Embodiment 1 of the present invention is disposed between a first optical waveguide and a second optical waveguide, a light-emitting element or a light-receiving element, and optically connects the first optical waveguide and the second optical waveguide, the light-emitting element or the light-receiving element. The optical connection component has: a substrate component having a first surface and a second surface opposite to the first surface, and having at least one through hole extending from the first surface to the second surface; and a reflective structure disposed in the through hole for reflecting light.

[0010] In the optical connector of Method 2, it is preferable to use an inorganic material, which is also the material used for the substrate component in Method 1. This improves the weather resistance of the optical connector. Therefore, even when used in high-temperature and high-humidity environments, the optical connector is less prone to deterioration. Consequently, the long-term reliability of the optical connector is improved.

[0011] In the optical connection component of Method 3, it is preferable that the inorganic material mentioned in Method 2 is either glass or silicon. This reduces the coefficient of thermal expansion of the substrate component. Therefore, even with temperature changes, the positional misalignment between the first and second optical waveguides, and between the light-emitting and light-receiving elements, can be effectively reduced. This reduces the impact on the optical connection. Consequently, the reliability of the optical connection component can be improved.

[0012] In the optical connector of method 4, it is preferable that the inorganic material in method 3 is glass, and the reflective structure has a transparent material with a higher refractive index than the substrate component. In this case, since the inorganic material is glass, the inorganic component made of glass is processed when the substrate component is obtained. Furthermore, the chemical resistance of the inorganic component can be adjusted by changing the composition of the glass. Therefore, when forming through-holes in the substrate component by etching the inorganic component, adjusting the etching rate becomes easier. As a result, the processing of the inorganic material becomes easier. In addition, by having a transparent material with a higher refractive index than the substrate component in the reflective structure, light loss in the optical connector can be effectively reduced.

[0013] In the optical connector of method 5, it is preferable that the transparent material mentioned in method 4 is a photocurable resin or a thermocurable resin. In this case, a reflective structure can be easily provided, and the optical connector can be easily obtained.

[0014] In the optical connection component of method 6, it is preferable that the inner wall of at least one of the through holes in the substrate component of any of methods 1 to 5 is inclined relative to the normal direction of the first surface. In this case, the diameter of the emitted light spot can be reduced. As a result, when the first optical waveguide is optically connected to the light-receiving element, light can be more reliably transmitted into the light-receiving element.

[0015] In the optical connection component of method 7, it is preferable that the above-mentioned reflective structure has a reflective film in any of methods 1 to 6. In this case, light loss in the optical connection component can be reduced more effectively.

[0016] In the optical connection component of mode 8, a plurality of the aforementioned through holes may be provided in any of modes 1 to 7. In at least one of the aforementioned first surface and the aforementioned second surface, at least a portion of the openings of the plurality of the aforementioned through holes are arranged in a straight line.

[0017] In the optical connection component of method 9, it is preferable that the coefficient of thermal expansion of the substrate component in any of methods 1 to 8 is 30 × 10⁻⁶. －7 / ℃Above 70×10 －7 Below / ℃. At this temperature, even when the temperature changes, the positional misalignment between the first and second optical waveguides, and between the light-emitting or light-receiving elements, can be minimized. This further reduces the impact on the optical connection, thus further improving the reliability of the optical connection components.

[0018] In the optical connection component of method 10, at least a portion of the surface of the substrate component in any of methods 1 to 9 may be an etched surface. If the surface of the substrate component is an etched surface, microcracks present on the surface of the raw material component of the substrate component before the etching process are removed. This prevents a reduction in the mechanical strength of the substrate component. This effect is particularly significant when the material of the substrate component is glass.

[0019] In the optical connector of mode 11, it is preferable to provide a plurality of the aforementioned through holes in any of modes 1 to 10. This increases the optical communication capacity provided by the optical connector. Here, the shape of the through holes in top view is preferably circular or polygonal.

[0020] In the optical connector of method 12, it is preferable that in method 11, the plurality of through holes include at least two through holes with different shapes when viewed from above. In this case, by shaping each through hole to correspond to the shape of light passing through it, the optical coupling efficiency between the optical waveguide and the like provided by the optical connector can be improved. When the through hole has a circular shape when viewed from above, it is preferable that the diameters of the through holes are different from each other. When the plurality of through holes has a polygonal shape when viewed from above, it is preferable that at least two through holes have similar shapes when viewed from above. Furthermore, the plurality of through holes may also include through holes with a circular shape when viewed from above and through holes with a polygonal shape when viewed from above.

[0021] In the optical connection component of method 13, the inner walls of the plurality of through holes in the substrate component of any of methods 1 to 12 may be inclined relative to the normal direction of the first surface. The plurality of through holes includes a first through hole and a second through hole with different shapes when viewed from above. The value obtained by dividing the opening area of ​​the first through hole on the first surface by the opening area of ​​the second surface of the first through hole is different from the value obtained by dividing the opening area of ​​the second through hole on the first surface by the opening area of ​​the second through hole. Specifically, the value obtained by dividing the opening area of ​​the first through hole on the first surface by the opening area of ​​the second through hole is preferably 10 or more and 100 or less, and the value obtained by dividing the opening area of ​​the second through hole on the first surface by the opening area of ​​the second through hole is preferably 1.1 or more and less than 50. The value obtained by dividing the opening area of ​​the first through hole on the first side by the opening area of ​​the second side of the first through hole is more preferably 30 or more and 90 or less, and the value obtained by dividing the opening area of ​​the first through hole on the first side by the opening area of ​​the second through hole is more preferably 1.5 or more and less than 30. The value obtained by dividing the opening area of ​​the first through hole on the first side by the opening area of ​​the second through hole is further preferably 50 or more and 80 or less, and the value obtained by dividing the opening area of ​​the first through hole on the first side by the opening area of ​​the second through hole is further preferably 1.1 or more and less than 10. In embodiment 13, the ratio of the opening areas of the first through hole to the second side is different from the ratio of the opening areas of the second through hole to the first side. Therefore, one optical connection member can be used to address applications, such as those involving multiple optical paths with different configurations.

[0022] The optical connection structure according to embodiment 14 of the present invention includes: an optical connection component of any one of embodiments 1 to 13; the first optical waveguide; and an optical element including the second optical waveguide. The optical connection component is disposed between the first optical waveguide and the optical element with the first surface facing the first optical waveguide. The optical connection component optically connects the first optical waveguide and the second optical waveguide.

[0023] In the optical connection structure of mode 15, the second optical waveguide mentioned in mode 14 can be a silicon waveguide.

[0024] The optical connection structure according to Embodiment 16 of the present invention includes: an optical connection component of any one of Embodiments 1 to 12; the first optical waveguide; and an optical element including the light-receiving element. The optical connection component is disposed between the first optical waveguide and the optical element with the first surface facing the first optical waveguide. The optical connection component optically connects the first optical waveguide and the light-receiving element. The inner wall of at least one of the through holes in the substrate component is inclined relative to the direction in which the first surface and the second surface face each other. In the at least one through hole, the opening area of ​​the first surface is larger than the opening area of ​​the second surface.

[0025] The optical connection structure according to embodiment 17 of the present invention includes: an optical connection component of any one of embodiments 1 to 13; the first optical waveguide; and the light-emitting element. The optical connection component is disposed between the first optical waveguide and the light-emitting element with the first surface side facing the first optical waveguide. The optical connection component optically connects the first optical waveguide and the light-emitting element.

[0026] In the optical connection structure of mode 18, the first optical waveguide mentioned in modes 14 to 17 can be an optical fiber.

[0027] The glass substrate according to Embodiment 19 of the present invention has a first surface and a second surface opposite to the first surface, and is provided with a plurality of through holes extending from the first surface to the second surface. The inner walls of the plurality of through holes are inclined relative to the normal direction of the first surface. The plurality of through holes include a first through hole and a second through hole. The value obtained by dividing the opening area of ​​the first through hole on the first surface side by the opening area of ​​the first through hole on the second surface side is different from the value obtained by dividing the opening area of ​​the second through hole on the first surface side by the opening area of ​​the second through hole. Specifically, the value obtained by dividing the opening area of ​​the first through hole on the first surface side by the opening area of ​​the second through hole on the second surface side is preferably 10 or more and less than 100, and the value obtained by dividing the opening area of ​​the second through hole on the first surface side by the opening area of ​​the second through hole on the second surface side is preferably 1.1 or more and less than 50. The value obtained by dividing the opening area of ​​the first through hole on the first side by the opening area of ​​the second side of the first through hole is more preferably 30 or more and 90 or less, and the value obtained by dividing the opening area of ​​the first through hole on the first side by the opening area of ​​the second through hole is more preferably 1.5 or more and less than 30. The value obtained by dividing the opening area of ​​the first through hole on the first side by the opening area of ​​the second through hole is further preferably 50 or more and 80 or less, and the value obtained by dividing the opening area of ​​the second through hole on the first side by the opening area of ​​the second through hole is further preferably 1.1 or more and less than 10.

[0028] The method for manufacturing the optical connector according to Embodiment 20 of the present invention is a method for manufacturing an optical connector according to any one of Embodiments 1 to 13, comprising: a step of modifying a portion of an inorganic component made of glass by irradiating it with a laser; and a step of forming the through hole by etching the modified portion of the inorganic component to obtain the substrate component.

[0029] The method for manufacturing an optical connector according to Embodiment 21 of the present invention is a method for manufacturing an optical connector according to Embodiment 13, comprising: a step of preparing an inorganic component having a third surface and a fourth surface opposite to the third surface and being made of glass; a first laser irradiation step of forming a first modified portion in a portion of the inorganic component by irradiating the inorganic component with a laser from the third surface side or the fourth surface side; a first etching step of forming a first recess for forming the first through-hole by etching the first modified portion; a second laser irradiation step of forming a second modified portion in a portion of the inorganic component other than the first recess by irradiating the inorganic component with a laser from the third surface side or the fourth surface side; a second etching step of forming a second recess for forming the second through-hole by etching the second modified portion; and a third etching step of obtaining the substrate component by etching the first recess and the second recess to form the first through-hole and the second through-hole, wherein the etching rate in the first etching step is different from the etching rate in the second etching step and the third etching step. In this case, it is preferable that the etching rate in the first etching process is greater than the etching rates in the second and third etching processes. This makes it easier to control the value obtained by dividing the opening area of ​​the first through-hole on its first side by the opening area of ​​the second side of the first through-hole. More preferably, the etching rates in the second and third etching processes are equal. This reduces the manufacturing cost of the optical connector.

[0030] In the manufacturing method of the connecting component in method 22, method 21 preferably further includes: a step of providing a protective sheet on the fourth surface of the inorganic component; and a step of peeling the protective sheet off the fourth surface of the inorganic component. The first etching step and the second etching step are performed while the protective sheet is provided on the fourth surface of the inorganic component, and the third etching step is performed after the protective sheet is peeled off the fourth surface of the inorganic component. Here, the fourth surface of the inorganic component becomes the second surface of the substrate component of the optical connecting component, and the third surface of the inorganic component becomes the first surface of the substrate component of the optical connecting component. In method 22, the diameters of the opening portions on the first surface and the opening portions on the second surface of the first and second through holes can be adjusted with high precision.

[0031] The glass substrate manufacturing method according to Embodiment 23 of the present invention is a glass substrate manufacturing method of Embodiment 19, comprising: a step of preparing an inorganic component having a third surface and a fourth surface opposite to the third surface and being made of glass; a first laser irradiation step of forming a first modified portion in a portion of the inorganic component by irradiating the inorganic component with a laser from the third surface side or the fourth surface side; a first etching step of forming a first recess for forming the first through hole by etching the first modified portion; a second laser irradiation step of forming a second modified portion in a portion of the inorganic component other than the first recess by irradiating the inorganic component with a laser from the third surface side or the fourth surface side; a second etching step of forming a second recess for forming the second through hole by etching the second modified portion; and a third etching step of forming the first through hole and the second through hole by etching the first recess and the second recess, wherein the etching rate in the first etching step is different from the etching rate in the second etching step and the third etching step. In this case, it is preferable that the etching rate in the first etching process is greater than the etching rates in the second and third etching processes. This makes it easier to control the value obtained by dividing the opening area of ​​the first through-hole on its first side by the opening area of ​​the second side of the first through-hole. More preferably, the etching rates in the second and third etching processes are equal. This reduces the manufacturing cost of the glass substrate.

[0032] Invention Effects According to the present invention, an optical connection component, an optical connection structure, a glass substrate, and a method for manufacturing the optical connection component and the glass substrate can be provided, which can improve productivity. Attached Figure Description

[0033] Figure 1 This is a schematic cross-sectional view showing a portion of an example of an optical connection structure using the optical connection component according to the first embodiment of the present invention.

[0034] Figure 2 This is a schematic top view showing the optical connection component according to the first embodiment of the present invention.

[0035] Figure 3 It is along Figure 2 A schematic cross-sectional view of the I-I line in the diagram.

[0036] Figure 4 This is a schematic bottom view of the optical connection component according to a first variation of the first embodiment of the present invention.

[0037] Figure 5This is a schematic cross-sectional view showing a cross-section of a plurality of through holes passing through the optical connection member in an example of an optical connection structure using the optical connection member of the first modification of the first embodiment of the present invention.

[0038] Figure 6 This is a schematic top view of the optical connection component according to a second variation of the first embodiment of the present invention.

[0039] Figure 7 (a) ~ Figure 7 (c) is a schematic cross-sectional view illustrating an example of a method for manufacturing an optical connection component according to the first embodiment of the present invention.

[0040] Figure 8 This refers to the optical connection component according to the second embodiment of the present invention, equivalent to along... Figure 2 A schematic cross-sectional view of the section of line I-I in the diagram.

[0041] Figure 9 This refers to the optical connection member involved in the modified example of the second embodiment of the present invention, which is equivalent to along... Figure 2 A schematic cross-sectional view of the section of line I-I in the diagram.

[0042] Figure 10 This is a schematic cross-sectional view showing a portion of the optical connection structure according to the third embodiment of the present invention.

[0043] Figure 11 This is a schematic cross-sectional view showing a portion of the optical connection structure according to a modified example of the third embodiment of the present invention.

[0044] Figure 12 This is a schematic cross-sectional view showing a portion of the optical connection structure according to the fourth embodiment of the present invention.

[0045] Figure 13 This is a schematic cross-sectional view showing a portion of the optical connection structure according to the fifth embodiment of the present invention.

[0046] Figure 14 This refers to the optical connection component according to the sixth embodiment of the present invention, equivalent to along... Figure 2 A schematic cross-sectional view of the section of line I-I in the diagram.

[0047] Figure 15 (a) ~ Figure 15 (e) is a schematic cross-sectional view illustrating an example of a method for manufacturing an optical connection component according to the sixth embodiment of the present invention.

[0048] Figure 16 (a) ~ Figure 16(e) is a schematic cross-sectional view of the third laser irradiation step, the fourth laser irradiation step, and the fourth to sixth etching steps in an example of a method for manufacturing an optical connection component according to the sixth embodiment of the present invention.

[0049] Figure 17 (a) and Figure 17 (b) is a schematic cross-sectional view of the fifth laser irradiation step and the seventh etching step in an example of a method for manufacturing an optical connection component according to the sixth embodiment of the present invention. Detailed Implementation

[0050] The embodiments of the present invention will be described below. However, the following embodiments are merely illustrative, and the present invention is not limited to the following embodiments. Furthermore, in the various drawings, components having substantially the same function are sometimes referred to by the same reference numerals.

[0051] (Optical connection component) (First Implementation) Figure 1 This is a schematic cross-sectional view showing a portion of an example of an optical connection structure using the optical connection component according to the first embodiment of the present invention. Figure 1 The single-dot dashed line in the diagram schematically illustrates the travel of light in the optical path.

[0052] exist Figure 1 In the example shown, the optical connection component 1 is a component that optically connects the first optical waveguide 5 and the second optical waveguide 6. The optical connection component 1 is disposed between the first optical waveguide 5 and the second optical waveguide 6. Specifically, the first optical waveguide 5 and the second optical waveguide 6 are preferably made of materials such as silicon waveguides or optical fibers. The first optical waveguide 5 and the second optical waveguide 6 are included, for example, in optical elements.

[0053] In this specification, an optical element is a component that includes at least an optical waveguide, such as a light-emitting element, a light-receiving element, or an integrated circuit. More specifically, silicon photonic devices or components with optical circuits on a glass substrate are preferred as optical elements. Photodiodes or phototransistors are preferred as light-receiving elements. Light-emitting diodes or laser diodes are preferred as light-emitting elements.

[0054] Alternatively, the optical connection component 1 can also optically connect the first optical waveguide 5 to the light-receiving element. In this case, the optical connection component 1 can be positioned between the first optical waveguide 5 and the light-receiving element.

[0055] The specific configuration of the optical connection component 1 in this embodiment will be described below. Figure 2 This is a schematic top view showing the optical connection component according to the first embodiment. Figure 3It is along Figure 2 A schematic cross-sectional view of line I-I in the diagram. Figure 1 The cross-section of the optical connector 1 shown is along... Figure 2 The cross section of line II-II in the middle.

[0056] like Figure 2 As shown, the optical connection component 1 has a substrate component 2. In this invention, the material of the substrate component 2 is preferably an inorganic material. Glass is more preferably used as the inorganic material for the substrate component 2. Examples of preferred glass materials for the substrate component 2 include borosilicate glass. However, silicon may also be used as the material for the substrate component 2.

[0057] like Figure 3 As shown, the base component 2 has a first surface 2a and a second surface 2b. The first surface 2a and the second surface 2b are opposite to each other. When using the optical connection component 1, the first surface 2a is... Figure 1 The first optical waveguide 5 is shown as one side surface. The second surface 2b is one side surface of the second optical waveguide 6 or the light-receiving element.

[0058] Return to Figure 3 The base component 2 has a plate-like shape. The first surface 2a and the second surface 2b of the base component 2 have rectangular shapes. However, the shapes of the first surface 2a and the second surface 2b are not limited to the shapes described above.

[0059] The base component 2 is provided with multiple through holes 2c. Specifically, the multiple through holes 2c extend from the first surface 2a to the second surface 2b. Figure 2 As shown, in this embodiment, the opening portions of all through holes 2c on the first surface 2a are arranged in a row. More specifically, the opening portions of all through holes 2c on the first surface 2a are arranged in a straight line. Although not shown, the opening portions of all through holes 2c on the second surface 2b are also arranged in a straight line. However, the arrangement of the through holes 2c is not limited to the above arrangement. The base member 2 only needs to be provided with at least one through hole 2c.

[0060] like Figure 3 As shown, the inner walls of the plurality of through holes 2c of the base component 2 are inclined relative to the normal direction of the first surface 2a. In each through hole 2c, the opening area on the first surface 2a side is larger than the opening area on the second surface 2b side. However, the inner walls of the plurality of through holes 2c of the base component 2 may also extend parallel to the normal direction of the first surface 2a. That is, in each through hole 2c, the opening area on the first surface 2a side and the opening area on the second surface 2b side may also be the same.

[0061] In this embodiment, the through hole 2c in the base component 2 has a circular shape when viewed from above. When the through hole 2c has a circular shape when viewed from above, the diameter of the through hole 2c can be, for example, 10 μm or more and 100 μm or less. However, the shape of the through hole 2c when viewed from above is not limited to a circle. The dimension of the base component 2 along the normal direction of the first surface 2a is not particularly limited, and can be, for example, 100 μm or more and 500 μm or less.

[0062] A reflective structure is provided within the through-hole 2c of the base component 2. Specifically, the reflective structure is a structure that reflects light. In this embodiment, the reflective structure has a reflective film 4. More specifically, the reflective structure is constructed by providing a reflective film 4 on the inner wall of the through-hole 2c of the base component 2.

[0063] As the reflective film 4, for example, a metal film or a dielectric multilayer film can be used. The material of the metal film is not particularly limited; metals such as aluminum or silver can be used. The thickness of the reflective film 4 is not particularly limited; for example, it can be 0.05 μm or more but less than 2 μm.

[0064] Figure 3 The double-headed arrow A in the diagram indicates the light guiding direction in the optical connector 1. In this embodiment, the light guiding direction in the optical connector 1 is parallel to the normal direction of the first surface 2a of the substrate 2. However, depending on the object to which the optical connector 1 is used for optical connection, the light guiding direction in the optical connector 1 may also be inclined relative to the normal direction of the first surface 2a.

[0065] exist Figure 1 In the example shown, the first optical waveguide 5 and the second optical waveguide 6 are optically connected via the optical connection component 1. Additionally, Figure 1 The element represented by the rectangular diagram is the grating coupler 8. Figure 1 The same applies to the general cross-sectional view. The direction of light travel is switched using the grating coupler 8.

[0066] For example, when light is emitted from one side of the second optical waveguide 6, it enters the grating coupler 8. The light emitted from the grating coupler 8 passes through the through-hole 2c of the substrate component 2 and enters the first optical waveguide 5. At this time, at least a portion of the light facing the inner wall of the through-hole 2c of the substrate component 2 is reflected by the reflective structure and enters the first optical waveguide 5. Thus, the loss of light transmitted from the second optical waveguide 6 to the first optical waveguide 5 can be reduced. However, the optical connection method between the first optical waveguide 5 and the second optical waveguide 6, as well as the direction of light transmission, are not limited to the above methods.

[0067] The feature of this embodiment is that, Figure 2As shown, the base component 2 has a through hole 2c, and a reflective structure is provided within the through hole 2c. This allows the optical connector 1 to become a low-loss independent component during light transmission. For example, when optically connecting optical waveguides to each other, the optical connector 1 can be placed between the optical waveguides. This eliminates the need for tedious processes such as repeatedly curing and removing resin between the optical waveguides. Therefore, the productivity of optical connector structures can be effectively improved.

[0068] As shown in this embodiment, the substrate component 2 preferably has a plurality of through holes 2c, and a reflective structure is provided within each through hole 2c. In this case, for example, even if multiple pairs are provided... Figure 1 In the case of the first optical waveguide 5 and the second optical waveguide 6 shown, it is only necessary to arrange the optical connection component 1 between the multiple first optical waveguides 5 and the multiple second optical waveguides 6. Furthermore, when manufacturing the optical connection component 1, multiple through holes 2c are provided on the substrate component 2 according to the positions of the multiple pairs of first optical waveguides 5 and second optical waveguides 6 to be optically connected. Therefore, the cumbersome process of optically connecting each first optical waveguide 5 and each second optical waveguide 6 is eliminated. Thus, the productivity of the optical connection structure can be further improved. The same applies to the cases where multiple pairs of first optical waveguides 5 are optically connected to light-emitting elements and to light-receiving elements.

[0069] Preferably, in at least one of the first surface 2a and the second surface 2b, at least a portion of the openings of the plurality of through holes 2c are arranged in a straight line. Therefore, when at least one of the plurality of first optical waveguides 5 and the plurality of second optical waveguides 6 is arranged in a straight line, multiple pairs of first optical waveguides 5 and second optical waveguides 6 can be optically connected effectively. The same applies when at least one of the plurality of first optical waveguides 5 and the plurality of light-emitting elements is arranged in a straight line. The same also applies when at least one of the plurality of first optical waveguides 5 and the plurality of light-receiving elements is arranged in a straight line.

[0070] For example, the portions of the multiple through holes 2c opening on the first surface 2a can also be arranged in two rows. In this case, a portion of the multiple through holes 2c opening on the first surface 2a is arranged in a straight line, while the remaining portions of the multiple through holes 2c opening on the first surface 2a are arranged in another straight line. Thus, when the multiple first optical waveguides 5 are arranged in two rows, multiple pairs of first optical waveguides 5 and second optical waveguides 6, multiple pairs of first optical waveguides 5 and light-emitting elements, or multiple pairs of first optical waveguides 5 and light-receiving elements can be optically connected effectively.

[0071] As shown in this embodiment, it is preferable to use an inorganic material for the substrate component 2. In this case, the weather resistance of the optical connector 1 can be improved. Therefore, even if the optical connector 1 is used in environments with high temperature and high humidity, the optical connector 1 is less likely to deteriorate. As a result, the long-term reliability of the optical connector 1 is improved.

[0072] Glass is more preferably used as the material for the substrate component 2. In this case, the coefficient of thermal expansion of the substrate component 2 can be reduced. Therefore, even when temperature changes occur, the positional offset between the first optical waveguide 5 and the second optical waveguide 6, the light-emitting element, or the light-receiving element can be effectively reduced. This reduces positional offsets that can affect the optical connection when temperature changes occur. Therefore, the reliability of the optical connection component 1 can be effectively improved.

[0073] The coefficient of thermal expansion of the base component 2 is preferably 30 × 10⁻⁶. －7 / ℃Above 70×10 －7 Below / ℃. This further reduces positional shifts and other effects on the optical connection caused by temperature changes. Therefore, the reliability of the optical connection component 1 can be further improved.

[0074] Furthermore, using silicon as the material for the substrate component 2 can effectively reduce the coefficient of thermal expansion of the substrate component 2. This, in turn, improves the reliability of the optical connection component 1.

[0075] The light guiding direction in the optical connector 1 is parallel to the normal direction of the first surface 2a. That is, the through hole 2c of the base component 2 extends parallel to the normal direction of the first surface 2a. However, the light guiding direction in the optical connector 1 can also be inclined relative to the normal direction of the first surface 2a. That is, the through hole 2c of the base component 2 can also extend inclined relative to the normal direction of the first surface 2a.

[0076] In the base component 2 of this embodiment, the plurality of through holes 2c are all circular in top view. The plurality of through holes 2c have the same diameter. More specifically, the diameter of the portion of the plurality of through holes 2c opening on the first surface 2a is the same. The diameter of the portion of the plurality of through holes 2c opening on the second surface 2b is also the same. Alternatively, the plurality of through holes 2c may include at least two through holes 2c with different diameters. More specifically, the plurality of through holes 2c may include at least two through holes 2c whose diameter of the portion opening on the first surface 2a and the diameter of the portion opening on the second surface 2b are different from each other. This example is represented by a first variation of the first embodiment.

[0077] (First variation) Figure 4 This is a schematic bottom view of the optical connection component involved in the first variation of the first embodiment. Figure 5This is a schematic cross-sectional view showing a cross-section of a plurality of through holes passing through the connecting member in an example of an optical connecting structure using the optical connecting member of the first variation of the first embodiment. Figure 5 The arrows in the diagram indicate the direction in which light travels.

[0078] like Figure 4 As shown, the base component 2A has four through holes 2c1 and four through holes 2c2. The through holes 2c1 and 2c2 are both circular in shape when viewed from above. However, the diameters of the through holes 2c1 and 2c2 are different from each other.

[0079] exist Figure 5 In the example shown, light passes from the grating coupler 8 through the through-hole 2c1 of the substrate component 2A and is incident on the first optical waveguide 5. Additionally, with... Figure 1 Similarly, in the example shown, a reflective film 9 is provided on a portion of the first optical waveguide 5. Light incident on the first optical waveguide 5 is reflected by the reflective film 9 and is well guided within the first optical waveguide 5. The diameter D1 of the incident side of the through-hole 2c1 is the diameter D1 of the portion of the through-hole 2c1 that opens on the second surface 2b.

[0080] On the other hand, light passes through the through-hole 2c2 of the substrate component 2A from the first optical waveguide 5 and is incident on the grating coupler 8. The diameter D2 of the exit side of the through-hole 2c2 is the diameter D2 of the portion of the through-hole 2c2 that opens on the second surface 2b. Here, D1 ≠ D2.

[0081] exist Figure 5 In the example shown, the direction of light passing through the through-hole 2c1 of the substrate component 2A is different from the direction of light passing through the through-hole 2c2. Furthermore, the diameter or angle of light passing through the through-hole 2c1 is sometimes different from the diameter or angle of light passing through the through-hole 2c2. In such cases, it is preferable to set the shape of each through-hole to correspond to the shape of the light passing through it. This improves the optical coupling efficiency provided by the optical connector 1A.

[0082] In addition, the number of parts with through holes 2c1, the number of parts with through holes 2c2, and the total number of parts with through holes 2c1 and through holes 2c2 can be adjusted appropriately.

[0083] When optically connecting the first optical waveguide 5 and the second optical waveguide 6, the optical connection component 1A can be disposed between the first optical waveguide 5 and the second optical waveguide 6. Therefore, similar to the first embodiment, the productivity of the optical connection structure can be effectively improved.

[0084] like Figure 5As shown, the inner walls of the through holes 2c1 and 2c2 of the base component 2A are inclined relative to the normal direction of the first surface 2a. However, for example, the inner wall of the through hole 2c1 of the base component 2A may extend parallel to the normal direction of the first surface 2a, and the inner wall of the through hole 2c2 may be inclined relative to the normal direction of the first surface 2a. Alternatively, the inner walls of the through holes 2c1 and 2c2 of the base component 2A may extend parallel to the normal direction of the first surface 2a, and the diameters of the through holes 2c1 and 2c2 may be different from each other.

[0085] In the first embodiment and its first variation, the multiple through holes are all circular in shape when viewed from above. However, the multiple through holes may also all be the same polygon in shape when viewed from above. In this case, at least two through holes may have similar shapes when viewed from above. More specifically, the multiple through holes may include at least two through holes whose shapes are similar to at least one of the opening portion of the base member on the first surface and the opening portion on the second surface.

[0086] Alternatively, the plurality of through holes may include at least two through holes with different shapes when viewed from above. This example is illustrated by a second variation of the first embodiment.

[0087] (Second variation) Figure 6 This is a schematic top view of the optical connection component involved in the second variation of the first embodiment.

[0088] The base component 2B has four through holes 2c3 and four through holes 2c4. The through holes 2c3 are circular when viewed from above. The through holes 2c4 are polygonal when viewed from above. Specifically, the through holes 2c4 are rectangular when viewed from above.

[0089] In Figure 1 When the first optical waveguide 5 and the second optical waveguide 6 are optically connected, the optical connection component 1B can be disposed between the first optical waveguide 5 and the second optical waveguide 6. Thus, similar to the first embodiment, the productivity of the optical connection structure can be effectively improved.

[0090] The following describes an example of a method for manufacturing the optical connection component 1 according to the first embodiment.

[0091] (Manufacturing method) Figure 7 (a) ~ Figure 7 (c) is a schematic cross-sectional view illustrating an example of a method for manufacturing an optical connection component according to the first embodiment.

[0092] like Figure 7As shown in (a), an inorganic component 7 made of glass is prepared. The inorganic component 7 has a first surface 7a and a second surface 7b. The first surface 7a and the second surface 7b are opposite to each other. Next, a laser L is irradiated onto the inorganic component 7 from the first surface 7a side. However, the irradiation with the laser L can also be performed from the second surface 7b side of the inorganic component 7. By irradiating with the laser L, a portion of the inorganic component 7 is modified. This operation is repeated to modify multiple portions of the inorganic component 7.

[0093] Of course, when manufacturing the optical connection component of the present invention, at least one portion of the inorganic component can be irradiated with a laser, depending on the object to which the optical connection component is used for optical connection. This allows for the modification of at least one portion of the inorganic component.

[0094] Next, regarding Figure 7 The modified portion of the inorganic component 7 shown in (a) is etched. Thus, as... Figure 7 As shown in (b), a through hole 2c is formed to obtain the base component 2.

[0095] Next, as Figure 7 As shown in (c), a reflective film 4 is formed within the through-hole 2c of the substrate component 2. The reflective film 4 can be formed, for example, by sputtering or vacuum evaporation. When the inner wall of the through-hole 2c of the substrate component 2 is inclined relative to the normal direction of the first surface 2a, it is particularly easy to form the reflective film 4 by sputtering or vacuum evaporation. Alternatively, if a metal film is formed as the reflective film 4, the reflective film 4 can be formed by plating.

[0096] This yields the optical connector 1. In this way, the optical connector 1 can be easily manufactured. Therefore, for example, when... Figure 1 When the first optical waveguide 5 and the second optical waveguide 6 are optically connected, the optical connection component 1 can be disposed between the first optical waveguide 5 and the second optical waveguide 6. On the other hand, when the first optical waveguide 5 and the light-receiving element are optically connected, the optical connection component 1 can be disposed between the first optical waveguide 5 and the light-receiving element. Therefore, the productivity of the optical connection structure can be effectively improved.

[0097] As described above, glass is preferably used as the material for the substrate component 2. In this case, the chemical resistance of the inorganic component 7 can be adjusted by changing the composition of the glass. Therefore, when forming the through-hole 2c of the substrate component 2 by etching the inorganic component 7, the etching rate is easily adjusted. As a result, the processing of the inorganic component 7 becomes easier.

[0098] Furthermore, from the normal direction of the first face 7a towards Figure 7 The inorganic component 7 shown in (a) is irradiated with laser L. Alternatively, laser L can be irradiated into the inorganic component 7 from a direction inclined relative to the normal direction of the first surface 7a, for example. In this case, Figure 7 The through hole 2c shown in (b) can be formed in a manner that extends obliquely relative to the normal direction of the first surface 2a. As a result, the light guiding direction of the light connection member 1 can be obliquely relative to the normal direction of the first surface 2a.

[0099] When obtaining the optical connection component 1, it can be obtained by monolithically processing the substrate component 2, which serves as the substrate. More specifically, Figure 7 The inorganic component 7 shown in (a) can be a substrate made of inorganic material. In this case, as... Figure 7 As shown in (b), the base component 2 obtained by forming the through hole 2c is a substrate. Furthermore, it is also possible to set... Figure 7 After the reflective film 4 shown in (c), the substrate component 2 is then monolithically processed. This allows for the production of multiple optical connection components 1 at once. Therefore, the productivity of the optical connection components 1 can be further improved. Consequently, the productivity of the optical connection structure can also be further improved.

[0100] However, the method for forming the through hole 2c of the base component 2 is not limited to the method described above. For example, a drill bit or the like can also be used to form the through hole 2c.

[0101] The above example illustrates the use of glass as the material for the substrate component 2. However, silicon can also be used as the material for the substrate component 2. In this case, an inorganic component 7 made of silicon can be prepared.

[0102] The following are examples other than the first embodiment of the optical connection component involved in the present invention.

[0103] (Optical connection component) (Second Implementation) Figure 8 This refers to the optical connection component involved in the second embodiment, equivalent to along... Figure 2 A schematic cross-sectional view of the section of line I-I in the diagram.

[0104] In this embodiment, the reflective structure 13, in addition to having a reflective film 4, also has a transparent material 17, which differs from the first embodiment. The transparent material 17 is filled within the through-hole 2c of the substrate component 2. The reflective film 4 is located around the transparent material 17. Apart from the above points, the optical connection component 11 of this embodiment has the same structure as the optical connection component 1 of the first embodiment.

[0105] The refractive index of the transparent material 17 is higher than that of the substrate 2. More specifically, the refractive index of the transparent material 17 is higher than that of the glass used as the material of the substrate 2. In this embodiment, the transparent material is a UV-curable resin. As the UV-curable resin, it is preferable to use, for example, an acrylate-based UV-curable resin or an epoxy-based UV-curable resin. Alternatively, a thermosetting resin may also be used as the transparent material 17.

[0106] In manufacturing the optical connector 11 of this embodiment, after providing the through hole 2c of the substrate member 2, a photocurable resin is filled into the through hole 2c. More specifically, after providing the reflective film 4 into the through hole 2c, a photocurable resin is filled into the through hole 2c. Then, the photocurable resin is photocured. As a result, the reflective structure 13 can be easily provided, and the optical connector 11 can be easily obtained.

[0107] Therefore, when optically connecting optical waveguides to each other, the optical connection component 11 can be disposed between the optical waveguides. Alternatively, when optically connecting optical waveguides and light-receiving elements, the optical connection component 11 can be disposed between the optical waveguides and the light-receiving elements. In this embodiment, similar to the first embodiment, the productivity of the optical connection structure can be effectively improved.

[0108] However, the reflective structure 13 of the optical connection component 11 does not necessarily have a reflective film 4. This example is shown by a variation of the second embodiment.

[0109] (Modified example) Figure 9 This refers to the optical connection component involved in the modified example of the second embodiment, equivalent to along... Figure 2 A schematic cross-sectional view of the section of line I-I in the diagram.

[0110] In this modified example, the reflective structure 13A has a transparent material 17 but no reflective film 4. The refractive index of the transparent material 17 is greater than that of the substrate component 2. Therefore, light can be appropriately reflected at the interface between the transparent material 17 and the substrate component 2. Thus, light loss can be appropriately reduced in the optical connection component 11A. In this modified example, similar to the second embodiment, the productivity of the optical connection structure can also be improved.

[0111] Of course, the reflective structure 13A preferably has a reflective film 4. Thus, in the optical connection component 11A, light loss can be reduced more reliably and effectively.

[0112] The optical connection component of this invention is used in an optical connection structure. Examples of the optical connection structures according to this invention are shown below.

[0113] (Optical connection structure) (Third implementation method) Figure 10 This is a schematic cross-sectional view showing a portion of the optical connection structure according to the third embodiment. Wherein, Figure 10 In the diagram, a light-emitting element is represented by adding two diagonals to a rectangle. Figure 10 The single-dot dashed line in the diagram schematically represents the travel of light in the optical path. Figure 10 The same applies to the rough cross-sectional views of other areas.

[0114] The optical connection structure 20 has an optical connection component 21 and multiple pairs of first optical waveguides 25 and second optical waveguides 26. Figure 10 The cross-section of the optical connection component 21 shown is equivalent to along... Figure 2 The section of the cross section of line II-II. Figure 10 The same applies to the schematic cross-sectional view of other structures. In the optical connection structure 20, with... Figure 10 The first optical waveguide 25 and the second optical waveguide 26 shown are the same. Figure 10 They are parallel in the direction of depth.

[0115] Multiple pairs of first optical waveguides 25 and second optical waveguides 26 are optically connected by an optical connection component 21. Of course, the optical connection structure 20 only needs to have at least one pair of first optical waveguides 25 and second optical waveguides 26.

[0116] In the optical connector 21, the inner wall of the through hole 2c of the base component 2 extends parallel to the normal direction of the first surface 2a, which differs from the optical connector 1 of the first embodiment. Apart from the above points, the optical connector 21 has the same structure as the optical connector 1 of the first embodiment. However, the structure of the optical connector 21 used in the optical connector structure 20 is not particularly limited. The optical connector structure 20 can use the optical connector according to the present invention.

[0117] In this embodiment, the first optical waveguide 25 is an optical fiber. The first optical waveguide 25 is included in an optical element 22A. The optical element 22A is a component for transmitting light. The optical element 22A has a substrate 23. The substrate 23 is provided with... Figure 10 Multiple trenches 23a are arranged in the depth direction. Each first optical waveguide 25 is embedded in each trench 23a. The substrate 23 can be made of materials such as glass, ceramic, or silicon.

[0118] In this embodiment, the second optical waveguide 26 is a silicon waveguide. The second optical waveguide 26 is included in the optical element 22B. The optical element 22B is a silicon photonic device. The optical element 22B has a substrate 24 made of silicon. The substrate 24 contains... Figure 10Multiple second optical waveguides 26 are arranged in the depth direction.

[0119] In addition to having multiple second optical waveguides 26, optical element 22B also has a light-emitting element 27 and a light-emitting element 27. Figure 10 Multiple grating couplers 8 are arranged in the depth direction. The light-emitting element 27 in this embodiment is a laser diode. However, the light-emitting element 27 is not limited to a laser diode. Multiple second optical waveguides 26 are optically connected to the same light-emitting element 27. Thus, each second optical waveguide 26 optically connects the light-emitting element 27 and each grating coupler 8.

[0120] More specifically, the substrate 24 has a recess 24a. A light-emitting element 27 is disposed within the recess 24a. Each grating coupler 8 is connected to each second optical waveguide 26. The plurality of grating couplers 8 and the plurality of second optical waveguides 26 are located in... Figure 10 Arranged along the depth direction.

[0121] However, the structure of optical element 22B is not limited to this. For example, optical element 22B may also have multiple light-emitting elements 27. For example, a second optical waveguide 26 may be optically connected to a light-emitting element 27.

[0122] An optical connector 21 is disposed between the first optical waveguide 25 and the optical element 22B. More specifically, the optical connector 21 is disposed such that the first surface 2a side of the substrate component 2 of the optical connector 21 faces the first optical waveguide 25. More specifically, the optical connector 21 is disposed between the first optical waveguide 25 and the grating coupler 8. Thus, the optical connector 21 and the grating coupler 8 are disposed in the optical loop between the first optical waveguide 25 and the second optical waveguide 26.

[0123] In the optical connection structure 20, light emitted from the light-emitting element 27 of the optical element 22B enters the grating coupler 8 through the second optical waveguide 26. The light then exits from the grating coupler 8 towards the optical connection component 21. The light then enters the first optical waveguide 25 through the optical connection component 21.

[0124] Furthermore, in this embodiment, in the optical fiber serving as the first optical waveguide 25, the portion where light is incident and the end face are distinct from each other. At least the area near the light-incident portion of the first optical waveguide 25 has a planar shape. In the first optical waveguide 25, the end face is inclined relative to the direction perpendicular to the planar portion where light is incident. A reflective film 9 is provided on the end face of the first optical waveguide 25. Light incident on the first optical waveguide 25 is reflected by the reflective film 9 and appropriately guided within the first optical waveguide 25.

[0125] However, the configuration of the first optical waveguide 25 and the structure near its end face are not limited thereto. For example, the first optical waveguide 25 can also be configured such that light enters from the end face of the first optical waveguide 25. In this case, the reflective film 9 is not provided on the end face of the first optical waveguide 25.

[0126] When the optical connection structure 20 is obtained, the optical connection component 21 is simply placed between the first optical waveguide 25 and the optical element 22B. Thus, the first optical waveguide 25 and the second optical waveguide 26 are optically connected via the optical connection component 21 and the grating coupler 8. Therefore, no complicated procedures are required for the optical connection of the first optical waveguide 25 and the second optical waveguide 26. Therefore, the productivity of the optical connection structure 20 can be effectively improved.

[0127] Optical elements 22A and 22B can be bonded to the optical connection component 21 using adhesives or the like. This allows for easy fixation of optical elements 22A and 22B to the optical connection component 21.

[0128] A suitable support can be provided between optical element 22A and optical element 22B. Thus, optical element 22A and optical element 22B can be appropriately supported by the support and optical connection member 21.

[0129] In this embodiment, the through hole 2c of the base component 2 extends parallel to the normal direction of the first surface 2a. However, corresponding to the direction of light emitted from the grating coupler 8, the extending direction of the through hole 2c may also be inclined relative to the normal direction of the first surface 2a.

[0130] Furthermore, in this embodiment, the reflective structure has a reflective film 4. Therefore, regardless of the direction of light emitted from the grating coupler 8, light loss in the optical connection member 21 can be reliably and effectively reduced. Thus, it is not necessary to change the extension direction of the through-hole 2c according to the direction of light emitted from the grating coupler 8. That is, when forming the through-hole 2c, the manufacturing conditions do not need to be switched. Therefore, the productivity of the optical connection member 21 can be further improved. Consequently, the productivity of the optical connection structure 20 can also be further improved.

[0131] Furthermore, a light-receiving element may be configured in optical element 22B instead of light-emitting element 27 or grating coupler 8. In these cases, light emitted from the first optical waveguide 25 is incident on the light-receiving element through optical connection member 21.

[0132] Alternatively, optical element 22B may also have both light-emitting element 27 and light-receiving element. In this case, light is emitted from a portion of the first optical waveguide 25, while incident light is received from the remaining portion of the first optical waveguide 25.

[0133] The optical fiber serving as the first optical waveguide 25 does not necessarily have to be included in the optical element 22A. In this case, it is sufficient to maintain the first optical waveguide 25 appropriately so that it is connected to the optical connection component 21. Here, "maintaining" refers to suppressing movement in three dimensions, movement in only two dimensions, or movement in only one dimension.

[0134] For example, the first optical waveguide 25 can also be configured such that light enters from the end face of the first optical waveguide 25. This example is shown by a variation of the third embodiment.

[0135] (Modified example) Figure 11 This is a schematic cross-sectional view showing a portion of the optical connection structure involved in a variation of the third embodiment.

[0136] In this variation, the first optical waveguide 25 is an optical fiber. The first optical waveguide 25 may not be included in the optical elements. However, in parts not shown, the first optical waveguide 25 is retained. The optical fiber serving as the first optical waveguide 25 may also be appropriately bent. In this variation, the configuration of the first optical waveguide 25, the extension direction of the end face of the first optical waveguide 25, and the absence of a reflective film on the end face are different from those in the third embodiment. The fact that the first optical waveguide 25 is not included in the optical elements in this variation is also different from that in the third embodiment. Apart from the points mentioned above, the optical connection structure 20A of this variation has the same structure as the optical connection structure 20 of the third embodiment.

[0137] Regarding the end face of the first optical waveguide 25, a portion near the end face of the first optical waveguide 25 extends in a direction orthogonal to the light transmission direction. However, the extension direction of this end face is not limited to the aforementioned direction. The end face of the first optical waveguide 25 is configured to cover a portion of the opening of the through hole 2c on the first surface 2a of the base member 2 of the optical connection member 21. Thus, light enters from the end face of the first optical waveguide 25. In this modified example, similar to the third embodiment, the productivity of the optical connection structure 20A can be effectively improved.

[0138] The first optical waveguide 25 and the optical element 22B can be bonded to the optical connection component 21 using an adhesive or the like. This allows for easy fixation of the first optical waveguide 25 and the optical element 22B to the optical connection component 21.

[0139] The portion that retains the first optical waveguide 25 may, for example, be disposed on the first surface 2a of the base component 2 of the optical connection component 21.

[0140] Alternatively, a light-receiving element may be configured in optical element 22B instead of light-emitting element 27 or grating coupler 8. In these cases, light emitted from the end face of the first optical waveguide 25 is incident on the light-receiving element. Alternatively, optical element 22B may have both light-emitting element 27 and light-receiving element.

[0141] (Fourth Implementation) Figure 12 This is a schematic cross-sectional view showing a portion of the optical connection structure according to the fourth embodiment. Figure 12 In the diagram, a light-receiving element is represented by adding two diagonals to a rectangle.

[0142] In this embodiment, the optical connection component 1 has the same structure as in the first embodiment, which differs from the third embodiment. In this embodiment, the optical connection component 1 optically connects multiple pairs of first optical waveguides 25 and light-receiving elements 37, which, along with the structure of the optical element 32B, also differs from the third embodiment. Apart from the points mentioned above, the optical connection structure 30 of this embodiment has the same structure as the optical connection structure 20 of the third embodiment.

[0143] Optical element 32B has a substrate 34 and in Figure 12 Multiple light-receiving elements 37 are arranged in the depth direction. The substrate 34 is provided with... Figure 12 Multiple recesses 34a are arranged in the depth direction. Each recess 34a contains a light-receiving element 37.

[0144] The optical connection component 1 is disposed between the first optical waveguide 25 and the optical element 32B, with the first surface 2a side of the substrate component 2 facing the first optical waveguide 25. More specifically, the optical connection component 1 is disposed between the first optical waveguide 25 and the light-receiving element 37. In the optical connection structure 30, light emitted from the first optical waveguide 25 passes through the optical connection component 1 and enters the light-receiving element 37.

[0145] When the optical connection structure 30 is obtained, the optical connection component 1 is simply placed between the first optical waveguide 25 and the optical element 32B. Thus, the first optical waveguide 25 and the light-receiving element 37 are optically connected by the optical connection component 1. Therefore, no complicated procedures are required for the optical connection of the first optical waveguide 25 and the light-receiving element 37. Therefore, the productivity of the optical connection structure 30 can be effectively improved.

[0146] In the optical connection component 1, the inner wall of the through hole 2c of the base component 2 is inclined relative to the normal direction of the first surface 2a. Furthermore, in the through hole 2c, the opening area on the first surface 2a side is larger than the opening area on the second surface 2b side. This reduces the diameter of the light spot emitted towards the second surface 2b side. Consequently, light can be more reliably incident on the light-receiving element 37.

[0147] (Fifth Implementation) Figure 13 This is a schematic cross-sectional view showing a portion of the optical connection structure according to the fifth embodiment.

[0148] The optical connection component 41 of the optical connection structure 40 optically connects the elements in an optical element 42 and the optical waveguide. Specifically, in this embodiment, the optical element 42 is a silicon photonic device. The optical element 42 includes a substrate 24, a light-emitting element 27, and a first optical waveguide 45. The substrate 24 has a recess 24a. The light-emitting element 27 is disposed within the recess 24a. In this embodiment, the light-emitting element 27 is a laser diode. In this embodiment, the first optical waveguide 45 is a silicon waveguide.

[0149] The optical connection component 41 is disposed between the first optical waveguide 45 and the light-emitting element 27 with its first surface 2a side facing the first optical waveguide 45. The optical connection component 41 optically connects the first optical waveguide 45 and the light-emitting element 27.

[0150] When the optical connection structure 40 is obtained, the optical connection component 41 is simply placed between the first optical waveguide 45 and the light-emitting element 27. Thus, the first optical waveguide 45 and the light-emitting element 27 are optically connected. Therefore, no complicated processes are required when optically connecting the first optical waveguide 45 and the light-emitting element 27. Thus, the productivity of the optical connection structure 40 can be effectively improved.

[0151] In the base component 2 of the optical connector 41, the opening area on the first surface 2a side of the through hole 2c is smaller than the opening area on the second surface 2b side. This allows light to be incident more reliably onto the first optical waveguide 45. However, the relationship between the opening areas on the first surface 2a side and the second surface 2b side of the through hole 2c is not limited to the aforementioned relationship.

[0152] Optical element 42 is not limited to silicon photonic devices. Alternatively, the first optical waveguide 45 does not necessarily have to be included in optical element 42. For example, the first optical waveguide 45 could also be an optical fiber, etc.

[0153] In the optical connection structure according to the third to fifth embodiments, the first optical waveguide is directly connected to the optical connection component. However, the first optical waveguide can also be indirectly connected to the optical connection component via a suitable optical component. This optical component only needs to be transparent. Examples of such optical components include, for example, a plate made of glass, a lens, or a prism.

[0154] When the aforementioned optical component is provided between the first optical waveguide and the optical component, for example, light emitted from the first optical waveguide passes through the aforementioned optical component and the optical connection component and is incident on the second optical waveguide or the light-receiving element. Alternatively, for example, light emitted from the second optical waveguide or the light-emitting element passes through the optical connection component and the aforementioned optical component and is incident on the first optical waveguide. The optical connection component according to the present invention is disposed between the first optical waveguide and the second optical waveguide, the light-emitting element or the light-receiving element, and optically connects the first optical waveguide and the second optical waveguide, the light-emitting element or the light-receiving element.

[0155] In addition, Figure 4 In the optical connection component 1A shown, the substrate component 2A has a plurality of through holes, including a plurality of through holes 2c1 and a plurality of through holes 2c2. The diameters of the portions of the through holes 2c1 and 2c2 that open on the second surface 2b side are different from each other. Alternatively, the plurality of through holes may include a plurality of through holes whose diameters of the portions that open on the first surface 2a side are different from each other. This example is illustrated by the sixth embodiment.

[0156] (Optical connection component) (Sixth Implementation Method) Figure 14 This refers to the optical connection component according to the sixth embodiment, equivalent to along... Figure 2 A schematic cross-sectional view of the section of line I-I in the diagram.

[0157] The substrate component of the optical connector 51 is a glass substrate 52 according to one embodiment of the present invention. The glass substrate 52, serving as the substrate component, has a plurality of through holes, including a plurality of first through holes 52c and a plurality of second through holes 52d. In the first through holes 52c and the second through holes 52d, the diameters of the portions opening on the first surface 52a are different from each other, and the diameters of the portions opening on the second surface 52b are also different from each other. In this embodiment, the plurality of through holes includes a plurality of first through holes 52c and a plurality of second through holes 52d, which differs from the first embodiment. Apart from the above points, the optical connector 51 of this embodiment has the same structure as the optical connector 1 of the first embodiment.

[0158] The inner walls of the plurality of through holes in the glass substrate 52 are inclined relative to the normal direction of the first surface 52a. Similar to the first embodiment, a reflective film 4 is provided on the inner wall of each through hole in the glass substrate 52, which serves as a base component. This constitutes a reflective structure.

[0159] In this invention, the value obtained by dividing the opening area of ​​the first through hole 52c on the first surface 52a side by the opening area of ​​the first through hole 52c on the second surface 52b side is preferably 10 or more, more preferably 30 or more, and even more preferably 50 or more. On the other hand, the value obtained by dividing the opening area of ​​the first through hole 52c on the first surface 52a side by the opening area of ​​the first through hole 52c on the second surface 52b side is preferably 100 or less, more preferably 90 or less, and even more preferably 80 or less.

[0160] The value obtained by dividing the opening area of ​​the second through hole 52d on the first surface 52a side by the opening area of ​​the second through hole 52d on the second surface 52b side is preferably 1.1 or more, more preferably 1.5 or more, and even more preferably 2 or more. On the other hand, the value obtained by dividing the opening area of ​​the second through hole 52d on the first surface 52a side by the opening area of ​​the second through hole 52d on the second surface 52b side is preferably less than 50, more preferably less than 30, and even more preferably less than 10.

[0161] In other words, the value obtained by dividing the opening area of ​​the first through hole 52c on the first surface 52a side by the opening area of ​​the first through hole 52c on the second surface 52b side is preferably 10 or more and 100 or less. The value obtained by dividing the opening area of ​​the second through hole 52d on the first surface 52a side by the opening area of ​​the second through hole 52d on the second surface 52b side is preferably 1.1 or more and less than 50. The value obtained by dividing the opening area of ​​the first through hole 52c on the first surface 52a side by the opening area of ​​the first through hole 52c on the second surface 52b side is more preferably 30 or more and 90 or less. The value obtained by dividing the opening area of ​​the second through hole 52d on the first surface 52a side by the opening area of ​​the second through hole 52d on the second surface 52b side is more preferably 1.5 or more and less than 30. The value obtained by dividing the opening area of ​​the first through hole 52c on the first surface 52a side by the opening area of ​​the first through hole 52c on the second surface 52b side is even more preferably 50 or more and 80 or less. The value obtained by dividing the opening area of ​​the second through hole 52d on the first surface 52a side by the opening area of ​​the second surface 52b side of the second through hole 52d is preferably 1.1 or more and less than 10.

[0162] Thus, in this embodiment, the ratio of the opening area of ​​the first surface 52a side and the second surface 52b side of the first through hole 52c differs significantly from the ratio of the opening area of ​​the first surface 52a side and the second surface 52b side of the second through hole 52d. Therefore, a single optical connection member 51 can be used to address applications involving multiple optical paths with significantly different configurations. Thus, when optically connecting the first optical waveguide to the second optical waveguide, the light-emitting element, or the light-receiving element, the optical connection member 51 can be positioned between the first optical waveguide and the second optical waveguide, the light-emitting element, or the light-receiving element. Therefore, the productivity of the optical connection structure can be effectively improved.

[0163] The base component of the optical connection component 51 is a glass substrate 52. However, as mentioned above, the material of the base component is not limited to glass.

[0164] The first through-hole 52c and the second through-hole 52d of the optical connector 51 can be formed, for example, by an etching process. In this case, the surface of the glass substrate 52, which serves as the substrate component, is also etched. Therefore, at least a portion of the surface of the substrate component is an etched surface. This etched surface is a smooth surface free of microcracks. Therefore, when at least a portion of the surface of the substrate component is an etched surface, the mechanical strength of the substrate component is improved. An example of a manufacturing method utilizing an etching process for the optical connector 51 according to the sixth embodiment will be described below.

[0165] (Manufacturing method) Figure 15 (a) ~ Figure 15 (e) is a schematic cross-sectional view illustrating an example of a method for manufacturing an optical connection component according to the sixth embodiment.

[0166] like Figure 15 As shown in (a), an inorganic component 57 made of glass is prepared. The inorganic component 57 has a third surface 57a and a fourth surface 57b. The third surface 57a and the fourth surface 57b are opposite to each other. The third surface 57a of the inorganic component 57 is equivalent to... Figure 7 The first surface 7a of the inorganic component 7 is shown in (a). The fourth surface 57b of the inorganic component 57 corresponds to the second surface 7b of the inorganic component 7. Next, a protective sheet 58 is provided on the fourth surface 57b of the inorganic component 57.

[0167] Next, a first laser irradiation process is performed. Specifically, a laser is irradiated onto the inorganic component 57 from the third surface 57a side. As a result, a first modified portion 57e is formed on a portion of the inorganic component 57, extending from the third surface 57a to the fourth surface 57b. This operation is repeated to form multiple first modified portions 57e on the inorganic component 57. However, it is sufficient for at least one first modified portion 57e to be formed on the inorganic component 57.

[0168] Next, a first etching process is performed. Specifically, the plurality of first modified portions 57e of the inorganic component 57 are etched. Thus, as... Figure 15 As shown in (b), a plurality of first recesses 57c are formed in the inorganic component 57. The first recesses 57c are for forming Figure 14 The recess of the first through hole 52c of the glass substrate 52 shown.

[0169] The etching process in the first etching step is specifically a wet etching process. Hydrofluoric acid can be used, for example, in the etching process of the first etching step. However, etching solutions other than hydrofluoric acid can also be used in the first etching step.

[0170] Next, as Figure 15 As shown in (c), a second laser irradiation process is performed. Specifically, a laser is irradiated onto the inorganic component 57 from the third surface 57a side. As a result, a second modified portion 57f is formed on the portion of the inorganic component 57 other than the first recess 57c, extending from the third surface 57a to the fourth surface 57b. This operation is repeated to form multiple second modified portions 57f on the inorganic component 57. However, it is sufficient for the inorganic component 57 to have at least one second modified portion 57f.

[0171] exist Figure 15 In the example shown in (c), more specifically, when forming one second modified portion 57f, laser light is irradiated at multiple points on the inorganic component 57. On the other hand, when forming one first modified portion 57e, laser light is irradiated at one point on the inorganic component 57. This allows for adjustment of the diameter of the multiple recesses or through holes formed. Furthermore, when forming one second modified portion 57f, laser light can also be irradiated at one point on the inorganic component 57.

[0172] Next, a second etching process is performed. Specifically, the plurality of first recesses 57c and the plurality of second modified portions 57f of the inorganic component 57 are etched. Thus, as... Figure 15 As shown in (d), a plurality of second recesses 57d are formed in the inorganic component 57, and the diameters of the plurality of first recesses 57c are enlarged. The second recesses 57d are used to form Figure 14 The recess of the second through hole 52d in the glass substrate 52 shown.

[0173] The second etching process is specifically a wet etching process. In the second etching process, for example, an aqueous solution of sodium hydroxide can be used. However, etching solutions other than aqueous solutions of sodium hydroxide can also be used in the second etching process.

[0174] The first and second etching processes described above are performed with the protective sheet 58 provided on the fourth surface 57b of the inorganic component 57. On the other hand, the etching processes can also be performed without the protective sheet 58. For example, the protective sheet 58 can be provided on the fourth surface 57b of the inorganic component 57 after the first laser irradiation process. Alternatively, the protective sheet 58 can be peeled off from the fourth surface 57b after the first etching process. In this case, the protective sheet 58 can be provided on the fourth surface 57b before or after the second laser irradiation process.

[0175] When the first laser irradiation process is performed without a protective sheet 58 on the fourth surface 57b of the inorganic component 57, the laser can be irradiated from the fourth surface 57b side. Similarly, in the second laser irradiation process, the laser can also be irradiated from the fourth surface 57b side.

[0176] After the second etching process, the protective sheet 58 is peeled off from the fourth surface 57b of the inorganic component 57. After peeling the protective sheet 58 off the fourth surface 57b, a third etching process is performed. Specifically, the first recess 57c and the second recess 57d of the inorganic component 57 are etched. Thus, as... Figure 15 As shown in (e), a plurality of first through holes 52c and a plurality of second through holes 52d are formed to obtain a glass substrate 52.

[0177] The third etching process is specifically a wet etching process. In this third etching process, for example, an aqueous solution of sodium hydroxide can be used. However, etching solutions other than aqueous solutions of sodium hydroxide can also be used in the third etching process.

[0178] The etching rate in the first etching process differs from the etching rates in the second and third etching processes. This allows for more reliable and precise adjustment of the diameters of the first through-hole 52c and the second through-hole 52d.

[0179] In the above example, different types of etching solutions are used in the first and second etching processes, resulting in different etching rates. However, for example, different types of etching solutions can also be used in the first and second etching processes, but with different concentrations. Alternatively, different types of etching solutions can be used in the first and second etching processes, but with different etching temperatures. The same applies to the first and third etching processes. That is, the etching rates in the first, second, and third etching processes can be arbitrarily adjusted by adjusting the type of etching solution, the concentration of the etching solution, the etching temperature, and the etching time.

[0180] Furthermore, in the above example, by using the protective sheet 58, the first and second etching processes are performed only on the third surface 57a and the fourth surface 57b of the inorganic component 57. Then, the protective sheet 58 is peeled off from the fourth surface 57b. The third etching process is then performed from the fourth surface 57b side. This allows for high-precision adjustment of the diameters of the portions of the first through-hole 52c and the second through-hole 52d that open on the first surface 52a and on the second surface 52b, respectively.

[0181] Figure 15 (a) ~ Figure 15 The method shown in (e) is Figure 14 This is part of an example of a method for manufacturing the optical connection component 51 shown. This method is also an example of a method for manufacturing the glass substrate 52 according to an embodiment of the present invention.

[0182] Next, multiple first through holes 52c and multiple second through holes 52d are formed in the glass substrate 52. Figure 14 The reflective film 4 is shown. The reflective film 4 can be formed, for example, by sputtering or vacuum evaporation.

[0183] Hereinafter, an example different from the above-described method for manufacturing the optical connection member 51 according to the sixth embodiment will be described. In this example, laser irradiation is performed three times and etching is performed four times, but for convenience, these are referred to as the third laser irradiation step to the fifth laser irradiation step and the fourth etching step to the seventh etching step. Of course, they can also be referred to as the first laser irradiation step to the third laser irradiation step and the first etching step to the fourth etching step.

[0184] Figure 16 (a) ~ Figure 16 (e) is a schematic cross-sectional view of the third laser irradiation step, the fourth laser irradiation step, and the fourth to sixth etching steps in an example of the manufacturing method of the optical connection component according to the sixth embodiment. Figure 17 (a) and Figure 17 (b) is a schematic cross-sectional view of the fifth laser irradiation step and the seventh etching step in an example of the manufacturing method of the optical connection component according to the sixth embodiment.

[0185] like Figure 16 As shown in (a), an inorganic component 57 made of glass is prepared. Next, a protective sheet 58 is provided on the fourth surface 57b of the inorganic component 57.

[0186] Next, a third laser irradiation process is performed. Specifically, laser light is irradiated onto the inorganic component 57 from the third surface 57a side. In this third laser irradiation process, a first modified portion 57e is formed on a portion of the inorganic component 57, extending from the third surface 57a to the portion between the third surface 57a and the fourth surface 57b. By repeating this operation, multiple first modified portions 57e are formed on the inorganic component 57. However, it is sufficient to form at least one first modified portion 57e on the inorganic component 57.

[0187] In the third laser irradiation process, when forming a modified part, a laser is irradiated at a point on the inorganic component 57. This is also done in the fourth and fifth laser irradiation processes, which will be described later.

[0188] Next, a fourth etching process is performed. Specifically, the plurality of first modified portions 57e of the inorganic component 57 are etched. Thus, as... Figure 16 As shown in (b), a plurality of first recesses 57c are formed in the inorganic component 57.

[0189] The etching process in the fourth etching step is specifically a wet etching process. Hydrofluoric acid can be used, for example, in this etching process. However, etching solutions other than hydrofluoric acid can also be used in the fourth etching step.

[0190] Next, as Figure 16 The fourth laser irradiation process is performed as shown in (c). Specifically, a laser is irradiated onto the third surface 57a of the inorganic component 57. As a result, a second modified portion 57f is formed on the portion of the inorganic component 57 other than the first recess 57c, extending from the third surface 57a to the fourth surface 57b. By repeating this operation, a plurality of second modified portions 57f are formed on the inorganic component 57. However, it is sufficient to form at least one second modified portion 57f on the inorganic component 57.

[0191] Next, a fifth etching process is performed. Specifically, the plurality of first recesses 57c and the plurality of second modified portions 57f of the inorganic component 57 are etched. Thus, as... Figure 16 As shown in (d), a plurality of second recesses 57d are formed in the inorganic component 57, and the diameter of a plurality of first recesses 57c is enlarged.

[0192] The etching process in the fifth etching step is specifically a wet etching process. In the fifth etching step, for example, an aqueous solution of sodium hydroxide can be used. However, etching solutions other than aqueous solutions of sodium hydroxide can also be used in the fifth etching step.

[0193] The aforementioned fourth and fifth etching processes are performed with the protective sheet 58 provided on the fourth surface 57b of the inorganic component 57. Alternatively, the processes can be performed without the protective sheet 58. For example, the protective sheet 58 can be provided on the fourth surface 57b of the inorganic component 57 after the third laser irradiation process. The protective sheet 58 can also be peeled off from the fourth surface 57b after the third etching process. In this case, the protective sheet 58 can be provided on the fourth surface 57b before or after the fourth laser irradiation process.

[0194] When performing the fourth laser irradiation process without providing a protective sheet 58 on the fourth surface 57b of the inorganic component 57, the laser can be irradiated from the fourth surface 57b side.

[0195] After the fifth etching step, the protective sheet 58 is peeled off from the fourth surface 57b of the inorganic component 57. After peeling the protective sheet 58 off the fourth surface 57b, a sixth etching step is performed. Specifically, the plurality of second recesses 57d of the inorganic component 57 are etched. Thus, as... Figure 16 As shown in (e), a plurality of second through holes 52d are formed. Furthermore, since a plurality of first recesses 57c are also etched in the fifth etching process, the diameter of the plurality of first recesses 57c is enlarged.

[0196] The etching process in the sixth etching step is specifically a wet etching process. For example, an aqueous solution of sodium hydroxide can be used in the etching process of the sixth etching step. However, etching solutions other than aqueous solutions of sodium hydroxide can also be used in the sixth etching step.

[0197] Next, as Figure 17 As shown in (a), a sixth laser irradiation process is performed. Specifically, a laser is irradiated onto the first recess 57c of the inorganic component 57 from either the third surface 57a side or the fourth surface 57b side. This forms a third modified portion 57g, extending from the bottom of the first recess 57c to the fourth surface 57b. By repeating this operation, multiple third modified portions 57g are formed on the inorganic component 57. However, it is sufficient to form at least one third modified portion 57g on the inorganic component 57.

[0198] Next, the seventh etching process is performed. Specifically, the third modified portion 57g of the inorganic component 57 is etched. Thus, as... Figure 17 As shown in (b), a plurality of first through holes 52c are formed to obtain a glass substrate 52. Furthermore, since a plurality of second through holes 52d are also etched in the seventh etching process, the diameter of the plurality of second through holes 52d is enlarged.

[0199] The etching rate in the fourth etching process is different from the etching rates in the fifth to seventh etching processes. This allows for more reliable and precise adjustment of the diameters of the first through-hole 52c and the second through-hole 52d.

[0200] Furthermore, in the above example, by using the protective sheet 58, the fourth and fifth etching processes are performed only from the third surface 57a on the third surface 57a and the fourth surface 57b of the inorganic component 57. Afterwards, the protective sheet 58 is peeled off from the fourth surface 57b. Then, the sixth and seventh etching processes are performed from the fourth surface 57b side. This allows for high-precision adjustment of the diameters of the portions of the first through-hole 52c and the second through-hole 52d that open on the first surface 52a and the second through-hole 52d, respectively.

[0201] Furthermore, in the example described above, the second through-hole 52d is formed by a sixth etching process. On the other hand, the first through-hole 52c is formed by a seventh etching process. It is preferable that the etching rate or etching time differs between the sixth and seventh etching processes. This allows for more precise adjustment of the diameter of the portion of the first through-hole 52c that opens on the second surface 52b, and the diameter of the portion of the second through-hole 52d that opens on the second surface 52b.

[0202] Figure 16 (a) ~ Figure 16 (e) and Figure 17 (a) and Figure 17 The method shown in (b) is Figure 14 This is part of an example of a method for manufacturing the optical connection component 51 shown. This method is also an example of a method for manufacturing the glass substrate 52 according to an embodiment of the present invention.

[0203] Next, multiple first through holes 52c and multiple second through holes 52d are formed in the glass substrate 52. Figure 14 The reflective film 4 is shown.

[0204] Furthermore, while a glass substrate was used as the base component for the optical interconnect in the above embodiments, the present invention is not limited thereto. The glass substrate may also have micro-vias for wiring, such as those found in a chip substrate or interposer. In this case, conductive material may be filled into the vias to form through electrodes.

[0205] Symbol Explanation 1, 1A, 1B... Optical connection components; 2, 2A, 2B… Base components; 2a, 2b... First page, second page; 2c, 2c1~2c4… through holes; 4…reflective film; 5, 6… First optical waveguide, second optical waveguide; 7…Inorganic components; 7a, 7b... First page, second page; 8…grating coupler; 9…reflective film; 11, 11A… Optical connection components; 13, 13A…reflective structure; 17…Transparent materials; 20, 20A… Optical connection structure; 21… Optical connection components; 22A, 22B… Optical elements; 23...Substrate; 23a…ditch section; 24...Substrate; 24a...concave; 25, 26… First optical waveguide, second optical waveguide; 27…light-emitting elements; 30… Optical connection structure; 32B… Optical element; 34...Substrate; 34a...concave; 37…light-receiving element; 40… Optical connection structure; 41… Optical connection components; 42… Optical elements; 45…First optical waveguide; 51… Optical connection components; 52…glass substrate; 52a, 52b... First page, second page; 52c, 52d… First through hole, second through hole; 57…Inorganic components; 57a, 57b... Third page, fourth page; 57c, 57d...the first concave part and the second concave part; 57e~57g…First Modification Section~Third Modification Section; 58…protective film.

Claims

1. An optical connection component disposed between a first optical waveguide and a second optical waveguide, and a light-emitting element or a light-receiving element, optically connecting the first optical waveguide and the second optical waveguide, and the light-emitting element or the light-receiving element, characterized in that it has: A base component having a first surface and a second surface opposite to the first surface, and having at least one through hole extending from the first surface to the second surface; and A reflective structure is disposed within the through hole for reflecting light.

2. The optical connection component as claimed in claim 1, characterized in that, Inorganic materials are used as the material for the base component.

3. The optical connection component as described in claim 2, characterized in that, The inorganic material is either glass or silicon.

4. The optical connection component as described in claim 3, characterized in that, The inorganic material is glass. The reflective structure is made of a transparent material with a higher refractive index than the substrate component.

5. The optical connection component as described in claim 4, characterized in that, The transparent material is a photocurable resin or a thermocurable resin.

6. The optical connection component as described in any one of claims 1 to 5, characterized in that, The inner wall of at least one of the through holes in the base component is inclined relative to the normal direction of the first surface.

7. The optical connection component as described in any one of claims 1 to 5, characterized in that, The reflective structure has a reflective film.

8. The optical connection component as described in any one of claims 1 to 5, characterized in that, Multiple through holes are provided. In at least one of the first and second surfaces, portions of at least a portion of the openings of a plurality of through holes are arranged in a straight line.

9. The optical connection component as described in any one of claims 1 to 5, characterized in that, The coefficient of thermal expansion of the base member is 30 x 10 －7 / °C or more and 70 x 10 －7 / °C or less.

10. The optical connection component as claimed in any one of claims 1 to 5, characterized in that, At least a portion of the surface of the base component is an etched surface.

11. The optical connection component as claimed in any one of claims 1 to 5, characterized in that, Multiple through holes are provided.

12. The optical connection component as claimed in claim 11, characterized in that, The plurality of through holes includes at least two through holes that have different shapes when viewed from above.

13. The optical connection component as claimed in claim 12, characterized in that, The inner walls of the plurality of through holes in the base component are inclined relative to the normal direction of the first surface. The plurality of through holes includes a first through hole and a second through hole, which have different shapes when viewed from above. The value obtained by dividing the opening area of ​​the first face of the first through hole by the opening area of ​​the second face of the first through hole is different from the value obtained by dividing the opening area of ​​the first face of the second through hole by the opening area of ​​the second face of the second through hole.

14. An optical connection structure, characterized by comprising: have: The optical connection component according to any one of claims 1 to 5; The first optical waveguide; and Optical elements including the second optical waveguide, The optical connection component is disposed between the first optical waveguide and the optical element with its first surface side facing the first optical waveguide. The optical connection component optically connects the first optical waveguide to the second optical waveguide.

15. The optical connection structure as described in claim 14, characterized in that, The second optical waveguide is a silicon waveguide.

16. An optical connection structure, characterized in that, have: The optical connection component according to any one of claims 1 to 5; The first optical waveguide; and An optical element that includes the light-receiving element. The optical connection component is disposed between the first optical waveguide and the optical element with its first surface side facing the first optical waveguide. The optical connection component optically connects the first optical waveguide to the light-receiving element. The inner wall of at least one of the through holes in the base component is inclined relative to the direction in which the first surface and the second surface are opposite to each other, and in the at least one through hole, the opening area on the first surface side is larger than the opening area on the second surface side.

17. An optical connection structure, characterized in that, have: The optical connection component according to any one of claims 1 to 5; The first optical waveguide; and The light-emitting element The optical connection component is disposed between the first optical waveguide and the light-emitting element with its first surface side facing the first optical waveguide. The optical connection component optically connects the first optical waveguide to the light-emitting element.

18. The optical connection structure as described in claim 14, characterized in that, The first optical waveguide is an optical fiber.

19. A glass substrate, characterized in that, It has a first surface and a second surface opposite to the first surface. It is provided with multiple through holes extending from the first surface to the second surface. The inner walls of the plurality of through holes are inclined relative to the normal direction of the first surface. The plurality of through holes includes a first through hole and a second through hole. The value obtained by dividing the opening area of ​​the first face of the first through hole by the opening area of ​​the second face of the first through hole is different from the value obtained by dividing the opening area of ​​the first face of the second through hole by the opening area of ​​the second face of the second through hole.

20. A method for manufacturing an optical connector, which is the method for manufacturing the optical connector according to any one of claims 1 to 5, characterized in that the manufacturing method comprises: The process of modifying a portion of an inorganic component by irradiating it with a laser; and The process of forming the through hole by etching the modified portion of the inorganic component to obtain the base component.

21. A method for manufacturing an optical connector, which is the method for manufacturing the optical connector according to claim 13, characterized in that the method comprises: A process for preparing an inorganic component having a third surface and a fourth surface opposite to the third surface, and being made of glass; A first laser irradiation process is performed to form a first modified portion in a part of the inorganic component by irradiating the inorganic component with a laser from the third surface side or the fourth surface side. A first etching process is performed by etching the first modified portion to form a first recess for forming the first through hole. A second laser irradiation process is performed to form a second modified portion in the portion of the inorganic component other than the first recess by irradiating the inorganic component with a laser from the third surface side or the fourth surface side. A second etching process is performed by etching the second modified portion to form a second recess for forming the second through hole; and The first through hole and the second through hole are formed by etching the first recess and the second recess, thus completing the third etching process of the substrate component. The etching rate in the first etching process is different from the etching rates in the second and third etching processes.

22. The method for manufacturing the optical connector as described in claim 21, characterized in that, Also includes: The process of providing a protective sheet on the fourth surface of the inorganic component; and The process of peeling the protective sheet off the fourth surface of the inorganic component. The first etching process and the second etching process are performed with the protective sheet provided on the fourth surface of the inorganic component. The third etching process is performed after the protective sheet is peeled off from the fourth surface of the inorganic component.

23. A method for manufacturing a glass substrate, which is the method for manufacturing a glass substrate according to claim 19, characterized in that the method comprises: A process for preparing an inorganic component having a third surface and a fourth surface opposite to the third surface, and being made of glass; A first laser irradiation process is performed to form a first modified portion in a part of the inorganic component by irradiating the inorganic component with a laser from the third surface side or the fourth surface side. A first etching process is performed by etching the first modified portion to form a first recess for forming the first through hole. A second laser irradiation process is performed to form a second modified portion in the portion of the inorganic component other than the first recess by irradiating the inorganic component with a laser from the third surface side or the fourth surface side. A second etching process is performed by etching the second modified portion to form a second recess for forming the second through hole; and A third etching process is performed to form the first through hole and the second through hole by etching the first recess and the second recess. The etching rate in the first etching process is different from the etching rates in the second and third etching processes.

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