Smart identification cable assembly

Abstract

This document describes several aspects of a smart identification cable assembly. One example cable assembly includes a cable bundle and a connector at one end of the cable bundle. The connector includes: a plurality of signal wafer assemblies electrically connected to the cables in the cable bundle; and an identification wafer assembly. The identification wafer assembly includes an identification wafer module. The identification wafer module stores a unique identifier for the cable assembly, such as the slot address of the connector. In other aspects, the identification wafer module is configured to communicate an identifier response of the cable assembly in response to a query. The identifier response may include a range of information, such as a unique identifier for a connector or slot address, data associated with a cable bundle, and other data associated with an interconnect system used in a computing environment.

Description

Background Technology

[0001] Computing, network switching, telecommunications, and related systems and environments rely on interconnect systems to provide data and power connections between different computing devices, switches, routers, and other equipment. A range of different input / output (I / O) connectors, cable assemblies, and interconnect systems are designed for those types of data, power, and data and power interconnect applications.

[0002] The example interconnect systems include board-to-board systems, wire-to-wire systems, and wire-to-board systems. For each type of connector, cable assembly, and interconnect system, numerous designs exist, depending on the power and data communication environment requirements of the connectors, assemblies, and systems used. As an example, a one-wire-to-board system includes a free-end connector attached to a cable bundle of wires and a fixed-end connector attached to a printed circuit board (PCB). As another example, a one-wire-to-wire system includes a first free-end connector attached to one end of the cable bundle and a second free-end connector attached to the other end of the cable bundle. Summary of the Invention

[0003] This document describes several aspects of a smart identification cable assembly. One example cable assembly includes a cable bundle and a connector at one end of the cable bundle. The connector includes: a plurality of signal wafer assemblies electrically connected to the cables in the cable bundle; and an identification wafer assembly. The identification wafer assembly includes an identification wafer module. The identification wafer module stores a unique identifier for the cable assembly, such as the slot address of the connector. In other aspects, the identification wafer module is configured to communicate an identifier response of the cable assembly in response to a query. The identifier response may include a series of information, such as a unique identifier for a connector or slot address, data associated with a cable bundle, and other data associated with an interconnect system used in a computing environment.

[0004] An example interconnect system includes a first cable assembly and a second cable assembly. The first cable assembly includes a first cable bundle and a first connector at one end of the first cable bundle. The first connector includes: a first signal sheet assembly electrically connected to a cable in the first cable bundle; and a first identification sheet assembly. The first identification sheet assembly includes: a first identification sheet module storing a first unique identifier of the first cable assembly. The second cable assembly includes a second cable bundle and a second connector at one end of the second cable bundle. The second connector includes: a second signal sheet assembly electrically connected to a cable in the second cable bundle; and a second identification sheet assembly. The second identification sheet assembly includes: a second identification sheet module storing a second unique identifier of the second cable assembly.

[0005] Another example cable assembly includes a cable bundle and a connector at one end of the cable bundle. The connector includes: a signal wafer assembly electrically connected to the cables in the cable bundle; and an identification wafer module. The identification wafer module stores a unique identifier for the cable assembly. In one example, the unique identifier includes a slot address identifier in a computing system.

[0006] In several other aspects of various embodiments, the identification sheet module is configured to communicate an identifier response of the cable assembly in response to a query on an identification connection interface of the identification sheet module. The identifier response includes data associated with the connector, the cable bundle, or both the connector and the cable bundle. In another example, the identifier response includes data associated with an address of the connector and at least one other connector in a row of connectors in a partition, as well as other information.

[0007] An example connector includes: a housing; a signal sheet assembly held within the housing; and an identification sheet assembly held within the housing. The identification sheet assembly includes an identification sheet module storing a unique identifier for the connector. In one example, a plurality of signal sheet assemblies are arranged in a row within the housing, and the identification sheet assembly is located at one end of the row of the plurality of signal sheet assemblies. In other aspects, the signal sheet assembly includes a signal connection interface, the identification sheet assembly includes an identification connection interface, and the signal connection interface is identical to the identification connection interface.

[0008] An example identification sheet assembly for a connector includes a connection interface and an identification sheet module. The connection interface may include a plurality of conductors and at least one shield. The identification sheet module may include an integrated circuit storing a unique identifier for the connector. In other aspects, the integrated circuit may include a data bus and power terminals respectively connected to the plurality of conductors in the connection interface. The unique identifier may include a slot address identifier, data relating to the address of the connector and at least one other connector in a row of a plurality of connectors in a partition, and other information.

[0009] Another example cable assembly includes a cable bundle and a connector at one end of the cable bundle. The connector includes: a plurality of signal conductors electrically connected to the cables in the cable bundle; and an identification module. The identification module stores a unique identifier for the cable assembly. The unique identifier may include a slot address identifier, data relating to an address of the connector and at least one other connector in a row of connectors in a partition, and other information.

[0010] Another example connector includes a housing, a plurality of signal conductors, and an identification module held within the housing. The identification module stores a unique identifier for the connector. The unique identifier may include a slot address identifier, data relating to an address of the connector and at least one other connector in a row of connectors on a partition, and other information. Attached Figure Description

[0011] Many aspects of this disclosure can be better understood by referring to the following accompanying drawings. The components in the drawings are not necessarily to scale, but the emphasis is on clearly illustrating the principles of this disclosure. Furthermore, similar reference numerals throughout the drawings denote corresponding parts.

[0012] Figure 1 An example computing environment with an interconnected system is shown according to various aspects of this disclosure.

[0013] Figure 2 This illustrates various aspects of the present disclosure. Figure 1 A perspective view of an example connector at a free end of a cable assembly in the interconnection system shown.

[0014] Figure 3A Various aspects of this disclosure are shown. Figure 2 A perspective view of an example sheet body assembly of the connector shown, wherein the housing has been removed.

[0015] Figure 3B Various aspects of this disclosure are shown. Figure 2The connector shown is a side view with the housing removed.

[0016] Figure 4 Various aspects of this disclosure are shown. Figure 1 A perspective view of a thin-film assembly in a connector of the interconnect system shown.

[0017] Figure 5A Various aspects of this disclosure are shown. Figure 1 A perspective view of a thin-film component in a connector of the interconnect system shown.

[0018] Figure 5B Various aspects of this disclosure are shown. Figure 5A The image shows a first side view of a circuit module in the sheet body assembly.

[0019] Figure 5C Various aspects of this disclosure are shown. Figure 5B A second side view of the circuit module shown. Detailed Implementation

[0020] As mentioned above, computing, network switching, telecommunications, and related systems and environments rely on interconnect systems to provide data and power connections between different computing devices, switches, routers, and other equipment. A range of different input / output (I / O) connectors, cable assemblies, and interconnect systems are designed for those types of data, power, and data and power interconnect applications. Interconnect systems can include board-to-board systems, wire-to-wire systems, wire-to-board systems, and related systems. For each type of connector, cable assembly, and interconnect system, numerous designs exist depending on the power and data communication environment requirements of the employing connector, assembly, and system.

[0021] High-data-rate connectors, cable assemblies, and interconnect systems often rely on differentially coupled signal pairs, in which two conductors are arranged in a pair to transmit a differential signal. The transmitted signal is represented by the electrical difference measured between the conductor pairs. Differential signaling helps avoid parasitic signals and crosstalk, and prevents unintentional signaling modes between adjacent signal pairs. In connector interfaces, a grounding terminal can be used to create a return path for electrical grounding, provide shielding between differential pairs, and for other purposes.

[0022] Connectors used in high data rate applications are typically designed to meet a range of mechanical and electrical requirements. As an example, high data rate connectors, cable assemblies, and interconnect systems are frequently used in backplane applications requiring very high conductor density and high data rates. To meet the required mechanical and electrical requirements, connectors used in such applications often comprise one or more sheet-body assemblies.

[0023] In some interconnect systems, arrays of connectors can be arranged and held in connector panels or bulkheads. A connector bulkhead can be a structure, such as a wall of a housing or an associated barrier, in which one or more connectors of an interconnect system are mounted or otherwise held. In some cases, connectors can extend through openings or perforations in the bulkhead. The connector bulkhead thereby supports multiple connectors and holds them in place relative to each other and the surrounding system. Connector bulkheads can particularly facilitate wire-to-wire interconnect systems of multiple cable assemblies including free-end connectors at the ends of cable bundles. The bulkhead can support a set of free-end connectors, to which mating connectors can be mechanically and electrically connected.

[0024] This document describes several aspects of a smart identification cable assembly. One example cable assembly includes a cable bundle and a connector at one end of the cable bundle. The connector includes: a plurality of signal wafer assemblies electrically connected to the cables in the cable bundle; and an identification wafer assembly. The identification wafer assembly includes an identification wafer module. The identification wafer module stores a unique identifier for the cable assembly, such as a slot address of the connector. In other aspects, the identification wafer module is configured to communicate an identifier response of the cable assembly in response to a query. The identifier response may include a range of information, such as a unique identifier for a connector or slot address, data associated with a cable bundle, and other data associated with an interconnect system used in a computing environment.

[0025] Figure 1 An example computing environment 10 (i.e., "environment 10") with an interconnect system 100 is shown according to various aspects of this disclosure. Both environment 10 and interconnect system 100 are shown in a representative example. Figure 1 The interconnect systems and concepts described in this paper can be extended to computing environments that include any number of computing systems, cable assemblies, connectors, cables, cable bundles, and other devices.

[0026] like Figure 1As shown, environment 10 includes two computing systems 20 and 40 and an interconnection system 100. Computing system 20 includes computing devices 30-39, etc., and computing system 40 includes computing devices 50-53, etc. Computing devices 30-39 can be multiple individual line cards of computing system 20. Each of computing devices 30-39 can be embodied in, but is not limited to, one or more general-purpose, special-purpose, or general-purpose and special-purpose processors and memories, a data communication device or system, a network storage device or system, a network switching, routing, or switching and routing system, a telecommunications system, or a computer or server of an associated computing system. Computing devices 50-53 can also be multiple line cards of computing system 40. Each of computing devices 50-53 can be embodied in, but is not limited to, one or more general-purpose, special-purpose, or general-purpose and special-purpose processors and memories, a network storage device or system, a network switching, routing, or switching and routing system, a telecommunications system, or a computer or server of an associated computing system.

[0027] In one example, interconnect system 100 provides a data interconnect between two computing systems 20 and 40. In other cases, interconnect system 100 can provide a power interconnect or a data and power interconnect between the two computing systems 20 and 40. Interconnect system 100 includes multiple cable bundles 110-119 and multiple free-end connectors 120-129 at the ends of the cable bundles 110-119. Interconnect system 100 also includes multiple cable bundles 130-133 and multiple free-end connectors 140-143 at the ends of the cable bundles 130-133. Examples of connectors 120-129 and 140-143 are shown below. Figure 2 The following description, along with examples of the multiple sheet body assemblies within connectors 120-129 and 140-143, are provided for reference. Figure 3A , Figure 3B , Figure 4 ,as well as Figures 5A to 5C illustrate.

[0028] Cable bundles 110-119 and 130-133 include multiple cables extending between connectors 120-129 and 140-143, and more. In one example, the cables can be conductive twinaxial or twinax cables, but other types of cables (such as shielded or unshielded twisted-pair cables, coaxial cables, fiber optic cables, etc.) can be used in interconnect system 100. When embodied as twinaxial cables, each of the multiple cables in cable bundles 110-119 and 130-133 can include a pair of inner conductors, a dielectric insulator surrounding the two conductors, one or more shields or shielding layers surrounding the dielectric insulator, one or more shielded conductors, and an outer sheath. Twinaxial cables can be used in high-speed differential data signal transmission applications and can be used in interconnect system 100 in a range of data interconnect applications.

[0029] Each of cable bundles 110-119, 130-133 includes a plurality of cables. The number of cables in each cable bundle 110-119, 130-133 of the interconnection system 100 can depend on the type, style, and number of the plurality of sheet body components, and the associated characteristics of the free-end connectors at the ends of each cable bundle. In one example described herein, each of cable bundles 110-119 includes sixty-four biaxial cables. In other examples, each cable bundle in a first group of cable bundles 110-119 includes a first number of cables, while each cable bundle in a different second group of cable bundles 110-119 includes a different second number of cables. However, the embodiments are not limited to cable bundles of any particular number of cables, and in other cases, each of cable bundles 110-119 can include more or less than sixty-four biaxial cables. Other examples include, but are not limited to, cable bundles of two (2), four (4), eight (8), sixteen (16), thirty-two (32), one hundred and twenty-eight (128), or other numbers of cables. Each of cable bundles 130-133 may also include more or fewer than sixty-four biaxial cables.

[0030] In the example shown, each of connectors 120-129 is secured to partition 22. As an example, partition 22 can be embodied as a wall of a housing, cabinet, enclosure, or related structure of computing system 20. In one case, connectors 120-129 can extend through a through-hole or opening in partition 22, but connectors 120-129 can also be secured to partition 22 in other arrangements or patterns using any suitable connectors, fasteners, or related means. As described in further detail later, partition 22 facilitates alignment between connectors 120-129 of interconnect system 100 and mating connectors of computing devices 30-39. Connectors 120-129 can be arranged in a linear or matrix array type using partition 22.

[0031] Each of connectors 140-143 is secured to partition 42. As an example, partition 42 can be embodied as a wall of a housing, cabinet, enclosure, or related structure of computing system 40. In one case, connectors 140-143 can extend through a through-hole or opening in partition 42, but connectors 140-143 can also be secured to partition 42 in other arrangements or patterns using any suitable connectors, fasteners, or related means. As described in further detail later, partition 42 facilitates alignment between connectors 140-143 of interconnect system 100 and mating connectors of computing devices 50-53. Connectors 140-143 can be arranged in a linear or matrix array type using partition 22.

[0032] like Figure 1 As shown, the computing devices 30-39 of the computing system 20 each include connectors 60-69. Figure 1 In the example shown, connectors 60-69 can be fixed-end connectors mounted on the printed circuit board (PCB) of computing devices 30-39. Thus, connector 60 facilitates an electrical connection or connection between computing device 30 and connector 120 of interconnect system 100. Similarly, connectors 61-69 facilitate an electrical connection or connection between computing devices 31-39 and connectors 121-129 of interconnect system 100. Also... Figure 1 As shown, computing devices 50-53 of computing system 40 each include connectors 70-73. Connectors 70-73 are fixed-end connectors mounted on the PCB of computing devices 50-53. Connectors 70-73 facilitate electrical connection or connection between computing devices 50-53 and connectors 140-143 of interconnection system 100. Fixed-end connectors 60-69 and 70-73 may also include various aspects of the smart identification concept described herein. For example, any one of fixed-end connectors 60-69 and 70-73 may also include the following references. Figures 5A to 5C The ID sheet body assembly 220 or its components are described.

[0033] In interconnect system 100, the cables in cable bundles 110-119 and 130-133 can be routed between connectors 120-129 and connectors 140-143 in any suitable manner depending on the interconnection needs in environment 10. In other words, cable bundles 110-119 and 130-133 facilitate data communication between line cards of computing system 20 and computing system 40 in various ways. As an example, cable bundle 110 can include cables extending between computing device 30 and one or more computing devices 31-39 in computing system 20. Alternatively or additionally, cable bundle 110 can include cables extending between computing device 30 and one or more computing devices 50-53 in computing system 40. In general, each of cable bundles 110-119 can include cables extending between one or more computing devices 30-39, 50-53, and other computing devices not shown. Similarly, cable bundle 130 may include cables extending between computing device 50 and one or more computing devices 51-53 in computing system 40. Alternatively or additionally, cable bundle 130 may include cables extending between computing device 50 and one or more computing devices 30-39 in computing system 20. Each of cable bundles 130-133 may include cables extending between computing devices 30-39, 50-53, or other possible computing devices.

[0034] According to various aspects of several embodiments, interconnect system 100 includes one or more identifier or "ID" components. For example, one or more of connectors 120-129, 140-143 include a component, element, or device configured to provide a unique identifier or ID (i.e., an "ID response"). An ID response can be provided at any time, such as when power is supplied to the ID component, in response to a query from one of computing devices 30-39 and 50-53, or in response to other conditions. An ID response can be provided in the form of voltage potentials or logic levels on the terminals of connectors 120-129, 140-143, serial or parallel data on the terminals, or other suitable formats. In one example, an ID response provided by one of connectors 120-129, 140-143 can be at least partially unique compared to any or all responses provided by the other connectors 120-129, 140-143.

[0035] The ID response capabilities from connectors 120-129 and 140-143 can include a series of information. The ID response capabilities include unique identifiers or codes, such as the unique identifiers of connectors 120-129 and 140-143. The ID response capabilities include the physical or logical slot address of connectors 120-129 and 140-143. The ID response capabilities include data related to the type, style, or other characteristics of connectors 120-129 and 140-143. The ID response capabilities include data related to the relative or absolute address of connectors 120-129 on partition 22. Similarly, the ID response capabilities include data related to the relative or absolute address of connectors 140-143 on partition 42. The ID response can include data related to cable bundles 110-119 and 130-133, the number and type of cables in cable bundles 110-119 and 130-133 (e.g., number of components, conductor or fiber type, gauge, length, etc.), the number of cable bundles in interconnect system 100, and other information related to cable bundles 110-119, 130-133 and interconnect system 100. The ID response can also include data related to specific cable connections between connectors 120-129 and connectors 140-143. These and other types of ID responses will be described later. As discussed in further detail below, based on the ID response, computing devices 30-39 and 50-53 can tailor or adjust certain operating parameters, such as clock or offset timing.

[0036] Conventional interconnect systems do not provide any mechanism for computing devices to identify or determine the structural, electrical, and associated characteristics of the interconnect system between them. For example, if interconnect system 100 does not contain the ID response concept described herein, computing device 30 will not identify itself as being connected to connector 120 and not to any other connectors 121-129, 140-143 in environment 10. Computing device 30 will not identify itself as being connected to computing device 31, to computing devices 31-33, or to any other specific combination of computing devices in environment 10. As another example, if interconnect system 100 does not contain the ID response concept described herein, computing device 30 will not determine the address of connector 120 relative to other connectors 121-129 on partition 22 or determine the physical or logical address (or connection to) other computing devices 31-39 in computing system 20. The computing device 30 does not determine any characteristics of the cable bundle 110 or the interconnection system 100, and the computing device 30 does not clip or adjust any operating parameters. These and other aspects of the various embodiments are described later.

[0037] Figure 2 Shown in Figure 1 The diagram shows a perspective view of an interconnect system 100 at the free end of a cable bundle 110, with connector 120 as the example. Connector 120 is shown as a representative example and is not drawn to any particular scale or size. The shape, size, ratios, and other characteristics of connector 120 vary relative to the diagram. Furthermore, while connector 120 and other connectors discussed herein are described for use in high-speed backplanes and related interconnect applications, the concept is not limited to use with such interconnect applications or systems. The concept can be extended to use with other types of connectors and other types of interconnect systems and applications.

[0038] Connector 120 includes a housing 200. Housing 200 has a mating interface 202 and a cable interface 204. Such as Figure 1 Another mating connector of connector 60 of the illustrated computing device 30 can mate and electrically connect to connector 120 at mating interface 202. In other examples, the free end of another interconnect system cable can mate and electrically connect to connector 120 at mating interface 202. In the illustrated example, connector 120 is a hermaphroditic or non-hermaphroditic type connector. In other words, a copy of connector 120 is rotatable and mates with connector 120 (i.e., itself) at mating interface 202. The concept is not limited to use with hermaphroditic connectors, and other types or styles of connectors can be relied upon in interconnect system 100.

[0039] The housing 200 can be formed from a plastic or polymer such as liquid crystal polymer (LCP), polyethylene (PE), polytetrafluoroethylene (PTFE), fluoropolymers, or other plastics or insulating materials. The housing 200 can be formed using any suitable additive or subtractive manufacturing technique, including molding, injection molding, printing, and other techniques. In some cases, the outer surface of the housing 200 can be plated with one or more conductive plated metals, and the housing 200 can be embodied as a plated plastic component. The surface can, in some cases, be etched and metallized or plated in a bath, barrel plated, plated by physical vapor deposition (PVD), plated by chemical plating, electroplating, sputtering, ion plating, or other plating techniques, or a combination thereof. The surface of the housing 200 can be metallized or plated with copper, nickel, tin, silver, other other plated metals, or a combination of these plated metals.

[0040] Cable bundle 110 extends into cable interface 204 of connector 120. As described in further detail later, the ends of multiple cables in cable bundle 110 are mechanically and electrically terminated to multiple sheet-like assemblies arranged side-by-side within housing 200. The multiple sheet-like assemblies include signal conductors or terminals, grounding shields, and other components, and multiple conductors in cable bundle 110 are electrically connected to the signal conductors of the multiple sheet-like assemblies. Any sheet-like assembly electrically connected to the cables in cable bundle 110 may be referred to herein as a signal sheet-like assembly. Among other signal sheet-like assemblies, an identification or ID sheet-like assembly is also located within housing 200. Housing 200 sits on and holds the multiple sheet-like assemblies in connector 120.

[0041] As described later, connector 120 includes sixteen signal wafer assemblies and one additional ID wafer assembly, totaling seventeen wafer assemblies. However, in other cases, connector 120 may include other numbers of signal and multiple ID wafer assemblies, including fewer or more wafer assemblies. See below for further details. Figure 4 Each of the plurality of signal sheet body assemblies, described in further detail, includes multiple pairs of signal conductors and a channel-like shield for each pair of signal conductors. In the example shown, each of the plurality of signal sheet body assemblies includes four pairs of signal conductors and four channel-like shields. Each pair of signal conductors extends within a channel of its respective channel-like shield, and the channel-like shield provides a common ground and shield for the pair of signal conductors. In the example shown, reference is made later. Figure 5A The ID sheet assembly, which is further detailed in Figure 5D, also includes four pairs of signal conductors and four channel-shaped shields.

[0042] Figure 3A Show Figure 2 A perspective view of the multiple sheet body assemblies of the connector 120 shown. Figure 3B Show Figure 2 A side view of the plurality of sheet body assemblies of the connector 120 shown. The housing 200 of the connector 120 is in... Figure 3A and Figure 3B The middle part is omitted from the figure, so multiple sheet body components are visible. Figure 3A and Figure 3B The multiple sheet body assemblies shown are illustrated as a representative example and are not drawn to any specific scale or size. The shape, size, ratio, and other characteristics of the multiple sheet body assemblies vary relative to those shown. Each of connectors 120-129 and 140-143 can include... Figure 3A and Figure 3B The arrangement shown is a similar arrangement of multiple sheet body components, including both multiple signal sheet body components and an ID sheet body component.

[0043] As shown, connector 120 includes a plurality of wafer assemblies, including multiple wafer assemblies 210A, 210B, 210C, 210D, 210P, etc. (collectively, "multiple wafer assemblies 210"). The multiple wafer assemblies 210 are arranged side-by-side in connector 120. Each of the multiple wafer assemblies 210 is a signal wafer assembly, as multiple cables from cable bundle 110 terminate at multiple wafer assemblies 210. For example, cables 110A-110D terminate at wafer assembly 210A, while other cables from cable bundle 110 terminate at wafer assemblies 210B, 210C, 210D, 210P, etc. In the example shown, connector 120 includes sixteen wafer assemblies 210. However, in other cases, connector 120 may include other numbers of wafer assemblies, including fewer or more wafer assemblies.

[0044] Connector 120 also includes an ID sheet assembly 220, which is an example of an ID component in interconnect system 100. In one example, each of connectors 120-129, 140-143 in interconnect system 100 may include an ID sheet assembly similar to ID sheet assembly 220. However, in other cases, a subset of connectors 120-129, 140-143 in interconnect system 100 includes an ID sheet assembly. Note that no cable from cable bundle 110 terminates at ID sheet assembly 220, and ID sheet assembly 220 can be called a "dead-end" sheet assembly for that reason. Figure 3A and Figure 3B In the example shown, the ID sheet assembly 220 is located at one end (e.g., the right end) of the plurality of signal sheet assemblies 210 in connector 120. In other cases, the ID sheet assembly 220 can be located at the other end (e.g., the left end) of the plurality of signal sheet assemblies 210. However, the ID sheet assembly 220 is not limited to being located at one end of a row of signal sheets, and in other cases, the ID sheet assembly 220 can also be located anywhere among the plurality of sheet assemblies 210 (e.g., in the middle of the plurality of sheet assemblies 210 or between the plurality of sheet assemblies 210).

[0045] Each of the plurality of sheet body assemblies 210 includes a signal connection interface. For example, the plurality of sheet body assemblies 210A, 210B, 210C, 210D, and 210P respectively include signal connection interfaces 212A, 212B, 212C, 212D, and 212P. The signal connection interface 212A of sheet body assembly 210A is described later. Figure 4Further details include the conductive contacts and grounding shield of the signal conductor. In the example shown, the signal connection interface in each of the other sheet body assemblies 210B, 210C, 210D, and 210P is the same as the signal connection interface 212A of sheet body assembly 210A.

[0046] ID thin-film assembly 220 includes an identifier or ID connection interface 222. The ID connection interface 222 of ID thin-film assembly 220 is described later. Figures 5A to 5C Further details include the conductive contacts and grounding shield of the signal conductors. As described in further detail later, the ID connection interface 222 of the ID wafer assembly 220 can be the same as the signal connection interface of the wafer assembly 210. In other cases, the ID connection interface 222 of the ID wafer assembly 220 can be different from the signal connection interface of the wafer assembly 210. The connection interfaces of the plurality of wafer assemblies 210 and ID wafer assemblies 220 can be connected to the connector 60 of the computing device 30 (see...). Figure 1 It is electrically connected to the computing device 30.

[0047] ID sheet assembly 220 includes wiring and / or circuitry for storing a unique identifier, as well as other data associated with connector 120, cable bundle 110, interconnect system 100, or combinations thereof. More specifically, Figure 3B An ID circuit module 280 is shown within the ID wafer assembly 220. (See reference...) Figure 3A The ID wafer assembly 220 includes a wafer insert 270, and the ID circuit module 280 is located within the wafer insert 270. The wafer insert 270 is... Figure 3B The middle part is omitted from the diagram, so the ID circuit module 280 is visible.

[0048] In response to a query from computing device 30, ID circuit module 280 can store and provide a unique identifier or ID. The ID response can be provided as a voltage potential or logic level on the connection interface 222 of ID wafer assembly 220, serial or parallel data on connection interface 222, or data in other suitable formats. An ID response from ID circuit module 280 is at least partially unique compared to any or all ID responses provided by the ID wafer assemblies of other connectors 121-129, 140-143. Further aspects of ID circuit module 280 are described later. Figure 5B and Figure 5C To explain in more detail.

[0049] like Figure 3A and Figure 3BAs shown, in interconnect system 100, the plurality of wafer body assemblies of connector 120 are representative of the plurality of wafer body assemblies in other connectors 121-129, 140-143. More specifically, connectors 121-129, 140-143 also each include a plurality of signal wafer body assemblies and an ID wafer body assembly. In some cases, each of connectors 121-129, 140-143 includes an ID wafer body assembly. In other cases, a subset of connectors 120-129, 140-143 in interconnect system 100 includes an ID wafer body assembly.

[0050] Consistent with the concept described herein, the ID sheet assembly of each (or any) of connectors 120-129 and 140-143 can be queried or interrogated by computing devices 30-30 and 50-53 to receive ID responses from connectors 120-129 and 140-143. The ID response from connectors 120-129 and 140-143 can include a series of information. The ID response can include a unique identifier or code, such as a unique identifier for connectors 120-129 and 140-143. The ID response can include data related to the type, style, or other characteristics of connectors 120-129 and 140-143. The ID response can include data related to the relative or absolute address of connectors 120-129 on partition 22. Similarly, the ID response can include data related to the relative or absolute address of connectors 140-143 on partition 42. The ID response can include data related to cable bundles 110-119 and 130-133, the quantity and type of cables in cable bundles 110-119 and 130-133 (e.g., number of components, conductor or fiber type, standard size, length, etc.), the number of cable bundles in interconnection system 100, and other information related to cable bundles 110-119, 130-133 and interconnection system 100. Based on the ID response, computing devices 30-39 and 50-53 can clip or adjust certain operating parameters, such as clock or offset timing.

[0051] Figure 4 Show Figure 1 A perspective view of the sheet assembly 210A in the connector 120 is shown. The sheet assembly 210A is shown as a representative example and is not drawn to any particular scale or size. The shape, size, proportions, and other characteristics of the sheet assembly 210A vary relative to the illustration. Each of the plurality of sheet assemblies 210 in the connector 120 may be similar to the sheet assembly 210A and includes the same components and features as the sheet assembly 210A.

[0052] The sheet assembly 210A includes channel-shaped shields 231-234, a sheet insert 240, and signal conductors 251-258. The signal conductors 251-258 are conductive terminals for communication of data signals passing through the sheet assembly 210A and the connector 120. The channel-shaped shields 231-234 are common or grounded shields in both the sheet assembly 210A and the connector 120. At one end, the channel-shaped shields 231-234 and the signal conductors 251-258 form a signal connection interface 212A for the sheet assembly 210A.

[0053] In the example shown, the channel-shaped shields 231-234 are formed as U-shaped shields, but they can be formed in other shapes. Each of the channel-shaped shields 231-234 includes a pair of sidewalls that extend substantially orthogonally to a back wall to form a U-shaped shield. Pairs of signal conductors 251-258 extend within the channels of the channel-shaped shields 231-234. Specifically, signal conductors 251 and 252 extend within a channel of channel-shaped shield 231, signal conductors 253 and 254 extend within a channel of channel-shaped shield 232, signal conductors 255 and 256 extend within a channel of channel-shaped shield 233, and signal conductors 257 and 258 extend within a channel of channel-shaped shield 234.

[0054] Signal conductors 251-258 can be formed from a flat sheet of metal, such as a lead frame (e.g., by stamping, shearing, or other methods). In some cases, the metal sheet or lead frame can be plated with one or more plated metals. The shape of signal conductors 251-258 can be formed by bending, pressing, or stamping. Channel-shaped shielding members 231-234 are independently formed from a flat sheet of metal material (e.g., by stamping, shearing, or other methods). The shape of channel-shaped shielding members 231-234 can be formed by bending, pressing, or stamping.

[0055] The sheet body insert 240 can be formed from a plastic or polymer such as LCP, PE, PTFE, fluoropolymer, or other plastics or insulating materials. The sheet body insert 240 can be molded around the signal conductors 251-258 and the channel shields 231-234. The sheet body insert 240 holds the signal conductors 251-258 and the channel shields 231-234 and positions the signal conductors 251-258 and the channel shields 231-234 relative to each other and relative to other components of the sheet body assembly 210A.

[0056] For example Figure 4As shown, cables 110A-110D are terminated in the wafer assembly 210A. More specifically, cable 110A includes conductors 151 and 152, which are electrically connected to signal conductors 251 and 252 within the wafer assembly 210A. Furthermore, cable 110B includes conductors 153 and 154, which are electrically connected to signal conductors 253 and 254 within the wafer assembly 210A. Cable 110C includes conductors 155 and 156, which are electrically connected to signal conductors 255 and 256. Cable 110D includes conductors 157 and 158, which are electrically connected to signal conductors 257 and 258. Thus, conductors 151-158 of cables 110A-110D are electrically connected to signal conductors 251-258. Data signals carried on conductors 151-158 are transmitted to signal conductors 251-258 via sheet assembly 210A. Several other sheet assemblies 210 in connector 120 are also designed in a similar manner to conduct data signals from other cables in cable bundle 110 to signal conductors. Shielded conductors in cables 110A-110D are also electrically connected to channel-shaped shields 231-234 in sheet assembly 210A.

[0057] Figure 5A Show Figure 1 A perspective view of the ID sheet assembly 220 in the connector 120 of the interconnect system 100 shown. The ID sheet assembly 220 is shown as a representative example and is not drawn to any particular scale or size. The shape, size, ratio, and other characteristics of the ID sheet assembly 220 vary relative to the representation shown.

[0058] ID wafer assembly 220 includes channel-shaped shielding members 261-264, a wafer insert 270, and conductors 281-288. Conductors 281-288 and channel-shaped shielding members 231-234 form an ID connection interface 222 of ID wafer assembly 220. ID wafer assembly 220 also includes an ID circuit module 280 held within wafer insert 270. See below for reference. Figure 5B and Figure 5C Explained, the ID circuit module 280 is configured to generate an ID response in response to a query presented on the ID connection interface 222 of the ID circuit module 280 by the computing device 30.

[0059] Will Figure 5A and Figure 4 In comparison, the ID connection interface 222 of the ID wafer assembly 220 is the same as the signal connection interface 212A of the wafer assembly 210A (e.g., having the same number, address, and arrangement of conductors / terminals, the same lead pattern, etc.). Furthermore, in the example shown (see also...) Figure 3A and Figure 3B The ID connection interface 222 of the ID wafer assembly 220 is also the same as the signal connection interface of all other wafer assemblies 210 in the connector 120. Thus, in the example shown, the docking connector 60 of the computing device 30 (see...) Figure 1 The connection between the ID sheet assembly 220 and the connector 120 requires no modification or adjustment. However, in other cases, the ID connection interface 222 of the ID sheet assembly 220 may differ from the signal connection interfaces of the plurality of sheet assemblies 210 in the connector 120.

[0060] Figure 5A The channel-shaped shields 261-264 of the illustrated ID sheet assembly 220 are formed in a U-shape, but can be formed in other shapes. Each of the channel-shaped shields 261-264 includes a pair of sidewalls that extend substantially orthogonally to a back wall to form a U-shaped shield. Pairs of signal conductors 281-288 extend within the channels of the channel-shaped shields 261-264. Conductors 281-288 can be formed from a flat sheet of metal, such as a lead frame (e.g., by stamping, shearing, or other methods). In some cases, the sheet of metal or the lead frame can be plated with one or more plated metals. The shape of the signal conductors 281-288 can be formed by bending, pressing, or stamping. The channel-shaped shields 261-264 can be independently formed from a flat sheet of metal material (e.g., by stamping, shearing, or other methods). The shape of the channel-shaped shielding components 261-264 can be formed by bending, pressing or stamping.

[0061] The sheet body insert 270 can be formed from a plastic or polymer such as LCP, PE, PTFE, fluoropolymers, or other plastics or insulating materials. The sheet body insert 270 can be molded around conductors 281-288 and channel-shaped shields 261-264. The sheet body insert 270 holds the conductors 281-288 and channel-shaped shields 261-264 and positions them relative to each other and relative to other components of the ID sheet body assembly 220. The sheet body insert 270 is also molded around the ID circuit module 280. Thus, the sheet body insert 270 holds the conductors 281-288, channel-shaped shields 261-264, and ID circuit module 280 and positions them relative to each other.

[0062] Figure 5B Show Figure 5A A first side view of the ID circuit module 280 in the ID sheet body assembly 220 shown, and Figure 5CA second side view of the ID circuit module 280 is shown. The ID circuit module 280 is shown as an example in... Figure 5A and Figure 5B In practice, the ID circuit module 280 can vary relative to what is shown. In the example shown, the ID circuit module 280 includes a PCB 300 and circuit devices or elements on the PCB 300. Figure 5C As shown, the ID circuit module 280 includes a circuit 330 and a resistor 340 on the PCB 300, as well as possible other active integrated circuits and passive devices. The PCB 300 includes a ground plane 310 and conductive traces 320-324. In various embodiments, the PCB 300 may include other ground planes, conductive traces, conductive pads, and related features. The channel-shaped shields 261-264 and conductors 281-288 of the ID sheet assembly 220 are electrically connected to the conductive pads of the PCB 300 for electrical connection to the ground plane 310 and conductive traces 320-324 of the PCB 300.

[0063] In various embodiments, circuit 330 can be embodied as a series of different discrete and integrated circuit devices. As an example, circuit 330 can be embodied as an electrically erasable programmable read-only memory (EEPROM) with a serial bus interface. Thus, in the example shown, ID circuit module 280 includes a memory circuit or device. Circuit 330 can also be embodied as other types of integrated circuits, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), programmable logic devices (PLDs), and other integrated circuits. In various embodiments, circuit 330 can include any suitable interface, such as a serial, parallel, or associated bus interface. In other cases, circuit 330 can also be embodied as one or more discrete devices, other integrated devices, or a combination thereof.

[0064] In the example shown, circuit 330 includes an internal integrated circuit or I²C serial bus interface, including clock or SCL and data or SDA pins. Circuit 330 also includes a write-protect or WP pin, and pins for power or VDC, ground or GND, and possibly other interfaces. The VDC pin of circuit 330 is electrically connected to conductor 288 of ID wafer assembly 220 via trace 321 on PCB 300. The SCL and SDA pins of circuit 330 are electrically connected to conductors 287 and 285 of ID wafer assembly 220 via traces 322 and 323, respectively. The WP pin of circuit 330 is connected to conductor 284 via trace 324, and the GND pin of circuit 330 is connected to ground plane 310 of PCB 300. Ground plane 310 of PCB 300 is also connected to conductor 283 via resistor 340 and trace 320. The connection between circuit 330 and conductors 281-288 is provided as an example. Figure 5C In other examples, depending on the type and format of circuit 330, circuit 330 can be electrically connected to conductors 281-288 in other ways. In some cases, all conductors 281-288 can be connected to circuit 330, for example, if more pins are needed for a different type of data bus.

[0065] Circuit 330 can be powered and communicate data via ID connection interface 222. For example, when connector 120 mates with connector 60 of computing device 30, computing device 30 can provide power to ID chip assembly 220 of circuit 330 and receive data from ID chip assembly 220 of circuit 330. More specifically, computing device 30 can provide power to circuit 330 via conductor 288, and computing device 30 can query data stored in circuit 330 using conductors 287 and 285 connected to the SCL and SDA pins of circuit 330. Any data received by computing device 30 from circuit 330 can be referred to herein as an ID response from ID chip assembly 220.

[0066] The circuitry 330 of the ID wafer assembly 220 can store data related to the connector 120, cable bundle 110, interconnect system 100, and other information. Data can be defined or programmed in the circuitry 330 when the circuit module 280 is manufactured, when the connector 120 is installed in environment 10, or at any other suitable time. As examples, circuit 330 can store a unique identifier for connector 120, a physical or logical slot address or identifier for connector 120, data related to the type, style, or other characteristics of connector 120, data related to the relative or absolute address of connector 120 on partition 22, data related to the relative or absolute address of other connectors 121-129 on partition 22, data related to the relative or absolute address of connectors 140-143 on partition 42, data related to cable bundle 110 or other cable bundles 111-119, 130-133, data related to the number and type (e.g., number of components, conductor or fiber type, standard size, length, etc.) of cables 130-133 in cable bundles 110-119, data related to the number of cable bundles or cable assemblies in interconnection system 100, data related to the cable interconnection between multiple individual cables in interconnection system 100, and other information. Figure 1 When the connector 120 shown is connected to the connector 60 of the computing device 30, the circuit 330 can communicate any or all of the above data to the computing device 30 through the ID connection interface 222.

[0067] For example, based on an ID response from the ID sheet assembly 220 in connector 120, computing device 30 can determine its slot address in computing system 20. The slot address can be defined as a physical or logical address relative to other computing devices 31-39 in computing system 20. Based on the slot address, computing device 30 can also clip or adjust certain operating parameters, such as clock or offset timing. Computing device 30 can also identify that it is connected to connector 120 and not to any other connectors 121-129, 140-143 in environment 10. For example, computing device 30 can also identify that it is connected to computing device 31 or to another computing device or device in environment 10 at a different slot address. Computing device 30 can also determine the address of connector 120 relative to other connectors 121-129 on partition 22 or determine the physical or logical address (or connection to) other computing devices 31-39 in computing system 20. The computing device 30 also does not determine any characteristics of the cable bundle 110 or the interconnection system 100, and the computing device 30 does not clip or adjust any operating parameters. These and other aspects of the various embodiments are described later.

[0068] In a similar manner, computing devices 31-39 can determine the slot address in computing system 20 based on the ID response from the ID sheet assemblies in connectors 121-129. For example, computing device 30 can determine a first slot address identifier from connector 120, and computing device 31 can determine a different second slot address identifier from connector 121. Additionally, computing devices 50-53 can determine the slot address in computing system 40 based on the ID response from the ID sheet assemblies in connectors 140-143. Each of the multiple ID sheet assemblies in connectors 120-129 and 140-143 can include unique data, such as unique data associated with connectors 120-129 and 140-143, cable bundles 110-119 and 130-133, and interconnection system 100.

[0069] Terms such as top, bottom, side, front, back, right, and left are not intended to provide an absolute frame of reference. Rather, these terms are relative and intended to identify certain characteristics in relation to each other, as the orientation of the structures described herein can vary. The terms comprising, including, and having are synonyms, used in an open-ended manner, and do not exclude additional elements, features, actions, operations, etc. Furthermore, terms are used either in their inclusive sense rather than their exclusive sense; therefore, for example, when used to connect a list of elements, the term either indicates one, some, or all of the elements in the list.

[0070] Unless otherwise stated, combination languages, such as at least one of X, Y, and Z, or any one of X, Y, or Z, are generally used to identify one of them, a combination of any two, or all three (or more if identifying a larger group), such as X and only X, Y and only Y, Z and only Z, X and Y, X and Z, and combinations of Y and Z, and all of X, Y, and Z. Unless specified, such combination languages ​​are generally not intended to identify or require the inclusion of at least one of X, at least one of Y, and at least one of Z. Unless otherwise defined herein, the terms about and substantially, associated with a particular range, percentage, or related measure of deviation, describe at least some manufacturing tolerances between a theoretically designed and manufactured product or component, such as the geometrical and tolerance standards described in ASME® Y14.5 and related International Organization for Standardization (ISO®) standards. As will be recognized by those skilled in the art, such manufacturing tolerances must still be taken into account, even though no explicit references are made to terms such as approximation, approximation, or related terms, or even to the use of theoretical terms such as geometric perpendicularity, orthogonality, highest point, collinearity, coplanarity, etc.

[0071] The embodiments described above are merely examples of implementations to provide a clear understanding of the principles of this disclosure. Many variations and modifications can be made to the above embodiments without substantially departing from the spirit and principles of this disclosure. Furthermore, components and features used in one embodiment can be included in another embodiment. All such modifications and variations are herein included within the scope of this disclosure.

Claims

1. A cable assembly, comprising: A cable bundle; A connector at one end of the cable bundle, the connector comprising: Multiple signal sheet body components, which are electrically connected to the cables in the cable bundle; as well as An identification sheet assembly includes an identification sheet module that stores a unique identifier for the cable assembly.

2. The cable assembly according to claim 1, wherein, The connector also includes a housing; The plurality of signal thin-film assemblies are arranged in a row within the housing; and The identifier sheet assembly is located at one end of the row of the plurality of signal sheet assemblies.

3. The cable assembly according to claim 1, wherein, Each of the aforementioned signal sheet body components includes a signal connection interface; The identification sheet assembly includes an identification connection interface; and The signal connection interface is the same as the identification connection interface.

4. The cable assembly according to claim 3, wherein, The identification connection interface includes a data bus and a power terminal.

5. The cable assembly according to claim 3, wherein, The identification connection interface includes a serial data bus and a power terminal.

6. The cable assembly according to claim 3, wherein, Each signal connection interface of the plurality of signal sheet body assemblies is electrically connected to the conductors of a plurality of cables in the cable bundle; as well as The identification sheet assembly has no electrical connection to any conductor of any cable in the cable bundle.

7. The cable assembly according to claim 1, wherein, The unique identifier includes a slot address identifier.

8. The cable assembly according to claim 1, wherein, The identification sheet module is configured to communicate the unique identifier of the cable assembly in response to a query of an identification connection interface of the identification sheet assembly.

9. The cable assembly according to claim 1, wherein, The identification sheet module is configured to communicate an identifier response of the cable assembly in response to a query of an identification connection interface of the identification sheet assembly.

10. The cable assembly according to claim 9, wherein, The identifier response includes a unique identifier for the connector at one end of the cable bundle.

11. The cable assembly according to claim 9, wherein, The identifier response includes data related to the connector, the cable bundle, or both the connector and the cable bundle.

12. The cable assembly according to claim 9, wherein, The identifier response includes data associated with the address of the connector and at least one other connector in a plurality of connectors arranged in a partition.

13. An interconnection system, comprising: A first cable assembly includes: First cable bundle; A first connector, located at one end of the first cable bundle, the first connector comprising: A first signal sheet assembly electrically connected to a cable in the first cable bundle; and A first identification sheet assembly, comprising a first identification sheet module storing a first unique identifier of the first cable assembly; and A second cable assembly includes: A second cable bundle; A second connector, located at one end of the second cable bundle, the second connector comprising: A second signal sheet assembly electrically connected to a cable in the second cable bundle; and A second identification sheet assembly includes a second identification sheet module that stores a second unique identifier for the second cable assembly.

14. The interconnection system according to claim 13, wherein, The first signal sheet assembly includes a signal connection interface; The first identification sheet assembly includes an identification connection interface; and The signal connection interface is the same as the identification connection interface.

15. The interconnection system according to claim 14, wherein, The identification connection interface includes a serial data bus and a power terminal.

16. The interconnection system according to claim 13, wherein, The first unique identifier includes the first slot address identifier; and The second unique identifier includes the second slot address identifier.

17. A cable assembly comprising: A cable bundle; A connector at one end of the cable bundle, the connector comprising: A signal sheet assembly electrically connected to the cables in the cable bundle; as well as An identification sheet module, wherein the identification sheet module stores a unique identifier for the cable assembly.

18. The cable assembly of claim 17, wherein, The unique identifier includes the slot address identifier.

19. The cable assembly of claim 17, wherein, The identification sheet module is configured to respond to a query of the identification connection interface of the identification sheet module by communicating the identifier response of the cable assembly.

20. The cable assembly of claim 19, wherein, The identifier response includes data related to the connector, the cable bundle, or both the connector and the cable bundle.

21. A connector comprising: A shell; A signal sheet assembly is held within the housing; as well as An identification sheet assembly is held within the housing, the identification sheet assembly including an identification sheet module that stores a unique identifier for the connector.

22. The connector according to claim 21, wherein, The signal sheet assembly includes a plurality of signal sheet assemblies arranged in a row within the housing; and The identifier sheet assembly is located at one end of the row of the plurality of signal sheet assemblies.

23. The connector according to claim 21, wherein, The signal sheet assembly includes a signal connection interface; The identification sheet assembly includes an identification connection interface; and The signal connection interface is the same as the identification connection interface.

24. The connector of claim 23, wherein, The identification connection interface includes a data bus and a power terminal.

25. The connector of claim 21, wherein, The unique identifier includes a slot address identifier.

26. The connector of claim 21, wherein, The unique identifier includes data associated with the address of the connector and at least one other connector in the arrangement of multiple connectors in a partition.

27. An identification sheet assembly for a connector, comprising: A connection interface, the connection interface comprising a plurality of conductors and at least one shielding element; as well as An identification sheet module, the identification sheet module including an integrated circuit, the integrated circuit storing a unique identifier of the connector.

28. The identification sheet assembly according to claim 27, wherein, The integrated circuit includes a data bus and a power supply terminal that are respectively connected to each of the plurality of conductors.

29. The identification sheet assembly of claim 27, wherein, The unique identifier includes the slot address identifier.

30. The identification sheet assembly of claim 27, wherein, The unique identifier includes data associated with the address of the connector and at least one other connector in a plurality of connectors arranged in a partition.

31. A cable assembly, comprising: A cable bundle; A connector at one end of the cable bundle, the connector comprising: Multiple signal conductors electrically connected to the cables in the cable bundle; as well as An identification module, wherein the identification module stores a unique identifier for the cable assembly.

32. The cable assembly according to claim 31, wherein, The identification module is electrically connected to an identification connection interface; and The identification connection interface includes a data bus and a power terminal.

33. The cable assembly of claim 31, wherein, The unique identifier includes the slot address identifier.

34. A connector comprising: A shell; Multiple signal conductors; as well as An identification module, which is fixed in the housing, stores a unique identifier for the connector.

35. The connector according to claim 34, wherein, The identification module is electrically connected to an identification connection interface of the connector; and The identification connection interface includes a data bus and a power terminal.

36. The connector of claim 34, wherein, The unique identifier includes the slot address identifier.

Images